Circuit board and electronic device

Abstract

The invention relates to a circuit board and an electronic device, the circuit board comprises a board body and a crimping connector, a conductive hole and a wiring layer are formed in the board body, the wiring layer is electrically connected with a metal hole wall of the conductive hole, the crimping connector is inserted in the conductive hole and is electrically connected with the wiring layer through the conductive hole, the conductive hole comprises an upper segment hole, a middle segment hole and a lower segment hole, and the upper segment hole is communicated with the middle segment hole. The upper-section hole is close to the upper end face of the plate body, the lower-section hole is close to the lower end face of the plate body, the middle-section hole is located between the upper-section hole and the lower-section hole, and at least part of the upper-section hole is not internally provided with a metal hole wall. According to the technical scheme, as at least part of the upper section hole is not internally provided with a metal hole wall, the length of the stub at the lower end of the conductive hole is equivalently shortened, or the stub which is originally positioned in the upper section hole and does not play a role in electrically connecting with the crimping connector is completely removed, so that the influence of the stub on signal transmission is eliminated or remarkably reduced, and the signal transmission efficiency is improved. The reflection and distortion of the signal are reduced, and the transmission quality of the signal is ensured.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board technology, and more specifically, to a circuit board and electronic device. Background Technology

[0002] The electrical connection between a crimp connector and the conductive vias of a printed circuit board (PCB) is a crucial step in enabling signal transmission. However, the design of crimp connectors often results in them only making electrical contact with a portion of the via wall, rather than completely covering it. When the crimp connector does not fully contact the via wall, the uncrimped portion may form "stubs" at both ends of the via. These stubs act as tiny impedance mismatch points, causing signal reflection and distortion, thus severely impacting signal quality and transmission rate. Summary of the Invention

[0003] The purpose of this disclosure is to provide a circuit board and electronic device to at least partially solve the technical problems existing in the related art.

[0004] To achieve the above objectives, according to a first aspect of this disclosure, a circuit board is provided, comprising: A plate body, wherein conductive holes and a wiring layer are formed within the plate body, and the wiring layer is electrically connected to the metal hole wall of the conductive holes; A crimp connector is inserted into the conductive hole and electrically connected to the wiring layer through the conductive hole; The conductive hole includes an upper section hole, a middle section hole, and a lower section hole. The upper section hole is located near the upper end face of the plate, the lower section hole is located near the lower end face of the plate, and the middle section hole is located between the upper section hole and the lower section hole. At least part of the upper section hole does not have a metal hole wall inside.

[0005] In the embodiments provided in this disclosure, at least a portion of the lower section hole does not have a metal hole wall inside.

[0006] In the embodiments provided in this disclosure, the crimp connector includes an elastically deformable portion, a root portion, and a pin portion, wherein the elastically deformable portion is connected between the root portion and the pin portion; The crimp connector is inserted into the conductive hole, with the root portion located in the upper hole, the elastic deformation portion located in the middle hole, and the pin portion located in the lower hole.

[0007] In the embodiments provided in this disclosure, the difference between the inner diameter of the upper section hole formed on the upper end face of the plate and the inner diameter of the middle section hole is greater than the wall thickness of the metal hole wall of the conductive hole. The difference between the inner diameter of the lower section hole formed on the lower end face of the plate and the inner diameter of the middle section hole is greater than the wall thickness of the metal hole wall of the conductive hole.

[0008] In the embodiments provided in this disclosure, the wiring layer is located in the area where the upper section hole is located, and the depth of the upper section hole is less than the distance between the upper end face of the board and the wiring layer; The depth of the lower section hole is less than or equal to the distance between the lower end face of the plate and the elastic deformation part.

[0009] In the embodiments provided in this disclosure, the wiring layer is located in the region where the middle section hole is located, and the depth of the upper section hole is less than or equal to the distance between the upper end face of the plate and the elastic deformation part; The depth of the lower section hole is less than or equal to the distance between the lower end face of the plate and the elastic deformation part.

[0010] In the embodiments provided in this disclosure, the wiring layer is located in the area where the lower section hole is located, and the depth of the lower section hole is less than the distance between the lower end face of the board and the wiring layer; The depth of the upper hole is less than or equal to the distance between the upper end face of the plate and the elastic deformation part.

[0011] In the embodiments provided in this disclosure, the lower section hole is formed as a flared hole along the direction from the upper end face of the plate to the lower end face of the plate. Along the direction from the lower end face of the plate to the upper end face of the plate, the upper section hole is formed as a flared hole.

[0012] In the embodiments provided in this disclosure, at least one of the upper section hole and the lower section hole is formed as a cylindrical conical hole; and / or, At least one of the upper section hole and the lower section hole is formed as a stepped hole.

[0013] According to a second aspect of this disclosure, an electronic device is provided, comprising the circuit board as described above.

[0014] By employing the above technical solution, since at least part of the upper section hole does not have a metal hole wall, it is equivalent to shortening the length of the residual post at the lower end of the conductive hole, or completely removing the residual post that was originally located in the upper section hole and did not play a role in electrical connection with the crimp connector. This eliminates or significantly reduces the influence of the residual post on signal transmission, reduces signal reflection and distortion, and ensures the quality of signal transmission.

[0015] Furthermore, since at least part of the upper section hole does not have a metal hole wall, the hole diameter of the upper section hole can be increased. In this way, when the above-mentioned crimp connector is inserted into the conductive hole, the phenomenon of the crimp connector hitting the metal hole wall and causing pin failure or damage to the pin can be avoided to a certain extent, thereby improving the production yield.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a cross-sectional view of a circuit board provided in an exemplary embodiment of the present disclosure, wherein the wiring layer is located in the middle section hole, and at this time, the portion of the metal hole wall located in the upper section hole and the portion of the metal hole wall located in the lower section hole of the wiring layer are removed. Figure 2 This is a cross-sectional view of a circuit board provided in an exemplary embodiment of the present disclosure, wherein the wiring layer is located in the upper hole, and at this time, the portion of the metal hole wall located in the upper hole and the portion of the metal hole wall located in the lower hole are removed. Figure 3 This is a cross-sectional view of a circuit board provided in an exemplary embodiment of the present disclosure, wherein the wiring layer is located in the lower hole, and at this time, the portion of the metal hole wall located in the upper hole and the portion of the metal hole wall located in the lower hole are removed. Figure 4 This is a cross-sectional view of a circuit board provided in another exemplary embodiment of this disclosure (and...). Figure 1 The process for removing the metal hole wall is different in the middle section of the hole. In this case, the wiring layer is located in the middle section of the hole. At this time, the metal hole wall located in the upper section of the hole and the metal hole wall located in the lower section of the hole are removed. Figure 5 This is a cross-sectional view of a circuit board provided in another exemplary embodiment of this disclosure, wherein only a portion of the metal hole wall located within the upper hole has been removed.

[0018] Explanation of reference numerals in the attached figures 100-Circuit board; 1-Board body; 10-Conductive hole; 11-Upper section hole; 12-Middle section hole; 13-Lower section hole; 20-Wiring layer; 30-Metal hole wall; 40-Crimp connector; 41-Elastic deformation part; 42-Root part; 43-Pin part. Detailed Implementation

[0019] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0020] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of a specific structure; directional terms such as "upper" and "lower" can be used to refer to... Figures 1 to 5 As shown; the terms used, such as "first" and "second", are only used to distinguish one element from another and do not indicate any order or importance.

[0021] Furthermore, "comprising" and its variations are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". Definitions of other terms will be given in the following description.

[0022] The terms “a” and “a plurality” used in this disclosure are illustrative and not restrictive, and those skilled in the art should understand that they should be understood as “one or more” unless otherwise expressly indicated in the context.

[0023] In this disclosure, directional terms are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or a specific orientation structure and operation, and therefore should not be construed as a limitation of this disclosure, which is not limited in this respect.

[0024] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connect," "link," and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0025] In related technologies, during the process of achieving electrical connection through crimp connectors, the crimp connector often only forms electrical contact with a portion of the conductive hole wall, rather than completely covering it. In this case, when the crimp connector does not fully contact the conductive hole wall, the uncrimped portion may form "stubs" at both ends of the conductive hole. These stubs, like tiny impedance mismatch points, can cause signal reflection and distortion, thus severely affecting signal quality and transmission rate.

[0026] Based on this, refer to Figures 1 to 5As shown, according to a first aspect of this disclosure, a circuit board 100 is provided, including a board body 1 and a crimp connector 40. A conductive hole 10 and a wiring layer 20 are formed in the board body 1. The wiring layer 20 is electrically connected to the metal hole wall 30 of the conductive hole 10. The crimp connector 40 is inserted into the conductive hole 10 and is electrically connected to the wiring layer 20 through the conductive hole 10. The conductive hole 10 includes an upper hole 11, a middle hole 12 and a lower hole 13. The upper hole 11 is disposed near the upper end face of the board body 1, the lower hole 13 is disposed near the lower end face of the board body 1, and the middle hole 12 is located between the upper hole 11 and the lower hole 13. At least a portion of the upper hole 11 does not have a metal hole wall 30 inside.

[0027] By using the above technical solution, since at least part of the upper hole 11 does not have a metal hole wall 30 inside, it is equivalent to shortening the length of the residual post at the lower end of the conductive hole 10, or completely removing the part of the residual post that was originally located in the upper hole 11 and did not play a role in electrical connection with the crimp connector 40, thereby eliminating or significantly reducing the influence of the residual post on signal transmission, reducing signal reflection and distortion, and ensuring the quality of signal transmission.

[0028] Furthermore, since at least part of the upper hole 11 does not have a metal hole wall 30 inside, the hole diameter of the upper hole 11 can be increased. In this way, during the process of inserting the crimp connector 40 into the conductive hole 10, the phenomenon of the crimp connector 40 hitting the metal hole wall 30 and causing pin failure or damage to the pins can be avoided to a certain extent, thereby improving the production yield.

[0029] To facilitate understanding of this solution, the following is provided: Figures 1 to 5 As shown in the figure, area A is the length of the upper hole 11 in the vertical direction, area B is the length of the middle hole 12 in the vertical direction, and area C is the length of the lower hole 13 in the vertical direction.

[0030] Similarly, in the embodiments provided in this disclosure, at least a portion of the lower section hole 13 is not provided with a metal hole wall 30 along the direction from the lower end face of the plate 1 to the upper end face of the plate 1. That is to say, at least a portion of the metal hole wall 30 located in the lower section hole 13 can also be removed or peeled off, so that the residual posts at both ends of the conductive hole 10 are reduced simultaneously, which can greatly reduce the impedance mismatch. Furthermore, the dual reduction of signal reflection and distortion makes the signal transmission on the circuit board 100 more stable and reliable.

[0031] It should be noted that, for the embodiment mentioned above in which at least some of the lower section holes 13 do not have metal hole walls 30 inside, the metal hole walls 30 can be removed along the direction from the lower end face of the plate 1 to the upper end face of the plate 1. The removal depth of the metal hole walls 30 should be such that it does not affect the electrical connection between the crimp connector 40 and the wiring hole. Similarly, for the embodiment mentioned above in which at least some of the upper section holes 11 do not have metal hole walls 30 inside, the metal hole walls 30 can be removed along the direction from the upper end face of the plate 1 to the lower end face of the plate 1. The removal depth of the metal hole walls 30 should be such that it does not affect the electrical connection between the crimp connector 40 and the wiring hole.

[0032] This disclosure does not limit the specific structure of the crimp connector 40 mentioned above. For example, in one exemplary embodiment provided in this disclosure, such as... Figures 1-5 As shown, the crimp connector 40 may include an elastic deformation portion 41, a root portion 42, and a pin portion 43. The elastic deformation portion 41 is connected between the root portion 42 and the pin portion 43. The crimp connector 40 is inserted into the conductive hole 10, with the root portion 42 located in the upper section hole 11, the elastic deformation portion 41 located in the middle section hole 12, and the pin portion 43 located in the lower section hole 13. Thus, after the crimp connector 40 is inserted into the conductive hole 10, the elastic deformation portion 41 is located in the middle section hole 12 and abuts against the metal hole wall 30 in the middle section hole 12, thereby achieving conductivity of the wiring layer 20 connected to the metal hole wall 30. Furthermore, since the crimp connector 40 achieves communication with the wiring layer 20 through the elastic deformation part 41 located in the middle section hole 12, the process of removing or peeling the metal hole wall 30 inside the lower section hole 13 and removing or peeling the metal hole wall 30 inside the upper section hole 11 mentioned in the above embodiment will not cause interference or interference to the connection between the elastic deformation part 41 and the wiring layer 20 through the metal hole wall 30 located in the middle section, thus ensuring high-speed and stable signal transmission.

[0033] To avoid the problem of unnecessary residual piles remaining at the upper and lower ends of the conductive hole 10 due to incomplete removal of the metal hole wall 30 or incomplete removal of the glass, in the embodiment provided in this disclosure, the difference between the inner diameter of the orifice of the upper section hole 11 formed on the upper end surface of the plate 1 and the inner diameter of the middle section hole 12 is greater than the wall thickness of the metal hole wall 30 of the conductive hole 10. In other words, during the removal or peeling of the metal hole wall 30 in the upper section hole 11, the thickness removed must be greater than the thickness of the metal hole wall 30, thereby ensuring that the metal hole wall 30 in this area is completely removed, avoiding the problem of residual piles remaining due to incomplete removal of the metal hole wall 30 and the presence of a certain thickness of metal hole wall 30 on the inner wall of the upper section hole 11.

[0034] refer to Figures 1 to 5As shown, the difference between the inner diameter of the lower section hole 13 formed on the lower end face of the plate 1 and the inner diameter of the middle section hole 12 is greater than the wall thickness of the metal hole wall 30 of the conductive hole 10. Similarly, the removal or stripping of the metal hole wall 30 within the lower section hole 13 is also carried out in the same manner, which will not be described in this disclosure.

[0035] In one embodiment provided in this disclosure, when removing or peeling off the metal hole wall 30 of the upper section hole 11 and the metal hole wall 30 of the lower section hole 13, the thickness removed can be greater than or equal to 4 mil. That is, the difference between the inner diameter of the through hole formed after removing the metal hole wall 30 and the upper section hole 11 or the lower section hole 13 is greater than or equal to 8 mil. In this way, it can be ensured that the metal hole wall 30 is completely removed without causing damage to other related structures within the plate 1 due to excessive removal.

[0036] The different positions of the wiring layer 20 will affect the connection effect between the crimp connector 40 and the wiring layer 20. In order to ensure that the removal of the metal hole wall 30 inside the upper hole 11 and the removal of the metal hole wall 30 inside the lower hole 13 does not affect the connection performance of the two, in the first exemplary embodiment provided in this disclosure, such as Figure 2 As shown, the wiring layer 20 is located in the area where the upper hole 11 is located, and the depth of the upper hole 11 is less than the distance between the upper end face of the board 1 and the wiring layer 20; the depth of the lower hole 13 is less than or equal to the distance between the lower end face of the board 1 and the elastic deformation part 41. Since the wiring layer 20 is located in the area where the upper hole 11 is located, there is a relatively large distance between the lower hole 13 and the wiring layer 20, which allows the metal hole wall 30 provided in the lower hole 13 to be removed or peeled off as much as possible. That is, the maximum length of the metal hole wall 30 that can be removed or peeled off is the length between the lower end face of the board 1 and the elastic deformation part 41. In other words, in the embodiment where the wiring layer 20 is located in the area where the upper hole 11 is located, the metal hole wall 30 in the lower hole 13 corresponding to the pin part 43 can be completely peeled off.

[0037] As for the metal hole wall 30 located in the upper hole 11, since the upper hole 11 is close to the wiring layer 20, when removing or peeling the metal hole wall 30 in the upper hole 11, a certain allowance S1 needs to be reserved, that is, the metal hole wall 30 in the upper hole 11 is not completely removed or peeled off, so as to avoid interference or disruption to the wiring layer 20 during the removal or peeling of the metal hole wall 30 in the upper hole 11.

[0038] In one exemplary embodiment provided in this disclosure, such as Figure 1 or Figure 4 As shown, the aforementioned margin S1 is less than 10 mil.

[0039] In the second exemplary embodiment provided in this disclosure, such as Figure 2 As shown, the wiring layer 20 is located in the area where the middle hole 12 is located. The depth of the upper hole 11 is less than or equal to the distance between the upper end face of the plate 1 and the elastic deformation part 41; the depth of the lower hole 13 is less than or equal to the distance between the lower end face of the plate 1 and the elastic deformation part 41. Since the wiring layer 20 is located in the area where the middle hole 12 is located, the upper hole 11 and the lower hole 13 are both relatively far from the wiring layer 20, which allows the metal hole wall 30 provided in the lower hole 13 to be removed or peeled off as much as possible. That is, the maximum length of the metal hole wall 30 that can be removed or peeled off is the length between the lower end face of the plate 1 and the elastic deformation part 41. In other words, in the embodiment where the wiring layer 20 is located in the area where the upper hole 11 is located, the metal hole wall 30 in the lower hole 13 corresponding to the pin part 43 can be completely peeled off.

[0040] In the third exemplary embodiment provided in this disclosure, the wiring layer 20 is located in the region where the lower section hole 13 is located. The depth of the lower section hole 13 is less than the distance between the lower end face of the plate 1 and the wiring layer 20, and the depth of the upper section hole 11 is less than or equal to the distance between the upper end face of the plate 1 and the elastic deformation portion 41. Since the wiring layer 20 is located in the region where the lower section hole 13 is located, there is a relatively large distance between the upper section hole 11 and the wiring layer 20, which allows the metal hole wall 30 provided in the upper section hole 11 to be removed or peeled off as much as possible. That is, the maximum length of the metal hole wall 30 that can be removed or peeled off is the length between the upper end face of the plate 1 and the elastic deformation portion 41. In other words, in the embodiment where the wiring layer 20 is located in the region where the lower section hole 13 is located, the metal hole wall 30 in the upper section hole 11 corresponding to the root portion 42 can be completely peeled off.

[0041] As for the metal hole wall 30 located within the lower section hole 13, such as Figure 3 As shown, since the lower hole 13 is close to the wiring layer 20, when removing or peeling the metal hole wall 30 in the lower hole 13, a certain margin S2 needs to be reserved, that is, the metal hole wall 30 in the lower hole 13 is not completely removed or peeled off, so as to avoid interference or disruption to the wiring layer 20 during the removal or peeling of the metal hole wall 30 in the lower hole 13.

[0042] In one exemplary embodiment provided in this disclosure, the aforementioned margin S2 is less than 10 mil.

[0043] In the embodiments provided in this disclosure, such as Figures 1 to 5As shown, along the direction from the upper end face of the plate 1 to the lower end face of the plate 1, the lower section hole 13 is formed as a flared hole, and along the direction from the lower end face of the plate 1 to the upper end face of the plate 1, the upper section hole 11 can be formed as a flared hole. Thus, during the process of inserting the crimp connector 40 from top to bottom into the conductive hole 10, since the upper section hole 11 is formed as a flared hole, on the one hand, this flared hole can provide more space for the insertion of the crimp connector 40, facilitating the alignment operation between the crimp connector 40 and the conductive hole 10 by the operator; on the other hand, after the crimp connector 40 is inserted into the conductive hole 10, the hole wall of the upper section hole 11 can also guide and position the downward movement of the crimp connector 40, achieving automatic alignment of the pin portion 43 of the crimp connector 40 with the center of the hole diameter of the conductive hole 10, thereby improving insertion efficiency and accuracy, and to a certain extent preventing the crimp connector 40 from buckling or damaging the pin portion 43 / metal hole wall 30.

[0044] Furthermore, since the lower section hole 13 is formed as a flared hole, when the crimp connector 40 is inserted close to the bottom of the conductive hole 10, the flared part can prevent the connector end from violently colliding with or getting stuck with the hole wall, so that the connector can smoothly reach the predetermined position and ensure the continuity of the insertion process.

[0045] Furthermore, the flared design of the upper section hole 11 and the lower section hole 13 allows the contact area between the crimp connector 40 and the hole wall to gradually increase during insertion, avoiding the large frictional force generated by sudden large-area contact. This not only reduces the force required for insertion and lowers the labor intensity of operators, but also further prevents damage to the crimp connector 40 and the metal hole wall 30 of the conductive hole 10 caused by excessive friction.

[0046] refer to Figures 1-3 as well as Figure 5 As shown, in one exemplary embodiment provided in this disclosure, at least one of the upper section hole 11 and the lower section hole 13 can be formed as a cylindrical conical hole. In the above scheme, it can be understood that the upper section hole 11 is formed as a cylindrical conical hole, while the lower section hole 13 is formed as another type of flared hole; or, both the upper section hole 11 and the lower section hole 13 are formed as cylindrical conical holes.

[0047] In embodiments where at least one of the upper section hole 11 and the lower section hole 13 can be formed as a cylindrical conical hole, during the process of inserting the crimp connector 40 into the conductive hole 10 from top to bottom, the cylindrical conical hole acts as a natural guide, automatically guiding the crimp connector 40 to accurately enter the conductive hole 10. Even if the crimp connector 40 has a certain positional deviation at the initial insertion, the inclined surface of the cylindrical conical hole will gradually correct it to the correct insertion path, greatly reducing the difficulty of insertion and improving the efficiency of insertion.

[0048] Similarly, when the lower section hole 13 is a cylindrical conical hole and the large diameter end is located on the lower end face of the plate 1, it can also play an auxiliary guiding role during the insertion process. Especially when the connector is about to be fully inserted to the bottom, it can avoid jamming or failure to insert into place due to slight deviation.

[0049] In another exemplary embodiment provided in this disclosure, such as Figure 4 As shown, at least one of the upper section hole 11 and the lower section hole 13 can be formed as a stepped hole. That is, the aforementioned stepped hole can be understood as the upper section hole 11 and / or the lower section hole 13 each including multiple through holes with different inner diameters, and when the stepped hole is cross-sectioned, the interior of the stepped hole forms a stepped structure.

[0050] It should be noted that this disclosure does not limit the specific shape of the upper hole 11 and the lower hole 13, as long as the inner diameter of the upper hole 11 and the lower hole 13 is larger than the inner diameter of the middle hole, so as to peel off or remove at least part of the metal hole wall 30 originally attached to the inner wall of the upper hole 11 and the lower hole 13.

[0051] In the process of peeling or removing at least a portion of the metal hole wall 30 on the inner wall of the upper hole 11 and the lower hole 13 mentioned above, in an exemplary embodiment provided in this disclosure, a back drilling process can be used to remove the metal hole wall 30.

[0052] In the embodiment where the metal hole wall 30 is removed by back drilling, the specific shapes of the upper hole 11 and the lower hole 13 formed depend on the shape of the drill bit used in the back drilling process, and this disclosure does not impose any limitations on them.

[0053] Alternatively, in another exemplary embodiment provided in this disclosure, during the manufacturing process of the circuit board 100, a metal hole wall 30 may be provided in at least a portion of the lower section hole 13, thereby avoiding the problem of increasing the residual pile of the conductive hole 10 due to the presence of the metal hole wall 30.

[0054] According to a second aspect of this disclosure, an electronic device is provided, comprising the circuit board 100 as described above. This electronic device possesses all the beneficial effects of the circuit board 100 described above, which will not be described further in this disclosure.

[0055] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0056] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0057] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A circuit board, characterized by, The circuit board comprises: a plate body, a conductive hole and a wiring layer are formed in the plate body, the wiring layer is electrically connected with a metal hole wall of the conductive hole; a crimping connector is inserted into the conductive hole and is electrically connected with the wiring layer through the conductive hole; the conductive hole comprises an upper section hole, a middle section hole and a lower section hole, the upper section hole is arranged close to an upper end surface of the plate body, the lower section hole is arranged close to a lower end surface of the plate body, and the middle section hole is located between the upper section hole and the lower section hole; at least part of the interior of the upper section hole is not provided with a metal hole wall.

2. The circuit board of claim 1, wherein at least part of the interior of the lower section hole is not provided with a metal hole wall.

3. The circuit board of claim 2, wherein, the crimping connector comprises an elastic deformation part, a root part and a pin part, the elastic deformation part is connected between the root part and the pin part; the crimping connector is inserted into the conductive hole, the root part is located in the upper section hole, the elastic deformation part is located in the middle section hole, and the pin part is located in the lower section hole.

4. The circuit board of claim 2, wherein a difference between an inner diameter of an orifice formed on the upper end surface of the plate body and an inner diameter of the middle section hole is greater than a wall thickness of the metal hole wall of the conductive hole; a difference between an inner diameter of an orifice formed on the lower end surface of the plate body and an inner diameter of the middle section hole is greater than a wall thickness of the metal hole wall of the conductive hole.

5. The circuit board of claim 3, wherein the wiring layer is located in a region where the upper section hole is located, a depth of the upper section hole is less than a distance between the upper end surface of the plate body and the wiring layer; a depth of the lower section hole is less than or equal to a distance between the lower end surface of the plate body and the elastic deformation part.

6. The circuit board of claim 3, wherein the wiring layer is located in a region where the middle section hole is located, a depth of the upper section hole is less than or equal to a distance between the upper end surface of the plate body and the elastic deformation part; a depth of the lower section hole is less than or equal to a distance between the lower end surface of the plate body and the elastic deformation part.

7. The circuit board of claim 3, wherein the wiring layer is located in a region where the lower section hole is located, a depth of the lower section hole is less than a distance between the lower end surface of the plate body and the wiring layer; a depth of the upper section hole is less than or equal to a distance between the upper end surface of the plate body and the elastic deformation part.

8. The circuit board according to any one of claims 2 to 7, characterized by the lower section hole is formed as a flared hole along a direction from the upper end surface of the plate body to the lower end surface of the plate body; the upper section hole is formed as a flared hole along a direction from the lower end surface of the plate body to the upper end surface of the plate body.

9. The circuit board according to any one of claims 2 to 7, characterized by at least one of the upper section hole and the lower section hole is formed as a cylindrical tapered hole; and / or at least one of the upper section hole and the lower section hole is formed as a stepped hole.

10. An electronic device, characterized by The circuit board comprises the circuit board according to any one of claims 1-9.

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