Equipment temperature control method and device, electronic device and storage medium

Abstract

The invention discloses an equipment temperature control method, an equipment temperature control device, an electronic device and a computer readable storage medium, and relates to the technical field of temperature control. The equipment is provided with a plurality of interfaces, the interfaces are connected with an external power device when in a working state, and the control method comprises the following steps: acquiring the shell temperature of the equipment, the environment temperature of the equipment and the total equivalent thermal resistance of active interfaces in the working state on the equipment; performing calculation processing according to the total equivalent thermal resistance, the shell temperature and the environment temperature, and determining the allowable total output power of the equipment; and performing allocation processing according to the allowable total output power and a preset power allocation proportion, and determining target power of each active interface. According to the invention, normal operation of equipment at different environment temperatures can be ensured, and the service life or service power of the equipment is prevented from being seriously influenced.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and more specifically, to a method for controlling the temperature of an equipment, a device for controlling the temperature of an equipment, an electronic device, and a computer-readable storage medium. Background Technology

[0002] When a device operates by connecting high-power components via an interface, its casing temperature can easily rise significantly, affecting its normal operation. Currently, when the device temperature exceeds a certain threshold, a common approach is to directly shut down a portion of the interfaces to reduce the device's total output power and lower its temperature. However, the device's heat dissipation rate varies depending on the ambient temperature, and existing temperature control methods do not consider this. This could lead to the device continuously overheating in high-temperature environments or excessively reducing power in low-temperature environments, impacting its lifespan or efficiency. Summary of the Invention

[0003] This application provides a method for controlling device temperature, a device for controlling device temperature, an electronic device, and a computer-readable storage medium, which can ensure that the device can operate normally under different ambient temperatures and avoid serious impact on the device's service life or power consumption.

[0004] The device temperature control method of this application includes a device having multiple interfaces, which are connected to external power devices when in operation. The control method includes: acquiring the device's casing temperature, the device's ambient temperature, and the total equivalent thermal resistance of the active interfaces on the device in operation; performing calculations based on the total equivalent thermal resistance, the casing temperature, and the ambient temperature to determine the device's allowable total output power; and performing allocation processing based on the allowable total output power and a preset power allocation ratio to determine the target power of each active interface.

[0005] In some implementations, obtaining the total equivalent thermal resistance of the active interfaces in operation on the device includes: obtaining the equivalent thermal resistance of each active interface based on thermal coupling simulation tests or actual tests; and performing parallel calculations based on the equivalent thermal resistance of each active interface to obtain the total equivalent thermal resistance.

[0006] In some embodiments, determining the allowable total output power of the device based on the total equivalent thermal resistance, the casing temperature, and the ambient temperature includes: determining the allowable total output power as zero when the casing temperature is greater than or equal to a preset first temperature threshold; calculating the allowable total output power based on the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature when the casing temperature is less than a preset second temperature threshold, wherein the second temperature threshold is less than the first temperature threshold; and calculating the allowable total output power based on the ambient temperature, the casing temperature, and the second temperature threshold when the casing temperature is greater than or equal to the first temperature threshold and the casing temperature is less than the second temperature threshold.

[0007] In some embodiments, when the casing temperature is less than a preset second temperature threshold, the step of calculating the allowable total output power based on the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature includes: obtaining a preset rated total power; and calculating the allowable total output power based on the rated total power, the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature.

[0008] In some embodiments, when the casing temperature is greater than or equal to the first temperature threshold and the casing temperature is less than the second temperature threshold, the calculation process based on the ambient temperature, the casing temperature, and the second temperature threshold to obtain the allowable total output power includes: calculating a derating slope based on the ambient temperature, a preset reference temperature, a preset reference slope, and a preset ambient temperature correction coefficient; and calculating the allowable total output power based on the derating slope, the casing temperature, and the second temperature threshold.

[0009] In some embodiments, the step of calculating the derating slope based on the ambient temperature, a preset reference temperature, a preset reference slope, and a preset ambient temperature correction coefficient includes: obtaining an upper limit slope and a lower limit slope based on the reference slope, wherein the upper limit slope is greater than the lower limit slope, and both the upper limit slope and the lower limit slope are positively correlated with the reference slope; calculating a transition slope based on the ambient temperature, the preset reference temperature, the preset reference slope, and the preset ambient temperature correction coefficient; determining the lower limit slope as the derating slope when the transition slope is less than the lower limit slope; determining the upper limit slope as the derating slope when the transition slope is greater than the upper limit slope; and determining the transition slope as the derating slope when the transition slope is greater than or equal to the lower limit slope and the transition slope is less than or equal to the upper limit slope.

[0010] In some implementations, the power allocation ratio includes a demand ratio, and the allocation process based on the total allowed output power and the preset power allocation ratio to determine the target power of each active interface includes: obtaining the real-time power demand of the active interface; and performing calculation processing based on the total allowed output power and the real-time power demand to determine the target power of each active interface.

[0011] In some embodiments, the control method further includes: when the target power is less than a preset minimum operating power, controlling the active interface to shut down, and re-executing the process of acquiring the housing temperature of the device, the ambient temperature of the device, and the total equivalent thermal resistance of the active interfaces in operation on the device, and then performing the allocation process according to the allowed total output power and a preset power allocation ratio to determine the target power of each active interface.

[0012] In some implementations, the power allocation ratio includes a priority ratio. The step of allocating power according to the total allowed output power and a preset power allocation ratio to determine the target power of each active interface includes: obtaining the real-time power requirement of the active interface and a preset interface priority, wherein the interface priority includes a first priority and a second priority, and the first priority is greater than the second priority; determining the target power of the active interface with the first priority as the corresponding real-time power requirement according to the total allowed output power; and obtaining the remaining power according to the total allowed output power and the target power of the active interface with the first priority, and determining the target power of the active interface with the second priority according to the remaining power.

[0013] In some embodiments, the control method further includes: when the housing temperature approaches a preset first temperature threshold, disconnecting the interfaces one by one in ascending order of interface priority according to a preset interface priority, until the housing temperature drops to a safe range, wherein the housing temperature approaching the preset first temperature threshold includes the sum of the housing temperature and a preset safety margin being greater than or equal to the first temperature threshold, and the housing temperature dropping to a safe range includes the sum of the housing temperature and the preset safety margin being less than the first temperature threshold.

[0014] This application provides a method for controlling the temperature of a device. The device has multiple interfaces, which are connected to external power devices when in operation. The control device includes an acquisition module, a first determination module, and a second determination module. The acquisition module acquires the device's casing temperature, the device's ambient temperature, and the total equivalent thermal resistance of the active interfaces on the device. The first determination module performs calculations based on the total equivalent thermal resistance, the casing temperature, and the ambient temperature to determine the device's allowable total output power. The second determination module performs allocation processing based on the allowable total output power and a preset power allocation ratio to determine the target power for each active interface.

[0015] This application also provides an electronic device, which includes the device for controlling the device temperature as described in any of the above embodiments.

[0016] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the control method described in any of the above embodiments.

[0017] In the device temperature control method, device temperature control apparatus, electronic device, and computer-readable storage medium provided in this application, the device is equipped with multiple interfaces. When in operation, these interfaces connect to external heat-generating components. The allowable total output power of the device is determined by the device's casing temperature, ambient temperature, and the total equivalent thermal resistance of the active interfaces in operation. Then, power is allocated according to the allowable total output power and a preset power allocation ratio to determine the target power for each active interface. This application considers the ambient temperature of the device in determining its allowable total output power, ensuring that the device can operate normally under different ambient temperatures and avoiding serious impacts on the device's lifespan or power consumption.

[0018] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein: Figure 1 This is a schematic flowchart of a device temperature control method according to some embodiments of this application; Figure 2 This is a schematic diagram of the structure of a device for controlling the temperature of an equipment according to some embodiments of this application; Figure 3 These are example diagrams of a device (smart socket) according to some embodiments of this application; Figure 4 This is a schematic flowchart illustrating the process of obtaining the total equivalent resistance of active interfaces in operation on a device in a device temperature control method according to some embodiments of this application. Figure 5 This is a schematic diagram of the process of determining the allowable total output power of the device based on the total equivalent thermal resistance, the casing temperature and the ambient temperature in the device temperature control method of some embodiments of this application. Figure 6 This is a schematic diagram of the process of calculating the allowable total output power based on the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature in the device temperature control method of some embodiments of this application. Figure 7 This is a schematic diagram of the process of calculating the allowable total output power based on the ambient temperature, the casing temperature and a second temperature threshold in the device temperature control method of some embodiments of this application. Figure 8 This is a schematic diagram of the process of calculating and processing the derating slope based on the ambient temperature, a preset reference temperature, a preset reference slope, and a preset ambient temperature correction coefficient in the equipment temperature control method of some embodiments of this application. Figure 9 This is a flowchart illustrating the process of determining the target power of each active interface by allocating power based on the allowable total output power and a preset power allocation ratio in a device temperature control method according to some embodiments of this application. Figure 10 This is a schematic flowchart of a device temperature control method according to some embodiments of this application; Figure 11 This is a flowchart illustrating the process of determining the target power of each active interface by allocating power based on the allowable total output power and a preset power allocation ratio in a device temperature control method according to some embodiments of this application. Figure 12 This is a schematic diagram of the structure of an electronic device according to some embodiments of this application; Figure 13 This is a schematic diagram illustrating the connection state of a computer-readable storage medium and a processor according to certain embodiments of this application.

[0020] Explanation of key component symbols: Electronic device 100; Equipment temperature control device 10; Acquisition module 11; First determination module 12; Second determination module 13; Processor 20; 200; computer-readable storage medium; 202; computer program; Smart socket 30; Type 1 interface 31; Type 2 interface 32; Type 3 interface 33. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting the embodiments of this application.

[0022] When a device operates by connecting high-power components via an interface, its casing temperature can easily rise significantly, affecting its normal operation. Currently, when the device temperature exceeds a certain threshold, a certain percentage of the interfaces are typically shut down to reduce the device's total output power and lower its temperature. However, the device's heat dissipation rate varies depending on the ambient temperature, and existing temperature control methods do not consider this. This can lead to continuous overheating in high-temperature environments or excessive power reduction in low-temperature environments, affecting the device's lifespan or efficiency. Therefore, enabling the device to adapt to different ambient temperatures is a pressing issue for those skilled in the art. To address this problem, this application provides a device temperature control method (such as...). Figure 1 As shown), the equipment temperature control device (such as...) Figure 2 As shown), electronic devices (such as...) Figure 12 (as shown) and computer-readable storage media (such as Figure 13 (As shown).

[0023] Please see Figures 1 to 3 The device is equipped with multiple interfaces, which are connected to external power devices when in operation. The device temperature control method of this application includes: 03: Obtain the device's casing temperature, the device's ambient temperature, and the total equivalent thermal resistance of the active interfaces on the device that are in operation; 05: Based on the total equivalent thermal resistance, casing temperature, and ambient temperature, calculate and determine the allowable total output power of the equipment; and 07: Based on the total allowed output power and the preset power allocation ratio, the power allocation process is performed to determine the target power of each active interface.

[0024] The above-described method for controlling device temperature can be applied to a device temperature control device 10. The device temperature control device 10 in this embodiment includes an acquisition module 11, a first determination module 12, and a second determination module 13. The acquisition module 11 acquires the device's casing temperature, the device's ambient temperature, and the total equivalent thermal resistance of the active interfaces on the device that are in operation. The first determination module 12 performs calculations based on the total equivalent thermal resistance, casing temperature, and ambient temperature to determine the device's allowable total output power. The second determination module 13 performs allocation processing based on the allowable total output power and a preset power allocation ratio to determine the target power for each active interface.

[0025] Specifically, the device temperature control device 10 manages the heat dissipation and power output of devices (such as energy storage devices, smart sockets, and other electronic devices with multiple interfaces). The device temperature control device 10 can be installed on the device itself or on any remote control device outside the device. The device temperature control device 10 ensures that the device operates stably within a safe temperature range. By monitoring the temperature parameters of the casing and the environment in real time, as well as the interface status of the device itself, the device temperature control device 10 dynamically adjusts the output power of the interfaces, ensuring that the device can adapt to different ambient temperatures while also preventing the device from malfunctioning due to excessively high casing temperatures.

[0026] More specifically, the device temperature control device 10 includes an acquisition module 11, a first determination module 12, and a second determination module 13. The acquisition module 11 is responsible for collecting key parameters during device operation, including the device's casing temperature, ambient temperature, and the total equivalent thermal resistance of the currently operating interface. The first determination module 12 calculates and analyzes the collected temperature data and interface heat dissipation characteristics to determine the upper limit of the device's total output power under the current thermal state. The first determination module 12 ensures that the output power will not cause the device to overheat and adapts to heat dissipation conditions under different ambient temperatures. The second determination module 13, based on the determined upper limit of total output power and a preset allocation ratio, rationally distributes the total output power to each operating interface. The second determination module 13 ensures that each interface receives power support as needed or according to priority, and can smoothly adjust the output when necessary to avoid sudden load changes or device malfunctions. This process will be explained in more detail later.

[0027] Further, please refer to Figure 3 , Figure 3 This is an example diagram of a device (smart socket) provided in an embodiment of this application. Figure 3The smart socket features multiple types of interfaces. Interface 31 is a USB-C interface, interface 32 is a USB-A interface, and interface 33 is an AC interface. Interfaces 31 and 32 are used to connect external power devices such as mobile phones, tablets, and power banks to charge them. These external power devices can be charged even with a significant reduction in power output from the interface. Interface 33, however, is used to connect power devices such as electric water heaters, which cannot operate with a significant reduction in power output from the interface.

[0028] Furthermore, the casing temperature refers to the real-time temperature of the metal or plastic casing of the smart socket, which reflects the internal heating state of the device. Ambient temperature refers to the temperature of the air surrounding the socket, which affects the device's heat dissipation efficiency. The total equivalent thermal resistance of active interfaces refers to the overall heat dissipation difficulty when multiple working interfaces (such as AC sockets and USB-C ports) are connected in parallel. The smaller the equivalent thermal resistance of an interface, the stronger its heat dissipation capacity; the larger the equivalent thermal resistance, the easier it is for heat to accumulate. Equivalent thermal resistance describes the difficulty of heat transfer from the interior to the environment; the higher the value, the more difficult the heat dissipation. In step 03, the thermal state of the device itself and the environment is monitored in real time by a temperature sensor, and the comprehensive heat dissipation performance parameters of all currently working interfaces (such as charging ports and socket ports used simultaneously) are calculated, providing a basis for subsequent power control.

[0029] It is understood that this application provides a method for controlling the temperature of a device. The device has multiple interfaces, which are connected to external heat-generating components when in operation. The allowable total output power of the device is determined by the device's casing temperature, ambient temperature, and the total equivalent thermal resistance of the active interfaces in operation. Then, the power is allocated according to the allowable total output power and a preset power distribution ratio to determine the target power for each active interface. This application considers the ambient temperature of the device in determining its allowable total output power, ensuring that the device can operate normally under different ambient temperatures and avoiding serious impacts on the device's lifespan or power consumption.

[0030] In some implementations, please refer to Figure 4 03: Obtain the total equivalent thermal resistance of the active interfaces on the device that are in operation, including: 031: Obtain the equivalent thermal resistance of each active interface based on thermal coupling simulation tests or actual tests; and 032: Perform parallel calculations based on the equivalent thermal resistance of each active interface to obtain the total equivalent thermal resistance.

[0031] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The acquisition module 11 in this embodiment is also used to acquire the equivalent thermal resistance of each active interface based on thermal coupling simulation test or actual test; and to perform parallel calculation processing based on the equivalent thermal resistance of each active interface to obtain the total equivalent thermal resistance.

[0032] Specifically, equivalent thermal resistance (ETR) refers to the resistance to heat transfer generated by a single interface (such as an AC socket or USB-C port) during operation. ERT reflects the difficulty of heat transfer from the inside of the interface to the outer casing; the higher the ERT, the lower the heat dissipation efficiency (analogous to the increased resistance of water flowing through a narrow pipe). The ERT of each active interface can be obtained through thermal coupling simulation testing or actual testing. Taking a smart socket as an example, thermal coupling simulation testing is conducted during the socket design phase, using a computer to simulate the heat conduction characteristics of each interface under high-temperature scenarios to calculate the theoretical thermal resistance value. Actual testing (single-port loading method or port-by-port loading method) applies a specific power load to the finished socket, directly monitors the interface temperature rise curve using temperature sensors, and calculates the precise thermal resistance value in reverse.

[0033] Specifically, the total equivalent thermal resistance is obtained by parallel calculation based on the equivalent thermal resistance of each active interface. The total equivalent thermal resistance can be calculated using the following formula: ; Among them, R th,i It is the equivalent thermal resistance from the i-th active interface to the housing.

[0034] Please combine Figure 5 In some implementations, 05: Determine the permissible total output power of the device based on the total equivalent thermal resistance, the casing temperature, and the ambient temperature, including: 051: When the casing temperature is greater than or equal to a preset first temperature threshold, the total allowable output power is determined to be zero. 052: When the casing temperature is lower than a preset second temperature threshold, the allowable total output power is calculated based on the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature. The second temperature threshold is lower than the first temperature threshold. 053: When the casing temperature is greater than or equal to the first temperature threshold and less than the second temperature threshold, the allowable total output power is obtained by calculation based on the ambient temperature, casing temperature and the second temperature threshold.

[0035] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The first determining module 12 of the present application embodiment is further used to: determine that the allowable total output power is zero when the shell temperature is greater than or equal to a preset first temperature threshold; calculate the allowable total output power based on the total equivalent thermal resistance, the second temperature threshold and the ambient temperature when the shell temperature is less than a preset second temperature threshold, wherein the second temperature threshold is less than the first temperature threshold; and calculate the allowable total output power based on the ambient temperature, the shell temperature and the second temperature threshold when the shell temperature is greater than or equal to the first temperature threshold and the shell temperature is less than the second temperature threshold.

[0036] Specifically, this embodiment divides power control into three ranges by comparing the casing temperature with a preset first temperature threshold (set according to safety standards and material limits, such as 60–85°C) and a second temperature threshold (set according to material heat resistance and user comfort, such as 45–60°C), thereby realizing a graded protection mechanism of high temperature shutdown, safety derating, and normal output.

[0037] Furthermore, when the casing temperature reaches or exceeds the first temperature threshold, the first determining module 12 determines that the allowable total output power is zero. For example, at this time, all interfaces can be shut down, which can prevent the equipment from burning out or causing a fire. However, when the casing temperature is less than the preset second temperature threshold, or when the casing temperature is greater than or equal to the first temperature threshold and less than the second temperature threshold, further calculations are needed to determine the allowable total output power.

[0038] Furthermore, the total output power can be calculated using the following formula: ; Among them, P max This is the maximum total output power allowed under the current thermal conditions (the calculation process is described below), T1 is the second temperature threshold, T2 is the first temperature threshold, k is the derating slope (the calculation process is described below), and P... out It is the allowed total output power.

[0039] Please see Figure 6 In some embodiments, 052: when the casing temperature is less than a preset second temperature threshold, the allowable total output power is calculated based on the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature, including: 0521: Obtain the preset rated total power; and 0522: The allowable total output power is obtained by calculating based on the rated total power, total equivalent thermal resistance, second temperature threshold and ambient temperature.

[0040] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The first determining module 12 in the embodiment of this application is also used to: obtain the preset rated total power; and perform calculation processing based on the rated total power, total equivalent thermal resistance, second temperature threshold and ambient temperature to obtain the allowable total output power.

[0041] Specifically, the preset rated total power is the maximum theoretical output power set at the factory. The equipment can operate safely when the casing temperature is below the second temperature threshold. The permissible total output power at this time can be calculated using the following formula: ; Among them, P rated It is the preset rated total power, R th，total It is the total equivalent thermal resistance of the active interface.

[0042] Please see Figure 7 In some embodiments, when the casing temperature is greater than or equal to a first temperature threshold and less than a second temperature threshold, 053: Calculations are performed based on the ambient temperature, casing temperature, and the second temperature threshold to obtain the allowable total output power, including: 0531: The derating slope is calculated based on the ambient temperature, preset reference temperature, preset reference slope, and preset ambient temperature correction coefficient; and 0533: The total allowable output power is obtained by calculating based on the derating slope, casing temperature, and second temperature threshold.

[0043] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The first determining module 12 of the present application embodiment is further used to: calculate and process based on the ambient temperature, the preset reference temperature, the preset reference slope and the preset ambient temperature correction coefficient to obtain the derating slope; and calculate and process based on the derating slope, the casing temperature and the second temperature threshold to obtain the allowable total output power.

[0044] Specifically, the maximum total output power P allowed under the current thermal conditions is defined as follows: when the casing temperature is greater than or equal to a first temperature threshold and the casing temperature is less than a second temperature threshold. max The total output power is determined by the total equivalent thermal resistance and the available temperature margin, which is determined by the difference between the second temperature threshold and the ambient temperature. Therefore, when the casing temperature is less than the preset second temperature threshold, the allowable total output power can be calculated by the following formula: k(T amb )=k0[1 α(T amb T ref )]; Where k0 is the reference ambient temperature T ref The derating slope is α, which is the ambient temperature correction factor (unit: K). 1 ), describing the sensitivity of the slope to changes in ambient temperature; T ref This is the reference ambient temperature (which can be 25°C). To ensure that at the reference ambient temperature T... ref The lower linear amplitude reduction satisfies the full-scale relationship, so the reference slope k0 = P can be taken. max / T2 T1 (at T) amb =T ref hour).

[0045] Please see Figure 8 In some embodiments, 0531: Calculations are performed based on the ambient temperature, a preset reference temperature, a preset reference slope, and a preset ambient temperature correction coefficient to obtain the derating slope, including: 05311: Based on the baseline slope, obtain the upper limit slope and lower limit slope. The upper limit slope is greater than the lower limit slope, and both the upper limit slope and the lower limit slope are positively correlated with the baseline slope. 05313: The transition slope is obtained by calculating based on the ambient temperature, the preset reference temperature, the preset reference slope, and the preset ambient temperature correction coefficient. 05315: When the transition slope is less than the lower limit slope, the lower limit slope is determined to be the depreciation slope; 05317: When the transition slope is greater than the upper limit slope, the upper limit slope is determined to be the reduction slope; and 05319: When the transition slope is greater than or equal to the lower limit slope and less than or equal to the upper limit slope, the transition slope is determined to be the depreciation slope.

[0046] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The first determining module 12 in this embodiment is further used to obtain the upper limit slope and the lower limit slope based on the reference slope, wherein the upper limit slope is greater than the lower limit slope, and both the upper limit slope and the lower limit slope are positively correlated with the reference slope; to calculate and process based on the ambient temperature, the preset reference temperature, the preset reference slope, and the preset ambient temperature correction coefficient to obtain the transition slope; when the transition slope is less than the lower limit slope, the lower limit slope is determined to be the derating slope; when the transition slope is greater than the upper limit slope, the upper limit slope is determined to be the derating slope; and when the transition slope is greater than or equal to the lower limit slope and the transition slope is less than or equal to the upper limit slope, the transition slope is determined to be the derating slope.

[0047] Specifically, the first determining module 12 sets two protection values ​​based on a preset reference slope: an upper limit slope and a lower limit slope. Both the upper and lower limit slopes are positively correlated with the reference slope, with the upper limit slope being greater than the lower limit slope. The upper and lower limit slopes are used to constrain the fluctuation range of subsequent calculations. The first determining module 12 dynamically calculates the theoretical transition slope based on the current ambient temperature, the preset reference temperature, the reference slope, and the ambient temperature correction coefficient. The transition slope reflects the power reduction requirement under actual temperature conditions. The first determining module 12 determines the final effective derating slope through a three-level protection criterion: if the transition slope is lower than the lower limit, the lower limit value is used to avoid insufficient derating; if it is higher than the upper limit, the upper limit value is used to prevent excessive derating; only when the transition slope is between the upper and lower limits is the calculated value used directly. This mechanism, through the combination of preset range protection and dynamic correction of environmental parameters, ensures that the derating slope is always within a reasonable range under sudden changes in ambient temperature or extreme operating conditions, preventing both overheating risks and performance waste, and achieving a balance between safety and efficiency.

[0048] Furthermore, the upper and lower slopes can be 1.5 times k0 and 0.1 times k0, respectively. From the formula above: k(T) amb )=k0[1 α(T amb T ref It can be seen that T amb The smaller the value of k, the larger the value of k. Therefore, if the ambient temperature is too high, it will cause k to decrease indefinitely, resulting in a sharp drop in output power. Conversely, if the ambient temperature is too low, it will cause k to be too large, resulting in excessively high output power. Therefore, it is necessary to limit k by using upper limit slope and lower limit slope to ensure that the device adjusts the total output power within a suitable range.

[0049] Please see Figure 9 In some implementations, 07: Based on the allowed total output power and a preset power allocation ratio, an allocation process is performed to determine the target power for each active interface, including: 071: Obtain the real-time power requirements of active interfaces; and 072: Calculate the target power for each active interface based on the total allowed output power and the immediate power requirement.

[0050] The above-described method for controlling the temperature of an equipment can be applied to the equipment temperature control device 10. The second determining module 13 in this embodiment is further used to: obtain the instantaneous power demand of the active interface; and perform calculation processing based on the allowed total output power and the instantaneous power demand to determine the target power of each active interface.

[0051] Specifically, in step 071, the second determining module 13 collects in real time the actual power demand of each active interface (such as AC socket, USB-C port, etc.) (e.g., 18W for fast charging of a mobile phone, 30W for an electric fan). This step directly reads the dynamic load demand of each interface through built-in current and voltage sensors, forming the original basis for power allocation and ensuring that subsequent allocation responds to real power consumption scenarios. In step 072, the target power allocated to each active interface is calculated using the following formula: ; Among them, P req,i This represents the real-time power demand of active interfaces; "active" indicates the set of active interfaces. This can be viewed as the target power for each active interface. Alternatively, the total allowable output power can be allocated according to the rated proportions.

[0052] Please see Figure 10 In some implementations, the control method further includes: 08: If the target power is less than the preset minimum operating power, control the active interface to shut down, and re-execute the process of acquiring the device's casing temperature, the device's ambient temperature, and the total equivalent resistance of the active interfaces on the device that are in operation, and then allocate the power according to the allowed total output power and the preset power allocation ratio to determine the target power of each active interface.

[0053] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The equipment temperature control device 10 is also used to control the active interface to shut down when the target power is less than the preset minimum operating power, and to re-execute the acquisition of the equipment casing temperature, the equipment ambient temperature, and the total equivalent resistance of the active interfaces in the working state on the equipment to perform allocation processing according to the allowed total output power and the preset power allocation ratio, and determine the target power of each active interface.

[0054] Specifically, when the device temperature control unit 10 calculates that the target power of a certain active interface is lower than its preset minimum operating power (e.g., 0.5W), it immediately shuts down the interface to prevent unnecessary power consumption. Simultaneously, due to changes in interface status (a decrease in active interfaces), the temperature control closed-loop process needs to be restarted: starting with real-time acquisition of the casing temperature, ambient temperature, and the equivalent resistance of the active interfaces, the total equivalent thermal resistance and allowable total output power are recalculated, and the target power is reallocated based on the updated total power and interface requirements. This design avoids power waste caused by localized inefficient power consumption through abnormal shutdown, state reset, and dynamic reallocation.

[0055] Please see Figure 11In some implementations, the power allocation ratio includes a priority ratio. 07: Based on the allowed total output power and a preset power allocation ratio, the allocation process determines the target power for each active interface, including: 073: Obtain the real-time power requirements and preset interface priorities of active interfaces. Interface priorities include first priority and second priority, with the first priority being greater than the second priority. 074: Based on the total allowed output power, determine the target power of the active interface with the highest priority as the corresponding immediate power requirement; and 075: Based on the total allowed output power and the target power of the active interface with the first priority, obtain the remaining power, and determine the target power of the active interface with the second priority based on the remaining power.

[0056] The above-mentioned equipment temperature control method can be applied to the equipment temperature control device 10. The second determining module 13 is further used to: obtain the instantaneous power demand of the active interface and the preset interface priority, the interface priority including a first priority and a second priority, the first priority being greater than the second priority; determine the target power of the active interface with the first priority as the corresponding instantaneous power demand based on the total allowed output power; and obtain the remaining power based on the total allowed output power and the target power of the active interface with the first priority, and determine the target power of the active interface with the second priority based on the remaining power.

[0057] Specifically, step 073 obtains the real-time power requirements of all active interfaces (e.g., 30W for the AC port and 18W for the USB-C port) and their preset priority labels (e.g., AC port is the first priority and USB-C is the second priority). A two-step allocation process is then executed: step 074 forcibly allocates the total allowed power to the first priority interface, directly satisfying its entire real-time demand (if the total power is sufficient); if the total power is insufficient, it is reduced proportionally according to the demand. In step 075, the remaining power (total allowed power minus the portion already allocated to the first priority interface) is allocated to the second priority interface; if still insufficient, it is reduced proportionally again. This mechanism ensures that in high-temperature derating scenarios, critical equipment (such as medical instruments) receives priority power support, while secondary equipment (such as mobile phone charging) only operates when redundant power is available, thus meeting core user needs while avoiding the risk of power overload.

[0058] Furthermore, for interfaces requiring gradual derating (such as USB interfaces), current limiting or voltage limiting can be used to achieve a smooth derating, avoiding device or load anomalies caused by momentary disconnections. For interfaces supporting communication (such as USB PD), derating can be achieved through protocol negotiation (e.g., downgrading to a lower PD level or requesting a lower current). Please see Figure 10In some implementations, the control method further includes: 06: When the casing temperature approaches the preset first temperature threshold, disconnect the interfaces one by one according to the preset interface priority in ascending order, until the casing temperature drops to a safe range. Here, the casing temperature approaching the preset first temperature threshold includes the sum of the casing temperature and the preset safety margin being greater than or equal to the first temperature threshold, and the casing temperature dropping to a safe range includes the sum of the casing temperature and the preset safety margin being less than the first temperature threshold.

[0059] The above-mentioned method for controlling the equipment temperature can be applied to the equipment temperature control device 10. The equipment temperature control device 10 is also used to disconnect the interfaces one by one in order of low to high priority according to the preset interface priority when the housing temperature is close to the preset first temperature threshold, until the housing temperature drops to a safe range. The housing temperature being close to the preset first temperature threshold includes the sum of the housing temperature and the preset safety margin being greater than or equal to the first temperature threshold, and the housing temperature dropping to a safe range includes the sum of the housing temperature and the preset safety margin being less than the first temperature threshold.

[0060] Understandably, when the sum of the casing temperature and the preset safety margin is detected to approach the first temperature threshold (i.e., the highest safe temperature critical point), the device temperature control device 10 activates an emergency protection mechanism—starting from the lowest priority active interface, it forcibly disconnects them one by one (e.g., first shutting down the USB interface with lower charging priority, while retaining the high-priority AC power supply), gradually reducing the load power to cause the casing temperature to drop until the "current temperature + safety margin" falls below the first threshold again, at which point the disconnection operation stops (indicating that the system has returned to the safe range). The purpose of this application's implementation is to quickly curb the risk of temperature rise by actively unloading the load, gradually disconnecting low-priority interfaces while retaining core power supply (e.g., when the power supply to the AC interface needs to be retained).

[0061] In summary, the device temperature control device 10 provided in this application has multiple interfaces on the device. These interfaces connect to external heat-generating components when in operation. The allowable total output power of the device is determined by the device's casing temperature, ambient temperature, and the total equivalent resistance of the active interfaces in operation. Then, the power is allocated according to the allowable total output power and a preset power allocation ratio to determine the target power for each active interface. This application considers the ambient temperature of the device in determining its allowable total output power, ensuring that the device can operate normally under different ambient temperatures and avoiding serious impacts on the device's lifespan or power consumption.

[0062] Please see Figure 12In some embodiments, this application also provides an electronic device 100, which includes a device temperature control device 10 from any of the above embodiments. Please see Figure 13 In some embodiments, this application also provides a computer-readable storage medium 200 having a computer program 202 stored thereon, which, when executed by a processor, implements the method in any of the above embodiments.

[0063] For example, when computer program 202 is executed by processor 20, the following method is implemented: 03: Obtain the device's casing temperature, the device's ambient temperature, and the total equivalent resistance of the active interfaces on the device that are in operation; 05: Based on the total equivalent thermal resistance, casing temperature, and ambient temperature, calculate and determine the allowable total output power of the equipment; and 07: Based on the total allowed output power and the preset power allocation ratio, the power allocation process is performed to determine the target power of each active interface.

[0064] For example, when computer program 202 is executed by processor 20, the following method is implemented: 031: Obtain the equivalent resistance of each active interface based on thermal coupling simulation tests or actual tests; and 032: Perform parallel calculations based on the equivalent resistance of each active interface to obtain the total equivalent resistance.

[0065] For example, when computer program 202 is executed by processor 20, it can also implement the methods in 051, 052, 0521, 0522, 053, 0531, 05311, 05313, 05315, 05317, 05319, 0533, 06, 071, 072, 073, 074, 075 and 08.

[0066] In the computer-readable storage medium 200 of this application, the device is provided with multiple interfaces. When the interfaces are in the working state, they are connected to external heat-generating components. The allowable total output power of the device is determined by the device's casing temperature, the ambient temperature of the device, and the total equivalent resistance of the active interfaces in the working state. Then, the power is allocated according to the allowable total output power and a preset power allocation ratio to determine the target power of each active interface. This application takes into account the ambient temperature of the device in the process of determining the allowable total output power of the device, ensuring that the device can operate normally under different ambient temperatures and avoiding serious impact on the device's service life or power consumption.

[0067] In the description of this specification, the references to terms such as "some embodiments," "in one example," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0068] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order according to the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.

[0069] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method of controlling the temperature of a device, characterized by, The device is provided with multiple interfaces, which are connected with external power devices when in working state, and the control method comprises: obtaining the shell temperature of the device, the ambient temperature of the device, and the total equivalent thermal resistance of active interfaces of the device in working state; performing calculation processing according to the total equivalent thermal resistance, the shell temperature, and the ambient temperature to determine the allowed total output power of the device; and performing distribution processing according to the allowed total output power and a preset power distribution ratio to determine the target power of each active interface.

2. The control method according to claim 1, characterized by, The obtaining of the total equivalent thermal resistance of active interfaces of the device in working state comprises: obtaining the equivalent thermal resistance of each active interface according to thermal coupling simulation testing or actual testing; and performing parallel calculation processing according to the equivalent thermal resistance of each active interface to obtain the total equivalent thermal resistance.

3. The control method according to claim 1, characterized by, The determination of the allowed total output power of the device according to the total equivalent thermal resistance, the shell temperature, and the ambient temperature comprises: in the case that the shell temperature is greater than or equal to a preset first temperature threshold, determining the allowed total output power as zero; in the case that the shell temperature is less than a preset second temperature threshold, performing calculation processing according to the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature to obtain the allowed total output power, the second temperature threshold being less than the first temperature threshold; and in the case that the shell temperature is greater than or equal to the first temperature threshold and less than the second temperature threshold, performing calculation processing according to the ambient temperature, the shell temperature, and the second temperature threshold to obtain the allowed total output power.

4. The control method according to claim 3, characterized by In the case that the shell temperature is less than a preset second temperature threshold, the performing of calculation processing according to the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature to obtain the allowed total output power comprises: obtaining a preset rated total power; and performing calculation processing according to the rated total power, the total equivalent thermal resistance, the second temperature threshold, and the ambient temperature to obtain the allowed total output power.

5. The control method according to claim 3, characterized by In the case that the shell temperature is greater than or equal to the first temperature threshold and less than the second temperature threshold, the performing of calculation processing according to the ambient temperature, the shell temperature, and the second temperature threshold to obtain the allowed total output power comprises: performing calculation processing according to the ambient temperature, a preset reference temperature, a preset reference slope, and a preset ambient temperature correction coefficient to obtain a derating slope; and performing calculation processing according to the derating slope, the shell temperature, and the second temperature threshold to obtain the allowed total output power.

6. The control method according to claim 5, characterized by The performing of calculation processing according to the ambient temperature, a preset reference temperature, a preset reference slope, and a preset ambient temperature correction coefficient to obtain a derating slope comprises: obtaining an upper limit slope and a lower limit slope according to the reference slope, the upper limit slope being greater than the lower limit slope, and the upper limit slope and the lower limit slope being positively correlated with the reference slope; and performing calculation processing according to the ambient temperature, the reference temperature, the upper limit slope, the lower limit slope, and the ambient temperature correction coefficient to obtain the derating slope. The transition slope is calculated according to the ambient temperature, the preset reference temperature, the preset reference slope, and a preset ambient temperature correction coefficient; In a case where the transition slope is less than the lower limit slope, the lower limit slope is determined as the derating slope; In a case where the transition slope is greater than the upper limit slope, the upper limit slope is determined as the derating slope; and In a case where the transition slope is greater than or equal to the lower limit slope and less than or equal to the upper limit slope, the transition slope is determined as the derating slope.

7. The control method according to claim 1, characterized by, The power distribution ratio includes a demand ratio, and the allocation processing according to the allowed total output power and the preset power distribution ratio to determine the target power of each active interface includes: obtaining an instantaneous power demand of the active interface; and calculating the target power of each active interface according to the allowed total output power and the instantaneous power demand.

8. The control method according to claim 7, characterized by, The control method further includes: In a case where the target power is less than a preset minimum working power, the active interface is controlled to be turned off, and the obtaining of the shell temperature of the device, the ambient temperature of the device, and the total equivalent thermal resistance of the active interface in a working state on the device, and the allocation processing according to the allowed total output power and the preset power distribution ratio to determine the target power of each active interface are re-executed.

9. The control method according to claim 1, characterized by, The power distribution ratio includes a priority ratio, and the allocation processing according to the allowed total output power and the preset power distribution ratio to determine the target power of each active interface includes: obtaining an instantaneous power demand of the active interface and a preset interface priority, the interface priority including a first priority and a second priority, the first priority being greater than the second priority; determining the target power of the active interface with the first priority as the corresponding instantaneous power demand according to the allowed total output power; and obtaining a remaining power according to the allowed total output power and the target power of the active interface with the first priority, and determining the target power of the active interface with the second priority according to the remaining power.

10. The control method according to claim 1, characterized by, The control method further includes: In a case where the shell temperature approaches a preset first temperature threshold, the interfaces are disconnected one by one according to the preset interface priority in an order from low to high of the interface priority until the shell temperature is reduced to a safe range according to the preset interface priority, wherein the shell temperature approaches the preset first temperature threshold includes that a sum of the shell temperature and a preset safety margin is greater than or equal to the first temperature threshold, and the shell temperature is reduced to a safe range includes that the sum of the shell temperature and the preset safety margin is less than the first temperature threshold.

11. A device for controlling the temperature of an equipment, characterized in that, The device is provided with a plurality of interfaces, the interfaces are connected with external power devices when in a working state, and the control device includes: an obtaining module, configured to obtain a shell temperature of the device, an ambient temperature of the device, and a total equivalent thermal resistance of active interfaces in a working state on the device; The first determining module is configured to determine the allowed total output power of the device according to the total equivalent thermal resistance, the shell temperature and the ambient temperature through calculation processing. The second determining module is configured to determine the target power of each active interface according to the allowed total output power and preset power distribution ratio through distribution processing.

12. An electronic device, comprising: The electronic device comprises the device temperature control device of claim 11.

13. A computer readable storage medium having stored thereon a computer program, characterized in that The program is executed by the processor to implement the control method of any one of claims 1-10.

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