Temperature control system, semiconductor processing equipment and temperature control method

Abstract

The invention discloses a temperature control system, semiconductor processing equipment and a temperature control method, and the temperature control system comprises a first temperature control source, a second temperature control source, a third temperature control source, a first three-way valve, a second three-way valve, a third three-way valve and a fifth three-way valve. Independent temperature control or rapid temperature switching of the first component and the second component can be achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and in particular to a temperature control system, semiconductor processing equipment, and temperature control method. Background Technology

[0002] In the semiconductor manufacturing process, temperature control of critical components in semiconductor processing equipment, such as electrostatic chucks and / or edge rings, is crucial for ensuring wafer quality and production efficiency.

[0003] For example, semiconductor processing equipment uses dry etching, which employs plasma to etch wafers. Different processing techniques require different temperatures to adjust the rates of physical and chemical reactions, thereby improving etching efficiency and yield. For instance, the electrostatic chuck and edge ring require relatively low temperatures during etching, while the subsequent cleaning step requires high temperatures for rapid cleaning. The time required to rise from low to high temperatures directly impacts the efficiency and time of the cleaning process, thus affecting the overall process time efficiency.

[0004] One solution is as follows Figure 1 As shown, temperature control of the electrostatic chuck is achieved through refrigerant. However, since there are only three temperature control sources, in order to achieve high and low temperature switching of the electrostatic chuck, two of the three temperature control sources need to be used to form a switching and self-circulation loop. Figure 1 As shown in numbers 10 and 11, only one temperature control source can be connected to the temperature control channel of the edge ring, making it impossible to achieve independent temperature adjustment and rapid switching between high and low temperatures. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature control system, a semiconductor processing device, and a temperature control method, which enables independent temperature control of at least two key components and rapid switching between high and low temperatures by using three temperature control sources.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0007] A temperature control system is provided for controlling the temperature of a first component and a second component. The first component has a first temperature-controlled flow path for controlling its temperature; the second component has a second temperature-controlled flow path for controlling its temperature. The temperature control system includes: a first temperature-controlled source that outputs a first temperature-controlled fluid; the outlet of the first temperature-controlled source is connected to the inlet of the first three-way valve; the first outlet of the first three-way valve is connected to the inlet of the first temperature-controlled flow path; and the second outlet of the first three-way valve is short-circuited to the inlet of the first temperature-controlled source.

[0008] The second temperature control source outputs a second temperature fluid. The outlet of the second temperature control source is connected to the inlet of a second three-way valve. The first outlet of the second three-way valve is connected to the inlet of the second temperature control flow path, and the second outlet of the second three-way valve is short-circuited to the inlet of the second temperature control source.

[0009] A third temperature control source outputs a third temperature fluid. The outlet of the third temperature control source is connected to the inlet of a third three-way valve. The first outlet of the third three-way valve can be connected to the inlet of both the first and second temperature control flow paths. The second outlet of the third three-way valve is short-circuited to the inlet of the third temperature control source.

[0010] The fourth three-way valve has its inlet connected to the outlet of the first temperature control flow path, its first outlet connected to the inlet of the first temperature control source, and its second outlet connected to the inlet of the third temperature control source.

[0011] The fifth three-way valve has its inlet connected to the outlet of the second temperature control flow path, its first outlet connected to the inlet of the second temperature control source, and its second outlet connected to the inlet of the third temperature control source.

[0012] Optionally, the output temperature of the third temperature control source is different from the output temperatures of the first and second temperature control sources.

[0013] Optionally, the first and second temperature control sources are cooling sources; the third temperature control source is a heating source.

[0014] Optionally, the output temperatures of the first temperature control source and the second temperature control source are different.

[0015] Optionally, the first outlet of the third three-way valve is connected to the inlet end of the first temperature-controlled flow path and the inlet end of the second temperature-controlled flow path via a three-way valve.

[0016] Optionally, the inlet end of the first temperature-controlled flow path and the inlet end of the second temperature-controlled flow path can be connected to each other via a shut-off valve.

[0017] Optionally, the first component and the second component are any two of the following: ESC, edge ring, gas spray head, upper grounding ring, and movable boundary ring.

[0018] Optionally, it further includes a mass flow control unit, which is respectively located near the inlet end of the first temperature control flow path and the inlet end of the second temperature control flow path.

[0019] On the other hand, the present invention also provides a semiconductor processing apparatus, including: a reaction chamber, and a temperature control system as described above. The temperature control system is disposed outside the reaction chamber and is used to regulate the temperature of the first component and the second component located inside the reaction chamber.

[0020] In other aspects, the present invention also provides a temperature control method, employing the temperature control system described above; the temperature control method includes: a first temperature control step, wherein the first three-way valve is switched to its first outlet, the second three-way valve is switched to its first outlet, the third three-way valve is switched to its second outlet, the fourth three-way valve is switched to its first outlet, and the fifth three-way valve is switched to its first outlet.

[0021] In the second temperature control step, the first three-way valve is switched to its second outlet, the second three-way valve is switched to its second outlet, the third three-way valve is switched to its first outlet, the fourth three-way valve is switched to its second outlet, and the fifth three-way valve is switched to its second outlet, so that the fluid in the first and second temperature control flow paths is quickly switched to the third temperature fluid.

[0022] Optionally, in the first temperature control step, the shut-off valve is closed; in the second temperature control step, the shut-off valve is opened.

[0023] Optionally, a target temperature is set for the first component and / or the second component. The target temperature provides feedback control over the flow rate into the first and second temperature-controlled flow paths. The flow rate into the first and second temperature-controlled flow paths is set by a mass flow control unit to adjust the temperature of the first component and / or the second component.

[0024] This invention has at least the following technical effects:

[0025] The temperature control system provided by this invention, through the combination of first to fifth three-way valves, can achieve independent temperature control or rapid temperature switching between the first and second components. This achieves a balance between rapid temperature rise and fall and precise control, improving the production efficiency and yield of semiconductor devices.

[0026] This invention, through the combination of the first to fifth three-way valves, enables independent temperature control of at least two key components (the first component and the second component) using three temperature control sources, and achieves rapid switching between high and low temperatures. It can achieve rapid switching between high and low temperatures of at least two key components without the need to expand the temperature control sources, which is highly efficient and low cost. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a high-low temperature switching structure for an electrostatic chuck or edge ring in the prior art;

[0028] Figure 2 This is a schematic diagram of a temperature control system provided in an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of a temperature control system provided in another embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of a temperature control system for performing the first temperature control step according to an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of a temperature control system for performing the second temperature control step according to an embodiment of the present invention. Detailed Implementation

[0032] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed explanation of the temperature control system, semiconductor processing equipment, and temperature control method proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the accompanying drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.

[0033] like Figure 2 As shown, this embodiment provides a temperature control system for controlling the temperature of a first component 101 and a second component 102. The first component 101 has a first temperature control flow path. Figure 2 (Not shown in the image) is used to control the temperature of the first component 101; the second component 102 has a second temperature-controlled flow path for controlling the temperature of the second component 102. The temperature control system includes: a first temperature control source 111 that outputs a first temperature fluid; the outlet of the first temperature control source 111 is connected to the inlet of a first three-way valve V1; the first outlet of the first three-way valve V1 is connected to the inlet of the first temperature-controlled flow path; and the second outlet of the first three-way valve V1 is short-circuited to the inlet of the first temperature control source 111.

[0034] The second temperature control source 112 outputs a second temperature fluid. The outlet of the second temperature control source 112 is connected to the inlet of the second three-way valve V2. The first outlet of the second three-way valve V2 is connected to the inlet of the second temperature control flow path, and the second outlet of the second three-way valve V2 is short-circuited to the inlet of the second temperature control source 112.

[0035] A third temperature control source 113 outputs a third temperature fluid. The outlet of the third temperature control source 113 is connected to the inlet of a third three-way valve V3. The first outlet of the third three-way valve V3 can be connected to the inlet of the first temperature-controlled flow path and the inlet of the second temperature-controlled flow path, respectively. The second outlet of the third three-way valve V3 is short-circuited to the inlet of the third temperature control source 113.

[0036] The fourth three-way valve V4 has its inlet connected to the outlet of the first temperature control flow path, its first outlet connected to the inlet of the first temperature control source 111, and its second outlet connected to the inlet of the third temperature control source 113.

[0037] The fifth three-way valve V5 has its inlet connected to the outlet of the second temperature control flow path, its first outlet connected to the inlet of the second temperature control source 112, and its second outlet connected to the inlet of the third temperature control source 113.

[0038] When semiconductor processing equipment performs etching processes, the electrostatic chuck and edge ring need to be set to different temperatures during the process.

[0039] like Figure 4 As shown, the first three-way valve V1 in the temperature control system is switched to its first outlet, the second three-way valve V2 is switched to its first outlet, the third three-way valve V3 is switched to its second outlet, the fourth three-way valve V4 is switched to its first outlet, and the fifth three-way valve V5 is switched to its first outlet.

[0040] At this time, the first temperature-controlled fluid (coolant) output by the first temperature control source 111 flows sequentially through the first outlet of the first three-way valve V1 and the inlet of the electrostatic chuck into the cooling channel of the electrostatic chuck, thereby reducing the temperature of the electrostatic chuck. This meets the requirement of extremely low temperature on the electrostatic chuck during this process.

[0041] The second temperature-controlled fluid (coolant) output by the second temperature control source 112 flows sequentially through the first outlet of the second three-way valve V2 and the inlet of the second component 102 into the cooling channel in the edge ring, thereby regulating the temperature of the edge ring. This meets the requirement of a low temperature on the edge ring during this process.

[0042] The third temperature fluid output by the third temperature control source 113 is self-circulating and does not participate in the temperature regulation process of the electrostatic chuck and edge ring, thereby realizing independent temperature control of the electrostatic chuck and edge ring.

[0043] When using dry cleaning methods to clean chambers during process intervals, such as Figure 5 As shown, by switching the first three-way valve V1 to its second outlet, the second three-way valve V2 to its second outlet, the third three-way valve V3 to its first outlet, the fourth three-way valve V4 to its second outlet, and the fifth three-way valve V5 to its second outlet in the temperature control system, the fluid in the cooling channel of the electrostatic chuck and the cooling channel of the edge ring is quickly switched to the third temperature fluid (a fluid with a temperature higher than that of the coolant).

[0044] At this time, the first temperature fluid output by the first temperature control source 111 circulates itself and no longer participates in the temperature control of the electrostatic chuck. The second temperature fluid output by the second temperature control source 112 circulates itself and no longer participates in the temperature control of the edge ring.

[0045] The third temperature-controlled fluid output by the third temperature source 113 flows directly into the cooling channels of the electrostatic chuck and the edge ring, respectively, rapidly switching the coolant in these channels to the third temperature-controlled fluid. This allows for rapid temperature switching of the electrostatic chuck and the edge ring. It enables the electrostatic chuck and edge ring to be set to a higher temperature in a shorter time, thereby cleaning organic polymers within the cavities of the semiconductor processing equipment. This reduces cleaning time and lowers costs.

[0046] Therefore, the temperature control system provided in this embodiment, through the combination of the first to fifth three-way valves, can achieve independent temperature control or rapid temperature switching between the first and second components. By using only three temperature control sources, a balance is achieved between rapid temperature rise and fall and precise control, improving the production efficiency and yield of semiconductor devices.

[0047] In some embodiments, the output temperature of the third temperature control source 113 is different from the output temperatures of the first temperature control source 111 and the second temperature control source 112. This allows for independent temperature control of the first and second components, or rapid switching between high and low temperatures.

[0048] In some embodiments, the first temperature control source 111 and the second temperature control source 112 are cooling sources; the third temperature control source 113 is a heating source. Therefore, this embodiment, through the combination of the first to fifth three-way valves, can achieve independent temperature control of at least two key components (the first component and the second component) based on three temperature control sources, and realize rapid high-low temperature switching of these two key components. This achieves rapid high-low temperature switching of at least two key components without the need for additional temperature control sources, resulting in high efficiency and low cost.

[0049] In some embodiments, the output temperatures of the first temperature control source 111 and the second temperature control source 112 are different. The temperatures and flow rates of the first, second, and third temperature fluids can be set. This allows for better independent temperature control of the first and second components.

[0050] Because the etching process is highly sensitive to temperature, and the cooling temperature, flow channel area, and flow resistance of the first component 101 and the second component 102 may be different, two temperature control sources are needed to perform precise temperature control on the two components. However, in the cleaning process, since it is only necessary to quickly raise the temperature to the required cleaning temperature, the temperature difference between the two components is not very sensitive. Therefore, a single temperature control source, namely the third temperature control source 113, can be used to uniformly and quickly raise the temperature.

[0051] Please continue to refer to this. Figure 2 As shown, in some embodiments, the first outlet of the third three-way valve V3 is connected to the inlet of the first temperature-controlled flow path and the inlet of the second temperature-controlled flow path via a three-way valve V6.

[0052] In some embodiments, the three-way V6 is a three-way valve, or the three-way valve is a valve combination structure with three channels formed by various valve combinations. Alternatively, the three-way V6 is a two-way valve. The present invention is not limited thereto. By setting this three-way V6, the first temperature fluid and the second temperature fluid are prevented from flowing towards each other in the same pipe, thereby preventing convection or heat exchange that could interfere with the temperature control accuracy of the first component and the second component 102.

[0053] In some embodiments, the inlet end of the first temperature-controlled flow path and the inlet end of the second temperature-controlled flow path can be connected to each other via a shut-off valve.

[0054] In some embodiments, the first component 101 and the second component 102 are any two of the following: an electrostatic chuck (ESC), an edge ring, a gas spray head, an upper grounding ring, and a movable boundary ring. The temperature control system provided in this embodiment uses the refrigerant from three temperature control sources to regulate the temperature of the electrostatic chuck and the edge ring, thereby achieving independent temperature control of the two components, i.e., high and low temperature switching.

[0055] In some embodiments, the first to fifth three-way valves V1 to V5 are bidirectional valves.

[0056] In some embodiments, please refer to Figure 3 As shown, it also includes two mass flow control units, wherein the first mass flow control unit M1 is located near the inlet end of the first temperature control flow path and the second mass flow control unit M2 is located near the inlet end of the second temperature control flow path.

[0057] The flow rates into the first and second temperature-controlled flow paths are set by mass flow control units (first mass flow control unit M1 and second mass flow control unit M2), thereby adjusting the temperatures of the first component 101 and / or the second component 102. This allows for feedback regulation of the temperatures of the first component 101 and / or the second component 102, ensuring that they reach the set target temperatures and improving the accuracy of temperature control.

[0058] On the other hand, the present invention also provides a semiconductor processing apparatus, including: a reaction chamber, and a temperature control system as described above. The temperature control system is disposed outside the reaction chamber and is used to regulate the temperature of the first component and the second component located inside the reaction chamber.

[0059] For example, if the first component 101 is an electrostatic chuck, the first temperature control flow path is the cooling channel for the electrostatic chuck; and if the second component 102 is an edge ring, the second temperature control flow path is the cooling channel for the edge ring. Combining the above temperature control system, the refrigerant from three temperature control sources is used to regulate the temperature of the electrostatic chuck and the edge ring, achieving independent temperature control for the two components, i.e., high and low temperature switching.

[0060] In other aspects, the present invention also provides a temperature control method, which is implemented using the temperature control system described above.

[0061] like Figure 4 As shown, the temperature control method includes: a first temperature control step, in which the first three-way valve V1 is switched to its first outlet, the second three-way valve V2 is switched to its first outlet, the third three-way valve V3 is switched to its second outlet, the fourth three-way valve V4 is switched to its first outlet, and the fifth three-way valve V5 is switched to its first outlet.

[0062] At this time, the first temperature fluid output from the first temperature control source 111 flows sequentially through the first outlet of the first three-way valve V1 and the inlet of the first component 101 into the first temperature control flow path, thereby regulating the temperature of the first component 101. Afterwards, the first temperature fluid flows out from the outlet of the first component 101, flows through the first outlet of the fourth three-way valve V4, and returns directly to the first temperature control source 111.

[0063] The second temperature fluid output from the second temperature control source 112 flows sequentially through the first outlet of the second three-way valve V2 and the inlet of the second component 102 into the second temperature control flow path, thereby regulating the temperature of the second component 102. Afterwards, the second temperature fluid flows out from the outlet of the second component 102, flows through the first outlet of the fifth three-way valve V5, and returns directly to the second temperature control source 112.

[0064] At this time, the third temperature fluid output by the third temperature control source 113 returns directly to the third temperature control source 113 through the second outlet of the third three-way valve V, and does not participate in the temperature regulation process of the component. This achieves independent temperature control of the two components.

[0065] In some embodiments, please refer to Figure 4 As shown, when the temperature control system is equipped with a three-way V6 or a shut-off valve, in the first temperature control step, the three-way V6 or shut-off valve is closed to prevent the first temperature fluid and the second temperature fluid from flowing in opposite directions in the same pipe, thereby generating convection or heat exchange and interfering with the temperature control of the first component 101 and the second component 102.

[0066] In some embodiments, the first temperature control step is applicable to a process, such as etching a pair of wafers.

[0067] like Figure 5 As shown, the temperature control method further includes: a second temperature control step, in which the first three-way valve V1 is switched to its second outlet, the second three-way valve V2 is switched to its second outlet, the third three-way valve V3 is switched to its first outlet, the fourth three-way valve V4 is switched to its second outlet, and the fifth three-way valve V5 is switched to its second outlet, so that the fluids in the first and second temperature control flow paths are quickly switched to the third temperature fluid.

[0068] At this time, the first temperature fluid output by the first temperature control source 111 returns directly to the first temperature control source 111 through the second outlet of the first three-way valve V1, and does not participate in the temperature regulation of the first component 101.

[0069] The second temperature fluid output from the second temperature control source 112 returns directly to the second temperature control source 112 through the second outlet of the second three-way valve V2, and does not participate in the temperature regulation of the second component 102.

[0070] The third temperature fluid output by the third temperature control source 113 flows through the first outlet of the third three-way valve V3 and flows into the first temperature control flow path through the inlet end of the first component 101 and into the second temperature control flow path through the inlet end of the second component 102, thereby quickly switching the first temperature fluid in the first temperature control flow path and the second temperature fluid in the second temperature control flow path to the third temperature fluid, thereby achieving rapid switching of the temperature of the first component 101 and the second component 102.

[0071] Subsequently, the third temperature fluid flows out from the first temperature control flow path, passes through the outlet end of the first component 101 and the second outlet of the fourth three-way valve V4, and returns directly to the third temperature control source 113.

[0072] After the third temperature fluid flows out from the second temperature control flow path, it passes through the outlet end of the second component 102 and the second outlet of the fifth three-way valve V5 in sequence and returns directly to the third temperature control source 113.

[0073] Continue to refer to Figure 5 As shown, when the temperature control system is equipped with a three-way V6 or a shut-off valve, the three-way V6 or shut-off valve is opened in the second temperature control step. This allows the third temperature fluid output from the third temperature control source 113 to flow into the first temperature control flow path and the second temperature control flow path, respectively. This enables rapid switching of the temperatures of the first component 101 and the second component 102.

[0074] The second temperature control step is applicable to process gaps, such as process gaps for cleaning the cavity.

[0075] Please continue to refer to this. Figure 3 As shown, a target temperature is set for the first component 101 and / or the second component 102. This target temperature provides feedback control over the flow rates flowing into the first and second temperature-controlled flow paths. The flow rates into the first and second temperature-controlled flow paths are set by mass flow control units (first mass flow control unit M1 and second mass flow control unit M2), thereby adjusting the temperatures of the first component 101 and / or the second component 102. This allows for feedback regulation of the temperatures of the first component 101 and / or the second component 102, improving the accuracy of temperature control.

[0076] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0077] In the description of this invention, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0078] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0079] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A temperature control system for temperature controlling a first component and a second component, the first component having a first temperature control flow path therein for temperature controlling the first component; the second component having a second temperature control flow path therein for temperature controlling the second component, characterized by, The temperature control system comprises: a first temperature control source outputting a first temperature fluid, an inlet of the first temperature control source being communicated with an inlet of a first three-way valve, a first outlet of the first three-way valve being communicated with an inlet end of the first temperature control flow path, and a second outlet of the first three-way valve being communicated with an inlet end of the first temperature control source through a short circuit; a second temperature control source outputting a second temperature fluid, an inlet of the second temperature control source being communicated with an inlet of a second three-way valve, a first outlet of the second three-way valve being communicated with an inlet end of the second temperature control flow path, and a second outlet of the second three-way valve being communicated with an inlet end of the second temperature control source through a short circuit; a third temperature control source outputting a third temperature fluid, an inlet of the third temperature control source being communicated with an inlet of a third three-way valve, a first outlet of the third three-way valve being communicated with the inlet end of the first temperature control flow path and the inlet end of the second temperature control flow path respectively, and a second outlet of the third three-way valve being communicated with an inlet end of the third temperature control source through a short circuit; and a fourth three-way valve, an inlet of the fourth three-way valve being communicated with an outlet end of the first temperature control flow path, a first outlet of the fourth three-way valve being communicated with an inlet end of the first temperature control source, and a second outlet of the fourth three-way valve being communicated with an inlet end of the third temperature control source, a fifth three-way valve, an inlet of the fifth three-way valve being communicated with an outlet end of the second temperature control flow path, a first outlet of the fifth three-way valve being communicated with an inlet end of the second temperature control source, and a second outlet of the fifth three-way valve being communicated with an inlet end of the third temperature control source.

2. The temperature control system of claim 1, wherein an output temperature of the third temperature control source is different from output temperatures of the first temperature control source and the second temperature control source.

3. The temperature control system of claim 1, wherein the first temperature control source and the second temperature control source are cooling sources, and the third temperature control source is a heating source.

4. The temperature control system of claim 3, wherein, output temperatures of the first temperature control source and the second temperature control source are different.

5. The temperature control system of claim 1, wherein, the first outlet of the third three-way valve is communicated with the inlet end of the first temperature control flow path and the inlet end of the second temperature control flow path through a three-way valve respectively.

6. The temperature control system of claim 5, wherein, the inlet end of the first temperature control flow path and the inlet end of the second temperature control flow path are communicated through a shut-off valve.

7. The temperature control system of claim 1, wherein the first component and the second component are any two of an ESC, an edge ring, a gas shower head, an upper grounding ring, and a movable boundary ring respectively.

8. The temperature control system of claim 1, wherein, further comprising: a mass flow control unit, the mass flow control unit being arranged close to the inlet end of the first temperature control flow path and the inlet end of the second temperature control flow path respectively.

9. A semiconductor processing apparatus, characterized by comprising: comprising: a reaction chamber, and the temperature control system of any one of claims 1 to 8; the temperature control system being arranged outside the reaction chamber, and being used for temperature adjustment of the first component and the second component located inside the reaction chamber.

10. A temperature control method characterized by, adopting the temperature control system of any one of claims 1 to 8; the temperature control method comprising: a first temperature control step, causing the first three-way valve to switch to its first outlet, the second three-way valve to switch to its first outlet, the third three-way valve to switch to its second outlet, the fourth three-way valve to switch to its first outlet, and the fifth three-way valve to switch to its first outlet; a second temperature control step, causing the first three-way valve to switch to its second outlet, the second three-way valve to switch to its second outlet, the third three-way valve to switch to its first outlet, the fourth three-way valve to switch to its second outlet, and the fifth three-way valve to switch to its second outlet, causing the fluid in the first and second temperature control flow paths to switch rapidly to the third temperature fluid.

11. The temperature control method of claim 10, wherein, in the first temperature control step, the shut-off valve is closed; in the second temperature control step, the shut-off valve is opened.

12. The temperature control method of claim 10, wherein, a target temperature of the first component and / or the second component is set, the target temperature being feedback controlled with respect to the flow rate into the first and second temperature control flow paths, the flow rate into the first and second temperature control flow paths being set by the mass flow control unit, and the temperature of the first component and / or the second component being adjusted. a first temperature control step, causing the first three-way valve to switch to its first outlet, the second three-way valve to switch to its first outlet, the third three-way valve to switch to its second outlet, the fourth three-way valve to switch to its first outlet, and the fifth three-way valve to switch to its first outlet; a second temperature control step, causing the first three-way valve to switch to its second outlet, the second three-way valve to switch to its second outlet, the third three-way valve to switch to its first outlet, the fourth three-way valve to switch to its second outlet, and the fifth three-way valve to switch to its second outlet, causing the fluid in the first and second temperature control flow paths to switch rapidly to the third temperature fluid. in the first temperature control step, the shut-off valve is closed; in the second temperature control step, the shut-off valve is opened. a target temperature of the first component and / or the second component is set, the target temperature being feedback controlled with respect to the flow rate into the first and second temperature control flow paths, the flow rate into the first and second temperature control flow paths being set by the mass flow control unit, and the temperature of the first component and / or the second component being adjusted.

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