Surface mounting precision compensation method and equipment based on XY platform surface, and medium
By arranging a calibration board on the XY platform of the chip mounting equipment and using an interpolation algorithm to calculate the compensation amount, the problem of insufficient accuracy of the XY platform was solved, and the chip mounting accuracy was improved.
Patent Information
- Application Number
- CN202511799069.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-03-06
AI Technical Summary
In the existing technology, the XY platform of the chip mounting equipment has low mounting accuracy due to the limitations of processing and assembly precision, and the commonly used instrument calibration methods cannot cover the entire continuous XY mounting area, resulting in poor compensation effect.
By arranging a calibration board on the XY platform, using a welding head camera to obtain the actual position coordinates of the calibration points, calculating the tilt angle of the calibration board, and combining the interpolation algorithm to calculate the theoretical position coordinates and compensation amount of each calibration point, accurate compensation for chip mounting points can be achieved.
It improves chip placement accuracy by covering the entire XY continuous placement area, eliminates geometric errors of the XY platform surface, and achieves precise placement position compensation.
Smart Images
Figure CN121620261A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of advanced chip packaging technology, and in particular to a mounting accuracy compensation method, device and medium based on the XY platform. Background Technology
[0002] In the advanced packaging process of semiconductor chips, the overall mounting accuracy of the packaging and testing equipment is required to be below 5μm@3σ. However, due to the limitations of the processing and assembly accuracy of the gantry XY and track platforms of the mounting equipment, it is impossible to achieve the ideal design requirements. For example, the perpendicularity of the gantry's X and Y axes cannot reach the ideal 90-degree perpendicularity. The straightness of the X and Y axes, as well as different degrees of yaw, pitch, and roll of the XYZ axes, are unavoidable, which will ultimately affect the chip mounting accuracy.
[0003] To address these issues, commonly used calibration methods typically employ precision testing instruments such as laser interferometers and collimators, followed by compensation via 2D or host computer motion control software integrated into the servo driver. However, instrument setup is limited by installation space constraints, making it difficult to directly measure the displacement of the end bonding head during testing, introducing Abbe measurement errors and resulting in lower placement accuracy. Furthermore, the calibration accuracy of such instruments is often limited to discrete, finite placement points, failing to cover the entire XY continuous placement area, leading to poor compensation performance. Summary of the Invention
[0004] In response to the aforementioned problems and technical requirements, the applicant proposes a mounting accuracy compensation method, device, and medium based on the XY platform to solve the problems of low accuracy and poor effect in the prior art when performing chip mounting accuracy compensation based on instruments, thereby improving chip mounting accuracy while covering the entire XY mounting continuous area.
[0005] This application provides a mounting accuracy compensation method based on an XY platform, the method comprising: The calibration board is placed on the mounting area of the XY platform of the packaging equipment; wherein, the calibration board includes a board body and multiple calibration points on the board body, the multiple calibration points being located in the X-axis of the calibration board coordinate system. b Axial direction and Y b The calibration points are arranged in an array along the axial direction, forming a calibration group consisting of at least four adjacent calibration points. The calibration points in the calibration group are located at X... b Axial direction and Y b The number of axes is consistent and is greater than or equal to 2. The first actual position coordinates of each calibration point on the calibration board in the mechanical coordinate system XOY based on the XY platform surface are obtained by the welding head camera. The actual tilt angle of the calibration board is calculated using multiple calibration groups on the diagonal. The theoretical position coordinates of each calibration point are calculated using the actual tilt angle of the calibration board. The deviation between the first actual position coordinates and the theoretical position coordinates of each calibration point is used as the corresponding compensation amount. The compensation amount represents the deviation of the mounting position identification caused by the packaging equipment. During the chip mounting process using packaging equipment, the second actual position coordinates of the target mounting point in the mechanical coordinate system XOY are determined by the solder head camera, and the target calibration group corresponding to the second actual position coordinates is determined. The second actual position coordinates of the target mounting point in the machine coordinate system XOY are compensated using an interpolation algorithm based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, so as to obtain the final compensation value corresponding to the target mounting point.
[0006] According to the mounting accuracy compensation method based on the XY platform provided in the embodiments of this application, the target calibration group includes calibration points located in the i-th row and j-th column. D i,j The calibration point located in the i-th row and j+1-th column D i,j+1 The calibration point located in the (i+1)th row and jth column D i+1,j The calibration point located in the (i+1)th row and (j+1)th column D i+1,j+1 Where i and j are integer parameters; Calibration point D i,j+1 The first actual position coordinates are Calibration point D i+1,j+1 The first actual position coordinates are Calibration point D i,j The first actual position coordinates are Calibration point D i+1,j The first actual position coordinates are ; The compensation set corresponding to the first actual position coordinates of the calibration points in the target calibration group includes: the compensation amount of each calibration point in the X-axis direction and the compensation amount in the Y-axis direction of the machine coordinate system. Among them, calibration points D i,j+1 The compensation amount on the X-axis is The compensation amount on the Y-axis is ; Calibration point Di+1,j+1 The compensation amount on the X-axis is The compensation amount on the Y-axis is ; Calibration point D i,j The compensation amount on the X-axis is The compensation amount on the Y-axis is ; Calibration point D i+1,j The compensation amount on the X-axis is The compensation amount on the Y-axis is .
[0007] According to the mounting accuracy compensation method based on the XY platform provided in the embodiments of this application, an interpolation algorithm is used to compensate the second actual position coordinates of the target mounting point in the machine coordinate system XOY based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, to obtain the final compensation value corresponding to the target mounting point, including: Based on the first actual position coordinates, the compensation amount, and the second actual position coordinates, one-dimensional linear interpolation is first performed on two sets of adjacent calibration points to obtain two first intermediate values and two Y coordinates. Then, a second interpolation is performed on the first intermediate values and the Y coordinates to obtain the X-axis compensation value. Based on the first actual position coordinates, the compensation amount, and the second actual position coordinates, one-dimensional linear interpolation is first performed on two sets of adjacent calibration points to obtain two second intermediate values and two X coordinates. Then, a second interpolation is performed on the second intermediate values and the X coordinates to obtain the Y-axis compensation value. The final compensation value is obtained based on the X-axis compensation value and the Y-axis compensation value.
[0008] According to the mounting accuracy compensation method based on the XY platform provided in the embodiments of this application, the second actual position coordinates of the target mounting point in the XOY machine coordinate system are compensated using an interpolation algorithm based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group. The method includes: The formula for calculating the first intermediate value includes: ; in, This represents a first intermediate value. Indicates another first intermediate value, Indicates the second actual position coordinates; The formula for calculating the Y-coordinate includes: ; in, Represents a Y coordinate. Indicates another Y coordinate; The formula for calculating the X-axis compensation value includes: ; in, Indicates the X-axis compensation value; The formula for calculating the second intermediate value includes: ; in, This represents a second intermediate value. Indicates another second intermediate value; ; in, Represents an X coordinate. Indicates another X coordinate; The formula for calculating the Y-axis compensation value includes: ; in, Indicates the Y-axis compensation value; The target mounting point is compensated based on the X-axis compensation value and the Y-axis compensation value.
[0009] According to the mounting accuracy compensation method based on the XY platform provided in the embodiments of this application, any calibration group located on the diagonal includes a calibration point located in the k-th row and k-th column. D k,k The calibration point located in the k-th row and k+1-th column D k,k+1 The calibration point located in the (k+1)th row and kth column D k+1,k The calibration point located in the (k+1)th row and (k+1)th column D k+1,k+1 Where k is an integer parameter; The actual tilt angle of the calibration plate is calculated using multiple calibration groups on the diagonal, including: Based on the calibration points in each calibration group D k,k First actual position coordinates and calibration point D k+1,k+1 First actual position coordinates, calculate calibration point D k,k and calibration points D k+1,k+1 The angle between the lines connecting them relative to the X-axis of the machine coordinate system is used to determine the average angle calculated by all calibration groups as the candidate tilt angle; Calculate the difference between the candidate tilt angle and the preset tilt angle, and determine the obtained difference as the actual tilt angle.
[0010] According to the mounting accuracy compensation method based on the XY platform provided in the embodiments of this application, the theoretical position coordinates of each calibration point are calculated using the actual tilt angle of the calibration board, and the deviation between the first actual position coordinates and the theoretical position coordinates of each calibration point is used as the corresponding compensation amount, including: By inputting the actual tilt angle and the coordinates of the calibration point in the calibration coordinate system into a preset mapping formula, the theoretical position coordinates are obtained. The mapping relationship includes: ; in, Represents the theoretical position coordinates. This indicates the coordinates of the calibration point in the calibration plate coordinate system. This indicates the actual tilt angle of the calibration plate. Represents the coordinates of the origin of the machine coordinate system; The compensation amount includes: ; in, This indicates the compensation amount corresponding to the calibration point on the X-axis. This indicates the compensation amount corresponding to the calibration point on the Y-axis. This represents the theoretical position coordinates in the machine coordinate system obtained after mapping the initial coordinates. This represents the first actual position coordinates in mechanical coordinates obtained from the welding head camera, where M represents the number of calibration points corresponding to the X-axis and N represents the number of calibration points corresponding to the Y-axis.
[0011] According to the mounting accuracy compensation method based on the XY platform surface provided in the embodiments of this application, the determination of the coordinates of the calibration point in the calibration board coordinate system includes: ; in, This represents the distance between two calibration points along the positive X-axis. This represents the deviation value of the m-th calibration point in the X-axis direction after retesting by the lithography machine. This represents the distance between two calibration points along the positive Y-axis. This represents the deviation value of the nth calibration point in the Y-axis direction after retesting by the lithography machine.
[0012] According to the mounting accuracy compensation method based on the XY platform provided in the embodiments of this application, the error between the calibration point on the calibration board and the calibration point farthest from the origin in the positive diagonal direction of the X-axis and Y-axis is less than or equal to 1μm@3σ / 25°C. The center distance between each calibration point is less than or equal to 0.3 μm @ 3σ / 25°C; The calibration plate is made of microcrystalline glass.
[0013] This application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the steps of the mounting accuracy compensation method based on the XY platform as described above.
[0014] This application also provides a non-transitory computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the mounting accuracy compensation method based on the XY platform as described above.
[0015] The mounting accuracy compensation method, device, and medium based on the XY platform surface provided in this application provide an effective data foundation for accurately calculating the compensation amount of each calibration point by arranging a calibration board on the mounting area of the XY platform surface of the packaging equipment and grouping the calibration points on the calibration board. The method uses a welding head camera to acquire the first actual position coordinates of each calibration point on the calibration board in the XOY mechanical coordinate system created based on the XY platform surface. The actual tilt angle of the calibration board is calculated using multiple calibration groups on the diagonal, and the theoretical position coordinates of each calibration point are calculated using the actual tilt angle of the calibration board. The deviation between the first actual position coordinates and the theoretical position coordinates of each calibration point is used as the corresponding compensation amount. Therefore, this application accurately calculates the deviation in mounting position identification caused by the design or production of the packaging equipment itself, providing effective data for subsequent chip mounting target mounting point position compensation. The basic principle is that during chip mounting using packaging equipment, the second actual position coordinates of the target mounting point in the XOY mechanical coordinate system are determined by a solder head camera, and a target calibration group corresponding to the second actual position coordinates is determined. An interpolation algorithm is used to compensate the second actual position coordinates of the target mounting point in the XOY mechanical coordinate system based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, thus obtaining the final compensation value corresponding to the target mounting point. In this application, during chip mounting, the compensation amount corresponding to the target calibration group corresponding to the second actual position and the interpolation algorithm are used to compensate the second actual position coordinates, resulting in a precise target mounting position. Therefore, this application, by combining the deployment of calibration points with a linear interpolation algorithm to eliminate geometric errors on the XY platform surface, improves the mounting accuracy of the chip while covering the entire continuous XY mounting area (XY platform surface). Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a flowchart illustrating the mounting accuracy compensation method based on the XY platform surface provided in the embodiments of this application; Figure 2 This is a schematic diagram of the coordinate system and calibration point positions provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0019] This application provides a method for mounting accuracy compensation based on an XY platform. This method can be applied to smart terminals and servers. This application uses the application of this method in a server as an example for illustration, and some other descriptions in the embodiments are illustrative and not intended to limit the scope of protection of this application, and will not be described in detail thereafter. The specific implementation of the method is as follows... Figure 1 As shown: Step 101: Place the calibration board onto the mounting area of the XY platform of the packaging equipment.
[0020] The calibration plate includes a plate body and multiple calibration points on the plate body. These calibration points are located in the X coordinate system of the calibration plate. b Axial direction and Y b The calibration points are arranged in an array along the axis, forming a calibration group with at least four adjacent calibration points. The calibration points in the calibration group are located at X... b Axial direction and Y b The number of axes is consistent and is greater than or equal to 2. Step 102: Obtain the first actual position coordinates of each calibration point on the calibration board in the mechanical coordinate system XOY created based on the XY platform surface using the welding head camera. Calculate the actual tilt angle of the calibration board using multiple calibration groups on the diagonal. Calculate the theoretical position coordinates of each calibration point using the actual tilt angle of the calibration board. Use the deviation between the first actual position coordinates and the theoretical position coordinates of each calibration point as the corresponding compensation amount.
[0021] The compensation amount represents the deviation in mounting position recognition caused by the packaging equipment.
[0022] Step 103: During the chip mounting process using packaging equipment, the second actual position coordinates of the target mounting point in the mechanical coordinate system XOY are determined by the solder head camera, and the target calibration group corresponding to the second actual position coordinates is determined.
[0023] Step 104: Using an interpolation algorithm, the second actual position coordinates of the target mounting point in the machine coordinate system XOY are compensated based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, so as to obtain the final compensation value corresponding to the target mounting point.
[0024] The interpolation algorithm includes bilinear interpolation.
[0025] The mounting accuracy compensation method based on the XY platform surface provided in this application provides an effective data basis for accurately calculating the compensation amount of each calibration point by arranging a calibration board on the mounting area of the XY platform surface of the packaging equipment and grouping the calibration points on the calibration board. The method uses a welding head camera to acquire the first actual position coordinates of each calibration point on the calibration board in the XOY mechanical coordinate system created based on the XY platform surface. It calculates the actual tilt angle of the calibration board using multiple calibration groups on the diagonal, calculates the theoretical position coordinates of each calibration point using the actual tilt angle of the calibration board, and uses the deviation between the first actual position coordinates and the theoretical position coordinates of each calibration point as the corresponding compensation amount. Therefore, this application accurately calculates the deviation in mounting position identification caused by the design or production of the packaging equipment itself, providing an effective data basis for subsequent chip mounting target mounting point position compensation. In the chip mounting process using packaging equipment, the second actual position coordinates of the target mounting point in the XOY mechanical coordinate system are determined by the solder head camera, and a target calibration group corresponding to the second actual position coordinates is determined. An interpolation algorithm is used to compensate the second actual position coordinates of the target mounting point in the XOY mechanical coordinate system based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, resulting in the final compensation value corresponding to the target mounting point. In this application, during chip mounting, the compensation amount corresponding to the target calibration group corresponding to the second actual position and the interpolation algorithm are used to compensate the second actual position coordinates, resulting in a precise target mounting position. Therefore, this application, by combining the deployment of calibration points with a linear interpolation algorithm to eliminate geometric errors on the XY platform surface, improves the mounting accuracy of the chip while covering the entire continuous XY mounting area (XY platform surface).
[0026] In one specific embodiment, the error between the calibration point on the calibration plate and the calibration point furthest from the origin in the positive direction of the diagonal of the X and Y axes is less than or equal to 1 μm@3σ / 25°C.
[0027] Specifically, the center distance accuracy of each calibration point is less than or equal to 0.3 μm @ 3σ / 25°C.
[0028] In one specific embodiment, the calibration plate is made of microcrystalline glass.
[0029] For example, the calibration board size covers the 12” wafer mounting range, with an effective size >300*300mm. The calibration board size is customized to 340mm*340mm to match the track width.
[0030] Specifically, the overall output accuracy requirement of the equipment is 5μm. In eliminating geometric errors in the equipment's mounting area, the requirements for the calibration board are extremely high, and its fabrication requirements include: (1) Marked as a ring, with an inner diameter of 1.0 mm and an outer diameter of 2.0 mm. The ring is filled with white.
[0031] (2) Calibration plate material: This calibration plate is made of microcrystalline glass with a thermal expansion coefficient of almost 0.
[0032] (3) Color of the bottom of the calibration plate: dark black or dark blue.
[0033] (4) Spacing between circular marks (calibration points): XY (horizontal and longitudinal) are both 8.8mm, and the center distance accuracy is 0.3μm@3σ / 25°C.
[0034] (5) The accuracy of the inner / outer diameter of the ring: 1μm@3σ / 25°C, and the accuracy of the two circular mark points (calibration points) at the farthest positions of the origin and the diagonal is 1μm.
[0035] (6) The number of circular markings in the XY direction is a multiple of 6, 36 in total, and the effective size is 8.8*35+2.0=310mm.
[0036] (7) The coordinates of all mark points on the calibration board are (0,0) with the lower left corner as the coordinate. The position deviation value of each point needs to be re-measured by the lithography machine measurement module.
[0037] In one specific embodiment, the calibration board is installed after it has been created.
[0038] Specifically, the calibration plate has an external mounting frame. During installation, it is first fixed to the conveyor track by the frame, and then the flat bottom of the calibration plate is placed on the adsorption plate of the substrate assembly. The calibration plate is then adsorbed and fixed by turning on the vacuum.
[0039] Specifically through Figure 2 The calibration plate, coordinate system, and relevant angles are illustrated below: (1) The calibration plate is set to be tilted when placed. The actual tilt angle of the calibration plate is calculated. This is to eliminate that part of the error.
[0040] (2) Establish the calibration plate coordinate system XbObYb with the first circular mark (calibration point) in the lower left corner as the center.
[0041] (3) Without loss of generality, assume that the distance between the centers of the annular marks along the positive X-axis is... The number of circular markers is M, numbered sequentially as 1, 2, 3, ..., i, ..., M; the spacing between the centers of the circular markers along the positive Y-axis is... The number of circular markers is 1, 2, 3, ..., j, ..., N.
[0042] (4) The four circular marks are combined into a group, and the central circular mark is the mounting mark.
[0043] (5) The number of marker sets distributed on the diagonal is min(M / 2,N / 2), which is used to calculate the actual tilt angle of the calibration plate.
[0044] (6) Coordinate representation: Because it involves two-dimensional coordinates and a set of markers, which contains many elements, the X and Y components are represented by subscripts and separated by commas for ease of reading. For example, .
[0045] Among them, Figure 2 In the middle coordinate system X' b ObY' b The coordinate system corresponding to XOB has an actual tilt angle relative to the coordinate system XbObYb. The deviation.
[0046] Specifically, the XY platform is guided by guide rails, which / sliders of THK P or SP grade. Within a 200mm displacement, their parallelism error is 2μm. Converted to an 8.8mm spacing between marker points (calibration points), the error is 0.088μm, which is negligible due to its small size. Therefore, when moving between markers along the XY direction, the geometric errors in the XY position caused by installation can be ignored. Furthermore, the distance between the origin O of the XOY coordinate system and the calibration plate is small, and the geometric errors caused by installation can be ignored. Therefore, local errors can be disregarded.
[0047] In one specific embodiment, the coordinates of the calibration point in the calibration plate coordinate system are determined by formula (1): ………………(1) in, This represents the distance between two calibration points along the positive X-axis. This represents the deviation value of the m-th calibration point in the X-axis direction after retesting by the lithography machine. This represents the distance between two calibration points along the positive Y-axis. This represents the deviation value of the nth calibration point in the Y-axis direction after retesting by the lithography machine.
[0048] In this process, after the optical measuring machine completes the re-measurement, the calibration points, deviation values, and the mapping relationship between the calibration points and deviation values are stored. This application obtains the mapping relationship by reading the ini file, obtains the deviation value, and finally obtains the coordinates of all calibration points.
[0049] Specifically, in the calibration plate coordinate system XbObYb, the diagonal angles of each calibration group are related to the fabrication of the calibration plate, and are assumed to be a fixed value while meeting accuracy requirements. Counterclockwise is positive. The diagonal angle in the XOY coordinate system is related to the geometric error of XY. As mentioned earlier, the geometric error of XY is negligible when the marker moves a distance in XY. Therefore, to consider the tilt angle of the entire calibration plate's XY range, the average tilt angle of the diagonals of the marker set can be taken, assumed to be... Counterclockwise is positive.
[0050] In the XY two-dimensional space, let the label be... (m=1,2,3,…,i,…,M, 1,2,3,…,j,…,N), the first marker in the lower left corner represents... The last mark in the upper right corner indicates that In the calibration plate coordinate system XbObYb, The coordinates are given in formula (1).
[0051] In one specific embodiment, the calibration point is moved along the XY axis for imaging, which is specifically implemented as follows: First, by moving the XY axis, align the optical axis center of the welding head camera with the first mark in the lower left corner (row 1, column 1). Align the center point (origin of the calibration plate coordinate system XbObYb) with the center point, or cover the circular mark pattern with the field of view of the welding head camera, photograph the circular mark, and obtain the image through coordinate mapping transformations such as the camera's pixel coordinate system, image coordinate system, physical coordinate system, and mechanical coordinate system. The coordinates of the point in the machine coordinate system XOY ,because Since it is close to the origin O, the influence of geometric errors is not considered.
[0052] Secondly, the XY-axis displacement is programmed to sequentially move the welding head camera to each marked position (calibration point), and perform an S-shaped traverse to capture images of the marks (starting from the lower left corner). (Start), where the distance moved along the X-axis is (m=1,2,3,…M), the distance moved along the Y-axis is (n=1,2,3,…N). Then, through coordinate mapping transformations such as the camera's pixel coordinate system, image coordinate system, physical coordinate system, and mechanical coordinate system, the various coordinates are obtained. The coordinates of the point in the machine coordinate system XOY .
[0053] In one specific embodiment, any calibration group located on the diagonal includes a calibration point located in the k-th row and k-th column. D k,k The calibration point located in the k-th row and k+1-th column D k,k+1 The calibration point located in the (k+1)th row and kth column D k+1,k The calibration point located in the (k+1)th row and (k+1)th column D k+1,k+1 .
[0054] Where k is an integer parameter.
[0055] The specific implementation of calculating the actual tilt angle of the calibration plate using multiple calibration groups on the diagonal includes: Based on the calibration points in each calibration group D k,k First actual position coordinates and calibration point D k+1,k+1 First actual position coordinates, calculate calibration point D k,k and calibration points D k+1,k+1 The angle between the lines connecting them and the X-axis of the machine coordinate system is calculated, and the average value of the angles calculated by all calibration groups is determined as the candidate tilt angle; the difference between the candidate tilt angle and the preset tilt angle is calculated, and the difference is determined as the actual tilt angle.
[0056] The actual tilt angle of the calibration plate is determined by formula (2): …………………………………………(2) in, This indicates the candidate tilt angle of the calibration plate in the machine coordinate system. This indicates the preset tilt angle, which is a constant.
[0057] in, .
[0058] in, This represents the angle between the diagonal of the e-th calibration group and the X-axis. Indicates the number of calibration groups.
[0059] Specifically, in the machine coordinate system XOY, calculate the angle between the diagonal of the first group and the X-axis, as shown in formula (3): ……………………(3) Calculate the angle between the diagonal of the second group and the X-axis, see formula (4): ……………………(4) Similarly, calculate the last group ( The angle between the diagonal of the x-axis and the x-axis is given in formula (5): ... (5) In one specific embodiment, the theoretical position coordinates of each calibration point are calculated using the actual tilt angle of the calibration plate, and the deviation between the first actual position coordinates and the theoretical position coordinates of each calibration point is used as the corresponding compensation amount. By inputting the actual tilt angle and the coordinates of the calibration point in the calibration coordinate system into the preset mapping formula, the theoretical position coordinates are obtained.
[0060] The mapping relationship is given in formula (6): …………………………(6) in, Represents the theoretical position coordinates. This indicates the coordinates of the calibration point in the calibration plate coordinate system. This indicates the actual tilt angle of the calibration plate. This represents the coordinates of the origin of the machine coordinate system.
[0061] The compensation amount is given by formula (7): ……………………………(7) in, This indicates the compensation amount corresponding to the calibration point on the X-axis. This indicates the compensation amount corresponding to the calibration point on the Y-axis. This represents the theoretical position coordinates in the machine coordinate system obtained after mapping the initial coordinates. This represents the first actual position coordinates in mechanical coordinates obtained from the welding head camera, where M represents the number of calibration points corresponding to the X-axis and N represents the number of calibration points corresponding to the Y-axis.
[0062] Specifically, the mapping to the machine coordinate system XOY can be achieved through two coordinate transformations: Rotation transformation: The calibration plate coordinate system XbObYb rotates clockwise around the origin Ob. The angle is changed to the X'bObY'b coordinate system.
[0063] Translation transformation: The origin Ob of the X'bObY'b coordinate system is translated to the XOY coordinate system. According to the coordinate transformation formulas for rotation and translation, the calibration plate markings are... The coordinates in the XOY coordinate system are given in formula (6).
[0064] Specifically, the geometric error of the XY platform is the difference between the actual coordinates of the calibration point in the XOY coordinate system obtained by the welding head camera and the mapped coordinates in the XOY coordinate system obtained by coordinate transformation on the calibration plate. This geometric error is... See formula (7).
[0065] In one specific embodiment, the target calibration group includes calibration points located in the i-th row and j-th column. D i,j The calibration point located in the i-th row and j+1-th column D i,j+1 The calibration point located in the (i+1)th row and jth column D i+1,j The calibration point located in the (i+1)th row and (j+1)th column D i+1,j+1 .
[0066] Where i and j are integer parameters.
[0067] Among them, calibration points D i,j+1 The first actual position coordinates are Calibration point D i+1,j+1 The first actual position coordinates are Calibration point D i,j The first actual position coordinates are Calibration point D i+1,j The first actual position coordinates are .
[0068] Specifically, the compensation set corresponding to the first actual position coordinates of the calibration points in the target calibration set includes: the compensation amount of each calibration point in the X-axis direction and the compensation amount in the Y-axis direction of the machine coordinate system.
[0069] Among them, calibration points D i,j+1 The compensation amount on the X-axis is The compensation amount on the Y-axis is Calibration point D i+1,j+1 The compensation amount on the X-axis is The compensation amount on the Y-axis is Calibration point D i,j The compensation amount on the X-axis is The compensation amount on the Y-axis is Calibration point D i+1,j The compensation amount on the X-axis is The compensation amount on the Y-axis is .
[0070] In one specific embodiment, the specific implementation of using an interpolation algorithm to compensate the second actual position coordinates of the target mounting point in the machine coordinate system XOY based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, and obtaining the final compensation value corresponding to the target mounting point, includes: The bilinear interpolation algorithm is used to compensate the second actual position coordinates of the target mounting point in the mechanical coordinate system XOY based on the first actual position coordinates and compensation amount of the four calibration points in the target calibration group, so as to obtain the final compensation value corresponding to the target mounting point.
[0071] In one specific embodiment, the specific implementation of using an interpolation algorithm to compensate the second actual position coordinates of the target mounting point in the machine coordinate system XOY based on the first actual position coordinates and compensation amount of each calibration point in the target calibration group, to obtain the final compensation value corresponding to the target mounting point, includes: Error compensation based on the calibration plate is a two-dimensional function. In the machine coordinate system XOY, its horizontal and vertical coordinates are known, and the target compensation amount corresponds to each coordinate point. These points can be identified as discrete points, separated by distances and the spacing between markers.
[0072] To obtain error compensation for coordinate points other than discrete points, a piecewise linear interpolation algorithm can be used to divide the coordinate set of XY coordinates into multiple intervals, and to use an interpolation algorithm in each interval to estimate continuous coordinates.
[0073] This application employs a bilinear interpolation algorithm, the specific implementation of which includes: X-axis compensation: First, perform one-dimensional linear interpolation on two sets of adjacent points along the X-axis coordinate direction to obtain two first intermediate values and two Y coordinates; then, perform secondary interpolation on the first intermediate values and Y coordinates along the Y-axis coordinate direction; finally, synthesize the X-axis compensation value.
[0074] Y-axis compensation: First, perform one-dimensional linear interpolation on two sets of adjacent points along the Y-axis coordinate direction to obtain two second intermediate values and two X coordinates; then, perform secondary interpolation on the second intermediate values and X coordinates along the X-axis coordinate direction; finally, synthesize the Y-axis compensation value.
[0075] Specifically, in practical applications, the actual position coordinates obtained by the camera are compared with the coordinate values (x, y) of the coordinate system to determine the interval, i.e., the corresponding target calibration group.
[0076] Specifically, bilinear interpolation first interpolates in one direction and then interpolates in the other direction.
[0077] For X-axis compensation, interpolation is first performed in the X-axis direction to obtain two first intermediate values, as shown in formula (8): …………(8) in, This represents a first intermediate value. Indicates another first intermediate value, This represents the coordinates of the second actual position.
[0078] Interpolation is performed along the X-axis to obtain two Y coordinates, as shown in formula (9): ………………(9) in, Represents a Y coordinate. This represents another Y-coordinate.
[0079] Perform a second interpolation in the Y-axis direction to obtain the X-axis compensation value, as shown in formula (10): ………………………………(10) in, This represents the X-axis compensation value.
[0080] Similarly, for compensation along the Y-axis, interpolation is first performed in the Y-axis direction to obtain two second intermediate values, as shown in formula (11): …………(11) in, This represents a second intermediate value. This represents another second intermediate value.
[0081] Interpolation is performed along the Y-axis to obtain two X coordinates, as shown in formula (12): ………………(12) in, Represents an X coordinate. This represents another X coordinate.
[0082] A second interpolation is performed in the X-axis direction to obtain the Y-axis compensation value, as shown in formula (13): ………………………………(13) in, This represents the Y-axis compensation value.
[0083] Then, the final compensation value is obtained through the X-axis compensation value and the Y-axis compensation value.
[0084] In this context, within the allowable error range, formulas (8) to (13) are equal signs.
[0085] This application addresses the processing and assembly errors of the equipment itself by creating a calibration board to calibrate the mounting errors of the entire XY platform surface mounting area, achieving mounting accuracy compensation at any position on the mounting plane. Furthermore, it combines a bilinear interpolation algorithm to eliminate geometric errors on the XY platform surface, improving the mounting accuracy of the mounting area on the XY platform surface.
[0086] Figure 3 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 3 As shown, the electronic device may include a processor 301, a communication interface 302, a memory 303, and a communication bus 304. The processor 301, communication interface 302, and memory 303 communicate with each other via the communication bus 304. The processor 301 can call logical instructions from the memory 303 to execute a mounting accuracy compensation method based on the XY platform.
[0087] Furthermore, the logical instructions in the aforementioned memory 303 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0088] On the other hand, the present invention also provides a computer program product, the computer program product including a computer program stored on a non-transitory computer-readable storage medium, the computer program including program instructions, and when the program instructions are executed by a computer, the computer is able to execute the mounting accuracy compensation method based on the XY platform provided by the above methods.
[0089] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the mounting accuracy compensation method based on the XY platform provided in the above embodiments.
[0090] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.
[0091] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.
[0092] Finally, it should be noted that the above descriptions are merely preferred embodiments of this application, and this application is not limited to the above embodiments. It is understood that other improvements and variations directly derived or conceived by those skilled in the art without departing from the spirit and concept of this application should be considered to be included within the protection scope of this application.
Claims
1. A mounting precision compensation method based on an XY platform surface, characterized in that, The method comprises: The calibration plate is arranged to a mounting area of an XY platform surface of a packaging device; wherein the calibration plate comprises a plate body and a plurality of calibration points on the plate body, the plurality of calibration points are arranged in an array form in X b axial direction and Y b axial direction, at least four adjacent calibration points form a calibration group, the calibration points in the calibration group are arranged in X b axial direction and Y b axial direction are consistent and are greater than or equal to 2. obtaining, by a welding head camera, first actual position coordinates of each calibration point on the calibration plate in a mechanical coordinate system XOY created based on an XY platform surface, calculating an actual tilt angle of the calibration plate by using a plurality of calibration groups on the diagonal line, calculating a theoretical position coordinate of each calibration point by using the actual tilt angle of the calibration plate, and taking a deviation between the first actual position coordinate and the theoretical position coordinate of each calibration point as a corresponding compensation amount, wherein the compensation amount represents a deviation in recognition of a mounting position caused by the packaging equipment; in a process of mounting a chip by using the packaging equipment, determining a second actual position coordinate of a target mounting point in the mechanical coordinate system XOY by using the welding head camera, and determining a target calibration group corresponding to the second actual position coordinate; compensating the second actual position coordinate of the target mounting point in the mechanical coordinate system XOY based on the first actual position coordinates of the calibration points in the target calibration group and the compensation amounts by using an interpolation algorithm to obtain a final compensation value corresponding to the target mounting point.
2. The XY stage-based placement accuracy compensation method of claim 1, wherein, The target calibration set includes a calibration point located at the i-th row and the j-th column D i,j a calibration point located at the i-th row and the j+1-th column D i,j+1 a calibration point located at the i+1-th row and the j-th column D i+1,j a calibration point located at the i+1-th row and the j+1-th column D i+1,j+1 ; wherein i and j are integer parameters; calibration point D i,j+1 the first actual position coordinate of calibration point D i+1,j+1 the first actual position coordinate of calibration point D i,j the first actual position coordinate of calibration point D i+1,j the first actual position coordinate of calibration point The compensation amount corresponding to the first actual position coordinate of the calibration point in the target calibration group comprises: a compensation amount of each calibration point in the X-axis direction of the mechanical coordinate system and a compensation amount of each calibration point in the Y-axis direction of the mechanical coordinate system; Wherein, the calibration point D i,j+1 The compensation amount in the X axis is The compensation amount in the Y axis is ; Calibration point D i+1,j+1 The compensation amount in the X axis is The compensation amount in the Y axis is ; Calibration point D i,j The compensation amount in the X axis is The compensation amount in the Y axis is ; Calibration point D i+1,j The compensation amount in the X axis is The compensation amount in the Y axis is .
3. The XY stage-based placement accuracy compensation method of claim 2, wherein, compensating the second actual position coordinate of the target mounting point in the mechanical coordinate system XOY based on the first actual position coordinates of the calibration points in the target calibration group and the compensation amounts by using an interpolation algorithm to obtain a final compensation value corresponding to the target mounting point, comprises: based on the first actual position coordinates, the compensation amounts and the second actual position coordinates, performing one-dimensional linear interpolation on two groups of adjacent calibration points to obtain two first intermediate values and two Y coordinates, and then performing quadratic interpolation on the first intermediate values and the Y coordinates to obtain an X-axis compensation value; based on the first actual position coordinates, the compensation amounts and the second actual position coordinates, performing one-dimensional linear interpolation on two groups of adjacent calibration points to obtain two second intermediate values and two X coordinates, and then performing quadratic interpolation on the second intermediate values and the X coordinates to obtain a Y-axis compensation value; obtaining the final compensation value based on the X-axis compensation value and the Y-axis compensation value.
4. The XY stage-based placement accuracy compensation method of claim 3, wherein, compensating the second actual position coordinate of the target mounting point in the mechanical coordinate system XOY based on the first actual position coordinates of the calibration points in the target calibration group and the compensation amounts by using an interpolation algorithm, comprises: the first intermediate value calculation formula comprises: ； wherein denotes a first intermediate value, denotes another first intermediate value, denotes a second actual position coordinate; the Y coordinate calculation formula comprises: ； wherein represents one Y coordinate, represents another Y coordinate; the X-axis compensation value calculation formula comprises: ； wherein represents the X-axis compensation value; the second intermediate value calculation formula comprises: ； wherein denotes a second intermediate value, denotes another second intermediate value; ； wherein represents one X coordinate, represents another X coordinate; the Y-axis compensation value calculation formula comprises: ； wherein, represents the Y-axis compensation value; compensating the target mounting point based on the X-axis compensation value and the Y-axis compensation value.
5. The XY stage-based placement accuracy compensation method according to any one of claims 1-4, wherein, Any one of the calibration groups located on the diagonal line includes a calibration point located at the kth row and the kth column D k,k a calibration point located at the kth row and the k+1th column D k,k+1 a calibration point located at the k+1th row and the kth column D k+1,k a calibration point located at the k+1th row and the k+1th column D k+1,k+1 ; wherein k is an integer parameter; calculating the actual tilt angle of the calibration plate by using a plurality of calibration groups on the diagonal line, comprises: Based on the calibration points in each calibration group D k,k First actual position coordinates and calibration point D k+1,k+1 First actual position coordinates, calculate calibration point D k,k and calibration points D k+1,k+1 The angle between the lines connecting them relative to the X-axis of the machine coordinate system is used to determine the average angle calculated by all calibration groups as the candidate tilt angle; calculating a difference value between the candidate tilt angle and the preset tilt angle, and determining the obtained difference value as the actual tilt angle.
6. The XY stage-based placement accuracy compensation method according to any one of claims 1-4, wherein, calculating the theoretical position coordinate of each calibration point by using the actual tilt angle of the calibration plate and taking a deviation between the first actual position coordinate and the theoretical position coordinate of each calibration point as a corresponding compensation amount, comprises: inputting the actual tilt angle and the coordinates of the calibration point in the calibration coordinate system into a preset mapping relationship formula to obtain the theoretical position coordinate; The mapping relationship formula includes: ； wherein, represents a theoretical position coordinate, represents a coordinate of a calibration point under a calibration plate coordinate system, represents an actual tilt angle of the calibration plate, represents an origin coordinate of the machine coordinate system; The compensation amount includes: ； wherein, represents the compensation amount corresponding to the calibration point on the X axis, represents the compensation amount corresponding to the calibration point on the Y axis, represents the theoretical position coordinate in the mechanical coordinate system after mapping the initial coordinate, represents the first actual position coordinate in the mechanical coordinate based on the welding head camera, M represents the number of calibration points corresponding to the X axis, and N represents the number of calibration points corresponding to the Y axis.
7. The XY stage-based placement accuracy compensation method of claim 4, wherein, The determination of the coordinates of the calibration points in the calibration plate coordinate system includes: ； wherein, represents the distance between two calibration points in the positive direction of the X axis, represents the deviation value of the mth calibration point in the X axis direction after re-measurement by the photolithography machine, represents the distance between two calibration points in the positive direction of the Y axis, represents the deviation value of the nth calibration point in the Y axis direction after re-measurement by the photolithography machine.
8. The XY stage-based placement accuracy compensation method of any of claims 1-4, wherein, The error of the calibration point in the calibration plate that is farthest from the origin in the diagonal positive direction of the X axis and the Y axis is less than or equal to 1 μm@3σ / 25°C; The center distance precision between each calibration point is less than or equal to 0.3 μm@3σ / 25°C; The material of the calibration plate is microcrystalline glass.
9. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor implements the steps of the mounting precision compensation method based on the XY platform surface according to any one of claims 1 to 8 when executing the program. 10.A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the mounting precision compensation method based on the XY platform surface according to any one of claims 1 to 8.