Mold temperature system, control method thereof and storage medium

Abstract

The invention discloses a mold temperature system, a control method thereof and a storage medium, and relates to the field of industrial temperature control, and the method comprises the following steps: obtaining operation parameters of the mold temperature system, and obtaining the production yield of the mold temperature system; under the condition that the production yield is smaller than a preset yield threshold value, control parameters of the mold temperature system are adjusted based on the operation parameters, and correction parameters are obtained; and controlling the mold temperature system to operate based on the corrected parameters so as to improve the production yield of the mold temperature system. Because the operation parameters can reflect the operation condition of the mold temperature system, the control parameters of the mold temperature system can be adjusted to obtain the correction parameters based on the operation parameters under the condition that the production yield is smaller than the preset yield threshold value, so that the parameters which cause that the production yield is lower than the preset yield threshold value in the operation parameters can be optimized; the mold temperature system operating according to the correction parameters can have higher production yield, and the technical problem that the production yield of the mold temperature system is low is solved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of industrial temperature control, and in particular to a mold temperature system and a control method thereof, and a storage medium. BACKGROUND

[0002] In the manufacturing field of injection molding, die casting, etc., a mold temperature system (e.g., a mold temperature machine) is a key device for controlling the temperature of a mold. However, the traditional mold temperature machine has a single function and can only achieve basic temperature control, for example, the mold temperature system operates based on a temperature set by a human being, etc. However, it is found in actual application that even if the mold temperature system operates at the temperature set by the human being and maintains the temperature at a relatively stable state, the mold temperature system can still have a high production failure rate. Therefore, there is currently a technical problem of low production yield of the mold temperature system.

[0003] The above content is only used to assist in understanding the technical solutions of the embodiments of the present application and does not represent an acknowledgement that the above content is prior art. SUMMARY

[0004] The main purpose of the embodiments of the present application is to provide a mold temperature system and a control method thereof, and a storage medium, aiming to solve the technical problem of low production yield of the mold temperature system.

[0005] To achieve the above-mentioned purpose, the embodiments of the present application provide a control method of a mold temperature system, which comprises: obtaining an operating parameter of the mold temperature system, and obtaining a production yield of the mold temperature system; in the case that the production yield is less than a preset yield threshold, adjusting a control parameter of the mold temperature system based on the operating parameter to obtain a corrected parameter; controlling the mold temperature system to operate based on the corrected parameter to improve the production yield of the mold temperature system.

[0006] In an embodiment, the step of obtaining the production yield of the mold temperature system comprises: inputting the operating parameter into a health degree model that has been pre-trained to output the production yield of the mold temperature system under the operating parameter through the health degree model.

[0007] In an embodiment, the control parameter comprises a set temperature and / or a set pressure, and the corrected parameter comprises a corrected temperature and / or a corrected pressure. The step of adjusting the control parameter of the mold temperature system based on the operating parameter to obtain the corrected parameter in the case that the production yield is less than the preset yield threshold comprises: calling a preset maintenance model to output a failure reason that causes the production yield to be less than the preset yield threshold based on the operating parameter; In a case where the cause of the abnormality includes temperature abnormality, a set temperature of the mold temperature system is corrected by the preset maintenance model to obtain a corrected temperature; In a case where the cause of the abnormality includes pressure abnormality, a set pressure of the mold temperature system is corrected by the preset maintenance model to obtain a corrected pressure.

[0008] In an embodiment, based on the corrected parameter, the step of controlling the mold temperature system to operate includes: A correction credibility of the corrected parameter is obtained by the preset maintenance model, in a case where the corrected parameter is in a preset normal range of parameter, and the correction credibility is greater than a preset credibility threshold, the mold temperature system is controlled to operate according to the corrected parameter; In a case where the correction credibility is less than or equal to the preset credibility threshold, and / or the corrected parameter is not in the preset normal range of parameter, an abnormal correction prompt is output, and the mold temperature system is controlled to operate according to a control parameter before the correction of the corrected parameter, or according to a feedback parameter obtained by external feedback based on the abnormal correction prompt.

[0009] In an embodiment, the control method of the mold temperature system further includes: Obtaining cumulative operation data of the mold temperature system, and a production plan of the mold temperature system; Calling a preset maintenance model, and generating maintenance data of the mold temperature system based on the cumulative operation data and the production plan.

[0010] In an embodiment, the maintenance data includes a target maintenance period and a maintenance component; The step of calling the preset maintenance model, and generating the maintenance data of the mold temperature system based on the cumulative operation data and the production plan includes: Inputting the cumulative operation data into the preset maintenance model, generating a component health degree of at least one component in the mold temperature system by the preset maintenance model, and determining a maintenance component in each component based on the component health degree of each component; Inputting the production plan into the preset maintenance model, and outputting a maintainable period without interrupting the production plan by the preset maintenance model; Determining a target maintenance period of each maintenance component based on the component health degree of each maintenance component and the maintainable period.

[0011] In an embodiment, the cumulative operation data at least includes one of the following: pump operation data of a pump in the mold temperature system, valve operation data of a solenoid valve, and heating operation data of a heating control assembly; The component health of the pump includes the pump's remaining lifespan and wear condition; the component health of the solenoid valve includes the valve's remaining lifespan; and the component health of the heating control assembly includes the component's remaining lifespan. The step of generating the component health status of at least one component in the mold temperature system through the preset maintenance model includes: When the cumulative operating data includes pump operating data, the remaining life of the pump is output by the preset maintenance model based on the cumulative running time, average operating current and number of start-stop times in the pump operating data, and the wear status of the pump is generated based on the current operating pressure, historical operating pressure and current operating current in the pump operating data. When the cumulative operating data includes the valve operating data, the remaining lifespan of the solenoid valve is generated by the preset maintenance model based on the cumulative number of switching times, cumulative energization time, and valve temperature in the valve operating data. When the cumulative operating data includes the heating operating data, the remaining lifespan of the heating control component is generated by the preset maintenance model based on the heating operating duration and the number of heating switches in the heating operating data.

[0012] In one embodiment, the mold temperature system includes a circulating water circuit and a cooling water circuit that exchanges heat with the circulating water circuit. A pressure relief valve is installed on the circulating water circuit, and a cold water pump and a cold water valve are installed on the cooling water circuit. The control method further includes: The current operating temperature of the circulating water circuit is obtained. If the operating temperature is greater than the current set temperature of the mold temperature system, the cold water valve and cold water pump are turned on to cool the circulating water circuit. If the operating temperature is lower than the current set temperature of the mold temperature system, increase the operating temperature of the mold temperature system and detect the operating pressure of the circulating water circuit; If the operating pressure is greater than the current set pressure of the mold temperature system, a pressure relief operation is performed through the pressure relief valve.

[0013] In one embodiment, the circulating water circuit is further equipped with a water storage device and a booster pump, and a level switch is installed at the highest preset liquid level of the water storage device. The control method further includes: The on / off state of the liquid level switch is detected, and if the switch is off, water is added to the circulating water circuit by a booster pump.

[0014] Furthermore, to achieve the above objectives, embodiments of this application provide a control device for a mold temperature system, the device comprising: The acquisition module is used to acquire the operating parameters of the mold temperature system and the production yield of the mold temperature system. The correction module is used to adjust the control parameters of the mold temperature system based on the operating parameters to obtain correction parameters when the production yield is less than a preset yield threshold. The control module is used to control the operation of the mold temperature system based on the correction parameters, so as to improve the production yield of the mold temperature system.

[0015] Furthermore, to achieve the above objectives, this application embodiment also provides a mold temperature system, the mold temperature system including: a memory, a processor, and a program for a control method of the mold temperature system stored in the memory and executable on the processor, wherein when the program for the control method of the mold temperature system is executed by the processor, the steps of the control method of the mold temperature system as described above can be implemented.

[0016] In addition, to achieve the above objectives, embodiments of this application also provide a computer-readable storage medium storing a program for implementing a mold temperature control method. When the program for implementing the mold temperature control method is executed by a processor, it implements the steps of the mold temperature control method as described above.

[0017] In addition, to achieve the above objectives, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the mold temperature system control method as described above.

[0018] One or more technical solutions proposed in this application have at least the following technical effects: This application can obtain the operating parameters of the mold temperature system and the production yield of the mold temperature system. Then, when the production yield is less than the preset yield threshold, the control parameters of the mold temperature system can be adjusted based on the operating parameters of the mold temperature system to obtain the correction parameters. Then, the operation of the mold temperature system can be controlled based on the correction parameters to improve the production yield of the mold temperature system.

[0019] In other words, based on the actual production situation of the mold temperature system, when the production yield is less than the preset yield threshold, the control parameters of the mold temperature system can be adjusted in a timely manner based on the operating parameters. Since the operating parameters can reflect the operating status of the mold temperature system, the control parameters of the mold temperature system can be adjusted based on the operating parameters to obtain corrected parameters, so as to optimize the parameters in the operating parameters that cause the production yield to be lower than the preset yield threshold. This allows the mold temperature system operating according to the corrected parameters to have a higher production yield, thereby solving the technical problem of low production yield of the mold temperature system. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with those described herein and, together with the specification, serve to explain the principles of those embodiments.

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a flowchart illustrating one embodiment of the mold temperature control method of this application. Figure 2 This is a schematic diagram of the cooling water circuit and circulating water circuit in the mold temperature control method of the embodiment of this application; Figure 3 This is a flowchart illustrating an example of the control method for the mold temperature system in an embodiment of this application. Figure 4 This is a schematic diagram of the module structure of the control device of the mold temperature system in an embodiment of this application; Figure 5 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the control method of the mold temperature system in the embodiments of this application.

[0023] The objectives, features, and advantages of the embodiments described in this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of the embodiments of this application and are not intended to limit the embodiments of this application.

[0025] To better understand the technical solutions of the embodiments of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0026] In manufacturing fields such as injection molding and die casting, mold temperature systems are crucial equipment for controlling mold temperature. Traditional mold temperature systems have limited functionality, only capable of basic temperature control. Furthermore, traditional maintenance methods often involve post-failure maintenance or fixed-cycle maintenance, which can easily lead to unexpected equipment downtime. This is because periodic maintenance may not address components that are about to fail but haven't yet, resulting in unforeseen shutdowns, low production efficiency, and low yield rates.

[0027] This embodiment provides a method for controlling a mold temperature system. In this embodiment, based on the actual production situation (production yield) of the mold temperature system, when the production yield is less than a preset yield threshold, the control parameters of the mold temperature system can be adjusted in a timely manner based on the operating parameters. Since the operating parameters can reflect the operating situation of the mold temperature system, the control parameters of the mold temperature system can be adjusted based on the operating parameters to obtain corrected parameters. This is to optimize the parameters in the operating parameters that cause the production yield to be lower than the preset yield threshold, so that the mold temperature system operating according to the corrected parameters can have a higher production yield, thereby solving the technical problem of low production yield of the mold temperature system.

[0028] Furthermore, in this embodiment, based on the cumulative operating data of the mold temperature system and its production plan, a preset maintenance model can be invoked to generate maintenance data for the mold temperature system. This facilitates the output of maintenance data based on the actual operating status of the mold temperature system and the actual production plan, enabling timely maintenance of components that are about to fail. It also facilitates maintenance when the mold temperature system is not in production, allowing for timely maintenance without affecting production efficiency, reducing the failure rate of the mold temperature system, avoiding production interruptions, and improving the production continuity of the mold temperature system.

[0029] Based on this, embodiments of this application provide a method for controlling a mold temperature system, referring to... Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the mold temperature control method according to this application. The mold temperature control method includes steps S10 to S30: Step S10: Obtain the operating parameters of the mold temperature system and the production yield of the mold temperature system; It should be noted that the mold temperature system includes a mold temperature controller. Operating parameters can reflect the operating status of the mold temperature controller, and these parameters may include the operating temperature and operating pressure of the controller, specifically the operating temperature and operating pressure of the circulating water circuit within the controller. In other embodiments, the operating parameters may also include the current operating data of each component within the mold temperature controller; this embodiment does not specifically limit this. For example, the current operating data of a component may be the running time or the operating current, etc. This embodiment does not specifically limit this, and the specific settings can be based on the actual situation of the component.

[0030] The components of a mold temperature controller can include solenoid valves, pumps, and heating elements, etc. This embodiment does not specifically limit the specific components. The mold temperature controller may include multiple solenoid valves, such as pressure relief valves and cold water valves. It may also include multiple pumps, such as a main water pump, a cold water pump, and a booster pump. The heating element includes a heating element and a heating relay. The heating element heats the water in the circulating water circuit, and the heating relay controls whether the heating element is heating. Multiple sensors, such as temperature sensors and pressure sensors, can also be installed in the mold temperature controller to detect operating pressure and operating temperature.

[0031] Production yield can be defined as the ratio of the number of products with a quality greater than a preset quality threshold within a preset cycle to all products manufactured within that preset cycle. The preset cycle can be set based on actual conditions, and this embodiment does not impose specific limitations on it. Users can input the production yield into the mold temperature controller, or the production yield estimated by the mold temperature controller under operating parameters; this embodiment does not impose specific limitations on it either.

[0032] The mold temperature system also includes a server. An edge computing unit is also installed in the mold temperature controller. The edge computing unit is used to communicate with the server. The operating parameters and production yield of the mold temperature controller can be sent to the server through the edge computing unit so that the server can determine whether the control parameters of the mold temperature controller need to be corrected.

[0033] In a feasible embodiment, step S10 further includes step S11: inputting the operating parameters into the pre-trained health model, and outputting the production yield of the mold temperature system under the operating parameters through the health model.

[0034] It should be noted that the health model is pre-trained. For example, an initial health model can be obtained, which could be a large language model or a neural network model, etc. This embodiment does not specifically limit this. Health training data can be obtained, including training parameters and yield labels for these parameters. The training parameters can be input into the initial health model, outputting the training yield. The training loss between the training yield and the yield labels of the training parameters is calculated. If the training loss is less than a preset loss threshold, the trained initial health model is used as the health model. If the training loss is greater than or equal to the preset loss threshold, new training parameters are obtained, and the initial health model is retrained until the training loss is less than the preset loss threshold. The initial health model can be deployed on a server in the mold temperature control system. When the mold temperature controller is not sending production yield data to the server, the initial health model can output the production yield under the specified operating parameters.

[0035] For example, operating parameters can be input into a health model, which then outputs the production yield under those parameters. This embodiment allows for the prediction of production yield, thereby improving the efficiency of subsequent adjustments to control parameters and ultimately increasing production yield.

[0036] Step S20: When the production yield is less than the preset yield threshold, adjust the control parameters of the mold temperature system based on the operating parameters to obtain the correction parameters; It should be noted that the preset yield threshold can be set based on actual conditions. When the production yield reaches the preset yield threshold, it indicates that the production yield is high and meets production requirements. When the production yield is lower than the preset yield threshold, it indicates that the production yield is low and there is more waste. Therefore, in this embodiment, the control parameters of the mold temperature controller in the mold temperature system can be adjusted based on the operating parameters.

[0037] Operating parameters are detected during the operation of the mold temperature controller, while control parameters are parameters that control the operation of the mold temperature controller. Control parameters can include set temperature and set pressure. The set temperature is the target temperature value that the mold temperature controller needs to achieve, and the set pressure is the target pressure value that the mold temperature controller needs to achieve. Specifically, the circulating water circuit in the mold temperature controller needs to reach the set temperature and the set pressure.

[0038] When the mold temperature controller is running according to the set temperature and set pressure, the temperature during operation may not reach the set temperature or set pressure. Therefore, in possible embodiments, the operating temperature and operating pressure in the operating parameters may not be the same as the control parameters.

[0039] The correction parameter is the corrected control parameter. After adjusting the control parameter, the circulating water circuit in the mold temperature controller needs to reach the correction temperature. The correction parameter may include correction temperature and / or correction pressure, etc., but this embodiment does not specifically limit it.

[0040] In a feasible embodiment, step S20 further includes steps S21 to S23: Step S21: Call the preset maintenance model and output the reasons for defects that cause the production yield to be less than the preset yield threshold based on the running parameters; It should be noted that the preset maintenance model can include multiple sub-models, all of which can be AI models (Artificial Intelligence Models). The AI ​​models can be fine-tuned to obtain the corresponding sub-models. The multiple sub-models can be correction models and prevention models, respectively. The correction model is used to determine the cause of the failure, while the prevention model can be used to output maintenance data of the mold temperature system to prevent mold temperature system failure.

[0041] The preset maintenance model can be deployed on the server of the mold temperature system. In other embodiments, the health model can also be used as a sub-model of the preset maintenance model; this embodiment does not specifically limit this. In this embodiment, the cause of defects where the production yield is lower than the preset yield threshold can be determined by correcting the model's output based on operating parameters.

[0042] The defective reason is that the production yield is less than the preset yield threshold. A low production yield means that a large number of products are of poor quality. Poor product quality can be manifested as product shrinkage or dimensional deviation, etc. This embodiment does not make specific limitations on this.

[0043] The process of fine-tuning the initial correction model (which is an AI model) to obtain the correction model may include: acquiring correction training data, which includes multiple sets of defective operating parameters corresponding to production yields below a preset yield threshold, and defect labels for each defective operating parameter. The defect labels include cause labels and correction labels. For example, when the cause label includes a temperature anomaly label, the correction label includes a temperature correction amount label; when the cause label includes a pressure anomaly label, the correction label includes a pressure correction amount label. The defective operating parameters can be input into the initial correction model, which outputs defective training results. The training loss between the defective training results and the defective labels of the defective operating parameters is calculated. If the training loss is less than a preset loss threshold, the trained initial correction model is used as the correction model. If the training loss is greater than or equal to the preset loss threshold, new defective operating parameters are acquired, and the initial correction model is retrained until the training loss is less than the preset loss threshold.

[0044] For example, if the production yield is less than the preset yield threshold, the cause of the defect can be output based on the operating parameters through the correction model in the preset maintenance model.

[0045] Step S22: In cases where the cause of the malfunction includes abnormal temperature, the set temperature of the mold temperature system is corrected using a preset maintenance model to obtain the corrected temperature. It should be noted that, in this embodiment, the causes of defects may include abnormal temperature and / or abnormal pressure. When abnormal temperature is included as a cause of defect, the reason for the production yield falling below the preset yield threshold is related to the operating temperature. Since the operating temperature is related to the set temperature, the set temperature in the control parameters needs to be corrected to improve the production yield subsequently. The corrected temperature is the adjusted set temperature.

[0046] When the correction model in the preset maintenance model outputs the cause of the defect, it will also output the correction amount corresponding to the cause of the defect. For example, when the cause of the defect includes abnormal temperature, the correction amount includes temperature correction amount. The set temperature can be corrected based on the temperature correction amount to obtain the corrected temperature. The temperature correction amount can be positive or negative, etc. This embodiment does not make specific limitations on this, but it is determined based on the actual situation.

[0047] For example, when the cause of the malfunction includes abnormal temperature, the set temperature is adjusted by correcting the temperature correction amount in the correction amount output by the correction model to obtain the corrected temperature. For example, the corrected temperature can be the sum of the set temperature and the temperature correction amount.

[0048] Step S23: In cases where the cause of the malfunction includes abnormal pressure, the set pressure of the mold temperature system is corrected using a preset maintenance model to obtain the corrected pressure.

[0049] It should be noted that when abnormal pressure is a contributing factor to defects, it indicates that the reason for the production yield falling below the preset yield threshold is related to the operating pressure. Since the mold temperature controller operates based on a set pressure, the operating pressure is also related to the set pressure. Therefore, the set pressure in the control parameters needs to be corrected to improve the production yield in the future. The corrected pressure is the adjusted set pressure.

[0050] When the cause of the problem includes abnormal pressure, the correction amount includes a pressure correction amount. The set pressure can be corrected based on the pressure correction amount to obtain the corrected pressure. The pressure correction amount can be positive or negative, etc. This embodiment does not make specific limitations on this, but it is determined based on the actual situation.

[0051] For example, when the cause of the malfunction includes abnormal pressure, the set pressure is adjusted by correcting the pressure correction amount in the correction amount output by the correction model to obtain the corrected pressure. For example, the corrected pressure can be the sum of the set pressure and the pressure correction amount.

[0052] In this embodiment, the cause of the defect can be identified, and the control parameters can be corrected based on the cause. This allows for adjustment of the operating parameters in the mold temperature controller, thereby improving production yield. This achieves adaptive adjustment of control parameters based on production yield, resulting in improved production yield. When the production yield is greater than or equal to a preset yield threshold, it indicates a high production yield, and no adjustment of the control parameters is needed to achieve a high production yield.

[0053] Step S30: Based on the corrected parameters, control the operation of the mold temperature system to improve the production yield of the mold temperature system.

[0054] It should be noted that once the corrected parameters are obtained, the operation of the mold temperature controller in the mold temperature system can be controlled to improve production yield. To better understand this embodiment, the control flow of the mold temperature system is briefly described below: The mold temperature system includes a mold temperature controller and a server. The server can be configured with a preset maintenance model. Multiple sub-models of the preset maintenance model can include a health model and a correction model. The mold temperature controller includes an edge computing unit, a controller, and a working device. The edge computing unit is communicatively connected to the server, the edge computing unit is connected to the controller, and the controller is connected to the working device. The working device includes a circulating water circuit. The operating parameters of the working device can be obtained through the controller in the mold temperature controller. The operating parameters can be sent to the server through the edge computing unit. The production yield under the operating parameters can be output through the health model in the server. When the production yield is less than the preset yield threshold, the correction model in the server can generate the cause of the defect and the correction amount. Based on the correction amount and control parameters, the correction parameters are determined. The correction parameters are sent to the edge computing unit through the server. The correction parameters are sent to the controller through the edge computing unit. The controller controls the operation of the working device in the mold temperature controller according to the correction parameters.

[0055] In this embodiment, the preset maintenance model is deployed on the server, which can reduce the operating pressure of the mold temperature controller and enable adaptive adjustment of the control parameters of the mold temperature controller, thereby improving the production yield of the mold temperature controller and reducing waste.

[0056] In a feasible embodiment, step S30 further includes steps S31 to S32: Step S31: Obtain the correction confidence level of the correction parameters through the preset maintenance model. If the correction parameters are within the normal range of the preset parameters and the correction confidence level is greater than the preset confidence threshold, control the mold temperature system to operate according to the correction parameters. It should be noted that a higher correction confidence level indicates a more reliable correction parameter, while a lower correction confidence level indicates a less reliable correction parameter. The preset normal parameter range is a pre-determined range of parameters that allows the mold temperature controller to operate normally; it can be set based on actual conditions, and this embodiment does not impose specific limitations on it. The preset confidence threshold can also be set based on actual conditions, and this embodiment does not impose specific limitations on it.

[0057] If the corrected parameters are within the normal range of the preset parameters and the correction confidence level is greater than the preset confidence threshold, it means that the corrected parameters allow the mold temperature controller to operate normally, and therefore the mold temperature controller in the mold temperature system can be controlled to operate according to the corrected parameters. For example, the server can determine whether the correction confidence level is greater than the preset confidence threshold and whether the corrected parameters are within the normal range of the preset parameters. Then, the server sends the corrected parameters to the edge computing unit, the edge computing unit sends the corrected parameters to the controller, and the controller controls the mold temperature controller to operate according to the corrected parameters.

[0058] The correction model in the preset maintenance model can perform multiple inferences on the same operating parameter, and each time it can infer the cause of the defect and the correction amount. Based on the cause of the defect and the correction amount obtained from multiple inferences, the correction model can output the correction confidence level. For example, when the cause of the defect is the same in multiple outputs, or the repetition rate is greater than the preset repetition threshold, and the standard deviation of the correction amount output in multiple outputs is less than the preset proximity threshold, then the correction confidence level is higher. For example, when the cause of the defect includes temperature abnormality and pressure abnormality, the standard deviation of the correction amount includes the standard deviation of temperature and the standard deviation of pressure. The smaller the standard deviation of temperature, the higher the confidence level of the temperature correction amount; the smaller the standard deviation of pressure, the higher the confidence level of the pressure correction amount. The preset repetition threshold and the preset proximity threshold can be determined based on the actual situation. This embodiment does not impose specific limitations on them. The confidence level of the correction parameter is equivalent to the confidence level of the correction amount. The correction model can take the most frequent cause of the defect in multiple inferences as the final cause of the defect and can obtain the correction amount corresponding to the cause of the defect. In other embodiments, the correction amount can be the average value, and the cause of the defect can be the one with the highest frequency of occurrence. This embodiment does not impose specific limitations on them.

[0059] When the cause of the malfunction includes abnormal temperature, the corrected reliability includes temperature reliability; when the cause of the malfunction includes abnormal pressure, the corrected reliability includes pressure reliability; the preset normal range of parameters includes the preset normal temperature range for temperature and the preset normal pressure range for pressure.

[0060] For example, when the corrected temperature is at the preset normal temperature and the temperature confidence level is greater than the preset confidence threshold, the corrected temperature can be sent to the edge computing unit via the server, and the edge computing unit can send the corrected temperature to the controller, which then controls the operating device in the mold temperature controller to operate according to the corrected temperature. When the corrected pressure is at the preset normal pressure and the pressure confidence level is greater than the preset confidence threshold, the corrected pressure can be sent to the edge computing unit via the server, and the edge computing unit can send the corrected pressure to the controller, which then controls the operating device in the mold temperature controller to operate according to the corrected pressure.

[0061] Step S32: If the correction confidence is less than or equal to the preset confidence threshold, and / or the correction parameter is not within the normal range of the preset parameter, then a correction anomaly prompt is output, and the mold temperature system is controlled to operate according to the control parameters before the correction parameter is corrected, or according to the feedback parameters obtained from the external feedback based on the correction anomaly prompt.

[0062] It should be noted that the correction error message is used to indicate that the correction parameters are abnormal. The correction error message can be used to remind users of the mold temperature system. For example, the correction error message can be output on the display interface of the mold temperature controller. Based on the correction error message, the user can input feedback parameters into the mold temperature controller. The feedback parameters are the parameters that the user provides based on the actual situation, which will enable the mold temperature controller to operate normally. The feedback parameters can also be confirmed as feasible. The indication of feasibility is that the operation can be carried out with reference to the correction parameters.

[0063] If the corrected confidence level is less than or equal to the preset confidence threshold, and / or the corrected parameters are not within the normal range of the preset parameters, it indicates that running according to the corrected parameters may cause the mold temperature controller to malfunction. In order to ensure the normal operation of the mold temperature controller, it can be run according to the control parameters before the correction to ensure the continuity of production. Alternatively, it can receive feedback parameters and run according to the parameters fed back by the user. This embodiment does not make specific limitations on this.

[0064] For example, when the temperature confidence level is less than or equal to a preset confidence threshold, and / or the temperature confidence level is not within the preset normal temperature range, it indicates a temperature correction anomaly. This can be achieved by outputting a correction anomaly prompt including the temperature correction anomaly via the server, sending the correction anomaly prompt to the controller via an edge computer, and controlling the mold temperature controller to operate at the set temperature before the temperature correction. Alternatively, feedback parameters including feedback on the temperature correction anomaly can be obtained, and the controller can control the mold temperature controller to operate according to the feedback parameters. For instance, if the feedback parameters include confirmation that the corrected temperature is feasible, and the corrected temperature is within the preset normal temperature range, the mold temperature controller will operate at the corrected temperature; if the corrected temperature is greater than the upper limit of the preset normal temperature range, the mold temperature controller will operate at the upper limit; if the corrected temperature is less than the lower limit of the preset normal temperature range, the mold temperature controller will operate at the lower limit. When the feedback parameters include a feedback temperature, the mold temperature controller will operate according to the feedback temperature. The feedback temperature is the temperature parameter provided by the user, and the feedback parameters will not simultaneously include both the feedback temperature and confirmation that the corrected temperature is feasible.

[0065] When the pressure confidence level is less than or equal to a preset confidence threshold, and / or the pressure confidence level is not within the preset normal pressure range, it indicates an abnormal pressure correction. This can be indicated by the server outputting a correction anomaly message, the edge computer sending the correction anomaly message to the controller, the controller controlling the temperature controller to operate at the preset pressure before correction, or by obtaining feedback parameters including feedback on the pressure correction anomaly and controlling the temperature controller to operate according to the feedback parameters. For example, if the feedback parameters include confirmation that the correction pressure is feasible, and the correction pressure is within the preset normal pressure range, the temperature controller will operate at the correction pressure; if the correction pressure is greater than the upper limit of the preset normal pressure range, the temperature controller will operate at the upper limit; if the correction pressure is less than the lower limit of the preset normal pressure range, the temperature controller will operate at the lower limit. When the feedback parameters include a feedback pressure, the temperature controller will operate according to the feedback pressure. The feedback pressure is the pressure parameter provided by the user; the feedback parameters will not simultaneously include both the feedback pressure and confirmation that the correction pressure is feasible.

[0066] In this embodiment, when the correction temperature is normal but the correction pressure is abnormal, the mold temperature controller can be controlled to operate at the correction temperature and at the set pressure before correction or according to the feedback parameters. For example, the correction parameters can take effect immediately in the next production cycle of the mold temperature controller, thus facilitating timely correction. When the correction temperature is abnormal but the correction pressure is normal, the mold temperature controller can be controlled to operate at the correction pressure and at the set temperature before correction or according to the feedback parameters.

[0067] This embodiment can determine whether the correction parameters are within the normal range of preset parameters, and can also determine whether the mold temperature controller needs to be operated according to the correction parameters based on the correction reliability, thereby improving the safety and reliability of the mold temperature controller operation.

[0068] Furthermore, based on the above embodiments of this application, in another embodiment of this application, the same or similar content as the above embodiments can be referred to the above description, and will not be repeated hereafter. Based on this, the mold temperature system control method further includes steps A10 to A20: Step A10: Obtain the cumulative operating data of the mold temperature system and the production plan of the mold temperature system; It should be noted that the cumulative operating data refers to the cumulative operating data of the mold temperature controller in the mold temperature system. The cumulative operating data may include the cumulative data of one or more components in the mold temperature controller. The production plan refers to the time schedule for the products that the mold temperature controller needs to produce. The production plan can be a future production arrangement, such as a production arrangement for the next week or a production arrangement for the next month. This embodiment does not make specific limitations on this.

[0069] The production plan can be obtained from the Manufacturing Execution System (MES) in the mold temperature system. The MES can interact with the user, store the production plan, and display the production plan. This embodiment does not make specific limitations on this.

[0070] For example, the cumulative operating data of the mold temperature controller can be obtained through the server, and the production plan of the mold temperature controller can be obtained through the MES through the server.

[0071] Step A20: Invoke the preset maintenance model and generate maintenance data for the mold temperature system based on the accumulated operating data and production plan.

[0072] It should be noted that the prevention model in the preset maintenance model can be called to produce the maintenance data of the mold temperature controller based on the cumulative operating data and the production plan. The maintenance data includes the maintenance period for the mold temperature controller and the maintenance components that need to be maintained.

[0073] For example, maintenance data for the mold temperature controller can be generated based on accumulated operating data and production plans using a prevention model in the server. This facilitates the determination of maintenance data for the mold temperature controller based on its actual condition, enabling timely and effective maintenance, improving maintenance efficiency, reducing production interruptions, and thus enhancing production continuity.

[0074] In one feasible embodiment, the maintenance data includes the target maintenance period and the maintenance components, and step A20 further includes steps A21 to A23: Step A21: Input the accumulated running data into the preset maintenance model, generate the component health status of at least one component in the mold temperature system through the preset maintenance model, and determine the maintenance component in each component based on the component health status of each component. It should be noted that accumulated operating data can be input into the prevention model within the preset maintenance model. The prevention model can then generate the health status of at least one component in the temperature controller. Component health reflects the component's lifespan. Maintenance components are those requiring maintenance and are those with a higher future failure rate. The prevention model is obtained by fine-tuning the AI ​​model, which can be a large language model, etc.

[0075] For example, a prevention model can be used to generate the component health of at least one component based on accumulated operating data, and based on the component health of each component, maintenance components can be identified among each component. For example, components with a component health of less than a preset health threshold can be identified as maintenance components.

[0076] Step A22: Input the production plan into the preset maintenance model, and output the maintainable time period without interrupting the production plan through the preset maintenance model; It should be noted that the production plan includes the time when the mold temperature controller will need to produce products in the future, while the maintainable period is the time when the mold temperature controller does not need to produce products. The maintainable period can be continuous or it can be obtained by splicing multiple sub-periods. This embodiment does not make specific limitations on this. The prevention model can determine the maintainable period that will not interrupt the production plan from the production plan. This facilitates the subsequent selection of maintenance periods for each component from the maintainable period.

[0077] Step A23: Based on the component health status and maintainable time period of each maintenance component, determine the target maintenance time period for each maintenance component.

[0078] It should be noted that the target maintenance period for different maintenance components can be the same. Generally, in this embodiment, each maintenance component can be maintained during the same target maintenance period, thereby improving maintenance efficiency and production continuity. In other possible embodiments, different maintenance components can be maintained during different target maintenance periods. This embodiment does not specifically limit this.

[0079] Since the health status of each component being maintained can include its remaining lifespan, the target maintenance period can be determined based on each remaining lifespan and maintainable period.

[0080] For example, based on the remaining lifespan of each component, the target maintenance period can be determined first within the maintainable time period. Specifically, when the remaining lifespan of each maintenance component is greater than the preset duration, the target maintenance period can be determined jointly for each maintenance component within the maintainable time period. Within the target maintenance period, the remaining lifespan of the maintenance component is either not exhausted or just exhausted. The preset duration is the duration between the current time and the earliest time of the maintainable time period.

[0081] If the remaining lifespan of any maintenance component is less than a preset duration, then that component is designated as the target maintenance component. A target maintenance period is determined for the target component before its remaining lifespan expires. Within the maintainable period, a common target maintenance period is determined for all remaining maintenance components. This prioritizes maintenance of the target component, preventing production interruptions due to its failure and avoiding malfunctions in other components caused by its failure. Remaining maintenance components are those other than the target component. If there are multiple target maintenance components, the earliest target maintenance period can be selected from the target maintenance periods for each component, allowing maintenance to be performed on each component during that earliest period.

[0082] In a feasible embodiment, the accumulated operating data includes at least one of the following: pump operating data of the pump in the mold temperature system, valve operating data of the solenoid valve, and heating operating data of the heating control component; the component health of the pump includes the remaining pump life and wear condition, the component health of the solenoid valve includes the remaining valve life, and the component health of the heating control component includes the remaining component life; step A10 further includes steps A11 to A13: Step A11: If the cumulative operating data includes pump operating data, the remaining life of the pump is output based on the cumulative running time, average operating current and number of start-stop cycles in the pump operating data through a preset maintenance model. The wear status of the pump is generated based on the current operating pressure, historical operating pressure and current operating current in the pump operating data. It should be noted that the cumulative operating data can include cumulative data for one or more components. The cumulative data represents the accumulated operating data of each component. For example, the cumulative operating data can include cumulative data for pumps, solenoid valves, and / or heating control components. The cumulative pump data is the pump operating data. A mold temperature controller can contain multiple pumps, and the cumulative operating data can include the operating data for each of these pumps. For example, the multiple pumps could be the main water pump and booster pump installed in the circulating water circuit, or a chilled water pump installed in the cooling water circuit. Each pump has its own operating data. For each pump, the pump operating data includes the pump's cumulative runtime, average operating current, number of start-stop cycles, historical operating pressure, current operating pressure, and current operating current.

[0083] The mold temperature controller includes multiple solenoid valves, which can be cold water valves and pressure relief valves. Each solenoid valve has valve operation data, including cumulative energization time, cumulative number of switching times, and valve temperature. Since the solenoid valve needs to be energized when it is turned on, the cumulative energization time can be the cumulative duration of the solenoid valve's conduction. The valve temperature is the operating temperature of the solenoid valve, which can include the solenoid valve's historical temperature and current temperature.

[0084] The heating control component includes a heating element and a heating relay. Heating operation data includes heating element and relay operation data. The heating element operation data includes the cumulative operating time and average operating temperature of the heating element. The relay operation data includes the number of times the heating relay has been switched on and off.

[0085] For each pump, the pump component health includes the pump's remaining life and wear condition, where the remaining life is the pump's remaining life. For each solenoid valve, the solenoid valve component health includes the valve's remaining life, where the remaining life is the solenoid valve's remaining life. The component health of the heating control assembly includes the remaining life of the heating element and the remaining life of the heating relay. Wear condition reflects the pump's wear status.

[0086] In this embodiment, the prevention model is a multi-task model. The prevention model can also be obtained by fine-tuning the AI ​​model. The prevention model can output maintainable time periods and component health status.

[0087] For example, when the cumulative operating data includes the pump operating data of any pump, for each pump operating data in the cumulative operating data, the cumulative running time, average operating current, and number of start-stop cycles are input into the prevention model. The prevention model outputs the remaining life of the pump. The remaining life of the pump is related to the cumulative running time, average operating current, and number of start-stop cycles. Therefore, the remaining life of the pump can be estimated by using the cumulative running time, average operating current, and number of start-stop cycles.

[0088] The pump's wear status is generated by analyzing the current operating pressure, historical operating pressure, and current operating current from the pump's operating data. The current operating pressure is the maximum operating pressure the pump can reach under the current set pressure of the mold temperature controller. The historical operating pressure is the pump's historical average operating pressure. The preventative model can assess the pump's performance deviation using the current and historical operating pressures. The performance deviation characterizes the degree of performance degradation; a larger deviation indicates a more severe performance degradation. The preventative model can also output the pump's wear status using the performance deviation and current operating current. The current operating current reflects the pump's current status. When the pump experiences different degrees of wear, or when different components within the pump are worn, the pump's operating current will change accordingly. For example, when the pump's bearings are worn, the current operating current may be relatively higher than normal. When a pump experiences wear, its performance deteriorates. Therefore, in this embodiment, the pump's current operating pressure, historical operating pressure, and current operating current are all input into the prevention model. The prevention model outputs the pump's wear status, which reflects the degree of wear. When the wear level exceeds a preset wear threshold, it indicates that the pump's component health is below a preset health threshold. Alternatively, when the remaining lifespan is less than a preset lifespan threshold, it also indicates that the pump's component health is below a preset health threshold, requiring pump maintenance. Both the preset wear threshold and the preset lifespan threshold can be set based on actual conditions; this embodiment does not impose specific limitations on them.

[0089] Therefore, this embodiment can perform timely maintenance on the pump when its remaining lifespan is insufficient or when wear is severe, thereby improving maintenance efficiency and thus facilitating increased production efficiency.

[0090] Step A12: If the cumulative operating data includes valve operating data, the remaining life of the solenoid valve is generated based on the cumulative number of switching times and cumulative energization time in the valve operating data using a preset maintenance model. It should be noted that the more times the valve is switched on and off, the longer the cumulative energization time, and the higher the valve temperature (for example, the valve temperature can be the average of historical temperature and current temperature), the shorter the remaining lifespan of the solenoid valve.

[0091] For example, for the valve operation data of each solenoid valve included in the cumulative operating data, the cumulative number of switching times, cumulative energization time, and valve temperature of the solenoid valve are input into the prevention model, and the remaining life of the solenoid valve is output. In this embodiment, the prevention model can output the life curve of the solenoid valve based on the cumulative number of switching times, cumulative energization time, and valve temperature. The initial life curve can be determined first based on the cumulative number of switching times and cumulative energization time, and then the initial life curve can be adjusted in combination with the valve temperature to obtain the life curve of the solenoid valve. The remaining life of the solenoid valve can be determined from the life curve. The horizontal axis of the life curve is the life, and the vertical axis can be a comprehensive parameter including the cumulative number of switching times, cumulative energization time, and valve temperature.

[0092] Step A13: If the cumulative operating data includes heating operating data, the remaining lifespan of the heating control component is generated based on the heating operating time and the number of heating switches in the heating operating data using a preset maintenance model.

[0093] It should be noted that the heating operation data includes the operating data of the heating element and the operating data of the heating relay, which can be a silicon controlled rectifier (SCR). The more times the heating relay is switched on and off, the shorter its remaining lifespan. Similarly, the higher the average operating temperature and the longer the cumulative operating time of the heating element, the shorter its remaining lifespan.

[0094] When the cumulative operating data includes heating operating data, the pipe operating data and relay operating data can be input into the prevention model. The prevention model outputs the remaining lifespan of the heating pipe under the pipe operating data and the remaining lifespan of the heating relay under the relay operating data.

[0095] Therefore, in this embodiment, the health status of multiple components can be output by the prevention model based on the cumulative operating data, which facilitates the subsequent determination of maintenance components based on the component health status, so that maintenance components can be maintained in a timely manner, avoiding maintenance only after the maintenance component fails, thereby improving maintenance efficiency and reducing production interruptions.

[0096] In this embodiment, the prevention model supports outputting the health status of multiple components. The prevention model can include multiple model units, each capable of outputting different results. For example, the multiple model units in the prevention model can be a pump life prediction unit, a pump wear prediction unit, a valve life prediction unit, a pipe life prediction unit, a relay life prediction unit, and a time period prediction unit. Specifically, the pump life prediction unit outputs the remaining pump life based on the pump's cumulative running time, average operating current, and number of start-stop cycles. The pump wear prediction unit generates the pump's wear status based on the pump's current operating pressure, historical operating pressure, and current operating current. The valve life prediction unit generates the remaining life of the solenoid valve based on the cumulative number of switching cycles, cumulative energization time, and valve temperature. The pipe life prediction unit outputs the remaining life of the heating element based on its average operating temperature and cumulative running time. The relay life prediction unit outputs the remaining life of the heating relay based on its switching cycles. The time period prediction unit outputs maintainable time periods based on the production plan. The fine-tuning process for each model unit is similar to that of the correction model, except for the different input training data; this embodiment will not elaborate further on this.

[0097] This embodiment enables the estimation of the health status of components within a mold temperature controller. This facilitates the generation of maintenance data based on the health status and maintainable timeframes of each component, enabling timely and effective maintenance of the mold temperature controller, improving maintenance efficiency, and avoiding production interruptions caused by reactive maintenance. In this embodiment, maintenance data can be presented in the form of maintenance work orders. These work orders can display each component to be maintained, along with its estimated remaining lifespan, in list or table format. When the component to be maintained is a pump, the work order can also display the pump's wear status. The work order can also display the target maintenance period and the components requiring maintenance within that period, making it easier for maintenance personnel to review and improving maintenance efficiency.

[0098] In this embodiment, by using a preset maintenance model, unexpected downtime is significantly reduced, enabling proactive maintenance management of the mold temperature controller and thus facilitating the extension of its lifespan. Furthermore, it allows for seamless integration of production and maintenance plans, reducing downtime for adjustments and improving equipment operating efficiency. It also reduces overall costs, such as maintenance costs (avoiding over-maintenance and severe damage), scrap costs, and manual intervention costs.

[0099] Furthermore, based on the above embodiments of this application, in another embodiment of this application, the same or similar content as the above embodiments can be referred to the above description, and will not be repeated hereafter. On this basis, the mold temperature system is equipped with a circulating water circuit and a cooling water circuit that exchanges heat with the circulating water circuit. A pressure relief valve is installed on the circulating water circuit, and a cold water pump and a cold water valve are installed on the cooling water circuit. The control method of the mold temperature system further includes steps B10 to B30: Step B10: Obtain the current operating temperature of the circulating water circuit. If the operating temperature is higher than the current set temperature of the mold temperature system, turn on the cold water valve and cold water pump to cool the circulating water circuit. It should be noted that the mold temperature controller in the mold temperature system contains a circulating water circuit and a cooling water circuit that exchanges heat with the circulating water circuit. Both the circulating water circuit and the cooling water circuit are operational devices within the mold temperature controller. The circulating water circuit is equipped with a pressure relief valve, while the cooling water circuit contains a cold water pump and a cold water valve. When the cold water pump and valve are open, heat is carried away from the circulating water circuit through the cooling water circuit. When the cold water pump and valve are closed, the temperature of the water in the cooling water circuit is influenced by the circulating water circuit and is heated to the same temperature as the circulating water circuit. The current set temperature of the mold temperature system is the set temperature used by the controller within the mold temperature controller to operate the operational devices. For example, if the set temperature has not been corrected, the current set temperature is the set temperature before correction; if the set temperature has been corrected, the current set temperature is the latest corrected set temperature.

[0100] For example, the current operating temperature of the circulating water circuit can be obtained. If the current operating temperature is higher than the current set temperature, it indicates that the current operating temperature is too high, so the circulating water circuit needs to be cooled down. Therefore, the cooling water valve and cooling water pump can be turned on to cool the circulating water circuit. This helps to stabilize the temperature of the circulating water circuit and improve production yield. For instance, when the mold temperature is too high, the mold temperature will cause the temperature of the circulating water circuit to rise, which may lead to the current operating temperature of the circulating water circuit exceeding the current set temperature.

[0101] Step B20: If the operating temperature is lower than the current set temperature of the mold temperature system, increase the operating temperature of the mold temperature system and detect the operating pressure of the circulating water circuit. Step B30: If the operating pressure is greater than the current set pressure of the mold temperature system, perform a pressure relief operation through the pressure relief valve.

[0102] It should be noted that if the operating temperature is lower than the current set temperature, it indicates that the mold temperature controller is operating at too low a temperature and needs to be heated. This can be achieved by increasing the operating temperature of the mold temperature controller, for example, by increasing the heating power of the heating element. Since it is necessary to prevent the water from boiling during heating, the operating pressure needs to be adjusted to ensure that the circulating water does not boil when operating at the increased temperature. The operating pressure is the current operating pressure of the circulating water circuit, while the current set pressure of the mold temperature system is the latest set pressure of the mold temperature controller. When the operating pressure reaches the current set pressure, the water in the circulating water circuit will not boil. When the operating pressure exceeds the current set pressure, the circulating water circuit needs to be depressurized to prevent pressure exceeding the limit. This can be done using a pressure relief valve; for example, opening the pressure relief valve will perform a pressure relief operation, thus ensuring that the operating pressure is maintained at the current set pressure of the mold temperature controller.

[0103] For example, when the operating temperature is lower than the current set temperature of the mold temperature system, the operating temperature of the mold temperature system can be increased by heating the heating tube, and the operating pressure of the circulating water circuit can be detected; when the operating pressure is higher than the current set pressure of the mold temperature system, the pressure relief valve can be opened to perform a pressure relief operation; when the operating pressure is lower than the current set pressure of the mold temperature system, the operating pressure of the mold temperature controller can be increased by a pressure boosting component, which can be a pressure boosting pump used to increase the operating pressure of the circulating water circuit in the mold temperature controller.

[0104] This embodiment can adjust the temperature in the circulating water circuit in a timely manner based on the actual operating temperature and the set temperature, so as to stabilize the operating temperature in the circulating water circuit at the set temperature, thereby improving production yield. Furthermore, in the event of pressure instability, this embodiment can also adaptively adjust the operating pressure in the circulating water circuit through the pressure relief valve and pressurization components, avoiding shutdowns caused by pressure instability. For example, water pressure varies in different regions, and some regions may experience unstable water pressure, which can lead to unstable operating pressure of the mold temperature controller during operation, potentially causing production interruptions. This embodiment can adaptively adjust the operating pressure in the circulating water circuit, improving production continuity and safety.

[0105] In one feasible embodiment, a water storage device and a booster pump are also provided in the circulating water circuit. The control method further includes step X10: detecting the on / off state of the water level switch, and replenishing the circulating water circuit with water by the booster pump when the switch is off.

[0106] It should be noted that the booster pump in the circulating water circuit can be used to replenish water to ensure that there is no air in the circulating water circuit. This prevents the main water pump in the circulating water circuit from failing to draw water due to air in the circulating water circuit, which could easily lead to main water pump failure. The main water pump is located in the circulating water circuit and is used to drive the water circulation in the circulating water circuit. In this embodiment, the booster pump used for replenishing water is different from the booster component used to increase the operating pressure.

[0107] The preset maximum liquid level can be the top of the water storage device. When the water storage device is full of water, the liquid level switch will be closed by the water. When the water storage device is not full, the liquid level switch will be open. Since the water storage device is located in the circulating water circuit, if there is air in the water storage device, it means that there is also air in the circulating water circuit. Therefore, it is necessary to purge the air from the circulating water circuit. Thus, a booster pump can be used to replenish the circulating water circuit.

[0108] For example, during the formal operation of the mold temperature controller, if the liquid level switch is detected to be disconnected, a booster pump is used to replenish water to the circulating water circuit. Formal operation of the mold temperature controller refers to the controller having passed the pre-operation preparation stage and been put into operation. During formal operation, a booster pump is needed to replenish water to the circulating water circuit because the operating pressure in the circulating water circuit is high; water that has not been pressurized cannot be input into the circulating water circuit. Therefore, a booster pump is needed to replenish water to the circulating water circuit to ensure the normal operation of the mold temperature controller and improve the continuity of mold temperature controller production.

[0109] To better understand this embodiment, please refer to Figure 2 , Figure 2 A schematic diagram of a module with a pressure relief valve, a booster pump, a water storage device, and a level switch installed on the circulating water line is given. A schematic diagram of a module with a cold water valve and a cold water pump installed on the cooling water line is also given. The cooling water line can be adjacent to the circulating water line, and the location of the cooling water line can be set according to the actual situation. This embodiment does not make specific limitations on this.

[0110] For further details, please refer to Figure 3 Here is a brief description of the process in this embodiment: From Figure 3 Starting from left to right, the preset maintenance model in the server can send control parameters to the edge computing unit. These control parameters can be either before or after correction, such as correction parameters. This embodiment does not specifically limit this. The edge computing unit can upload operating parameters to the server, including accumulated operating parameters, etc. This embodiment does not specifically limit this either. After receiving the operating parameters, the edge computing unit can send control parameters to the controller.

[0111] Controller self-test refers to the controller performing a self-test process to check for any abnormalities. If the self-test fails, an alarm will sound and the machine will stop. An alarm will sound and the mold temperature controller will be stopped.

[0112] After the controller passes the self-test, it can perform air venting. Air venting refers to expelling air from the circulating water circuit. Specifically, it can be achieved by controlling the main water pump to run intermittently, that is, the main water pump can run intermittently periodically, each time for 2-3 seconds, or by setting a preset air venting time. The preset air venting time can be determined based on the actual situation. This embodiment does not make a specific limitation on this. The main water pump can run for n cycles until the air in the circulating water circuit is expelled. For example, the intermittent operation of the main water pump can expel air intermittently. The air can be expelled by using the water pumped by the main water pump to squeeze the air.

[0113] After the main water pump runs intermittently for n cycles, the level switch can be checked. When the level switch is open, it indicates that the water in the circulating water circuit is not full, so water needs to be added until the level switch is closed. At this point, water can be added directly without using the booster pump, because the mold temperature controller has not yet entered the formal operation stage. After the level switch is closed, the main water pump runs continuously, meaning it will not run intermittently. Once the main water pump is running continuously, it indicates that the mold temperature controller has entered formal operation. Additionally, if an abnormality is detected during water addition, an alarm can be triggered to stop the machine. For example, if water addition continues even when the level switch is closed, or if water addition stops abnormally, it can be considered an abnormality in water addition.

[0114] After the main water pump runs continuously, the operating temperature can be monitored. When the operating temperature is lower than the set temperature, the cold water valve and cold water pump are opened to cool down the water. Temperature is controlled by PID (Proportional-Integral-Derivative) to keep the circulating water circuit of the mold temperature controller at a constant temperature. While the cold water valve and cold water pump are being opened to cool down the water, the liquid level switch also needs to be monitored. When the liquid level switch is closed, the water in the circulating water circuit needs to be kept at a constant temperature. When the liquid level switch is open, water needs to be added through the booster pump until the liquid level switch is closed. If there is any abnormality in water addition during the process of adding water through the booster pump, an alarm will be triggered and the machine will be shut down.

[0115] When the operating temperature is lower than the set temperature, the temperature needs to be increased. After the temperature is increased, the temperature needs to be controlled by PID so that the mold temperature controller can enter a constant temperature state. During the temperature increase, the operating pressure also needs to be detected. When the operating pressure is normal, the pressure maintenance step is executed. The pressure maintenance can be maintained by a pressure boosting component. When the operating pressure is too low, it can also be boosted by a pressure boosting component. For example, when the operating pressure is lower than the set pressure, it is considered that the operating pressure is too low.

[0116] When the operating pressure exceeds the limit, pressure needs to be released. During the pressure release process, water in the circulating water circuit may escape as steam, potentially leading to insufficient water in the circulating water circuit. Therefore, after pressure release, the level switch needs to be checked. If the level switch is open, water is added through a booster pump until the level switch is closed. If there is an abnormality in water replenishment, an alarm will sound and the machine will shut down. When the level switch is closed, the circulating water circuit must also be kept at a constant temperature. In this embodiment, the mold temperature controller can adapt to changes in water pressure and temperature, enabling continuous automatic optimization. It will not shut down due to unstable water pressure, thus improving production yield and production continuity. Furthermore, it can adjust the set temperature and / or set pressure in a timely manner through preset maintenance models, improving production yield, reducing scrap rate, and ensuring product quality.

[0117] This application also provides a control device for a mold temperature system. Please refer to... Figure 4 The device includes: The acquisition module 10 is used to acquire the operating parameters of the mold temperature system and the production yield of the mold temperature system; The correction module 20 is used to adjust the control parameters of the mold temperature system based on the operating parameters to obtain correction parameters when the production yield is less than the preset yield threshold. The control module 30 is used to control the operation of the mold temperature system based on the correction parameters, so as to improve the production yield of the mold temperature system.

[0118] In one embodiment, the acquisition module 10 is further configured to: The operating parameters are input into the pre-trained health model, and the health model outputs the production yield of the mold temperature system under the operating parameters.

[0119] In one embodiment, the control parameters include a set temperature and / or a set pressure, and the correction parameters include a correction temperature and / or a correction pressure; the correction module 20 is further configured to: The preset maintenance model is invoked, and the reasons for defects that cause the production yield to be less than the preset yield threshold are output based on the operating parameters. If the cause of the malfunction includes abnormal temperature, the set temperature of the mold temperature system is corrected using the preset maintenance model to obtain the corrected temperature. If the cause of the malfunction includes abnormal pressure, the set pressure of the mold temperature system is corrected using the preset maintenance model to obtain the corrected pressure.

[0120] In one embodiment, the control module 30 is further configured to: The correction confidence level of the correction parameters is obtained through a preset maintenance model. When the correction parameters are within the normal range of the preset parameters and the correction confidence level is greater than the preset confidence threshold, the mold temperature system is controlled to operate according to the correction parameters. If the correction confidence level is less than or equal to the preset confidence threshold, and / or the correction parameter is not within the normal range of the preset parameter, a correction anomaly prompt is output, and the mold temperature system is controlled to operate according to the control parameters before correction, or according to the feedback parameters obtained from external feedback based on the correction anomaly prompt.

[0121] In one embodiment, the control device is further configured to: Obtain the cumulative operating data of the mold temperature system, as well as the production plan of the mold temperature system; The preset maintenance model is invoked, and maintenance data for the mold temperature system is generated based on the accumulated operating data and the production plan.

[0122] In one embodiment, the control device is further configured to: The maintenance data includes the target maintenance period and the components to be maintained; The step of calling the preset maintenance model and generating maintenance data for the mold temperature system based on the accumulated operating data and the production plan includes: The accumulated operating data is input into the preset maintenance model, and the component health status of at least one component in the mold temperature system is generated through the preset maintenance model. Based on the component health status of each component, the component to be maintained is determined among each component. The production plan is input into the preset maintenance model, and the preset maintenance model outputs the maintainable time period that does not interrupt the production plan; Based on the component health status of each maintenance component and the maintainable time period, the target maintenance time period for each maintenance component is determined.

[0123] In one embodiment, the cumulative operating data includes at least one of the following: pump operating data of the pump in the mold temperature system, valve operating data of the solenoid valve, and heating operating data of the heating control component; the component health of the pump includes the remaining pump life and wear status, the component health of the solenoid valve includes the remaining valve life, and the component health of the heating control component includes the remaining component life; the control device is further configured to: When the cumulative operating data includes pump operating data, the remaining life of the pump is output by the preset maintenance model based on the cumulative running time, average operating current and number of start-stop times in the pump operating data, and the wear status of the pump is generated based on the current operating pressure, historical operating pressure and current operating current in the pump operating data. When the cumulative operating data includes the valve operating data, the remaining lifespan of the solenoid valve is generated by the preset maintenance model based on the cumulative number of switching times, cumulative energization time, and valve temperature in the valve operating data. When the cumulative operating data includes the heating operating data, the remaining lifespan of the heating control component is generated by the preset maintenance model based on the heating operating duration and the number of heating switches in the heating operating data.

[0124] In one embodiment, the mold temperature system includes a circulating water circuit and a cooling water circuit that exchanges heat with the circulating water circuit. A pressure relief valve is installed on the circulating water circuit, and a cold water pump and a cold water valve are installed on the cooling water circuit. The control device is further configured to: The current operating temperature of the circulating water circuit is obtained. If the operating temperature is greater than the current set temperature of the mold temperature system, the cold water valve and cold water pump are turned on to cool the circulating water circuit. If the operating temperature is lower than the current set temperature of the mold temperature system, increase the operating temperature of the mold temperature system and detect the operating pressure of the circulating water circuit; If the operating pressure is greater than the current set pressure of the mold temperature system, a pressure relief operation is performed through the pressure relief valve.

[0125] In one embodiment, the circulating water circuit is further equipped with a water storage device and a booster pump, and a level switch is installed at the highest preset liquid level of the water storage device. The control device is also used for: The on / off state of the liquid level switch is detected, and if the switch is off, water is added to the circulating water circuit by a booster pump.

[0126] The mold temperature control device provided in this application adopts the mold temperature control method in the above embodiments, aiming to solve the technical problem of low production yield of the mold temperature system. Compared with the prior art, the beneficial effects of the mold temperature control method provided in this application are the same as those of the mold temperature control method provided in the above embodiments, and other technical features in the mold temperature control device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0127] This application provides a mold temperature system, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the control method of the mold temperature system in the first embodiment described above.

[0128] The following is for reference. Figure 5 It shows a schematic diagram of a mold temperature system suitable for implementing the embodiments of this application. Figure 5 The mold temperature system shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0129] likeFigure 5 As shown, the mold temperature system may include a processing device 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in the read-only memory 1002 or a program loaded from the storage device 1003 into the random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the mold temperature system. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems can be connected to the input / output interface 1006: input devices 1007 including, for example, a touch screen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices 1003 including, for example, magnetic tape, hard disk, etc.; and communication devices 1009. The communication device 1009 allows the mold temperature system to communicate wirelessly or wiredly with other devices to exchange data. Although the figure shows mold temperature systems with various configurations, it should be understood that implementation or possession of all the systems shown is not required. More or fewer systems may be implemented alternatively.

[0130] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from read-only memory 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0131] The mold temperature system provided in this application, employing the mold temperature system control method described in the above embodiments, can solve the technical problem of low production yield in mold temperature systems. Compared with the prior art, the beneficial effects of the mold temperature system provided in this application are the same as those of the mold temperature system control method provided in the above embodiments, and other technical features of this mold temperature system are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0132] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0133] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0134] This embodiment provides a computer-readable storage medium having computer-readable program instructions stored thereon, which are used to execute the control method of the mold temperature system in the first embodiment described above.

[0135] The computer-readable storage medium provided in this application embodiment may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor devices, apparatuses, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable EPROM (Electrical Programmable Read Only Memory) or flash memory, optical fiber, portable compact disk CD-ROM (compact discread-only memory), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution device, apparatus, or apparatus. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0136] The aforementioned computer-readable storage medium may be included in the mold temperature system or may exist independently without being assembled into the mold temperature system.

[0137] The aforementioned computer-readable storage medium carries one or more programs. When the one or more programs are executed by the mold temperature system, the mold temperature system: acquires the operating parameters of the mold temperature system and acquires the production yield of the mold temperature system; if the production yield is less than a preset yield threshold, adjusts the control parameters of the mold temperature system based on the operating parameters to obtain correction parameters; and controls the operation of the mold temperature system based on the correction parameters to improve the production yield of the mold temperature system.

[0138] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a LAN (local area network) or WAN (wide area network)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0139] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of devices, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based device that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0140] The modules described in the embodiments of this disclosure can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0141] The computer-readable storage medium provided in this application embodiment stores computer-readable program instructions for executing the above-described mold temperature system control method, aiming to solve the technical problem of low production yield of mold temperature systems. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application embodiment are the same as the beneficial effects of the mold temperature system control method provided in the above embodiments, and will not be repeated here.

[0142] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the mold temperature system control method described above.

[0143] The computer program product provided in this application aims to solve the technical problem of low production yield of mold temperature control systems. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as the beneficial effects of the mold temperature control method provided in the above embodiments, and will not be repeated here.

[0144] The above are merely preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structural or procedural transformations made using the description and drawings of the present application, or direct or indirect applications in other related technical fields, are similarly included within the patent processing scope of the present application.

Claims

1. A control method of a mold temperature system, characterized by, The control method comprises: obtaining an operation parameter of the mold temperature system, and obtaining a production yield of the mold temperature system; in the case where the production yield is less than a preset yield threshold, adjusting a control parameter of the mold temperature system based on the operation parameter to obtain a corrected parameter; based on the corrected parameter, controlling the mold temperature system to operate so as to improve the production yield of the mold temperature system.

2. The control method of a mold temperature system according to claim 1, wherein, The step of obtaining the production yield of the mold temperature system comprises: inputting the operation parameter into a health degree model trained in advance, and outputting the production yield of the mold temperature system under the operation parameter by the health degree model.

3. The control method of a mold temperature system according to claim 1, wherein, The control parameter comprises a set temperature and / or a set pressure, and the corrected parameter comprises a corrected temperature and / or a corrected pressure; The step of correcting the control parameter of the mold temperature system based on the operation parameter to obtain a corrected parameter in the case where the production yield is less than a preset yield threshold comprises: calling a preset maintenance model, and outputting an unqualified reason causing the production yield to be less than the preset yield threshold based on the operation parameter; in the case where the unqualified reason comprises temperature abnormality, correcting the set temperature of the mold temperature system by the preset maintenance model to obtain a corrected temperature; in the case where the unqualified reason comprises pressure abnormality, correcting the set pressure of the mold temperature system by the preset maintenance model to obtain a corrected pressure.

4. The control method of a mold temperature system according to claim 1, wherein The step of controlling the mold temperature system to operate based on the corrected parameter comprises: obtaining a correction credibility of the corrected parameter by a preset maintenance model, and in the case where the corrected parameter is in a preset normal parameter range and the correction credibility is greater than a preset credibility threshold, controlling the mold temperature system to operate according to the corrected parameter; in the case where the correction credibility is less than or equal to the preset credibility threshold and / or the corrected parameter is not in the preset normal parameter range, outputting a correction abnormality prompt, and controlling the mold temperature system to operate according to the control parameter before the correction or according to a feedback parameter obtained based on the correction abnormality prompt.

5. The control method of a mold temperature system according to claim 1, wherein The control method of the mold temperature system further comprises: obtaining cumulative operation data of the mold temperature system and a production plan of the mold temperature system; calling a preset maintenance model, and generating maintenance data of the mold temperature system based on the cumulative operation data and the production plan.

6. The control method of a mold temperature system according to claim 5, wherein The maintenance data comprises a target maintenance period and a maintenance component; The step of calling the preset maintenance model, and generating the maintenance data of the mold temperature system based on the cumulative operation data and the production plan comprises: inputting the cumulative operation data into the preset maintenance model, generating a component health degree of at least one component of the mold temperature system by the preset maintenance model, and determining a maintenance component in each component based on the component health degree of each component; inputting the production plan into the preset maintenance model, and outputting a maintainable period in which the production plan is not interrupted by the preset maintenance model; determining a target maintenance period of each maintenance component based on the component health degree of each maintenance component and the maintainable period.

7. The control method of a mold temperature system according to claim 6, wherein The cumulative operation data at least includes one of pump operation data of a pump in the mold temperature system, valve operation data of a solenoid valve, and heating operation data of a heating control assembly; The component health of the pump includes pump remaining life and wear state, the component health of the solenoid valve includes valve remaining life, and the component health of the heating control assembly includes assembly remaining life; The step of generating the component health of at least one component in the mold temperature system through the preset maintenance model includes: In the case that the cumulative operation data includes pump operation data, the pump remaining life is outputted based on cumulative operation time, operation average current and start-stop number in the pump operation data, and the wear state of the pump is generated based on current operation pressure, historical operation pressure and current operation current in the pump operation data through the preset maintenance model; In the case that the cumulative operation data includes the valve operation data, the valve remaining life is generated based on cumulative switch number, cumulative power-on time and valve temperature in the valve operation data through the preset maintenance model; In the case that the cumulative operation data includes the heating operation data, the assembly remaining life of the heating control assembly is generated based on heating operation time and heating switch number in the heating operation data through the preset maintenance model.

8. The control method of a mold temperature system according to claim 1, wherein, The mold temperature system is provided with a circulating water circuit and a cooling water circuit in heat exchange with the circulating water circuit, a pressure relief valve is arranged on the circulating water circuit, a cold water pump and a cold water valve are arranged on the cooling water circuit, and the control method further includes: acquiring current operation temperature of the circulating water circuit, and in the case that the operation temperature is greater than current set temperature of the mold temperature system, opening the cold water valve and the cold water pump to cool the circulating water circuit; in the case that the operation temperature is less than the current set temperature of the mold temperature system, increasing operation temperature of the mold temperature system, and detecting operation pressure of the circulating water circuit; in the case that the operation pressure is greater than current set pressure of the mold temperature system, performing pressure relief operation through the pressure relief valve.

9. The control method of a mold temperature system according to claim 8, wherein, The circulating water circuit is further provided with a water storage device and a booster pump, and a liquid level switch at the highest liquid level of the water storage device, and the control method further includes: detecting switch state of the liquid level switch, and in the case that the switch state is off, supplementing water to the circulating water circuit through the booster pump.

10. A mold temperature system characterized by, The mold temperature system includes: at least one processor; and a memory in communication connection with the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the steps of the control method of the mold temperature system in any one of claims 1 to 9.

11. A storage medium, characterized by The storage medium is a computer readable storage medium, and the computer readable storage medium stores a program for implementing the control method of the mold temperature system, and the program for implementing the control method of the mold temperature system is executed by the processor to implement the steps of the control method of the mold temperature system in any one of claims 1 to 9.

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