Temperature control device applied to electronic equipment and electronic equipment

Abstract

The invention discloses a temperature control device applied to electronic equipment and the electronic equipment, which are used for automatically controlling the temperature of the electronic equipment so as to at least solve the problem that the electronic equipment runs at an over-low temperature. The device provided by the invention comprises a heating circuit; the temperature comparison module obtains the temperature difference between the environment temperature of the electronic equipment and the reference environment temperature; the load comparison module is used for acquiring the power consumption difference between the load power consumption of the electronic equipment and the reference load power consumption; and the control module is connected with the temperature comparison module, the load comparison module and the heating circuit, and controls the working state of the heating circuit according to the temperature difference signal output by the temperature comparison module and the power consumption difference signal output by the load comparison module.

Description

Technical Field

[0001] This application relates to the field of temperature control, and more particularly to a temperature control device and an electronic device for use in electronic devices. Background Technology

[0002] Electronic devices are often set with a rated operating temperature, which is the temperature at which the various functional modules within the electronic device can operate normally. If the ambient temperature of the electronic device is too low, it may cause malfunctions.

[0003] How to automatically control the temperature of electronic devices to prevent them from operating at excessively low temperatures is a technical problem that urgently needs to be solved. Summary of the Invention

[0004] The purpose of this application is to provide a temperature control device and an electronic device for use in electronic devices, so as to automatically control the temperature of the electronic device, thereby at least solving the problem of the electronic device operating at excessively low temperatures.

[0005] In a first aspect, a temperature control device for use in electronic devices is provided, comprising:

[0006] Heating circuit;

[0007] The temperature comparison module obtains the temperature difference between the ambient temperature of the electronic device and the reference ambient temperature.

[0008] The load comparison module obtains the power difference between the load power consumption of the electronic device and the reference load power consumption;

[0009] The control module is connected to the temperature comparison module, the load comparison module, and the heating circuit, and controls the working state of the heating circuit according to the temperature difference signal output by the temperature comparison module and the power consumption difference signal output by the load comparison module.

[0010] In a second aspect, an electronic device is provided, including the temperature control device as described in the first aspect.

[0011] In this embodiment, the temperature control device for an electronic device includes a heating circuit, a temperature comparison module, a load comparison module, and a control module. The temperature comparison module acquires the temperature difference between the ambient temperature of the electronic device and a reference ambient temperature. The load comparison module acquires the power consumption difference between the load power consumption of the electronic device and the reference load power consumption. The control module controls the operating state of the heating circuit based on the temperature difference signal output by the temperature comparison module and the power consumption difference signal output by the load comparison module. For electronic devices operating at excessively low temperatures, the device provided in this embodiment can fully utilize the heat energy generated by the load of the electronic device itself, and comprehensively control the operating state of the heating circuit by combining the temperature of the electronic device and the heat energy generated by the load, ensuring that the electronic device is at the required operating temperature and effectively improving energy utilization. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0013] Figure 1 This is one of the structural schematic diagrams of a temperature control device applied to an electronic device according to an embodiment of this application;

[0014] Figure 2 This is a second schematic diagram of the structure of a temperature control device applied to an electronic device, according to one embodiment of this application.

[0015] Figure 3a This is a third schematic diagram of the structure of a temperature control device applied to an electronic device, according to one embodiment of this application.

[0016] Figure 3b This is a circuit diagram of a temperature comparison module applied in a temperature control device for electronic devices, according to one embodiment of this application.

[0017] Figure 4 This is a fourth schematic diagram of a temperature control device applied to an electronic device, according to one embodiment of this application.

[0018] Figure 5 This is the fifth schematic diagram of a temperature control device applied to an electronic device, according to one embodiment of this application.

[0019] Figure 6 This is a schematic diagram of the structure of a load comparison module of a temperature control device for electronic devices, according to an embodiment of this application.

[0020] Figure 7a This is a schematic diagram of the structure of a temperature control device applied to an electronic device, according to one embodiment of this application;

[0021] Figure 7b This is a schematic diagram of the circuit structure of a load comparison module of a temperature control device for electronic devices, according to an embodiment of this application.

[0022] Figure 8 This is the seventh schematic diagram of a temperature control device applied to an electronic device, according to one embodiment of this application;

[0023] Figure 9 This is a schematic diagram of the circuit structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. The drawing numbers in this application are only used to distinguish the various steps in the solution and are not used to limit the execution order of the various steps. The specific execution order is subject to the description in the specification.

[0025] The solution provided in this application can be used to control the temperature of electronic devices, ensuring they operate at a suitable temperature and preventing malfunctions caused by excessively low temperatures. For example, in countries like Northern Europe, winter temperatures are extremely low, and outdoor-installed CPE (Customer Premise Equipment) products may be exposed to temperatures below -40 degrees Celsius. At such temperatures, many electronic components cannot function properly, and may even fail to power on.

[0026] The device provided in this application embodiment can be applied to the above-mentioned CPE small network terminal equipment or other electronic equipment. It can be used to reasonably heat electronic equipment in low-temperature environments, ensuring that the electronic equipment operates normally at a suitable temperature, while making full use of energy and achieving energy-saving and environmental protection effects.

[0027] To address the problems existing in related technologies, embodiments of this application provide a temperature control device for electronic devices, such as... Figure 1 As shown, it includes:

[0028] Heating circuit 11;

[0029] Temperature comparison module 12 acquires the temperature difference between the ambient temperature of the electronic device and the reference ambient temperature;

[0030] The load comparison module 13 obtains the power difference between the load power consumption of the electronic device and the reference load power consumption;

[0031] The control module 14 is connected to the temperature comparison module 12, the load comparison module 13 and the heating circuit 11, and controls the working state of the heating circuit 11 according to the temperature difference signal output by the temperature comparison module 12 and the power consumption difference signal output by the load comparison module 14.

[0032] In the apparatus provided in this application embodiment, the heating circuit may include sub-modules such as heating resistors capable of performing heating functions. This heating circuit may be located near the electronic device, for example, positioned around the electronic device, covering the surface of the electronic device, or embedded within the electronic device.

[0033] The temperature comparison module is used to obtain the temperature difference between the ambient temperature of the electronic device and a reference ambient temperature. Specifically, the ambient temperature of the electronic device can be acquired through data acquisition and compared with a pre-set reference ambient temperature to determine the temperature difference. Alternatively, the temperature difference can be obtained directly from other modules or devices.

[0034] Ambient temperature refers to the temperature of the operating environment of the electronic device. In practical applications, the temperature acquisition method can be flexibly set according to the actual structure of the electronic device. For example, the temperature can be measured at multiple points such as the outer surface, inner surface, and center of the electronic device, and the ambient temperature can be determined by averaging or weighted averaging, thereby improving the accuracy of obtaining the ambient temperature.

[0035] The load comparison module is used to obtain the power difference between the load power consumption of the electronic device and the reference load power consumption. Specifically, the load power consumption of the electronic device can be acquired by sampling and compared with the preset reference load power consumption to determine the power difference. Alternatively, the power difference can be obtained directly from other modules or devices.

[0036] Load power consumption refers to the power consumed by an electronic device under load. In practical applications, the load power consumption of an electronic device can be determined by measuring several electrical parameters such as the load current and load voltage.

[0037] In this embodiment of the application, the aforementioned reference ambient temperature and reference load power consumption can be preset based on actual needs.

[0038] The following examples will further illustrate this solution.

[0039] The temperature control device provided in this application embodiment can be applied to a CPE (Continuous Equipment). It obtains the temperature difference between the CPE's ambient temperature and a reference ambient temperature through a temperature comparison module, and the power consumption difference between the CPE's load power consumption and the reference load power consumption through a load comparison module. Therefore, the control module combines the temperature difference and power consumption difference to control the operating state of the heating circuit, thereby effectively regulating the CPE's ambient temperature. During the regulation process, the temperature difference output by the temperature comparison module reflects the difference between the CPE's ambient temperature and its optimal operating temperature. The power consumption difference output by the load comparison module reflects the difference between the heat energy generated by the CPE's own load power consumption and the required heat energy. Furthermore, by comprehensively controlling the operating state of the heating circuit based on the temperature difference and power consumption difference, the device can rationally utilize the heat energy generated by the CPE's own load power consumption based on the power consumption difference, and supplement the heat energy required to maintain the CPE's ambient temperature, thereby preventing the CPE's function from being affected by low temperatures and ensuring the normal and stable operation of the CPE's overall function.

[0040] The reference ambient temperature and reference load power consumption can be set according to the actual situation of the CPE.

[0041] Optionally, the reference ambient temperature is the temperature within the rated operating temperature range of the electronic device.

[0042] Assuming the suitable operating temperature for a CPE is greater than or equal to -20℃, the reference ambient temperature can be set to a value greater than -20℃, such as -10℃. Setting the reference ambient temperature based on the rated operating temperature range of the electronic device allows the temperature difference output by the temperature comparison module to characterize whether the temperature at which the electronic device is located is a suitable temperature for the electronic device, and thus whether heating of the electronic device is required.

[0043] Optionally, the heat generated by the electronic device under the reference load power consumption is greater than or equal to the heat generated by the heating circuit in the working state.

[0044] The aforementioned reference load power consumption can be determined based on the heat generated by the heating circuit during operation. For example, the heat generated by the electronic device under the reference load power consumption is greater than or equal to the heat generated by the heating circuit during operation. Setting the reference load power consumption based on the heat generated by the heating circuit during operation allows the power consumption difference output by the load comparison module to characterize whether the heat generated by the electronic device's own load can replace the heat generated by the heating circuit during operation. This, in turn, indicates whether it is necessary to control the heating circuit to perform heating based on the heat generated by the electronic device's own load.

[0045] The device provided in this application embodiment enables intelligent control of the heating circuit of outdoor CPEs and small network terminal devices when they are working outdoors. By monitoring and comparing temperature and load, the heating circuit can be flexibly controlled to ensure that the heated CPE is at a suitable operating temperature.

[0046] In practical applications, the aforementioned power consumption difference may vary due to the actual load power consumption of the CPE, and the aforementioned temperature difference may also vary due to factors such as ambient temperature and the heating effect of the heating circuit. The device provided in this solution can be flexibly adjusted by the control module according to the actual changes, and the CPE can be kept at a suitable operating temperature by controlling the working state of the heating circuit.

[0047] Specifically, the control module can compare and judge the working state of the CPE and the working state of the heating circuit to determine how to control the working state of the heating circuit.

[0048] For example, suppose the ambient temperature is lower than the reference ambient temperature, and the CPE is not powered on (i.e., the power consumption difference is 0, which is the difference between the power consumption of the reference load and the ambient temperature). In this case, in order to ensure that the CPE can be powered on normally, the heating circuit can be controlled to generate the heat energy required for the CPE to power on, based on the temperature difference between the ambient temperature and the reference ambient temperature, ensuring that the generated heat energy is greater than or equal to the heat energy corresponding to the temperature difference.

[0049] After the CPE is powered on, the CPE itself will generate some heat energy due to its own load. The control module can adjust the working state of the heating circuit according to the power consumption difference.

[0050] In one scenario, if the aforementioned power consumption difference indicates that the heat generated by the CPE's own load is greater than or equal to the heat required to reach the aforementioned start-up temperature, then it means that the heat generated by the CPE itself is sufficient to maintain its ambient temperature at or above the aforementioned reference ambient temperature. In this case, the control module can control the heating circuit to stop operating, and the CPE can maintain a suitable operating temperature based on the heat generated by its own load, without requiring additional heating from the heating circuit.

[0051] In one scenario, after the CPE is powered on, if the aforementioned power consumption difference indicates that the heat generated by the CPE's own load is less than the heat required to reach the aforementioned startup temperature, it means that the heat generated by the CPE itself is insufficient to maintain an ambient temperature greater than or equal to the aforementioned reference ambient temperature. In this case, the power consumption difference output by the load comparison module can characterize the power consumption difference between the heat generated by the CPE's actual load power consumption and the heat generated by the heating circuit. Based on this power consumption difference, the heating circuit is controlled to supplement the heat generated when the CPE's own heat generation is insufficient, thereby ensuring that the CPE is at a suitable operating temperature.

[0052] In one scenario, the power consumption of the CPE itself remains unchanged, while the ambient temperature changes. In this case, the temperature difference output by the temperature comparison module reflects the change in ambient temperature. Specifically, if the environment cools, the temperature difference tends to decrease while the load and heating circuit operating states remain constant. Conversely, if the environment warms, the temperature difference tends to increase while the load and heating circuit operating states remain constant. The control module can flexibly control the operating state of the heating circuit based on this temperature difference. That is, when the environment cools and the temperature difference decreases, it immediately controls the heating circuit to generate more heat to prevent the CPE's environment from cooling down. Conversely, when the environment warms and the temperature difference increases, it immediately controls the heating circuit to generate less heat, fully utilizing ambient heat and saving energy.

[0053] In one scenario, the CPE's own load power consumption changes, and the ambient temperature of the CPE also changes. In this case, the control module can comprehensively determine the heat energy that the heating circuit needs to replenish based on the temperature difference output by the temperature comparison module and the power consumption difference output by the load comparison module. This allows the control module to control the operating state of the heating circuit, ensuring that the sum of the heat energy generated by the heating circuit and the heat energy generated by the CPE's own load is greater than or equal to the heat energy corresponding to the temperature difference. This raises the ambient temperature of the CPE to the reference ambient temperature required for normal CPE operation.

[0054] In the device provided in this application embodiment, the temperature difference output by the temperature comparison module reflects the difference between the ambient temperature of the electronic device and the reference ambient temperature suitable for operation. The power consumption difference output by the load comparison module represents the difference between the heat energy generated by the electronic device itself and the heat energy generated by the heating circuit in operation. The control module determines the required temperature difference and the heat generated by the electronic device's own load based on the aforementioned temperature difference and power consumption difference. It then determines the heat energy required by the heating circuit based on the difference between the heat energy required to increase the temperature difference and the heat energy generated by the electronic device's own load, thereby determining the operating state of the heating circuit. This allows the control of the specific operating state of the heating circuit to supplement the heat energy, ensuring that the sum of the heat generated by the electronic device itself and the heat generated by the heating circuit can raise the ambient temperature of the electronic device to above the aforementioned reference ambient temperature.

[0055] Optionally, the operating state of the heating circuit may only include on and off. When the heat generated by the electronic device itself is insufficient to maintain the electronic device at a temperature above the reference ambient temperature, the heating circuit is controlled to turn on; when the heat generated by the electronic device itself is sufficient to maintain the electronic device at a temperature above the reference ambient temperature, the heating circuit is controlled to turn off.

[0056] Optionally, the operating state of the heating circuit can include multiple levels, such as 0% (completely off), 20%, 40%, 60%, 80%, and 100% (completely on). The control module can control the operating level of the heating circuit according to the determined heat energy required by the heating circuit, ensuring that the heat energy generated by the heating circuit is greater than or equal to the determined heat energy required.

[0057] The apparatus provided in this application includes a heating circuit, a temperature comparison module, a load comparison module, and a control module. The temperature comparison module acquires the temperature difference between the ambient temperature of the electronic device and a reference ambient temperature. The load comparison module acquires the power consumption difference between the load power consumption of the electronic device and the reference load power consumption. The control module controls the operating state of the heating circuit based on the temperature difference signal output by the temperature comparison module and the power consumption difference signal output by the load comparison module. For electronic devices operating at excessively low temperatures, the apparatus provided in this application can fully utilize the heat energy generated by the load of the electronic device itself, and comprehensively control the operating state of the heating circuit by combining the temperature of the electronic device and the heat energy generated by the load, ensuring that the electronic device is at the required operating temperature and effectively improving energy utilization.

[0058] Based on the solution provided in the above embodiments, optionally, the control module controls the heating circuit to perform heating when at least one of the temperature difference signal and the power consumption difference signal triggers a preset heating condition, wherein the preset heating condition includes the ambient temperature being lower than the reference ambient temperature and the load power consumption being lower than the reference load power consumption.

[0059] In this application example, the control module connected to the aforementioned temperature comparison module and load comparison module controls the operating state of the heating circuit based on OR gate logic. That is, if the temperature difference indicates that the ambient temperature is lower than the reference ambient temperature, and / or the power consumption difference indicates that the load power consumption is lower than the reference load power consumption, then the heating circuit is controlled to perform heating.

[0060] The preset heating conditions include an ambient temperature lower than a reference ambient temperature and a load power consumption lower than a reference load power consumption. When the temperature difference triggers the preset heating condition, it indicates that the ambient temperature of the electronic device is lower than the reference ambient temperature, and heating is required. When the load comparison module triggers the preset heating condition, it indicates that the heat generated by the electronic device's own load is lower than the heat generated by the heating circuit, and cannot replace the heating circuit, so the heating circuit needs to perform heating to make up for the required heat.

[0061] The apparatus provided in this application integrates the difference between temperature and load based on OR gate logic, and determines the operating state of the heating circuit from both temperature and load dimensions. This enables efficient and accurate heating and ensures that the electronic equipment is at a suitable operating temperature.

[0062] Based on the solutions provided in the above embodiments, optionally, such as Figure 2 As shown, the heating circuit 11 includes multiple heating resistors, the temperature difference signal includes a temperature difference value, and the power consumption difference signal includes a power consumption difference value;

[0063] When at least one of the temperature difference signal and the power consumption difference signal triggers a preset heating condition, the control module 14 determines the target thermal energy corresponding to the difference of the target signal that triggers the preset heating condition, and controls at least one target heating resistor to be turned on, wherein the total thermal energy generated by the at least one target heating resistor in the turned-on state is greater than or equal to the target thermal energy.

[0064] In this embodiment, the heating circuit specifically includes multiple heating resistors. These heating resistors may be of the same or different types, and the heat energy generated by different heating resistors may be the same or different. The control module can control a portion of the heating resistors to conduct and heat according to the actual power output of each heating resistor, thereby combining to generate the required heat energy.

[0065] For example, the control module first determines the heat energy required by the heating circuit based on the temperature difference and power consumption difference mentioned above; that is, the difference between the heat energy corresponding to the temperature difference and the heat energy generated by the electronic device load itself. Then, it determines the power required to generate the required heat energy based on the power consumption of the heating circuit. Assuming that the heating circuit contains 10 identical heating resistors, the number of heating resistors required to achieve the above power is determined, and then the number of heating resistors is controlled to conduct through a switch to ensure that the total heat energy generated by the conducting heating resistors in the heating circuit is greater than or equal to the heat energy required by the heating circuit.

[0066] For multiple heating resistors, they can be arranged in parallel in the heating circuit. Each branch containing a heating resistor can include a switch connected in series with the heating resistor. The on / off state of the heating resistor in the branch can be controlled by controlling the opening and closing of the switch. Figure 2 In the example shown, the heating circuit includes three heating resistors connected in parallel, and each heating resistor branch contains a switch connected in series with the heating resistor.

[0067] Specifically, the control module can determine whether the temperature difference signal and the power consumption difference signal have triggered the preset heating conditions, that is, whether the temperature difference signal indicates that the ambient temperature is lower than the reference ambient temperature, and whether the power consumption difference signal indicates that the load power consumption is lower than the reference load power consumption.

[0068] In practical applications, the signal that triggers the preset heating condition is identified as the target signal. If both the temperature difference signal and the power consumption difference signal trigger the preset heating condition, both signals are identified as target signals. After identifying the target signals, the target thermal energy corresponding to the difference between the target signals is determined. For example, if both the temperature difference signal and the power consumption difference signal trigger the preset heating condition, the sum of the temperature difference value of the temperature difference signal and the power consumption difference value of the power consumption difference signal is determined, and then the target thermal energy corresponding to this sum of differences is determined. Then, at least one target heating resistor that generates more heat than the target thermal energy is identified from the multiple heating resistors included in the heating circuit. The at least one target heating resistor is then controlled to conduct, such that the total thermal energy generated by the conducting heating resistor is greater than or equal to the target thermal energy.

[0069] The solution provided in this application allows the control module to flexibly control the switching on and off of multiple heating resistors in the heating circuit, thereby ensuring that the overall heat energy generated by the heating circuit is greater than or equal to the target heat energy. For the power consumption difference signal that triggers the preset heating conditions, the control module controls the target heating resistor to conduct, allowing the heat energy generated by the heating circuit to compensate for the difference in the target signal, ensuring that the temperature of the electronic device meets the requirements for normal operation and guaranteeing the stability of the electronic device's operation.

[0070] Based on the solutions provided in the above embodiments, optionally, such as Figure 3a As shown, the temperature comparison module 12 includes an internal temperature acquisition module 121 and a temperature comparator 122;

[0071] The internal temperature acquisition module 121 acquires the internal ambient temperature of the electronic device;

[0072] The temperature comparator 122 compares the internal ambient temperature with the reference ambient temperature and outputs a temperature difference signal characterizing the temperature comparison result.

[0073] In this embodiment, the temperature comparison module includes an internal temperature acquisition module and a temperature comparator. The internal temperature acquisition module acquires the internal ambient temperature of the electronic device, then compares the internal ambient temperature with a reference ambient temperature using the temperature comparator, and outputs a temperature difference signal characterizing the comparison result. The temperature difference signal can be simply a high or low level signal; for example, an output of 1 indicates that the internal ambient temperature is lower than the reference ambient temperature, and an output of 0 indicates that the internal ambient temperature is higher than or equal to the reference ambient temperature. Alternatively, the temperature difference signal can include the temperature difference value between the internal ambient temperature and the reference ambient temperature.

[0074] The solution provided in this application collects the internal ambient temperature of electronic devices. Collecting the temperature from the inside can accurately reflect the actual temperature of the internal functional modules of the electronic devices, thereby improving the accuracy and effectiveness of temperature control.

[0075] Optionally, the internal temperature acquisition module 121 includes a thermistor;

[0076] The first terminal of the thermistor is electrically connected to the negative input terminal of the temperature comparator, and the second terminal of the thermistor is grounded.

[0077] The temperature comparator 122 compares the temperature collected by the thermistor with the reference ambient temperature and outputs a temperature difference signal.

[0078] In this embodiment, the internal temperature acquisition module includes a thermistor, which can convert the ambient temperature into electrical parameters so that the temperature comparator can acquire the electrical parameters and compare the temperature represented by the electrical parameters with the reference ambient temperature to output an accurate temperature difference signal.

[0079] Optionally, the internal temperature acquisition module 121 includes:

[0080] A filter current limiting circuit, wherein the first terminal of the filter current limiting circuit is electrically connected to the power supply terminal;

[0081] A voltage divider circuit is connected between the second terminal of the filter current limiting circuit and the positive input terminal of the temperature comparator 122.

[0082] In this embodiment, the internal temperature acquisition module includes a filtering and current-limiting circuit. This circuit filters the electrical signal, improving its stability and reducing interference. The current-limiting circuit also stabilizes the peak current of the electrical signal, enhancing the overall circuit safety.

[0083] Optional, Figure 3b A circuit diagram of a temperature comparison module is shown, wherein the filter current limiting circuit includes a filter capacitor C21 and a current limiting resistor R21;

[0084] The first terminal of the filter capacitor C21 is electrically connected to the power supply terminal, and the second terminal of the filter capacitor C21 is grounded.

[0085] The first end of the current-limiting resistor R21 is electrically connected to the first end of the filter capacitor C21, and the second end of the current-limiting resistor R21 is electrically connected to the power supply terminal of the temperature comparator.

[0086] The voltage divider circuit includes voltage divider resistors R22, R24, and R25;

[0087] The first end of the voltage divider resistor R22 is electrically connected to the power supply terminal of the temperature comparator 122, and the second end of the voltage divider resistor R22 is electrically connected to the negative input terminal of the temperature comparator 122.

[0088] The first input terminal of the voltage divider resistor R24 ​​is electrically connected to the power supply terminal of the temperature comparator 122, and the second terminal of the voltage divider resistor R24 ​​is electrically connected to the positive input terminal of the temperature comparator 122.

[0089] The first end of the voltage divider resistor R25 is electrically connected to the positive input terminal of the temperature comparator 122, and the second end of the voltage divider resistor R25 is grounded.

[0090] Specifically, the thermistor can be an NTC (Negative Temperature Coefficient) resistor. This thermistor can be placed near the core functional components of an electronic device to detect the temperature of those components. The voltage divider resistors in the voltage divider circuit can be used to set a reference ambient temperature; this setting is achieved by adjusting the resistance values ​​of each voltage divider resistor in the circuit.

[0091] The temperature comparator is specifically selected as a voltage comparator. The positive input terminal is connected to the voltage divider circuit to receive the voltage value that represents the reference ambient temperature, and the negative input terminal is connected to the thermistor to receive the voltage value that represents the ambient temperature measured by the thermistor. Thus, the voltage comparator performs voltage comparison and outputs a temperature difference signal.

[0092] The solution provided by the embodiments of this application can effectively reduce costs while realizing the function of the temperature comparison module.

[0093] Based on the solutions provided in the above embodiments, optionally, such as Figure 4 As shown, the temperature comparison module 12 is connected to the load comparison module 13, and the temperature comparison module 12 includes an external temperature acquisition module 123;

[0094] The external temperature acquisition module 123 acquires the external ambient temperature of the electronic device;

[0095] The temperature comparison module 12 controls the load comparison module 13 to power on when the external ambient temperature is lower than the reference ambient temperature, and controls the load comparison module 13 to power off when the external ambient temperature is higher than or equal to the reference ambient temperature.

[0096] In this embodiment, the temperature comparison module includes an external temperature acquisition module. This external temperature acquisition module is used to acquire the ambient temperature of the electronic device, which specifically refers to the temperature of the environment in which the electronic device is located. If the electronic device is located inside a building, the external ambient temperature can refer to the temperature inside the building. If the electronic device is located outdoors, the external ambient temperature can refer to the outdoor temperature. Specifically, the external temperature acquisition module can achieve temperature acquisition using a thermistor.

[0097] The temperature comparison module acquires the aforementioned external ambient temperature and compares it with a reference ambient temperature. If the external ambient temperature is higher than or equal to the reference ambient temperature, it indicates that the external ambient temperature is the temperature at which the electronic device can operate normally. In this case, the temperature comparison module controls the load comparison module to shut down, thereby not monitoring the load of the electronic device and eliminating the need to compare the load power consumption.

[0098] Optionally, in one application scenario, if the environment in which the electronic device is located rapidly rises from below a reference ambient temperature to above a reference ambient temperature, the internal ambient temperature of the electronic device may remain below the reference ambient temperature for a short period due to thermal lag. In this case, the device provided in this application embodiment can compare the internal ambient temperature of the electronic device with the reference ambient temperature and output a temperature difference signal. The heating circuit then heats the electronic device according to the temperature difference signal, thereby raising the internal ambient temperature of the electronic device to above or equal to the reference ambient temperature as quickly as possible.

[0099] The solution provided in this application allows the control module to power on or off the load comparison module based on the external ambient temperature of the electronic device, thereby achieving differentiated control with high priority for the temperature comparison module and low priority for the load comparison module. When the external ambient temperature is higher than or equal to a reference ambient temperature, the load comparison module is powered off, and the heating circuit's operation is controlled solely based on the temperature difference output by the temperature comparison module. When the external ambient temperature is lower than the reference ambient temperature, the load comparison module is powered on, thus fully utilizing the heat energy generated by the electronic device's own load. By comprehensively considering both the load and temperature difference, the operating state of the heating circuit is rationally controlled, achieving energy-saving and environmentally friendly effects.

[0100] Based on the solutions provided in the above embodiments, optionally, such as Figure 5 As shown, the load comparison module 13 includes a load acquisition module 131 and a load comparator 132;

[0101] The load acquisition module 131 acquires the load power consumption of the electronic device;

[0102] The load comparator 132 compares the load power consumption output by the load acquisition module 131 with the reference load power consumption and outputs a power difference signal characterizing the load power consumption comparison result.

[0103] In this embodiment, the load comparison module includes a load acquisition module and a load comparator. The load acquisition module is used to acquire the load power consumption of the electronic device, and the acquired load power consumption can characterize the heat generated by the load of the electronic device itself. The load comparator is used to compare the acquired load power consumption with a reference load power consumption and output a power difference signal, which can characterize the heat generated by the load power consumption of the electronic device. If the heat generated by the electronic device under the reference load power consumption is greater than or equal to the heat generated by the heating circuit in the fully on state, then the power difference signal can characterize whether the heat generated by the load power consumption of the electronic device itself can replace the heat generated by the heating circuit as a whole.

[0104] In practical applications, when the control module receives the temperature difference output by the temperature comparison module and the power consumption difference output by the load comparison module, it determines whether the heat generated by the electronic device's own load is sufficient to compensate for the temperature difference, thereby ensuring that the electronic device operates in an environment with a temperature greater than or equal to the reference ambient temperature. If the power consumption difference indicates that the heat generated by the electronic device's own load is sufficient to compensate for the temperature difference, and the heating circuit is currently in a conductive state, the control module can control the heating circuit to be de-energized. This allows the electronic device to maintain its ambient temperature solely through the heat generated by its own load, eliminating the need for additional heating from the heating circuit and achieving energy-saving and environmentally friendly results.

[0105] Based on the solutions provided in the above embodiments, optionally, Figure 6 A schematic diagram of the load comparison module is shown. The reference load power consumption includes the reference load voltage. The load acquisition module 131 includes a precision resistor 1311.

[0106] The precision resistor 1311 is connected between the power supply terminal and the load circuit of the electronic device;

[0107] The load comparator 1312 compares the voltage difference across the precision resistor 1311 with the reference load voltage and outputs the power consumption difference signal.

[0108] In the solution provided in this application embodiment, the load acquisition module realizes load acquisition of the electronic device through a precision resistor. This precision resistor is connected between the power supply terminal and the load circuit of the electronic device, enabling real-time and effective detection of the current in the load circuit of the electronic device.

[0109] The load comparator detects the voltage difference across the precision resistor and compares it with a reference load voltage. Based on the circuit containing the precision resistor, the voltage across it changes accordingly with the load on the electronic device. This transmits the load value of the electronic device to the load comparator, which then compares the voltage difference across the precision resistor with the reference load voltage and outputs a power difference signal characterizing the power consumption of the electronic device.

[0110] Based on the solutions provided in the above embodiments, optionally, such as Figure 7a As shown, the load acquisition module 131 includes:

[0111] A first filter circuit 1313 is connected between the precision resistor 1311 and the power supply terminal;

[0112] The second filter circuit 1314 and the amplifier circuit 1315 are used to connect the two ends of the precision resistor 1311 to the negative input terminal of the load comparator 1312 through the second filter circuit 1314 and the amplifier circuit 1315.

[0113] A reference voltage setting circuit 1316 is electrically connected to the positive input terminal of the load comparator 1312.

[0114] In this embodiment, a first filter circuit is connected between the precision resistor and the power supply terminal. The first filter circuit can filter the electrical signals in the circuit, thereby improving the overall safety of the circuit and the stability of the electrical signals.

[0115] The aforementioned second filter circuit and amplifier circuit are connected between the precision resistor and the load comparator. The voltage difference across the precision resistor is filtered by the second filter circuit, reducing electrical signal interference. Subsequently, the filtered voltage difference is amplified by the amplifier circuit and then input to the negative input terminal of the load comparator. By amplifying the filtered voltage difference through the amplifier circuit, the accuracy of voltage comparison performed by the load comparator can be improved.

[0116] Specifically, the load comparator can be a voltage comparator. The positive input of the load comparator is connected to the reference voltage setting circuit, and the negative input is connected to the voltage difference after filtering and amplification. This allows the load comparator to compare the reference load voltage with the acquired voltage difference and output a power consumption difference signal.

[0117] The solution provided in this application embodiment enables effective detection of the load of electronic equipment through a precision resistor. The first filter circuit, the second filter circuit, and the amplification circuit can effectively improve the stability of the electrical signal, reduce electrical signal interference in the circuit, and improve the accuracy of the comparison results.

[0118] Optional, Figure 7b A schematic diagram of the circuit structure of a load comparison module is shown.

[0119] The first filter circuit 1313 includes a resistor R11 and a capacitor C11;

[0120] The first end of the resistor R11 is electrically connected to the power supply terminal, and the second end of the resistor R11 is electrically connected to the first end of the precision resistor and the power supply terminal of the load comparator;

[0121] The first end of the capacitor C11 is electrically connected to the second end of the resistor R11, and the second end of the capacitor C11 is grounded;

[0122] The second filter circuit 1314 includes:

[0123] A resistor R13 connected between the first end of the precision resistor and the first end of the capacitor C12;

[0124] A resistor R14 connected between the second end of the precision resistor and the second end of the capacitor C12;

[0125] Both ends of the capacitor C12 are electrically connected to the input end of the amplifier circuit;

[0126] The output end of the amplifier circuit is electrically connected to the negative input end of the load comparator;

[0127] The reference voltage setting circuit 1316 includes a resistor R15 and a resistor R16;

[0128] The first end of the resistor R15 is electrically connected to the power supply terminal of the load comparator, and the second end of the resistor R15 is electrically connected to the positive input end of the load comparator;

[0129] The first end of the resistor R16 is electrically connected to the positive input end of the load comparator, and the second end of the resistor R16 is grounded.

[0130] In the solution provided by the embodiment of the present application, the first filter circuit may specifically be an RC filter circuit, and the power supply provides electrical energy for the load circuit after passing through the RC filter circuit. The precision resistor in the circuit can sample the actual power consumption of the load of the electronic device in real time. The relatively small voltage values sampled before and after the precision sampling resistor enter the amplifier circuit through the second filter circuit, so as to filter and amplify the sampled voltage values. Then, the filtered and amplified voltage difference is input to the negative input end IN- of the comparator. The reference voltage setting circuit may specifically be composed of multiple reference resistors. By presetting the resistance values of the reference resistors, the specific value of the reference voltage can be set. The reference voltage setting circuit is connected to the positive input end IN+ of the load comparator, and the load comparison module compares the voltages at the positive input end and the negative input end. Optionally, when IN+>IN-, the load comparator outputs a high level; when IN+<IN-, the load comparator outputs a low level.

[0131] The solution provided by the embodiments of this application can effectively reduce costs while realizing the function of the load comparison module, make full use of the heat generated by the electronic equipment load itself, flexibly control the working state of the heating circuit, and achieve effective temperature control and energy saving and environmental protection.

[0132] Based on the solutions provided in the above embodiments, optionally, such as Figure 8 As shown, the device further includes:

[0133] The active control chip 15, which is connected to the heating circuit, controls the working state of the heating circuit based on active control commands.

[0134] In the solution provided in this application embodiment, the temperature difference output by the temperature comparison module, the power consumption difference output by the load comparison module, and the active control chip all play a certain degree of control role over the heating circuit. In practical applications, the priority of the active control chip can be higher than that of the temperature comparison module and the load comparison module. The active control chip can be preset with safety control rules, thereby controlling the working state of the heating circuit with safety as the highest priority rule.

[0135] In practical applications, technicians can communicate with the active control chip via wired or wireless communication methods, using portable devices such as mobile phones. They can then send control commands to the active control chip through the portable device, and the active control chip will control the working state of the heating circuit according to the received control commands, thereby enabling technicians to control the circuit with high priority.

[0136] In one application scenario, if technicians learn through weather forecasts or other means that electronic devices are about to face extreme low temperatures, they can use an active control chip to control the heating circuit to perform heating before the extreme low temperatures arrive. This will raise the ambient temperature of the electronic devices as much as possible while ensuring safety, thus achieving the goal of resisting extreme low temperatures.

[0137] The power consumption difference output by the load comparison module and the temperature difference output by the temperature comparison module are used to perform logical judgments based on OR gate logic. When at least one of the preset heating conditions is triggered, the logic module controls the heating circuit to perform heating.

[0138] In one application scenario, the power consumption difference and temperature difference can be represented by high and low level signals, i.e., the comparison result is represented by 1 / 0. Based on OR gate logic, the control module controls the heating circuit to enter the heating state when at least one input is high (1). Conversely, the control module controls the heating circuit to stop heating when both inputs are low (0).

[0139] In order to solve the problems existing in the related technologies, this application also provides an electronic device, including the temperature control device described in any of the above embodiments.

[0140] Below, in conjunction with Figure 9 The embodiments of this application will be further described.

[0141] The electronic device provided in this application includes a temperature control device, which can be used to control the ambient temperature of the electronic device. By controlling the heating circuit, the temperature of the electronic device can be increased in low-temperature environments, thereby ensuring that the electronic device operates at a suitable temperature and guaranteeing the overall stability of the electronic device's performance.

[0142] See Figure 9 The circuit diagram shown illustrates an electronic device that includes a power supply circuit. This power supply circuit powers the temperature control device and other functional modules of the electronic device. The temperature control device includes a temperature comparison module, a load comparison module, a control module, a heating circuit, and an active control chip.

[0143] The load comparison module includes a precision resistor, a filter circuit, an amplifier circuit, and a load comparator. Additionally, the load comparison module may include other functional modules described in any of the above embodiments, and is capable of implementing the functions of the load comparison module described in any of the above embodiments, achieving the corresponding technical effects.

[0144] The precision resistor is connected between the power supply circuit and the load circuit, enabling real-time and effective detection of the electronic device's load. It converts the load into voltage, which is then transmitted to the load comparator via a filter and amplifier circuit. The load comparator then compares the detected voltage with a reference load voltage, outputting a power difference signal representing the difference between the load's power consumption and the reference load's power consumption.

[0145] The temperature comparison module includes a temperature comparator, an external temperature acquisition module, and an internal temperature acquisition module. Among them, Figure 9 The environmental detection circuit shown may include the aforementioned external temperature acquisition module and internal temperature acquisition module. Furthermore, the temperature comparison module may also include other functional modules of the temperature comparison module described in any of the above embodiments, and is capable of implementing the functions of the temperature comparison module described in any of the above embodiments, achieving the corresponding technical effects.

[0146] The aforementioned external temperature acquisition module is used to detect the temperature of the external environment in which the electronic device is located, and controls the load comparison module to power on when the external ambient temperature is lower than the reference ambient temperature, and controls the load comparison module to power off when the external ambient temperature is higher than or equal to the reference ambient temperature. The negative input terminal of the aforementioned temperature comparison module is connected to the internal ambient temperature of the electronic device, and the positive input terminal is connected to the reference ambient temperature. The temperature comparison module outputs a temperature difference signal characterizing the difference between the ambient temperature of the aforementioned electronic device and the reference ambient temperature.

[0147] The temperature difference signal output by the temperature comparison module and the power consumption difference signal output by the load comparison module are input to the control module. The control module performs a judgment on the temperature difference signal and the power consumption difference signal based on OR gate logic. If at least one signal triggers a preset heating condition, the control module controls the heating circuit to perform heating. Furthermore, the control module may also include other functional modules described in any of the above embodiments, and is capable of implementing the functions of the control module described in any of the above embodiments, achieving the corresponding technical effects.

[0148] The heating circuit contains multiple heating resistors, in Figure 9 In the example shown, the heating circuit includes six heating resistors. It should be understood that the heating circuit may also include other sub-modules with heating functions, and the number of sub-modules with heating functions can be flexibly set according to actual needs.

[0149] The aforementioned active control chip includes Figure 9 The main chip shown can be connected to the heating circuit to control the heating circuit based on high priority.

[0150] In practical applications, the instruction priority of the main chip in this embodiment is higher than that of the temperature comparison module, and the instruction priority of the temperature comparison module is higher than that of the load comparison module.

[0151] The electronic devices in this solution will be further explained below in conjunction with practical application scenarios.

[0152] In one scenario, electronic devices in a low-temperature environment are powered off. To ensure the devices can power on normally, an ambient temperature detection circuit uses an NTC thermistor to detect both the external ambient temperature and the internal functional module temperature. When the external ambient temperature is lower than a reference ambient temperature (e.g., -15°C), the ambient temperature detection can trigger the temperature comparison module to power on and start operating, outputting a temperature difference signal to trigger the heating circuit to perform heating via the control module.

[0153] As the heating circuit continues to heat, the internal ambient temperature of the electronic device gradually increases. When the internal ambient temperature of the electronic device rises to a level greater than or equal to the reference ambient temperature (e.g., -15℃), that is, when the electronic device is in a suitable operating temperature, other functional modules of the electronic device can be automatically triggered to start operation. Alternatively, other functional modules of the electronic device can be triggered to start operation according to load requirements or manual instructions.

[0154] After the electronic device reaches a suitable operating temperature, the load comparison module, under the control of the temperature comparison module, is powered on because the external ambient temperature is lower than the reference ambient temperature. This load comparison module monitors the load power consumption of the electronic device in real time and outputs a power consumption difference signal. Assuming the external ambient temperature remains constant, the electronic device load itself generates a certain amount of heat, which can replace at least part of the heat generated by the heating circuit. The control module can determine, based on the power consumption difference signal, whether the heating circuit needs to supplement the heat generated by the electronic device load itself. If the heat generated by the electronic device load itself is greater than or equal to the total heat generated by the heating circuit, then the electronic device can maintain a suitable operating temperature solely through its own heat generation, and the heating circuit can be stopped. If the heat generated by the electronic device load itself is less than the total heat generated by the heating circuit, then the difference between the heat generated by the electronic device load itself and the total heat generated by the heating circuit can be further determined, and at least some of the heating resistors in the heating circuit can be activated to compensate for the difference, ensuring that the total heat generated by the heating circuit and the electronic device load itself is sufficient to maintain a suitable operating temperature for the electronic device.

[0155] In addition, the main chip has a higher priority than the control module mentioned above, and technicians can flexibly control the heating circuit according to their own needs through the main chip.

[0156] In one scenario, the actual load on an electronic device may change, and this change in load power consumption will cause a change in the power difference output by the load comparison module. On the one hand, frequently changing load power consumption is difficult to detect effectively in real time. If a high-frequency, accurate detection method is used, it often requires significant energy consumption, high-frequency transmission of electrical signals, and the control module also needs to perform calculations at a corresponding high frequency. While this method can effectively detect and determine the appropriate operating state of the heating circuit in real time, it consumes a large amount of resources.

[0157] Optionally, in the solution provided in this application embodiment, if the aforementioned power consumption difference signal triggers a preset heating condition, the control module needs to further determine how to control the operating state of the heating circuit based on the power consumption difference signal. In this case, the heat generated by the electronic device itself can be determined based on the heating efficiency of the lowest load of the electronic device. The advantage of determining the minimum load heat generation based on the heating efficiency of the lowest load of the electronic device is that, regardless of how the load of the electronic device changes, the heat generated by the electronic device itself will inevitably be greater than the aforementioned minimum load heat generation, which is beneficial for controlling the lower limit of the temperature of the electronic device and avoiding the temperature from falling below the suitable minimum operating temperature of the electronic device.

[0158] In practical applications, the heating efficiency of all components of an electronic device can be queried. The heating efficiency A of the electronic device is determined based on the power consumption of the entire device under the lowest load condition. That is, the heat generated by the electronic device under any load condition while powered on is greater than the aforementioned heating efficiency A. For ease of explanation, in this embodiment, the minimum power consumption of the electronic device under normal operation is recorded as WA1, and the maximum power consumption is recorded as WA2. The heating efficiency of the heating circuit is recorded as B, and the maximum heating power consumption is recorded as WB.

[0159] In a scenario where the external ambient temperature remains constant and is lower than the reference ambient temperature, when the heating circuit operates at its maximum heating power consumption WB, and WB*B ≤ WA1*A, the self-generated heat from the load after the electronic device starts up is greater than or equal to the maximum heat generated by the heating circuit. After the electronic device starts up, when the load reaches its minimum value WA1, the heat generated by the electronic device's own load is sufficient to replace the heating circuit's heating function. That is, the electronic device can maintain its ambient temperature at a suitable operating temperature through its own heat generation, and the heating circuit can be shut down via the control module.

[0160] In practical applications, the ambient temperature may change. If the ambient temperature rises, the self-generated heat from the electronic device after startup will still exceed the maximum heat output of the heating circuit, and the external heating circuit will not need to be activated. If the ambient temperature drops, causing the self-generated heat from the electronic device to be less than the maximum heat output of the heating circuit, the control module can control at least part of the heating circuit to activate based on the specific temperature drop. This ensures that the total heat generated by the electronic device's own load and the heat supplied by the heating circuit can maintain the temperature of the electronic device at a suitable operating temperature.

[0161] In one scenario, if WA1*A ≤ WB*B ≤ WA2*A, meaning the self-generated heat of the electronic device after startup is less than the maximum heat generated by the heating circuit, the heat generated by the electronic device's own load cannot replace the total heat generated by the heating circuit. To ensure the electronic device operates at a suitable temperature, the control module needs to continuously heat at least a portion of the heating circuit based on the heat generated by the electronic device's own load to compensate for the insufficient heat generated by the electronic device's own load, ensuring that the total heat generated by the electronic device's own load and the heating circuit can maintain the electronic device at a suitable operating temperature.

[0162] Specifically, the control module controls a portion of the heating circuit to perform heating, where the sum of the heat generated by the electronic device's own load at time Y (WAY*A) and the heat generated by the portion of the heating circuit performing heating at time Y (WBY*B) must be sufficient to raise the current external ambient temperature to a reference ambient temperature (e.g., -15℃).

[0163] Furthermore, if the ambient temperature subsequently rises, some heating circuits are shut down to reduce the heat output of the external heating circuits based on the temperature difference. If the ambient temperature subsequently drops, some heating circuits are turned on to increase the heat output of the external heating circuits based on the temperature difference. This ensures that when the ambient temperature changes, the sum of the equipment's self-generated heat and the heat output of the external heating circuits keeps the equipment at a suitable operating temperature, thus controlling the electronic equipment to maintain a stable and suitable operating temperature even when the ambient temperature changes.

[0164] The solution provided in this application enables temperature control for products such as CPEs and small base stations located in low-temperature environments, ensuring normal operation of electronic equipment in extremely cold winter conditions. This solution effectively monitors the temperature of the electronic equipment and its own heat generation through a temperature comparison module and a load comparison module. By rationally controlling the operating state of the heating circuit through a control module, energy consumption is reduced while ensuring the electronic equipment operates at a suitable temperature, achieving energy conservation and environmental protection. Specifically, before the electronic equipment starts up, the heating circuit is controlled by the control module based on the temperature difference signal from the external ambient temperature, ensuring the electronic equipment starts up at a suitable operating temperature. After the equipment starts up, the operating state of the heating circuit can be adjusted according to the heat generated by the electronic equipment load, fully utilizing the load's own heat generation. In practical applications, the control module can flexibly control the operating state of the heating circuit in real time based on changes in environmental factors, load, and other aspects, thereby ensuring the rationality of heating and achieving cyclic dynamic temperature self-adjustment.

[0165] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0166] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0167] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0168] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0169] In a typical configuration, a computing device includes one or more processors (CPUs), an input / output interface, a network interface, and memory.

[0170] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, like read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0171] Computer-readable media include both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0172] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0173] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0174] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A temperature control device applied to an electronic device, characterized by, The device comprises: a heating circuit; a temperature comparison module, which obtains a temperature difference between an ambient temperature of an electronic device and a reference ambient temperature; a load comparison module, which obtains a power consumption difference between a load power consumption of the electronic device and a reference load power consumption; a control module, which is connected with the temperature comparison module, the load comparison module and the heating circuit, and controls an operating state of the heating circuit according to a temperature difference signal output by the temperature comparison module and a power consumption difference signal output by the load comparison module.

2. The device of claim 1, wherein the control module controls the heating circuit to perform heating when at least one of the temperature difference signal and the power consumption difference signal triggers a preset heating condition, wherein the preset heating condition comprises that the ambient temperature is lower than the reference ambient temperature and the load power consumption is lower than the reference load power consumption.

3. The apparatus of claim 2, wherein, the heating circuit comprises a plurality of heating resistors, the temperature difference signal comprises a temperature difference value, and the power consumption difference signal comprises a power consumption difference value; the control module determines a target thermal energy corresponding to a difference value of a target signal triggering the preset heating condition and controls at least one target heating resistor to be turned on when at least one of the temperature difference signal and the power consumption difference signal triggers the preset heating condition, wherein the at least one target heating resistor generates a total thermal energy greater than or equal to the target thermal energy in the turned-on state.

4. The device of any one of claims 1-3, wherein the temperature comparison module comprises an internal temperature acquisition module and a temperature comparator; the internal temperature acquisition module acquires an internal ambient temperature of the electronic device; the temperature comparator compares the internal ambient temperature with a reference ambient temperature and outputs a temperature difference signal representing a comparison result.

5. The device of any one of claims 1 to 3, wherein, the temperature comparison module is connected with the load comparison module, and the temperature comparison module comprises an external temperature acquisition module; the external temperature acquisition module acquires an external ambient temperature of the electronic device; the temperature comparison module controls the load comparison module to be powered on when the external ambient temperature is lower than the reference ambient temperature, and controls the load comparison module to be powered off when the external ambient temperature is higher than or equal to the reference ambient temperature.

6. The device of any one of claims 1 to 3, wherein, the load comparison module comprises a load acquisition module and a load comparator; the load acquisition module acquires a load power consumption of the electronic device; the load comparator compares the load power consumption output by the load acquisition module with the reference load power consumption and outputs a power consumption difference signal representing a comparison result of the load power consumption.

7. The apparatus of claim 6, wherein, the reference load power consumption comprises a reference load voltage, and the load acquisition module comprises a precision resistor; the precision resistor is connected between a power supply end and a load circuit of the electronic device; the load comparator compares a voltage difference across the precision resistor with the reference load voltage and outputs the power consumption difference signal.

8. The apparatus of claim 7, wherein, the load acquisition module comprises: a first filter circuit connected between the precision resistor and the power supply end; A second filter circuit and an amplification circuit, two ends of the precision resistor are electrically connected with a negative input end of the load comparator through the second filter circuit and the amplification circuit; A reference voltage setting circuit electrically connected with a positive input end of the load comparator.

9. The device of any one of claims 1 to 3, wherein, The reference ambient temperature is a temperature within a rated working temperature range of the electronic device.

10. The device of any one of claims 1-3, wherein, The thermal energy generated by the electronic device under the reference load power consumption is greater than or equal to the thermal energy generated by the heating circuit in the working state.

11. The device of any one of claims 1 to 3, wherein, Further comprising: An active control chip connected with the heating circuit, which controls the working state of the heating circuit based on an active control instruction.

12. An electronic device, comprising: Comprise: The temperature control device according to any one of claims 1 to 11.

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