Device for rapid clamping test and heat dissipation of module

Abstract

The invention discloses a device for rapid clamping test and heat dissipation of a module. The device comprises a base, and a limiting mechanism, a clamping mechanism, a heat dissipation assembly and a signal acquisition and output assembly which are mounted on the base, the limiting mechanism is used for limiting the module which is placed on the base and is to be subjected to clamping test and heat dissipation so as to realize positioning; the clamping mechanism is used for clamping the module so as to enable the signal acquisition and output assembly to be in contact with the module; the signal acquisition and output assembly is used for acquiring a test signal of the module and outputting the test signal to an external terminal; and the heat dissipation assembly is used for monitoring the temperature of the module and realizing heat dissipation of the module at the same time. The device is an integrated device, is small and convenient, is convenient to carry by an operator, can adapt to the testing functions of different modules, and reduces the operation steps of the operator. The heat dissipation channel in the device is an up-and-down heat dissipation channel, so that up-and-down simultaneous heat dissipation of the module can be realized, and the effect is better. The device is simple and compact in structure, the signal acquisition and output assembly is composed of probes, later replacement and maintenance are facilitated, and the problem of poor signals is avoided.

Description

Technical Field

[0001] This invention belongs to the technical field of module testing devices, and in particular, it is a device for quickly clamping, testing, and dissipating heat from modules. Background Technology

[0002] With the continuous development of technology, modules are playing an increasingly important role in various electronic devices. When testing modules, the key to ensuring testing efficiency and accuracy lies in how to quickly and stably clamp the modules and effectively dissipate heat.

[0003] Existing testing devices suffer from slow clamping speed and poor heat dissipation, which affect the smooth progress of testing. Therefore, it is necessary to design a modular fast clamping and heat dissipation device. Summary of the Invention

[0004] The purpose of this invention is to address the deficiencies or shortcomings of the existing technology by providing a device for rapid clamping, testing, and heat dissipation of modules.

[0005] The technical solution to achieve the purpose of this invention is: a device for quick clamping, testing and heat dissipation of a module, the device including a base and a limiting mechanism, a clamping mechanism, a heat dissipation component and a signal acquisition and output component mounted on the base;

[0006] The limiting mechanism is used to limit the positioning of the module placed on the base for clamping and heat dissipation testing.

[0007] The clamping mechanism is used to clamp the module so that the signal acquisition and output component comes into contact with the module;

[0008] The signal acquisition and output component is used to acquire the test signals of the module and output them to an external terminal;

[0009] The heat dissipation component is used to monitor the temperature of the module and simultaneously dissipate heat from the module.

[0010] Furthermore, the limiting mechanism includes multiple limiting structural units located on the pinless side of the module, which cooperate with each other to limit the module.

[0011] Furthermore, each of the limiting structure units includes at least: a first slide rail extending along a first direction, a first slider movable along the length direction of the first slide rail, a second slide rail movable along a second direction and disposed on the first slider, and a pressing block mechanism fixed to the end of the second slide rail. The first slide rail is fixedly mounted on the base. The first direction is perpendicular to the second direction and parallel to the extension directions of the adjacent two sides of the module. According to the module size, for each limiting structure unit, the first slider is driven to slide along the first slide rail and drive the second slide rail to move, and then the second slide rail is driven to slide along the second direction so that the pressing block mechanism contacts the module.

[0012] Furthermore, the clamping mechanism includes several clamping structure units located on the side of the module with pins, and these multiple clamping structure units cooperate with each other to drive the signal acquisition and output component to contact the module.

[0013] Furthermore, each of the clamping structure units includes at least a clamping arm and a driving component. The signal acquisition and output component is mounted on the clamping arm, and the driving component is used to drive the clamping arm to perform linear reciprocating motion to move closer to or further away from the module, thereby realizing the connection or disconnection between the signal acquisition and output component and the module pins.

[0014] Furthermore, the limiting mechanism is also used to mechanically limit the movement of the clamping arm.

[0015] Furthermore, the signal acquisition and output component includes at least a plurality of pressure pins connected to the module pins, each pressure pin being mounted on the clamping arm via a buffer device.

[0016] Furthermore, the heat dissipation assembly includes an upper heat dissipation assembly and a lower heat dissipation assembly located on the upper and lower sides of the module, respectively.

[0017] Furthermore, the device has at least a pressed state, and the upper heat dissipation component is rotatably connected to the base along a first rotation center line; when the device is in the pressed state, the lower surface of the upper heat dissipation component is parallel to the upper surface of the base, and the upper heat dissipation component is located directly above the module.

[0018] Furthermore, the device has at least a locked state, in which the upper heat dissipation component is locked to the base by the locking device to achieve the locked state, based on the pressed state.

[0019] Compared with the prior art, the significant advantages of this invention are:

[0020] (1) The device is an integrated device, which is small and convenient, easy for operators to carry, and can adapt to the testing functions of different modules, reducing the number of personnel operation steps.

[0021] (2) The heat dissipation channel is a top and bottom heat dissipation channel, which can dissipate heat from the top and bottom of the module at the same time, resulting in better performance.

[0022] (3) The device has a simple and compact structure, and the signal acquisition and output components are composed of probes, which facilitates later replacement and maintenance and avoids signal problems.

[0023] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0024] Figure 1 This is an isometric view of the heat dissipation device structure for quick clamping test of a module in one embodiment.

[0025] Figure 2 A side view of the module quick clamping test heat dissipation device in one embodiment, excluding the upper heat dissipation channel and the base structure.

[0026] Figure 3 This is a schematic diagram of the limiting mechanism of the module quick clamping test heat dissipation device in one embodiment.

[0027] Figure 4 This is a cross-sectional view of the module quick clamping test heat dissipation device connection mechanism in one embodiment. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0029] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0031] In one embodiment, combined Figure 1 A device is provided for quick clamping, testing, and heat dissipation of a module. The device includes a base 1 and a limiting mechanism, a clamping mechanism, a heat dissipation component, and a signal acquisition and output component mounted on the base 1.

[0032] The limiting mechanism is used to limit the positioning of the module placed on the base 1 for clamping test and heat dissipation.

[0033] The clamping mechanism is used to clamp the module so that the signal acquisition and output component comes into contact with the module;

[0034] The signal acquisition and output component is used to acquire the test signals of the module and output them to an external terminal;

[0035] The heat dissipation component is used to monitor the temperature of the module and simultaneously dissipate heat from the module.

[0036] Furthermore, in one embodiment, the limiting mechanism includes a plurality of limiting structural units located on the pinless side of the module, which cooperate with each other to limit the module.

[0037] Furthermore, in one embodiment, each of the limiting structure units includes at least: a first slide rail 2 extending along a first direction, a first slider 3 movable along the length direction of the first slide rail 2, a second slide rail 5 slidable along a second direction and disposed on the first slider 3, and a pressing block mechanism 8 fixed to the end of the second slide rail 5. The first slide rail 2 is fixedly mounted on the base 1. The first direction is perpendicular to the second direction and parallel to the extension directions of the adjacent two sides of the module. According to the module size, for each limiting structure unit, the first slider 3 is driven to slide along the first slide rail 2 and drive the second slide rail 5 to move. Then, the second slide rail 5 is driven to slide along the second direction so that the pressing block mechanism 8 contacts the module, thereby limiting and fixing the module, realizing tool-free quick installation and limiting, and preventing the module from shaking.

[0038] Preferably, in some embodiments, the limiting structure unit is used to limit the corners of the module.

[0039] More preferably, in some embodiments, the pressing mechanism 8 includes a first plate 23 and a second plate 24 that are fixedly connected and form an L-shaped structure, which can fit against the top corner of the module.

[0040] More preferably, in some embodiments, the pressing mechanism 8 is provided in at least two sets, located on the two pinless sides of the module respectively, and is centrally symmetrically distributed with respect to the module.

[0041] Here, the first slider 3 and the second slide rail 5 are driven by means of, but not limited to, gear drive, external electric drive, etc.

[0042] It should be noted that any component that can perform the function corresponding to the limit structure unit is acceptable, and no special restrictions are imposed here.

[0043] Furthermore, in one embodiment, the clamping mechanism includes a plurality of clamping structure units located on the side of the module with pins, the plurality of clamping structure units cooperating with each other to drive the signal acquisition and output component to contact the module.

[0044] Furthermore, in one embodiment, each clamping structure unit includes at least a clamping arm 16 and a driving component. The signal acquisition and output component is mounted on the clamping arm 16, and the driving component is used to drive the clamping arm 16 to perform linear reciprocating motion, thereby moving closer to or further away from the module, and thus enabling the signal acquisition and output component to connect or disconnect from the module pins.

[0045] Preferably, in some embodiments, the drive assembly includes at least a ball screw mechanism 19, and the clamping arm 16 is mounted on the ball screw mechanism 19, which drives the clamping arm 16 to perform linear reciprocating motion under the drive of an external input control signal.

[0046] Preferably, in some embodiments, the drive assembly further includes a slide rail assembly, which includes a third slide rail 7 or 10 and a second slider mounted on the third slide rail. In this case, the clamping arm is fixedly mounted on the second slider, and the ball screw mechanism 19 drives the clamping arm 16 to perform linear reciprocating motion along the third slide rail under the drive of an external input control signal.

[0047] Furthermore, in some embodiments, the second slider can be replaced by a roller 22, in which case the clamping arm is mounted on a ball screw mechanism; the roller 22 is driven by an external driving force to slide along the third slide rail until it presses against the driving inclined surface 11 on the clamping arm. By the pressure of the roller 22 on the driving inclined surface 11, the clamping arm is driven to achieve linear reciprocating motion by relying on the ball screw mechanism 19.

[0048] Here, the drive ramp 11 can be formed by an arc-shaped seat mounted on the clamping arm 16, or it can be formed by integrally machining a ramp with the clamping arm.

[0049] It should be noted that the above-mentioned structures are not limited to any one of them. Any component that can achieve the corresponding function of the driver component is acceptable, and no special restrictions are imposed here.

[0050] Furthermore, in one embodiment, the limiting mechanism is also used to mechanically limit the movement of the clamping arm 16.

[0051] Here, the movement of the clamping arm 16 is mechanically limited to prevent the continuous movement of the clamping arm from causing squeezing damage to the module.

[0052] Preferably, in some embodiments, the limiting mechanism further includes at least one limiting block 17 disposed between the clamping arm and the module. The limiting block is positioned near a critical value that prevents the movement of the clamping arm from causing crush damage to the module. Here, the limiting block is not limited to any specific component that can achieve the corresponding function.

[0053] Furthermore, in some embodiments, the limiting mechanism further includes: at least one pressure monitoring device for real-time monitoring of the pressure between the clamping arm and the module, and controlling the clamping arm to stop moving when the pressure exceeds a preset critical value.

[0054] Preferably, the clamping arm 16 has a plunger 6 on its end face near the module. When the clamping arm 16 approaches the module, the plunger 6 contacts the module first. The pressure monitoring device is used to monitor the pressure borne by the plunger 6 in real time. When the pressure exceeds a preset critical value, the clamping arm is controlled to stop moving.

[0055] Here, the pressure monitoring device employs, but is not limited to, at least one pressure sensor.

[0056] Here, the plunger 6 is made of materials such as resin, but not limited to, to avoid scratching the module surface.

[0057] Furthermore, in some embodiments, the limiting mechanism further includes: at least one distance monitoring device for real-time monitoring of the distance between the clamping arm and the module, and when the distance reaches a preset threshold, controlling the clamping arm to stop moving and causing the plunger 6 to press against the side of the module.

[0058] It should be noted that the above-mentioned structures are not limited to any one of them. Any component that can achieve the corresponding function of the limit mechanism is acceptable, and no special restrictions are imposed here.

[0059] Furthermore, in one embodiment, the signal acquisition and output component includes at least a plurality of pressure pins 12 connected to the module pins, each pressure pin 12 being mounted on the clamping arm 16 via a buffer device.

[0060] Here, by setting a buffer device, the pressure pin 12 will not be subjected to hard compression when it contacts the module pin, which would cause damage to the pressure pin 12 or the module pin.

[0061] Preferably, in some embodiments, the buffer device includes at least: a cylindrical connecting rod 13 with one open end fixedly mounted on the clamping arm 16, the pressure pin 12 being connected to an elastic device mounted inside the connecting rod 13 and extending out of the opening of the connecting rod 13; the axial direction of the connecting rod 13 is perpendicular to the surface of the module with pins, and the elastic device can generate a force along the axial direction of the connecting rod 13, so that the pressure pin 12 and the module pins are positively aligned.

[0062] Here, the elastic device is, but is not limited to, a compression spring 20, one end of which abuts against the bottom of the inner side of the connecting rod 13, and the other end abuts against the pressure needle 12.

[0063] Furthermore, in some embodiments, the buffer device further includes at least an adjusting device for adjusting the elastic device to move axially along the connecting rod 13 to change the position of the pressure pin 12. This approach enables the device of the present invention to achieve a reliable connection between the pressure pin 12 and the module pins, while also allowing the device to adapt to different pressure pin types or module types.

[0064] Here, the adjustment device is, but is not limited to, an adjustment block 25 that is slidably mounted on the bottom of the inner side of the connecting rod 13.

[0065] Furthermore, the position of the adjusting block can be adjusted by a protrusion mounted on the adjusting block and extending out of the side of the connecting rod 13, the protrusion being able to slide along the axial direction of the connecting rod 13; alternatively, the adjusting block 25 can be moved by an external driving device to adjust its position, the driving end of the external driving device being inserted into the connecting rod 13 and connected to the adjusting block 25.

[0066] Here, the routing of the connecting wire between the pressure pin and the external components should be designed so as not to interfere with the movement of other components, thus avoiding interference with module performance testing. For example, preferably, in some embodiments, the connecting rod 13 is designed so that the pressure pin passes through the entire clamping arm.

[0067] It should be noted that the above-mentioned structures are not limited to any one of them. Any component that can realize the corresponding functions of signal acquisition and output components and buffer devices is acceptable, and no special restrictions are imposed here.

[0068] Furthermore, in one embodiment, the heat dissipation assembly includes an upper heat dissipation assembly and a lower heat dissipation assembly located on the upper and lower sides of the module, respectively, to achieve simultaneous heat dissipation on the upper and lower surfaces of the module.

[0069] Preferably, in some embodiments, the upper heat dissipation component includes, but is not limited to, the first heat dissipation tooth 9, and the lower heat dissipation component includes, but is not limited to, the second heat dissipation tooth 18.

[0070] Preferably, in some embodiments, the lower heat dissipation component is mounted on the base 1 and is located directly below the module.

[0071] Preferably, in some embodiments, the lower heat dissipation component also includes, but is not limited to, air-cooled heat dissipation components such as fan system 21.

[0072] Here, the fan assembly can be mounted on the base 1 to work with the second heat dissipation fins, or it can be mounted in the second heat dissipation fins to form an integral structure. No special limitations are imposed here.

[0073] Preferably, in some embodiments, the heat dissipation assembly further includes a temperature monitoring device for real-time monitoring of the module's temperature. Here, the temperature monitoring device employs, but is not limited to, at least one temperature sensor 14.

[0074] Preferably, in some embodiments, the temperature monitoring device is detachably mounted on the upper heat dissipation assembly. Preferably, for the first heat dissipation tooth, the temperature monitoring device is mounted in the middle groove of the first heat dissipation tooth 9.

[0075] Preferably, in some embodiments, thermally conductive materials such as thermal grease are applied to the base 1 to achieve heat dissipation in conjunction with heat dissipation components.

[0076] It should be noted that the above-mentioned structures are not limited to any one of them. Any component that can achieve the corresponding function of heat dissipation components is acceptable, and no special restrictions are imposed here.

[0077] Furthermore, in one embodiment, the device has at least a pressed state, with the upper heat dissipation component rotatably connected to the base 1 along a first rotation center line; when the device is in the pressed state, the lower surface of the upper heat dissipation component is parallel to the upper surface of the base 1, and the upper heat dissipation component is located directly above the module. Conversely, the upper heat dissipation component rotates around the first rotation center line to move away from the upper surface of the base 1, i.e., it is in an open state.

[0078] Preferably, in some embodiments, the upper heat dissipation assembly is rotatably connected to the base 1 by, but not limited to, a torsion spring.

[0079] Preferably, in some embodiments, when the device is in a compressed state, the upper heat dissipation component contacts and clamps against the upper surface of the module. Further, in some embodiments, the protruding portion of the first heat dissipation tooth 9 contacts and clamps against the upper surface of the module.

[0080] Preferably, in some embodiments, when the second slider can be replaced by the roller 22, the third slide rail is mounted on the upper heat dissipation assembly. When the upper heat dissipation assembly changes from an open state to a closed state, the roller 22 gradually presses against the drive inclined surface 11 on the clamping arm.

[0081] It should be noted that the above-mentioned structures are not limited to any one of them; any component that can achieve the clamping function is acceptable, and no special restrictions are imposed here.

[0082] Furthermore, in one embodiment, the device has at least a locked state, in which the upper heat dissipation component is locked to the base 1 by a locking device to achieve the locked state, based on the pressed state.

[0083] Preferably, in some embodiments, one side of the upper heat dissipation component is rotatably connected to the base 1 along a first rotation center line, and the other side is locked to the base 1 by the locking device.

[0084] Preferably, in some embodiments, the locking device includes, but is not limited to, a protrusion fixedly connected to the base 1, and a buckle 4 fixedly connected to the upper heat dissipation assembly in cooperation with the protrusion.

[0085] Here, the latch includes a locking part that engages with a protrusion on the base 1. The latch also includes a pressing part for locking or unlocking the locking device from the base 1.

[0086] It should be noted that the above-mentioned structures are not limited to any one of them; any component that can achieve the locking function is acceptable, and no special restrictions are imposed here.

[0087] The following describes, in conjunction with the above embodiments, an exemplary installation and use process of the device of the present invention.

[0088] Step 1: Apply thermal grease to base 1, then place the module on the base. The base is fixed to the limiting mechanism with screws. The two sets of pressing mechanisms 8 are centrally symmetrical in the vertical direction. According to the module size, the slide rail in the limiting mechanism moves, and the mutually perpendicular pressing mechanisms 8 limit and fix the module, realizing tool-free quick installation and limiting, and preventing the module from shaking.

[0089] Step 2: Drill threaded holes in the clamping arm 16 and install the plunger 6. Install a connecting rod 13 on the clamping arm 16 for installing the pressure needle that passes through the entire clamping arm. Install an arc-shaped seat on the clamping arm 16, or it can be integrally machined into a slope as a driving slope 11 for contacting the roller 22, and the roller 22 drives the clamping arm 16 to move.

[0090] Step 3: The clamping arm 16 moves by relying on the ball screw mechanism 19 installed on the left and right sides to achieve linear displacement movement with high precision. When the pulley assembly (composed of roller 22 and third slide rail) applies pressure to the clamping arm 16, the ball screw mechanism 19 drives the clamping arm 16 to start moving in the normal direction of the module to achieve clamping action.

[0091] Step 4: The upper heat dissipation channel mainly uses custom-made heat dissipation fins. One side of the heat dissipation fins is rotatably connected to the base, and the opening and closing action of the heat dissipation fins is achieved by the rotation of the torsion spring 15. The other side is equipped with a buckle 4, which locks into the base when closed. An opening is made in the middle of the first heat dissipation fin 9 for installing a temperature sensor 14. The pressure pin 12 is in direct contact with the module for testing the real-time temperature of the module.

[0092] Step 5: The lower heat dissipation channel is an air-cooled heat dissipation system, which is mainly installed under the module and connected and fixed to the base. The fan system 21 is fixed to the second heat dissipation tooth 18 with screws. Then, the second lower heat dissipation tooth 18 is quickly installed on the base 1 through the positioning pin, so as to achieve heat dissipation on the upper and lower surfaces of the module at the same time.

[0093] Step 6: When the distance sensor on the clamping arm 16 senses a certain distance from the side of the module, the plunger 6 on the clamping arm 16 presses against the side of the module to complete the clamping action, and a part of the first heat dissipation tooth 9 protrudes and contacts the upper surface of the module to clamp it, thus ensuring the overall reliability.

[0094] Step 7: After the upper heat dissipation channel is closed, the side buckle 4 is fastened and fixed to the base 1. The temperature sensor 14 probe in the middle of the heat dissipation channel contacts the upper surface of the module to monitor the temperature of the module in a timely manner.

[0095] Step 8: After the module is clamped, the pressure pin 12 on the clamping arm directly contacts the module's pins and collects signals. The probe and connecting wire pass out from between the sliding assembly and the base 1 to avoid interference with the pulley assembly and perform module testing. The other side of the probe is connected to the external test wire for easy connection and testing by the operator.

[0096] It should be noted that for components without special structural limitations, any component that can achieve the corresponding function in the existing technology is acceptable.

[0097] It should also be noted that the above-mentioned settings, installations, connections, and fixations can be made using, but are not limited to, bolts, threads, etc. Any existing fixed or movable connection scheme can be adapted, as long as the corresponding function can be achieved.

[0098] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention without departing from its spirit and scope should be included within the protection scope of the present invention.

Claims

1. A device for rapid clamping and testing of modules and for heat dissipation, characterized in that The device comprises a base, a limiting mechanism, a clamping mechanism, a heat dissipation assembly and a signal acquisition and output assembly mounted on the base; The limiting mechanism is used for limiting and positioning the module placed on the base to be clamped, tested and cooled; The clamping mechanism is used for clamping the module to make the signal acquisition and output assembly contact the module; The signal acquisition and output assembly is used for acquiring the test signal of the module and outputting to an external terminal; The heat dissipation assembly is used for monitoring the temperature of the module and cooling the module.

2. The device of quick clamping test and heat dissipation of module according to claim 1, characterized in that, The limiting mechanism comprises a plurality of limiting structure units on the side of the module without pins, which cooperate to limit the module.

3. The device of quick clamping test and heat dissipation of module according to claim 2, characterized in that, Each limiting structure unit comprises at least a first sliding rail extending in a first direction, a first sliding block capable of moving along the length direction of the first sliding rail, a second sliding rail capable of sliding in a second direction and arranged on the first sliding block, and a pressing block mechanism fixed at the end of the second sliding rail, wherein the first sliding rail is fixedly installed on the base; the first direction is perpendicular to the second direction and parallel to the extension direction of the two adjacent sides of the module; according to the size of the module, the first sliding block is driven to slide along the first sliding rail and drive the second sliding rail to move, and then the second sliding rail is driven to slide in the second direction so that the pressing block mechanism contacts the module.

4. The device of quick clamping test and heat dissipation of module according to claim 1, characterized in that, The clamping mechanism comprises a plurality of clamping structure units on the side of the module with pins, which cooperate to drive the signal acquisition and output assembly to contact the module.

5. The device of quick clamping test and heat dissipation of module according to claim 4, characterized in that, Each clamping structure unit comprises at least a clamping arm and a driving assembly, wherein the signal acquisition and output assembly is installed on the clamping arm, and the driving assembly is used to drive the clamping arm to perform linear reciprocating motion to approach or move away from the module, thereby realizing the communication or disconnection of the signal acquisition and output assembly and the module pins.

6. The device of quick clamping test and heat dissipation of module according to claim 5, characterized in that, The limiting mechanism is also used for mechanically limiting the movement of the clamping arm.

7. The device of quick clamping test and heat dissipation of module according to claim 5, characterized in that, The signal acquisition and output assembly comprises at least a plurality of pressing needles corresponding to the module pins, each of which is installed on the clamping arm through a buffer device.

8. The device of quick clamping test and heat dissipation of module according to claim 1, characterized in that, The heat dissipation assembly comprises an upper heat dissipation assembly and a lower heat dissipation assembly arranged on the upper and lower sides of the module respectively.

9. The device of quick clamping test and heat dissipation of module according to claim 8, characterized in that, The device has at least a compression state, and the upper heat dissipation assembly is rotationally connected to the base along a first rotation center line; when the device is in the compression state, the lower surface of the upper heat dissipation assembly is parallel to the upper surface of the base, and the upper heat dissipation assembly is located directly above the module.

10. The device of quick clamping test and heat dissipation of module according to claim 9, characterized in that, The device has at least a locking state, and on the basis of the compression state, the upper heat dissipation assembly is locked with the base by a locking device to achieve the locking state.

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