Cover window, display device, and electronic apparatus

Abstract

The invention discloses a cover window, a display device, and an electronic apparatus. The cover window includes: a base layer; the anti-reflection layer is arranged on the base body layer; and a nitrogen-containing layer disposed on the anti-reflection layer. The anti-reflection layer includes a high refractive index layer and a low refractive index layer disposed on the high refractive index layer. The nitrogen-containing layer has a thickness in the range of about 0.5 nm to about 5 nm, including about 0.5 nm and about 5 nm. Accordingly, the cover window may have improved hardness and scratch resistance while exhibiting excellent reflectance.

Description

Cross-references to related applications

[0001] This patent application claims priority to Korean Patent Application No. 10-2024-0121275, filed on September 6, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a cover window, and more specifically, to a cover window including a nitrogen-containing layer, a display device including the cover window, and an electronic device including the display device. Background Technology

[0003] Various electronic devices such as televisions, mobile phones, tablet computers, and portable game consoles are under development. These devices include display panels that generate images and detect input in the case of touch-sensitive display panels. Display panels generally consist of multiple different layers, each with a different refractive index, to improve display quality. Layers with low refractive indices can improve display quality by reducing reflectivity; however, such layers can be relatively soft and therefore may be prone to scratches. Summary of the Invention

[0004] A cover window includes: a substrate layer; an anti-reflective layer disposed on the substrate layer and including a high refractive index layer and a low refractive index layer disposed on the high refractive index layer; and a nitrogen-containing layer disposed on the anti-reflective layer and having a thickness in the range of about 0.5 nm to about 5 nm (inclusive).

[0005] The refractive index of a nitrogen-containing layer can be greater than that of a low-refractive-index layer.

[0006] The refractive index of a nitrogen-containing layer can be lower than that of a high-refractive-index layer.

[0007] The nitrogen-containing layer can be directly applied to the low-refractive-index layer.

[0008] The thickness of the nitrogen-containing layer can be less than the thickness of the high-refractive-index layer and the low-refractive-index layer.

[0009] The low refractive index layer may include at least one of silicon oxide, aluminum oxide, and silicon oxynitride.

[0010] Nitrogen in the nitrogen-containing layer can be chemically bonded to the material of the low-refractive-index layer.

[0011] The cover window may also include a functional layer disposed on the nitrogen-containing layer. The functional layer may include at least one of an antistatic agent, a hard coating agent, and an anti-fingerprint agent.

[0012] The thickness of the nitrogen-containing layer can be less than the thickness of the functional layer.

[0013] Multiple high-refractive-index layers and multiple low-refractive-index layers can be provided, and components of multiple high-refractive-index layers and components of multiple low-refractive-index layers can be arranged alternately relative to each other.

[0014] A display device includes: a display panel including a light-emitting element; and a cover window disposed on the display panel. The cover window includes: a substrate layer, an anti-reflective layer disposed on the substrate layer and including a high refractive index layer and a low refractive index layer disposed on the high refractive index layer; and a nitrogen-containing layer disposed on the anti-reflective layer and having a thickness in the range of about 0.5 nm to about 5 nm (inclusive).

[0015] The refractive index of a nitrogen-containing layer can be greater than that of a low-refractive-index layer.

[0016] The refractive index of a nitrogen-containing layer can be lower than that of a high-refractive-index layer.

[0017] The nitrogen-containing layer can be directly applied to the low-refractive-index layer.

[0018] The thickness of the nitrogen-containing layer can be less than the thickness of the high-refractive-index layer and the low-refractive-index layer.

[0019] The low refractive index layer may include at least one of silicon oxide, aluminum oxide, and silicon oxynitride.

[0020] The high-refractive-index layer and the low-refractive-index layer can each be provided in multiples, and the components of the multiple high-refractive-index layers and the components of the multiple low-refractive-index layers can be arranged alternately relative to each other.

[0021] The light-emitting element may include a first electrode, a second electrode disposed on the first electrode, and a light-emitting layer disposed between the first electrode and the second electrode.

[0022] An electronic device includes: a display device having a module region defined within the display device; and an electronic module disposed in the module region. The display device includes a display panel comprising a light-emitting element and a cover window disposed on the display panel. The cover window includes: a substrate layer; an anti-reflective layer disposed on the substrate layer and comprising a high-refractive-index layer and a low-refractive-index layer disposed on the high-refractive-index layer; and a nitrogen-containing layer disposed on the anti-reflective layer and having a thickness in the range of about 0.5 nm to about 5 nm (inclusive).

[0023] The refractive index of a nitrogen-containing layer can be greater than that of a low-refractive-index layer, but less than that of a high-refractive-index layer.

[0024] The nitrogen-containing layer can be directly applied to the low-refractive-index layer.

[0025] The low refractive index layer may include at least one of silicon oxide, aluminum oxide, and silicon oxynitride.

[0026] The thickness of the nitrogen-containing layer can be less than either the thickness of the high-refractive-index layer or the thickness of the low-refractive-index layer. Attached Figure Description

[0027] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0028] Figure 1 This is a perspective view showing an electronic device according to an embodiment;

[0029] Figure 2 This is an exploded perspective view showing an electronic device according to an embodiment;

[0030] Figure 3 It shows along Figure 2 A cross-sectional view of the portion intercepted by line I-I';

[0031] Figure 4 This is a cross-sectional view showing a portion of an electronic device according to an embodiment;

[0032] Figure 5 This is a cross-sectional view showing a portion of an electronic device according to an embodiment;

[0033] Figure 6A This is a perspective view showing an electronic device according to an embodiment;

[0034] Figure 6B This is a perspective view showing an electronic device according to an embodiment;

[0035] Figure 6C This is a plan view illustrating an electronic device according to an embodiment;

[0036] Figure 6D This is a perspective view showing an electronic device according to an embodiment;

[0037] Figure 7 This is an exploded perspective view showing an electronic device according to an embodiment;

[0038] Figure 8 A diagram illustrating an electronic device according to an embodiment of the present invention; and

[0039] Figure 9 This is a view illustrating an electronic device according to various embodiments. Detailed Implementation

[0040] The inventive concept can be implemented in various modifications and has various forms, and specific embodiments are shown in the accompanying drawings and described in detail in the text. However, it should be understood that the inventive concept is not necessarily intended to be limited to the specific forms disclosed, and is intended to cover all modifications, equivalents, and substitutions falling within the spirit and scope of the inventive concept.

[0041] In this specification, it will be understood that when an element (or region, layer, or portion, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element, the element may be directly disposed on / directly connected to / directly coupled to the other element, or an intermediary element may be disposed between the element and the other element.

[0042] When an element is said to be "about" equal to a specific value, this can mean that the element is within 10% of that value, within 5% of that value, within 2% of that value, within 1% of that value, or within 0.1% of that value.

[0043] Throughout the specification and drawings, the same reference numerals or symbols may refer to the same elements. Although each drawing may represent one or more specific embodiments of the present disclosure and is drawn to scale so that relative lengths, thicknesses, and angles can be inferred from them, it should be understood that the invention is not necessarily limited to the relative lengths, thicknesses, and angles shown. These values ​​may be varied within the spirit and scope of the present disclosure, for example, to allow for manufacturing limitations, etc. The term "and / or" includes all combinations of one or more of the associated listed elements.

[0044] Although the terms first, second, etc., can be used to describe various elements, these elements should not necessarily be limited by these terms. These terms are used to distinguish one element from another. For example, without departing from the scope of the inventive concept, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element. Unless the context clearly indicates otherwise, the singular form also includes the plural form.

[0045] Furthermore, terms such as “below,” “down,” “above,” and “above” can be used to describe the relationship between one element and another shown in the accompanying drawings. It will be understood that these terms are relative and are described based on the orientation depicted in the drawings.

[0046] It will be understood that, when used in this specification, the terms “comprising” or “including” indicate the presence of the stated features, integrals, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof.

[0047] In the following description, embodiments of a cover window, a display device including a cover window, and an electronic device including a display device according to the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing an electronic device according to an embodiment. Figure 2 This is an exploded perspective view of an electronic device according to an embodiment.

[0048] According to the embodiments Figure 1 The electronic device EA shown can be activated in response to an electrical signal. For example, the electronic device EA can be a personal computer, laptop computer, personal digital terminal, portable game console, portable electronic device, television, computer monitor, outdoor digital billboard, car navigation unit, or wearable device, but the examples of the inventive concept are not necessarily limited thereto. Figure 1 An electronic device EA, which is a smartphone, is shown as an example.

[0049] An electronic device EA may include a display surface ES defined by a first directional axis DR1 and a second directional axis DR2 intersecting the first directional axis DR1. The electronic device EA can provide an image IM to a user through the display surface ES. The electronic device EA can display the image IM on the display surface ES defined by the first directional axis DR1 and the second directional axis DR2 in the direction of a third directional axis DR3. The image IM can be not only a moving image but also a static image.

[0050] The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 shown herein are relative and can therefore be changed to other directions. Furthermore, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first direction, the second direction, and the third direction, respectively, and may be represented by the same reference numerals or symbols.

[0051] In this specification, the first direction axis DR1 is perpendicular to the second direction axis DR2, and the third direction axis DR3 can be the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the electronic device EA can be the direction of the third direction axis DR3. The same reference numerals or symbols can be used for the thickness direction of the electronic device EA and the third direction axis DR3. The front surface (or upper surface) and the rear surface (or lower surface) can be opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) can be the direction of the third direction axis DR3. The front surface (or upper surface) is referred to as the surface adjacent to the display surface ES, and the rear surface (or lower surface) is referred to as the surface spaced apart from the display surface ES. In addition, the rear surface (or lower surface) is referred to as the surface adjacent to the second display surface RS, which will be described later (see Figure 6AAdjacent surfaces. The upper side is referred to as the direction that gets closer to the display surface ES, and the lower side is referred to as the direction that gets further away from the display surface ES.

[0052] In this specification, a cross section is referred to as a surface in the thickness direction DR3, and a plane is referred to as a surface perpendicular to the thickness direction DR3. The plane is referred to as a flat surface defined by a first directional axis DR1 and a second directional axis DR2.

[0053] An electronic device (EA) can detect external inputs. External inputs can include various types of inputs applied from outside the electronic device (EA). For example, external inputs can include not only touch applied by a part of the user's body (such as the user's hand), but also external inputs applied when the device is close to or adjacent to the electronic device (EA) within a predetermined distance (e.g., hovering). In addition, external inputs are not necessarily limited to touch inputs and can take various forms such as force (e.g., pressure), temperature, light, etc.

[0054] The display surface ES may include a display area DA, a non-display area NDA, and a sub-area MH. The display area DA can be activated in response to an electrical signal. The display area DA may be an area in which an image IM can be displayed and various types of external inputs can be detected.

[0055] The display area DA may include a flat surface defined by a first direction axis DR1 and a second direction axis DR2. The display area DA may also include a curved surface that bends from at least one side of the flat surface defined by the first direction axis DR1 and the second direction axis DR2. Figure 1 An electronic device EA according to an embodiment is shown, comprising two curved surfaces that bend from both sides of a flat surface defined by a first directional axis DR1 and a second directional axis DR2, respectively. However, this is presented as an example, and the shape of the display area DA is not necessarily limited thereto. For example, the display area DA may comprise only the flat surface defined by the first directional axis DR1 and the second directional axis DR2, and may also comprise more than two curved surfaces, for example, four curved surfaces that bend from all four sides of the flat surface defined by the first directional axis DR1 and the second directional axis DR2, respectively.

[0056] The electronic device EA according to an embodiment can be flexible. The term "flexible" means bendable and can include all fully foldable structures as well as structures that can be bent to the level of a few nanometers. For example, the electronic device EA can be a rigid device. Alternatively, the electronic device EA can be a foldable device.

[0057] The non-display area NDA can have a predetermined color. The non-display area NDA can be adjacent to the display area DA. The non-display area NDA can surround the display area DA. Therefore, the shape of the display area DA can be substantially defined by the non-display area NDA. However, this is presented as an example. The non-display area NDA can be adjacent to only one side of the display area DA, or the non-display area NDA can be omitted. The display area DA can have various shapes and is not necessarily limited to any one embodiment.

[0058] The sub-region MH can detect external objects received through the display surface ES, or provide sound signals such as speech through the display surface ES. Optical signals such as visible light or infrared light can be transmitted to the sub-region MH.

[0059] The sub-region MH can be set within the display area DA. However, this is shown as an example, and the arrangement of the sub-region MH is not necessarily limited to any one embodiment. For example, the sub-region MH can be surrounded not only by the non-display area NDA, but also by both the display area DA and the non-display area NDA. Figure 1 The example shows a subregion MH, but subregion MH can also be provided as multiple regions.

[0060] Various electronic modules (ELM) (see) Figure 2 ) can be set to correspond to the sub-region MH. For example, the electronic module ELM (see Figure 2 The device may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The electronic device EA may include an electronic module ELM (see [link to electronic module]). Figure 2 Electronic module ELM (see) Figure 2 External images are captured by using visible light that passes through the sub-region MH, or by using infrared light to determine if an external object is approaching. Electronic Module ELM (see...) Figure 2 It may also include multiple elements and is not necessarily limited to any one embodiment.

[0061] Reference Figure 2 The electronic device EA may include a display device DD and an electronic module ELM. The display device DD may include a display module DM and a cover window CW disposed on the display module DM. In addition, the electronic device EA may also include a housing HAU that houses the display module DM. In the display device DD, a module area DM-MH may be defined, and the electronic module ELM may be configured to correspond to the module area DM-MH.

[0062] exist Figure 1 and Figure 2In the electronic device EA shown, the cover window CW and the housing HAU can be coupled to form the exterior of the electronic device EA. The housing HAU can be disposed below the display module DM. The housing HAU can include materials with relatively high rigidity. For example, the housing HAU can include multiple frames and / or plates made of glass, plastic, or metal. The housing HAU can provide a predetermined receiving space. The display module DM can be housed within the receiving space and protected from impact.

[0063] The display module DM can be activated in response to an electrical signal. The display module DM can be activated to display the electronic device EA in the display area DA (see [link]). Figure 1 The image IM is displayed in (see) Figure 1 The active area DM-AA, the peripheral area DM-NAA, and the module area DM-MH can be defined in the display module DM.

[0064] The active region DM-AA can be activated in response to an electrical signal. A pixel PX can be disposed within the active region DM-AA. The pixel PX may include a transistor TR, which will be described later (see [link to transistor]). Figure 5 ) and light-emitting elements (ED) (see Figure 5 The peripheral region DM-NAA may be adjacent to at least one side of the active region DM-AA. Circuits, wires, etc., used to drive the active region DM-AA may be located in the peripheral region DM-NAA.

[0065] Module area DM-MH can correspond to Figure 1 The sub-region MH is shown in the diagram. Optical signals, such as visible light or infrared light, can be moved to the module region DM-MH. The module region DM-MH can be located within the active region DM-AA. The module region DM-MH can be surrounded not only by the peripheral region DM-NAA, but also by both the active region DM-AA and the peripheral region DM-NAA.

[0066] An electronic module (ELM) can be an electronic component that outputs or receives optical signals. An ELM may include a camera module and / or a proximity sensor. The camera module can capture external images via the module area DM-MH.

[0067] The display device DD may further include an optical layer disposed between the display module DM and the overlay window CW. The optical layer can be formed on the display module DM using a continuous process. The optical layer may include a polarizer or a color filter layer. For example, the optical layer may include at least one of a phase retarder, a polarizer, a polarizing film, and a polarizing filter. Alternatively, the optical layer may include a plurality of color filters arranged in a predetermined configuration. For example, the color filters may be arranged considering the emission color of the pixel PX. Additionally, the optical layer may also include a black matrix adjacent to the color filters.

[0068] The overlay window CW may include a transmissive region TA and a border region BZA. The transmissive region TA may overlap with at least a portion of the active region DM-AA of the display module DM. The transmissive region TA may be an optically transparent region. Image IM (see...) Figure 1 It can be provided to the user through the transmission area TA.

[0069] The border region BZA can be a region with lower light transmittance than the transmission region TA. The border region BZA can define the shape of the transmission region TA. The border region BZA can be adjacent to the transmission region TA and can surround the transmission region TA.

[0070] The border region BZA may have a predetermined color. The border region BZA may cover the peripheral region DM-NAA of the display module DM and prevent the peripheral region DM-NAA from being viewed from the outside. However, embodiments of the inventive concept are not necessarily limited to those shown in the accompanying drawings. The border region BZA may be configured to be adjacent to only one side of the transmissive region TA, and at least a portion of the border region BZA may be omitted.

[0071] Figure 3 It shows along Figure 2 A cross-sectional view of the portion intercepted by line I-I'. Figure 3 For ease of description, the outer shell HAU (see [link to Chinese text]) is omitted. Figure 2 ). Figure 3 It can be a cross-sectional view showing the components of the display device DD in detail.

[0072] Reference Figure 3 The display module DM may include a display panel DP and an input sensing element TP disposed on the display panel DP. The display panel DP can be configured to essentially generate images.

[0073] The display panel (DP) may include a substrate (BS), a circuit layer (DP-CL), a display element layer (DP-EL), and a packaging layer (TFE) stacked sequentially. Additional components may also be disposed between two adjacent layers of the substrate (BS), circuit layer (DP-CL), display element layer (DP-EL), and packaging layer (TFE).

[0074] The substrate BS can provide a substrate surface on which the circuit layer DP-CL is disposed. The substrate BS can be a flexible substrate that is bendable, foldable, rollable, etc. The substrate BS can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments of the present invention are not necessarily limited to these, and the substrate BS can include inorganic layers, organic layers, or composite material layers.

[0075] The circuit layer DP-CL can be disposed on the substrate BS. The circuit layer DP-CL may include insulating layers, semiconductor patterns, conductive patterns, signal lines, etc. The display element layer DP-EL can be disposed on the circuit layer DP-CL. The display element layer DP-EL may include light-emitting elements ED, which will be described later (see [link to documentation]). Figure 5 For example, light-emitting elements (ED) (see...) Figure 5 This can include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, or quantum rods. For example, light-emitting elements (EDs) (see...) Figure 5 This can include miniature light-emitting diodes (LEDs) or nano LEDs.

[0076] A TFE (Transmission Equipment) encapsulation layer can be disposed on the Display Element Layer (DP-EL). The TFE protects the DP-EL from moisture, oxygen, and foreign matter such as dust particles. The TFE may include at least one inorganic layer. For example, the TFE may include inorganic, organic, and inorganic layers stacked sequentially.

[0077] The input sensing component TP can be disposed on the display panel DP. Alternatively, the input sensing component TP can be directly disposed on the encapsulation layer TFE. Or, an adhesive can be used between the input sensing component TP and the display panel DP.

[0078] In this specification, when an element is referred to as being directly set / provided / formed on another element, there is no intermediary element between the element and the other element. For example, the phrase "element 'directly set / provided / formed on 'another element'" means that the element 'is in contact with 'another element'.

[0079] The input sensing component TP can detect external input, convert the detected external input into a predetermined input signal, and provide the input signal to the display panel DP. For example, the input sensing component TP can be a touch sensing component that detects touch. The input sensing component TP can recognize direct touch by the user, indirect touch by the user, direct touch by an object, indirect touch by an object, etc.

[0080] The input sensing component TP can detect at least one of the position and intensity (pressure) of a touch applied to it. In embodiments, the input sensing component TP can have various structures or be composed of various materials, but is not necessarily limited to any one embodiment. For example, the input sensing component TP can detect external input capacitively. The display panel DP can receive the input signal from the input sensing component TP and generate an image corresponding to the input signal.

[0081] The display device DD may further include an adhesive layer AP-C disposed between the display module DM and the cover window CW. The adhesive layer AP-C can bond the display module DM and the cover window CW to each other. The adhesive layer AP-C may include pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear resin (OCR). However, this is presented by way of example, and embodiments of the inventive concept are not necessarily limited thereto. The adhesive layer AP-C may also be omitted.

[0082] Figure 4 This is a cross-sectional view showing the cover window according to an embodiment. Figure 4 It can be shown in detail Figure 3 The diagram shows a cross-sectional view of the components of the cover window CW.

[0083] Reference Figure 4 The cover window CW may include a substrate layer BL, an anti-reflective layer RPL disposed on the substrate layer BL, and a nitrogen-containing layer NCL disposed on the anti-reflective layer RPL. Additionally, the cover window CW may also include a functional layer FL disposed on the nitrogen-containing layer NCL. The functional layer FL may be spaced apart from the anti-reflective layer RPL, and the nitrogen-containing layer NCL is disposed between the functional layer FL and the anti-reflective layer RPL.

[0084] The substrate layer BL can provide a substrate surface on which the anti-reflective layer RPL is disposed. The substrate layer BL can include glass or a polymer film. For example, the substrate layer BL can be a flexible polymer film. The substrate layer BL can include at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene-vinyl alcohol copolymer. However, this is presented by way of example, and the material of the substrate layer BL is not necessarily limited to these.

[0085] The anti-reflective layer RPL may include a high refractive index layer HL and a low refractive index layer WL disposed on the high refractive index layer HL. The high refractive index layer HL may be provided as multiple high refractive index layers HR1 to HR n The low-refractive-index layer WL can be provided as multiple low-refractive-index layers WR1 to WR n Here, n is an integer of 2 or greater. Multiple high refractive index layers HR1 to HR n The thicknesses of these layers can vary. Multiple low-refractive-index layers WR1 to WR n The thicknesses can vary from one another.

[0086] Includes multiple high refractive index layers HR1 to HR n and multiple low refractive index layers WR1 to WR nThe antireflective layer RPL can reduce reflectivity through destructive interference caused by the difference in refractive index. Therefore, the overlay window CW including the antireflective layer RPL exhibits low reflectivity, and thus can improve the display device DD (see [link to documentation]). Figure 3 Display quality. Multiple high refractive index layers HR1 to HR n and multiple low refractive index layers WR1 to WR n They can be set alternately. The nitrogen-containing layer (NCL) can be set in the nth low-refractive-index layer (WR). n For example, the high refractive index layer HL and the low refractive index layer WL can each be provided as two, three, or five layers.

[0087] The refractive index of the high refractive index layer HL can be in the range of about 1.7 to about 2.5 (inclusive). The high refractive index layer HL may include a silicon (Si) nitride. For example, the high refractive index layer HL may include silicon nitride (SiN). x It may be at least one of silicon aluminum nitride (SiAlN), aluminum nitride (AlN), germanium dioxide (GeO2), zirconium dioxide (ZrO2), and titanium dioxide (TiO2). However, this is presented by way of example, and the high refractive index layer HL may include any material with a high refractive index known in the art without limitation.

[0088] The refractive index of the low refractive index layer WL can be in the range of about 1.3 to about 1.6 (inclusive). The low refractive index layer WL may comprise an oxide containing silicon (Si) and / or an oxide containing aluminum (Al). For example, the low refractive index layer WL may comprise silicon oxide (SiO2). x The low refractive index layer (WL) may include at least one of aluminum oxide (Al2O3) and silicon oxynitride (SiON). However, this is presented by way of example, and the low refractive index layer (WL) may also include materials with low refractive indices known in the art.

[0089] The nitrogen-containing layer (NCL) can be deposited on the low-refractive-index layer (WL). Alternatively, the nitrogen-containing layer (NCL) can be directly deposited on the nth low-refractive-index layer (WR). n Above, the nth low refractive index layer WR n It is positioned on the top part of the anti-reflective layer RPL. The nitrogen-containing layer NCL can be formed by passing it through the nth low refractive index layer WR. n A layer formed by directly supplying nitrogen gas to the surface. This can be achieved through the WR layer at the nth low refractive index. n A nitrogen-containing layer (NCL) is formed by performing a nitrogen treatment on the surface. The nitrogen in the NCL can be chemically bonded to the nth low-refractive-index layer (WR). n The material. The nth low refractive index layer WR nThis can include materials that form chemical bonds with nitrogen. It can be achieved through a re-sputtering process by applying the material to the nth low-refractive-index layer (WR). n The surface provides plasma-state nitrogen to form a nitrogen-containing layer (NCL). The nitrogen-containing NCL can be formed by chemically bonding nitrogen to the nth low-refractive-index layer (WR). n Materials formed from materials. For example, a nitrogen-containing layer (NCL) may include silicon nitride and / or silicon oxynitride. Silicon nitride and silicon oxynitride may be formed by chemically bonding nitrogen to the nth low-refractive-index layer (WR). n Materials formed from silicon nitride and silicon oxynitride are materials that exhibit high hardness due to their microstructure, and components comprising silicon nitride and silicon oxynitride (e.g., nitrogen-containing NCL layers) can have a maximum hardness of approximately 24 GPa. Therefore, the low-refractive-index layer WR formed on the nth layer... n The nitrogen-containing NCL layer can increase the hardness of the anti-reflective layer RPL while maintaining excellent reflectivity.

[0090] As the reflectivity of the low-refractive-index layer decreases, the reflectivity of the anti-reflective layer improves, but its hardness and scratch resistance decrease. Materials with low refractive indices included in the low-refractive-index layer generally exhibit low hardness. The cover window CW according to an embodiment includes a nitrogen-containing layer NCL formed by performing a nitrogen treatment on the surface of the low-refractive-index layer WL, and therefore can exhibit excellent hardness and scratch resistance while maintaining excellent reflectivity.

[0091] In an embodiment, the nitrogen-containing layer NCL may have a thickness TH1 ranging from about 0.5 nm to about 5 nm (inclusive). The refractive index of the nitrogen-containing layer NCL may be greater than the refractive index of the low-refractive-index layer WL. The refractive index of the nitrogen-containing layer NCL may be greater than that of the nearest nth low-refractive-index layer WR. n The refractive index of the nitrogen-containing layer (NCL) can be less than that of the high-refractive-index layer (HL). The thickness (TH1) of the nitrogen-containing layer (NCL) can be less than that of the nth low-refractive-index layer (WR). n The thickness of TH2 and the nth high refractive index layer HR n The thickness TH3. The thickness TH1 of the nitrogen-containing NCL layer can be less than that of multiple low-refractive-index layers WR1 to WR. n The thickness of each of the nitrogen-containing NCL layers. The thickness TH1 of the nitrogen-containing NCL layer can be less than that of the multiple high-refractive-index layers HR1 to HR2. n The thickness of each layer is considered. The thickness TH1 of the nitrogen-containing layer NCL can be less than the thickness TH4 of the functional layer FL. Because the nitrogen-containing layer NCL has a relatively high refractive index, it can be formed with a thickness TH1 ranging from about 0.5 nm to about 5 nm (inclusive) without increasing reflectivity. Reflectivity increases when the layer disposed on the uppermost portion of the antireflective layer RPL has a relatively high refractive index and a relatively large thickness.

[0092] A nitrogen-containing layer with a thickness of less than about 0.5 nm can be considered extremely small, so the hardness and scratch resistance of the antireflective layer are not improved. A nitrogen-containing layer with a thickness greater than about 5 nm increases the reflectivity of the antireflective layer. Furthermore, a nitrogen-containing layer with a thickness greater than about 5 nm is not formed by processing the surface of a low-refractive-index layer, but rather by performing a deposition process. The refractive index of the nitrogen-containing layer is greater than that of the nearest nth low-refractive-index layer, and a large thickness (e.g., greater than about 5 nm) of the nitrogen-containing layer increases reflectivity. The nitrogen-containing layer NCL according to the embodiment has a thickness TH1 in the range of about 0.5 nm to about 5 nm (inclusive), and therefore can improve hardness and scratch resistance while maintaining excellent reflectivity. In the embodiment, the cover window CW including the nitrogen-containing layer NCL can achieve improved hardness and scratch resistance while exhibiting excellent reflectivity. The cover window CW according to the embodiment can exhibit excellent reliability.

[0093] The functional layer FL may include a polymer film. The functional layer FL may include at least one of an antistatic agent, a hard coating agent, and an anti-fingerprint agent. For example, the functional layer FL may include perfluoropolyether (PFPE). The functional layer FL may also be omitted.

[0094] The cover window (CW) may also include an auxiliary layer between the substrate layer (BL) and the anti-reflective layer (RPL). The auxiliary layer can increase the bonding strength between the substrate layer (BL) and the anti-reflective layer (RPL) and enhance the mechanical properties of the cover window (CW) (e.g., abrasion resistance). For example, the auxiliary layer may include silicon oxide.

[0095] Table 1 below shows the evaluation results of the cover windows based on Comparative Example 1 and Example 1 and Example 2. The cover windows were evaluated using a spectrophotometer CM-3700A (a product of Konica Minolta).

[0096] In Table 1, Comparative Examples 1, 1, and 2 differ from each other in that they do not form a nitrogen-containing layer. In Comparative Example 1, no nitrogen-containing layer is formed in the overlay window, while in Examples 1 and 2, a nitrogen-containing layer is formed in the overlay window. The overlay window of Comparative Example 1 comprises a substrate layer, an auxiliary layer, an anti-reflective layer, and an anti-fingerprint layer stacked sequentially, and does not include a nitrogen-containing layer. The overlay window of each of Examples 1 and 2 comprises a substrate layer, an auxiliary layer, an anti-reflective layer, a nitrogen-containing layer, and an anti-fingerprint layer stacked sequentially. The overlay window of each of Examples 1 and 2 is an overlay window according to an embodiment.

[0097] Each of Examples 1 and 2 includes a cover window formed by supplying nitrogen to the surface of a sixth layer having a thickness of approximately 91 nm via a re-sputtering process, wherein the sixth layer is a low-refractive-index layer comprising a material having a low refractive index. Nitrogen is supplied to the cover window of Example 1 for approximately 1 minute, and to the cover window of Example 2 for approximately 2 minutes. In this case, the nitrogen-containing layer is formed as a very small layer with a thickness ranging from approximately 1 nm to approximately 3 nm (inclusive). The thickness of the nitrogen-containing layer formed as a very small layer can be determined using values ​​within a certain range.

[0098] In the cover window of each of Comparative Examples 1, 1, and 2, the auxiliary layer has a thickness of approximately 47 nm and comprises silicon oxide. In the cover window of each of Comparative Examples 1, 1, and 2, the anti-fingerprint layer has a thickness of approximately 10 nm.

[0099] In the overlay window of each of Comparative Examples 1, 2, and 3, the antireflective layer comprises a first to a sixth layer stacked sequentially, and the thicknesses of the first to sixth layers are approximately 21 nm, approximately 43 nm, approximately 56 nm, approximately 21 nm, approximately 161 nm, and approximately 91 nm, respectively. The first, third, and fifth layers comprise silicon nitride (SiN). x The high refractive index layer. The second, fourth, and sixth layers consist of silicon oxide (SiO2). x The low refractive index layer.

[0100] In Table 1, a* and b* indicate color coordinates, and represent the cross-sectional color coordinates. ΔE*ab represents the value calculated using the following formula. ΔE*ab=[(ΔL*) 2 +(Δa*) 2 +(Δb*) 2 ] 1 / 2 Formula (1)

[0101] In Table 1, the term "initial" refers to the value obtained before the vibration abrasion test was performed, and the term "later" refers to the value obtained after the vibration abrasion test was performed. In Table 1, R represents the reflectivity value, and ΔSCE represents the change in specular component excluded (SCE) reflectivity, for example, the difference between the SCE reflectivity before and after the vibration abrasion test. The vibration abrasion test was performed to confirm the level of improvement in scratch resistance.

[0102] Table 1]

[0103] Referring to Table 1, it can be seen that the ΔE*ab and ΔSCE values ​​of the cover windows in Examples 1 and 2 are smaller than those of the cover window in Comparative Example 1. ΔE*ab indicates a value related to the change in reflectivity and color in the worn area, and means that the larger the value, the higher the level of reflectivity and color change. ΔSCE indicates a value related to surface roughness, and means that the larger the value, the higher the degree of surface roughness and surface damage. Therefore, it can be seen that the cover windows in Examples 1 and 2 have low levels of reflectivity change, color change, and surface damage. As described above, in Comparative Example 1, no nitrogen-containing layer is formed in the cover window. The cover windows in each of Examples 1 and 2 include a nitrogen-containing layer formed by providing nitrogen to a sixth layer, which is the uppermost part of a low-refractive-index layer, and are cover windows according to embodiments. Therefore, it can be seen that the cover window including a nitrogen-containing layer according to embodiments can exhibit improved scratch resistance while maintaining excellent reflectivity.

[0104] Table 2 below shows the evaluation results of the cover windows according to Experimental Examples 1 through 4. The cover windows were evaluated using a spectrophotometer CM-3700A (a product of Konica Minolta).

[0105] The cover windows in Experimental Examples 1 through 4 were formed by depositing a layer comprising silicon oxynitride (SiON) on a sixth layer, which is a low-refractive-index layer, and differed in thickness and / or refractive index. In the following text, for ease of description, the layer comprising silicon oxynitride is referred to as the “deposited layer”.

[0106] In the cover window of Experimental Example 1, the deposited layer has a thickness of approximately 5 nm and a refractive index of approximately 1.60. In the cover window of Experimental Example 2, the deposited layer has a thickness of approximately 10 nm and a refractive index of approximately 1.60. In the cover window of Experimental Example 3, the deposited layer has a thickness of approximately 5 nm and a refractive index of approximately 1.71. In the cover window of Experimental Example 4, the deposited layer has a thickness of approximately 10 nm and a refractive index of approximately 1.71. In the cover window of each of Experimental Examples 1 to 4, the refractive index of the deposited layer is the refractive index of light with a wavelength of approximately 550 nm.

[0107] The cover windows of Experimental Example 1 and Experimental Example 2 consist of deposited layers with different thicknesses but the same refractive index. The cover windows of Experimental Example 3 and Experimental Example 4 consist of deposited layers with different thicknesses but the same refractive index. The cover windows of Experimental Example 1 and Experimental Example 3 consist of deposited layers with the same thickness but different refractive indices. The cover windows of Experimental Example 2 and Experimental Example 4 consist of deposited layers with the same thickness but different refractive indices.

[0108] The cover window of each of Experimental Examples 1 to 4 comprises a substrate layer, an auxiliary layer, an anti-reflective layer, and a deposited layer stacked sequentially. In the cover window of each of Experimental Examples 1 to 4, the auxiliary layer comprises silicon dioxide (SiO2) and has a thickness of approximately 47 nm.

[0109] In the cover window of each of Experimental Examples 1 to 4, the antireflective layer comprises a first to a sixth layer stacked sequentially, with thicknesses of approximately 21 nm, 43 nm, 56 nm, 21 nm, and 161 nm, respectively. Each of the sixth layers in Experimental Examples 1 and 3 has a thickness of approximately 86 nm. Each of the sixth layers in Experimental Examples 2 and 4 has a thickness of approximately 81 nm. In Experimental Examples 1 to 4, the sum of the thickness of the deposited layers and the thickness of the sixth layer is the same, approximately 91 nm. The first, third, and fifth layers are high-refractive-index layers comprising Si3N4. The second, fourth, and sixth layers are low-refractive-index layers comprising SiO2.

[0110] In Table 2, R indicates the reflectance value, and a* and b* represent the color coordinates.

[0111] Table 2]

[0112] Referring to Table 2, it can be seen that the reflectivity of the cover window in Experimental Example 2 is increased compared to that of the cover window in Experimental Example 1. As described above, the cover windows in Experimental Example 1 and Experimental Example 2 differ from each other in the thickness of the deposited layer. It can be seen that the reflectivity increases in Experimental Example 2, which has a larger deposited layer. It can be seen that the reflectivity of the cover window in Experimental Example 4 is increased compared to that of the cover window in Experimental Example 3. As described above, the cover windows in Experimental Example 3 and Experimental Example 4 differ from each other in the thickness of the deposited layer. It can be seen that the reflectivity increases in Experimental Example 4, which has a larger deposited layer. Therefore, it can be seen that when a layer with a high refractive index and a large thickness is deposited on the uppermost portion of the low refractive index layer of the antireflective layer, the reflectivity increases. The nitrogen-containing layer according to the embodiment has a thickness in the range of about 0.5 nm to about 5 nm (inclusive), and is formed by re-sputtering nitrogen gas onto the uppermost surface of the low refractive index layer of the antireflective layer. Therefore, it can be seen that nitrogen-containing layers can exhibit improved scratch resistance while maintaining excellent reflectivity.

[0113] Figure 5 It is shown in detail Figure 3 The diagram shows a cross-sectional view of the display module. Figure 5 It can be a cross-sectional view showing the active region DM-AA of the display module DM in detail.

[0114] Reference Figure 5 The substrate BS may comprise a single layer or multiple layers. For example, the substrate BS may comprise a first synthetic resin layer, multiple or single-layer inorganic layers, or a second synthetic resin layer disposed on multiple or single-layer inorganic layers. The first and second synthetic resin layers may each comprise a polyimide resin. Additionally, the first and second synthetic resin layers may each comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, resins with the prefix "~~" are considered to include the functional group "~~".

[0115] The display panel DP may include transistors (TR) and light-emitting elements (ED). The transistors (TR) and light-emitting elements (ED) may be disposed on the substrate (BS). Figure 5 A transistor TR is shown, but the display panel DP can essentially include at least one capacitor and multiple transistors for driving the light-emitting element ED.

[0116] The circuit layer DP-CL may include insulating layers, semiconductor patterns, conductive patterns, signal lines, etc. For example, the circuit layer DP-CL may include switching transistors or driving transistors for driving the light-emitting elements ED of the display element layer DP-EL.

[0117] The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, and multiple insulating layers BFL and INS1 to INS6. The multiple insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first insulating layers INS1 to sixth insulating layers INS6. However, Figure 5 The stacked structure of the DP-CL circuit layer shown is presented as an example, and the stacked structure of the DP-CL circuit layer can be changed according to the configuration of the display panel DP and the process of the DP-CL circuit layer.

[0118] A shielding electrode BML can be disposed on the substrate BS. The shielding electrode BML can overlap with the transistor TR. The shielding electrode BML can block light incident on the transistor TR from below the display panel DP, thereby protecting the transistor TR. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, embodiments of the present invention are not necessarily limited to this, and the shielding electrode BML can be a floating electrode. The shielding electrode BML may also be omitted.

[0119] A buffer layer BFL can be disposed on a substrate BS and cover a shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL can increase the adhesion between the substrate BS and the semiconductor or conductive pattern disposed on the buffer layer BFL.

[0120] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may be formed from a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide. However, any material with semiconductor properties can be used without limitation, and it is not necessarily limited to any one embodiment.

[0121] A semiconductor pattern can include multiple regions divided according to conductivity levels. Regions in the semiconductor pattern that are doped with dopants or where metal oxides are reduced can have high conductivity and can essentially serve as the source and drain electrodes of a transistor TR. The high-conductivity regions of the semiconductor pattern can correspond to the source S1 and drain D1 of the transistor TR. Regions in the semiconductor pattern that are undoped, lightly doped, or have low conductivity due to unreduced metal oxides can correspond to the channel C1 (or active region) of the transistor TR.

[0122] The first insulating layer INS1 can cover the semiconductor pattern of transistor TR and is disposed on the buffer layer BFL. The gate G1 of transistor TR can be disposed on the first insulating layer INS1. In a planar view, the gate G1 can overlap with the channel C1 of transistor TR. The gate G1 can act as a mask during the semiconductor patterning process of doped transistor TR.

[0123] The second insulating layer INS2 may cover the gate G1 and be disposed on the first insulating layer INS1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0124] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 that electrically connects the transistor TR and the light-emitting element ED. However, the configuration of the connection electrode CNE that electrically connects the transistor TR to the light-emitting element ED is not necessarily limited to the configuration described above. The first connection electrode CNE1 or the second connection electrode CNE2 may be omitted, or additional connection electrodes may be included.

[0125] The first connecting electrode CNE1 can be disposed on the third insulating layer INS3. The first connecting electrode CNE1 can be connected to the drain electrode D1 via a first contact hole CH1 passing through the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 can cover the first connecting electrode CNE1 and is disposed on the third insulating layer INS3. The fifth insulating layer INS5 can be disposed on the fourth insulating layer INS4.

[0126] The second connecting electrode CNE2 can be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 via a second contact hole CH2 passing through the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 can cover the second connecting electrode CNE2 and is disposed on the fifth insulating layer INS5.

[0127] The first insulating layer INS1 to the sixth insulating layer INS6 may each comprise an inorganic layer or an organic layer. For example, the inorganic layer may comprise at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0128] The display element layer DP-EL may include a pixel defining film (PDL) and a light-emitting element (ED). The ED may include a first electrode AE, a second electrode CE disposed on the first electrode AE, and a light-emitting layer (EML) disposed between the first electrode AE ​​and the second electrode CE. Additionally, the ED may also include a hole control layer (HCL) and an electronic control layer (TCL). The hole control layer (HCL) may be disposed between the first electrode AE ​​and the light-emitting layer (EML). The electronic control layer (TCL) may be disposed between the light-emitting layer (EML) and the second electrode CE.

[0129] Light-emitting elements (EDs) can emit light. For example, EDs can include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, or quantum rods. For example, EDs can include micro-LEDs or nano-LEDs.

[0130] The first electrode AE ​​can be disposed on the sixth insulating layer INS6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 via the third contact hole CH3 passing through the sixth insulating layer INS6. The first electrode AE ​​can be electrically connected to the drain D1 of the transistor TR via the first connecting electrode CNE1 and the second connecting electrode CNE2.

[0131] The first electrode AE ​​can be formed of a metal, a metal alloy, or a conductive compound. The first electrode AE ​​can be an anode or a cathode. However, embodiments of the present invention are not necessarily limited to this. Furthermore, the first electrode AE ​​can be a pixel electrode. The first electrode AE ​​can be a transmission electrode, a semi-transmission / semi-reflection electrode, or a reflection electrode. The first electrode AE ​​can include: at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a compound selected from two or more materials selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a mixture selected from two or more materials selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; or oxides thereof.

[0132] When the first electrode AE ​​is a transmission electrode, it may comprise a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. When the first electrode AE ​​is a semi-transmissive / semi-reflective electrode or a reflective electrode, it may comprise Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, or compounds or mixtures thereof (e.g., a mixture of Ag and Mg), or LiF / Ca (a stacked structure of LiF and Ca), LiF / Al (a stacked structure of LiF and Al). Alternatively, the first electrode AE ​​may have a multilayer structure, including a reflective or semi-transmissive / semi-reflective film formed from the materials described above, and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not necessarily limited to this. Furthermore, embodiments of the present invention are not necessarily limited thereto, and the first electrode AE ​​may include the metal material described above, a combination of two or more metal materials selected from the metal materials, an oxide of the metal material described above, etc.

[0133] A pixel-defining film (PDL) can be disposed on a sixth insulating layer (INS6). A light-emitting opening (PX_OP) exposing a portion of the first electrode (AE) can be defined in the pixel-defining film (PDL). The portion of the first electrode (AE) exposed by the light-emitting opening (PX_OP) can be defined as the light-emitting region (LA).

[0134] The active region DM-AA of the display module DM may include a light-emitting region LA and a light-blocking region NLA. The area where the pixel limiting film PDL is disposed may correspond to the light-blocking region NLA. The light-blocking region NLA may surround the light-emitting region LA within the active region DM-AA.

[0135] A hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel defining film (PDL). The HCL can be a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). The HCL can also be disposed in the region corresponding to the light-emitting opening (PX_OP). The HCL can include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The HCL can include conventional hole injection materials and / or conventional hole transport materials.

[0136] The luminescent layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the luminescent opening (PX_OP). Alternatively, the EML can also be provided as a common layer. The EML can include organic and / or inorganic luminescent materials. The EML can emit light of one of the colors red, green, and blue. For example, the EML can emit blue light.

[0137] An electron control layer (TCL) can be disposed on the light-emitting layer (EML). The TCL can be a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). The TCL can also be disposed in the region corresponding to the light-emitting opening (PX_OP). The TCL can include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The TCL can include conventional electron injection materials and / or conventional electron transport materials.

[0138] The second electrode CE can be disposed on the electronic control layer TCL. The second electrode CE can be provided as a common layer overlapping the light-emitting region LA and the light-blocking region NLA. The second electrode CE can be a common electrode. The second electrode CE can be a cathode or an anode, but embodiments of the present invention are not necessarily limited to these. For example, when the first electrode AE ​​is an anode, the second electrode CE can be a cathode, and when the first electrode AE ​​is a cathode, the second electrode CE can be an anode.

[0139] The second electrode CE can be a transmission electrode, a semi-transmission / semi-reflection electrode, or a reflection electrode. When the second electrode CE is a transmission electrode, it can include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0140] When the second electrode CE is a semi-transmissive / semi-reflective electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, Yb, W, or compounds or mixtures thereof (e.g., AgMg, AgYb, or MgYb), or LiF / Ca, LiF / Al. Alternatively, the second electrode CE may have a multilayer structure, including a reflective or semi-transmissive / semi-reflective film formed from the materials described above, and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the second electrode CE may include the metallic materials described above, a combination of two or more metallic materials selected from the metallic materials, oxides of the metallic materials described above, etc.

[0141] The encapsulation layer TFE can be disposed on the display element layer DP-EL. The encapsulation layer TFE can be disposed on the second electrode CE and cover the light-emitting element ED. The encapsulation layer TFE can protect the display element layer DP-EL from moisture, oxygen and / or foreign matter such as dust particles. The encapsulation layer TFE can include multiple thin films.

[0142] The encapsulation layer TFE may include at least one inorganic film. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film can protect the light-emitting element ED from moisture / oxygen, and the organic film can protect the light-emitting element ED from foreign matter such as dust particles.

[0143] The input sensing component TP can be disposed on the display panel DP. For example, the input sensing component TP can be directly disposed on the encapsulation layer TFE of the display panel DP. Alternatively, an adhesive layer can be disposed between the input sensing component TP and the display panel DP.

[0144] The input sensing component TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing component TP may include at least one conductive layer disposed on the sensing insulating layers. The input sensing component TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0145] A first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0146] A first conductive layer CDL1 may be disposed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0147] A second conductive layer CDL2 may be disposed on a second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may be connected to a plurality of first conductive patterns respectively via contact holes formed in the second sensing insulating layer IL2.

[0148] The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each be configured to correspond to the light-blocking region NLA. The plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 can each be a mesh pattern.

[0149] The third sensing insulating layer IL3 can be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 can each include an inorganic insulating layer or an organic insulating layer.

[0150] The first conductive layer CDL1 and the second conductive layer CDL2 can each have a monolayer structure or a multilayer structure in which the layers are stacked along the third direction DR3. The monolayer conductive layers CDL1 and CDL2 can each include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer can include transparent conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). Furthermore, the transparent conductive layer can include conductive polymers such as PEDOT, metal nanowires, graphene, etc.

[0151] The conductive layers CDL1 and CDL2, which have a multilayer structure, may include metal layers. For example, the metal layers may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). The conductive layers CDL1 and CDL2, which have a multilayer structure, may include at least one metal layer and at least one transparent conductive layer.

[0152] Figures 6A to 7 This is a view illustrating an electronic device according to an embodiment of the concept of the present invention. In the following, regarding... Figures 6A to 7 The description of the element, without providing a detailed description of the element in this figure, is to be understood that the element is at least similar to the corresponding element already described elsewhere in this disclosure.

[0153] Figures 6A to 7 The electronic device EA-a shown may be a foldable device relative to at least one of the folding axes FX1 and FX2. Figure 6A This is a perspective view showing the electronic device EA-a in its unfolded state.

[0154] Electronic device EA-a may include a first display surface FS and a second display surface RS. The first display surface FS may include a first display area F-DA, a first non-display area F-NDA, and a sub-area MH-a. The second display surface RS may be defined as a surface facing away from at least a portion of the first display surface FS. For example, the second display surface RS may be defined as a portion of the rear surface of electronic device EA-a.

[0155] The first display area F-DA can be activated in response to an electrical signal. The first display area F-DA can be an area where an image IM can be displayed and various types of external input can be detected. A first non-display area F-NDA can be adjacent to the first display area F-DA. The transmittance of the first non-display area F-NDA can be less than that of the first display area F-DA. The first non-display area F-NDA can have a predetermined color. The first non-display area F-NDA can surround the first display area F-DA. Therefore, the shape of the first display area F-DA can be substantially defined by the first non-display area F-NDA. However, this is presented as an example, and the first non-display area F-NDA can be configured to be adjacent to only one side of the first display area F-DA, or the first non-display area F-NDA can be omitted.

[0156] Sub-region MH-a can detect external objects received via display surfaces FS and RS, or provide sound signals such as speech to the outside via display surfaces FS and RS. Optical signals such as visible light or infrared light can be moved to sub-region MH-a.

[0157] Various electronic modules (ELM) can be configured (see...) Figure 7 ) so as to correspond to sub-region MH-a. For example, electronic module ELM (see Figure 7 The electronic device EA-a may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The electronic device EA-a may include an electronic module ELM (see...). Figure 7 Electronic module ELM (see) Figure 7 External images can be captured by using visible light that passes through the sub-region MH-a, or by using infrared light to determine if an external object is approaching.

[0158] Sub-region MH-a may be located within the first display area F-DA. However, this is presented as an example, and the arrangement of sub-region MH-a is not necessarily limited to any one embodiment. For example, sub-region MH-a may be surrounded not only by the first non-display area F-NDA, but also by both the first display area F-DA and the first non-display area F-NDA. Figure 6A The example shown is a subregion MH-a, but subregion MH-a can also be provided as multiple regions.

[0159] Electronic device EA-a may include at least one folded region FA and a plurality of non-folded regions NFA1 and NFA2 extending from the folded region FA. For example, a first non-folded region NFA1, a folded region FA, and a second non-folded region NFA2 may be defined along a second direction DR2. Electronic device EA-a may include a first non-folded region NFA1 and a second non-folded region NFA2, the first non-folded region NFA1 and the second non-folded region NFA2 being spaced apart from each other in the second direction DR2, and the folded region FA being between the first non-folded region NFA1 and the second non-folded region NFA2. For example, the first non-folded region NFA1 may be disposed on one side of the folded region FA along the second direction DR2, and the second non-folded region NFA2 may be disposed on the other side of the folded region FA along the second direction DR2.

[0160] Figure 6A The illustrated electronic device EA-a includes an embodiment of a folded region FA, but embodiments of the present invention are not necessarily limited thereto. Multiple folded regions may be defined in the electronic device EA-a. For example, the electronic device according to the embodiment may include two or more folded regions, and may also include three or more non-folded regions, each of the folded regions being disposed between the three or more non-folded regions.

[0161] Figure 6B It is shown Figure 6A The image shows a perspective view of the folding operation of the electronic device EA-a. Figure 6C It is shown Figure 6A The diagram shows a plan view of the electronic device EA-a in a folded state. Figure 6D It is shown Figure 6A The image shows a perspective view of the folding operation of the electronic device EA-a.

[0162] Reference Figure 6BThe electronic device EA-a can be folded relative to a first folding axis FX1 extending in a first direction DR1. In the folded state of the electronic device EA-a, the folding region FA can have a predetermined curvature and radius of curvature. The electronic device EA-a can be folded relative to the first folding axis FX1 and changed to an inward folded state, such that the first non-folded region NFA1 and the second non-folded region NFA2 face each other, and the first display surface FS is not exposed to the outside.

[0163] Figure 6C This could be a plan view showing the electronic device EA-a in an inward-folded state. (Refer to...) Figure 6C In the inward-folded state of the electronic device EA-a, the second display surface RS can be seen by the user. In this case, the second display surface RS may include a second display area R-DA for displaying images. The second display area R-DA can be activated in response to an electrical signal. The second display area R-DA may be an area in which images can be displayed and various types of external inputs can be detected.

[0164] Additionally, the second display surface RS may include a second non-display area R-NDA. The second non-display area R-NDA may be adjacent to the second display area R-DA. The light transmittance of the second non-display area R-NDA may be less than that of the second display area R-DA. The second non-display area R-NDA may have a predetermined color. The second non-display area R-NDA may surround the second display area R-DA. The electronic device EA-a may further include a sub-region within the second display surface RS in which an electronic module comprising various components is disposed, and is not necessarily limited to any one embodiment.

[0165] Reference Figure 6D The electronic device EA-a can be folded relative to a second folding axis FX2 extending in the first direction DR1. The electronic device EA-a can be folded relative to the second folding axis FX2 and changed to an outward folded state, such that the first display surface FS is exposed to the outside. The electronic device EA-a according to the embodiment can be configured to repeatedly perform inward or outward folding operations from an unfolded operation, and vice versa, but the embodiments of the inventive concept are not necessarily limited thereto.

[0166] Figures 6A to 6DAn electronic device EA-a is exemplarily shown folding relative to a folding axis FX1 or FX2, but in the electronic device according to the embodiment, the number of folding axes and the number of non-folded areas corresponding to the number of folding axes are not necessarily limited to this. For example, the electronic device EA-a may be folded relative to multiple folding axes such that corresponding portions of the first display surface FS and the second display surface RS face each other. Furthermore, the first folding axis FX1 and the second folding axis FX2 are shown parallel to the long side of the electronic device EA-a, but embodiments of the inventive concept are not necessarily limited to this. The first folding axis FX1 and the second folding axis FX2 may be parallel to the short side of the electronic device EA-a.

[0167] In electronic devices such as EA-a Figure 6C In the folded state shown, the first non-folded region NFA1 and the second non-folded region NFA2 can be defined as portions having display surfaces FS and RS in a plane defined by the first direction axis DR1 and the second direction axis DR2, and the folded region FA can be defined as the region between the first non-folded region NFA1 and the second non-folded region NFA2. The folded region FA may have a curved portion to have a predetermined curvature in the folded state.

[0168] Figure 7 yes Figure 6A An exploded perspective view of the electronic device EA-a is shown. (Refer to...) Figure 7 The electronic device EA-a may include a display device DD-a and an electronic module ELM. The electronic device EA-a may also include a housing HAU. The display device DD-a may include a display module DM-a and a cover window CW disposed on the display module DM-a.

[0169] The display module DM-a may include a foldable display component FP-D and non-foldable display components NFP1-D and NFP2-D. The foldable display component FP-D may correspond to the folding area FA (see...). Figure 6A The non-folding display components NFP1-D and NFP2-D can be parts corresponding to the non-folding areas NFA1 and NFA2 (see...). Figure 6A (part of)

[0170] The folding display component FP-D can correspond to FX1 and FX2 relative to the folding axis (see...). Figure 6B and Figure 6DThe folded portion. The non-folding display components NFP1-D and NFP2-D may include a first non-folding display component NFP1-D and a second non-folding display component NFP2-D. The first non-folding display component NFP1-D and the second non-folding display component NFP2-D may be spaced apart from each other in the second direction DR2, and the folding display component FP-D is located between the first non-folding display component NFP1-D and the second non-folding display component NFP2-D. The first non-folding display component NFP1-D may correspond to the first non-folding region NFA1 (see...). Figure 6A The second non-folding display component NFP2-D may be a portion corresponding to the second non-folding area NFA2 (see...). Figure 6A (part of)

[0171] The electronic device EA-a may also include a lower module disposed below the display module DM-a. For example, the lower module may include a support layer, a padding layer, a shielding layer, etc. The support layer may be a thin-film metal substrate. The padding layer may include an elastomer, such as sponge, foam, or urethane resin. The shielding layer may be an electromagnetic wave shielding layer or a heat dissipation layer. However, this is presented as an example, and the components included in the lower module may vary depending on the size, shape, or operating characteristics of the electronic device EA-a.

[0172] In an embodiment, the electronic device may include a display device and an electronic module. The display device may include a cover window disposed on a display panel. The cover window may include an anti-reflective layer and a nitrogen-containing layer disposed on the anti-reflective layer. The anti-reflective layer may include a high-refractive-index layer and a low-refractive-index layer disposed on the high-refractive-index layer, and the nitrogen-containing layer may be disposed directly on the low-refractive-index layer. The nitrogen-containing layer can be formed by performing a nitrogen treatment on the surface of the low-refractive-index layer and has a thickness in the range of about 0.5 nm to about 5 nm (inclusive). Therefore, the nitrogen-containing layer can improve hardness and scratch resistance while maintaining excellent reflectivity. The cover window including the nitrogen-containing layer according to the embodiment can have improved hardness and scratch resistance while exhibiting excellent reflectivity. In an embodiment, a display device including a cover window and an electronic device including the display device can have improved hardness and scratch resistance while exhibiting excellent reflectivity.

[0173] The cover window according to the embodiment includes a nitrogen-containing layer, and thus can achieve improved hardness and scratch resistance, while exhibiting excellent reflectivity.

[0174] The display device and electronic device including the display device according to the embodiments include a cover window containing a nitrogen-containing layer, and thus can achieve improved hardness and scratch resistance, while exhibiting excellent reflectivity.

[0175] Figure 8This is a diagram illustrating an electronic device according to an embodiment of the present invention. (Refer to...) Figure 8 According to an embodiment of the present invention, the electronic device 1000 can output various information (e.g., images, text, music, etc.) through the display module 1140, which can, for example, correspond to... Figure 3 The display device DD is shown in the figure. When the processor 1110 executes the application stored in the memory 1120, the display module 1140 can provide application information to the user through the display panel 1141.

[0176] In some embodiments, electronic device 1000 may be configured as a smartphone, camera, smart TV, monitor, smartwatch, tablet computer, automotive display, or augmented reality (AR) / virtual reality (VR) headset. For example, electronic device 1000 may be a smartphone including a touch-sensitive display area for interaction and a non-display area including sensors and circuitry for enhanced functionality. For example, electronic device 1000 may be a television or monitor including a large display area for high-resolution video playback and a non-display area containing drive circuitry or connection modules for external input. For example, electronic device 1000 may be a smartwatch including a display area optimized for compact and high-definition visual effects and a non-display area integrating biometric sensors for health monitoring. In some cases, electronic device 1000 is an AR / VR headset.

[0177] In some embodiments, memory 1120 may store information such as software code for operating application 1123. Application 1123 may include software designed to perform specific tasks or provide functionality to a user. Application 1123 may operate under the control of processor 1110 and utilize data stored in memory 1120 to deliver a wide variety of features, such as productivity tools, multimedia streaming and playback, file or email delivery, or communication services. Application 1123 interacts seamlessly with user interface 1161 or touchscreen 1142, allowing users to launch, navigate, and utilize the program through user input such as touch, tap, gestures, or voice interaction.

[0178] When a user selects an application via touchscreen 1142 or user interface 1161, processor 1110 can execute application program 1123 corresponding to the selected application retrieved from memory 1120 to perform the functions of the application. For example, when a user selects a camera application by tapping an icon (or camera application icon) presented in display panel 1141, processor 1110 activates the camera module. Processor 1110 can then transfer image data corresponding to a captured image obtained by the camera module to display module 1140. Display module 1140 can display the image corresponding to the captured image via display panel 1141.

[0179] As another example, when a user wishes to make a call, they tap a phone icon displayed in display module 1140, and processor 1110 can execute a phone application stored in memory 1120. A phone keypad can be displayed on display panel 1141 for the user to enter the phone number to call.

[0180] As another example, the display module 1140 can be integrated into an electronic device 1000 such as a laptop computer, smart TV, or tablet computer. Users wishing to access multimedia streaming applications (e.g., watching music videos or movies) can do so by tapping the corresponding icon. This action activates the application, allowing the user to view the streaming content.

[0181] Processor 1110 may include a main processor 1111 and an auxiliary or coprocessor 1112. The main processor 1111 may include a central processing unit (CPU). The main processor 1111 may also include one or more of a graphics processing unit (GPU), a communication processor (CP), and an image signal processor (ISP).

[0182] The coprocessor 1112 may include a controller 1112-1. The controller 1112-1 may include interface / interface conversion circuitry and timing control circuitry. The controller 1112-1 can receive image signals from the main processor 1111, convert the data format of the image signals to match the interface / interface specifications of the display module 1140, and output the image data. The controller 1112-1 can output various control signals to drive the display module 1140. For example, the controller 1112-1 can drive the display module 1140 to display icons suitable for user selection on the screen, thereby enabling the application 1123 to execute.

[0183] The memory 1120 may store one or more applications 1123 and various data used by at least one component of the electronic device 1000 (e.g., processor 1110 or user interface 1161), as well as input or output data for commands associated with the memory 1120. For example, camera applications, GPS applications, augmented reality and virtual reality applications, and other applications that can be executed by the processor 1110 when the user selects a corresponding icon presented on the display screen (or display panel 1141) via the touchscreen 1142 or user interface 1161 may be stored in the memory 1120. Additionally, various setting data corresponding to user settings may be stored in the memory 1120. The memory 1120 may include volatile memory 1121 and non-volatile memory 1122.

[0184] Display module 1140 can output visual information (images) to the user. Display module 1140 may include display panel 1141, gate driver, source driver, voltage generation circuitry, and touchscreen 1142. Display module 1140 may also include a window, chassis, and bracket to protect display panel 1141. Display module 1140 may include... Figure 3 At least a portion of the configuration of the display device DD shown in the figure.

[0185] User interface 1161 serves as an interaction medium between the user and electronic device 1000. User interface 1161 can detect input from a part of the user's body (e.g., a finger) or from a pen or mouse, and generate electrical signals or data values ​​corresponding to the input. User interface 1161 includes a fingerprint sensor 1162, an input sensor 1163, and a digitizer 1164.

[0186] The fingerprint sensor 1162 can sense a fingerprint used for biometric identification of a user, and can also measure one or more biometric signals, such as blood pressure, humidity, or weight.

[0187] Input sensor 1163 can sense user interactions, including touch, tap, gesture, movement, verbal commands, and eye movement. Input sensor 1163 includes optical sensors for image capture, eye tracking, or motion and gesture detection. The optical sensors can be infrared or semiconductor photodetectors. Input sensor 1163 includes audio and acoustic sensors, which can be MEMS microphones for speech recognition or voice-based interaction. The audio and acoustic sensors can be mounted as part of user interface 1161 or embedded in display panel 1141.

[0188] The digitizer 1164 can generate data values ​​corresponding to coordinate information input via a pen or mouse to control cursor movement on the screen. The digitizer 1164 can also generate electromagnetic changes caused by input as data values. The digitizer 1164 can detect input from a passive pen, or send and receive data using an active pen or remote control.

[0189] At least one of the fingerprint sensor 1162, the input sensor 1163, and the digitizer 1164 can be implemented as a sensor layer formed on the top layer of the display panel 1141 by a process that is continuous with the process of forming elements (e.g., light-emitting elements and transistors) included in the display panel 1141.

[0190] Additionally, the user interface 1161 may include, for example, a gesture sensor, a gyroscope sensor for sensing rotational movement, an accelerometer sensor for tracking translational movement, a grip sensor, a pressure sensor, a proximity sensor, a color sensor, an infrared (IR) emitter and camera sensor for tracking gaze direction and eye movement, a temperature sensor, or a light sensor. For example, the gyroscope sensor, accelerometer, and infrared emitter and camera may be particularly suitable for AR / VR headset functionality.

[0191] Touchscreen 1142 includes a touch sensor embedded in a semiconductor layer of display panel 1141 to sense pressure applied to the top layer (screen) of display panel 1141. The touch sensor can be capacitive or resistive. Touchscreen 1142 can be used as a primary interface for users to select and navigate applications, control electronic device 1000, and interact with electronic device 1000.

[0192] The display panel 1141 (or display) may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and the type of display panel 1141 is not particularly limited. The display panel 1141 may be rigid or flexible and capable of being rolled or folded. The display module 1140 may also include supports, brackets, and heat dissipation components for supporting the display panel 1141. The display panel 1141 may include... Figure 1 The display unit shown in the image.

[0193] Power module 1150 can supply power to the components of electronic device 1000. Power module 1150 may include a battery that is charged by a power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 1150 may include a power management integrated circuit (PMIC). The PMIC can supply optimized power to each of the components described above, including display module 1140.

[0194] Figure 9 This is a schematic diagram illustrating an electronic device according to various embodiments. (Refer to...) Figure 9 According to the embodiments, the display device DD (see...) Figure 2 The electronic devices EA of the device may include not only electronic devices for displaying images (e.g., smartphones EA_1a, tablet computers (PCs) EA_1b, laptop computers EA_1c, televisions EA_1d, and monitors for desktop computers EA_1e), but also wearable electronic devices that include display devices (e.g., smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c) and vehicle electronic devices EA_3 that include display devices (e.g., vehicle dashboards, central instrument panels, central information displays (CIDs) set on control panels, and rearview mirror displays).

[0195] Although embodiments of the inventive concept have been described, it is understood that the inventive concept should not be limited to these embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of the inventive concept.

Claims

1. A cover window, wherein, The cover window includes: a base layer; an anti-reflection layer provided on the base layer and including a high-refractive-index layer and a low-refractive-index layer provided on the high-refractive-index layer; and a nitrogen-containing layer provided on the anti-reflection layer and having a thickness in a range of 0.5 nm to 5 nm and including 0.5 nm and 5 nm.

2. The cover window of claim 1, wherein, A refractive index of the nitrogen-containing layer is greater than a refractive index of the low-refractive-index layer, and the refractive index of the nitrogen-containing layer is less than a refractive index of the high-refractive-index layer.

3. The cover window of claim 1, wherein, The nitrogen-containing layer is directly provided on the low-refractive-index layer.

4. The cover window of claim 1, wherein, The thickness of the nitrogen-containing layer is less than each of a thickness of the high-refractive-index layer and a thickness of the low-refractive-index layer.

5. The cover window of claim 1, wherein, The low-refractive-index layer includes at least one of silicon oxide, aluminum oxide, and silicon oxynitride.

6. The cover window of claim 1, wherein, A nitrogen of the nitrogen-containing layer is chemically bonded to a material of the low-refractive-index layer.

7. The cover window of claim 1, wherein, The cover window further includes a functional layer provided on the nitrogen-containing layer, wherein the functional layer includes at least one of an antistatic agent, a hard coat agent, and an anti-fingerprint agent.

8. The cover window of claim 7, wherein, The thickness of the nitrogen-containing layer is less than a thickness of the functional layer.

9. The cover window of claim 1, wherein, The high-refractive-index layer and the low-refractive-index layer are each provided as a plurality, and wherein members of the plurality of the high-refractive-index layer and members of the plurality of the low-refractive-index layer are alternately provided with respect to each other.

10. A display device, wherein, The display device includes: a display panel including a light-emitting element; and a cover window provided on the display panel, wherein the cover window is the cover window according to any one of claims 1 to 9.

11. The display device of claim 10, wherein, The light-emitting element includes: a first electrode; a second electrode provided on the first electrode; and a light-emitting layer provided between the first electrode and the second electrode.

12. An electronic device, comprising: The electronic device includes: a display device having a module region defined in the display device; and an electronic module provided in the module region, wherein the display device includes: a display panel including a light-emitting element; and a cover window provided on the display panel; and wherein the cover window is the cover window according to any one of claims 1 to 9.

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