Multi-element collaborative photoresist and Micro-LED electroluminescence huge amount detection method and system
By constructing a three-dimensional conductive network using multi-element synergistic photoresist, the problems of chip damage and low detection efficiency during Micro-LED testing are solved, achieving efficient and non-destructive electrical performance testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-11
- Publication Date
- 2026-03-10
AI Technical Summary
Traditional Micro-LED testing methods are prone to damaging chips and have low testing efficiency, while photoluminescence testing suffers from inflated yield rates.
A multi-component synergistic photoresist, comprising 0D, 1D, and 2D conductive materials, is used to construct a three-dimensional conductive network. This network is aligned and contacts the electrodes of the Micro-LED chip array via a flexible substrate, providing driving signals for image acquisition and detection.
This enables non-destructive testing of Micro-LED chips, improving testing efficiency and accurately reflecting electrical performance while avoiding additional damage.
Smart Images
Figure CN121634705A_ABST
Abstract
Description
Technical Field
[0001] This disclosure belongs to the field of optical display technology and relates to a multi-element synergistic photoresist, a method and system for mass detection of Micro-LED electroluminescence. Background Technology
[0002] Micro-LED is a self-emissive display technology. Due to its many advantages such as high display quality, high energy efficiency, high maximum resolution, high reliability, longer lifespan, and low power consumption, it has become the core of the next generation of display technology and is widely used in displays, medical devices, smart wearable devices, etc.
[0003] Traditional Micro-LED testing methods include contact electroluminescence detection and photoluminescence detection. However, contact electroluminescence detection technology is prone to scratching and squeezing damage to the Micro-LED electrodes and chip surface. It also suffers from low detection efficiency, significantly increasing the manufacturing cost of display devices. Photoluminescence detection technology can result in inflated yield rates and does not accurately reflect the device's operating status. Therefore, a testing technology is needed that can accurately obtain the electroluminescence performance of Micro-LED chips without causing additional damage to the chips. Summary of the Invention
[0004] To overcome the above problems, this disclosure provides a method and system for mass detection of multi-element synergistic photoresist and Micro-LED electroluminescence.
[0005] The technical solution disclosed herein is as follows: In a first aspect, this disclosure provides a multi-component synergistic photoresist, comprising a multi-component conductive material, a photosensitive polymer, a solvent, and additives; The multi-element conductive material includes 0D material, 1D material and 2D material; 0D material is liquid metal; 1D materials are one or a combination of carbon nanotubes and silver nanowires; The 2D material is one or a combination of graphene, reduced graphene oxide, and graphene oxide. The mass fraction of 0D materials and their modified materials is 1%~8%, the mass fraction of 1D materials and their modified materials is 0.1%~1.5%, and the mass fraction of 2D materials and their modified materials is 0.5%~3%. The mass fraction of the photosensitive polymer is 15%~25%; The solvent has a mass fraction of 62% to 83%; The mass fraction of the additive is 0.1% to 1%.
[0006] Furthermore, the photosensitive polymer is one of SU-8, polyimide, linear phenolic resin, DNQ photosensitizer, epoxy acrylate resin, bisazide and thioonium salt PAG, or a combination of resin and photosensitizer.
[0007] Further, the solvent is one or a combination of at least two of the following: cyclohexanone, cyclopentanone, methyl isobutyl ketone toluene, xylene, ethylene glycol monobutyl ether, ethylene glycol, propylene glycol methyl ether acetate, propylene glycol methyl ether, and ethyl lactate.
[0008] Furthermore, the additives include antioxidants and dispersants.
[0009] Secondly, this disclosure provides a method for mass detection of Micro-LED electroluminescence, including: A multi-element synergistic conductive circuit is prepared by fabricating the multi-element synergistic photoresist described in the first aspect, and the multi-element synergistic conductive circuit corresponds to the electrodes of the Micro-LED chip array under test. Align and contact the Micro-LED chip array under test with the multi-element synergistic conductive circuit; Provide Micro-LED chip driving signals for the multi-element collaborative conductive circuit to drive the Micro-LED chip array under test to work; Acquire working images of the Micro-LED chip array under test; The micro-LED chip array under test is tested based on its working image.
[0010] Furthermore, the multi-element synergistic conductive circuit is disposed on a flexible substrate, the flexible substrate being made of polyimide, polyethylene terephthalate, polydimethylsiloxane, transparent polyimide, or polyethylene naphthalate.
[0011] Furthermore, the flexible substrate is treated with oxygen plasma.
[0012] Thirdly, this disclosure provides a Micro-LED electroluminescence mass detection system, comprising: A flexible substrate, wherein a multi-element synergistic conductive circuit prepared by the multi-element synergistic photoresist described in the first aspect is disposed on the flexible substrate, and the multi-element synergistic conductive circuit corresponds to the electrodes of the Micro-LED chip array under test. A power supply and signal generator provide driving signals for the Micro-LED chip to the multi-element cooperative conductive circuit; A stage for placing the Micro-LED chip array to be tested; An alignment unit is used to drive the Micro-LED chip array under test to align with the multi-element cooperative conductive circuit. An image acquisition system is used to acquire working images of the Micro-LED chip array under test.
[0013] Furthermore, the power supply and signal generator emit one or more combinations of sine waves, triangle waves, square waves, sawtooth waves, pulse signals, and modulation signals.
[0014] Furthermore, the platform can be displaced in three directions: X-axis, Y-axis, and Z-axis.
[0015] This disclosure has the following beneficial effects: This invention utilizes the synergistic interaction of 0D, 1D, and 2D conductive materials to construct a three-dimensional conductive network. 1D materials connect 2D sheets, while 0D materials fill the gaps, forming a "three-dimensional permeation pathway," significantly reducing the critical filler concentration and greatly lowering the permeation threshold. 1D conductive materials can penetrate the gaps between stacked 2D conductive layers, forming a fractal conductive network and exponentially increasing the effective conductive path. The high probability of direct contact between 1D / 2D materials, coupled with liquid metal filling that brings the spacing close to zero, eliminates the potential barrier and achieves metallic contact. The graphene edge functional groups (-COOH) form coordination bonds with the liquid metal oxide layer (Ga2O3), reducing contact resistance. Multidimensional interfacial bonding increases electron mobility by 3–5 times. When mechanical stress causes fracture between 1D / 2D materials, the liquid metal can flow to fill the gaps and rebuild the conductive pathway. Graphene sheets disperse localized stress, preventing 1D nanotube fracture and maintaining network integrity. Figure 2 As shown.
[0016] Flexible circuits constructed using multi-element synergistic photoresist, compared to traditional probe testing methods, not only enable non-destructive testing of massive quantities of Micro-LED chips with high testing efficiency, but also allow for testing of the electrical performance of Micro-LED chips through excellent electrical contact. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of a Micro-LED electroluminescent mass detection system according to an embodiment of the present disclosure.
[0018] Figure 2 This is a schematic diagram of the multi-element synergistic conductive circuit and the internal multi-element structure of the multi-element synergistic conductive photoresist.
[0019] The reference numerals in the figure are as follows: 101. Flexible substrate; 102. Multi-element synergistic conductive circuit; 103. Micro-LED chip array under test; 104. Insulating substrate; 105. Stage; 106. Power supply and signal generator; 107. Alignment unit; 108. Image acquisition system; 109. Signal transmission unit; 110. Processing unit; 111. 0D conductive material liquid metal; 112. 1D conductive material carbon nanotubes or silver nanowires; 113. 2D conductive material graphene or reduced graphene oxide. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0021] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes. To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of some known functions and components are omitted.
[0022] The present disclosure will now be described in detail with reference to the accompanying drawings and specific embodiments.
[0023] In a first aspect, this disclosure provides a multi-component synergistic photoresist, comprising a multi-component conductive material, a photosensitive polymer, a solvent, and additives; The multi-element conductive material includes 0D material, 1D material and 2D material; 0D material is liquid metal; 1D materials are one or a combination of carbon nanotubes and silver nanowires; The 2D material is one or a combination of graphene, reduced graphene oxide, and graphene oxide. The mass fraction of 0D materials and their modified materials is 1%~8%, the mass fraction of 1D materials and their modified materials is 0.1%~1.5%, and the mass fraction of 2D materials and their modified materials is 0.5%~3%. The mass fraction of the photosensitive polymer is 15%~25%; The solvent has a mass fraction of 62% to 83%; The mass fraction of the additive is 0.1% to 1%.
[0024] 0D materials are zero-dimensional materials, 1D materials are one-dimensional materials, and 2D materials are two-dimensional materials.
[0025] Photosensitive polymers are used to impart photosensitivity to multi-component synergistic photoresists, enabling them to perform photolithographic patterning.
[0026] In one embodiment of this disclosure, the photosensitive polymer is one of SU-8, polyimide, linear phenolic resin, DNQ photosensitizer, epoxy acrylate resin, bisazide and thioonium salt PAG, or a combination of resin and photosensitizer.
[0027] In one embodiment of this disclosure, the solvent is one or a combination of at least two of the following: cyclohexanone, cyclopentanone, methyl isobutyl ketone toluene, xylene, ethylene glycol monobutyl ether, ethylene glycol, propylene glycol methyl ether acetate, propylene glycol methyl ether, and ethyl lactate.
[0028] In one embodiment of this disclosure, the additive includes an antioxidant and a dispersant.
[0029] Specifically, the antioxidant can be one of the following: butylated hydroxytoluene (BHT), pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (antioxidant 1010), triphenyl phosphite (TPP), tris(2,4-di-tert-butylphenyl) phosphite (antioxidant 168), benzotriazole (BTA), or dilauryl thiodipropionate (DLTP).
[0030] The dispersant can be one of the following: polyether-modified siloxane, PEO-PPO-PEO triblock copolymer (such as the Pluronic series), ammonium polyacrylate, silane coupling agent, titanate coupling agent, or hyperbranched polyesteramine (HPMA).
[0031] Secondly, this disclosure provides a method for mass detection of Micro-LED electroluminescence, including: A multi-element synergistic conductive circuit 102 is fabricated using the multi-element synergistic photoresist described in the first aspect. The multi-element synergistic conductive circuit 102 corresponds to the electrodes of the Micro-LED chip array 103 under test. Align and contact the Micro-LED chip array 103 under test with the multi-element synergistic conductive circuit 102; Provide Micro-LED chip driving signals to the multi-element collaborative conductive circuit 102 to drive the Micro-LED chip array 103 under test to work; Acquire working images of the Micro-LED chip array 103 under test; The Micro-LED chip array 103 under test is tested based on the working image of the Micro-LED chip array 103 under test.
[0032] Furthermore, the multi-element synergistic conductive circuit 102 is disposed on a flexible substrate 101, the flexible substrate 101 being made of polyimide, polyethylene terephthalate, polydimethylsiloxane, transparent polyimide, or polyethylene naphthalate.
[0033] Furthermore, the flexible substrate 101 is treated with oxygen plasma.
[0034] Thirdly, such as Figure 1 As shown, this disclosure provides a Micro-LED electroluminescence mass detection system, comprising: A flexible substrate 101 is provided on which a multi-element synergistic conductive circuit 102 is prepared by the multi-element synergistic photoresist described in the first aspect, and the multi-element synergistic conductive circuit 102 corresponds to the electrodes of the Micro-LED chip array 103 under test. The power supply and signal generator 106 provides the driving signal for the Micro-LED chip to the multi-element cooperative conductive circuit 102; Stage 105 is used to place the Micro-LED chip array 103 to be tested; Alignment unit 107 is used to drive the Micro-LED chip array 103 under test to align with the multi-element cooperative conductive circuit 102; The image acquisition system 108 is used to acquire working images of the Micro-LED chip array 108 under test.
[0035] Furthermore, the power supply and signal generator 106 emits one or more combinations of sine waves, triangle waves, square waves, sawtooth waves, pulse signals, and modulation signals.
[0036] Furthermore, the stage 105 can be displaced in three directions: X-axis, Y-axis, and Z-axis.
[0037] The following are some embodiments of this disclosure.
[0038] Example 1 (1) The mass fraction of liquid metal and its modified materials is 2.5%, the mass fraction of carbon nanotubes or silver nanowires and their modified materials is 0.5%, the mass fraction of graphene or redox graphene and its modified materials is 0.8%, the mass fraction of photosensitive polymer is a combination of resin and photosensitizer is 20%, the mass fraction of solvent propylene glycol methyl ether acetate (PGMEA) and ethyl lactate is 75.5%, and the mass fraction of antioxidant and dispersant is 0.7%. The above materials are mixed and thoroughly stirred and ultrasonically dispersed to prepare multi-component synergistic photoresist.
[0039] (2) Polyimide (PI) is used as a flexible substrate 101 and treated with oxygen plasma to enhance its adhesion. (3) A uniform multi-element synergistic photoresist film is formed by spin-coating a multi-element synergistic photoresist onto a PI substrate; (4) Selective exposure of the multi-element synergistic photoresist film using ultraviolet light through a photomask; (5) After developing in an alkaline developer and drying with nitrogen, a patterned multi-element synergistic conductive circuit 102 is obtained. (6) Place the Micro-LED chip array 103 to be tested on the upper surface of the stage 105; (7) The Micro-LED chip array 103 to be tested is aligned with the multi-element cooperative conductive circuit 102 by the alignment unit 107; (8) Make the Micro-LED chip array 103 under test contact with the multi-element cooperative conductive circuit 102; (9) Turn on the power supply and signal generator 106 connected to the multi-element cooperative conductive circuit 102 to conduct the circuit and drive the Micro-LED chip to emit light; (10) The signal transmission unit 109 transmits the light emission information and electrical signal information acquired from the image acquisition unit 108 and the multi-element cooperative conductive circuit 102 to the processing unit 110 for detection.
[0040] Example 2: (1) The mass fraction of liquid metal and its modified materials is 8%, the mass fraction of carbon nanotubes or silver nanowires and their modified materials is 1.5%, and the mass fraction of graphene or redox graphene and its modified materials is 3%. The photosensitive polymer is SU-8 with a mass fraction of 25%, the solvent is cyclopentanone with a mass fraction of 62%, and the additives are antioxidants and dispersants with a mass fraction of 0.5%. The above materials are mixed and thoroughly stirred and ultrasonically dispersed to prepare a multi-component synergistic photoresist.
[0041] (2) Polyethylene terephthalate (PET) is used as a flexible substrate 101 and treated with oxygen plasma to enhance its adhesion. (3) A uniform multi-element synergistic photoresist film is formed by spin-coating a multi-element synergistic photoresist onto a PET substrate; (4) Selective exposure of the multi-element synergistic photoresist film using ultraviolet light through a photomask; (5) After developing in an alkaline developer and drying with nitrogen, a patterned multi-element synergistic conductive circuit 102 is obtained. (6) Place the Micro-LED chip array 103 to be placed on the upper surface of the stage 105; (7) The Micro-LED chip array 103 to be tested is aligned with the multi-element conductive circuit 102 by the alignment unit 107; (8) Make the Micro-LED chip array 103 under test contact with the multi-element cooperative conductive circuit 102; (9) Turn on the power supply and signal generator 106 connected to the multi-element cooperative conductive circuit 102 to conduct the circuit and drive the Micro-LED chip to emit light; (10) The signal transmission unit 109 transmits the light emission information and electrical signal information acquired from the image acquisition unit 108 and the multi-element cooperative conductive circuit 102 to the processing unit 110 for detection.
[0042] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.
[0043] The units described in the embodiments of this disclosure can be implemented in software or hardware. The names of the units are not, in some cases, intended to limit the specific unit.
[0044] The functions described above in this document can be performed at least in part by one or more hardware logic components. For example, exemplary types of hardware logic components that can be used, without limitation, include: field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), system-on-a-chip (SoCs), complex programmable logic devices (CPLDs), and so on.
[0045] The above description is merely a preferred embodiment of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features disclosed in this disclosure that have similar functions.
[0046] Furthermore, while the operations are described in a specific order, this should not be construed as requiring these operations to be performed in the specific order shown or in a sequential order. In certain environments, multitasking and parallel processing may be advantageous. Similarly, while several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of this disclosure. Certain features described in the context of individual embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments.
[0047] Although the subject matter has been described using language specific to structural features and / or methodological logic, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are merely illustrative examples of implementing the claims.
[0048] The following points should be noted regarding this disclosure: (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.
[0049] (2) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.
[0050] The above description is merely an embodiment of this disclosure and does not limit the patent scope of this disclosure. Any equivalent structure made using the content of this disclosure and its drawings, or directly or indirectly applied to other related technical fields, is similarly included within the patent protection scope of this disclosure.
Claims
1. A multi-patterning synergistic photoresist, characterized in that, The multi-element conductive material, photosensitive polymer, solvent and additive are included. The multi-element conductive material includes 0D material, 1D material and 2D material. The 0D material is liquid metal. The 1D material is one or a combination of carbon nanotube and silver nanowire. The 2D material is one or a combination of graphene and redox graphene. The mass fraction of the 0D material and modified material is 1-8%, the mass fraction of the 1D material and modified material is 0.1-1.5%, and the mass fraction of the 2D material and modified material is 0.5-3%. The mass fraction of the photosensitive polymer is 15-25%. The mass fraction of the solvent is 62-83%. The mass fraction of the additive is 0.1-1%.
2. The multi-patterning photoresist of claim 1, wherein The photosensitive polymer is one of SU-8, polyimide, linear phenolic resin, DNQ photosensitizer, epoxy acrylate resin, bis-azide and sulfonium salt PAG, or a combination of resin and photosensitizer.
3. The multi-patterning photoresist of claim 1, wherein The solvent is one or a combination of at least two of cyclohexanone, cyclopentanone, methyl isobutyl ketone toluene, xylene, ethylene glycol monobutyl ether, ethylene glycol, propylene glycol methyl ether acetate, propylene glycol methyl ether and ethyl lactate.
4. The multi-patnt photorcsist of claim 1, wherein The additive includes antioxidant and dispersant. 5.A method for detecting a Micro-LED electroluminescence, characterized in that, The multi-element synergistic conductive circuit is prepared by the multi-element synergistic photoresist. The multi-element synergistic conductive circuit corresponds to the electrodes of the Micro-LED chip array to be tested. The Micro-LED chip array to be tested is aligned and contacted with the multi-element synergistic conductive circuit. The multi-element synergistic conductive circuit is provided with Micro-LED chip driving signal to drive the Micro-LED chip array to work. The working image of the Micro-LED chip array to be tested is collected. The Micro-LED chip array to be tested is detected according to the working image of the Micro-LED chip array to be tested.
6. The Micro-LED electroluminescence mass detection method according to claim 5, characterized in that, The multi-element synergistic conductive circuit is arranged on a flexible substrate, and the material of the flexible substrate is polyimide, polyethylene terephthalate, polydimethylsiloxane, transparent polyimide or polyethylene naphthalate.
7. The Micro-LED electroluminescence mass detection method according to claim 6, characterized in that, The flexible substrate is treated with oxygen plasma. 8.A Micro-LED electroluminescence mass detection system, characterized in that, The multi-element synergistic conductive circuit is prepared by the multi-element synergistic photoresist. The power supply and signal generator provide the multi-element synergistic conductive circuit with Micro-LED chip driving signal. The stage is used to place the Micro-LED chip array to be tested. The alignment unit is used to drive the Micro-LED chip array to be tested to align with the multi-element synergistic conductive circuit. The image acquisition system is used to collect the working image of the Micro-LED chip array to be tested. The power supply and signal generator emit one or more combinations of sine wave, triangular wave, square wave, sawtooth wave, pulse signal and modulation signal.
9. The Micro-LED electroluminescence massive detection system according to claim 8, wherein, The stage can be displaced in X-axis, Y-axis and Z-axis directions.
10. The Micro-LED electroluminescence massive detection system according to claim 8, wherein,