Component mounting device and component mounting method

Abstract

The invention provides a component mounting device and a component mounting method, which can restrain contact between a component mounted on the back surface of a substrate and a support pin. The component mounting apparatus includes: a substrate conveying device that supports an end portion of a substrate and conveys the substrate; a support pin that supports the back surface of the substrate; a mounting head for mounting a component on the surface of the substrate; a pin moving device for moving the support pin; a height sensor that detects the height of the back surface of the substrate; and a controller. The controller includes: a determination unit that determines, based on detection data of the height sensor, a mounting region in which a component is mounted and a non-mounting region in which no component is mounted on the rear surface of the substrate; a pin control unit that controls the pin moving device so that the support pin supports the non-attachment area; and a head control unit that controls the mounting head so as to mount the component on the surface of the substrate in a state in which the support pin supports the non-mounting region.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a parts mounting device and a parts mounting method. Background Technology

[0002] In component mounting devices, support pins, such as those disclosed in Patent Document 1, are sometimes used. These support pins support the back side of the substrate to prevent deflection.

[0003] [Existing technical documents] [Patent Literature] [Patent Document 1] Japanese Patent Application Publication No. 2016-171126 Summary of the Invention [The problem the invention aims to solve] When components are mounted on the back side of a substrate, there is an urgent need for a technology to prevent the support pins from contacting the components.

[0004] The purpose of the technology disclosed in this specification is to suppress contact between components mounted on the back of a substrate and support pins.

[0005] [Technical means to solve the problem] This specification discloses a component mounting apparatus. The component mounting apparatus includes: a substrate conveying device that supports the end of a substrate and conveys the substrate; a support pin that supports the back side of the substrate; a mounting head that mounts a component on the surface of the substrate; a pin moving device that moves the support pin; a height sensor that detects the height of the back side of the substrate; and a controller. The controller includes: a determining unit that determines, based on the detection data from the height sensor, a mounting area on the back side of the substrate where a component is mounted and a non-mounting area where no component is mounted; a pin control unit that controls the pin moving device to cause the support pin to support the non-mounting area; and a head control unit that controls the mounting head to mount the component on the surface of the substrate while the support pin supports the non-mounting area.

[0006] [The effects of the invention] According to the technology disclosed in this specification, contact between the component mounted on the back of the substrate and the support pin is suppressed. Attached Figure Description

[0007] Figure 1 This is a plan view schematically showing the component mounting device of the embodiment.

[0008] Figure 2 This is a side view schematically illustrating the component mounting device of the embodiment.

[0009] Figure 3 This is a block diagram showing the controller of the parts mounting device in the embodiment.

[0010] Figure 4This is a flowchart illustrating a component assembly method for an implementation.

[0011] Figure 5 This is a diagram illustrating a method for detecting the height of the back side of a substrate in an embodiment.

[0012] Figure 6 This is a diagram used to illustrate the installation area and non-installation area of ​​the implementation method.

[0013] Figure 7 This is a diagram illustrating the method of mounting the parts in the implementation method.

[0014] Figure 8 This is a plan view schematically showing a first variation of the embodiment of the component mounting device.

[0015] Figure 9 This is a side view schematically illustrating a second variation of the embodiment of the component mounting device.

[0016] Explanation of icon numbers 1: Parts mounting device 2: Substrate transport device 3: Support pin 3A: Base section 3B: Sales Department 4: Suction nozzle 5: Install head 6: Pin moving device 7: Altitude sensor 8: Controller 8A: Processor 8B: Main Memory 8C: Storage 8D: Input / Output Interface 21: Guiding Component 22: Conveyor belt 23: Pulley 31: First support pin 32: Second support pin 61: Slider 62: Guide rail 81: Substrate Control Unit 82: Head Control Unit 83: Sales Control Department 84: Contour Generation Department 85: Determining the Department 86: Contour Storage Department 611: First slider 612: Second slider 613: Third slider C: Parts D: Segmentation region D1: First segmented region D2: Second segmentation region G: Support position G1: First support position G2: Second support position M: Installation area N: Non-installation area P: Substrate Pa: Surface Pb: Backside PL: Outline Q1: Entrance location Q2: Processing location Detailed Implementation The following is a reference to the appendix. Figure 1 The embodiments of the present invention will be described below, but the present invention is not limited to these embodiments. The constituent elements of the embodiments described below can be appropriately combined. Sometimes, some constituent elements are not used.

[0017] In the following description, an XYZ orthogonal coordinate system is established for the part mounting device 1, and the positional relationships of each part are explained with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis (first axis) in the specified plane is defined as the X-axis direction (first axis direction). The direction parallel to the Y-axis (second axis) orthogonal to the X-axis in the specified plane is defined as the Y-axis direction (second axis direction). The direction parallel to the Z-axis (third axis) orthogonal to the specified plane is defined as the Z-axis direction (third axis direction). The rotational or tilting direction centered on the X-axis is defined as the θX direction. The rotational or tilting direction centered on the Y-axis is defined as the θY direction. The rotational or tilting direction centered on the Z-axis is defined as the θZ direction. The specified plane is the XY plane. In the embodiment, the specified plane is assumed to be parallel to the horizontal plane. The Z-axis direction is the vertical direction (up and down direction). The +Z side is the upper side, and the -Z side is the lower side.

[0018] [Parts mounting device] Figure 1 This is a schematic plan view of the parts mounting device 1 according to the embodiment. Figure 2 This is a schematic side view of the component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 includes: a substrate conveying device 2, which supports the end of a substrate P in the Y-axis direction and conveys the substrate P; a support pin 3, which supports the back surface Pb of the substrate P; a mounting head 5, which mounts a component C on the surface Pa of the substrate P; a pin moving device 6, which moves the support pin 3; and a height sensor 7, which detects the height of the back surface Pb of the substrate P.

[0019] The substrate transport device 2 transports the substrate P from the entry position Q1 to the processing position Q2. The entry position Q1 is positioned further to the -X side than the processing position Q2. The substrate transport device 2 transports the substrate P towards the +X side. The processing position Q2 is the position where the mounting process of the component C is performed on the substrate P. The entry position Q1 is the position where the loading process of the substrate P is performed on the processing position Q2.

[0020] The substrate transport device 2 supports the substrate P with its surface Pa facing upwards and its back surface Pb facing downwards. The surface Pa and back surface Pb of the substrate P are substantially parallel. The substrate transport device 2 supports the substrate P with its back surface Pb parallel to the XY plane. The substrate transport device 2 transports the substrate P while maintaining the back surface Pb of the substrate P parallel to the XY plane. At both the inlet position Q1 and the processing position Q2, the back surface Pb of the substrate P is parallel to the XY plane.

[0021] In the XY plane, substrate P has a rectangular shape. Substrate P is longer along the X-axis. Substrate conveying device 2 conveys substrate P along its longer side.

[0022] The substrate conveying device 2 includes a pair of guide members 21 for guiding a substrate P, a pair of conveyor belts 22 for conveying the ends of the substrate P, and a plurality of pulleys 23 for supporting the conveyor belts 22. The guide members 21 are long in the X-axis direction. One guide member 21 is spaced apart from the other guide member 21 and arranged along the Y-axis direction. The guide members 21 guide the substrate P in the X-axis direction. The conveyor belts 22 are loop-shaped and are seamless. One conveyor belt 22 is spaced apart from the other conveyor belt 22 and arranged along the Y-axis direction. The pair of conveyor belts 22 support both ends of the substrate P in the Y-axis direction. One conveyor belt 22 supports the +Y side end of the back surface Pb of the substrate P from below. The other conveyor belt 22 supports the -Y side end of the back surface Pb of the substrate P from below. At least one of the plurality of pulleys 23 is a drive pulley that is rotated by a conveying motor. The drive pulley, supporting the conveyor belt 22, rotates due to the rotational force generated by the conveyor motor. The rotation of the drive pulley causes the conveyor belt 22 to rotate. The substrate P is conveyed along the X-axis direction by the rotation of the conveyor belt 22. After the substrate P is positioned at processing position Q2, both ends of the substrate P in the Y-axis direction are clamped by a clamping mechanism (not shown). The clamping mechanism fixes the substrate P at processing position Q2.

[0023] Support pin 3 supports the back surface Pb of substrate P disposed at processing position Q2. In this embodiment, two support pins 3 are provided. Each support pin 3 includes a first support pin 31 and a second support pin 32. In the X-axis direction, the first support pin 31 and the second support pin 32 are disposed at different positions. The first support pin 31 is disposed further towards the -X side than the second support pin 32. The first support pin 31 moves within a first range of movement in the XY plane. The second support pin 32 moves within a second range of movement in the XY plane, different from the first range of movement. The first range of movement of the first support pin 31 is positioned further towards the -X side than the second range of movement of the second support pin 32. In this embodiment, both the first support pin 31 and the second support pin 32 move along the X-axis direction. The first support pin 31 moves along the X-axis direction within the first range of movement. The second support pin 32 moves along the X-axis direction within the second range of movement.

[0024] The mounting head 5 has a suction nozzle 4 for holding part C. The mounting head 5 mounts part C onto the surface Pa of the substrate P, which is positioned at processing position Q2. With the back side Pb of the substrate P supported by the support pin 3, the mounting head 5 mounts part C, held by the suction nozzle 4, onto the surface Pa of the substrate P. The mounting head 5 uses the suction nozzle 4 to hold part C supplied from the part feeder and mount it onto the surface Pa of the substrate P.

[0025] The mounting head 5 can move along the X-axis and Y-axis directions respectively via a head moving device (not shown). The mounting head 5 supports the suction nozzle 4, which can move along the Z-axis and θZ directions respectively. The suction nozzle 4 can move along the Z-axis and θZ directions respectively via a suction nozzle moving device (not shown). The suction nozzle 4 can move along the four directions of X-axis, Y-axis, Z-axis, and θZ via the head moving device and the suction nozzle moving device. Alternatively, the suction nozzle 4 can also move along six directions: X-axis, Y-axis, Z-axis, θX, θY, and θZ. The mounting head 5 uses the suction nozzle 4 to hold the part C supplied from the part feeder, transport it to the processing position Q2, and then mount it onto the surface Pa of the substrate P.

[0026] The pin moving device 6 moves the support pin 3 in the XY plane. In this embodiment, the pin moving device 6 moves the support pin 3 along the X-axis. The pin moving device 6 has a slider 61 to which the lower end of the support pin 3 is fixed and a guide rail 62 that guides the slider 61 along the X-axis. The position of the guide rail 62 is fixed. The pin moving device 6 includes a linear motor. The slider 61 includes the mover of the linear motor. The guide rail 62 includes the stator of the linear motor. The linear motor may also be a moving coil type where the mover has a coil and the stator has a magnet. The linear motor may also be a moving iron type where the mover has a magnet and the stator has a coil.

[0027] The slider 61 includes a first slider 611 with its lower end fixed to a first support pin 31 and a second slider 612 with its lower end fixed to a second support pin 32. A guide rail 62 guides the first slider 611 and the second slider 612 along the X-axis. The first slider 611 moves along the X-axis towards the -X side, which is closer to the second slider 612. The second slider 612 moves along the X-axis towards the +X side, which is closer to the first slider 611.

[0028] The support pin 3 has a base portion 3A fixed to the slider 61 and a pin portion 3B at least partially disposed above the base portion 3A. The lower end of the base portion 3A is fixed to the slider 61. The pin portion 3B protrudes upward from the upper end of the base portion 3A. The support pin 3 supports the back surface Pb of the base plate P at the upper end of the pin portion 3B. The pin portion 3B is fixed to the base portion 3A. Alternatively, the pin portion 3B can also be movable relative to the base portion 3A along the Z-axis direction via a pin actuator (not shown).

[0029] A support pin 3 is disposed between one conveyor belt 22 and the other conveyor belt 22 in the Y-axis direction. The support pin 3 supports the center of the back surface Pb of the substrate P in the Y-axis direction. The guide rail 62 is configured such that the support pin 3 supports the center of the back surface Pb of the substrate P in the Y-axis direction.

[0030] The height sensor 7 detects the height of the back surface Pb of the substrate P. The height sensor 7 detects the height of the back surface Pb of the substrate P when the end of the substrate P in the Y-axis direction is supported by the substrate conveying device 2.

[0031] The height sensor 7 detects the height of the back surface Pb of the substrate P without contact with the substrate P. The height sensor 7 is an optical sensor having a light-emitting part and a light-receiving part. The light-emitting part illuminates the substrate P with detection light, and the light-receiving part receives the detection light reflected by the substrate P. The height sensor 7 is positioned lower than the substrate P being transported by the substrate transport device 2. The height sensor 7 is positioned facing the back surface Pb of the substrate P, which is positioned at the entrance position Q1. The height sensor 7 detects the height of the back surface Pb of the substrate P, which is positioned at the entrance position Q1.

[0032] The height sensor 7 is positioned further along the guide rail 62 of the pin moving device 6 towards the -X side (entry position Q1 side). The position of the height sensor 7 is fixed. The height sensor 7 detects the height of the back surface Pb of the substrate P when the substrate P is passing through the entry position Q1 by means of the substrate transport device 2. The height sensor 7 detects the height of the back surface Pb of the substrate P before the substrate P is transported to the processing position Q2.

[0033] In the Y-axis direction, the height sensor 7 is positioned at the same location as the support pin 3 (guide rail 62). The height sensor 7 detects the height of the center of the back surface Pb of the substrate P, at least in the Y-axis direction. The detection range of the height sensor 7 is set to include the center of the back surface Pb of the substrate P in the Y-axis direction. The detection range of the height sensor 7 includes the illumination range of the detection light. The detection range of the height sensor 7 is set to include at least a portion of the back surface Pb of the substrate P that can be supported by the support pin 3.

[0034] [Controller] Figure 3 This is a block diagram illustrating the controller 8 of the component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 includes a controller 8. The controller 8 includes a computer. The controller 8 has a processor 8A, a main memory 8B, a memory 8C, and an input / output interface 8D. The processor 8A includes a central processing unit (CPU) or a microprocessor (MPU). The main memory 8B includes non-volatile memory such as read-only memory (ROM) or volatile memory such as random access memory (RAM). The memory 8C is a non-temporary tangible storage medium. Examples of memory 8C include a magnetic disk, optical disk, or semiconductor memory. The input / output interface 8D includes input / output circuitry. The function of the controller 8 is to store the computer program in the memory 8C. The processor 8A reads the computer program from the memory 8C and expands it into the main memory 8B, and executes processing according to the computer program. Alternatively, the computer program can also be distributed to the controller 8 via a network. The processor 8A is connected to the substrate transport device 2, the mounting head 5, the pin moving device 6 and the height sensor 7 via the input / output interface 8D.

[0035] The processor 8A includes a substrate control unit 81, a head control unit 82, a pin control unit 83, a contour generation unit 84, and a determination unit 85. The memory 8C includes a contour storage unit 86.

[0036] The substrate control unit 81 outputs control commands for controlling the substrate transport device 2. The head control unit 82 outputs control commands for controlling the mounting head 5, which includes the suction nozzle 4. The pin control unit 83 outputs control commands for controlling the pin moving device 6. The contour generation unit 84 generates contour data representing the three-dimensional shape of the back surface Pb of the substrate P based on the detection data of the height sensor 7. The determination unit 85 determines, based on the detection data of the height sensor 7, the mounting area M where the part C is mounted and the non-mounting area N where the part C is not mounted. The contour storage unit 86 stores the contour data generated by the contour generation unit 84. The determination unit 85 determines the mounting area M and the non-mounting area N based on the contour data stored in the contour storage unit 86.

[0037] [Parts Installation Method] Figure 4 This is a flowchart illustrating a component mounting method according to an embodiment. A substrate P is moved from the upstream device of the component mounting apparatus 1 to the inlet position Q1 of the substrate transport apparatus 2. An example of the upstream device of the component mounting apparatus 1 is a solder printing apparatus that applies solder paste to the surface Pa of the substrate P. The substrate control unit 81 controls the substrate transport apparatus 2 to move the substrate P from the inlet position Q1 to the processing position Q2. The substrate P is moved from the inlet position Q1 to the processing position Q2. The height sensor 7 detects the height of the back surface Pb of the substrate P in parallel with the movement of the substrate P (step S1).

[0038] Figure 5 This is a diagram illustrating the height detection method of the back surface Pb of the substrate P in an embodiment. (See diagram) Figure 5 As shown, component C is mounted on the back side Pb of substrate P. Substrate P with component C mounted on the back side Pb passes through inlet position Q1. Substrate P with component C mounted on the back side Pb is moved from inlet position Q1 to processing position Q2.

[0039] The height sensor 7 detects the height of the back surface Pb of the substrate P when the substrate P is passing through the inlet position Q1 by means of the substrate transport device 2. The height sensor 7 illuminates the back surface Pb of the substrate P with detection light when the substrate P is passing through the inlet position Q1.

[0040] The height of the back surface Pb of substrate P refers to the position of the back surface Pb in the Z-axis direction. The height of the back surface Pb of substrate P includes the height of the component C mounted on the back surface Pb of substrate P. The height of component C includes the position of the lower surface of component C in the Z-axis direction. Detecting the height of the back surface Pb of substrate P includes detecting the height of the component C mounted on the back surface Pb of substrate P. Irradiating the back surface Pb of substrate P with detection light includes irradiating the component C mounted on the back surface Pb of substrate P with detection light.

[0041] The contour generation unit 84 acquires detection data from the height sensor 7. Based on the detection data from the height sensor 7, the contour generation unit 84 generates contour data representing the three-dimensional shape of the back surface Pb of the substrate P. The contour data includes the three-dimensional shape of the part C mounted on the back surface Pb of the substrate P. The contour data includes position data of the back surface Pb of the substrate P at least along the X-axis and Z-axis directions. The contour data includes position data of multiple detection points of the back surface Pb of the substrate P in the X-axis, Y-axis, and Z-axis directions respectively. The contour data includes the three-dimensional shape of the back surface Pb of the substrate P. The contour data generated by the contour generation unit 84 is stored in the contour storage unit 86 (step S2).

[0042] The determination unit 85 determines the mounting area M on the back side Pb of the substrate P where the component C is mounted and the non-mounting area N where the component C is not mounted, based on the contour data stored in the contour storage unit 86 (step S3).

[0043] Figure 6 This is a diagram used to illustrate the installation area M and the non-installation area N of the implementation method. For example... Figure 6 As shown, the contour data includes a contour line PL representing the three-dimensional shape of the back surface Pb of substrate P. The back surface Pb of substrate P is a flat surface parallel to the XY plane. The reference contour line in contour line PL representing the back surface Pb of substrate P is parallel to the XY plane. The part contour line in contour line PL representing part C protrudes downward from the reference contour line. The determination unit 85 can determine the mounting area M and the non-mounting area N based on the reference contour line in contour line PL representing the back surface Pb of substrate P and the part contour line representing part C. The determination unit 85 can determine the mounting area M and the non-mounting area N based on the amount of protrusion of the part contour line protruding downward from the reference contour line. The determination unit 85 determines the portion of the profile line PL protruding downward from the reference contour line where the amount of protrusion is above a predetermined threshold as the mounting area M.

[0044] The determining unit 85 defines multiple segmented regions D on the back surface Pb of the substrate P based on the number of support pins 3. The determining unit 85 defines the segmented regions D such that their areas are equal. The determining unit 85 divides the back surface Pb of the substrate P into multiple segmented regions D by equal division of the support pins 3. In this embodiment, the number of support pins 3 is two. The determining unit 85 divides the back surface Pb of the substrate P into a first segmented region D1 and a second segmented region D2. The determining unit 85 divides the back surface Pb of the substrate P into the first segmented region D1 and the second segmented region D2 (step S4).

[0045] The first segmented region D1 is the segmented region D supported by the first support pin 31. The second segmented region D2 is the segmented region D supported by the second support pin 32. The first support pin 31 is positioned further to the -X side than the second support pin 32. The first segmented region D1 is positioned further to the -X side than the second segmented region D2. In the XY plane, the shape and area of ​​the first segmented region D1 are substantially equal to the shape and area of ​​the second segmented region D2.

[0046] The determining unit 85 determines the support position G in the segmented region D where the support pin 3 is supported. The support position G is the position where the upper end of the pin 3B contacts the back surface Pb of the substrate P. The determining unit 85 sets the support position G to the non-mounting region N in the XY plane that is closest to the center of the segmented region D (step S5).

[0047] In this embodiment, the support pin 3 moves only along the X-axis direction. In this embodiment, the center of the segmented region D refers to the center of the segmented region D along the X-axis direction.

[0048] The support position G is determined to be such that the support pin 3 does not contact the part C. The determining unit 85 determines the support position G in a manner that satisfies the condition of being closest to the center of the segmented region D and that the support pin 3 does not contact the part C. The determining unit 85 may determine the support position G based on the contour data of the back surface Pb of the substrate P and the known shape and size of the support pin 3, in a manner that satisfies the condition of being closest to the center of the segmented region D and that the support pin 3 does not contact the part C.

[0049] When the center of segmented region D is located in non-installation region N, the support position G is determined to be the center of segmented region D. When the center of segmented region D is located in non-installation region N, the support pin 3 may come into contact with part C when supporting the center of segmented region D. If the support pin 3 may come into contact with part C when supporting the center of segmented region D, the determining unit 85 sets the support position G to a position offset from the center of segmented region D to prevent the support pin 3 from contacting part C.

[0050] When the center of the segmented region D is located in the mounting region M, the support position G is determined to be the position closest to the center of the segmented region D among the non-mounting regions N surrounding the center of the segmented region D. When the support pin 3 supports the position closest to the center of the segmented region D in the non-mounting region N, the support pin 3 may come into contact with the part C. If the support pin 3 may come into contact with the part C when it supports the position closest to the center of the segmented region D in the non-mounting region N, the determining unit 85 sets the support position G to a position in the non-mounting region N that is offset from the position closest to the center of the segmented region D to prevent the support pin 3 from contacting the part C.

[0051] The determining unit 85 determines the first support position G1 supported by the first support pin 31 in the first segmented region D1. The determining unit 85 determines the second support position G2 supported by the second support pin 32 in the second segmented region D2. The first support position G1 is determined to satisfy the condition of being closest to the center of the first segmented region D1 and the first support pin 31 not contacting the part C. The second support position G2 is determined to satisfy the condition of being closest to the center of the second segmented region D2 and the second support pin 32 not contacting the part C.

[0052] After the support position G is determined, the pin control unit 83 controls the pin moving device 6 so that the support pin 3 supports the non-mounting area N of the back surface Pb of the substrate P. The pin control unit 83 controls the pin moving device 6 so that the first support pin 31 supports the first segmented area D1 of the back surface Pb of the substrate P, and the second support pin 32 supports the second segmented area D2 of the back surface Pb of the substrate P. The pin control unit 83 controls the pin moving device 6 so that the first support pin 31 supports the non-mounting area N closest to the center of the first segmented area D1, and the second support pin 32 supports the non-mounting area N closest to the center of the second segmented area D2 (step S6).

[0053] The pin control unit 83 controls the pin moving device 6 so that the first support pin 31 supports the first support position G1 determined in step S5, and the second support pin 32 supports the second support position G2 determined in step S5. The pin moving device 6 adjusts the X-axis positions of the first support pin 31 and the second support pin 32 so that the first support pin 31 supports the first support position G1 and the second support pin 32 supports the second support position G2.

[0054] Figure 7 This is a diagram illustrating the mounting method of part C in the embodiment. (See diagram below.) Figure 7 As shown, the first support pin 31 supports the first support position G1 on the back side Pb of the substrate P. The second support pin 32 supports the second support position G2 on the back side Pb of the substrate P. After the support pins 3 (31, 32) support the support positions G (G1, G2) of the non-mounting area N, the head control unit 82 controls the mounting head 5 to mount the part C on the surface Pa of the substrate P while the support pins 3 support the support positions G of the non-mounting area N (step S7).

[0055] Since the back surface Pb of substrate P is supported by the support pin 3, the component C is mounted on substrate P while the deflection of substrate P is suppressed. The support pin 3 supports the back surface Pb of substrate P in a manner that does not contact the component C on the back surface Pb of substrate P, thus preventing damage to the component C mounted on the back surface Pb of substrate P or the component C from falling off substrate P.

[0056] After component C has been mounted onto surface Pa of substrate P, substrate control unit 81 controls substrate transport device 2 to remove substrate P from processing position Q2 (step S8). Substrate P, whose mounting process has been completed, is moved from processing position Q2 to the +X side.

[0057] [Effect] As explained above, the determining unit 85 determines the mounting area M on the back side Pb of the substrate P where the component C is mounted and the non-mounting area N where the component C is not mounted, based on the detection data from the height sensor 7. Since the support pin 3 supports the non-mounting area N, contact between the component C mounted on the back side Pb of the substrate P and the support pin 3 is suppressed. Because contact between the component C and the support pin 3 is suppressed, damage to the component C or detachment of the component C from the substrate P is prevented. The pin control unit 83 controls the pin moving device 6 to make the support pin 3 support the non-mounting area N. The operator of the component mounting device 1 does not need to manually set the support pin 3, thus reducing the operator's workload.

[0058] Height sensor 7 detects the height of the back surface Pb of substrate P, which is positioned at entry position Q1. Therefore, before substrate P is positioned at processing position Q2, contour data of the back surface Pb of substrate P is generated, and the support position G is determined.

[0059] The height sensor 7 detects the height of the back surface Pb of the substrate P when the substrate P is passing through the entrance position Q1. The detection range of the height sensor 7 moves relative to the back surface Pb of the substrate P, and the detection range of the height sensor 7 scans the back surface Pb of the substrate P, thus efficiently generating the contour data of the back surface Pb of the substrate P.

[0060] The first support pin 31 supports the first segmented region D1 of the back surface Pb of the substrate P, and the second support pin 32 supports the second segmented region D2 of the back surface Pb of the substrate P. Thus, the deflection of the substrate P is effectively suppressed.

[0061] The pin control unit 83 controls the pin moving device 6 so that the first support pin 31 supports the non-installation area N closest to the center of the first segmented region D1, and the second support pin 32 supports the non-installation area N closest to the center of the second segmented region D2. As a result, contact between the support pin 3 and the part C is suppressed, and the deflection of the substrate P is effectively suppressed.

[0062] [Other Implementation Methods] Figure 8This is a plan view schematically illustrating a first variation of the embodiment of the part mounting device 1. Alternatively, the distance between one conveyor belt 22 and the other conveyor belt 22 can be varied in the Y-axis direction. For example, the distance between one conveyor belt 22 and the other conveyor belt 22 can be varied in the Y-axis direction, consistent with the size of the substrate P in the Y-axis direction. Alternatively, the guide rail 62 of the pin moving device 6 can move in the Y-axis direction, consistent with the distance between one conveyor belt 22 and the other conveyor belt 22. The guide rail 62 moves in the Y-axis direction so that the center of the back surface Pb of the substrate P is supported on the support pin 3. The guide rail 62 moves in the Y-axis direction by a guide movement actuator (not shown). When the distance between one conveyor belt 22 and the other conveyor belt 22 is varied, the controller 8 can also control the guide movement actuator to move the guide rail 62 in the Y-axis direction so that the center of the back surface Pb of the substrate P is supported on the support pin 3 in the Y-axis direction.

[0063] In the described embodiment, there are two support pins 3. However, there may also be three or more support pins 3. The number of segmented regions D can also be determined based on the number of support pins 3.

[0064] In the described embodiments, for example, when the area of ​​the non-mounting region N is small, i.e., when the parts C are densely packed, the support pin 3 may not be able to support the non-mounting region N. If it is determined that the support pin 3 cannot support the non-mounting region N, the pin control unit 83 may also control the pin moving device 6 to move the support pin 3 to the outside of the substrate P. That is, if it is determined that the support pin 3 cannot support the non-mounting region N, the pin control unit 83 may also move the support pin 3 to a position that is not facing the back surface Pb of the substrate P. If it is determined that among the multiple segmented regions D, the first support pin 31 cannot support the non-mounting region N of the first segmented region D1, while the second support pin 32 can support the non-mounting region N of the second segmented region D2, the pin control unit 83 may also control the pin moving device 6 to move the first support pin 31 to a position that is not facing the back surface Pb of the substrate P, and the second support pin 32 supports the non-mounting region N of the second segmented region D2. In addition, if the pin 3B can move relative to the base 3A along the Z-axis direction via a pin actuator (not shown), and it is determined that the support pin 3 cannot support the non-installation area N, the pin control unit 83 can also lower the pin 3B so that the pin 3B moves away from the back surface Pb of the substrate P.

[0065] In the described embodiment, the support pin 3 is assumed to move only along the X-axis direction. The support pin 3 can also move along both the X-axis and Y-axis directions. The pin moving device 6 can also move the support pin 3 along both the X-axis and Y-axis directions. The support position G can also be determined to satisfy the following conditions: it is closest to the center of the segmented region D in each of the X-axis and Y-axis directions, and the support pin 3 does not contact the part C.

[0066] In the described embodiment, the detection range of the height sensor 7 can also be a long slit in the Y-axis direction. The +Y side end of the detection range of the height sensor 7 can also coincide with the +Y side end of the back surface Pb of the substrate P transported by the substrate transport device 2. Similarly, the -Y side end of the detection range of the height sensor 7 can also coincide with the -Y side end of the back surface Pb of the substrate P transported by the substrate transport device 2. When the substrate P is passing through the inlet position Q1, detection light is emitted from the height sensor 7, thereby illuminating the entire area of ​​the back surface Pb of the substrate P. When the substrate P is passing through the inlet position Q1, the detection light emitted from the height sensor 7 allows the contour generation unit 84 to generate contour data for the entire area of ​​the back surface Pb of the substrate P.

[0067] In the described embodiment, parameters for determining the support position G by the determining unit 85 can be pre-specified. Examples of parameters for determining the support position G include the range of support positions G set on the back surface Pb of the substrate P, the lower limit of the distance between adjacent support positions G, the ratio of the intervals between multiple support positions G, and the lower limit of the distance between the support position G and the component C. When the controller 8 is connected to an input device such as a computer keyboard or touch panel, the operator of the component mounting device 1 can operate the input device to specify the parameters for determining the support position G. The operator can also operate the input device to specify the range of support positions G set on the back surface Pb of the substrate P. When multiple support pins 3 are present, the operator can also operate the input device to specify the lower limit of the distance between adjacent support positions G. The operator can also operate the input device to specify the ratio of the intervals between multiple support positions G so that the ratio of the intervals between multiple support positions G becomes the same, that is, the multiple support positions G are arranged at equal intervals. The operator can also operate the input device to specify the lower limit of the distance between the support position G and the component C. The operator can also operate the input device to specify the position of the support position G. The support location G can be designated as either the non-installation area N closest to the center of the segmented region D or the non-installation area N furthest from the center of the segmented region D.

[0068] In the described embodiment, priority conditions for the parameters used by the determining unit 85 when determining the support position G can also be specified. The operator of the part mounting device 1 can operate the input device to specify the priority conditions. The operator can also operate the input device to specify that the distance between adjacent support positions G is not lower than a lower limit value as the first priority. The operator can also operate the input device to specify that the ratio of the intervals between multiple support positions G becomes the same as the first priority. The operator can also operate the input device to specify that the distance between the support position G and the part C is not lower than a lower limit value as the first priority.

[0069] As described in the embodiment, the height sensor 7 detects the height of the back surface Pb of the substrate P when the substrate P is passing through the inlet position Q1 by means of the rotation of the conveyor belt 22. If the substrate P slips on the conveyor belt 22, the actual three-dimensional shape of the back surface Pb of the substrate P may deviate from the contour line PL generated in the contour generation unit 84. In order to suppress the deviation between the actual three-dimensional shape of the back surface Pb of the substrate P and the contour line PL, measures can be taken to suppress the slippage of the substrate P on the conveyor belt 22. For example, the surface of the conveyor belt 22 may be formed of a material with a high coefficient of friction relative to the substrate P. The surface of the conveyor belt 22 may also be cleaned periodically or automatically. The conveying acceleration and deceleration of the conveyor belt 22 when conveying the substrate P may also be reduced. The distance in the Y-axis direction between one conveyor belt 22 and the other conveyor belt 22 may also be adjusted according to the size of the substrate P.

[0070] Figure 9 This is a side view schematically illustrating a second variation of the embodiment, showing the component mounting device 1. In this embodiment, the position of the height sensor 7 is fixed. The height sensor 7 can also be moved. Figure 9 As shown, the height sensor 7 can also be configured on a third slider 613 that moves on the guide rail 62. The height sensor 7 can move along the X-axis direction by moving the third slider 613. The height sensor 7 detects the height of the back surface Pb of the substrate P, which is positioned at the processing position Q2. After the position of the substrate P is fixed at the processing position Q2, the height sensor 7 moves along the X-axis while detecting the height of the back surface Pb of the substrate P. The detection range of the height sensor 7 moves relative to the back surface Pb of the substrate P, and the detection range of the height sensor 7 scans the back surface Pb of the substrate P, thereby generating contour data of the back surface Pb of the substrate P. After the contour data of the back surface Pb of the substrate P is generated, the support position G is determined, and the pin moving device 6 is controlled to make the support pin 3 support the support position G. After the support pin 3 supports the support position G, the part C is mounted on the surface Pa of the substrate P.

Claims

1. A component mounting apparatus comprising: a substrate conveyance device that conveys a substrate while supporting an end portion of the substrate; a support pin that supports a back surface of the substrate; a mounting head that mounts a component on a surface of the substrate; a pin moving device that moves the support pin; a height sensor that detects a height of the back surface of the substrate; and a controller, the controller having: a determination section that determines a mounting area on which a component is mounted on the back surface of the substrate and a non-mounting area on which a component is not mounted, based on detection data of the height sensor; a pin control section that controls the pin moving device so that the support pin supports the non-mounting area; and a head control section that controls the mounting head so that it mounts a component on the surface of the substrate while the support pin supports the non-mounting area.

2. The component mounting apparatus according to claim 1, wherein the substrate conveyance device conveys the substrate from an entry position to a processing position, the support pin supports the back surface of the substrate disposed at the processing position, the mounting head mounts a component on the surface of the substrate disposed at the processing position, the pin moving device moves the support pin in a prescribed plane parallel to the back surface of the substrate, the height sensor detects the height of the back surface of the substrate disposed at the entry position.

3. The component mounting apparatus according to claim 2, wherein the height sensor detects the height of the back surface of the substrate while the substrate is passing through the entry position by the substrate conveyance device.

4. The component mounting apparatus according to claim 2, wherein the support pin includes a first support pin and a second support pin, the pin moving device has a first slide to which the first support pin is fixed, a second slide to which the second support pin is fixed, and a guide rail that guides the first slide and the second slide in a first axis direction of the prescribed plane, the first support pin supports a first divided area of the back surface of the substrate, the second support pin supports a second divided area of the back surface of the substrate.

5. The component mounting apparatus according to claim 4, wherein the pin control section controls the pin moving device so that the first support pin supports the non-mounting area closest to a center of the first divided area and the second support pin supports the non-mounting area closest to a center of the second divided area.

6. The component mounting apparatus according to claim 4, wherein the substrate conveyance device has a pair of conveyance belts that support both end portions of the substrate in a second axis direction orthogonal to the first axis direction in the prescribed plane, and conveys the substrate in the first axis direction by the conveyance belts, a distance between one of the conveyance belts and the other conveyance belt in the second axis direction is variable, the guide rail moves in the second axis direction in correspondence with the distance.

7. The component mounting apparatus according to claim 1, wherein the pin control section controls the pin moving device so that the support pin moves to an outside of the substrate when it is determined that the support pin cannot support the non-mounting area. ​ ​ 8. A component mounting method comprising: detecting a height of a back surface of a substrate with a height sensor while an end portion of the substrate is supported by a substrate conveyance device; determining a mounting area where a component is mounted on the back surface of the substrate and a non-mounting area where no component is mounted based on detection data of the height sensor; controlling a pin moving device that moves a support pin so that the support pin supports the non-mounting area; and controlling a mounting head so that the mounting head mounts a component on a surface of the substrate while the support pin supports the non-mounting area. ​

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