PCB processing equipment and PCB processing method

Abstract

The invention discloses PCB processing equipment and a PCB processing method, and relates to the field of PCB processing equipment.The PCB processing equipment comprises a vibration workbench; a to-be-machined PCB is fixed to the vibration workbench, and the vibration workbench is used for driving the PCB on the vibration workbench to vibrate in the first direction at the set amplitude and frequency in the machining process, so that periodic contact and separation are formed between the machining tool rotating at the high speed and the PCB, and machining of the PCB is achieved. In the embodiment, the vibration workbench drives the PCB on the vibration workbench to perform high-frequency vibration in the first direction through the amplitude and frequency set in the machining process, the complex structure of a traditional spindle vibration mode is simplified, the cost is reduced, and the problems that an existing PCB machining device adopts the spindle vibration mode and is complex in structure and high in cost are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB processing equipment, and particularly relates to a PCB processing equipment and a PCB processing method. BACKGROUND

[0002] With the rapid development of aerospace, medical, automobile and electronic industries, the number of layers of printed circuit boards (PCB boards) is increasing, the diameter of micro-holes is becoming smaller and smaller, and the quality requirements of micro-holes are becoming higher and higher. In the processing of PCB boards, the materials involved in micro-hole processing are mainly carbon fiber composite materials and other difficult-to-machine materials. These materials have poor machinability, and the aspect ratio of micro-holes is generally large, resulting in large drilling force, high drilling temperature and short service life of drill bits during drilling, and further leading to the decline of the processing precision of PCB boards.

[0003] In the prior art, in order to improve the processing precision of PCB boards, vibration is usually applied to the main shaft. However, this method needs to add a vibration device to the main shaft, which increases the complexity of the structure of the main shaft and the cost. SUMMARY

[0004] Therefore, the embodiments of the present application provide a PCB processing equipment and a PCB processing method to solve the technical problem of complex structure and high cost of the prior art PCB processing equipment using the main shaft vibration method.

[0005] To solve the above problems, the technical scheme adopted by the present application is as follows: In a first aspect, the embodiments of the present application provide a PCB processing equipment, which comprises a vibration workbench. The vibration workbench is fixed with a PCB board to be processed, and is used to drive the PCB board on the vibration workbench to vibrate in a first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, thereby realizing the processing of the PCB board.

[0006] Optionally, the vibration workbench comprises an ultrasonic vibration workbench, and the ultrasonic vibration workbench comprises a processing workbench and an ultrasonic vibration device. The ultrasonic vibration device is used to drive the PCB board on the processing workbench to vibrate in the first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, thereby realizing the processing of the PCB board.

[0007] Optionally, the frequency range of the ultrasonic vibration device is 20KHz-60KHz; and the ultrasonic vibration device comprises an ultrasonic transducer, an amplitude transformer and a resonant body. One end of the ultrasonic transducer is connected with one end of the amplitude transformer. The other end of the amplitude transformer is connected to one end of the resonator; The other end of the resonator is connected to the processing worktable.

[0008] Optionally, it includes at least one of the ultrasonic vibration devices, and the ultrasonic vibration devices are arranged in a uniform manner on the processing worktable.

[0009] Optionally, the PCB processing equipment further includes an ultrasonic generator for converting electrical energy into a high-frequency electrical signal that matches the ultrasonic transducer; The ultrasonic generator is connected to the ultrasonic transducer.

[0010] Optionally, the ultrasonic vibration device includes a pneumatic ultrasonic vibration device.

[0011] Optionally, the pneumatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, a first pneumatic bearing, a second pneumatic bearing, a third pneumatic bearing, a vibration rod, and an air-floating vibration plate disposed on the vibration rod. The bearing mounting cover is detachably connected to the bearing mounting base; The first gas static pressure bearing is installed in the bearing mounting cover; The second air static bearing and the third air static bearing are installed in the bearing mounting base; The vibrating rod is disposed in the accommodating cavity formed by the bearing mounting cover and the bearing mounting base, and is located at the axial center of the first air static bearing, the second air static bearing and the third air static bearing. The air-bearing vibration plate is located between the first air-static bearing and the second air-static bearing, and is used to drive the vibration rod to vibrate in the first direction, so that the vibration rod drives the PCB board on the processing worktable to vibrate in the first direction.

[0012] Optionally, the pneumatic ultrasonic vibration device further includes a silencer; The bearing mounting base has an outlet communicating with the accommodating chamber, and the silencer is located at the outlet.

[0013] Optionally, the PCB processing equipment further includes a spindle, a bed, a gantry system, and a moving platform; A passage is formed between the gantry system and the bed; The gantry system and / or the mobile platform are movably disposed on the bed along a third direction, and the mobile platform can drive the vibrating worktable to move in or out along the channel; The main shaft is movably disposed in the gantry system along the second direction, and the main shaft is also movable along the first direction; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

[0014] Optionally, the PCB processing equipment further includes a laser displacement sensor for detecting the actual amplitude and actual frequency of the processing worktable; The laser displacement sensor is located below the machining worktable.

[0015] Optionally, the PCB board may be manufactured using a process including drilling, milling, or cutting, and / or the PCB board may be a high aspect ratio PCB board, a multilayer PCB board, or a high-density interconnect PCB board.

[0016] In a second aspect, embodiments of the present invention provide a PCB processing method, applied to the PCB processing equipment described in the first aspect above, the method comprising: Obtain the PCB board processing parameters; Based on the processing parameters, the target vibration parameters corresponding to the processing of the PCB board are determined; According to the target vibration parameters, the vibration table is controlled to vibrate along the first direction, so as to drive the PCB board on the vibration table to vibrate in the first direction, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, so as to realize the processing of the PCB board.

[0017] Optionally, after obtaining the processing parameters of the PCB board, the method further includes: The spindle is controlled to move to a preset position above the vibrating worktable, and the spindle is controlled to rotate at high speed according to a preset speed, so as to drive the machining tool set on the spindle to rotate at high speed.

[0018] Optionally, after controlling the ultrasonic vibration table to vibrate along the first direction according to the target vibration parameters, the method further includes: Obtain the actual vibration parameters of the vibration worktable; The actual vibration parameters are compared with the target vibration parameters to obtain the comparison results; If the comparison result is a match, then the PCB board processing begins; If the comparison result is a mismatch, the control parameters are adjusted until the actual vibration parameters match the target vibration parameters.

[0019] Optionally, the target vibration parameters include amplitude and frequency, wherein the amplitude ranges from 1µm to 20µm and the frequency ranges from 2kHz to 40kHz.

[0020] Optionally, the processing parameters include at least one or more of the following parameters: PCB board parameters, which include PCB board type and inherent parameters of the PCB board; Machining type parameters, which include drilling parameters, milling parameters, milling parameters, or cutting parameters.

[0021] In one embodiment of the present invention, a PCB processing equipment includes a vibrating worktable. The vibrating worktable holds a PCB board to be processed and is used to drive the PCB board on the worktable to vibrate in a first direction with a set amplitude and frequency during processing. This causes periodic contact and separation between the high-speed rotating processing tool and the PCB board, thereby achieving the processing of the PCB board. In this embodiment, by using a vibrating worktable with a set amplitude and frequency during processing to drive the PCB board to vibrate at high frequency in a first direction, the complex structure of the traditional spindle vibration method is simplified, costs are reduced, and the problem of complex structure and high cost of existing PCB processing equipment using spindle vibration is solved. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a PCB processing device according to an embodiment of the present invention; Figure 2 This is a partial schematic diagram of a PCB processing equipment according to one embodiment of the present invention; Figure 3 This is a schematic diagram of an ultrasonic vibration device according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a pneumatic ultrasonic vibration device according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a partial installation of an ultrasonic vibration device according to an embodiment of the present invention; Figure 6 This is another schematic diagram of a partial installation of the ultrasonic vibration device in one embodiment of the present invention; Figure 7 This is a flowchart of a PCB processing method according to an embodiment of the present invention; Figure 8 This is another flowchart of a PCB processing method according to one embodiment of the present invention.

[0024] The accompanying figure is labeled as follows: 1. Spindle; 2. Ultrasonic vibration worktable; 21. Machining worktable; 22. Ultrasonic vibration device; 221. Ultrasonic transducer; 222. Amplitude transformer; 223. Resonator; 2211. Double-ended stud; 2212. Front end cap; 2213. Insulating sleeve; 2214. Electrode plate; 2215. Ceramic plate; 2216. Rear end cap; 2217. First screw; 224. Second screw; 23. Air static pressure ultrasonic vibration device; 231. Bearing mounting cover; 232. Bearing mounting base; 233. First air static pressure bearing; 234. Second air static pressure bearing; 235. Third air static pressure bearing; 236. Vibrating rod; 237. Air-floating vibrating plate; 238. Silencer; 239. Air circuit structure; 240. Third screw; 3. Mobile platform; 4. Beam base; 41. First base; 42. Second base; 5. Crossbeam; 6. Bed; 7. First motion assembly; 8. Second motion assembly; 9. Third motion assembly; 10. Ultrasonic generator; 11. Laser displacement sensor; 12. Control system; 13. PCB board; 14. Machining tool. Detailed Implementation

[0025] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0026] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] It should be noted that the PCB board to be protected by this invention is not limited to the PCB board itself. Structures similar to the PCB board, such as IC carrier boards and glass substrates, are also within the scope of protection claimed by this invention. To avoid redundancy, the following description mainly uses the PCB board as an example.

[0029] The first aspect provides a PCB processing device; please refer to [link / reference]. Figure 1 and Figure 2 The PCB processing equipment includes a vibrating worktable; the vibrating worktable has a fixed PCB board 13 to be processed, which is used to drive the PCB board 13 on the vibrating worktable to vibrate in the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool 14 and the PCB board 13 form periodic contact and separation, so as to realize the processing of the PCB board 13.

[0030] In some embodiments, the machining tool 14 can be connected to the output end of the spindle 1, and the vibrating table can be disposed below the spindle 1. The rotational speed of the spindle 1 can be between 50,000 rpm and 300,000 rpm. Preferably, the rotational speed of the spindle 1 can be 100,000 rpm, 150,000 rpm, 200,000 rpm, or 250,000 rpm. This is not a limitation. Therefore, when the spindle 1 rotates at high speed, it drives the machining tool 14 to rotate at high speed. Specifically, when processing the PCB board 13 using PCB processing equipment, by setting a vibrating table on the PCB processing equipment, the vibrating table drives the PCB board 13 on it to vibrate at high frequency in the first direction with a set amplitude and frequency during the processing. This simplifies the complex structure of the traditional spindle 1 vibration method, reduces costs, and solves the problem of complex structure and high cost of the existing PCB processing equipment using the spindle vibration method.

[0031] In practical applications, the preset amplitude range of the vibration table can be 1µm to 20µm, and the preset frequency range can be 100Hz to 80KHz. As an example, during the process of controlling the spindle 1 to drive the machining tool 14 to process the PCB board 13, the vibration table can be controlled to vibrate in the first direction at the set amplitude and frequency. This allows the machining tool 14 to rotate and feed, and due to the vibration of the vibration table, the PCB board 13 on the vibration table and the high-speed rotating machining tool 14 form a periodic contact and separation. Compared with the traditional continuous contact between the machining tool 14 and the PCB board 13, this greatly improves the machining accuracy and efficiency.

[0032] For example, during vibratory drilling, when the drill bit deviates during drilling, the vibration causes it to briefly retract and reposition itself, automatically eliminating the deviation and ensuring the drill bit can accurately re-drill into the target position. This improves the positioning accuracy of the hole, making vibratory drilling more precise and efficient than conventional drilling in PCB manufacturing. It demonstrates significant advantages, especially when machining difficult-to-machine materials such as high aspect ratio PCBs, multilayer PCBs, and high-density interconnect PCBs. Therefore, by using a vibratory table to drive the PCB board 13 to vibrate at high frequency in the first direction during processing, the effect of improving machining accuracy can also be achieved, simplifying the complex structure of the traditional spindle 1 vibration method and reducing costs.

[0033] Furthermore, the excellent chip-breaking performance generated by vibration facilitates smoother chip removal during machining, reducing chip scraping on the hole surface. The reciprocating pressing action of the machining tool 14 on the inner hole surface during vibration machining further reduces the surface roughness of the PCB board 13 and the surface quality of the hole walls, improving the machining quality of the PCB board 13. The intermittent action between the machining tool 14 and the PCB board 13 significantly reduces friction, ensuring that the machining tool 14 remains in a stable and normal wear stage with a very low cutting temperature, stable drill performance, and slow wear rate, thus extending the lifespan of the machining tool 14.

[0034] It should be understood that the aforementioned periodic contact and separation during the processing manifests as the number of times the processing tool 14 contacts and separates from the PCB board 13, determined by the vibration frequency of the ultrasonic vibration table 2. For example, one contact and separation cycle is completed every 50µs (1s / 20000 times). The amplitude determines the pressure exerted by the processing tool 14 on the PCB board 13 during each contact; the larger the amplitude, the stronger the contact force.

[0035] Furthermore, such as Figure 2As shown, the vibration worktable includes an ultrasonic vibration worktable 2, which includes a processing worktable 21 and an ultrasonic vibration device 22. The ultrasonic vibration device 22 is used to drive the PCB board 13 on the processing worktable 21 to vibrate in the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool 14 and the PCB board 13 form periodic contact and separation, so as to realize the processing of the PCB board 13.

[0036] As an example, the ultrasonic vibration device 22 applies vibration to the machining table 21 with a set amplitude and frequency during the machining process, thereby causing the PCB board 13 to make a small periodic displacement in the first direction. The amplitude and frequency can be adjusted according to the specific requirements of the machining to adapt to different types of machining tasks. For example, during drilling or milling, the amplitude range can be set between 1µm and 20µm, and the frequency range can be set between 20kHz and 40kHz; the specific values ​​are not limited. By vibrating with a specific amplitude and frequency, the cutting ability of the machining tool 14 can be effectively improved, and the machining accuracy of the PCB board 13 can be optimized.

[0037] In one embodiment, such as Figure 3 As shown, the frequency range of the ultrasonic vibration device 22 can be above 20KHz. Further, the frequency range of the ultrasonic vibration device 22 can be configured in the range of 20KHz to 60KHz. Preferably, it can be configured as 20KHz, 30KHz, or 40KHz. The ultrasonic vibration device 22 includes an ultrasonic transducer 221, an amplitude transformer 222, and a resonator 223. One end of the ultrasonic transducer 221 is connected to one end of the amplitude transformer 222. The other end of the amplitude transformer 222 is connected to one end of the resonator 223. The other end of the resonator 223 is connected to the processing worktable 21.

[0038] As an example, one end of the ultrasonic transducer 221 can be connected to one end of the amplitude transformer 222 via a thread or other means. The other end of the amplitude transformer 222 can also be connected to one end of the resonator 223 via a similar connection. The other end of the resonator 223 can be connected to the processing table 21 via a thread or welding to ensure that it does not shift during processing. During operation, the ultrasonic transducer 221 converts the high-frequency electrical signal sent by the ultrasonic generator 10 into ultrasonic vibrations. These vibrations are amplified by the amplitude transformer 222 and transmitted to the resonator 223, causing the resonator 223 to drive the processing table 21 to vibrate, further acting on the PCB board 13 to improve processing efficiency, reduce drilling force, and improve the surface roughness of the processed surface.

[0039] It should be noted that the amplitude transformer 222 in this embodiment can be a single-stage amplitude transformer or a multi-stage amplitude transformer. For example, an amplitude transformer composed of a first-stage amplitude transformer and a second-stage amplitude transformer connected in series can be selected according to the processing requirements. Here, no limitation is made.

[0040] Furthermore, such as Figure 3 As shown, the ultrasonic transducer 221 includes a double-ended stud 2211, a front end cap 2212, an insulating sleeve 2213, an electrode plate 2214, a ceramic plate 2215, a rear end cap 2216, and a first screw 2217. As an example, the front end cap 2212 and the rear end cap 2216 can be detachably connected together via threads or a snap-fit ​​device to form a receiving chamber. The first screw 2217 is disposed in the receiving chamber. One end of the double-ended stud 2211 is fixed to the front end cap 2212, and the other end of the double-ended stud 2211 extends out of the front end cap 2212 and is connected to one end of the amplitude transformer 222 via threads or a plug-in device. The ceramic plate 2215 and the electrode plate 2214 are sequentially sleeved on the first screw 2217 and located within the receiving chamber. To prevent direct contact between the first screw 2217 and the ceramic plate 2215 and electrode plate 2214, an insulating sleeve 2213 is fitted between the first screw 2217 and the ceramic plate 2215, as well as the electrode plate 2214, to reduce electrical interference and short circuits between the first screw 2217 and these components, thereby maintaining the stability and efficiency of the ultrasonic transducer 221. During operation, the high-frequency electrical signal transmitted by the ultrasonic generator 10 applies an AC voltage to the ceramic plate 2215 through the electrode plate 2214. Under the influence of the electric field, the ceramic plate 2215 undergoes a piezoelectric effect, i.e., its internal crystal structure undergoes mechanical deformation, generating high-frequency mechanical vibrations. These vibrations are transmitted to the amplitude transformer 222 through the other end of the double-ended stud 2211. The amplitude transformer 222 further amplifies these high-frequency vibrations and transmits them to the resonator 223, which in turn drives the machining table 21 and the PCB board 13 fixed on it to vibrate at the micron level. This causes the machining tool 14 to periodically contact and separate from the PCB board 13 during rotation and feeding, thereby optimizing the cutting effect and improving machining accuracy and efficiency.

[0041] As an example, the ultrasonic vibration devices 22 are evenly arranged above and / or below the processing worktable 21. Alternatively, the processing worktable 21 can be implemented using a honeycomb aluminum structure, in which case the ultrasonic vibration devices 22 can be evenly arranged inside the processing worktable 21. No specific limitation is made here. The technical solution that enables the PCB board 13 on the processing worktable 21 to vibrate in the first direction, so that the processing tool 14 and the PCB board 13 form periodic contact and separation, or the corresponding vibration fixture that enables the PCB board 13 to vibrate in the first direction, so that the processing tool 14 and the PCB board 13 form periodic contact and separation, are all within the scope of protection claimed in this application.

[0042] Preferably, taking the ultrasonic vibration devices 22 evenly arranged under the processing worktable 21 as an example, four identical ultrasonic vibration devices 22 can be used and symmetrically arranged under the processing worktable 21, for example, at the four corners of the processing worktable 21, so as to achieve uniform vibration distribution on the processing worktable 21 and ensure that the PCB board 13 can obtain uniform ultrasonic vibration during the processing.

[0043] It should be noted that the above is merely an example and does not constitute a limitation of this application. If the power of a single ultrasonic vibration device 22 is sufficient, only one ultrasonic vibration device 22 may be arranged directly below the machining table 21. It should be understood that in this case, a guide pillar structure needs to be added to enhance stability and avoid displacement or uneven vibration of the machining table 21 caused by vibration.

[0044] Furthermore, the PCB processing equipment also includes an ultrasonic generator 10 for converting electrical energy into a high-frequency electrical signal that matches the ultrasonic transducer 221; one end of the ultrasonic generator 10 is connected to the ultrasonic transducer 221, and the other end is connected to the control system 12.

[0045] In some embodiments, the ultrasonic generator 10 is responsible for converting the input electrical energy into a high-frequency electrical signal, which is then transmitted to the ultrasonic transducer 221 via a cable or other conductor. The ultrasonic generator 10 includes a signal generation module and a power amplification module. The signal generation module generates an electrical signal with the desired frequency, while the power amplification module amplifies these electrical signals to drive the ultrasonic transducer 221. This causes the ultrasonic transducer 221 to convert the high-frequency electrical signal into mechanical vibration, which in turn drives the processing table 21 to vibrate.

[0046] In one embodiment, the ultrasonic vibration device 22 includes a pneumatic ultrasonic vibration device 23. As an example, one end of the pneumatic ultrasonic vibration device 23 can be connected to the processing table 21 via a third screw 240, and the other end can be connected to the moving platform 3 via a flange. During operation, the pneumatic ultrasonic vibration device 23 drives the processing table 21 to perform micron-level ultrasonic vibration along a first direction, causing the processing tool 14 to periodically contact and separate from the PCB board 13, effectively reducing drilling force and temperature, and improving processing accuracy and quality. The input air pressure range of the pneumatic ultrasonic vibration device 23 can be configured to be 0.2MPa~0.8MPa, preferably 0.4MPa~0.6MPa, but no specific limitation is made.

[0047] Furthermore, such as Figure 4As shown, the air static pressure ultrasonic vibration device 23 includes a bearing mounting cover 231, a bearing mounting base 232, a first air static pressure bearing 233, a second air static pressure bearing 234, a third air static pressure bearing 235, a vibration rod 236, and an air-floating vibration plate 237 disposed on the vibration rod 236. The bearing mounting cover 231 is detachably connected to the bearing mounting base 232. The first air static pressure bearing 233 is installed in the bearing mounting cover 231, and the second air static pressure bearing 234 and the third air static pressure bearing 235 are installed in the bearing mounting base 232. In the base 232, the vibrating rod 236 is disposed in the accommodating cavity formed by the bearing mounting cover 231 and the bearing mounting base 232, and is located at the axial center of the first air static pressure bearing 233, the second air static pressure bearing 234 and the third air static pressure bearing 235. The air-floating vibrating plate 237 is located between the first air static pressure bearing 233 and the second air static pressure bearing 234, and is used to drive the vibrating rod 236 to vibrate in the first direction, so that the vibrating rod 236 drives the PCB board 13 on the processing worktable 21 to vibrate in the first direction.

[0048] In some embodiments, the bearing mounting cover 231 can be detachably connected to the bearing mounting base 232, for example, by bolts, snaps, or other suitable mechanical connections. The first gas static bearing 233 is fixed inside the bearing mounting cover 231, ensuring stable axial support for the vibrating rod 236; the second gas static bearing 234 and the third gas static bearing 235 are mounted on the bearing mounting base 232, further enhancing the vertical positioning accuracy and smooth movement of the vibrating rod 236. The vibrating rod 236 is disposed in the accommodating cavity formed by the bearing mounting cover 231 and the bearing mounting base 232, located at the axial center of the three gas static bearings, and can move freely along the first direction. The air-floating vibrating plate 237 is located between the first air static bearing 233 and the second air static bearing 234. When high-pressure air enters the air static ultrasonic vibration device 23 through the air passage structure 239, a very thin air film is formed between the vibrating rod 236 and the three air static bearings. This air film has sufficient rigidity and load-bearing capacity, so that the vibrating rod 236 is in a suspended state.

[0049] During operation, due to the difference in the number of air holes in the first air static bearing 233 and the second air static bearing 234, different pressure differences are generated on both sides of the air-bearing vibrating plate 237, thereby driving the air-bearing vibrating plate 237 to move axially towards the area of ​​lower pressure. As the sliding distance increases, the change in air film thickness causes the high and low pressure sides to interchange, thereby causing the air-bearing vibrating plate 237 to slide in the opposite direction, forming a reciprocating axial motion, which in turn drives the vibrating rod 236 to achieve high-frequency micro-vibration in the first direction. This vibration is transmitted to the PCB board 13 on the processing worktable 21 through the vibrating rod 236, so that the PCB board 13 periodically contacts and separates from the processing tool 14 during the processing, effectively reducing drilling force and cutting temperature, and improving processing accuracy.

[0050] Furthermore, the pneumatic ultrasonic vibration device 23 also includes a silencer 238; the bearing mounting base 232 is provided with an outlet communicating with the accommodating chamber, and the silencer 238 is located at the outlet.

[0051] In some embodiments, the silencer 238 can be fixed to the bearing mounting base 232 at the outlet communicating with the accommodating chamber by bolts, clamps, or flanges, etc., to reduce the noise generated by the pneumatic ultrasonic vibration device 23 during operation, thereby improving the comfort of the working environment and the quietness of the PCB processing equipment. The silencer 238 can be of various types, including but not limited to: perforated silencers, diffuser silencers, and reflective silencers.

[0052] In one embodiment, the PCB processing equipment further includes a spindle 1, a bed 6, a gantry system, and a moving platform 3.

[0053] In some embodiments, the spindle 1 includes a mechanical spindle or an electric spindle. As an example, a mechanical spindle may include a spindle body and a drive gear, with one end of the drive gear connected to one end of the spindle body and the other end connected to an external motor or transmission device to drive the rotation of the spindle body. An electric spindle may include a motor and a spindle body, with one end of the motor connected to one end of the spindle body so that the motor directly drives the rotation of the spindle body. It should be noted that the spindle 1 described above may also be a pneumatic hydrostatic ultrasonic electric spindle or a hydraulic hydrostatic ultrasonic electric spindle; the specific type is not limited in this invention.

[0054] Furthermore, the machining tool 14 is located at the output end of the spindle 1. As an example, the spindle 1 can be connected to the machining tool 14 via a dedicated connector, such as a tool holder, collet, or flange, to drive the machining tool 14 to rotate at high speed when the spindle 1 rotates, performing drilling or other machining tasks. This ensures that the high-speed rotation of the spindle 1 can be accurately and error-free transmitted to the machining tool 14, allowing it to machine the PCB board 13 at a stable speed and cutting force. The machining tool 14 can be replaced with different tools according to different PCB machining requirements, such as drilling, milling, or cutting tools.

[0055] Furthermore, the gantry system includes a beam base 4 and a beam 5 mounted on the beam base 4. Specifically, the beam base 4 includes a first base 41 and a second base 42 spaced apart. One end of the first base 41 and the second base 42 are connected to the beam 5 via fasteners or other means, thus forming the gantry system. This connection method allows the gantry system to be quickly disassembled and reassembled when movement or adjustment is required, improving the operational efficiency and flexibility of the PCB processing equipment. The beam 5 can be made of a rigid material, such as marble, steel, or aluminum alloy, to ensure it can withstand the weight of the spindle 1 and the load caused by its movement during processing, preventing deformation.

[0056] Furthermore, a channel is formed between the gantry system and the bed 6. As an example, one end of the first base 41 and the second base 42 can be connected to the crossbeam 5, and the other end can be connected to the bed 6, thereby forming a channel for the movement of the ultrasonic vibration worktable 2 between the first base 41 and the second base 42.

[0057] Furthermore, the gantry system and / or the moving platform 3 are movably mounted on the bed 6 along a third direction; that is, the gantry system is movably mounted on the bed 6 along a third direction, or the moving platform 3 is movably mounted on the bed 6 along a third direction, or the gantry system and the moving platform 3 are movably mounted on the bed 6 along a third direction. When the gantry system and / or the moving platform 3 moves, the moving platform 3 can drive the vibrating table to move into or out of the relative channel. If the gantry system moves, the moving platform 3 can drive the vibrating table through or through the channel to achieve movement into or out of the relative channel.

[0058] In some embodiments, the bed 6 serves as a supporting base, on which a gantry system and / or a moving platform 3 are movably mounted along a third direction. As an example, a third motion component 9 for moving along a third direction can be provided between the bed 6 and the moving platform 3. One end of the third motion component 9 is connected to the bed 6 via a threaded connection, pin connection, key connection, or quick-locking device, and the other end is also connected to the moving platform 3 via a threaded connection, pin connection, key connection, or quick-locking device. This allows the third motion component 9 to drive the moving platform 3 to move along a third direction, causing the moving platform 3 to move the ultrasonic vibration worktable 2 in or out of the channel, thereby moving the PCB board 13 in or out of the channel. This improves the automation level and efficiency of the PCB processing equipment. The gantry system can also be fixed to the bed 6 in the above manner to form a channel for moving the vibration worktable; however, this invention does not limit the specific details.

[0059] In some embodiments, the third motion component 9 may include a third linear motor, a third rolling guide rail, and a third slider. The third linear motor and the third rolling guide rail are mounted on the bed 6, and the third slider is disposed on the third rolling guide rail and connected to the moving platform 3 and the third linear motor. During operation, by controlling the third linear motor, it drives the third slider to move along the third rolling guide rail in a third direction, thereby driving the moving platform 3 to move in a third direction, thus moving the ultrasonic vibration worktable 2 into or out of the channel formed between the gantry system and the bed 6.

[0060] Furthermore, such as Figure 5 and Figure 6 As shown, the ultrasonic vibration device 22 is installed between the processing worktable 21 and the moving platform 3. As an example, one end of the ultrasonic vibration device 22 can be tightly connected to the processing worktable 21 via threads or slots to ensure effective transmission of vibration energy to the PCB board 13. The other end of the ultrasonic vibration device 22 is installed inside the moving platform 3 via a second screw 224 to facilitate adjustment of the distance between the processing worktable 21 and the moving platform 3. For example, the flange mounting hole on the moving platform 3 can be designed as a countersunk hole, allowing the flange of the ultrasonic transducer 221 to be installed inside the moving platform 3 via the second screw 224. This design not only facilitates the stable installation of the ultrasonic vibration device 22 but also allows for flexible adjustment of the position of the processing worktable 21 according to different processing requirements and workpiece sizes, thereby optimizing the ultrasonic vibration transmission effect and ensuring processing accuracy and efficiency. Simultaneously, the countersunk hole design makes the wiring of the ultrasonic vibration device 22 more convenient, which is beneficial for heat dissipation and subsequent maintenance.

[0061] Furthermore, the main shaft 1 is movably disposed in the gantry system along the second direction, and the main shaft 1 can move along the first direction.

[0062] As an example, a first motion component 7 for moving in a first direction and a second motion component 8 for moving in a second direction can be provided between the spindle 1 and the crossbeam 5. In this way, the spindle 1 is driven to move in the first direction by the first motion component 7, and the first motion component 7 is driven to move in the second direction by the second motion component 8, so that the first motion component 7 drives the spindle 1 to move in the second direction, thereby realizing the movement of the crossbeam 5 in the second direction.

[0063] Specifically, one end of the spindle 1 can be detachably connected to one end of the first motion component 7; the other end of the first motion component 7 can be detachably connected to one end of the second motion component 8; and the other end of the second motion component 8 can be detachably connected to the crossbeam 5. The first motion component 7 and the second motion component 8 can employ high-precision ball screws or linear guides to ensure smooth and precise movement when driving the spindle 1 along the first direction; however, no specific limitations are imposed here.

[0064] In some embodiments, the first motion component 7 may include a first linear motor, a first rolling guide rail, a first slider, and a base plate. The first linear motor and the first rolling guide rail are fixed to the front of the base plate. The first slider is disposed on the first rolling guide rail and connected to the first linear motor. The spindle 1 can be fixed to the first slider, or connected to the first slider via a spindle fixing assembly. During operation, by controlling the first linear motor, the first linear motor drives the first slider to move along the first rolling guide rail in a first direction, thereby driving the spindle 1 to move in the first direction. Preferably, the first rolling guide rail is made of a high-precision and low-friction material, such as marble, steel, or aluminum alloy, to ensure the smoothness and accuracy of the first slider's movement on the first rolling guide rail, effectively reducing vibration or friction that affects machining accuracy.

[0065] The second motion component 8 may include a second linear motor, a second rolling guide rail, and a second slider. As an example, the second linear motor and the second rolling guide rail can be mounted on the crossbeam 5, and the second slider can be mounted on the second rolling guide rail, connected to the back of the base plate and the second linear motor respectively. During operation, by controlling the second linear motor, the second linear motor drives the second slider to move along the second rolling guide rail in a second direction, thereby enabling the second motion component 8 to drive the first motion component 7, which in turn drives the spindle 1 to move in the second direction. Through this configuration, the spindle 1 can move not only in the first direction but also in the second direction, achieving omnidirectional, high-precision processing of the PCB board 13.

[0066] In summary, the first motion component 7 and the second motion component 8 drive the spindle 1 to perform precision machining in the first and second directions, respectively. After machining is completed, the third motion component 9 drives the moving platform 3 to move out along the third direction, causing the moving platform 3 to move the machining table 21 out of the machining area, thereby moving the PCB board 13 out of the machining area. This allows the operator to easily unload and reload the PCB board 13. The entire process improves the working efficiency and operational convenience of the PCB processing equipment.

[0067] In this design, the first, second, and third directions are all perpendicular to each other. Specifically, this perpendicularity ensures that the first motion component 7, the second motion component 8, and the third motion component 9 do not interfere with each other when working independently in their respective directions, thus achieving precise and stable motion control. For example, when the first motion component 7 drives the spindle 1 to move in the first direction, the second motion component 8 can simultaneously adjust its processing position in the second direction, while the third motion component 9 can flexibly adjust the movement of the worktable in the third direction. Through this design, the PCB processing equipment can be precisely positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0068] In one embodiment, such as Figure 1 As shown, the PCB processing equipment also includes a laser displacement sensor 11 for detecting the actual amplitude and frequency of the processing worktable 21. The laser displacement sensor 11 is located below the processing worktable 21 and connected to the control system 12. As an example, the laser displacement sensor 11 can be mounted on the moving platform 3 below the processing worktable 21 by screws or other means. It further measures the actual displacement of the surface of the processing worktable 21 by emitting a laser beam and receiving the reflected light signal, thereby determining the actual amplitude and frequency of the processing worktable 21. This enables real-time detection of the vibration state of the processing worktable 21 during processing, ensuring optimal coordination between the spindle 1 and the ultrasonic vibration worktable 2, thereby achieving high-precision, low-wear processing.

[0069] Furthermore, the laser displacement sensor 11 includes a laser emitter and a laser receiver. Specifically, the laser emitter emits a laser beam onto the surface of the machining table 21, and the laser beam is reflected after contacting the surface. The laser receiver receives these reflected light signals, and calculates the vibration of the machining table 21 based on the changes in the intensity and frequency of the reflected light, so as to ensure that the amplitude and frequency during the machining process meet the preset machining requirements.

[0070] In one embodiment, the processing type of PCB board 13 includes drilling, milling, or cutting.

[0071] As an example, drilling is a processing method that forms holes in a PCB board 13.

[0072] In some embodiments, when drilling the PCB board 13 via the spindle 1, the ultrasonic vibration table 2 drives the PCB board 13 to vibrate at a set amplitude and frequency in a first direction (e.g., a direction perpendicular to the surface of the PCB board 13). This vibration causes periodic contact and separation between the drill bit connected to the spindle 1 and the PCB board 13, effectively reducing cutting force, reducing cutting heat, and promoting timely chip removal.

[0073] During the drilling process, the ultrasonic vibration stage 2 drives the PCB board 13 to vibrate at high frequency. This not only ensures the accuracy of the drilling, namely the position, diameter, and depth of the hole, but also reduces cutting stress and thermal impact, protecting the integrity of the PCB board 13 and its surrounding circuit structure. Furthermore, it helps remove burrs and residues generated during drilling, improving the quality of the drilling.

[0074] A roulette wheel is a processing method that removes excess material from a PCB board 13 to form a specific shape or structure.

[0075] In some embodiments, when the PCB board 13 is being milled by the spindle 1, the ultrasonic vibration table 2 drives the PCB board 13 to vibrate at a high frequency in a first direction with a set amplitude and frequency. This vibration enables the special tool connected to the spindle 1 to not only significantly reduce cutting resistance and thermal impact when removing excess material from the PCB board 13, ensuring the accuracy and integrity of the processing area, but also promotes the smooth discharge of chips and effectively prevents tool blockage and wear.

[0076] Milling is a surface treatment and precision machining method for PCB boards.

[0077] In some embodiments, when the PCB board 13 is milled by the spindle 1, the ultrasonic vibration table 2 drives the PCB board 13 to vibrate at a high frequency in the first direction with a set amplitude and frequency. This vibration makes the milling cutter connected to the spindle 1 more precise and delicate in the cutting process, which reduces the damage to the PCB board 13 caused by cutting heat and mechanical stress, and ensures the smoothness and accuracy of the processed edge.

[0078] Cutting is a processing method for forming a PCB board 13 into the desired shape and structure.

[0079] In some embodiments, when the PCB board 13 is cut by the spindle 1, the ultrasonic vibration table 2 drives the PCB board 13 to vibrate at a high frequency in a first direction with a set amplitude and frequency. This vibration causes the cutting tool connected to the spindle 1 to have a high-frequency impact with the PCB board 13, thereby achieving precise and efficient cutting. This not only reduces damage to the substrate of the PCB board 13 and ensures the smoothness and flatness of the processed edges, but also greatly improves the processing accuracy and production efficiency.

[0080] Furthermore, PCB board 13 includes high aspect ratio PCB boards, multilayer PCB boards, or high-density interconnect PCB boards. Specifically, a high aspect ratio PCB board refers to a PCB board with a relatively large thickness, for example, a PCB board with a thickness of 1.0 mm to 10.0 mm. A multilayer PCB board refers to a PCB board composed of multiple PCB boards stacked together, with each layer having an independent circuit pattern and connection structure, for example, a PCB board with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm. A high-density interconnect (HDI) PCB board refers to a printed circuit board with a high wiring density.

[0081] The second aspect provides a PCB processing method applicable to the PCB processing equipment described in the first aspect embodiment. The PCB processing equipment includes an ultrasonic vibration worktable 2 and a control system 12, such as... Figure 7 As shown, the processing method of this PCB processing equipment includes: S10. Obtain the processing parameters of PCB board 13; In this embodiment, the processing parameters of PCB board 13 include PCB board parameters and processing type parameters. Specifically, the PCB board parameters include PCB board type and PCB board inherent parameters. Among them, the PCB board type includes high aspect ratio PCB board, multilayer PCB board or high density interconnect (HDI) PCB board, and the PCB board inherent parameters include high aspect ratio PCB board parameters, multilayer PCB board parameters or high density interconnect PCB board parameters.

[0082] As an example, high aspect ratio PCB board parameters include: Thickness: For example, 1.0mm to 10.0mm; Aperture: for example, 0.2mm to 1.0mm; Aspect ratio: for example, 5:1 to 10:1 or higher; Material type: For example, FR-4 material.

[0083] Parameters for multilayer PCBs include: Number of floors: For example, 4 to 20 floors or more; Total thickness: for example, 1.5mm to 10.0mm; Material type: For example, FR-4 material.

[0084] High-density interconnect PCB board parameters include: Thickness: for example, 0.5mm to 3.0mm; Aperture: for example, 0.1mm to 0.3mm; Line width and spacing: for example, 50µm to 150µm.

[0085] Material type: For example, low dielectric constant materials.

[0086] Machining type parameters include drilling parameters, milling parameters, milling parameters, or cutting parameters.

[0087] Specifically, drilling parameters include: drilling depth, spindle speed, and feed rate.

[0088] The parameters of the router include: cutting width, router cutter diameter, cutting speed, router cutter speed, and feed rate.

[0089] Milling parameters include: depth of cut, cutter diameter, spindle speed, and feed rate.

[0090] Cutting parameters include: cutting depth, cutting speed, and cutting accuracy.

[0091] S20. Based on the processing parameters, determine the target vibration parameters corresponding to the processed PCB board 13.

[0092] In this embodiment, the target vibration parameters may include amplitude and frequency. The amplitude range can be from 1µm to 20µm, and the frequency range can be from 2kHz to 40kHz. Preferably, the amplitude can be configured as 5µm, 10µm, 15µm, or 18µm, and the frequency can be configured as 5kHz, 10kHz, 20kHz, 30kHz, or 35kHz; no specific limitation is imposed. The amplitude and frequency suitable for the PCB board 13 are determined based on its processing parameters to optimize the processing effect and ensure processing quality. Specifically, the corresponding amplitude and frequency can be preset according to the processing parameters of the PCB board 13. Furthermore, the corresponding amplitude and frequency can be automatically retrieved by inputting the processing parameters of the PCB board 13. Other methods can also be used to determine the amplitude and frequency; no limitation is imposed here.

[0093] As an example, a database of processing parameters for PCB board 13 can be pre-established, covering the aforementioned processing parameters of PCB board 13, the corresponding amplitude and frequency of PCB board 13, and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitude and frequency corresponding to the processing parameters of PCB board 13.

[0094] Specifically, when the user inputs the processing parameters of the PCB board 13, the control system 12 immediately initiates an automatic query and matching mechanism to quickly filter out similar or related cases from the historical database based on the input processing parameters of the PCB board 13. Then, the system uses a parameter prediction model to intelligently analyze the amplitude and frequency settings in these cases, comprehensively considering multiple dimensions such as processing accuracy, processing quality, and tool wear, and finally recommends the optimal amplitude and frequency.

[0095] For example, a user needs to process a batch of PCB boards 13 with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4. After inputting these parameters, the control system 12 determines the corresponding amplitude and frequency through a pre-trained parameter prediction model; for example, the amplitude is set to 2.5 µm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0096] As another example, a table relating the processing parameters of the PCB board 13 to amplitude and frequency can be pre-established. When the user inputs the processing parameters of the PCB board 13, the control system 12 determines the corresponding amplitude and frequency of the PCB board 13 by querying the pre-established table. For example, a 1.0mm thick high aspect ratio PCB board corresponds to a frequency of 30kHz and an amplitude of 1.5µm. A 2.0mm thick high aspect ratio PCB board corresponds to a frequency of 28kHz and an amplitude of 2µm. It should be noted that the above is only an example; the specific processing parameters of the PCB board 13, and the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.

[0097] S30. According to the target vibration parameters, control the ultrasonic vibration worktable 2 to vibrate along the first direction, so as to drive the PCB board 13 on the ultrasonic vibration worktable 2 to vibrate in the first direction, so that the processing tool 14 and the PCB board 13 form periodic contact and separation, so as to realize the processing of the PCB board 13.

[0098] In this embodiment, based on the target vibration parameters determined in step S20, the ultrasonic vibration stage 2 is controlled to perform stable micron-level vibration along a first direction. As the ultrasonic vibration stage 2 vibrates, the PCB board 13 fixed on it also vibrates, causing the machining tool 14 to periodically contact and separate from the PCB board 13 during the machining process. This effectively reduces the continuous friction between the machining tool 14 and the PCB board 13, thereby reducing the cutting force and cutting temperature, and achieving efficient and precise machining of the PCB board 13.

[0099] For example, taking a 5.4mm high aspect ratio PCB board and drilling a 0.2mm through hole as an example: Assuming the spindle speed of 1 is set to 100,000 rpm, the drill bit's machining speed is 20 µm / revolution, the amplitude is 10 µm, and the frequency is 20 kHz, the drill bit's feed rate is 33.33 mm / s. This can be calculated as follows: multiply the drill bit's machining speed (20 µm / revolution) by the spindle speed of 1 (1666.67 rpm), and then convert the units. Here, the spindle speed of 1 is 100,000 rpm, or 100,000 revolutions per minute. Converted to revolutions per second, this is 100,000 ÷ 60 = 1666.67 rpm (approximately 1666.67 revolutions per second).

[0100] During operation, the amplitude is 10µm and the frequency is 20kHz, meaning the vibrating table 2 vibrates 20,000 times per second. Under this setting, each drill bit vibration occurs with an amplitude of 10µm, resulting in an actual drilling feed displacement of 1.67µm per vibration (calculated as 33.33mm / 20,000 vibrations). Thus, during drilling, the vibrating table 2 undergoes 20,000 ultrasonic vibrations. The displacement generated on the PCB board 13 by each vibration is far greater than the actual drilling displacement, enabling the drill bit to effectively perform micron-level cutting on the PCB board 13. Under ultrasonic vibration conditions, the drill bit does not continuously drill 33.33mm; instead, while drilling, the vibrating table 2 exhibits high-frequency, micro-level vibration (1.67µm). This micron-level cutting significantly improves cutting efficiency and quality, effectively reduces cutting force and temperature, reduces drill bit wear, and improves machining accuracy and surface quality. It should be noted that the above is merely an example and does not constitute a limitation of the present invention.

[0101] In one embodiment, after step S10, that is, after obtaining the processing parameters of the PCB board 13, the following steps are included: S40. Control the spindle 1 to move to a preset position above the vibrating worktable, and control the spindle 1 to rotate at high speed according to the preset speed, so as to drive the machining tool 14 set on the spindle 1 to rotate at high speed.

[0102] In this embodiment, after obtaining the processing parameters of the PCB board 13, the spindle 1 is further controlled to move to a preset position above the vibrating table. This process aims to ensure accurate positioning of the spindle so that the processing tool 14 can be aligned with the PCB board 13 at an appropriate distance and angle for effective processing. Next, controlling the spindle 1 to rotate at a preset speed ensures that the processing tool 14 can effectively cut or drill. The speed setting depends on the obtained processing parameters; for example, different types of PCB boards 13 require different speeds. The drive system of the spindle 1 is adjusted according to the set speed to achieve a stable rotational speed. For example, when processing a high aspect ratio PCB board 13, the spindle 1 speed can be set to 50,000 revolutions per minute to reduce wear on the processing tool 14 and ensure processing stability.

[0103] In one embodiment, such as Figure 8 As shown, after step S40, that is, after controlling the vibration of the ultrasonic vibration table 2 according to the target vibration parameters, the following steps are included: S50. Obtain the actual vibration parameters of the vibrating table; S60. Compare the actual vibration parameters with the target vibration parameters to obtain the comparison results; S70. If the comparison result is a match, then begin processing of PCB board 13. S80. If the comparison result is a mismatch, adjust the control parameters until the actual vibration parameters of the vibration table match the target vibration parameters.

[0104] In this embodiment, after controlling the vibration of the vibrating worktable, the control system 12 receives the actual vibration parameters of the vibrating worktable, namely the actual amplitude and frequency, monitored in real time by the laser displacement sensor 11 or other vibration detection device, providing basic data for subsequent comparison and adjustment. The laser displacement sensor 11 can be installed below the processing worktable 21, and obtains the actual vibration parameters by measuring the actual displacement of the processing worktable 21.

[0105] Next, the actual vibration parameters are compared with the target vibration parameters to generate a comparison result. If the actual vibration parameters match the target vibration parameters, it means that the vibration table is vibrating under the expected conditions. If they do not match, the control parameters need to be further adjusted to meet the expected processing conditions, thereby achieving high-quality processing results.

[0106] For example, assuming the target vibration parameters are a frequency of 30 kHz and an amplitude of 10 µm, while the actual measured frequency is 29.8 kHz and the amplitude is 9.8 µm, the control system 12 will automatically adjust the control parameters of the ultrasonic vibration stage 2 based on this comparison. For example, it may increase the input power of the ultrasonic transducer 221 by 5 watts and increase the output frequency by 0.2 kHz. After each adjustment, the laser displacement sensor 11 will remeasure the actual vibration parameters and feed them back to the control system 12. The remeasured actual vibration parameters will be compared with the target vibration parameters. If a difference still exists, the control system 12 will continue to adjust until the actual vibration parameters match the target vibration parameters, thereby ensuring the best processing effect. It should be understood that the above is merely an example and does not constitute a limitation of the present invention.

[0107] In one embodiment, the vibration worktable includes an ultrasonic vibration worktable 2, which includes a processing worktable 21 and an ultrasonic vibration device 22. The ultrasonic vibration device 22 includes a pneumatic ultrasonic vibration device 23. In step S30, that is, according to the target vibration parameters, the vibration worktable 2 is controlled to vibrate along the first direction to drive the PCB board 13 on the vibration worktable 2 to vibrate in the first direction, which includes the following steps: S31. Output the corresponding current signal according to the target vibration parameters; S32. Convert the current signal into a gas signal, and control the input air pressure of the gas static pressure ultrasonic vibration device 23 according to the gas signal, so that the gas static pressure ultrasonic vibration device 23 drives the PCB board 13 on the processing worktable 21 to vibrate in the first direction.

[0108] In this embodiment, after determining the amplitude and frequency, the control system 12 further generates corresponding current signals. These current signals directly correspond to the required amplitude and frequency, for example, implemented by an advanced digital signal processor (DSP) or microcontroller. This allows for precise calculation based on the input amplitude and frequency values, resulting in a matching current signal output. The current signal is then converted into a pneumatic signal using a dedicated signal conversion device, such as an electro-pneumatic converter (E / P converter) or a proportional solenoid valve, which is not limited here. The converted pneumatic signal is used to control the input air pressure of the pneumatic ultrasonic vibration device 23, thereby achieving precise control of the amplitude and frequency of the pneumatic ultrasonic vibration device 23. This allows the pneumatic ultrasonic vibration device 23 to drive the machining tool 14 to vibrate in the first direction according to the input air pressure. The input air pressure range of the pneumatic ultrasonic vibration device 23 can be set to 0.2 MPa to 0.8 MPa, preferably 0.4 MPa to 0.6 MPa, but the specific range is not limited.

[0109] The third aspect provides a PCB processing system, which includes at least one PCB processing device as described in the first aspect embodiment.

[0110] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A PCB processing apparatus characterized by comprising: The vibration workbench is fixed with a PCB to be processed, and is used to drive the PCB on the vibration workbench to vibrate in a first direction with a set amplitude and frequency during processing, so that a high-speed rotating processing tool and the PCB form periodic contact and separation, to realize processing of the PCB. The vibration workbench comprises an ultrasonic vibration workbench; the ultrasonic vibration workbench comprises a processing workbench and an ultrasonic vibration device; 2. The PCB processing apparatus according to claim 1, wherein The ultrasonic vibration device is used to drive the PCB on the processing workbench to vibrate in the first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, to realize processing of the PCB. The frequency range of the ultrasonic vibration device is 20KHz-60KHz; the ultrasonic vibration device comprises an ultrasonic transducer, an amplitude transformer and a resonance body; 3. The PCB processing apparatus according to claim 2, wherein One end of the ultrasonic transducer is connected with one end of the amplitude transformer; The other end of the amplitude transformer is connected with one end of the resonance body; The other end of the resonance body is connected with the processing workbench. The ultrasonic vibration device is arranged on the processing workbench in a uniform arrangement.

4. The PCB processing apparatus according to claim 2, wherein The PCB processing equipment further comprises an ultrasonic generator used to convert electric energy into a high-frequency electric signal matched with the ultrasonic transducer; 5. The PCB processing apparatus according to claim 3, wherein The ultrasonic generator is connected with the ultrasonic transducer. The ultrasonic vibration device comprises an aerostatic ultrasonic vibration device.

6. The PCB processing apparatus according to claim 2, wherein The aerostatic ultrasonic vibration device comprises a bearing mounting cover, a bearing mounting base, a first aerostatic bearing, a second aerostatic bearing, a third aerostatic bearing, a vibration rod and an air-floating vibration plate arranged on the vibration rod; 7. The PCB processing apparatus according to claim 6, wherein The bearing mounting cover and the bearing mounting base are detachably connected; The first aerostatic bearing is mounted in the bearing mounting cover; The second aerostatic bearing and the third aerostatic bearing are mounted in the bearing mounting base; The vibration rod is arranged in a containing cavity formed by the bearing mounting cover and the bearing mounting base, and is located at the axial center positions of the first aerostatic bearing, the second aerostatic bearing and the third aerostatic bearing; The air-floating vibration plate is located between the first aerostatic bearing and the second aerostatic bearing, and is used to drive the vibration rod to vibrate in the first direction, so that the vibration rod drives the PCB on the processing workbench to vibrate in the first direction. The aerostatic ultrasonic vibration device further comprises a muffler; 8. The PCB processing apparatus according to claim 7, wherein The bearing mounting base is provided with an outlet communicating with the containing cavity, and the muffler is arranged at the outlet. The PCB processing equipment further comprises a main shaft, a bed body, a gantry system and a moving platform; 9. The PCB processing apparatus according to any one of claims 1 to 8, characterized by, The gantry system and the bed body form a channel; The gantry system and / or the moving platform are movably arranged on the bed body along a third direction, and the moving platform can drive the vibration workbench to move into or out of the channel; The main shaft is movably arranged on the gantry system along a second direction, and the main shaft can move along the first direction; ​ The first direction, the second direction and the third direction are perpendicular to each other.

10. The PCB processing apparatus according to claim 9, wherein The PCB processing device further comprises a laser displacement sensor for detecting the actual amplitude and the actual frequency of the processing workbench. The laser displacement sensor is arranged below the processing workbench.

11. The PCB processing apparatus according to any one of claims 1 to 8, characterized by, The processing type of the PCB board includes drilling, milling, milling or cutting, and / or the PCB board includes a high aspect ratio PCB board, a multi-layer PCB board or a high-density interconnection PCB board.

12. A method of processing a PCB, characterized by, The method is applied to the PCB processing device of any one of claims 1-11, and the method comprises: obtaining a processing parameter of a PCB board; determining a target vibration parameter corresponding to the processing of the PCB board according to the processing parameter; controlling the vibration workbench to vibrate in the first direction according to the target vibration parameter, so as to drive the PCB board on the vibration workbench to vibrate in the first direction, and form periodic contact and separation between the high-speed rotating processing tool and the PCB board, so as to realize the processing of the PCB board.

13. The PCB processing method of claim 12, wherein, After obtaining the processing parameter of the PCB, the method further comprises: controlling the spindle to move to a preset position above the vibration workbench, and controlling the spindle to rotate at a preset speed to drive the processing tool arranged on the spindle to rotate at a high speed.

14. The PCB processing method of claim 12, wherein, After controlling the vibration workbench to vibrate in the first direction according to the target vibration parameter, the method further comprises: obtaining an actual vibration parameter of the vibration workbench; comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result; if the comparison result is matched, the processing of the PCB board is started; if the comparison result is not matched, the control parameter is adjusted until the actual vibration parameter and the target vibration parameter are matched.

15. The PCB processing method of claim 12, wherein, The vibration workbench comprises an ultrasonic vibration workbench; the target vibration parameter comprises an amplitude and a frequency, the amplitude ranges from 1µm to 20µm, and the frequency ranges from 2KHz to 40KHz.

16. The PCB processing method of claim 15, wherein, The processing parameter at least comprises one or more of the following parameters: PCB board parameters, the PCB board parameters comprising a PCB board type and a PCB board inherent parameter; processing type parameters, the processing type parameters comprising drilling parameters, milling parameters, milling parameters or cutting parameters.

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