Resin composition, prepreg and application thereof
By adding epoxidized isocyanurate compounds with specific structures and epoxidized polybutadiene to polyphenylene ether resin to form a high-density interpenetrating network, the processability and reliability issues of polyphenylene ether resin in the field of copper clad laminates are solved, and the excellent performance of high-frequency and high-speed copper clad laminates and circuit boards is achieved.
CN121610055APending Publication Date: 2026-03-06SHENGYI TECH SUZHOU +1
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Patent Information
- Application Number
- CN202511953438.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-23
- Publication Date
- 2026-03-06
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Figure CN121610055A_ABST
Abstract
The invention provides a resin composition and application thereof, and the resin composition comprises the following components by weight: 20-100 parts of polyphenyl ether resin; 10 to 70 parts by weight of an epoxidized isocyanurate compound; 10 to 80 parts by weight of epoxidized polybutadiene; the epoxidized isocyanurate compound contains a structural formula (1), in the structural formula (1), X1, X2 and X3 are the same or different and are respectively selected from allyl, vinyl or at least one of X1, X2 and X3; therefore, the final cured product has the characteristics of low dielectric constant, low dielectric loss tangent, high glass transition temperature (Tg) and high cohesiveness.
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