Copper-molybdenum alloy component and manufacturing method thereof

Abstract

The invention discloses a copper-molybdenum alloy component and a manufacturing method thereof, and belongs to the technical field of alloy manufacturing. Mo powder is sequentially subjected to vacuum drying treatment, oxidation-reduction treatment and coating treatment, so that the Mo powder has good flowability and powder laying uniformity; under the preset 3D printing condition, the porous Mo framework which is stably formed and complex in structure can be obtained, the problems that an existing rolling composite method is complex in technological process, strict in technological requirement and the like are solved, and the method is suitable for manufacturing parts with small sizes or complex shapes; the porous Mo framework is subjected to vacuum thermocuring and Cu infiltration treatment, and the obtained copper-molybdenum alloy component is excellent in compactness, high-temperature stability, interface bonding strength, heat conduction, electrical conductivity and the like. The problems that a copper-molybdenum alloy obtained in the prior art is poor in wettability and low in density and uniformity, and the mass content of copper is lower than 30%, so that the heat conductivity, the electric conductivity, the air tightness and other performance are low are solved.

Description

Technical Field

[0001] This invention relates to the field of alloy manufacturing, and more particularly to a copper-molybdenum alloy component and its manufacturing method. Background Technology

[0002] Copper-molybdenum alloys are widely used in electronic packaging, heat sink materials, electrode materials, and electron beam targets due to their high electrical and thermal conductivity, low coefficient of thermal expansion, and non-magnetic properties.

[0003] Among the existing methods for preparing copper-molybdenum alloys, the commonly used solution infiltration method involves filling and wetting the molybdenum particle skeleton with molten copper flowing along the gaps between the molybdenum particles under capillary action, thereby obtaining a copper-molybdenum alloy. However, this method suffers from problems such as poor wettability, low density and uniformity, and copper content below 30%. It is also prone to liquid copper overflow and has defects such as residual porosity and component segregation, which directly lead to a significant decrease in the thermal conductivity, electrical conductivity, and airtightness of the copper-molybdenum alloy. In addition, parts manufactured by solution infiltration usually require subsequent rolling processes to obtain parts that meet the requirements, making it unsuitable for manufacturing small-sized or complex-shaped parts. Secondly, the hot isostatic pressing method for manufacturing copper-molybdenum alloys requires uniform mixing of copper and molybdenum powders, followed by sintering and densification in an inert gas atmosphere at a high temperature of 800–1100°C and a high pressure of 70–150 MPa to obtain the copper-molybdenum alloy. However, this method is difficult to achieve uniform mixing of copper and molybdenum powders, and the production equipment is expensive, resulting in high costs. It also involves encapsulation and removal steps, making the process cumbersome and difficult to scale up. Furthermore, the rolling composite method involves pre-sintering to obtain a copper-molybdenum alloy slab, then layering it with copper sheets and performing melt infiltration sintering, finally followed by hot and cold rolling to obtain copper-molybdenum alloy foils. However, this method suffers from complex processes, stringent process requirements, and generally can only produce foils of specific shapes, limiting its applicability. Summary of the Invention

[0004] The main objective of this invention is to provide a copper-molybdenum alloy component and its manufacturing method, aiming to solve a series of problems existing in the preparation of copper-molybdenum alloys by methods such as solution infiltration, hot isostatic pressing, and rolling composite methods.

[0005] To achieve the above objectives, the present invention provides a method for manufacturing copper-molybdenum alloy components, comprising the following steps: Mo powder was subjected to vacuum drying, oxidation-reduction treatment and coating treatment in sequence to obtain pretreated Mo powder. Under preset printing conditions, the pretreated Mo powder is printed into a porous Mo skeleton using 3D printing technology. The porous Mo framework is subjected to vacuum thermosetting treatment to obtain a cured porous Mo framework; The solidified porous Mo skeleton is subjected to Cu diffusion treatment to obtain the copper-molybdenum alloy component.

[0006] Optionally, the vacuum drying process includes: Under a vacuum of 3Pa to 10Pa, the drying temperature is controlled at 100℃ to 150℃; the drying time is ≥1h*H, where h is hours and H represents the thickness of the powder coating in cm.

[0007] Optionally, the redox treatment includes: Mix 3% to 7% Ni powder into the dried Mo powder and stir evenly. Place the mixture into a redox apparatus and then introduce a mixed gas of CO and N2. Control the reduction temperature to 550℃ to 700℃ and hold for 30 to 60 minutes.

[0008] Optionally, the coating process includes: In an inert gas atmosphere, the Mo powder after oxidation-reduction treatment is coated with TiC nanoparticles at a coating temperature of 300℃~400℃, wherein the amount of TiC nanoparticles used is <5%.

[0009] Optionally, the preset printing conditions include: The printing layer thickness is 10μm~50μm; for the thin-walled region <5μm of the porous Mo skeleton, the liquid saturation is 60%~65%; for the thick region ≥5μm of the porous Mo skeleton, the liquid saturation is 67%~75%; the nozzle temperature is 40℃~60℃.

[0010] Optionally, the vacuum thermosetting process includes: Under a preset vacuum, the temperature is raised to the first curing temperature at a first heating rate for the first curing and heat preservation; then, it is raised to the second curing temperature at a second heating rate for the second curing and heat preservation; after the second curing and heat preservation is completed, it is allowed to cool down to room temperature naturally, while the preset vacuum is adjusted to 1Pa~3Pa.

[0011] Optionally, the preset vacuum degree is 0.1 Pa to 1.0 Pa; the first heating rate is 3 °C / min to 5 °C / min; the first curing temperature is 100 °C to 120 °C; and the duration of the first curing and holding is 0.8 h to 1.0 h; the second heating rate is 1 °C / min to 3 °C / min; the second curing temperature is 130 °C to 150 °C; and the duration of the second curing and holding is 1.0 h to 1.5 h.

[0012] Optionally, the Cu diffusion treatment includes: Add 0.5%~0.9% nano Ag powder to the raw materials for copper infiltration; An inert gas is introduced into the Cu diffusion treatment equipment. Copper vapor is introduced during the negative pressure stage and at the negative pressure temperature for negative pressure insulation. After completion, the first insulation is carried out under the first pressure stage and at the first temperature. Then, the second insulation is carried out under the second pressure stage and at the second temperature.

[0013] Optionally, the pressure of the negative pressure stage is 5 Pa to 20 Pa, the negative pressure temperature is 350℃ to 500℃, and the duration of the negative pressure heat preservation is 1.5 h * d, where h is hours and d is the maximum thickness of the solidified porous Mo skeleton in cm; the first pressure is atmospheric pressure, the first temperature is 1350℃ to 1400℃, and the duration of the first heat preservation is 1.5 h to 2.0 h; the second pressure is 3 MPa to 5 MPa, the second temperature is 1400℃ to 1450℃, and the duration of the second heat preservation is 0.5 h to 1.0 h.

[0014] To achieve the above objectives, the present invention also provides a copper-molybdenum alloy component, which is manufactured by the above-described manufacturing method.

[0015] Compared with the prior art, the beneficial effects that the present invention can achieve include: 1. In the technical solution of this invention, vacuum drying of Mo (molybdenum) powder removes moisture and impurities; oxidation-reduction treatment removes oxidative impurities, improving Mo powder purity without introducing harmful impurities; and coating reduces particle agglomeration. The synergistic effect of these three processes ensures good flowability and uniform powder distribution of the Mo powder. Under preset printing conditions, the pretreated Mo powder can be used in 3D printing to obtain a stable and structurally complex porous Mo skeleton, solving the problems of complex processes and stringent requirements in existing rolling composite methods. This method is suitable for manufacturing small or complex-shaped parts. After vacuum thermosetting, the porous Mo skeleton maintains its strength and releases internal thermal stress, preventing deformation and collapse during subsequent high-temperature copper infiltration. The cured porous Mo skeleton exhibits good pore connectivity and uniform structure, providing channels for full copper penetration.

[0016] 2. In the manufacturing process of the copper-molybdenum alloy of this invention, the porous Mo skeleton obtained by 3D printing using pretreated Mo powder is matched with the Cu infiltration process. This promotes the wetting and filling of copper liquid in the pores of the Mo skeleton, reducing interfacial porosity and oxide layer. The resulting copper-molybdenum alloy component has a copper mass content >50%, high density, and combines the high-temperature stability and high strength of molybdenum with the excellent thermal and electrical conductivity of copper. It also exhibits high interfacial bonding strength, which avoids copper-molybdenum delamination during use. This solves the problems of poor wettability, low density and uniformity, copper mass content below 30%, easy liquid copper overflow, and significant decreases in thermal conductivity, electrical conductivity, and airtightness of copper-molybdenum alloys directly caused by defects such as residual porosity and component segregation in existing solution-infiltration methods. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the process for manufacturing copper-molybdenum alloy components according to the present invention. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0019] To address the problems of poor wettability, low density and uniformity, copper content below 30%, and easy liquid copper overflow in copper-molybdenum alloys manufactured by infiltration processes in existing technologies, as well as the significant decrease in thermal conductivity, electrical conductivity, and airtightness of copper-molybdenum alloys due to residual porosity and component segregation; to solve the problems of difficulty in uniformly mixing copper and molybdenum powders, expensive production equipment, high costs, and cumbersome processes in hot isostatic pressing; and to solve the problems of complex processes and stringent process requirements in rolling composite methods, this invention provides a method for manufacturing copper-molybdenum alloy components, applicable to the manufacture of small-sized or complex-shaped parts, such as... Figure 1 As shown, it includes the following steps: S10. The Mo powder is subjected to vacuum drying, oxidation-reduction treatment and coating treatment in sequence to obtain pretreated Mo powder; S20. Under preset printing conditions, the pretreated Mo powder is printed into a porous Mo skeleton using 3D printing technology; S30. The porous Mo skeleton is subjected to vacuum thermosetting treatment to obtain a cured porous Mo skeleton; S40. The solidified porous Mo skeleton is subjected to Cu diffusion treatment to obtain a copper-molybdenum alloy component.

[0020] Optionally, the particle size of the Mo powder is less than 20 μm.

[0021] Optionally, the Mo powder can be graded so that the proportion of Mo powder with a particle size of 10μm~20μm is 35%~40%, the proportion of Mo powder with a particle size of 5μm~10μm is 35%~40%, the proportion of Mo powder with a particle size of 1μm~5μm is 18%~22%, and the proportion of Mo powder with a particle size of 0.1μm~1μm is 10%~15%. Under this gradation treatment, the tap density of the Mo powder can reach 5.3 g / cm³. 3 ~8.0g / cm 3 .

[0022] It should be noted that after the above-mentioned Mo powder undergoes vacuum drying, oxidation-reduction treatment and coating treatment in sequence, the purity is >99.9% and there is no hard agglomeration. After gradation treatment, the particle size range of the Mo powder is continuous without gaps, which can avoid the problem of increased porosity caused by excessive concentration of particles in a single range. At the same time, the Mo powder has a near-spherical morphology.

[0023] Furthermore, after the above-mentioned Mo undergoes gradation treatment, the proportion of 10μm~20μm is ≥35%, which can ensure the fluidity of the powder, while the proportion of 1μm~5μm and 0.1μm~1μm Mo powder is <40%, which can avoid agglomeration, thereby balancing the forming accuracy and density of the alloy.

[0024] Optionally, in the above Cu diffusion treatment, the raw material can be a high-purity copper-based material, such as oxygen-free copper powder with a purity > 99.95%, or oxygen-free copper block with a purity ≥ 99.9%.

[0025] Optionally, the equipment for the Cu diffusion treatment described above can be a vacuum pressure sintering furnace.

[0026] Optionally, after Cu diffusion treatment of the solidified porous Mo skeleton, the obtained copper-molybdenum alloy component can be passivated. Specifically, the alloy can be immersed in chromic acid passivation solution at 30℃~50℃ for 30 minutes, then rinsed with deionized water and vacuum dried.

[0027] In one possible implementation, the above-mentioned vacuum drying process includes: Under 3Pa~10Pa conditions, the drying temperature is controlled at 100℃~150℃; the drying time is ≥1h*H.

[0028] It should be understood that h represents hours, and H represents the thickness of the powder coating, in cm.

[0029] Optionally, when H < 1 cm, the drying time is ≥ 1 h.

[0030] In one possible implementation, the above-mentioned redox treatment includes: Mix 3% to 7% Ni powder into the dried Mo powder and stir evenly. Place the mixture into a redox apparatus and then introduce a mixed gas of CO and N2. Control the reduction temperature to 550℃ to 700℃ and hold for 30 to 60 minutes.

[0031] Optionally, the above-mentioned mixture of CO and N2 consists of 20% CO and 80% N2.

[0032] Optionally, the aforementioned oxidation-reduction equipment can be an atmosphere-protected rotary kiln.

[0033] It should be noted that during the redox treatment process described above, after mixing in 3% to 7% Ni powder, at temperatures of 550℃ to 700℃, because the atomic diffusion rates of Ni and Mo are extremely low, the thermodynamic threshold for forming intermetallic compounds is not reached. Therefore, the Mo and Ni powders only undergo physical mixing without any chemical reaction. Simultaneously, at the subsequent Cu diffusion treatment at a high temperature of 1450℃, because Mo and Ni powders are limited solid solutions with extremely low solubility, a brittle intermediate phase will not form; only a small amount of Ni will dissolve in the Cu matrix.

[0034] Furthermore, during the redox process, mixing in 3% to 7% Ni powder can lower the reduction temperature of Mo oxide, thereby shortening the processing time. It can also improve the flowability of Mo powder, optimizing the uniformity of subsequent 3D printing powder spreading. The residual Ni can enhance the strength and wear resistance of the Cu matrix without affecting the thermal and electrical conductivity of the alloy.

[0035] In one possible implementation, the above-mentioned coating process includes: In an inert gas atmosphere, the Mo powder after oxidation-reduction treatment is coated with TiC nanoparticles at a coating temperature of 300℃~400℃, wherein the amount of TiC nanoparticles used is <5%.

[0036] Alternatively, the above coating treatment can be carried out using plasma spraying equipment.

[0037] Optionally, when the above coating treatment is carried out using a plasma spraying equipment, specifically, under an argon inert atmosphere, TiC nanopowder and redox Mo powder are fed into the plasma spraying equipment. At 300℃~400℃, TiC nanopowder can be uniformly coated on the surface of Mo powder in a molten state, thereby forming a dense thin coating with high coating efficiency and strong coating adhesion.

[0038] Optionally, the particle size of the above-mentioned TiC nanoparticles can be 50 nm to 100 nm.

[0039] It should be understood that the coating temperature of 300℃~400℃ and the subsequent process temperature of 1450℃ are both below the reaction threshold of TiC with Mo and Cu. Therefore, TiC exists only in a physical coating state and will not form brittle intermetallic compounds, nor will it affect the fluidity and wettability of Cu liquid.

[0040] It should be noted that by using TiC nanoparticles to coat the Mo powder after oxidation-reduction treatment, the TiC coating layer can reduce the agglomeration between Mo powder particles, improve its fluidity and tap density, and TiC has high hardness and high temperature resistance, which can strengthen the subsequent porous Mo skeleton structure and reduce the phenomenon of deformation and cracking in high-temperature processes; at the same time, it will not affect the wettability of Cu liquid, as well as the thermal and electrical conductivity of copper-molybdenum alloy.

[0041] Furthermore, TiC nanoparticles can fill the tiny pores between Mo powder particles and, when matched with the gradation treatment of Mo powder, can further improve the tap density and reduce interlayer porosity. Simultaneously, the near-spherical morphology of TiC optimizes the flowability of Mo powder, resulting in more uniform wetting of the molten metal and Mo powder, reducing defects such as missed printing and over-wetting.

[0042] Furthermore, in the aforementioned vacuum drying, oxidation-reduction, and coating processes, vacuum drying removes moisture from the Mo powder, preventing Ni powder oxidation during oxidation-reduction. Oxidation-reduction improves the purity and activity of the Mo powder, making it easier for TiC nanoparticles to be adsorbed and coated, thus improving coating uniformity. After 3D printing, the coated Mo powder results in a more uniform porous framework structure, allowing for sufficient filling of the copper liquid during Cu diffusion. This not only ensures that the final alloy has a copper content exceeding 30% but also prevents liquid copper overflow, while eliminating defects such as residual pores and component segregation. It is suitable for manufacturing small-sized or complex-shaped parts and can be mass-produced.

[0043] Therefore, the vacuum drying treatment, oxidation-reduction treatment, and coating treatment mentioned above have a synergistic effect and are compatible with subsequent processes. If any of the conditions are changed, for example, in the oxidation-reduction treatment, if the amount of Ni powder added is <3% or >7%, or the temperature deviates from 550℃~700℃, problems such as Ni agglomeration affecting the alloy plasticity or Mo powder being prone to sintering and agglomeration will occur; in the coating treatment, if the amount of TiC is ≥5%, or the temperature deviates from 300℃~400℃, problems such as decreased Mo powder fluidity, weak coating, or easy oxidation of TiC will occur, all of which will ultimately reduce the accuracy of 3D printing.

[0044] In one possible implementation, the above-mentioned preset printing conditions include: The printing thickness is 10μm~50μm; for thin-walled areas of the porous Mo skeleton with a thickness <5μm, the liquid saturation is 60%~65%; for thick areas of the porous Mo skeleton with a thickness ≥5μm, the liquid saturation is 67%~75%; the nozzle temperature is 40℃~60℃.

[0045] It should be noted that, under preset printing conditions, for thin-walled regions of the porous Mo skeleton with a thickness of <5μm, a material saturation of 60%~65% can avoid edge overflow and blurred contours caused by excessive material wetting, ensuring the precision and integrity of the thin-walled structure and reducing defects such as collapse and adhesion. For thick regions of the porous Mo skeleton with a thickness ≥5μm, a material saturation of 67%~75% can ensure that the material fully penetrates the Mo powder layer, thereby improving the interlayer bonding force, avoiding problems such as internal pores and delamination in thick regions, and also ensuring structural density. In addition, the printing thickness of 10μm to 50μm can meet the precision forming requirements of 3D printing technology, which can achieve precise layer stacking of complex structures without causing low printing efficiency due to excessive thickness. The nozzle temperature of 40℃ to 60℃ can keep the liquid material in a suitable viscosity range, avoiding the liquid material solidification and clogging of the nozzle due to excessively low temperature, or the liquid material overflowing due to excessively high temperature. At the same time, it can ensure the wetting effect between the liquid material and Mo powder, ultimately improving the consistency of copper-molybdenum alloy component forming.

[0046] In one possible implementation, the above-mentioned vacuum thermosetting process includes: Under a preset vacuum, the temperature is raised to the first curing temperature at a first heating rate for the first curing and heat preservation; then, the temperature is raised to the second curing temperature at a second heating rate for the second curing and heat preservation; after the second curing and heat preservation is completed, the temperature is naturally cooled to room temperature, while the vacuum is adjusted to 1 Pa to 3 Pa.

[0047] In one possible implementation, the preset vacuum level is 0.1 Pa to 1.0 Pa; the first heating rate is 3 °C / min to 5 °C / min, the first curing temperature is 100 °C to 120 °C, and the duration of the first curing and holding is 0.8 h to 1.0 h; the second heating rate is 1 °C / min to 3 °C / min, the second curing temperature is 130 °C to 150 °C, and the duration of the second curing and holding is 1.0 h to 1.5 h.

[0048] Optionally, the equipment for the above-mentioned vacuum thermosetting treatment can be a vacuum segmented temperature-controlled sintering furnace.

[0049] It should be noted that in the above-mentioned vacuum thermosetting process, in the first stage, the temperature is increased at 3℃ / min~5℃ / min to 100℃~120℃, which allows for rapid heating to the low curing temperature. Holding at this temperature for 0.8h~1.0h initially cures the porous Mo skeleton and slowly removes residual surface moisture and volatile impurities, avoiding the problem of moisture boiling and pore formation caused by rapid heating. In the second stage, the heating rate is slowed to 1℃ / min~3℃ / min to avoid thermal stress concentration. Holding at this temperature for 1.0h~1.5h allows the porous Mo skeleton to fully cure, thereby strengthening the skeleton structure. The vacuum environment of 0.1Pa~1.0Pa during the curing stage removes impurities from the decomposition products, preventing impurities from clogging the skeleton pores. Finally, adjusting the vacuum to 1Pa~3Pa balances the pressure inside the furnace and the pressure difference between the inside and outside of the skeleton, preventing minor collapses of the skeleton due to pressure fluctuations at low temperatures and reducing the risk of oxidation of the skeleton during the cooling process.

[0050] In one possible implementation, the Cu diffusion process includes: introducing an inert gas into a Cu diffusion equipment, then introducing copper vapor under negative pressure and at a negative pressure temperature for negative pressure insulation; after completion, performing a first insulation under a first pressure and at a first temperature; and finally performing a second insulation under a second pressure and at a second temperature.

[0051] It should be understood that the "negative pressure" in the above negative pressure stage and negative pressure temperature is relative to normal pressure.

[0052] Optionally, copper vapor is introduced during the negative pressure stage and at the negative pressure temperature. The copper vapor can be copper vapor directly introduced from the outside, or it can be a trace amount of copper vapor generated by Cu-diffusion raw materials, such as high-purity ultrafine copper powder or high-purity copper blocks, during the negative pressure stage and at the negative pressure temperature.

[0053] Optionally, when the copper vapor is directly introduced from the outside, the amount introduced is equivalent to the amount of copper vapor generated by high-purity ultrafine copper powder or high-purity copper blocks during the negative pressure stage and at the negative pressure temperature.

[0054] In one possible implementation, the pressure of the negative pressure stage is 5 Pa to 20 Pa, the negative pressure temperature is 350°C to 500°C, and the duration of negative pressure heat preservation is 1.5 h*d; the first pressure is atmospheric pressure, the first temperature is 1350°C to 1400°C, and the duration of the first heat preservation is 1.5 h to 2.0 h; the second pressure is 3 MPa to 5 MPa, the second temperature is 1400°C to 1450°C, and the duration of the second heat preservation is 0.5 h to 1.0 h.

[0055] It should be understood that the duration of negative pressure insulation is 1.5h*d, where h represents hours and d represents the maximum thickness of the cured porous Mo skeleton, in cm.

[0056] It should be understood that the pressure of 5Pa~20Pa in the above negative pressure stage refers to a vacuum environment with an absolute pressure of 5Pa~20Pa inside the Cu diffusion treatment equipment.

[0057] In one possible implementation, 0.5% to 0.9% of nano-Ag powder may be added to the Cu-treated raw material.

[0058] Optionally, the particle size of the above-mentioned nano Ag powder can be 50 nm to 200 nm.

[0059] It should be understood that during the Cu diffusion process at 1350℃~1450℃, the nano-Ag powder and Mo are thermodynamically immiscible, with no intermediate compounds formed and a solid solubility of almost zero. Therefore, the nano-Ag powder is uniformly dispersed in the copper matrix as an alloying element, maintaining physical contact with the Mo framework without any chemical reaction.

[0060] Optionally, the equipment for the Cu diffusion treatment described above can be a vacuum pressurized atmosphere sintering furnace.

[0061] It should be noted that during the Cu infiltration process described above, the negative pressure environment of 5 Pa to 20 Pa can completely remove residual gas and trace impurities in the porous Mo skeleton, preventing them from hindering copper molten infiltration. It can also reduce gas molecule collisions, extend the free path of copper vapor, and allow copper vapor to penetrate more fully into the internal pores of the solidified porous Mo skeleton, thereby improving the uniformity and penetration depth of Cu infiltration. Furthermore, when the temperature is 350℃ to 500℃, copper vapor can be pre-adsorbed on the surface of the skeleton pores to form a thin copper layer. After 1.5 h*d of heat preservation, it can be ensured that copper vapor penetrates into the deep pores of the skeleton, providing a transition layer for subsequent high-temperature melting and infiltration, and reducing the element diffusion resistance at the copper-molybdenum interface. When the temperature rises to 1350℃~1400℃, the melting temperature of copper is reached. The molten copper can rapidly penetrate the porous Mo framework using capillary force. The ambient pressure environment prevents excessive pressure from causing framework deformation. After 1.5h~2.0h of holding, the molten copper can fully spread and fill most of the medium and large pores. Simultaneously, nano-Ag powder is uniformly dispersed with the molten copper, and its high wettability further improves the interfacial compatibility between the molten copper and the porous Mo framework. Finally, a high pressure of 3MPa~5MPa propels the molten copper to penetrate into the micropores of the porous Mo framework, completely eliminating residual porosity after ambient pressure melting and infiltration. This increases the alloy density to over 98%. Combined with the 1400℃~1450℃ temperature, this promotes slight metallurgical bonding at the copper-molybdenum interface. Furthermore, the nano-Ag powder and copper can form a solid solution, strengthening the interfacial bond and preventing copper-molybdenum delamination during use.

[0062] Furthermore, in the Cu diffusion process, the addition of 0.5% to 0.9% nano Ag powder can further improve the thermal and electrical conductivity of the alloy, while also enhancing its corrosion resistance. Moreover, the nano Ag powder has a large specific surface area, which can fill the tiny gaps between copper and molybdenum, reducing interface defects, making the mechanical properties of the alloy more uniform, and combining the high-temperature strength of molybdenum with the toughness of copper.

[0063] To achieve the above objectives, the present invention also provides a copper-molybdenum alloy component, which is prepared by the above-described manufacturing method.

[0064] In the manufacturing method of this invention, the process parameters of each step are matched with the 3D process, enabling the molding of complex structures such as thin walls and irregularly shaped channels. The resulting copper-molybdenum alloy components have a density of over 98%, a porosity of <2%, and are free from defects such as cracks, delamination, and copper-molybdenum peeling. Simultaneously, the high strength of the Mo skeleton combined with the toughness of copper significantly improves the interfacial bonding strength, resulting in stable mechanical properties. Furthermore, it retains the high thermal and electrical conductivity of copper, and the doping of nano-Ag powder further optimizes the alloy's corrosion resistance, while the high-temperature stability of Mo enhances the alloy's high-temperature resistance.

[0065] In the manufacturing method of this invention, after Mo powder undergoes vacuum drying, oxidation-reduction treatment, and coating treatment in sequence, its flowability and tap density can be significantly improved, making it compatible with the subsequent 3D printing conditions. The porous Mo skeleton obtained after printing undergoes staged vacuum thermosetting treatment, which can release thermal stress and prevent deformation and cracking. Moreover, the setting temperature is lower than the reaction temperature between TiC and Mo, which can protect the integrity of the coating layer. The porous Mo skeleton after curing treatment has advantages such as high purity, uniform pore size, and clean surface, which can be matched with the negative pressure stage environment of Cu diffusion treatment, thereby allowing copper vapor to be rapidly adsorbed and penetrated. After the subsequent Cu diffusion process, uniform copper diffusion of the porous Mo skeleton is finally achieved. Therefore, in the above manufacturing method, there is a synergistic effect between the various process steps and their parameters, which together improve the performance of the copper-molybdenum alloy component.

[0066] Example 1 A method for manufacturing a copper-molybdenum alloy component includes the following steps: S10. The Mo powder is subjected to vacuum drying, redox treatment and coating treatment in sequence to obtain pretreated Mo powder, which is based on S101~S103, as follows: S101. Adjust the vacuum degree of the vacuum drying oven to 5Pa, the drying temperature to 120℃, the Mo powder thickness to 8mm, and the drying time to 1.2h to dry the Mo powder and remove moisture and volatile impurities from it. S102. Using an atmosphere-protected rotary kiln, the Mo powder treated in S101 is subjected to oxidation-reduction treatment. 5% Ni powder is mixed into the dried Mo powder and stirred evenly. A mixed gas with a volume ratio of 20% CO + 80% N2 is introduced into the equipment, the temperature is adjusted to 600℃, and the temperature is held for 45 minutes to remove the oxide layer on the surface of the Mo powder, improve the purity of the Mo powder to over 99.95%, and improve the flowability of the Mo powder. S103. The Mo powder treated in S102 was coated using a plasma spraying device. Under an inert argon atmosphere, the amount of TiC nanopowder was 3%, the coating temperature was 350℃, the spraying power was 8kW, and the Mo powder feeding rate was 5kg / h. A uniform TiC coating layer was formed on the surface of the Mo powder, which can avoid particle agglomeration and improve the uniformity of powder spreading. S20. The Mo powder treated with S10 is printed into a porous Mo framework using 3D printing technology, as follows: Start the 3D metal printer, preheat the nozzle to 50°C, and calibrate the level of the printing platform. Load the S10-treated Mo powder into the printer's toner cartridge, turn on the automatic powder spreading system, and set the initial powder spreading thickness to 30μm. Then import the model parameters. In this embodiment, the 3D model contains a 3μm thin wall and an 8μm thick structure. Divide the area in the printing software, marking the thin-walled area as having a material saturation of 62% and the thick area as having a material saturation of 70%. After confirming the printing path, perform layer printing. For each layer, first spread a 30μm thick layer of Mo powder, and then spray the material onto the corresponding area through the nozzle to complete the bonding. After one layer is printed, the platform is lowered by 30μm, and the powder spreading and spraying steps are repeated until the entire porous Mo skeleton is printed. After printing, remove the skeleton along with the printing platform to obtain the initially formed porous Mo skeleton. S30. The porous Mo skeleton obtained in S20 is subjected to vacuum thermosetting treatment to obtain a cured porous Mo skeleton, specifically as follows: The initially formed porous Mo skeleton obtained from S20 was gently placed on the high-temperature resistant support of the vacuum segmented temperature-controlled sintering furnace, ensuring that the skeleton did not contact the furnace wall and the furnace body was sealed. The vacuum pump was started, and the vacuum degree inside the furnace was evacuated to 0.5 Pa. The vacuum state was maintained, and then the furnace was heated at a heating rate of 4℃ / min until the furnace temperature reached 110℃. The temperature was held for 0.9 h, and the vacuum was continuously evacuated during this period to remove residual solvent and trace amounts of water vapor from the surface of the liquid material in the skeleton. After the holding time was completed, the heating rate was adjusted to 2℃ / min, and the temperature was continued to 140℃. The temperature was held for 1.2 h to allow the binder to fully cross-link and react, strengthen the skeleton structure, and slowly release internal thermal stress. After completion, the heating was stopped, the vacuum degree inside the furnace was adjusted to 2 Pa, and a slightly positive argon atmosphere was maintained to allow the skeleton to cool down naturally. After the furnace temperature dropped to room temperature, the furnace body was opened and the cured porous Mo skeleton was taken out. S40. The solidified porous Mo skeleton obtained in S30 is subjected to Cu diffusion treatment to obtain a copper-molybdenum alloy component, as detailed below: Oxygen-free copper powder was mixed with 0.7% nano Ag powder and ground in a planetary ball mill to obtain copper-silver mixed powder. The solidified porous Mo skeleton was fixed on the central support of a vacuum pressurized atmosphere sintering furnace, and the copper-silver mixed powder was evenly spread around and below the skeleton. The vacuum pump was started to draw the pressure inside the furnace to 12 Pa, and argon gas was introduced into the furnace to atmospheric pressure to isolate the air. The furnace body was heated to 400°C, and a small amount of copper vapor was introduced. The temperature was kept constant for 3 hours, where the 3 hours was obtained by measuring 1.5 hours × 2 cm, where 2 cm is the maximum size d of the skeleton. During the holding period, the negative pressure was maintained to allow the copper vapor to penetrate into the deep pores of the skeleton and adsorb onto the pore surface to form a thin copper layer. After completion, the vacuuming was stopped, and the temperature was rapidly increased to 1380℃ and held at that temperature for 1.8 hours. At this time, the copper-silver mixed powder melted into a copper-silver alloy liquid and initially filled the pores of the skeleton with the help of capillary force. Then, the temperature was increased to 1420℃ while maintaining 1380℃. The pressurization system was started to increase the pressure in the furnace to 4MPa and stabilize it. The temperature was held at that temperature for 0.8 hours. Under the action of high pressure, the copper-silver alloy liquid fully filled the tiny pores and formed a tight bond with the Mo skeleton. After the heat preservation is completed, the heating device is turned off, and the argon atmosphere and furnace pressure are maintained until the temperature drops to 500℃. Then the pressure is released, and the temperature continues to drop naturally. The furnace body is opened, and the copper-infiltrated components are taken out to complete the Cu infiltration treatment.

[0067] Through the above S10~S40 processes, copper-molybdenum alloy components are obtained.

[0068] Example 2 A method for manufacturing a copper-molybdenum alloy component includes the following steps: S10. The Mo powder is subjected to vacuum drying, redox treatment, and coating treatment in sequence to obtain the treated Mo powder, which is achieved based on S101~S103, as follows: S101. Adjust the vacuum degree of the vacuum drying oven to 3Pa, the drying temperature to 150℃, the Mo powder thickness to 12mm, and the drying time to 1.5h to dry the Mo powder and remove moisture and volatile impurities from it. S102. Using an atmosphere-protected rotary kiln, the Mo powder treated in S101 is subjected to oxidation-reduction treatment. 3% Ni powder is mixed into the dried Mo powder and stirred evenly. A mixed gas with a volume ratio of 20% CO + 80% N2 is introduced into the equipment, the temperature is adjusted to 700℃, and the temperature is held for 30 minutes to remove the oxide layer on the surface of the Mo powder, improve the purity of the Mo powder to over 99.98%, and improve the flowability of the Mo powder. S103. The Mo powder treated in S102 was coated using a plasma spraying device. Under an inert argon atmosphere, the amount of TiC nanopowder was 3%, the coating temperature was 300℃, the spraying power was 8kW, and the Mo powder feeding rate was 5kg / h. A uniform TiC coating layer was formed on the surface of the Mo powder, which can avoid particle agglomeration and improve the uniformity of powder spreading. S20. The Mo powder treated with S10 is printed into a porous Mo framework using 3D printing technology, as follows: Start the 3D metal printer, preheat the nozzle to 40°C, and calibrate the level of the printing platform. Load the S10-treated Mo powder into the printer's toner cartridge, turn on the automatic powder spreading system, and set the initial powder spreading thickness to 40μm. Then import the model parameters. In this embodiment, the 3D model contains a 4μm thin wall and a 10μm thick structure. Divide the area in the printing software, marking the thin-walled area as having a material saturation of 60% and the thick area as having a material saturation of 75%. After confirming the printing path, perform layer printing. For each layer, first spread a 40μm thick layer of Mo powder, and then spray the material onto the corresponding area through the nozzle to complete the bonding. After one layer is printed, the platform is lowered by 40μm, and the powder spreading and spraying steps are repeated until the entire porous Mo skeleton is printed. After printing, remove the skeleton along with the printing platform to obtain the initially formed porous Mo skeleton. S30. The porous Mo skeleton obtained in S20 is subjected to vacuum thermosetting treatment to obtain a cured porous Mo skeleton, specifically as follows: The initially formed porous Mo skeleton obtained from S20 is gently placed on the high-temperature resistant support of the vacuum segmented temperature-controlled sintering furnace, ensuring that the skeleton does not contact the furnace wall and the furnace body is sealed. The vacuum pump is started to evacuate the vacuum in the furnace to 0.1 Pa and maintain the vacuum state. Then, the furnace is heated at a heating rate of 3℃ / min until the furnace temperature reaches 120℃. The temperature is held at this temperature for 0.8 hours, during which the vacuum is continuously evacuated to remove residual solvent and trace amounts of water vapor from the surface of the liquid material in the skeleton. After the holding time is completed, the heating rate is adjusted to 1℃ / min and the temperature is continued to 150℃. The temperature is held at this temperature for 1.0 hour to allow the binder to fully cross-link and react, strengthening the skeleton structure and slowly releasing internal thermal stress. After completion, the heating is stopped, the vacuum in the furnace is adjusted to 1.0 Pa, and a slightly positive argon atmosphere is maintained to allow the skeleton to cool down naturally. After the furnace temperature drops to room temperature, the furnace body is opened and the cured porous Mo skeleton is taken out. S40. The solidified porous Mo skeleton obtained in S30 is subjected to Cu diffusion treatment to obtain a copper-molybdenum alloy component, as detailed below: Oxygen-free copper powder was mixed with 0.5% nano-Ag powder and ground in a planetary ball mill to obtain copper-silver mixed powder. The solidified porous Mo skeleton was fixed on the central support of a vacuum pressurized atmosphere sintering furnace, and the copper-silver mixed powder was evenly spread around and below the skeleton. The vacuum pump was started to draw the pressure inside the furnace to 5 Pa, and argon gas was introduced into the furnace to atmospheric pressure to isolate the air. The furnace body was heated to 500°C. Under this condition, the oxygen-free copper powder will evaporate a trace amount of copper vapor. The temperature was kept constant for 6 hours, where the 6 hours was obtained by measuring 1.5 hours × 4 cm, where 4 cm is the maximum size d of the skeleton. During the holding period, the negative pressure was maintained to allow the copper vapor to penetrate into the deep pores of the skeleton and adsorb onto the pore surface to form a thin copper layer. After completion, the vacuuming was stopped, and the temperature was rapidly increased to 1400℃ and held at that temperature for 1.5 hours. At this time, the copper-silver mixed powder melted into a copper-silver alloy liquid and initially filled the pores of the skeleton with the help of capillary force. Then, the temperature was increased to 1450℃ while maintaining the temperature at 1400℃. The pressurization system was started to increase the pressure in the furnace to 3MPa and stabilize it. The temperature was held at that temperature for 0.5 hours. Under the action of high pressure, the copper-silver alloy liquid fully filled the tiny pores and formed a tight bond with the Mo skeleton. After the heat preservation is completed, the heating device is turned off, and the argon atmosphere and furnace pressure are maintained until the temperature drops to 500℃. Then the pressure is released, and the temperature continues to drop naturally. The furnace body is opened, and the copper-infiltrated components are taken out to complete the Cu infiltration treatment.

[0069] Through the above S10~S40 processes, copper-molybdenum alloy components are obtained.

[0070] Example 3 A method for manufacturing a copper-molybdenum alloy component includes the following steps: S10. The Mo powder is subjected to vacuum drying, redox treatment, and coating treatment in sequence to obtain the treated Mo powder, which is achieved based on S101~S103, as follows: S101. Adjust the vacuum degree of the vacuum drying oven to 10Pa, the drying temperature to 100℃, the Mo powder thickness to 5mm, and the drying time to 1.0h to dry the Mo powder and remove moisture and volatile impurities from it. S102. Using an atmosphere-protected rotary kiln, the Mo powder treated in S101 is subjected to oxidation-reduction treatment. 7% Ni powder is mixed into the dried Mo powder and stirred evenly. A mixed gas with a volume ratio of 20% CO + 80% N2 is introduced into the equipment, the temperature is adjusted to 550℃, and the temperature is held for 60 minutes to remove the oxide layer on the surface of the Mo powder, improve the purity of the Mo powder to over 99.99%, and improve the flowability of the Mo powder. S103. The Mo powder treated in S102 was coated using a plasma spraying device. Under an inert argon atmosphere, the amount of TiC nanopowder was 2%, the coating temperature was 400℃, the spraying power was 8kW, and the Mo powder feeding rate was 5kg / h. A uniform TiC coating layer was formed on the surface of the Mo powder, which can avoid particle agglomeration and improve the uniformity of powder spreading. S20. The Mo powder treated with S10 is printed into a porous Mo framework using 3D printing technology, as follows: Start the 3D metal printer, preheat the nozzle to 40°C, and calibrate the level of the printing platform. Load the S10-treated Mo powder into the printer's toner cartridge, turn on the automatic powder spreading system, and set the initial powder spreading thickness to 10μm. Then import the model parameters. In this embodiment, the 3D model contains a 2μm thin wall and a 6μm thick structure. Divide the area in the printing software, marking the thin-walled area as having a material saturation of 60% and the thick area as having a material saturation of 67%. After confirming the printing path, perform layer printing. For each layer, first spread a 10μm thick layer of Mo powder, and then spray the material onto the corresponding area through the nozzle to complete the bonding. After one layer is printed, the platform is lowered by 10μm, and the powder spreading and spraying steps are repeated until the entire porous Mo skeleton is printed. After printing, remove the skeleton along with the printing platform to obtain the initially formed porous Mo skeleton. S30. The porous Mo skeleton obtained in S20 is subjected to vacuum thermosetting treatment to obtain a cured porous Mo skeleton, specifically as follows: The initially formed porous Mo skeleton obtained from S20 is gently placed on the high-temperature resistant support of the vacuum segmented temperature-controlled sintering furnace, ensuring that the skeleton does not contact the furnace wall and the furnace body is sealed. The vacuum pump is started to evacuate the vacuum degree inside the furnace to 1.01 Pa and maintain the vacuum state. Then, the furnace is heated at a heating rate of 5℃ / min until the furnace temperature reaches 100℃. The temperature is held at this time for 1.0 h, during which the vacuum is continuously evacuated to remove residual solvent and trace amounts of water vapor from the surface of the liquid material in the skeleton. After the holding time is completed, the heating rate is adjusted to 3℃ / min and the temperature is continued to 130℃. The temperature is held at this time for 1.5 h to allow the binder to fully cross-link and react, strengthen the skeleton structure, and slowly release internal thermal stress. After completion, the heating is stopped, the vacuum degree inside the furnace is adjusted to 3.0 Pa, and a slightly positive argon atmosphere is maintained to allow the skeleton to cool down naturally. After the furnace temperature drops to room temperature, the furnace body is opened and the cured porous Mo skeleton is taken out. S40. The solidified porous Mo skeleton obtained in S30 is subjected to Cu diffusion treatment to obtain a copper-molybdenum alloy component, as detailed below: Oxygen-free copper powder was mixed with 0.9% nano-Ag powder and ground in a planetary ball mill to obtain copper-silver mixed powder. The solidified porous Mo skeleton was fixed on the central support of a vacuum pressurized atmosphere sintering furnace, and the copper-silver mixed powder was evenly spread around and below the skeleton. The vacuum pump was started to evacuate the furnace pressure to 20 Pa, and argon gas was introduced into the furnace to atmospheric pressure to isolate the air. The furnace body was heated to 350°C, and a small amount of copper vapor was introduced. The temperature was kept constant for 1.5 h, where 1.5 h is the length of 1.5 h × 1.0 cm, and 1.0 cm is the maximum size d of the skeleton. During the holding period, the negative pressure was maintained to allow the copper vapor to penetrate into the deep pores of the skeleton and adsorb onto the pore surface to form a thin copper layer. After completion, the vacuuming was stopped, and the temperature was rapidly increased to 1350℃ and held at that temperature for 2.0 hours. At this time, the copper-silver mixed powder melted into copper-silver alloy liquid and initially filled the pores of the skeleton with the help of capillary force. Then, the temperature was increased to 1400℃ while maintaining 1350℃. The pressurization system was started to increase the pressure in the furnace to 5MPa and stabilize it. The temperature was held at that temperature for 1.0 hour. Under the action of high pressure, the copper-silver alloy liquid fully filled the tiny pores and formed a tight bond with the Mo skeleton. After the heat preservation is completed, the heating device is turned off, and the argon atmosphere and furnace pressure are maintained until the temperature drops to 500℃. Then the pressure is released, and the temperature continues to drop naturally. The furnace body is opened, and the copper-infiltrated components are taken out to complete the Cu infiltration treatment.

[0071] Through the above S10~S40 processes, copper-molybdenum alloy components are obtained.

[0072] The properties of the copper-molybdenum alloy components prepared in Examples 1-3 were measured, and the results are shown in Table 3.

[0073] Table 3

[0074] Analysis of the data in Table 1 shows that the copper-molybdenum alloy components prepared by the technical solutions in Examples 1-3 exhibit excellent performance, specifically as follows: First, the copper content of the copper-molybdenum alloy components obtained in Examples 1-3 is all >50%. Higher copper content results in denser heat and electrical transport channels in the alloy component, leading to a simultaneous increase in thermal conductivity and electrical conductivity. Furthermore, copper content is directly related to the pore filling rate of the Mo skeleton; higher copper content indicates more thorough filling of the skeleton pores by the copper melt during the copper infiltration process, resulting in higher alloy density. However, if the copper content exceeds 60%, it will lead to a decrease in the skeleton's supporting capacity. Therefore, it is necessary to control the Cu infiltration process to maintain the copper content within the optimal range of 50% to 60%.

[0075] Secondly, the density can reach over 99%. This is because, during the preparation process, vacuum drying of Mo powder removes impurities and avoids contaminant residue. Then, Ni doping through redox treatment improves the flowability of Mo powder and ensures the density of the powder layer. Finally, TiC coating significantly reduces Mo powder agglomeration and optimizes particle packing. These three factors work synergistically to achieve a tap density of 5.3 g / cm³ for Mo powder. 3 -8.0g / cm 3This lays the foundation for subsequent alloy porosity. Secondly, during the Cu infiltration process, a negative pressure stage of 5 Pa to 20 Pa allows copper vapor to penetrate into the deep pores of the porous Mo skeleton in advance. Then, through atmospheric pressure melting infiltration at 1350℃ to 1400℃, the copper liquid is initially filled. Finally, high-pressure densification is achieved at 3 MPa to 5 MPa to eliminate micropores. This three-stage process can ensure that the porosity of the porous Mo skeleton exceeds 98%.

[0076] Furthermore, the interfacial bonding strength can reach 258MPa~265MPa. This is because the oxidation-reduction treatment of Mo powder removes the oxide layer on its surface, thereby improving its purity; while the TiC coating treatment prevents secondary oxidation of Mo powder, resulting in a clean and impurity-free surface of the 3D-printed porous Mo skeleton, reducing the barrier at the copper-molybdenum interface. In the Cu diffusion treatment, the added 0.5%~0.9% nano Ag powder can form a solid solution with the copper liquid, thereby improving the wettability of the copper liquid to the Mo skeleton, fully filling the tiny gaps at the Mo skeleton interface, and strengthening the bonding force. In Example 1, the addition amount of 0.7% showed the best compatibility, resulting in a bonding strength as high as 265MPa. At the same time, the temperature and pressure in the Cu diffusion treatment stage work synergistically to promote the metallurgical bonding of the copper-molybdenum alloy component interface. The high pressure further compresses the porosity of the interface, preventing the interface from peeling off.

[0077] In addition, thermal conductivity ≥210W / (m The conductivity is ≥44% IACS. This is because the purity of Mo powder is increased to over 99.95% after processing, ensuring unobstructed thermal and electrical conduction channels. The addition of nano-Ag powder further optimizes this performance. The resulting alloy has a density >98.5% and a porosity <1.5%, which reduces pore scattering during heat and electrical transport and improves transport efficiency. At the same time, the temperature in the preparation process is below the reaction threshold of TiC, Ni and Mo, so brittle intermetallic compounds are not generated, avoiding the increase of interfacial heat and resistance.

[0078] Furthermore, the alloy exhibits excellent high-temperature stability at 1000℃ for 2 hours. This is because the Mo skeleton acts as a supporting framework, preventing softening and deformation at 1000℃; while the high-temperature fluidity of copper is restricted by the Mo skeleton, preventing loss at high temperatures. Additionally, the TiC coating on the surface of the Mo powder particles possesses high-temperature resistance, which enhances the high-temperature strength of the Mo skeleton. The resulting copper-molybdenum alloy component exhibits tight interfacial bonding, with no delamination or oxidation at high temperatures, ensuring its performance stability.

[0079] Under the technical solutions of Examples 1-3, the copper-molybdenum alloy components obtained by 3D printing have high dimensional accuracy. This is because during the printing process, the saturation of the liquid material in different areas is controlled to avoid problems such as overflow and material shortage. Furthermore, the printing thickness is matched to the size and structure of the component, and the nozzle temperature setting ensures stable liquid material viscosity, ultimately improving the accuracy of the formed component. Simultaneously, during the vacuum thermosetting process, segmented temperature control can fully release the thermal stress of the formed part, reducing the deformation rate. The temperature and pressure control during the Cu diffusion treatment avoids the problem of skeleton deformation caused by high pressure and high temperature, ultimately resulting in a significant improvement in the dimensional accuracy of the copper-molybdenum alloy components.

[0080] Comparative Example 1 Comparative Example 1 was set up under Example 1. In Comparative Example 1, S10 did not include the redox treatment and coating treatment; the remaining steps and process parameters were the same as in Example 1.

[0081] Comparative Example 2 Comparative Example 2 was set up under Example 1. In Comparative Example 2, in S20, the saturation of the liquid was not set according to the wall thickness region, and the saturation of the liquid was uniformly set to 65%; in S30, it was heat-cured at 150°C for 2 hours; in S40, no nano Ag powder was added, and it was kept at 12 Pa and 400°C for 30 hours, and then kept at 1450°C for 2.0 hours. The remaining steps and process parameters were the same as in Example 1.

[0082] The performance of the copper-molybdenum alloy components obtained from Comparative Example 1 and Comparative Example 2 was tested, and the results are shown in Table 2.

[0083] Table 2

[0084] Analysis of the data in Table 2 shows that in Comparative Example 1, because the Mo powder did not undergo redox treatment and coating treatment, its flowability was poor, resulting in severe powder agglomeration during 3D printing. This led to uneven pore distribution and numerous defects in the resulting porous Mo framework. Furthermore, the lack of TiC coating treatment resulted in a tap density of <3.5 g / cm³. 3This results in weak bonding between printed layers, cracking of the matrix, and numerous ineffective pores for subsequent copper diffusion. Furthermore, the untreated Mo powder has an oxide layer on its surface, which reacts with the molten copper during Cu diffusion to form brittle oxide products, CuMoO4. This hinders the bonding between the copper and molybdenum interfaces, leading to a significant decrease in interfacial strength. The remaining ineffective pores in the porous Mo matrix also prevent sufficient copper penetration, ultimately resulting in a significant reduction in the copper content, density, and porosity of the copper-molybdenum alloy component. Consequently, the thermal and electrical conduction channels are blocked by these pores, leading to a significant performance degradation. Simultaneously, the untreated Mo powder lacks a TiC protective layer on its surface, causing deformation during Cu diffusion and at high temperatures, resulting in reduced component precision and an increased defect rate.

[0085] In Comparative Example 2, the saturation level of the liquid material was uniformly set during the 3D printing process without dividing the area according to the wall thickness of the component. This resulted in problems such as overflow and blurred contours in thin-walled areas due to excessive saturation, while in thicker areas, insufficient saturation led to weak interlayer bonding, ultimately increasing the porosity of the skeleton. Secondly, the use of constant temperature curing during thermosetting prevented the gradual release of internal thermal stress in the skeleton. After curing, the skeleton was prone to deformation, and microcracks appeared in some areas. Furthermore, during copper infiltration, the molten copper could not fill the crack gaps, resulting in an increase in residual porosity. Ultimately, this led to a significant decrease in the performance of the resulting copper-molybdenum alloy component.

[0086] By comparing and analyzing the performance of the copper-molybdenum alloy components obtained in Examples 1-3 and Comparative Examples 1-2, it can be seen that in the technical solution of the present invention, the vacuum drying treatment, oxidation-reduction treatment and coating treatment of Mo powder have a synergistic effect with the preset parameters of subsequent 3D printing, vacuum thermosetting treatment and Cu infiltration treatment process steps and parameters, which together improve the performance of the copper-molybdenum alloy components. The technical features cannot be used separately. If any process is changed, the performance of the copper-molybdenum alloy components will decrease.

[0087] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method of manufacturing a copper-molybdenum alloy member, characterized by, The method comprises the following steps: The Mo powder is sequentially subjected to vacuum drying treatment, oxidation-reduction treatment and coating treatment to obtain pretreated Mo powder; The pretreated Mo powder is printed into a porous Mo framework under preset printing conditions by using a 3D printing process; The porous Mo framework is subjected to vacuum heat curing treatment to obtain a cured porous Mo framework; The cured porous Mo framework is subjected to Cu infiltration treatment to obtain the copper-molybdenum alloy component.

2. The production method according to claim 1, characterized by The vacuum drying treatment comprises: The drying temperature is controlled to be 100-150 DEG C under a vacuum degree of 3-10 Pa, and the drying time is ≥1h*H, wherein h is hour and H is the powder laying thickness of the Mo powder.

3. The production method according to claim 1, characterized by The oxidation-reduction treatment comprises: The Mo powder after drying treatment is mixed with 3-7% Ni powder, stirred uniformly, and then put into an oxidation-reduction device, and then a mixed gas composed of CO and N2 is introduced, and the reduction temperature is controlled to be 550-700 DEG C, and the holding time is 30-60 min.

4. The production method according to claim 1, characterized by The coating treatment comprises: The Mo powder after oxidation-reduction treatment is coated with TiC nano powder under an inert gas atmosphere, and the coating temperature is 300-400 DEG C, wherein the amount of TiC nano powder is <5%.

5. The production method according to claim 1, characterized by The preset printing conditions comprise: The printing layer thickness is 10-50 μm; for the thin-wall area of the porous Mo framework with a thickness <5 μm, the liquid saturation degree is set to be 60-65%; for the thick area of the porous Mo framework with a thickness ≥5 μm, the liquid saturation degree is set to be 67-75%; and the nozzle temperature is 40-60 DEG C.

6. The production method according to claim 1, characterized by The vacuum heat curing treatment comprises: Under a preset vacuum degree, the first heat-up rate is used to heat up to the first curing temperature for the first curing holding; then the second heat-up rate is used to heat up to the second curing temperature for the second curing holding; and after the second curing holding is completed, the temperature is naturally lowered to room temperature, and the preset vacuum degree is adjusted to 1-3 Pa.

7. The production method according to claim 6, wherein The preset vacuum degree is 0.1-1.0 Pa; the first heat-up rate is 3-5 DEG C / min, the first curing temperature is 100-120 DEG C, and the first curing holding time is 0.8-1.0 h; the second heat-up rate is 1-3 DEG C / min, the second curing temperature is 130-150 DEG C, and the second curing holding time is 1.0-1.5 h.

8. The production method according to claim 1, wherein The Cu infiltration treatment comprises: 0.5-0.9% nano Ag powder is added to the raw material for Cu infiltration treatment; Inert gas is introduced into the Cu infiltration treatment equipment, and then copper vapor is introduced under negative pressure stage and negative pressure temperature for negative pressure holding; after completion, the first holding is carried out under the first pressure and the first temperature; and finally the second holding is carried out under the second pressure and the second temperature.

9. The production method according to claim 8, wherein The pressure of the negative pressure stage is 5 Pa to 20 Pa, the negative pressure temperature is 350 DEG C to 500 DEG C, and the duration of the negative pressure holding is 1.5 h*d, wherein h is hour and d is the maximum thickness of the solidified porous Mo skeleton; the first pressure is normal pressure, the first temperature is 1350 DEG C to 1400 DEG C, and the duration of the first holding is 1.5 h to 2.0 h; the second pressure is 3 MPa to 5 MPa, the second temperature is 1400 DEG C to 1450 DEG C, and the duration of the second holding is 0.5 h to 1.0 h.

10. A copper-molybdenum alloy component, characterized by, The copper-molybdenum alloy component is manufactured by the manufacturing method of any one of claims 1 to 9.

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