Wafer processing device of semiconductor integrated circuit device

Abstract

The invention relates to the technical field of wafer processing, and discloses a wafer processing device of a semiconductor integrated circuit device, which comprises a fixed chuck and a wafer processing table mounted on the fixed chuck, a wafer to be polished is placed on the wafer processing table, and a plurality of electric pushing clamping blocks for clamping the wafer processing table are arranged on the fixed chuck. The first suction cup and the multiple second suction cups are matched with each other to suck and press the to-be-polished wafer, the to-be-polished wafer abuts against the top of the wafer machining table, in this way, the to-be-polished wafer can be sucked and fixed, meanwhile, the upper surface of the to-be-polished wafer can be completely exposed, and the polishing efficiency is improved. A plurality of second suction cups are matched to not adsorb the to-be-polished wafer any more, a first suction cup drives the to-be-polished wafer to rotate, and a rolling ball and a rolling bead are matched for clamping on the two sides of the to-be-polished wafer, so that the to-be-polished wafer is rotationally and stably clamped in the detection process.

Description

Technical Field

[0001] This invention relates to the field of wafer fabrication technology, and more particularly to a wafer fabrication apparatus for semiconductor integrated circuit devices. Background Technology

[0002] Wafers must be precisely, stably, and without damage held in processing equipment, while also withstanding extreme environments such as vacuum, high temperature, and plasma. Wafer processing typically employs a fixed process, using a few precision chucks that only contact the outermost ineffective area of ​​the wafer. This is common in conveyor robots, some measuring tables, and older equipment. However, the above-mentioned clamping methods usually have the following problems: First, the uneven clamping force of conventional clamping may cause micro-deformation of the wafer, affecting photolithography focus and potentially generating particles at the contact points; it is not suitable for applications requiring back-side processing or uniform overall temperature. In addition, conventional clamping will create a clamping coverage area on the upper surface of the wafer, which will form grinding dead corners and is not conducive to clamping and grinding. Secondly, the wafer surface is prone to unevenness during the clamping and polishing process. Therefore, it is necessary to add corresponding detection methods during the clamping and fixing process to complete the detection process, so as to improve the overall processing efficiency.

[0003] To this end, we designed a wafer fabrication apparatus for semiconductor integrated circuit devices. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that the wafer surface is easily uneven during the clamping and polishing process in the prior art. Therefore, corresponding detection methods need to be added during the clamping and fixing process. Therefore, a wafer processing device for semiconductor integrated circuit devices is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a wafer processing apparatus for semiconductor integrated circuit devices, comprising a fixed chuck and a wafer processing stage mounted on the fixed chuck, wherein a wafer to be polished is placed on the wafer processing stage, the fixed chuck is provided with a plurality of electrically pushed clamping blocks for clamping the wafer processing stage, and a plurality of second suction cups for adsorbing the wafer to be polished are provided inside the wafer processing stage, the plurality of second suction cups are arranged in a circle, and the second suction cups slide along the radial direction of the wafer processing stage through suction pipes; The suction pipe is equipped with a push detection mechanism that abuts against the bottom of the wafer to be polished. A rotating rod is coaxially mounted on the wafer processing table, and a first suction cup for adsorbing the wafer to be polished is mounted on the rotating rod. Multiple electrically driven bases are arranged in a circle on the wafer processing table, and the positions of the electrically driven bases and the second suction cups are one-to-one. A push rod slides along the radial direction of the wafer to be polished on the electrically driven base, and a defect marking mechanism for marking the wafer to be polished is provided at the end of the push rod.

[0006] Preferably, the wafer processing stage has an internal cavity, in which a first support frame body is installed. The suction pipe slides radially on the first support frame body via a bottom slider, and the bottom slider slides on the first support frame body via a first sliding hole. The bottom of the wafer processing stage is provided with a drive unit that drives the bottom slider to slide.

[0007] Preferably, the driving unit includes: a first driving motor, multiple first driving motors are provided and fixed at the bottom of the wafer processing stage, the positions of the first driving motors correspond one-to-one with the positions of the second suction cups, the output end of the first driving motor is fixed with a lead screw, and the lead screw is adapted to the bottom slider, the top of the bottom slider is provided with a first suction pump, and the output end of the first suction pump is connected to the suction pipe.

[0008] Preferably, the wafer processing stage has multiple second mounting slots arranged in a circular pattern, and a second suction cup is disposed in the second mounting slot. The wafer processing stage has a second sliding hole connected to the second mounting slot along the radial direction. The suction pipe slides radially on the wafer processing stage through the second sliding hole. Both the second suction cup and the first suction cup protrude from the surface of the wafer processing stage.

[0009] Preferably, a second drive motor is provided on the first support frame body, and the rotating rod is coaxially fixed with the output end of the second drive motor. A first placement slot is coaxially opened on the wafer processing table, the rotating rod coaxially passes through the first placement slot, and a second suction pump is provided at the top of the rotating rod, and a first suction cup is provided at the output end of the second suction pump.

[0010] Preferably, the pushing detection mechanism includes: a rolling ball, which pushes the bottom of the wafer to be polished by a first reset spring; a lifting rod is coaxially arranged inside the suction pipe; a second support frame body is fixed inside the suction pipe; and the lifting rod slides coaxially inside the suction pipe through the second support frame body. A ball table is provided at the top of the lifting rod, and a rolling ball is placed inside the ball table. A chassis is provided at the bottom of the lifting rod. A first return spring is coaxially arranged with the lifting rod, and the two ends of the first return spring are respectively connected to the chassis and the second support frame body.

[0011] Preferably, a sensor is provided on the second support frame body, and the lifting rod is coaxially arranged with the sensor, and an annular elastic membrane is provided between the chassis and the inner wall of the suction pipe.

[0012] Preferably, the electric drive base is mounted on the top of the wafer processing stage via a tension spring, and the push rod on the electric drive base moves toward the wafer to be polished via the tension spring.

[0013] Preferably, the defect marking mechanism includes: an end platform, a movable cavity provided in the end platform, a piston body movable in the movable cavity, and the piston body dividing the movable cavity into an upper cavity and a lower cavity, with a first liquid passage pipe and a second liquid passage pipe respectively passing through the upper cavity and the lower cavity; The upper chamber is connected to the lower part of the end platform through an oil chamber, and a first nozzle is installed in the oil chamber. The lower chamber is connected to the lower part of the end platform through a through hole, and a second nozzle is installed in the through hole.

[0014] Preferably, the defect marking mechanism further includes: a first electromagnetic generator and a second electromagnetic generator, the first electromagnetic generator and the second electromagnetic generator are respectively disposed in the upper cavity and the lower cavity, an iron block is disposed in the piston body, and a second reset spring for resetting the piston body is disposed in the movable cavity; The bottom of the end stage is equipped with a rolling ball that abuts against the top of the wafer to be polished.

[0015] The beneficial effects of this invention are as follows: 1. This invention uses a first suction cup and multiple second suction cups working together to adsorb and press down the wafer to be polished, so that the wafer to be polished is against the top of the wafer processing stage. This not only achieves the adsorption and fixation of the wafer to be polished, but also completely exposes the upper surface of the wafer to be polished, making it easy to process without dead corners. With the multiple second suction cups no longer adsorbing the wafer to be polished, the first suction cup carries the wafer to be polished to rotate. With the clamping of the rolling ball and rolling bead on both sides of the wafer to be polished, the rotation of the wafer to be polished is stably clamped during the inspection process.

[0016] 2. The present invention employs a sensor in conjunction with a first electromagnetic generator and a second electromagnetic generator. The sensor transmits the lifting state of the lifting rod to the first and second electromagnetic generators, thereby driving the piston body to rise or fall, spraying mist-like and non-mist-like markings onto the back side of the wafer to be polished, facilitating subsequent identification and re-flipping and clamping for polishing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a wafer fabrication apparatus for a semiconductor integrated circuit device proposed in this invention; Figure 2 This is a schematic diagram of the structure of a wafer processing stage in a wafer processing apparatus for a semiconductor integrated circuit device proposed in this invention; Figure 3 This is a partial exploded view of the wafer processing stage in a wafer processing apparatus for a semiconductor integrated circuit device proposed in this invention; Figure 4This is an isometric view of the upper and lower isometric views of the wafer processing stage in a wafer processing apparatus for a semiconductor integrated circuit device proposed in this invention. Figure 5 This is a schematic diagram of the suction pipe in a wafer processing apparatus for a semiconductor integrated circuit device proposed in this invention; Figure 6 This is a side sectional view of the end stage in a wafer fabrication apparatus for a semiconductor integrated circuit device according to the present invention. Figure 7 This is a schematic diagram of the end stage in a wafer fabrication apparatus for a semiconductor integrated circuit device proposed in this invention.

[0018] In the diagram: 1. Fixed chuck; 2. Electrically pushed clamping block; 3. Wafer processing stage; 4. Wafer to be polished; 5. Electrically driven base; 6. Push rod; 7. End stage; 8. First drive motor; 9. First support frame body; 10. First sliding hole; 11. Lead screw; 12. Bottom slider; 13. First suction pump; 14. Suction pipe; 15. Second drive motor; 16. Rotating rod; 17. Second sliding hole; 18. First mounting slot; 19. Second mounting slot; 20. Second suction cup ; 21. First suction cup; 22. Second suction pump; 23. Ball table; 24. Rolling ball; 25. Second support frame body; 26. Chassis; 27. Elastic membrane; 28. First return spring; 29. ​​Lifting rod; 30. Sensor; 31. Movable chamber; 32. Piston body; 33. Oil chamber; 34. First nozzle; 35. Second nozzle; 36. First electromagnetic generator; 37. Second electromagnetic generator; 38. First liquid passage pipe; 39. Second liquid passage pipe; 40. Rolling ball. Detailed Implementation

[0019] Reference Figures 1-7 A wafer processing apparatus for semiconductor integrated circuit devices includes a fixed chuck 1 and a wafer processing stage 3 mounted on the fixed chuck 1. The fixed chuck 1 is provided with a plurality of electrically pushed clamping blocks 2 for clamping the wafer processing stage 3. By opening the electrically pushed clamping blocks 2, the wafer processing stage 3 placed on the fixed chuck 1 is clamped and fixed from the side. The wafer processing stage 3 is clamped in multiple sizes for different specifications. A wafer 4 to be polished is placed on the wafer processing stage 3, thereby placing wafers 4 of different specifications on wafer processing stages 3 of different specifications. Then, the wafer processing stages 3 of different specifications are clamped and fixed to facilitate subsequent processing of the wafers 4 to be polished.

[0020] The wafer processing stage 3 has multiple second suction cups 20 for adsorbing the wafer 4 to be polished. The multiple second suction cups 20 are arranged in a circle. The second suction cups 20 are adsorbed on the bottom of the wafer 4 to be polished by adsorption force, and are used to adsorb and fix the wafer 4 to be polished.

[0021] The wafer processing stage 3 has an internal cavity, in which a first support frame body 9 is installed. The second suction cup 20 slides radially along the wafer processing stage 3 via a suction pipe 14. The wafer processing stage 3 has multiple second placement slots 19 arranged in a circular pattern. The second suction cup 20 is placed in the second placement slots 19. At the same time, the wafer processing stage 3 has a first placement slot 18 coaxially arranged. The wafer processing stage 3 has a rotating rod 16 coaxially arranged, and the rotating rod 16 is equipped with a first suction cup 21 that adsorbs the wafer 4 to be polished.

[0022] Therefore, the wafer 4 to be polished is placed on the wafer processing stage 3. Since both the second suction cup 20 and the first suction cup 21 protrude from the surface of the wafer processing stage 3, the wafer 4 to be polished will first come into contact with the second suction cup 20 and the first suction cup 21, which is convenient for subsequent adsorption and fixation. It should be noted that by adsorbing and fixing the bottom of the wafer 4 to be polished through the second suction cup 20 and the first suction cup 21, the top of the wafer 4 to be polished is completely exposed, which is convenient for subsequent polishing operations and avoids the problem of polishing dead corners caused by conventional side clamping.

[0023] The rotating rod 16 coaxially passes through the first mounting slot 18, and a second suction pump 22 is provided at the top of the rotating rod 16. A first suction cup 21 is located at the output end of the second suction pump 22. Simultaneously, a first suction pump 13 is provided at the top of the bottom slider 12, and the output end of the first suction pump 13 is connected to the suction pipe 14. Therefore, after activating the first suction pump 13 and the second suction pump 22, suction can be generated through the first suction cup 21 and multiple second suction cups 20 to adsorb the tightly attached wafer 4 to be polished. It should be noted that both the second suction cup 20 and the first suction cup 21 protrude from the surface of the wafer processing stage 3. The second suction cup 20 and the first suction cup 21 are made of rubber. Therefore, after the second suction cup 20 and the first suction cup 21 generate suction, the second suction cup 20 and the first suction cup 21 deform, which can drive the wafer 4 to be polished to press down and stick tightly to the wafer processing stage 3. This can achieve pressing and fixing of the wafer 4 to be polished, which is convenient for fixing and polishing the upper surface of the wafer 4 after it is fixed.

[0024] After polishing, flip the polished wafer 4 over so that the polished side faces down, and then turn the unpolished wafer 4 up. At this point, the polished side is against the push-and-detection mechanism, which facilitates the subsequent polishing status detection.

[0025] During the inspection of the polished surface, a push-and-detection mechanism is required. The suction pipe 14 contains a push-and-detection mechanism that abuts against the bottom of the wafer 4 to be polished. (Refer to...) Figure 5The state of the push-and-detection mechanism includes a rolling ball 24, which is pushed against the bottom of the wafer 4 to be polished by a first return spring 28. A lifting rod 29 is coaxially arranged inside the air suction pipe 14. A ball table 23 is arranged on the top of the lifting rod 29, and the rolling ball 24 is arranged inside the ball table 23. A base 26 is arranged at the bottom of the lifting rod 29. The first return spring 28 is coaxially arranged with the lifting rod 29, and the two ends of the first return spring 28 are respectively connected to the base 26 and the second support frame body 25. Therefore, under the action of the first return spring 28, the ball table 23 drives the lifting rod 29 to rise and reach the bottom of the polished wafer 4.

[0026] A second support frame body 25 is fixed inside the suction pipe 14. The lifting rod 29 slides coaxially inside the suction pipe 14 through the second support frame body 25. An annular elastic membrane 27 is provided between the base 26 and the inner wall of the suction pipe 14. Therefore, after the first suction pump 13 is turned on, a negative pressure can be generated below the base 26 and the elastic membrane 27, which can drive the base 26 to press down. This creates a negative pressure in the area where the second suction cup 20, which was originally against the bottom of the wafer 4 to be polished, is located, thereby completing the adsorption and fixation of the wafer 4 to be polished. This not only allows the wafer 4 to be polished to be adsorbed by a stable negative pressure, but also avoids deformation and damage to the wafer 4 to be polished caused by the direct adsorption of the first suction pump 13.

[0027] When it is necessary to inspect the bottom of the polished wafer 4, simply turn off the first suction pump 13. Under the action of the first reset spring 28, the chassis 26 will lift the lifting rod 29 and bring the rolling ball 24 on the table 23 against the bottom of the polished wafer 4. At the same time, keep the second suction pump 22 on. The first support frame body 9 is equipped with a second drive motor 15, and the rotating rod 16 is coaxially fixed with the output end of the second drive motor 15. At the same time, turn on the second drive motor 15.

[0028] It should be noted that at this time, only the first suction cup 21 is adsorbed on the wafer 4 to be polished, and the first suction cup 21 is coaxially set with the wafer 4 to be polished. The other multiple second suction cups 20 no longer adsorb the wafer 4 to be polished, but instead abut against the bottom of the polished wafer 4 through the rolling ball 24. Therefore, after the second drive motor 15 is turned on, it can rotate the wafer 4 to be polished.

[0029] Since the rolling ball 24 abuts against the bottom of the polished wafer 4, if the polishing of the wafer 4 results in over-polishing with grooves or incomplete polishing with protrusions, the surface of the wafer 4 will be uneven. The rolling ball 24 will directly contact the uneven surface of the wafer 4. The second support frame body 25 is equipped with a sensor 30, and the lifting rod 29 is coaxially arranged with the sensor 30. Therefore, when it abuts against the wafer 4, this is marked as the initial surface. During the rotation of the wafer 4, when the rolling ball 24 abuts against the concave surface of the wafer 4, the lifting rod 29 rises, and the sensor 30 on the second support frame body 25 records the corresponding rising displacement; conversely, when the rolling ball 24 abuts against the convex surface of the wafer 4, the lifting rod 29 falls, and the sensor 30 on the second support frame body 25 records the corresponding falling displacement.

[0030] As the wafer 4 to be polished rotates, the rolling ball 24 only detects the annular area within it. Therefore, it is necessary to adjust the rolling ball 24 to slide radially along the wafer 4 to improve the corresponding detection range. The wafer processing stage 3 has a second sliding hole 17 connected to the second placement slot 19 along the radial direction. The suction pipe 14 slides radially on the wafer processing stage 3 through the second sliding hole 17. The suction pipe 14 slides radially on the first support frame body 9 through the bottom slider 12. The bottom slider 12 slides on the first support frame body 9 through the first sliding hole 10. The bottom of the wafer processing stage 3 is provided with a drive unit that drives the bottom slider 12 to slide. Therefore, opening the drive unit can move the rolling ball 24 radially.

[0031] The drive unit includes a first drive motor 8, and there are multiple first drive motors 8, which are fixed to the bottom of the wafer processing stage 3. The positions of the first drive motor 8 and the second suction cup 20 are one-to-one. The output end of the first drive motor 8 is fixed with a lead screw 11, and the lead screw 11 is adapted to the bottom slider 12. Therefore, after the first drive motor 8 is turned on, the lead screw 11 drives the first suction pump 13 on the bottom slider 12 to slide along the first sliding hole 10 on the first support frame body 9. Thus, the first suction pump 13 drives the suction pipe 14 to slide on the second sliding hole 17, thereby completing the movement of the rolling ball 24 and expanding the detection range.

[0032] Multiple electrically driven bases 5 are provided on the wafer processing stage 3. The electrically driven bases 5 are set on the top of the wafer processing stage 3 by tension springs. The push rods 6 on the electrically driven bases 5 move towards the wafer 4 to be polished by tension springs. The electrically driven bases 5 are arranged in a circle on the wafer processing stage 3, and the positions of the electrically driven bases 5 and the second suction cups 20 are one-to-one. Under the action of the tension springs, the electrically driven bases 5, along with the push rods 6 and the end plates 7 at the ends, press down and abut against the top of the wafer 4 to be polished. In conjunction with the multiple rolling balls 24 that rise upwards from the bottom, the wafer 4 to be polished is clamped and fixed on both sides.

[0033] A push rod 6 slides radially along the wafer 4 to be polished on the electric push base 5. The end of the push rod 6 is provided with a defect marking mechanism for marking the wafer 4 to be polished. It should be noted that the electric push base 5 and the first drive motor 8 operate synchronously, so that the defect marking mechanism and the bottom slider 12 are located on the same vertical plane, so that the uneven surface condition of the bottom of the wafer 4 to be polished, which is located on the same vertical plane, can be fed back to the defect marking mechanism in a timely and synchronous manner.

[0034] The defect marking mechanism includes an end platform 7, which has a movable cavity 31. A piston body 32 moves within the movable cavity 31, and the piston body 32 divides the movable cavity 31 into an upper cavity and a lower cavity. A first liquid pipe 38 and a second liquid pipe 39 are respectively connected to the upper cavity and the lower cavity. One-way valves are provided in the first liquid pipe 38 and the second liquid pipe 39, so that marking liquid can be replenished to the upper cavity and the lower cavity in a timely manner.

[0035] The end stage 7 has a rolling ball 40 at its bottom that abuts against the top of the wafer 4 to be polished. Therefore, when the wafer 4 to be polished rotates, the end stage 7 will not affect the wafer 4 to be polished.

[0036] The defect marking mechanism also includes a first electromagnetic generator 36 and a second electromagnetic generator 37, which are respectively disposed in the upper and lower chambers. An iron block is disposed inside the piston body 32, and a second reset spring for resetting the piston body 32 is disposed inside the movable chamber 31. The first electromagnetic generator 36 and the second electromagnetic generator 37 cooperate with the sensor 30. When the sensor 30 records the corresponding lifting displacement signal, it transmits the corresponding electrical signal to the first electromagnetic generator 36 and activates the first electromagnetic generator 36. When the sensor 30 records the corresponding lowering displacement signal, it transmits the corresponding electrical signal to the second electromagnetic generator 37. This allows the information recorded by the sensor 30 to be transmitted to the first electromagnetic generator 36 and the second electromagnetic generator 37 and generate a magnetic field, thereby creating a suction force to lift or lower the piston body 32. The transmission of electrical signals by the sensor 30 to the first electromagnetic generator 36 and the second electromagnetic generator 37 and the generation of a magnetic field is existing technology and will not be elaborated further here.

[0037] The upper chamber is connected to the lower part of the end stage 7 via an oil chamber 33, and a first nozzle 34 is installed in the oil chamber 33. The lower chamber is connected to the lower part of the end stage 7 via a through hole, and a second nozzle 35 is installed in the through hole. It should be noted that both the first nozzle 34 and the second nozzle 35 are one-way spray valves. The first nozzle 34 is a mist spray head, and the second nozzle 35 is a non-mist spray head. Therefore, when there is a concave surface at the bottom of the wafer 4 to be polished, the piston body 32 is lifted, spraying the marking liquid in the upper chamber from the first nozzle 34 on the oil chamber 33. The first nozzle 34 is a mist spray nozzle, which will form a mist mark on the upper surface of the wafer 4 to be polished. This mark is a concave surface of the wafer 4 to be polished. Conversely, when there is a convex surface at the bottom of the wafer 4 to be polished, the piston body 32 is driven to descend, and the marking liquid in the lower chamber is sprayed out from the second nozzle 35. The second nozzle 35 is a non-mist spray nozzle, which will form a non-mist mark on the upper surface of the wafer 4 to be polished. This mark is a convex surface of the wafer 4 to be polished. Therefore, it is convenient to quickly complete the detection marking effect during the clamping process.

[0038] The working principle of this invention is as follows: First, the electric push clamp 2 is activated, and the wafer processing stage 3 placed on the fixed chuck 1 is clamped and fixed from the side. After the first suction pump 13 and the second suction pump 22 are activated, the suction force can be generated by the first suction cup 21 and multiple second suction cups 20 to adsorb the wafer 4 to be polished, which can drive the wafer 4 to be polished to be pressed down and pressed tightly against the wafer processing stage 3. This can achieve the pressing and fixing of the wafer 4 to be polished, which makes it easier to fix and polish the upper surface of the wafer 4 after it is fixed. Then, after polishing, flip the polished wafer 4 over so that the polished side faces down and the unpolished wafer 4 faces up. At this time, the polished side is against the pushing detection mechanism, which facilitates the subsequent polishing status detection. When the first suction pump 13 is turned off, the chassis 26, under the action of the first return spring 28, drives the lifting rod 29 to rise and the rolling ball 24 on the table 23 to abut against the bottom of the polished wafer 4. At the same time, the second suction pump 22 is kept on. The first support frame body 9 is equipped with a second drive motor 15, and the rotating rod 16 is coaxially fixed with the output end of the second drive motor 15. When the second drive motor 15 is turned on, the wafer 4 to be polished can be rotated. Since the rolling ball 24 abuts against the bottom of the polished wafer 4, if the polishing of the wafer 4 is excessive and has grooves, or if the polishing is incomplete and has protrusions, the surface of the wafer 4 will be uneven, and the rolling ball 24 will directly contact the uneven surface of the wafer 4.

[0039] Finally, when there is a concave surface at the bottom of the wafer 4 to be polished, the piston body 32 is lifted, and the marking liquid in the upper chamber is sprayed out from the first nozzle 34 on the oil chamber 33. The first nozzle 34 is a mist spray nozzle, which will form a mist mark on the upper surface of the wafer 4 to be polished. This mark indicates that the opposite surface of the wafer 4 to be polished is concave. Conversely, when there is a convex surface at the bottom of the wafer 4 to be polished, the piston body 32 is lowered, and the marking liquid in the lower chamber is sprayed out from the second nozzle 35. The second nozzle 35 is a non-mist spray nozzle, which will form a non-mist mark on the upper surface of the wafer 4 to be polished. This mark indicates that the opposite surface of the wafer 4 to be polished is convex. Therefore, it is convenient to quickly complete the detection marking effect during the clamping process.

[0040] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer processing apparatus for a semiconductor integrated circuit device, comprising a stationary chuck (1) and a wafer processing table (3) mounted on the stationary chuck (1), on which a wafer (4) to be polished is placed, characterized in that, The fixed chuck (1) is provided with a plurality of electric push extrusion blocks (2) for clamping a wafer processing table (3), the wafer processing table (3) is provided with a plurality of second suction cups (20) for sucking a wafer to be polished (4), the plurality of second suction cups (20) are arranged in a circle, and the second suction cups (20) slide along the radial direction of the wafer processing table (3) through suction pipes (14); The suction pipes (14) are provided with a push detection mechanism abutting against the bottom of the wafer to be polished (4), the wafer processing table (3) is coaxially provided with a rotating rotating rod (16), and the rotating rod (16) is provided with a first suction cup (21) for sucking the wafer to be polished (4); The wafer processing table (3) is provided with a plurality of electric push base tables (5), the electric push base tables (5) are arranged in a circle on the wafer processing table (3), and the electric push base tables (5) correspond to the positions of the second suction cups (20) one by one, the electric push base tables (5) are provided with push rods (6) sliding along the radial direction of the wafer to be polished (4), and the end portions of the push rods (6) are provided with defect marking mechanisms for marking the wafer to be polished (4).

2. The wafer processing apparatus of a semiconductor integrated circuit device according to claim 1, wherein The wafer processing table (3) is provided with an inner cavity, the inner cavity is provided with a first support frame body (9), the suction pipes (14) slide along the radial direction of the wafer processing table (3) through bottom sliding blocks (12) on the first support frame body (9), the bottom sliding blocks (12) slide on the first support frame body (9) through first sliding holes (10), and the wafer processing table (3) is provided with a driving part for driving the bottom sliding blocks (12) to slide.

3. The wafer processing apparatus of a semiconductor integrated circuit device according to claim 2, wherein The driving part comprises: A plurality of first driving motors (8) are arranged on the bottom of the wafer processing table (3), the first driving motors (8) correspond to the positions of the second suction cups (20) one by one, the output ends of the first driving motors (8) are fixedly provided with screws (11), the screws (11) are matched with the bottom sliding blocks (12), the top of each bottom sliding block (12) is provided with a first suction pump (13), and the output end of the first suction pump (13) is communicated with the suction pipe (14).

4. The wafer processing apparatus of claim 1, wherein The wafer processing table (3) is provided with a plurality of second placing grooves (19), the second suction cups (20) are arranged in the second placing grooves (19), the wafer processing table (3) is provided with second sliding holes (17) connected with the second placing grooves (19) along the radial direction, the suction pipes (14) slide along the radial direction of the wafer processing table (3) through the second sliding holes (17), and the second suction cups (20) and the first suction cup (21) protrude from the table surface of the wafer processing table (3).

5. The wafer processing apparatus of claim 2, wherein The first support frame body (9) is provided with a second driving motor (15), the rotating rod (16) is coaxially fixed to the output end of the second driving motor (15), the wafer processing table (3) is coaxially provided with a first placing groove (18), the rotating rod (16) penetrates through the first placing groove (18) in a coaxial mode, the top of the rotating rod (16) is provided with a second suction pump (22), and the first suction cup (21) is arranged at the output end of the second suction pump (22).

6. The wafer processing apparatus of a semiconductor integrated circuit device according to Claim 1, wherein The pushing detection mechanism comprises a rolling ball (24) pushed against the bottom of the wafer to be polished (4) by a first reset spring (28), a lifting rod (29) coaxially arranged in the suction pipe (14), a second support frame body (25) fixed in the suction pipe (14), and the lifting rod (29) coaxially slides in the suction pipe (14) through the second support frame body (25); The top of the lifting rod (29) is provided with a ball table (23), the rolling ball (24) is arranged in the ball table (23), the bottom of the lifting rod (29) is provided with a bottom disc (26), the first reset spring (28) is coaxially arranged with the lifting rod (29), and the two ends of the first reset spring (28) are respectively connected with the bottom disc (26) and the second support frame body (25).

7. The wafer processing apparatus of a semiconductor integrated circuit device according to Claim 6, wherein The second support frame body (25) is provided with a sensor (30), and the lifting rod (29) is coaxially arranged with the sensor (30), and the bottom disc (26) and the inner wall of the suction pipe (14) are provided with an annular elastic film (27).

8. The wafer processing apparatus of a semiconductor integrated circuit device according to Claim 1, wherein The electric pushing base (5) is arranged on the top of the wafer processing table (3) through a tension spring, and the pushing rod (6) on the electric pushing base (5) moves towards the wafer to be polished (4) through the tension spring.

9. The wafer processing apparatus of a semiconductor integrated circuit device according to Claim 1, wherein The defect marking mechanism comprises an end table (7), the end table (7) is provided with a movable cavity (31), the movable cavity (31) is movably provided with a piston body (32), and the piston body (32) divides the movable cavity (31) into an upper cavity and a lower cavity, and the upper cavity and the lower cavity are respectively provided with a first liquid pipe (38) and a second liquid pipe (39); The upper cavity is communicated with the lower part of the end table (7) through an oil cavity (33), and the oil cavity (33) is provided with a first nozzle (34), the lower cavity is communicated with the lower part of the end table (7) through a through hole, and the through hole is provided with a second nozzle (35).

10. The wafer processing apparatus of a semiconductor integrated circuit device according to Claim 9, wherein The defect marking mechanism further comprises a first electromagnetic generator (36) and a second electromagnetic generator (37), the first electromagnetic generator (36) and the second electromagnetic generator (37) are arranged in the upper cavity and the lower cavity respectively, the piston body (32) is provided with an iron block, and the movable cavity (31) is provided with a second reset spring for resetting the piston body (32); The bottom of the end table (7) is provided with a rolling ball (40) abutting against the top of the wafer to be polished (4).

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