Circuit board preparation method and circuit board

Abstract

The invention provides a circuit board preparation method and a circuit board. The circuit board preparation method comprises the following steps: arranging a supporting piece in a hollow area of a substrate; covering the substrate and the supporting piece with a metal plate; the metal plate is processed through a pattern transfer technology to form a plurality of terminal sets and a plurality of bridging lines, each terminal set comprises a first terminal and a second terminal, the first terminals and the second terminals are located on the two opposite sides of the hollowed-out area respectively, and the bridging lines are used for connecting the first terminals and the second terminals; the supporting piece is removed from the hollow area; according to the circuit board preparation method and the circuit board, the connection quality of the bridging line pair between the first terminal and the second terminal is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic manufacturing, and in particular to a circuit board preparation method and a circuit board. BACKGROUND

[0002] A circuit board, usually referred to as a printed circuit board, is a board used to support electronic components and realize electrical connection therebetween. The circuit board miniaturizes and visualizes the circuit, and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout.

[0003] The circuit board of the related art includes a board body, the board body includes a substrate and copper plates covering both sides of the substrate, the substrate is made of resin, the substrate has a hollow area, the hollow area can provide mounting space for certain specific elements, and the substrate has a first terminal and a second terminal on both sides of the hollow area, when the first terminal and the second terminal need to be electrically connected, due to the limitation of the hollow area, a metal piece is usually used to realize the electrical connection by welding, and the electrical connection between the first terminal and the second terminal is realized by welding two pins of the metal piece to the first terminal and the second terminal respectively.

[0004] However, when the first terminal and the second terminal are welded by the metal piece, manual welding is usually used, and the connection quality of the metal piece to the first terminal and the second terminal is reduced due to the small shape of the first terminal and the second terminal, such as welding deviation between the terminal group and the metal piece. SUMMARY

[0005] The present application provides a circuit board preparation method and a circuit board to solve the technical problem that the related art uses manual welding to connect the metal piece to the first terminal and the second terminal, and reduces the connection quality of the metal piece to the first terminal and the second terminal.

[0006] In one aspect, the present application provides a circuit board preparation method, comprising:

[0007] a support is arranged in the hollow area of the substrate;

[0008] a metal plate is arranged on the substrate and the support;

[0009] the metal plate is processed by a pattern transfer process to form a plurality of terminal groups and a plurality of bridge lines, the terminal group includes a first terminal and a second terminal, the first terminal and the second terminal are respectively located on opposite sides of the hollow area, and the bridge line is used to connect the first terminal and the second terminal;

[0010] the support is removed from the hollow area.

[0011] In some embodiments, the disposing the support within the hollowed region of the substrate comprises:

[0012] filling a heat-curing material into the hollowed region;

[0013] baking the heat-curing material to solidify the heat-curing material to form the support.

[0014] In some embodiments, the processing the metal plate by a pattern transfer process comprises:

[0015] applying a photoresist on the metal plate;

[0016] covering a transparent mask on the photoresist, the transparent mask having a circuit design pattern of the terminal groups and the bridge lines thereon;

[0017] irradiating the photoresist and the transparent mask using an ultraviolet lamp, such that the photoresist other than the circuit design pattern is dissolved;

[0018] immersing the metal plate into a developing solution, such that the metal plate other than the circuit design pattern is dissolved, and the undissolved metal plate forms a plurality of the terminal groups and a plurality of the bridge lines simultaneously.

[0019] In some embodiments, after the immersing the metal plate into the developing solution, the method further comprises

[0020] removing the photoresist on the terminal groups and the bridge lines.

[0021] In some embodiments, the removing the support from within the hollowed region comprises:

[0022] applying a dissolving solution on the support, such that the dissolving solution dissolves the support.

[0023] In some embodiments, the removing the support from within the hollowed region further comprises:

[0024] cleaning the support dissolved and softened within the hollowed region.

[0025] In some embodiments, the removing the support from within the hollowed region comprises:

[0026] applying the dissolving solution formed by at least one of a water-based medicine, a chlorinated solution, and a hydrocarbon solution on the support.

[0027] In some embodiments, before the disposing the support within the hollowed region of the substrate, the method further comprises:

[0028] milling the substrate to machine a first hollowed groove on the substrate;

[0029] laser processing the first hollow groove to process a second hollow groove on the substrate;

[0030] plasma etching the second hollow groove to form the hollow region.

[0031] In some embodiments, after the support is withdrawn from the hollow region, the method comprises:

[0032] solder mask processing the substrate.

[0033] In another aspect, the application provides a circuit board produced by the circuit board production method.

[0034] The application provides a circuit board production method and a circuit board. The circuit board production method provided by the application sets a support in the hollow region of the substrate, so that the support can support the metal plate, thereby facilitating the formation of the terminal group and the bridge line on the substrate and the support. The terminal group and the bridge line formed by the metal plate are integrally arranged through the pattern transfer process, and the bridge line can accurately connect the first terminal and the second terminal, thereby improving the connection quality of the bridge line for electrically connecting the first terminal and the second terminal, and indirectly improving the signal transmission quality of the bridge line for the first terminal and the second terminal. The bridge line and the terminal group formed by the metal plate have good corrosion resistance, thermal stability and thermal conductivity, thereby further improving the signal transmission quality of the bridge line for the first terminal and the second terminal in a harsh environment. The terminal group and the bridge line are directly formed by the metal plate, so that the bridge line does not need to be installed manually in the subsequent process, thereby saving manpower and indirectly improving the production efficiency. The support is withdrawn from the hollow region after the formation of the terminal group and the bridge line, thereby preventing the support from affecting the arrangement of other specific elements in the hollow region. BRIEF DESCRIPTION OF DRAWINGS

[0035] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.

[0036] Figure 1 A flow structure schematic diagram of the circuit board production method provided by the embodiments of the application;

[0037] Figure 2 A structure schematic diagram of the circuit board production method provided by the embodiments of the application, in which the metal plate covers the substrate and the support;

[0038] Figure 3 A structure schematic diagram of the circuit board production method provided by the embodiments of the application, in which the metal plate is processed through the pattern transfer process;

[0039] Figure 4 A structural schematic diagram of a circuit board provided by an embodiment of the present application is shown in the following.

[0040] Explanation of reference signs:

[0041] 100, substrate;

[0042] 200, terminal group; 210, first terminal; 220, second terminal;

[0043] 300, bridging wire;

[0044] 400, hollowed region;

[0045] 500, support;

[0046] 600, metal plate.

[0047] The specific embodiments of the present application have been shown in the above-described drawings, and will be described in more detail hereinafter. These drawings and written descriptions are not intended to limit the scope of the concept of the present application by any means, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0048] The exemplary embodiments will be described in detail herein with reference to the accompanying drawings. In the following description, the same numbers refer to the same elements throughout the drawings, unless otherwise represented. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with the present application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present application, as detailed in the appended claims.

[0049] As described in the background section, the circuit board of the related art includes a board body including a substrate made of resin and copper plates covering both sides of the substrate, the substrate has a hollowed region thereon, the hollowed region can provide installation space for some specific elements, the substrate has a first terminal and a second terminal on both sides of the hollowed region, respectively, and when the first terminal and the second terminal need to be electrically connected, a metal piece is usually used to realize the electrical connection by welding, that is, two pins of the metal piece are welded to the first terminal and the second terminal, respectively, to realize the electrical connection between the first terminal and the second terminal.

[0050] However, when the first terminal and the second terminal are welded by the metal piece, manual welding is usually used. In the manual welding, the first terminal and the second terminal are small in shape, which makes it inconvenient for the operator to operate, for example, the pins of the metal piece are deviated from the first terminal and the second terminal, which reduces the connection quality of the first terminal and the second terminal after the manual welding of the metal piece.

[0051] To solve the above technical problems, the circuit board preparation method and the circuit board are provided. The method includes filling a thermal curing material in a hollow area of a substrate, baking the thermal curing material, and solidifying the thermal curing material. Then, photoresist is applied on a metal plate, a transparent mask is covered on the photoresist, the metal plate is irradiated by a UV lamp, and the metal plate is immersed in a developing solution. As a result, the metal plate that is not dissolved forms multiple terminal groups and multiple bridge lines. The terminal groups and the bridge lines formed by the pattern transfer process and the metal plate are integrally arranged. The bridge line accurately connects the first terminal and the second terminal, thereby improving the connection quality of the bridge line connecting the first terminal and the second terminal, and indirectly improving the signal transmission quality of the bridge line to the first terminal and the second terminal. The bridge line and the terminal group formed by the metal plate have good corrosion resistance, thermal stability, and thermal conductivity, thereby further improving the signal transmission quality of the bridge line to the first terminal and the second terminal in a harsh environment.

[0052] The technical solutions of the present application and how the technical solutions solve the above technical problems will be described in detail below with specific examples. The following specific examples can be combined with each other, and the same or similar concepts or processes can not be described again in some examples. The embodiments of the present application will be described below with reference to the accompanying drawings.

[0053] In combination Figures 1 to 4 A circuit board preparation method includes:

[0054] S101: A support 500 is arranged in a hollow area 400 of a substrate 100.

[0055] Before the support 500 is arranged in the hollow area 400 of the substrate 100, the method includes:

[0056] The substrate 100 is milled to process a first hollow groove on the substrate.

[0057] In this embodiment, the substrate 100 is milled by using a milling machine or a computer numerical control machine tool to remove the material in a specific area and form the required first hollow groove. The first hollow groove is relatively rough at this time. In other embodiments, the substrate 100 can also be milled by a milling device manually to form the required hollow area 400.

[0058] The first hollow groove is processed by laser to process a second hollow groove on the substrate.

[0059] In the embodiment, the first hollow groove is accurately cut according to the design pattern by using a laser cutting machine, so that the first hollow groove is formed into the second hollow groove, and the second hollow groove is relatively fine at this time. The laser cutting method can realize accurate machining of a complex shape, for example, when the hollow area 400 is a special shape, the special-shaped hollow area 400 is convenient to machine. In other embodiments, the substrate 100 can also be cut by a laser cutting device by manual operation, so as to further form the required hollow area 400.

[0060] The second hollow groove is plasma etched to form the hollow area 400.

[0061] In the embodiment, the plasma etching includes using a high-power plasma etching machine and a low-power plasma etching machine to respectively perform plasma etching on the substrate 100. By using the setting of the plasma etching machine, selective etching of a specific material in the second hollow groove can be realized without affecting other materials. And the high-energy chemical reaction of the plasma can remove the exposed copper or other materials.

[0062] By using the above technical solution, by milling the substrate 100, the first hollow groove can be formed on the substrate 100. By laser processing the first hollow groove, the first hollow groove can be further machined, so that the first hollow groove forms the second hollow groove. The second hollow groove is processed by plasma etching. The plasma is composed of charged particles and has high energy, which can chemically react with the substrate 100 to realize partial removal of the substrate 100. The plasma etching can selectively etch a specific material without affecting other materials, thereby preventing the influence of the already arranged electronic elements or other parts when processing the hollow area 400. And the plasma etching can be carried out at a relatively low temperature, which helps to protect sensitive materials and devices. Further improve the processing quality of the hollow area 400.

[0063] S102: Cover the metal plate 600 on the substrate 100 and the support 500.

[0064] In the embodiment, the metal plate 600 is set as a copper plate; the copper plate can be covered on the substrate 100 and the support 500 by a mechanical hand; in other embodiments, the copper plate can also be placed on the substrate 100 and the support 500 by manual operation.

[0065] S103: Process the metal plate 600 by a pattern transfer process to form a plurality of terminal groups 200 and a plurality of bridge lines 300. The terminal group 200 includes a first terminal 210 and a second terminal 220, and the first terminal 210 and the second terminal 220 are respectively located on both sides of the hollow area 400. The bridge line 300 is used to connect the first terminal 210 and the second terminal 220.

[0066] In the embodiment, the copper plate can also form other circuit structures that need to be made synchronously on the substrate 100 and the support 500, in addition to the plurality of terminal groups 200 and the plurality of bridge lines 300.

[0067] S104: The support 500 is removed from the hollow area 400.

[0068] By adopting the technical scheme, the support 500 is arranged in the hollow area 400 of the substrate 100, so that the support 500 can support the copper plate, thereby facilitating the copper plate to form the terminal group 200 and the bridge line 300 on the substrate 100 and the support 500. The terminal group 200 and the bridge line 300 formed by the pattern transfer process and the metal plate 600 are integrally arranged, and the bridge line 300 can accurately realize the connection between the first terminal 210 and the second terminal 220, thereby improving the connection quality of the bridge line 300 for electrically connecting the first terminal 210 and the second terminal 220, and indirectly improving the signal transmission quality of the bridge line 300 for the first terminal 210 and the second terminal 220. The bridge line 300 and the terminal group 200 formed by the copper plate have good corrosion resistance, thermal stability and thermal conductivity, thereby further improving the signal transmission quality of the bridge line 300 for the first terminal 210 and the second terminal 220 in a harsh environment. The terminal group 200 and the bridge line 300 are directly formed by the copper plate, so that the bridge line 300 does not need to be installed manually in the subsequent process, thereby saving manpower and indirectly improving the production efficiency. The support 500 is removed from the hollow area 400 after the terminal group 200 and the bridge line 300 are formed, thereby preventing the support 500 from affecting the arrangement of other specific elements in the hollow area 400.

[0069] After the support 500 is removed from the hollow area 400, the method further includes:

[0070] The substrate 100 is subjected to a pre-soldering treatment.

[0071] In the embodiment, the anti-soldering pretreatment includes cleaning, micro-etching, deoxidation, roughening, drying and pre-coating, wherein the cleaning process is to remove dust, oil stains, fingerprints and other contaminants on the circuit board to ensure that the surface is clean, and the cleaning process can be completed by solvent cleaning, ultrasonic cleaning or jet cleaning; the micro-etching is to slightly etch the surface of the circuit board by using chemical or physical methods to increase the surface roughness and improve the adhesion of the anti-soldering layer; the deoxidation is to remove the oxidation layer by using a specific chemical solution, and if the circuit board surface does not have an oxidation layer, deoxidation is not required; the roughening is to increase the surface roughness of copper by mechanical or chemical methods to enhance the adhesion of the anti-soldering layer; the drying process is to thoroughly dry the circuit board to remove residual moisture on the surface; and the pre-coating is to pre-coat a special primer or adhesive on the circuit board to improve the adhesion of the anti-soldering layer.

[0072] Anti-soldering treatment of the substrate 100.

[0073] In the embodiment, the anti-soldering treatment includes coating anti-soldering material, pre-curing treatment and curing treatment, the anti-soldering material is coated on the circuit board by using screen printing, spraying, dipping or roll-to-roll coating, etc.; the pre-curing treatment is to pre-cure the coated anti-soldering material, for example, by using soft baking to improve the stability of the anti-soldering material in the subsequent process; and the curing treatment is to place the circuit board in a high-temperature furnace for curing, so that the anti-soldering material is completely hardened and forms an anti-soldering layer.

[0074] By adopting the above technical solutions, through the anti-soldering pretreatment and anti-soldering treatment of the substrate 100, a special material anti-soldering layer is coated on the circuit board in the area where soldering is not required, the anti-soldering layer can prevent accidental connection of solder on the non-soldering area of the circuit board, thereby avoiding short circuit; by preventing solder bridging, the anti-soldering treatment helps to improve the electrical performance and long-term reliability of the circuit board; the anti-soldering material can prevent oxidation of copper wiring in the air, prolonging the service life of the terminal set 200 and the bridging wire 300; the anti-soldering pretreatment refers to the preparation work performed on the circuit board before coating the anti-soldering layer, including cleaning, degreasing and roughening steps, to ensure the adhesion and uniformity of the anti-soldering layer to the circuit board.

[0075] In combination Figures 1 to 4 The support 500 is arranged in the hollowed-out area 400 of the substrate 100, including:

[0076] S1011: Fill the thermosetting material into the hollowed-out area 400.

[0077] In this embodiment, manual filling can be used, where the thermosetting material is manually injected into the cutout area 400 using hand tools such as syringes, needles, or small scrapers; an automatic dispensing machine can also be used, which can precisely control the flow rate and position of the thermosetting material to dispense the thermosetting material into the cutout area 400; alternatively, the cutout area 400 of the circuit board can be immersed in the thermosetting material, and then removed and the excess thermosetting material is taken out.

[0078] S1012: Bake the thermosetting material to solidify it and form the support 500.

[0079] In this embodiment, oven curing can be used, by placing the substrate 100 filled with thermosetting material into an oven and baking it at a set temperature and time; infrared or ultraviolet radiation can also be used to heat the thermosetting material; or a hot air gun or hot air curing equipment can be used to heat the thermosetting material; or a laser beam can be used to precisely heat and cure the thermosetting material.

[0080] By adopting the above technical solution, the support member 500 made of thermosetting material can prevent the substrate 100 and copper plate from being affected when the thermosetting material is filled into the hollow area 400. It also facilitates the subsequent removal of the support member 500, which would otherwise affect the substrate 100, the terminal group 200, and the bridging line 300. The thermosetting material is solidified by baking, which can prevent the substrate 100 and copper plate from being affected during the baking process. The solidified thermosetting material can also provide better support for the copper plate.

[0081] In this embodiment, the thermosetting material is set as glass fiber epoxy resin.

[0082] By adopting the above technical solution, glass fiber has high tensile strength and modulus, which gives glass fiber epoxy resin excellent mechanical properties, thereby indirectly improving the support effect of support member 500.

[0083] Combination Figures 1 to 4 The metal plate 600 is processed by a pattern transfer process, including:

[0084] S1031: Apply photoresist to metal plate 600.

[0085] In this embodiment, photoresist can be applied by screen printing, using a screen as a template and a squeegee to press the photoresist onto the copper plate through the pattern openings on the screen; alternatively, photoresist can be sprayed onto the copper plate in a mist using a spray gun, suitable for coating large areas or irregular shapes; alternatively, the copper plate can be immersed in photoresist and then lifted, utilizing surface tension and the viscosity of the photoresist to form a uniform film; or automated equipment can be used for precise photoresist coating, ensuring the uniformity and repeatability of the coating.

[0086] S1032: A transparent mask is placed over photoresist, and the transparent mask has a circuit design pattern of terminal group 200 and bridging line 300.

[0087] In this embodiment, an automatic alignment system can be used to ensure that the pattern on the transparent mask is precisely aligned with the pattern on the substrate 100; a projection system can also be used to reduce the size of the pattern on the transparent mask and project it onto the substrate 100; or the transparent mask can be gently pressed onto the surface of the substrate 100 to ensure accurate transfer of the pattern while avoiding damage to the transparent mask or the substrate 100; on an automated production line, a robot can also be used to automatically place and replace the transparent mask.

[0088] S1033: Using ultraviolet light to irradiate the photoresist and transparent mask, causing the photoresist outside the circuit design pattern to dissolve.

[0089] In this embodiment, a robotic arm can be used to grip the substrate 100, causing the substrate 100 to bring the photoresist or transparent mask closer to the ultraviolet lamp; or a robotic arm can be used to grip the ultraviolet lamp, causing the ultraviolet lamp to bring closer to the photoresist or transparent mask.

[0090] S1034: The metal plate 600 is immersed in the developing solution, which dissolves the metal plate 600 outside the circuit design pattern. The undissolved metal plate 600 simultaneously forms multiple sets of terminal groups 200 and multiple bridging lines 300.

[0091] In this embodiment, the developing solution is placed in a tank, and the copper plate can be immersed in the tank by an automated method such as a robotic arm and lifted out after a set time; alternatively, the developing solution can be evenly sprayed onto the surface of the copper plate through a spray system, which is suitable for rapid development or local development; or the copper plate can be processed by a developing machine, in which the copper plate is placed on a conveyor belt and automatically passes through the developing solution area of ​​the developing machine.

[0092] After the metal plate 600 is immersed in the developing solution, the following steps are taken:

[0093] S1035: Remove photoresist from terminal block 200 and bridging line 300.

[0094] In this embodiment, photoresist can be removed by ultrasonic stripping, chemical stripping, or physical methods. Ultrasonic stripping uses the vibration of ultrasonic waves to break the bonds between photoresist molecules, thereby achieving separation. Specific steps include immersing the substrate 100 in an ultrasonic cleaner for cleaning, then washing with deionized water, then immersing the substrate 100 in a solvent that can dissolve the photoresist to soften it, and then vibrating with ultrasound again to strip the photoresist. Chemical stripping uses the dissolving effect of chemical solvents to strip the photoresist. First, the substrate 100 is immersed in deionized water to remove impurities, then the substrate 100 is immersed in a chemical solvent to soften the photoresist, and finally the photoresist is rinsed clean with pure water or deionized water. Physical methods use scraping, peeling, and ion beam methods to mechanically scrape or peel the photoresist from the surface.

[0095] By adopting the above technical solution and using a transparent mask, the circuit design patterns of the terminal group 200 and the bridging line 300 on the transparent mask can be used for mass production of circuit boards, thereby improving the efficiency of circuit board production. Furthermore, the circuit design pattern can be accurately transferred to the substrate 100 through the same transparent mask, thereby further improving the production quality of the terminal group 200 and the bridging line 300 formed on the substrate 100. By using a developing solution to dissolve the copper plate, the position of the terminal group 200 and the bridging line 300 can be more precisely controlled, reducing unnecessary material removal.

[0096] Combination Figures 1 to 4 The support member 500 is removed from the hollowed-out area 400, including:

[0097] S1041: Apply a dissolving liquid to the support 500 so that the dissolving liquid dissolves the support 500.

[0098] In this embodiment, the dissolving solution can be manually applied evenly to the surface of the support 500 using a brush; the dissolving solution can also be sprayed onto the surface of the support 500 in a mist using a spray gun; or the support 500 can be immersed in the solution to ensure full contact with the solution; or an automated spraying device can be used to precisely and evenly spray the dissolving solution.

[0099] Removing the support member 500 from the hollowed-out area 400 also includes:

[0100] S1042: Clean the dissolved support component 500 within the hollowed-out area 400.

[0101] In this embodiment, an ultrasonic cleaner can be used to clean the dissolved and softened support component 500. The circuit board is placed in the cleaning tank, and the microbubbles generated by the ultrasonic waves are used to remove the residue of the dissolved support component 500. Alternatively, a soft brush can be used to gently scrub the surface of the circuit board to remove the residue of the dissolved support component 500. Compressed air can also be used to blow on the surface of the circuit board to help remove the residue of the dissolved support component 500 and dust.

[0102] By adopting the above technical solution, the support 500 is dissolved and softened by using a dissolving liquid, which prevents the solidified support 500 from affecting the terminal group 200 and bridging line 300 formed on the substrate 100. This facilitates the complete removal of the support 500 and prevents the support 500 remaining in the hollow area 400 from affecting the installation of specific components.

[0103] Remove the support member 500 from the hollowed-out area, including:

[0104] The solution is formed by applying at least one of water-based medicine, chlorination solution and hydrocarbon solution to the support 500.

[0105] By adopting the above technical solutions, water-based solutions typically contain fewer harmful chemicals and have a smaller impact on the environment; using water-based solutions can reduce pollution during the production process and improve product cleanliness; chlorination solutions typically have strong dissolving power and can effectively dissolve support component 500; chlorination solutions react quickly with resins, improving the dissolution efficiency of support component 500; hydrocarbon solutions have high volatility and can evaporate quickly, reducing residues; hydrocarbon solutions can provide a powerful cleaning effect, helping to remove support component 500 and other impurities; hydrocarbon solutions typically have good chemical stability and are not prone to reacting with other substances.

[0106] In this embodiment, before milling the substrate 100, the process includes blanking, inner layer pattern exposure, etching, and browning. The production of a single inner layer circuit board is achieved through these processes. Multiple circuit boards are then laminated to produce a multilayer circuit board. Blanking involves placing the substrate 100 and a single-layer circuit board with copper plates on both sides at the processing position. Inner layer pattern exposure and etching are the pattern transfer processes described in this embodiment. Browning is a process that forms a protective film on the copper surface to prevent oxidation or contamination during subsequent processing. Browning is typically achieved using a chemical solution. After the multilayer circuit board is processed, a hollow area 400 is formed on the outermost circuit board through milling, laser processing, and plasma etching. Multiple terminal groups 200 and multiple bridging lines 300 are formed on the outermost circuit board using a pattern transfer process. In other embodiments, the hollow area 400 can also be formed on the inner layer circuit board of the multilayer circuit board using a circuit board fabrication method.

[0107] After the substrate 100 is solder resisted, the process also includes cutting the multilayer circuit board into multiple small multilayer circuit boards, and finally testing and final quality inspection of the small multilayer circuit boards before packaging and shipping.

[0108] Combination Figures 1 to 4 A circuit board, which is produced by the circuit board manufacturing method of any of the above embodiments.

[0109] The circuit board manufacturing method has been described in detail in the above embodiments and will not be repeated here.

[0110] By filling the hollow area 400 of the substrate 100 with thermosetting material and baking the thermosetting material to solidify it, photoresist is applied to the copper plate and a transparent mask is placed on the photoresist. The photoresist and transparent mask are then irradiated with ultraviolet light, and the copper plate is immersed in a developing solution. This causes the undissolved copper plate to simultaneously form multiple terminal groups 200 and multiple bridging lines 300. The terminal groups 200 and bridging lines 300 formed by the copper plate are integrated, thereby improving the connection quality of the bridging lines 300 electrically connecting the first terminal 210 and the second terminal 220, and indirectly improving the signal transmission quality of the bridging lines 300 between the first terminal 210 and the second terminal 220. Furthermore, the bridging lines 300 and terminal groups 200 formed by the copper plate have good corrosion resistance, thermal stability, and thermal conductivity, further improving the signal transmission quality between the first terminal 210 and the second terminal 220 of the bridging lines 300 in harsh environments.

[0111] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0112] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A method of manufacturing a circuit board, characterized by, The method comprises the following steps: setting a support (500) in a hollowed-out area (400) of a substrate (100); covering a metal plate (600) on the substrate (100) and the support (500); processing the metal plate (600) through a pattern transfer process to form a plurality of terminal groups (200) and a plurality of bridge lines (300), the terminal group (200) comprising a first terminal (210) and a second terminal (220), the first terminal (210) and the second terminal (220) being located on opposite sides of the hollowed-out area (400) respectively, the bridge line (300) being used for connecting the first terminal (210) and the second terminal (220); removing the support (500) from the hollowed-out area (400).

2. The method of manufacturing a circuit board according to claim 1, wherein The step of setting the support (500) in the hollowed-out area (400) of the substrate (100) comprises the following steps: filling a thermosetting material into the hollowed-out area (400); baking the thermosetting material to make the thermosetting material solidify to form the support (500).

3. The method of manufacturing a circuit board according to claim 1, wherein The step of processing the metal plate (600) through the pattern transfer process comprises the following steps: applying a photoresist on the metal plate (600); covering a transparent mask on the photoresist, the transparent mask having a circuit design pattern of the terminal group (200) and the bridge line (300) thereon; irradiating the photoresist and the transparent mask with an ultraviolet lamp to make the photoresist except for the circuit design pattern dissolve; immersing the metal plate (600) in a developing solution to make the metal plate (600) except for the circuit design pattern dissolve, and the undissolved metal plate (600) simultaneously form a plurality of the terminal groups (200) and a plurality of the bridge lines (300).

4. The method of manufacturing a circuit board according to claim 3, wherein After the step of immersing the metal plate (600) in the developing solution, the method comprises the following step: removing the photoresist on the terminal group (200) and the bridge line (300).

5. The method of manufacturing a circuit board according to claim 1, wherein The step of removing the support (500) from the hollowed-out area (400) comprises the following step: applying a dissolving solution on the support (500) to make the dissolving solution dissolve the support (500).

6. The method of manufacturing a circuit board according to claim 5, wherein The step of removing the support (500) from the hollowed-out area (400) further comprises the following step: cleaning the dissolved support (500) in the hollowed-out area (400).

7. The method of manufacturing a circuit board according to claim 5, wherein The step of removing the support (500) from the hollowed-out area (400) comprises the following step: applying the dissolving solution formed by at least one of a water-based medicine, a chlorinated solution and a hydrocarbon solution on the support.

8. The method of manufacturing a circuit board according to any one of claims 1 to 7, wherein Before the step of setting the support (500) in the hollowed-out area (400) of the substrate (100), the method comprises the following steps: milling the substrate (100) to process a first hollowed-out groove on the substrate (100); laser processing the first hollowed-out groove to process a second hollowed-out groove on the substrate (100); plasma etching the second hollowed-out groove to form the hollowed-out area (400).

9. The method of manufacturing a circuit board according to any one of claims 1 to 7, wherein After the support (500) is removed from the hollowed-out area (400), comprising: The substrate (100) is subjected to a solder mask treatment.

10. A circuit board, characterized by The circuit board is produced by the method of any one of claims 1-9.

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