Composition article

Abstract

The invention provides a composition product, the composition product comprises resin, a conductive filler and silicone, and the silicone accounts for 0.15% or more of the total weight of the composition product. According to the composition product, particles are not prone to falling off when the composition product is collided or rubbed, and the electrostatic phenomenon can be restrained.

Description

Technical Field

[0001] This application relates to a composition article, particularly a tray for loading electronic devices when storing or transporting them. Background Technology

[0002] When storing or transporting electronic devices, the devices are secured in trays. Trays are composite products made from resin as a base material. Electronic devices consist primarily of semiconductor components such as semiconductor chips, liquid crystal modules, and hard disk drives. After the electronic devices are secured in the trays, multiple trays are stacked for handling or storage. Summary of the Invention

[0003] This application provides a composition article comprising a resin, a conductive filler, and a silicone, wherein the silicone accounts for more than 0.15% of the total weight of the composition article.

[0004] In the article of composition according to this application, the resin and the silicone are formed as two phases.

[0005] According to the composition article of this application, the content of the silicone at the surface of the composition article is higher than the content in the interior of the composition article.

[0006] According to the composition article described in this application, the silicone accounts for 0.15%-1.5% of the total weight of the composition article.

[0007] The composition article according to this application, wherein the silicone has a weight-average molecular weight greater than 200 kDa.

[0008] According to the composition article of this application, the resin accounts for 67%-96.75% of the total weight of the composition article.

[0009] According to the composition article described in this application, the resin accounts for 72.5%-95.55% of the total weight of the composition article.

[0010] The composition article according to this application, wherein the resin is non-crystalline and has a water absorption rate of 0.5% in air at 25°C and 50% RH.

[0011] The composition article according to this application, wherein the resin comprises at least one of the following polymers: acrylonitrile-styrene-butadiene copolymer, polyarylsulfone, polyphenylene ether alloy, polysulfone, polyethersulfone, liquid crystal polymer and polycarbonate.

[0012] According to the composition article of this application, the conductive filler accounts for 3%-25% of the total weight of the composition article.

[0013] According to the composition article of this application, the conductive filler accounts for 4%-20% of the total weight of the composition article.

[0014] According to the composition article described in this application, the conductive filler includes at least one of the following: carbon black, carbon nanotubes, carbon fibers, conductive or electrostatic dissipative polymers, and conductive or electrostatic dissipative mica.

[0015] The article of composition according to this application is obtained by injection molding.

[0016] The composition article according to this application is used for loading articles.

[0017] The composition article according to this application includes at least one storage opening for securing the article therein.

[0018] The article of composition according to this application is a tray, and the article is an electronic device.

[0019] Articles of composition according to this application, wherein the articles are semiconductor electronic devices. Attached Figure Description

[0020] In the following, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings, in which:

[0021] Figure 1A This is a top perspective view of a tray according to an embodiment of this application.

[0022] Figure 1B yes Figure 1A A three-dimensional view of the tray from below.

[0023] Figure 2A There are two Figure 1A and Figure 1B A partial cross-sectional view of trays stacked together, containing electronic components.

[0024] Figure 2B There are two Figure 1A and Figure 1B The image shows a partial 3D view of trays stacked together, containing electronic components. Detailed Implementation

[0025] Various specific embodiments of this application will now be described with reference to the accompanying drawings, which form part of this specification. It should be understood that, where possible, the same or similar reference numerals used in this application refer to the same parts.

[0026] It should be understood that if terms indicating direction, such as "front," "rear," "upper," "lower," "left," "right," "top," "bottom," "inner," and "outer," are used in this application to describe various example structural parts and elements of this application, their use is merely for illustrative purposes and is determined based on the example orientations shown in the accompanying drawings. Since the embodiments disclosed in this application can be arranged in different orientations, these terms indicating direction are for illustrative purposes only and should not be considered as limiting.

[0027] In this application, unless otherwise specified, all equipment and materials are commercially available or commonly used in the field. Unless otherwise specified, the methods used in the embodiments of this application are conventional methods in the field.

[0028] Figure 1A and Figure 1B The overall structure of a tray 100 according to one embodiment of this application is shown. Figure 1A This is a top-down 3D view of the tray 100. Figure 1B yes Figure 1A The diagram shows a bottom perspective view of the tray 100. The tray 100 includes a frame 101, with several storage openings 111 and 121 on its top and bottom surfaces, respectively. The storage openings 111 and 121, which are opposite each other in the thickness direction of the frame 101, are aligned and have the same shape and corresponding size. When two or more trays 100 are stacked together, the corresponding storage openings 111 and 121 on adjacent trays 100 cooperate to form a receiving space to secure electronic devices within it.

[0029] Figure 2A and 2B The electronic device 200 is shown being fixed in the tray 100. Figure 2A There are two Figure 1A and Figure 1B A partial cross-sectional view of the trays 100 stacked together shown. Figure 2B There are two Figure 1A and Figure 1B The image shows a partial perspective view of two trays 100 stacked together, with an electronic device 200 fixed within a receiving space formed by corresponding storage openings 111 and 121 of the two stacked trays 100. When the two trays 100 are stacked, the storage opening 121 of the upper tray 100 and the corresponding storage opening 111 of the lower tray 100 cooperate to form a receiving space, in which the electronic device 200 is fixed. The electronic device 200 is in contact with the surface of the tray 100 defining the receiving space. In some embodiments, the electronic device 100 is a semiconductor device. In some embodiments, the electronic device 200 includes, but is not limited to, devices such as semiconductor chips, liquid crystal modules, and hard disk components.

[0030] After the electronic device 200 is fixed in the receiving space formed by the corresponding receiving openings 111 and 121 of the adjacent tray 100, if the tray 100 is subjected to impact or vibration during storage or handling, the electronic device 200 vibrates in the receiving space, thereby colliding or rubbing against the surface of the tray 100 that defines the receiving space. The tray 100 according to this application can suppress particle shedding and static electricity phenomena of the tray 100 under such circumstances.

[0031] The tray 100 according to this application includes resin, conductive filler (or antistatic filler), and silicone. The resin serves as the substrate of the tray 100, providing rigidity and mechanical strength, thus enabling the tray 100 to support the electronic device 200 housed therein. The addition of the conductive filler gives the tray 100 good electrostatic dissipation (ESD) performance, thereby suppressing static electricity generation when the electronic device 200 collides or rubs against the surface of the tray 100. Silicone has low surface energy and is incompatible with the resin and conductive filler, causing it to migrate to and distribute on the surface of the tray 100, with a higher concentration at the surface than inside. This migration of silicone to the surface of the tray 100 results in a two-phase formation of silicone and resin within the tray 100, with the silicone distributed on the surface of the tray 100, thus covering the surface of the tray 100 and forming a mask. This ensures that even if the electronic device 200 collides or rubs against the surface of the tray 100, the resin substrate or filler (such as conductive filler) in the tray 100 is less likely to detach (or pulverize and detach), thereby reducing particle shedding caused by collision or friction. During the migration of silicone to the surface of the tray 100, at least a portion of the conductive filler is carried to the surface of the tray 100 by the silicone, resulting in the conductive filler being distributed on the surface of the tray 100. The distribution of conductive filler on the surface of the tray 100 improves the static dissipation performance of the tray 100 surface. Therefore, when the electronic device 200 collides or rubs against the surface of the tray 100, it helps to suppress static electricity. Furthermore, the silicone forming a mask on the surface of the tray 100 contributes to a good surface finish and smoothness.

[0032] In tray 100, silicone accounts for more than 0.15% of the total weight of tray 100, ensuring sufficient silicone migration to the surface of tray 100 to form a cover that provides shielding, thereby reducing particle shedding when the electronic device 200 collides or rubs against the surface of tray 100. In some embodiments, silicone accounts for 0.15%-1.5% of the total weight of tray 100. Setting the silicone weight content below 1.5% results in a better surface appearance for tray 100. This is because, when the silicone weight content is set below 1.5%, less air is trapped in the surface of tray 100 during the molding process, thus reducing air bubbles on the surface of tray 100. Furthermore, setting the silicone weight content below 1.5% avoids severe separation of silicone from resin, thereby preventing peeling of the tray 100 surface. In some embodiments, the silicone has a weight-average molecular weight greater than 200 kDa as determined by gel chromatography (GPC), which makes it less likely for the silicone to form an oily substance during the manufacture of tray 100, thereby contributing to the appearance and cleanliness of tray 100.

[0033] In some embodiments, the conductive filler accounts for 3%-25% of the total weight of the tray 100, enabling the tray 100 to simultaneously possess excellent electrostatic dissipation capability and excellent processability and mechanical properties. In other embodiments, the conductive filler accounts for 4%-20% of the total weight of the tray 100. In some embodiments, the conductive filler includes at least one of the following: carbon black, carbon nanotubes, carbon fibers, conductive or electrostatic dissipative polymers, and conductive or electrostatic dissipative mica. In some embodiments, the conductive or electrostatic dissipative polymer includes copolyether polymers.

[0034] In some embodiments, the resin constitutes 67%-96.75% of the total weight of the tray 100. In other embodiments, the resin constitutes 72.5%-95.55% of the total weight of the tray 100. In some embodiments, the resin is non-crystalline and has a water absorption rate of 0.5% in air at 25°C and 50% RH. Such a non-crystalline, low-water-absorption resin exhibits good dimensional stability under heat. Since the resin is heated during the manufacturing process of the tray 100, using such a resin results in the tray 100 having the desired dimensions. In some embodiments, the resin comprises at least one of the following substances: acrylonitrile-styrene-butadiene copolymer (ABS), polyarylsulfone (PAS), polyphenylene ether alloy (PPO alloy), polysulfone (PSU), polyethersulfone (PES), liquid crystal polymer (LCP), and polycarbonate (PC). The PPO alloy is a blend of PPO with other polymers. In some embodiments, the PPO content in the PPO alloy is 60% or more by weight. In some embodiments, the PPO alloy is a blend of PPO and acrylonitrile-styrene-butadiene copolymer (ABS), or a blend of PPO and high-impact polystyrene (HIPS). In some embodiments, the LCP is a thermotropic liquid crystal polymer (TLCP). In some embodiments, the LCP is a thermotropic liquid crystal polymer (TLCP) based on a copolymer formed from one or more of hydroxybenzoic acid, terephthalic acid, and 4,4'-biphenyl.

[0035] In some embodiments, the pallet 100 includes reinforcing filler to improve the rigidity and mechanical strength of the pallet 100. In some embodiments, the reinforcing filler is glass fiber. In some embodiments, the reinforcing filler accounts for less than 30% of the total weight of the pallet 100. In other embodiments, the reinforcing filler accounts for approximately 20% of the total weight of the pallet 100.

[0036] In one embodiment, the tray 100 according to this application is manufactured by injection molding. During the production of the tray 100, silicone and resin are heated and melted to become fluid. Due to the low surface energy of silicone, it is incompatible with the resin, and the molten silicone flows outward. Thus, after the tray 100 is formed, silicone and resin form a two-phase mixture, and the silicone is distributed on the surface of the tray 100, with a higher content of silicone on the surface of the tray 100 than in the interior of the tray 100. The distribution of silicone on the surface of the tray 100 causes it to cover the surface of the tray 100, forming a mask. The masking effect of silicone on the surface of the tray 100 makes it less likely that the resin substrate or filler (e.g., conductive filler) in the tray 100 will be detached (or powdered) by collision or friction when the electronic device 200 collides or rubs against the surface of the tray 100, thereby reducing the amount of particles detached due to collision or friction.

[0037] Suppose that particles detach (or pulverize) from the surface of tray 100 due to collision or friction with the electronic device 200 fixed therein. These detached particles may migrate from the surface of tray 100 to the electronic device 200 within tray 100. In this case, since the detached particles are conductive, the particles migrating to the electronic device 200 may affect the electrical performance of the electronic device 200. This application utilizes silicone to form a cover on the surface of tray 100, suppressing particle detachment from tray 100 caused by mutual collision or friction between the electronic device 200 and tray 100, thereby preventing the electrical performance of the electronic device 200 from being affected.

[0038] Furthermore, during the outward flow of the silicone, at least a portion of the conductive filler is carried outward along with it. Therefore, after the tray 100 is formed, at least a portion of the conductive filler is carried to the surface of the tray 100 by the silicone, and the silicone causes the conductive filler to distribute on the tray surface, thereby improving the static dissipation performance of the tray 100 surface. Thus, when the electronic device 200 collides or rubs against the surface of the tray, the tray 100 of this application can suppress the occurrence of static electricity, thereby preventing the static electricity generated by the collision or friction from affecting the electrical performance of the electronic device 200.

[0039] When the surface appearance of the resin substrate itself is poor, the surface appearance of the resulting tray 100 will be affected, negatively impacting its smoothness and flatness. The use of fillers (e.g., conductive fillers) also affects the surface appearance of the tray 100, especially when the filler content is high. The influence of the resin substrate and fillers on the surface appearance of the tray 100 includes visible or accessible particles on its surface. Forming a silicone coating on the surface of the tray 100 helps improve its surface appearance, resulting in a smoother and flatter surface.

[0040] Table 1 lists the embodiments and comparative examples of the present application, as well as their performance test results. The content values ​​of each component in the embodiments and comparative examples shown in Table 1 are the weight percentages of each component in the pallet sample. In Table 1, embodiments are indicated by the letter "E", and comparative examples are indicated by the letter "C".

[0041] The tray samples of the embodiments and comparative examples in Table 1 were prepared by injection molding. During the preparation process, the silicone and resin in the embodiments of this application were heated and melted to become fluid, allowing the silicone to flow to the surface of the tray sample.

[0042] Table 1. Examples and Comparative Examples and Performance Test Results

[0043]

[0044] In Table 1, the silicone used has a weight-average molecular weight of 800 kDa as determined by the GPC test method, and the PTFE (polytetrafluoroethylene) is Teflon. TM 8AX, carbon black is XC72, CNT (carbon nanotubes) is commercially available multi-walled CNT, PAS is polyphenylene sulfone resin (PPSU), PPO alloy is a blend of PPO and HIPS, of which HIPS accounts for 15% of the total weight of PPO alloy, copolyether is a copolymer of polyester and polyether, and glass fiber is commercially available glass fiber.

[0045] The particle reduction percentages in Table 1 were obtained using the following method. The tray samples of the examples and comparative examples were cleaned to remove surface particles. A metal block was fixed in the storage opening of the cleaned tray sample, and then the tray sample was sealed with polyethylene film for vibration testing. During the vibration test, the tray sample was placed in a tumbler, which was rotated at 2000 RPM for 1 hour, during which time the tray sample vibrated. Afterward, the tray samples were removed from the tumbler, and white paper was laid on a worktable. Each tray sample was tapped 15 times on the white paper, and the number of particles falling onto the paper was counted. In Table 1, the particle reduction percentages of the examples and comparative examples listed in Table 1 are obtained using the number of particles obtained from the tray sample of Comparative Example 1 as a benchmark. Specifically, the particle reduction percentage values ​​in Table 1 are obtained by calculating: (Number of particles in the example / comparative example - Number of particles in Comparative Example 1) ÷ Number of particles in Comparative Example 1.

[0046] The surface appearance in Table 1 was determined by the operator's visual observation and touch. A "Good" surface appearance indicates a very smooth and flat surface with no visible particles and no granular feel to the touch. A "Fair" surface appearance indicates a generally smooth and flat surface with slightly visible particles or a slightly granular feel to the touch. A "Poor" surface appearance indicates a surface with bubbles or peeling.

[0047] The ESD stability data in Table 1 were obtained using the probe method according to ASTM D257 standard. Specifically, 10-15 pairs of points were randomly selected on each tray sample to perform surface resistivity tests according to ASTM D257 standard. For tray samples with "Excellent" ESD stability, the surface resistivity measured at all pairs of points was within 1×10⁻⁶. 10 Below Ω. For the tray sample with "good" ESD stability, there is a pair of sites where the measured surface resistivity is 1×10 Ω. 10 The Ω is less than an order of magnitude higher. For the tray sample with "poor" ESD stability, the surface resistivity measured at more than one pair of sites is higher than 1×10. 10Ω is more than an order of magnitude higher, or the surface resistivity measured at two or more pairs of sites is greater than 1×10 10 Ω is less than an order of magnitude higher.

[0048] As shown in Table 1, silicone was not used in the tray samples of Comparative Examples 1-2 and 4, while PTFE was used instead of silicone in the tray sample of Comparative Example 3. Compared with Comparative Examples 1-4, the tray samples obtained according to Examples 1-9 of this application, after using silicone accounting for more than 0.15% of the total weight of the tray sample, showed a significant reduction in particle shedding. Furthermore, the tray samples in Examples 1-9 exhibited excellent electrostatic dissipation capabilities. Further, as shown in Examples 1-8, when silicone accounted for 0.15%-1.5% of the total weight of the tray sample, the surface of the tray sample had comparable or better smoothness and flatness compared to the comparative examples, i.e., a surface appearance comparable or better than the comparative examples.

[0049] The applicant found that, in Comparative Example 3, although PTFE also has low surface energy and is incompatible with various resins, its viscosity is very high after being heated and melted during the production of tray 100, resulting in poor flowability. Therefore, PTFE does not easily migrate to the surface of tray 100, and correspondingly, it does not easily carry conductive fillers to the surface of tray 100. Thus, as shown in Table 1, the tray samples obtained using PTFE have inferior particle reduction, electrostatic dissipation performance, and surface appearance compared to the embodiments of this application.

[0050] Based on the above test results, the tray 100 according to this application can suppress particle shedding and static electricity generation when it collides or rubs with the electronic device 200, thereby preventing the electrical performance of the electronic device 200 from being affected. Furthermore, when using an appropriate amount of silicone, the tray according to this application also has an excellent surface appearance.

[0051] Although this application only describes a tray 100 for carrying electronic devices 200, it should be understood that the composition article of this application can be manufactured as other forms of products. And although this application only describes the composition article according to this application for carrying electronic devices 200, it should be understood that the composition article of this application can be used to carry other articles.

[0052] Finally, the composition product of this application has many beneficial technical effects, including but not limited to:

[0053] 1. Reduce the amount of particles caused by friction and collision.

[0054] 2. Excellent static dissipation capability.

[0055] 3. Ensure the electrical performance of electronic components.

[0056] 4. Excellent surface appearance.

[0057] 5. The production process is simple.

[0058] Although this disclosure has been described in conjunction with examples of the embodiments outlined above, various alternatives, modifications, variations, improvements, and / or substantially equivalents, whether known or currently or soon to be foreseen, will likely be apparent to those skilled in the art. Furthermore, the technical effects and / or technical problems described herein are exemplary and not limiting; therefore, the disclosures herein may be used to solve other technical problems and have other technical effects and / or can solve other technical problems. Accordingly, the examples of embodiments of this disclosure as set forth above are intended to be illustrative and not limiting. Various changes may be made without departing from the spirit or scope of this disclosure. Therefore, this disclosure is intended to include all known or previously developed alternatives, modifications, variations, improvements, and / or substantially equivalents.

Claims

1. A composition article characterized in that, The composition article (100) includes: a resin, an electrically conductive filler, and a silicone, the silicone being 0.15% or more of the total weight of the composition article (100).

2. The composition article of claim 1, wherein, The resin and the silicone form two phases.

3. The composition article of claim 2, wherein, The content of the silicone is higher at the surface of the composition article (100) than in the interior of the composition article (100).

4. The composition article of claim 3, wherein, The silicone is 0.15% to 1.5% of the total weight of the composition article (100).

5. The composition article of claim 4, wherein, The silicone has a weight average molecular weight of greater than 200 KDa.

6. The composition article of claim 3, wherein, The resin is 67% to 96.75% of the total weight of the composition article (100).

7. The composition article of claim 6, wherein, The resin is 72.5% to 95.55% of the total weight of the composition article (100).

8. The composition article of claim 7, wherein, The resin is non-crystalline and has a water absorption of 0.5% in air at 25°C, 50% RH.

9. The composition article of claim 8, wherein, The resin includes at least one of the following polymers: acrylonitrile-styrene-butadiene copolymer, poly aryl sulfone, polyphenylene ether alloy, polysulfone, polyether sulfone, liquid crystal polymer, and polycarbonate.

10. The composition article of claim 3, wherein, The electrically conductive filler is 3% to 25% of the total weight of the composition article (100).

11. The composition article of claim 10, wherein, The electrically conductive filler is 4% to 20% of the total weight of the composition article (100).

12. The composition article of claim 11, wherein, The electrically conductive filler includes at least one of the following: carbon black, carbon nanotube, carbon fiber, electrically conductive or static dissipative polymer, and electrically conductive or static dissipative mica.

13. The composition article of any one of claims 1-12, the composition article (100) being made by an injection molding process.

14. The composition article of claim 1, wherein, The composition article (100) is for loading an article (200).

15. The composition article of claim 14, wherein, The composition article includes at least one receiving opening (111, 121) for securing the article (200) therein.

16. The composition article of claim 13, wherein, The composition article (100) is a tray, and the article (200) is an electronic device.

17. The composition article of claim 16, wherein, The article (200) is a semiconductor electronic device.

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