Heat dissipation module and projection device
By using a combination of elastic and thermally conductive components in the heat dissipation module, the side of the cooling chip is not compressed, which solves the problem of chip breakage caused by uneven force applied by spring screws in traditional heat dissipation modules, and improves heat dissipation effect and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2026-03-10
Smart Images
Figure CN121634665A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of heat dissipation and optics, in particular to a heat dissipation module and a projection device. BACKGROUND
[0002] The imaging principle of a projection device is to convert the illumination beam generated by a light source into an image beam by a light valve, and the image beam is projected onto a screen or a wall surface by a lens to form a projection image. In the prior art, since a large amount of heat is generated during the operation of the light valve, a heat dissipation module needs to be configured in the projection device to dissipate heat from the light valve.
[0003] The configuration of a conventional heat dissipation module is to sequentially stack a thermoelectric cooler chip (TEC chip) and a heat sink on a copper block, and to tightly fix the copper block, the TEC chip and the heat sink by penetrating a plurality of spring screws through the heat sink and locking them to the copper block. The copper block is connected to the light valve, so that the heat generated by the light valve can be conducted to the cold side of the TEC chip through the copper block to achieve the effect of uniform temperature, and the hot side of the TEC chip is in contact with the heat sink, so that the heat generated by the light valve can be conducted from the hot side of the TEC chip to the heat sink for heat dissipation.
[0004] However, during the locking process of the spring screws, the heat sink is easily tilted and pressed against the side edge of the TEC chip due to uneven force of the plurality of spring screws, which causes the side edge of the TEC chip to be broken, thereby causing the TEC chip to fail or its performance to be degraded, and affecting the heat dissipation effect of the conventional heat dissipation module.
[0005] The background section is only used to help understand the content of the present application, so the content disclosed in the background section may include some prior art known to those skilled in the art. The content disclosed in the background section does not represent the problems to be solved by the present application or one or more embodiments of the present application, which have been known or recognized by those skilled in the art before the present application is filed. SUMMARY
[0006] In view of the above deficiencies of the prior art, the present application aims to provide a heat dissipation module and a projection device, which improves the heat dissipation effect of the heat dissipation module by improving the structure of the heat dissipation module to avoid the side edge of the TEC chip being broken due to being pressed.
[0007] Other objects and advantages of the present application can be further understood from the technical features disclosed in the present application.
[0008] To achieve one or some or all of the above-mentioned purposes or other purposes, an embodiment of the present application is to use the aforementioned heat dissipation module for fixing on a plate member. The heat dissipation module includes an elastic member, a heat conduction member, a refrigeration chip, and a heat sink. The elastic member, the heat conduction member, the refrigeration chip, and the heat sink are sequentially arranged along an assembly direction and the elastic member is in an assembled state. The elastic member includes a body and at least two plate portions. The at least two plate portions are respectively located on both sides of the body and respectively extend outward from the body. The heat conduction member is arranged on the body of the elastic member. The refrigeration chip has a first surface and a second surface located on opposite sides. The first surface of the refrigeration chip is thermally connected to the heat conduction member. The heat sink is thermally connected to the second surface of the refrigeration chip and is fixed with the at least two plate portions of the elastic member. The body of the elastic member has a projection on the refrigeration chip that overlaps the first surface of the refrigeration chip, and the projection of the body on the refrigeration chip is less than or equal to the first surface of the refrigeration chip. When the elastic member is in the assembled state, each of the at least two plate portions of the elastic member provides the body with an elastic force towards the heat conduction member.
[0009] To achieve one or some or all of the above-mentioned purposes or other purposes, another embodiment of the present application is to use the aforementioned projection device to include a light source, a light valve, a lens, a plate member, and a heat dissipation module. The light source is used to provide an illumination light beam. The light valve is arranged on the transmission path of the illumination light beam and is used to convert the illumination light beam into an image light beam. The lens is arranged on the transmission path of the image light beam and is used to project the image light beam. The plate member is connected to the light valve. The heat dissipation module is fixed on the plate member and includes an elastic member, a heat conduction member, a refrigeration chip, and a heat sink. The elastic member, the heat conduction member, the refrigeration chip, and the heat sink are sequentially arranged along an assembly direction and the elastic member is in an assembled state. The elastic member includes a body and at least two plate portions. The at least two plate portions are respectively located on both sides of the body and respectively extend outward from the body. The heat conduction member is arranged on the body of the elastic member and is connected to the light valve. The refrigeration chip has a first surface and a second surface located on opposite sides. The first surface of the refrigeration chip is thermally connected to the heat conduction member. The heat sink is thermally connected to the second surface of the refrigeration chip and is fixed with the at least two plate portions of the elastic member. The body of the elastic member has a projection on the refrigeration chip that overlaps the first surface of the refrigeration chip, and the projection of the body on the refrigeration chip is less than or equal to the first surface of the refrigeration chip. When the elastic member is in the assembled state, each of the at least two plate portions of the elastic member provides the body with an elastic force towards the heat conduction member.
[0010] The present application, through the above structure, by setting the elastic member below the heat conduction member, when the elastic member is in the assembled state, at least two plate parts of the elastic member will be fixed to the heat sink and located between the heat sink and the plate member, and each of the at least two plate parts will provide the body with an elastic force towards the heat conduction member, and by the orthographic projection of the body of the elastic member on the refrigeration chip overlapping the first surface of the refrigeration chip, and the orthographic projection of the body on the refrigeration chip being less than or equal to the first surface of the refrigeration chip, so that the position of the elastic force generated by the body is located inside the refrigeration chip, thereby avoiding the side edge of the refrigeration chip being pressed to break, so as to improve the heat dissipation effect of the heat dissipation module. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 is an exploded view of an embodiment of the heat dissipation module and the plate member of the present application; Figure 2 and Figure 3 are respectively the perspective schematic diagram of the heat dissipation module before and after assembly of the present application; Figure 4 is the perspective schematic diagram after assembly according to Figure 1 Figure 5 is the first state diagram of the elastic member of the heat dissipation module of the present application; Figure 6 is the second state diagram of the elastic member of the heat dissipation module of the present application; Figure 7 is the third state diagram of the elastic member of the heat dissipation module of the present application; Figure 8 is the fourth state diagram of the elastic member of the heat dissipation module of the present application; Figure 9 is the schematic diagram of an embodiment of the projection device of the present application. BRIEF DESCRIPTION OF DRAWINGS: 10: heat dissipation module; 11: elastic member; 111: body; 111A: first side; 111B: second side; 111C: third side; 111D: fourth side; 112: plate part; 112A: first plate part; 112B: second plate part; 112C: third plate part; 112D: fourth plate part; 113: opening; 12: heat conduction member; 121: bump; 122: first surface; 123: second surface; 13: refrigeration chip; 131: first surface; 132: second surface; 14: heat sink; 141: pipe; 15: first fastener; 16: second fastener; 20: plate member; AD: assembly direction; F: elastic force; 30: projection device; 40: light source; 50: light valve; 60: lens; L1: illumination beam; L2: image beam. DETAILED DESCRIPTION
[0012] The above and other technical contents, features and effects of the present application will be apparent from the following detailed description of a preferred embodiment, which is illustrated in the accompanying drawings. Directional terms mentioned in the following embodiment, such as up, down, left, right, front or back, are only for reference to the direction of the drawings. Therefore, the directional terms are used for illustration, not for limiting the present application.
[0013] Regarding the embodiment of the heat dissipation module 10 of the present application, please refer to Figures 1 to 3As shown in the figure, the heat dissipation module 10 is used to be fixed on the plate 20. The heat dissipation module 10 comprises an elastic member 11, a heat conducting member 12, a refrigeration chip 13 and a heat sink 14. The elastic member 11, the heat conducting member 12, the refrigeration chip 13 and the heat sink 14 are sequentially arranged along the assembling direction AD, and the elastic member 11 is in the assembled state after the above components are assembled. The elastic member 11 comprises a body 111 and at least two plate parts 112. The at least two plate parts 112 are respectively located at different sides of the body 111, and respectively extend outward from the body 111, that is, each of the at least two plate parts 112 has one end part (not numbered) extending outward, and the other end part (not numbered) connected with the body 111, and all the outwardly extending end parts are separated from each other. The heat conducting member 12 has a first face 122 and a second face 123 located at opposite sides, and the first face 122 of the heat conducting member 12 is arranged on the body 111 of the elastic member 11. The refrigeration chip 13 has a first surface 131 and a second surface 132 located at opposite sides, wherein the first surface 131 of the refrigeration chip 13 is thermally connected to the second face 123 of the heat conducting member 12. The heat sink 14 is thermally connected to the second surface 132 of the refrigeration chip 13, and is fixed with the at least two plate parts 112 of the elastic member 11. After the assembly is completed, the body 111 of the elastic member 11, the first face 122 of the heat conducting member 12, the second face 123 of the heat conducting member 12, the first surface 131 of the refrigeration chip 13, the second surface 132 of the refrigeration chip 13 and the heat sink 14 are sequentially arranged along the assembling direction AD. The orthographic projection of the body 111 of the elastic member 11 on the refrigeration chip 13 overlaps the first surface 131 of the refrigeration chip 13, and the orthographic projection of the body 111 of the elastic member 11 on the refrigeration chip 13 is less than or equal to the first surface 131 of the refrigeration chip 13, wherein the orthographic projection of the body 111 of the elastic member 11 on the refrigeration chip 13 refers to the projection range of the body 111 on the first surface 131 of the refrigeration chip 13 along the assembling direction AD. When the elastic member 11 is in the assembled state, the at least two plate parts 112 of the elastic member 11 are fixed to the heat sink 14, and each of the at least two plate parts 112 provides the body 111 with an elastic force F towards the heat conducting member 12.
[0014] Therefore, the present application provides the elastic member 11 under the heat conducting member 12, when the elastic member 11 is in the assembled state, at least two plate portions 112 of the elastic member 11 are fixed to the heat spreader 14 and located between the plate member 20 and the heat spreader 14, each of the at least two plate portions 112 provides the body 111 to generate the elastic force F towards the heat conducting member 12, and the orthographic projection of the body 111 on the cooling chip 13 overlaps the first surface 131 of the cooling chip 13, and the orthographic projection of the body 111 on the cooling chip 13 is less than or equal to the first surface 131 of the cooling chip 13, so that the position of the elastic force F generated by the body 111 is located inside the cooling chip 13, thereby avoiding the elastic force applied to the edge of the cooling chip 13 to prevent the side of the cooling chip 13 from being pressed to break, thereby improving the heat dissipation effect of the heat dissipation module 10.
[0015] As shown in Figures 1 to 3 the present embodiment, the elastic member 11, the heat conducting member 12, the cooling chip 13 and the heat spreader 14 are sequentially arranged in the assembly direction AD, which includes that the elastic member 11, the heat conducting member 12, the cooling chip 13 and the heat spreader 14 are sequentially stacked from bottom to top. The orthographic projection of the body 111 of the elastic member 11 on the cooling chip 13 overlaps the first surface 131 of the cooling chip 13 in the assembly direction AD, and the orthographic projection of the body 111 of the elastic member 11 on the cooling chip 13 is less than or equal to the first surface 131 of the cooling chip 13, that is, the orthographic projection of the body 111 completely falls within the first surface 131 of the cooling chip 13 or the range of the orthographic projection of the body 111 is equal to the range of the first surface 131 of the cooling chip 13.
[0016] In the present embodiment, the heat dissipation module 10 further comprises at least two first locking members 15, each of the at least two plate portions 112 of the elastic member 11 extends outwardly from the body 111, each of the at least two plate portions 112 is, for example, triangular, one end (one end of the triangle) of each of the at least two plate portions 112 extends outwardly, and the end of each of the at least two plate portions 112 is relatively far away from the body 111. The at least two first locking members 15 pass through the heat spreader 14 downwardly (for example, opposite to the assembly direction AD) and lock to the ends of the at least two plate portions 112 of the elastic member 11 to fix the heat spreader 14 and the at least two plate portions 112 of the elastic member 11. Each of the at least two first locking members 15 locks the corresponding end to the heat spreader 14 to make the elastic member 11 in the assembled state. In the present embodiment, the number of the at least two first locking members 15 corresponds to the number of the at least two plate portions 112 of the elastic member 11.
[0017] To illustrate the change of the assembled state of the elastic member 11 in the present embodiment. Please refer to Figure 2 and Figure 3 shown in the present embodiment, asFigure 2 As shown, when at least two first fasteners 15 are not locked to the ends of each of the at least two plate portions 112 of the elastic member 11, the elastic member 11 is in an unassembled state. Each of the at least two plate portions 112 extends outward from different sides of the body 111 and is inclined or bent away from the heat-conducting member 12 to be in a curved shape. For example, each of the at least two plate portions 112 has an angle with respect to the body 111 that is not 0 degrees or 180 degrees. When the elastic member 11 is in the unassembled state, the elastic member 11 is in a static state without deformation. However, this is not a limitation of the present invention. In different embodiments of the present invention, each of the at least two plate portions 112 may also extend horizontally outward from different sides of the body 111 to be in a flat shape.
[0018] Next, as Figure 3 As shown, in this embodiment, when at least two first fasteners 15 are fastened to the ends of at least two plate portions 112 of the elastic member 11, and each of the at least two fasteners 15 fastens its corresponding end to the heat sink 14, the elastic member 11 deforms from an unassembled state to an assembled state. Thus, each of the at least two plate portions 112 provides the body 111 with an elastic force F toward the heat conduction member 12, thereby using this elastic force F to tightly fix the heat conduction member 12, the cooling chip 13, and the heat sink 14 together.
[0019] To fix the heat dissipation module 10 of the present invention onto the plate 20, such as Figure 1 and Figure 4 As shown, in this embodiment, the heat dissipation module 10 may further include at least two second fasteners 16. Each of the at least two second fasteners 16 passes downward (e.g., opposite to the assembly direction AD) through the heat sink 14 and is fastened to the plate 20, so that the heat dissipation module 10 and the plate 20 are tightly fixed to each other. At this time, at least two plate portions 112 of the elastic member 11 are located between the heat sink 14 and the plate 20. There is no direct contact between the at least two second fasteners 16 and the elastic member 115 to avoid affecting the elastic force F uniformly provided by the elastic member 11 to the heat conducting member 12 and the cooling chip 13.
[0020] To illustrate the more detailed structure of the body 111 of the elastic element 11 and the heat-conducting element 12, as follows: Figures 1 to 4As shown, in the present embodiment, the body 111 of the elastic member 11 is in a square shape, which is merely illustrative and not intended to limit the present application. Preferably, the elastic member 11 has an opening 113 passing through the body 111, and the first face 122 of the heat conducting member 12 correspondingly has a protrusion 121 protruding from the first face 122, wherein the protrusion 121 is in a shape matching the opening 113 or the protrusion 121 is in a shape smaller than the opening 113. In the present embodiment, when the elastic member 11, the heat conducting member 12, the refrigeration chip 13 and the heat sink 14 are sequentially arranged along the assembling direction AD, the protrusion 121 of the first face 122 of the heat conducting member 12 passes through the opening 113 of the body 111 to be thermally connected to the heat generating element on the board 20, so that the refrigeration chip 13 can cool the heat generating element through the heat conducting member 12. For example, the heat generating element can be a light source or a light valve 50, the light source can be a laser diode (LD) or a light-emitting diode (LED), and the light valve 50 can be a digital micro mirror device (DMD), but not limited thereto. The heat generating element can also be any element that generates heat energy, such as a circuit board or a processor. In the present embodiment, when the elastic member 11 is in the assembled state, each of the at least two plate portions 112 provides a frame portion (not numbered) of the body 111 in a square shape to generate an elastic force F towards the heat conducting member 12.
[0021] In the present embodiment, the first surface 131 of the refrigeration chip 13 is a cold face, and the second surface 132 of the refrigeration chip 13 is a hot face. The second face 123 of the heat conducting member 12 is thermally connected to the cold face (the first surface 131) of the refrigeration chip 13, and the heat sink 14 is thermally connected to the hot face (the second surface 132) of the refrigeration chip 13. When the heat generating element generates a large amount of heat energy during operation, the cold face of the refrigeration chip 13 can cool the heat generating element through the heat conducting member 12, and the heat energy generated by the heat generating element can be conducted to the heat sink 14 through the hot face of the refrigeration chip 13. In this way, the heat generating element can be cooled to avoid overheating and damage. For example, the heat sink 14 can be an air-cooled heat sink with a heat dissipation fin structure or a water-cooled heat sink with a heat pipe structure. If the heat sink 14 is a water-cooled heat sink, a cooling fluid can flow in the pipeline 141 of the heat sink 14, but not limited thereto.
[0022] To further illustrate the application mode of various shapes of the elastic member 11 in the present embodiment, please refer to Figure 5 As shown. Figure 5For the first shape example in the present embodiment, the body 111 has opposite first and second sides 111A and 111B, and the at least two plate portions 112 include first and second plate portions 112A and 112B extending outwardly from the first and second sides 111A and 111B, respectively. Each of the first and second plate portions 112A and 112B has a triangular plate shape.
[0023] Referring to Figure 6 As shown, the second shape example in the present embodiment is substantially the same as the first shape example (as shown in Figure 5 ), except that the body 111 further has opposite third and fourth sides 111C and 111D connected between the first and second sides 111A and 111B, respectively. The first, second, third and fourth sides 111A, 111B, 111C and 111D, for example, jointly form a rectangle. The at least two plate portions 112 are four in number, including first, second, third and fourth plate portions 112A, 112B, 112C and 112D extending outwardly from the first, second, third and fourth sides 111A, 111B, 111C and 111D, respectively. Each of the first, second, third and fourth plate portions 112A, 112B, 112C and 112D has one end portion (not labeled) extending outwardly and the other end portion (not labeled) connected to the body 111. All the outwardly extending end portions are separated from each other.
[0024] Referring to Figure 7 As shown, the third shape example in the present embodiment is substantially the same as the second shape example (as shown in Figure 6 ), except that the first, second, third and fourth plate portions 112A, 112B, 112C and 112D further extend toward each other to be connected to form a unitary structure.
[0025] Referring to Figure 8 As shown, the fourth shape example in the present embodiment is substantially the same as the first shape example (as shown in Figure 5The technical contents of the above-mentioned embodiments are substantially the same, and the main difference is that the body 111 has a first side 111A and a second side 111B, and the body 111 further has a third side 111C, wherein the first side 111A, the second side 111B and the third side 111C can be connected to each other without being adjacent to each other, or can be connected to each other adjacent to each other. The number of at least two plate portions 112 is three, wherein the three plate portions 112 are a first plate portion 112A, a second plate portion 112B and a third plate portion 112C, respectively, which extend outwardly from the first side 111A, the second side 111B and the third side 111C of the body 111. Each of the first plate portion 112A, the second plate portion 112B and the third plate portion 112C has one end portion (not labeled) extending outwardly, and the other end portion (not labeled) connected to the body 111, and all the outwardly extending end portions are separated from each other.
[0026] Based on the above-mentioned embodiments of the present application, a projection device 30 using the heat dissipation module 10 can be further provided, please refer to Figure 9 The projection device 30 includes a light source 40, a light valve 50, a lens 60, the aforementioned plate member 20 and the heat dissipation module 10 of any one of the above-mentioned embodiments. The light source 40 is used to provide an illumination light beam L1. The light valve 50 is arranged on the transmission path of the illumination light beam L1, and is used to convert the illumination light beam L1 into an image light beam L2. The lens 60 is arranged on the transmission path of the image light beam L2, and is used to project the image light beam L2. The plate member 20 is connected to the light valve 50. The heat dissipation module 10 is fixed to the plate member 20. For example, the light source 40 can be the aforementioned laser diode or light-emitting diode or the combination thereof, the light valve 50 can be the aforementioned digital micromirror device or a reflective light modulator such as a liquid crystal on silicon panel (LCoS panel), or a transparent liquid crystal panel, an electro-optical modulator, a magneto-optic modulator, an acousto-optic modulator (AOM) and the like, the plate member 20 is a circuit board known to those skilled in the art, and the lens 60 is a combination of one or more optical lenses having refractive power, such as various combinations of non-planar lenses including double-concave lenses, double-convex lenses, concave-convex lenses, convex-concave lenses, plano-convex lenses and plano-concave lenses, but not limited thereto.
[0027] In summary, the embodiments of the present invention have at least one of the following advantages. In the embodiments of the present invention, by providing a body of an elastic member below the heat-conducting member, when the elastic member is in an assembled state, at least two plates of the elastic member are fixed to the heat sink and located between the plate and the heat sink. Each of the at least two plates provides the body with an elastic force that generates towards the heat-conducting member. Furthermore, the orthographic projection of the body of the elastic member onto the cooling chip overlaps with the first surface of the cooling chip, and the orthographic projection of the body onto the cooling chip is less than or equal to the first surface of the cooling chip, so that the position of the elastic force generated by the body is located inside the cooling chip, thereby preventing the sides of the cooling chip from being compressed and cracking, thereby improving the heat dissipation effect of the heat dissipation module.
[0028] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent variations and modifications made in accordance with the claims and description of the invention are still within the scope of this patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Moreover, the terms "first," "second," etc., used in this specification or claims are only used to name components or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of components.
Claims
1. A heat dissipating module for attachment to a panel, characterized by, The heat dissipation module comprises an elastic member, a heat conducting member, a refrigeration chip and a heat sink, the elastic member, the heat conducting member, the refrigeration chip and the heat sink are configured in sequence along an assembling direction and the elastic member is in an assembled state, wherein: The elastic member comprises a body and at least two plate portions, the at least two plate portions are respectively located on two sides of the body and respectively extend outward from the body; The heat conducting member is arranged on the body of the elastic member; The refrigeration chip has a first surface and a second surface located on opposite sides, wherein the first surface of the refrigeration chip is thermally connected to the heat conducting member; and The heat sink is thermally connected to the second surface of the refrigeration chip and is fixed with the at least two plate portions of the elastic member; Wherein, the orthographic projection of the body of the elastic member on the refrigeration chip overlaps the first surface of the refrigeration chip, and the orthographic projection of the body on the refrigeration chip is less than or equal to the first surface of the refrigeration chip; When the elastic member is in the assembled state, each of the at least two plate portions of the elastic member provides the body with an elastic force towards the heat conducting member.
2. The heat dissipating module of claim 1, wherein, The first surface of the refrigeration chip is a cold face, the second surface of the refrigeration chip is a hot face, the heat conducting member is thermally connected to the cold face, and the heat sink is thermally connected to the hot face.
3. The heat dissipating module of claim 1, wherein, When the elastic member is in a non-assembled state, each of the at least two plate portions extends outward from the two sides of the body and tilts or bends away from the heat conducting member.
4. The heat dissipating module of claim 3, wherein, The two sides of the body are opposite first and second sides, and the at least two plate portions include a first plate portion and a second plate portion, the first and second plate portions extend outward from the first and second sides of the body, respectively.
5. The heat dissipating module of claim 4, wherein, The body further has opposite third and fourth sides, the third side is connected between the first and second sides, respectively, and the fourth side is connected between the first and second sides, respectively, the number of the at least two plate portions is four, the four plate portions are the first, second, third and fourth plate portions, respectively, and the first, second, third and fourth plate portions extend outward from the first, second, third and fourth sides of the body, respectively.
6. The heat dissipating module of claim 5, wherein, The first, second, third and fourth plate portions are connected to each other.
7. The heat dissipating module of claim 3, wherein, The two sides of the body are first and second sides, and the body further has a third side, the number of the at least two plate portions is three, and the three plate portions extend outward from the first, second and third sides of the body, respectively.
8. The heat dissipating module of claim 3, wherein, The heat dissipation module comprises at least two locking members, each of the at least two plate portions has an end portion away from the body, and when each of the at least two locking members locks the corresponding end portion to the heat sink, the elastic member is deformed from the non-assembled state to the assembled state.
9. The heat dissipating module of claim 1, wherein, The elastic member has an opening through the body, the heat-conducting member has a protrusion, when the elastic member, the heat-conducting member, the refrigeration chip and the heat sink are sequentially arranged along the assembling direction, the protrusion penetrates the opening of the body to be thermally connected to the heat-generating element on the plate.
10. A projection apparatus, characterized by, The projection device comprises a light source, a light valve, a lens, a plate and a heat dissipation module, wherein: The light source is used to provide an illumination beam; The light valve is arranged on the transmission path of the illumination beam and is used to convert the illumination beam into an image beam; The lens is arranged on the transmission path of the image beam and is used to project the image beam; The plate is connected with the light valve; The heat dissipation module is fixed on the plate and comprises an elastic member, a heat-conducting member, a refrigeration chip and a heat sink, the elastic member, the heat-conducting member, the refrigeration chip and the heat sink are sequentially arranged along the assembling direction and the elastic member is in the assembled state, wherein: The elastic member comprises a body and at least two plate parts, the at least two plate parts are respectively located on both sides of the body and respectively extend outward from the body; The heat-conducting member is arranged on the body of the elastic member and is connected with the light valve; The refrigeration chip has a first surface and a second surface located on opposite sides, wherein the first surface of the refrigeration chip is thermally connected to the heat-conducting member; and The heat sink is thermally connected to the second surface of the refrigeration chip and is fixed with the at least two plate parts of the elastic member; Wherein, the orthographic projection of the body of the elastic member on the refrigeration chip overlaps the first surface of the refrigeration chip, and the orthographic projection of the body on the refrigeration chip is less than or equal to the first surface of the refrigeration chip; When the elastic member is in the assembled state, each of the at least two plate parts of the elastic member provides an elastic force of the body towards the heat-conducting member.
11. The projection apparatus of claim 10, wherein The first surface of the refrigeration chip is a cold face, the second surface of the refrigeration chip is a hot face, the heat-conducting member is thermally connected to the cold face, and the heat sink is thermally connected to the hot face.
12. The projection apparatus of claim 10, wherein When the elastic member is in a non-assembled state, each of the at least two plate parts extends outward from the two sides of the body and inclines or bends away from the heat-conducting member.
13. The projection apparatus of claim 12, wherein The two sides of the body are opposite first and second sides, the at least two plate parts comprise a first plate part and a second plate part, the first plate part and the second plate part extend outward from the first side and the second side of the body, respectively.
14. The projection apparatus of claim 13, wherein The body further has opposite third and fourth sides, the third side is connected between the first side and the second side, respectively, and the fourth side is connected between the first side and the second side, respectively, the number of the at least two plate parts is four, the four plate parts are a first plate part, a second plate part, a third plate part and a fourth plate part, respectively, and the first plate part, the second plate part, the third plate part and the fourth plate part extend outward from the first side, the second side, the third side and the fourth side of the body, respectively.
15. The projection apparatus of claim 14, wherein The first plate portion, the second plate portion, the third plate portion and the fourth plate portion are connected to each other.
16. The projection apparatus of claim 12, wherein The two sides of the body are a first side and a second side, and the body further has a third side, the number of the at least two plate portions is three, and the three plate portions respectively extend outward from the first side, the second side and the third side of the body.
17. The projection apparatus of claim 12, wherein The heat dissipation module comprises at least two fasteners, each of the at least two plate portions has an end portion away from the body, and when each of the at least two fasteners fastens the corresponding end portion to the heat sink, the elastic member is deformed from the non-assembled state to the assembled state.
18. The projection apparatus of claim 10, wherein The elastic member has an opening through the body, and the heat-conducting member has a protrusion, when the elastic member, the heat-conducting member, the refrigeration chip and the heat sink are sequentially arranged along the assembling direction, the protrusion penetrates through the opening of the body to be thermally connected to the light valve on the plate member.