Circuit board and electronic equipment

Abstract

The invention provides a circuit board and electronic equipment, and the circuit board comprises a circuit board body which is provided with a containing groove formed in a first surface; the accommodating groove is used for accommodating a chip, and the groove bottom surface of the accommodating groove is opposite to the chip; the heat conduction piece is embedded in the circuit board body, at least part of the heat conduction piece is arranged opposite to the groove bottom face of the containing groove, and the end face of the heat conduction piece is exposed out of the first surface.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular to a circuit board and an electronic device. BACKGROUND

[0002] The circuit board is a key component in an electronic device. A chip can be mounted on the surface of the circuit board, or the chip can be embedded in the circuit board.

[0003] In the related art, a heat dissipation material is usually coated on the surface of the circuit board and the surface of the chip to accelerate the dissipation of heat from the chip. The heat at the bottom of the chip cannot be dissipated to the external environment in time, resulting in a high temperature of the chip and a high local temperature of the circuit board, which affects the reliability of use. SUMMARY

[0004] In view of the above problems, the present disclosure provides a circuit board and an electronic device.

[0005] A first aspect of the present disclosure provides a circuit board, comprising:

[0006] A circuit board body having a receiving groove opened in a first surface; the receiving groove is used for accommodating a chip, and a groove bottom surface of the receiving groove is arranged opposite to the chip;

[0007] A heat conduction member embedded in the circuit board body, at least part of the heat conduction member is arranged opposite to the groove bottom surface of the receiving groove, and an end surface of the heat conduction member is exposed by the first surface.

[0008] According to an embodiment of the present disclosure, the circuit board body is provided with a containing cavity, the containing cavity is arranged around the receiving groove, and the heat conduction member is arranged in the containing cavity.

[0009] According to an embodiment of the present disclosure, the containing cavity comprises a first containing cavity and at least one second containing cavity which are in communication with each other, the first containing cavity is opened in the inside of the circuit board body and arranged opposite to the groove bottom surface of the receiving groove, and at least one second containing cavity is arranged around the receiving groove along the circumferential direction of the receiving groove, and the second containing cavity is opened in the first surface of the circuit board body.

[0010] The heat conduction member comprises:

[0011] A first heat conduction part located in the first containing cavity;

[0012] A second heat conduction part located in the second containing cavity, and at least part of the first heat conduction part is arranged in close contact with the second heat conduction part.

[0013] According to an embodiment of the present disclosure, the first containing cavity is arranged spaced apart from the groove bottom surface of the receiving groove, and the spacing between the first containing cavity and the groove bottom surface is less than or equal to 0.1 millimeter.

[0014] The second accommodating cavity is arranged apart from the side groove wall surface of the accommodating groove, and the distance between the second accommodating cavity and the side groove wall surface is less than or equal to 0.1 millimeter.

[0015] According to an embodiment of the present disclosure, the first accommodating cavity is arranged apart from the groove bottom surface of the accommodating groove, the distance between the first section of the first accommodating cavity and the groove bottom surface is less than or equal to 0.1 millimeter, and a circuit area for accommodating a signal line is arranged between the second section of the first accommodating cavity and the groove bottom surface.

[0016] The first heat-conducting part comprises:

[0017] A first heat-conducting block is embedded in the first section of the first accommodating cavity.

[0018] A second heat-conducting block is embedded in the second section of the first accommodating cavity.

[0019] According to an embodiment of the present disclosure, the cavity radius of the first accommodating cavity near the chip side is less than the cavity radius of the first accommodating cavity away from the chip side.

[0020] According to an embodiment of the present disclosure, the other surface of the end surface of the heat-conducting part is exposed by the other surface of the first surface of the circuit board body.

[0021] According to an embodiment of the present disclosure, the circuit board further comprises a heat-dissipating part arranged on the first surface of the circuit board body.

[0022] At least part of the heat-conducting part is in contact with the heat-dissipating part.

[0023] At least part of the heat-dissipating part is arranged opposite to the chip.

[0024] According to an embodiment of the present disclosure, the material of the heat-conducting part comprises any one or a combination of multiple of copper material, copper alloy material, aluminum material and aluminum alloy material.

[0025] The material of the heat-dissipating part comprises any one or a combination of multiple of copper material, aluminum material, silicon grease material and heat-conducting glue material.

[0026] The second aspect of the present disclosure provides an electronic device, comprising: a circuit board comprising:

[0027] A circuit board body has an accommodating groove opened on a first surface; the accommodating groove is used for accommodating a chip, and a groove bottom surface of the accommodating groove is arranged opposite to the chip.

[0028] A heat conducting member is embedded in the circuit board body, at least a part of the heat conducting member is arranged opposite to the groove bottom surface of the accommodating groove, and an end surface of the heat conducting member is exposed by the first surface. BRIEF DESCRIPTION OF DRAWINGS

[0029] For a more complete understanding of the present disclosure and its advantages, reference is now made to the following description taken in conjunction with the accompanying drawings in which:

[0030] Figure 1 One of cross-sectional views of a circuit board, chip assembly according to an embodiment of the present disclosure is schematically shown;

[0031] Figure 2 One of cross-sectional views of a circuit board body according to an embodiment of the present disclosure is schematically shown;

[0032] Figure 3 One of cross-sectional views of a heat conducting member according to an embodiment of the present disclosure is schematically shown;

[0033] Figure 4 Two of cross-sectional views of a circuit board, chip assembly according to another embodiment of the present disclosure are schematically shown;

[0034] Figure 5 Two of cross-sectional views of a circuit board body according to another embodiment of the present disclosure are schematically shown;

[0035] Figure 6 Two of cross-sectional views of a heat conducting member according to another embodiment of the present disclosure are schematically shown;

[0036] Figure 7 A top view of a circuit board, chip assembly according to an embodiment of the present disclosure is schematically shown.

[0037] REFERENCE NUMERALS:

[0038] 10: circuit board; 11: circuit board body; 111: first surface; 112: second surface; 113: side surface of the circuit board body; 101: housing groove; 1011: groove bottom surface; 1012: side groove wall surface; 102: accommodation cavity; 1021: first accommodation cavity; 10211: first cavity wall surface; 10212: second cavity wall surface; 10213: third cavity wall surface; 10214: first side cavity wall surface; 10215: second side cavity wall surface; 10216: third side cavity wall surface; 1022: second accommodation cavity; 10221: fourth cavity wall surface; 10222: fifth cavity wall surface; 12: heat conducting member; 121: first heat conducting portion; 1211: first heat conducting block; 1212: second heat conducting block; 122: second heat conducting portion; 1201: first surface; 1202: second surface; 1203: third surface; 1204: first circumferential surface; 1205: second circumferential surface; 1206: third circumferential surface; 1207: fourth circumferential surface; 1208: fifth circumferential surface; 1209: end surface; 13: heat radiating member; 14: signal line; 20: chip; 201: third surface; 202: side surface of the chip. DETAILED DESCRIPTION

[0039] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood, however, that the description is merely exemplary and is not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known functions and constructions are omitted to avoid obscuring the concept of the present disclosure in unnecessary detail.

[0040] The terms used herein are merely used to describe specific embodiments and are not intended to limit the present disclosure. The terms "include", "comprise" and the like used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0041] All terms used herein, including technical and scientific terms, have the same meanings as those generally understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having meanings consistent with the context of the present specification, and should not be interpreted in an idealized or excessively formal manner.

[0042] The following will be described below in conjunction with Figures 1 to 7 A circuit board and an electronic device according to an embodiment of the present disclosure are described.

[0043] In an embodiment of the present disclosure, as Figure 1 and Figure 4As shown, the circuit board 10 comprises a circuit board body 11 and a heat conducting member 12. The circuit board body 11 has a receiving groove 101 formed in a first surface 111, the receiving groove 101 is used for receiving the chip 20, and a groove bottom surface 1011 of the receiving groove 101 is arranged opposite to the chip 20. The heat conducting member 12 is embedded in the circuit board body 11, at least part of the heat conducting member 12 is arranged opposite to the groove bottom surface 1011 of the receiving groove 101, and an end surface 1209 of the heat conducting member 12 is exposed by the first surface 111.

[0044] The circuit board body 11 and the heat conducting member 12 embedded in the circuit board body 11 constitute the circuit board 10. The circuit board body 11 is provided with the receiving groove 101, the chip 20 is mounted at the receiving groove 101 of the circuit board 10, the chip 20 generates heat in the working state, the heat at the bottom of the chip 20 can be conducted to the outside of the circuit board body 11 through the heat conducting member 12, the heat at the side of the chip 20 can also be conducted to the outside of the circuit board body 11 through the heat conducting member 12, and the heat at the top of the chip 20 can be directly dissipated to the outside of the circuit board body 11.

[0045] The circuit board body 11 has a length direction, a width direction and a thickness direction, and the circuit board body 11 has opposite first and second surfaces 111 and 112 in the thickness direction. The circuit board body 11 can be composed of multiple layers of conductive layers and multiple layers of dielectric layers laminated together, the conductive layers and the dielectric layers are arranged alternately, and adjacent conductive layers are isolated from each other by the dielectric layers. The first surface 111 of the circuit board body 11 constitutes the first surface 111 of the circuit board 10, and the second surface 112 of the circuit board body 11 constitutes the second surface 112 of the circuit board 10.

[0046] As shown in Figure 2 and Figure 5 , the side where the first surface 111 of the circuit board body 11 is located is provided with the receiving groove 101, the shape of the receiving groove 101 is matched with the shape of the chip 20, and the shape of the receiving groove 101 can be square, circular, etc. The receiving groove 101 has a groove bottom surface 1011 and a side groove wall surface 1012 connected with the groove bottom surface 1011.

[0047] In the thickness direction of the chip 20, the chip 20 has opposite third and fourth surfaces 201 and 202, and a side surface connecting the third and fourth surfaces 201 and 202. The chip 20 is mounted in the accommodating groove 101 of the circuit board body 11, and the third surface 201 of the chip 20 abuts against the groove bottom surface 1011 of the accommodating groove 101. The thickness of the chip 20 can be equal to the groove depth of the accommodating groove 101, can be smaller than the groove depth of the accommodating groove 101, or can be greater than the groove depth of the accommodating groove 101. When the thickness of the chip 20 is equal to or close to the groove depth of the accommodating groove 101, the fourth surface of the chip 20 is substantially coplanar with the first surface 111 of the circuit board body 11. When the fourth surface of the chip 20 is substantially coplanar with the first surface 111 of the circuit board body 11, the chip 20 does not occupy the external space of the circuit board body 11, and the overall structure of the circuit board 10 and the chip 20 is miniaturized.

[0048] The material of the heat conduction member 12 includes any one or a combination of copper material, copper alloy material, aluminum material, and aluminum alloy material. The heat conduction member 12 can be made of one of the copper material, the copper alloy material, the aluminum material, and the aluminum alloy material. The heat conduction member 12 can also be made of two or more of the copper material, the copper alloy material, the aluminum material, and the aluminum alloy material. For example, one part of the heat conduction member 12 is made of copper material, and another part of the heat conduction member 12 is made of copper alloy material, which can meet the heat conduction requirement while taking into account light weight and low cost.

[0049] Part of the heat conduction member 12 can be arranged opposite to the groove bottom surface 1011 of the accommodating groove 101, and the distance between the heat conduction member 12 and the groove bottom surface 1011 is set according to actual requirements. Part of the heat conduction member 12 can be arranged opposite to the side groove wall surface 1012 of the accommodating groove 101, and the distance between the heat conduction member 12 and the side groove wall surface 1012 is set according to actual requirements. Figure 3 and Figure 6 As shown in FIGS. 12 and 13, one surface of the heat conduction member 12 is described as an end surface 1209 in the thickness direction of the heat conduction member 12. The end surface 1209 of the heat conduction member 12 can be exposed at the first surface 111, i.e., the end surface 1209 of the heat conduction member 12 can be coplanar with the first surface 111.

[0050] In some embodiments, the heat conducting member 12 can be a one-piece member, and the circuit board body 11 can be provided with a receiving cavity 102 adapted to the heat conducting member 12, and the heat conducting member 12 can be embedded in the circuit board body 11. For example, after the circuit board body 11 is prepared, a receiving groove 101 can be formed on the side where the first surface 111 of the circuit board body 11 is located, and a mounting cavity and the receiving cavity 102 can be formed in communication on the side where the second surface 112 of the circuit board body 11 is located, and the heat conducting member 12 can be put into the receiving cavity 102 from the side where the second surface 112 is located. A backfill member adapted to the mounting cavity can be prepared by using a backfill material, and the material of the backfill member can include polypropylene material, and the backfill member can be bonded to the mounting cavity by using an adhesive, so as to fix the heat conducting member 12. The adhesive can include a resin adhesive.

[0051] In some embodiments, as shown in Figure 1 and Figure 3 , the heat conducting member 12 includes a first heat conducting part 121 and a second heat conducting part 122. The circuit board body 11 includes a plurality of substrates stacked together, and the receiving groove 101 can be formed by grooving the substrates at different layers, and the receiving cavity 102 can be formed by opening the substrates at different layers. For example, the circuit board body 11 can be divided into a first substrate, a second substrate and a third substrate, the first substrate can be processed to form a first receiving area adapted to the first heat conducting part 121, the second substrate can be processed to form a second receiving area adapted to the second heat conducting part 122 and the receiving groove 101, and the third substrate does not need to be processed. The first heat conducting part 121 can be embedded in the first receiving area of the first substrate, and the second heat conducting part 122 can be embedded in the second receiving area of the second substrate, and then the first substrate and the second substrate can be laminated, so that the second heat conducting part 122 is attached to the first heat conducting part 121. Then, the third substrate can be laminated with the first substrate and the second substrate, so as to complete the installation of the circuit board body 11 and the heat conducting member 12. The first receiving area and the second receiving area can be respectively formed on the first substrate and the second substrate, which is beneficial to the convenience of processing and preparation. The first heat conducting part 121 and the second heat conducting part 122 are respectively embedded in the first substrate and the second substrate, and then laminated, which is beneficial to the convenience of installation of the heat conducting member 12. It can be understood that the first substrate can include a plurality of first sub-substrates, and the plurality of first sub-substrates can be laminated to form the first substrate; and the second substrate can include a plurality of second sub-substrates, and the plurality of second sub-substrates can be laminated to form the second substrate.

[0052] In some embodiments, the heat-conducting member 12 can be combined by a plurality of heat-conducting parts or blocks. After the circuit board body 11 is prepared, the accommodating groove 101 can be processed on the side where the first surface 111 of the circuit board body 11 is located, and the mounting cavity and the accommodating cavity 102 connected therewith can be processed on the side where the second surface 112 of the circuit board body 11 is located. After the plurality of heat-conducting parts or blocks are sequentially placed into the accommodating cavity 102 from the side where the second surface 112 is located, the backfill member is bonded to the mounting cavity by the resin bonding agent, and the fixation of the heat-conducting member 12 is realized.

[0053] As shown in Figure 1 and Figure 4 , at least part of the heat-conducting member 12 is arranged opposite to the groove bottom surface 1011 of the accommodating groove 101, and the end surface 1209 of the heat-conducting member 12 is exposed by the first surface 111 of the circuit board body 11. The chip 20 is mounted at the accommodating groove 101, the third surface 201 of the chip 20 is connected with the groove bottom surface 1011 of the accommodating groove 101, and the side surface 202 of the chip is opposite to the side groove wall surface 1012 of the accommodating groove 101. The heat at the bottom of the chip 20 can be conducted to the heat-conducting member 12, and the heat is conducted along a certain path in the heat-conducting member 12 to the end surface 1209, thereby dissipating the heat to the external environment of the circuit board body 11; the heat at the top of the chip 20 can be directly dissipated to the external environment, and the heat at the top of the chip 20 can also be dissipated to the external environment through the heat-dissipating member 13 arranged at the first surface 111. The heat-conducting member 12 embedded in the circuit board body 11 increases the heat conduction path of the heat of the chip 20, thereby accelerating the conduction of the heat at the bottom of the chip 20 to the external environment, which is beneficial to improve the heat dissipation efficiency of the chip 20, ensure that the temperature of the chip 20 is kept below the target temperature, ensure the reliable operation of the chip 20, and is beneficial to improve the service life of the chip 20.

[0054] In the embodiments of the present disclosure, the first surface 111 of the circuit board body 11 is provided with the accommodating groove 101, the heat-conducting member 12 is embedded in the circuit board body 11, at least part of the heat-conducting member 12 is arranged opposite to the groove bottom surface 1011 of the accommodating groove 101, the end surface 1209 of the heat-conducting member 12 is exposed by the first surface 111, the chip 20 is mounted at the accommodating groove 101, and the heat at the bottom of the chip 20 can be conducted to the external environment of the circuit board body 11 through the heat-conducting member 12. The heat at the top of the chip 20 can be directly dissipated to the external environment of the circuit board body 11. The heat-conducting member 12 increases the heat conduction path, and effectively improves the heat dissipation efficiency of the chip 20.

[0055] In the embodiments of the present disclosure, as shown in Figure 2 and Figure 5 , the circuit board body 11 is provided with the accommodating cavity 102, and the accommodating cavity 102 is arranged around the accommodating groove 101. The heat-conducting member 12 is arranged in the accommodating cavity 102.

[0056] According to the position of the accommodating cavity 102 in the circuit board body 11 relative to the accommodating groove 101, the accommodating cavity 102 can be roughly divided into a first part and a second part, the first part of the accommodating cavity 102 is arranged opposite to the groove bottom surface 1011 of the accommodating groove 101, and the second part of the accommodating cavity 102 is arranged opposite to the side groove wall surface 1012 of the accommodating groove 101. The second part of the accommodating cavity 102 can be perpendicular to the first part of the accommodating cavity 102, so that the accommodating cavity 102 can be roughly arranged around the accommodating groove 101. The heat conduction member 12 is located in the accommodating cavity 102, and the heat conduction member 12 can be arranged around the side of the chip 20 and opposite to the third surface 201 of the chip 20. The first part of the heat conduction member 12 is spaced apart from the third surface 201 of the chip 20 by a certain distance, and the second part of the heat conduction member 12 is spaced apart from the side surface 202 of the chip by a certain distance. The third surface 201 of the chip 20 is described as the bottom surface of the chip 20, and the fourth surface of the chip 20 is described as the top surface of the chip 20.

[0057] In some embodiments, the accommodating groove 101 can be a square-shaped accommodating groove 101, and the chip 20 can be a square-shaped chip 20. The heat at the bottom of the chip 20 is conducted to the first part of the heat conduction member 12, and then further conducted along the second part of the heat conduction member 12 to the end surface 1209 of the heat conduction member 12, so as to be dissipated to the external environment of the circuit board body 11. The second part of the heat conduction member 12 can surround the chip 20, and the heat at the first part of the heat conduction member 12 can be conducted along multiple areas at the same time, which is beneficial to accelerate the heat conduction. The cross section of the first part of the heat conduction member 12 can be slightly larger than the groove bottom surface 1011, and the projection area of the first part of the heat conduction member 12 on the groove bottom surface 1011 can completely cover the groove bottom surface 1011, so that the heat at the bottom of the chip 20 can be quickly conducted to the first part of the heat conduction member 12.

[0058] In some embodiments, the accommodating groove 101 can be a square-shaped accommodating groove 101, and the chip 20 can be a square-shaped chip 20. The heat at the bottom of the chip 20 is conducted to the first part of the heat conduction member 12, and then further conducted along the second part of the heat conduction member 12 to the end surface 1209 of the heat conduction member 12, so as to be dissipated to the external environment of the circuit board body 11. The second part of the heat conduction member 12 can surround the chip 20, and the heat at the first part of the heat conduction member 12 can be conducted along multiple areas at the same time, which is beneficial to accelerate the heat conduction. The cross section of the first part of the heat conduction member 12 can be slightly larger than the groove bottom surface 1011, and the projection area of the first part of the heat conduction member 12 on the groove bottom surface 1011 can completely cover the groove bottom surface 1011, so that the heat at the bottom of the chip 20 can be quickly conducted to the first part of the heat conduction member 12.

[0059] The accommodating cavity 102 is arranged around the accommodating groove 101, the heat conduction member 12 is located in the accommodating cavity 102, the chip 20 is located in a region surrounded by the heat conduction member 12, and heat at the bottom of the chip 20 can be quickly conducted to the first part of the heat conduction member 12, further conducted to the end face 1209 of the heat conduction member 12 from the second part of the heat conduction member 12 along multiple regions, and dissipated to the external environment of the circuit board 10, thereby facilitating the quick conduction of heat of the chip 20.

[0060] In the embodiment of the present disclosure, the accommodating cavity 102 is arranged around the accommodating groove 101, the heat conduction member 12 located in the accommodating cavity 102 can be opposite to the bottom surface of the chip 20 and the side surface 202 of the chip, heat of the chip 20 can be quickly conducted to the heat conduction region of the heat conduction member 12 opposite to the bottom surface of the chip 20, further conducted to the end face 1209 of the heat conduction member 12 along the heat conduction region of the heat conduction member 12 opposite to the side surface 202 of the chip, and the heat conduction region can cover the bottom surface of the chip 20 and the side surface 202 of the chip to the maximum extent, thereby facilitating the further improvement of the heat dissipation efficiency of the chip 20.

[0061] In the embodiment of the present disclosure, as shown in Figure 2 and Figure 5 , the accommodating cavity 102 includes a first accommodating cavity 1021 and at least one second accommodating cavity 1022 which are in communication with each other. The first accommodating cavity 1021 is arranged inside the circuit board body 11 and opposite to the groove bottom surface 1011 of the accommodating groove 101. The at least one second accommodating cavity 1022 is arranged around the accommodating groove 101 along the circumferential direction of the accommodating groove 101, and the second accommodating cavity 1022 is arranged on the first surface 111 of the circuit board body 11. As shown in Figure 3 and Figure 6 , the heat conduction member 12 includes a first heat conduction part 121 and a second heat conduction part 122, the first heat conduction part 121 is located in the first accommodating cavity 1021, the second heat conduction part 122 is located in the second accommodating cavity 1022, and at least part of the first heat conduction part 121 is arranged in close contact with the second heat conduction part 122.

[0062] The length direction of the circuit board body 11 is described as a first direction, the width direction of the circuit board body 11 is described as a second direction, and the thickness direction of the circuit board body 11 is described as a third direction. The first direction, the second direction and the third direction are as shown in Figure 1 and Figure 7 . The cross section in the following is parallel to the plane formed by the first direction and the second direction, and the longitudinal section is parallel to the plane formed by the first direction and the third direction. The length direction of the chip 20 is consistent with the first direction, the width direction of the chip 20 is consistent with the second direction, and the length and the width of the chip 20 can be equal.

[0063] The dimension of the first accommodation cavity 1021 in the first direction can be greater than the dimension of the accommodation groove 101 in the first direction, the dimension of the first accommodation cavity 1021 in the second direction can be greater than the dimension of the accommodation groove 101 in the second direction, and the dimension of the first accommodation cavity 1021 in the third direction is set according to actual requirements. The second accommodation cavity 1022 can be provided on the peripheral side of the side groove wall surface 1012 of the accommodation groove 101. One end of the second accommodation cavity 1022 is communicated with the first accommodation cavity 1021, and the other end of the second accommodation cavity 1022 extends to be connected with the first surface 111 of the circuit board body 11.

[0064] The number of the second accommodation cavities 1022 can be one, two or more. When the number of the second accommodation cavities 1022 is one, the second accommodation cavity 1022 can be a U-shaped or ring-shaped accommodation cavity. When the number of the second accommodation cavities 1022 is more than one, the plurality of second accommodation cavities 1022 are arranged at intervals along the circumferential direction of the accommodation groove 101 on the peripheral side of the side groove wall surface 1012. The cross-sectional shape of the second accommodation cavity 1022 can be circular, square, etc. The plurality of second accommodation cavities 1022 are arranged at intervals, and the aperture and position of the second accommodation cavity 1022 can be flexibly set according to actual requirements. The plurality of second heat conducting parts 122 are respectively installed in the plurality of second accommodation cavities 1022.

[0065] In some embodiments, the first heat conducting part 121 and the second heat conducting part 122 can be an integral structural member. The shape of the first heat conducting part 121 is adapted to the shape of the first accommodation cavity 1021, and the shape of the second heat conducting part 122 is adapted to the shape of the second accommodation cavity 1022. The longitudinal section of the first accommodation cavity 1021 can be approximately trapezoidal, and the longitudinal section of the first heat conducting part 121 can be approximately trapezoidal. The longitudinal section of the first accommodation cavity 1021 can be approximately rectangular, and the longitudinal section of the first heat conducting part 121 can be approximately rectangular. The second accommodation cavity 1022 can be a U-shaped accommodation cavity, as Figure 7 shown, the shape of the second heat conducting part 122 can be U-shaped. The second accommodation cavity 1022 can also be a ring-shaped accommodation cavity, and the cross-sectional shape of the second heat conducting part 122 is ring-shaped. The first heat conducting part 121 and the second heat conducting part 122 can be integrally formed by a casting process. The first heat conducting part 121 and the second heat conducting part 122 can also be connected into one body by a welding process.

[0066] The process of embedding the heat conducting member 12 into the circuit board body 11 is as follows. First, a mounting cavity is processed at the region of the second surface 112 of the circuit board body 11 corresponding to the accommodating groove 101, the size of the mounting cavity in the first direction is slightly larger than the size of the first heat conducting part 121 in the first direction, and the size of the mounting cavity in the second direction is slightly larger than the size of the first heat conducting part 121 in the second direction. Then, the first accommodating cavity 1021 and the second accommodating cavity 1022 are processed, the first accommodating cavity 1021 is processed on the side of the second surface 112 of the circuit board body 11, and the second accommodating cavity 1022 can be processed on the side of the second surface 112 of the circuit board body 11 or on the side of the first surface 111 of the circuit board body 11.

[0067] Then, the heat conducting member 12 is placed into the accommodating cavity 102 from the mounting cavity, after being installed in place, the second heat conducting part 122 is located in the second accommodating cavity 1022, and the first heat conducting part 121 is located in the first accommodating cavity 1021. Then, the backfill member is bonded at the mounting cavity, thereby fixing the heat conducting member 12 in the accommodating cavity 102.

[0068] In some embodiments, the first heat conducting part 121 and the second heat conducting part 122 can be two separable parts. The shape of the first heat conducting part 121 is adapted to the shape of the first accommodating cavity 1021, and the shape of the second heat conducting part 122 is adapted to the shape of the second accommodating cavity 1022. The longitudinal section of the first accommodating cavity 1021 can be approximately trapezoidal, and the longitudinal section of the first heat conducting part 121 can be approximately trapezoidal. The second accommodating cavity 1022 can be a back-shaped accommodating cavity, and the cross-sectional shape of the second heat conducting part 122 can be back-shaped. The first heat conducting part 121 and the second heat conducting part 122 can be prepared respectively.

[0069] The process of embedding the heat conducting member 12 into the circuit board body 11 is as follows. First, a mounting cavity is processed at the region of the second surface 112 of the circuit board body 11 corresponding to the accommodating groove 101, the size of the mounting cavity in the first direction is slightly larger than the size of the first heat conducting part 121 in the first direction, and the size of the mounting cavity in the second direction is slightly larger than the size of the first heat conducting part 121 in the second direction. Then, the first accommodating cavity 1021 and the second accommodating cavity 1022 are processed, the first accommodating cavity 1021 is processed on the side of the second surface 112 of the circuit board body 11, and the second accommodating cavity 1022 can be processed on the side of the second surface 112 of the circuit board body 11 or on the side of the first surface 111 of the circuit board body 11.

[0070] Next, the second heat-conducting part 122 is placed from the mounting cavity into the second receiving cavity 1022, and then the first heat-conducting part 121 is placed from the mounting cavity into the first receiving cavity 1021. After installation, the second heat-conducting part 122 is located in the second receiving cavity 1022, and the first heat-conducting part 121 is located in the first receiving cavity 1021, with at least a portion of the first heat-conducting part 121 in contact with the second heat-conducting part 122. Then, the backfill material is bonded to the mounting cavity, thereby fixing the first heat-conducting part 121 and the second heat-conducting part 122 in the receiving cavity 102.

[0071] The first heat-conducting part 121 is located in the first receiving cavity 1021, and the second heat-conducting part 122 is located in the second receiving cavity 1022. The first heat-conducting part 121 is disposed opposite to the bottom surface 1011 of the receiving groove 101, and the second heat-conducting part 122 is disposed opposite to the side wall surface 1012 of the receiving groove 101. The chip 20 is located in the receiving groove 101. The heat at the bottom of the chip 20 can be conducted to the end face 1209 of the heat-conducting component 12 along the heat conduction path of the first heat-conducting part 121 and the second heat-conducting part 122. The heat on the side of the chip 20 can be dissipated to the external environment through the gap between the chip 20 and the side wall surface 1012. The heat on the side of the chip 20 can also be conducted to the second heat-conducting part 122 and further conducted to the end face 1209 of the heat-conducting component 12. The heat at the top of the chip 20 can be directly dissipated to the external environment. Thus, the heat of the chip 20 can be conducted along multiple heat conduction paths, effectively improving the heat dissipation efficiency of the chip 20.

[0072] In the embodiments of this disclosure, the first receiving cavity 1021 is disposed opposite to the bottom surface 1011 of the receiving groove 101, and the second receiving cavity 1022 is disposed opposite to the side wall surface 1012 of the receiving groove 101. The heat-conducting area of ​​the first heat-conducting part 121 can cover the bottom of the chip 20, and the heat-conducting area of ​​the second heat-conducting part 122 can cover the side of the chip 20. The heat of the chip 20 can be conducted along multiple heat conduction paths, effectively improving the heat dissipation efficiency of the chip 20.

[0073] In embodiments of this disclosure, such as Figure 2 As shown, the first receiving cavity 1021 is spaced apart from the bottom surface 1011 of the receiving groove 101, and the distance between the first receiving cavity 1021 and the bottom surface 1011 is less than or equal to 0.1 mm. The second receiving cavity 1022 is spaced apart from the side wall surface 1012 of the receiving groove 101, and the distance between the second receiving cavity 1022 and the side wall surface 1012 is less than or equal to 0.1 mm.

[0074] In some embodiments, no signal lines are provided in the area on the circuit board body 11 that is at a suitable distance from the bottom surface 1011 of the receiving groove 101. The first receiving cavity 1021 can be a regularly shaped receiving cavity 102, and the first heat-conducting part 121 can be a regularly shaped heat-conducting part.

[0075] The first receiving cavity 1021 has opposing first cavity wall surfaces 10211 and 10212, with the first cavity wall surface 10211 being closer to the bottom surface 1011 than the second cavity wall surface 10212. The first cavity wall surface 10211 may be parallel to the bottom surface 1011, and the second cavity wall surface 10212 may be parallel to the bottom surface 1011. The first cavity wall surface 10211 and the second cavity wall surface 10212 may be parallel to each other. The cavity wall surface of the first receiving cavity 1021 also includes a side cavity wall surface connected to the first cavity wall surface 10211 and the second cavity wall surface 10212, which is described as a first side cavity wall surface 10214. The first side cavity wall surface 10214 may be perpendicular to the first cavity wall surface 10211 and the second cavity wall surface 10212. The first side cavity wall 10214 can also be inclined, with the angle between the first side cavity wall 10214 and the first cavity wall 10211 being greater than 90 degrees, and the angle between the first side cavity wall 10214 and the second cavity wall 10212 being less than 90 degrees.

[0076] The distance between the first receiving cavity 1021 and the bottom surface 1011 of the groove is the distance between the first cavity wall surface 10211 and the bottom surface 1011 of the groove. This distance is described as the first distance, as follows: Figure 2 As shown in L1, the first distance is less than or equal to 0.1 mm, and can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. By adjusting the first distance, the distance between the first heat-conducting part 121 and the bottom surface of the chip 20 is controlled, ensuring that the heat at the bottom of the chip 20 can be quickly conducted to the first heat-conducting part 121.

[0077] like Figure 3 As shown, the first heat-conducting part 121 has a shape adapted to the first receiving cavity 1021. The first heat-conducting part 121 has two opposing surfaces, which are respectively described as the first surface 1201 and the second surface 1202. The first heat-conducting part 121 also has a circumferential surface connected to the first surface 1201 and the second surface 1202, which is described as the first circumferential surface 1204. The first surface 1201 and the second surface 1202 can be parallel to each other. The distance between the first surface 1201 and the second surface 1202 is the thickness of the first heat-conducting part 121, and the thickness of the first heat-conducting part 121 is set according to actual needs.

[0078] like Figure 1As shown, the first heat-conducting part 121 is installed in the first receiving cavity 1021. The first surface 1201 is in contact with the first cavity wall surface 10211, and the first surface 1201 and the first cavity wall surface 10211 are in surface contact. The second surface 1202 is in contact with the second cavity wall surface 10212, and the second surface 1202 and the second cavity wall surface 10212 are in surface contact.

[0079] like Figure 2 As shown, the second receiving cavity 1022 has opposing fourth cavity wall surfaces 10221 and fifth cavity wall surfaces 10222, with the fourth cavity wall surface 10221 being closer to the side groove wall surface 1012 than the fifth cavity wall surface 10222. The fourth cavity wall surface 10221 can be connected to the first side cavity wall surface 10214, and the fifth cavity wall surface 10222 can be connected to the first cavity wall surface 10211. The fourth cavity wall surface 10221 can be perpendicular to the first cavity wall surface 10211, and the fifth cavity wall surface 10222 can be perpendicular to the first cavity wall surface 10211.

[0080] The distance between the second receiving cavity 1022 and the side groove wall 1012 is the same as the distance between the fourth cavity wall 10221 and the side groove wall 1012. The distance between the fourth cavity wall 10221 and the side groove wall 1012 is described as the second distance, as follows: Figure 2 As shown in L2, the second distance is less than or equal to 0.1 mm, and can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. By adjusting the second distance, the distance between the second heat-conducting part 122 and the side surface 202 of the chip is controlled, minimizing the heat conduction path between the first heat-conducting part 121 and the second heat-conducting part 122, ensuring that the heat of the chip 20 can be quickly conducted from the first heat-conducting part 121 to the second heat-conducting part 122. Furthermore, since the second heat-conducting part 122 is close to the side surface 202 of the chip, the heat on the side of the chip 20 can be quickly conducted to the second heat-conducting part 122.

[0081] like Figure 3 As shown, the second heat-conducting part 122 has a shape adapted to the second receiving cavity 1022. The second heat-conducting part 122 has two opposing surfaces, which are described as a fourth circumferential surface 1207 and a fifth circumferential surface 1208, respectively. The second heat-conducting part 122 also has an end face 1209 connected to the fourth circumferential surface 1207 and the fifth circumferential surface 1208. The distance between the fourth circumferential surface 1207 and the fifth circumferential surface 1208 is the thickness of the second heat-conducting part 122, and the thickness of the second heat-conducting part 122 is set according to actual needs.

[0082] like Figure 1As shown, the second heat-conducting part 122 is installed in the second receiving cavity 1022. The fourth circumferential surface 1207 is in contact with the fourth cavity wall 10221. The fourth circumferential surface 1207 and the fourth cavity wall 10221 are in surface contact. The fifth circumferential surface 1208 is in contact with the fifth cavity wall 10222. The fifth circumferential surface 1208 and the fifth cavity wall 10222 are in surface contact.

[0083] The distance between the first cavity wall surface 10211 and the bottom surface 1011 is less than or equal to 0.1 mm. The two opposing surfaces of the first heat-conducting part 121 are in contact with the first cavity wall surface 10211 and the second cavity wall surface 10212, respectively, to ensure that the heat at the bottom of the chip 20 can be quickly conducted to the first heat-conducting part 121. The distance between the fourth cavity wall surface 10221 and the side groove wall surface 1012 is less than or equal to 0.1 mm. The two opposing surfaces of the second heat-conducting part 122 are in contact with the fourth cavity wall surface 10221 and the fifth cavity wall surface 10222, respectively, to reduce the heat conduction path between the first heat-conducting part 121 and the second heat-conducting part 122, to ensure that the heat at the bottom and side of the chip 20 can be quickly conducted to the second heat-conducting part 122.

[0084] In the embodiments of this disclosure, the distance between the first receiving cavity 1021 and the bottom surface 1011 of the slot is less than or equal to 0.1 mm, and the distance between the second receiving cavity 1022 and the side slot wall 1012 is less than or equal to 0.1 mm. This allows the first heat-conducting part 121 to be close to the bottom surface of the chip 20, and the second heat-conducting part 122 to be close to the side surface 202 of the chip. This helps to reduce the heat conduction path between the first heat-conducting part 121 and the second heat-conducting part 122, and further improves the heat dissipation efficiency of the chip 20.

[0085] In embodiments of this disclosure, such as Figure 4 and Figure 5 As shown, the first receiving cavity 1021 and the bottom surface 1011 of the receiving groove 101 are spaced apart, and the distance between the first section of the first receiving cavity 1021 and the bottom surface 1011 is less than or equal to 0.1 mm; a wiring area is provided between the second section of the first receiving cavity 1021 and the bottom surface 1011, and the wiring area is used to accommodate the signal line 14. Figure 6 As shown, the first heat-conducting part 121 includes a first heat-conducting block 1211 and a second heat-conducting block 1212. The first heat-conducting block 1211 is embedded in the first section of the first receiving cavity 1021, and the second heat-conducting block 1212 is embedded in the second section of the first receiving cavity 1021.

[0086] In some embodiments, a signal line 14 is provided in a certain area below the bottom surface 1011 of the receiving groove 101 on the circuit board body 11, and the shape of the first heat-conducting part 121 is adapted to the first receiving cavity 1021.

[0087] In some embodiments, such as Figure 5 As shown, the cavity wall of the first receiving cavity 1021 may include a first cavity wall 10211, a second cavity wall 10212, and a third cavity wall 10213. In the thickness direction of the circuit board body 11, the first cavity wall 10211, the third cavity wall 10213, and the second cavity wall 10212 are arranged sequentially. The first cavity wall 10211 and the third cavity wall 10213 are close to the bottom surface 1011 of the slot, with the first cavity wall 10211 being closer to the bottom surface 1011 than the third cavity wall 10213. The second cavity wall 10212 is farther from the bottom surface 1011 of the slot. The first cavity wall 10211, the second cavity wall 10212, and the third cavity wall 10213 can be parallel to each other. The area between the bottom surface 1011 of the slot and the third cavity wall 10213 within the circuit board body 11 forms a circuit area, within which signal lines 14 can be disposed. The cavity wall of the first receiving cavity 1021 also includes a first side cavity wall 10214 connected to the first cavity wall 10211 and the second cavity wall 10212. The first side cavity wall 10214 may be perpendicular to the first cavity wall 10211 and the second cavity wall 10212. The first side cavity wall 10214 may also be inclined, with the angle between the first side cavity wall 10214 and the first cavity wall 10211 being greater than 90 degrees, and the angle between the first side cavity wall 10214 and the second cavity wall 10212 being less than 90 degrees.

[0088] The distance between the first section of the first receiving cavity 1021 and the bottom surface 1011 is the distance between the first cavity wall 10211 and the bottom surface 1011. The distance between the first cavity wall 10211 and the bottom surface 1011 is called the first distance, which is less than or equal to 0.1 mm. The first distance can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. The distance between the third cavity wall 10213 and the bottom surface 1011 is set according to actual needs, sufficient to accommodate the signal line 14. By adjusting the first distance, the distance between the first heat-conducting part 121 and the bottom surface of the chip 20 is controlled, ensuring that heat from the bottom of the chip 20 can be quickly conducted to the first heat-conducting part 121.

[0089] The cavity wall of the first receiving cavity 1021 also includes a second side cavity wall 10215 and a third side cavity wall 10216. The second side cavity wall 10215 is connected to the third cavity wall 10213 and the first cavity wall 10211, and the third side cavity wall 10216 is connected to the third cavity wall 10213 and the cavity wall of the second receiving cavity 1022.

[0090] In some embodiments, the first cavity wall 10211 and the second side cavity wall 10215 enclose a first sub-receiving cavity, the first cavity wall 10211, the first side cavity wall 10214 and the third side cavity wall 10216 enclose a second sub-receiving cavity, and the third cavity wall 10213, the second cavity wall 10212 and the first side cavity wall 10214 enclose a third sub-receiving cavity. The first receiving cavity 1021 includes the first sub-receiving cavity, the second sub-receiving cavity and the third sub-receiving cavity.

[0091] like Figure 6 As shown, the first heat-conducting part 121 includes a first heat-conducting block 1211 and a second heat-conducting block 1212. The number of first heat-conducting blocks 1211 can be two. One first heat-conducting block 1211 has a shape adapted to the first sub-receiving cavity, the other first heat-conducting block 1211 has a shape adapted to the second sub-receiving cavity, and the second heat-conducting block 1212 has a shape adapted to the third sub-receiving cavity.

[0092] In some embodiments, the first heat-conducting block 1211 and the second heat-conducting block 1212 can be an integral structural component. The first heat-conducting portion 121 has a first surface 1201, a second surface 1202, and a third surface 1203. The first surface 1201, the third surface 1203, and the second surface 1202 are arranged sequentially along the thickness direction of the first heat-conducting portion 121. The first heat-conducting portion 121 also includes a first circumferential surface 1204 connected to the first surface 1201 and the second surface 1202, a second circumferential surface 1205 connected to the first surface 1201 and the third surface 1203, and a third circumferential surface 1206 connected to the third surface 1203. The distance between the first surface 1201 and the third surface 1203 is the thickness of the first heat-conducting block 1211, and the thickness of the first heat-conducting block 1211 is set according to actual requirements. The distance between the third surface 1203 and the second surface 1202 is the thickness of the second heat-conducting block 1212, and the thickness of the second heat-conducting block 1212 is set according to actual requirements.

[0093] like Figure 4 As shown, the first heat-conducting part 121 is installed in the first receiving cavity 1021. The first surface 1201 is in contact with the first cavity wall surface 10211, and the first surface 1201 and the first cavity wall surface 10211 are in surface contact. The second surface 1202 is in contact with the second cavity wall surface 10212, and the second surface 1202 and the second cavity wall surface 10212 are in surface contact. The third surface 1203 is in contact with the third cavity wall surface 10213, and the third surface 1203 and the third cavity wall surface 10213 are in surface contact. The first circumferential surface 1204 is in surface contact with the first side cavity wall surface 10214, the second circumferential surface 1205 is in surface contact with the second side cavity wall surface 10215, and the third circumferential surface 1206 is in surface contact with the third side cavity wall surface 10216.

[0094] likeFigure 5 As shown, the second receiving cavity 1022 has opposing fourth cavity wall surfaces 10221 and fifth cavity wall surfaces 10222, with the fourth cavity wall surface 10221 being closer to the side groove wall surface 1012 than the fifth cavity wall surface 10222. The fourth cavity wall surface 10221 can be connected to the first side cavity wall surface 10214, and the fifth cavity wall surface 10222 can be connected to the first cavity wall surface 10211. The fourth cavity wall surface 10221 can be perpendicular to the first cavity wall surface 10211, and the fifth cavity wall surface 10222 can be perpendicular to the first cavity wall surface 10211.

[0095] The distance between the second receiving cavity 1022 and the side groove wall 1012 is the same as the distance between the fourth cavity wall 10221 and the side groove wall 1012. This distance is described as the second distance, which is less than or equal to 0.1 mm. The second distance can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. By adjusting the second distance, the distance between the second heat-conducting part 122 and the side surface 202 of the chip is controlled, minimizing the heat conduction path between the first heat-conducting part 121 and the second heat-conducting part 122, ensuring that the heat from the chip 20 can be quickly conducted from the first heat-conducting part 121 to the second heat-conducting part 122. Furthermore, the second heat-conducting part 122 is close to the side surface 202 of the chip, allowing heat from the side of the chip 20 to be quickly conducted to the second heat-conducting part 122.

[0096] like Figure 6 As shown, the second heat-conducting part 122 has a shape adapted to the second receiving cavity 1022. The second heat-conducting part 122 has two opposing surfaces, which are described as a fourth circumferential surface 1207 and a fifth circumferential surface 1208, respectively. The second heat-conducting part 122 also has an end face 1209 connected to the fourth circumferential surface 1207 and the fifth circumferential surface 1208. The distance between the fourth circumferential surface 1207 and the fifth circumferential surface 1208 is the thickness of the second heat-conducting part 122, and the thickness of the second heat-conducting part 122 is set according to actual needs.

[0097] like Figure 4 As shown, the second heat-conducting part 122 is installed in the second receiving cavity 1022. The fourth circumferential surface 1207 is in contact with the fourth cavity wall 10221. The fourth circumferential surface 1207 and the fourth cavity wall 10221 are in surface contact. The fifth circumferential surface 1208 is in contact with the fifth cavity wall 10222. The fifth circumferential surface 1208 and the fifth cavity wall 10222 are in surface contact.

[0098] The distance between the first cavity wall surface 10211 and the bottom surface 1011 is less than or equal to 0.1 mm. The three surfaces of the first heat-conducting part 121 are in contact with the first cavity wall surface 10211, the second cavity wall surface 10212, and the third cavity wall surface 10213, respectively, ensuring that heat from the bottom of the chip 20 can be quickly conducted to the first heat-conducting part 121. The distance between the fourth cavity wall surface 10221 and the side cavity wall surface 1012 is less than or equal to 0.1 mm. The two opposing surfaces of the second heat-conducting part 122 are in contact with the fourth cavity wall surface 10221 and the fifth cavity wall surface 10222, respectively, reducing the heat conduction path between the first heat-conducting part 121 and the second heat-conducting part 122, ensuring that heat from the bottom and sides of the chip 20 can be quickly conducted to the second heat-conducting part 122. This satisfies the requirements for the signal line 14 layout while also facilitating rapid heat conduction from the chip 20.

[0099] In some embodiments, the first heat-conducting block 1211 and the second heat-conducting block 1212 are separable. When installing the first heat-conducting part 121, one first heat-conducting block 1211 can be installed in the first sub-receiving cavity and another first heat-conducting block 1211 in the second sub-receiving cavity first, and then the second heat-conducting block 1212 can be installed in the third sub-receiving cavity. After the first heat-conducting block 1211 and the second heat-conducting block 1212 are installed in place, the second heat-conducting block 1212 comes into contact with the first heat-conducting block 1211. The first heat-conducting block 1211 and the second heat-conducting block 1212 can be manufactured separately, which facilitates the manufacturing of the first heat-conducting part 121; the sequential installation of the first heat-conducting block 1211 and the second heat-conducting block 1212 facilitates the installation of the first heat-conducting part 121.

[0100] In the embodiments of this disclosure, the distance between the first section of the first receiving cavity 1021 and the bottom surface 1011 of the groove is less than or equal to 0.1 mm, the distance between the second receiving cavity 1022 and the side groove wall 1012 is less than or equal to 0.1 mm, and a signal line 14 is provided in the line area between the second section of the first receiving cavity 1021 and the bottom surface 1011 of the groove; at least a portion of the first heat-conducting part 121 is close to the bottom surface of the chip 20, and the second heat-conducting part 122 is close to the side surface 202 of the chip, which helps to reduce the heat conduction path between the first heat-conducting part 121 and the second heat-conducting part 122, and while meeting the requirements for the layout of the signal line 14, it also helps to improve the heat dissipation efficiency of the chip 20.

[0101] In embodiments of this disclosure, such as Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the cavity radius of the first receiving cavity 1021 on the side closer to the chip 20 is smaller than the cavity radius of the first receiving cavity 1021 on the side farther away from the chip 20.

[0102] In some embodiments, the cross-section of the first receiving cavity 1021 extends from the first surface 111 of the circuit board body 11 toward the second surface 112 of the circuit board body 11, and the cross-section gradually increases.

[0103] like Figure 2 As shown, the radial dimension of the first side cavity wall 10214 of the first receiving cavity 1021 gradually increases, as... Figure 3 As shown, the cross-section of the corresponding first heat-conducting part 121 gradually increases. The gradually increasing cross-section of the first receiving cavity 1021 is beneficial to increasing the heat-conducting area of ​​the first heat-conducting part 121, and also beneficial to enhancing the bonding strength between the first heat-conducting part 121 and the circuit board body 11.

[0104] like Figure 5 As shown, the radial dimension of the first side cavity wall 10214 of the first receiving cavity 1021 gradually increases, as... Figure 6 As shown, the cross-section of the first heat-conducting block 1211 located in the second sub-receiving cavity gradually increases, and the cross-section of the second heat-conducting block 1212 located in the third sub-receiving cavity also gradually increases. The gradually increasing cross-section of the first receiving cavity 1021 is beneficial for increasing the heat-conducting area of ​​the first heat-conducting part 121, and also for enhancing the bonding strength between the first heat-conducting part 121 and the circuit board body 11.

[0105] In the embodiments of this disclosure, the radius of the cavity on the side of the first receiving cavity 1021 away from the chip 20 is larger than the radius of the cavity on the side closer to the chip 20. This is beneficial to increasing the heat conduction area of ​​the first heat conduction part 121, thereby further improving the heat dissipation efficiency of the chip 20. In addition, it is beneficial to enhance the bonding strength between the first heat conduction part 121 and the circuit board body 11. When the chip 20 is facing downward, that is, when the main body of the circuit board body 11 is located above the chip 20, the tendency of the heat conduction part 12 to move downward can be avoided or weakened, and the chip 20 can be prevented from being squeezed.

[0106] The following describes the installation process of the heat-conducting component 12 using an embodiment.

[0107] like Figure 3 As shown, the heat-conducting component 12 includes a first heat-conducting part 121 and a second heat-conducting part 122, which are integrally formed.

[0108] A mounting cavity is machined on one side of the second surface 112 of the circuit board body 11, and a first receiving cavity 1021 and a second receiving cavity 1022 are further machined. The first receiving cavity 1021 includes a first cavity wall surface 10211, a second cavity wall surface 10212, and a first side cavity wall surface 10214. The second receiving cavity 1022 includes a fourth cavity wall surface 10221 and a fifth cavity wall surface 10222. The distance between the first cavity wall surface 10211 and the bottom surface 1011 of the receiving groove 101 is a first distance, which is less than or equal to 0.1 mm. The distance between the fourth cavity wall surface 10221 and the side groove wall surface 1012 of the receiving groove 101 is a second distance, which is less than or equal to 0.1 mm.

[0109] The heat-conducting component 12 is installed from the mounting cavity of the circuit board body 11. After the heat-conducting component 12 is installed in place, the first heat-conducting part 121 is located in the first receiving cavity 1021, and the second heat-conducting part 122 is located in the second receiving cavity 1022. The fourth circumferential surface 1207 of the second heat-conducting part 122 is in contact with the fourth cavity wall 10221, and the fifth circumferential surface 1208 of the second heat-conducting part 122 is in contact with the fifth cavity wall 10222. The first surface 1201 of the first heat-conducting part 121 is in contact with the first cavity wall 10211, and the first circumferential surface 1204 of the first heat-conducting part 121 is in contact with the first side cavity wall 10214.

[0110] A backfill component adapted to the mounting cavity is prepared and bonded to the mounting cavity using an adhesive, including a resin adhesive. The surface of the backfill component opposite to the second surface 1202 of the first heat-conducting part 121 forms the second cavity wall 10212 of the first receiving cavity 1021. This achieves the assembly of the heat-conducting component 12 and the circuit board body 11.

[0111] In some embodiments, the circuit board body 11 may include multiple substrates stacked together. The receiving groove 101 may be formed by slotting on different layers of substrates, and the receiving cavity 102 may be formed by opening on different layers of substrates. For example, the circuit board body 11 is divided into a first substrate, a second substrate, and a third substrate. A first receiving cavity 1021 adapted to the first heat-conducting part 121 is processed on the first substrate. A second receiving cavity 1022 adapted to the second heat-conducting part 122 and the receiving groove 101 are processed on the second substrate. The third substrate does not require processing. The first heat-conducting part 121 is placed in the first receiving cavity 1021 of the first substrate by embedding, and the second heat-conducting part 122 is placed in the second receiving cavity 1022 of the second substrate. The first substrate and the second substrate are then pressed together, thereby bringing the second heat-conducting part 122 into contact with the first heat-conducting part 121. Then, the third substrate is pressed together with the first substrate and the second substrate, thereby completing the installation of the circuit board body 11 and the heat-conducting component 12. The first receiving cavity 1021 and the second receiving cavity 1022 are respectively processed on the first substrate and the second substrate, which facilitates the processing and preparation. The first heat-conducting part 121 and the second heat-conducting part 122 are respectively embedded into the first substrate and the second substrate before being pressed together, which facilitates the preparation and installation of the heat-conducting component 12. It is understood that the first substrate may include multiple first sub-substrates, which are stacked and pressed together to form the first substrate; the second substrate may include multiple second sub-substrates, which are stacked and pressed together to form the second substrate.

[0112] The installation process of the heat-conducting component 12 will be described below using another embodiment.

[0113] like Figure 6 As shown, the heat-conducting component 12 includes a first heat-conducting part 121 and a second heat-conducting part 122. The first heat-conducting part 121 and the second heat-conducting part 122 can be integrally formed. The first heat-conducting part 121 includes a first heat-conducting block 1211 and a second heat-conducting block 1212. The first heat-conducting block 1211 and the second heat-conducting block 1212 can be integrally formed.

[0114] A mounting cavity is machined on one side of the second surface 112 of the circuit board body 11, and a first receiving cavity 1021 and a second receiving cavity 1022 are further machined. The first receiving cavity 1021 includes a first sub-receiving cavity, a second sub-receiving cavity, and a third sub-receiving cavity that are interconnected. The first receiving cavity 1021 includes a first cavity wall surface 10211, a third cavity wall surface 10213, a second cavity wall surface 10212, a first side cavity wall surface 10214, a second side cavity wall surface 10215, and a third side cavity wall surface 10216. The second receiving cavity 1022 includes a fourth cavity wall surface 10221 and a fifth cavity wall surface 10222. The distance between the first cavity wall surface 10211 and the bottom surface 1011 of the receiving groove 101 is a first distance, which is less than or equal to 0.1 mm. The distance between the fourth cavity wall surface 10221 and the side groove wall surface 1012 of the receiving groove 101 is a second distance, which is less than or equal to 0.1 mm.

[0115] The heat-conducting component 12 is installed from the mounting cavity of the circuit board body 11. After the heat-conducting component 12 is installed in place, the second heat-conducting part 122 is located in the second receiving cavity 1022, one first heat-conducting block 1211 is located in the first sub-receiving cavity, another first heat-conducting block 1211 is located in the second sub-receiving cavity, and the second heat-conducting block 1212 is located in the third sub-receiving cavity. The first surface 1201 of the first heat-conducting part 121 is in contact with the first cavity wall surface 10211, the third surface 1203 is in contact with the third cavity wall surface 10213, the first circumferential surface 1204 is in contact with the first side cavity wall surface 10214, the second circumferential surface 1205 is in contact with the second side cavity wall surface 10215, and the third circumferential surface 1206 is in contact with the third side cavity wall surface 10216. The fourth circumferential surface 1207 of the second heat-conducting part 122 is in contact with the fourth cavity wall surface 10221, and the fifth circumferential surface 1208 is in contact with the fifth cavity wall surface 10222. The end face 1209 of the second heat-conducting part 122 may be coplanar with the first surface 111.

[0116] A backfill component adapted to the mounting cavity is prepared and bonded to the mounting cavity using an adhesive, including a resin adhesive. The surface of the backfill component opposite to the second surface 1202 of the first heat-conducting part 121 forms the second cavity wall 10212 of the first receiving cavity 1021. This achieves the assembly of the heat-conducting component 12 and the circuit board body 11.

[0117] In embodiments of this disclosure, the surfaces of the heat-conducting element 12 other than the end face 1209 are exposed beyond the first surface 111 of the circuit board body 11.

[0118] In some embodiments, the second surface 1202 of the heat-conducting element 12 can be exposed from the second surface 112 of the circuit board body 11, that is, the first receiving cavity 1021 can communicate with the second surface 112 of the circuit board body 11, and the second surface 1202 of the heat-conducting element 12 can be located in the same plane as the second surface 112. The heat of the chip 20 is conducted to the first heat-conducting part 121, and can be conducted to the external environment on the side where the second surface 112 is located through the first heat-conducting part 121, or to the external environment on the side where the first surface 111 is located through the second heat-conducting part 122, which increases the heat conduction path and helps to further improve the heat dissipation efficiency of the chip 20.

[0119] In some embodiments, the first circumferential surface 1204 of the heat-conducting element 12 may be exposed from the side surface 113 of the circuit board body, that is, the first receiving cavity 1021 may be in communication with the side surface 113 of the circuit board body. The heat of the chip 20 is conducted to the first heat-conducting part 121, and can be conducted to the external environment on the side of the circuit board body where the side surface 113 is located through the first heat-conducting part 121, or it can be conducted to the external environment on the side of the first surface 111 through the second heat-conducting part 122, which increases the heat conduction path and helps to further improve the heat dissipation efficiency of the chip 20.

[0120] In the embodiments of this disclosure, other surfaces of the heat-conducting element 12 other than the end face 1209 can be exposed from other surfaces of the circuit board body 11 other than the first surface 111, which increases the heat conduction path and helps to further improve the heat dissipation efficiency of the chip 20.

[0121] In embodiments of this disclosure, such as Figure 1 and Figure 4 As shown, the circuit board 10 also includes a heat sink 13, which is disposed on the first surface 111 of the circuit board body 11. At least a portion of the heat conductor 12 is in contact with the heat sink 13, and at least a portion of the heat sink 13 is disposed opposite to the chip 20.

[0122] The heat sink 13 is made of any one or more combinations of copper, aluminum, silicone grease and thermal adhesive.

[0123] In some embodiments, the heat sink 13 can be made of copper plate, copper alloy plate, aluminum plate, aluminum alloy plate, etc. For example, the heat sink 13 is made of copper plate, which is fixed to the first surface 111 of the circuit board body 11. The projection area of ​​the copper plate on the first surface 111 can cover the chip 20 and the second heat-conducting part 122. The heat on the top of the chip 20 can be dissipated to the external environment through the copper plate, and the heat conducted to the second heat-conducting part 122 can be dissipated to the external environment through the copper plate, which helps to further improve the heat dissipation efficiency of the chip 20.

[0124] In some embodiments, the heat sink 13 can be made of silicone grease. By applying silicone grease to the first surface 111 of the circuit board body 11, the top surface of the chip 20, and the end face 1209 of the heat conductor 12, the silicone grease can quickly dissipate the heat of the circuit board body 11, the chip 20, and the heat conductor 12 to the external environment, which is beneficial to further improve the heat dissipation efficiency of the chip 20.

[0125] In some embodiments, the heat sink 13 can be made of thermally conductive adhesive. By applying thermally conductive adhesive to the first surface 111 of the circuit board body 11, the top surface of the chip 20, and the end face 1209 of the thermally conductive component 12, the thermally conductive adhesive can quickly dissipate the heat from the circuit board body 11, the chip 20, and the thermally conductive component 12 to the external environment, which is beneficial to further improve the heat dissipation efficiency of the chip 20.

[0126] In the embodiments of this disclosure, the heat sink 13 is disposed on the first surface 111 of the circuit board body 11, at least a portion of the heat conductor 12 is in contact with the heat sink 13, and at least a portion of the heat sink 13 is disposed opposite to the top surface of the chip 20. The heat conductor 12 increases the heat conduction speed at the bottom of the chip 20, and the heat sink 13 increases the heat conduction speed at the top surface of the chip 20 and the heat conduction speed at the end face 1209 of the heat conductor 12. The combination of the heat conductor 12 and the heat sink 13 is beneficial to further improve the heat dissipation efficiency of the chip 20.

[0127] This disclosure also provides an electronic device, which includes a circuit board 10, a circuit board body 11, and a heat-conducting element 12. The circuit board body 11 has a receiving groove 101 formed on a first surface 111 for receiving a chip 20, and the bottom surface 1011 of the receiving groove 101 is disposed opposite to the chip 20. The heat-conducting element 12 is embedded in the circuit board body 11, at least a portion of the heat-conducting element 12 is disposed opposite to the bottom surface 1011 of the receiving groove 101, and the end face 1209 of the heat-conducting element 12 is exposed from the first surface 111.

[0128] The structure of circuit board 10 is as described above. Circuit board 10 is used in electronic devices, which may include mobile phones, electronic watches, laptops, etc.

[0129] The circuit board body 11 is provided with a receiving groove 101, and a heat-conducting component 12 is embedded in the circuit board body 11. At least a portion of the heat-conducting component 12 is disposed opposite to the bottom surface 1011 of the receiving groove 101. The end face 1209 of the heat-conducting component 12 is exposed from the first surface 111. The chip 20 is installed in the receiving groove 101. The heat at the bottom of the chip 20 can be conducted to the external environment of the circuit board body 11 through the heat-conducting component 12, and the heat at the top of the chip 20 can be directly dissipated to the external environment of the circuit board body 11. The built-in heat-conducting component 12 increases the heat conduction path and effectively improves the heat dissipation efficiency of the chip 20.

[0130] In an electronic device with the aforementioned circuit board 10, the heat generated by the chip 20 can be quickly dissipated to the external environment through the heat-conducting component 12, ensuring the reliability of the chip 20's operation and thus contributing to ensuring the reliability of the electronic device's operation.

[0131] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0132] Although this disclosure has been shown and described with reference to specific exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made to this disclosure without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. Therefore, the scope of this disclosure should not be limited to the above embodiments, but should be defined not only by the appended claims, but also by their equivalents.

Claims

1. A circuit board, comprising: a circuit board body having a receiving slot formed in a first surface; the receiving slot is configured to receive a chip, a bottom surface of the receiving slot is configured to be opposite to the chip; a heat conducting member is embedded in the circuit board body, at least a portion of the heat conducting member is configured to be opposite to the bottom surface of the receiving slot, and an end surface of the heat conducting member is exposed by the first surface. 2.The circuit board according to claim 1, wherein: the circuit board body is provided with a receiving cavity, the receiving cavity is configured to surround the receiving slot, and the heat conducting member is configured to be disposed in the receiving cavity. 3.The circuit board according to claim 2, wherein: the receiving cavity comprises a first receiving cavity and at least one second receiving cavity, the first receiving cavity is formed in an inner portion of the circuit board body and is configured to be opposite to the bottom surface of the receiving slot, and the at least one second receiving cavity is configured to surround the receiving slot along a circumferential direction of the receiving slot and is formed in the first surface of the circuit board body; the heat conducting member comprises: a first heat conducting portion located in the first receiving cavity; and a second heat conducting portion located in the second receiving cavity, and at least a portion of the first heat conducting portion is configured to be in contact with the second heat conducting portion. 4.The circuit board according to claim 3, wherein: the first receiving cavity is spaced apart from the bottom surface of the receiving slot, and a distance between the first receiving cavity and the bottom surface of the receiving slot is less than or equal to 0.1 mm; the second receiving cavity is spaced apart from a side wall surface of the receiving slot, and a distance between the second receiving cavity and the side wall surface of the receiving slot is less than or equal to 0.1 mm. 5.The circuit board according to claim 3, wherein: the first receiving cavity is spaced apart from the bottom surface of the receiving slot, a distance between a first section of the first receiving cavity and the bottom surface of the receiving slot is less than or equal to 0.1 mm, and a second section of the first receiving cavity is provided with a circuit area between the second section and the bottom surface of the receiving slot, and the circuit area is configured to accommodate a signal line; the first heat conducting portion comprises: a first heat conducting block embedded in the first section of the first receiving cavity; and a second heat conducting block embedded in the second section of the first receiving cavity. 6.The circuit board according to claim 3, wherein a cavity radius of the first receiving cavity near a side of the chip is less than a cavity radius of the first receiving cavity away from the side of the chip. 7.The circuit board according to any one of claims 1-6, wherein a surface of the heat conducting member other than the end surface is exposed by a surface of the circuit board body other than the first surface. 8.The circuit board according to any one of claims 1-6, further comprising: a heat dissipation member configured to be disposed on the first surface of the circuit board body; at least a portion of the heat conducting member is configured to be in contact with the heat dissipation member; at least a portion of the heat dissipation member is configured to be opposite to the chip. 9.The circuit board according to claim 8, wherein: a material of the heat conducting member comprises any one or a combination of a copper material, a copper alloy material, an aluminum material, and an aluminum alloy material; a material of the heat dissipation member comprises any one or a combination of a copper material, an aluminum material, a silicone grease material, and a heat conducting adhesive material.

10. An electronic device comprising: a circuit board, comprising: The circuit board body has a receiving groove opened in the first surface; the receiving groove is used for receiving a chip, and a groove bottom surface of the receiving groove is arranged opposite to the chip; The heat-conducting member is embedded in the circuit board body, at least part of the heat-conducting member is arranged opposite to the groove bottom surface of the receiving groove, and an end surface of the heat-conducting member is exposed by the first surface.

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