Area detection method based on PCB design
By using an automated area inspection method that incorporates etching and expansion calculations, the problem of low efficiency in manual inspection during PCB design has been solved. This method achieves efficient and accurate area inspection, improving product yield and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2026-03-10
AI Technical Summary
The manual inspection of existing PCB designs is inefficient and inaccurate, resulting in long inspection times and high product defect rates, which increases manufacturing costs and rework.
By obtaining the area to be inspected, the reduced area is obtained by etching inward based on the shape and size of the object to be placed. The components within the reduced area are then expanded. A difference operation is performed using polygon boolean operations to automatically detect whether there is a remaining area. If not, the PCB is redesigned to ensure a clear area.
It achieves automated, efficient, and accurate area detection, reducing detection time, improving product yield, and lowering the number of design reworks and manufacturing costs.
Smart Images

Figure CN121645693A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to printed circuit boards, and more specifically to a method for area detection based on PCB design. Background Technology
[0002] Printed circuit boards (PCBs) are a crucial component of the electronics industry. Almost every electronic device, from small items like watches and calculators to large systems like computers, communication devices, and military weaponry, relies on PCBs for electrical interconnection with integrated circuits and other electronic components. The design and manufacturing quality of PCBs directly impacts the overall product quality and cost, and can even determine the success or failure of a business competition.
[0003] The success of PCB design largely depends on the designer's experience. When lacking experience in mass production processes, the manufactured PCBs may not fully meet production or product requirements. For example, auxiliary molds are used during actual PCBA assembly to support the PCB without affecting surrounding components; pins are needed to support the unprocessed sides of the PCB before automatic solder paste printing and mounting; logos, barcodes, and other product markings are printed on the PCB according to product needs; and due to limited designer experience, there may be instances where clearance areas are not reserved in advance, leading to collisions or overlaps between the components to be placed and surrounding parts during PCBA assembly, making assembly difficult or even impossible, or preventing the printing of product markings on the PCBs. This increases the defect rate, leading to rework, increased design and manufacturing costs, and delayed delivery. Therefore, pre-manufacturing inspection of relevant areas in the PCB design is crucial. Currently, this inspection mainly relies on manual methods, manually measuring to find the presence of relevant areas. For complex PCB designs, this is time-consuming, inaccurate, and inefficient. Summary of the Invention
[0004] The purpose of this invention is to provide a region inspection method based on PCB design to solve the problem of low efficiency caused by manual inspection in the prior art.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A method for area detection based on PCB design, characterized by the following steps:
[0007] Step 1: Obtain the area to be inspected on the PCB to be inspected;
[0008] Step 2: Based on the shape and size of the object to be placed, etch the inspection area inward to obtain a reduced inspection area, which is denoted as the reduced total area;
[0009] Step 3: Based on the shape and size of the object to be placed, expand the outline of other components in the reduced total area outward to obtain the union of all expanded areas in the reduced total area, which is denoted as the total expanded area;
[0010] Step 4: Perform a difference operation on the graphs of the reduced and expanded total regions to obtain the remaining region;
[0011] Step 5: If there is a remaining area, it means that the area to be inspected can be used to place the item to be placed.
[0012] If there is no remaining area, it means that the area to be inspected cannot be used to place the object. In this case, the PCB will be redesigned to manufacture a PCB with a clear area that can be used to place the object.
[0013] Complete regional testing.
[0014] Furthermore, step 2 specifically includes:
[0015] 2.1 Determine if the object to be placed is circular;
[0016] If the object to be placed is circular, obtain the radius R of the circle and proceed to step 2.2;
[0017] If the object to be placed is not circular, obtain the circumcircle of the object and the radius R of the circumcircle, and proceed to step 2.2.
[0018] 2.2. Etch R inwards along the entire area to be inspected to obtain a reduced area to be inspected, denoted as the reduced total area.
[0019] Furthermore, step 3 specifically includes:
[0020] 3.1 Check if there are any other components within the reduced area;
[0021] If there are no other components, then shrink the total area to the remaining area and proceed to step 5;
[0022] If other components are present, proceed to step 3.2;
[0023] 3.2 Expand the outline of other components located within the reduced total area outward by R, and obtain the union of all expanded areas located within the reduced total area, which is denoted as the expanded total area.
[0024] Furthermore, step 2.2 specifically includes:
[0025] Obtain a rolling circle with radius R, and move the center of the rolling circle along the outline of the area to be inspected for one revolution to obtain the first motion trajectory of the rolling circle. The area enclosed by the first motion trajectory is the reduced area to be inspected, denoted as the reduced total area.
[0026] Furthermore, step 3.2 specifically includes:
[0027] Obtain the outline of other components within the reduced total area, and move the center of a rolling circle with radius R along the outline of other components to obtain the second motion trajectory. The second motion trajectory includes a second outer ring and a second inner ring nested together. The area enclosed by the second outer ring is the expansion area. Obtain the union of all expansion areas, which is denoted as the total expansion area. If there are specified components that do not need to be expanded within the area to be inspected, then no expansion is required.
[0028] Further, step 4 specifically involves performing a difference operation on the reduced and expanded total regions using polygon boolean operations to obtain the remaining region.
[0029] Furthermore, step 1 specifically includes:
[0030] 1.1 Obtain the correct CAD file for the PCB to be found;
[0031] 1.2 Determine whether the item to be placed is a label;
[0032] If the object to be placed is a marker, then the entire PCB to be found or the designated area is the area to be inspected, and step 2 is executed;
[0033] If the item to be placed is not a label, proceed to step 1.3;
[0034] 1.3. Based on the placement requirements of the object to be placed, search for devices related to the object in the CAD file and define them as specified devices;
[0035] 1.4 Determine whether the object to be placed is the positioning gold wire of the designated device;
[0036] If the object to be placed is the positioning gold wire of the specified device, then proceed to step 1.5;
[0037] If the object to be placed is not the positioning gold wire of the specified device, proceed to step 1.6;
[0038] 1.5 Extend the outline of the specified device outward by a preset range. The resulting extended area is the area to be inspected. Proceed to step 2.
[0039] 1.6 Compare the vertical distances between each point on the outline of the specified component and the PCB outline;
[0040] If the vertical distances between each point on the outline of the specified device and the outer frame of the PCB are not equal, then the side of the specified device that is farther from the outer frame of the PCB is extended by a preset range towards that side, and the resulting extended area is the area to be inspected. Then proceed to step 2.
[0041] If the distances between all points on the outline of the specified device and the outer frame of the PCB are equal, then the side of the specified device on the side of the PCB board entry direction in actual production is extended by a preset range to that side, and the resulting extended area is the area to be inspected. Then, step 2 is executed.
[0042] Step 2.2 specifically involves:
[0043] If the object to be placed is not a positioning gold wire, obtain a rolling circle with radius R, and make the center of the rolling circle move around the outline of the area to be inspected to obtain the first movement trajectory of the rolling circle. The area enclosed by the first movement trajectory is the reduced area to be inspected, which is denoted as the reduced total area.
[0044] If the object to be placed is a positioning gold wire, the outline of the area to be inspected includes two nested outline loops; obtain a rolling circle with radius R, and make the center of the rolling circle move along the two nested outline loops for one revolution to obtain the first motion trajectory of the rolling circle. The area enclosed by the first motion trajectory is the reduced area to be inspected, denoted as the reduced total area.
[0045] Furthermore, step 1.1 specifically includes:
[0046] Obtain the CAD file, BOM information, and component library information of the PCB to be found. Obtain the actual data of each component through the BOM information and component library information. Match the actual data of each component to the design data of each component in the CAD file to obtain the correct CAD file.
[0047] Further, step 1.1 includes:
[0048] 1.1.1 Obtain the CAD file of the PCB to be found, and extract the design package dimensions of each component from the CAD file;
[0049] Obtain the BOM information of the PCB to be found, and extract the material code, manufacturer part number and manufacturer of each component from the BOM information;
[0050] Obtain the component library information of the PCB to be found, and obtain the actual package size of each component based on the material code, manufacturer part number and manufacturer;
[0051] 1.1.2 The actual package dimensions of each component are matched one-to-one with the designed package dimensions of each component; thus, the correct CAD file is obtained.
[0052] Furthermore, in step 1.2:
[0053] The identification elements include barcodes, silkscreen printing, and logos.
[0054] Furthermore, in step 1.3:
[0055] The specified devices include BGA, QFN, WLCSP packaged components or stress-sensitive devices.
[0056] Furthermore, in steps 1.5 and 1.6:
[0057] By definition, the direction of PCB entry or the direction in which a specified component is further from the outer frame of the PCB is the length direction, and the direction perpendicular to the length direction is the width direction.
[0058] The maximum value of the preset range is: PCB length - PCB outer frame safety distance × 2 - length of the specified device; the minimum value of the preset range is 0.
[0059] A computer device includes a memory, a processor, and a computer program stored in the memory, characterized in that the processor executes the computer program to implement the steps of the above-described area detection method based on PCB design.
[0060] A computer-readable storage medium storing a computer program / instructions thereon, characterized in that: when the computer program / instructions are executed by a processor, they implement the steps of the above-described area detection method based on PCB design.
[0061] A computer program product includes a computer program / instructions, characterized in that: when the computer program / instructions are executed by a processor, they implement the steps of the above-described area detection method based on PCB design.
[0062] The beneficial effects of this invention are:
[0063] This invention matches and corrects the CAD file of the PCB to be located using BOM information and component library information, matching the component design package dimensions in the CAD file to the actual package dimensions. It differentiates the type and shape of the object to be placed, obtaining a reduced inspection area through etching, and then expanding the components within this reduced inspection area to determine if there is any remaining space within the inspection area, thus identifying the presence of a clearance area of the same size as the object to be placed. By pre-analyzing the CAD file of the PCB to be located, it determines whether there is a clearance area with the same shape and size as the object to be placed. If no clearance area exists, the CAD data is modified in a timely manner, effectively avoiding collisions or overlaps between the object to be placed and surrounding components during actual PCBA assembly, thus improving product yield and reducing design rework and manufacturing costs. This application can automatically detect clearance areas, significantly reducing inspection time compared to manual inspection. Especially for complex PCBs, the method of this invention can complete the inspection in only 1-2 seconds with high accuracy, improving inspection efficiency. Attached Figure Description
[0064] Figure 1 This is a flowchart of an embodiment of a region detection method based on PCB design according to the present invention;
[0065] Figure 2 This is a schematic diagram of the first motion trajectory obtained after the rolling circle rolls along the contour line of the area to be inspected in an embodiment of the present invention;
[0066] Figure 3 This is a schematic diagram of the difference operation of polygon bool in an embodiment of the present invention;
[0067] Figure 4 This is a schematic diagram showing the presence of a remaining region in an embodiment of the present invention;
[0068] Figure 5 This is a schematic diagram of an embodiment of the present invention when there is no remaining region;
[0069] Figure 6 This is a schematic diagram of the remaining area when placing the positioning gold wire in an embodiment of the present invention.
[0070] Icon labels:
[0071] 1-Inspection area, 2-Designated device, 3-First outer ring, 4-First inner ring, 5-Outline of the inspection area, 6-Reduced total area, 7-Other components, 8-Remaining area, 9-Expanded total area. Detailed Implementation
[0072] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0073] This invention provides a method for area detection based on PCB design, such as... Figure 1 As shown, the method includes the following steps:
[0074] Step 1: Obtain the inspection area 1 on the PCB to be inspected;
[0075] 1.1 Obtain the correct CAD file for the PCB to be found;
[0076] 1.1.1) Obtain the CAD file of the PCB to be found. The data in the CAD file usually includes PCB dimensions, component dimensions, positions, angles, reference designators, package information, etc. Obtain the design package dimensions of each component from the CAD file.
[0077] Obtain the BOM information of the PCB to be found. The BOM information usually includes material code, manufacturer part number, manufacturer, etc. Extract the material code, manufacturer part number, and manufacturer of each component from the BOM information.
[0078] Obtain component library information for the PCB to be found, and obtain the actual package size and package information of each component based on the found material code, manufacturer part number, and manufacturer.
[0079] 1.1.2) Match the actual package size of each component with the designed package size of each component; match the package size information of each component in the CAD file with the actual package size to obtain the correct CAD file.
[0080] Since the design package dimensions of each component in the obtained CAD file may differ from the actual package dimensions, matching the actual package dimensions in the BOM information and component library information with the design package dimensions in the CAD file can identify the effective clearance area and avoid rework after the PCB is manufactured.
[0081] 1.2 Determine whether the item to be placed is a label, which may include barcodes, silkscreen printing, logos, etc.
[0082] If the object to be placed is a marker, then the entire PCB to be found or the designated area is designated as inspection area 1, and step 2 is executed.
[0083] If the item to be placed is not a label, proceed to step 1.3;
[0084] 1.3. Based on the placement requirements of the object to be placed, search for the devices related to the object in the CAD file and define them as designated device 2. Designated device 2 is generally specified according to actual needs and can be a component with special package such as BGA, QFN, WLCSP or other stress-sensitive devices.
[0085] 1.4 Determine whether the object to be placed is the positioning gold wire of the designated device 2;
[0086] If the object to be placed is the positioning gold wire of the designated device 2 (specifically, in this embodiment, it refers to a positioning gold wire of a special shape such as an L-shape), then proceed to step 1.5; if the object to be placed is not the positioning gold wire of the designated device 2, then proceed to step 1.6.
[0087] 1.5 Extend the outline of the specified device 2 outward by a preset range to obtain the extended area as the inspection area 1, and then proceed to step 2;
[0088] The PCB board entry direction or the direction in which the specified device 2 is further from the outer frame of the PCB board is defined as the length direction, and the direction perpendicular to the length direction is defined as the width direction.
[0089] The maximum value of the above preset range is: PCB length - PCB outer frame safety distance × 2 - length of the specified device; the minimum value of the preset range is 0. When the specified device 2 is a saddle-type connector, the preset range is 20mm.
[0090] 1.6 Compare the vertical distances between each point on the outline of the specified component 2 and the PCB outline;
[0091] If the vertical distances between each point on the outline of the specified device 2 and the outer frame of the PCB are not equal, the outline of the specified device 2 is extended by a preset range K in the direction inside the board. That is, the side of the specified device 2 that is farther from the outer frame of the PCB is extended by a preset range K to that side. The resulting extended area is the inspection area 1, and step 2 is executed. The value of the preset range K is determined by the specifications and stress of the object to be placed, and is generally greater than 0.
[0092] If the distances between each point on the outline of the specified device 2 and the outer frame of the PCB are equal, then the side edge of the specified device 2 on the PCB board entry direction in actual production is extended by a preset range K to that side, and the resulting extended area is the inspection area 1. Then, step 2 is executed.
[0093] Step 2: Based on the shape and size of the object to be placed, etch the inspection area inward to obtain a reduced inspection area, which is denoted as the reduced total area 6;
[0094] 2.1 Determine if the object to be placed is circular;
[0095] If the object to be placed is circular, obtain the radius R of the circle and proceed to step 2.2; the radius R includes the actual size of the object to be placed, manufacturing tolerances, and safety distance.
[0096] If the object to be placed is not circular, i.e., it is a polygon (including rectangles with angles other than 0, 90, 180, and 270 degrees), then obtain the circumcircle of the object to be placed and obtain the radius R of the circumcircle, and proceed to step 2.2.
[0097] 2.2, such as Figure 2 As shown, if the object to be placed is a positioning gold wire, a rolling circle with a radius of R is obtained. This rolling circle is a virtual circle. The center of the rolling circle moves around the outline 5 of the area to be inspected (the outline 5 of the area to be inspected includes the side of the designated device for extension) to obtain the first movement trajectory of the rolling circle. The first movement trajectory includes a first outer ring 3 and a first inner ring 4 nested together. The area enclosed by the first inner ring 4 is the reduced area to be inspected, denoted as the reduced total area 6.
[0098] like Figure 6As shown, if the object to be placed is a positioning gold wire, the outline 5 of the area to be inspected includes not only the outer outline ring extending the preset range, but also the outer outline ring of the designated device 2. The center of the rolling circle moves around the two nested outline rings to obtain the first motion trajectory of the rolling circle. The first motion trajectory includes two nested rings. The area between the inner ring of the outer ring and the outer ring of the inner ring is the area surrounded by the first motion trajectory, which is the reduced inspection area, denoted as the reduced total area 6.
[0099] Step 3: Based on the shape and size of the object to be placed, expand the outline of other components in the reduced total area 6 outward to obtain the union of all expanded areas in the reduced total area 6, which is denoted as the expanded total area 9.
[0100] 3.1 Check if there are any other components 7 within the reduced total area 6;
[0101] If there are no other components 7, then shrink the total area 6 to the remaining area 9 and proceed to step 5;
[0102] If other components 7 exist, proceed to step 3.2;
[0103] 3.2 Obtain the outline of other components 7 within the reduced total area 6, and move the center of a rolling circle with radius R along the outline of other components 7 for one revolution to obtain a second motion trajectory. This second motion trajectory includes a second outer ring and a second inner ring nested together. The area enclosed by the second outer ring is the expansion area. Obtain the union of all expansion areas located within the reduced total area 6, denoted as the expansion total area 9. If there are specified components in the area to be inspected that do not need to be expanded, then no expansion is required.
[0104] It should be noted that when other components 7 are completely located within the reduced total area 6, their overall outline is expanded; when other components 7 are partially located within the reduced total area 6, their partial outline within the reduced total area 6 is expanded, or their overall outline is expanded to obtain the expanded area within the reduced total area 6.
[0105] Step 4: Perform a difference operation on the reduced total region 6 and the expanded total region 9 using polygon boolean operation to obtain the remaining region 8, and then proceed to step 5;
[0106] like Figure 3 As shown, the difference operation of the polygon bool operation is as follows: within the outline of the region bounded by (x1,y1), (x2,y1), (x2,y2), (x1,y2), remove the areas occupied by A, B, and C within its range, and the shaded area is the remaining region 8.
[0107] Step 5, as follows Figure 4As shown, if there is a remaining area 8, it means that there is a clear area to be found in the area to be inspected, which can be used to place the object to be placed.
[0108] like Figure 5 As shown, if there is no remaining area 8, the area to be inspected cannot be used to place the object to be placed. In this case, the CAD file is modified so that a PCB with a clear area for placing the object to be placed can be manufactured using the revised CAD file.
[0109] like Figure 6 As shown, when the object to be placed is a positioning gold wire, if there is a remaining area 8, then the remaining area 8 will surround the designated device 2.
[0110] This completes the area detection. If the object to be placed can be placed, it or its circumscribed circle's center can be placed arbitrarily within the remaining area. Optimal placement occurs when the centroid of the remaining area coincides with the center of the object's circle or its circumscribed circle. By matching components in the CAD file of the PCB to be found and etching and expanding based on the radius of the object or its circumscribed circle, it determines whether a clear area exists for placing the object. If not, the CAD file of the PCB to be found is modified promptly. In actual PCBA assembly, placing the object or its circumscribed circle's center within the remaining area effectively avoids collisions or overlaps between the object and surrounding components, preventing assembly failures, improving product yield, and reducing design rework and manufacturing costs. This application enables automatic detection of clear areas, significantly reducing detection time compared to manual detection. Especially for complex PCBs, the method of this application can complete the detection in only 1-2 seconds with high accuracy, improving detection efficiency. When the object to be placed is a positioning gold wire, a clearance area that contacts both the top and bottom layers of the PCB's restricted area can be selected, and the distance between the positioning gold wire and the copper foil around the perimeter should be less than the set distance.
[0111] This embodiment also provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above method.
[0112] This embodiment also provides a computer-readable storage medium storing a computer program / instructions thereon, which, when executed by a processor, implement the steps of the above-described method.
[0113] This embodiment also provides a computer program product, including a computer program / instructions, which, when executed by a processor, implement the steps of the above-described method.
[0114] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A method for detecting a region based on a PCB design, characterized in that, The method comprises the following steps: Step 1, obtaining a to-be-detected area on a PCB to be found; Step 2, based on the shape and size of the to-be-placed object, etching the to-be-detected area inward to obtain a reduced to-be-detected area, denoted as a reduced total area; Step 3, based on the shape and size of the to-be-placed object, expanding the contour of other elements in the reduced total area outward to obtain the union of all expanded areas in the reduced total area, denoted as an expanded total area; Step 4, performing a difference set operation on the reduced total area and the expanded total area to obtain a remaining area; Step 5, if there is a remaining area, it indicates that the to-be-detected area can be used to place the to-be-placed object; If there is no remaining area, it indicates that the to-be-detected area cannot place the to-be-placed object, then the PCB is redesigned to manufacture a PCB with a clear area that can be used to place the to-be-placed object; Complete area detection.
2. The method of claim 1, wherein the PCB design-based region detection method is characterized by, Step 2 specifically comprises: 2.1, judging whether the to-be-placed object is circular; If the to-be-placed object is circular, obtain the radius R of the circle, and execute step 2.2; If the to-be-placed object is not circular, obtain the circumscribed circle of the to-be-placed object and the radius R of the circumscribed circle, and execute step 2.2; 2.2, etching the to-be-detected area inward by R to obtain a reduced to-be-detected area, denoted as a reduced total area.
3. The method of claim 2, wherein the PCB design-based region detection method is characterized by, Step 3 specifically comprises: 3.1, checking whether there are other elements in the reduced total area; If there are no other elements, record the reduced total area as the remaining area, and execute step 5; If there are other elements, execute step 3.2; 3.2, expanding the contour of other elements located in the reduced total area outward by R to obtain the union of all expanded areas located in the reduced total area, denoted as an expanded total area.
4. The method of claim 3, wherein the PCB design-based region detection method is characterized by, Step 2.2 specifically comprises: Obtain a rolling circle with a radius of R, and make the center of the rolling circle move around the contour line of the to-be-detected area for one round to obtain a first motion trajectory of the rolling circle, then the area surrounded by the first motion trajectory is the reduced to-be-detected area, denoted as a reduced total area.
5. The method of claim 4, wherein the PCB design-based region detection method is characterized by, Step 3.2 specifically comprises: Obtain the contour line of other elements in the reduced total area, and make the center of the rolling circle with a radius of R move around the contour line of other elements for one round to obtain a second motion trajectory, then the second motion trajectory includes a second outer ring and a second inner ring nested with each other, the area surrounded by the second outer ring is an expanded area, obtain the union of all expanded areas, denoted as an expanded total area; if there are specified elements that do not need to be expanded in the to-be-detected area, they do not need to be expanded.
6. The method of claim 5, wherein the PCB design-based region detection method is characterized by, Step 4 specifically comprises: performing a difference set operation on the reduced total area and the expanded total area by using a polygon bool operation to obtain a remaining area.
7. The method of claim 1-6, wherein the method is based on a PCB design. Step 1 specifically comprises: 1.1, obtaining a correct CAD file of a PCB to be found; 1.2, determining whether the to-be-placed object is an identification object; If the to-be-placed object is an identification object, take the entire plate or a specified area of the PCB to be found as the to-be-detected area, and execute step 2; If the to-be-placed object is not an identification object, execute step 1.3; 1.3, based on the placement requirements of the to-be-placed object, search for devices related to the to-be-placed object in the CAD file, and define the devices as specified devices; 1.4, determining whether the to-be-placed object is a positioning gold wire of a specified device; If the to-be-placed object is a positioning gold wire of a specified device, execute step 1.5; If the object to be placed is not a positioning gold wire of the specified device, step 1.6 is performed; 1.5, uniformly extend the contour of the specified device outward by a preset range, and the obtained extension region is a detection region, and step 2 is performed; 1.6, compare the vertical distances of each point on the contour of the specified device and the PCB outer frame; If the vertical distances of each point on the contour of the specified device and the PCB outer frame are not equal, the side of the specified device farther away from the PCB outer frame is extended by a preset range, and the obtained extension region is a detection region, and step 2 is performed; If the vertical distances of each point on the contour of the specified device and the PCB outer frame are equal, the side of the specified device in the PCB feeding direction in actual production is extended by a preset range, and the obtained extension region is a detection region, and step 2 is performed; Step 2.2 is specifically: If the object to be placed is not a positioning gold wire, a rolling circle with a radius R is obtained, the center of the rolling circle moves along the contour line of the detection region for one round, and a first motion trajectory of the rolling circle is obtained, and the region surrounded by the first motion trajectory is a reduced detection region, denoted as a reduced total region; If the object to be placed is a positioning gold wire, the contour line of the detection region includes two mutually nested contour ring lines; a rolling circle with a radius R is obtained, the center of the rolling circle moves along the two mutually nested contour ring lines for one round, and a first motion trajectory of the rolling circle is obtained, and the region surrounded by the first motion trajectory is a reduced detection region, denoted as a reduced total region.
8. The method of claim 7, wherein the PCB design-based region detection method is characterized by, Step 1.1 is specifically: Obtain the CAD file, BOM information and component library information of the PCB to be found, obtain the actual data of each component through the BOM information and the component library information; match the actual data of each component to the design data of each component in the CAD file to obtain a correct CAD file.
9. The method of claim 8, wherein the PCB design-based region detection method is characterized by, Step 1.1 includes: 1.1.1, obtain the CAD file of the PCB to be found, and obtain the design package size of each component from the CAD file; Obtain the BOM information of the PCB to be found, obtain the material code, manufacturer part number and manufacturer of each component from the BOM information; Obtain the component library information of the PCB to be found, and obtain the actual package size of each component based on the material code, manufacturer part number and manufacturer; 1.1.2, each actual package size of each component is matched one by one with each design package size of each component; and a correct CAD file is obtained.
10. The method of claim 9, wherein the PCB design-based region detection method is characterized by, In step 1.2: The marker includes a bar code, silk screen printing and a LOGO.
11. The method of claim 10, wherein the PCB design-based region detection method is characterized by, In step 1.3: The specified device includes a BGA, a QFN, a WLCSP package component or a stress-sensitive device.
12. The method of claim 11, wherein the PCB design-based region detection method is characterized by, In steps 1.5 and 1.6: It is defined that the PCB feeding direction or the direction of the specified device farther away from the PCB outer frame is the length direction, and the direction perpendicular to the length direction is the width direction; The maximum value of the preset range is: the length of the PCB - the safety distance of the PCB outer frame x 2 - the length of the specified device; and the minimum value of the preset range is 0.
13. A computer device comprising a memory, a processor, and a computer program stored on the memory, wherein: The processor executes the computer program to realize the steps of the PCB design-based region detection method in claim 1.
14. A computer readable storage medium having stored thereon computer programs / instructions, characterized in that: The computer program / instruction is executed by the processor to realize the steps of the PCB design-based region detection method in claim 1.
15. A computer program product comprising computer programs / instructions, characterized in that: The computer program / instruction is executed by the processor to realize the steps of the PCB design-based region detection method in claim 1.