Power supply

Abstract

The invention provides a power supply, which comprises an insulating sheet, a circuit board and a rubber material, the insulating sheet comprises a plurality of side walls to form an accommodating space. The circuit board comprises a top surface and a bottom surface. The bottom surface faces the insulating sheet. The adhesive material is accommodated in the accommodating space and covers the top surface and the bottom surface of the circuit board.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a power supply, and more particularly to a thin potting power supply. BACKGROUND

[0002] Protection of a power supply is to protect electronic components on a circuit board by a glue material. In the industry, the glue material is coated on the circuit board or is potted to the circuit board. However, coating the glue material on the circuit board results in a limited protection area and poor protection ability. Poting the glue material to the circuit board results in using a large amount of glue material, which is prone to leakage and poor heat dissipation.

[0003] Therefore, there is a need for a power supply that effectively protects electronic components on a circuit board without using a large amount of glue material and effectively dissipating heat. SUMMARY

[0004] The present disclosure provides a power supply including an insulating sheet, a circuit board, and a glue material. The insulating sheet includes a plurality of side walls to form an accommodation space. The circuit board includes a top surface and a bottom surface. The bottom surface faces the insulating sheet. The glue material is accommodated in the accommodation space, and the glue material covers the top surface and the bottom surface of the circuit board.

[0005] In an embodiment, the insulating sheet includes a bottom plate, wherein the bottom plate of the insulating sheet faces the bottom surface of the circuit board, and the bottom surface of the circuit board is located between the top surface of the circuit board and the bottom plate of the insulating sheet.

[0006] In an embodiment, the side walls of the insulating sheet extend upward from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

[0007] In an embodiment, the bottom plate of the insulating sheet, the top surface of the circuit board, and the bottom surface of the circuit board are parallel to each other.

[0008] In an embodiment, the side walls of the insulating sheet extend along a direction perpendicular to the bottom plate of the insulating sheet.

[0009] In an embodiment, the height of the side walls of the insulating sheet is higher than the glue material.

[0010] In an embodiment, the insulating sheet further includes a front wall, the front wall extending upward from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

[0011] In an embodiment, the front wall of the insulating sheet extends along a direction perpendicular to the bottom plate of the insulating sheet.

[0012] In an embodiment, the height of the front wall of the insulating sheet is lower than the height of the side walls of the insulating sheet.

[0013] In an embodiment, the height of the front wall of the insulating sheet is higher than the glue material.

[0014] In one embodiment, the power supply further includes a first pad disposed between the base plate of the insulating sheet and the bottom surface of the circuit board.

[0015] In one embodiment, the first gasket abuts against the sidewall, the base plate of the insulating sheet, and the bottom surface of the circuit board.

[0016] In one embodiment, the power supply further includes a second pad disposed on the top surface of the circuit board, wherein the second pad is higher than the adhesive material.

[0017] In one embodiment, the power supply further includes a connector disposed on the top surface of the circuit board, and a second gasket disposed between the connector and the adhesive material, wherein the adhesive material does not cover the connector.

[0018] In one embodiment, the connector does not directly contact the adhesive material.

[0019] In one embodiment, the power supply further includes a housing, wherein the housing is a sheet metal shell.

[0020] In one embodiment, the outer casing is not sealed.

[0021] In one embodiment, the power supply further includes a fan disposed on the housing, wherein the fan supplies airflow to the circuit board.

[0022] In one embodiment, the insulating sheet further includes a front wall, which is disposed between the fan and the adhesive.

[0023] In one embodiment, the fan does not directly contact the adhesive material. Attached Figure Description

[0024] Although this specification concludes by specifically pointing out and explicitly claiming the scope of the claims that are considered embodiments of the present disclosure, the advantages of the embodiments of the present disclosure can be more readily apparent from the description of certain examples of the embodiments when read in conjunction with the accompanying drawings, wherein:

[0025] Figure 1 This is an exploded view of a power supply according to some embodiments of the present disclosure;

[0026] Figure 2 This is a perspective view of a power supply according to some embodiments of the present disclosure, wherein the top cover is omitted.

[0027] [Symbol Explanation]

[0028] 10: Outer shell

[0029] 11: Bottom shell

[0030] 12: Top Cover

[0031] 20: Insulating sheet

[0032] 21: Base Plate

[0033] 22: Sidewall

[0034] 23: Anterior wall

[0035] 30: Circuit board

[0036] 30a: Top surface

[0037] 30b: Bottom surface

[0038] 31: Connector

[0039] 40: First gasket

[0040] 50: Second gasket

[0041] 60: Fan

[0042] 70: Adhesive Materials

[0043] 100: Power Supply Detailed Implementation

[0044] This disclosure can be more clearly understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and to maintain the simplicity of the drawings, many of the figures in this disclosure depict only a portion of the display device, and specific elements in the figures are not drawn to scale. Furthermore, the number and dimensions of the elements in the figures are for illustrative purposes only and are not intended to limit the scope of this disclosure. Additionally, similar and / or corresponding reference numerals may be used in different embodiments, merely to clearly describe some embodiments, and do not represent any connection between the different embodiments and / or structures discussed.

[0045] Throughout this disclosure, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the specification and claims, words such as "comprising," "containing," and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, when the terms "comprising," "containing," and / or "having" are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0046] Furthermore, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one element of the figures to another element. It is understood that if the apparatus in the figures is flipped so that it is upside down, the element described as being on the "below" side will become the element on the "above" side.

[0047] When a component (e.g., an element, membrane, or region) is referred to as "on another component" or "connected to another component," it can be directly on or directly connected to another component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component" or "directly connected to another component," there are no components between them. Furthermore, when a component is referred to as "on another component," there is a vertical relationship between the two in the planar view, and this component can be above or below the other component, depending on the orientation of the device.

[0048] The terms “approximately,” “substantially,” or “roughly” are generally interpreted as being within 10% of a given value or range, or as being within 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0049] In this disclosure, when element A is mentioned as overlapping element B, it is intended to include cases where there is at least partial overlap.

[0050] It is understood that although terms such as "first," "second," etc., may be used herein to describe various elements, layers, and / or portions, these elements, layers, and / or portions should not be limited by these terms, and these terms are only used to distinguish different elements, layers, and / or portions. Therefore, a first element, layer, and / or portion discussed below may be referred to as a second element, layer, and / or portion without departing from the teachings of some embodiments disclosed herein. Furthermore, for the sake of brevity, the terms "first," "second," etc., may not be used in the specification to distinguish different elements. Without departing from the scope defined by the claims, the first and / or second elements recited in the claims may be interpreted as any element described in the specification.

[0051] In this disclosure, the thickness, length, and width can be measured using an optical microscope, while the thickness can be measured from a cross-sectional image obtained using an electron microscope, but these methods are not limited to this. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first direction is perpendicular to the second direction, the angle between the first and second directions can be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions can be between 0 and 10 degrees.

[0052] It should be noted that the technical solutions provided in the different embodiments below can be substituted for, combined or mixed with each other to constitute another embodiment without violating the spirit of this disclosure.

[0053] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0054] Please see Figure 1 and Figure 2 . Figure 1 This is an exploded view of a power supply 100 according to some embodiments of the present disclosure. Figure 2 This is a perspective view of a power supply 100 according to some embodiments of the present disclosure, wherein the top cover 12 is omitted.

[0055] like Figure 1 As shown, the power supply 100 includes a housing 10, an insulating sheet 20, a circuit board 30, a first gasket 40, a second gasket 50, a fan 60, and an adhesive material 70.

[0056] The housing 10 includes a bottom housing 11 and a top cover 12. The bottom housing 11 and the top cover 12 can form an internal space to accommodate other components of the power supply 100.

[0057] According to some embodiments disclosed herein, the housing 10 may be a sheet metal casing, and the housing 10 may be non-sealed. In other words, the housing 10 may have gaps, allowing communication between the interior and exterior of the power supply 100.

[0058] According to some embodiments disclosed herein, the housing 10 may include a metallic material, while the insulating sheet 20 is electrically insulating. The insulating sheet 20 may be formed by adhesive bonding into a semi-open (non-closed) insulating sheet.

[0059] An insulating sheet 20 is disposed on a bottom shell 11. The insulating sheet 20 includes a bottom plate 21, a plurality of side walls 22, and a front wall 23. The bottom plate 21 is parallel to the bottom shell 11, and the side walls 22 and the front wall 23 extend upward from the bottom plate 21 in a direction perpendicular to the bottom plate 21.

[0060] like Figure 1 and Figure 2 As shown, the sidewalls 22 can be opposite each other, and the front wall 23 can be substantially perpendicular to the sidewalls 22. The sidewalls 22 and the front wall 23 can form a generally U-shaped continuous wall.

[0061] The sidewall 22 (or the sidewall 22 and the front wall 23) can form a receiving space to accommodate the adhesive material 70. The sidewall 22 extends from the base plate 21 at a greater height than the front wall 23 extends from the base plate 21, such that the height of the sidewall 22 is higher than the height of the front wall 23 (the height of the front wall 23 is lower than the height of the sidewall 22). In this way, the adhesive material 70 can be effectively accommodated in the receiving space, and the components on the circuit board 30 can be protected.

[0062] like Figure 1 and Figure 2 As shown, the front wall 23 may not be a continuous plane. The front wall 23 may have a recessed portion facing the circuit board 30 to form a space for accommodating the fan 60 between the front wall 23 and the housing 10.

[0063] The circuit board 30 is disposed above the insulating sheet 20, and there may be a gap between the circuit board 30 and the insulating sheet 20. This gap may be filled with adhesive 70, so that the pins of the electronic components or electronic devices on the circuit board 30 can be covered by the adhesive 70, thereby protecting the pins of the electronic components or electronic devices and preventing dust from accumulating on the pins.

[0064] According to some embodiments disclosed herein, circuit board 30 may include multiple electronic components or electronic devices, such as surface mount devices (SMDs).

[0065] The circuit board 30 includes a top surface 30a, a bottom surface 30b, and a connector 31. The bottom surface 30b faces the base plate 21 of the insulating sheet 20, and the bottom surface 30b is located between the top surface 30a and the base plate 21. The top surface 30a, bottom surface 30b, base shell 11, and base plate 21 can be parallel to each other. The connector 31 is disposed on the top surface 30a, and a portion of the connector 31 is located outside the housing 10 for connection with other external devices.

[0066] The first gasket 40 is disposed between the base plate 21 of the insulating sheet 20 and the bottom surface 30b of the circuit board 30. The first gasket 40 abuts against the side wall 22 of the insulating sheet 20, the base plate 21, and the bottom surface 30b of the circuit board 30. In this way, the adhesive 70 filled between the circuit board 30 and the insulating sheet 20 can be prevented from overflowing outside the first gasket 40.

[0067] Please continue reading. Figure 1 and Figure 2 The second pad 50 is disposed on the top surface 30a of the circuit board 30, and the second pad 50 can abut against the top surface 30a, and the second pad 50 is higher than the adhesive material 70 to prevent the adhesive material 70 from overflowing outside the second pad 50.

[0068] The second gasket 50 is also disposed between the connector 31 and the adhesive material 70, so that the adhesive material 70 does not cover the connector 31 and the connector 31 does not directly contact the adhesive material 70.

[0069] According to some embodiments disclosed herein, the first gasket 40 and the second gasket 50 may be soft gaskets. In some embodiments, there may be gaps between the first gasket 40 and the second gasket 50 and the circuit board 30; however, due to the high viscosity coefficient of the adhesive 70, the adhesive 70 will not leak in large quantities.

[0070] Please continue reading. Figure 1 and Figure 2 The fan 60 is mounted on the housing 10, and the fan 60 can be positioned on the opposite side of the connector 31. For example, when the fan 60 is located on the front side of the power supply 100, the connector 31 can be located on the rear side of the power supply 100.

[0071] The fan 60 is disposed on the front wall 23 adjacent to the insulating sheet 20, such that the front wall 23 is positioned between the fan 60 and the adhesive material 70. In this way, the adhesive material 70 does not cover the fan 60, and the fan 60 does not directly contact the adhesive material 70.

[0072] like Figure 1 and Figure 2 As shown, fan 60 is also adjacent to circuit board 30, allowing fan 30 to supply airflow to circuit board 30 for cooling. Since housing 10 may have gaps, fan 30 can introduce cooler air from outside power supply 100 into power supply 100, and use this cooler air to cool the electronic components or devices on circuit board 30. This effectively cools the electronic components or devices on circuit board 30, thereby making power supply 100 more stable.

[0073] Adhesive material 70 is disposed within the receiving space of sidewall 22, and adhesive material 70 can cover the top surface 30a and bottom surface 30b of circuit board 30. The sidewall 22 and front wall 23 of insulating sheet 20 extend upwards from base plate 21 beyond the top surface 30a of circuit board 30, and the height of sidewall 22 and front wall 23 is higher than that of adhesive material 70. Therefore, adhesive material 70 can remain well on circuit board 30 without flowing to other places.

[0074] According to some embodiments of this disclosure, the adhesive 70 can be a potting compound such as PU, silicone, or EPOXY adhesive. According to some embodiments of this disclosure, the thickness of the adhesive 70 on the top surface 30a of the circuit board 30 is 1 mm to 5 mm. In this way, the adhesive 70 can effectively protect the electronic components or devices on the circuit board 30, and the amount of adhesive 70 is not excessive.

[0075] Therefore, the power supply 100 configuration of this disclosed embodiment allows the power supply 100 to have the advantage of "thin potting". Therefore, the power supply 100 of this disclosed embodiment has the advantage of saving adhesive material.

[0076] Furthermore, the adhesive 70 of this disclosed embodiment can cover the top surface 30a and bottom surface 30b of the circuit board 30 to protect the electronic components or electronic devices and their component leads on the circuit board 30.

[0077] Furthermore, the coating process has restricted areas and, due to machine limitations, cannot achieve complete protection, resulting in some substrates and components not being coated, thus affecting the power supply's outdoor lifespan. Therefore, compared to the coating process, the power supply 100 of this disclosed embodiment can improve product reliability and achieve effects such as shock absorption.

[0078] Furthermore, in this embodiment of the power supply 100, after assembling the circuit board 30 and the first pad 40 onto the insulating sheet 20 according to a process, adhesive 70 is poured onto the surface of the circuit board 30. The pouring is done by a pouring method, covering the circuit board 30 and its electronic components. By controlling the pouring position, pouring time is saved, and the flow distance of the adhesive can be effectively shortened. Therefore, there is no need for additional fixtures and demolding processes as in traditional methods. Thus, the power supply 100 of this embodiment has the advantages of simplified process and reduced cost, and also avoids damage to components during demolding. Alternatively, in other embodiments, adhesive 70 can be poured onto the insulating sheet 20 first, and then the circuit board 30 can be placed. Or, in other embodiments, a portion of adhesive 70 can be poured onto the insulating sheet 20 first, then the circuit board 30 can be placed, and then a portion of adhesive 70 can be poured onto the surface of the circuit board 30.

[0079] In this disclosed embodiment, the adhesive 70 is a thin layer covering the entire top surface 30a and bottom surface 30b of the circuit board 30, so the gap between the circuit board 30 and the insulating sheet 20 can be completely filled with the adhesive 70. However, the present invention is not limited thereto. In other embodiments, the adhesive 70 may be used to cover only a portion of the top surface 30a and part of the bottom surface 30b of the circuit board 30 as needed, so the gap between the circuit board 30 and the insulating sheet 20 can be partially filled with the adhesive 70.

[0080] In summary, the components and configuration of the power supply according to the embodiments disclosed herein have the advantages of simplified manufacturing process, reduced cost, lightweight design, good heat dissipation, and improved stability.

[0081] Although the embodiments and advantages of this disclosure have been described above, it should be understood that those skilled in the art can make various changes, substitutions, and modifications to this disclosure without departing from its spirit and scope. It should be noted that different embodiments can be arbitrarily combined to form other embodiments, as long as the combination conforms to the spirit of this disclosure. Furthermore, the scope of this disclosure is not limited to the processes, machines, manufacturing processes, compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Those skilled in the art can understand existing or developing processes, machines, manufacturing processes, compositions, apparatuses, methods, and steps from some embodiments of this disclosure. Therefore, the scope of this disclosure includes the aforementioned processes, machines, manufacturing processes, compositions, apparatuses, methods, and steps. Moreover, each claim in the claims constitutes a separate embodiment, and the scope of this disclosure also includes every combination of claims and embodiments.

Claims

1. A power supply, characterized by, Comprising: a housing having an interior space, an insulating sheet disposed in the interior space, the insulating sheet comprising a bottom plate and a plurality of side walls extending upwardly from the bottom plate, the bottom plate and the plurality of side walls forming a receiving space; a circuit board disposed in the receiving space, the circuit board comprising: a top surface; and a bottom surface facing the bottom plate of the insulating sheet; and an adhesive material received in the receiving space, and the adhesive material covering at least part of the top surface and at least part of the bottom surface of the circuit board.

2. The power supply of claim 1, wherein, The bottom plate of the insulating sheet faces the bottom surface of the circuit board, and the bottom surface of the circuit board is located between the top surface of the circuit board and the bottom plate of the insulating sheet.

3. The power supply of claim 2, wherein, The plurality of side walls of the insulating sheet extend upwardly from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

4. The power supply of claim 2, wherein, The bottom plate of the insulating sheet, the top surface of the circuit board, and the bottom surface of the circuit board are parallel to each other.

5. The power supply of claim 2, wherein, The plurality of side walls of the insulating sheet extend along a direction perpendicular to the bottom plate of the insulating sheet.

6. The power supply of claim 2, wherein, The plurality of side walls of the insulating sheet have a height higher than the adhesive material.

7. The power supply of claim 2, wherein, The insulating sheet further comprises a front wall extending upwardly from the bottom plate of the insulating sheet beyond the top surface of the circuit board.

8. The power supply of claim 7, wherein, The front wall of the insulating sheet extends along a direction perpendicular to the bottom plate of the insulating sheet.

9. The power supply of claim 7, wherein, The front wall of the insulating sheet has a height lower than the height of the plurality of side walls of the insulating sheet.

10. The power supply of claim 7, wherein, The front wall of the insulating sheet has a height higher than the adhesive material.

11. The power supply of claim 1, wherein, Further comprising a first gasket disposed between the bottom plate of the insulating sheet and the bottom surface of the circuit board.

12. The power supply of claim 11, wherein, The first gasket abuts against the plurality of side walls, the bottom plate of the insulating sheet, and the bottom surface of the circuit board.

13. The power supply of claim 1, wherein, Further comprising a second gasket disposed on the top surface of the circuit board, wherein the second gasket is higher than the adhesive material.

14. The power supply of claim 13, wherein, Further comprising a connector disposed on the top surface of the circuit board, wherein the second gasket is disposed between the connector and the adhesive material, and the adhesive material does not cover the connector.

15. The power supply of claim 14, wherein, The connector does not directly contact the adhesive material.

16. The power supply of claim 1, wherein, The housing is a sheet metal housing.

17. The power supply of claim 16, wherein, The housing is non-sealed.

18. The power supply of claim 16, wherein, Further comprising a fan disposed on the housing, wherein the fan supplies an airflow to the circuit board.

19. The power supply of claim 18, wherein, The insulating sheet further comprises a front wall, and the front wall is disposed between the fan and the adhesive material.

20. The power supply of claim 18, wherein, The fan does not directly contact the adhesive material.

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