Nanoprobe manufacturing method and nanoprobe with micro-spring buffer structure

Abstract

The invention relates to a nanoprobe manufacturing method, which comprises the following steps of: selecting a metal probe; preparing a micro-spring by using an etching process; and the relative positions of the hollow silicon tube with the micro-spring and the metal probe are fixed by using a sleeve and a bolt and are combined. The high-precision micro-spring is prepared through wet etching real-time monitoring and is accurately matched with the tungsten steel probe, and a buffer structure is formed through convenient and fast assembly by installing a sleeve bolt. The micro-spring can effectively absorb contact impact force, probe abrasion and sample damage are avoided, and the detection stability is guaranteed; the micro-spring is good in dimensional precision and performance consistency, is adaptive to nanoscale detection requirements, and has assembling convenience and universality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit testing, and in particular to a nanometer probe manufacturing method and a nanometer probe with a micro-spring buffer structure. BACKGROUND

[0002] In the information age, integrated circuits are ubiquitous. From aerospace, high-speed rail and ships to mobile phones, computers and smart watches, integrated circuits are the key "components" in these products. Traditional industries such as the agricultural industry are also undergoing transformation and upgrading to achieve informatization and intelligentization with the help of integrated circuits. Integrated circuit technology is changing the way humans produce and live, and has become the "engine" of social informatization, with both economic value and strategic significance. With the continuous development of integrated circuits, electronic products are being used more and more widely, and human life is closely related to integrated circuits. Considering the product quality, production cost, customer satisfaction and national information security of integrated circuits, the importance of integrated circuit testing is self-evident.

[0003] Integrated circuit testing refers to a series of detection and verification processes performed on chips during the manufacturing process of integrated circuits. These tests aim to ensure that the chips function properly, perform stably, and meet the design specifications. Integrated circuit testing usually includes multiple stages, from the early stages of chip manufacturing to the final product testing. Probe station is one of the important detection equipment for integrated circuit testing, and is widely used in complex precision electrical measurement. The working principle of the probe station is to accurately position the probe to each device on the wafer surface through a precise mechanical system and electronic control system, and then test by applying current or voltage signals. This requires the probe to have high precision, high stability and long service life, etc. to ensure the accuracy and reliability of the test results.

[0004] The existing probe has the defect that the needle is easy to break. When the needle is inserted, if the force is too large or the needle is inserted for a long time, it will cause irreparable damage to the probe. Once slightly damaged, this damage, which is often invisible to the naked eye, will greatly affect the measured electrical characteristic parameters, and the replacement of the needle is also a considerable cost.

[0005] Traditional probes are generally machined, so the difficulty in achieving this design lies in the design of the micro-spring. Integrated circuits have developed to the present size, and the diameter of the metal probe on the probe station is mostly hundreds of microns. Traditional large-size springs are generally achieved by mechanical machining, so the micro-spring of the probe designed for integrated circuit chip testing must consider a new scheme. SUMMARY

[0006] The purpose of the present application is to provide a nanometer probe manufacturing method and a nanometer probe with a micro-spring buffer structure to solve the technical problems described in the background art.

[0007] A nano probe manufacturing method, comprising the following steps: S100: Selecting a tungsten steel probe with a diameter of 500 um; S200: Preparing a micro spring: the micro spring is a cylindrical compression spring; the micro spring is processed by a wet etching process: a cylindrical hollow wafer material silicon tube with an outer diameter of 550 um and an inner diameter of 500 um is selected; photoresist is evenly coated on the inner wall of the silicon tube, and the silicon tube with uniform photoresist is subjected to baking treatment; the etching solution is poured into a beaker, and the silicon tube is immersed in the beaker; in the initial etching stage, the sample is taken out every 15 min to observe the etching morphology, and the observation period is appropriately shortened to 10 min, 5 min, 2 min, etc. according to the etching degree of the sample, since the etching is non-uniform, the etched micro spring should be taken out and saved constantly, and when the position without photoresist is completely etched, the photoresist on the spring is removed to obtain a micro spiral compression spring; S300: Using a mounting sleeve and a bolt to fix the hollow silicon tube with the micro spring and the metal probe, and forming a nano probe with a micro spring buffer structure.

[0008] The nano probe with the micro spring buffer structure comprises a tungsten steel probe, a micro spring and a mounting sleeve; the top mounting section of the micro spring extends into the bottom of the mounting sleeve, and the bottom of the tungsten steel probe extends into the inner wall of the mounting sleeve from the top of the mounting sleeve; the bolt extends into the relative position of the mounting sleeve where the micro spring and the tungsten steel probe coincide to fix the micro spring mounting section, the tungsten steel probe and the mounting sleeve.

[0009] Compared with the prior art, the advantages and positive effects of the present application are that: the high-precision micro spring is prepared in real time by wet etching, which is accurately matched with the tungsten steel probe, and the buffer structure is conveniently assembled by the mounting sleeve bolt. The micro spring can effectively absorb the contact impact force, avoid probe wear and sample damage, and ensure the stability of detection; the size precision and performance consistency of the micro spring are good, which meets the requirements of nanoscale detection, and has the advantages of convenient assembly and universality. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0011] Figure 1 It is a structural schematic diagram of a nano probe with a micro spring buffer structure.

[0012] Figure 2 It is a schematic diagram of coating glue before etching of the micro spring.

[0013] Figure 3 This is a schematic diagram of the assembly of the micro-spring and the tungsten carbide probe.

[0014] Figure 4 This is a flowchart of a method for manufacturing a nanoprobe with a microspring buffer structure.

[0015] Figure 5 This is a flowchart of a micro-spring manufacturing process. Detailed Implementation

[0016] The description of this invention will be taken in conjunction with specific embodiments and with reference to specific drawings, but the invention is not limited thereto, but is limited only by the claims. The described drawings are merely illustrative and not restrictive. In the drawings, some elements may be enlarged and not drawn to scale for illustrative purposes. The use of the term "comprising" in this specification and claims does not exclude other elements or steps. The use of indefinite or definite articles, such as "a" or "the," when referring to singular nouns, includes the plural form of the noun unless otherwise stated.

[0017] The term "comprising" as used in the claims should not be construed as limiting it to the components listed thereafter, and does not exclude other elements or steps. Therefore, the expression "the device comprises components A and B" should not be limited to the device consisting solely of components A and B. This means that, with respect to the present invention, the relevant components of the device are only A and B.

[0018] Furthermore, the terms "first," "second," "third," etc., used in the specification and claims are used to distinguish similar elements and are not necessarily used to describe order or chronological sequence. It should be understood that such terms are interchangeable in appropriate contexts, and the embodiments of the invention described herein can operate in a different order than that described or illustrated herein.

[0019] Furthermore, the terms "top," "bottom," "above," "below," etc., used in the specification and claims are for descriptive purposes and not necessarily for describing relative positions. It should be understood that such terms are interchangeable in appropriate contexts, and the embodiments of the invention described herein can operate in directions other than those described or illustrated herein.

[0020] It should be noted that the term "comprising" as used in the claims should not be construed as limiting itself to the components listed thereafter, and does not exclude other elements or steps. Therefore, it should be understood as explicitly stating the presence of the described feature, integral, step, or component, but not excluding the presence or addition of one or more other features, integrals, steps, or components, or combinations thereof. Thus, the expression "the device comprises components A and B" should not be limited to the device consisting solely of components A and B. This means that, with respect to the present invention, the relevant components of the device are only A and B.

[0021] Throughout this specification, the phrase "an embodiment" or "one embodiment" refers to a specific feature, structure, or characteristic described in connection with the embodiment, which is included in at least one embodiment of the invention. Therefore, the phrases "in one embodiment" or "in one embodiment" appearing throughout this specification do not necessarily all refer to the same embodiment, but may refer to the same embodiment. Furthermore, those skilled in the art will readily understand from this invention that these features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0022] Similarly, it should be understood that in the description of exemplary embodiments of the invention, various features of the invention are sometimes combined in a single embodiment, drawing, or description therein to make the invention flow smoothly and to aid in understanding one or more of the multiple inventive aspects. However, this approach of the invention should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. In fact, as reflected in the following claims, the inventive aspects lie in fewer features than all of the features in a single foregoing embodiment. Therefore, the claims immediately following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim is independently a separate embodiment of the invention.

[0023] Furthermore, those skilled in the art will understand that while some embodiments described herein include certain features but not those included in other embodiments, combinations of features from different embodiments are intended to fall within the scope of the invention and form different embodiments. For example, any claimed embodiment in the appended claims can be used in any combination.

[0024] Numerous specific details are set forth in the description provided herein. However, it should be understood that various embodiments of the invention may be practiced without these specific details. In other instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0025] The invention will now be described by way of a detailed description of several embodiments thereof. It is obvious that other embodiments of the invention can be configured based on the knowledge of those skilled in the art without departing from the technical teachings of the invention, and the invention is limited only by the terminology of the appended claims.

[0026] As per the instruction manual Figures 1-5 As shown: A method for manufacturing nanoprobes includes the following steps: S100: The probe is made of tungsten carbide and has a diameter of 500um. S200: Fabrication of microsprings: The microsprings are cylindrical compression springs; the microsprings are fabricated using a wet etching process: a cylindrical hollow wafer silicon tube with an outer diameter of 550 μm and an inner diameter of 500 μm is selected; photoresist is uniformly coated on the inner wall of the silicon tube, and the coated silicon tube is baked; the etching solution is poured into a beaker, and the silicon tube is immersed in the beaker. In the initial stage of etching, the sample is taken out every 15 minutes to observe the etching morphology, and the observation period is appropriately shortened to 10 minutes, 5 minutes, 2 minutes, etc., depending on the degree of etching. Since the etching is non-uniform, the etched microsprings should be taken out and stored continuously. When the area without photoresist is completely etched away, the photoresist on the spring is removed to obtain a miniature helical compression spring. S300: A hollow silicon tube with microsprings and a metal probe are fixed together using mounting sleeves and bolts to form a nanoprobe with a microspring buffer structure.

[0027] The working principle of a nanoprobe manufacturing method: A hollow silicon tube (500µm inner diameter, 550µm outer diameter) with an inner diameter precisely matched to the tungsten carbide probe diameter (500µm) was selected as the substrate. Photoresist was coated and baked to firmly adhere to the target area on the inner wall of the silicon tube, forming a protective etching layer. After immersing the silicon tube in the etching solution, selective etching occurred in areas not covered by photoresist, while the areas protected by photoresist retained their original structure. By periodically adjusting the observation period (gradually shortening from 15 minutes to 2 minutes), the etching morphology and progress were monitored in real time. Utilizing the non-uniformity of etching, the silicon tube with completed target etching was promptly removed to avoid over-etching or under-etching. After the areas without photoresist were completely etched away, the residual photoresist was removed, and the protected area remaining on the inner wall of the silicon tube formed a spiral support structure, ultimately resulting in a cylindrical spiral compression spring adapted to the probe. The prepared microspring and tungsten carbide probe are coaxially fixed together using mounting sleeves and bolts, so that the axis of the microspring coincides with the axis of the tungsten carbide probe. When the nanoprobe is used for nanoscale detection (such as surface morphology characterization, micro-force measurement, etc.), the probe tip contacts the sample and is subjected to pressure. Based on the elastic properties of the helical compression structure, the microspring undergoes reversible compression deformation, absorbing the impact force between the probe and the sample through deformation, thus achieving buffering and unloading. At the same time, the elastic restoring force of the microspring can maintain stable contact between the probe and the sample, avoiding probe tip wear or sample surface damage caused by rigid collision.

[0028] The nanoprobe manufacturing method in this embodiment utilizes a wet etching process with real-time monitoring to prepare a high-precision microspring, which is precisely matched with a tungsten carbide probe. The spring is then easily assembled using mounting sleeve bolts to form a buffer structure. The microspring effectively absorbs contact impact forces, preventing probe wear and sample damage, and ensuring detection stability. The microspring exhibits good dimensional accuracy and performance consistency, meeting nanoscale detection requirements, and combining ease of assembly with versatility.

[0029] Specifically, a method for manufacturing nanoprobes also includes S210: preparing a cylindrical hollow wafer material silicon tube with an outer diameter of 550 μm and an inner diameter of 500 μm before wet etching, then rinsing off the impurities on the silicon tube with clean water, wiping it with cotton soaked in anhydrous alcohol, and drying it with a hair dryer.

[0030] Specifically, a method for manufacturing nanoprobes also includes step S220: further coating a hollow cylindrical silicon wafer with photoresist already coated on its inner wall; applying photoresist spirally to the outer wall of the middle portion of the horizontally placed silicon wafer, which will be etched into a microspring in a subsequent step; and placing the coated silicon wafer on a hot plate at 130°C for 9 minutes. By applying photoresist spirally to the pre-defined area of ​​the microspring in the middle of the horizontally placed silicon wafer, unevenness of the photoresist layer caused by gravity is avoided and photoresist waste is reduced. Combined with the precise process of baking on a hot plate at 130°C for 9 minutes, the photoresist is fully cross-linked and cured to improve adhesion and etching resistance to the outer wall of the silicon wafer, while eliminating residual stress in the photoresist layer. This synergistic effect ensures the accuracy of key dimensions such as pitch and wire diameter of the microspring formed by subsequent etching, resulting in a regular structure and smooth sidewalls, improving the mechanical stability and fatigue life of the microspring, while also adapting to the physicochemical properties of the silicon substrate to avoid structural damage, thus balancing process stability and production efficiency.

[0031] Specifically, a method for manufacturing nanoprobes also includes S230: exposure treatment for 90 seconds using a URE-2000 / 17 ultraviolet depth exposure machine.

[0032] Specifically, a method for manufacturing nanoprobes also includes S240: The etching solutions used in wet etching are HNO3 and HF. The chemical reactions between the etching solutions and Si and SiO2 satisfy the following relationship: Si + HNO3 → SiO2 + 2H2O + 4NO2 SiO2 + 6HF → H2SiF6 + 2H2O Pour the HNO3 and HF etching solution into a beaker and immerse the silicon tube in the beaker.

[0033] The nanoprobe with a micro-spring buffer structure manufactured based on the above manufacturing method includes: a tungsten carbide probe 100, a micro-spring 200, and a mounting sleeve 300; the top mounting section 210 of the micro-spring 200 extends into the bottom of the mounting sleeve 300, and the bottom of the tungsten carbide probe 100 extends from the top of the mounting sleeve 300 into the inner wall of the mounting sleeve 300; a bolt 310 extends into the mounting sleeve 300 to fix the micro-spring mounting section 210, the tungsten carbide probe 100, and the mounting sleeve 300 at their overlapping relative positions.

[0034] Specifically, the nanoprobe with a micro-spring buffer structure is precisely fixed to the tungsten steel probe and the micro-spring by the installation sleeve and bolts, ensuring the relative position stability and coaxiality of the three. The micro-spring can effectively buffer the impact force when the probe comes into contact with the sample, avoiding probe wear and sample damage, and ensuring detection accuracy. The tungsten steel probe has both high hardness and wear resistance, extending its service life. The bolt and sleeve fixing method is convenient to assemble and disassemble, and the structure is compact and reasonable, making it suitable for nanoscale detection scenarios.

[0035] Specifically, the microspring 200 has a probe station mounting part 220 at its bottom, which is used to fix the microspring to the probe station. The probe station mounting part at the bottom of the microspring achieves a stable assembly with the probe station, accurately ensuring the coaxiality and installation stability of the probe and the probe station, and avoiding the impact of loose assembly on the buffering effect and detection accuracy during the detection process.

[0036] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), or random access memory (RAM), etc.

[0037] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A method of manufacturing a nanoprobe, characterized by the steps of Comprise: S100: select tungsten steel material probe, probe diameter is 500 um; S200: preparation of micro spring: micro spring is cylindrical compression spring; Through wet etching process processing micro spring: select the outer diameter 550 um, inner diameter 500 um cylindrical hollow wafer material silicon tube; The photoresist is evenly coated on the inner wall of the silicon tube, and the silicon tube with uniform glue is baked; The etching solution is poured into a beaker, and the silicon tube is immersed in the beaker, and the etching morphology is observed every 15 min in the initial etching stage, and the observation period is appropriately shortened to 10 min, 5 min, 2 min, etc. According to the etching degree of the sample, since the etching is not uniform, the etched micro spring should be taken out and saved, and when the position without photoresist is completely etched, the photoresist on the spring is removed, and the micro spiral compression spring is obtained; S300: use installation sleeve and bolt to fix the hollow silicon tube with micro spring and metal probe, and form the nano probe with micro spring buffer structure.

2. The nanoprobe manufacturing method of claim 1, wherein, The steps further comprise: S210: before wet etching, prepare the outer diameter 550 um, inner diameter 500 um cylindrical hollow wafer material silicon tube, then rinse the dirt on the silicon tube with water, and wipe it with cotton dipped in anhydrous alcohol, and dry it with a hair dryer.

3. The nanoprobes manufacturing method according to claim 1, wherein, The steps further comprise: S220: further glue treatment is made to the hollow cylindrical wafer material silicon tube with photoresist coated on the inner wall, the photoresist is spirally applied to the outer wall of the middle part of the silicon tube placed horizontally, which is etched into a micro spring in the subsequent step, and the silicon tube with uniform glue is placed on a hot plate at 130 DEG C for 9 min.

4. The nanoprobes manufacturing method according to claim 1, wherein, The steps further comprise: S230: exposure treatment is carried out for 90 s by using URE-2000 / 17 type ultraviolet depth exposure machine.

5. The nanoprobes manufacturing method according to claim 1, wherein, The steps further comprise: S240: pour HNO3 and HF etching solution into a beaker, and immerse the silicon tube in the beaker.

6. The nano-probe with micro-spring buffer structure manufactured based on the nano-probe manufacturing method according to any one of claims 1-5, characterized in that, Comprise: Tungsten steel probe (100), micro spring (200), installation sleeve (300); The top installation section (210) of the micro spring (200) extends into the bottom of the installation sleeve (300), and the bottom of the tungsten steel probe (100) extends into the inner wall of the installation sleeve (300) from the top of the installation sleeve (300); The bolt (310) extends into the relative position of the micro spring (200) and the tungsten steel probe (100) coinciding in the installation sleeve (300), and the micro spring installation section (210), the tungsten steel probe (100) and the installation sleeve (300) are fixed.

7. The nano-probe with micro-spring buffer structure according to claim 6, wherein, Further comprise: The bottom of the micro spring (200) is provided with a probe table mounting part (220), and the probe table mounting part (220) of the micro spring is fixedly installed on the probe table.

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