Semiconductor silicon wafer loading and unloading equipment and loading and unloading method

Abstract

The invention relates to the technical field of silicon wafer feeding and discharging equipment, in particular to semiconductor silicon wafer feeding and discharging equipment and a feeding and discharging method, and the semiconductor silicon wafer feeding and discharging equipment comprises a wafer cleaning machine, a supporting table, a cleaning tank, a drying tank, a conveying structure, a drying structure, a basket structure, a suspension structure, a feeding structure, a linear motor and a wafer. The conveying structure not only can convey the flower basket structure, but also can seal the drying box, the structure is simple and convenient, the occupied space is small, and the wafer conveying efficiency is improved; a linear motor is mounted at the top end of the wafer cleaning machine, the linear motor drives the feeding structure to move horizontally, the hanging structure is driven by the feeding structure to lift the basket structure, and the basket structure is convenient to convey; the hanging structure fixes the flower basket structure again in the process of clamping the flower basket structure, and deviation caused by different weights of the two sides of the flower basket structure is effectively prevented. And the lifting stability of the flower basket structure is improved.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer loading and unloading equipment technology, specifically to a semiconductor silicon wafer loading and unloading equipment and method. Background Technology

[0002] In the wafer manufacturing process, sulfuric acid cleaning equipment is one of the key wet cleaning devices, mainly used to remove organic contaminants (such as photoresist residue, polymers, grease, etc.) and some metallic impurities from the wafer surface. The system can be broken down into six functional modules: a core process unit, a chemical supply and recovery unit, a temperature control unit, a gas-assisted unit, an automation control unit, and a safety and environmental protection unit. These modules work together to achieve a stable and efficient cleaning process. The cleaning reaction zone consists of a cleaning tank, a wafer carrier, and a spray assembly. A basket carrying the wafers is transported into the cleaning machine via a conveyor assembly, and the baskets are transferred using loading and unloading fixtures. After cleaning, the wafers are dried using high-temperature isopropanol.

[0003] However, in order to prevent the leakage of high-temperature isopropanol, a sealing cover is installed above the drying tank when the wafer is dried inside the drying tank. The sealing cover and the conveying components are set up separately, which takes up space and has a complex structure. The hanging rack in the loading and unloading structure is directly connected to the docking rod on the basket. When the weights on both sides of the basket are different, it is easy to cause the basket to shift, affecting the stability of the connection between the basket and the hanging rack. Therefore, a semiconductor silicon wafer loading and unloading device is needed to solve the above technical problems. Summary of the Invention

[0004] To address the problems in the prior art, the present invention provides a semiconductor silicon wafer loading and unloading device and a loading and unloading method.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a semiconductor silicon wafer loading and unloading device, including a wafer cleaning machine and a support platform installed inside the wafer cleaning machine. A cleaning tank is installed on the support platform, and a conveying structure with a conveying basket structure is installed on the support platform. The wafer is stored inside the basket structure, and a drying structure is installed on the conveying structure. A drying tank is provided at the bottom of the support platform. A linear motor is installed at the top of the wafer cleaning machine, which drives the feeding structure to move. A suspension structure is installed at the bottom of the feeding structure, which includes a bracket and a pull rod. The pull rod is fixed to the feeding structure and is slidably connected to the bracket. The bracket is suspended from the connecting rod in the basket structure. A wheel frame is fixed to the bottom of the pull rod. A spring is installed between the wheel frame and the bracket. A gear is rotatably connected to the wheel frame. A slide rod is fixed to one side of the bracket and is slidably connected to a rack. The gear meshes with the rack. A limit block is fixed to the bottom of the rack and engages with a slot in the basket structure.

[0006] Specifically, the flower basket structure includes a flower basket and a connecting rod. The connection between the hanging bracket and the connecting rod is an L-shaped structure. The connecting rod is located between two flower baskets, and multiple wafers are stored on the flower basket.

[0007] Specifically, the bottom of the flower basket has a through hole, and the flower basket is provided with a slot, and the limiting block engages with the slot.

[0008] Specifically, the feeding structure includes a hydraulic cylinder and a suspension. The suspension is fixed on the slide of the linear motor, and a hydraulic cylinder is installed inside the suspension. The telescopic end of the hydraulic cylinder is fixed to the tie rod.

[0009] Specifically, guide rods are fixed on the lugs on both sides of the top of the hanger. The guide rods are slidably connected to the guide sleeves, and the guide sleeves are fixed to both sides of the suspension.

[0010] Specifically, the conveying structure includes a guide rod and a conveying platform. Two guide rods are fixed on the support platform, and the conveying platform is slidably mounted on the guide rods.

[0011] Specifically, four L-shaped positioning blocks are fixed on the conveyor platform, and a storage cavity is opened at the bottom of the conveyor platform.

[0012] Specifically, a transmission rod is fixed on one side of the conveyor table, a transmission groove is provided on the transmission rod, a drive shaft is slidably provided in the transmission groove, the drive shaft is rotatably connected to the drive rod, the side of the drive rod away from the drive shaft is fixed to the output shaft of the motor, and the motor is fixed to the support table by a mounting bracket.

[0013] Specifically, a docking frame is fixed to the bottom of the support platform, a drying trough is fixed to the bottom of the docking frame, a second sealing ring is fixed at an angle to the top of the docking frame, and a first sealing ring is fixed at an angle to the bottom of the conveyor platform.

[0014] Specifically, the drying structure includes spray pipes, multiple spray pipes are provided inside the receiving cavity, spray pipes are equipped with nozzles, a conveying pipe is fixed on the conveying platform, and the conveying pipe is connected to the spray pipes.

[0015] A loading and unloading method for a semiconductor silicon wafer loading and unloading device includes the following steps: S1: The wafer is stored in the basket structure and transported to the inside of the wafer cleaning machine by the conveying structure. S2: The feeding structure drives the suspension structure to move up and down, and the suspension structure suspends the flower basket structure; the linear motor drives the feeding structure to move horizontally, so that the flower basket structure moves in the washing tank and the drying tank. S3: After the wafer is cleaned in the cleaning tank, the feeding structure drives the suspension structure to lift the basket out of the cleaning tank. The linear motor drives the feeding structure to move horizontally, so that the basket structure moves from the cleaning tank to above the drying tank. After the basket structure carries the wafer into the drying tank, the conveying structure seals the drying tank, and the drying structure dries the wafer inside the drying tank.

[0016] The beneficial effects of this invention are: (1) The semiconductor silicon wafer loading and unloading equipment and loading and unloading method described in this invention are provided with a conveying structure with a conveying basket structure installed on the support platform. The basket structure stores wafers inside. A drying structure is installed on the conveying structure. A drying trough is provided at the bottom of the support platform. The conveying structure can not only convey the basket structure, but also seal the drying box. The structure is simple and convenient, occupies little space, and improves the conveying efficiency of wafers.

[0017] (2) The semiconductor silicon wafer loading and unloading equipment and loading and unloading method described in this invention are provided with a linear motor installed at the top of the wafer cleaning machine. The linear motor drives the loading structure to move horizontally, and the loading structure drives the suspension structure to lift the basket structure, which facilitates the transportation of the basket structure.

[0018] (3) The semiconductor silicon wafer loading and unloading equipment and method described in this invention have a suspension structure installed at the bottom of the loading structure. The suspension structure is used to fix the basket structure again during the clamping process, effectively preventing the basket structure from shifting due to different weights on both sides. This improves the lifting stability of the basket structure. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of a semiconductor silicon wafer loading and unloading device and method provided by the present invention. Figure 2 for Figure 1 The diagram shown is an enlarged view of the structure of part A. Figure 3 This is a schematic diagram of the connection structure between the linear motor and the feeding structure of the present invention; Figure 4 for Figure 3 The diagram shown is an enlarged view of the structure of section B. Figure 5 This is a cross-sectional view of the cleaning tank and drying tank of the present invention; Figure 6 for Figure 5 The diagram shows an enlarged view of section C. Figure 7 This is a schematic diagram of the connection structure between the guide rod and the conveyor table of the present invention; Figure 8 This is a schematic diagram of the connection structure between the conveying structure and the drying structure of the present invention; Figure 9 This is a schematic diagram of the suspension structure of the present invention; Figure 10 This is a schematic diagram of the connection structure between the flower basket and the connecting rod of the present invention; Figure 11 for Figure 9 Vertical cross-sectional view; Figure 12 for Figure 11 The diagram shows an enlarged view of the structure of part D.

[0021] In the diagram: 1. Wafer cleaning machine; 2. Support platform; 3. Cleaning tank; 4. Drying tank; 5. Conveying structure; 501. Guide rod 1; 502. Conveying platform; 503. Motor; 504. Mounting bracket; 505. Drive rod; 506. Transmission rod; 507. Receiving cavity; 508. First sealing ring; 509. Second sealing ring; 510. Positioning block; 511. Transmission groove; 512. Drive shaft; 6. Drying structure; 601. Conveying pipe; Spray pipe; 603. Spray head 7. Flower basket structure; 701. Flower basket; 702. Docking rod; 703. Through hole; 704. Slot; 8. Suspension structure; 801. Hanger; 802. Tie rod; 803. Spring component; 804. Wheel frame; 805. Rack; 806. Slide rod; 807. Limiting block; 808. Gear; 9. Feeding structure; 901. Suspension; 902. Hydraulic cylinder; 903. Guide rod II; 904. Guide sleeve; 10. Linear motor; 11. Wafer; 12. Docking frame. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0023] like Figure 1 , Figure 2 , Figure 4 and Figures 9-12 As shown, the semiconductor silicon wafer loading and unloading equipment of the present invention includes a wafer cleaning machine 1 and a support platform 2 installed inside the wafer cleaning machine 1. A cleaning tank 3 is installed on the support platform 2. A conveying structure 5 of a conveying basket structure 7 is installed on the support platform 2. A wafer 11 is stored inside the basket structure 7. A drying structure 6 is installed on the conveying structure 5. A drying tank 4 is provided at the bottom of the support platform 2. A linear motor 10 is installed at the top of the wafer cleaning machine 1, which drives the feeding structure 9 to move. A suspension structure 8 is installed at the bottom of the feeding structure 9. The suspension structure 8 includes a bracket 801 and a pull rod 802. The pull rod 802 is fixed on the feeding structure 9 and is slidably connected to the bracket 801. The bracket 801 is suspended from the connecting rod 702 in the basket structure 7. A wheel frame 804 is fixed at the bottom of the pull rod 802. A spring 803 is installed between the wheel frame 804 and the bracket 801. A gear 808 is rotatably connected to the wheel frame 804. A sliding rod 80 is fixed on one side of the bracket 801. 6. The slide bar 806 is slidably connected to the rack 805, the gear 808 meshes with the rack 805, and the bottom end of the rack 805 is fixed with a limiting block 807. The limiting block 807 engages with the slot 704 in the basket structure 7. The basket structure 7 includes a basket 701 and a connecting rod 702. The connection between the bracket 801 and the connecting rod 702 is an L-shaped structure. The connecting rod 702 is located between two baskets 701. Multiple wafers 11 are stored on the basket 701. The bottom end of the basket 701 has a through hole 703 to facilitate the flow of cleaning fluid. The basket 701 is provided with a slot 704, and the limiting block 807 engages with the slot 704. When the hanger 801 contacts the connecting rod 702, the feeding structure 9 drives the suspension structure 8 to move upward. After the hanger 801 is suspended from the connecting rod 702, the overall weight of the hanger 801 increases. The hanger 801 and the wheel frame 804 compress the spring 803. The pull rod 802 on the wheel frame 804 slides between the hanger 801 and the wheel frame 804. During the movement of the wheel frame 804, the gear 808 moves upward. The gear 808 and the wheel frame 804 rotate. The gear 808 drives the rack 805 to move downward. The rack 805 drives the limiting block 807 to engage with the slot 704. The limiting block 807 positions the flower basket 701, improving the stability of the connection between the hanger 801 and the flower basket structure 7.

[0024] like Figures 1-4 and Figures 9-12As shown, the feeding structure 9 includes a hydraulic cylinder 902 and a suspension 901. The suspension 901 is fixed on the slide of the linear motor 10, and the hydraulic cylinder 902 is installed inside the suspension 901. The telescopic end of the hydraulic cylinder 902 is fixed to the pull rod 802. Guide rods 903 are fixed on the lugs on both sides of the top of the bracket 801. The guide rods 903 are slidably connected to the guide sleeves 904, and the guide sleeves 904 are fixed on both sides of the suspension 901. After the conveyor table 502 is aligned with the drying tank 4, the conveyor table 502... The basket structure 7 is located at the bottom of the suspension structure 8. At this time, the hydraulic cylinder 902 extends and drives the suspension structure 8 to move downward. When the bracket 801 corresponds to the docking rod 702, the linear motor 10 drives the suspension 901 to move. The suspension 901 drives the tie rod 802 to move through the hydraulic cylinder 902. The tie rod 802 drives the bracket 801 to contact the docking rod 702. The bracket 801 drives the guide rod 903 to slide with the guide sleeve 904, making the movement of the bracket 801 more stable.

[0025] like Figure 1 , Figure 2 , Figure 3 and Figures 5-8 As shown, the conveying structure 5 includes guide rods 501 and a conveying platform 502. Two guide rods 501 are fixed on the support platform 2, and the conveying platform 502 is slidably mounted on the guide rods 501. Four L-shaped positioning blocks 510 are fixed on the conveying platform 502, and a storage cavity 507 is opened at the bottom of the conveying platform 502. A transmission rod 506 is fixed on one side of the conveying platform 502, and a transmission groove 511 is opened on the transmission rod 506. A drive shaft 512 is slidably mounted in the transmission groove 511. The drive shaft 512 is rotatably connected to the drive rod 505. The side of the drive rod 505 away from the drive shaft 512 is fixed to the output shaft of the motor 503. The motor 503 is fixed to the support platform 2 by a mounting bracket 504. The basket 701 carrying the wafer 11 is placed on the conveying platform. On platform 502, the conveyor platform 502 is located on the side away from the drying tank 4. The conveyor platform 502 faces outward, with ample operating space, facilitating the placement and removal of the basket 701. The basket 701 is placed on four positioning blocks 510. The positioning blocks 510 facilitate the positioning of the basket 701 and the docking rod 702 in the basket structure 7. After the basket structure 7 is placed, the motor 503 rotates, driving the drive rod 505 to rotate. The drive shaft 512 at the end of the drive rod 505 slides in the transmission groove 511. The drive shaft 512 drives the transmission rod 506, causing the transmission rod 506 to drive the conveyor platform 502 to slide on the guide rod 501. The wafer 11 is then transported to the interior of the wafer cleaning machine 1 via the conveyor platform 502.

[0026] like Figure 1 , Figure 2 , Figure 3 and Figures 5-8As shown, a docking frame 12 is fixed to the bottom of the support platform 2, a drying trough 4 is fixed to the bottom of the docking frame 12, a second sealing ring 509 is fixed to the top of the docking frame 12 at an angle, and a first sealing ring 508 is fixed to the bottom of the conveying platform 502 at an angle; the drying structure 6 includes a spray pipe 602, multiple spray pipes 602 are provided inside the receiving cavity 507, a nozzle 603 is provided on the spray pipe 602, and a conveying pipe 601 is fixed on the conveying platform 502, and the conveying pipe 601 is connected to the spray pipe 602; After cleaning, the conveyor table 502 is not sealed to the drying tank 4. It is connected to the hanging basket structure 7 through the suspension structure 8. The linear motor 10 drives the feeding structure 9 to move horizontally, conveying the basket structure 7 into the drying tank 4. The motor 503 rotates, driving the drive rod 505 to rotate. The drive shaft 512 at the end of the drive rod 505 slides in the transmission groove 511. The drive shaft 512 drives the transmission rod 506, causing the conveyor table 502 to slide on the guide rod 501. The conveyor table 502 drives the spray pipe 602 and the nozzle 603 to move, positioning the spray pipe 602 above the wafer 11. Because the first sealing ring 508 and the second sealing ring 509 are inclined, when the first sealing ring 508 and the second sealing ring 509 come into contact, the drying tank 4 is sealed, creating a closed environment for subsequent drying operations. High-temperature isopropanol enters the conveying pipe 601 from the equipment, and then is sprayed into the drying tank 4 from the nozzle 603 through the spray pipe 602. The drying tank 4 is equipped with pipes to handle the high-temperature isopropanol vapor that evaporates during the drying process. The conveying structure 5 can not only convey the basket structure 7, but also seal the drying box 3. The structure is simple and convenient, occupies little space, and improves the conveying efficiency of the wafer 11.

[0027] A loading and unloading method for a semiconductor silicon wafer loading and unloading device includes the following steps: S1: The wafer 11 is stored in the basket structure 7 and the basket structure 7 is transported to the inside of the wafer cleaning machine 1 through the conveying structure 5; S2: The feeding structure 9 drives the suspension structure 8 to move up and down, and the suspension structure 8 suspends the flower basket structure 7; the linear motor 10 drives the feeding structure 9 to move horizontally, so that the flower basket structure 7 moves in the washing tank 3 and the drying tank 4. S3: After the wafer 11 is cleaned in the cleaning tank 3, the feeding structure 9 drives the suspension structure 8 to lift the basket in the cleaning tank 3. The linear motor 10 drives the feeding structure 9 to move horizontally, so that the basket structure 7 moves from the cleaning tank 3 to above the drying tank 4. After the basket structure 7 carries the wafer 11 into the drying tank 4, the conveying structure 5 seals the drying tank 4, and the drying structure 6 dries the wafer 11 inside the drying tank 4.

[0028] In use, the basket 701 carrying the wafer 11 is placed on the conveyor table 502. At this time, the conveyor table 502 is on the side away from the drying tank 4 and faces outward. The conveyor table 502 has sufficient operating space, which is convenient for picking up and putting down the basket 701. The basket 701 is placed on four positioning blocks 510. The positioning blocks 510 are set to facilitate the positioning of the basket 701 and facilitate the docking of the suspension structure 8 with the docking rod 702 in the basket structure 7. After the basket structure 7 is placed, the motor 503 rotates, and the motor 503 drives the drive rod 505 to rotate. The drive shaft 512 at the end of the drive rod 505 slides in the transmission groove 511. The drive shaft 512 drives the transmission rod 506, so that the transmission rod 506 drives the conveyor table 502 to slide on the guide rod 501. The wafer 11 is transported to the inside of the wafer cleaning machine 1 through the conveyor table 502. After the conveyor table 502 aligns with the drying tank 4, the basket structure 7 on the conveyor table 502 is at the bottom of the suspension structure 8. At this time, the hydraulic cylinder 902 extends, driving the suspension structure 8 to move downwards. When the hanger 801 aligns with the docking rod 702, the linear motor 10 drives the suspension 901 to move. The suspension 901, through the hydraulic cylinder 902, drives the pull rod 802 to move. The pull rod 802 drives the hanger 801 to contact the docking rod 702. The hanger 801 drives the guide rod 903 to slide against the guide sleeve 904, improving the stability of the hanger 801's movement. After the hanger 801 contacts the docking rod 702, the hydraulic cylinder 902 extends. 02. When the hydraulic cylinder 902 retracts, it drives the suspension structure 8. After the bracket 801 and the connecting rod 702 are suspended, the overall weight of the bracket 801 increases. The bracket 801 and the wheel frame 804 compress the spring 803. The pull rod 802 on the wheel frame 804 slides between the bracket 801 and the bracket. During the movement of the wheel frame 804, it drives the gear 808 to move upward. The gear 808 and the wheel frame 804 rotate. The gear 808 drives the rack 805 to move downward. The rack 805 drives the limit block 807 to engage with the slot 704. The limit block 807 positions the flower basket 701, improving the stability of the connection between the bracket 801 and the flower basket structure 7. Then, the hydraulic cylinder 902 retracts, causing the suspension structure 8 and the basket structure 7 to move upward, separating the basket 701 from the positioning block 510. The linear motor 10 then drives the feeding structure 9 to move horizontally, conveying the basket structure 7 above the cleaning tank 3. The hydraulic cylinder 902 extends, causing the pull rod 802 to move downward. The pull rod 802 drives the hanging frame 801 to place the basket structure 7 into the cleaning tank 3. When the hanging frame 801 is not in contact with the connecting rod 702, the overall weight of the hanging frame 801 decreases. The spring 803 drives the hanging frame 801 to separate from the wheel frame 804. The pull rod 802 on the wheel frame 804 slides between itself and the hanging frame 801. During the movement of the wheel frame 804, it drives the gear 80... 8 moves downward, gear 808 and wheel frame 804 rotate, gear 808 drives rack 805 to move upward, rack 805 drives limit block 807 to separate from slot 704. Cleaning tank 3 is made of high-purity polytetrafluoroethylene (PTFE) or perfluoroalkoxyalkane (PFA). The tank body is designed with an "overflow prevention + inclined bottom" structure. Drainage / discharge port (equipped with corrosion-resistant valve) is provided at the bottom. PFA material spray head can be installed on the side wall of cleaning tank 3 to spray high-pressure diluted sulfuric acid or ultrapure water (UPW) for cleaning the inner wall of the cleaning tank or pre-wetting the wafer surface to avoid local contaminant accumulation and remove organic contaminants (such as photoresist residue, polymer, grease, etc.) and some metal impurities from the surface of wafer 11. After cleaning, the conveyor table 502 is not sealed to the drying tank 4. It is connected to the hanging basket structure 7 through the suspension structure 8. The linear motor 10 drives the feeding structure 9 to move horizontally, conveying the basket structure 7 into the drying tank 4. The motor 503 rotates, driving the drive rod 505 to rotate. The drive shaft 512 at the end of the drive rod 505 slides in the transmission groove 511. The drive shaft 512 drives the transmission rod 506, causing the conveyor table 502 to slide on the guide rod 501. The conveyor table 502 drives the spray pipe 602 and the nozzle 603 to move, positioning the spray pipe 602 above the wafer 11. Because the first sealing ring 508 and the second sealing ring 509 are inclined, when the first sealing ring 508 and the second sealing ring 509 come into contact, the drying tank 4 is sealed, creating a closed environment for subsequent drying operations. High-temperature isopropanol enters the conveying pipe 601 from the equipment, and then is sprayed into the drying tank 4 from the nozzle 603 through the spray pipe 602. The drying tank 4 is equipped with pipes to handle the high-temperature isopropanol vapor that evaporates during the drying process. The conveying structure 5 can not only convey the basket structure 7, but also seal the drying box 3. The structure is simple and convenient, occupies little space, and improves the conveying efficiency of the wafer 11.

[0029] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0030] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor silicon wafer loading and unloading device, characterized in that, The application relates to a wafer cleaning machine and a supporting table arranged in the wafer cleaning machine, wherein a cleaning tank is arranged on the supporting table, a conveying structure for conveying a wafer basket structure is arranged on the supporting table, the wafer basket structure is arranged in the wafer basket structure, a drying structure is arranged on the conveying structure, and a drying tank is arranged at the bottom end of the supporting table. A linear motor is arranged at the top end of the wafer cleaning machine, the linear motor drives a feeding structure to move, a hanging structure is arranged at the bottom end of the feeding structure, the hanging structure comprises a hanging frame and a pull rod, the pull rod is fixed on the feeding structure, the pull rod is slidably connected with the hanging frame, the hanging frame is slidably connected with a connecting rod in the wafer basket structure, a wheel frame is fixed at the bottom end of the pull rod, a spring piece is arranged between the wheel frame and the hanging frame, a gear is rotatably connected to the wheel frame, a slide rod is fixed on one side of the hanging frame, the slide rod is slidably connected with a rack, the gear is meshed with the rack, a limiting block is fixed at the bottom end of the rack, and the limiting block is clamped in a clamping groove in the wafer basket structure.

2. The semiconductor silicon wafer feeding and discharging device according to claim 1, characterized in that: The wafer basket structure comprises a wafer basket and a connecting rod, the connecting part of the hanging frame and the connecting rod is in L-shaped structure, the connecting rod is arranged between two wafer baskets, and a plurality of wafers are arranged in the wafer basket.

3. The semiconductor silicon wafer feeding and discharging device according to claim 2, characterized in that: A through hole is arranged at the bottom end of the wafer basket, a clamping groove is arranged on the wafer basket, and the limiting block is clamped in the clamping groove.

4. The semiconductor silicon wafer feeding and discharging device according to claim 1, characterized in that: The feeding structure comprises a hydraulic cylinder and a suspension frame, the suspension frame is fixed on the sliding seat of the linear motor, the hydraulic cylinder is arranged in the suspension frame, and the hydraulic cylinder is fixed with the pull rod.

5. The semiconductor silicon wafer feeding and discharging device according to claim 4, characterized in that: Guide rods II are fixed on the hanging ears at the top end of the hanging frame, the guide rods II are slidably connected with guide sleeves, and the guide sleeves are fixed on the two sides of the suspension frame.

6. The semiconductor silicon wafer feeding and discharging device according to claim 1, characterized in that: The conveying structure comprises guide rods I and a conveying table, two guide rods I are fixed on the supporting table, and the conveying table is slidably arranged on the guide rods I; four L-shaped positioning blocks are fixed on the conveying table, and a receiving cavity is arranged at the bottom end of the conveying table.

7. The semiconductor silicon wafer feeding and discharging device according to claim 6, characterized in that: A transmission rod is fixed on one side of the conveying table, a transmission groove is arranged on the transmission rod, a driving shaft is slidably arranged in the transmission groove, the driving shaft is rotatably connected with a driving rod, the side, away from the driving shaft, of the driving rod is fixed on the output shaft of a motor, and the motor is fixed on the supporting table through a mounting frame. 8.The semiconductor silicon wafer feeding and discharging device according to claim 7, characterized in that: A connecting frame is fixed at the bottom end of the supporting table, a drying tank is fixed at the bottom end of the connecting frame, a second sealing ring is fixed at the top end of the connecting frame, and an inclined first sealing ring is fixed at the bottom end of the conveying table.

9. The semiconductor silicon wafer feeding and discharging device according to claim 7, characterized in that: The drying structure comprises spray pipes, a plurality of spray pipes are arranged in the receiving cavity, spray heads are arranged on the spray pipes, a conveying pipe is fixed on the conveying table, and the conveying pipe is connected with the spray pipes.

10. The loading and unloading method of the semiconductor silicon wafer loading and unloading device according to any one of claims 1-9, characterized in that: The application further discloses a wafer cleaning method comprising the following steps: S1: storing wafers in the wafer basket structure, conveying the wafer basket structure into the wafer cleaning machine through the conveying structure; S2: driving the hanging structure to move up and down through the feeding structure, hanging the wafer basket structure through the hanging structure, and driving the feeding structure to move horizontally through the linear motor, so that the wafer basket structure moves in the cleaning tank and the drying tank; S3: When the wafer is cleaned in the cleaning tank, the feeding structure drives the suspension structure to take out the flower basket in the cleaning tank, the linear motor drives the feeding structure to move horizontally, so that the flower basket structure moves from the cleaning tank to the drying tank, when the flower basket structure drives the wafer into the drying tank, the conveying structure seals the drying tank, and the drying structure dries the wafer in the drying tank.

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