Surface mounting device for chip processing

Abstract

The invention discloses a mounting device for chip processing, and relates to the technical field of chip mounting. The mounting device for chip processing comprises an operation table, the front side of the operation table is fixedly connected with discharging equipment, the interior of the operation table is rotationally connected with a first rotating disc through a first rotating shaft, and the front side of the first rotating disc is provided with a discharging port; a second rotating disc is fixedly connected to the outer side of the first rotating shaft, a plurality of protruding blocks are fixedly connected to the side face of the second rotating disc, a first hydraulic block is fixedly connected to the interior of the operation table through a first fixing plate, a triangular push block is movably connected to the rear side of the first hydraulic block, and a second hydraulic block is fixedly connected to the front side of the first fixing plate through a second fixing plate. The interior of the first hydraulic block communicates with the interior of the second hydraulic block through a first hose, and the front side of the second hydraulic block is movably connected with the buffering base plate through a transmission piece. According to the mounting device for chip processing, the rotating shaft I is rotated, so that the rotating plate is rotated, the buffer base plate is rotated, and the damage of the processed chip during unloading is reduced.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology, specifically to a chip mounting apparatus for chip processing. Background Technology

[0002] A chip is a type of integrated circuit package. During the production process, a bonding machine is used to weld and fix the chip onto a substrate for mounting. Then, the chip is transported to the next stage for further processing via a conveyor structure. By welding and fixing the chip to the substrate, the chip and circuit board can be integrated together to achieve complex circuit functions. This is one of the key technologies in the electronics manufacturing industry.

[0003] Chinese patent CN118315313A, authorized and published on July 9, 2024, discloses a chip mounting apparatus, including a base. The upper part of the base is equipped with a mounting unit for mounting chips and a conveying unit for conveying a substrate. A mounting groove is formed on one side of the base, and a motor for driving the conveying unit is installed in the mounting groove. A transmission unit and a loading unit for feeding materials onto the conveying unit are also installed on another side of the base. In the aforementioned application, during the unloading process, the mounted chips fall directly from the outlet onto the surface of the unloading equipment, which can easily cause the newly soldered chips to detach from the substrate. It can also easily cause collision damage to the processed chips, thus reducing the equipment's yield and wasting raw materials. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a chip mounting apparatus, solving the problems mentioned in the background section. To achieve the above objectives, this invention provides the following technical solution: a chip mounting apparatus, comprising: The control panel has a front-mounted unloading device. Inside the control panel, a turntable is rotatably connected via a rotating shaft. The front of the turntable has a discharge port. A second turntable is fixedly connected to the outside of the rotating shaft. Multiple protrusions are fixedly connected to the side of the second turntable. Inside the control panel, a hydraulic block is fixedly connected via a fixed plate. A triangular pusher is movably connected to the rear of the hydraulic block. A spring is fixedly connected between the triangular pusher and the fixed plate. A second hydraulic block is fixedly connected to the front of the fixed plate via a fixed plate. The interior of the first hydraulic block communicates with the interior of the second hydraulic block via a hose. The front of the second hydraulic block is movably connected to a buffer plate via a transmission component. The buffer plate prevents the chip from falling directly onto the unloading device when it is driven from the discharge port by the turntable. Instead, the chip falls onto the turntable first, where its rotation prevents it from flipping. The chip is then cushioned on the buffer plate before sliding down to the unloading device, thus protecting the processed chip, reducing the defect rate, and saving raw materials.

[0005] Preferably, the transmission component includes a rack, a gear, a second rotating shaft, a third fixed plate, a rotating plate, a third rotating shaft, a second hose, a third hydraulic block, and a first push block. The rack is movably connected to the front side of the second hydraulic block. The third fixed plate is fixedly connected to the bottom of the discharge port. The rotating plate is movably connected to the third fixed plate via the second rotating shaft. Gears are fixedly connected to both sides of the second rotating shaft, and the gears mesh with the rack. A buffer pad is rotatably connected to the bottom of the rotating plate via the third rotating shaft. The third hydraulic block is fixedly connected to the rear side of the rotating plate. One end of the second hose is fixedly connected to the side of the third hydraulic block, and the other end of the second hose is fixedly connected to the bottom of the second hydraulic block. The first push block is movably connected to the bottom of the third hydraulic block, and a buffer pad is fixedly connected to the front side of the first push block.

[0006] Preferably, a feeding device is fixedly connected to the side of the operating table, a patch-attaching robotic arm is movably connected to the top left side of the operating table, a welding device is fixedly connected to the top right side of the operating table, a cooling and reinforcement assembly is fixedly connected to the top right side of the operating table, and a plate-adhesive assembly is movably connected inside the turntable.

[0007] Preferably, the number of springs is two, the number of fixing plates is two, the number of hoses is two, the number of hydraulic blocks is two, the number of racks is two, the number of gears is two, the number of fixing plates is two, and the number of hoses is two.

[0008] Preferably, the cooling reinforcement assembly includes a fixed plate four, a push block two, a hydraulic block four, a hose three, a fixed plate five, a hydraulic block five, a push block three, a cooling block, an air outlet pipe, an air vent, a reinforcement plate, and an air inlet pipe. The right side of the triangular push block is fixedly connected to the fixed plate four, the rear side of the fixed plate four is fixedly connected to the push block two, the rear side of the push block two is movably connected to the hydraulic block four, the rear side of the hydraulic block four is fixedly connected to the rear side of the fixed plate one, the rear side of the hydraulic block four is fixedly connected to one end of the hose three, the other end of the hose three is fixedly connected to the top of the hydraulic block five, the top of the operating platform is fixedly connected to the fixed plate five, the interior of the fixed plate five is fixedly connected to the hydraulic block five, the bottom of the hydraulic block five is movably connected to the push block three, the bottom of the push block three is fixedly connected to the cooling block, the two sides of the cooling block are fixedly connected to the air outlet pipe, the interior two sides of the cooling block are provided with multiple air outlets, the interior of the cooling block is fixedly connected to the reinforcement plate, and the rear side of the cooling block is fixedly connected to the air inlet pipe. The cooling and reinforcement components are designed so that the chip after soldering is cooled by the cold air blown from both sides of the cooling block, thereby cooling and solidifying the liquid tin between the chip and the substrate, making the chip and the substrate more secure. At the same time, due to the limiting effect of the reinforcement plate, the cold air will not blow the chip away during cooling, making the subsequent unloading process smoother.

[0009] Preferably, the number of air outlet pipes is six, with three air outlet pipes forming a group, and each group of air outlet pipes is symmetrically distributed about the center line of the cooling block, and the number of air outlets is six.

[0010] Preferably, the bottom horizontal height of the reinforcing plate is higher than the bottom horizontal height of the cooling block.

[0011] Preferably, the adhesive plate assembly includes a fixed plate six, a pusher four, a hydraulic block six, a hose four, a hydraulic block seven, a pusher five, an adhesive plate, and a slider. The left side of the triangular pusher is fixedly connected to the fixed plate six, the rear side of the fixed plate six is ​​fixedly connected to the pusher four, the rear side of the pusher four is movably connected to the hydraulic block six, the rear side of the hydraulic block six is ​​fixedly connected to the rear side of the fixed plate one, the rear side of the hydraulic block six is ​​fixedly connected to one end of the hose four, and the other end of the hose four is fixedly connected to the bottom of the hydraulic block seven. The operating table is fixedly connected to the hydraulic block seven via a fixed groove inside it, the top of the hydraulic block seven is movably connected to the pusher five, the interior of the substrate groove of the turntable one is movably connected to the adhesive plate via a slider, the rear side of the adhesive plate is fixedly connected to the slider, and the top of the pusher five is movably connected to the adhesive plate. By setting up the adhesive plate assembly, the bottom of the substrate initially adheres to the adhesive plate during loading, thus preventing substrate misalignment during mounting and soldering, thereby improving equipment processing efficiency and reducing the equipment's defect rate.

[0012] Preferably, the number of adhesive plates is ten, and the number of sliders is ten.

[0013] Preferably, the interior of the hydraulic block seven is connected to the interior of the hydraulic block six via a hose four.

[0014] This invention provides a chip mounting apparatus for chip fabrication. It has the following advantages: The chip processing mounting device rotates a rotating shaft 1, which works in conjunction with a rotating disk 2, bump, triangular push block, hydraulic block 1, hose 1, hydraulic block 2, rack, gear, rotating shaft 2, rotating plate, rotating shaft 3, hose 2, hydraulic block 3, and push block 1 to rotate the rotating plate at a certain angle, thereby rotating the buffer pad at a certain angle to prevent the chip from flipping and to allow the chip to fall onto the buffer pad for cushioning.

[0015] The chip processing mounting device, when the triangular pusher moves forward, works in conjunction with pusher two, hydraulic block four, hose three, hydraulic block five, pusher three, cooling block, air outlet pipe, and reinforcing plate to cool the chip after soldering by the cold air blown from both sides of the cooling block, thereby cooling and solidifying the liquid tin between the chip and the substrate, thus making the chip and the substrate more firmly bonded.

[0016] This chip processing mounting device, when the triangular pusher moves forward, works in conjunction with pusher four, hydraulic block six, hose four, hydraulic block seven, pusher five, and slider to move the adhesive plate upward, initially fixing the substrate to the adhesive plate, preventing the substrate from shifting during the chip mounting and soldering process, thereby improving the equipment's processing efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall internal structure of the present invention; Figure 3 This is a schematic diagram of some of the components of the present invention; Figure 4 This is a schematic diagram of another component structure of the present invention; Figure 5 This is a schematic diagram of the cooling reinforcement component structure of the present invention; Figure 6 For the present invention Figure 5 Enlarged structural diagram at point A in the middle; Figure 7 This is a schematic diagram of the adhesive plate assembly structure of the present invention; Figure 8 For the present invention Figure 7 Enlarged structural diagram at point B.

[0018] In the picture: 100. Operating table; 200. Feeding equipment; 300. Chip placement robotic arm; 400. Welding equipment; 500. Unloading equipment; 600. Turntable 1; 700. Rotating shaft 1; 800. Discharge port; 901. Turntable 2; 902. Protrusion; 903. Triangular push block; 904. Hydraulic block 1; 905. Fixing plate 1; 906. Spring; 907. Fixing plate 2; 908. Hose 1; 909. Hydraulic block 2; 910. Rack; 911. Gear; 912. Rotating shaft 2; 913. Fixing plate 3; 914. Rotating plate; 915. Buffer pad; 916. Rotating shaft 3; 917. Hose 2; 918. Hydraulic block 3; 919. Push block 1; 1000. Cooling reinforcement assembly; 1001. Fixing plate four; 1002. Push block two; 1003. Hydraulic block four; 1004. Hose three; 1005. Fixing plate five; 1006. Hydraulic block five; 1007. Push block three; 1008. Cooling block; 1009. Air outlet duct; 1010. Air outlet; 1011. Reinforcement plate; 1012. Air inlet duct; 1100. Adhesive plate assembly; 1101. Fixing plate six; 1102. Push block four; 1103. Hydraulic block six; 1104. Hose four; 1105. Hydraulic block seven; 1106. Push block five; 1107. Adhesive plate; 1108. Slider. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0020] Example 1, please refer to Figures 1-4 A chip mounting apparatus for chip processing, comprising: An operating table 100 has a material unloading device 500 fixedly connected to its front side. Inside the operating table 100, a turntable 600 is rotatably connected via a rotating shaft 700. The front side of the turntable 600 has a discharge port 800, which allows the processed chips to fall directly onto the material unloading device 500. A material loading device 200 is fixedly connected to the side of the operating table 100, which automatically places the substrate into the turntable 600. The operating table 100 is equipped with a chip placement robot arm 300, which is movably connected to the top left side. The chip placement robot arm 300 is set up so that the chip can be initially fixed on the substrate by the chip placement robot arm 300. The operating table 100 is fixedly connected to the top right side, and the welding equipment 400 is set up so that the substrate and the chip are welded and fixed by the welding equipment 400. The operating table 100 is fixedly connected to the top right side, and the turntable 600 is movably connected to the plate mounting assembly 1100.A turntable 901 is fixedly connected to the outer side of the rotating shaft 700. Multiple protrusions 902 are fixedly connected to the side of the turntable 901. A hydraulic block 904 is fixedly connected to the inside of the operating table 100 via a fixing plate 905. A triangular push block 903 is movably connected to the rear side of the hydraulic block 904. A spring 906 is fixedly connected between the triangular push block 903 and the fixing plate 905, allowing the triangular push block 903 to automatically return to its original position. A hydraulic block 909 is fixedly connected to the front side of the fixing plate 905 via a fixing plate 907. The interior of the hydraulic block 904 is connected to the interior of the hydraulic block 909 via a hose 908. The front side of hydraulic block 2 909 is movably connected to buffer plate 915 via a transmission component. The transmission component includes rack 910, gear 911, rotating shaft 2 912, fixed plate 3 913, rotating plate 914, rotating shaft 3 916, hose 2 917, hydraulic block 3 918, and push block 1 919. Rack 910 is movably connected to the front side of hydraulic block 2 909. Fixed plate 3 913 is fixedly connected to the bottom of discharge port 800. Rotating plate 914 is movably connected between fixed plates 3 913 via rotating shaft 2 912. The rotating plate 914 is set so that the processed chip is initially received by the rotating plate 914, thereby forming a buffering effect. Gears 911 are fixedly connected to both sides of the second plate 912. Gears 911 mesh with racks 910. A buffer plate 915 is rotatably connected to the bottom of the rotating plate 914 via a rotating shaft 916. A hydraulic block 918 is fixedly connected to the rear side of the rotating plate 914. One end of the hydraulic block 918 is fixedly connected to the side of the second hose 917. The other end of the second hose 917 is fixedly connected to the bottom of the second hydraulic block 909. A push block 919 is movably connected to the bottom of the third hydraulic block 918. A buffer plate 915 is fixedly connected to the front side of the push block 919. There are two springs 906, two fixed plates 907, and several hoses 908. The equipment consists of two hydraulic blocks 909, two racks 910, two gears 911, two fixing plates 913, and two hoses 917. A buffer plate 915 is installed to prevent the chips from falling directly onto the unloading device 500 when the turntable 600 carries them from the discharge port 800. Instead, the chips first fall onto the turntable 914, where their rotation prevents them from flipping. The chips are then cushioned by the buffer plate 915 before sliding down to the unloading device 500, thus protecting the processed chips, reducing equipment defect rates, and saving raw materials.

[0021] In operation, when the equipment starts working, start the rotating shaft 700, which rotates the turntable 600, causing the turntable 901 to rotate. This causes the protrusion 902 to push the triangular push block 903 forward, increasing the internal pressure of the hydraulic block 904. This pressure is then transmitted through the hose 908 to the hydraulic block 909, increasing the internal pressure of the hydraulic block 909. This causes the rack 910 to push forward, rotating the gear 911 counterclockwise, rotating the rotating shaft 912 counterclockwise, and rotating the rotating plate 914 counterclockwise. This causes the chips falling from the discharge port 800 to be rotated. The plate 914 provides support, preventing the chip from flipping and facilitating subsequent testing. Simultaneously, excess pressure inside hydraulic block 909 is transmitted to hydraulic block 918 via hose 917, increasing the internal pressure and causing pusher block 919 to push downwards. This causes buffer plate 915 to rotate counterclockwise along shaft 916, allowing the chip that slipped from plate 914 to fall onto buffer plate 915 and then onto unloading device 500. This protects the processed chip, reduces equipment defect rate, and saves raw materials.

[0022] Example 2, please refer to Figures 1-6Based on Embodiment 1, the cooling reinforcement assembly 1000 includes a fixing plate 1001, a pusher 1002, a hydraulic block 1003, a hose 1004, a fixing plate 1005, a hydraulic block 1006, a pusher 1007, a cooling block 1008, an air outlet 1009, an air outlet 1010, a reinforcement plate 1011, and an air inlet 1012. The right side of the triangular pusher 903 is fixedly connected to the fixing plate 1001, the rear side of the fixing plate 1001 is fixedly connected to the pusher 1002, and the rear side of the pusher 1002 is movably connected to the hydraulic block 1003. The rear side of hydraulic block 1003 is fixedly connected to the rear side of fixed plate 905. The rear side of hydraulic block 1003 is fixedly connected to one end of hose 1004. The other end of hose 1004 is fixedly connected to the top of hydraulic block 1006. Hose 1004 is installed so that the interior of hydraulic block 1006 communicates with the interior of hydraulic block 1003. Fixed plate 1005 is fixedly connected to the top of operating platform 100. Hydraulic block 1006 is fixedly connected inside fixed plate 1005. Push block 1007 is movably connected to the bottom of hydraulic block 1006. A fixed component is fixedly connected to the bottom of push block 1007. Cooling block 1008 has air outlet pipes 1009 fixedly connected to both sides. Multiple air outlets 1010 are formed on the inner side surfaces of cooling block 1008, allowing cold air to be blown from the outlets 1010 to the solder joint between the chip and the substrate, thus solidifying the liquid solder at the solder joint. A reinforcing plate 1011 is fixedly connected inside cooling block 1008, supporting the chip and preventing it from being blown away by the cold air. The bottom of the reinforcing plate 1011 is higher than the bottom of the cooling block 1008. The rear side of the 8 is fixedly connected with an air inlet pipe 1012 and six air outlet pipes 1009. Every three air outlet pipes 1009 form a group, and each group of air outlet pipes 1009 is symmetrically distributed about the center line of the cooling block 1008. There are six air outlets 1010. A cooling reinforcement component 1000 is set up so that the chip after soldering is cooled by the cold air blown from both sides of the cooling block 1008, thereby cooling and solidifying the liquid tin between the chip and the substrate, making the chip and the substrate more secure. At the same time, due to the limiting effect of the reinforcement plate 1011, the cold air will not blow the chip away during cooling, making the subsequent unloading process smoother.

[0023] In use, based on Embodiment 1, when the triangular pusher 903 moves forward, the fixing plate 1001 moves forward, the pusher 1002 moves forward, and the internal pressure of the hydraulic block 1003 increases. The internal pressure of the hydraulic block 1003 is transmitted to the hydraulic block 1006 through the hose 1004, increasing the internal pressure of the hydraulic block 1006. This causes the pusher 1007 to push downward, and the cooling block 1008 to move downward until it contacts the chip surface. At this time, cold air is introduced into the air inlet pipe 1012, so that the chip after soldering is cooled by the cold air blown from both sides of the cooling block 1008. This cools and solidifies the liquid tin between the chip and the substrate, making the chip and the substrate more secure. At the same time, due to the limiting effect of the reinforcing plate 1011, the cold air will not blow the chip away during cooling, making the subsequent unloading process smoother.

[0024] Example 3, please refer to Figures 1-8 Based on Embodiments 1 and 2, the adhesive plate assembly 1100 includes a fixed plate 1101, a pusher block 1102, a hydraulic block 1103, a hose 1104, a hydraulic block 1105, a pusher block 1106, an adhesive plate 1107, and a slider 1108. The fixed plate 1101 is fixedly connected to the left side of the triangular pusher block 903. The pusher block 1102 is fixedly connected to the rear side of the fixed plate 1101. The hydraulic block 1103 is movably connected to the rear side of the pusher block 1102. The rear side of the hydraulic block 1103 is fixedly connected to the rear side of the fixed plate 905. The rear side of the hydraulic block 1103 is fixedly connected to one end of the hose 1104. The other end of the hose 1104 is fixedly connected to the bottom of the hydraulic block 1105. The interior of the hydraulic block 1105 is connected to the interior of the hydraulic block 1103 via the hose 1104. The operating table 100 is fixedly connected to the hydraulic block 7 1105 through a fixed groove inside it. The top of the hydraulic block 7 1105 is movably connected to the push block 5 1106. The interior of the substrate groove of the turntable 600 is movably connected to the adhesive plate 1107 through the slider 1108. The rear side of the adhesive plate 1107 is fixedly connected to the slider 1108. The top of the push block 5 1106 is movably connected to the adhesive plate 1107. The adhesive plate 1107 is set so that the bottom of the substrate is fixed to the top of the adhesive plate 1107, thus fixing the position of the substrate on the turntable 600. There are ten adhesive plates 1107 and ten sliders 1108. The adhesive plate assembly 1100 is set so that when the substrate is fed, the bottom of the substrate is initially attached to the adhesive plate 1107, so that the substrate will not shift during the chip mounting and soldering process, thereby improving the processing efficiency of the equipment and reducing the defect rate of the equipment.

[0025] In use, based on Embodiment 1 and Embodiment 2, when the triangular pusher 903 moves forward, the fixed plate 6 1101 moves forward, the pusher 4 1102 moves forward, the internal pressure of the hydraulic block 6 1103 increases, and the internal pressure of the hydraulic block 6 1103 is transmitted to the hydraulic block 7 1105 through the hose 4 1104, increasing the internal pressure of the hydraulic block 7 1105, the pusher 5 1106 is pushed upward, and the adhesive plate 1107 moves upward through the slider 1108, so that the substrate on the feeding device 200 is initially attached to the adhesive plate 1107, so that the substrate will not shift during the chip mounting and soldering process, thereby improving the equipment processing efficiency and reducing the equipment production defect rate.

[0026] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A chip mounting apparatus, characterized in that, include: An operating table is provided, with a material unloading device fixedly connected to its front side. A turntable is rotatably connected inside the operating table via a rotating shaft, and a discharge port is provided on the front side of the turntable. A turntable 2 is fixedly connected to the outer side of the rotating shaft 1. Multiple protrusions are fixedly connected to the side of the turntable 2. A hydraulic block 1 is fixedly connected to the inside of the operating table through a fixed plate 1. A triangular push block is movably connected to the rear side of the hydraulic block 1. A spring is fixedly connected between the triangular push block and the fixed plate 1. A hydraulic block 2 is fixedly connected to the front side of the fixed plate 1 through a fixed plate 2. The inside of the hydraulic block 1 communicates with the inside of the hydraulic block 2 through a hose 1. The front side of the hydraulic block 2 is movably connected to a buffer pad through a transmission component.

2. The chip fabrication mounting apparatus according to claim 1, characterized in that: The transmission components include a rack, gears, a second rotating shaft, a third fixed plate, a rotating plate, a third rotating shaft, a second flexible hose, a third hydraulic block, and a first pusher. The rack is movably connected to the front side of the second hydraulic block. The third fixed plate is fixedly connected to the bottom of the discharge port. The rotating plate is movably connected to the third fixed plate via the second rotating shaft. Gears are fixedly connected to both sides of the second rotating shaft, and the gears mesh with the rack. A buffer pad is rotatably connected to the bottom of the rotating plate via the third rotating shaft. The third hydraulic block is fixedly connected to the rear side of the rotating plate. One end of the second flexible hose is fixedly connected to the side of the third hydraulic block, and the other end of the second flexible hose is fixedly connected to the bottom of the second hydraulic block. The first pusher is movably connected to the bottom of the third hydraulic block, and a buffer pad is fixedly connected to the front side of the first pusher.

3. The chip processing mounting apparatus according to claim 1, characterized in that: A feeding device is fixedly connected to the side of the operating table, a patch-attaching robotic arm is movably connected to the top left side of the operating table, a welding device is fixedly connected to the top right side of the operating table, a cooling and reinforcement assembly is fixedly connected to the top right side of the operating table, and a plate-sticking assembly is movably connected inside the turntable.

4. The chip processing mounting apparatus according to claim 1, characterized in that: The number of springs is two, the number of fixing plates is two, the number of hoses is two, the number of hydraulic blocks is two, the number of racks is two, the number of gears is two, the number of fixing plates is two, and the number of hoses is two.

5. The chip processing mounting apparatus according to claim 3, characterized in that: The cooling and reinforcement assembly includes a fixed plate four, a push block two, a hydraulic block four, a hose three, a fixed plate five, a hydraulic block five, a push block three, a cooling block, an air outlet pipe, an air vent, a reinforcement plate, and an air inlet pipe. The right side of the triangular push block is fixedly connected to the fixed plate four. The rear side of the fixed plate four is fixedly connected to the push block two. The rear side of the push block two is movably connected to the hydraulic block four. The rear side of the hydraulic block four is fixedly connected to the rear side of the fixed plate one. The rear side of the hydraulic block four is fixedly connected to one end of the hose three. The other end of the hose three is fixedly connected to the top of the hydraulic block five. The top of the operating platform is fixedly connected to the fixed plate five. The interior of the fixed plate five is fixedly connected to the hydraulic block five. The bottom of the hydraulic block five is movably connected to the push block three. The bottom of the push block three is fixedly connected to the cooling block. Air outlet pipes are fixedly connected to both sides of the cooling block. Multiple air vents are opened on the inner two sides of the cooling block. A reinforcement plate is fixedly connected to the interior of the cooling block. An air inlet pipe is fixedly connected to the rear side of the cooling block.

6. The chip fabrication mounting apparatus according to claim 5, characterized in that: The number of air outlet pipes is six, with three air outlet pipes forming a group. Each group of air outlet pipes is symmetrically distributed about the center line of the cooling block, and the number of air outlets is six.

7. The chip fabrication mounting apparatus according to claim 5, characterized in that: The bottom horizontal height of the reinforcing plate is higher than the bottom horizontal height of the cooling block.

8. The chip fabrication mounting apparatus according to claim 5, characterized in that: The adhesive plate assembly includes a fixed plate six, a push block four, a hydraulic block six, a hose four, a hydraulic block seven, a push block five, an adhesive plate, and a slider. The left side of the triangular push block is fixedly connected to the fixed plate six, the rear side of the fixed plate six is ​​fixedly connected to the push block four, the rear side of the push block four is movably connected to the hydraulic block six, the rear side of the hydraulic block six is ​​fixedly connected to the rear side of the fixed plate one, the rear side of the hydraulic block six is ​​fixedly connected to one end of the hose four, the other end of the hose four is fixedly connected to the bottom of the hydraulic block seven, the operating table is fixedly connected to the hydraulic block seven through a fixed groove inside it, the top of the hydraulic block seven is movably connected to the push block five, the interior of the base plate groove of the turntable one is movably connected to the adhesive plate through a slider, the rear side of the adhesive plate is fixedly connected to the slider, and the top of the push block five is movably connected to the adhesive plate.

9. A chip fabrication mounting apparatus according to claim 8, characterized in that: The number of adhesive plates is ten, and the number of sliders is ten.

10. A chip fabrication mounting apparatus according to claim 8, characterized in that: The interior of hydraulic block seven is connected to the interior of hydraulic block six via hose four.

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