A high-precision alignment method and device for a glass substrate of a semiconductor package

Abstract

The application provides a glass substrate high-precision alignment method and device for semiconductor packaging, relates to the technical field of glass substrate alignment, and comprises the following steps: obtaining a system trigger signal; controlling a moving platform to move a glass substrate to a reference mark position based on the system trigger signal, and obtaining a moving completion signal; controlling a visual detection component to detect the glass substrate to obtain a reference mark image based on the moving completion signal; inputting the reference mark image into an edge detection algorithm to analyze and obtain reference mark coordinates; analyzing the reference mark image and the reference mark coordinates to obtain actual mark coordinates; inputting the actual mark coordinates into a rigid body transformation algorithm to analyze and obtain a plane offset; controlling a fixed height measurement component to measure the glass substrate to obtain a substrate warping parameter; correlating the plane offset and the substrate warping parameter to obtain final alignment data, and controlling a robot to perform posture adjustment according to the final alignment data. The application has the effect of ensuring to improve the alignment precision of the glass substrate.

Description

Technical Field

[0001] This application relates to the technical field of glass substrate alignment, and in particular to a high-precision alignment method and apparatus for glass substrates used in semiconductor packaging. Background Technology

[0002] The glass substrate alignment method refers to the method of accurately measuring the center offset and angular offset of the glass substrate before it is transferred from the wafer cassette to the process chamber, with the aim of ensuring that subsequent processes can be performed in the correct position.

[0003] In related technologies, glass substrate alignment methods typically involve controlling a robot to place the glass substrate on a high-speed rotating chuck, scanning its edges with an optical sensor as the glass substrate rotates, and calculating the center coordinates and rotation angle of the glass substrate by identifying feature points of V-shaped notches or flat edges on the glass substrate's edges.

[0004] Regarding the aforementioned technologies, optical sensors scan the edges of a glass substrate as it rotates. However, if the glass substrate is opaque, its visibility is low, making it impossible to effectively identify feature points, which leads to a decrease in the alignment accuracy of the glass substrate. There is still room for improvement. Summary of the Invention

[0005] To ensure improved alignment accuracy of glass substrates, this application provides a high-precision alignment method and apparatus for glass substrates used in semiconductor packaging.

[0006] In a first aspect, this application provides a high-precision alignment method for glass substrates used in semiconductor packaging, employing the following technical solution:

[0007] A high-precision alignment method for glass substrates used in semiconductor packaging includes:

[0008] Obtain system trigger signals;

[0009] Based on the system trigger signal, the preset moving platform is controlled to move the preset glass substrate to the preset reference mark position and obtain the moving completion signal;

[0010] The glass substrate is inspected by a vision inspection component controlled by the motion completion signal to generate a reference mark image;

[0011] The reference marker image is input into a preset edge detection algorithm for analysis to determine the reference marker coordinates;

[0012] The reference marker image and reference marker coordinates are analyzed to determine the actual marker coordinates;

[0013] The actual marked coordinates are input into a preset rigid body transformation algorithm for analysis to determine the plane offset;

[0014] The preset fixed height measuring component is controlled to measure the glass substrate in order to determine the substrate warpage parameters;

[0015] The plane offset and substrate warpage parameters are correlated to generate final alignment data, and the preset robot is controlled to adjust its posture based on the final alignment data.

[0016] By adopting the above technical solution, the mobile platform is controlled to move the glass substrate to the reference mark position. The vision inspection component is controlled to detect the glass substrate and generate a reference mark image. The reference mark image is then input into the edge detection algorithm for analysis to determine the reference mark coordinates. The reference mark image and reference mark coordinates are analyzed to determine the actual mark coordinates. The actual mark coordinates are then input into the rigid body transformation algorithm for analysis to determine the plane offset. The fixed height measurement component is controlled to measure the glass substrate to determine the substrate warping parameters. The plane offset and substrate warping parameters are then correlated to generate the final alignment data. Based on the final alignment data, the robot is controlled to adjust its posture. When the glass substrate is opaque, the reference mark coordinates are corrected, thereby effectively identifying feature points. This allows the robot to accurately adjust its posture for safe gripping during the next grasping operation, ensuring improved alignment accuracy of the glass substrate.

[0017] Optionally, the step of analyzing the reference marker image and reference marker coordinates to determine the actual marker coordinates includes:

[0018] Obtain the image pixel values ​​of the baseline marker image;

[0019] Image pixel values ​​are weighted and summed according to preset channel weight parameters to generate grayscale pixel values;

[0020] Calculate the mean value of grayscale pixels to generate the average brightness of the image;

[0021] Determine whether the average brightness of the image is greater than the preset standard average brightness;

[0022] If it is greater than, then the reference marker coordinates are defined as the actual marker coordinates;

[0023] If it is not greater than, then the coordinates of the reference mark are analyzed to determine the actual mark coordinates.

[0024] By adopting the above technical solution, grayscale pixel values ​​are generated by weighted summation of image pixel values ​​according to channel weight parameters. After calculating the mean of grayscale pixel values, the average brightness of the image is generated. When the average brightness of the image is greater than the standard average brightness, the reference mark coordinates are directly defined as the actual mark coordinates. If it is not greater, the actual mark coordinates are determined after analyzing the reference mark coordinates. Thus, the transparency of the glass substrate is determined based on the average brightness of the image. Furthermore, when the glass substrate is opaque, the reference mark coordinates are corrected to improve the alignment accuracy of the glass substrate.

[0025] Optionally, the step of analyzing the reference marker coordinates to determine the actual marker coordinates includes:

[0026] Determine the reference horizontal and vertical coordinates based on the reference mark coordinates;

[0027] Calculate the sum of the baseline x-coordinate and the preset lateral offset value to generate the actual x-coordinate;

[0028] Calculate the sum of the baseline ordinate and the preset longitudinal offset value to generate the actual ordinate;

[0029] Associate the actual x-coordinate and the actual y-coordinate to generate the actual marked coordinates.

[0030] By adopting the above technical solution, the reference horizontal coordinate and reference vertical coordinate are determined based on the reference mark coordinates. After calculating the sum of the reference horizontal coordinate and the horizontal offset value, the actual horizontal coordinate is generated. After calculating the sum of the reference vertical coordinate and the vertical offset value, the actual vertical coordinate is generated. Thus, the actual mark coordinates are generated by associating the actual horizontal coordinate and the actual vertical coordinate. Therefore, when the glass is opaque, the reference horizontal coordinate and the reference vertical coordinate are corrected according to the systematic offset caused by the opaque glass, thereby enabling the vision inspection component to effectively identify the position coordinates of the reference mark.

[0031] Optionally, the step of controlling a preset fixed height measuring component to measure the glass substrate to determine the substrate warpage parameters includes:

[0032] Obtain the property parameters of the glass substrate and the diameter of the laser beam;

[0033] The property parameters of the glass substrate and the diameter of the laser beam are analyzed to determine the safe laser power;

[0034] The glass substrate is measured using a fixed height measuring component controlled by a safe laser power to determine the glass measurement parameters, and the glass measurement parameters are analyzed to determine the spatial plane equation.

[0035] The glass measurement parameters and spatial plane equations are input into a preset warp parameter calculation unit for analysis to generate substrate warp parameters.

[0036] By adopting the above technical solution, the safe laser power is determined after analyzing the property parameters of the glass substrate and the laser beam diameter. The glass measurement parameters are determined after controlling the fixed height measuring component according to the safe laser power to control the glass substrate. The spatial plane equation is then determined after analyzing the glass measurement parameters. The glass measurement parameters and the spatial plane equation are then input into the warping parameter calculation unit for analysis to generate the substrate warping parameters. The safe laser power is then used to measure the glass substrate to obtain accurate glass measurement data, thereby obtaining a spatial plane equation that can represent the glass substrate, thus improving the alignment accuracy of the glass substrate.

[0037] Optionally, the steps of analyzing the glass substrate properties and laser beam diameter to determine the safe laser power include:

[0038] Determine the glass substrate density, glass substrate thickness, and glass substrate specific heat capacity based on the glass substrate property parameters.

[0039] Calculate the product of glass substrate density, glass substrate thickness, and laser beam diameter to generate the substrate heating mass;

[0040] Calculate the product of the substrate heating mass, the specific heat capacity of the glass substrate, and the preset safe temperature rise value to generate safe temperature rise energy;

[0041] Calculate the quotient of the safe temperature rise energy and the preset standard irradiation time to generate safe laser power.

[0042] By adopting the above technical solution, the glass substrate density, thickness, and specific heat capacity are determined based on the glass substrate's property parameters. The substrate heating mass is generated by calculating the product of the glass substrate density, thickness, and laser beam diameter. The safe temperature rise energy is generated by calculating the product of the substrate heating mass, specific heat capacity, and safe temperature rise value. The safe laser power is then generated by calculating the quotient of the safe temperature rise energy and the standard irradiation time. Thus, under the condition of determining the safe temperature rise value, the safe laser power is determined based on the energy required for the glass substrate to reach the safe temperature rise value. This avoids thermal expansion of the glass substrate due to the heat generated by the laser, thereby ensuring the effect of improving the alignment accuracy of the glass substrate.

[0043] Optionally, the steps of measuring the glass substrate using a fixed height-measuring assembly controlled by a safe laser power to determine the glass measurement parameters, and analyzing these parameters to determine the spatial plane equation, include:

[0044] The fixed height measuring component, controlled by a safety laser power, measures preset measurement points to generate glass measurement parameters.

[0045] Determine the reference vertical height based on the glass measurement parameters;

[0046] Obtain the horizontal coordinates of the measurement point;

[0047] The spatial plane equation of the glass substrate is generated by fitting a preset least squares method based on the horizontal coordinates and the reference vertical height.

[0048] By adopting the above technical solution, the glass measurement parameters are generated after the fixed height measuring component is measured according to the safety laser power control. The reference vertical height is determined according to the glass measurement parameters. Then, the spatial plane equation of the glass substrate is generated by fitting the least squares method according to the horizontal coordinate and the reference vertical height. Thus, a spatial plane equation that can represent the plane where the glass substrate is located is obtained. Then, the warping parameters of the glass substrate are determined according to the spatial plane equation, so as to facilitate the subsequent control of the robot to adjust the posture.

[0049] Optionally, the steps of measuring the glass substrate using a fixed height-measuring assembly controlled by a safe laser power to determine the glass measurement parameters, and analyzing these parameters to determine the spatial plane equation, include:

[0050] The fixed height measuring component, controlled by a safety laser power, scans the glass substrate along a preset scanning path to determine the glass measurement parameters.

[0051] Determine the warpage detection coordinates based on the glass measurement parameters;

[0052] The spatial plane equation of the glass substrate is generated by fitting a preset least squares method based on the warp detection coordinates.

[0053] By adopting the above technical solution, the glass substrate is scanned along the scanning path by a fixed height measuring component controlled by a safe laser power to determine the glass measurement parameters. The warpage detection coordinates are then determined based on the glass measurement parameters. The spatial plane equation of the glass substrate is then generated by fitting the warpage detection coordinates using the least squares method. By scanning the glass substrate, the contour data of the glass substrate is obtained, and the warpage parameters of the glass substrate are determined through the spatial plane equation, so as to facilitate the subsequent control of the robot to adjust its posture.

[0054] Secondly, this application provides a high-precision alignment device for glass substrates used in semiconductor packaging, employing the following technical solution:

[0055] A high-precision alignment device for a glass substrate in semiconductor packaging includes a base for mounting, a moving platform for driving the glass substrate, an integrated optical measurement module for measuring the glass substrate, and a control system for controlling the moving platform and the integrated optical measurement module.

[0056] The control system is electrically connected to the mobile platform and the integrated optical measurement module;

[0057] The mobile platform is mounted on a base. The mobile platform includes a Y-axis module responsible for movement in the Y-axis direction, an X-axis module responsible for movement in the X-axis direction, and a rotation module responsible for rotation. The X-axis module is mounted on the Y-axis module, and the rotation module is mounted on the X-axis module.

[0058] The rotating module is provided with a follow-up support assembly for supporting the glass substrate. The follow-up support assembly includes a plurality of kinematic pillars, and the glass substrate is placed on the kinematic pillars.

[0059] The integrated optical measurement module is mounted on the base. The integrated optical measurement module includes a vision inspection component and a fixed height measurement component. The vision inspection component includes a column and an industrial camera. The column is mounted on the base, and the industrial camera is mounted on the top of the column. The industrial camera is used to capture images of the glass substrate.

[0060] The fixed height measurement component includes a bracket and a laser displacement sensor. The bracket is mounted on a base, and the laser displacement sensor is mounted on the bracket. The laser displacement sensor is used to measure the distance from the glass substrate to the laser displacement sensor.

[0061] By adopting the above technical solution, the control system drives the glass substrate to move to the reference mark position by controlling the mobile platform, thereby controlling the industrial camera in the vision inspection component to capture an image of the glass substrate, and controlling the laser displacement sensor in the fixed height measurement component to emit a laser to measure the distance from the glass substrate to the laser displacement sensor. In this way, the distance of the glass substrate passing over the lower surface of the glass substrate above the laser displacement sensor is measured in a non-contact manner, thereby determining the planar offset and warping parameters of the glass substrate. This effectively identifies feature points, enabling the robot to accurately adjust its posture for safe gripping during the next gripping operation, thus ensuring improved alignment accuracy of the glass substrate.

[0062] In summary, this application includes at least one of the following beneficial technical effects:

[0063] 1. By controlling the mobile platform to move the glass substrate to the reference mark position, the vision inspection component detects the glass substrate and generates a reference mark image. The reference mark image is then input into the edge detection algorithm for analysis to determine the reference mark coordinates. After analyzing the reference mark image and the reference mark coordinates, the actual mark coordinates are determined. The actual mark coordinates are then input into the rigid body transformation algorithm for analysis to determine the plane offset. The fixed height measurement component measures the glass substrate to determine the substrate warping parameters. The plane offset and substrate warping parameters are then correlated to generate the final alignment data. Based on the final alignment data, the robot is controlled to adjust its posture. When the glass substrate is opaque, the reference mark coordinates are corrected, thus effectively identifying feature points. This allows the robot to accurately adjust its posture for safe gripping during the next grasping operation, thereby improving the alignment accuracy of the glass substrate.

[0064] 2. Grayscale pixel values ​​are generated by weighted summation of image pixel values ​​according to channel weight parameters. The average brightness of the image is generated after calculating the mean of the grayscale pixel values. When the average brightness of the image is greater than the standard average brightness, the reference mark coordinates are directly defined as the actual mark coordinates. If it is not greater, the actual mark coordinates are determined after analyzing the reference mark coordinates. Thus, the transparency of the glass substrate is determined based on the average brightness of the image. When the glass substrate is opaque, the reference mark coordinates are corrected to improve the alignment accuracy of the glass substrate.

[0065] 3. By determining the glass substrate density, thickness, and specific heat capacity based on its property parameters, the substrate heating mass is generated by calculating the product of the glass substrate density, thickness, and laser beam diameter. The safe temperature rise energy is generated by calculating the product of the substrate heating mass, specific heat capacity, and safe temperature rise value. The safe laser power is then generated by calculating the quotient of the safe temperature rise energy and the standard irradiation time. Thus, under the condition of determining the safe temperature rise value, the safe laser power is determined based on the energy required for the glass substrate to reach the safe temperature rise value. This avoids thermal expansion of the glass substrate due to the heat generated by the laser, thereby ensuring the effect of improving the alignment accuracy of the glass substrate. Attached Figure Description

[0066] Figure 1 This is a flowchart of a high-precision alignment method for glass substrates used in semiconductor packaging, as described in an embodiment of this application.

[0067] Figure 2 This is a flowchart of the steps in this application embodiment to analyze the reference marker image and reference marker coordinates to determine the actual marker coordinates.

[0068] Figure 3 This is a flowchart of the steps in this application embodiment to analyze the coordinates of the reference marker to determine the actual marker coordinates.

[0069] Figure 4 This is a flowchart of the steps in this application embodiment to control a preset fixed height measuring component to measure the glass substrate in order to determine the substrate warpage parameters.

[0070] Figure 5 This is a flowchart illustrating the steps in this application embodiment to analyze the property parameters of the glass substrate and the diameter of the laser beam to determine the safe laser power.

[0071] Figure 6 This is a flowchart illustrating the steps in this application embodiment of measuring a glass substrate using a fixed height measuring component controlled by a safe laser power to determine glass measurement parameters, and analyzing these parameters to determine the spatial plane equation.

[0072] Figure 7 This is a flowchart illustrating the steps in this application embodiment of measuring a glass substrate using a fixed height measuring component controlled by a safe laser power to determine glass measurement parameters, and analyzing these parameters to determine the spatial plane equation.

[0073] Figure 8 This is an overall diagram of a high-precision alignment device for a glass substrate used in semiconductor packaging, as described in an embodiment of this application.

[0074] Figure 9 This is a structural diagram of the follow-up support component in the embodiments of this application.

[0075] Explanation of reference numerals in the attached drawings: 100, base; 200, follow-up support assembly; 210, kinematic support column; 300, moving platform; 310, X-axis module; 320, Y-axis module; 330, rotating module; 410, vision inspection assembly; 411, column; 412, industrial camera; 420, fixed height measurement assembly; 421, bracket; 422, laser displacement sensor; G, glass substrate. Detailed Implementation

[0076] To make the purpose, technical solution, and advantages of this application clearer, the following description is provided in conjunction with the appendix. Figures 1 to 9 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the application.

[0077] This application discloses a high-precision alignment method for glass substrates used in semiconductor packaging. Specifically, it discloses a mobile platform 300, a vision inspection component 410, a fixed height measurement component 420, and a robot. A processing terminal is communicatively connected to the mobile platform 300, the vision inspection component 410, the fixed height measurement component 420, and the robot to achieve data interaction and control. After receiving a system trigger signal, the processing terminal controls the mobile platform 300 to move the glass substrate G to a reference mark position. The vision inspection component 410 then inspects the glass substrate G and generates a reference mark image. This reference mark image is then input into an edge detection algorithm for analysis to determine the reference mark coordinates. After analyzing the reference mark image and reference mark coordinates, the actual mark coordinates are determined. These actual mark coordinates are then input into the rigid body transformation algorithm for further analysis to determine the planar offset. The fixed height measuring component 420 is then controlled to measure the glass substrate G to determine the substrate warpage parameters. Finally, the planar offset and substrate warpage parameters are correlated to generate the final alignment data. Based on the final alignment data, the robot is controlled to adjust its posture. When the glass substrate G is opaque, the reference mark coordinates are corrected, thus effectively identifying feature points. This allows the robot to accurately adjust its posture for safe gripping during the next grasping operation, thereby improving the alignment accuracy of the glass substrate G.

[0078] Reference Figure 1 This application discloses a high-precision alignment method for glass substrates used in semiconductor packaging, comprising the following steps:

[0079] Step 100: Obtain the system trigger signal.

[0080] Among them, the system trigger signal refers to the system's trigger signal, which is triggered by the operator to activate the system's start switch, thereby sending the level signal representing the system trigger signal to the processing terminal, providing the start conditions for the mobile platform 300.

[0081] Step 101: Based on the system trigger signal, control the preset moving platform to move the preset glass substrate to the preset reference mark position, and obtain the moving completion signal.

[0082] In this process, after the system trigger signal is determined, the processing terminal responds to the system trigger signal and controls the mobile platform 300 to move the glass substrate G to the reference mark position. By driving the glass substrate G to find the probe, the vibration and dust generation problems caused by the traditional mobile probe are solved, so as to facilitate the subsequent determination of the reference mark image.

[0083] The mobile platform 300 refers to a device installed above the base 100, used to support and drive the glass substrate G to move and rotate omnidirectionally in the horizontal plane. It adopts a stacked design, including a Y-axis module 320 that moves in the Y-axis direction, an X-axis module 310 stacked on the Y-axis module 320, and a rotation module 330 located on the top layer. Among them, the base 100 refers to the bottom base, which is the mounting foundation of the entire device.

[0084] Glass substrate G refers to a rectangular or square glass substrate used for semiconductor packaging. The specific model is determined by the operator based on the actual situation.

[0085] The reference mark position refers to the pre-marked position on the glass substrate G that needs to be aligned, which is determined in advance by the operator. By determining the reference mark position, the moving platform 300 is controlled to move the glass substrate G to the marked position, so as to facilitate the subsequent determination of the reference mark image.

[0086] The movement completion signal refers to the signal indicating that the movement operation of the moving platform 300 is complete. It is obtained by the moving platform 300 sending a level signal representing the movement completion signal to the processing terminal after completing the movement operation. By determining the movement completion signal, it is confirmed that the glass substrate G has been moved to the reference mark position, facilitating subsequent determination of the reference mark image.

[0087] Step 102: Based on the motion completion signal, control the preset visual inspection component to inspect the glass substrate to generate a reference mark image.

[0088] After the movement completion signal is determined, the processing terminal responds to the movement completion signal by controlling the vision detection component 410 to take a picture of the glass substrate G and generate a reference mark image, so as to determine the coordinates of the reference mark in the future.

[0089] The visual inspection component 410 refers to a device for capturing images of the glass substrate G, including a column 411 and an industrial camera 412. The column 411 is fixed to one side of the base 100, avoiding the range of motion of the moving platform 300, and a cantilever structure extends from the top to mount the industrial camera 412. The camera lens is vertically downward, thereby capturing images of the reference marks.

[0090] The reference mark image refers to a small-area image including the location of the reference mark, obtained by the processing terminal controlling the vision inspection component 410 to capture an image of the glass substrate G. By determining the reference mark image, the coordinates of the reference mark are determined, thereby providing data support for subsequently determining the coordinates of the actual mark.

[0091] Step 103: Input the reference marker image into the preset edge detection algorithm for analysis to determine the reference marker coordinates.

[0092] The reference mark coordinates refer to the coordinates of the reference marks on the glass substrate G, which are obtained by the processing terminal after inputting the reference mark image into the edge detection algorithm for analysis. By determining the reference mark coordinates, the specific position coordinates of the reference marks on the glass substrate G are determined, so as to facilitate subsequent correction of the reference mark coordinates and thus improve the alignment accuracy of the glass substrate G.

[0093] Edge detection algorithms are used to process reference marker images to obtain reference marker coordinates. First, the color image is converted to grayscale, and the gradient intensity and direction of each pixel in the reference marker image are calculated. The pixel with the largest gradient intensity is retained as a potential edge point, and a threshold is applied to extract the edge pixels of the reference marker. Then, these edge pixels are connected to form a closed contour, and the coordinates of the center point of the closed contour are calculated to obtain the reference marker coordinates.

[0094] Step 104: Analyze the reference mark image and reference mark coordinates to determine the actual mark coordinates.

[0095] The actual marker coordinates refer to the coordinates obtained after correcting the reference marker coordinates based on whether the glass substrate G is transparent. These coordinates are obtained by the processing terminal after analyzing the reference marker image and the reference marker coordinates. For specific methods, please refer to... Figure 2 The steps involve determining the actual marker coordinates to avoid systematic offsets caused by the opacity of the glass substrate G, thereby ensuring improved alignment accuracy of the glass substrate G.

[0096] Step 105: Input the actual marked coordinates into the preset rigid body transformation algorithm for analysis to determine the plane offset.

[0097] The planar offset refers to the offset of the glass substrate G relative to the initial position of the moving platform 300, including the X-axis translation value, the Y-axis translation value, and the rotation angle around the Z-axis. It is obtained by the processing terminal after inputting the actual marked coordinates into the rigid body transformation algorithm for analysis. By determining the planar offset, the offset of the glass substrate G relative to the target position is determined, which facilitates the subsequent determination of the final alignment data and improves the alignment accuracy of the glass substrate G.

[0098] Rigid body transformation algorithm refers to an algorithm used to calculate planar offset. It stores the target coordinates corresponding to the reference marker coordinates. A transformation model is established using the reference marker coordinates and the target coordinates, and the optimal transformation parameters are solved, including rotation angle and translation vector. The rotation angle is the rotation angle around the Z-axis, and the translation vectors are the X-axis translation value and the Y-axis translation value, respectively.

[0099] Step 106: Control the preset fixed height measuring component to measure the glass substrate to determine the substrate warpage parameters.

[0100] The substrate warpage parameter refers to the longitudinal warpage parameter of the glass substrate G relative to the target position, including the Z-axis height offset, the tilt angle around the X-axis, and the tilt angle around the Y-axis. This parameter is obtained by the processing terminal controlling the fixed height measurement component 420 to measure the glass substrate G. The specific method is described in [reference needed]. Figure 4 The steps involve determining the substrate warpage parameters to ascertain the longitudinal deviation of the glass substrate G relative to the target position. This facilitates subsequent posture adjustment by the robot, thereby ensuring improved alignment accuracy of the glass substrate G.

[0101] The fixed height measuring component 420 refers to a device used to measure the height information of the glass substrate G, including multiple laser displacement sensors 422 and their brackets 421. The bracket 421 is fixed on the base 100 and located in the peripheral gap of the moving platform 300. The probes of the laser displacement sensors 422 face upward, and the distance passing over the lower surface of the glass substrate G is measured in a non-contact manner.

[0102] Step 107: Associate the plane offset and substrate warping parameters to generate final alignment data, and control the preset robot to adjust its posture based on the final alignment data.

[0103] After determining the substrate warpage parameters, the terminal associated plane offset and substrate warpage parameters are processed to generate final alignment data. Based on the final alignment data, the robot is controlled to adjust its posture so that the robot's end effector perfectly fits the warped glass substrate G surface, thereby enabling the safe gripping of the glass substrate G in the next operation.

[0104] Final alignment data refers to the alignment data used to adjust the robot's posture, which is obtained by processing the terminal to correlate the plane offset and the substrate warping parameters. By determining the final alignment data, the robot can be controlled to adjust its posture according to the final alignment data, so that it can perfectly fit the warped surface of the glass substrate G when it grasps the glass substrate G again.

[0105] A robot is a mechanical device used to grasp a glass substrate G. Its end effector is connected to the end of the robot. After the robot receives the final alignment data, the end effector will not only translate and rotate, but also adjust its Z-axis height and tilt posture, thereby achieving safe grasping of the glass substrate G and ensuring the effect of improving the alignment accuracy of the glass substrate G.

[0106] Reference Figure 2 The steps for analyzing the reference marker image and reference marker coordinates to determine the actual marker coordinates include:

[0107] Step S200: Obtain the image pixel values ​​of the reference marker image.

[0108] The image pixel value refers to the color quantization value of the reference marker image, which is read from the reference marker image information by the processing terminal. By determining the image pixel value, the three-channel pixel values ​​are converted into single-channel values, providing data support for subsequent determination of grayscale pixel values.

[0109] Step S201: The image pixel values ​​are weighted and summed according to the preset channel weight parameters to generate grayscale pixel values.

[0110] Here, the grayscale pixel value refers to the luminance quantization value of the reference marker image, which is obtained by the processing terminal through a weighted sum of the image pixel values ​​according to the channel weight parameters. By determining the grayscale pixel value, the three-dimensional color information is compressed into one-dimensional luminance information, which facilitates the subsequent determination of the image's average luminance.

[0111] Channel weight parameters refer to the weighting parameters that map the three-channel color values ​​of the reference marker image to single-channel brightness values. For example, the weight of the red channel is 0.299, the weight of the green channel is 0.587, and the weight of the blue channel is 0.114, which are pre-set by the operator. By determining the channel weight parameters, grayscale distortion caused by average weighting is avoided, thereby preserving the brightness information of the reference marker image to the greatest extent and providing data support for determining grayscale pixel values.

[0112] Step S202: Calculate the mean value of grayscale pixels to generate the average brightness of the image.

[0113] The average image brightness refers to the average brightness of the reference mark image, which is obtained by the processing terminal after calculating the average value of grayscale pixels. By determining the average image brightness, it is determined whether the average brightness of the reference mark image is within the range of transparent glass, and then the coordinates of the reference mark are corrected to ensure the effect of improving the alignment accuracy of the glass substrate G.

[0114] Step S203: Determine whether the average brightness of the image is greater than the preset standard average brightness.

[0115] The standard average brightness refers to the brightness threshold used to determine whether the glass substrate G is a transparent glass substrate, and it is set in advance by the operator. By judging whether the average brightness of the image is greater than the standard average brightness, it is determined whether the glass substrate G is an opaque substrate, so as to determine the actual marker coordinates in the subsequent process.

[0116] Step S2031: If it is greater than, then define the reference mark coordinates as the actual mark coordinates.

[0117] If the average brightness of the image is greater than the standard average brightness, it indicates that the glass substrate G is a transparent substrate. In this case, the reference mark coordinates can be effectively identified. Therefore, the processing terminal directly defines the reference mark coordinates as the actual mark coordinates, providing data support for the subsequent determination of the plane offset.

[0118] Step S2032: If it is not greater than, then analyze the coordinates of the reference mark to determine the actual mark coordinates.

[0119] If the average brightness of the image is not greater than the standard average brightness, it indicates that the glass substrate G is opaque. In this case, the reference marker coordinates cannot be effectively identified. Therefore, the processing terminal analyzes the reference marker coordinates to obtain the actual marker coordinates. The specific method is described in [reference needed]. Figure 3 The steps are as follows: By determining the actual mark coordinates, the reference mark coordinates are corrected when the glass substrate G is opaque glass, so as to ensure the effect of improving the alignment accuracy of the glass substrate G.

[0120] The actual marker coordinates in this step are the same as those in step S2031. The difference is that the actual marker coordinates in this step are obtained by the processing terminal after analyzing the reference marker coordinates.

[0121] Reference Figure 3 The steps for analyzing the coordinates of the reference markers to determine the actual marker coordinates include:

[0122] Step S300: Determine the reference horizontal coordinate and reference vertical coordinate based on the reference mark coordinates.

[0123] The reference horizontal coordinate refers to the horizontal coordinate of the reference mark position, which is identified and retrieved by the processing terminal from the reference mark coordinates. By determining the reference horizontal coordinate, the horizontal coordinate of the detected reference mark position is determined, and then the reference horizontal coordinate is corrected to compensate for the coordinate position offset caused by the opaque glass.

[0124] The reference ordinate refers to the horizontal ordinate of the reference mark position, which is identified and retrieved by the processing terminal from the reference mark coordinates. By determining the reference ordinate, the horizontal ordinate of the detected reference mark position is determined, and then the reference ordinate is corrected to compensate for the coordinate position offset caused by the opaque glass.

[0125] Step S301: Calculate the sum of the reference horizontal coordinate and the preset horizontal offset value to generate the actual horizontal coordinate.

[0126] The actual abscissa refers to the coordinate obtained after correcting the reference abscissa based on the systematic offset caused by the opaque glass. It is calculated by the processing terminal as the sum of the reference abscissa and the lateral offset value. By determining the actual abscissa, the recognition accuracy of the abscissa of the reference mark is improved when the glass substrate G is opaque glass.

[0127] The lateral offset value refers to the systematic lateral offset caused by the opaque glass, which is preset by the operator. By determining the lateral offset value, the reference horizontal coordinate can be corrected, thereby improving the recognition accuracy of the reference mark position.

[0128] Step S302: Calculate the sum of the reference ordinate and the preset longitudinal offset value to generate the actual ordinate.

[0129] The actual ordinate refers to the coordinate obtained after correcting the reference ordinate based on the systematic offset caused by the opaque glass. It is calculated by the processing terminal as the sum of the reference ordinate and the longitudinal offset value. By determining the actual ordinate, the recognition accuracy of the ordinate of the reference mark is improved when the glass substrate G is opaque glass.

[0130] The longitudinal offset value refers to the systematic longitudinal offset caused by the opaque glass, which is preset by the operator. By determining the longitudinal offset value, the reference ordinate can be corrected, thereby improving the accuracy of the reference mark position recognition.

[0131] Step S303: Associate the actual x-coordinate and the actual y-coordinate to generate the actual marker coordinates.

[0132] In this process, after determining the actual vertical coordinate, the processing terminal associates the actual horizontal and vertical coordinates to generate the actual marker coordinates. By determining the actual marker coordinates, when the glass substrate G is opaque, the horizontal and vertical coordinates are corrected to offset the systematic offset caused by the opaque glass, thereby ensuring and improving the alignment accuracy of the glass substrate G.

[0133] Reference Figure 4 The steps for controlling a preset fixed height measuring component to measure the glass substrate to determine the substrate warpage parameters include:

[0134] Step S400: Obtain the glass substrate property parameters and laser beam diameter.

[0135] The attribute parameters of the glass substrate G refer to the properties related to the glass substrate G, including its density, thickness, and specific heat capacity, which can be found in the product specifications provided by the manufacturer. The glass substrate density and thickness are strongly correlated with the substrate's temperature rise mass; the higher the density and thickness, the larger the volume of laser irradiation on the glass substrate G. Conversely, a higher specific heat capacity indicates that the glass substrate G requires to absorb more energy, thus providing data support for determining the safe temperature rise energy.

[0136] The laser beam diameter refers to the diameter of the laser beam emitted by the fixed height measuring component 420, which is obtained by the operator using a laser beam analyzer to detect the laser beam. By determining the laser beam diameter, the irradiation area of ​​the laser beam can be determined, providing data support for subsequent determination of the substrate temperature rise quality.

[0137] Step S401: Analyze the property parameters of the glass substrate and the diameter of the laser beam to determine the safe laser power.

[0138] Among them, the safe laser power refers to the laser power that will not cause thermal expansion to the glass substrate G. It is obtained by the processing terminal after analyzing the property parameters of the glass substrate G and the laser beam diameter. The specific method is described in [reference needed]. Figure 5 The steps involve determining a safe laser power that will not cause thermal expansion to the glass substrate G, thereby improving the accuracy of the data detected by the fixed height measuring component 420, and thus ensuring the effect of improving the alignment accuracy of the glass substrate G.

[0139] Step S402: The glass substrate is measured by the fixed height measuring component controlled by the safe laser power to determine the glass measurement parameters, and the glass measurement parameters are analyzed to determine the spatial plane equation.

[0140] After determining the safe laser power, the processing terminal controls the fixed height measuring component 420 to measure the glass substrate G according to the safe laser power, and then determines the glass measurement parameters. After analyzing the glass measurement parameters, the spatial plane equation is determined, thereby determining the equation representing the overall plane of the glass substrate G, so as to facilitate the subsequent determination of the substrate warpage parameters.

[0141] The glass measurement parameters refer to a series of parameters obtained by the fixed height measuring component 420, including the reference vertical height, warpage detection coordinates, and laser reflection intensity. These parameters are obtained by the fixed height measuring component 420 measuring the glass substrate G under the control of the processing terminal. By determining the glass measurement parameters, the height parameters of the glass are determined, thereby providing data support for determining the spatial plane equation.

[0142] The spatial plane equation refers to the plane equation representing the overall plane of the glass substrate G. It is obtained by the processing terminal after analyzing the glass measurement parameters. For specific methods, please refer to [link / reference needed]. Figure 6 or Figure 7 The steps involve determining the spatial plane equation, thereby transforming the glass measurement parameters into a planar model that can describe the overall deformation trend of the glass substrate G. This facilitates the subsequent determination of the substrate warpage parameters, thereby ensuring the improvement of the alignment accuracy of the glass substrate G.

[0143] Step S403: Input the glass measurement parameters and spatial plane equation into the preset warp parameter calculation unit for analysis to generate substrate warp parameters.

[0144] After determining the spatial plane equation, the processing terminal inputs the glass measurement parameters and the spatial plane equation into the warp parameter calculation unit for analysis to obtain the substrate warp parameters, thereby accurately characterizing the degree and state of warping of the glass substrate G, thus providing data support for the subsequent determination of the final alignment data, and thus ensuring the effect of improving the alignment accuracy of the glass substrate G.

[0145] The warpage parameter calculation unit refers to the calculation unit used to calculate the warpage parameter. By inputting the glass measurement parameters and the plane space equation, it extracts the height data of the measurement point and the coefficients of the space plane equation. It calculates the height offset by calculating the difference between the average height of the measurement point and the target height, and calculates the tilt angle of the X-axis and Y-axis by using the coefficients of the plane equation, thus obtaining the warpage parameter.

[0146] Reference Figure 5 The steps for determining a safe laser power by analyzing the property parameters of the glass substrate and the laser beam diameter include:

[0147] Step S500: Determine the glass substrate density, glass substrate thickness, and glass substrate specific heat capacity based on the glass substrate property parameters.

[0148] The glass substrate density refers to the mass of the glass substrate G per unit volume, which is identified and retrieved by the processing terminal from the glass substrate attribute parameters. The glass substrate density is strongly correlated with the substrate's heating mass; a higher density indicates a greater mass carried by the glass substrate G per unit volume, resulting in a greater mass increase after heating, thus providing data support for subsequently determining the substrate's heating mass.

[0149] The thickness of the glass substrate refers to the thickness of the glass substrate G, which is identified and retrieved from the glass substrate's attribute parameters by the processing terminal. By determining the thickness of the glass substrate G, the volume of the glass substrate G within the laser beam diameter is determined, providing data support for subsequently determining the substrate's heating quality.

[0150] The specific heat capacity of a glass substrate refers to the amount of heat required to raise the temperature of the glass substrate G, which is identified and retrieved by the processing terminal from the glass substrate's property parameters. The specific heat capacity of a glass substrate is strongly correlated with the safe temperature rise energy. The larger the specific heat capacity of the glass substrate, the stronger its ability to raise the temperature by the same amount of heat, thus providing data support for subsequently determining the safe temperature rise energy.

[0151] Step S501: Calculate the product of the glass substrate density, glass substrate thickness and laser beam diameter to generate the substrate heating mass.

[0152] The substrate heating mass refers to the mass of the glass substrate G that has been directly irradiated by the laser beam and absorbed energy. It is obtained by calculating the product of the glass substrate density, glass substrate thickness, and laser beam diameter using the processing terminal. With a constant laser beam diameter, a larger glass substrate density and thickness indicate a larger volume of the glass substrate irradiated by the laser. Therefore, a greater substrate heating mass requires more energy absorption, providing data support for determining the safe temperature rise energy.

[0153] Step S502: Calculate the product of the substrate heating mass, the specific heat capacity of the glass substrate, and the preset safe temperature rise value to generate safe temperature rise energy.

[0154] The safe temperature rise energy refers to the energy required to raise the temperature of the glass substrate G to a certain level. It is obtained by the processing terminal by calculating the product of the substrate's heating mass, the glass substrate's specific heat capacity, and the safe temperature rise value. With a constant safe temperature rise value, the larger the substrate's heating mass and the glass substrate's specific heat capacity, the more energy is required for heating, and the greater the safe temperature rise energy. This allows for the calculation of the energy required by the glass substrate G within the safe temperature rise range, thereby preventing localized thermal expansion of the glass substrate G due to excessive laser power.

[0155] The safe temperature rise value refers to the maximum allowable temperature rise of the local area of ​​the glass substrate G, which is set in advance by the operator. By determining the safe temperature rise value, the energy required to raise the temperature to the maximum rise value can be determined, and thus the safe laser power can be determined to prevent local thermal expansion of the glass substrate G.

[0156] Step S503: Calculate the quotient of the safe temperature rise energy and the preset standard irradiation time to generate safe laser power.

[0157] The safe laser power refers to the laser power required when the glass substrate G expands due to the heat of the laser. It is calculated by the processing terminal as the quotient of the safe temperature rise energy and the standard irradiation time. Under the condition of a constant standard irradiation time, a higher safe temperature rise energy indicates that more energy is required to raise the temperature to the safe temperature rise value, thus requiring a higher safe laser power. By determining the safe laser power, it is possible to prevent inaccurate detection data from the fixed height measuring component 420 due to thermal expansion of the glass substrate G caused by laser detection, thereby ensuring improved alignment accuracy of the glass substrate G.

[0158] The standard irradiation time refers to the time that the fixed height measuring component 420 irradiates the same position on the glass substrate G, which is set in advance by the operator. By determining the standard irradiation time, the duration of one effective laser irradiation is determined. Under the condition that the safe temperature rise energy remains constant, a longer standard irradiation time indicates a longer time spent irradiating the same position on the glass substrate G, and at this time, a lower safe laser power, thus providing data support for determining the safe laser power.

[0159] Reference Figure 6 The steps of measuring the glass substrate using a fixed height-measuring assembly controlled by a safe laser power to determine the glass measurement parameters, and analyzing these parameters to determine the spatial plane equation, include:

[0160] Step S600: The fixed height measuring component is controlled according to the safety laser power to measure the preset measurement points to generate glass measurement parameters.

[0161] The processing terminal measures the glass measurement parameters by controlling the fixed height measuring component 420 according to the safety laser power, thereby obtaining the height data of the glass substrate G at the measurement point, so as to determine the spatial plane equation in the future.

[0162] The measurement point refers to the measurement position of the fixed height measuring component 420 on the glass substrate G. There are no fewer than three non-collinear measurement points, which are predetermined by the operator. By determining the measurement points, the fixed height measuring component 420 is controlled to measure the height data of that point, so as to facilitate the subsequent determination of the spatial plane equation.

[0163] Step S601: Determine the reference vertical height based on the glass measurement parameters.

[0164] The reference vertical height refers to the vertical height of the measurement point on the glass substrate G, which is identified and retrieved by the processing terminal from the glass measurement parameters. By identifying and retrieving the reference vertical height, data support is provided for determining the spatial plane equation, and then the substrate warpage parameters are determined based on the height data and the coefficients of the spatial plane equation.

[0165] Step S602: Obtain the horizontal coordinates of the measurement point.

[0166] The horizontal coordinates refer to the coordinates of the measurement points, which are stored by the operator in the processing terminal. By determining the horizontal coordinates of the measurement points, a spatial plane equation is generated by fitting the horizontal coordinates and the corresponding reference vertical height, which facilitates the subsequent calculation of substrate warpage parameters.

[0167] Step S603: Generate the spatial plane equation of the glass substrate by fitting the horizontal coordinates and the reference vertical height using the preset least squares method.

[0168] After determining the horizontal coordinates, the processing terminal uses the least squares method to fit and generate the spatial plane equation of the glass substrate G based on the horizontal coordinates and the reference vertical height, thereby determining a plane equation that can represent the glass substrate G. Then, the height offset is calculated by measuring the height difference between the point and the spatial plane. The tilt angles of the X-axis and Y-axis are calculated by the coefficients of the plane equation, so as to determine the substrate warping parameters in the future.

[0169] The least squares method is an algorithm used to fit measurement points to generate equations for a spatial plane. It first constructs a design matrix, with each row containing a measurement point. The equations for the spatial plane equations are: a design matrix and a height vector containing the reference vertical height of the corresponding measurement point. The coefficients are obtained by multiplying the transpose of the design matrix by the design matrix, finding the inverse matrix, multiplying it by the transpose of the design matrix, and then multiplying by the height vector.

[0170] Reference Figure 7 The steps of measuring the glass substrate using a fixed height-measuring assembly controlled by a safe laser power to determine the glass measurement parameters, and analyzing these parameters to determine the spatial plane equation, include:

[0171] Step S700: The fixed height measuring component is controlled according to the safety laser power to scan the glass substrate along the preset scanning path to determine the glass measurement parameters.

[0172] In this step, the processing terminal controls the fixed height measuring component 420 to scan the glass substrate G along the scanning path according to the safety laser power and then determines the glass measurement parameters. The glass measurement parameters in this step are the same as those in step S600. The difference is that the glass measurement parameters in this step are obtained by the processing terminal controlling the fixed height measuring component 420 to scan the glass substrate G along the scanning path.

[0173] The scanning path refers to the path along which the fixed height measuring component 420 scans the glass substrate G, which is pre-set by the operator. By determining the scanning path, the fixed height measuring component 420 is controlled to scan the glass substrate G along the scanning path, thereby determining the position coordinates of the scanned points, so as to facilitate the subsequent determination of the spatial plane equation.

[0174] Step S701: Determine the warpage detection coordinates based on the glass measurement parameters.

[0175] The warpage detection coordinates refer to the position coordinates of the scanned points on the glass substrate G, including horizontal abscissa, horizontal ordinate, and height coordinates, which are identified and retrieved by the processing terminal from the glass measurement parameters. By identifying and retrieving the warpage detection coordinates, the three-dimensional spatial position of the scanned points is determined, which facilitates the subsequent determination of the spatial plane equation.

[0176] Step S702: Generate the spatial plane equation of the glass substrate by fitting the warp detection coordinates using the preset least squares method.

[0177] In this process, after determining the warpage detection coordinates, the processing terminal uses the least squares method to fit and generate the spatial plane equation of the glass substrate G based on the warpage detection coordinates. This allows the point cloud data detected by the fixed height measuring component 420 to be fitted and generated into the spatial plane equation, thereby characterizing the local deformation of the glass substrate G surface in detail and improving the alignment accuracy of the glass substrate G.

[0178] The least squares method in this step is the same as the least squares method in step S603. The difference is that the input data in this step is the warping detection coordinates, and the subsequent calculation steps are the same as those in step S603.

[0179] Reference Figure 8 and Figure 9 Based on the same inventive concept, this application provides a high-precision alignment device for a glass substrate in semiconductor packaging, including a base 100, a moving platform 300, an integrated optical measurement module, and a control system. The moving platform 300 is disposed in the middle of the base 100 and is used to support and drive the glass substrate G to move and rotate in a horizontal plane. The integrated optical measurement module is mounted on the side of the base 100 and is used to measure the position and height of the glass substrate G. The control system controls the moving platform 300 and the integrated optical measurement module, and acquires data via a data cable.

[0180] Reference Figure 8 and Figure 9 The control system is electrically connected to the mobile platform 300 and the integrated optical measurement module, and is configured to send substrate warpage parameters to the robot at the front end of the equipment, thereby guiding the robot to grasp the substrate according to the substrate warpage parameters, thereby improving the alignment accuracy of the glass substrate G.

[0181] Reference Figure 8 and Figure 9 The mobile platform 300 adopts a layered design. The bottom layer is equipped with a Y-axis module 320, the middle layer is equipped with an X-axis module 310, and the X-axis module 310 is orthogonally mounted on the slider of the Y-axis module 320. The top layer is equipped with a rotation module 330, which is mounted on the slider of the X-axis module 310. This module is responsible for carrying and driving the glass substrate G to move and rotate in all directions in the horizontal plane, so as to facilitate the subsequent use of the integrated optical measurement module to capture images of the glass substrate G.

[0182] Reference Figure 9A follower support assembly 200 is mounted on the rotating module 330. The follower support assembly 200 includes an adapter plate, and a kinematic support column 210 is mounted near each of the four corners of the adapter plate. The top of the kinematic support column 210 is a ball head made of PEEK material. The glass substrate G is placed directly on the top of the kinematic support column 210, thereby supporting the glass substrate G in a multi-point support manner, effectively adapting to the warping shape of the glass substrate G, and minimizing the contact area between the kinematic support column 210 and the glass substrate G.

[0183] Reference Figure 8 The integrated optical measurement module includes a vision inspection component 410 and a fixed height measurement component 420. The vision inspection component 410 includes a column 411 and an industrial camera 412. The column 411 is mounted on the side of the base 100, and the industrial camera 412 is mounted on the end of the column 411 via an L-shaped adapter at the top of the column 411. The industrial camera 412 includes a telecentric lens and a coaxial illumination source. The telecentric lens is an optical lens that effectively reduces distortion and eliminates perspective distortion caused by ordinary lenses. The coaxial illumination source is an illumination device that directs light along the optical axis of the industrial camera 412, effectively reducing surface reflection interference on the glass substrate G, thereby improving the inspection accuracy of the vision inspection component 410 and ensuring improved alignment accuracy of the glass substrate G.

[0184] Reference Figure 8 The fixed height measuring component 420 includes a bracket 421 and a laser displacement sensor 422. The bracket 421 is mounted on the side surrounding the moving platform 300 and is L-shaped. Each bracket 421 has a laser displacement sensor 422 mounted on its top. The laser displacement sensor 422 can be a laser confocal displacement sensor or a laser triangulation distance sensor. The light spot is emitted vertically upward, thereby measuring the distance passing over the lower surface of the glass substrate G above the laser displacement sensor 422 in a non-contact manner.

[0185] The implementation principle of a high-precision alignment device for glass substrates used in semiconductor packaging according to an embodiment of this application is as follows:

[0186] The control system drives the glass substrate G to move to the reference mark position by controlling the mobile platform 300, thereby controlling the industrial camera 412 in the vision inspection component 410 to capture an image of the glass substrate G, and controlling the laser displacement sensor 422 in the fixed height measurement component 420 to emit a laser to measure the distance from the glass substrate G to the laser displacement sensor 422. In this way, the distance of the lower surface of the glass substrate G above the laser displacement sensor 422 is measured in a non-contact manner, thereby determining the planar offset and substrate warping parameters of the glass substrate G. This enables the effective identification of feature points, allowing the robot to accurately adjust its posture for safe gripping during the next gripping operation, thus ensuring improved alignment accuracy of the glass substrate G.

[0187] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0188] This application provides a computer-readable storage medium storing a computer program that can be loaded by a processor and executed as a high-precision alignment method for a glass substrate used in semiconductor packaging.

[0189] Computer storage media include, for example, USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, optical disks, and other media that can store program code.

[0190] Based on the same inventive concept, embodiments of this application provide a smart terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded and executed by the processor, which is a high-precision alignment method for glass substrates used in semiconductor packaging.

[0191] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0192] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any feature disclosed in this specification (including the abstract and drawings) may be replaced by other equivalent or similar features unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is only one example of a series of equivalent or similar features.

Claims

1. A high-precision alignment method for glass substrates used in semiconductor packaging, characterized in that, include: Obtain system trigger signals; Based on the system trigger signal, the preset moving platform is controlled to move the preset glass substrate to the preset reference mark position and obtain the moving completion signal; The glass substrate is inspected by a vision inspection component controlled by the motion completion signal to generate a reference mark image; The reference marker image is input into a preset edge detection algorithm for analysis to determine the reference marker coordinates; The reference marker image and reference marker coordinates are analyzed to determine the actual marker coordinates; The actual marked coordinates are input into a preset rigid body transformation algorithm for analysis to determine the plane offset; The preset fixed height measuring component is controlled to measure the glass substrate in order to determine the substrate warpage parameters; The plane offset and substrate warpage parameters are correlated to generate final alignment data, and the preset robot is controlled to adjust its posture based on the final alignment data; The steps for analyzing the reference marker image and reference marker coordinates to determine the actual marker coordinates include: Obtain the image pixel values ​​of the baseline marker image; Image pixel values ​​are weighted and summed according to preset channel weight parameters to generate grayscale pixel values; Calculate the mean value of grayscale pixels to generate the average brightness of the image; Determine whether the average brightness of the image is greater than the preset standard average brightness; the standard average brightness refers to the brightness threshold for measuring whether the glass substrate is a transparent glass substrate. If the average brightness of the image is greater than the standard average brightness, the glass substrate is a transparent glass substrate, and the reference mark coordinates can be effectively identified. If the average brightness of the image is not greater than the standard average brightness, the glass substrate is an opaque glass substrate, and the reference mark coordinates cannot be effectively identified. If it is greater than, then the reference marker coordinates are defined as the actual marker coordinates; If it is not greater than, then the coordinates of the reference mark are analyzed to determine the actual mark coordinates; The steps for analyzing the reference marker coordinates to determine the actual marker coordinates include: Determine the reference horizontal and vertical coordinates based on the reference mark coordinates; The sum of the reference horizontal coordinate and the preset horizontal offset value is calculated to generate the actual horizontal coordinate; the horizontal offset value refers to the systematic horizontal offset caused by the opaque glass. The reference horizontal coordinate is corrected according to the horizontal offset value to offset the coordinate position offset caused by the opaque glass. The sum of the reference ordinate and the preset longitudinal offset value is calculated to generate the actual ordinate; the longitudinal offset value refers to the systematic longitudinal offset caused by the opaque glass. The reference ordinate is corrected according to the longitudinal offset value to offset the coordinate position offset caused by the opaque glass. Associate the actual x-coordinate and the actual y-coordinate to generate the actual marked coordinates.

2. The high-precision alignment method for glass substrates used in semiconductor packaging according to claim 1, characterized in that, The steps of controlling a preset fixed height measuring component to measure the glass substrate to determine the substrate warpage parameters include: Obtain the property parameters of the glass substrate and the diameter of the laser beam; The property parameters of the glass substrate and the diameter of the laser beam are analyzed to determine the safe laser power; The glass substrate is measured using a fixed height measuring component controlled by a safe laser power to determine the glass measurement parameters, and the glass measurement parameters are analyzed to determine the spatial plane equation. The glass measurement parameters and spatial plane equations are input into a preset warp parameter calculation unit for analysis to generate substrate warp parameters.

3. The high-precision alignment method for glass substrates used in semiconductor packaging according to claim 2, characterized in that, The steps for determining a safe laser power by analyzing the property parameters of the glass substrate and the laser beam diameter include: Determine the glass substrate density, glass substrate thickness, and glass substrate specific heat capacity based on the glass substrate property parameters. Calculate the product of glass substrate density, glass substrate thickness, and laser beam diameter to generate the substrate heating mass; Calculate the product of the substrate heating mass, the specific heat capacity of the glass substrate, and the preset safe temperature rise value to generate safe temperature rise energy; Calculate the quotient of the safe temperature rise energy and the preset standard irradiation time to generate safe laser power.

4. The high-precision alignment method for glass substrates used in semiconductor packaging according to claim 2, characterized in that, The steps of measuring the glass substrate using a fixed height-measuring assembly controlled by a safe laser power to determine the glass measurement parameters, and then analyzing these parameters to determine the spatial plane equation, include: The fixed height measuring component, controlled by a safety laser power, measures preset measurement points to generate glass measurement parameters. Determine the reference vertical height based on the glass measurement parameters; Obtain the horizontal coordinates of the measurement point; The spatial plane equation of the glass substrate is generated by fitting a preset least squares method based on the horizontal coordinates and the reference vertical height.

5. A high-precision alignment method for glass substrates used in semiconductor packaging according to claim 2, characterized in that, The steps of measuring the glass substrate using a fixed height-measuring assembly controlled by a safe laser power to determine the glass measurement parameters, and then analyzing these parameters to determine the spatial plane equation, include: The fixed height measuring component, controlled by a safety laser power, scans the glass substrate along a preset scanning path to determine the glass measurement parameters. Determine the warpage detection coordinates based on the glass measurement parameters; The spatial plane equation of the glass substrate is generated by fitting a preset least squares method based on the warp detection coordinates.

6. A high-precision alignment apparatus for a glass substrate used in semiconductor packaging, employing a high-precision alignment method for a glass substrate used in semiconductor packaging as described in any one of claims 1-5, characterized in that, It includes a base for mounting, a moving platform for driving the movement of the glass substrate, an integrated optical measurement module for measuring the glass substrate, and a control system for controlling the moving platform and the integrated optical measurement module. The control system is electrically connected to the mobile platform and the integrated optical measurement module; The mobile platform is mounted on a base. The mobile platform includes a Y-axis module responsible for movement in the Y-axis direction, an X-axis module responsible for movement in the X-axis direction, and a rotation module responsible for rotation. The X-axis module is mounted on the Y-axis module, and the rotation module is mounted on the X-axis module. The rotating module is provided with a follow-up support assembly for supporting the glass substrate. The follow-up support assembly includes a plurality of kinematic pillars, and the glass substrate is placed on the kinematic pillars. The integrated optical measurement module is mounted on the base. The integrated optical measurement module includes a vision inspection component and a fixed height measurement component. The vision inspection component includes a column and an industrial camera. The column is mounted on the base, and the industrial camera is mounted on the top of the column. The industrial camera is used to capture images of the glass substrate. The fixed height measurement component includes a bracket and a laser displacement sensor. The bracket is mounted on a base, and the laser displacement sensor is mounted on the bracket. The laser displacement sensor is used to measure the distance from the glass substrate to the laser displacement sensor.

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