Laser processing device and method

Abstract

The invention belongs to the technical field of microgroove machining, and discloses a laser machining device and method.The laser machining device comprises a laser conveying assembly, a rotary disc module and an objective table, a to-be-machined part is rotationally installed on the objective table, the objective table can move on the X axis, the Y axis and the Z axis and can adjust the machining taper of the to-be-machined part, and the rotary disc module is located above the objective table; a laser head is arranged on the rotary disc module and used for laser machining on a workpiece to be machined, and the laser conveying assembly can emit laser beams, conduct beam expanding, shaping and parallel alignment on the laser beams and then guide the laser beams to the laser head. The laser beam can be subjected to beam expanding, shaping and parallel alignment through the laser conveying assembly, the objective table can move on the X axis, the Y axis and the Z axis, the machining taper of a workpiece to be machined can be adjusted, and therefore the machining effect of narrow width, large depth and high quality can be achieved in cooperation with the laser beam subjected to beam expanding and shaping; therefore, the machining size precision and the machining efficiency of the microgroove with the high aspect ratio are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of micro-groove processing, and particularly relates to a laser processing device and method. BACKGROUND

[0002] With the development of aerospace technology, a large number of micro-groove alloy structure mechanical parts with high depth-width ratio are increasingly applied in the fields of aerospace turbine blades, engine fuel injection nozzles, artificial simulation test blocks of aviation metal fatigue cracks, and turbofan guide grooves, and the precision requirements are also increasingly high. Traditional mechanical processing mainly adopts micro-cutters to cut the workpiece to form micro-grooves. Due to the problems of cutter rigidity limitation and wear, the traditional mechanical cutting processing method is difficult to process micro-grooves with a width less than 1 mm. Correspondingly, wire electrical discharge machining can process micro-grooves with a width less than 1 mm and has high processing efficiency, but the arc discharge technology requires a large amount of electrodes, and the electrodes are consumables. The metal electrical discharge machining is prone to problems such as micro-cracks and recast layers. Similarly, electrolytic machining can form high-precision micro-grooves on alloy materials, but electrolytic machining cannot etch non-conductive ceramic materials, and the electrolytic machining efficiency is low under the same conditions. That is, the existing mechanical cutting, wire electrical discharge machining, and electrolytic machining cannot meet the high-precision micro-groove processing on different materials.

[0003] Laser processing not only belongs to non-contact processing, but also is environmentally friendly, has high processing efficiency and good processing quality, and can process almost all materials. In particular, ultrafast laser has the characteristics of short pulse width, high peak power, and small heat-affected zone, and can accurately control the size of micro-groove processing and realize high-depth-width-ratio micro-groove processing. With the development of ultrafast laser technology and the development of advanced laser processing technology, the cost of laser is gradually reduced, and the processing efficiency of laser is increasingly high. Therefore, ultrafast laser micro special processing will gradually become the main processing technology in the application fields of aviation metal parts.

[0004] However, in the prior art, the micro-groove is processed by laser, mainly by different light spots to realize different shape micro-groove processing, and the quality of the side wall cannot be guaranteed. Therefore, although the micro-groove processing is realized, how to process the micro-groove with narrow width, large depth and high quality, and how to improve the size precision and processing efficiency of the micro-groove processing through multi-dimensional adjustment of the position and angle of the workpiece are still problems to be solved by the personnel in the field. SUMMARY

[0005] The purpose of the present application is to provide a laser processing device and method to process micro-grooves with narrow width, large depth and high quality, and to improve the size precision and processing efficiency of the micro-groove processing through multi-dimensional adjustment of the position and angle of the workpiece.

[0006] To achieve this purpose, the present application adopts the following technical solutions:

[0007] A laser processing apparatus, comprising:

[0008] The system includes a laser conveying assembly, a turntable module, and a stage. The workpiece is rotatably mounted on the stage, which is movable along the X, Y, and Z axes and can adjust the processing taper of the workpiece. The turntable module is located above the stage and is equipped with a laser head for laser processing on the workpiece. The laser conveying assembly emits a laser beam and expands, shapes, and aligns the laser beam before guiding it to the laser head.

[0009] Optionally, the laser delivery assembly includes a laser source module, which includes at least a laser for emitting the laser beam;

[0010] And / or, the laser is a solid-state laser with a wavelength of 1030 nm, a pulse width adjustable from 170 fs to 20 ps, ​​and a repetition frequency adjustable from 1 kHz to 1 MHz.

[0011] Optionally, the laser delivery assembly includes a beam expander module, which includes a beam expander lens to collimate and parallel the transmission of the laser beam.

[0012] And / or, the beam expander is a fused silica substrate lens group, and has adjustment functions in the X-axis, Y-axis and Z-axis directions, as well as pitch angle and yaw angle adjustment functions.

[0013] Optionally, the magnification of the beam expander is adjustable between 2x and 5x.

[0014] Optionally, the laser delivery assembly includes a shaping module, which includes at least a spatial light modulator to change the amplitude or intensity, phase, and polarization state of the laser beam distribution.

[0015] And / or, the laser delivery assembly also includes an industrial computer that is communicatively connected to the shaping module to load programs or graphics into the spatial light modulator.

[0016] Optionally, the laser delivery assembly includes parallel pinhole modules, at least two of which are provided, and both of the parallel pinhole modules are provided with parallel pinholes of adjustable aperture. The laser beam is guided into the turntable module after being aligned parallelly through the parallel pinholes.

[0017] Optionally, the laser delivery assembly includes a monitoring module, which includes a semi-transparent mirror, a lens, and an imaging camera. The laser beam is parallel aligned and then reflected by the semi-transparent mirror before being directed into the turntable module for processing. The semi-transparent mirror is used to create an image, and the coaxially arranged lens enables real-time monitoring of the processing status in the imaging camera.

[0018] Optionally, the stage includes an adjustment platform, which is provided with a swing mechanism and a turntable mechanism. The swing mechanism is used to fix the workpiece to be processed and can adjust the angle of the workpiece to be processed relative to the incident laser beam to change the processing taper. The turntable mechanism is connected to the side of the swing mechanism away from the workpiece to realize the rotation of the workpiece.

[0019] Optionally, the stage further includes a displacement platform, which is provided with a Z-axis mechanism, an X-axis mechanism and a Y-axis mechanism in sequence along the vertical direction, so as to move on the Z-axis, X-axis and Y-axis respectively, and the turntable mechanism is rotatably mounted on the Z-axis mechanism.

[0020] On the other hand, a laser processing method, wherein the laser processing apparatus is used, includes the following steps:

[0021] S1. Open the laser delivery assembly to emit the laser beam, expand, shape, and align it before guiding it into the turntable module 80;

[0022] S2. The workpiece to be processed is mounted on the stage using a fixture, and the relative position between the workpiece and the laser beam, as well as the processing taper, are adjusted.

[0023] S3. The laser beam is focused onto the workpiece by the laser head for processing. The focusing position of the laser beam and the processing process are observed and adjusted by the monitoring module in the laser delivery assembly.

[0024] The beneficial effects of this invention are:

[0025] In this invention, the laser delivery component in the laser processing device expands, shapes, and aligns the laser beam before the laser head in the turntable module performs laser processing on the workpiece on the stage, thereby achieving microgroove processing. Specifically, the workpiece can be rotatably mounted on the stage, and the stage can move along the X, Y, and Z axes and adjust the processing taper of the workpiece. This, combined with the expanded and shaped laser beam, enables narrow-width, deep, and high-quality processing, thereby improving the dimensional accuracy and efficiency of microgroove processing. The laser processing method implemented using this device significantly reduces the heat-affected zone in microgroove processing, and direct processing is possible after beam shaping and focusing. The processing steps are simple and efficient, and the multi-dimensional motion of the stage allows for precise adjustment of the workpiece's position and processing angle. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the laser processing apparatus described in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram illustrating the working principle of the beam expansion module in the laser processing apparatus described in this embodiment of the invention;

[0028] Figure 3 This is a schematic diagram illustrating the working principle of some modules in the laser processing device described in this embodiment of the invention;

[0029] Figure 4 This is a schematic diagram of the processing of the original laser head on the workpiece in the existing technology;

[0030] Figure 5 This is a first processing schematic diagram of the laser processing device described in this embodiment of the invention on the workpiece;

[0031] Figure 6 This is a second processing schematic diagram of the laser processing device described in this embodiment of the invention on the workpiece;

[0032] Figure 7 This is a schematic diagram of the laser processing device described in the embodiment of the present invention after processing on the workpiece.

[0033] In the picture:

[0034] 100 - Workpiece to be processed; 101 - Groove; 200 - Original laser head; 310 - Focus; 320 - Input mirror; 330 - Output mirror; 340 - Parallel laser beam;

[0035] 10-Laser source module; 11-Industrial control computer; 20-Beam expander module; 30-Reflector; 40-Shaping module; 50-Parallel pinhole module; 60-Semi-transparent mirror; 70-Monitoring module; 80-Turntable module; 801-Laser head; 90-Stage; 91-Adjustment platform; 911-Swing mechanism; 912-Turntable mechanism; 92-Displacement platform; 921-Z-axis mechanism; 922-X-axis mechanism; 923-Y-axis mechanism. Detailed Implementation

[0036] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0037] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0038] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] The technical solution of this embodiment will be further described below with reference to the accompanying drawings and specific implementation methods.

[0040] like Figures 1 to 7As shown, this embodiment provides a laser processing apparatus, including a laser conveying assembly, a turntable module 80, and a stage 90. A workpiece 100 is rotatably mounted on the stage 90. The stage 90 is movable along the X, Y, and Z axes and can adjust the processing taper of the workpiece 100. The turntable module 80 is located above the stage 90, and two of the X, Y, and Z axes are perpendicular to each other. Furthermore, a laser head 801 is provided on the turntable module 80 for laser processing on the workpiece 100. The laser conveying assembly can emit a laser beam and, after expanding, shaping, and aligning the laser beam, guide it to the laser head 801.

[0041] On the other hand, laser processing methods, using laser processing equipment, include the following steps:

[0042] S1. Open the laser delivery assembly to emit a laser beam, which is then expanded, shaped, and aligned parallel before being introduced into the turntable module 80;

[0043] S2. Mount the workpiece 100 to be processed onto the stage 90 using a fixture, and adjust the relative position between the workpiece 100 and the laser beam, as well as the processing taper.

[0044] S3. The laser beam is focused onto the workpiece 100 by the laser head 801 for processing. The focusing position of the laser beam and the processing process are observed and adjusted by the monitoring module 70 in the laser delivery assembly.

[0045] Specifically, in this embodiment, the laser beam is expanded, shaped, and aligned parallel by the laser delivery component in the laser processing device. Then, the laser head 801 in the turntable module 80 performs laser processing on the workpiece 100 on the stage 90, thereby achieving microgroove processing. Specifically, the workpiece 100 can be rotatably mounted on the stage 90, and the stage 90 can move along the X, Y, and Z axes and adjust the processing taper of the workpiece 100. This, combined with the expanded and shaped laser beam, enables narrow-width, large-depth, and high-quality processing, thereby improving the dimensional accuracy and processing efficiency of microgroove processing. The laser processing method implemented using the laser processing device can greatly reduce the heat-affected zone of microgroove processing. After beam shaping and focusing, processing can be performed directly, making the processing steps simple and efficient. Furthermore, the multi-dimensionally moving stage 90 can precisely adjust the position and processing angle of the workpiece 100.

[0046] The specific structure of the laser processing device in this embodiment will be described below.

[0047] like Figure 1As shown, the laser processing device in this embodiment includes a laser conveying assembly, a turntable module 80, and a stage 90. The workpiece 100 to be processed is rotatably mounted on the stage 90. The stage 90 is movable along the X, Y, and Z axes and can adjust the processing taper of the workpiece 100, thereby achieving five-dimensional adjustment of the workpiece 100 on the stage 90 and improving the accuracy of laser processing. Optionally, the turntable module 80 is located above the stage 90, and a laser head 801 is provided on the turntable module 80 to facilitate laser processing of the workpiece 100.

[0048] Furthermore, the laser delivery assembly can emit a laser beam, expand, shape, and align it before guiding it to the laser head 801. The laser beam then performs laser processing on the workpiece 100, achieving deep, high-quality processing through non-contact operation and five-dimensional adjustment. Specifically, the laser delivery assembly includes a laser source module 10, a beam expander module 20, a shaping module 40, a parallel pinhole module 50, and a monitoring module 70. Multiple sets of reflectors 30 are also installed within the laser delivery assembly to ensure precise reflection of the laser beam.

[0049] For example, the laser source module 10 includes at least a laser for emitting a laser beam, and / or, in this embodiment, the laser is an ultrafast laser, and the laser is a solid-state laser with a wavelength of 1030 nm, a pulse width adjustable from 170 fs to 20 ps, ​​and a repetition frequency adjustable from 1 kHz to 1 MHz, thereby adjusting its data as needed.

[0050] Furthermore, the beam expander module 20 includes a beam expander, a reflector 30, and a polarizer to ensure collimated and parallel transmission of the laser beam; and / or, wherein the beam expander is a fused silica substrate lens group and has adjustment functions in the X, Y, and Z axes, as well as pitch and yaw angle adjustment functions. Specifically, the base of the beam expander is configured as a five-dimensional adjustment base, thereby ensuring the collimation and parallelism of the laser transmission through adjustments in different directions and angles. For example, the magnification of the beam expander is adjustable between 2x and 5x. Figure 2 As shown, in this embodiment, the beam expander generally includes an input mirror 320 and an output mirror 330, and the focal point 310 is located on the side of the input mirror 320 away from the output mirror 330. By adjusting the focal lengths f1 and f2, the incident positions y1, y2, y3, and the incident angles θ1, θ2, θ3, the beam expansion effect of different parallel laser beams 340 can be achieved.

[0051] Optionally, multiple reflectors 30 are arranged at an angle, with each pair of reflectors 30 forming a pair. Multiple pairs of reflectors 30 constitute a light guiding module for guiding the laser beam between modules in the laser delivery assembly. For example, the base of each reflector 30 is configured as a three-dimensional adjustable base, thereby enabling the position of the reflected laser beam to be adjusted so that it is parallel to the collimation standard.

[0052] Optionally, the shaping module 40 includes at least a spatial light modulator to change the amplitude or intensity, phase, and polarization state of the laser beam distribution; and / or, the laser delivery assembly further includes an industrial control computer 11, which is communicatively connected to the shaping module 40 to load programs or graphics into the spatial light modulator. Specifically, in this embodiment, the shaping module 40 also includes an aperture stop, a water chiller, and a driving power supply, and the spatial light modulator is a liquid crystal spatial light modulator. For example, a liquid crystal spatial light modulator is a device that modulates the spatial distribution of light waves. Under the drive of an electrical signal, it can change the amplitude or intensity, phase, polarization state, etc., of the light distribution in space. Optionally, the liquid crystal spatial light modulator includes a liquid crystal panel, connecting lines, and a power supply to ensure operational stability. The liquid crystal spatial light modulator is also flexible, allowing different programs or graphics to be designed using the industrial control computer 11 or other computer equipment and loaded onto it. For example, the industrial control computer 11 can control the generation of circular flat-top beams, square flat-top beams, Bezier beams, ring beams, and m*n array beams to meet the beam requirements of different processing requirements.

[0053] Furthermore, the size of the aperture stop is consistent with the size of the light-receiving area of ​​the spatial light modulator, and the aperture stop is located at a certain distance in front of the spatial light modulator to filter out stray light, reduce its influence, and maximize the utilization of the light-receiving area of ​​the spatial light modulator. Correspondingly, the water chiller is a low-temperature, low-flow-rate water-cooled circulating machine, and the water chiller is bonded and fixed to the back plate of the liquid crystal spatial light modulator through a three-inlet, three-outlet copper cooling plate, thereby cooling the target surface of the liquid crystal spatial light modulator, thus ensuring the normal and stable operation of the liquid crystal spatial light modulator. The low-temperature, low-flow-rate performance also reduces the impact of vibration on the stability of the liquid crystal spatial light modulator.

[0054] Furthermore, at least two parallel pinhole modules 50 are provided, and both parallel pinhole modules 50 are provided with parallel pinholes of adjustable aperture. The laser beam is guided into the turntable module 80 after being aligned parallel to each other through the parallel pinholes. Specifically, the two parallel pinhole modules 50 are arranged parallel to each other, and their centers are strictly aligned parallel to the center of the light-transmitting port in the turntable module 80. This ensures that the laser beam, after being adjusted by the two parallel pinhole modules 50, can be guided into the objective lens in the turntable module 80 for focusing, thereby achieving stable processing of the workpiece 100. For example, the turntable module 80 can be connected to objective lenses of different magnifications to select the appropriate objective lens for focusing according to the processing requirements of the workpiece 100.

[0055] Optionally, the monitoring module 70 includes a semi-transparent mirror 60, a lens, and an imaging camera. The laser beam, after being aligned parallel to the ground, is reflected by the semi-transparent mirror 60 and guided into the turntable module 80 for processing. Imaging is achieved through the semi-transparent mirror 60, and the processing status can be monitored in real time via the imaging camera, in conjunction with the coaxially arranged lens. For example, the imaging camera is a CCD device, and the semi-transparent mirror 60 is a short-pass semi-reflective mirror. While reflecting the laser beam, it can also transmit illumination to achieve light imaging. Combined with a coaxial, variable magnification lens and the imaging CCD, the workpiece 100 can be monitored in real time. Adjusting to a low magnification allows observation of the entire processing area and the forming status, while adjusting to a high magnification allows observation of processing quality and details. Figure 3 As shown in the figure, the principle of shaping and monitoring in this embodiment is as follows, where P is a polarizer, MO1 is a microscope objective lens 10 / 0.3, MO2 is a microscope objective lens 20 / 0.4, L1 and L2 are both lenses, NDF(v) is a neutral density filter (variable), and LCoS represents the target surface of the liquid crystal spatial light modulator.

[0056] Specifically, the stage 90 includes an adjustment platform 91 and a displacement platform 92. Optionally, the adjustment platform 91 is provided with a swing mechanism 911 and a turntable mechanism 912. The swing mechanism 911 is used to fix the workpiece 100 and can adjust the angle of the workpiece 100 relative to the incident laser beam to change the processing taper. The turntable mechanism 912 is connected to the side of the swing mechanism 911 away from the workpiece 100 to realize the rotation of the workpiece 100. Thus, under the action of the swing mechanism 911, the angle of the workpiece 100 relative to the incident laser beam can be adjusted to control the taper of the groove 101, making it easy to realize high-precision microgroove laser processing.

[0057] Furthermore, the displacement platform 92 is sequentially equipped with a Z-axis mechanism 921, an X-axis mechanism 922, and a Y-axis mechanism 923 along the vertical direction, allowing it to move along the Z-axis, X-axis, and Y-axis respectively. A turntable mechanism 912 is rotatably mounted on the Z-axis mechanism 921. This turntable mechanism 912 allows for adjustment of the consistency of the linear movement of the workpiece 100 along the X-axis and Y-axis, ensuring the stability of the workpiece 100 during processing. Specifically, the Z-axis mechanism 921, X-axis mechanism 922, and Y-axis mechanism 923 enable height adjustment of the workpiece 100 along the Z-axis, ensuring that the laser beam is focused on the workpiece 100. Through movement along the X-axis and Y-axis, the workpiece 100 can form grooves 101 under the action of the laser beam.

[0058] The specific details of the laser processing method are explained below.

[0059] The laser processing method, using the aforementioned laser processing apparatus, includes the following steps:

[0060] S1. Open the laser delivery assembly to emit a laser beam, which is then expanded, shaped, and aligned parallel before being introduced into the turntable module 80;

[0061] S2. Mount the workpiece 100 to be processed onto the stage 90 using a fixture, and adjust the relative position between the workpiece 100 and the laser beam, as well as the processing taper.

[0062] S3. The laser beam is focused onto the workpiece 100 by the laser head 801 for processing. The focusing position of the laser beam and the processing process are observed and adjusted by the monitoring module 70 in the laser delivery assembly.

[0063] Specifically, in step S1, the laser in the laser source module 10 is first turned on. The laser is connected to the industrial control computer 11, so that the industrial control computer 11 can control the switching and output of the laser and adjust the output parameters of the laser beam. For example, in this embodiment, the laser is also equipped with corresponding water cooling equipment and power supply equipment, and both can be turned on and off through the main switch of the power control panel to ensure that the laser outputs a stable laser beam.

[0064] Then, the laser beam is guided to the beam expander by the reflector 30 in the beam expander module 20. The beam expander, pre-installed at an appropriate position in the optical path, along with the angle adjustment of its five-dimensional adjustment base, ensures that the laser beam remains collimated and parallel throughout its transmission after exiting the beam expander. For example, the magnification of the beam expander is related to the size of the laser's output spot and the diameter of the polarizer's guide port. This allows for flexible beam tuning to suit various processing needs, and the appropriate magnification can be selected through adjustment.

[0065] Next, the laser beam adjusted by the beam expander module 20 is guided into the shaping module 40 via multiple reflectors 30 of the light guide module. Specifically, the spatial light modulator in the shaping module 40 includes a liquid crystal target surface, control lines communicating with the industrial control computer 11, and a water chiller. The industrial control computer 11 controls the spatial light modulator to generate a circular flat-top beam, a square flat-top beam, a Bessel beam, a ring beam, or an m*n array beam, allowing selection of different beams according to specific processing needs. For example, a flat-top beam can create better bottom surface flatness during processing, improving the processing taper of the groove 101; a Bessel beam can improve the depth-to-diameter ratio, increasing the depth of the groove 101. Therefore, the beams can be selected or combined during processing based on experiments.

[0066] Finally, the workpiece 100 is fixed in place using a fixture, which can be configured as needed (details omitted here). Further, the laser beam is guided through the light port of the turntable module 80 to the laser head 801, and then focused onto the workpiece 100 for processing. Both the laser beam focusing process and the processing process can be observed and adjusted via the monitoring module 70. For example, the monitoring module 70 is also communicatively connected to the industrial control computer 11 for real-time observation by the operator.

[0067] Combination Figures 4 to 7 As shown, existing laser processing technologies generally utilize single-pulse laser energy or high average laser power to ablate the workpiece 100. However, because the laser outputs a Gaussian beam, which is a highly symmetrical beam with a bell-shaped intensity distribution (maximum intensity at the center, gradually decreasing towards the sides), this characteristic results in a smaller processing depth and a larger taper at the bottom of the groove when the laser head 200 is used. Specifically, the processing effect of existing technologies is as follows: Figure 4 As shown, the processing depth is relatively shallow, making it suitable for processing microgrooves with relatively wide width and shallow depth. It is widely used in surface treatment and large-width texture fabrication, but it cannot process microgrooves with narrow width and deep depth, thus limiting its application range.

[0068] Correspondingly, in this embodiment, the beam shaping technology of the laser delivery component is used to expand and collimate the laser beam before it reaches the workpiece 100, and to shape it into a Bessel beam. The width of the Bessel beam narrows as the beam travels, and the beam amplitude distribution is consistent throughout the entire beam range. Figure 5As shown, the processing depth is superior to that of a Gaussian beam, making it suitable for processing narrow widths and deep depths. Furthermore, in this embodiment, the stage 90 employs five-dimensional adjustment, featuring small-angle rotation and pitch adjustment functions. Rotation adjustment allows for adjusting the orthogonal position of the workpiece 100 and the laser beam, while pitch adjustment adjusts the pitch angle of the workpiece 100, which can, to some extent, reduce the taper of the groove 101. The processing effect of pitch adjustment is as follows: Figure 6 As shown.

[0069] like Figure 7 As shown, an exemplary operation example is used to illustrate the following: A groove 101 is engraved on a 30mm*10mm*0.05mm stainless steel or glass surface. The dimensions of the groove 101 are required to be 0.01mm wide, 0.04mm deep, and 6mm long. Specifically, for stainless steel, since the thickness of the workpiece 100 is only 0.05mm, machining is very difficult. It is not only inconvenient to fix and clamp, but also the machining has a certain feed force, which can easily cause deformation. For electrical discharge machining, since the groove 101 does not penetrate the entire surface of the thin sheet, there is no entry point for the electrode on the workpiece 100, and the production of special electrodes is costly and inefficient. For glass sheets, because they are non-conductive, electrical discharge machining cannot be used; and glass is a hard and brittle material with a thickness of only 0.05mm, machining also faces the problem of fixing and clamping, and machining is also very likely to cause the glass to break, resulting in processing failure. Therefore, the laser processing device in this embodiment can process similar thin sheets, which can solve the problem when traditional processing methods are either unable to process them or the processing is very difficult.

[0070] The specific steps are as follows: Place the workpiece 100 flat on the stage 90, securing it solely by its own weight or by suction from the base. Since laser processing is a non-contact process, no strong force is applied to the workpiece 100, preventing deformation or breakage. Then, start the system, including the laser source module 10 and the industrial computer 11. Adjust the stage 80 to position the workpiece 100 in the preset horizontal and vertical positions. Simultaneously, move the platform and observe whether the surface of the workpiece 100 is level. If not... To ensure the laser beam is level, the tilting mechanism 911 is adjusted to prevent defocusing during processing, which could lead to inconsistent processing depth. The industrial control computer 11 designs the graphic and loads it into the spatial light modulator to generate a Bessel beam, which is then focused on the workpiece 100 to perform the grooving 101. During processing, the pitch angle can be adjusted so that the laser beam's focal point is incident at a small angle, improving the taper of the grooving 101. After processing, the workpiece 100 is removed for measurement to check the processing effect and quality, and feedback is provided to optimize subsequent processing techniques.

[0071] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A laser processing apparatus characterized by comprising: The laser delivery assembly, the rotating disc module (80) and the object table (90), the workpiece (100) is rotatably installed on the object table (90), the object table (90) can move on the X axis, Y axis, Z axis and can adjust the processing taper of the workpiece (100), the rotating disc module (80) is located above the object table (90), and the rotating disc module (80) is provided with a laser head (801) for laser processing on the workpiece (100), the laser delivery assembly can emit a laser beam, and the laser beam is expanded, shaped, and parallel aligned before being guided to the laser head (801). The laser delivery assembly includes a shaping module (40) and an industrial computer (11), the industrial computer (11) is communicatively connected to the shaping module (40), and at least a circular flat-top beam, a square flat-top beam and a Bessel beam can be generated through the industrial computer (11). The object table (90) includes an adjusting platform (91), the adjusting platform (91) is provided with a swing table mechanism (911) and a rotating table mechanism (912), the swing table mechanism (911) is used for fixing the workpiece (100) and can adjust the angle of the workpiece (100) relative to the incident of the laser beam to change the processing taper, and the rotating table mechanism (912) is connected to the side of the swing table mechanism (911) away from the workpiece (100) to realize the rotation of the workpiece (100). The laser delivery assembly includes a laser source module (10), the laser source module (10) at least includes a laser for emitting the laser beam.

2. The laser processing apparatus according to claim 1, characterized by, And / or, the laser is a solid-state laser with a wavelength of 1030nm, a pulse width adjustable in the range of 170fs to 20ps, and a repetition frequency adjustable in the range of 1kHz to 1MHz. The laser delivery assembly includes an expansion module (20), the expansion module (20) includes an expansion mirror to make the laser beam collimated and parallel transmission.

3. The laser processing apparatus according to claim 1, characterized by And / or, the expansion mirror is a fused quartz substrate lens group, and has adjusting functions in X axis, Y axis and Z axis directions, as well as adjusting functions of pitch angle and yaw angle. The magnification of the expansion mirror is adjustable between 2 times and 5 times.

4. The laser processing apparatus according to claim 3, characterized by The laser delivery assembly includes the shaping module (40), the shaping module (40) at least includes a spatial light modulator to change the amplitude or intensity, phase, polarization state of the laser beam distribution.

5. The laser processing apparatus according to claim 1, characterized by And / or, the laser delivery assembly further includes the industrial computer (11), the industrial computer (11) is communicatively connected to the shaping module (40) to load programs or graphics into the spatial light modulator. The laser delivery assembly includes a parallel pinhole module (50), the parallel pinhole module (50) is provided with at least two parallel pinholes with adjustable apertures, and the laser beam is parallel aligned through the parallel pinholes and introduced into the rotating disc module (80).

6. The laser processing apparatus according to claim 1, characterized by ​ 7. The laser processing apparatus according to claim 1, characterized by The laser delivery assembly comprises a monitoring module (70) comprising a semi-transparent half mirror (60), a lens and an imaging camera, the laser beam is reflected by the semi-transparent half mirror (60) into the rotary table module (80) for processing after parallel alignment, and the processing condition can be monitored in real time in the imaging camera through the semi-transparent half mirror (60) imaging and the lens coaxially arranged.

8. The laser processing apparatus according to claim 1, characterized by The object table (90) further comprises a displacement platform (92) sequentially provided with a Z-axis mechanism (921), an X-axis mechanism (922) and a Y-axis mechanism (923) in the vertical direction to move on the Z-axis, the X-axis and the Y-axis respectively, and the rotary table mechanism (912) is rotationally arranged on the Z-axis mechanism (921).

9. A laser processing method characterized by, The laser processing device as claimed in any one of claims 1-8 comprises the following steps: S1, turning on the laser delivery assembly to emit the laser beam, which is expanded, shaped, and aligned in parallel before being introduced into the rotary table module (80); S2, mounting the workpiece (100) on the object table (90) by a clamp, adjusting the relative position between the workpiece (100) and the laser beam, and processing the taper; S3, focusing the laser beam on the workpiece (100) by the laser head (801) for processing, and observing the laser beam focusing position and the processing process by the monitoring module (70) in the laser delivery assembly for adjustment.

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