Quartz oscillation chip

Abstract

A quartz oscillation chip comprises a housing and a quartz oscillation sheet. The quartz oscillation sheet is arranged in the shell. The quartz oscillation sheet comprises a flat substrate, two electrodes and two conductive silver adhesives, wherein the two electrodes are respectively arranged on two opposite main surfaces of the flat substrate. The flat substrate is provided with at least one notch, and the notch is formed in the side face of the flat substrate and is recessed towards the interior of the flat substrate along the direction perpendicular to the side face. The height of the notch is the same as the thickness of the flat substrate, and the two conductive silver adhesives are connected with the flat substrate and the shell. The invention provides a quartz oscillation chip capable of improving vibration characteristics.

Description

Technical Field

[0001] This invention relates to a quartz oscillator chip. Background Technology

[0002] Due to physical limitations, the primary frequencies of current quartz oscillator chips, including quartz crystal oscillators (e.g., thickness shear vibration mode), are often accompanied by secondary frequencies such as bending vibration and surface shear vibration. These secondary frequencies being too close can easily couple with the primary vibration, resulting in poor chip vibration characteristics and undesirable modes. Modern chips strive for high frequencies and miniaturization; to avoid these problems, the tolerance range for chip size design is small, leading to lower chip production yields and hindering chip development. Summary of the Invention

[0003] This invention provides a quartz oscillator chip that can improve vibration characteristics.

[0004] According to an embodiment of the present invention, a quartz oscillator chip includes a housing and a quartz oscillator plate. The quartz oscillator plate is disposed within the housing. The quartz oscillator plate includes a flat substrate, two electrodes, and two conductive silver pastes. The two electrodes are respectively disposed on two opposite main surfaces of the flat substrate. The flat substrate has at least one notch located on a side surface of the flat substrate and recessed along a direction perpendicular to the side surface and toward the interior of the flat substrate. The height of the notch is the same as the thickness of the flat substrate. The two conductive silver pastes connect the flat substrate and the housing.

[0005] In the quartz oscillator chip according to an embodiment of the present invention, the ratio of the depth of at least one notch to the length of the side surface is less than or equal to 0.4.

[0006] In a quartz oscillator chip according to an embodiment of the present invention, at least one notch includes a pair of first notches, the pair of first notches being respectively disposed on opposite sides of a flat substrate.

[0007] In the quartz oscillator chip according to an embodiment of the present invention, at least one notch further includes a pair of second notches, which are respectively disposed on the two sides of the flat substrate. The pair of second notches and the pair of first notches are symmetrically disposed on the two sides of the chip center passing through the quartz oscillator and the center line perpendicular to the two sides.

[0008] In a quartz oscillator chip according to an embodiment of the present invention, the side surface includes two connected first side surfaces and two second side surfaces, each of the two first side surfaces being located between the two second side surfaces, and at least one notch includes a plurality of notches, the plurality of notches being symmetrically disposed on at least one of the two first side surfaces or the two second side surfaces with the first central axis of the flat substrate as the axis of symmetry.

[0009] In a quartz oscillator chip according to an embodiment of the present invention, the side surface includes two connected first side surfaces and two second side surfaces, each of the two first side surfaces being located between the two second side surfaces, and at least one notch includes a plurality of notches, the plurality of notches being symmetrically disposed on at least one or both of the two second side surfaces with the second central axis of the flat substrate as the axis of symmetry.

[0010] In a quartz oscillator chip according to an embodiment of the present invention, there is a gap between the chip center of the flat substrate and the geometric center of the electrode.

[0011] In a quartz oscillator chip according to an embodiment of the present invention, at least one notch includes two opposing sides and a bottom edge that connects the two sides to each other.

[0012] In a quartz oscillator chip according to an embodiment of the present invention, at least one of the two sides is connected to the bottom edge with a rounded corner.

[0013] In the quartz oscillator chip according to an embodiment of the present invention, the electrodes are square, and each side of the square is spaced apart from each side of the corresponding flat substrate.

[0014] In a quartz oscillator chip according to an embodiment of the present invention, the length of at least one notch is less than the length of the side of the square.

[0015] In a quartz oscillator chip according to an embodiment of the present invention, the electrode includes a side edge corresponding to the side surface of a flat substrate, and at least one notch is located at least partially on the side edge of the orthogonal projection of the electrode.

[0016] In a quartz oscillator chip according to an embodiment of the present invention, the housing includes a first housing and a second housing, the first housing being connected to the second housing to form an accommodating space, and the quartz oscillator chip being located within the accommodating space.

[0017] In a quartz oscillator chip according to an embodiment of the present invention, at least one notch penetrates through a flat substrate in the thickness direction.

[0018] In a quartz oscillator chip according to an embodiment of the present invention, the first central axis and the second central axis of the flat substrate intersect at the chip center of the flat substrate, and the thickness direction is perpendicular to the extension direction of the first central axis and the extension direction of the second central axis.

[0019] In a quartz oscillator chip according to an embodiment of the present invention, at least one notch corresponds to at least one long side of a flat substrate.

[0020] In a quartz oscillator chip according to an embodiment of the present invention, at least one notch corresponds to at least one short side of a flat substrate.

[0021] Based on the above, the quartz oscillator chip of the present invention includes a flat substrate, electrodes disposed on the flat substrate, and a recess recessed from the side of the flat substrate. The recess can improve the vibration characteristics of the quartz oscillator chip, thereby increasing the production yield of the quartz oscillator chip and facilitating its development. Attached Figure Description

[0022] Figure 1A This is an exploded view of a quartz oscillator chip according to an embodiment of the present invention;

[0023] Figure 1B yes Figure 1A A schematic diagram of a quartz oscillator plate from another perspective;

[0024] Figure 2 yes Figure 1A Top view of a quartz oscillator;

[0025] Figure 3 This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0026] Figure 4 This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0027] Figure 5 This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0028] Figure 6A This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0029] Figure 6B This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0030] Figure 6C This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0031] Figure 7 This is a top view of a quartz oscillator plate according to another embodiment of the present invention;

[0032] Figure 8 This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Detailed Implementation

[0033] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0034] Figure 1A This is an exploded view of a quartz oscillator chip according to an embodiment of the present invention. Figure 1B yes Figure 1A A schematic diagram of a quartz oscillator plate from another perspective. Figure 2 yes Figure 1A The top view of the quartz oscillator. Please also refer to... Figures 1A to 2 The quartz oscillator chip 100 includes a housing 110 and a quartz oscillator plate 120. The quartz oscillator plate 120 is disposed within the housing 110 and includes a flat substrate 121, two electrodes 122 and 126, and two conductive silver pastes 130. The two electrodes 122 and 126 are respectively disposed on two opposing main surfaces of the flat substrate 121, namely the upper surface 127 and the lower surface 128. The flat substrate 121 has at least one notch 124. The notch 124 is located on the side surface 123 of the flat substrate 121 and is recessed along a direction perpendicular to the side surface 123 and toward the interior of the flat substrate 121. The height B1 of the notch 124 is the same as the thickness B2 of the flat substrate 121. The two conductive silver pastes 130 connect the flat substrate 121 and the housing 110.

[0035] The notch 124 can be formed through an etching process, but is not limited to this. By providing the notch 124 on the side surface 123 of the flat substrate 121, the quartz oscillator chip 100 can effectively suppress the secondary waves (e.g., bending vibration, planar shear vibration) of the quartz oscillator chip 100 without affecting the main wave (e.g., thickness shear vibration mode) of the quartz oscillator chip 100. In this way, the quartz oscillator chip 100 can tolerate larger manufacturing errors, thereby improving the production yield of the quartz oscillator chip 100 and enabling more efficient development.

[0036] like Figure 1A As shown, the housing 110 includes a first housing 111 and a second housing 112. The first housing 111 is connected to the second housing 112 to form an accommodating space P, and the quartz oscillator chip 120 is located within the accommodating space P. The quartz oscillator chip 100 in this embodiment is rectangular, but is not limited thereto.

[0037] like Figure 1B and Figure 2 As shown, the side surface 123 of the flat substrate 121 is connected between two main surfaces (upper surface 127 and lower surface 128), and includes two connected first side surfaces 1231 and two second side surfaces 1232. The flat substrate 121 in this embodiment is rectangular, but not limited thereto. The first side surface 1231 is located between the two second side surfaces 1232. The length W1 of the first side surface 1231 is greater than the length W5 of the second side surface 1232. The first side surface 1231 is the longer side S1, and the second side surface 1232 is the shorter side S2.

[0038] The shapes of the two electrodes 122 and 126 can be different, but are not limited to them. Electrode 122 is the first electrode, and electrode 126 is the second electrode. Electrode 122 includes a side 125, which corresponds to the side 123 of the flat substrate 121. The side 125 includes two first side 1251 and two second side 1252, with the two first side 1251 connected between the two second side 1252. The first side 1251 corresponds to the first side 1231 (long side S1), and the second side 1252 corresponds to the second side 1232 (short side S2). The length W2 of the first side 1251 of electrode 122 is greater than the length W4 of the second side 1252. Electrode 122 is square, but is not limited to it. Each side (first side 1251 and second side 1252) of the square electrode 122 is spaced apart from the corresponding side 123 (first side 1231 and second side 1232) of the flat substrate 121. The length W3 of the notch 124 is less than the lengths W2 and W4 of each side of the square electrode 122.

[0039] The flat substrate 121 also includes a chip center C1 and a central axis. The chip center C1 is the geometric center of the flat substrate 121. The central axis passes through the chip center C1 and is perpendicular to the side surface 123 of the flat substrate 121. The central axis includes a first central axis L1 and a second central axis L2. The first central axis L1 is different from the second central axis L2. Specifically, the first central axis L1 is perpendicular to the second central axis L2 and intersects the second central axis L2 at the chip center C1. The first central axis L1 is perpendicular to the two first side surfaces 1231, and the second central axis L2 is perpendicular to the two second side surfaces 1232. In this embodiment, there is a distance G between the chip center C1 of the flat substrate 121 and the geometric center C2 of the electrode 122. That is, the electrode 122 is biased onto the flat substrate 121. The geometric center C2 of the electrode 122 is located on the second central axis L2, but is not limited thereto.

[0040] like Figure 1A and Figure 2As shown, the number of notches 124 in this embodiment is one, but it is not limited to this. The notch 124 is recessed from the first side surface 1231 of the flat substrate 121 toward the electrode 122, corresponding to the first side surface 1251 of the electrode 122 and the long side surface S1 (first side surface 1231) of the flat substrate 121. The ratio of the depth H1 of the notch 124 recessed toward the electrode 122 to the length of the corresponding side surface 123 (here, the length W1 of the first side surface 1231) is less than or equal to 0.4. The length W3 of the notch 124 is less than or equal to the length of the corresponding side surface 125 (here, the length W2 of the first side surface 1251). There is a distance D1 between the bottom edge 1241 of the notch 124 and the corresponding side surface 125 (first side surface 1251) of the electrode 122. The orthographic projection of the notch 124 onto the electrode 122 is located on the corresponding side surface 125 (first side surface 1251), but it is not limited to this. The notch 124 penetrates the flat substrate 121 in the thickness direction A. The thickness direction A is perpendicular to the extension direction of the central axis (first central axis L1 and second central axis L2).

[0041] Figure 3 This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 2 and Figure 3 The quartz oscillator 120a in this embodiment is similar to that in the above embodiment, except that the notch of the quartz oscillator 120a in this embodiment includes a pair of first notches 124a and 124a'. These first notches 124a and 124a' are symmetrically disposed on opposite sides 123 (second side 1232) of the flat substrate 121 about the first central axis L1 of the flat substrate 121, corresponding to the short side S2 of the flat substrate 121. The orthogonal projection of the first notches 124a and 124a' onto the electrode 122 is located on the corresponding second side 1252 (side 125). The distance D2 between the first notch 124a and the corresponding second side 1252 is less than or equal to the distance D3 between the first notch 124a' and the corresponding second side 1252. The conductive silver paste 130 is disposed at a position corresponding to the first notch 124a', but is not limited thereto. The quartz oscillator 120a in this embodiment has similar effects to those in the above embodiments, and will not be described again here.

[0042] Figure 4 This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 4The quartz oscillator 120b in this embodiment is similar to that in the above embodiment, except that the quartz oscillator 120b in this embodiment further includes a pair of second notches 124b and 124b'. These second notches 124b and 124b' are respectively disposed on both sides 123 (second side 1232) of the flat substrate 121. The second notches 124b and 124b' are symmetrically disposed on both sides of the central axis (second central axis L2) with respect to the first notches 124a and 124a'. Here, the first notches 124a and 124a' and the second notches 124b and 124b' can be considered as being symmetrically disposed on the two second side 1232 of the flat substrate 121 with respect to the first central axis L1 and the second central axis L2, respectively, corresponding to the two second side 1252 of the electrode 122. One conductive silver paste 130 corresponds to the first notch 124a', and another conductive silver paste 130 corresponds to the second notch 124b', but is not limited thereto. The quartz oscillator 120b of this embodiment has similar effects to the above embodiments, and will not be described again here.

[0043] Figure 5 This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 5 The quartz oscillator 120c of this embodiment is similar to that of the above embodiment, except that the two notches 124 of the quartz oscillator 120c of this embodiment are symmetrically arranged on one side 123 (second side 1232) of the flat substrate 121 with the second central axis L2 as the axis of symmetry. The two conductive silver pastes 130 correspond to the two notches 124, but are not limited thereto. The quartz oscillator 120c of this embodiment has similar effects to those of the above embodiment, and will not be described again here.

[0044] Figure 6A This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 6A The quartz oscillator 120d in this embodiment is similar to that in the above embodiment, except that a pair of first notches 124d in this embodiment are symmetrically disposed on two sides 123 (first side 1231) of the flat substrate 121 with the second central axis L2 as the axis of symmetry, corresponding to the two first side edges 1251 of the electrode 122. The quartz oscillator 120d in this embodiment has similar effects to those in the above embodiment, and will not be described again here.

[0045] In an embodiment not shown, the quartz oscillator 120d may include a pair of second notches, which may be symmetrically disposed on the two first side surfaces 1231 of the flat substrate 121 with the second central axis L2 as the axis of symmetry, and located next to the first notch 124d.

[0046] Figure 6B This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 6B The quartz oscillator 120d' in this embodiment is similar to that in the above embodiment, except that the notches 124 of the quartz oscillator 120d' in this embodiment are symmetrically arranged on one side 123 (first side 1231) of the flat substrate 121 with the first central axis L1 as the axis of symmetry. The orthographic projections of the two notches 124 onto the electrodes 122 are located on the corresponding side 125 (first side 1251). The quartz oscillator 120d' in this embodiment has similar effects to those in the above embodiment, and will not be described again here.

[0047] Figure 6C This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 6C The quartz oscillator 120d in this embodiment is similar to the above embodiment, except that the quartz oscillator 120d in this embodiment includes six notches 124. The six notches 124 are symmetrically arranged on three sides 123 (two first sides 1231 and one second side 1232) of the flat substrate 121 with the first central axis L1 and the second central axis L2 as the axes of symmetry. The quartz oscillator 120d in this embodiment has similar effects to the above embodiment, and will not be described again here.

[0048] When producing conventional quartz oscillators without notches, the permissible error value for the first side of the flat substrate is ±2 micrometers, and the permissible error value for the second side is ±2 micrometers. Of every 16 conventional quartz oscillator chips produced, only 6 can effectively eliminate side waves and achieve an equivalent series resistance (ESR) of less than 30 ohms. In this embodiment, by providing the notch 124, when producing the quartz oscillator 120d", the permissible error value for the first side 1231 of the flat substrate 121 can be ±4 micrometers, and the permissible error value for the second side 1232 can be ±4 micrometers. Quartz oscillator chips with the quartz oscillator 120d” can all effectively eliminate side waves and achieve an equivalent series resistance of less than 30 ohms.

[0049] Figure 7 This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 3 and Figure 7The quartz oscillator 120e of this embodiment is similar to that of the above embodiment, except that the quartz oscillator 120e of this embodiment includes eight notches 124. The eight notches 124 are symmetrically arranged on the four sides 123 (two first sides 1231 and two second sides 1232) of the flat substrate 121 about the first central axis L1 and the second central axis L2 of the flat substrate 121. The electrode 122e is polygonal. The electrode 122e extends to the first side 1231 and the second side 1232 of the flat substrate 121. The notches 124 are offset from the conductive silver paste 130. The quartz oscillator 120e of this embodiment has similar effects to that of the above embodiment, and will not be described again here.

[0050] Figure 8 This is a top view of a quartz oscillator plate according to another embodiment of the present invention. Please also refer to... Figure 6C and Figure 8 The quartz oscillator 120f in this embodiment is similar to that in the above embodiment, except that the notches 124f and 124f' of the quartz oscillator 120f in this embodiment include rounded corners R1 and R2. The rounded corners R1 and R2 are provided at the corners of the notches 124f and 124f', which can effectively reduce the stress concentration phenomenon at the corners and improve the structural strength of the quartz oscillator 120f.

[0051] Taking notch 124f as an example, notch 124f includes two opposing sides 1242 and a bottom edge 1241. The two ends of the bottom edge 1241 (i.e., the corners of notch 124f) are respectively connected to the two sides 1242. The two sides 1242 and the bottom edge 1241 of notch 124f are connected by rounded corners R1, and the notch includes two rounded corners R1. In an embodiment not shown, one side edge 1242 is connected to the bottom edge 1241 by a rounded corner R1, and the notch may include only one rounded corner R1.

[0052] The four notches 124f located on the first side 1231 are symmetrically arranged about the first central axis L1 and the second central axis L2. The two notches 124f' located on the second side 1232 are symmetrically arranged about the second central axis L2. The fillets R1 and R2 of the notches 124f and 124f' with different central axes of symmetry may have different R values, and the depths H2 and H3 of the notches 124f and 124f' may also be different. Specifically, the fillet R1 of the notch 124f has a greater R value than the fillet R2 of the notch 124f', and the depth H2 of the notch 124f is greater than the depth H3 of the notch 124f'. The quartz oscillator 120f of this embodiment has similar effects to the above embodiment, and will not be described again here.

[0053] The number and arrangement of the notches 124 in the quartz oscillators 120, 120a, 120b, 120c, 120d, 120d', 120d" and 120f can be changed according to the structure and application of the quartz oscillators, and are not limited to the above embodiments.

[0054] In summary, the quartz oscillator chip of the present invention includes a flat substrate, electrodes disposed on the flat substrate, and a recess recessed from the side of the flat substrate. The recess can improve the vibration characteristics of the quartz oscillator chip, thereby increasing the production yield of the quartz oscillator chip and facilitating its development.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A quartz oscillation chip, characterized by, Including: a housing; and a quartz oscillation piece disposed in the housing, the quartz oscillation piece comprising a flat substrate, two electrodes and two conductive silver pastes, the two electrodes are respectively disposed on opposite two major surfaces of the flat substrate, the flat substrate has at least one notch, the at least one notch is disposed on a side surface of the flat substrate and recessed in a direction perpendicular to the side surface and towards the inside of the flat substrate, the height of the at least one notch is the same as the thickness of the flat substrate, and the two conductive silver pastes connect the flat substrate and the housing. The ratio of the depth of each of the at least one notch to the length of the side surface is less than or equal to 0.

4.

2. The quartz oscillation chip according to claim 1, characterized by The at least one notch comprises a pair of first notches, which are respectively disposed on opposite two side surfaces of the flat substrate.

3. The quartz oscillation chip according to claim 1, characterized by The at least one notch further comprises a pair of second notches, which are respectively disposed on the two side surfaces of the flat substrate, and the pair of second notches are symmetrically disposed on two sides of a center line perpendicular to the two side surfaces and passing through the chip center of the quartz oscillation piece.

4. The quartz oscillation chip according to claim 3, characterized by The side surface comprises two first side surfaces and two second side surfaces connected to each other, each of the two first side surfaces is located between the two second side surfaces, and the at least one notch comprises a plurality of notches symmetrically disposed on at least one of the two first side surfaces or the two second side surfaces with a first central axis of the flat substrate as a symmetric axis.

5. The quartz oscillation chip according to claim 1, wherein The side surface comprises two first side surfaces and two second side surfaces connected to each other, each of the two first side surfaces is located between the two second side surfaces, and the at least one notch comprises a plurality of notches symmetrically disposed on at least one of the two second side surfaces or the two second side surfaces with a second central axis of the flat substrate as a symmetric axis.

6. The quartz oscillation chip according to claim 1, wherein The chip center of the flat substrate and the geometric center of the electrode have a spacing.

7. The quartz oscillation chip according to claim 1, wherein The at least one notch comprises two side edges opposite to each other and a bottom edge connecting the two side edges.

8. The quartz oscillation chip according to claim 1, wherein At least one of the two side edges is connected to the bottom edge with a rounded corner.

9. The quartz oscillation chip according to claim 8, characterized by The electrode is in a quadrilateral shape, and each side of the quadrilateral is spaced apart from each side surface of the flat substrate by a distance.

10. The quartz oscillation chip according to claim 1, characterized by The length of the at least one notch is less than the length of the side of the quadrilateral.

11. The quartz oscillation chip according to claim 10, characterized by The electrode comprises a side edge corresponding to the side surface of the flat substrate, and the orthographic projection of the at least one notch on the electrode is at least partially located on the side edge.

12. The quartz oscillation chip according to claim 1, characterized by The housing comprises a first housing and a second housing, the first housing is connected to the second housing to form a containing space, and the quartz oscillation piece is located in the containing space.

13. The quartz oscillation chip according to claim 1, characterized by The at least one notch penetrates the flat substrate in a thickness direction.

14. The quartz oscillation chip according to claim 1, characterized by The first central axis and the second central axis of the flat substrate intersect at the chip center of the flat substrate, the thickness direction is perpendicular to the extension direction of the first central axis, and is also perpendicular to the extension direction of the second central axis.

15. The quartz oscillation chip according to claim 1, characterized by The at least one notch corresponds to at least one long side of the flat substrate.

16. The quartz oscillation chip according to claim 1, characterized by The at least one notch corresponds to at least one short side of the flat substrate.

17. The quartz oscillation chip according to claim 1, characterized by ​

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