A semiconductor wafer single-wafer cleaning device and cleaning method

Abstract

This invention discloses a semiconductor wafer single-wafer cleaning device and method, belonging to the field of wafer cleaning technology. The cleaning device includes a housing; a support mechanism for supporting the wafer to be cleaned; and a positioning mechanism including a locking component and a recirculation component. The support mechanism is detachably mounted on the locking component and has multiple lower nozzles for cleaning the bottom of the wafer. The locking component includes multiple upper nozzles for cleaning the top of the wafer. The locking component is sleeved on the recirculation component, which is used to purify and recirculate the cleaning wastewater. In this invention, the wafer to be cleaned is placed on the positioning seat of the support mechanism. The cylinder piston rod drives the locking ring to rotate, causing the locking part on the linkage block to engage with the slot on the second positioning post, achieving axial locking of the support mechanism. This also pushes the connecting ring to slide, causing the second spray channel to connect with the third spray channel, completing the spray channel connection.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, specifically to a semiconductor wafer single-wafer cleaning device and cleaning method. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. It is the fundamental material for manufacturing semiconductor chips, a circular thin sheet made primarily of silicon, possessing certain electrical conductivity and semiconductor properties. In wafer fabrication, sand and gravel raw materials are first purified through a chemical reaction to obtain high-purity polycrystalline silicon. Then, single-crystal silicon rods are prepared using methods such as the Czochralski method or zone melting. Following a series of processing steps including ingot shaping, slicing, grinding, chamfering, polishing, cleaning, and inspection, a wafer that meets the required specifications is finally formed.

[0003] Chinese patent application CN120854342A discloses a driven mechanism and a wafer cleaning apparatus, comprising: a base with a hollow interior forming a mounting cavity; a rotating shaft rotatably connected to the mounting cavity via a rotary transmission assembly, with a first end extending from the base; a wafer support unit concentrically and coaxially connected to the rotating shaft for supporting the wafer; a structural component sealed to the base, partially extending into the mounting cavity and abutting against the rotary transmission assembly; and a sensor assembly partially connected to the rotating shaft for monitoring the number of rotations of the rotating shaft relative to the base. The wafer rotation drives the wafer support unit to rotate, and the rotating shaft rotates synchronously, driving the sensor assembly to rotate, thereby monitoring the wafer rotation speed. This invention achieves wafer rotation speed monitoring by having the wafer rotate, driving the wafer support unit to rotate, and the rotating shaft rotating synchronously in conjunction with the sensor assembly. The rotating shaft has a small mass and torque, reducing the moment of inertia of the rotating shaft and the wafer support unit, resulting in more accurate wafer rotation speed monitoring and better cleaning performance.

[0004] However, the cleaning effect and degree of freedom of the wafer cleaning equipment disclosed above are generally limited. During operation, the support unit cannot be quickly disassembled, nor can the wafer be cleaned from the upper and lower surfaces simultaneously. Summary of the Invention

[0005] The purpose of this invention is to address the problems of existing wafer cleaning devices, such as limited cleaning effect and flexibility, inability to quickly disassemble the support unit during operation, and inability to clean the upper and lower surfaces of the wafer simultaneously. This invention provides a semiconductor wafer single-wafer cleaning device and cleaning method.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a semiconductor wafer single-wafer cleaning device and cleaning method, comprising:

[0008] outer shell;

[0009] The support mechanism is used to support the wafers to be cleaned;

[0010] Positioning mechanism, including locking components and return components;

[0011] The carrier mechanism is detachably mounted on the locking assembly, and the carrier mechanism is provided with multiple lower nozzles for cleaning the bottom of the wafer; the locking assembly includes multiple upper nozzles for cleaning the top of the wafer; the locking assembly is sleeved on the reflux assembly, and the reflux assembly is used to purify and reflux the wastewater after cleaning.

[0012] As a further embodiment of the present invention: the bottom of the bearing mechanism is provided with a first positioning pile and a plurality of second positioning piles; the bottom inner wall of the first positioning pile is provided with an insertion cavity, and the axial inner wall of the insertion cavity is provided with a positioning post; the inner wall of the locking component facing the bearing mechanism is provided with a first pile cavity and a plurality of second pile cavities, the bottom inner wall of the first pile cavity is provided with an insertion post, and the axial outer wall of the insertion post is provided with a positioning cavity.

[0013] As a further embodiment of the present invention: a slot is provided on the outer wall of the second positioning pile; a rotating cavity communicating with multiple second pile cavities is provided inside the locking assembly, and a locking ring is rotatably disposed in the rotating cavity; the locking ring is used to lock the slots on the multiple second positioning piles.

[0014] As a further embodiment of the present invention: the locking ring includes a linkage block, the linkage block includes a locking part for locking the slot and a first inclined part; the outer wall of the first positioning pile is provided with a plurality of first linkage grooves communicating with the insertion cavity, and the outer wall of the locking assembly is provided with a plurality of second linkage grooves communicating with the rotating cavity and the first pile cavity.

[0015] As a further embodiment of the present invention: the locking assembly has a receiving cavity for accommodating the bearing mechanism; the bearing mechanism has a first spray channel, one end of the first spray channel is connected to the axial inner wall of the insertion cavity, and the other end is connected to the radial inner wall of the receiving cavity; the lower nozzle is connected to the first spray channel; the radial inner wall of the receiving cavity has a third spray channel connected to the first spray channel, and the upper nozzle is connected to the third spray channel.

[0016] As a further embodiment of the present invention: a connecting ring is slidably disposed inside the insertion cavity, and a second spray channel communicating with the first spray channel is opened on the connecting ring; a fifth spray channel misaligned with the second spray channel is opened on the insertion post; and a fourth spray channel communicating with the fifth spray channel is opened at the bottom of the locking component.

[0017] As a further embodiment of the present invention: the reflux assembly has an installation cavity for accommodating the locking assembly; the inner wall of the bearing mechanism has a first reflux groove, the inner wall of the accommodating cavity has a second reflux groove, and the interior of the reflux assembly also has a reflux chamber communicating with the fourth spray channel; a connecting member connects the second reflux groove and the reflux chamber.

[0018] As a further embodiment of the present invention: a plurality of second inclined portions are provided on the radial outer wall of the connecting ring, a plurality of equipment cavities are provided on the return assembly, a cylinder is provided in the equipment cavity, and the output end of the cylinder passes through the first linkage groove and the second linkage groove in sequence; a slot is provided on the locking ring for the output end of the cylinder to pass through.

[0019] As a further embodiment of the present invention: the interior of the rotating cavity is provided with multiple sets of mounting plates, and a first reset member is connected to the mounting plate. The mounting plate is connected to the locking ring through the first reset member. A second reset member is provided on the inner wall of the connecting ring facing the insertion post. The connecting ring is connected to the locking assembly through the second reset member. The bearing mechanism is provided with multiple positioning seats, which are used to support the wafer to be cleaned. The reflux cavity is provided with a cleaning channel, and the reflux cavity is connected to external purification equipment through the cleaning channel.

[0020] Secondly, the present invention provides a method for cleaning a single semiconductor wafer, used in the aforementioned semiconductor wafer cleaning equipment:

[0021] Place the wafer to be cleaned onto the carrier mechanism;

[0022] Place the carrier containing the wafer to be cleaned onto the locking assembly and lock it;

[0023] The wafer to be cleaned is cleaned using both the lower and upper nozzles.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] This invention places the wafer to be cleaned on the positioning seat of the carrier mechanism, and then inserts the first and second positioning posts of the carrier mechanism into the first and second post cavities of the locking assembly, respectively, to complete the initial alignment. The piston rod of the cylinder of the reflux assembly extends and passes through the slots on each linkage groove and the locking ring in sequence, driving the locking ring to rotate, so that the locking part on the linkage block is engaged with the slot on the second positioning post, realizing the axial locking of the carrier mechanism. The piston rod continues to extend, pressing against the second inclined part on the connecting ring, pushing the connecting ring to slide, so that the second spray channel and the third spray channel are connected, completing the spray channel connection. The external liquid supply system delivers cleaning liquid to the third spray channel, one path through the first spray channel to the lower nozzle, and the other path directly to the upper nozzle, realizing simultaneous spraying of both sides of the wafer. The cleaning wastewater is collected through the first and second reflux tanks and enters the reflux chamber for purification through the connecting piece. Attached Figure Description

[0026] The present invention will be further explained below with reference to the accompanying drawings and embodiments:

[0027] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0028] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0029] Figure 3 This is a three-dimensional structural diagram of the positioning mechanism in this invention;

[0030] Figure 4 This is a cross-sectional view of the present invention;

[0031] Figure 5 yes Figure 4 Enlarged view of the structure at point A in the middle;

[0032] Figure 6 This is a cross-sectional view of the positioning mechanism in this invention;

[0033] Figure 7 This is a cross-sectional view of the locking component in this invention;

[0034] Figure 8 This is a three-dimensional structural diagram of the locking component in this invention;

[0035] Figure 9 This is a cross-sectional view of the recirculation component in this invention;

[0036] Figure 10 This is the internal three-dimensional structure of the locking component in this invention. Figure 1 ;

[0037] Figure 11 This is the internal three-dimensional structure of the locking component in this invention. Figure 2 ;

[0038] Figure 12This is a three-dimensional structural diagram of the load-bearing component in this invention;

[0039] Figure 13 This is a cross-sectional view of the carrier component in this invention. Figure 1 ;

[0040] Figure 14 This is a cross-sectional view of the carrier component in this invention. Figure 2 .

[0041] Explanation of reference numerals in the attached figures:

[0042] 1. Outer shell;

[0043] 2. Bearing mechanism; 201. First positioning pile; 202. Second positioning pile; 203. Slot; 204. Insertion cavity; 205. Positioning column; 206. First linkage groove; 207. Positioning seat; 208. First spray channel; 209. Lower nozzle; 210. First return channel;

[0044] 3. Positioning mechanism;

[0045] 31. Locking components;

[0046] 3101, First pile cavity; 3102, Second pile cavity; 3103, Insertion post; 3104, Positioning cavity; 3105, Rotating cavity; 3106, Mounting plate; 3107, First reset component; 3108, Locking ring; 3109, Linkage block; 3110, Locking part; 3111, First inclined part; 3112, Slot; 3113, Connecting ring; 3114, Second spray channel; 3115, Second inclined part; 3116, Second reset component; 3117, Second linkage groove; 3118, Receiving cavity; 3119, Third spray channel; 3120, Upper nozzle; 3121, Second return groove; 3122, Fourth spray channel; 3123, Fifth spray channel;

[0047] 32. Recirculation component;

[0048] 3201, Installation cavity; 3202, Equipment cavity; 3203, Cylinder; 3204, Return cavity; 3205, Cleaning channel; 3206, Connecting component. Detailed Implementation

[0049] The following will be combined with the appendix Figures 1 to 14 The technical solutions of the present invention have been clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0051] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] This invention provides, through improvements, a semiconductor wafer single-wafer cleaning device and cleaning method, such as... Figures 1-14 As shown, including;

[0054] Outer shell 1;

[0055] Support mechanism 2 is used to support the wafer to be cleaned;

[0056] The positioning mechanism 3 includes a locking component 31 and a return component 32;

[0057] The carrier mechanism 2 is detachably mounted on the locking assembly 31. The carrier mechanism 2 is provided with multiple lower nozzles 209 for cleaning the bottom of the wafer. The locking assembly 31 includes multiple upper nozzles 3120 for cleaning the top of the wafer. The locking assembly 31 is sleeved on the reflux assembly 32, which is used to purify and reflux the wastewater after cleaning.

[0058] The equipment places the wafer to be cleaned on the positioning seat 207 of the carrier mechanism 2. Then, the first positioning post 201 and the second positioning post 202 of the carrier mechanism 2 are inserted into the first post cavity 3101 and the second post cavity 3102 of the locking assembly 31, respectively, to complete the initial alignment. The piston rod of the cylinder 3203 of the return assembly 32 extends and passes through the slots 3112 on each linkage groove and the locking ring 3108, causing the locking ring 3108 to rotate. This causes the locking part 3110 on the linkage block 3109 to engage with the slot 203 on the second positioning post 202, achieving axial locking of the carrier mechanism 2. The piston rod continues to extend, pressing against the second inclined part 3115 on the connecting ring 3113, pushing the connecting ring 3113 to slide, causing the second spray channel 3114 to align with the third spray channel 3119, completing the spray channel connection.

[0059] An external liquid supply system delivers cleaning fluid to the third spray channel 3119, with one path leading to the lower nozzle 209 via the first spray channel 208 and the other path leading directly to the upper nozzle 3120, achieving simultaneous spraying of both sides of the wafer. Cleaning wastewater is collected via the first return tank 210 and the second return tank 3121, and then enters the return chamber 3204 for purification through the connecting piece 3206.

[0060] The purified cleaning solution flows back to the fourth spray channel 3122 and then through the fifth spray channel 3123 to perform a fine rinsing of the wafer.

[0061] See appendix Figure 6 -Appendix Figure 8 Appendix Figure 12 -Appendix Figure 14 The bottom of the bearing mechanism 2 is provided with a first positioning pile 201 and a plurality of second positioning piles 202; the bottom inner wall of the first positioning pile 201 is provided with a plug cavity 204, and the axial inner wall of the plug cavity 204 is provided with a positioning post 205; the inner wall of the locking component 31 facing the bearing mechanism 2 is provided with a first pile cavity 3101 and a plurality of second pile cavities 3102, the bottom inner wall of the first pile cavity 3101 is provided with a plug post 3103, and the axial outer wall of the plug post 3103 is provided with a positioning cavity 3104.

[0062] In this embodiment: the structure adopts a dual positioning pile design with main positioning and auxiliary positioning to achieve precise and stable assembly of the bearing mechanism 2 and the locking component 31.

[0063] In this embodiment: The primary positioning fit consists of the first positioning post 201 at the bottom of the bearing mechanism 2 and the first pile cavity 3101 on the locking assembly 31, forming the core positioning pair. During assembly, the first positioning post 201 is inserted into the first pile cavity 3101. At this time, the insertion post 3103 inside the pile cavity will embed into the insertion cavity 204 at the bottom of the first positioning post 201, and simultaneously, the positioning cavity 3104 on the outer wall of the insertion post 3103 will engage with the positioning post 205 on the axial inner wall of the insertion cavity 204. This nested structure restricts the horizontal translation and rotation of the bearing mechanism 2 and serves as the core positioning reference.

[0064] In this embodiment: auxiliary positioning and fitting: multiple second positioning posts 202 at the bottom of the bearing mechanism 2 correspond one-to-one with multiple second pile cavities 3102 on the locking assembly 31. The function of the auxiliary positioning posts is to distribute the force on the bearing mechanism 2, prevent a single positioning post from deforming due to vibration and spray impact during the cleaning process, and further improve the coaxiality of the assembly to ensure the alignment accuracy of the upper nozzle 3120 and the lower nozzle 209.

[0065] See appendix Figure 7 -Appendix Figure 8 Appendix Figure 10 -Appendix Figure 11 The outer wall of the second positioning post 202 is provided with a slot 203; the inside of the locking component 31 is provided with a rotating cavity 3105 that communicates with multiple second post cavities 3102, and a locking ring 3108 is rotatably arranged in the rotating cavity 3105; the locking ring 3108 is used to lock the slots 203 on the multiple second positioning posts 202.

[0066] In this embodiment: the rotating cavity 3105 inside the locking component 31 is the movement space of the locking ring 3108. The locking ring 3108 is connected to multiple second pile cavities 3102, and its inner wall is designed with a protruding locking tongue that matches the slot 203 of the second positioning pile 202.

[0067] When the second positioning stake 202 of the bearing mechanism 2 is inserted into the second stake cavity 3102, rotating the locking ring 3108 will cause its locking tongue to engage with the slot 203, forming a double limit in both the circumferential and axial directions. Rotating the locking ring 3108 in the opposite direction will disengage the locking tongue from the slot 203, thus releasing the lock.

[0068] See appendix Figure 10 -Appendix Figure 11 The locking ring 3108 includes a linkage block 3109, which includes a locking part 3110 for locking the slot 203 and a first tilting part 3111. The outer wall of the first positioning post 201 is provided with a plurality of first linkage grooves 206 that communicate with the insertion cavity 204, and the outer wall of the locking assembly 31 is provided with a plurality of second linkage grooves 3117 that communicate with the rotating cavity 3105 and the first post cavity 3101.

[0069] In this embodiment, the linkage block 3109 on the locking ring 3108 includes two functional areas: a locking part 3110 and a first inclined part 3111. The locking part 3110 is a protruding structure that matches the slot 203 of the second positioning post 202 and is responsible for axial locking. The first inclined part 3111 is a sloped guide structure that is responsible for engaging with the linkage groove of the first positioning post 201.

[0070] The first linkage groove 206 on the outer wall of the first positioning post 201 is connected to the internal insertion cavity 204, and the second linkage groove 3117 of the locking component 31 simultaneously passes through the rotating cavity 3105 and the first post cavity 3101. When the first positioning post 201 is inserted into the first post cavity 3101, the first linkage groove 206 and the second linkage groove 3117 are precisely aligned, forming a channel that triggers the movement of the first inclined part 3111.

[0071] See appendix Figure 4 -Appendix Figure 6 Appendix Figure 9 The locking assembly 31 has a receiving cavity 3118 for accommodating the carrying mechanism 2; the carrying mechanism 2 has a first spray channel 208, one end of the first spray channel 208 is connected to the axial inner wall of the insertion cavity 204, and the other end is connected to the radial inner wall of the receiving cavity 3118; the lower nozzle 209 is connected to the first spray channel 208; the radial inner wall of the receiving cavity 3118 has a third spray channel 3119 connected to the first spray channel 208, and the upper nozzle 3120 is connected to the third spray channel 3119.

[0072] In this embodiment: the cleaning fluid, or the circulating fluid purified by the reflux component 32, first enters the fifth spray channel 3123 of the locking component 31. One end of the fifth spray channel 3123 is connected to the reflux component 32, and the other end is intermittently connected to the first spray channel 208.

[0073] Once the support mechanism 2 is installed and locked, its first spray channel 208 connects with its fifth spray channel 3123. The cleaning fluid flows from the fifth spray channel 3123 into the first spray channel 208, and then is sprayed onto the bottom of the wafer through the lower nozzle 209 connected to the first spray channel 208. The design that one end of the first spray channel 208 is connected to the axial inner wall of the insertion cavity 204 can utilize the sealing structure after the positioning pile is assembled to prevent the cleaning fluid from leaking.

[0074] In this embodiment: After the support mechanism 2 is installed in place, the third spray channel 3119 on the radial inner wall of the receiving cavity 3118 is connected to the first spray channel 208. At this time, the third spray channel 3119 simultaneously supplies liquid directly to the upper spray head 3120, and the upper spray head 3120 sprays cleaning liquid toward the top of the wafer.

[0075] In this embodiment, the assembly of the bearing mechanism 2 is both a signal for the completion of positioning and locking, and a sealing condition for the nozzle docking.

[0076] In this embodiment, the upper nozzle 3120 and the lower nozzle 209 share the same main liquid supply path, which can achieve complete synchronization of cleaning fluid pressure and flow rate, avoid the problem of inconsistent spray intensity between the upper and lower parts caused by traditional branched liquid supply, and ensure uniform cleaning effect on the upper and lower surfaces of the wafer.

[0077] See appendix Figure 3 -Appendix Figure 5 Appendix Figure 10 -Appendix Figure 11 The insertion cavity 204 is also slidably provided with a connecting ring 3113, and the connecting ring 3113 is provided with a second spray channel 3114 that communicates with the first spray channel 208; the insertion post 3103 is provided with a fifth spray channel 3123 that is misaligned with the second spray channel 3114; and the bottom of the locking component 31 is provided with a fourth spray channel 3122 that communicates with the fifth spray channel 3123.

[0078] In this embodiment: the external liquid supply system or reflux assembly 32 delivers the purified conventional cleaning fluid to the fifth spray channel 3123 of the locking assembly 31. After the support mechanism 2 is assembled and locked, the third spray channel 3119 connects with the first spray channel 208 of the support mechanism 2. Part of the cleaning fluid flows down to the nozzle 209 through the first spray channel 208 to spray the bottom of the wafer. The other part of the cleaning fluid flows directly to the upper nozzle 3120 of the locking assembly 31 to spray the top of the wafer simultaneously.

[0079] In this embodiment: After the supporting mechanism 2 is assembled and locked, the connecting ring 3113 in the insertion cavity 204 slides to the top, and its second spray channel 3114 communicates with the first spray channel 208. After the supporting mechanism 2 is unlocked, the connecting ring 3113 in the insertion cavity 204 slides to the bottom. Due to the misalignment design between the second spray channel 3114 and the fifth spray channel 3123, the connecting ring 3113 blocks and closes the fifth spray channel 3123.

[0080] After the carrier mechanism 2 is unlocked and disengaged from the locking component 31, external foreign objects and impurities will not block the fifth spray channel 3123.

[0081] In this embodiment: the connecting ring 3113 slides within the insertion cavity 204, enabling the switching of two key states:

[0082] Connection status: The second jet channel 3114 is aligned and connected with the first jet channel 208;

[0083] Isolation state: The second jet duct 3114 is separated from the first jet duct 208 and blocks the fifth jet duct 3123.

[0084] See appendix Figure 2 -Appendix Figure 3 Appendix Figure 9The return assembly 32 has an installation cavity 3201 for accommodating the locking assembly 31; the inner wall of the bearing mechanism 2 has a first return groove 210, the inner wall of the receiving cavity 3118 has a second return groove 3121, and the interior of the return assembly 32 also has a return cavity 3204 communicating with the fourth spray channel 3122; a connecting member 3206 connects the second return groove 3121 and the return cavity 3204.

[0085] In this embodiment: This application realizes the full-process recycling of cleaning fluid, and the complete path is divided into four steps: wastewater collection, return transportation, purification treatment, and circulating fluid supply.

[0086] In this embodiment, a portion of the wastewater generated during double-sided wafer cleaning falls onto the inner wall of the support mechanism 2 and flows into the first return tank 210. The layout of the double return tanks covers the entire area of ​​wafer cleaning, avoiding secondary contamination of the wafer caused by wastewater residue.

[0087] In this embodiment: after the bearing mechanism 2 and the locking component 31 are assembled in place, the first return channel 210 and the second return channel 3121 are precisely connected. After the collected wastewater is combined, it is transported to the return channel 3204 of the return component 32 through the connecting piece 3206 that connects the second return channel 3121 and the return cavity 3204.

[0088] In this embodiment, the reflux chamber 3204 is the core area for wastewater purification, integrating filtration and other purification modules to remove particulate impurities, metal ions, organic residues, and other pollutants from the wastewater, enabling it to meet recycling standards. The purified cleaning solution is directly transported from the reflux chamber 3204 to the fourth spray channel 3122, and then through the fifth spray channel 3123 to participate in the refined cleaning process of the wafer. Simultaneously, the reflux chamber 3204 can also be linked with an external liquid supply system to replenish fresh cleaning solution to the first spray channel 208.

[0089] In this embodiment, a pump mechanism is also designed to drive the circulation of the cleaning fluid.

[0090] See appendix Figure 6 -Appendix Figure 11 The connecting ring 3113 has multiple second inclined portions 3115 on its radial outer wall, and the return assembly 32 has multiple equipment cavities 3202. A cylinder 3203 is installed in the equipment cavity 3202, and the output end of the cylinder 3203 passes through the first linkage groove 206 and the second linkage groove 3117 in sequence. The locking ring 3108 has a slot 3112 through which the output end of the cylinder 3203 passes.

[0091] In this embodiment: This application achieves the synchronous execution of two core actions—rotation locking of locking ring 3108 and sliding switching of spray channel by multi-path through-cooperation of the output end of a single cylinder 3203.

[0092] In this embodiment: the cylinder 3203 installed in the equipment cavity 3202 of the return assembly 32 has its output end passing through the second linkage groove 3117 of the locking assembly 31, the first linkage groove 206 of the bearing mechanism 2, and the slot 3112 on the locking ring 3108 in sequence. At the same time, the end of the piston rod abuts against the second inclined portion 3115 of the radial outer wall of the connecting ring 3113.

[0093] In this embodiment: when the piston rod presses the first inclined portion 3111, it can drive the locking ring 3108 to rotate. The second inclined portion 3115 is a sloped guide structure, and the linear motion of the piston rod can be converted into the radial sliding of the connecting ring 3113 through the slope. The piston rod of the cylinder 3203 extends outward and drives the locking ring 3108 to rotate, so that the locking portion 3110 of the linkage block 3109 is embedded in the slot 203 of the second positioning post 202, thus completing the axial locking of the bearing mechanism 2.

[0094] The piston rod continues to extend, and its end presses against the second inclined portion 3115 of the connecting ring 3113. Through the guiding effect of the inclined surface, the connecting ring 3113 is pushed to slide radially within the insertion cavity 204, so that the second spray channel 3114 and the third spray channel 3119 on the connecting ring 3113 are precisely connected or disconnected.

[0095] See appendix Figure 2 -Appendix Figure 14 The rotating cavity 3105 has multiple sets of mounting plates 3106 inside. The mounting plates 3106 are connected to a first reset member 3107. The mounting plates 3106 are connected to the locking ring 3108 through the first reset member 3107. The connecting ring 3113 has a second reset member 3116 on the inner wall facing the insertion post 3103. The connecting ring 3113 is connected to the locking assembly 31 through the second reset member 3116. The bearing mechanism 2 has multiple positioning seats 207. The positioning seats 207 are used to support the wafer to be cleaned. The reflux cavity 3204 has a cleaning channel 3205. The reflux cavity 3204 is connected to the external purification equipment through the cleaning channel 3205.

[0096] In this embodiment: the application achieves automatic reset of the locking ring 3108 and the connecting ring 3113 after the driving action is completed through the synergistic effect of the first reset member 3107 and the second reset member 3116, so as to ensure the consistency and accuracy of the device's operation in each cycle.

[0097] In this embodiment: multiple mounting plates 3106 within the rotating cavity 3105 serve as fixed fulcrums. The first reset member 3107, typically a torsion spring or tension spring, is connected at one end to the mounting plate 3106 and at the other end to the locking ring 3108. When the piston rod of the cylinder 3203 extends, it rotates the locking ring 3108 and stretches the first reset member 3107, allowing it to store elastic potential energy. When the piston rod of the cylinder 3203 retracts, the first reset member 3107 releases its elastic potential energy, causing the locking ring 3108 to rotate in the opposite direction to its initial position, ensuring that the locking part 3110 is completely disengaged from the slot 203 of the second positioning post 202, thus completing the unlocking and reset process.

[0098] In this embodiment: the second reset member 3116, typically a tension spring, has one end connected to the inner wall of the connecting ring 3113 facing the insertion post 3103, and the other end fixed to the corresponding fulcrum of the locking assembly 31. When the piston rod of the cylinder 3203 extends continuously, it presses against the second inclined portion 3115 of the connecting ring 3113, pushing the connecting ring 3113 to slide radially and stretching the second reset member 3116. When the piston rod of the cylinder 3203 retracts, the second reset member 3116 releases its elastic potential energy, pushing the connecting ring 3113 to slide and reset in the opposite direction, thus disconnecting the second spray channel 3114 from the third spray channel 3119.

[0099] In this embodiment: the multiple positioning seats 207 on the carrier mechanism 2 are the direct carrier components of the wafer, and their design must meet the high precision requirements of semiconductor wafer cleaning. The multiple positioning seats 207 are evenly distributed around the circumference, and the wafer is stably supported at the center of the carrier mechanism 2 by three-point centering or multi-point support, ensuring the coaxiality of the wafer and the nozzle and avoiding blind spots in edge cleaning.

[0100] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and inventive features disclosed herein.

Claims

1. A semiconductor wafer single-wafer cleaning device, characterized in that, include: Outer shell (1); The support mechanism (2) is used to support the wafer to be cleaned; The positioning mechanism (3) includes a locking component (31) and a return component (32); The carrier mechanism (2) is detachably mounted on the locking component (31), and the carrier mechanism (2) is provided with a plurality of lower nozzles (209) for cleaning the bottom of the wafer; the locking component (31) includes a plurality of upper nozzles (3120) for cleaning the top of the wafer; the locking component (31) is sleeved on the return component (32), and the return component (32) is used to purify and return the wastewater after cleaning; when the carrier mechanism (2) is mounted on the locking component (31), the locking component (31) locks the carrier mechanism (2) in multiple ways, and the spray channels inside the carrier mechanism (2) and the locking component (31) are connected.

2. The semiconductor wafer single-wafer cleaning equipment according to claim 1, characterized in that, The bottom of the bearing mechanism (2) is provided with a first positioning pile (201) and a plurality of second positioning piles (202); the bottom inner wall of the first positioning pile (201) is provided with a plug-in cavity (204), and the axial inner wall of the plug-in cavity (204) is provided with a positioning column (205). The locking component (31) has a first pile cavity (3101) and a plurality of second pile cavities (3102) on the inner wall facing the bearing mechanism (2). The bottom inner wall of the first pile cavity (3101) is provided with a plug-in post (3103), and the axial outer wall of the plug-in post (3103) is provided with a positioning cavity (3104).

3. The semiconductor wafer single-wafer cleaning equipment according to claim 2, characterized in that, The second positioning pile (202) has a slot (203) on its outer wall; the locking component (31) has a rotating cavity (3105) that communicates with multiple second pile cavities (3102) inside, and a locking ring (3108) is rotatably arranged in the rotating cavity (3105). The locking ring (3108) is used to lock the slots (203) on the plurality of second positioning stakes (202).

4. A semiconductor wafer single-wafer cleaning device according to claim 3, characterized in that, The locking ring (3108) includes a linkage block (3109), which includes a locking part (3110) for locking the slot (203) and a first tilting part (3111). The outer wall of the first positioning pile (201) is provided with a plurality of first linkage grooves (206) that communicate with the insertion cavity (204), and the outer wall of the locking component (31) is provided with a plurality of second linkage grooves (3117) that communicate with the rotating cavity (3105) and the first pile cavity (3101).

5. A semiconductor wafer single-wafer cleaning device according to claim 4, characterized in that, The locking assembly (31) has a receiving cavity (3118) for accommodating the bearing mechanism (2); the bearing mechanism (2) has a first spray channel (208), one end of the first spray channel (208) is connected to the axial inner wall of the insertion cavity (204), and the other end is connected to the radial inner wall of the receiving cavity (3118); The lower nozzle (209) is connected to the first spray channel (208); a third spray channel (3119) connected to the first spray channel (208) is provided on the radial inner wall of the receiving cavity (3118), and the upper nozzle (3120) is connected to the third spray channel (3119).

6. A semiconductor wafer single-wafer cleaning device according to claim 5, characterized in that, The insertion cavity (204) is also slidably provided with a connecting ring (3113), and a second spray channel (3114) communicating with the first spray channel (208) is opened on the connecting ring (3113); a fifth spray channel (3123) is opened on the insertion post (3103) that is misaligned with the second spray channel (3114). The bottom of the locking component (31) is provided with a fourth spray channel (3122) that communicates with the fifth spray channel (3123).

7. A semiconductor wafer single-wafer cleaning device according to claim 6, characterized in that, The return assembly (32) has an installation cavity (3201) for accommodating the locking assembly (31); the inner wall of the bearing mechanism (2) has a first return groove (210), the inner wall of the accommodating cavity (3118) has a second return groove (3121), and the interior of the return assembly (32) also has a return cavity (3204) communicating with the fourth spray channel (3122). A connecting piece (3206) is provided between the second reflux groove (3121) and the reflux cavity (3204).

8. A semiconductor wafer single-wafer cleaning device according to claim 7, characterized in that, The connecting ring (3113) has multiple second inclined portions (3115) on its radial outer wall, and the return assembly (32) has multiple equipment cavities (3202). A cylinder (3203) is installed in the equipment cavity (3202), and the output end of the cylinder (3203) passes through the first linkage groove (206) and the second linkage groove (3117) in sequence. The locking ring (3108) has a slot (3112) through which the output end of the cylinder (3203) passes.

9. A semiconductor wafer single-wafer cleaning device according to claim 8, characterized in that, The rotating cavity (3105) is provided with multiple sets of mounting plates (3106), and a first reset member (3107) is connected to the mounting plate (3106). The mounting plate (3106) is connected to the locking ring (3108) through the first reset member (3107). And / or, a second reset member (3116) is provided on the inner wall of the connecting ring (3113) facing the plug post (3103), and the connecting ring (3113) is connected to the locking assembly (31) through the second reset member (3116); And / or, the carrier mechanism (2) is provided with a plurality of positioning seats (207), the positioning seats (207) being used to carry the wafer to be cleaned; And / or, the reflux chamber (3204) is provided with a cleaning channel (3205), and the reflux chamber (3204) is connected to an external purification device through the cleaning channel (3205).

10. A method for cleaning a single semiconductor wafer, used in a single semiconductor wafer cleaning apparatus as described in any one of claims 1-9, characterized in that, Place the wafer to be cleaned onto the carrier mechanism (2); The carrier mechanism (2) containing the wafer to be cleaned is placed on the locking assembly (31) and locked; The wafer to be cleaned is cleaned using the lower nozzle (209) and the upper nozzle (3120).

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