PCB processing equipment and PCB processing method

Abstract

The invention discloses PCB processing equipment and a PCB processing method, and relates to the field of PCB processing equipment.The PCB processing equipment comprises an air static pressure vibration workbench which is used for driving a PCB fixed to the air static pressure vibration workbench to vibrate in the first direction at the set amplitude and frequency in the processing process, so that periodic contact and separation are formed between a processing tool rotating at a high speed and the PCB, and the processing tool rotates at a high speed; therefore, the processing of the PCB is realized. In the embodiment, the air static pressure vibration working table is arranged on the PCB processing equipment, and the air static pressure vibration working table drives the PCB on the air static pressure vibration working table to perform high-frequency vibration in the first direction at the set amplitude and frequency in the processing process, so that the complex structure of a traditional main shaft vibration mode is simplified, and the cost is reduced; the problems that an existing PCB machining device adopting a main shaft vibration mode is complex in structure and high in cost are solved.

Description

Technical Field

[0001] This invention relates to the field of PCB processing equipment, and more particularly to a PCB processing equipment and a PCB processing method. Background Technology

[0002] With the rapid development of the aerospace, medical, automotive, and electronics industries, printed circuit boards (PCBs) are becoming increasingly multi-layered, with micro-hole diameters shrinking and quality requirements becoming increasingly stringent. However, micro-hole machining in PCB manufacturing often involves difficult-to-machine materials such as carbon fiber composites. These materials have poor machinability, and the micro-holes generally have a large aspect ratio, resulting in high drilling forces, high drilling temperatures, and short drill bit lifespan, ultimately leading to a decrease in PCB machining accuracy.

[0003] In existing technologies, to improve the processing accuracy of PCB boards, a vibration device is typically added to the spindle. However, this method increases the complexity of the spindle structure and is costly. Summary of the Invention

[0004] Based on this, embodiments of the present invention provide a PCB processing equipment and processing method to solve the technical problems of complex structure and high cost of existing PCB processing equipment using spindle vibration.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows: In a first aspect, embodiments of the present invention provide a PCB processing apparatus, comprising: A pneumatic-static vibration table is used to drive a PCB board fixed on it to vibrate in a first direction at a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, thereby realizing the processing of the PCB board.

[0006] Optionally, the pneumatic vibration table includes a pneumatic ultrasonic vibration table; the pneumatic ultrasonic vibration table includes a machining table and a pneumatic ultrasonic vibration device. The pneumatic ultrasonic vibration device is used to drive the PCB board on the processing worktable to vibrate in the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, so as to realize the processing of the PCB board.

[0007] Optionally, the pneumatic ultrasonic vibration device includes an ultrasonic vibration device that utilizes aerodynamic principles to enable a vibration rod disposed inside the ultrasonic vibration device to vibrate and rotate in a preset direction under a cyclone buoyancy state.

[0008] Optionally, it includes at least one of the aforementioned pneumatic ultrasonic vibration devices, and the pneumatic ultrasonic vibration devices are arranged in a uniform manner on the processing worktable.

[0009] Optionally, the pneumatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, and a vibration rod; The output end of the vibration rod is detachably connected to the processing worktable; The bearing mounting cover is detachably connected to the bearing mounting base; The vibration rod is disposed in the accommodating cavity formed by the bearing mounting cover and the bearing mounting base, and is used to drive the processing worktable to vibrate in the first direction, thereby driving the PCB board to vibrate in the first direction.

[0010] Optionally, the pneumatic ultrasonic vibration device further includes a first pneumatic bearing, a second pneumatic bearing, and an air-bearing vibrating plate disposed on the vibrating rod; The first air static pressure bearing is fixedly installed on the bearing mounting cover; The second air static pressure bearing is fixedly installed on the bearing mounting base; The central axis of the vibrating rod is perpendicular to the central axes of the first air static bearing and the second air static bearing, respectively, and the air-floating vibrating plate is located between the first air static bearing and the second air static bearing. The bearing mounting base is provided with an air inlet hole, a first air inlet channel is provided between the first air static bearing and the bearing mounting cover, and a second air inlet channel is provided between the second air static bearing and the bearing mounting base. Both the first air intake passage and the second air intake passage are connected to the air intake hole, so that the high-pressure air introduced through the air intake hole enters the first annular air groove on the first air static pressure bearing through the first air intake passage and forms a first air film between the first air static pressure bearing and the air-floating vibrating plate. After entering the second annular air groove on the second air static pressure bearing through the second air inlet, a second air film is formed between the second air static pressure bearing and the air flotation vibrating plate. The first air film and the second air film generate different pressures on both sides of the air flotation vibrating plate, thereby causing the air flotation vibrating plate to drive the vibrating rod to vibrate along the first direction.

[0011] Optionally, the pneumatic ultrasonic vibration device further includes a third pneumatic bearing; The third air static pressure bearing is fixedly installed on the bearing mounting base; A third air intake is provided between the third air static bearing and the bearing mounting base; The third air intake channel is connected to the air intake hole so that the high-pressure air introduced through the air intake hole enters the third annular air groove on the third gas static pressure bearing through the third air intake channel and fills the accommodating chamber to form a third air film for supporting the suspension of the vibrating rod.

[0012] Optionally, the gas static bearing includes a toroidal throttle type gas static bearing or a pinhole throttle type gas static bearing.

[0013] Optionally, the pneumatic ultrasonic vibration device further includes a silencer; The bearing mounting base has an outlet that communicates with the accommodating chamber, and the silencer is located at the outlet.

[0014] Optionally, the processing worktable is provided with a groove; The bearing mounting cover is embedded in the groove.

[0015] Optionally, the PCB processing equipment further includes a bed and a moving platform disposed below the pneumatic vibration table; The mobile platform is provided with a first through hole communicating with the air inlet and a second through hole communicating with the muffler. The bearing mounting base is detachably connected to the mobile platform; The mobile platform is detachably connected to the bed.

[0016] Optionally, the PCB processing equipment further includes a gantry system, a first motion component, a second motion component, a third motion component, and a spindle fixing component; The gantry system forms a passage with the bed; The spindle is connected to one side of the spindle fixing assembly, the other side of the spindle fixing assembly is connected to one end of the first motion assembly, the other end of the first motion assembly is connected to one end of the second motion assembly, and the other end of the second motion assembly is connected to the gantry system. One end of the third motion component is connected to the bed frame, and the other end is connected to the moving platform; The first motion component can drive the spindle fixing component to move along the first direction, so that the spindle fixing component drives the spindle to move along the first direction; The second motion component can drive the first motion component to move along the second direction, thereby causing the main shaft to move along the second direction; The third motion component can drive the mobile platform to move along a third direction, so that the mobile platform can move the pneumatic ultrasonic vibration worktable into or out of the channel; Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

[0017] Optionally, the spindle fixing assembly includes a spindle clamping assembly, a chip suction assembly, and a lifting assembly for controlling the lifting and lowering of the chip suction assembly; One side of the spindle clamp assembly is detachably connected to the first motion assembly; The other side of the spindle clamp assembly is detachably connected to the lifting assembly; The end of the lifting component is detachably connected to the dust suction component.

[0018] Optionally, the chip removal assembly includes a chip removal hood and a pressure component for pressing the PCB board; The pressure component is detachably connected to the chip suction hood assembly.

[0019] In a second aspect, embodiments of the present invention provide a basic processing method applied to the PCB processing equipment described in the first aspect above, the method comprising: Obtain the PCB board processing parameters; Based on the processing parameters, the target vibration parameters corresponding to the processing of the PCB board are determined; According to the target vibration parameters, the pneumatic static pressure vibration table is controlled to vibrate along the first direction with a set amplitude and frequency, so as to drive the PCB board fixed on it to vibrate in the first direction, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, so as to realize the processing of the PCB board.

[0020] Optionally, after obtaining the processing parameters of the PCB board, the method further includes: The spindle is controlled to move to a preset position above the pneumatic vibration table, and the spindle is controlled to rotate at high speed according to a preset speed, so as to drive the machining tool set on the spindle to rotate at high speed.

[0021] Optionally, the pneumatic vibration table includes a pneumatic ultrasonic vibration table; the pneumatic ultrasonic vibration table includes a machining table and a pneumatic ultrasonic vibration device, and the step of controlling the pneumatic ultrasonic vibration table to vibrate along a first direction with a set amplitude and frequency according to the target vibration parameters includes: Based on the target vibration parameters, output the corresponding current signal; The current signal is converted into a gas signal, and the input air pressure of the pneumatic ultrasonic vibration device is controlled according to the gas signal, so that the pneumatic ultrasonic vibration device drives the PCB board on the processing worktable to vibrate in the first direction with a set amplitude and frequency.

[0022] Optionally, the pneumatic vibration table includes a pneumatic ultrasonic vibration table; after controlling the pneumatic ultrasonic vibration table to vibrate along a first direction with a set amplitude and frequency according to the target vibration parameters, the process includes: Obtain the actual vibration parameters of the pneumatic ultrasonic vibration device; The actual vibration parameters are compared with the target vibration parameters to obtain the comparison results; If the comparison result is a match, then the PCB board processing begins; If the comparison result is a mismatch, the input air pressure of the pneumatic ultrasonic vibration device is adjusted until the actual vibration parameters match the target vibration parameters.

[0023] Optionally, if the comparison result is a mismatch, adjusting the input air pressure of the pneumatic ultrasonic vibration device until the actual vibration parameters match the target vibration parameters includes: Obtain the input air pressure; Determine whether the input air pressure exceeds the preset range; If the input air pressure exceeds the preset range, an alarm will be triggered and / or the pneumatic ultrasonic vibration device will be controlled to stop working; If the input air pressure does not exceed the preset range, the input air pressure is adjusted until the actual vibration parameters match the target vibration parameters.

[0024] In one embodiment of the present invention, the PCB processing equipment includes a pneumatic vibration table, which drives a PCB board fixed thereon to vibrate in a first direction at a set amplitude and frequency during processing. This causes periodic contact and separation between the high-speed rotating processing tool and the PCB board, thereby achieving the processing of the PCB board. In this embodiment, by setting a pneumatic vibration table on the PCB processing equipment and driving the PCB board thereon to vibrate at a high frequency in a first direction at a set amplitude and frequency during processing, the complex structure of the traditional spindle vibration method is simplified, the cost is reduced, and the problem of complex structure and high cost of the spindle vibration method in existing PCB processing equipment is solved. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1This is a schematic diagram of a PCB processing device according to an embodiment of the present invention; Figure 2 This is a partial cross-sectional view of a PCB processing equipment according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of a PCB processing equipment according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the arrangement of the pneumatic ultrasonic vibration device in one embodiment of the present invention; Figure 5 This is a cross-sectional view of a pneumatic ultrasonic vibration device according to an embodiment of the present invention; Figure 6 This is a partially enlarged view of a PCB processing equipment according to an embodiment of the present invention; Figure 7 This is a partial cross-sectional view of a PCB processing equipment according to an embodiment of the present invention.

[0027] Figure 8 This is a schematic diagram of a PCB processing system according to an embodiment of the present invention; Figure 9 This is a flowchart of a PCB processing method according to an embodiment of the present invention; Figure 10 This is another flowchart of a PCB processing method according to an embodiment of the present invention; Figure 11 This is another flowchart of a PCB processing method according to an embodiment of the present invention; Figure 12 This is another flowchart of a PCB processing method in one embodiment of the present invention.

[0028] The reference numerals in the attached figures are as follows: 1. Spindle; 2. Pneumatic static pressure vibration worktable; 21. Machining workbench; 22. Pneumatic ultrasonic vibration device; 221. Bearing mounting cover; 222. Bearing mounting base; 223. Vibration rod; 224. First pneumatic bearing; 225. Second pneumatic bearing; 226. Third pneumatic bearing; 227. Air-floating vibrating plate; 228. First air inlet; 229. Second air inlet; 2210. Third air inlet; 2211. First annular air groove; 2212. Second annular air groove; 2213. Third annular air groove; 2214. Air inlet; 2215. Silencer; 3. Mobile platform; 31. First through hole; 32. Second through hole; 4. Beam base; 41. Beam base; 42. Second base; 5. Crossbeam; 6. Bed; 7. First motion assembly; 8. Second motion assembly; 9. Third motion assembly; 10. Spindle fixing assembly; 11. PCB board; 12. Machining tool; 13. Screw; 14. Spindle clamp assembly; 141. Spindle clamp rear seat; 142. Spindle clamp front cover; 15. Chip suction assembly; 151. Chip suction hood; 152. Pressure components; 16. Lifting assembly. Detailed Implementation

[0029] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0030] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] It should be noted that the PCB board to be protected by this invention is not limited to the PCB board itself. Structures similar to the PCB board, such as IC carrier boards and glass substrates, are also within the scope of protection claimed by this invention. To avoid redundancy, the following description mainly uses the PCB board as an example.

[0033] The first aspect provides a PCB processing device; please refer to [link / reference]. Figure 1 and Figure 2The PCB processing equipment includes a pneumatic vibration table 2, which is used to drive the PCB board 11 fixed on it to vibrate in the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool 12 and the PCB board 11 form periodic contact and separation, so as to realize the processing of the PCB board 11.

[0034] In some embodiments, the machining tool 12 can be connected to the output end of the spindle 1, and the pneumatic vibration table 2 can be disposed below the spindle 1. The rotational speed of the spindle 1 can be between 50,000 rpm and 300,000 rpm. Preferably, the rotational speed of the spindle 1 can be 100,000 rpm, 150,000 rpm, 200,000 rpm, or 250,000 rpm. This is not a limitation. Therefore, when the spindle 1 rotates at high speed, it can drive the machining tool 12 to rotate at high speed. Specifically, when processing the PCB board 11 using PCB processing equipment, the pneumatic vibration table 2 is set on the PCB processing equipment. During the processing, the pneumatic vibration table 2 drives the PCB board 11 on it to vibrate at high frequency in the first direction with a set amplitude and frequency. This simplifies the complex structure of the traditional spindle vibration method, reduces costs, and solves the problem of complex structure and high cost of the existing PCB processing equipment using the spindle vibration method.

[0035] As an example, the pneumatic vibration table 2 can be an ultrasonic vibration table driven by pneumatic and ultrasonic vibration technologies. While controlling the spindle 1 to drive the machining tool 12 to process the PCB board 11, the pneumatic vibration table 2 can be simultaneously controlled to vibrate in the first direction with a set amplitude and frequency. This allows the machining tool 12 to rotate and feed simultaneously, and due to the vibration of the pneumatic vibration table 2, a periodic contact and separation occurs between the PCB board 11 on the pneumatic vibration table 2 and the machining tool 12. Compared to the continuous contact between the machining tool 12 and the PCB board 11 in traditional machining, this significantly improves machining accuracy and efficiency.

[0036] For example, during vibratory drilling, when the drill bit deviates during drilling, the vibration causes it to briefly retract and reposition itself, automatically eliminating the deviation and ensuring the drill bit can accurately re-drill into the target position. This improves the positioning accuracy of the hole, making vibratory drilling more precise and efficient than conventional drilling in PCB manufacturing. It shows significant advantages, especially when machining difficult-to-machine materials such as high aspect ratio PCBs, multilayer PCBs, and high-density interconnect PCBs. Therefore, by using a pneumatic-static vibration table 2 to drive the PCB board 11 on it to vibrate at high frequency in the first direction during processing, the effects of improving processing accuracy and efficiency can also be achieved, simplifying the complex structure of traditional spindle vibration methods and reducing costs.

[0037] Furthermore, the excellent chip-breaking performance generated by vibration facilitates smoother chip removal during machining, reducing chip scraping on the hole surface. The reciprocating pressing action of the machining tool 12 on the inner hole surface during vibration machining further reduces the surface roughness of the PCB board 11 and the surface quality of the hole walls, thus improving the machining quality of the PCB board 11. The intermittent action between the machining tool 12 and the PCB board 11 significantly reduces friction, ensuring that the machining tool 12 remains in a stable and normal wear stage. This results in lower cutting temperatures, stable drill performance, slow wear rate, and extended tool life.

[0038] It should be understood that the aforementioned periodic contact and separation, during the processing, manifests as the number of times the processing tool 12 contacts and separates from the PCB board 11, determined by the vibration frequency of the pneumatic vibration table 2. For example, one contact and separation cycle is completed every 50µs (1s / 20000 times). The amplitude determines the pressure exerted by the processing tool 12 on the PCB board 11 during each contact; the larger the amplitude, the stronger the contact force.

[0039] In one embodiment, such as Figure 2 and Figure 3 As shown, the pneumatic vibration table 2 includes a pneumatic ultrasonic vibration table with a frequency range of 20kHz or higher. Further, the frequency range of the pneumatic ultrasonic vibration table can be configured within the range of 20kHz to 60kHz, preferably 20kHz, 30kHz, or 40kHz. The pneumatic ultrasonic vibration table includes a processing table 21 and a pneumatic ultrasonic vibration device 22. Even further, the frequency range of the pneumatic ultrasonic vibration device 22 can be configured within the range of 20kHz to 40kHz, without specific limitation. The pneumatic ultrasonic vibration device 22 is used to drive the PCB board 11 on the processing table 21 to vibrate in a first direction with a set amplitude and frequency during processing, causing the high-speed rotating processing tool 12 to form periodic contact and separation with the PCB board 11, thereby realizing the processing of the PCB board 11.

[0040] In some embodiments, the pneumatic ultrasonic vibration device 22 can apply vibration to the processing table 21 with a set amplitude and frequency during processing, thereby causing the PCB board 11 to make a small periodic displacement in the first direction. The amplitude and frequency can be adjusted according to the specific processing requirements to adapt to different types of processing tasks. For example, during drilling or milling, the amplitude range can be set between 1µm and 20µm, and the frequency range can be set between 20kHz and 40kHz. Specifically, this invention does not limit the range. By vibrating with a specific amplitude and frequency, the cutting capability of the processing tool 12 can be effectively improved, and the processing accuracy of the PCB board 11 can be optimized.

[0041] In one embodiment, the pneumatic ultrasonic vibration device 22 includes an ultrasonic vibration device that utilizes aerodynamic principles to enable a vibration rod 223 disposed inside the ultrasonic vibration device to vibrate and rotate in a preset direction in a cyclone-floating state.

[0042] In some embodiments, the pneumatic ultrasonic vibration device 22 can be an ultrasonic vibration device that integrates aerodynamic principles and ultrasonic technology. As an example, a vibration rod 223 can be installed inside the ultrasonic vibration device, and the vibration rod 223 can be made to vibrate at high frequency along a first direction under ultrasonic drive. By introducing high-pressure air into the ultrasonic vibration device, the introduced high-pressure air forms a static pressure air film around the vibration rod 223, thereby isolating the vibration rod 223 from direct contact with the inner wall of the ultrasonic vibration device. Then, under the action of air vortex buoyancy, the vibration rod 223 can simultaneously achieve vibration and rotation in a preset direction.

[0043] In one embodiment, such as Figure 4 As shown, the PCB processing equipment includes at least one air static pressure ultrasonic vibration device 22, and the air static pressure ultrasonic vibration device 22 is arranged in a uniform manner on the processing worktable 21.

[0044] As an example, the pneumatic ultrasonic vibration device 22 is evenly arranged above and / or below the processing worktable 21. Alternatively, the processing worktable 21 can be implemented using a honeycomb aluminum structure, in which case the pneumatic ultrasonic vibration device 22 can be evenly arranged inside the processing worktable 21. No specific limitation is made here. The technical solution that enables the PCB board 11 on the processing worktable 21 to vibrate in the first direction, so that the processing tool 12 and the PCB board 11 form periodic contact and separation, or the corresponding vibration fixture that enables the PCB board 11 to vibrate in the first direction, so that the processing tool 12 and the PCB board 11 form periodic contact and separation, are all within the scope of protection claimed in this application.

[0045] Preferably, taking the uniform arrangement of the pneumatic ultrasonic vibration devices 22 under the processing worktable 21 as an example, five identical pneumatic ultrasonic vibration devices 22 can be used and symmetrically arranged under the processing worktable 21, for example, at the four corners and the center of the processing worktable 21, so as to achieve uniform vibration distribution on the processing worktable 21 and ensure that the PCB board 11 can obtain uniform ultrasonic vibration during the processing.

[0046] It should be noted that the above is merely an example and does not constitute a limitation of this application. If a single pneumatic ultrasonic vibration device 22 is sufficient to meet the processing requirements, only one pneumatic ultrasonic vibration device 22 may be arranged directly below the processing table 21. It should be understood that in this case, a guide column structure needs to be added to enhance stability and avoid displacement or uneven vibration of the processing table 21 caused by vibration.

[0047] Furthermore, such as Figure 5 As shown, the pneumatic ultrasonic vibration device 22 includes a bearing mounting cover 221, a bearing mounting base 222, and a vibration rod 223; the output end of the vibration rod 223 is detachably connected to the processing worktable 21; the bearing mounting cover 221 is detachably connected to the bearing mounting base 222; the vibration rod 223 is disposed in the accommodating cavity formed by the bearing mounting cover 221 and the bearing mounting base 222, and is used to drive the processing worktable 21 to vibrate in the first direction, thereby driving the PCB board 11 to vibrate in the first direction.

[0048] In some embodiments, the pneumatic ultrasonic vibration device 22 may include a bearing mounting cover 221, a bearing mounting base 222, and a vibration rod 223. The output end of the vibration rod 223 is fixedly connected to the processing table 21 via a detachable connection device. For example, a screw 13 is used to pass through a pre-set through hole on the processing table 21 and to a pre-set threaded hole on the vibration rod 223 for fixed connection, ensuring that the vibration rod 223 can stably transmit vibration during operation. The other end of the vibration rod 223 is located within the accommodating cavity formed by the bearing mounting cover 221 and the bearing mounting base 222.

[0049] As an example, the bearing mounting cover 221 and the bearing mounting base 222 can be detachably connected by bolts or other fasteners to form a closed accommodating chamber for supporting and fixing the vibrating rod 223. During operation, high-pressure air is introduced into the accommodating chamber formed by the bearing mounting cover 221 and the bearing mounting base 222, causing a static pressure film to form around the vibrating rod 223. This isolates the vibrating rod 223 from direct contact with the inner wall of the accommodating chamber. Under the action of buoyancy, the vibrating rod 223 vibrates periodically in the first direction with a set amplitude and frequency. Furthermore, the processing table 21, driven by the vibrating rod 223, causes the PCB board 11 to undergo a small periodic displacement in the first direction. This small vibration enables periodic contact and separation between the machining tool 12 and the PCB board 11, reducing the cutting force during machining and improving the cutting capability and machining accuracy of the machining tool 12.

[0050] Furthermore, the gas static pressure ultrasonic vibration device 22 also includes a first gas static pressure bearing 224, a second gas static pressure bearing 225, and an air-floating vibrating plate 227 disposed on the vibration rod 223; the first gas static pressure bearing 224 is fixedly installed on the bearing mounting cover 221; the second gas static pressure bearing 225 is fixedly installed on the bearing mounting base 222; the central axis of the vibration rod 223 is perpendicular to the central axes of the first gas static pressure bearing 224 and the second gas static pressure bearing 225, respectively, and the air-floating vibrating plate 227 is located between the first gas static pressure bearing 224 and the second gas static pressure bearing 225; an air inlet 2214 is provided on the bearing mounting base 222, a first air inlet 228 is provided between the first gas static pressure bearing 224 and the bearing mounting cover 221, and the second gas static pressure bearing 225 is located ... respectively; an air inlet 2214 is provided on the bearing mounting base 222, a first air inlet 228 is provided between the first gas static pressure bearing 224 and the bearing mounting cover 221, and the second gas static pressure bearing 225 is located between the first gas static pressure bearing 224 and the bearing mounting cover 221, respectively; and an air-floating vibrating plate 227 is provided between the first gas static pressure bearing 224 and the bearing mounting cover 221, respectively. A second air inlet 229 is provided between the bearing mounting bases 222; both the first air inlet 228 and the second air inlet 229 are connected to the air inlet 2214, so that the high-pressure air introduced through the air inlet 2214 enters the first annular air groove 2211 on the first air static pressure bearing 224 through the first air inlet 228, and forms a first air film between the first air static pressure bearing 224 and the air-floating vibrating plate 227; after entering the second annular air groove 2212 on the second air static pressure bearing 225 through the second air inlet 229, a second air film is formed between the second air static pressure bearing 225 and the air-floating vibrating plate 227; the first air film and the second air film generate different pressures on both sides of the air-floating vibrating plate 227, thereby causing the air-floating vibrating plate 227 to drive the vibrating rod 223 to vibrate in the first direction.

[0051] In some embodiments, a threaded hole can be provided on the first air static pressure bearing 224, and a through hole matching the threaded hole on the bearing mounting cover 221 can be pre-set on the bearing mounting cover 221. During the connection process, a screw 13 can be passed through the through hole and fixedly connected to the threaded hole on the first air static pressure bearing 224. Alternatively, the first air static pressure bearing 224 can be glued to the inside of the bearing mounting cover 221 using an adhesive component. The specific fixing method is not limited in this invention. Similarly, the second air static pressure bearing 225 is fixed to the bearing mounting base 222 in the above manner, which will not be described again here. In addition, the air-bearing vibrating plate 227 is fixedly connected to the vibrating rod 223. The air inlet 2214 is connected to the first air inlet 228 and the second air inlet 229 through a pipe. For example, the connecting pipe of the air inlet 2214 can be connected to the first air inlet 228 and the second air inlet 229 to ensure the sealing of each connection part, and further ensure that high-pressure air can smoothly enter the air groove of the air static pressure bearing. These connection methods not only optimize the performance of PCB processing equipment, but also improve durability and ease of maintenance.

[0052] During operation, high-pressure air enters through the air inlet 2214, passes through the first air inlet 228, and enters the first annular air groove 2211 on the first air static pressure bearing 224, forming a first air film between the first air static pressure bearing 224 and the air-bearing vibrating plate 227. Similarly, high-pressure air enters through the second air inlet 229 and enters the second annular air groove 2212 on the second air static pressure bearing 225, forming a second air film between the second air static pressure bearing 225 and the air-bearing vibrating plate 227. These two air films create different pressures on both sides of the air-bearing vibrating plate 227, causing it to vibrate back and forth in the first direction. Because the vibrating rod 223 is connected to the air-bearing vibrating plate 227, the vibration of the air-bearing vibrating plate 227 is transmitted to the processing table 21 through the vibrating rod 223, thereby causing the PCB board 11 on the processing table 21 to vibrate in the first direction. This periodic vibration causes intermittent contact between the processing tool 12 and the PCB board 11, thereby achieving the purpose of precision machining of the PCB board 11. Frictionless vibration transmission is achieved through the pressure difference of the air film, ensuring stability and accuracy during the vibration process, effectively reducing mechanical wear between the vibrating rod 223 and the pneumatic bearing, and improving the reliability and service life of the pneumatic ultrasonic vibration device 22.

[0053] Furthermore, the gas static pressure ultrasonic vibration device 22 also includes a third gas static pressure bearing 226; the third gas static pressure bearing 226 is fixedly installed on the bearing mounting base 222; a third air inlet 2210 is provided between the third gas static pressure bearing 226 and the bearing mounting base 222; the third air inlet 2210 is connected to the air inlet 2214 so that the high-pressure air introduced through the air inlet 2214 enters the third annular air groove 2213 on the third gas static pressure bearing 226 through the second air inlet 229 and fills the accommodating chamber to form a third air film for supporting the suspension of the vibration rod 223.

[0054] In some embodiments, the third gas static bearing 226 can be fixedly mounted on the bearing mounting base 222 in the same manner as the second gas static bearing 225 described above, which will not be repeated here. The bearing mounting base 222 is also provided with a third air inlet 2210, which is connected to the air inlet 2214. Its function is to guide high-pressure air to the third gas static bearing 226. During operation, when high-pressure air enters the third annular air groove 2213 through the third air inlet 2210, it forms a uniform air film. This air film provides support within the accommodating cavity formed by the bearing mounting cover 221 and the bearing mounting base 222, allowing the vibrating rod 223 to suspend on the air film. This not only supports the weight of the vibrating rod 223 but also reduces direct contact with the inner wall of the accommodating cavity, improving the stability and lifespan of the gas static ultrasonic vibration device 22.

[0055] In summary, the gas static pressure ultrasonic vibration device 22 includes a vibrating rod 223, an air-bearing vibrating plate 227, a first gas static pressure bearing 224, a second gas static pressure bearing 225, a third gas static pressure bearing 226, a bearing mounting cover 221, and a bearing mounting base 222. The output end of the vibrating rod 223 is detachably connected to the processing worktable 21. The bearing mounting cover 221 and the bearing mounting base 222 are fixed together by bolts or other connecting devices to form a receiving chamber, in which the vibrating rod 223 is disposed. The first gas static pressure bearing 224 is fixedly mounted on the bearing mounting cover 221, while the second gas static pressure bearing 225 and the third gas static pressure bearing 226 are both fixedly mounted on the bearing mounting base 222. The central axis of the vibrating rod 223 is perpendicular to the central axes of the first gas static pressure bearing 224 and the second gas static pressure bearing 225. The first air inlet 228, the second air inlet 229, and the third air inlet 2210 are all connected to the air inlet 2214.

[0056] During operation, high-pressure air enters through the air inlet 2214, passes through the first air inlet 228, and enters the first annular air groove 2211 on the first gas static pressure bearing 224, forming a first air film. Simultaneously, high-pressure air enters through the second air inlet 229 and enters the second annular air groove 2212 on the second gas static pressure bearing 225, forming a second air film. The first and second air films generate different pressures on both sides of the air-bearing vibrating plate 227, causing the air-bearing vibrating plate 227 to vibrate in the first direction, thereby driving the vibrating rod 223 to vibrate the processing worktable 21 in the first direction. In addition, the third gas static pressure bearing 226 is connected to the air inlet 2214 through the third air inlet 2210, allowing high-pressure air to enter the third annular air groove 2213 on the third gas static pressure bearing 226 and fill the receiving chamber, forming a third air film. The third air film generates a supporting force within the receiving chamber to support the suspension of the vibrating rod 223 and reduce the contact between the vibrating rod 223 and the inner wall of the receiving chamber. The above configuration simplifies the problem of complex structures caused by existing ultrasonic vibration devices requiring functional components such as ultrasonic power supplies, transducers, and amplitude transformers, and reduces costs.

[0057] Furthermore, gas static bearings include toroidal throttle type gas static bearings or orifice throttle type gas static bearings.

[0058] In this embodiment, the types of gas static bearings include toroidal throttle type gas static bearings and orifice throttle type gas static bearings. The toroidal throttle type gas static bearing is a type of gas static bearing that regulates gas flow through a toroidal throttle. Its advantage lies in providing a uniform and stable gas film, reducing friction between the vibrating rod 223 and the gas static bearing, and improving the suspension stability and motion accuracy of the vibrating rod 223. This gas film is uniformly distributed across the entire surface of the gas static bearing, thereby effectively supporting the vibrating rod 223 and reducing vibration errors.

[0059] As one implementation method, since the gas static pressure ultrasonic vibration device 22 has low requirements for axial movement and radial load, the third gas static pressure bearing 226 can be a toroidal throttle type gas static pressure bearing with simple processing technology, easy maintenance, and good stability, thereby reducing costs and also reducing the air hammer phenomenon of the third gas static pressure bearing 226. It should be noted that the above is only an example, and the present invention does not limit the specific implementation.

[0060] Small-aperture throttling gas static bearing is a type of gas static bearing that uses a small-diameter throttling orifice to regulate gas flow. Its advantages are that it can achieve high gas film pressure in a small volume, making it suitable for applications with strict requirements on space and gas flow. It can provide stable support force under different working conditions and effectively reduce the movement error of the vibrating rod 223.

[0061] As another implementation, since the first air static bearing 224 and the second air static bearing 225 need to control the vibration of the vibrating rod 223 to drive the machining table 21 to vibrate, a small-hole throttling type air static bearing with greater load-bearing capacity and stiffness can be used, so that it has greater load-bearing capacity and stiffness for the machining table 21 installed on the air static ultrasonic vibration device 22. It should be noted that the number of air holes provided on the first air static bearing 224 and the second air static bearing 225 is different.

[0062] In summary, in practical applications, appropriate types of gas static bearings can be selected according to requirements to optimize the performance of the gas static ultrasonic vibration device 22, ensuring that the PCB processing equipment can operate efficiently under various operating conditions. Specifically, this invention does not limit the scope of the invention.

[0063] Furthermore, the pneumatic ultrasonic vibration device 22 includes a silencer 2215; the bearing mounting cover 221 is provided with an outlet communicating with the accommodating chamber, and the silencer 2215 is located at the outlet.

[0064] In some embodiments, the silencer 2215 can be fixed to the outlet of the bearing mounting base 222, which communicates with the accommodating chamber, by bolts, clamps, or flanges, to reduce the noise generated by the pneumatic ultrasonic vibration device 22 during operation, thereby improving the comfort of the working environment and the quietness of the equipment operation. The silencer 2215 can be of various types, including but not limited to: perforated silencers, diffuser silencers, and reflective silencers.

[0065] Furthermore, the processing worktable 21 is provided with a groove; the bearing mounting cover 221 is embedded in the groove.

[0066] In some embodiments, the size and shape of the groove need to match the shape of the bearing mounting cover 221 to ensure that the bearing mounting cover 221 can be accurately embedded therein. Typically, the depth, width, and shape of the groove can be preset as needed to ensure that the bearing mounting cover 221 can be stably fixed within the groove without displacement or loosening. The number of grooves is related to the placement and number of the pneumatic ultrasonic vibration device 22. During installation, the bearing mounting cover 221 can be placed into the groove, and its outer edge fits snugly against the inner wall of the groove, forming a secure fixation. By embedding the bearing mounting cover 221 into the groove of the machining table 21, the bearing mounting cover 221 can be firmly fixed to the machining table 21, thereby improving the overall stability of the pneumatic ultrasonic vibration table 2. Furthermore, because the embedded structure makes it easier to position and fix the components, the above design also simplifies the assembly and disassembly process.

[0067] In one embodiment, the PCB processing equipment further includes a bed 6 and a movable platform 3 disposed below the pneumatic vibration table 2; the movable platform 3 is provided with a first through hole 31 communicating with an air inlet 2214 and a second through hole 32 communicating with a muffler 2215; the bearing mounting base 222 is detachably connected to the movable platform 3; the movable platform 3 is detachably connected to the bed 6.

[0068] In some embodiments, by providing a first through hole 31 and a second through hole 32 on the mobile platform 3, and connecting the first through hole 31 to the air inlet 2214, it is ensured that high-pressure gas can enter the interior of the pneumatic ultrasonic vibration device 22. Furthermore, the second through hole 32 is connected to a silencer 2215, so that the gas entering the pneumatic ultrasonic vibration device 22 can be reduced in noise after passing through the silencer 2215.

[0069] During operation, high-pressure air is introduced into the air inlet of the pneumatic ultrasonic vibration device 22 through the first through-hole 31 of the moving platform 3. The high-pressure air is guided to the corresponding position at the air inlet, thereby driving the vibrating rod 223 to vibrate in the first direction. At the same time, the second through-hole 32 on the moving platform 3 is connected to the silencer 2215, which allows the noise generated by the pneumatic ultrasonic vibration device 22 during operation to be effectively reduced by the silencer 2215. This reduces the noise caused by high-pressure air, improves the working environment comfort of the PCB processing equipment, and enhances the working experience of the operators.

[0070] In one embodiment, the PCB processing equipment further includes a gantry system, a first motion component 7, a second motion component 8, a third motion component 9, and a spindle fixing component 10.

[0071] In some embodiments, the gantry system includes a beam base 4 and a beam 5 disposed on the beam base 4. Specifically, the beam base 4 includes a first base 41 and a second base 42 spaced apart. One end of the first base 41 and the second base 42 are connected to the beam 5 by fasteners or other means, thereby forming the gantry system. This connection method allows the PCB processing equipment to be quickly disassembled and reassembled when it needs to be moved or adjusted, improving the operating efficiency and flexibility of the PCB processing equipment. The beam 5 can also be made of a rigid material, such as marble, steel, or aluminum alloy, to ensure that it can withstand the weight of the spindle 1 and the load caused by its movement during processing, preventing deformation. The length and strength of the beam 5 can be customized according to the processing area and processing requirements, and are not limited here.

[0072] Furthermore, a channel is formed between the gantry system and the bed 6. As an example, one end of the first base 41 and the second base 42 can be connected to the crossbeam 5, and the other end can be connected to the bed 6, thereby forming a channel for moving the pneumatic-static vibration table 2 between the first base 41 and the second base 42.

[0073] Furthermore, the spindle 1 is connected to one side of the spindle fixing assembly 10, the other side of the spindle fixing assembly 10 is connected to one end of the first motion assembly 7, the other end of the first motion assembly 7 is connected to one end of the second motion assembly 8, and the other end of the second motion assembly 8 is connected to the gantry system; the first motion assembly 7 can drive the spindle fixing assembly 10 to move along a first direction, so that the spindle fixing assembly 10 drives the spindle 1 to move along the first direction; the second motion assembly 8 can drive the first motion assembly 7 to move along a second direction, so that the spindle 1 moves along the second direction.

[0074] In some embodiments, one side of the spindle fixing assembly 10 can be connected to the spindle 1 via a detachable connection device (such as bolts or clamps), allowing for easy installation and removal of 1 as needed. The other side of the spindle fixing assembly 10 is connected to one end of the first motion assembly 7 via a similar detachable connection device. This ensures that the first motion assembly 7 can drive the spindle fixing assembly 10 to move along a first direction, thereby causing the spindle 1 to move along the first direction. The other end of the first motion assembly 7 is connected to one end of the second motion assembly 8 via a detachable connection device, and the other end of the second motion assembly 8 is connected to the crossbeam 5 via a similar detachable connection device. In this way, while the first motion assembly 7 drives the spindle fixing assembly 10 to move along the first direction, the second motion assembly 8 can drive the first motion assembly 7 to move along a second direction, thereby causing the spindle 1 to move synchronously in the first and second directions. This improves processing flexibility, meets the requirements of different processing techniques, and simplifies the installation and maintenance process of PCB processing equipment.

[0075] In one embodiment, the first motion assembly 7 includes a first linear motor, a first rolling guide rail, a first slider, and a base plate. The first linear motor and the first rolling guide rail are fixed to the front side of the base plate. The first slider is disposed on the first rolling guide rail and connected to the first linear motor and one side of the spindle fixing assembly 10, while the spindle 1 is fixed to the other side of the spindle fixing assembly 10. During operation, by controlling the first linear motor, it drives the first slider to move smoothly along the first rolling guide rail in a first direction, thereby driving the spindle fixing assembly 10 to move in the first direction, for example, the Z-axis direction, thereby driving the spindle 1 to move in the first direction. The first motion assembly 7 can use a high-precision and low-friction material (e.g., steel or aluminum alloy) to ensure that the first slider moves smoothly on the first guide rail and avoids affecting machining accuracy due to vibration or friction.

[0076] In one embodiment, the second motion component 8 includes a second linear motor, a second rolling guide rail, and a second slider. The second linear motor and the second rolling guide rail are mounted on the crossbeam 5, and the second slider is disposed on the second rolling guide rail and connected to the back of the base plate and the second linear motor. During operation, by controlling the second linear motor, it drives the second slider to move along the second rolling guide rail in a second direction, for example, the X-axis direction, thereby driving the first motion component 7 to move in the second direction, which in turn drives the spindle 1 on the spindle fixing component 10 to move in the second direction. This connection method allows the spindle 1 to move precisely in two directions, forming a complete two-dimensional motion plane, for example, the ZX plane, realizing comprehensive control of the spindle 1 and meeting the precision requirements of different PCB board 11 processing.

[0077] Furthermore, one end of the third motion component 9 is connected to the bed 6, and the other end is connected to the moving platform 3; the third motion component 9 can drive the moving platform 3 to move along a third direction, so that the moving platform 3 can move the pneumatic vibration table 2 into or out of the channel; In some embodiments, the third motion assembly 9 can be connected to the bed 6 and the pneumatic vibration table 2 via threaded connections, pin connections, key connections, or quick-locking devices, allowing the third motion assembly 9 to be easily disassembled or adjusted when needed, facilitating maintenance or component replacement. The main function of the third motion assembly 9 is to drive the pneumatic vibration table 2 to move in a third direction, such as the Y-axis, thereby enabling the pneumatic vibration table 2 to flexibly move in and out of the channel formed between the crossbeam base 4 and the crossbeam 5.

[0078] For example, when processing large PCB boards 11, the pneumatic vibration table 2 can be moved along a third direction by the third motion component 9, which makes it convenient to move the PCB board 11 from outside the PCB processing equipment into the processing area, or to move it out of the processing area after processing. This makes the operation of the PCB processing equipment more flexible, and can significantly improve production efficiency, especially in batch production or complex board processing.

[0079] Furthermore, the third motion component 9 includes a third linear motor, a third rolling guide rail, and a third slider. The third linear motor and the third rolling guide rail are mounted on the bed 6, and the third slider is disposed on the third rolling guide rail and connected to the moving platform 3 and the third linear motor. During operation, by controlling the third linear motor, it drives the third slider to move along the third rolling guide rail in a third direction, thereby driving the moving platform 3 to move in a third direction upward, and driving the pneumatic-static vibration table 2 to move in a third direction. This allows for flexible entry and exit within the channel, forming a complete three-dimensional motion plane, such as the ZXY plane, which meets the processing accuracy requirements of different PCB boards 11.

[0080] In summary, the first motion component 7 and the second motion component 8 drive the spindle 1 to perform precision machining in the first and second directions, respectively. After machining is completed, the third motion component 9 drives the moving platform 3 to move in the third direction, thereby moving the pneumatic vibration table 2 out of the machining area along the third direction. This allows operators to easily unload and reload the PCB board 11. The entire process improves the working efficiency and operational convenience of the PCB processing equipment.

[0081] Furthermore, the first, second, and third directions are mutually perpendicular. Specifically, this perpendicularity ensures that the first motion component 7, the second motion component 8, and the third motion component 9 do not interfere with each other when working independently in their respective directions, thus achieving precise and stable motion control. For example, when the first motion component 7 drives the spindle 1 to move in the first direction, the second motion component 8 can simultaneously adjust its processing position in the second direction, while the third motion component 9 can flexibly adjust the movement of the moving platform 3 in the third direction. Through this design, the PCB processing equipment can be precisely positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0082] In one embodiment, such as Figure 6 and Figure 7 As shown, the spindle fixing assembly 10 includes a spindle clamp assembly 14, a chip suction assembly 15, and a lifting assembly 16 for controlling the lifting of the chip suction assembly 15; one side of the spindle clamp assembly 14 is detachably connected to the first motion assembly 7; the other side of the spindle clamp assembly 14 is detachably connected to the lifting assembly 16; and the end of the lifting assembly 16 is detachably connected to the chip suction assembly 15.

[0083] In some embodiments, one side of the spindle clamp assembly 14 is connected to the first motion assembly 7 via a detachable connecting device (e.g., bolts, clamps, or other mechanical fasteners), allowing the spindle clamp assembly 14 to be easily installed and removed from the first motion assembly 7 as needed. The other side of the spindle clamp assembly 14 is connected to the lifting assembly 16 via a similar detachable connecting device, thus fixing the lifting assembly 16 to the other side of the spindle clamp assembly 14. The end of the lifting assembly 16 is connected to the chip suction assembly 15 via a detachable connecting device, allowing the lifting of the lifting assembly 16 to be controlled according to processing requirements during machining, thereby adjusting the height of the chip suction assembly 15. During operation, under the control of the lifting assembly 16, the chip suction assembly 15 can rise and fall accordingly based on the position changes of the spindle 1, effectively collecting and removing debris generated during machining and maintaining the cleanliness of the machining area.

[0084] In one embodiment, the spindle clamp assembly 14 may include a spindle clamp rear seat 141 and a spindle clamp front cover 142. Specifically, the spindle 1 can be fixed between the spindle clamp rear seat 141 and the spindle clamp front cover 142. For example, the spindle 1 can be embedded in the spindle clamp rear seat 141, and then the spindle clamp front cover 142 can be tightly connected to the spindle clamp rear seat 141 by threads or snaps, thereby fixing the spindle 1.

[0085] In one embodiment, such as Figure 7 As shown, the chip suction assembly 15 includes a chip suction cover 151 and a pressure member 152 for pressing the PCB board 11; the pressure member 152 is detachably connected to the chip suction cover 151 assembly.

[0086] In some embodiments, the dust collection shroud 151 of the dust collection assembly 15 and the pressure member 152 can be connected by bolts, nuts, clamps, or other mechanical fasteners. These connections allow the pressure member 152 to be easily installed or removed from the dust collection shroud 151 as needed, while ensuring that the two are securely joined together during operation. The pressure member 152 is responsible for pressing the PCB board 11, thereby maintaining the stability of the PCB board 11 during processing. The design of the pressure member 152 and its connection to the dust collection shroud 151 ensures that the pressure member 152 can be firmly fixed to the dust collection shroud 151, so that the PCB board 11 can receive uniform pressure.

[0087] During installation, the pressure component 152 can be mated with the chip suction cover 151 and secured together using bolts or other connecting devices. This ensures that the pressure component 152 presses firmly against the PCB board 11, preventing movement during processing, while the chip suction cover 151 effectively collects the cutting chips generated during processing. This design simplifies the installation and removal of the chip suction assembly 15, while also ensuring convenient maintenance of the PCB processing equipment.

[0088] In one embodiment, the processing types of the PCB board 11 include drilling, routing, milling, or cutting. During the processing of the PCB board 11, common processing types include drilling, routing, milling, and cutting, depending on different requirements and design specifications. Specifically: Drilling is a processing method that creates holes in a PCB board.

[0089] In one implementation, when drilling a hole in the PCB board 11 using the machining tool 12, the pneumatic vibration table 2 is driven to vibrate at a high frequency in a first direction (e.g., perpendicular to the surface of the PCB board 11) with a set amplitude and frequency. This vibration causes periodic contact and separation between the machining tool 12 and the PCB board 11, effectively reducing cutting force, reducing cutting heat, and promoting timely chip removal. Furthermore, ultrasonic vibration helps remove burrs and residues generated during drilling, improving the quality of the drilling.

[0090] A roulette wheel is a processing method that removes excess material from a PCB board 11 to form a specific shape or structure.

[0091] In one implementation, when the machining tool 12 performs a milling operation on the PCB board 11, the pneumatic vibration table 2 is driven to vibrate at a high frequency in the first direction with a set amplitude and frequency, so that the machining tool 12 can accurately remove excess material from the PCB board 11 along a preset trajectory. In this process, ultrasonic vibration not only significantly reduces cutting resistance and thermal impact, but also ensures the accuracy and integrity of the machining area, promotes smooth chip removal, and effectively prevents tool clogging and wear.

[0092] Milling is a surface treatment and precision machining method for PCB boards.

[0093] As one implementation, when milling the PCB board 11 with the machining tool 12, the pneumatic vibration table 2 is driven to vibrate at a high frequency in the first direction with a set amplitude and frequency, making the cutting process more precise and delicate. This reduces the damage to the PCB board 11 caused by cutting heat and mechanical stress, and ensures the smoothness and accuracy of the machining edge.

[0094] Cutting is a processing method for forming a PCB board into the desired shape and structure.

[0095] In one implementation, when the PCB board 11 is cut by the cutting tool 12, the pneumatic vibration table 2 is driven to vibrate at a high frequency in the first direction with a set amplitude and frequency. This causes a high-frequency impact between the cutting tool 12 and the PCB board 11, thereby achieving precise and efficient cutting. This cutting method not only reduces damage to the PCB board 11 substrate and ensures the smoothness and flatness of the processed edges, but also greatly improves processing accuracy and production efficiency.

[0096] In one embodiment, the PCB board 11 includes a high aspect ratio PCB board, a multilayer PCB board, or a high-density interconnect (HDI) PCB board. Specifically, a high aspect ratio PCB board refers to a PCB board 11 with a relatively large thickness, for example, a PCB board 11 with a thickness of 1.0 mm to 10.0 mm. A multilayer PCB board refers to a circuit board composed of multiple PCB boards 11 stacked together, with each layer having an independent circuit pattern and connection structure, for example, a PCB board 11 with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm. A high-density interconnect (HDI) PCB board refers to a PCB board with a high wiring density.

[0097] The second aspect provides a PCB processing method applicable to the PCB processing equipment described in the first aspect embodiment, such as... Figure 8 and Figure 9 As shown, the PCB processing equipment includes a pneumatic ultrasonic vibration device 22, a control system 100, a pneumatic supply and pressure processing system 200, a pneumatic control system 300, and a detection system 400. The PCB processing method includes: S10. Obtain the processing parameters of PCB board 11; In this embodiment, the processing parameters of PCB board 11 include PCB board parameters and processing type parameters. Specifically, the PCB board parameters include PCB board type and PCB board inherent parameters. Among them, the PCB board type includes high aspect ratio PCB board, multilayer PCB board or high density interconnect (HDI) PCB board; the PCB board parameters include high aspect ratio PCB board parameters, multilayer PCB board parameters or high density interconnect PCB board parameters.

[0098] As an example, high aspect ratio PCB board parameters include: Thickness: For example, 1.0mm to 10.0mm; Aperture: for example, 0.2mm to 1.0mm; Aspect ratio: for example, 5:1 to 10:1 or higher; Material type: For example, FR-4 material.

[0099] Parameters for multilayer PCBs include: Number of floors: For example, 4 to 20 floors or more; Total thickness: for example, 1.5mm to 10.0mm; Material type: For example, FR-4 material.

[0100] High-density interconnect PCB board parameters include: Thickness: for example, 0.5mm to 3.0mm; Aperture: for example, 0.1mm to 0.3mm; Line width and spacing: for example, 50µm to 150µm.

[0101] Material type: For example, low dielectric constant materials.

[0102] Machining type parameters include drilling parameters, milling parameters, milling parameters, or cutting parameters.

[0103] Specifically, drilling parameters include: drilling depth, spindle speed, and feed rate.

[0104] The parameters of the router include: cutting width, router cutter diameter, cutting speed, router cutter speed, and feed rate.

[0105] Milling parameters include: depth of cut, cutter diameter, spindle speed, and feed rate.

[0106] Cutting parameters include: cutting depth, cutting speed, and cutting accuracy.

[0107] S20. Determine the target vibration parameters corresponding to the processed PCB board 11 based on the processing parameters; In this embodiment, the target vibration parameters include amplitude and frequency. Specifically, the amplitude ranges from 1µm to 20µm, and the frequency ranges from 2kHz to 40kHz. Preferably, the amplitude can be configured as 5µm, 10µm, 15µm, or 18µm, and the frequency can be configured as 5kHz, 10kHz, 20kHz, 30kHz, or 35kHz; no specific limitation is imposed. The amplitude and frequency suitable for the PCB board 11 are determined based on its processing parameters to optimize the processing effect and ensure processing quality. Specifically, the corresponding amplitude and frequency can be preset according to the processing parameters of the PCB board 11. Furthermore, the corresponding amplitude and frequency can be automatically retrieved by inputting the processing parameters of the PCB board 11. Other methods can also be used to determine the amplitude and frequency; no limitation is imposed here.

[0108] As an example, a database of processing parameters for PCB board 11 can be pre-established, covering the aforementioned processing parameters of PCB board 11, the corresponding amplitude and frequency of PCB board 11, and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitude and frequency corresponding to the processing parameters of PCB board 11.

[0109] Specifically, when the user inputs the processing parameters of PCB board 11, the control system immediately initiates an automatic query and matching mechanism to quickly filter out similar or related cases from the historical database based on the input processing parameters of PCB board 11. Then, the system uses a parameter prediction model to intelligently analyze the amplitude and frequency settings in these cases, comprehensively considering multiple dimensions such as processing accuracy, processing quality, and tool wear, and finally recommends the optimal amplitude and frequency.

[0110] For example, a user needs to process a batch of PCB boards 11 with a thickness of 1.6mm, a hole diameter of 0.3mm, and a material type of FR-4. After inputting these parameters, the control system determines the corresponding amplitude and frequency through a pre-trained parameter prediction model; for example, the amplitude is set to 2.5µm and the frequency is set to 30kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0111] As another example, a table relating the processing parameters of PCB board 11 to amplitude and frequency can be pre-established. When the user inputs the processing parameters of PCB board 11, the control system determines the corresponding amplitude and frequency of PCB board 11 by querying the pre-established table. For example, a 1.0mm thick high aspect ratio PCB board corresponds to a frequency of 30kHz and an amplitude of 1.5µm. A 2.0mm thick high aspect ratio PCB board corresponds to a frequency of 28kHz and an amplitude of 2µm. It should be noted that the above is only an example; the specific processing parameters of PCB board 11, and the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.

[0112] S30. According to the target vibration parameters, control the pneumatic vibration table 2 to vibrate along the first direction, so as to drive the PCB board 11 on the pneumatic vibration table 2 to vibrate in the first direction, so that the high-speed rotating processing tool 12 and the PCB board 11 form periodic contact and separation, so as to realize the processing of the PCB board 11.

[0113] In this embodiment, based on the target vibration parameters determined in step S20, the pneumatic vibration table 2 is controlled to perform stable micron-level vibration along a first direction. As the pneumatic vibration table 2 vibrates, the PCB board 11 fixed on it also vibrates, causing the high-speed rotating machining tool 12 to periodically contact and separate from the PCB board 11 during the machining process. This effectively reduces the continuous friction between the machining tool 12 and the PCB board 11, thereby reducing the cutting force and cutting temperature, and achieving efficient and precise machining of the PCB board 11.

[0114] For example, taking a 5.4mm high aspect ratio PCB board and drilling a 0.2mm through hole as an example: Assuming the spindle speed 1 is set to 100,000 rpm, the drill bit's machining speed is 20 µm / revolution, and the pneumatic vibration table 2 has an amplitude of 10 µm and a frequency of 20 kHz, the drill bit's feed rate is 33.33 mm / s. This can be calculated as follows: multiply the drill bit's machining speed (20 µm / revolution) by the spindle speed 1's revolutions per second (1666.67 rpm), and then convert the units. The spindle speed 1 is 100,000 rpm, or 100,000 revolutions per minute. Converting this to revolutions per second, we get 100,000 ÷ 60 = 1666.67 rpm (approximately 1666.67 revolutions per second).

[0115] During operation, the pneumatic vibration table 2 has an amplitude of 10µm and a frequency of 20kHz, meaning it vibrates 20,000 times per second. Under this setting, the actual feed displacement corresponding to each vibration is 1.67µm (calculated as 33.33mm / 20,000 times). Thus, during drilling, the pneumatic vibration table 2 undergoes 20,000 ultrasonic vibrations. The displacement generated on the PCB board 11 by each vibration is much greater than the actual drilling displacement, allowing the drill bit to effectively perform micron-level cutting on the PCB board 11 during each vibration. Under ultrasonic vibration conditions, the drill bit does not continuously drill 33.33mm, but rather performs high-frequency, micro-scale (1.67µm) vibration cutting simultaneously with drilling. This micron-level cutting significantly improves cutting efficiency and quality, effectively reduces cutting force and temperature, reduces drill bit wear, and improves machining accuracy and surface quality. It should be noted that the above is merely an example and does not constitute a limitation of the invention.

[0116] Optionally, after step S10, that is, after obtaining the processing parameters of PCB board 11, the following steps are included: S40. Control the spindle 1 to move to a preset position above the pneumatic vibration worktable 2, and control the spindle 1 to rotate at high speed according to the preset speed, so as to drive the machining tool 12 set on the spindle 1 to rotate at high speed.

[0117] In this embodiment, after obtaining the processing parameters of the PCB board 11, the spindle 1 is further controlled to move to a preset position above the pneumatic vibration table 2. This process aims to ensure the accurate positioning of the spindle 1 so that the processing tool 12 can be aligned with the PCB board 11 at an appropriate distance and angle for effective processing. Next, controlling the spindle 1 to rotate at a preset speed ensures that the processing tool 12 can effectively cut or drill. The speed setting depends on the obtained processing parameters; for example, different types of PCB boards 11 require different speeds. The drive system of the spindle 1 is adjusted according to the set speed to achieve a stable rotational speed. For example, when processing PCB boards with a high aspect ratio, the spindle 1 speed can be set to 50,000 revolutions per minute to reduce the wear of the processing tool 12 and ensure processing stability.

[0118] In one embodiment, such as Figure 10 As shown, the pneumatic vibration table 2 includes a processing table 21 and a pneumatic ultrasonic vibration device 22. In step S30, which involves controlling the pneumatic vibration table 2 to vibrate along a first direction according to the target vibration parameters, the following steps are included: S31. Output the corresponding current signal according to the target vibration parameters; S32. Convert the current signal into a gas signal, and control the input air pressure of the gas static pressure ultrasonic vibration device 22 according to the gas signal, so that the gas static pressure ultrasonic vibration device 22 drives the PCB board 11 on the processing worktable 21 to vibrate in the first direction.

[0119] In this embodiment, after determining the amplitude and frequency, the control system further outputs a corresponding current signal and sends it to the pneumatic control system. Based on the received current signal, the pneumatic control system controls a dedicated signal conversion device to convert the current signal into a pneumatic signal. For example, firstly, an electro-pneumatic converter (e.g., an E / P converter) or a proportional solenoid valve is used to convert the current signal into a pneumatic signal. Then, the converted pneumatic signal is amplified by a pneumatic-pneumatic positioner to precisely control the opening of the pressure regulating valve, thereby precisely controlling the input air pressure of the pneumatic ultrasonic vibration device 22. This achieves precise control of the amplitude and frequency of the pneumatic ultrasonic vibration device 22, enabling the pneumatic ultrasonic vibration device 22 to drive the PCB board 11 on the processing workbench 21 to vibrate in the first direction according to the input air pressure. One end of the pressure regulating valve is connected to the air inlet of the pneumatic ultrasonic vibration device 22, and the other end is connected to the air source pressure supply system. This allows the pneumatic control system to adjust the input air pressure from the air source pressure supply system to the pneumatic ultrasonic vibration device 22 by controlling the opening of the pressure regulating valve.

[0120] It should be noted that the air supply pressure treatment system may include an air dryer, a main pipeline filter, an oil mist separator, and an air storage tank. The air dryer removes most of the moisture from the compressed air; the main pipeline filter filters impurities from the air; the oil mist separator removes oil mist particles from the air; the air storage tank stabilizes the air pressure and reduces airflow fluctuations; and the ultrafine oil mist separator deeply purifies the air, ensuring extremely dry and pure input air pressure. Furthermore, one end of the air dryer is connected to the air source, and the other end is connected to one end of the main pipeline filter, the other end of the main pipeline filter is connected to one end of the oil mist separator, the other end of the oil mist separator is connected to one end of the air storage tank, and the other end of the air storage tank is connected to one end of the pressure regulating valve. By setting up the above air supply pressure treatment system, the high-pressure air input to the pneumatic ultrasonic vibration device 22 is dry and pure compressed air, ensuring the stable performance and reliable operation of the pneumatic ultrasonic vibration device 22.

[0121] For example, when processing a PCB board with a thickness of 2.5mm and a high aspect ratio, the frequency of the pneumatic ultrasonic vibration device 22 is determined to be 25kHz and the amplitude to be 2µm. Next, the control system calculates the corresponding current signal, assuming it to be 100mA, and converts this current signal into a pneumatic signal via an E / P converter. This signal is then further converted into a precise input air pressure, for example, 0.5MPa, by an air-to-air positioner. This precisely controls the opening of the pressure regulating valve, introducing high-pressure air into the interior of the pneumatic ultrasonic vibration device 22, where it contacts the air-bearing vibrating plate 227 fixed to the vibrating rod 223. The air-bearing vibrating plate 227 drives the vibrating rod 223 to vibrate in the first direction, thereby precisely controlling the vibration of the processing table 21. This effectively reduces stress accumulation and interlayer separation during processing, improves processing efficiency, and reduces defect rates and material waste. It should be noted that the working air pressure of the pneumatic ultrasonic vibration device 22 is 0.55MPa to 0.65MPa, and the minimum working air pressure without ultrasound is 0.45MPa to 0.55MPa. The above embodiment solves the problem of continuous noise generated during processing or when not processing by controlling the input pressure within the range of 0.45MPa to 0.55MPa, improving the comfort of the working environment, reducing the impact on the health of operators, effectively extending the service life of the pneumatic ultrasonic vibration device 22, and improving the overall performance of the PCB processing equipment.

[0122] In one embodiment, such as Figure 11 As shown, after step S30, that is, after controlling the pneumatic ultrasonic vibration device 22 to drive the machining tool 12 to vibrate in the first direction according to the target vibration parameters, the following steps are included: S50. Obtain the actual vibration parameters of the pneumatic ultrasonic vibration device 22; S60. Compare the actual vibration parameters with the target vibration parameters to obtain the comparison results; S70. If the comparison result is a match, then begin processing of PCB board 11. S80. If the comparison result is mismatched, adjust the input air pressure of the pneumatic ultrasonic vibration device 22 until the actual vibration parameters match the target vibration parameters.

[0123] In this embodiment, to ensure that the pneumatic ultrasonic vibration device 22 achieves the target vibration parameters when driving the machining table 21, the control system acquires the actual vibration parameters of the pneumatic ultrasonic vibration device 22 as detected in real time by the detection system. These parameters include key data such as the actual amplitude and frequency. The detection system may include high-precision sensors or detection devices. Specifically, high-precision sensors or detection devices can be installed inside the machining table 21 or at other locations to accurately measure the vibration of the machining table 21 and send the measured actual vibration parameters to the control system.

[0124] Next, the control system compares the acquired actual vibration parameters with the preset target vibration parameters to obtain the comparison result. If the actual vibration parameters perfectly match the target vibration parameters, the control system will confirm that the ultrasonic vibration conditions have been met and allow the processing of the PCB board 11 to begin. In this case, the pneumatic ultrasonic vibration device 22 drives the processing table 21 to work at the set frequency and amplitude, thereby causing the processing table 21 to drive the PCB board 11 on it to vibrate at the set frequency and amplitude, ensuring the processing quality and efficiency of the PCB board 11.

[0125] If the comparison results show a difference between the actual vibration parameters and the target vibration parameters, the control system will automatically make adjustments. For example, it will adjust the input air pressure of the pneumatic ultrasonic vibration device 22 to change the vibration characteristics of the processing table 21 until the actual vibration parameters match the target vibration parameters. This adjustment process may require multiple iterations, and after each adjustment, the system will re-monitor the actual vibration parameters to ensure that the vibration state of the processing table 21 meets the requirements. This process improves the processing quality and consistency of the PCB board 11. It should be noted that the above is merely an example and does not constitute a limitation of this application.

[0126] In one embodiment, such as Figure 12 As shown, in step S80, if the comparison result is a mismatch, the input air pressure of the pneumatic ultrasonic vibration device 22 is adjusted until the actual vibration parameters match the target vibration parameters, including the following steps: S81. Obtain the input air pressure; S82. Determine if the input air pressure exceeds the preset range; S83. If the input air pressure exceeds the preset range, an alarm will be triggered and / or the pneumatic ultrasonic vibration device 22 will be stopped working. S84. If the input air pressure does not exceed the preset range, adjust the input air pressure until the actual vibration parameters match the target vibration parameters.

[0127] In this embodiment, to ensure that the pneumatic ultrasonic vibration device 22 achieves the expected vibration effect, if the actual vibration parameters do not match the target vibration parameters, the current input air pressure value will be obtained. This step can be achieved through a built-in air pressure sensor to ensure that the control system can monitor air pressure changes in real time. Next, it is determined whether the current input air pressure exceeds a preset range. The preset range is a pre-set safe operating range for the pneumatic ultrasonic vibration device 22, for example, 0.2MPa to 0.8MPa. Preferably, the input air pressure range can be configured to 0.4MPa to 0.6MPa, but the specific range is not limited.

[0128] If the input air pressure exceeds the preset range, an alarm will be triggered immediately. This alarm can be an audible or visual warning, alerting the operator to abnormal air pressure and / or stopping the pneumatic ultrasonic vibration device 22 to prevent damage to the PCB processing equipment or a decrease in processing accuracy due to abnormal air pressure. If the input air pressure is within the preset range, the air pressure will continue to be adjusted until the actual vibration parameters match the target vibration parameters, ensuring that the pneumatic ultrasonic vibration device 22 operates under optimal conditions, thereby achieving high-precision processing results.

[0129] For example, the target vibration parameters are an amplitude of 3µm and a frequency of 25kHz. The initially measured actual vibration parameters are an amplitude of 2µm and a frequency of 22kHz. Comparing the actual and target parameters, the amplitude is found to be lower than the target value, while the frequency is higher. At this point, the control system acquires the current input air pressure, assuming it is measured to be 0.5MPa. Next, it determines whether this air pressure is within the preset safety range. Since 0.5MPa is within this range, no alarm will be triggered or operation will stop; instead, adjustments will continue.

[0130] The input air pressure is then adjusted. This is done by increasing the air pressure, for example, adjusting it to 0.6 MPa. During the adjustment process, the control system continuously monitors the actual vibration parameters to verify the adjustment effect. If the actual vibration parameters after adjustment have an amplitude of 3 µm and a frequency of 25 kHz, these parameters match the target vibration parameters, confirming that the new actual vibration parameters have met the target standard, indicating successful adjustment. After confirming the match, the processing of PCB board 11 is initiated. During processing, the control system continues to monitor the actual vibration parameters to ensure they remain within the set range, guaranteeing processing quality and equipment stability. This process not only improves processing quality and efficiency but also optimizes the operational stability of the PCB processing equipment, making it suitable for various applications with stringent ultrasonic processing requirements. It should be noted that the above is merely an example and does not constitute a limitation.

[0131] The third aspect provides a PCB processing system, which includes at least one PCB processing device as described in the first aspect embodiment.

[0132] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A PCB processing apparatus characterized by comprising: The application relates to a gas static pressure vibration workbench. The gas static pressure vibration workbench comprises a gas static pressure ultrasonic vibration workbench; the gas static pressure ultrasonic vibration workbench comprises a machining workbench and a gas static pressure ultrasonic vibration device.

2. The PCB processing apparatus according to claim 1, wherein The gas static pressure ultrasonic vibration device is used for driving the PCB board on the machining workbench to vibrate in the first direction with a set amplitude and frequency during machining, so that the high-speed rotating machining tool and the PCB board form periodic contact and separation, and the machining of the PCB board is realized. The gas static pressure ultrasonic vibration device comprises an ultrasonic vibration device which realizes the vibration and rotation of a vibration rod arranged in the ultrasonic vibration device in a cyclone floating state according to the principle of aerodynamics.

3. The PCB processing apparatus according to claim 2, wherein The gas static pressure ultrasonic vibration device comprises a bearing mounting cover, a bearing mounting base and a vibration rod.

4. The PCB processing apparatus according to claim 2, wherein The output end of the vibration rod is detachably connected with the machining workbench.

5. The PCB processing apparatus according to claim 2, wherein The bearing mounting cover is detachably connected with the bearing mounting base. The vibration rod is arranged in a containing cavity formed by the bearing mounting cover and the bearing mounting base, and is used for driving the machining workbench to vibrate in the first direction, so as to drive the PCB board to vibrate in the first direction. The gas static pressure ultrasonic vibration device further comprises a first gas static pressure bearing, a second gas static pressure bearing and an air floating vibration plate arranged on the vibration rod. The first gas static pressure bearing is fixedly arranged on the bearing mounting cover.

6. The PCB processing apparatus according to claim 5, wherein The second gas static pressure bearing is fixedly arranged on the bearing mounting base. The central axis of the vibration rod is perpendicular to the central axes of the first gas static pressure bearing and the second gas static pressure bearing, and the air floating vibration plate is arranged between the first gas static pressure bearing and the second gas static pressure bearing. The bearing mounting base is provided with an air inlet hole, the first gas static pressure bearing and the bearing mounting cover are provided with a first air inlet channel, and the second gas static pressure bearing and the bearing mounting base are provided with a second air inlet channel. The first air inlet channel and the second air inlet channel are communicated with the air inlet hole, so that the high-pressure air introduced from the air inlet hole enters the first annular air groove on the first gas static pressure bearing through the first air inlet channel, and a first air film is formed between the first gas static pressure bearing and the air floating vibration plate. A second air film is formed between the second gas static pressure bearing and the air floating vibration plate through the second air inlet channel. The first air film and the second air film generate different pressures on the two sides of the air floating vibration plate, so that the air floating vibration plate drives the vibration rod to vibrate in the first direction. The gas static pressure ultrasonic vibration device further comprises a third gas static pressure bearing. ​ 7. The PCB processing apparatus according to claim 6, wherein ​ The third aerostatic bearing is fixedly installed on the bearing installation base; A third air inlet is arranged between the third aerostatic bearing and the bearing installation base; The third air inlet is communicated with the air inlet hole, so that the high-pressure air introduced by the air inlet hole enters the third annular air groove on the third aerostatic bearing through the third air inlet, and then fills the accommodating cavity to form a third air film for supporting the vibration rod to be suspended.

8. The PCB processing apparatus according to claim 7, wherein The aerostatic bearing comprises a torus restrictor type aerostatic bearing or a small hole restrictor type aerostatic bearing.

9. The PCB processing apparatus according to claim 7, wherein The aerostatic ultrasonic vibration device further comprises a muffler; The bearing installation base is provided with an outlet communicated with the accommodating cavity, and the muffler is arranged at the outlet.

10. The PCB processing apparatus according to claim 9, wherein The processing workbench is provided with a groove; The bearing installation cover is embedded in the groove.

11. The PCB processing apparatus according to claim 10, wherein The PCB processing equipment further comprises a bed and a moving platform arranged below the aerostatic vibration workbench; The moving platform is provided with a first through hole communicated with the air inlet hole and a second through hole communicated with the muffler; The bearing installation base is detachably connected with the moving platform; The moving platform is detachably connected with the bed.

12. The PCB processing apparatus of claim 11, wherein, The PCB processing equipment further comprises a gantry system, a first movement assembly, a second movement assembly, a third movement assembly and a spindle fixing assembly; The gantry system forms a channel with the bed; One side of the spindle fixing assembly is connected with the spindle, and the other side of the spindle fixing assembly is connected with one end of the first movement assembly, the other end of the first movement assembly is connected with one end of the second movement assembly, and the other end of the second movement assembly is connected with the gantry system; One end of the third movement assembly is connected with the bed, and the other end is connected with the moving platform; The first movement assembly can drive the spindle fixing assembly to move in the first direction, so that the spindle fixing assembly drives the spindle to move in the first direction; The second movement assembly can drive the first movement assembly to move in the second direction, so as to drive the spindle to move in the second direction; The third movement assembly can drive the moving platform to move in the third direction, so that the moving platform drives the aerostatic ultrasonic vibration workbench to move into or out of the channel; The first direction, the second direction and the third direction are perpendicular to each other.

13. The PCB processing apparatus of claim 12, wherein, The spindle fixing assembly comprises a spindle clamp assembly, a chip suction assembly and a lifting assembly for controlling the lifting of the chip suction assembly; One side of the spindle clamp assembly is detachably connected with the first movement assembly; The other side of the spindle clamp assembly is detachably connected with the lifting assembly; The end of the lifting assembly is detachably connected with the chip suction assembly.

14. The PCB processing apparatus according to claim 13, wherein, The chip suction assembly comprises a chip suction cover and a pressure component for pressing the PCB board. The pressure component is detachably connected with the chip suction cover assembly.

15. A method of processing a PCB, characterized by, The method is applied to the PCB processing equipment of any one of claims 1-14, and the method comprises: Obtaining the processing parameters of the PCB board; According to the processing parameters, the target vibration parameters corresponding to the processing of the PCB board are determined; According to the target vibration parameter, the aerostatic vibration table is controlled to vibrate in a first direction at a set amplitude and frequency, so as to drive the PCB to vibrate in the first direction, and the high-speed rotating machining tool and the PCB form periodic contact and separation, so as to realize the machining of the PCB.

16. The PCB processing method of claim 15, wherein, After the machining parameter of the PCB is acquired, the method further comprises: The main shaft is controlled to move to a preset position above the aerostatic vibration table, and the main shaft is controlled to rotate at a preset speed, so as to drive the machining tool arranged on the main shaft to rotate at a high speed.

17. The PCB processing method of claim 15, wherein, The aerostatic vibration table comprises an aerostatic ultrasonic vibration table; the aerostatic ultrasonic vibration table comprises a machining table and an aerostatic ultrasonic vibration device; according to the target vibration parameter, the aerostatic ultrasonic vibration table is controlled to vibrate in a first direction at a set amplitude and frequency, which comprises: According to the target vibration parameter, a corresponding current signal is outputted; The current signal is converted into a gas signal, and the input gas pressure of the aerostatic ultrasonic vibration device is controlled according to the gas signal, so that the aerostatic ultrasonic vibration device drives the PCB on the machining table to vibrate in the first direction at a set amplitude and frequency.

18. The PCB processing method of claim 15, wherein, The aerostatic vibration table comprises an aerostatic ultrasonic vibration table; after the aerostatic ultrasonic vibration table is controlled to vibrate in a first direction at a set amplitude and frequency according to the target vibration parameter, the method further comprises: An actual vibration parameter of the aerostatic ultrasonic vibration device is acquired; The actual vibration parameter is compared with the target vibration parameter to obtain a comparison result; If the comparison result is matched, the machining of the PCB is started; If the comparison result is not matched, the input gas pressure of the aerostatic ultrasonic vibration device is adjusted until the actual vibration parameter is matched with the target vibration parameter.

19. The PCB processing method of claim 18, wherein, If the comparison result is not matched, the input gas pressure of the aerostatic ultrasonic vibration device is adjusted until the actual vibration parameter is matched with the target vibration parameter, which comprises: The input gas pressure is acquired; It is determined whether the input gas pressure exceeds a preset range; If the input gas pressure exceeds the preset range, an alarm is triggered and / or the aerostatic ultrasonic vibration device is controlled to stop working; If the input gas pressure does not exceed the preset range, the input gas pressure is adjusted until the actual vibration parameter is matched with the target vibration parameter.

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