Method for measuring cutting temperature of PCB (Printed Circuit Board) micro-drilling tool based on micro-texture pre-embedded wire

Abstract

The invention discloses a method for measuring the cutting temperature of a PCB micro-drilling tool based on a micro-texture pre-embedded wire. The method comprises the following steps: S1, preparing a PCB micro-drilling tool with a micro-texture; s2, connecting the two wires embedded in the microstructure to a calibration data acquisition module; s3, a tool nose of the PCB micro-drilling tool is heated through a heater, a calibration data acquisition module synchronously acquires resistance data of the tool nose, and a data processing terminal generates a temperature-resistance calibration database according to the temperature data and the resistance data; s4, the PCB micro-drilling tool is installed on a machine tool main shaft, and the two wires are connected to a resistance data acquisition module on the machine tool main shaft; and S5, the resistance value of the tool nose during drilling operation is collected in real time through a resistance data collection module, and the data processing terminal obtains the corresponding cutting temperature value from the temperature-resistance calibration database according to the resistance value. According to the invention, the temperature distribution characteristics of the PCB micro-drill tool in the whole processing time can be accurately obtained.

Description

Technical Field

[0001] This invention relates to the field of PCB micro-drilling tool technology, and in particular to a method for measuring the cutting temperature of PCB micro-drilling tools based on micro-textured pre-embedded conductors. Background Technology

[0002] Compared to conventional drilling, PCB micro-drilling presents unique challenges in heat transfer and temperature measurement: First, the heat generated during PCB drilling is primarily concentrated at the rake angle of the cutting edge. Due to varying cutting speeds, the heat generated on this edge is uneven, and the heat-laden chips are trapped within the spiral grooves for extended periods, resulting in a more severe temperature rise under the same operating conditions compared to other processes, making temperature monitoring significantly more difficult. Second, the extremely small size of PCB micro-drilling tools, coupled with the complex and variable internal structure of PCB composite boards, leads to a dynamic and continuous change in tool temperature during machining. These characteristics make precise temperature capture during PCB micro-drilling challenging. Therefore, obtaining the temperature distribution characteristics of the cutting edge throughout the entire machining time has become crucial for improving tool life and the quality of the machined surface.

[0003] Currently, the commonly used temperature measurement technologies in the industry are mainly divided into two categories: contact temperature measurement technology and non-contact temperature measurement technology.

[0004] Among them, non-contact temperature measurement technology is represented by infrared thermometry. Its core defects are: first, the emissivity correction accuracy is insufficient. Due to interference factors such as chips and dust in the PCB processing environment, it is difficult to accurately calibrate the emissivity of the tool surface, resulting in a large temperature measurement error; second, it cannot measure the temperature of objects that are blocked or covered. In PCB micro-drilling, the cutting edge of the tool is often blocked by chips and board material, which makes it impossible to directly apply the infrared thermometry to the temperature measurement of the core cutting area of ​​the tool.

[0005] In contact temperature measurement technology, the use of temperature sensors is a common solution. However, this technology has significant limitations when applied to temperature measurement of PCB micro-drills: due to the extremely small size of PCB micro-drill tools, the installation of temperature sensors will damage the integrity of the tool structure and affect cutting performance; at the same time, the sensor response speed is slow, making it impossible to achieve real-time dynamic temperature detection, and it is easily damaged by vibration and cutting forces in the high-speed rotating micro-drill machining environment, making it difficult to meet the long-term stable industrial processing requirements.

[0006] Therefore, there is an urgent need for a technical solution that can be specifically adapted to the structural characteristics of PCB micro-drill tools and achieve accurate temperature measurement throughout the entire processing time, in order to fill the existing technological gap. Summary of the Invention

[0007] The problem to be solved by the present invention is to provide a method for measuring the cutting temperature of PCB micro-drilling tools based on micro-textured pre-embedded conductors, so as to overcome the shortcomings of the existing technology in that it is difficult to achieve accurate temperature measurement of PCB micro-drilling tools throughout the entire machining time.

[0008] The technical solution adopted by this invention to solve its technical problem is: a method for measuring the cutting temperature of a PCB micro-drill tool based on micro-textured embedded conductors, comprising the following steps: S1, Fabrication of PCB micro-drills with microtexture; A micro-texture is machined along two chip removal grooves of the PCB micro-drill tool, and wires are pre-embedded in both micro-textures; S2, Construct the calibration data acquisition loop; Both wires are connected to the calibration data acquisition module, so that the two wires form a calibration data acquisition loop with the calibration data acquisition module through the tip of the PCB micro drill bit; S3, Generate temperature-resistance calibration database; The tip of the PCB micro-drill is gradually heated from low to high within a set temperature range by a heater, while the calibration data acquisition module simultaneously acquires the resistance data of the tip through two wires; the temperature data of the heater and the resistance data acquired by the calibration data acquisition module are obtained by the data processing terminal, and a temperature-resistance calibration database is generated based on the temperature data and the resistance data. S4, Construct a temperature measurement and acquisition loop; Disconnect the two wires from the calibration data acquisition module, install the PCB micro drill bit onto the machine tool spindle, and connect both wires to the resistance data acquisition module on the machine tool spindle, so that the two wires form a temperature measurement acquisition loop with the resistance data acquisition module through the tip of the PCB micro drill bit; S5, PCB micro-drill tool cutting temperature measurement; The machine tool spindle drives the PCB micro-drill tool to perform drilling operations on the PCB board. The resistance value of the tool tip is collected in real time by the resistance data acquisition module. The data processing terminal obtains the corresponding cutting temperature value from the temperature-resistance calibration database based on the resistance value collected by the resistance data acquisition module.

[0009] As a further improvement of the present invention, in step S1, the microtexture is a groove with a certain depth and width opened along the inner wall of the chip removal groove.

[0010] As a further improvement of the present invention, the width of the groove is 0.015mm~0.3mm and the depth is 0.015mm~0.3mm.

[0011] As a further improvement of the present invention, in step S1, the end of the wire extending toward the blade tip is the end point, and a safety distance is reserved between the end point of the wire and the edge of the blade tip, the safety distance being 0.05mm~0.1mm.

[0012] As a further improvement of the present invention, in step S1, the cutting tip is provided with a resistance measuring area, the width of the resistance measuring area along the extension direction of the chip removal groove is H, H is greater than the safety distance, and H is 0.1mm~0.2mm; the end of the wire extends into the resistance measuring area, and only the section of the wire within the resistance measuring area is electrically connected to the PCB micro-drilling tool.

[0013] As a further improvement of the present invention, the section of the conductor located within the resistance measurement area is bonded with conductive adhesive and embedded in the microtexture, while the remaining sections of the conductor located within the microtexture are wrapped with insulating adhesive.

[0014] As a further improvement of the present invention, in step S3, in the temperature-resistance calibration database, the temperature data heated by the heater and the resistance data collected by the calibration data acquisition module have a one-to-one correspondence, that is, when the heater heats the blade tip to a certain temperature value, the blade tip has a corresponding and unique resistance value at that temperature value.

[0015] As a further improvement of the present invention, in step S3, within a set temperature range, the correspondence between temperature data and resistance data in the temperature-resistance calibration database is fitted with a quadratic polynomial to form a functional relationship: T=AR 2 +BR+C; where T is the temperature value, R is the resistance value, A is the coefficient of the quadratic term, B is the coefficient of the linear term, and C is the constant term; in step S5, when the resistance data acquisition module acquires a certain resistance value of the tool tip, the corresponding cutting temperature value can be calculated through the functional relationship.

[0016] As a further improvement of the present invention, in step S4, the resistance data acquisition module is fixedly connected to the machine tool spindle so as to rotate synchronously with the machine tool spindle; The resistance data acquisition module is equipped with a storage module. In step S5, the resistance value of the blade tip acquired by the resistance data acquisition module is stored in the storage module and can be read by the data processing terminal. Alternatively, the resistance data acquisition module may be equipped with a wireless module. In step S5, the wireless module establishes a wireless communication connection with the data processing terminal to transmit the resistance value of the blade tip acquired by the resistance data acquisition module to the data processing terminal in real time.

[0017] As a further improvement of the present invention, the PCB micro-drilling tool is a drill bit or milling cutter with a diameter between 0.05 and 2 mm; the diameter of the conductor is 0.01 mm to 0.1 mm.

[0018] The beneficial effects of this invention are as follows: This invention provides a method for measuring the cutting temperature of a PCB micro-drill tool based on micro-textured embedded wires. By machining micro-textures and embedding wires in the two chip grooves of the PCB micro-drill tool, it cleverly utilizes the structural space of the chip grooves and leverages the perfect fit between the micro-texture and the wires to the structural characteristics of the small-sized PCB micro-drill tool. This achieves stable fixation and signal transmission of the wires on the PCB micro-drill tool without damaging the overall tool structure or affecting cutting performance. Simultaneously, through the acquisition loop formed by the wires and the tool tip, precise correlation between temperature and resistance is achieved. Temperature is generated by simultaneously acquiring the resistance data of the tool tip through heating with a heater and calibration data acquisition module. The resistance calibration database establishes a precise correlation between temperature and resistance, enabling the temperature change of the cutting tip during the cutting process to be directly converted into a detectable resistance signal. By using the temperature-resistance calibration database to deduce the actual temperature value, the temperature distribution characteristics of the PCB micro-drill tool throughout the entire machining time can be accurately obtained. The entire method is a complete closed loop with strong operability. It not only overcomes the technical bottlenecks of existing technologies that cannot adapt to extremely small PCB micro-drill tools and are difficult to capture concentrated and dynamically changing cutting temperatures, but also provides reliable temperature data support for subsequent optimization of machining parameters, reduction of tool wear, and improvement of PCB board slot quality, significantly improving the production yield and stability of PCB micro-drilling. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart illustrating the steps of the PCB micro-drill tool cutting temperature measurement method based on micro-textured embedded conductors according to the present invention. Figure 2 This is a perspective view of the PCB micro-drilling tool in this invention; Figure 3 This is a schematic diagram of the structure for constructing the calibration data acquisition loop in step S2 of the present invention; Figure 4 This is a schematic diagram of the structure of the temperature measurement and acquisition loop constructed in step S4 of the present invention.

[0021] Referring to the accompanying drawings, the following explanations are provided: 1. PCB micro drill bit; 101. Microtexture; 102. Chip groove; 103. Tool tip; 1031. Resistance measurement area; 2. Wire; 3. Calibration data acquisition module; 4. Heater; 5. Data processing terminal; 6. Machine tool spindle; 7. Resistance data acquisition module; 8. Conductive adhesive; 9. Insulating adhesive; 10. PCB board; 11. Mounting device. Detailed Implementation

[0022] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0024] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0025] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0026] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0027] See Figures 1 to 4 This invention provides a method for measuring the cutting temperature of a PCB micro-drill tool based on micro-textured pre-embedded wires. It is implemented based on a PCB micro-drill tool cutting temperature measurement system, which includes a PCB micro-drill tool 1, a wire 2, a calibration data acquisition module 3, a heater 4, a data processing terminal 5, a machine tool spindle 6, a resistance data acquisition module 7, and a fixing mount 11.

[0028] The present invention provides a method for measuring the cutting temperature of PCB micro-drilling tools based on micro-textured embedded conductors, comprising the following steps: S1, Prepare a PCB micro-drill tool 1 with microtexture 101; S2, Construct the calibration data acquisition loop; S3, Generate temperature-resistance calibration database; S4, Construct a temperature measurement and acquisition loop; S5, PCB micro drill tool 1 cutting temperature measurement.

[0029] Specifically, such as Figure 2 As shown, the PCB micro-drill cutter 1 has at least two helical chip removal grooves 102. In step S1, a micro-texture 101 is machined along each of the two chip removal grooves 102 of the PCB micro-drill cutter 1, and a wire 2 is pre-embedded in both micro-textures 101. The end of the wire 2 extending toward the tip 103 of the PCB micro-drill cutter 1 is the end point, which is fixedly connected to the PCB micro-drill cutter 1 and electrically connected to the tip 103; the other end of the wire 2 is the beginning point, and an electrical connector can be provided at the beginning point of the wire 2 to facilitate electrical connection with the calibration data acquisition module 3 or the resistance data acquisition module 7.

[0030] like Figure 3 As shown, in step S2, the PCB micro-drill cutter 1 prepared in step S1 is fixed on the mounting bracket 11, and both wires 2 are connected to the calibration data acquisition module 3, so that the two wires 2 form a calibration data acquisition loop with the calibration data acquisition module 3 through the tip 103 of the PCB micro-drill cutter 1. The calibration data acquisition module 3 is used to acquire the resistance data of the tip 103 through the two wires 2.

[0031] Further, in step S3, the heating source of the heater 4 is brought into contact with the tip 103 of the PCB micro-drill tool 1. The heater 4 is controlled to gradually heat the tip 103 of the PCB micro-drill tool 1 from low to high within a set temperature range. Simultaneously, the calibration data acquisition module 3 synchronously acquires the resistance data of the tip 103 through two wires 2. Both the heater 4 and the calibration data acquisition module 3 are communicatively connected to the data processing terminal 5 to transmit their respective data. The data processing terminal 5 acquires the temperature data of the heater 4 and the resistance data acquired by the calibration data acquisition module 3, and generates a temperature-resistance calibration database based on the temperature and resistance data.

[0032] like Figure 4 As shown, in step S4, the connection between the two wires 2 and the calibration data acquisition module 3 is disconnected, the PCB micro drill 1 is removed from the mounting bracket 11 and installed on the machine tool spindle 6, and then both wires 2 are connected to the resistance data acquisition module 7 on the machine tool spindle 6, so that the two wires 2 form a temperature measurement acquisition circuit with the resistance data acquisition module 7 through the tip 103 of the PCB micro drill 1; the resistance data acquisition module 7 is used to acquire the resistance value of the tip 103 through the two wires 2.

[0033] Furthermore, the machine tool is started, and the machine tool spindle 6 drives the PCB micro drill bit 1 to perform drilling operations on the PCB board 10 below. The resistance value of the tool tip 103 is collected in real time by the resistance data acquisition module 7. The data processing terminal 5 can obtain the resistance value of the tool tip 103 collected by the resistance data acquisition module 7. The data processing terminal 5 obtains the corresponding cutting temperature value from the temperature-resistance calibration database based on the resistance value collected by the resistance data acquisition module 7.

[0034] This invention utilizes the structural space of the chip removal grooves 102 of a PCB micro-drilling tool 1 by machining micro-textures 101 and pre-embedding wires 2 within them. It also leverages the perfect fit between the micro-textures 101 and the wires 2 to the small-sized PCB micro-drilling tool 1, achieving stable fixation and signal transmission of the wires 2 on the PCB micro-drilling tool 1 without damaging the overall tool structure or affecting cutting performance. Simultaneously, the acquisition loop formed by the wires 2 and the tool tip 103 enables precise correlation between temperature and resistance. Heating with a heater 4 and synchronously acquiring resistance data from the tool tip 103 using a calibration data acquisition module 3 generates a temperature-resistance calibration database, establishing... The precise correlation between temperature and resistance was established, enabling the temperature change of the tool tip 103 during cutting to be directly converted into a detectable resistance signal. The actual temperature value was then deduced from the temperature-resistance calibration database, allowing for accurate acquisition of the temperature distribution characteristics of the PCB micro-drill tool 1 throughout the entire machining process. The entire method is a complete closed-loop process with strong operability. It not only overcomes the technical bottlenecks of existing technologies that cannot adapt to the extremely small PCB micro-drill tool 1 and are difficult to capture concentrated and dynamically changing cutting temperatures, but also provides reliable temperature data support for subsequent optimization of machining parameters, reduction of tool wear, and improvement of the slot quality of the PCB board 10, significantly improving the production yield and stability of PCB micro-drilling.

[0035] See Figure 2 In step S1, the microtexture 101 is a groove with a certain depth and width opened along the inner wall of the chip removal groove 102 using a grinding wheel. This design makes full use of the structural space of the chip removal groove 102, without the need to open additional structures in the non-functional area of ​​the PCB micro drill 1, thus avoiding damage to the overall structural integrity of the PCB micro drill 1. At the same time, the groove on the inner wall of the chip removal groove 102 can stably accommodate the wire 2 without affecting the normal discharge of chips, ensuring that the cutting performance of the PCB micro drill 1 is not affected, and providing a reasonable and reliable structural foundation for the subsequent stable pre-embedding of the wire 2 and the construction of the measurement circuit.

[0036] The groove extends in the same direction as the chip removal groove 102, both being spiral-shaped. The width of the groove is 0.015mm~0.3mm, and the depth is 0.015mm~0.3mm. In this embodiment, preferably, both the width and depth of the groove are 0.015mm. This dimensional parameter precisely matches the subsequently defined 0.01mm diameter wire 2, ensuring that the wire 2 is securely embedded in the microtexture 101 while minimizing the impact of the microtexture 101 on the tool strength, thus avoiding problems such as breakage and deformation during tool cutting due to structural modifications.

[0037] It is worth mentioning that in step S1, the microtexture 101 formed in the chip removal groove 102 does not extend to the edge of the cutting tip 103, but leaves a distance from the edge of the cutting tip 103. This allows for a safety distance h between the wire 2 embedded in the microtexture 101 and the edge of the cutting tip 103. The safety distance h is 0.05mm to 0.1mm, preferably 0.05mm. This safety distance h effectively prevents the wear and collision of the cutting tip 103 from directly affecting the wire 2 during the cutting process of the PCB micro-drill tool 1, preventing damage to the wire due to cutting stress or friction, ensuring the continuity and stability of the measurement circuit, and extending the service life of the wire. At the same time, this distance does not affect the temperature conduction in the cutting tip 103 area, ensuring that the wire 2 can accurately acquire the resistance signal corresponding to the cutting temperature of the cutting tip 103.

[0038] In this invention, the cutting tip 103 has a resistance measurement area 1031 near its edge. The width of the resistance measurement area 1031 along the chip removal groove 102 is H. The end of the wire 2 extends into the resistance measurement area 1031, and the section of the wire 2 within the resistance measurement area 1031 is electrically connected to the PCB micro-drilling tool 1. This forces the current path to be confined to the core cutting area of ​​the cutting tip 103, effectively eliminating the interference of resistance from other parts of the tool on the measurement results. This ensures that the collected resistance data can truly reflect the changes in cutting temperature, significantly improving the accuracy of temperature measurement. At the same time, clearly defining that the end of the wire extends into this temperature measurement area further ensures the targeted nature of the resistance signal acquisition, avoids the generation of invalid data, and provides a high-quality data foundation for subsequent temperature calculations.

[0039] In this embodiment, the width H of the resistance measuring region 1031 is greater than the safety distance h, and H is 0.1mm~0.2mm, preferably 0.1mm. That is to say, the 0.05mm section of the end of the conductor 2 in this embodiment is located within the resistance measuring region 1031.

[0040] Further explanation of the circuit formed by the two wires 2 and the resistance measurement area 1031: When the calibration data acquisition module 3 / resistance data acquisition module 7 is working, the current I generated flows in from one side of the wire 2, passes through the resistance measurement area 1031 and flows out from the other side of the wire 2. The current path is forcibly confined within a very small resistance measurement area 1031 of the tool tip 103. When measuring the cutting temperature of the PCB micro drill tool 1, the overall resistance at this position is independent of the current and the tool length, and is only determined by the local ρ(T) and contact size a of the contact area. Here, ρ(T) is the resistivity of the contact area material and a is the equivalent contact radius. That is, the two wires 2 are adjacent and can be approximately merged into an effective circular spot.

[0041] Continue reading Figure 2The section of wire 2 within the resistance measurement area 1031 is bonded with conductive adhesive 8 and embedded in the microtexture 101, ensuring a stable and reliable electrical connection between the wire and the PCB micro-drill tool 1, and ensuring effective transmission of the resistance signal. The remaining sections of wire 2 within the microtexture 101 are wrapped with insulating adhesive 9, which isolates the resistance interference in the non-temperature measurement area of ​​the PCB micro-drill tool 1, avoids the formation of stray loops, and ensures the purity of the measurement circuit. At the same time, the use of both adhesives can firmly fix wire 2 within the microtexture 101, preventing wire 2 from shifting due to high-speed rotation and vibration of the tool during processing, thus taking into account the reliability of electrical connection, anti-interference and structural stability.

[0042] In step S3, the heater 4 can gradually heat the tip 103 of the PCB micro drill 1 at certain temperature intervals, for example, by gradually increasing the temperature in increments of 0.5°C.

[0043] Furthermore, in step S3, in the temperature-resistance calibration database, the temperature data heated by the heater 4 and the resistance data collected by the calibration data acquisition module 3 have a one-to-one correspondence. That is, when the heater 4 heats the blade tip 103 to a certain temperature value, the blade tip 103 has a corresponding and unique resistance value at that temperature value. It should be noted that, in order to ensure that the heating temperature of the heater 4 is consistent with the temperature of the blade tip 103, the resistance value of the blade tip 103 can be measured after the heating is maintained at the current temperature value for a certain period of time.

[0044] Within a set temperature range, the correspondence between temperature and resistance data in the temperature-resistance calibration database is established as a functional relationship through quadratic polynomial fitting: T=AR 2 +BR+C; where T is the temperature value, R is the resistance value, A is the coefficient of the quadratic term, B is the coefficient of the linear term, and C is the constant term. In step S5, when the resistance data acquisition module 7 acquires a certain resistance value of the tool tip 103, the corresponding cutting temperature value can be calculated through the functional relationship, which not only improves the accuracy of temperature calculation, but also enables accurate interpolation calculation for temperature points not fully covered by the calibration data.

[0045] In step S4, the resistance data acquisition module 7 is fixedly connected to the machine tool spindle 6 so as to rotate synchronously with the machine tool spindle 6, thereby achieving relative stillness between the machine tool spindle 6 and the resistance data acquisition module 7 during the processing.

[0046] In this embodiment, the resistance data acquisition module 7 is equipped with a storage module. In step S5, during the drilling operation of the PCB micro drill 1 by the machine tool spindle 6 driving the PCB board 10, the resistance value of the tool tip 103 is collected in real time by the resistance data acquisition module 7 and stored in the storage module. After the drilling of the PCB board 10 is completed, the resistance data acquisition module 7 is connected to the data processing terminal 5. The data processing terminal 5 reads the measurement data stored in the storage module and then calculates the corresponding cutting temperature value through the function relationship.

[0047] Of course, in some other embodiments of the present invention, a wireless module may also be provided on the resistance data acquisition module 7. In step S5, the wireless module establishes a wireless communication connection with the data processing terminal 5 so as to transmit the resistance value of the blade tip 103 acquired by the resistance data acquisition module 7 to the data processing terminal 5 in real time.

[0048] In this embodiment, both the calibration data acquisition module 3 and the resistance data acquisition module 7 employ high-precision resistance measuring devices capable of amplifying the acquired resistance, which is a conventional technology. The data processing terminal 5 can be a computer.

[0049] In this invention, the PCB micro-drilling tool 1 is a drill or milling cutter with a diameter between 0.05 and 2 mm, which is a mainstream micro-drilling tool specification in the PCB industry; the diameter of the wire is 0.01 mm to 0.1 mm, preferably 0.01 mm, which perfectly matches the size of the micro-texture 101, ensuring that the wire 2 can be successfully embedded in the micro-texture 101, and that the tool structure will not be damaged or the cutting performance will be affected due to the excessive size of the wire 2.

[0050] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments.

[0051] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A PCB micro drill tool cutting temperature measurement method based on micro-texture pre-embedded wire, characterized by, The method comprises the following steps: S1, preparing a PCB micro drill tool (1) with a micro texture (101); A micro texture (101) is machined along each of two chip flutes (102) of the PCB micro drill tool (1), and a wire (2) is embedded in each of the two micro textures (101); S2, constructing a calibration data acquisition loop; Both of the two wires (2) are connected to a calibration data acquisition module (3), so that the two wires (2) form a calibration data acquisition loop with the calibration data acquisition module (3) through the tip (103) of the PCB micro drill tool (1); S3, generating a temperature-resistance calibration database; The tip (103) of the PCB micro drill tool (1) is gradually heated from low to high within a set temperature range by a heater (4), while the calibration data acquisition module (3) synchronously collects resistance data of the tip (103) through the two wires (2); the temperature data of the heater (4) and the resistance data collected by the calibration data acquisition module (3) are acquired by a data processing terminal (5), and a temperature-resistance calibration database is generated according to the temperature data and the resistance data; S4, constructing a temperature measurement acquisition loop; The connection between the two wires (2) and the calibration data acquisition module (3) is disconnected, the PCB micro drill tool (1) is installed on a machine tool spindle (6), and the two wires (2) are connected to a resistance data acquisition module (7) on the machine tool spindle (6), so that the two wires (2) form a temperature measurement acquisition loop with the resistance data acquisition module (7) through the tip (103) of the PCB micro drill tool (1); S5, cutting temperature measurement of the PCB micro drill tool (1); The machine tool spindle (6) drives the PCB micro drill tool (1) to perform drilling on a PCB plate (10), and the resistance value of the tip (103) is collected in real time by the resistance data acquisition module (7), and the data processing terminal (5) obtains the corresponding cutting temperature value from the temperature-resistance calibration database according to the resistance value collected by the resistance data acquisition module (7).

2. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method according to claim 1, wherein, In step S1, the micro texture (101) is a groove with a certain depth and width opened along the inner wall of the chip flute (102).

3. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method according to claim 2, wherein, The width of the groove is 0.015mm~0.3mm, and the depth is 0.015mm~0.3mm.

4. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method of claim 1, wherein, In step S1, the end of the wire (2) extending towards the tip (103) is the terminal end, and a safety distance is reserved between the terminal end of the wire (2) and the edge of the tip (103), and the safety distance is 0.05mm~0.1mm.

5. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method according to claim 4, wherein, In step S1, the tool tip (103) is provided with a measurement resistance area (1031) extending along the width of the chip flute (102) in the direction of extension, and the width H of the measurement resistance area (1031) is greater than the safety distance and is 0.1mm-0.2mm; the end of the wire (2) extends into the measurement resistance area (1031), and only the section of the wire (2) in the measurement resistance area (1031) is electrically connected to the PCB micro drill tool (1).

6. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method according to claim 5, wherein, The section of the wire (2) in the measurement resistance area (1031) is bonded and inlaid in the micro texture (101) using conductive glue (8), and the remaining section of the wire (2) in the micro texture (101) is wrapped with insulating glue (9).

7. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method of claim 1, wherein, In step S3, in the temperature-resistance calibration database, the temperature data of the heater (4) and the resistance data collected by the calibration data collection module (3) have a one-to-one correspondence, that is, when the heater (4) heats the tool tip (103) to a certain temperature value, the tool tip (103) has a corresponding and unique resistance value at the temperature value.

8. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method according to claim 7, wherein, In step S3, in the temperature range, the temperature data and the resistance data in the temperature-resistance calibration database are fitted by a quadratic polynomial to form a function relationship: T=AR 2 +BR+C; wherein, T is the temperature value, R is the resistance value, A is the quadratic coefficient, B is the linear coefficient, and C is the constant term; in step S5, when the resistance data acquisition module (7) collects a certain resistance value of the tool tip (103), the corresponding cutting temperature value can be calculated by the function relationship.

9. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method of claim 1, wherein, In step S4, the resistance data collection module (7) is fixedly connected with the machine tool spindle (6) to rotate synchronously with the machine tool spindle (6); The resistance data collection module (7) is provided with a storage module, and in step S5, the resistance value of the tool tip (103) collected by the resistance data collection module (7) is stored in the storage module and can be read by the data processing terminal (5); Or the resistance data collection module (7) is provided with a wireless module, and in step S5, the wireless module establishes a wireless communication connection with the data processing terminal (5) to transmit the resistance value of the tool tip (103) collected by the resistance data collection module (7) to the data processing terminal (5) in real time.

10. The micro-texture embedded wire based PCB micro drill tool cutting temperature measurement method of claim 1, wherein, The PCB micro drill tool (1) is a drill or a milling cutter with a diameter of 0.05-2mm; the diameter of the wire is 0.01mm-0.1mm.

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