Liquid-cooled case compatible with liquid-passing type module

Abstract

The invention provides a liquid cooling case compatible with a liquid-passing type module, and belongs to the technical field of electronic equipment heat dissipation, the liquid cooling case comprises a case main body, a front panel, a rear panel, a cold conduction type heat dissipation module and a liquid-passing type heat dissipation module, the case main body comprises a left side plate, a right side plate, an upper cold plate and a lower cold plate, the front panel and the rear panel are respectively arranged at the front end and the rear end of the case main body, the cold conduction type heat dissipation module and the liquid passing type heat dissipation module are arranged between the upper cold plate and the lower cold plate, the rear panel is provided with an inlet fluid connector, an outlet fluid connector and an electric connector, the upper cold plate and the lower cold plate are respectively provided with a cooling flow channel, and the upper cold plate and the lower cold plate are respectively provided with an electric connector. The cooling flow channel of the upper cooling plate is provided with a cooling liquid inlet, the cooling flow channel of the lower cooling plate is provided with a cooling liquid outlet, the inlet fluid connector is connected with the cooling liquid inlet, and the outlet fluid connector is connected with the cooling liquid outlet. The problem of different heat dissipation requirements of different power consumption board cards in the case is solved, and the overall heat dissipation efficiency of the liquid cooling case is improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a liquid-cooled chassis compatible with liquid-cooled modules. Background Technology

[0002] As airborne electronic equipment evolves towards higher performance, higher integration, and miniaturization, its power density continues to increase, making heat dissipation a core issue restricting equipment reliability. Traditional liquid-cooled chassis utilize conductive heat dissipation modules. These modules transfer heat to the chassis by contacting the sides with the chassis's guide rails. The chassis typically employs forced air cooling or forced liquid cooling. Conductive heat dissipation modules primarily rely on metal conduction to transfer heat to the coolant through the chassis. This method results in a long heat transfer path and high thermal resistance, which can easily lead to localized overheating in high-power chips, causing component throttling or even failure. Summary of the Invention

[0003] In view of this, the present application provides a liquid-cooled chassis compatible with liquid-conducting modules, which can effectively solve the problem of insufficient heat dissipation capacity of traditional liquid-cooled chassis using heat conduction modules for high-power boards.

[0004] This application provides a liquid-cooled chassis compatible with a liquid-flow module, including a chassis body, a front panel, a rear panel, a heat-conducting module, and a liquid-flow module. The chassis body includes a left side panel, a right side panel, an upper cooling plate, and a lower cooling plate connected to each other. The front panel and the rear panel are respectively installed at the front and rear ends of the chassis body. The heat-conducting module and the liquid-flow module are disposed between the upper cooling plate and the lower cooling plate. The rear panel is provided with an inlet fluid connector, an outlet fluid connector, and an electrical connector. Cooling channels are provided on the upper cooling plate and the lower cooling plate, respectively. The cooling channel of the upper cooling plate has a coolant inlet, and the cooling channel of the lower cooling plate has a coolant outlet. The inlet fluid connector is connected to the coolant inlet, and the outlet fluid connector is connected to the coolant outlet.

[0005] According to a specific implementation of an embodiment of this application, the cooling channel includes parallel serpentine channels and horizontal straight channels. The serpentine channels are connected to the vertical straight channels on the right side plate, and the horizontal straight channels are connected to the internal channels of the liquid-flow heat dissipation module.

[0006] According to a specific implementation of the present application, the upper cold plate has a horizontal straight channel with a plurality of first liquid outlets, and the lower cold plate has a horizontal straight channel with a plurality of first liquid inlets. The plurality of first liquid outlets are respectively connected to the second liquid inlets on the upper part of the plurality of liquid-conducting heat dissipation modules, and the plurality of first liquid inlets are respectively connected to the second liquid outlets on the lower part of the plurality of liquid-conducting heat dissipation modules.

[0007] According to a specific implementation of an embodiment of this application, the first liquid outlet is connected to the second liquid inlet via a quick-connect fluid connector, and the first liquid inlet is connected to the second liquid outlet via a quick-connect fluid connector.

[0008] According to a specific implementation of an embodiment of this application, the liquid-cooled heat dissipation module includes a liquid-cooled cavity, a module mounting plate, a blind-plug liquid-cooled connector, and a rectangular blind-plug connector. The internal flow channel of the liquid-cooled heat dissipation module is arranged in the liquid-cooled cavity. A boss is provided on the wall of the liquid-cooled cavity. The boss contacts the heat-generating device. The blind-plug liquid-cooled connector is connected to the second liquid inlet and the second liquid outlet respectively.

[0009] According to a specific implementation of an embodiment of this application, the upper cold plate and the lower cold plate are respectively provided with mounting grooves, and the heat dissipation module with heat conduction and the heat dissipation module with liquid flow are respectively fixed between the upper cold plate and the lower cold plate through the mounting grooves, and the heat dissipation module with heat conduction and the heat dissipation module with liquid flow are respectively locked by wedge locking devices.

[0010] According to a specific implementation of an embodiment of this application, multiple slot rails are provided on the upper and lower cold plates respectively, and the heat dissipation module is disposed between adjacent slot rails.

[0011] According to one specific implementation of an embodiment of this application, mounting ears are provided on the left side plate and the right side plate respectively.

[0012] According to one specific implementation of the embodiments of this application, folding handles are provided on the left side panel and the right side panel respectively.

[0013] According to a specific implementation of this application, the cooling channels of the upper cold plate, the cooling channels of the lower cold plate, and the internal channels of the liquid-flow heat dissipation module are formed by friction stir welding.

[0014] Beneficial effects: The liquid-cooled chassis compatible with liquid-flow modules in this embodiment can be installed with both a heat-conducting module and a liquid-flow heat dissipation module. For high-power boards, the liquid-flow heat dissipation module is used to enhance the heat conduction effect by shortening the heat transfer path between the heat-generating components and the coolant. This effectively solves the problem of different heat dissipation requirements for different power consumption boards in the chassis, thereby improving the overall heat dissipation efficiency of the liquid-cooled chassis. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the front of a liquid-cooled chassis according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the rear structure of a liquid-cooled chassis according to an embodiment of the present invention; Figure 3 This is an exploded view of a liquid-cooled chassis according to an embodiment of the present invention; Figure 4 This is a structural diagram of the upper cooling plate of a liquid-cooled chassis according to an embodiment of the present invention; Figure 5 This is an internal structural diagram of a liquid-cooled heat dissipation module according to an embodiment of the present invention; Figure 6 This is an overall structural diagram of a liquid-cooled heat dissipation module according to an embodiment of the present invention; Figure 7 This is a structural diagram of the upper surface of a liquid-cooled cavity according to an embodiment of the present invention; Figure 8 A cross-sectional view of a liquid-cooled cavity according to an embodiment of the present invention; Figure 9 This is a structural diagram of a heat dissipation module according to an embodiment of the present invention.

[0017] In the diagram: 1. Front panel, 2. Rear panel, 3. Left side panel, 4. Right side panel, 5. Upper cooling plate, 6. Lower cooling plate, 7. Inlet fluid connector, 8. Outlet fluid connector, 9. Electrical connector, 10. Folding handle, 11. Mounting ear, 12. First liquid outlet, 13. Conductive cooling module, 14. Slot rail, 15. Wedge locking device, 16. Liquid-cooled chassis frame, 17. Fluid-flow cooling module, 171. Module mounting plate, 172. Blind-mating liquid cooling connector, 173. Rectangular blind-mating connector. Detailed Implementation

[0018] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0019] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0021] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0022] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0023] This application provides a liquid-cooled chassis compatible with liquid-flow modules, as described below. Figures 1 to 9 Provide a detailed description.

[0024] In one embodiment, refer to Figures 1 to 3 The liquid-cooled chassis compatible with liquid-flow modules includes a chassis body, a front panel 1, a rear panel 2, a heat-conducting module 13, and a liquid-flow module 17. The chassis body includes a left side panel 3, a right side panel 4, an upper cooling plate 5, and a lower cooling plate 6 connected to each other. The front panel 1 and the rear panel 2 are respectively installed at the front and rear ends of the chassis body. The heat-conducting module 13 and the liquid-flow module 17 are disposed between the upper cooling plate 5 and the lower cooling plate 6. The rear panel 2 is provided with an inlet fluid connector 7, an outlet fluid connector 8, and an electrical connector 9. The upper cooling plate 5 and the lower cooling plate 6 are respectively provided with cooling channels. The cooling channel of the upper cooling plate 5 is provided with a coolant inlet, and the cooling channel of the lower cooling plate 6 is provided with a coolant outlet. The inlet fluid connector 7 is connected to the coolant inlet, and the outlet fluid connector 8 is connected to the coolant outlet.

[0025] In this embodiment, the chassis body is enclosed by the left side panel 3, right side panel 4, upper cooling plate 5, and lower cooling plate 6 to form an internal installation space, providing a stable mounting platform for the heat dissipation module 13 and the liquid-flow cooling module 17. The front panel 1 and rear panel 2 not only enclose the chassis body but also protect the internal modules. The inlet fluid connector 7 and outlet fluid connector 8 on the rear panel 2 facilitate the input and output of coolant, while the electrical connector 9 meets the connection requirements between the module and external circuitry. The upper cooling plate 5 and lower cooling plate 6, as important components of the chassis body, have cooling channels that are crucial for coolant circulation. Coolant enters the upper cooling plate 5 through the inlet fluid connector 7, flows through the cooling channels of the upper cooling plate 5, and then some coolant enters the liquid-flow cooling module 17 for heat exchange, while the rest continues to flow, eventually converging into the cooling channels of the lower cooling plate 6. Finally, it exits the chassis through the coolant outlet and outlet fluid connector 8, thus carrying away the heat generated inside the chassis and achieving the heat dissipation function. The placement of the heat dissipation module 13 (conductive cooling) and the liquid-flow cooling module 17 between the upper cooling plate 5 and the lower cooling plate 6 allows the chassis to be flexibly configured according to the heat dissipation requirements of different modules, thereby improving the chassis's applicability and heat dissipation efficiency.

[0026] In practice, the main body of the chassis is formed by friction stir welding of the left side plate 3, the right side plate 4, the upper cold plate 5 and the lower cold plate 6. The front panel 1 and the rear panel 2 are connected and fixed to the main body of the chassis by screws.

[0027] Furthermore, refer to Figure 4 The cooling channel system includes parallel serpentine channels and horizontal straight channels. The serpentine channels are connected to the vertical straight channels on the right side plate 4, and the horizontal straight channels are connected to the internal channels of the liquid-flowing heat dissipation module 17. Specifically, one end of the serpentine channel on the upper cold plate 5 is connected to the coolant inlet, and the other end flows to the vertical straight channel on the right side plate 4. The vertical straight channel on the right side plate 4 is connected to one end of the serpentine channel on the lower cold plate 6, and the other end of the serpentine channel on the lower cold plate 6 is connected to the coolant outlet. This parallel design allows the coolant to flow through both the serpentine and horizontal straight channels simultaneously. The serpentine channels provide overall cooling for the internal space of the chassis, while the horizontal straight channels specifically provide coolant for the liquid-flowing heat dissipation module 17, achieving a combination of targeted and overall heat dissipation. By connecting the serpentine channels with the vertical straight channels on the right side plate 4, a circulation path for the coolant is formed between the upper and lower cold plates 6, ensuring that the coolant can fully cover the chassis body and effectively improving the overall heat dissipation uniformity of the chassis. Meanwhile, the connection between the flat DC channel and the internal flow channel of the liquid-flow heat dissipation module 17 ensures that the liquid-flow heat dissipation module 17 can obtain sufficient coolant in a timely manner for efficient heat exchange, further optimizing the heat dissipation performance of the chassis.

[0028] Furthermore, refer to Figure 4 and Figure 5 The upper cold plate 5 has a flat DC channel with multiple first liquid outlets 12, and the lower cold plate 6 has a flat DC channel with multiple first liquid inlets. The multiple first liquid outlets 12 are respectively connected to the second liquid inlets on the upper part of the multiple liquid-conducting heat dissipation modules 17, and the multiple first liquid inlets are respectively connected to the second liquid outlets on the lower part of the multiple liquid-conducting heat dissipation modules 17.

[0029] In specific implementation, there are two first liquid outlets 12 and two first liquid inlets. The two first liquid outlets 12 are connected to the two liquid-flow heat dissipation modules 17 in a one-to-one correspondence, and the two first liquid inlets are connected to the two liquid-flow heat dissipation modules 17 in a one-to-one correspondence.

[0030] Furthermore, the first liquid outlet 12 is connected to the second liquid inlet via a quick-connect fluid connector, and the first liquid inlet is connected to the second liquid outlet via a quick-connect fluid connector.

[0031] Specifically, the flow path of the coolant is as follows: the coolant flows from the inlet fluid connector 7 into the upper cooling plate 5 channel through the coolant inlet of the upper cooling plate 5, and then splits into the horizontal direct channel and the serpentine channel of the upper cooling plate 5 respectively; the fluid entering the horizontal direct channel of the upper cooling plate 5 enters the two liquid-flowing heat dissipation modules 17 channels through two outlets via quick-connect fluid connectors, and then enters the horizontal direct channel of the lower cooling plate 6 through two inlets via quick-connect fluid connectors; the fluid entering the serpentine channel flows to the end of the channel and enters the serpentine channel of the lower cooling plate 6 through the vertical direct channel of the right side plate 4; the fluid from the three paths converges and flows out through the coolant outlet of the lower cooling plate 6 via the outlet fluid connector 8.

[0032] The heat dissipation path of the heat source on the board is as follows: For the heat source on the liquid-flow heat dissipation module 17, the heat is transferred to the coolant in the internal flow channel of the liquid-flow module and then discharged through the flow channel of the lower cold plate 6. For the heat source on the heat conduction module, the heat is conducted to the guide rails on the lower surface of the upper cold plate 5 and the upper surface of the lower cold plate 6 and then discharged into the coolant in the upper cold plate 5 and the lower cold plate 6.

[0033] Furthermore, refer to Figures 6 to 8 The liquid-cooled heat dissipation module 17 includes a liquid-cooled cavity, a module mounting plate 171, a blind-plug liquid-cooled connector 172, and a rectangular blind-plug connector 173. The internal flow channel of the liquid-cooled heat dissipation module 17 is set in the liquid-cooled cavity. The wall of the liquid-cooled cavity is provided with a boss, which contacts the heat-generating device. The blind-plug liquid-cooled connector 172 is connected to the second liquid inlet and the second liquid outlet respectively.

[0034] Specifically, the liquid-cooled heat dissipation module 17 mainly consists of a liquid-cooled cavity, internal flow channels, blind-plug liquid-cooled connectors 172, module mounting plate 171, wedge-shaped locking device 15, puller, printed circuit board, heat-generating device, and rectangular connector. The liquid-cooled cavity is the core component for heat dissipation; it not only serves as the carrier for the flow channels but also integrates structural support, pressure sealing, and heat conduction. The liquid-cooled cavity is made of high-strength aluminum alloy through precision machining and welding. Its upper surface has raised protrusions of varying heights, directly supporting the heat-generating device. The internal flow channels are machined first and then welded.

[0035] The main heat dissipation methods of the product are divided into the following two approaches: 1. Liquid circulation heat dissipation inside the module. When the module is working, the devices mounted on the printed circuit board generate heat. Driven by an external liquid cooling source, the coolant enters the module through the blind-plug liquid cooling connector 172, flows through the built-in flow channel, and directly carries away the heat generated by the printed circuit board and devices in the form of convection heat transfer, and then carries the heat out of the module.

[0036] 2. Heat conduction from module to chassis. This mainly involves heat conduction through direct contact between the module shell and the guide rail. By optimizing the surface roughness of each contact surface, some heat can be conducted to the chassis, and the chassis then carries away the heat through internal airflow channels.

[0037] Furthermore, refer to Figure 9 The upper cold plate 5 and the lower cold plate 6 are respectively provided with mounting slots. The heat conduction heat dissipation module 13 and the liquid flow heat dissipation module 17 are respectively fixed between the upper cold plate 5 and the lower cold plate 6 through the mounting slots. The heat conduction heat dissipation module 13 and the liquid flow heat dissipation module 17 are respectively locked by the wedge locking device 15.

[0038] Furthermore, multiple slot rails 14 are provided on the upper cold plate 5 and the lower cold plate 6 respectively, and the heat dissipation module 13 is arranged between adjacent slot rails 14.

[0039] Specifically, in terms of product composition, the heat dissipation module 13 does not require the blind-plug liquid cooling connector 172 for liquid flow treatment, and the cavity of the heat dissipation module 13 does not require the processing of complex liquid flow channels. The rest of the components are basically the same.

[0040] This type of heat dissipation module 13 is installed inside a liquid-cooled chassis. The installation method of the module inside the liquid-cooled chassis is as follows: Figure 9As shown, after the module is inserted into the liquid-cooled chassis, it is secured by tightening the wedge-shaped locking device 15. At this point, the right edge of the module is tightly fitted against the chassis slot guide rail 14. The heat generated by the electronic components inside the module is then conducted through the module cavity to the chassis sidewall, and finally to the coolant. The coolant then flows through the internal channels of the chassis back to the external liquid cooling source for further cooling, thus continuously carrying away the heat from inside the chassis.

[0041] Furthermore, mounting ears 11 are provided on the left side plate 3 and the right side plate 4 respectively.

[0042] Furthermore, folding handles 10 are provided on the left side panel 3 and the right side panel 4 respectively.

[0043] Specifically, the two foldable handles 10 and mounting ears 11 are fixedly connected to the left side panel 3 and the right side panel 4 with screws. The foldable handles 10 can be folded and stored when not in use, effectively saving space and facilitating the handling and storage of the chassis. The mounting ears 11 facilitate the fixing of the liquid-cooled chassis to racks or other mounting positions, enhancing the stability and reliability of the chassis installation. This design allows the liquid-cooled chassis to have efficient heat dissipation performance while also taking into account good portability and installation adaptability, meeting the needs of different usage scenarios.

[0044] Furthermore, the cooling channels of the upper cold plate 5, the lower cold plate 6, and the internal channels of the liquid-cooled heat dissipation module 17 are formed using friction stir welding. This process generates heat through friction between the high-speed rotating stirring head and the workpiece, causing localized plasticization of the welded materials. Under the extrusion of the stirring head, a solid-state connection is achieved. Using this process to process the channels effectively avoids defects such as porosity and cracks that may occur with traditional welding methods, ensuring excellent sealing and structural strength of the channels. It also reduces the impact on material properties, guaranteeing the long-term stable operation of the cooling channels. The high strength and minimal deformation of the welds formed by friction stir welding allow the cooling channels to maintain good structural integrity even when subjected to high-pressure coolant circulation, further improving the overall reliability and service life of the liquid-cooled chassis.

[0045] The embodiments provided by the present invention allow for the installation of a heat-conducting module between the upper and lower cold plates 6 of the liquid-cooled chassis, while also allowing for the installation of a liquid-flow heat dissipation module 17. For high-power boards, the liquid-flow heat dissipation module 17 is used to enhance the heat conduction effect by shortening the heat transfer path between the heat-generating components and the coolant. This effectively solves the problem of different heat dissipation requirements for different power-consuming boards in the chassis, thereby improving the overall heat dissipation efficiency of the liquid-cooled chassis.

[0046] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A liquid-cooled chassis compatible with liquid-flow modules, characterized in that, The case main body includes left side plate (3), right side plate (4), upper cold plate (5) and lower cold plate (6) connected, front panel (1) and rear panel (2) are installed on the front end and rear end of the case main body respectively, the cold conduction type heat dissipation module (13) and the liquid passing type heat dissipation module (17) are arranged between the upper cold plate (5) and the lower cold plate (6), the rear panel (2) is provided with inlet fluid connector (7), outlet fluid connector (8) and electric connector (9), the upper cold plate (5) and the lower cold plate (6) are respectively provided with cooling flow channel, the cooling flow channel of the upper cold plate (5) is provided with cooling liquid inlet, the cooling flow channel of the lower cold plate (6) is provided with cooling liquid outlet, the inlet fluid connector (7) is connected with the cooling liquid inlet, and the outlet fluid connector (8) is connected with the cooling liquid outlet.

2. The liquid-cooled chassis compatible with a liquid-pass-through module according to claim 1, wherein, The cooling flow channel includes the serpentine flow channel and the straight flow channel connected in parallel, the serpentine flow channel is communicated with the vertical flow channel on the right side plate (4), and the straight flow channel is communicated with the internal flow channel of the liquid passing type heat dissipation module (17).

3. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 2, wherein, The straight flow channel of the upper cold plate (5) is provided with a plurality of first liquid outlets (12), the straight flow channel of the lower cold plate (6) is provided with a plurality of first liquid inlets, the plurality of first liquid outlets (12) are connected with the second liquid inlets on the upper portion of the plurality of liquid passing type heat dissipation modules (17) one by one, and the plurality of first liquid inlets are connected with the second liquid outlets on the lower portion of the plurality of liquid passing type heat dissipation modules (17) one by one.

4. The liquid-cooled chassis compatible with a liquid-pass-through module according to claim 3, wherein, The first liquid outlet (12) is connected with the second liquid inlet through the quick plug-in fluid connector, and the first liquid inlet is connected with the second liquid outlet through the quick plug-in fluid connector.

5. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 3, wherein, The liquid passing type heat dissipation module (17) includes a liquid cooling cavity, a module mounting plate (171), a blind plug type liquid cooling connector (172) and a rectangular blind plug connector (173), the internal flow channel of the liquid passing type heat dissipation module (17) is arranged in the liquid cooling cavity, the wall surface of the liquid cooling cavity is provided with a boss, the boss is in contact with the heating device, and the blind plug type liquid cooling connector (172) is connected with the second liquid inlet and the second liquid outlet respectively.

6. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 1, wherein, The upper cold plate (5) and the lower cold plate (6) are respectively provided with mounting grooves, and the cold conduction type heat dissipation module (13) and the liquid passing type heat dissipation module (17) are fixed between the upper cold plate (5) and the lower cold plate (6) through the mounting grooves.

7. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 1, wherein, The upper cold plate (5) and the lower cold plate (6) are respectively provided with a plurality of slot guide rails (14), and the cold conduction type heat dissipation module (13) is arranged between adjacent slot guide rails (14).

8. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 1, wherein, The left side plate (3) and the right side plate (4) are respectively provided with mounting ears (11).

9. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 1, wherein, The left side plate (3) and the right side plate (4) are respectively provided with folding handles (10).

10. The liquid-cooled chassis compatible with liquid-pass-through modules of claim 1, wherein, The cooling flow channel of the upper cold plate (5), the cooling flow channel of the lower cold plate (6) and the internal flow channel of the liquid passing type heat dissipation module (17) are processed by using a friction stir welding process.

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