Processing device of crystal resonator

Abstract

The invention relates to the technical field of resonator processing, and discloses a crystal resonator processing device which comprises a lower injection plate, a crystal fixing plate is arranged above the lower injection plate, an upper injection plate is arranged above the crystal fixing plate, and effective position mechanisms are arranged on the left side and the right side of the lower injection plate and the left side and the right side of the upper injection plate. The positioning mechanism comprises a heating bin plate, a material injection port is fixedly connected to the side, away from the lower injection plate or the upper injection plate, of the heating bin plate, a fixing frame is arranged on the outer side of the material injection port, a mounting plate is slidably connected to the surface of the fixing frame, and the left side and the right side of the upper injection plate are each fixedly connected with two downward pressing folded plates. And a sliding rod fixing plate is fixedly connected to the side, away from the crystal fixing plate, of the downward pressing folded plate, a clamping rod is slidably connected to the surface of the sliding rod fixing plate, and a nail cap is fixedly connected to the position, away from the tail end, of the clamping rod. And electrode deviation caused by manual adjustment is avoided.

Description

Technical Field

[0001] This invention relates to the field of resonator processing technology, specifically to a crystal resonator processing apparatus. Background Technology

[0002] Crystal resonators are widely used in electronic devices such as clocks, frequency synthesizers, and filters. Their processing equipment mainly includes multiple precision devices to ensure the high precision and stability of crystal resonators. During processing, metal or other materials are coated using a casting method. Stable processing equipment and steps work together closely to ensure that crystal resonators meet high standards in terms of frequency accuracy, stability, and reliability.

[0003] Patent CN210327520U discloses a quartz crystal resonator processing fixture, relating to the technical field of resonator manufacturing. The fixture includes a chassis, a rotating rod, and stop bars. The upper surface of the chassis has several rows of horizontally arranged storage slots. Two horizontally arranged mounting seats are fixedly connected to the upper surface of the chassis. The left and right ends of the rotating rod are rotatably connected to the mounting seats. One end of several stop bars is fixedly connected to the rotating rod, and the other end of each stop bar is fixedly connected to a limiting rod, with the stop bars perpendicular to both the rotating rod and the limiting rod. The stop bars are arranged in several rows of... Directly above the material trough; two hydraulic cylinders are fixedly connected to the lower surface of the chassis, and U-shaped brackets are fixedly connected to the output shafts of the hydraulic cylinders; the two ends of the limiting rod are placed inside the brackets, and the brackets are equipped with removable screws to limit the limiting rods from leaving the brackets; a storage battery is fixedly connected to the lower surface of the chassis, and the storage battery is electrically connected to the hydraulic cylinders. It has the advantages of convenient use, high transport stability, and low risk of collision. However, this patent also has the problem of electrode misalignment caused by mismatched molds. Therefore, a crystal resonator processing device is proposed to solve the above-mentioned problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a crystal resonator processing apparatus in view of the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a crystal resonator processing device, including a lower plate, a crystal fixing plate disposed above the lower plate, an upper plate disposed above the crystal fixing plate, and effective positioning mechanisms disposed on the left and right sides of the lower plate and the upper plate. The positioning mechanism includes a heating chamber plate. A material injection port is fixedly connected to the side of the heating chamber plate away from the lower or upper injection plate. A fixing frame is provided on the outer side of the material injection port. An mounting plate is slidably connected to the surface of the fixing frame. Two downward pressing folding plates are fixedly connected to both sides of the upper injection plate. A sliding rod fixing plate is fixedly connected to the side of the downward pressing folding plate away from the crystal fixing plate. A locking rod is slidably connected to the surface of the sliding rod fixing plate. A nail head is fixedly connected to the end of the locking rod. Inclined support plates are provided on both sides of the crystal fixing plate. Limiting grooves are formed on the surface of the inclined support plates. Coordinate blocks are fixedly connected to the four corners of the crystal fixing plate. Laser transceiver modules are installed at the four corners of the lower or upper injection plate. Branch injection grooves are formed on the surface of the lower or upper injection plate.

[0006] The side of the crystal plate is provided with a coating positioning mechanism, and the interior of both the lower and upper injection plates is provided with a sprue cutting mechanism.

[0007] According to the above technical solution, the heating chamber plate is fixedly connected to the side of the lower and upper injection plates away from the crystal fixing plate. The sides of both the lower and upper injection plates away from the crystal fixing plate are fixedly connected to a fixing frame. The lower and upper injection plates have the same structure. A telescopic spring is provided on the outer side of the locking rod, and both ends of the telescopic spring are fixedly connected to the sliding rod fixing plate and the nail head, respectively. The inclined support plate corresponds one-to-one with the lower pressure folding plate. The upper and lower sides of the coordinate block are reflective mirror surfaces. The branch injection groove extends from the upper or lower surface of the upper or lower injection plate through to the lower surface. Heating wires are built into the interior of both the lower and upper injection plates. When the heating chamber plate is installed on the upper or lower injection plate... When the mounting plate is pushed by the connecting cylinder, the mounting plate pushes the connected fixing frame and squeezes the return spring between the mounting plate and the fixing frame, causing the lower and upper infusion plates to approach the upper and lower sides of the crystal fixing plate at the same time. As the lower and upper infusion plates approach each other, they will drive the lower pressure folding plate to move. The lower pressure folding plates, which move in opposite directions at the upper and lower ends, squeeze the inclined surface of the inclined support plate, causing the inclined support plate to move away from the crystal fixing plate. During the movement of the inclined support plate, the clamping rod slides upward along the sliding rod fixing plate and stretches the telescopic spring through the connected nail head until the clamping rod is aligned with the limiting groove on the inclined support plate. Under the action of the elastic spring, the clamping rod is reset downward and inserted into the limiting groove.

[0008] According to the above technical solution, the coating positioning mechanism includes two fixed plate end shells, which are slidably connected to the left and right sides of the crystal fixed plate. The surface of the crystal fixed plate is provided with an array of wafer slots. A fixed arc block is fixedly connected to the bottom surface of the inner wall of each wafer slot. A fixed crystal arc plate and a misaligned arc plate are slidably connected to the top edge of the wafer slot. A sliding slot is provided around each fixed crystal arc plate and misaligned arc plate. Electrode slots are provided on both the upper and lower sides of the crystal fixed plate. An arc plate connecting rod is fixedly connected to the side of the misaligned arc plate.

[0009] According to the above technical solution, a spring groove is provided inside the end shell of the fixed plate, and waist grooves are provided on the left and right surfaces near the edges of the crystal fixed plate. A short groove rod is slidably connected to the inner side of each waist groove. A sliding rod groove is provided around each wafer slot of the crystal fixed plate. A connecting rod is slidably connected to the inner side of the sliding rod groove. A crossbar is fixedly connected to the end of the connecting rod away from the wafer slot, and a long rod is fixedly connected to the end of the crossbar.

[0010] According to the above technical solution, the electrode groove is connected to the wafer groove, the sliding groove is opened on the upper surface of the crystal plate, the inner side of the spring groove is provided with a spring plate, and the two ends of the spring plate are fixedly connected to the inner wall of the spring groove and the crystal plate respectively, and the short groove rod is fixedly connected to the end shell of the plate.

[0011] According to the above technical solution, the long rod is fixedly connected to the right side fixed plate end shell, the arc plate connecting rod is fixedly connected to the left side fixed plate end shell, the arc plate connecting rod is slidably connected to the crystal fixed plate, the long rod is slidably connected to the crystal fixed plate, each connecting rod is fixedly connected to the corresponding fixed crystal arc plate, and the fixed crystal arc plate is slidably connected to the crystal fixed plate. During material injection, the heating chamber plate is continuously heated by the built-in heating tube, so that the molten metal entering the heating chamber plate through the injection port will not cool down. Through the continuous injection of material in the heating chamber plate, the heating chamber plate enters the side of the wafer slot opened on the crystal fixed plate through the branch injection groove on the upper or lower injection plate, and allows the metal injected into the wafer slot by the branch injection groove to adhere to the side of the plate-shaped quartz crystal. After the metal coating on both sides of the wafer slot, it will form electrode wires along the connected electrode slots, thereby enabling rapid batch processing. This invention enables the coating and electrode welding processes of quartz crystals, improving the processing efficiency of crystal resonators. When the lower and upper injection plates approach the crystal mounting plate, the lower pressure plate approaches the inclined support plate connected to the end shell of the mounting plate. This causes the inclined support plate to slide the end shell of the mounting plate through the short groove rod and the waist groove opened on the crystal mounting plate, pulling the spring sheet inside the spring groove to be stretched. At this time, the left and right end shells of the mounting plates will respectively drive the arc plate connecting rod and the long rod to slide. When the arc plate connecting rod slides, it will drive the connected misaligned arc plate to slide along the sliding groove, so that the misaligned arc plate no longer blocks the crystal slot. At the same time, the long rod slides, which will drive the connected cross rod and connecting folding rod to slide along the sliding rod groove. The sliding of the connecting folding rod will drive the fixed crystal arc plate connected to the other side of the crystal mounting plate to slide along the sliding groove, so that the fixed crystal arc plate no longer blocks the crystal slot. This can significantly reduce the manual alignment time.

[0012] According to the above technical solution, the water inlet cutting mechanism includes a wire groove, effective positioning holes are opened at the four corners of the lower or upper inlet plate, a cutting groove is opened inside the lower or upper inlet plate, a cutting piece is slidably connected to the inner side of the cutting groove, a push rod is fixedly connected to the side of the cutting piece, a connecting rod push bar is fixedly connected to the end of the push rod, and a side groove folding plate is slidably connected to the outer side of the connecting rod push bar.

[0013] According to the above technical solution, the wire guide groove is opened on the side of the lower or upper infusion plate near the crystal fixing plate. The wire guide groove is connected to the branch infusion groove. A sliding groove is provided in the middle of the connecting rod push bar, and a thin rod is fixedly connected to the edge of the sliding groove. A zigzag groove is opened on the side of the side groove folding plate, and the zigzag groove is slidably connected to the thin rod of the connecting rod push bar. When the crystal fixing plate moves between the lower and upper infusion plates, the laser light reflected by the laser transceiver module passes through the positioning hole and is projected onto the coordinate block. The light is then reflected by the coordinate block and received by the laser transceiver module. If the laser transceiver module can receive the light reflected by the coordinate block, it means that the crystal fixing plate has been aligned with the lower and upper infusion plates. When the mounting plates on the lower and upper infusion plates are pushed by the connecting cylinder, the mounting plates push the connected fixing plates. The mounting plate is fixed and the return spring between the mounting plate and the fixed frame is squeezed. At this time, the fixed frame and the mounting plate move relative to each other. The mounting plate slides along the fixed frame and moves closer to the crystal plate. The movement of the mounting plate drives the side groove folding plate to slide through the folded groove and the connecting rod push bar. At this time, the connecting rod push bar is squeezed by the inclined surface of the folded groove, which moves the connecting rod push bar away from the lower or upper injection plate and drives the connected push rod and the cutting blade to slide along the cutting groove. At this time, the electroplating material is injected into the side of the crystal through the branch injection groove. After the injection is completed, the cylinder retracts and drives the mounting plate to reset. At this time, the return spring resets and pushes the mounting plate and the fixed frame away from each other. The movement of the mounting plate drives the side groove folding plate to move through the inclined surface of the folded groove, which makes the connecting rod push bar move closer to the lower or upper injection plate and pushes the push rod to drive the cutting blade to block and cut the branch injection groove, making the wire groove more flat.

[0014] The present invention, by adopting the above technical solution, can bring the following beneficial effects: The crystal resonator processing device, through the effective positioning mechanism, uses a limiting groove and a locking rod to coordinate the lower and upper injection plates to calibrate their corresponding positions when they approach the crystal mounting plate. At the same time, the lower and upper injection plates are positioned on the crystal mounting plate by the locking rod and the inclined support plate. The mold engagement structure ensures that each crystal is aligned with the corresponding position of the lower and upper injection plates, avoiding electrode misalignment caused by manual adjustment. The cooperation of the upper and lower molds ensures that the electrode patterns on the front and back of the crystal are strictly symmetrical, reducing frequency deviation caused by asymmetry.

[0015] The crystal resonator processing device is equipped with a coating positioning mechanism to enable rapid clamping of batch crystals, adapting to the needs of automated production lines. The positioning structure can prevent coating offset, ensure that the electrode pattern is aligned with the crystal resonant area, and reduce frequency deviation caused by uneven coating. In addition, by locking the crystal in the structure, it serves as a reference point for laser adjustment in subsequent processing, guiding the etching solution to flow precisely to the target area, reducing repeated calibration time and improving batch etching efficiency.

[0016] The crystal resonator processing device is equipped with a gate cutting mechanism. The cutting blade can limit the coating material to cover only the target electrode area, preventing it from spreading to the edge of the non-coated area, reducing subsequent cleaning or trimming processes. At the same time, the gate cutting process facilitates subsequent removal, avoiding the wire pulling or nodules of traditional gates, and reducing the need for subsequent manual trimming or polishing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall frontal three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the overall bottom three-dimensional structure of the present invention; Figure 3 This is a schematic diagram of the structural distribution of the mechanism of the present invention; Figure 4 This is a schematic diagram of the effective position mechanism of the present invention; Figure 5 This is a schematic diagram of the top surface of the crystal fixing plate of the present invention; Figure 6 For the present invention Figure 5 A magnified structural diagram of A in the middle; Figure 7 This is a schematic diagram of the bottom surface of the crystal fixing plate of the present invention; Figure 8 For the present invention Figure 7 A magnified structural diagram of B in the diagram; Figure 9 This is a schematic diagram of the water inlet cutting mechanism of the present invention; Figure 10 For the present invention Figure 9 A magnified structural diagram of C.

[0018] In the diagram: 1. Lower inlet plate; 2. Crystal mounting plate; 3. Upper inlet plate; 4. Laser transceiver module; 5. Positioning mechanism; 51. Heating chamber plate; 52. Fixing frame; 53. Inlet port; 54. Mounting plate; 55. Lower pressure folding plate; 56. Slide rod mounting plate; 57. Positioning rod; 58. Nail head; 59. Inclined support plate; 510. Limiting groove; 511. Coordinate block; 512. Branch inlet groove; 6. Coating positioning mechanism; 61. Mounting plate end shell; 62. Wafer groove; 63. 64. Fixed arc block; 65. Fixed crystal arc plate; 66. Sliding plate groove; 67. Arc plate connecting rod; 68. Offset arc plate; 69. Electrode groove; 60. Spring groove; 610. Short groove rod; 611. Waist groove; 612. Long rod; 613. Cross rod; 614. Connecting folding rod; 615. Sliding rod groove; 71. Sprue cutting mechanism; 72. Wire groove; 73. Positioning hole; 74. Cutting groove; 75. Connecting rod push bar; 76. Cutting plate; 77. Push rod; 78. Side groove folding plate. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1-10 An embodiment of the present invention is as follows: a crystal resonator processing device includes a lower plate 1, a crystal fixing plate 2 is disposed above the lower plate 1, an upper plate 3 is disposed above the crystal fixing plate 2, and effective position mechanisms 5 are disposed on the left and right sides of the lower plate 1 and the upper plate 3. The positioning mechanism 5 includes a heating chamber plate 51. A material injection port 53 is fixedly connected to the side of the heating chamber plate 51 away from the lower injection plate 1 or the upper injection plate 3. A fixing frame 52 is provided on the outside of the material injection port 53. An installation plate 54 is slidably connected to the surface of the fixing frame 52. Two downward pressure folding plates 55 are fixedly connected to the left and right sides of the upper injection plate 3. A sliding rod fixing plate 56 is fixedly connected to the side of the downward pressure folding plate 55 away from the crystal fixing plate 2. A locking rod 57 is slidably connected to the surface of the sliding rod fixing plate 56. A nail head 58 is fixedly connected to the end of the locking rod 57. Inclined support plates 59 are provided on the left and right sides of the crystal fixing plate 2. Limiting grooves 510 are opened on the surface of the inclined support plates 59. Coordinate blocks 511 are fixedly connected to the four corners of the crystal fixing plate 2. Laser transceiver modules 4 are installed at the four corners of the lower injection plate 1 or the upper injection plate 3. Branch injection grooves 512 are opened on the surface of the lower injection plate 1 or the upper injection plate 3.

[0021] The side of the crystal plate 2 is provided with a coating positioning mechanism 6, and the inside of the lower plate 1 and the upper plate 3 are both provided with a sprue cutting mechanism 7.

[0022] The heating chamber plate 51 is fixedly connected to the side of the lower injection plate 1 and the upper injection plate 3 away from the crystal fixing plate 2. The sides of the lower injection plate 1 and the upper injection plate 3 away from the crystal fixing plate 2 are both fixedly connected to the fixing frame 52. The lower injection plate 1 and the upper injection plate 3 have the same structure. A telescopic spring is provided on the outside of the locking rod 57, and the two ends of the telescopic spring are fixedly connected to the sliding rod fixing plate 56 and the nail head 58 respectively. The inclined support plate 59 corresponds one-to-one with the position of the lower pressure folding plate 55. The upper and lower sides of the coordinate block 511 are both reflective mirror surfaces. The branch injection groove 512 extends from the upper surface of the upper injection plate 3 or the lower injection plate 1 through the lower surface. The lower injection plate 1 and the upper injection plate 3 both have built-in heating wires. When the mounting plate 54 on the lower injection plate 1 and the upper injection plate 3 is pushed by the connecting cylinder, the mounting plate 54 pushes the connected fixing frame 52 and squeezes the return spring between the mounting plate 54 and the fixing frame 52, so that the lower injection plate 1 and the upper injection plate 3 can move together. 3. Simultaneously approaching the upper and lower sides of the crystal plate 2, the lower betting plate 1 and the upper betting plate 3 move towards each other, causing the lower pressure plate 55 to move. The lower pressure plate 55, moving in opposite directions, presses the inclined surface of the inclined support plate 59, causing the inclined support plate 59 to move away from the crystal plate 2. During the movement of the inclined support plate 59, the locking rod 57 slides upward along the sliding rod plate 56 and stretches the telescopic spring through the connected nail head 58 until the locking rod 57 is aligned with the limiting groove 510 on the inclined support plate 59. Under the action of the elastic spring, the locking rod 57 is reset downward and inserted into the limiting groove 510. Through the cooperation of the limiting groove 510 and the locking rod 57, the lower betting plate 1 and the upper betting plate 3 can be aligned with the corresponding position when they approach the crystal plate 2. At the same time, the lower betting plate 1 and the upper betting plate 3 can be positioned on the crystal plate 2 by the locking rod 57 and the inclined support plate 59.

[0023] The coating positioning mechanism 6 includes two fixed plate end shells 61, which are slidably connected to the left and right sides of the crystal fixed plate 2. The surface of the crystal fixed plate 2 is provided with arrayed wafer grooves 62. The bottom surface of the inner wall of each wafer groove 62 is fixedly connected with a fixed arc block 63. The top edge of the wafer groove 62 is slidably connected with a fixed crystal arc plate 64 and a misaligned arc plate 67. Each fixed crystal arc plate 64 and misaligned arc plate 67 is surrounded by a sliding plate groove 65. Electrode grooves 68 are provided on the upper and lower sides of the crystal fixed plate 2. An arc plate connecting rod 66 is fixedly connected to the side of the misaligned arc plate 67.

[0024] The interior of the fixed plate end shell 61 is provided with a spring groove 69. The left and right surfaces of the crystal fixed plate 2 near the edge are provided with waist grooves 611. A short groove rod 610 is slidably connected to the inside of each waist groove 611. A sliding rod groove 615 is provided around each wafer groove 62 of the crystal fixed plate 2. A connecting rod 614 is slidably connected to the inside of the sliding rod groove 615. A crossbar 613 is fixedly connected to the end of the connecting rod 614 away from the wafer groove 62. A long rod 612 is fixedly connected to the end of the crossbar 613.

[0025] Electrode groove 68 is connected to wafer groove 62. Sliding groove 65 is opened on the upper surface of crystal plate 2. Spring plate is provided on the inner side of spring groove 69, and the two ends of spring plate are fixedly connected to the inner wall of spring groove 69 and crystal plate 2 respectively. Short groove rod 610 is fixedly connected to plate end shell 61.

[0026] The long rod 612 is fixedly connected to the right fixed plate end shell 61, the arc plate connecting rod 66 is fixedly connected to the left fixed plate end shell 61, the arc plate connecting rod 66 is slidably connected to the crystal fixed plate 2, the long rod 612 is slidably connected to the crystal fixed plate 2, each connecting rod 614 is fixedly connected to the corresponding fixed crystal arc plate 64, the fixed crystal arc plate 64 is slidably connected to the crystal fixed plate 2, during material injection, the heating chamber plate 51 is continuously heated by the built-in heating tube, so that the molten metal entering the heating chamber plate 51 through the injection port 53 will not cool down, and the heating chamber plate 51 is heated by the continuous injection of material into the heating chamber plate 51. The branch injection groove 512 on the upper injection plate 3 or the lower injection plate 1 enters the side of the wafer slot 62 opened on the crystal mounting plate 2, and allows the branch injection groove 512 to inject metal into the wafer slot 62 and attach it to the side of the sheet-like quartz crystal. After the metal coating on both sides of the wafer slot 62 is applied, it will form an electrode wire along the connected electrode slot 68, thereby quickly realizing the coating and electrode welding process of quartz crystals in batches and improving the processing efficiency of crystal resonators. When the lower injection plate 1 and the upper injection plate 3 approach each other on the crystal mounting plate 2, the lower pressure folding plate 55 approaches the inclined support plate 59 connected to the end shell 61 of the mounting plate, so that the inclined support plate 59 drives the fixed plate end shell 61 to slide through the short groove rod 610 and the waist groove 611 opened on the crystal fixed plate 2, which pulls the spring sheet inside the spring groove 69 to be stretched. At this time, the left and right fixed plate end shells 61 will drive the arc plate connecting rod 66 and the long rod 612 to slide respectively. When the arc plate connecting rod 66 slides, it will drive the connected misaligned arc plate 67 to slide along the sliding plate groove 65, so that the misaligned arc plate 67 no longer blocks the crystal slot 62. At the same time, the sliding of the long rod 612 will drive the connected cross rod 613 and the connecting folding rod 614 to slide along the sliding rod groove 615. The sliding of the connecting folding rod 614 will bring The fixed crystal arc plate 64 connected to the other side of the moving crystal plate 2 slides along the sliding groove 65, so that the fixed crystal arc plate 64 no longer blocks the wafer groove 62, which can greatly reduce the manual alignment time, realize the rapid clamping of batch crystals, adapt to the needs of automated production lines, and the positioning structure can avoid coating offset, ensure the alignment of the electrode pattern with the crystal resonant area, and reduce the frequency deviation caused by uneven coating. In addition, by locking the crystal by the structure, it can be used as a reference point for laser adjustment in subsequent processing, so as to guide the etching solution to flow precisely to the target area, reduce the repeated calibration time, and improve the batch etching efficiency.

[0027] The water inlet cutting mechanism 7 includes a wire groove 71, effective positioning holes 72 are opened at the four corners of the lower inlet plate 1 or the upper inlet plate 3, a cutting groove 73 is opened inside the lower inlet plate 1 or the upper inlet plate 3, a cutting piece 75 is slidably connected to the inner side of the cutting groove 73, a push rod 76 is fixedly connected to the side of the cutting piece 75, a connecting rod push bar 74 is fixedly connected to the end of the push rod 76, and a side groove folding plate 77 is slidably connected to the outer side of the connecting rod push bar 74.

[0028] The wire guide groove 71 is located on the side of the lower injection plate 1 or upper injection plate 3 near the crystal fixing plate 2. The wire guide groove 71 is connected to the branch injection groove 512. The connecting rod push bar 74 has a sliding groove in the middle, and a thin rod is fixedly connected to the edge of the sliding groove. The side groove folding plate 77 has a folded groove on its side, and the folded groove is slidably connected to the thin rod of the connecting rod push bar 74. When the crystal fixing plate 2 moves between the lower injection plate 1 and the upper injection plate 3, the laser light reflected by the laser transceiver module 4 passes through the position hole 72, and the emitted light is projected onto the coordinate block 511 and transmitted through the coordinate... The reflected light from block 511 is then received by laser transceiver module 4. If laser transceiver module 4 can receive the reflected light from coordinate block 511, it indicates that the crystal mounting plate 2 is aligned with the lower betting plate 1 and the upper betting plate 3. When the mounting plate 54 on the lower betting plate 1 and the upper betting plate 3 is pushed by the connecting cylinder, the mounting plate 54 pushes the connected fixing frame 52 and squeezes the return spring between the mounting plate 54 and the fixing frame 52. At this time, the fixing frame 52 and the mounting plate 54 move relative to each other, and the mounting plate 54 slides along the fixing frame 52 towards the crystal mounting plate 2. At this moment, the movement of the mounting plate 54 causes the side groove folding plate 77 to slide through the folded groove and the connecting rod push bar 74. At this time, the connecting rod push bar 74 is squeezed by the inclined surface of the folded groove, causing the connecting rod push bar 74 to move away from the lower injection plate 1 or the upper injection plate 3 and drive the connected push rod 76 and the cutting plate 75 to slide along the cutting groove 73. At this time, the electroplating material is injected into the side of the crystal through the branch injection groove 512. After the injection is completed, the cylinder retracts and drives the mounting plate 54 to reset. At this time, the reset spring resets and pushes the mounting plate 54 and the fixing frame 52 away from each other. The motion drives the side groove folding plate 77 to move the connecting rod push bar 74 close to the lower injection plate 1 or the upper injection plate 3 through the inclined surface of the folding groove, and pushes the push rod 76 to drive the cutting plate 75 to block and cut the branch injection groove 512, making the wire groove 71 more flat. The cutting plate 75 can limit the coating material to only cover the target area electrode area, preventing it from spreading to the edge of the non-coating area, reducing the need for subsequent cleaning or trimming processes. At the same time, the material is cut off by cutting the gate, which facilitates subsequent removal and avoids the traditional gate wire pulling or nodules, reducing the need for subsequent manual trimming or grinding.

[0029] Working principle: When the mounting plates 54 on the lower and upper injection plates 1 and 3 are pushed by the connecting cylinder, the mounting plates 54 push the connected fixing frame 52 and squeeze the return spring between the mounting plates 54 and the fixing frame 52, causing the lower injection plate 1 and the upper injection plate 3 to move closer to the upper and lower sides of the crystal fixing plate 2. As the lower injection plate 1 and the upper injection plate 3 move closer to each other, they will drive the lower pressure folding plate 55 to move. Through the two opposing lower pressure folding plates 55, the inclined surface of the inclined support plate 59 is squeezed, causing the inclined support plate 59 to move away from the crystal fixing plate 2. During the movement of the inclined support plate 59... The clamping rod 57 slides upward along the slide bar plate 56 and stretches the telescopic spring through the connected nail head 58 until the clamping rod 57 is aligned with the limiting groove 510 on the inclined support plate 59. Under the action of the elastic spring, the clamping rod 57 is reset downward and inserted into the limiting groove 510. Through the cooperation of the limiting groove 510 and the clamping rod 57, the lower betting plate 1 and the upper betting plate 3 can be aligned with the corresponding position when they are close to the crystal plate 2. At the same time, the lower betting plate 1 and the upper betting plate 3 can be positioned on the crystal plate 2 through the clamping rod 57 and the inclined support plate 59. During material injection, the heating chamber plate 51 is continuously heated by the built-in heating tube, ensuring that the molten metal entering the heating chamber plate 51 through the injection port 53 does not cool down. Material is continuously injected into the heating chamber plate 51, which then enters the side of the wafer slot 62 on the crystal plate 2 through the branch injection grooves 512 on the upper injection plate 3 or lower injection plate 1. The metal injected into the wafer slot 62 by the branch injection grooves 512 adheres to the side of the sheet-like quartz crystal. After metal coating on both sides of the wafer slot 62, electrode wires are formed along the connected electrode grooves 68, thereby rapidly achieving the coating and electrode welding process of quartz crystals in batches, improving the processing efficiency of crystal resonators. When the lower injection plate 1 and upper injection plate 3 approach the crystal plate 2, the lower pressure plate 55 approaches the inclined support plate 59 connected to the end shell 61 of the plate, causing the inclined support plate 59 to drive the end shell 61 of the plate to slide through the short groove rod 610 and the waist groove 611 on the crystal plate 2, stretching the spring sheet inside the spring groove 69. At this time, the left and right sides... The two side plate end shells 61 will drive the arc plate connecting rod 66 and the long rod 612 to slide respectively. When the arc plate connecting rod 66 slides, it will drive the connected misaligned arc plate 67 to slide along the sliding groove 65, so that the misaligned arc plate 67 no longer blocks the wafer groove 62. At the same time, the sliding of the long rod 612 will drive the connected cross rod 613 and the connecting folding rod 614 to slide along the sliding rod groove 615. The sliding of the connecting folding rod 614 will drive the fixed crystal arc plate 64 connected to the other side of the crystal plate 2 to slide along the sliding groove 65, so that the fixed crystal arc plate 64 no longer blocks the wafer groove 62. This can greatly reduce the manual alignment time, realize the rapid clamping of batch crystals, adapt to the needs of automated production lines, and the positioning structure can avoid coating offset, ensure the alignment of the electrode pattern with the crystal resonant area, and reduce the frequency deviation caused by uneven coating. In addition, by locking the crystal by the structure, it can be used as a reference point for laser adjustment in subsequent processing to guide the etching solution to flow precisely to the target area, reduce the repeated calibration time, and improve the batch etching efficiency. When the crystal plate 2 moves between the lower betting plate 1 and the upper betting plate 3, the laser light reflected by the laser transceiver module 4 passes through the positioning hole 72 and is projected onto the coordinate block 511. The light is then reflected by the coordinate block 511 and received by the laser transceiver module 4. If the laser transceiver module 4 can receive the light reflected by the coordinate block 511, it means that the crystal plate 2 is aligned with the lower betting plate 1 and the upper betting plate 3. When the mounting plate 54 on the lower betting plate 1 and the upper betting plate 3 is pushed by the connecting cylinder, the mounting plate 54 pushes the connected fixing frame 52 and squeezes the return spring between the mounting plate 54 and the fixing frame 52. At this time, the fixing frame 52 and the mounting plate 54 move relative to each other, and the mounting plate 54 slides along the fixing frame 52 towards the crystal plate 2. At this time, the movement of the mounting plate 54 drives the side groove folding plate 77 to slide through the folded groove and the connecting rod push bar 74. At this time, the connecting rod push bar 74 is squeezed by the inclined surface of the folded groove, allowing the connecting rod push bar 74 to slide. The push rod 74 moves away from the lower or upper injection plate 1 and drives the connected push rod 76 and the cutting blade 75 to slide along the cutting groove 73. At this time, the electroplating material is injected into the side of the crystal through the branch injection groove 512. After the injection is completed, the cylinder retracts and drives the mounting plate 54 to reset. At this time, the reset spring resets and pushes the mounting plate 54 away from the fixing frame 52. The movement of the mounting plate 54 drives the side groove folding plate 77 to move the connecting rod push rod 74 close to the lower or upper injection plate 3 through the folding groove slope and pushes the push rod 76 to drive the cutting blade 75 to block and cut the branch injection groove 512, making the wire groove 71 more flat. The cutting blade 75 can limit the coating material to only cover the target area electrode area and prevent it from spreading to the edge of the non-coating area, reducing the need for subsequent cleaning or trimming processes. At the same time, the material is cut off by cutting the gate, which facilitates subsequent removal and avoids the wire pulling or nodules of traditional gates, reducing the need for subsequent manual trimming or grinding.

[0030] This invention provides a fabrication apparatus for crystal resonators. Many methods and approaches exist for implementing this technical solution; the above description is merely a preferred embodiment of the invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this invention, and these improvements and modifications should also be considered within the scope of protection of this invention. All components not explicitly stated in this embodiment can be implemented using existing technologies.

Claims

1. A device for processing a crystal resonator comprising a lower plate (1), characterized in that: The upper side of the lower injection plate (1) is provided with a crystal fixing plate (2), the upper side of the crystal fixing plate (2) is provided with an upper injection plate (3), and the left and right sides of the lower injection plate (1) and the upper injection plate (3) are provided with effective position mechanisms (5). The effective position mechanism (5) comprises a heating bin plate (51), the side of the heating bin plate (51) away from the lower injection plate (1) or the upper injection plate (3) is fixedly connected with an injection port (53), the outer side of the injection port (53) is provided with a fixing frame (52), the surface of the fixing frame (52) is slidably connected with a mounting plate (54), the left and right sides of the upper injection plate (3) are fixedly connected with two downward folding plates (55), the side of the downward folding plate (55) away from the crystal fixing plate (2) is fixedly connected with a sliding rod fixing plate (56), the surface of the sliding rod fixing plate (56) is slidably connected with a clamping rod (57), the end of the clamping rod (57) away from the end is fixedly connected with a nail cap (58), the left and right sides of the crystal fixing plate (2) are provided with inclined supporting plates (59), the surface of the inclined supporting plate (59) is provided with a limiting groove (510), the four corners of the crystal fixing plate (2) are fixedly connected with coordinate blocks (511), the four corners of the lower injection plate (1) or the upper injection plate (3) are provided with laser transceiver modules (4), and the surfaces of the lower injection plate (1) or the upper injection plate (3) are provided with branch injection grooves (512).

2. The apparatus according to claim 1, wherein: The side of the crystal fixing plate (2) is provided with a film coating positioning mechanism (6), and the interiors of the lower injection plate (1) and the upper injection plate (3) are provided with water gap cutting mechanisms (7).

3. The apparatus according to claim 2, wherein: The heating bin plate (51) is fixedly connected to the side of the lower injection plate (1) and the upper injection plate (3) away from the crystal fixing plate (2), the side of the lower injection plate (1) and the upper injection plate (3) away from the crystal fixing plate (2) is fixedly connected with the fixing frame (52), the lower injection plate (1) is the same in structure as the upper injection plate (3), the outer side of the clamping rod (57) is provided with a telescopic spring, the two ends of the telescopic spring are fixedly connected with the sliding rod fixing plate (56) and the nail cap (58), the inclined supporting plate (59) corresponds to the position of the downward folding plate (55) one by one, the upper and lower sides of the coordinate block (511) are both reflective surfaces, the branch injection groove (512) penetrates from the upper surface to the lower surface of the upper injection plate (3) or the lower injection plate (1), and the interiors of the lower injection plate (1) and the upper injection plate (3) are both provided with heating wires.

4. The apparatus according to claim 3, wherein: The film coating positioning mechanism (6) comprises two fixed plate end shells (61), which are respectively connected to the left and right sides of the crystal fixed plate (2) in a sliding manner, the surface of the crystal fixed plate (2) is provided with a plurality of wafer grooves (62) arranged in an array, the inner wall bottom surface of each wafer groove (62) is fixedly connected with a fixed arc block (63), the top side edge of the wafer groove (62) is respectively connected with a fixed wafer arc piece (64) and a misaligned wafer arc piece (67), the periphery of each fixed wafer arc piece (64) and misaligned wafer arc piece (67) is provided with a sliding piece groove (65), the upper and lower sides of the crystal fixed plate (2) are provided with electrode grooves (68), and the side surface of the misaligned wafer arc piece (67) is fixedly connected with an arc piece connecting rod (66).

5. The apparatus according to claim 4, wherein: The inside of the fixed plate end shell (61) is provided with a spring groove (69), the surface of the left and right edges of the crystal fixed plate (2) is provided with a waist groove (611), the inner side of each waist groove (611) is connected with a short groove rod (610) in a sliding manner, the periphery of each wafer groove (62) of the crystal fixed plate (2) is provided with a sliding rod groove (615), the inner side of the sliding rod groove (615) is connected with a connecting folding rod (614) in a sliding manner, one end of the connecting folding rod (614) away from the wafer groove (62) is fixedly connected with a horizontal rod (613), and the tail end of the horizontal rod (613) is fixedly connected with a long rod (612).

6. The apparatus according to claim 5, wherein: The electrode groove (68) is communicated with the wafer groove (62), the sliding piece groove (65) is arranged on the upper surface of the crystal fixed plate (2), the inner side of the spring groove (69) is provided with a spring piece, and the two ends of the spring piece are fixedly connected with the inner wall of the spring groove (69) and the crystal fixed plate (2) respectively, and the short groove rod (610) is fixedly connected with the fixed plate end shell (61).

7. The apparatus according to claim 6, wherein: The long rod (612) is fixedly connected with the right fixed plate end shell (61), the arc piece connecting rod (66) is fixedly connected with the left fixed plate end shell (61), the arc piece connecting rod (66) is connected with the crystal fixed plate (2) in a sliding manner, the long rod (612) is connected with the crystal fixed plate (2) in a sliding manner, each connecting folding rod (614) is fixedly connected with the fixed wafer arc piece (64) at the corresponding position, and the fixed wafer arc piece (64) is connected with the crystal fixed plate (2) in a sliding manner.

8. The apparatus according to claim 7, wherein: The water gap cutting mechanism (7) comprises a wire groove (71), effective position holes (72) are arranged at the four corners of the lower pouring plate (1) or the upper pouring plate (3), a cutting groove (73) is arranged in the lower pouring plate (1) or the upper pouring plate (3), a cutting piece (75) is connected to the inner side of the cutting groove (73) in a sliding manner, a push rod (76) is fixedly connected to the side surface of the cutting piece (75), a connecting rod push strip (74) is fixedly connected to the tail end of the push rod (76), and a side groove folding plate (77) is connected to the outer side of the connecting rod push strip (74) in a sliding manner.

9. The apparatus according to claim 8, wherein: The wire groove (71) is arranged on the side of the lower injection plate (1) or the upper injection plate (3) close to the crystal fixing plate (2), the wire groove (71) is communicated with the branch injection groove (512), the middle part of the connecting rod push strip (74) is provided with a sliding groove, and the edge of the sliding groove is fixedly connected with a thin rod, the side groove folding plate (77) is provided with a folding line groove on the side, and the thin rod of the connecting rod push strip (74) is slidably connected with the folding line groove.

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