Mechanism for measuring characteristics of electronic components, apparatus for manufacturing electronic components equipped with same, and method for measuring

Abstract

The invention provides a characteristic measurement mechanism for an electronic component, an electronic component manufacturing apparatus provided with the characteristic measurement mechanism, and a characteristic measurement method for an electronic component. The present invention suppresses the occurrence of poor measurement of characteristics of an electronic component. The electronic component characteristic measurement mechanism includes: a plurality of measurement terminal groups each having a plurality of measurement terminals and capable of abutting against a plurality of external electrodes provided in an electronic component; a measurement unit that is electrically connected between the measurement terminal groups, among the plurality of measurement terminal groups, which are respectively in contact with at least two of the plurality of external electrodes, and that measures the characteristics of the electronic component; and a voltage generation unit electrically connected to each of the plurality of measurement terminal groups, the tip of each of the plurality of measurement terminals having a flat surface facing the outer surface of the external electrode that is in contact with the plurality of external electrodes, the voltage generation unit being electrically connected to each of the plurality of measurement terminal groups, and the voltage generation unit being electrically connected to each of the plurality of measurement terminal groups. A voltage is applied between the measurement terminals by a voltage generation unit to discharge.

Description

Technical Field

[0001] The present invention relates to a characteristic measuring mechanism for electronic components, an apparatus for manufacturing electronic components equipped with the characteristic measuring mechanism, and a method for measuring the characteristics of electronic components. Background Technology

[0002] As prior art, Japanese Patent Publication No. 4-177891 (Patent Document 1) discloses the structure of a tape-and-reel assembly for electronic components. In the tape-and-reel assembly for electronic components described in Patent Document 1, a component feeder, a continuity testing machine, and a tape-and-reel section are arranged sequentially in the rotation direction of the turntable around an intermittently rotating turntable. The continuity testing machine has probes that abut against the external electrodes of the electronic components.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Publication No. Hei 4-177891 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In electronic component characteristic measurement mechanisms, if the tip of the measuring terminal deteriorates due to wear or other factors, or if foreign matter accumulates on the tip of the measuring terminal due to repeated use, it may be difficult to obtain electrical conductivity between the measuring terminal and the external electrode of the electronic component, resulting in poor measurement of the electronic component's characteristics.

[0008] The present invention was made in view of the above-mentioned problems, and its object is to provide a characteristic measurement mechanism for electronic components that can suppress the occurrence of measurement defects in the characteristics of electronic components, an apparatus for manufacturing electronic components equipped with the characteristic measurement mechanism, and a method for measuring the characteristics of electronic components.

[0009] means for solving problems

[0010] The characteristic measurement mechanism for an electronic component according to the present invention includes multiple measurement terminal groups, a measuring section, and a voltage generating section. Each of the multiple measurement terminal groups has multiple measurement terminals capable of contacting with multiple external electrodes of the electronic component. The measuring section is electrically connected between the measurement terminal groups that contact at least two of the external electrodes, and measures the characteristics of the electronic component. The voltage generating section is electrically connected to each of the multiple measurement terminal groups. Each of the multiple measurement terminals has a flat surface at its tip facing the outer surface of the contacting external electrode. In each of the multiple measurement terminal groups, the voltage generating section applies a voltage between the measurement terminals to discharge them.

[0011] The effects of the invention

[0012] According to the present invention, it is possible to suppress the occurrence of measurement defects in the characteristics of electronic components. Attached Figure Description

[0013] Figure 1 This is a perspective view showing the appearance of the electronic component according to Embodiment 1 of the present invention.

[0014] Figure 2 Observe from the direction of the arrow on line II-II Figure 1 The cross-sectional view obtained from the electronic components.

[0015] Figure 3 Observe from the direction of the arrow on line III-III Figure 1 The cross-sectional view obtained from the electronic components.

[0016] Figure 4 This is a top view showing the structure of the manufacturing apparatus for electronic components according to Embodiment 1 of the present invention.

[0017] Figure 5 Observe from the direction of the arrow on the VV line Figure 4 A schematic cross-sectional view obtained from the periphery of the characteristic measuring mechanism of the electronic components.

[0018] Figure 6 From Figure 5 The diagram shows the positional relationship between multiple measuring terminals and the external electrodes of electronic components, as observed by arrow VI in the direction of observation.

[0019] Figure 7 This is a diagram showing the positional relationship between multiple measuring terminals and the external electrodes of the electronic component in a modified embodiment 1 of the present invention.

[0020] Figure 8 This is a top view showing the first and second regions of the Sn layer formed on a flat surface.

[0021] Figure 9 It is a graph showing the relationship between driving time and driving speed when using piezoelectric elements to drive the measuring terminals.

[0022] Figure 10 This is a schematic diagram showing the circuit structure of the characteristic measurement mechanism of the electronic component according to Embodiment 1 of the present invention.

[0023] Figure 11 This is a flowchart illustrating the operation of the characteristic measurement mechanism of the electronic component according to Embodiment 1 of the present invention.

[0024] Figure 12 This is a diagram showing the state in which a discharge phenomenon occurs between the measuring terminals.

[0025] Figure 13 This is a schematic cross-sectional view showing the structure of the characteristic measurement mechanism of the ultrasonic electronic component according to Embodiment 2 of the present invention.

[0026] Explanation of reference numerals in the attached figures

[0027] 1. Manufacturing apparatus for electronic components; 10. Bowl-shaped feeder; 20. Linear feeder; 30. Planar stage; 40. Rotor; 40p. Recess; 50. Cover; 60. Conveying mechanism; 70. Drive unit; 80. Appearance screening mechanism; 90. Packaging mechanism; 91. Belt; 91h. Bag; 100. Multilayer ceramic capacitor; 110. Laminated body; 111. First main surface; 112. Second main surface; 113. First side surface; 114. Second side surface; 115. First end face; 116. Second end face; 120. First external electrode; 130. Second external electrode; 140. Dielectric layer; 150. Internal electrode layer; 151. First internal electrode layer; 152. Second internal electrode layer; 200. Characteristic measurement mechanism; 2 10. First measuring terminal group; 211. First measuring terminal; 212. Second measuring terminal; 220. Second measuring terminal group; 221. First measuring terminal; 222. Second measuring terminal; 230. Measuring unit; 240A. First voltage generating unit; 240B. Second voltage generating unit; 250. Switching unit; 251. First switch; 252. Second switch; 253. First terminal; 254. First terminal; 255. Second terminal; 256. Second terminal; C. Inner layer; E1. First end edge; E2. Second end edge; FT. Flat surface; R1. First region; R2. Second region; S. Central axis; S1. First side edge; S2. Second side edge; X1. First outer layer; X2. Second outer layer. Detailed Implementation

[0028] The following description, with reference to the accompanying drawings, describes the characteristic measurement mechanism for electronic components according to various embodiments of the present invention, the manufacturing apparatus for electronic components equipped with the characteristic measurement mechanism, and the characteristic measurement method for electronic components. In the following description of the embodiments, the same or equivalent parts in the drawings will be labeled with the same reference numerals, and their description will not be repeated.

[0029] (Implementation Method 1)

[0030] First, the structure of the electronic component in Embodiment 1 of the present invention will be described. Figure 1 This is a perspective view showing the appearance of the electronic component according to Embodiment 1 of the present invention. Figure 2 Observe from the direction of the arrow on line II-II Figure 1 The cross-sectional view obtained from the electronic components. Figure 3 Observe from the direction of the arrow on line III-III Figure 1A cross-sectional view obtained from electronic components. For example... Figures 1-3 As shown, the electronic component in Embodiment 1 of the present invention is a multilayer ceramic capacitor 100. Figures 1-3 The diagram shows the length direction L, width direction W, and stacking direction T of the laminate, which will be described later.

[0031] like Figures 1-3 As shown, the multilayer ceramic capacitor 100 of Embodiment 1 of the present invention includes a multilayer body 110, a first external electrode 120, and a second external electrode 130. The multilayer body 110 includes a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 alternately stacked along the stacking direction T.

[0032] The laminate 110 includes a first main surface 111 and a second main surface 112 opposite to each other in the lamination direction T, a first side surface 113 and a second side surface 114 opposite to each other in the width direction W orthogonal to the lamination direction T, and a first end surface 115 and a second end surface 116 opposite to each other in the length direction L orthogonal to both the lamination direction T and the width direction W. A first external electrode 120 is disposed on the first end surface 115. A second external electrode 130 is disposed on the second end surface 116.

[0033] The plurality of internal electrode layers 150 include a plurality of first internal electrode layers 151 connected to the first external electrode 120 and a plurality of second internal electrode layers 152 connected to the second external electrode 130. Additionally, in Figure 2 and Figure 3 The example shown is that the first internal electrode layer 151 and the second internal electrode layer 152 each have five layers, but the number of layers of the first internal electrode layer 151 and the second internal electrode layer 152 is not limited to five layers.

[0034] like Figure 2 and Figure 3 As shown, the laminate 110 is divided into an inner layer C, a first outer layer X1, a second outer layer X2, a first side edge S1, a second side edge S2, a first end edge E1, and a second end edge E2.

[0035] The inner layer C has electrostatic capacitance by being stacked in the stacking direction T through the opposing portions of the first inner electrode layer 151 and the opposing portions of the second inner electrode layer 152. The first outer layer X1 is located on the side of the first main surface 111 of the inner layer C in the stacking direction T. The second outer layer X2 is located on the side of the second main surface 112 of the inner layer C in the stacking direction T.

[0036] The first side edge S1 is located on the first side surface 113 side of the inner layer C in the width direction W. The second side edge S2 is located on the second side surface 114 side of the inner layer C in the width direction W. The first end edge E1 is located on the first end face 115 side of the inner layer C in the length direction L. The second end edge E2 is located on the second end face 116 side of the inner layer C in the length direction L.

[0037] The laminate 110 preferably has rounded corners and edges. Here, the corners are the parts where three faces of the laminate 110 intersect, and the edges are the parts where two faces of the laminate 110 intersect.

[0038] The thickness of the dielectric layer 140 located in the inner layer C is, for example, 0.3 μm or more and 0.8 μm or less. Furthermore, the thicknesses of the first outer layer X1 and the second outer layer X2 are, for example, 10 μm or more and 30 μm or less. The widths of the first side edge S1 and the second side edge S2 are, for example, 0.1 μm or more and 0.5 μm or less. The lengths of the first end edge E1 and the second end edge E2 are, for example, 0.2 mm or more and 1.0 mm or less. The thicknesses of the dielectric layer 140 located in the inner layer C, the first outer layer X1, and the second outer layer X2, as well as the lengths of the first end edge E1 and the second end edge E2, are dimensions at the center of the laminate in the width direction W. The widths of the first side edge S1 and the second side edge S2 are dimensions at the center of the laminate in the length direction L.

[0039] The plurality of dielectric layers 140 respectively contain, for example, perovskite-structured dielectric particles such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3 as the main component. The plurality of dielectric layers 140 may also contain, in a smaller amount than the main component, at least one of Si compound, Mg compound, Mn compound, Fe compound, Cr compound, Ni compound, and Co compound.

[0040] The first internal electrode layer 151 has a counter electrode portion opposite to the second internal electrode layer 152 and an exit electrode portion extending from the counter electrode portion to the first end face 115 of the laminate 110. The second internal electrode layer 152 has a counter electrode portion opposite to the first internal electrode layer 151 and an exit electrode portion extending from the counter electrode portion to the second end face 116 of the laminate 110.

[0041] The first internal electrode layer 151 and the second internal electrode layer 152 each comprise a metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing such metal. The first internal electrode layer 151 and the second internal electrode layer 152 may also further comprise dielectric particles with the same composition as the ceramic contained in the dielectric layer 140. Furthermore, Sn may be present at the interface between the first internal electrode layer 151 and the second internal electrode layer 152 and the dielectric layer 140.

[0042] The thickness of each of the first internal electrode layer 151 and the second internal electrode layer 152 is, for example, 0.3 μm or more and 0.8 μm or less. In addition, the number of internal electrode layers 150 including the first internal electrode layer 151 and the second internal electrode layer 152 is, for example, 10 or more and 1000 or less.

[0043] Here, the thicknesses of the dielectric layer 140, the first internal electrode layer 151, and the second internal electrode layer 152 can be measured by the following method.

[0044] First, the surface defined by the lamination direction T and width direction W of the laminate 110, i.e., the surface of the laminate 110 orthogonal to the length direction L, is exposed by grinding, and the exposed cross-section is observed using a scanning electron microscope. Next, the thickness of the dielectric layer 140 is measured along five lines: a centerline passing through the center of the exposed cross-section along the lamination direction T, and two lines equally spaced out from this centerline on both sides. The average of these five measurements is taken as the thickness of the dielectric layer 140.

[0045] Regarding the thickness of the first internal electrode layer 151 and the second internal electrode layer 152, a cross-section identical to the cross-section in which the thickness of the dielectric layer 140 was measured can be used with a scanning electron microscope in accordance with the method for measuring the thickness of the dielectric layer 140.

[0046] The first external electrode 120 is formed on the entire first end face 115 of the laminate 110, and is formed to extend from the first end face 115 to the first main face 111, the second main face 112, the first side face 113 and the second side face 114. The first external electrode 120 is electrically connected to the first internal electrode layer 151.

[0047] The second external electrode 130 is formed integrally on the second end face 116 of the laminate 110, and extends from the second end face 116 to the first main face 111, the second main face 112, the first side face 113, and the second side face 114. The second external electrode 130 is electrically connected to the second internal electrode layer 152.

[0048] Both the first external electrode 120 and the second external electrode 130 have, for example, a base electrode layer and a plating layer disposed on the base electrode layer. The base electrode layer includes at least one layer selected from layers such as a calcined electrode layer, a resin electrode layer, and a thin film electrode layer.

[0049] A calcined electrode layer is a layer comprising glass and metal, which can be a single layer or multiple layers. For example, a calcined electrode layer may be composed of a metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing that metal, such as an alloy containing Ag and Pd.

[0050] The calcined electrode layer is formed by coating a conductive paste containing glass and metal onto the laminate 110 and then calcining it. Calcination can be performed simultaneously with or after the firing of the laminate 110. The maximum thickness of the calcined electrode layer is, for example, 20 μm or more and 70 μm or less.

[0051] The resin electrode layer can be formed, for example, into a layer comprising conductive particles and a thermosetting resin. When forming a resin electrode layer, it is also possible to form the resin electrode layer directly on the laminate without forming a calcined electrode layer. The resin electrode layer can be a single layer or multiple layers. The maximum thickness of the resin electrode layer is, for example, 20 μm or more and 70 μm or less.

[0052] Thin film electrode layers, for example, are layers less than 1 μm thick formed by the accumulation of metal particles, and can be formed by known thin film formation methods such as sputtering or vapor deposition.

[0053] The plating disposed on the base electrode layer is, for example, composed of a metal selected from the group consisting of Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn, or an alloy containing such metal, such as an alloy containing Ag and Pd. The plating can be a single layer or multiple layers. However, a double-layer structure with a Sn plating layer formed on top of a Ni plating layer is preferred. The Ni plating layer has the function of preventing the base electrode layer from being eroded by solder when mounting the multilayer ceramic capacitor 100. The Sn plating layer has the function of improving the wettability of solder when mounting the multilayer ceramic capacitor 100. When the inner electrode layer is formed of Ni, the first plating layer is preferably composed of Cu, which has good adhesion to Ni. Glass is preferably not included in the plating layer. The metal content per unit volume of the plating layer is preferably 99% by volume or more. The plating layer is formed by columnar growth of grains along the thickness direction of the plating layer. The thickness of each plating layer is preferably 1 μm or more and 15 μm or less.

[0054] The dimension of the multilayer ceramic capacitor 100 in the length direction L is, for example, 0.1 mm or more and 3.2 mm or less. The dimension of the multilayer ceramic capacitor 100 in the stacking direction T is 0.05 mm or more and 1.6 mm or less. The dimension of the multilayer ceramic capacitor 100 in the width direction W is, for example, 0.05 mm or more and 1.6 mm or less. The above values ​​represent the range of nominal dimensions excluding tolerances.

[0055] Furthermore, electronic components are not limited to capacitors. In electronic components, piezoelectric ceramics function as piezoelectric elements, semiconductor ceramics function as thermistors, and magnetic ceramics function as inductors. However, in the case of inductors, the internal electrodes are composed of spiral conductors.

[0056] Next, the structure of the characteristic measuring mechanism for the electronic component according to Embodiment 1 of the present invention and the manufacturing apparatus for the electronic component equipped with the characteristic measuring mechanism will be described. Figure 4 This is a top view showing the structure of the manufacturing apparatus for electronic components according to Embodiment 1 of the present invention. Figure 5 Observe from the direction of the arrow on the VV line Figure 4 A schematic cross-sectional view obtained from the periphery of the characteristic measuring mechanism of the electronic components. Figure 4 The cover, which will be described later, is not shown in the figure.

[0057] like Figure 4 and Figure 5 As shown, the electronic component manufacturing apparatus 1 of Embodiment 1 of the present invention includes an electronic component characteristic measuring mechanism 200, a conveying mechanism 60, and a packaging mechanism 90. The electronic component manufacturing apparatus 1 also includes a bowl-shaped feeder 10, a linear feeder 20, and an appearance screening mechanism 80.

[0058] A multilayer ceramic capacitor 100, which is an electronic component, is fed into a bowl-shaped feeder 10 from a hopper (not shown). The bowl-shaped feeder 10 is equipped with a sensor capable of measuring the number of multilayer ceramic capacitors 100 fed. A linear feeder 20 is connected to the outlet of the bowl-shaped feeder 10. The multilayer ceramic capacitors 100 are discharged one by one from the bowl-shaped feeder 10 to the linear feeder 20.

[0059] The linear feeder 20 conveys the multilayer ceramic capacitors 100 to the conveying mechanism 60 by vibration. Alternatively, a magnet can be placed midway through the linear feeder 20, and the magnetic force of the magnet can act on the internal electrodes of the multilayer ceramic capacitors 100 to change their orientation. In this case, it is possible to ensure that the orientation of multiple multilayer ceramic capacitors 100 conveyed by the linear feeder 20 is consistent.

[0060] The conveying mechanism 60 includes a planar stage 30, a rotor 40, and a cover 50. The planar stage 30 has a circular plate shape. The upper surface of the planar stage 30 is horizontal. The planar stage 30 is made of an insulating material such as zirconium oxide or epoxy glass. The planar stage 30 is fixed. The rotor 40 is rotatably mounted on the planar stage 30.

[0061] The rotor 40 has a circular plate shape with recesses 40p formed at equal intervals around its periphery. The recesses 40p serve as housings for the multilayer ceramic capacitors 100. The rotor 40 rotates intermittently in one direction around its central axis S. Thus, the multilayer ceramic capacitors 100 housed in the recesses 40p are intermittently transported circumferentially along the central axis S on the planar stage 30. That is, the transport mechanism 60 transports electronic components on the planar stage 30. The rotor 40 is made of an insulating material such as zirconium oxide or epoxy glass.

[0062] A cover 50 is disposed on the rotor 40. The cover 50 has a circular plate shape. The cover 50 is made of an insulating material such as zirconium oxide or epoxy glass. The cover 50 is used to prevent the multilayer ceramic capacitor 100 housed in the recess 40p from flying upwards. In addition, the cover 50 does not need to cover the entire rotor 40, or it can only cover a part of the rotor 40. When taking pictures by a camera in the appearance screening mechanism 80, the part of the cover 50 can also be made of transparent glass in order to enable the picture to be taken.

[0063] An electronic component characteristic measurement mechanism 200, an appearance screening mechanism 80, and a packaging mechanism 90 are sequentially arranged along the transport path of the transport mechanism 60. The characteristic measurement mechanism 200 measures the characteristics of a multilayer ceramic capacitor 100. The characteristics of the multilayer ceramic capacitor 100 include, for example, electrostatic capacitance, insulation resistance, or inductance. However, the electronic component characteristic measurement mechanism 200 and the appearance screening mechanism 80 are not necessarily arranged in this order.

[0064] The appearance inspection of the multilayer ceramic capacitor 100 is carried out in the appearance inspection mechanism 80. Specifically, the appearance inspection mechanism 80 checks the shape, size, and presence of defects or cracks in the multilayer ceramic capacitor 100.

[0065] In the packaging mechanism 90, only the multilayer ceramic capacitors 100 that are determined to be qualified products by the characteristic measurement mechanism 200 and the appearance screening mechanism 80 are packaged. That is, the packaging mechanism 90 packages electronic components whose characteristics have been measured by the measuring unit of the electronic component characteristic measurement mechanism 200 (described later). In addition, unqualified electronic components are removed from the recess 40p by an ejection mechanism (not shown) disposed between the packaging mechanism 90 and the appearance screening mechanism 80.

[0066] In this embodiment, the stacked ceramic capacitor 100 is packaged in the packaging mechanism 90 in a bag 91h housed within a long strip 91. However, the stacked ceramic capacitor 100 may also be packaged in the packaging mechanism 90 in a loosely arranged manner within the outer casing.

[0067] like Figure 5 As shown, the characteristic measurement mechanism 200 for electronic components includes multiple measurement terminal groups, a measurement section 230, and a voltage generation section. The characteristic measurement mechanism 200 for electronic components also includes a drive section 70.

[0068] Each of the multiple measurement terminal groups has multiple measurement terminals that can respectively contact the multiple external electrodes of the electronic component. In this embodiment, the characteristic measurement mechanism 200 of the electronic component has a first measurement terminal group 210 and a second measurement terminal group 220, but the number of measurement terminal groups is not limited to two, and varies correspondingly to the number of external electrodes of the electronic component.

[0069] The first measuring terminal group 210 has a first measuring terminal 211 and a second measuring terminal 212. That is, the first measuring terminal group 210 consists of a pair of measuring terminals. However, the number of measuring terminals in the first measuring terminal group 210 is not limited to two, and may be three or more.

[0070] The second measuring terminal group 220 has a first measuring terminal 221 and a second measuring terminal 222. That is, the second measuring terminal group 220 consists of a pair of measuring terminals. However, the number of measuring terminals in the second measuring terminal group 220 is not limited to two, and may be three or more.

[0071] Each of the plurality of measuring terminals has a flat surface FT at its tip that faces the outer surface of one of the plurality of external electrodes. In this embodiment, the first measuring terminal 211 and the second measuring terminal 212 each have a flat surface FT that faces the lower surface of the first external electrode 120. The first measuring terminal 221 and the second measuring terminal 222 each have a flat surface FT that faces the lower surface of the second external electrode 130.

[0072] Alternatively, the top ends of each of the multiple measuring terminals can be entirely flat surfaces FT, or only a portion of the top ends of each of the multiple measuring terminals can be flat surfaces FT. For example, the central portion of the top end of each of the multiple measuring terminals can be a flat surface FT, while the peripheral portion is conical.

[0073] The thickness of each of the multiple measuring terminals is, for example, 10 μm or more and 0.5 mm or less. The aforementioned thickness refers to the diameter when the measuring terminal is cylindrical, and the length of one side when the measuring terminal is prismatic. The length of each of the multiple measuring terminals is, for example, 100 mm or more and 1000 mm or less. The distance between the measuring terminals within the measuring terminal group is, for example, 10 μm or more and 0.5 mm or less.

[0074] Figure 6 It is from Figure 5 The diagram shows the positional relationship between multiple measurement terminals and the external electrodes of electronic components, as indicated by arrow VI. Figure 6 As shown, in this embodiment, the first measuring terminal 211 and the second measuring terminal 212 are located at a distance between each other in the width direction W. The first measuring terminal 221 and the second measuring terminal 222 are located at a distance between each other in the width direction W.

[0075] Figure 7 This is a diagram showing the positional relationship between multiple measuring terminals and the external electrodes of the electronic component in a modified embodiment 1 of the present invention. Figure 7 China and Figure 6 The diagram is drawn by observing from the same direction. For example... Figure 7 As shown, in the modified example, the first measuring terminal 211 and the second measuring terminal 212 are located at a distance from each other in the length direction L. The first measuring terminal 221 and the second measuring terminal 222 are located at a distance from each other in the length direction L.

[0076] Compared to the modified example, in this embodiment, by arranging the measuring terminals in the measuring terminal group together along the width direction W of the electronic component, it is possible to ensure the distance between the measuring terminals while making the measuring terminals thicker, thereby improving the strength and wear resistance of the measuring terminals.

[0077] The measuring terminals are made of metals with high conductivity, such as tungsten, iron, or copper. Furthermore, considering environmental factors, it is preferable that the measuring terminals do not contain beryllium. Alternatively, a Sn layer may be formed on the flat surface FT.

[0078] Figure 8 This is a top view showing regions 1 and 2 of the Sn layer formed on a flat surface. When a Sn layer is formed on the flat surface FT, as described later, based on the discharge at the tip of the measuring terminal, such as... Figure 8 As shown, the Sn layer has different compositions in the first region R1 located in the center of the flat plane FT and the second region R2 located in the periphery of the flat plane FT.

[0079] Specifically, compared to the Sn layer in region 1 R1, which contains 5% to 8% oxygen by mass, the Sn layer in region 2 R2 contains 10% to 20% oxygen by mass. That is, the mass percentage of Sn in the Sn layer of region 1 R1 is greater than that in the Sn layer of region 2 R2. The Sn layer in region 2 R2 contains more tin oxide than the Sn layer in region 1 R1. When the main component of the measuring terminal is tungsten, tungsten is also detected as a component of the Sn layer, but the proportion of tungsten is lower in region 2 R2 and higher in region 1 R1. The composition of the Sn layer can be measured by SEM-EDX (scanning electron microscopy with energy-dispersive X-ray spectrometry). The above-mentioned content is the value obtained when the accelerating voltage is set to 15 kV and the magnification is set to 150x.

[0080] Each of the multiple measuring terminals has its end electrically connected to a corresponding voltage generating unit. In this embodiment, the ends of the first measuring terminal 211 and the second measuring terminal 212 are each electrically connected to the first voltage generating unit 240A. The ends of the first measuring terminal 221 and the second measuring terminal 222 are each electrically connected to the second voltage generating unit 240B. That is, the voltage generating unit is electrically connected to each of the multiple measuring terminal groups. Specifically, the first voltage generating unit 240A is electrically connected to the first measuring terminal group 210. The second voltage generating unit 240B is electrically connected to the second measuring terminal group 220.

[0081] The drive unit 70 causes at least one measuring terminal of each measuring terminal group to protrude from the planar stage 30 toward the electronic component. A through hole in the vertical direction is formed at the position corresponding to the measuring terminal on the planar stage 30.

[0082] In this embodiment, the drive unit 70 moves the first measuring terminal group 210 and the second measuring terminal group 220 together in the vertical direction. However, the drive unit 70 may also be configured to independently drive at least one measuring terminal of the first measuring terminal group 210 and at least one measuring terminal of the second measuring terminal group 220.

[0083] The first measuring terminal 211 and the second measuring terminal 212 protrude from the planar stage 30 via the drive unit 70, thereby abutting against the first external electrode 120. The top ends of the first measuring terminal 211 and the second measuring terminal 212 are located below the upper surface of the planar stage 30 before being driven by the drive unit 70.

[0084] The first measuring terminal 221 and the second measuring terminal 222 protrude from the planar stage 30 via the drive unit 70, thereby abutting against the second external electrode 130. The top ends of the first measuring terminal 221 and the second measuring terminal 222 are located below the upper surface of the planar stage 30 before being driven by the drive unit 70.

[0085] In this embodiment, the drive unit 70 includes a piezoelectric element that mechanically deforms in response to the application of an electric field as a drive source. Figure 9 This is a graph showing the relationship between the driving time and driving speed when a piezoelectric element drives a measuring terminal. Figure 9 In the diagram, the vertical axis represents the driving speed, and the horizontal axis represents the driving time.

[0086] like Figure 9 As shown, when the drive source of the drive unit 70 is a piezoelectric element, there exists a region F where the drive speed is approximately constant. Therefore, by setting the measuring terminal to contact the external electrode in region F, the measuring terminal can collide with the external electrode at a constant speed, thus suppressing the application of load to the electronic components. However, the drive source of the drive unit 70 is not limited to a piezoelectric element; it can also be a solenoid valve. In this case, the drive unit 70 can be constructed more cost-effectively compared to when the drive source is a piezoelectric element.

[0087] Figure 10 This is a schematic diagram illustrating the circuit structure of the characteristic measurement mechanism of the electronic component according to Embodiment 1 of the present invention. (See diagram below.) Figure 10 As shown, the voltage generating unit applies voltage between the measurement terminals in multiple measurement terminal groups. In this embodiment, the first voltage generating unit 240A applies voltage between the first measurement terminal 211 and the second measurement terminal 212 in the first measurement terminal group 210. The second voltage generating unit 240B applies voltage between the first measurement terminal 221 and the second measurement terminal 222 in the second measurement terminal group 220. The voltage applied between the measurement terminals by the voltage generating unit is 20V or more and 10000V or less. The voltage applied between the measurement terminals by the voltage generating unit may also be 20V or more and 50V or less. A discharge phenomenon is generated by applying voltage between the measurement terminals by the voltage generating unit. The application time of the voltage by the voltage generating unit is preferably 1ms or more and 100ms or less.

[0088] The characteristic measurement mechanism 200 of the electronic component in this embodiment also includes a switching unit 250, which alternately switches the measuring unit 230 and the voltage generating unit to electrically connect them to each of the plurality of measuring terminal groups. The switching unit 250 may be provided inside the voltage generating unit or outside the voltage generating unit.

[0089] The switching unit 250 includes: a first switch 251 that alternately switches the measuring unit 230 and the first voltage generating unit 240A to be electrically connected to the first measuring terminal group 210; and a second switch 252 that alternately switches the measuring unit 230 and the second voltage generating unit 240B to be electrically connected to the second measuring terminal group 220.

[0090] When the first switch 251 is connected to the first terminal 253, the first measuring terminal group 210 is electrically connected to the first voltage generating unit 240A. When the first switch 251 is connected to the second terminal 255, the first measuring terminal group 210 is electrically connected to the measuring unit 230.

[0091] When the second switch 252 is connected to the first terminal 254, the second measuring terminal group 220 is electrically connected to the second voltage generating unit 240B. When the second switch 252 is connected to the second terminal 256, the second measuring terminal group 220 is electrically connected to the measuring unit 230.

[0092] As described above, when a voltage is applied to the voltage generating unit, the measuring unit 230 is isolated by the self-closing circuit using the switching unit 250 and is not affected by the applied voltage. Furthermore, since the voltage applied from the voltage generating unit is applied between the measuring terminals in the measuring terminal group and not between the first external electrode 120 and the second external electrode 130, it is possible to suppress the possibility of damage to electronic components or changes in characteristics caused by the voltage.

[0093] The voltage generating unit is equipped with a terminal for receiving and generating signals, which is connected to an internal IC. The electrical signal may be, for example, a signal driving a trigger on a measurement terminal, a signal transmitting the measurement timing of the measurement unit, or a switching signal to the switching unit 250.

[0094] The measuring unit 230 is electrically connected to each other among a plurality of measuring terminal groups, which respectively abut against at least two of a plurality of external electrodes, to measure the characteristics of electronic components. In this embodiment, the measuring unit 230 measures the electrostatic capacitance, insulation resistance, or inductance of the multilayer ceramic capacitor 100.

[0095] The operation of the electronic component characteristic measurement mechanism 200 and the electronic component characteristic measurement method of this embodiment will be described here. Figure 11 This is a flowchart illustrating the operation of the characteristic measurement mechanism of the electronic component according to Embodiment 1 of the present invention.

[0096] First, the voltage generating unit is electrically connected to each of the multiple measurement terminal groups using the switching unit 250. Next, as... Figure 11As shown, in this embodiment, when at least one measuring terminal protrudes from the planar stage 30 toward the electronic component using the drive unit 70, the electronic component characteristic measuring mechanism 200 applies a voltage to the measuring terminals, including the measuring terminal, with each other using the voltage generating unit (process S1).

[0097] In this embodiment, when the first measuring terminal 211 and the second measuring terminal 212 protrude from the planar stage 30 toward the first external electrode 120, a voltage is applied between the first measuring terminal 211 and the second measuring terminal 212 by the first voltage generating unit 240A. If an insulation breakdown occurs between the first measuring terminal 211 and the second measuring terminal 212 and the first external electrode 120, a discharge phenomenon occurs between the outer surface of the first external electrode 120 and the flat surfaces FT of the first measuring terminal 211 and the second measuring terminal 212.

[0098] Similarly, when the first measuring terminal 221 and the second measuring terminal 222 protrude from the planar stage 30 toward the second external electrode 130, a voltage is applied between the first measuring terminal 221 and the second measuring terminal 222 using the second voltage generating unit 240B. If insulation breakdown occurs between the first measuring terminal 221 and the second measuring terminal 222 and the second external electrode 130, a discharge phenomenon occurs between the outer surface of the second external electrode 130 and the flat surfaces FT of the first measuring terminal 221 and the second measuring terminal 222.

[0099] Using the aforementioned discharge phenomenon, foreign matter deposited on the flat surface FT of the measuring terminal can be removed. If the foreign matter is an oxide coating, the oxide coating can be removed or reduced to make it conductive. The first region R1 and the second region R2 of the aforementioned Sn layer are formed through this discharge phenomenon. That is, the Sn layer in the first region R1 is either partially removed of tin oxide or at least partially reduced to tin through the discharge phenomenon.

[0100] Next, the measuring unit 230 is electrically connected to each of the plurality of measuring terminal groups using the switching unit 250 (step S2). In this embodiment, as... Figure 10 As shown, the first measuring terminal 211, which abuts against the first external electrode 120, and the first measuring terminal 221, which abuts against the second external electrode 130, are electrically connected to the measuring unit 230.

[0101] Next, the characteristics of the electronic component are measured using the measuring unit 230 (step S3). That is, after applying voltage using the voltage generating unit, the characteristics of the electronic component are measured using the measuring unit 230. This allows the measuring terminals to be in contact with the external electrodes of the electronic component while removing any foreign matter from the tips of the measuring terminals, thus suppressing measurement defects. After the measurement is completed, the driving unit 70 separates the measuring terminals from the external electrodes.

[0102] Alternatively, if a discharge phenomenon can be generated, the voltage can be applied by the voltage generating unit after the measuring terminal comes into contact with the external electrode. Furthermore, the voltage can also be applied by the voltage generating unit before driving the measuring terminal.

[0103] Discharge can also occur between the measuring terminals when the distance between the voltage-applied measuring terminals is, for example, less than 10 μm. Figure 12 This diagram illustrates a state where a discharge phenomenon occurs between the measuring terminals. This occurs when the measuring terminals to which voltage is applied are close to each other, such as... Figure 12 As shown, when multiple measuring terminals are not protruding from the planar stage 30 toward the electronic component, a voltage generating unit can be used to apply voltage between the measuring terminals, thereby discharging between the measuring terminals.

[0104] Because discharge is easily generated at the tip of the measuring terminal, even in situations such as... Figure 12 Even when a discharge phenomenon occurs between the measurement terminals without the external electrode in between, it is possible to remove foreign matter accumulated on the flat surface FT of the measurement terminals.

[0105] (Experimental Example)

[0106] The characteristics of 1 million multilayer ceramic capacitors were measured with and without a voltage generator, and the incidence of measurement failures was compared.

[0107] The experimental conditions are as follows: The length L dimension of the stacked ceramic capacitor 100 is set to 0.6 mm, the width W dimension is set to 0.3 mm, and the stacking T dimension is set to 0.3 mm. The diameter of the measuring terminal is set to 0.05 mm. The distance between the first and second measuring terminals is set to 20 μm. The voltage applied by the voltage generating unit is set to 30 V. The voltage application time is set to 50 ms.

[0108] Compared to the 0.7% measurement failure rate when the voltage generator was not used, no measurement failures occurred when the voltage generator was used.

[0109] Based on the above experimental results, the following was confirmed: In the manufacturing apparatus for electronic components according to Embodiment 1 of the present invention, production efficiency can be improved.

[0110] (Implementation Method 2)

[0111] The characteristic measurement mechanism of the electronic component according to Embodiment 2 of the present invention will be described below with reference to the accompanying drawings. Since the configuration of the measuring terminals in the characteristic measurement mechanism of the ultrasonic electronic component according to Embodiment 2 of the present invention differs from that in the characteristic measurement mechanism of the electronic component according to Embodiment 1 of the present invention, the same structures as those in the characteristic measurement mechanism of the electronic component according to Embodiment 1 of the present invention will not be described repeatedly.

[0112] Figure 13 This is a schematic cross-sectional view showing the structure of the characteristic measurement mechanism of the ultrasonic electronic component according to Embodiment 2 of the present invention. Figure 13 Chinese use and Figure 5 The same sectional view is illustrated.

[0113] like Figure 13 As shown, in the ultrasonic electronic component characteristic measurement mechanism of Embodiment 2 of the present invention, each of the plurality of measurement terminal groups includes a first measurement terminal and a second measurement terminal, and the second measurement terminal is arranged opposite to the first measurement terminal with an electronic component spaced between it and the first measurement terminal.

[0114] In this embodiment, the first measuring terminal group includes a first measuring terminal 211 and a second measuring terminal 212. The second measuring terminal 212 is disposed opposite to the first measuring terminal 211, with a stacked ceramic capacitor 100 spaced between it and the first measuring terminal 211. The first measuring terminal 211 is fixed to the cover 50.

[0115] The second measurement terminal group includes a first measurement terminal 221 and a second measurement terminal 222. The second measurement terminal 222 is disposed opposite to the first measurement terminal 221, with a stacked ceramic capacitor 100 spaced apart from the first measurement terminal 221. The first measurement terminal 221 is fixed to the cover 50.

[0116] The drive unit 70 causes either the first or second measuring terminal to protrude from the planar stage 30 toward the electronic component. In this embodiment, the drive unit 70 causes the second measuring terminal 212 to protrude toward the first external electrode 120. The drive unit 70 causes the second measuring terminal 222 to protrude toward the second external electrode 130.

[0117] The first measuring terminal 211 has a flat surface FT opposite the upper surface of the first external electrode 120. The second measuring terminal 212 has a flat surface FT opposite the lower surface of the first external electrode 120. The first measuring terminal 221 has a flat surface FT opposite the upper surface of the second external electrode 130. The second measuring terminal 222 has a flat surface FT opposite the lower surface of the second external electrode 130.

[0118] The second measuring terminal 212 protrudes from the planar stage 30 via the drive unit 70, thereby abutting against the first external electrode 120. The first external electrode 120 is further pushed upward by the second measuring terminal 212, thereby abutting against the first external electrode 120.

[0119] The second measuring terminal 222 protrudes from the planar stage 30 via the drive unit 70, thereby abutting against the second external electrode 130. The second external electrode 130 is further pushed upward by the second measuring terminal 222, thereby abutting against the second external electrode 130 by the first measuring terminal 221.

[0120] In this embodiment, when the second measuring terminal 212 protrudes from the planar stage 30 toward the first external electrode 120, a voltage is applied between the first measuring terminal 211 and the second measuring terminal 212 using the first voltage generating unit 240A. If an insulation breakdown occurs between the first measuring terminal 211 and the first external electrode 120, a discharge phenomenon occurs between the outer surface of the first external electrode 120 and the flat surface FT of the first measuring terminal 211.

[0121] Similarly, when the second measuring terminal 222 protrudes from the planar stage 30 toward the second external electrode 130, a voltage is applied between the first measuring terminal 221 and the second measuring terminal 222 using the second voltage generating unit 240B. If an insulation breakdown occurs between the first measuring terminal 221 and the second external electrode 130, a discharge phenomenon occurs between the outer surface of the second external electrode 130 and the flat surface FT of the first measuring terminal 221.

[0122] Using the discharge phenomenon described above, foreign matter accumulated on the flat surface FT of the measuring terminal can be removed. Next, the first measuring terminal 211, which abuts against the first external electrode 120, and the first measuring terminal 221, which abuts against the second external electrode 130, are electrically connected to the measuring unit 230, and the characteristics of the electronic components are measured using the measuring unit 230.

[0123] In this embodiment, since the first measuring terminal 211 and the first measuring terminal 221 are disposed on the cover 50 side, and the second measuring terminal 212 and the second measuring terminal 222 are disposed on the planar stage 30 side, the arrangement density of multiple measuring terminals can be reduced, and the measuring terminals can be made thicker, thereby improving the strength and wear resistance of the measuring terminals.

[0124] (Postscript)

[0125] Those skilled in the art will understand that the above exemplary embodiments are specific examples of the following solutions.

[0126] <1>

[0127] A characteristic measurement mechanism for an electronic component, wherein,

[0128] This characteristic measurement mechanism has the following features:

[0129] Multiple measurement terminal groups, each having multiple measurement terminals, are capable of contacting multiple external electrodes of the electronic components.

[0130] A measuring unit, electrically connected between the measuring terminal groups of the plurality of measuring terminal groups, which respectively abut against at least two of the plurality of external electrodes, measures the characteristics of the electronic component; and

[0131] The voltage generating unit is electrically connected to each of the plurality of measuring terminal groups.

[0132] Each of the plurality of measuring terminals has a flat surface at its tip that faces the outer surface of the external electrode that abuts against one of the plurality of external electrodes.

[0133] In each of the plurality of measurement terminal groups, the voltage generating unit applies a voltage to the measurement terminals to discharge them.

[0134] <2>

[0135] According to the characteristic measurement mechanism of the electronic component described in <1>, wherein,

[0136] The characteristic measuring mechanism also includes a switching unit that alternately switches the measuring unit and the voltage generating unit to electrically connect to each of the plurality of measuring terminal groups.

[0137] <3>

[0138] According to the characteristic measurement mechanism of the electronic component described in <1> or <2>, wherein,

[0139] Each of the multiple measurement terminal groups consists of a pair of measurement terminals.

[0140] <4>

[0141] The characteristic measuring mechanism of the electronic component according to any one of <1> to <3>, wherein,

[0142] The voltage applied between the measuring terminals is above 20V and below 10000V.

[0143] <5>

[0144] An apparatus for manufacturing electronic components, wherein,

[0145] The manufacturing apparatus includes:

[0146] The characteristic measurement mechanism of the electronic component as described in any one of <1> to <4>;

[0147] A conveying mechanism having a planar stage on which the electronic components are conveyed; and

[0148] A packaging mechanism that packages the electronic components after their characteristics have been measured using the measuring unit.

[0149] The characteristic measurement mechanism of the electronic component also includes a drive unit that causes at least one measurement terminal of each of the plurality of measurement terminal groups to protrude from the planar stage toward the electronic component.

[0150] <6>

[0151] According to the manufacturing apparatus for electronic components described in <5>, wherein,

[0152] The plurality of measurement terminal groups include a first measurement terminal and a second measurement terminal, wherein the second measurement terminal is configured opposite to the first measurement terminal, spaced apart from the first measurement terminal by the electronic component.

[0153] The drive unit causes the first measuring terminal or the second measuring terminal to protrude from the planar stage toward the electronic component.

[0154] <7>

[0155] The manufacturing apparatus for electronic components according to <5> or <6>, wherein,

[0156] The drive unit includes a solenoid valve.

[0157] <8>

[0158] The manufacturing apparatus for electronic components according to <5> or <6>, wherein,

[0159] The drive unit includes a piezoelectric element.

[0160] <9>

[0161] The manufacturing apparatus for an electronic component according to any one of <5> to <8>, wherein,

[0162] After a voltage is applied using the voltage generating unit, the characteristics of the electronic component are measured using the measuring unit.

[0163] <10>

[0164] According to the manufacturing apparatus for electronic components described in <9>, wherein,

[0165] When the at least one measuring terminal protrudes toward the electronic component using the driving unit, the voltage generating unit applies a voltage to the measuring terminals, including the measuring terminal, and discharges between the outer surface of the external electrode and the flat surface of the measuring terminal.

[0166] <11>

[0167] According to the manufacturing apparatus for electronic components described in <9>, wherein,

[0168] When the plurality of measuring terminals do not protrude from the planar stage toward the electronic component, the voltage generating unit applies a voltage to the measuring terminals and discharges them between each other.

[0169] <12>

[0170] A method for measuring the characteristics of an electronic component, wherein,

[0171] Preparation for this characteristic measurement method:

[0172] Multiple measurement terminal groups, each having multiple measurement terminals, are capable of contacting multiple external electrodes of the electronic components.

[0173] A measuring unit, electrically connected between the measuring terminal groups of the plurality of measuring terminal groups, which respectively abut against at least two of the plurality of external electrodes, measures the characteristics of the electronic component; and

[0174] The voltage generating unit is electrically connected to each of the plurality of measuring terminal groups.

[0175] Each of the plurality of measuring terminals has a flat surface at its tip that faces the outer surface of the external electrode that abuts against one of the plurality of external electrodes.

[0176] In each of the plurality of measurement terminal groups, the voltage generating unit applies a voltage to the measurement terminals to discharge them.

[0177] In the above description of the embodiments, the combinable structures can also be combined with each other.

[0178] It should be considered that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the invention is defined not by the foregoing description but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. An electronic component characteristic measuring mechanism, wherein the characteristic measuring mechanism comprises: a plurality of measurement terminal groups each having a plurality of measurement terminals capable of abutting against a plurality of external electrodes provided in an electronic component, respectively; a measurement unit electrically connected to the measurement terminal groups each of which abuts against at least two external electrodes among the plurality of external electrodes, respectively, and measuring a characteristic of the electronic component; a voltage generating unit electrically connected to each of the plurality of measurement terminal groups, the plurality of measurement terminals each have a flat surface facing an external surface of the abutting external electrode among the plurality of external electrodes, in each of the plurality of measurement terminal groups, a voltage is applied to the measurement terminals by the voltage generating unit to discharge the measurement terminals.

2. The electronic component characteristic measuring mechanism according to claim 1, wherein the characteristic measuring mechanism further comprises a switching unit that alternately switches the measurement unit and the voltage generating unit to be electrically connected to each of the plurality of measurement terminal groups.

3. The electronic component characteristic measuring mechanism according to claim 1 or 2, wherein the plurality of measurement terminal groups each consist of a pair of measurement terminals.

4. The electronic component characteristic measuring mechanism according to any one of claims 1 to 3, wherein the voltage applied to the measurement terminals is 20 V or more and 10,000 V or less.

5. An electronic component manufacturing apparatus, wherein the apparatus comprises: the electronic component characteristic measuring mechanism according to any one of claims 1 to 4; a conveyance mechanism having a planar stage on which the electronic component is conveyed; and a packaging mechanism that packages the electronic component whose characteristic is measured by the measurement unit, the electronic component characteristic measuring mechanism further comprises a driving unit that causes at least one measurement terminal of each of the plurality of measurement terminal groups to protrude toward the electronic component from the planar stage.

6. The electronic component manufacturing apparatus according to claim 5, wherein the plurality of measurement terminal groups include a first measurement terminal and a second measurement terminal disposed opposite to the first measurement terminal with the electronic component interposed therebetween, the driving unit causes the first measurement terminal or the second measurement terminal to protrude toward the electronic component from the planar stage.

7. The electronic component manufacturing apparatus according to claim 5 or 6, wherein the driving unit includes a solenoid valve.

8. The electronic component manufacturing apparatus according to claim 5 or 6, wherein the driving unit includes a piezoelectric element.

9. The electronic component manufacturing apparatus according to any one of claims 5 to 8, wherein after the voltage is applied by the voltage generating unit, the characteristic of the electronic component is measured by the measurement unit.

10. The electronic component manufacturing apparatus according to claim 9, wherein ​ When the at least one measurement terminal is protruded toward the electronic component by the driving section, the voltage generating section applies a voltage between the measurement terminals including the measurement terminal to each other, thereby discharging between the outer surface of the external electrode and the flat surface of the measurement terminal.

11. The apparatus for manufacturing an electronic component according to claim 9, wherein When the plurality of measurement terminals are not protruded toward the electronic component from the flat stage, the voltage generating section applies a voltage between the measurement terminals, thereby discharging between the measurement terminals.

12. A method for measuring a characteristic of an electronic component, wherein The method for measuring a characteristic prepares: a plurality of measurement terminal groups each having a plurality of measurement terminals capable of being brought into contact with a plurality of external electrodes of an electronic component, respectively; a measurement section electrically connected between the measurement terminal groups each of which is brought into contact with at least two external electrodes of the plurality of external electrodes, respectively, to measure a characteristic of the electronic component; and a voltage generating section electrically connected to each of the plurality of measurement terminal groups, the tip of each of the plurality of measurement terminals has a flat surface facing the outer surface of the external electrode with which the measurement terminal is brought into contact, and in each of the plurality of measurement terminal groups, the voltage generating section applies a voltage between the measurement terminals to discharge between the measurement terminals. ​

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