Method and system for modified backing

Abstract

Various methods and systems are provided for a probe for a medical device. In one example, the probe includes an additive manufactured backing having a porous matrix and one or more thermal management structures. The porous matrix may attenuate acoustic energy, and the one or more thermal management structures may enable heat transfer from a front portion of the probe to a rear portion of the probe.

Description

[0001] Cross-references to related applications

[0002] This application is a continuation-in-part of U.S. Patent Application Serial No. 18 / 309,344, entitled “METHODS AND SYSTEMS FOR AMODIFIED BACKING”, filed April 28, 2023, which is incorporated herein by reference. Technical Field

[0003] The implementation schemes of the subject matter disclosed herein relate to transducer probes for use in medical devices. Background Technology

[0004] Transducer probes are used in a variety of applications to convert energy from a physical form to an electrical form. For example, a transducer probe may include a piezoelectric material that vibrates at a resonant frequency when mechanical stress or strain is applied. An acoustic signal can be generated by the vibrating piezoelectric material and transmitted from the front end of the transducer probe. To absorb and attenuate acoustic energy scattered in directions away from the front end of the transducer probe (such as towards the rear end), a backing may be included in the acoustic stack of the transducer probe. The backing may be arranged behind the piezoelectric material relative to the signal propagation direction and may be formed of a material that suppresses scattered acoustic energy, thereby reducing acoustic reverberation and mitigating interference with signal reception at the transducer probe. Summary of the Invention

[0005] In one embodiment, a probe includes an additively manufactured backing having a porous matrix and one or more thermal management structures. The porous matrix attenuates acoustic energy, and the one or more thermal management structures allow heat to be transferred from the front of the probe to the rear. Therefore, the backing can be easily optimized for specific probe types and applications, reducing manufacturing costs and complexity.

[0006] In one embodiment, a probe is provided. The probe includes an additively manufactured backing having: a porous matrix at least partially filled with at least one filler, and one or more thermal management structures. The additively manufactured backing is configured to attenuate acoustic energy and allow heat to be transferred from the front of the probe to the rear of the probe. At least a portion of the additively manufactured backing is additively manufactured using a variety of different materials with different acoustic properties, different thermal properties, or different mechanical properties.

[0007] In one embodiment, a method for manufacturing a transducer probe is provided. The method includes additively manufacturing a backing for the transducer probe using a variety of different materials with different acoustic properties, different thermal properties, or different mechanical properties. The backing has a porous matrix and one or more thermal management structures, wherein the backing is configured to attenuate acoustic energy and allow heat to be transferred from the front of the probe to the rear of the probe.

[0008] In one embodiment, a transducer probe is provided. The transducer probe includes a piezoelectric or microelectromechanical system (MEMS) layer for generating an acoustic signal. The transducer probe also includes a backing disposed beneath the piezoelectric or MEMS layer relative to the signal propagation direction. The backing is additively manufactured to a near-net-shape, which excludes subsequent machining or grinding to achieve a net shape, wherein at least one structural element mitigates one or more of the acoustic attenuation and thermal conductivity of the backing. At least a portion of the backing is additively manufactured using multiple different materials with different acoustic properties, different thermal properties, or different mechanical properties.

[0009] It should be understood that the above brief description is provided to introduce selected concepts further described in the detailed embodiments in a simplified form. This is not intended to identify key or essential features of the claimed subject matter, the scope of which is uniquely defined by the claims following the detailed embodiments. Furthermore, the claimed subject matter is not limited to specific implementations that address any shortcomings mentioned above or in any part of this disclosure. Attached Figure Description

[0010] The invention will be better understood by referring to the following description of non-limiting embodiments, in which:

[0011] Figure 1 An acoustic stack of an ultrasonic transducer, which may include a modified backing, is shown according to one embodiment;

[0012] Figure 2 A diagram illustrating the attenuation of acoustic energy in a modified backing according to one embodiment is shown;

[0013] Figure 3 A modified backing with a curved geometry is shown according to one embodiment;

[0014] Figure 4 A modified backing surrounded by an outer wall is shown according to one embodiment;

[0015] Figure 5 A modified backing with internal contents according to a first example is shown;

[0016] Figure 6A modified backing with internal contents, according to one embodiment, is shown;

[0017] Figure 7 A modified backing with internal contents according to one embodiment is shown;

[0018] Figure 8 A modified backing with a gradient structure according to one embodiment is shown;

[0019] Figure 9 The illustration shows the injection of filler into a modified backing according to one embodiment;

[0020] Figure 10 A modified backing for an injected filler seal according to one embodiment is shown;

[0021] Figure 11 A first example of a modified backing with an integrated heat sink according to one embodiment is shown;

[0022] Figure 12 A second example of a modified backing with an integrated heat sink according to one embodiment is shown;

[0023] Figure 13 A sealed container filled with filler is shown according to one embodiment. Figure 12 The modified backing;

[0024] Figure 14 A third example of a modified backing with an integrated heat sink is shown according to one embodiment;

[0025] Figure 15 A combination according to one implementation scheme is shown. Figure 11 The modified backing of the first transducer probe;

[0026] Figure 16 A combination according to one implementation scheme is shown. Figure 14 The modified backing of the second transducer probe;

[0027] Figure 17 A method for producing a modified backing according to one embodiment is shown;

[0028] Figure 18 A method for producing a modified backing (e.g., using a powder mixture of various different materials) according to one embodiment is shown;

[0029] Figure 19 A method for producing a modified backing (e.g., using a powder composite material having a variety of different materials) according to one embodiment is shown;

[0030] Figure 20 The illustration shows a modified backing made from a variety of different materials with different acoustic properties according to one embodiment;

[0031] Figure 21 A modified backing made from a variety of different materials with different mechanical properties is shown according to one embodiment;

[0032] Figure 22 A modified backing made from a variety of different materials with different thermal properties is shown according to one embodiment;

[0033] Figure 23 A modified backing made using a variety of different materials to form a gradient structure is shown according to one embodiment;

[0034] Figure 24 A modified backing with mechanical features, made from a variety of different materials, is shown according to one embodiment;

[0035] Figure 25 The illustration shows a modified backing fabricated from multiple different materials and coupled to a supporting structure according to one embodiment; and

[0036] Figure 26 A modified backing made using a variety of different materials (e.g., including one or more fillers) is shown according to one embodiment. Detailed Implementation

[0037] The following description relates to various embodiments of a backing for a transducer probe. The backing attenuates acoustic energy scattered in directions other than the signal propagation direction from the transducer probe, thereby improving image quality by reducing noise and ringing time. For example... Figure 1 As shown, the backing can be included in the acoustic stack of the transducer probe, positioned behind the piezoelectric material of the acoustic stack. In one example, the backing can be a modified backing that is additively manufactured to have both high acoustic attenuation and high thermal conductivity. Figure 2 As shown, the modified backing can be fabricated with a structure that attenuates sound energy through scattering and absorption. When additively manufacturing the modified backing, various variations in its construction are possible, allowing for the mitigation of the modified backing's acoustic and thermal properties. For example, the modified backing can have a curved geometry, such as... Figure 3 As shown, it can be at least partially enclosed by the outer wall, such as Figure 4 As shown, or may include internal structures, such as Figures 5 to 7 As shown. Figure 8 As shown, the modified backing can also have a gradient structure. The porous matrix of the modified backing can be at least partially filled with filler and sealed, as shown below. Figure 9 and Figure 10 As shown. It should be understood that, regarding Figure 9 and Figure 10 The examples of the filler described can be used in any of the modified backings shown and described herein. In some cases, the modified backing may include an integrated heat sink, examples of which are shown in... Figures 11 to 14 As shown in the image. Figure 15 and Figure 16 As shown, the modified backing, manufactured using additive manufacturing, can be easily integrated into the transducer probe. Figure 17 The document provides a detailed example of a method for creating a modified backing.

[0038] Before further discussing the methods used to manufacture modified backings with high acoustic attenuation and high thermal conductivity, Figure 1 A general overview of the acoustic stack for the transducer probe is shown and described below. In one example, the transducer probe may be an ultrasonic probe, although other types of probes that require absorption of stray acoustic energy and thermal management have been considered.

[0039] An ultrasonic probe includes one or more active components for generating ultrasonic signals. Examples of active components, piezoelectric or MEMS elements 102 in an ultrasonic probe are shown in [the image / description]. Figure 1 The acoustic stack 100 is shown in a schematic diagram, having a central axis 104. A set of reference axes is provided, indicating a propagation (e.g., signal propagation) direction 101, an azimuth direction 103, and an elevation direction 105. In other examples, this set of reference axes may represent a z-axis 101, an x-axis 103, and a y-axis 105. A piezoelectric or MEMS element 102 is present in... Figure 1 As shown in the figure, its central axis 104 is parallel to the propagation direction 101.

[0040] It should be noted that although the acoustic stack 100 is shown as having what is described as being similar to... Figure 1 The propagation direction is parallel to the z-axis, but other examples may include a propagation direction angled relative to the z-axis, depending on the shape of the piezoelectric element array. For example, an ultrasonic probe may be a curved array or a phased array, and thus produce a nonlinear beam that is not parallel to the z-axis. Furthermore, while the examples shown and described herein are for ultrasonic applications, the methods and systems described below are applicable to various sensor array types.

[0041] Although Figure 1The image shows a single piezoelectric or MEMS element, but an ultrasonic probe may include multiple piezoelectric or MEMS elements arranged in an array and individually coupled to an electrical energy source via wires. Each circuit formed by one or more piezoelectric or MEMS elements may be a transducer. In some examples, the transducer may include an array of piezoelectric or MEMS elements, which may be arranged in various patterns or matrices, including one-dimensional (1D) linear, two-dimensional (2D) square, 2D ring, etc. Each transducer may be electrically insulated from adjacent transducers, but may all be coupled to a common layer positioned above and below the piezoelectric or MEMS elements relative to the direction of propagation. The multiple piezoelectric or MEMS elements and the accompanying layer may be surrounded by a housing of the ultrasonic probe, which may be, for example, a plastic housing with various geometries. For example, the housing may be a rectangular block, a cylinder, or a shape constructed to comfortably fit the user's hand. Thus, Figure 1 The components shown can be adapted to have a geometry and size suitable for mounting within the housing of an ultrasonic probe.

[0042] Element 102 may be a block formed of a piezoelectric material such as lead zirconate titanate, which deforms and vibrates when, for example, a voltage is applied by an emitter. In some examples, piezoelectric element 102 may be a single crystal with a crystal axis, such as PMN-PT(Pb(Mg) 1 / 3Nb 2 / 3 (O3–PbTiO3). Vibration of the piezoelectric element 102 generates an ultrasonic signal, which is formed by ultrasonic waves propagating from an ultrasonic probe in the direction indicated by arrow 107 (e.g., along the propagation direction 101). The piezoelectric element 102 can also receive ultrasonic waves (such as ultrasonic waves reflected from a target object) and convert the ultrasonic waves into a voltage. The voltage can be transmitted to a receiver in an ultrasonic imaging system and processed into an image. The element 102 can also be formed by MEMS devices, such as a capacitive micromachined ultrasonic transducer (cMUT) or a piezoelectric micromachined ultrasonic transducer (pMUT).

[0043] Electrode 114 may be in direct contact with piezoelectric or MEMS element 102 to transmit voltage, derived from ultrasound, via wire 115. Wire 115 may be connected to a circuit board (not shown), to which multiple wires from electrodes of multiple piezoelectric or MEMS elements may be secured. The circuit board may be coupled to a coaxial cable to provide electronic communication between the ultrasound probe and receiver. In one example, the circuit board may be one or more ASICs electrically coupled to piezoelectric or MEMS element 102 via electrical dielectric structures. Electrode 114, wire 115, and circuit board may together form a circuit or electro-actuator for piezoelectric or MEMS element 102. In some examples, as an alternative to one or more ASICs, the circuit may be a flexible circuit.

[0044] In embodiments where element 102 is a piezoelectric element, an acoustic matching layer 120 may be disposed above the piezoelectric element 102 relative to the propagation direction 101 and oriented perpendicular to the central axis 104. The acoustic matching layer 120 may be a material positioned between the piezoelectric element 102 and the target object to be imaged. By disposing the acoustic matching layer 120 therebetween, ultrasonic waves can first pass through the acoustic matching layer 120 and be emitted in phase from it, thereby reducing the likelihood of reflection at the target object. The acoustic matching layer 120 can shorten the pulse length of the ultrasonic signal, which can increase the axial resolution of the signal. Additionally, in some examples, multiple (e.g., more than one) acoustic matching layers may be included in the acoustic stack 100.

[0045] The backing layer 126 may be disposed below the piezoelectric or MEMS element 102 relative to the propagation direction 101. In some examples, the backing layer 126 may be a block of material extending along the azimuth direction 103 (and the elevation direction 105), such that each of the plurality of piezoelectric or MEMS elements in the ultrasonic probe is directly above the backing layer 126 relative to the propagation direction 101. The backing layer 126 may be configured to absorb ultrasonic waves guided from the piezoelectric or MEMS element 102 in a direction opposite to the direction indicated by arrow 107. Additionally, the backing layer 126 may attenuate any stray ultrasonic waves deflected by the transducer and probe in directions other than those useful for imaging (e.g., directions outside the range of signal angles that can be emitted and received by the ultrasonic probe based on its specific size and frequency range). The bandwidth and axial resolution of the ultrasonic signal may be increased by the backing layer 126.

[0046] In one example, as described herein, backing layer 126 can be a modified backing layer manufactured via additive manufacturing. Additive manufacturing of a modified backing layer allows for flexibility in its construction, including the geometry, porosity, integration of internal structures or inclusions, and integration of the modified backing layer with other components. Furthermore, by controlling such aspects of the modified backing layer, it can possess thermal management capabilities. For example, the modified backing layer can be configured to be thermally conductive or fabricated as a single unit along with a thermally conductive structure such as a heat sink. Further details of the modified backing layer will be referenced below. Figures 2 to 17 supply.

[0047] In some examples, the backing layer 126 may be positioned below at least one ASIC of the ultrasonic probe (e.g., relative to the z-axis 101). In such examples, the backing layer 126 may be formed of a continuous (e.g., uncut) material. Cutting the backing layer 126 can be challenging because its thickness can be greater than the other layers of the acoustic stack 100. In other examples, the acoustic stack 100 may also include a dematching layer (…). Figure 1(Not shown in the image), the dematching layer is disposed directly below the piezoelectric element 102 and between the piezoelectric element 102 and the backing layer 126. The dematching layer may be a high acoustic impedance layer that reflects most of the ultrasonic signal received by the ultrasonic probe from the front of the ultrasonic probe (e.g., along the propagation direction 101), thereby allowing the reflected portion of the ultrasonic signal to be used for imaging.

[0048] As described above, a modified backing can be included in an acoustic stack instead of a conventional backing layer. The modified backing can be additively manufactured and is therefore customizable to the target application, while incurring lower costs during production than conventional transducer probes. For example, the modified backing can have a porous matrix that allows for the random or pseudo-random scattering and absorption of acoustic energy. The material and structure of the porous matrix can be heterogeneous, which is achieved via additive manufacturing. Furthermore, by forming the modified backing through additive manufacturing, other probe components can be integrated into the modified backing, thereby reducing the number of individual probe parts and improving component efficiency. For example, the modified backing may include at least one structural element, including a pore structure, filler, and thermal conductivity structure, which allows the modified backing to provide one or more of a target acoustic attenuation and a target thermal conductivity.

[0049] The scattering and absorption (e.g., attenuation) of acoustic energy reflected from the piezoelectric material in the acoustic stack Figure 2 The example of the modified backing 200 is shown in [the image / description]. Figure 2 The modified backing 200 is described as a porous matrix formed from one or more of aluminum, aluminum nitride, copper, titanium, tungsten, metal alloys, and stainless steel, and includes a filling material filling the porous matrix. The porosity and structure of the modified backing 200 can be random or pseudo-random, such that the porosity and corresponding structure (e.g., crystal structure or molecular structure) can be variable within the modified backing 200, or can be relatively uniform while maintaining the ability to scatter acoustic energy in different directions.

[0050] like Figure 2 As shown, incident acoustic energy (e.g., sound waves) can enter the modified backing 200 in a direction opposite to the propagation direction 101, as indicated by arrow 202. For example, incident acoustic energy can be reflected into the modified backing 200 from a piezoelectric material arranged at the front of the modified backing 200 relative to the propagation direction 101, as... Figure 1 As depicted, the incident sound energy can have a first intensity when entering the modified backing 200, as indicated by arrow 204.

[0051] The acoustic energy can then interact with the modified backing 200 and be redirected to travel in different directions. For example, the acoustic energy can be reflected by the structure of the matrix, such as at pores. Additionally, vibrations of the material of the modified backing 200 can be caused by the incident acoustic energy and can destructively interfere with the acoustic energy traveling through it. The intensity of the acoustic energy can be reduced as it is scattered and absorbed by the porous matrix and filler, as indicated by arrow 206.

[0052] Sound energy can continue to be scattered and its intensity decreases through the modified backing 200 until the sound energy is completely dissipated. The number of sound energy reflections within the modified backing 200 required for complete absorption can vary, such as... Figure 2 As shown. Acoustic energy can be bounced in a variable manner within the modified backing 200 and simultaneously suppressed, thereby minimizing the escape of acoustic energy from the modified backing 200.

[0053] The attenuation properties of a modified backing can be optimized by adjusting various parameters of the modified backing, which can be achieved via additive manufacturing of the modified backing layer. For example, the modified backing can be formed with a near-net-shape, thereby minimizing the application of finishing processes (such as machining or grinding) to achieve the final, desired geometry of the backing layer. When formed in a near-net-shape, the modified backing can be produced with a geometry very close to the desired final or net shape of the modified backing. In some cases, additive manufacturing of the modified backing allows for the exclusion of machining or grinding of the modified backing. As an example, the shape of the modified backing can be selected, for example, by an operator during the fabrication of the modified backing, such that the modified backing is additively manufactured with the desired geometry. As an example, such as Figure 3 As shown, a modified backing can be made for use in curved probes.

[0054] An example of a modified backing 300 with a curved geometry is shown in Figure 3 The modified backing 300 may have a matrix 302 composed of any of the materials provided above, and may be additively manufactured to have a specific shape. For example, the modified backing 300 may have a curved upper or front surface 304 to accommodate attachment to a curved piezoelectric material for (as an example) transabdominal imaging.

[0055] The bottom or rear surface 306 of the modified backing 300 may have structural details that enable mechanical coupling of the modified backing 300 to adjacent components. For example, the rear surface 306 may include an alignment element 308, which may be a slot configured to receive a protrusion of a component to be coupled to the rear surface 306 of the modified backing 300. The rear surface 306 may also include at least one recess 310 for receiving electrical components 312.

[0056] Therefore, the geometry of the modified backing can be easily customized during manufacturing to suit the target application. The modified backing shape can affect its ability to attenuate the acoustic energy of a particular transducer shape, which can be custom-designed. For example, a curved transducer allows acoustic waves to penetrate deeper into the region of interest, providing in-depth imaging, while a linear transducer enables high-resolution imaging at shallower depths. By forming the modified backing via a process that allows for near-net-shape production, the modified backing can be fabricated with minimal additional processing and labor to achieve its geometric and detailed structural features, which broadens the use of specific modified backing matrix types for different probe applications.

[0057] The acoustic attenuation capability of an additively manufactured modified backing can also vary depending on the porosity of the modified backing. Depending on the target application, the porosity can be controlled during the fabrication (e.g., printing) of the modified backing based on selected (e.g., operator-selected) pore size, pore structure (e.g., shape), and pore density or total porosity. For example, by reducing the pore size, the modified backing can attenuate acoustic energy at higher frequencies. The shape of the pores and the total porosity of the modified backing can also affect how the material of the modified backing layer interacts with incident acoustic energy.

[0058] Furthermore, by modifying manufacturing parameters during the printing of the modified backing, the material of the modified backing can be formed with a target structure, such as desired density orientation and alignment. For example, the laser pass power, speed, direction, angle, shadow lines, and printing orientation can be adjusted to obtain desired structural properties in the modified backing, such as target hole uniformity, hole size, hole shape, and hole density. By obtaining the desired structural properties, the modified backing can exhibit target acoustic and thermal properties.

[0059] The modified backing can also be additively manufactured to provide thermal management properties. For example, heat can be transferred from the front of the transducer probe to the rear of the transducer probe via the thermal management structure of the modified backing, away from the surface of the transducer probe in contact with the patient. By enabling the modified backing to conduct heat in a desired manner, the operation of the transducer probe at a desired power level can be extended. In one example, such as... Figure 4 As shown, the modified backing 400 can be fabricated to have one or more structures along the outer surface of the modified backing 400, such as a solid outer wall 402 that surrounds the matrix 404 of the modified backing 400 and is continuously connected to the matrix 404. The outer wall 402 can be formed of the same or different material as the matrix 404, but can have a higher density and lower porosity than the matrix 404. For example, the outer wall 402 can include one or more of aluminum, aluminum nitride, copper, titanium, tungsten, metal alloys, and stainless steel (e.g., thermally conductive materials), and can be configured to have higher thermal conductivity than the matrix 404.

[0060] The outer wall 402 may at least partially enclose the matrix 404 and may not detach from the matrix 404. As an example, the outer wall 402 may extend across the upper or front surface 406 of the matrix 404 and the side surface 408 of the matrix 404 relative to the signal propagation direction 101. By arranging the outer wall 402 at least across the front surface 406 of the matrix 404, the outer wall 402 may be positioned between the piezoelectric material of the acoustic stack and the matrix 404. The outer wall 402 may conduct heat away from the circuitry (e.g., electric actuators) of the piezoelectric material and around the matrix 404 to the rear side of the modified backing 400, as indicated by arrow 410, thereby transferring heat to other areas of the transducer distal to the patient and not in contact with the patient. Although the outer wall 402 is depicted as surrounding the front surface 406 and side surface 408 of the matrix 404, in other examples, the outer wall 402 may have different geometries.

[0061] For example, the outer wall may not extend along all the side surfaces of the substrate 404, or it may not extend across the side surfaces at all. In such cases, the outer wall may come into contact with heat-absorbing components (such as radiators). Additionally, as... Figure 5 As shown, the outer wall can be connected to a thermally conductive structure embedded in the matrix of the modified backing.

[0062] exist Figure 5 In one example, the modified backing 500 may include an internal inclusion embedded therein. The internal inclusion may be a heat-conducting structure 502 extending through a matrix 504 of the modified backing 500, and may be formed of the same material as the outer wall 506 of the modified backing 500. However, in other examples, the heat-conducting structure 502 may be formed of a different thermally conductive material than the outer wall 506.

[0063] The heat conduction structure 502 may form an internal grid within the substrate 504, which provides an increased path for heat conduction through the substrate 504, as indicated by arrow 503. Each of the heat conduction structures 502 may be a discrete structure having segments (such as branches 502a) extending from the trunk 502b of each of the heat conduction structures 502. The trunk 502b of the heat conduction structure 502 may extend continuously from the front surface 508 of the substrate 504 to the rear surface 510 of the substrate 504 at an angle θ relative to the propagation direction 101. For example, this angle may be 0 degrees to 80 degrees relative to the propagation direction 101.

[0064] The heat conduction structure 502 can be as follows Figure 5As shown, spaced apart from each other, or in other examples, the thermally conductive structures 502 may be interconnected to form a continuous grid through the matrix 504. Furthermore, the modified backing 500 may have a variable number of thermally conductive structures 502, each of which has a variable number of branches 502a. In a given modified backing, the thermally conductive structures 502 may be formed of a common material or may be formed of different materials.

[0065] In addition to thermal management within the acoustic stack, the thermally conductive structure 502 can also affect the attenuation of acoustic energy. For example, the thermally conductive structure 502 can reflect acoustic energy scattered from the piezoelectric material of the acoustic stack into the modified backing 500. By providing additional surfaces for reflecting acoustic energy, the total path length of acoustic energy traveling within the modified backing 500 can be increased, which increases the attenuation of acoustic energy. The attenuation properties of the modified backing 500 provided by the thermally conductive structure 502 can be modified by changing the physical parameters of the thermally conductive structure 502, such as its material and texture, the number of thermally conductive structures (e.g., density), the distribution and orientation in the matrix 504, the number of branches, the size of the thermally conductive structures, etc.

[0066] A modified backing 600 of a second example with an internal structure embedded therein Figure 6 The modified backing 600's internal structure or thermal conductivity structure 602 may be embedded within the matrix 604 of the modified backing 600 and may extend from the front surface 606 of the matrix 604 to the rear surface 608 of the matrix 604. As described above, the thermal conductivity structure 602 may be formed of a thermally conductive material, which may be the same as or different from the outer wall 610 of the modified backing 600.

[0067] The heat-conducting structure 602 can be discrete units spaced apart from each other and having segments forming a zigzag or lightning bolt shape. However, in other examples, the heat-conducting structure 602 can be interconnected and can also vary with respect to angle and orientation. Additionally, the heat-conducting structure 602 can be composed of a common material or different materials.

[0068] Similar to Figure 5 502 heat conduction structure Figure 6 The heat conduction structure 602 provides a heat conduction path through the substrate 604 via the modified backing 600, while the outer wall 610 can conduct heat around the substrate 604. Figure 5 and Figure 6 The combined effect of the outer wall and the heat-conducting structure effectively diverts heat away from the circuitry of the piezoelectric material connected to the acoustic stack, which is adjacent to the modified backing 600. Furthermore, as described above, the heat-conducting structure 602 also mitigates the attenuation of acoustic energy caused by the modified backing 600. The effect of the heat-conducting structure 602 on attenuation can similarly depend on the orientation, number, material, size, spacing, etc., of the heat-conducting structure 602.

[0069] A modified backing 700 of a third example with an internal structure embedded therein Figure 7 The modified backing 700's internal structure or thermal conductivity structure 702 may be embedded within the matrix 704 of the modified backing 700 and may extend from the front surface 706 of the matrix 704 to the rear surface 708 of the matrix 704. As described above, the thermal conductivity structure 702 may be formed of a thermally conductive material, which may be the same as or a different type from the outer wall 710 of the modified backing 700.

[0070] and Figure 5 and Figure 6 Compared to the heat conduction structure, Figure 7 The heat conduction structure 702 can have a simple and planar geometry, extending linearly through the matrix 704 without any turns, bends, branches, etc. For example, the heat conduction structure 702 can be similar to Figure 5 The main stem 502b of each of the heat conduction structures 502. The heat conduction structure 702 can provide more than Figure 5 and Figure 6 The heat-conducting structure has fewer surfaces, for example, to reflect acoustic energy scattered into the modified backing from the piezoelectric material attached to it. However, the reflection and scattering provided by the heat-conducting structure 702 can alternatively vary based on the angle φ of the heat-conducting structure 702 relative to the propagation direction 101.

[0071] The ability of a modified backing to attenuate acoustic energy while effectively conducting heat across the modified backing can be adjusted based on the geometry of the thermally conductive structures embedded in the matrix of the modified backing. The interaction between the thermally conductive structures and acoustic energy can be modified by varying the number of segments of the thermally conductive structures. By forming the thermally conductive structures from a material that is more thermally conductive than the matrix of the modified backing, and by configuring the thermally conductive structures to extend from the side of the matrix closer to the piezoelectric material, the thermally conductive structures can provide a direct path for heat transfer through the modified backing, thus diverting heat away from the piezoelectric material and the circuitry that generates heat. The thermal conductivity and acoustic attenuation properties of the modified backing can be further mitigated based on the density (e.g., number and spacing) of the thermally conductive structures within the matrix, as well as the orientation / angle of the thermally conductive structures.

[0072] When manufactured via additive manufacturing, the modified backing can be formed to have target thermal conductivity and acoustic attenuation characteristics. For example, the thermal conductivity of the modified backing can be at least 10 watts / meter Kelvin (W / m·K), and the modified backing can have thermal management structures, such as outer walls and / or internal thermal conduction structures, such as... Figures 5 to 7 As shown. In some examples, the thermal conductivity can be as high as at least 40 W / m·K. For example, the attenuation of acoustic energy provided by the modified backing can be greater than 10 dB / mm at 3 MHz.

[0073] As a complement or alternative to the external and / or internal heat conduction structures, the modified backing may have a gradient structure that mitigates its acoustic and / or thermal properties. An example of a modified backing 800 with a gradient structure is shown in... Figure 8 As shown in the figure. The modified backing 800 may have a substrate 802 at least partially enclosed by an outer wall 804. As described above, the outer wall 804 can conduct heat away from the piezoelectric material circuitry around the substrate 802.

[0074] The matrix 802 can be graded to have properties that vary along the propagation direction 101. As an example, the matrix 802 may have a first region 802a with a first porosity, a second region 802b with a second porosity, and a third region 802c with a third porosity, the second region 802b being disposed between the first region 802a and the third region 802c. The first porosity may be lower than the second porosity, which may be lower than the third porosity. However, in other examples, the porosity gradient may be reversed or the porosity may not be sequentially gradual. Additionally, in other examples, different parameters may vary along the propagation direction 101 instead of gradually varying the porosity.

[0075] For example, the pore structure, the type of filler filling the pores, the amount of filler, the uniformity of the pores, and the pore size can be varied in a controlled manner across the modified backing. The gradient structure of matrix 802 can influence acoustic attenuation by incorporating regions that interact differently with acoustic energy. For example, Figure 8 The varying porosity of the matrix 802 regions can provide regions with different surfaces that reflect acoustic energy, as well as regions that vibrate at different frequencies when excited to destructively interfere with acoustic energy. The gradient structure can also conduct heat differently along its regions. For example, regions with lower porosity or type 1 filler can conduct heat more effectively than regions with higher porosity or type 2 filler (different from type 1).

[0076] As described above, fillers can be added to the porous structure of a modified backing to enhance the acoustic and / or thermal properties of the modified backing compared to an unmodified backing. In one example, such as... Figure 9 and Figure 10 As shown, the filler can be introduced into the matrix in a liquid state, thereby allowing the filler to be injected into the matrix. Figure 9 and Figure 10 The image depicts a modified backing 900 having a matrix 902 completely enclosed within an outer wall 904. As described above, the outer wall 904 may be thermally conductive, and the matrix 902 may be porous. For example, the matrix 902 may be a foam structure with randomly or uniformly distributed pores.

[0077] The outer wall 904 may include a port 906, which may be a fill port and / or a vent port, as an opening in the outer wall 904 that fluidly connects the matrix 902 (e.g., fluid in the pores of the matrix, such as air) to the fluid outside the modified backing 900. Although in Figure 9 Two ports 906 are shown, but the outer wall 904 may include any number of ports arranged at various locations around the matrix 902. By providing ports 906 in the outer wall 904, filler 908 can be added to the matrix 902 after the additively manufactured modified backing 900. For example, the filler 908, which may be fluid, can be injected through ports 906 using a syringe 910, as... Figure 9 As shown. The outer wall 904 can be an impermeable barrier surrounding the matrix 902, which holds the filler within the matrix 902 of the modified backing 900 during the injection of the filler 908.

[0078] As another example, filler can be added to matrix 902 via a vacuum impregnation process. For instance, a separate mold can be used to encapsulate matrix 902, and matrix 902 can be maintained at low pressure to extract the filler in liquid form into matrix 902. The filler can be cured, and matrix 902 can be removed from the mold and machined to obtain the final target shape. Therefore, the outer wall 904 does not need to provide a solid barrier around matrix 902 to accommodate the filler.

[0079] The filler 908 may fill at least a portion of the pores of the matrix 902, forming filled regions 912 and unfilled regions 914 of the matrix 902. In some examples, the pores of the matrix 902 may be completely filled with filler, and the unfilled regions 914 may not exist. In other examples, the matrix 902 may include more than one filled region 912, each of which includes a different type of filler.

[0080] In one example, after the filler 908 is added to the matrix 902, the filler 908 can be allowed to cure, with port 906 remaining open to allow any gases generated during curing to escape. Alternatively, port 906 can be sealed when the injection of the filler 908 is complete. Figure 10 As shown, port 906 can be sealed with ball bearing 1000, thereby sealing packing 908 within the modified backing 900 while keeping packing 908 in the liquid phase. However, other types of sealing devices or structures are also possible. Furthermore, the sealing device or structure can be permanent or semi-permanent (e.g., removable).

[0081] The filler for the modified backing can be a material that modifies the acoustic and / or thermal properties of the modified backing, and can be selected during manufacturing to provide a target range of attenuation and / or thermal conductivity. The filler can be readily added to the modified backing by utilizing a material that is at least introduced into the modified backing as a fluid. The filler can be one or more of, for example, epoxy resin, silicone, phase change materials, and scattering particles formed from phenolic microspheres, tungsten, metals or metal oxides, silicone, glass, etc.

[0082] As an example, the acoustic attenuation of the modified backing can be increased by filling the matrix with a lossy epoxy resin. As another example, the matrix can be filled with a phase change material (PCM) to increase heat capacity. The PCM can be a liquid-to-solid PCM that transforms into a solid PCM when the temperature of the modified backing decreases to a threshold PCM temperature and returns to a liquid state when the temperature rises above the threshold PCM temperature, thereby absorbing and storing thermal energy. The PCM can be selected to have a PCM temperature corresponding to the operating temperature range of the modified backing. For example, the PCM can have a PCM temperature of approximately 40°C, or in the range of 30°C to 50°C. In one example, the PCM can be paraffin wax. The paraffin wax can be first heated to melt it, allowing it to be easily added to the matrix, whereby the paraffin wax can cool and harden. When exposed to heat during operation of the transducer probe, the paraffin wax can absorb heat and melt, storing thermal energy as a liquid, which can be released after the transducer is no longer in operation and has cooled.

[0083] In addition to controlling attenuation and thermal management of the modified backing, additive manufacturing of the modified backing also allows for integration with the transducer probe's support structure, such as continuous formation into a single unit. For example, one or more of the support structures can be fabricated to be continuous and continuous with the porous matrix of the modified backing. In other words, one or more support structures and the porous matrix can be fixedly connected to each other and are not detachable. The support structure may include components that provide structural support and / or thermal management, such as heat sinks, which can also be thermal management structures that draw heat away from the porous matrix of the modified backing and transfer heat to the rear of the transducer probe. Figure 11 An example of a modified backing 1100 with a substrate 1102 integrated with a heat sink 1104 is shown. The heat sink 1104 can be fabricated together with the substrate 1102 in a single process to form the modified backing as a continuous unit, thereby eliminating additional bonding mechanisms such as adhesives. In other words, the heat sink 1104 can be continuously bonded to the substrate 1102, and more specifically, to the rear side of the substrate 1102.

[0084] The heat sink 1104 may be formed of a thermally conductive material (such as aluminum or copper) and may be fabricated with a geometry corresponding to the available space within the transducer probe housing. In some examples, the modified backing 1100 may be fabricated to have at least one internal cooling channel 1106 through which coolant can flow. The internal cooling channel 1106 may allow the coolant to absorb heat from the heat sink 1104, such as... Figure 11 As depicted, or extending through both the heat sink 1104 and the substrate 1102 to absorb heat from both portions of the modified backing 1100. Additionally, in some examples, the substrate 1102 may include internal heat conduction structures, such as... Figures 5 to 7 The heat conduction structure depicted in the image.

[0085] Additionally, the geometry of the modified backing radiator can be altered to also form an outer wall continuous with the radiator surrounding the matrix. For example... Figure 9 As shown, filler can be added to the modified backing. For example, as... Figure 12 As shown, the modified backing 1200 can be a single continuous unit comprising a substrate 1202, an outer wall 1204, and a heat sink 1206. The outer wall 1204 may be continuous with the heat sink 1206, such that the substrate 1202 is completely enclosed by the outer wall 1204 and the heat sink 1206. In one example, the outer wall 1204 and the heat sink 1206 may be formed of a common material. The heat sink 1206 may include a port 1208 providing an opening in the heat sink 1206, which allows the substrate 1202 to be filled with filler.

[0086] For example, the modified backing 1200 in Figure 13 The image shows a filler 1300 with orifices 1202 and ports 1208 filled with a matrix 1202. A syringe (such as...) can be used... Figure 9 The syringe 910, for example, injects filler 1300 through port 1208. As described above, Figure 12 The number of ports 1208 depicted is exemplary, and other examples may have other numbers of ports. Ports 1208 may be plugged with seals 1302 (such as ball bearings) that seal the filler 1300 within the matrix 1202 and the ports 1208.

[0087] Go to Figure 14Another example of a modified backing 1400 is shown, featuring components integrated during additive manufacturing. The modified backing 1400 includes an attenuation region 1402, a heat storage region 1404, an outer wall 1406, an inner wall 1408, and a heat sink 1410. The outer wall 1406 may extend across the front surface of the attenuation region 1402 and the side surface of the heat storage region 1404. The attenuation region 1402 may be separated from the heat storage region 1404 by the inner wall 1408, which may be continuous with the outer wall 1406, which in turn may be continuous with the heat sink 1410. In one example, the outer wall 1406, the inner wall 1408, and the heat sink 1410 may be formed from a common material. Additionally, in some examples, the attenuation region 1402 and / or the heat storage region 1404 may include internal heat conduction structures, such as… Figures 5 to 7 The heat conduction structure depicted in the image.

[0088] The attenuation region 1402 may be located closer to the piezoelectric material of the acoustic stack than the heat storage region 1404, and may be a matrix with high attenuation properties (e.g., higher than the heat storage region 1404). For example, the matrix may be formed of any of the materials described above and may be filled with a lossy epoxy resin. The lossy epoxy resin may be injected into the matrix of the attenuation region 1402 through a first set of ports 1412 forming openings in the outer wall 1406. The first set of ports 1412 may be sealed closed with a seal 1414. For example, the seal 1414 may be a plug.

[0089] The heat storage region 1404 may include a matrix having high heat absorption (e.g., higher than that of the attenuation region 1402). For example, the matrix may be formed from any of the materials previously described and may be filled with a phase change material. The phase change material absorbs and stores heat as it undergoes a phase transition. The matrix of the heat storage region 1404 may be filled with the phase change material via a second set of ports 1416 forming openings in the heat sink 1410. The second set of ports 1416 may be sealed by a seal 1418. The seal 1418 may be, for example, a ball bearing.

[0090] exist Figures 11 to 14 In the example, the modified backing can be fabricated together with integrated components such as the outer wall, matrix, and heat sink, which provide thermal and acoustic management for the modified backing. By manufacturing the components simultaneously as continuous units, the parts of the transducer probe can be combined, resulting in cost reductions compared to conventional manufacturing processes that involve manufacturing individual parts and requiring subsequent assembly. Similarly, the number of thermal interfaces included in the transducer probe can be reduced, which can improve probe performance.

[0091] Furthermore, additive manufacturing of modified backings with integrated components enables the creation of customized backing geometries with minimal processing to achieve specific dimensions and shapes. For example, Figure 11 Modified backing 1100 and Figure 14 The modified backing 1400 is shown as being respectively bonded to Figure 15 and Figure 16 The first transducer probe 1500 and the second transducer probe 1600 are in the middle.

[0092] Both the first and second transducer probes have a probe housing 1502, a heat spreader 1504, a lens 1506, a piezoelectric or MEMS material 1508, and a thermal interface material (TIM) 1510. The piezoelectric or MEMS material 1508 may be positioned above a modified backing of each transducer probe relative to the propagation direction 101. Various other probe components may be included in the probe, such as electrical devices, circuits, connectors, etc., but for clarity, they are not shown here. Figure 15 and Figure 16 The details are omitted. The probe housing 1502 may enclose all the internal components of the corresponding probe except for the lens 1506, and may have a geometry corresponding to its specific application. For example, the probe housing 1502 may be shaped for use as... Figure 15 and Figure 16 The phase-controlled or sector transducer array shown, or used for convex transducer arrays or linear transducer arrays.

[0093] The vapor chamber 1504 may be a thin, continuous layer of metal (such as aluminum) or other thermally conductive material, extending along the inner surface of the probe housing 1502 across the entire probe housing. The vapor chamber 1504 transfers heat from the front end 1503 of the corresponding probe to the rear end 1505, thus aiding in probe thermal management. The heat exchanger 1510 may be a compliant material, such as clay or silicone, used to fill the space between the vapor chamber 1504 and the modified backing 1100 or 1400, and to provide thermal conduction from the heat exchangers 1104 and 1410 to the vapor chamber 1504.

[0094] like Figure 15 As shown, the size of the modified backing 1100 can be configured to fit within the available packaging space behind the piezoelectric or MEMS material 1508. For example, the dimensions of the substrate 1102 and the heat sink 1104 can be selected during the additive manufacturing of the modified backing 1100 to fit within the internal volume of the probe housing 1502. Additionally, the shape of the modified backing 1200 can be selected, for example, by the operator or computing system, such that the size of the heat sink 1104 is maximized within the available packaging space.

[0095] like Figure 16 As shown, Figure 14 The modified backing 1400 can alternatively be arranged within the available encapsulation space of the probe housing 1502, behind the piezoelectric or MEMS material 1508. For example, the modified backing 1400 can be fabricated to have the same characteristics as... Figure 11 and Figure 15The modified backing has a similar footprint to the 1100. Therefore, additive manufacturing of the modified backing allows for greater flexibility in its construction, enabling optimization of its performance and geometry for positioning behind the piezoelectric material based on a specific probe. Furthermore, additive manufacturing allows for a higher level of refinement of the modified backing's details to be achieved beyond what is possible with conventional manufacturing processes, depending on the application. For example, Figure 15 and Figure 16 The probe depicted in the image can be constructed to have Figures 3 to 14 Any of the examples of modified backing shown, as well as other constructions not described herein, without increasing the complexity or cost of the manufacturing process.

[0096] When adapted to a modified backing, the probe can thus be configured with different domains. For example, the second transducer probe 1600 may include an attenuation domain (e.g., attenuation region 1402), a heat storage domain (e.g., heat storage region 1404), and a solid heat sink domain (e.g., heat sink 1410). Each domain can provide for a specific operational task and can each be incorporated into a single structure, which can be manufactured as a single multi-domain, near-net-shape component.

[0097] Figure 17 An example of method 1700 for manufacturing a modified backing for a transducer probe is shown. This method can be performed by an additive manufacturing system (such as a 3D printer) configured to receive input from an operator and having executable instructions stored in the memory of the additive manufacturing system's controller. The modified backing can be... Figures 3 to 14 Any of the examples of modified backings depicted in the text.

[0098] At 1702, the method includes obtaining target parameters for the modified backing. The target parameters may be stored in the controller's memory, retrieved from a database accessible to the controller, and / or input to the controller by an operator. For example, the target parameters may include the type of probe in which the modified backing will be incorporated, target acoustic attenuation, target thermal conductivity, and one or more materials by which the modified backing will be formed. The target parameters may also include the porosity, pore structure and distribution of the matrix of the modified backing, variations in pores forming a gradient structure within the matrix, the number, geometry and orientation of internal thermal conductors, the arrangement of the outer walls around the matrix, the presence of ports in the outer walls, the presence of inner walls arranged between the two matrices, the shape of the heat sink integrated with the matrix, etc. Furthermore, the target parameters may include manufacturing conditions such as printing parameters, including laser power, printing speed, printing direction, printing angle, printing ray, printing orientation, etc.

[0099] At 1704, the method includes printing the modified backing according to target parameters. Optionally, at 1706, at least one filler may be added to one or more substrates of the modified backing. For example, the filler may be a fluid that can be injected into the substrate through a port in the outer wall or a port in the radiator. Alternatively, the filler may be incorporated into the additive backing substrate using a vacuum impregnation process with a separate mold. In examples where the modified backing has more than one substrate, for example, such as... Figure 14 and Figure 16 As shown, different fillers can be injected into the matrix. Additionally or alternatively, more than one type of filler can be injected into a single matrix. The filler can be, for example, a material that modifies the acoustic and / or thermal properties of the backing, and can remain fluid after injection or can be solidified into a non-liquid, such as a solid. In one example, the filler can be a phase change material that can be injected as a fluid and undergo a solid phase transition when exposed to temperatures below its phase transition temperature. In examples where the filler is not solidified, ports in the outer wall and / or radiator can be plugged and sealed to suppress filler loss through the ports.

[0100] In this way, a backing for a transducer probe can be provided. The embodiments of the backing described herein can also be applied, for example, to industrial non-destructive probes for detecting structural defects. The backing can be a modified backing with acoustic and / or thermal management capabilities. During the fabrication of the modified backing via additive manufacturing, the acoustic and / or thermal properties of the modified backing can be readily incorporated into the modified backing. The additively manufactured modified backing can include various elements to optimize its ability to attenuate acoustic energy and conduct heat away from the piezoelectric material of the transducer. For example, various elements can include a porous matrix to which fillers can be added, an outer wall surrounding the matrix to guide heat, an internal heat conduction structure embedded in the matrix, and a heat sink, wherein the elements can be fabricated together as a single integrated unit. The properties and geometry of the modified backing can be easily varied based on adjustments to printing parameters to optimize the modified backing for a specific application or probe. Therefore, the modified backing can be manufactured at low cost and with high flexibility, which can improve the performance of the transducer probe.

[0101] In some embodiments, the additive manufacturing process for components used in transducer probes (e.g., backing materials) utilizes multi-material printing (e.g., incorporating two or more materials into the same additively manufactured part) to enhance properties. For example, acoustic attenuation can be enhanced by incorporating materials with different acoustic properties (i.e., acoustic impedance) and different shapes / sizes to increase attenuation. In another example, thermal properties can be enhanced by combining high thermal conductivity materials (e.g., 100 W / m·K to 400 W / m·K) and structures to improve thermal management beyond what might be achievable using only the primary acoustic backing material. In yet another example, mechanical properties can be enhanced by combining materials and structures with higher strength compared to the primary acoustic backing material. In some embodiments, a combination of these properties can be enhanced. In some embodiments, multi-material printing may be located in strategically positioned areas of the backing material. In some embodiments, multi-material printing may extend throughout the entire backing material.

[0102] Therefore, in some embodiments, the probe includes an additively manufactured backing having: a porous matrix at least partially filled with at least one filler, and one or more thermal management structures. The additively manufactured backing is configured to attenuate acoustic energy and allow heat to be transferred from the front of the probe to the rear of the probe. At least a portion of the additively manufactured backing is additively manufactured using a variety of different materials with different acoustic properties, different thermal properties, and / or different mechanical properties.

[0103] One or more materials can be used during the printing process to achieve the desired geometric and physical backing material properties. Material mixing can be accomplished in various ways. In one embodiment, two or more powders (e.g., metal powders) can be mixed prior to the printing process. In another embodiment, two or more powders can be premixed during powder manufacturing to form a powder composite material (prior to the printing process). In one embodiment, the mixing of powders and different forms of auxiliary materials can be premixed or mixed in situ during the printing process. The second material can be in the form of a liquid, paste, gel, etc.

[0104] Mixed powders can interact in different ways. The desired properties of the acoustic backing material can be adjusted and achieved using different in-situ methods, such as mixing two or more powders, where the master powder material has the desired final chemical and physical properties.

[0105] In some embodiments, one or more sacrificial powders may be used together with the host material without any chemical reaction between them. One or more additional sacrificial materials may be added and sacrificed (e.g., decomposed, vaporized, or boiled) during the printing process to create randomized porosity in the host material. For example, titanium powder (i.e., the host material) may be mixed with hydroxyapatite (i.e., the sacrificial material). The hydroxyapatite vaporizes during the printing process and creates randomized porosity in the printed structure independently of the computer-aided geometry. The vaporization of the hydroxyapatite also alters the chemical composition of the final product. The final chemical composition of the porous structure (e.g., the porous matrix) is derived from the titanium powder (and altered due to the vaporization of the hydroxyapatite).

[0106] In some implementations, one or more auxiliary powders that react with the main powder may be utilized. For example, auxiliary (non-sacrificial) materials that melt together with the main material may be used to modify the chemical composition of the final structure to produce a new chemical composition with enhanced or advantageous properties compared to the isolation material during the printing process.

[0107] The properties of the final printed product can be adjusted not only by mixing different powders, but also by adjusting and controlling the printing process. Adjusting and controlling the printing process can affect the chemical composition of the final product, the control of elemental microsegregation, and / or the randomized porosity in the structure independent of the CAD design.

[0108] Figure 18 An example of a method 1800 for manufacturing a modified backing for a transducer probe is shown (e.g., using a powder mixture having a variety of different materials). Method 1800 can be performed by an additive manufacturing system (such as a 3D printer) configured to receive input from an operator and having executable instructions stored in the memory of the additive manufacturing system's controller.

[0109] At 1802, method 1800 includes manufacturing a powder composite material using a mixture of two or more powders prior to additively manufacturing the backing, wherein the powder composite material has the multiple different materials. At 1804, method 1800 includes obtaining target parameters for the modified backing. The target parameters may be stored in the controller's memory, retrieved from a database accessible to the controller, and / or input to the controller by an operator. For example, the target parameters may include the type of probe in which the modified backing will be incorporated, target acoustic attenuation, target thermal conductivity, and one or more materials by which the modified backing will be formed. The target parameters may also include the porosity, pore structure and distribution of the pores in the matrix of the modified backing, variations in pores forming a gradient structure in the matrix, the number, geometry and orientation of internal thermal conductors, the arrangement of the outer walls around the matrix, the presence of ports in the outer walls, the presence of inner walls arranged between the two matrices, the shape of the heat sink integrated with the matrix, etc. Furthermore, the target parameters may include manufacturing conditions such as printing parameters, including laser power, printing speed, printing direction, printing angle, printing ray, printing orientation, etc.

[0110] At 1806, the method 1800 includes printing a modified backing according to target parameters. Optionally, at 1808, at least one filler may be added to one or more substrates of the modified backing. For example, the filler may be a fluid that can be injected into the substrate through a port in the outer wall or a port in a heat sink. Alternatively, the filler may be incorporated into the additive backing substrate using a vacuum impregnation process with a separate mold. In some embodiments, one or more fillers may be additively manufactured into the substrate simultaneously with the additive manufacturing of the backing substrate.

[0111] Figure 19 An example of a method 1900 for manufacturing a modified backing for a transducer probe is shown (e.g., using a powder composite material having a variety of different materials). Method 1900 can be performed by an additive manufacturing system (such as a 3D printer) configured to receive input from an operator and having executable instructions stored in the memory of the additive manufacturing system's controller.

[0112] At 1902, method 1900 includes mixing two or more powders together to form a powder mixture having multiple different materials prior to additively manufacturing the backing. At 1904, method 1900 includes obtaining target parameters for the modified backing. The target parameters may be stored in the controller's memory, retrieved from a database accessible to the controller, and / or input to the controller by the operator. For example, the target parameters may include the type of probe in which the modified backing will be incorporated, target acoustic attenuation, target thermal conductivity, and one or more materials from which the modified backing will be formed. The target parameters may also include the porosity, pore structure and distribution of the pores in the matrix of the modified backing, variations in pores forming a gradient structure in the matrix, the number, geometry and orientation of internal thermal conductors, the arrangement of the outer walls around the matrix, the presence of ports in the outer walls, the presence of inner walls arranged between the two matrices, the shape of the heat sink integrated with the matrix, etc. Furthermore, the target parameters may include manufacturing conditions such as printing parameters, including laser power, printing speed, printing direction, printing angle, printing ray, printing orientation, etc.

[0113] At 1906, the method 1900 includes printing a modified backing according to target parameters. Optionally, at 1908, at least one filler may be added to one or more substrates of the modified backing. For example, the filler may be a fluid that can be injected into the substrate through a port in the outer wall or a port in a heat sink. Alternatively, the filler may be incorporated into the additive backing substrate using a vacuum impregnation process with a separate mold. In some embodiments, one or more fillers may be additively manufactured into the substrate simultaneously with the additive manufacturing of the backing substrate.

[0114] Figure 20 A modified backing 2000 is shown, made using a variety of different materials with different acoustic properties. The modified backing 2000 is manufactured using a variety of different materials via additive manufacturing. Figure 20A modified porous matrix 2002 of the backing 2000 is depicted. The porous matrix 2002 is formed of a main material 2004 (e.g., a matrix acoustic material). One or more auxiliary materials 2006 (e.g., auxiliary sound scattering materials) are distributed throughout the porous matrix 2002, wherein the acoustic impedance of the one or more auxiliary materials 2006 differs from that of the main material 2004. The main material 2004 is an acoustic material configured to attenuate sound energy, and the one or more auxiliary materials 2006 are configured to increase scattering to enhance the attenuation of sound energy. One or more materials 2004, 2006 can be added to the printing powder while maintaining the chemical and structural form / shape / composition. For example, using laser powder bed melting technology, only the matrix material (i.e., the main material 2004) can be processed (e.g., laser melting), while one or more auxiliary materials 2006 may be distributed homogeneously or heterogeneously in the final printed part. The auxiliary materials 2006 may be embedded in the matrix structure or retained in the powder mixture and become part of the lattice structure voids.

[0115] Figure 21 A modified backing 2100 is shown, made using a variety of different materials with different mechanical properties. The modified backing 2100 is manufactured using additive manufacturing with a variety of different materials. Figure 21 A modified porous matrix 2102 of the backing 2100 is depicted. The porous matrix 2102 is formed of a primary material 2104 (e.g., a matrix acoustic material). One or more auxiliary materials 2106 (e.g., structural materials) are distributed within or around the porous matrix 2102, wherein the auxiliary materials 2106 have higher strength than the primary material 2104. The primary material 2104 is an acoustic material configured to attenuate acoustic energy. The one or more auxiliary materials 2106 are configured to enhance the mechanical strength of the backing 2100. Some transducer fabrication processes require the ability to withstand high lamination pressures. The one or more auxiliary materials 2106 provide higher mechanical strength and structure. As depicted, the one or more auxiliary materials 2106 form a mechanical structure 2108 (e.g., a serrated structure) within the porous matrix 2102. Moreover, as depicted, the one or more auxiliary materials 2106 form a mechanical structure 2110 disposed around the porous matrix 2102 (e.g., disposed along a portion of the periphery 2112 of the porous matrix 2102). The number, shape, and size of mechanical structures can vary.

[0116] Figure 22 A modified backing 2200 is shown, made using a variety of different materials with different thermal properties. The modified backing 2200 is manufactured using additive manufacturing with a variety of different materials. Figure 22A porous matrix 2202 of a modified backing 2200 is depicted. The porous matrix 2202 is formed of a primary material 2204 (e.g., a matrix acoustic material). One or more auxiliary materials 2206 (e.g., a high thermal conductivity material) are distributed around the porous matrix 2202, wherein the auxiliary materials 2206 have a higher thermal conductivity than the primary material 2204 (e.g., 100 W / m·K to 400 W / m·K). The primary material 2204 is an acoustic material configured to attenuate sound energy. The one or more auxiliary materials 2206 are configured to enhance the thermal properties of the backing 2200. As depicted, the one or more auxiliary materials 2206 form a thermal management structure 2208 disposed along a portion of the periphery 2210 of the porous matrix 2202. The thermal management structure 2208 is configured to transport heat to an additional thermal management structure (as indicated by arrow 2212) around the periphery 2210 of the backing 2200. The location, length, and arrangement of the thermal management structure can vary.

[0117] Figure 23 A modified backing 2300 is shown, fabricated using a variety of different materials to form a gradient structure. The modified backing 2300 is fabricated using a variety of different materials via additive manufacturing. Figure 23 A porous matrix 2302 of a modified backing 2300 is depicted. The porous matrix 2302 is formed of gradient structures 2304, which vary relative to each other in both acoustic and thermal properties. As depicted, the porous matrix 2302 includes three gradient structures 2304 (e.g., gradient structures 2306, 2308, and 2310). The number, size, arrangement, and properties of the gradient structures 2304 can vary. For example, gradient structure 2306 may be formed of a first material (e.g., a main material, such as a matrix acoustic material). Gradient structure 2308 may be formed of a mixture of the first and second materials (e.g., an auxiliary material having a higher thermal conductivity than the first material). Gradient 2310 may be formed of a second material. Thus, gradient structure 2306 may be more configured to attenuate acoustic energy, gradient structure 2310 may be more configured to improve thermal performance, and gradient structure 2308 may fall between gradient structures 2306 and 2310 in both acoustic energy attenuation and thermal performance.

[0118] Figure 24 A modified backing 2400 with mechanical features, made using a variety of different materials, is shown. The modified backing 2400 is manufactured using additive manufacturing with a variety of different materials. Figure 24 A porous matrix 2402 of the modified backing 2400 is depicted. The porous matrix 2402 is formed of a main material 2404 (e.g., a matrix acoustic material). The main material 2404 is an acoustic material configured to attenuate sound energy. One or more auxiliary materials 2406 form one or more mechanical features 2408 within the porous matrix 2402. Figure 24As shown, two mechanical features 2408 are disposed within the porous matrix 2402. The mechanical features 2408 are configured to interface with fasteners 2410 to couple the porous matrix 2402 to the support structure 2412.

[0119] Figure 25 A modified backing 2500, made from a variety of different materials and coupled to the support structure 2501, is shown. The modified backing 2500 is fabricated using a variety of different materials via additive manufacturing. Figure 25 A modified porous matrix 2502 of the backing 2500 is depicted. The porous matrix 2502 is formed of a main material 2504 (e.g., a matrix acoustic material). The main material 2504 is an acoustic material configured to attenuate sound energy. One or more auxiliary materials 2506 form a support structure 2501 coupled to the porous matrix 2502, which is additively manufactured (e.g., simultaneously with the porous matrix 2502).

[0120] Figure 26 A modified backing 2600 is shown, which is made using a variety of different materials (e.g., including one or more fillers). The modified backing 2600 is made using a variety of different materials via additive manufacturing. Figure 26 A portion of the porous matrix 2602 of the modified backing 2600 is depicted. The porous matrix 2602 is formed of a primary material 2604 (e.g., a matrix acoustic material). The primary material 2604 is an acoustic material configured to attenuate sound energy. One or more auxiliary materials 2606 form a filler 2608, which is additively manufactured within the pores of the porous matrix 2602 (e.g., simultaneously with the porous matrix 2602). The filler 2608 may be as described above (e.g., in...). Figure 17 Any type of packing as described in ( ).

[0121] The technical advantage of additive manufacturing for modified backings of transducer probes is that the acoustic attenuation and thermal management provided by the modified backing can be increased and / or modified depending on the intended use.

[0122] Figures 1 to 16An example configuration for the relative positioning of the various components is shown. In at least one example, if such components are shown to be in direct contact or directly coupled to each other, they may be referred to as being in direct contact or directly coupled, respectively. Similarly, in at least one example, components shown to be adjacent to each other may be referred to as being adjacent to each other, respectively. For example, components placed in coplanar contact with each other may be referred to as being in coplanar contact. As another example, in at least one example, components positioned to be spaced apart from each other and having only space between them without other components may be described and referenced as such. As yet another example, components shown to be above / below each other, on opposite sides of each other, or on the left / right side of each other may be described and referenced relative to each other. Furthermore, as shown, in at least one example, the topmost component or the point of the component may be referred to as the “top” of the component, and the bottommost component or the point of the component may be referred to as the “bottom” of the component. As used herein, top / bottom, upper / lower, above / below may be relative to the vertical axis of the figure and may be used to describe the position of the components in the figure relative to each other. Therefore, in one example, an element shown above other elements is vertically positioned above them. Similarly, the shapes of the elements depicted in the figures can be described as having those shapes (e.g., circular, straight, planar, curved, rounded, chamfered, angled, etc.). Furthermore, in at least one example, elements shown intersecting each other can be described as intersecting elements or intersecting with each other. Additionally, in one example, an element shown as being inside or outside another element can be described and referred to as such.

[0123] As used herein, elements or steps listed in the singular and beginning with the word "a" or "an" should be understood to not exclude a plurality of said elements or steps unless such exclusion is explicitly stated. Furthermore, references to "an embodiment" of the invention are not intended to be construed as excluding the existence of additional embodiments that also include the referenced features. Moreover, unless explicitly stated to the contrary, embodiments that "comprise," "include," or "have" elements or multiple elements having a particular characteristic may include additional such elements that do not have that characteristic. The terms "comprise" and "in" are used as concise linguistic equivalents to the corresponding terms "comprising" and "wherein." Furthermore, the terms "first," "second," and "third," etc., are used merely as notations and are not intended to impose numerical requirements or a particular order of position on their objects.

[0124] This disclosure also provides support for a probe comprising: an additively manufactured backing having a porous matrix and one or more thermal management structures, the porous matrix being at least partially filled with at least one filler, wherein the additively manufactured backing attenuates acoustic energy and allows heat to be transferred from the front of the probe to the rear of the probe. In a first example of the system, the porous matrix has a heterogeneous structure, and wherein the uniformity, size, shape, and spacing of the pores in the porous matrix are modified by varying one or more of the laser pass power, printing speed, printing direction, printing angle, print ray, and print orientation during the fabrication of the porous matrix. In a second example of the system, optionally including the first example, the at least one filler comprises one or more of a lossy epoxy resin, silicone, scattering particles, and a phase change material, and wherein the at least one filler modifies one or more of the acoustic attenuation and thermal conductivity of the porous matrix. In a third example of the system, one or both of the first and second examples are optionally included, wherein the phase change material transitions between a solid and a liquid state, and wherein the phase change temperature of the phase change material is in the range of 30°C to 50°C. In a fourth example of the system, one or more of the first to third examples are optionally included, wherein the one or more thermal management structures include pores in the porous matrix, and wherein changing one or more of the pore shape, pore size, pore density, and total porosity of the porous matrix alters the thermal conductivity of the porous matrix. In a fifth example of the system, one or more of the first to fourth examples are optionally included, wherein the one or more thermal management structures include at least one support structure continuous and adjacent to the porous matrix, and wherein the at least one support structure and the porous matrix form a single integrated unit. In a sixth example of the system, one or more of the first to fifth examples are optionally included, wherein the at least one support structure includes one or more of an outer wall, internal inclusions, and a heat sink, and wherein the at least one support structure is formed of a material having high thermal conductivity. In a seventh example of the system, one or more or each of the first to sixth examples is optionally included, wherein the internal inclusion is embedded in the porous matrix, and wherein the internal inclusion modifies both the acoustic attenuation and thermal conductivity of the porous matrix. In an eighth example of the system, one or more or each of the first to seventh examples is optionally included, wherein the porous matrix is ​​formed of one or more of aluminum, aluminum nitride, copper, titanium, tungsten, metal alloys, and stainless steel. In a ninth example of the system, one or more or each of the first to eighth examples is optionally included, wherein the additively manufactured backing is formed to a near-net-shape, and wherein when the additively manufactured backing is formed to the near-net-shape, the machining and / or grinding of the additively manufactured backing is minimized to achieve the final net shape.

[0125] This disclosure also provides support for a method of manufacturing a transducer probe, the method comprising: additively manufacturing a backing having a heterogeneous structure for the transducer probe, the backing having at least one structural element providing one or more of a target acoustic attenuation and a target thermal conductivity. In a first example of the method, the target acoustic attenuation is at least 10 dB / mm at 3 MHz, and the target thermal conductivity is at least 20 W / m·K. In a second example of the method, optionally including the first example, the target thermal conductivity is at least 40 W / m·K. In a third example of the method, optionally including one or both of the first and second examples, wherein when the at least one structural element provides the target thermal conductivity, the at least one structural element includes ports for filling and / or venting a porous matrix of the backing. In a fourth example of the method, one or more or each of the first to third examples is optionally included, wherein the at least one structural element includes pores in the porous matrix of the backing, an outer wall continuously coupled to the porous matrix, one or more internal inclusions embedded in the porous matrix, and a heat sink continuously coupled to the outer wall and at least one of the porous matrix. In a fifth example of the method, one or more or each of the first to fourth examples is optionally included, wherein the outer wall at least partially surrounds the porous matrix and transfers heat around the porous matrix. In a sixth example of the method, one or more or each of the first to fifth examples is optionally included, wherein the one or more internal inclusions extend through the porous matrix along the signal propagation direction, and wherein changing the geometry, density, material, and orientation of the one or more internal inclusions modifies the acoustic attenuation and thermal conductivity of the porous matrix.

[0126] This disclosure also provides support for a transducer probe comprising: a piezoelectric or MEMS layer for generating an acoustic signal; and a backing disposed beneath the piezoelectric or MEMS layer relative to the signal propagation direction and additively manufactured to a near-net-shape, the near-net-shape excluding subsequent machining or grinding to achieve a net shape, wherein at least one structural element mitigates one or more of the acoustic attenuation and thermal conductivity of the backing. In a first example of the system, the backing is additively manufactured with at least one internal cooling channel through which coolant flows. In a second example of the system, optionally including the first example, the backing is a single continuous unit comprising an attenuation domain, a heat storage domain, and a solid heat sink domain.

[0127] This disclosure also provides support for a probe comprising: an additively manufactured backing having: a porous matrix at least partially filled with at least one filler; and one or more thermal management structures, wherein the additively manufactured backing is configured to attenuate acoustic energy and to allow heat to be transferred from a front portion of the probe to a rear portion of the probe, and wherein at least a portion of the additively manufactured backing is additively manufactured using a variety of different materials with different acoustic properties, different thermal properties, or different mechanical properties. In a first example of the system, the additively manufactured backing is additively manufactured using a primary material forming the porous matrix and one or more auxiliary materials distributed throughout the porous matrix, wherein the acoustic impedance of the one or more auxiliary materials is different from that of the primary material. In a second example of the system, optionally including the first example, the primary material is an acoustic material configured to attenuate the acoustic energy, and the one or more auxiliary materials are configured to increase scattering to enhance the attenuation of the acoustic energy. In a third example of the system, optionally including one or both of the first and second examples, the additively manufactured backing is additively manufactured using a main material forming the porous matrix and one or more auxiliary materials distributed within or around the porous matrix, wherein the one or more auxiliary materials have higher strength than the main material. In a fourth example, optionally including one or more or each of the first to third examples, the one or more auxiliary materials form a mechanical structure within the porous matrix. In a fifth example, optionally including one or more or each of the first to fourth examples, the additively manufactured backing is additively manufactured using a main material forming the porous matrix and one or more auxiliary materials distributed within or around the porous matrix, wherein the one or more auxiliary materials have higher thermal conductivity than the main material. In a sixth example, optionally including one or more or each of the first to fifth examples, the one or more auxiliary materials form a structure disposed around at least a portion of the periphery of the porous matrix. In the seventh example, one or more or each of the first to sixth examples is optionally included, wherein the main material and the one or more auxiliary materials form a gradient structure that continuously varies relative to each other in both acoustic and thermal properties. In the eighth example, one or more or each of the first to seventh examples is optionally included, wherein the additively manufactured backing is additively manufactured using a main material forming the porous matrix and one or more auxiliary materials forming one or more mechanical features within the porous matrix, wherein the one or more mechanical features are configured to interface with fasteners to couple the porous matrix to a support structure. In the ninth example, one or more or each of the first to eighth examples is optionally included, wherein the additively manufactured backing is additively manufactured using a main material forming the porous matrix and one or more auxiliary materials forming a support structure coupled to the porous matrix.In the tenth example, optionally including one or more or each of the first to ninth examples, the additively manufactured backing is additively manufactured using a primary material forming the porous matrix and one or more auxiliary materials forming the at least one filler, wherein the porous matrix and the at least one filler are additively manufactured simultaneously.

[0128] This disclosure also provides support for a method for manufacturing a transducer probe, the method comprising: additively manufacturing a backing for the transducer probe using multiple different materials having different acoustic properties, different thermal properties, or different mechanical properties, the backing having a porous matrix and one or more thermal management structures, wherein the backing is configured to attenuate acoustic energy and to allow heat to be transferred from the front of the probe to the rear of the probe. In a first example of the method, the method further comprises mixing two or more powders together to form a powder mixture having the multiple different materials prior to additive manufacturing of the backing. In a second example of the method, optionally including the first example, the method further comprises using the mixture of two or more powders to manufacture a powder composite material having the multiple different materials prior to additive manufacturing of the backing. In a third example of the method, optionally including one or both of the first and second examples, the additive manufacturing of the backing is performed using a mixture of different powders having the multiple different materials, wherein the mixture of different powders includes a main powder forming the porous matrix and one or more auxiliary powders sacrificed during the additive manufacturing of the backing to form random pores within the porous matrix. In the fourth example, optionally including one or more or each of the first to third examples, the additive manufacturing of the backing utilizes a mixture of different powders having the multiple different materials, wherein during the additive manufacturing of the backing, two or more powders in the mixture of different powders chemically react with each other to form a new chemical composition. In the fifth example, optionally including one or more or each of the first to fourth examples, the backing is additively manufactured using a main material forming the porous matrix and one or more auxiliary materials distributed throughout the porous matrix, wherein the acoustic impedance of the one or more auxiliary materials differs from that of the main material. In the sixth example, optionally including one or more or each of the first to fifth examples, the backing is additively manufactured using a main material forming the porous matrix and one or more auxiliary materials distributed within the porous matrix, wherein the one or more auxiliary materials have a higher strength than the main material. In the seventh example, one or more or each of the first to sixth examples may be optionally included, wherein the backing is additively manufactured using a primary material forming the porous matrix and one or more auxiliary materials distributed within or around the porous matrix, wherein the one or more auxiliary materials have a higher thermal conductivity than the primary material.

[0129] This disclosure also provides support for a transducer probe comprising: a piezoelectric or MEMS layer for generating an acoustic signal; and a backing disposed beneath the piezoelectric or MEMS layer relative to the signal propagation direction, wherein the backing is additively manufactured to a near-net-shape, the near-net-shape excluding subsequent machining or grinding to achieve a net shape, wherein at least one structural element mitigates one or more of the acoustic attenuation and thermal conductivity of the backing, and wherein at least a portion of the backing is additively manufactured using a variety of different materials with different acoustic properties, different thermal properties, or different mechanical properties.

[0130] This written description uses examples to disclose the invention, including the best mode, and also enables those skilled in the art to practice the invention, including making and using any device or system and performing any included methods. The scope of patentability of the invention is defined by the claims, but may include other examples that would occur to those skilled in the art. Such other examples are intended to fall within the scope of the claims if they have structural elements that are not indistinguishable from the literal language of the claims, or if they include equivalent structural elements that have minor differences from the literal language of the claims.

Claims

1. A probe comprising: an additively manufactured backing having a porous matrix at least partially filled with at least one filler material; and one or more thermal management structures, wherein the additively manufactured backing is configured to attenuate acoustic energy and enable heat transfer from a front portion of the probe to a rear portion of the probe, and wherein at least a portion of the additively manufactured backing is additively manufactured with a plurality of different materials having different acoustic properties, different thermal properties, or different mechanical properties.

2. The probe of claim 1, wherein the additively manufactured backing is additively manufactured with a primary material forming the porous matrix and one or more secondary materials distributed throughout the porous matrix, wherein the one or more secondary materials have a different acoustic impedance than the primary material.

3. The probe of claim 2, wherein the primary material is an acoustic material configured to attenuate the acoustic energy, and the one or more secondary materials are configured to increase scattering to enhance attenuation of the acoustic energy.

4. The probe of claim 1, wherein the additively manufactured backing is additively manufactured with a primary material forming the porous matrix and one or more secondary materials distributed within or around the porous matrix, wherein the one or more secondary materials have a higher strength than the primary material.

5. The probe of claim 4, wherein the one or more secondary materials form a mechanical structure within the porous matrix.

6. The probe of claim 1, wherein the additively manufactured backing is additively manufactured with a primary material forming the porous matrix and one or more secondary materials distributed within or around the porous matrix, wherein the one or more secondary materials have a higher thermal conductivity than the primary material.

7. The probe of claim 6, wherein the one or more secondary materials form a structure disposed around at least a portion of a perimeter of the porous matrix.

8. The probe of claim 6, wherein the primary material and the one or more secondary materials form a gradient structure that continuously varies with respect to each other in both acoustic properties and thermal properties.

9. The probe of claim 1, wherein the additively manufactured backing is additively manufactured with a primary material forming the porous matrix and one or more secondary materials forming one or more mechanical features within the porous matrix, wherein the one or more mechanical features are configured to engage with a fastener to couple the porous matrix to a support structure.

10. The probe of claim 1, wherein the additively manufactured backing is additively manufactured with a primary material forming the porous matrix and one or more secondary materials forming a support structure coupled to the porous matrix.

11. The probe of claim 1, wherein the additively manufactured backing is additively manufactured with a primary material forming the porous matrix and one or more secondary materials forming the at least one filler material, wherein the porous matrix and the at least one filler material are additively manufactured simultaneously.

12. A method for manufacturing a transducer probe, the method comprising: additively manufacturing a backing for the transducer probe with a plurality of different materials having different acoustic properties, different thermal properties, or different mechanical properties, the backing having a porous matrix and one or more thermal management structures, wherein the backing is configured to attenuate acoustic energy and enable heat to be transferred from a front portion of the probe to a back portion of the probe.

13. The method of claim 12, further comprising mixing two or more powders together to form a powder mixture having the plurality of different materials prior to additively manufacturing the backing.

14. The method of claim 12, further comprising manufacturing a powder composite material with a mixture of two or more powders prior to additively manufacturing the backing, wherein the powder composite material has the plurality of different materials.

15. The method of claim 12, wherein the addititive manufacturing of the backing is performed with a mixture of different powders having the plurality of different materials, wherein the mixture of different powders includes a primary powder that forms the porous matrix and one or more secondary powders that are sacrificed during the additively manufacturing of the backing to form random pores within the porous matrix.

16. The method of claim 12, wherein the additively manufacturing of the backing is performed with a mixture of different powders having the plurality of different materials, wherein two or more powders in the mixture of different powders chemically react with each other during the additively manufacturing of the backing, thereby forming a new chemical composition.

17. The method of claim 12, wherein the backing is additively manufactured with a primary material that forms the porous matrix and one or more secondary materials distributed throughout the porous matrix, wherein the one or more secondary materials have a different acoustic impedance than the primary material.

18. The method of claim 12, wherein the backing is additively manufactured with a primary material that forms the porous matrix and one or more secondary materials distributed within the porous matrix, wherein the one or more secondary materials have a higher strength than the primary material.

19. The method of claim 12, wherein the backing is additively manufactured with a primary material that forms the porous matrix and one or more secondary materials distributed within or around the porous matrix, wherein the one or more secondary materials have a higher thermal conductivity than the primary material.

20. A transducer probe, the transducer probe comprising: a piezoelectric or microelectromechanical system (MEMS) layer for generating acoustic signals; and a backing arranged below the piezoelectric or MEMS layer with respect to a signal propagation direction, wherein the backing is additively manufactured in a near-net shape, which excludes subsequent machining or grinding to achieve a net shape, wherein at least one structural element moderates one or more of an acoustic attenuation and a thermal conductivity of the backing, and wherein at least a portion of the backing is additively manufactured with a plurality of different materials having different acoustic properties, different thermal properties, or different mechanical properties.

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