Display device

Abstract

The invention discloses a display device, which comprises a display panel, and the display panel comprises a substrate; an insulating layer disposed on the substrate; a plurality of first electrodes disposed on the insulating layer; a plurality of light emitting elements arranged on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of light emitting elements; an optical layer surrounding the plurality of light-emitting elements; a capping layer disposed on the optical layer; at least one pattern disposed on the capping layer; a cover adhesive layer covering the at least one pattern; and a cover disposed on the cover adhesive layer. The cover may include a flat region and a curved region formed around the flat region.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0118938, filed on September 3, 2024, which is incorporated herein by reference in its entirety. Technical Field

[0003] This specification relates to a display panel and a display device including the display panel. Background Technology

[0004] Display devices are used in a variety of electronic devices such as televisions (TV), mobile phones, laptops, and tablets.

[0005] Display devices include self-emitting organic light-emitting displays (OLEDs) and liquid crystal displays (LCDs) that require a separate light source.

[0006] Recently, display devices that include light-emitting elements (e.g., light-emitting diodes; LEDs) have been attracting attention as the next generation of display devices. Because light-emitting elements are formed from inorganic materials rather than organic materials, they have a faster light emission speed, superior luminous efficiency, and can display high-brightness images compared to LCDs or OLEDs.

[0007] Micro LEDs can be used as light-emitting elements and as pixels in display devices. Furthermore, micro LEDs can achieve high brightness.

[0008] The display device includes a cover on the light-emitting element, and the cover may include a curved surface configured to be adjacent to its edge.

[0009] The scattered light emitted from the light-emitting element is directed toward the edge of the cover, and this light can be refracted by the curved surface of the cover. Therefore, the light emitted from the light-emitting element can be refracted by the curved surface of the cover toward the display device (or display panel). Furthermore, the light refracted toward this side of the display device (or display panel) can form a mura on the curved surface of the cover. For example, when viewing the display device from this side, a brightness difference may occur due to the light refracted toward this side, and this brightness difference can form a mura on the curved surface of the cover. The mura may appear more pronounced at an angle. Here, the position from which the user views the display device from this side is referred to as the angle.

[0010] Therefore, the patterns visible at an oblique viewing angle reduce the display quality of the display device, and the reduction in display quality reduces the reliability of the display device. Summary of the Invention

[0011] Embodiments of this specification relate to a display panel and a display device including the display panel, which uses patterns to prevent, reduce or minimize the appearance of streaks at oblique viewing angles.

[0012] The embodiments of this specification relate to a display panel and a display device including the display panel, which can provide various embodiments for the size, arrangement, and position of patterns set in the display panel in order to improve design flexibility.

[0013] The objectives to be addressed by the embodiments disclosed herein are not limited to those described above, and other objectives not mentioned will be clearly understood by those skilled in the art based on the following description.

[0014] A display device according to an embodiment of this specification may include: a display panel, the display panel comprising: a substrate; an insulating layer disposed on the substrate; a plurality of first electrodes disposed on the insulating layer; a plurality of light-emitting elements disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of light-emitting elements; an optical layer surrounding the plurality of light-emitting elements; a cover layer disposed on the optical layer; at least one pattern disposed on the cover layer; a cover adhesive layer covering the at least one pattern; and a cover member disposed on the cover adhesive layer. The cover member may include a flat region and a curved region formed around the flat region.

[0015] According to this specification, patterns arranged along the light emission path of the light-emitting element can be used to prevent, reduce, or minimize the appearance of streaks at oblique viewing angles. This improves the reliability of the display device.

[0016] According to this specification, display quality at tilted viewing angles can be improved by using patterns without the need for additional compensation for brightness differences, thereby enabling low-power operation of the display device.

[0017] According to this specification, the design flexibility of the display device can be improved by adjusting the size, shape, and arrangement of the patterns.

[0018] The effects of this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains based on the following description. Attached Figure Description

[0019] The above and other objects, features and advantages of this disclosure will become more apparent to those skilled in the art from the detailed description of exemplary embodiments of this disclosure with reference to the accompanying drawings, wherein:

[0020] Figure 1 This is an exploded perspective view illustrating a display device according to an embodiment of this specification;

[0021] Figure 2 This is a plan view illustrating a display device according to an embodiment of this specification;

[0022] Figure 3 This is a partial enlarged view illustrating a display device according to an embodiment of this specification;

[0023] Figure 4 This is a diagram illustrating the circuit structure in a display device according to an embodiment of this specification;

[0024] Figure 5 This is a partial plan view illustrating a display device according to an embodiment of this specification;

[0025] Figure 6 This is a partial plan view illustrating a display device according to an embodiment of this specification;

[0026] Figure 7 This is a partial plan view illustrating a display device according to an embodiment of this specification;

[0027] Figure 8 It shows along Figure 3 A cross-sectional view of the display panel of the display device according to an embodiment of this specification, taken by line II′;

[0028] Figure 9 This is a partial cross-sectional view showing a sub-pixel of a display device according to an embodiment of this specification;

[0029] Figure 10 This is a diagram showing the first electrode of a display device according to an embodiment of this specification;

[0030] Figure 11 This is a diagram illustrating the arrangement relationship between the first electrode and the passivation layer of a display device according to an embodiment of this specification;

[0031] Figure 12 This is a cross-sectional view showing the display panel of the display device according to the comparative example, which corresponds to the view along... Figure 2 A cross-sectional view taken from line II-II′;

[0032] Figure 13 It shows along Figure 2 A cross-sectional view of the display panel of a display device according to another embodiment of this specification, taken by line II-II′;

[0033] Figure 14 This is a plan view showing a pattern arranged in a display panel according to another embodiment of this specification;

[0034] Figure 15It is a diagram showing the light scattering efficiency of a display panel according to a comparative example, the light scattering efficiency of a display panel according to another embodiment, and the height of the pattern, based on the flat and curved areas of the cover arranged in the display panel.

[0035] Figure 16 It shows along Figure 2 A cross-sectional view of the display panel of a display device according to another embodiment of this specification, taken by line II-II′;

[0036] Figure 17 This is a plan view showing a pattern arranged in a display panel according to another embodiment of this specification;

[0037] Figure 18 It is a diagram showing the light scattering efficiency of a display panel according to a comparative example, the light scattering efficiency of a display panel according to another embodiment, and the height of the pattern, based on the flat and curved areas of the cover arranged in the display panel.

[0038] Figure 19 It shows along Figure 2 A cross-sectional view of the display panel of a display device according to another embodiment of this specification, taken by line II-II′;

[0039] Figure 20 This is a plan view showing a pattern arranged in a display panel according to another embodiment of this specification;

[0040] Figure 21 It is a diagram showing the light scattering efficiency of a display panel according to a comparative example, the light scattering efficiency of a display panel according to another embodiment, and the height of the pattern, based on the flat and curved areas of the cover arranged in the display panel.

[0041] Figure 22 It shows along Figure 2 A cross-sectional view of the display panel of a display device according to another embodiment of this specification, taken by line II-II′;

[0042] Figure 23 It shows along Figure 2 A cross-sectional view of the display panel of a display device according to another embodiment of this specification, taken by line II-II′; and

[0043] Figures 24 to 27 This is a schematic diagram illustrating a device to which a display apparatus according to an embodiment of this specification is applied. Detailed Implementation

[0044] The advantages and features of this disclosure, as well as the methods for implementing this disclosure, will become clearer from the embodiments described below with reference to the accompanying drawings. However, this disclosure is not limited to the following embodiments, but can be implemented in various different forms. Rather, these embodiments will complete the disclosure and allow those skilled in the art to fully understand its scope. This disclosure is limited only by the scope of the appended claims.

[0045] The shapes, dimensions, ratios, angles, quantities, etc., disclosed in the accompanying drawings for describing embodiments of this disclosure are exemplary, and this disclosure is not limited to the items shown. The same reference numerals always refer to the same elements. Furthermore, in describing this disclosure, detailed descriptions of related known technologies will be omitted if it is determined that such detailed descriptions may unnecessarily obscure the subject matter of this disclosure.

[0046] Terms such as “including,” “comprising,” and “having” used herein are generally intended to allow for the addition of additional components, unless the term is used in conjunction with the term “only.” Unless otherwise expressly stated, references to the singular should be interpreted as including the plural.

[0047] When interpreting components, it is interpreted to include the range of error, even if there is no separate description.

[0048] When describing positional relationships, such as when the positional relationship between two parts is described as "on top of", "above", "below", "next to", etc., one or more other parts may be located between the two parts, unless "immediately adjacent" or "directly" is used.

[0049] When describing temporal context, phrases such as “after,” “following,” “after,” or “before” may include discontinuous cases unless “immediately after” or “directly” is used.

[0050] In the description of the embodiments, terms such as "first," "second," etc., are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the "first component" mentioned below can be a "second component" within the technical spirit of this disclosure.

[0051] Elements of embodiments of this specification may be described using terms such as first, second, A, B, (a), (b), etc. Such terms are intended only to distinguish one component from another and are not intended to define the nature, order, sequence, or number of such components.

[0052] When a component is described as “connected,” “joined,” or “attached” to another component, it should be understood that the component may be directly connected to or attached to the other component, but unless otherwise specified, there may also be other components “inserted” between the corresponding components that may be indirectly connected or attached.

[0053] When a component or layer is described as "contacting" or "overlapping" another component or layer, the component or layer may directly contact or overlap the other component or layer, but unless specifically stated otherwise, it should be understood that other components may be inserted between components that are indirectly in contact or overlapping.

[0054] It should be understood that the term "at least one" includes all possible combinations of one or more related components. For example, "at least one of the first component, the second component, and the third component" means not only the first component, the second component, or the third component, but also any combination of two or more of the first component, the second component, and the third component.

[0055] The terms “first direction,” “second direction,” “third direction,” “X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted merely as geometrically perpendicular to each other, but may refer to a broader range of directions within the scope of the configuration in this specification that may function.

[0056] The following embodiments can be combined or associated with each other, in whole or in part, and various types of interlocks and drives are technically possible. These embodiments can be implemented independently of each other or together in an interrelated relationship.

[0057] Preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings.

[0058] Figure 1 This is an exploded perspective view illustrating a display device according to an embodiment of this specification. Figure 2 This is a plan view illustrating a display device according to an embodiment of this specification. Figure 3 This is a partial enlarged view illustrating a display device according to an embodiment of this specification. Figure 1 The reference numeral C shown in the figures can indicate the center of the display device 1000 and / or display panel 100 on the horizontal plane.

[0059] Reference Figures 1 to 3 The display device 1000 according to embodiments of this specification may include a display panel 100, which may include a polarizing layer 293, a cover adhesive layer 295, a cover member 120, and a substrate 110. The display device 1000 may also include a flexible circuit board CB and a printed circuit board 160.

[0060] The substrate 110 may be a component supporting other parts of the display device 1000. The substrate 110 may be formed of an insulating material. The substrate 110 may be formed of glass, resin, or the like. Furthermore, the substrate 110 may be formed of a flexible material. For example, the substrate 110 may be formed of a flexible plastic material, such as polyimide (PI). However, the embodiments described in this specification are not limited to these.

[0061] The display panel 100 can display information, video, and / or images provided to the user. For example, the display panel 100 may include a display area AA and a non-display area NA. For example, the substrate 110 may include a display area AA and a non-display area NA. The display area AA and the non-display area NA are not limited to the substrate 110, but can be described on the entire display device 1000.

[0062] The display area AA can be an area for displaying an image. The display area AA may include multiple pixels PX. Each of the multiple pixels PX may include multiple sub-pixels. Multiple light-emitting elements may be arranged in each of the multiple sub-pixels. The configuration of the multiple light-emitting elements may vary depending on the type of display device 1000. For example, in the case that the display device 1000 is an inorganic light-emitting display, each of the light-emitting elements may be a light-emitting diode (LED), a micro LED, or a mini LED; however, the embodiments in this specification are not limited thereto.

[0063] The non-display area NA can be an area where no image is displayed. Various wires, circuits, etc., used to drive the multiple pixels PX in the display area AA can be arranged in the non-display area NA. For example, various wires and driving circuits can be formed in the non-display area NA, and pad portions PADs on which integrated circuits, printed circuits, etc. are connected can be disposed in the non-display area NA; however, the embodiments in this specification are not limited thereto.

[0064] For example, the driving circuit may be a data driving circuit and / or a gate driving circuit; however, embodiments of this specification are not limited thereto. Wires for providing control signals used to control the driving circuit may be arranged on the display panel 100. For example, the control signals may include various timing signals, including clock signals, input data enable signals, and synchronization signals; however, embodiments of this specification are not limited thereto. Control signals may be received via pad portions PAD. For example, link lines LL for transmitting signals may be arranged in the non-display area NA. For example, driving components such as flexible circuit boards CB and printed circuit boards 160 may be connected to pad portions PAD.

[0065] According to this specification, the non-display area NA may include a first non-display area NA1, a curved area BA, and a second non-display area NA2. For example, the first non-display area NA1 may be a region surrounding at least a portion of the display area AA. The curved area BA may be a region extending from at least one side of a plurality of sides of the first non-display area NA1, and may be a flexible region. The second non-display area NA2 may be a region extending from the curved area BA. A pad portion PAD may be disposed in the second non-display area NA2. For example, the curved area BA may be in a curved state, and the remaining areas of the substrate 110 other than the curved area BA may be in a flat state. In this case, as the curved area BA bends, the second non-display area NA2 may be positioned on the rear surface of the display area AA. However, the embodiments of this specification are not limited thereto.

[0066] According to the design of the display device 1000, the substrate 110 or the display area AA of the display device 1000 can be formed into various shapes. For example, the display area AA can be formed into a rectangular shape with four rounded corners. However, the embodiments of this specification are not limited to this. In another example, the display area AA can be formed into a rectangular shape or a circular shape with four right-angled corners. However, the embodiments of this specification are not limited to this.

[0067] According to this specification, the width of the second non-display area NA2, in which a plurality of pad electrodes PE are arranged, may be greater than the width of the curved area BA, in which only a plurality of link lines LL are arranged. Furthermore, the width of the display area AA, in which a plurality of sub-pixels are arranged, may be greater than the width of the curved area BA, in which only a plurality of link lines LL are arranged. Although the width of the curved area BA is shown in the drawings as being smaller than the width of other areas of the substrate 110, the shape of the substrate 110 including the curved area BA is merely illustrative, and the embodiments described herein are not limited thereto.

[0068] Reference Figure 3Multiple pixel driving circuits (PDs) can be arranged in the display area AA. The multiple pixel driving circuits (PDs) can be circuits configured to drive light-emitting elements of multiple sub-pixels. Each of the multiple pixel driving circuits (PDs) may include multiple transistors (including driving transistors), storage capacitors, etc., and can provide control signals, power, and driving current to the light-emitting elements of the corresponding multiple sub-pixels to control the light-emitting operation of the light-emitting elements. For example, each pixel driving circuit (PD) may include a power line and a signal line configured to control the emission on / off state and / or emission time of the light-emitting elements. For example, the multiple pixel driving circuits (PDs) may each be a driver fabricated on a semiconductor substrate using a metal-oxide-semiconductor field-effect transistor (MOSFET) fabrication process, but the embodiments in this specification are not limited thereto. A driver may include multiple pixel driving circuits (PDs) and can drive multiple sub-pixels.

[0069] Also refer to Figure 1 The flexible circuit board CB and the printed circuit board 160 may be disposed below the display panel 100. The flexible circuit board CB and the printed circuit board 160 may be disposed at at least one side edge of the display panel 100, but embodiments of this specification are not limited thereto. One side of the flexible circuit board CB may be attached to the display panel 100, and the other side may be attached to the printed circuit board 160; however, embodiments of this specification are not limited thereto. The flexible circuit board CB may be a flexible film, but embodiments of this specification are not limited thereto.

[0070] A pad portion PAD, including multiple pad electrodes PE, is disposed in a second non-display area NA2. A driving component, including at least one flexible circuit board (or flexible film) CB and a printed circuit board 160, can be attached or bonded to the pad portion PAD. The multiple pad electrodes PE of the pad portion PAD can be electrically connected to at least one flexible circuit board (or flexible film) CB, and can transmit various signals (or power) from the printed circuit board 160 and the flexible circuit board (or flexible film) CB to multiple pixel driving circuits PD in the display area AA.

[0071] A flexible circuit board (or flexible film) CB can be a film material in which various components are arranged on a flexible base film. For example, driver integrated circuits (ICs), such as gate driver ICs or data driver ICs, can be arranged on the flexible circuit board (or flexible film) CB, but the embodiments in this specification are not limited thereto. The driver IC can be a component that processes data and drive signals for displaying images. The driver IC can be arranged according to the mounting method using methods such as chip on glass (COG), chip on film (COF), or tape-on-carrier (TCP); however, the embodiments in this specification are not limited thereto. The flexible circuit board (or flexible film) CB can be attached or bonded to multiple pad electrodes PE by a conductive adhesive layer, but the embodiments in this specification are not limited thereto.

[0072] Printed circuit board 160 may be a component electrically connected to at least one flexible circuit board (or flexible film) CB and configured to provide signals to a driver IC. Printed circuit board 160 may be disposed on one side of the flexible circuit board (or flexible film) CB and may be electrically connected to the flexible circuit board (or flexible film) CB. Various types of components configured to provide different signals to the driver IC may be arranged on printed circuit board 160. For example, various components such as timing controllers, power supply units, memory, and processors may be arranged on printed circuit board 160. For example, printed circuit board 160 may include a power management integrated circuit (PMIC); however, embodiments of this specification are not limited thereto.

[0073] The printed circuit board 160 may include at least one hole 180, but embodiments of this specification are not limited thereto. Internal components configured to detect ambient light, temperature, etc. (which may be provided to multiple sensors) may be disposed in the area corresponding to the at least one hole 180. For example, the internal components may include an ambient light sensor (ALS), a temperature sensor, etc., but embodiments of this specification are not limited thereto. For example, the hole 180 may be a through hole, etc.; however, embodiments of this specification are not limited thereto.

[0074] Reference Figure 1 A polarization layer 293 can be disposed on the display panel 100. The polarization layer 293 can prevent or reduce the entry of light generated from an external light source into the display panel 100 and its impact on the light-emitting elements, etc.

[0075] Cover 120 may be disposed on polarizing layer 293. Cover 120 may be a component configured to protect display panel 100. Cover adhesive layer 295 may be disposed between polarizing layer 293 and cover 120. Cover 120 may be attached to display panel 100 via cover adhesive layer 295. Cover adhesive layer 295 may include optically clear adhesive (OCA), optically clear resin (OCR), pressure-sensitive adhesive (PSA), etc., but the embodiments described herein are not limited thereto.

[0076] The substrate 110 may be disposed between the display panel 100 and the printed circuit board 160. The substrate 110 may enhance the rigidity of the display panel 100. The substrate 110 may be a backplate; however, the embodiments described in this specification are not limited thereto.

[0077] Reference Figures 1 to 3 Multiple link lines LL can be arranged in the non-display area NA. The multiple link lines LL can be wires transmitting various signals from at least one flexible circuit board (or flexible film) CB and printed circuit board 160 to the display area AA. The multiple link lines LL can extend from multiple pad electrodes PE in the second non-display area NA2 toward the curved area BA and the first non-display area NA1, and can be electrically connected to multiple drive lines VL in the display area AA. Multiple pixel drive circuits PD can be driven in response to signals received from at least one flexible circuit board (or flexible film) CB and printed circuit board 160 via the drive lines VL in the display area AA and the link lines LL in the non-display area NA.

[0078] For example, multiple drive lines VL and multiple link lines LL can be wires configured to transmit signals output from at least one flexible circuit board (or flexible film) CB and printed circuit board 160 to multiple pixel driving circuits PD. The multiple drive lines VL can be arranged in the display area AA and can be electrically connected to each of the pixel driving circuits PD. The multiple drive lines VL can extend from the display area AA toward the non-display area NA and can be electrically connected to the multiple link lines LL. Therefore, signals output from at least one flexible circuit board (or flexible film) CB and printed circuit board 160 can be transmitted to each of the multiple pixel driving circuits PD via the multiple link lines LL and the multiple drive lines VL.

[0079] When the bending region BA is bent, some portions of the multiple connecting lines LL may also be bent. Stress may concentrate on the bent portions of the connecting lines LL, which could lead to cracks in the connecting lines LL. Therefore, the multiple connecting lines LL can be formed of a conductive material with excellent flexibility to reduce cracking during bending of the bending region BA. For example, the multiple connecting lines LL can be formed of highly flexible conductive materials such as gold (Au), silver (Ag), or aluminum (Al), but the embodiments in this specification are not limited thereto. In addition, the multiple connecting lines LL can be formed of one of the various conductive materials used in the display region AA. For example, the multiple connecting lines LL can be formed of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg), or other alloys of these, but the embodiments in this specification are not limited thereto. The multiple connecting lines LL can also be formed as a multilayer structure comprising various conductive materials. For example, multiple link lines LL can be formed into a three-layer structure including titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments in this specification are not limited thereto.

[0080] Multiple connecting lines LL can be configured in various shapes to reduce stress. At least a portion of the multiple connecting lines LL disposed in the curved region BA can extend in the same direction as the extending direction of the curved region BA, or can extend in a direction different from the extending direction of the curved region BA to reduce stress. For example, when the curved region BA extends in a direction from the first non-display region NA1 to the second non-display region NA2, at least a portion of the connecting lines LL disposed in the curved region BA can extend in a direction inclined relative to that direction. In another example, at least a portion of the multiple connecting lines LL can be configured in various shaped patterns. For example, at least a portion of the multiple connecting lines LL disposed in the curved region BA can have a shape in which a conductive pattern having at least one of a diamond shape, rhombus shape, trapezoidal wave shape, triangular wave shape, sawtooth wave shape, sine wave shape, circular shape, or omega (Ω) shape is repeatedly arranged; however, embodiments of this specification are not limited thereto. Therefore, in order to minimize the stress concentrated on the multiple connecting lines LL and the resulting cracks, the multiple connecting lines LL can have various shapes including the aforementioned shapes; however, embodiments of this specification are not limited thereto.

[0081] Figure 4 This is a diagram illustrating the circuit structure in a display device according to an embodiment of this specification.

[0082] exist Figure 4The example shown is a single light-emitting element (ED) connected to a microdriver (μDriver), but the embodiments described in this specification are not limited to this. For example, eight light-emitting elements (EDs) may be connected to a single microdriver (μDriver). In another example, sixteen light-emitting elements (EDs) may be connected to a single microdriver (μDriver), or thirty-two or sixty-four light-emitting elements (EDs) may be connected simultaneously to a single microdriver (μDriver). The light-emitting elements (EDs) may be microLEDs (μLEDs).

[0083] A single microdriver (μDriver) may include a driving transistor T DR and light-emitting transistor T EM However, the embodiments described in this specification are not limited thereto.

[0084] For example, driving transistor T DR It may include a first electrode configured to receive a high-potential power supply voltage VDD, connected to a light-emitting transistor T. EM The first electrode, the second electrode, and the gate electrode configured to receive the scan signal SC are applied to the drive transistor T. DR The scan signal SC of the gate electrode can be a direct current (DC) voltage, and a fixed reference voltage (Vref) can be applied for each frame; however, the embodiments in this specification are not limited thereto.

[0085] Light-emitting transistor T EM May include connection to drive transistor T DR The first electrode of the second electrode, the second electrode connected to the light-emitting element ED, and the gate electrode configured to receive the emitted signal EM are applied to the light-emitting transistor T. EM The transmit signal EM of the gate electrode can be a pulse width modulation (PWM) signal that varies in each frame; however, the embodiments in this specification are not limited thereto.

[0086] The first electrode of the light-emitting element ED can be connected to the light-emitting transistor T. EM The second electrode is connected, and the second electrode of the light-emitting element ED can be grounded. For example, the first electrode of the light-emitting element ED can be the anode electrode, and the second electrode of the light-emitting element ED can be the cathode electrode; however, the embodiments in this specification are not limited thereto.

[0087] Drive transistor T DR With light-emitting transistor T EM They can each be either n-type transistors or p-type transistors.

[0088] In the microdriver μDriver, the driving transistor T DR It can be turned on in response to a scan signal SC applied from the timing controller (T-CON), and the light-emitting transistor... TEMIt can be turned on in response to the transmitted signal EM. Therefore, due to the application of the driving transistor T DR The high potential power supply voltage VDD of the first electrode can be driven by transistor T. DR and light-emitting transistor T EM A driving current is applied to the light-emitting element (ED), thereby allowing the ED to emit light.

[0089] Figures 5 to 7 This is a partial plan view of a display device according to an embodiment of this specification. For example, Figure 5 It is a magnified partial planar view that includes a display area of ​​multiple pixels. For example, Figure 6 It is a magnified local planar view that includes the display area of ​​individual pixels. For example, Figure 7 It is a magnified partial planar view of a display area that includes multiple pixels. Figure 5 and Figure 6 The specification only shows multiple signal lines TL, multiple communication lines NL, multiple first electrodes CE1, multiple embankments BNK, and multiple light-emitting elements ED; however, the embodiments in this specification are not limited to this. Figure 7 It is shown that... Figure 5 A magnified partial plan view of the additionally arranged second electrodes CE2.

[0090] Reference Figure 5 and Figure 6 Multiple pixels PX can be arranged in the display area AA, and each pixel PX is formed by multiple sub-pixels. Each of the multiple sub-pixels may include a light-emitting element ED and can emit light independently. The multiple sub-pixels may be arranged in a matrix form including multiple rows and multiple columns; however, the embodiments in this specification are not limited thereto.

[0091] Multiple subpixels may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, any one of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be a red subpixel, another may be a green subpixel, and the remaining one may be a blue subpixel. The types of multiple subpixels are illustrative, and the embodiments described in this specification are not limited thereto.

[0092] Each of a plurality of pixels PX may include at least one first sub-pixel SP1, at least one second sub-pixel SP2, and at least one third sub-pixel SP3. For example, each pixel PX may include a pair of first sub-pixels SP1, a pair of second sub-pixels SP2, and a pair of third sub-pixels SP3. The pair of first sub-pixels SP1 may include a first first sub-pixel SP1a and a second first sub-pixel SP1b. The pair of second sub-pixels SP2 may include a first second sub-pixel SP2a and a second second sub-pixel SP2b. The pair of third sub-pixels SP3 may include a first third sub-pixel SP3a and a second third sub-pixel SP3b. For example, each pixel PX may include a first first sub-pixel SP1a and a second first sub-pixel SP1b, a first second sub-pixel SP2a and a second second sub-pixel SP2b, and a first third sub-pixel SP3a and a second third sub-pixel SP3b. However, embodiments of this specification are not limited thereto.

[0093] The multiple subpixels forming each pixel PX can be arranged in various ways. For example, in each pixel PX, a pair of first subpixels SP1 can be arranged in the same column, a pair of second subpixels SP2 can be arranged in the same column, and a pair of third subpixels SP3 can be arranged in the same column. The first subpixels SP1, second subpixels SP2, and third subpixels SP3 can be arranged in the same row. The number and arrangement of the multiple subpixels forming each pixel PX are illustrative and the embodiments described herein are not limited thereto.

[0094] Multiple signal lines TL can be arranged in the area between multiple sub-pixels. The multiple signal lines TL can extend along the column direction between the multiple sub-pixels. The multiple signal lines TL can be wires that transmit the anode electrode from the pixel driving circuit PD to the multiple sub-pixels. For example, the multiple signal lines TL can be electrically connected to the multiple pixel driving circuits PD and the first electrode CE1 of the multiple sub-pixels. The anode voltage output from the pixel driving circuit PD can be transmitted to the first electrode CE1 of the multiple sub-pixels through the multiple signal lines TL. For example, the first electrode CE1 can be the anode electrode 134 electrically connected to the light-emitting element ED (e.g., ...). Figure 9 The electrode (shown). Therefore, the anode voltage from the signal line TL can be transmitted to the anode electrode 134 of the light-emitting element ED through the first electrode CE1.

[0095] Therefore, the structure of the display device 1000 can be simplified by using a pixel drive circuit PD that integrates multiple pixel circuits, instead of forming multiple transistors and storage capacitors in each of the multiple sub-pixels. Furthermore, since the circuits arranged separately in the multiple sub-pixels of a conventional display device are integrated into a single pixel drive circuit PD, high efficiency and low power operation can be achieved.

[0096] Multiple signal lines TL may include a first signal line TL1, a second signal line TL2, a third signal line TL3, a fourth signal line TL4, a fifth signal line TL5, and a sixth signal line TL6. The first signal line TL1 and the second signal line TL2 may be electrically connected to a pair of first sub-pixels SP1, respectively. The third signal line TL3 and the fourth signal line TL4 may be electrically connected to a pair of second sub-pixels SP2, respectively. The fifth signal line TL5 and the sixth signal line TL6 may be electrically connected to a pair of third sub-pixels SP3, respectively.

[0097] A first signal line TL1 can be disposed on one side of a pair of first sub-pixels SP1, and a second signal line TL2 can be disposed on the other side of the pair of first sub-pixels SP1. The first signal line TL1 can be electrically connected to the first electrode CE1 of one of the pair of first sub-pixels SP1, for example, the first electrode CE1 of the first first sub-pixel SP1a. The second signal line TL2 can be electrically connected to the first electrode CE1 of the remaining one of the pair of first sub-pixels SP1, for example, the first electrode CE1 of the second first sub-pixel SP1b.

[0098] A third signal line TL3 can be positioned on one side of a pair of second sub-pixels SP2, and a fourth signal line TL4 can be positioned on the other side of the pair of second sub-pixels SP2. For example, the third signal line TL3 can be positioned adjacent to the second signal line TL2. The third signal line TL3 can be electrically connected to the first electrode CE1 of one of the pair of second sub-pixels SP2, for example, the first electrode CE1 of the first second sub-pixel SP2a. The fourth signal line TL4 can be electrically connected to the first electrode CE1 of the remaining one of the pair of second sub-pixels SP2, for example, the first electrode CE1 of the second second sub-pixel SP2b.

[0099] A fifth signal line TL5 can be positioned on one side of a pair of third sub-pixels SP3, and a sixth signal line TL6 can be positioned on the other side of the pair of third sub-pixels SP3. For example, the fifth signal line TL5 can be positioned adjacent to the fourth signal line TL4. The sixth signal line TL6 can be positioned adjacent to the first signal line TL1 connected to the adjacent pixel PX. The fifth signal line TL5 can be electrically connected to the first electrode CE1 of one of the pair of third sub-pixels SP3, such as the first electrode CE1 of the first third sub-pixel SP3a. The sixth signal line TL6 can be electrically connected to the first electrode CE1 of the remaining one of the pair of third sub-pixels SP3, such as the first electrode CE1 of the second third sub-pixel SP3b.

[0100] Multiple signal lines TL can be formed of conductive materials. For example, multiple signal lines TL can be formed of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO); however, the embodiments in this specification are not limited thereto. In another example, multiple signal lines TL can have a multilayer structure of conductive materials. For example, multiple signal lines TL can have a multilayer structure including titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO); however, the embodiments in this specification are not limited thereto.

[0101] Multiple communication lines NL can be arranged in the region between multiple pixels PX. The multiple communication lines NL can be arranged to extend along the row direction in the region between the multiple pixels PX. The multiple communication lines NL can be arranged in the region between multiple second electrodes CE2, and may not overlap with the multiple second electrodes CE2. For example, the multiple communication lines NL can be wires for short-range communication such as near-field communication (NFC). The multiple communication lines NL can be used as antennas. For example, the multiple communication lines NL can be multiple connecting lines, etc., but the embodiments in this specification are not limited thereto.

[0102] According to this specification, a dam section (BNK) can be disposed in each of a plurality of sub-pixels. The plurality of dam sections (BNK) can be a structure on which a plurality of light-emitting elements (EDs) are disposed. In the transfer process of transferring the plurality of light-emitting elements (EDs) to the display device 1000, the plurality of dam sections (BNK) can guide the position of the plurality of light-emitting elements (EDs). In the transfer process of the plurality of light-emitting elements (EDs), the plurality of light-emitting elements (EDs) can be transferred onto the plurality of dam sections (BNK). The plurality of dam sections (BNK) can be dam patterns, structures, etc., but the embodiments described in this specification are not limited thereto.

[0103] The dam portions BNK of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can be spaced apart from each other. The dam portions BNK of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can be configured to be separate. Therefore, it is easy to identify the dam portions BNK of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 on which different types of light-emitting elements (EDs) are transferred.

[0104] The dam portion BNK of the first first sub-pixel SP1a and the dam portion BNK of the second first sub-pixel SP1b can be connected to each other or can be spaced apart or separated. For example, considering design factors such as transfer process requirements, the dam portion BNK of the first first sub-pixel SP1a and the dam portion BNK of the second first sub-pixel SP1b, on which the same type of light-emitting element ED is arranged, can be connected to each other or can be spaced apart or separated. The dam portion BNK of the first second sub-pixel SP2a and the dam portion BNK of the second second sub-pixel SP2b can be connected to each other or can be spaced apart or separated. The dam portion BNK of the first third sub-pixel SP3a and the dam portion BNK of the second third sub-pixel SP3b can be connected to each other or can be spaced apart or separated. Therefore, the dam portion BNK of a pair of first sub-pixels SP1, a pair of second sub-pixels SP2, and a pair of third sub-pixels SP3 can be formed in various ways, and the embodiments in this specification are not limited thereto.

[0105] For example, multiple dammed BNKs can be formed from organic insulating materials. Multiple dammed BNKs can be configured as single-layer or multi-layer structures using organic insulating materials. For example, multiple dammed BNKs can be formed from photoresist, polyimide (PI), acrylic-based materials, etc., but the embodiments in this specification are not limited thereto.

[0106] A first electrode CE1 may be disposed in each of a plurality of sub-pixels. The first electrode CE1 may be disposed on a dam BNK. The first electrode CE1 may be electrically connected to one of a plurality of signal lines TL. At least a portion of the first electrode CE1 may extend outward from the dam BNK and may be electrically connected to the signal line TL closest to the first electrode CE1. For example, a portion of the first electrode CE1 of the first first sub-pixel SP1a may extend to one side of the first first sub-pixel SP1a and may be electrically connected to the first signal line TL1. A portion of the first electrode CE1 of the second first sub-pixel SP1b may extend to the other side of the second first sub-pixel SP1b and may be electrically connected to the second signal line TL2. A portion of the first electrode CE1 of the first second sub-pixel SP2a may extend to one side of the first second sub-pixel SP2a and may be electrically connected to the third signal line TL3. A portion of the first electrode CE1 of the second second sub-pixel SP2b may extend to the other side of the second second sub-pixel SP2b and may be electrically connected to the fourth signal line TL4. A portion of the first electrode CE1 of the first third sub-pixel SP3a can extend to one side of the first third sub-pixel SP3a and can be electrically connected to the fifth signal line TL5. A portion of the first electrode CE1 of the second third sub-pixel SP3b can extend to the other side of the second third sub-pixel SP3b and can be electrically connected to the sixth signal line TL6.

[0107] The first electrode CE1 can be electrically connected to the anode electrode 134 of the light-emitting element ED, and the anode voltage from the pixel driving circuit PD can be transmitted to the light-emitting element ED via the signal line TL. Depending on the image to be displayed, different voltages can be applied to the first electrode CE1 of each of the multiple sub-pixels. For example, different voltages can be applied to the corresponding first electrodes CE1 of the multiple sub-pixels. Therefore, each first electrode CE1 can serve as a pixel electrode; however, the embodiments described in this specification are not limited thereto.

[0108] The first electrode CE1 may be formed of a conductive material. For example, the first electrode CE1 may be integrally formed with multiple signal lines TL. For example, the first electrode CE1 may be formed of the same conductive material as the multiple signal lines TL; however, the embodiments of this specification are not limited thereto. For example, the first electrode CE1 may be formed of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc., but the embodiments of this specification are not limited thereto. In another example, the first electrode CE1 may be formed as a multilayer structure using a conductive material. For example, multiple first electrodes CE1 may be configured as a multilayer structure including titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO); however, the embodiments of this specification are not limited thereto.

[0109] A light-emitting element (ED) can be disposed in each of a plurality of sub-pixels. Each of the plurality of EDs can be an LED or a micro-LED; however, the embodiments described herein are not limited thereto. The plurality of EDs can be arranged on the embankment BNK and the first electrode CE1. The plurality of EDs can be arranged on and electrically connected to the first electrode CE1. Therefore, each of the EDs can receive an anode voltage from the corresponding pixel driving circuit PD through the corresponding signal line TL and the associated first electrode CE1, thereby emitting light.

[0110] Multiple light-emitting elements (EDs) may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130 may be disposed in a first sub-pixel SP1. The second light-emitting element 140 may be disposed in a second sub-pixel SP2. The third light-emitting element 150 may be disposed in a third sub-pixel SP3. For example, any one of the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, another may be a green light-emitting element, and the remaining one may be a blue light-emitting element; however, the embodiments of this specification are not limited thereto. Therefore, various colors of light, including white, can be achieved by combining red, green, and blue light emitted from multiple light-emitting elements (EDs). The types of multiple light-emitting elements (EDs) are illustrative, and the embodiments of this specification are not limited thereto.

[0111] The first light-emitting element 130 may include a first first light-emitting element 130a disposed in a first first sub-pixel SP1a and a second first light-emitting element 130b disposed in a second first sub-pixel SP1b. The second light-emitting element 140 may include a first second light-emitting element 140a disposed in a first second sub-pixel SP2a and a second second light-emitting element 140b disposed in a second second sub-pixel SP2b. The third light-emitting element 150 may include a first third light-emitting element 150a disposed in a first third sub-pixel SP3a and a second third light-emitting element 150b disposed in a second third sub-pixel SP3b.

[0112] Refer to together Figure 5 , Figure 6 and Figure 7 The second electrode CE2 can be disposed in each of the multiple sub-pixels. The second electrode CE2 can also be disposed on the corresponding light-emitting element ED. The second electrode CE2 can be electrically connected to the corresponding pixel driving circuit PD through multiple contact electrodes CCE.

[0113] For example, each second electrode CE2 can be electrically connected to the cathode electrode 135 of the corresponding light-emitting element ED (e.g., Figure 9 (As shown), and the cathode voltage can be transmitted from the pixel driving circuit PD to the light-emitting element ED. The same cathode voltage can be applied to the second electrode CE2 of each of the multiple sub-pixels. For example, the same voltage can be applied to the second electrode CE2 of each of the multiple sub-pixels and the cathode electrode 135 of the light-emitting element ED. Therefore, the second electrode CE2 can be used as a common electrode; however, the embodiments in this specification are not limited thereto.

[0114] At least some of the sub-pixels in a plurality of sub-pixels may share the second electrode CE2. At least some of the second electrodes CE2 of the plurality of sub-pixels may be electrically connected to each other. When the same voltage is applied to the second electrode CE2, at least some sub-pixels may share the second electrode CE2. For example, the second electrodes CE2 of at least some pixels PX arranged in the same row in a plurality of pixels PX may be connected to each other. For example, a single second electrode CE2 may be configured for a plurality of pixels PX. A single second electrode CE2 may be arranged for every n sub-pixels.

[0115] For example, some of the corresponding second electrodes CE2 of a plurality of sub-pixels can be spaced apart or arranged to be separate from each other. For example, the second electrode CE2 connected to pixel PX in row n and the second electrode CE2 connected to pixel PX in row n+1 can be spaced apart or arranged to be separate from each other. For example, the plurality of second electrodes CE2 can be spaced apart from each other by multiple communication lines NL interposed between them and extending along the row direction. Therefore, the number of plurality of sub-pixels can be greater than the number of plurality of second electrodes CE2. In another example, all the second electrodes CE2 of a plurality of sub-pixels can be interconnected, such that only one second electrode CE2 is provided on substrate 110, but the embodiments of this specification are not limited thereto.

[0116] Multiple second electrodes CE2 may be formed of a transparent conductive material; however, the embodiments described herein are not limited thereto. The multiple second electrodes CE2 may be made of a transparent conductive material, thereby allowing light emitted from the light-emitting element ED to be directed upwards towards the second electrodes CE2. For example, the second electrodes CE2 may be formed of transparent conductive materials such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc.; however, the embodiments described herein are not limited thereto.

[0117] Multiple contact electrodes CCE can be arranged on the substrate 110. For example, the multiple contact electrodes CCE can be spaced apart from multiple embankments BNK and multiple signal lines TL. Each of the multiple second electrodes CE2 can overlap with at least one contact electrode CCE. For example, one second electrode CE2 can overlap with multiple contact electrodes CCE.

[0118] For example, multiple contact electrodes CCE can be electrically connected to multiple second electrodes CE2. Multiple contact electrodes CCE can be arranged between the substrate 110 and the multiple second electrodes CE2, and can transmit cathode voltage from the pixel driving circuit PD to the second electrodes CE2.

[0119] For example, when using micro-LEDs (or inorganic light-emitting elements) as light-emitting elements ED, the display device 1000 can be manufactured by forming multiple micro-LEDs on a wafer and transferring the micro-LEDs to the substrate 110 of the display device 1000. During the process of transferring multiple light-emitting elements ED, each with a micro-sized component, from the wafer to the substrate 110, various defects may occur. For example, in some sub-pixels, a non-transfer defect may occur where the light-emitting element ED is not successfully transferred. In other sub-pixels, a misalignment defect may occur, where the light-emitting element ED is transferred to a position other than the intended position due to alignment errors. Furthermore, even if the transfer process is performed normally, the transferred light-emitting element ED itself may be defective. Therefore, considering the defects that may occur during the transfer process of multiple light-emitting element EDs, multiple light-emitting element EDs of the same type can be transferred to each sub-pixel. A light emission inspection can be performed on the multiple light-emitting element EDs, and ultimately only the one light-emitting element ED determined to be normal can be used.

[0120] For example, a first light-emitting element 130a and a second first light-emitting element 130b can be transferred together to a single pixel PX, and the presence of defects can be checked. If both the first first light-emitting element 130a and the second first light-emitting element 130b are determined to be normal, only the first first light-emitting element 130a can be used, while the second first light-emitting element 130b can remain unused. In another example, if only the second first light-emitting element 130b is determined to be normal, the first first light-emitting element 130a can remain unused, and only the second first light-emitting element 130b can be used. Therefore, even if multiple light-emitting elements ED of the same type are transferred to each pixel PX, only one light-emitting element ED can ultimately be used.

[0121] Therefore, either one of a pair of light-emitting elements (EDs) can be the primary (or main) ED, and the remaining EDs can be redundant EDs. Redundant EDs can be additional EDs transferred as backups in case the primary ED fails. If the primary ED is defective, the redundant EDs can be used as replacements. Therefore, transferring both the primary and redundant EDs together onto a single pixel (PX) minimizes display quality degradation due to defects in either the primary or redundant EDs.

[0122] For example, the first first light-emitting element 130a, the first second light-emitting element 140a, and the first third light-emitting element 150a transferred to each pixel PX can be used as the main light-emitting element ED. The second first light-emitting element 130b, the second second light-emitting element 140b, and the second third light-emitting element 150b can be used as redundant light-emitting elements ED.

[0123] The display panel 100 according to this specification includes a first electrode CE1 disposed below a light-emitting element ED. Light output efficiency can be improved by exposing a portion of a conductive layer with relatively high reflectivity among a plurality of conductive layers disposed in the first electrode CE1 through processes such as etching. However, during the manufacture of the display panel 100, the exposed conductive layer of the first electrode CE1 may be exposed to solutions used in various processes, which may cause corrosion or damage to the exposed conductive layer. For example, aluminum included in the first electrode CE1 may be easily corroded when exposed to solutions such as tetramethylammonium hydroxide (TMAH).

[0124] Figure 8 It shows along Figure 3 The image shown is a cross-sectional view of the display panel of a display device according to an embodiment of this specification, taken by line II′. Figure 8 The display panel shown may be the display panel 100 according to the first embodiment. For example, Figure 8 It shows along Figure 3 The cross-sectional view of the display area AA, the first non-display area NA1, the curved area BA, and the second non-display area NA2 intercepted by line II′.

[0125] Reference Figure 8 The first buffer layer 111a and the second buffer layer 111b can be arranged in the remaining areas of the substrate 110 except for the bending region BA.

[0126] A first buffer layer 111a and a second buffer layer 111b may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. The first buffer layer 111a and the second buffer layer 111b can reduce the penetration of moisture or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b may be formed of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b may be configured as a single-layer or multi-layer structure formed of silicon oxide (SiOx) or silicon nitride (SiNx); however, the embodiments described in this specification are not limited thereto.

[0127] For example, a portion of the first buffer layer 111a and a portion of the second buffer layer 111b located in the bending region BA can be removed. The upper surface of the substrate 110 located in the bending region BA can be exposed from the first buffer layer 111a and the second buffer layer 111b. Cracks that may occur in the first buffer layer 111a and the second buffer layer 111b during bending can be minimized by removing the first buffer layer 111a and the second buffer layer 111b, which are formed of inorganic insulating material, from the bending region BA.

[0128] Multiple alignment keys MK may be arranged between the first buffer layer 111a and the second buffer layer 111b. The multiple alignment keys MK may be configured to identify the location of the pixel driving circuit PD during the manufacturing process of the display device 1000. For example, the multiple alignment keys MK may be configured to align the location of the pixel driving circuit PD transferred onto the circuit adhesive layer 112. In another example, the multiple alignment keys MK may be omitted.

[0129] A circuit adhesive layer 112 may be disposed on the second buffer layer 111b. The circuit adhesive layer 112 may be disposed in the display area AA, the first non-display area NA1, the curved area BA, and the second non-display area NA2. In another example, at least a portion of the circuit adhesive layer 112 located in the non-display area NA (including the curved area BA) may be removed. For example, the circuit adhesive layer 112 may be formed from any of the following: adhesive polymer, epoxy resin, UV-curable resin, polyimide-based material, acrylate-based material, polyurethane-based material, or polydimethylsiloxane (PDMS); however, the embodiments described herein are not limited thereto.

[0130] In the display area AA, a pixel driving circuit PD can be disposed on the circuit adhesive layer 112. When the pixel driving circuit PD is implemented as a driver, the driver can be mounted on the circuit adhesive layer 112 via a transfer process; however, the embodiments described herein are not limited thereto.

[0131] A first protective layer 113a and a second protective layer 113b may be disposed on the circuit adhesive layer 112 and the pixel driving circuit PD. The first protective layer 113a and the second protective layer 113b may be arranged to surround the side surface of the pixel driving circuit PD. However, embodiments of this specification are not limited thereto. For example, the second protective layer 113b may be configured to cover at least a portion of the upper surface of the pixel driving circuit PD. For example, at least one of the first protective layer 113a and the second protective layer 113b disposed in the curved region BA may be omitted. For example, the first protective layer 113a may be configured to extend throughout the display area AA and the non-display area NA, and the second protective layer 113b may be partially disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. For example, a portion of the second protective layer 113b located in the curved region BA may be removed; however, embodiments of this specification are not limited thereto.

[0132] The first protective layer 113a and the second protective layer 113b may be formed of organic insulating materials. However, the embodiments described herein are not limited to this. For example, the first protective layer 113a and the second protective layer 113b may be formed of photoresist, polyimide (PI), photoacrylic-based material, etc. However, the embodiments described herein are not limited to this. For example, the first protective layer 113a and the second protective layer 113b may each be a coating or an insulating layer; however, the embodiments described herein are not limited to this.

[0133] According to this specification, multiple first connection lines 121 can be arranged on the second protective layer 113b in the display area AA. The multiple first connection lines 121 can be wires used for electrically connecting the pixel driving circuit PD and other components. For example, the pixel driving circuit PD can be electrically connected to multiple signal lines TL and multiple contact electrodes CCE via the multiple first connection lines 121. For example, the multiple first connection lines 121 may include a first first connection line 121a, a second first connection line 121b, a third first connection line 121c, and a fourth first connection line 121d; however, the embodiments in this specification are not limited thereto.

[0134] For example, multiple first connection lines 121a can be arranged on the second protective layer 113b. The multiple first connection lines 121a can be electrically connected to the pixel driving circuit PD. The multiple first connection lines 121a can transmit the voltage output from the pixel driving circuit PD to the first electrode CE1 or the second electrode CE2.

[0135] For example, a third protective layer 114 may be disposed on the second protective layer 113b. The third protective layer 114 may be disposed throughout the display area AA and the non-display area NA. In the curved area BA, the third protective layer 114 may cover or surround the side surface of the second protective layer 113b and the upper surface of the first protective layer 113a. The third protective layer 114 may be formed of an organic insulating material. For example, the third protective layer 114 may be formed of photoresist, polyimide (PI), photosensitive acrylic-based material, etc.; however, the embodiments of this specification are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be formed of the same material; however, the embodiments of this specification are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may each be an insulating layer; however, the embodiments of this specification are not limited thereto.

[0136] Multiple second first connection lines 121b may be arranged on the third protective layer 114. These multiple second first connection lines 121b may be connected to or directly connected to the pixel driving circuit PD. For example, some of the multiple second first connection lines 121b may be directly connected to the pixel driving circuit PD through contact holes in the third protective layer 114. Some other connection lines of the second first connection lines 121b may be electrically connected to the first first connection line 121a through contact holes in the third protective layer 114. However, the embodiments described in this specification are not limited thereto. The voltage output from the pixel driving circuit PD may be transmitted to the first electrode CE1 or the second electrode CE2 through the multiple second first connection lines 121b and other connection lines.

[0137] The first insulating layer 115a may be disposed on a plurality of second first connecting lines 121b. The first insulating layer 115a may be disposed throughout the display area AA and the non-display area NA; however, the embodiments of this specification are not limited thereto. The first insulating layer 115a may be formed of an organic insulating material; however, the embodiments of this specification are not limited thereto. For example, the first insulating layer 115a may be formed of photoresist, polyimide (PI), photosensitive acrylic-based material, etc.; however, the embodiments of this specification are not limited thereto.

[0138] Multiple third first connecting wires 121c may be arranged on the first insulating layer 115a. These multiple third first connecting wires 121c may be electrically connected to multiple second first connecting wires 121b. For example, the third first connecting wire 121c may be electrically connected to the second first connecting wire 121b through contact holes in the first insulating layer 115a.

[0139] The second insulating layer 115b may be disposed on multiple third first connecting lines 121c. The second insulating layer 115b may be disposed in the remaining areas except for the curved region BA; however, embodiments of this specification are not limited thereto. The second insulating layer 115b may be disposed in the display region AA, the first non-display region NA1, and the second non-display region NA2; however, embodiments of this specification are not limited thereto. For example, a portion of the second insulating layer 115b disposed in the curved region BA may be removed. The second insulating layer 115b may be formed of an organic insulating material; however, embodiments of this specification are not limited thereto. For example, the second insulating layer 115b may be formed of photoresist, polyimide (PI), photosensitive acrylic-based materials, etc.; however, embodiments of this specification are not limited thereto.

[0140] Multiple fourth first connecting wires 121d can be arranged on the second insulating layer 115b. These multiple fourth first connecting wires 121d can be electrically connected to multiple third first connecting wires 121c. For example, the fourth first connecting wire 121d can be electrically connected to the third first connecting wire 121c through contact holes in the second insulating layer 115b.

[0141] According to this specification, multiple second connection lines 122 may be arranged on the second protective layer 113b in the non-display area NA. The multiple second connection lines 122 may be configured to connect the flexible circuit board (or flexible film) CB and the printed circuit board 160 (see [reference]). Figure 1 The signal transmitted to the pad portion PAD is transmitted to the pixel driving circuit PD in the display area AA via wires. For example, multiple second connection lines 122 can be electrically connected to multiple pad electrodes PE and can receive signals from the flexible circuit board (or flexible film) CB and the printed circuit board.

[0142] For example, multiple second connection lines 122 can extend from the pad portion PAD toward the display area AA and transmit signals to the conductors in the display area AA. In this case, the multiple second connection lines 122 can be used as link lines LL. The multiple second connection lines 122 may include a first second connection line 122a, a second second connection line 122b, a third second connection line 122c, and a fourth second connection line 122d.

[0143] Multiple first second connection lines 122a can be arranged on the second protective layer 113b. These multiple first second connection lines 122a can extend from the second non-display area NA2 to the curved area BA and the first non-display area NA1. The multiple first second connection lines 122a can transmit signals from the flexible circuit board (or flexible film) CB and the printed circuit board to the pad portion PAD, and then to the pixel driving circuit PD in the display area AA.

[0144] Multiple second connection lines 122b can be arranged on the third protective layer 114. Multiple second connection lines 122b can be arranged in the second non-display area NA2. The second connection lines 122b can be electrically connected to the first second connection line 122a through contact holes in the third protective layer 114. Therefore, signals from the flexible circuit board (or flexible film) CB and the printed circuit board can be transmitted to the first second connection line 122a through the second connection lines 122b.

[0145] Multiple third second connection lines 122c can be arranged on the first insulating layer 115a. The third second connection lines 122c can be located in the second non-display area NA2. The third second connection lines 122c can be electrically connected to the second second connection line 122b through contact holes in the first insulating layer 115a. Therefore, signals from the flexible circuit board (or flexible film) CB and the printed circuit board can be transmitted to the first second connection line 122a through the third second connection line 122c and the second second connection line 122b.

[0146] Multiple fourth second connection lines 122d can be arranged on the second insulating layer 115b. The fourth second connection line 122d can be located in the second non-display area NA2. The fourth second connection line 122d can be electrically connected to the third second connection line 122c through contact holes in the second insulating layer 115b. Therefore, signals from at least one flexible circuit board (or flexible film) CB and the printed circuit board can be transmitted to the first second connection line 122a through the fourth second connection line 122d, the third second connection line 122c, and the second second connection line 122b.

[0147] The plurality of first connecting lines 121 and the plurality of second connecting lines 122 can be formed of any of a highly flexible conductive material or a variety of conductive materials applicable to the display area AA. For example, the second connecting lines 122 (a portion of which is disposed in the curved area BA) can be formed of a highly flexible conductive material such as gold (Au), silver (Ag), aluminum (Al), etc.; however, the embodiments of this specification are not limited thereto. In another example, the plurality of first connecting lines 121 and the plurality of second connecting lines 122 can be formed of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg), or other alloys thereof. However, the embodiments of this specification are not limited thereto.

[0148] The third insulating layer 115c may be disposed on a plurality of first connecting lines 121 and a plurality of second connecting lines 122. The third insulating layer 115c may be disposed in the remaining areas except for the curved region BA; however, embodiments of this specification are not limited thereto. The third insulating layer 115c may be disposed in the display region AA, the first non-display region NA1, and the second non-display region NA2. A portion of the third insulating layer 115c located in the curved region BA may be removed. The third insulating layer 115c may be formed of an organic insulating material, but embodiments of this specification are not limited thereto. For example, the third insulating layer 115c may be formed of photoresist, polyimide (PI), photosensitive acrylic-based materials, etc.; however, embodiments of this specification are not limited thereto.

[0149] In the display area AA, multiple dam sections (BNK) can be arranged on the third insulating layer 115c. The multiple dam sections (BNK) can be arranged to overlap with multiple sub-pixels respectively. One or more light-emitting elements (ED) of the same type can be disposed on each of the multiple dam sections (BNK).

[0150] In the display area AA, multiple signal lines TL can be arranged on the third insulation layer 115c. The multiple signal lines TL can be positioned in the area between multiple dike sections BNK. For example, the multiple signal lines TL can be positioned adjacent to any one of the multiple dike sections BNK.

[0151] In the display area AA, multiple contact electrodes CCE can be arranged on the third insulating layer 115c. Each of the multiple contact electrodes CCE can supply a cathode voltage from the pixel driving circuit PD to the corresponding second electrode CE2.

[0152] Each first electrode CE1 may be disposed on a corresponding embankment BNK. For example, the first electrode CE1 may be disposed to extend from an adjacent signal line TL toward the upper part of the embankment BNK. The first electrode CE1 may be formed on both the upper surface and the side surface of the embankment BNK. For example, the first electrode CE1 may be disposed to extend from the signal line TL on the upper surface of the third insulating layer 115c to both the side surface and the upper surface of the embankment BNK.

[0153] Figure 9 This is a partial cross-sectional view showing a sub-pixel of a display device according to an embodiment of this specification. Figure 9 It is a partial cross-sectional view showing the sub-pixels including the light-emitting elements disposed in the display area AA. Figure 10 This is a diagram showing the first electrode of a display device according to an embodiment of this specification. Figure 11 This is a diagram illustrating the arrangement relationship between the first electrode and the passivation layer of a display device according to an embodiment of this specification.

[0154] Reference Figures 9 to 11The first electrode CE1 may be configured to have multiple conductive layers. For example, the first electrode CE1 may include a first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d. However, the embodiments described in this specification are not limited thereto.

[0155] A first conductive layer CE1a may be disposed on the embankment BNK. A second conductive layer CE1b may be disposed on the first conductive layer CE1a. A third conductive layer CE1c may be disposed on the second conductive layer CE1b. A fourth conductive layer CE1d may be disposed on the third conductive layer CE1c. For example, each of the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may be formed of at least one of titanium (Ti), molybdenum (Mo), aluminum (Al), or indium tin oxide (ITO). However, the embodiments described in this specification are not limited thereto.

[0156] According to this specification, some of the conductive layers with high reflectivity among the plurality of conductive layers forming the first electrode CE1 can be configured as alignment keys and / or reflectors for aligning the light-emitting element ED. For example, the second conductive layer CE1b among the plurality of conductive layers of the first electrode CE1 may include a reflective material. For example, the second conductive layer CE1b may include aluminum (Al), but the embodiments of this specification are not limited thereto. Therefore, the second conductive layer CE1b can be configured as a reflector. Furthermore, the high reflectivity of the second conductive layer CE1b facilitates its identification during manufacturing. Therefore, the position or relocation position of the light-emitting element ED can be aligned based on the second conductive layer CE1b.

[0157] For example, to configure the second conductive layer CE1b as a reflector, the third conductive layer CE1c and the fourth conductive layer CE1d covering the second conductive layer CE1b can be partially removed or etched. For example, the upper surface of the second conductive layer CE1b can be exposed by removing or etching a portion of the third conductive layer CE1c and a portion of the fourth conductive layer CE1d. For example, the remaining portions of the third conductive layer CE1c and the fourth conductive layer CE1d, except for the central and peripheral (or edge) portions where the solder pattern SDP is provided, can be removed. For example, the peripheral (or edge) portions of each of the third conductive layer CE1c formed of titanium (Ti) and the fourth conductive layer CE1d formed of indium tin oxide (ITO) can remain unetched. Therefore, in the masking process used to form the first electrode CE1, other conductive layers of the first electrode CE1 (such as the second conductive layer CE1b) can be protected from corrosion caused by the tetramethylammonium hydroxide (TMAH) solution used in the masking process.

[0158] According to this specification, the first conductive layer CE1a and the third conductive layer CE1c may each comprise titanium (Ti) or molybdenum (Mo). The second conductive layer CE1b may comprise aluminum (Al). The fourth conductive layer CE1d may comprise a transparent conductive oxide layer, such as indium tin oxide (ITO) or indium zinc oxide (IZO), which exhibits excellent adhesion to the solder pattern SDP and demonstrates corrosion resistance and acid resistance. However, the embodiments in this specification are not limited thereto.

[0159] The first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d can be sequentially deposited and patterned using photolithography and etching processes. However, the embodiments described in this specification are not limited thereto.

[0160] Reference Figure 10 The first electrode CE1 may include a first conductive layer CE1a, a second conductive layer CE1b disposed on the first conductive layer CE1a, a third conductive layer CE1c disposed on the second conductive layer CE1b, and a fourth conductive layer CE1d disposed on the third conductive layer CE1c. The second conductive layer CE1b may be formed of a material having a higher light reflectivity than the third conductive layer CE1c and the fourth conductive layer CE1d. For example, the second conductive layer CE1b may include aluminum (Al) or silver (Ag). Therefore, in the display panel 100 according to this specification, the second conductive layer CE1b having a higher light reflectivity than the fourth conductive layer CE1d which is in contact with the solder pattern SDP can be exposed, thereby improving the light output efficiency of the light-emitting element ED by reflecting light emitted from the light-emitting element ED using the second conductive layer CE1b.

[0161] The first electrode CE1 may include a trench G. For example, the first electrode CE1 may include a trench G formed in the upper surface of the first electrode CE1. For example, the first electrode CE1 may include a trench G formed in a recessed shape in the upper surface of the first electrode CE1. The trench G may be formed along the periphery of the first electrode CE1 and may be arranged to be spaced apart from the edge of the upper surface of the first electrode CE1. The trench G may be formed in the upper surface of the first electrode CE1 by photolithography and etching processes; however, the embodiments described in this specification are not limited thereto.

[0162] A portion of the upper surface of the second conductive layer CE1b can be exposed by the trench G, and the exposed portion of the second conductive layer CE1b can reflect light emitted by the light-emitting element ED and incident on the second conductive layer CE1b through the trench G, thereby improving the light output efficiency of the display device 1000.

[0163] When the trench G is formed, the first electrode CE1 may include a first electrode region CE1A1 in contact with the solder pattern SDP, a second electrode region CE1A2 disposed outside the first electrode region CE1A1, and a third electrode region CE1A3 disposed outside the second electrode region CE1A2. The second electrode region CE1A2 may be a region of the second conductive layer CE1b on which the third conductive layer CE1c and the fourth conductive layer CE1d are not disposed. The second electrode region CE1A2 may be used as a reflective region, which improves the light output efficiency by reflecting light incident on the second conductive layer CE1b through the trench G.

[0164] Although Figure 10 In the diagram, the first electrode CE1 is shown to include a first electrode region CE1A1, a second electrode region CE1A2, and a third electrode region CE1A3; however, the embodiments described herein are not limited to this. For example, to improve the light output efficiency of the display panel 100, the third electrode region CE1A3 may be omitted. For example, the first electrode CE1 may only include the first electrode region CE1A1 and the second electrode region CE1A2.

[0165] The first electrode CE1 can be formed with a predetermined thickness CT. Since the first electrode CE1 can be formed using multiple conductive layers with different resistances, even if the design specifications of the resistance of the first electrode CE1 are changed, the resistance of the first electrode CE1 can be adjusted by controlling the thickness of the conductive layers. The thickness of each conductive layer can refer to the distance between one surface and another surface of the conductive layer arranged in the Z-axis direction.

[0166] The first conductive layer CE1a may be formed having a first thickness CT1. The first thickness CT1 may be adjustable. The first conductive layer CE1a may have a lower light reflectivity and a higher resistance than the second conductive layer CE1b. For example, the first conductive layer CE1a may include titanium (Ti) or molybdenum (Mo); however, the embodiments in this specification are not limited thereto.

[0167] The second conductive layer CE1b may be formed to have a second thickness CT2 greater than the first thickness CT1. The second thickness CT2 may be adjustable. The second conductive layer CE1b may be formed of a material having a higher light reflectivity than the third conductive layer CE1c and the fourth conductive layer CE1d. For example, the second conductive layer CE1b may include aluminum (Al) or silver (Ag); however, the embodiments described herein are not limited thereto.

[0168] The third conductive layer CE1c may be formed having a third thickness CT3. The third thickness CT3 may be adjustable. The third conductive layer CE1c may be formed of a material having a lower light reflectivity and a higher resistance than the second conductive layer CE1b. For example, the third conductive layer CE1c may include titanium (Ti) or molybdenum (Mo); however, the embodiments in this specification are not limited thereto.

[0169] The fourth conductive layer CE1d may be formed with a fourth thickness CT4. The fourth thickness CT4 may be adjustable. The fourth conductive layer CE1d may be formed of a material having a lower light reflectivity than the second conductive layer CE1b. For example, the fourth conductive layer CE1d may comprise a transparent conductive oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO), which exhibits excellent adhesion to the solder pattern SDP and demonstrates corrosion resistance and acid resistance. However, the embodiments described in this specification are not limited thereto.

[0170] Considering the reflection efficiency, which depends on the depth of the trench G, the thicknesses of the third conductive layer CE1c and the fourth conductive layer CE1d can be determined. Even when the first electrode CE1 is configured to have a preset thickness CT, the display panel 100 according to this specification can achieve the desired resistance of the first electrode CE1 by adjusting the thicknesses of the first conductive layer CE1a and the second conductive layer CE1b.

[0171] According to this specification, the signal line TL, contact electrode CCE, and pad electrode PE, arranged in the same layer as the first electrode CE1, can be configured as a multilayer structure formed of conductive material. However, the embodiments of this specification are not limited thereto. For example, the signal line TL, contact electrode CCE, and pad electrode PE can be formed as a multilayer structure comprising indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti). However, the embodiments of this specification are not limited thereto.

[0172] According to this specification, a solder pattern SDP can be disposed on a first electrode CE1 in each of a plurality of sub-pixels. The solder pattern SDP can bond a light-emitting element ED to the first electrode CE1. The first electrode CE1 and the light-emitting element ED can be electrically connected via eutectic bonding using the solder pattern SDP; however, the embodiments of this specification are not limited thereto. For example, the first electrode CE1 and the anode electrode 134 of the light-emitting element ED can be electrically connected via eutectic bonding using the solder pattern SDP; however, the embodiments of this specification are not limited thereto. For example, in the case where the solder pattern SDP is formed of indium (In) and the anode electrode 134 of the light-emitting element ED is formed of gold (Au), the solder pattern SDP and the anode electrode 134 can be bonded by applying heat and pressure during the transfer of the light-emitting element ED. Through eutectic bonding, the light-emitting element ED can be bonded to the solder pattern SDP and the first electrode CE1 without the need for additional adhesive material. For example, the solder pattern SDP can be formed of indium (In), tin (Sn), or alloys thereof; however, the embodiments of this specification are not limited thereto. For example, the solder pattern SDP can be a pattern, a pattern layer, a bonding pad, or a connection pad, but the embodiments in this specification are not limited thereto.

[0173] According to this specification, passivation layer 116 can be disposed on multiple signal lines TL, multiple first electrodes CE1, multiple contact electrodes CCE, and a third insulating layer 115c. For example, passivation layer 116 can be disposed in display area AA, first non-display area NA1, and second non-display area NA2. A portion of passivation layer 116 disposed in the curved area BA can be removed. A portion of passivation layer 116 covering multiple pad electrodes PE in the second non-display area NA2 can also be removed. Because passivation layer 116 is configured to cover areas other than those where curved area BA, multiple pad electrodes PE, and solder pattern SDP are disposed, the penetration of moisture or impurities into the light-emitting element ED can be reduced. For example, passivation layer 116 can be configured as a single-layer or multi-layer structure comprising silicon oxide (SiOx) or silicon nitride (SiNx). However, the embodiments in this specification are not limited thereto. For example, passivation layer 116 can be used as a protective layer or an insulating layer, but the embodiments in this specification are not limited thereto. For example, the passivation layer 116 may include an aperture 116H in each of a plurality of sub-pixels, in which a solder pattern SDP is disposed and exposed. According to this specification, the passivation layer 116 may include a plurality of apertures 116H, and a plurality of solder patterns SDP are disposed in the plurality of apertures 116H.

[0174] The passivation layer 116 can be configured to cover the trench G of the first electrode CE1, thereby protecting the exposed second conductive layer CE1b. For example, to form a solder pattern SDP, an organic insulating material that can be used as a mask can be deposited on the passivation layer 116. Subsequently, holes corresponding to the formation positions of the solder pattern SDP can be formed in the organic insulating material by performing an exposure process and an etching process, the etching process using an etching solution to remove a portion of the organic insulating material that has already reacted with the exposure process. Subsequently, material for forming the solder pattern SDP can be placed inside the holes, thereby forming the solder pattern SDP on the first electrode CE1. The organic insulating material used as a mask can then be removed by a mask removal process. If the exposed position of the organic insulating material deviates from the preset position, the upper part of the second conductive layer CE1b exposed to the developer used in the exposure process may be exposed, thereby damaging the second conductive layer CE1b. However, in the display panel 100 according to this specification, the passivation layer 116 can prevent or at least reduce such damage to the second conductive layer CE1b in advance. Therefore, in the display panel 100 according to this specification, the passivation layer 116 can enhance the reliability of the manufacturing process.

[0175] A passivation layer 116 extending from the upper edge of the first electrode CE1 toward the interior of the first electrode CE1 can be configured to cover the trench G, thereby protecting the exposed second conductive layer CE1b. The end of the passivation layer 116 extending toward the interior of the first electrode CE1 on the upper surface of the first electrode CE1 can overlap with the edge of the first electrode region CE1A1 in the Z-axis direction. The inward direction of the first electrode CE1 can refer to the direction toward the electrode center C1 of the first electrode CE1. The outward direction of the first electrode CE1 can refer to the direction opposite to the inward direction of the first electrode CE1. The center C1 of the first electrode CE1 can be the center of the first electrode CE1 in a horizontal plane extending along the X-axis and Y-axis directions. Furthermore, the end of the passivation layer 116 extending inward on the upper surface of the first electrode CE1 can be the inner end of the passivation layer 116.

[0176] In each of the plurality of sub-pixels, a light-emitting element ED can be disposed on a solder pattern SDP. A first light-emitting element 130 can be disposed in a first sub-pixel SP1. A second light-emitting element 140 can be disposed in a second sub-pixel SP2. A third light-emitting element 150 can be disposed in a third sub-pixel SP3.

[0177] Light-emitting elements (EDs) can be formed on silicon wafers using methods such as metal-organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor deposition (HVPE), sputtering, etc. However, the embodiments described in this specification are not limited thereto.

[0178] Reference Figure 9 The first light-emitting element 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and an encapsulation film 136. However, the embodiments described in this specification are not limited thereto. For example, the first light-emitting element 130 may not include the encapsulation film 136.

[0179] A first semiconductor layer 131 may be disposed on a solder pattern SDP. A second semiconductor layer 133 may be disposed on the first semiconductor layer 131.

[0180] For example, the first semiconductor layer 131 or the second semiconductor layer 133 can be implemented using a compound semiconductor such as a group III-V or group II-VI semiconductor, and can be doped with impurities (or dopants). For example, the first semiconductor layer 131 or the second semiconductor layer 133 can be an n-type doped semiconductor layer, while the other can be a p-type doped semiconductor layer. However, the embodiments of this specification are not limited thereto. For example, at least one of the first semiconductor layer 131 and the second semiconductor layer 133 can be a layer formed by doping with an n-type impurity or a p-type impurity with a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs). However, the embodiments of this specification are not limited thereto. For example, n-type impurities may include silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn); however, the embodiments described herein are not limited thereto. For example, p-type impurities may include magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), beryllium (Be), etc., but the embodiments described herein are not limited thereto.

[0181] For example, the first semiconductor layer 131 and the second semiconductor layer 133 may be formed of a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively. However, the embodiments in this specification are not limited thereto. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities; however, the embodiments in this specification are not limited thereto.

[0182] An active layer 132 may be disposed between a first semiconductor layer 131 and a second semiconductor layer 133. The active layer 132 can receive holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133 and emit light. For example, the active layer 132 may be formed as a single-well structure, a multi-well structure, a single quantum well structure, a multiple quantum well (MQW) structure, a quantum dot structure, or a quantum wire structure. However, the embodiments described in this specification are not limited thereto. For example, the active layer 132 may be formed of indium gallium nitride (InGaN), gallium nitride (GaN), etc.; however, the embodiments described in this specification are not limited thereto.

[0183] In another example, the active layer 132 may comprise a multiple quantum well (MQW) structure having a well layer and a barrier layer, the barrier layer having a higher bandgap than the well layer. For example, the active layer 132 may be configured to have a well layer formed of InGaN and a barrier layer formed of AlGaN. However, the embodiments described herein are not limited thereto.

[0184] An anode electrode 134 may be disposed between the first semiconductor layer 131 and the solder pattern SDP. For example, the anode electrode 134 may be electrically connected to the first semiconductor layer 131 and the first electrode CE1. The anode voltage output from the pixel driving circuit PD may be applied to the first semiconductor layer 131 through the signal line TL, the first electrode CE1, and the anode electrode 134. For example, the anode electrode 134 may be formed of a conductive material capable of eutectic bonding with the solder pattern SDP; however, embodiments of this specification are not limited thereto. For example, the anode electrode 134 may be formed of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), copper (Cu), or alloys thereof. However, embodiments of this specification are not limited thereto.

[0185] A cathode electrode 135 may be disposed on the second semiconductor layer 133. For example, the cathode electrode 135 may be electrically connected to the second semiconductor layer 133 and the second electrode CE2. The cathode voltage output from the pixel driving circuit PD may be applied to the second semiconductor layer 133 through the contact electrode CCE, the second electrode CE2, and the cathode electrode 135. The cathode electrode 135 may be formed of a transparent conductive material to allow light emitted from the light-emitting element ED to pass through the light-emitting element ED in the upward direction. However, the embodiments described in this specification are not limited thereto. For example, the cathode electrode 135 may be formed of materials such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc.; however, the embodiments described in this specification are not limited thereto.

[0186] The encapsulation film 136 may be disposed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the encapsulation film 136 may surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0187] For example, the encapsulation film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the encapsulation film 136 can be disposed on the side surface of the first semiconductor layer 131, the side surface of the active layer 132, and the side surface of the second semiconductor layer 133.

[0188] For example, the encapsulation film 136 may be disposed on at least a portion of the anode electrode 134 and the cathode electrode 135, such as the edge portion (or peripheral portion or side) of the anode electrode 134 and the edge portion (or peripheral portion or side) of the cathode electrode 135. At least a portion of the anode electrode 134 may be exposed from the encapsulation film 136, thereby allowing the anode electrode 134 to be connected to the solder pattern SDP. For example, at least a portion of the cathode electrode 135 may be exposed from the encapsulation film 136, thereby allowing the cathode electrode 135 to be connected to the second electrode CE2. For example, the encapsulation film 136 may be formed of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx); however, the embodiments described in this specification are not limited thereto.

[0189] In another example, the encapsulation film 136 may have a structure in which reflective material is dispersed in a resin layer. However, the embodiments of this specification are not limited thereto. For example, the encapsulation film 136 may be formed as a reflector having various structures. However, the embodiments of this specification are not limited thereto. The encapsulation film 136 may reflect light emitted from the active layer 132 upwards, thereby improving light extraction efficiency. For example, the encapsulation film 136 may be a reflective layer; however, the embodiments of this specification are not limited thereto.

[0190] According to this specification, although the light-emitting element (ED) has been described as having a vertical structure, the embodiments described herein are not limited to this. For example, the ED may have a horizontal structure or a flip-chip structure. The ED may be an inorganic light-emitting element, but the embodiments described herein are not limited to this.

[0191] Although it has been referenced Figure 9The first light-emitting element 130 has been described, but the second light-emitting element 140 and the third light-emitting element 150 may have substantially the same structure as the first light-emitting element 130. For example, the second light-emitting element 140 and the third light-emitting element 150 may have substantially the same components as the first light-emitting element 130, including a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, an anode electrode 134, a cathode electrode 135, and an encapsulation film 136.

[0192] According to this specification, a first optical layer 117a may be disposed around a plurality of light-emitting elements ED in a display area AA. The first optical layer 117a may surround the plurality of light-emitting elements ED. For example, the first optical layer 117a may be formed to cover the plurality of light-emitting elements ED and the embankment BNK in a corresponding area of ​​a plurality of sub-pixels. For example, the first optical layer 117a may cover the embankment BNK, a portion of the passivation layer 116, and the space between the plurality of light-emitting elements ED. The first optical layer 117a may be disposed between the plurality of light-emitting elements ED and the plurality of embankment BNK included in each pixel PX, or may cover the space between the plurality of light-emitting elements ED and the plurality of embankment BNK included in each pixel PX. For example, the first optical layer 117a may extend in a first direction (X-axis direction) and have a spacing in a second direction (Y-axis direction). For example, the first optical layer 117a may be formed to surround the side surfaces of the light-emitting elements ED and the side surfaces of the embankment BNK between the passivation layer 116 and the second electrode CE2. However, the embodiments of this specification are not limited thereto. For example, the first optical layer 117a may be a diffuse layer or a sidewall diffuse layer, but the embodiments in this specification are not limited thereto.

[0193] The first optical layer 117a may include an organic insulating material in which fine particles are dispersed. However, the embodiments described herein are not limited thereto. For example, the first optical layer 117a may be formed of a siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed, but the embodiments described herein are not limited thereto. Light emitted from the plurality of light-emitting elements (EDs) can be scattered by the fine particles dispersed in the first optical layer 117a and then emitted to the outside of the display device 1000. Therefore, the first optical layer 117a can improve the extraction efficiency of light emitted from the plurality of light-emitting elements (EDs).

[0194] For example, the first optical layer 117a may be disposed in each of a plurality of pixels PX, or may be disposed in some pixels PX arranged in the same row. However, embodiments of this specification are not limited thereto. For example, the first optical layer 117a may be disposed in each of a plurality of pixels PX, or a plurality of pixels PX may share a single first optical layer 117a. In another example, each of a plurality of sub-pixels may individually include the first optical layer 117a, but embodiments of this specification are not limited thereto.

[0195] According to this specification, the second optical layer 117b may be disposed on the passivation layer 116 in the display area AA. For example, the second optical layer 117b may be disposed around the first optical layer 117a. For example, the second optical layer 117b may be formed to surround the first optical layer 117a. For example, the second optical layer 117b may be in contact with the side surface of the first optical layer 117a. For example, the second optical layer 117b may be disposed in the area between a plurality of pixels PX; however, the embodiments of this specification are not limited thereto. For example, the second optical layer 117b may be a diffuse layer, a diffuse layer window, a window diffuse layer, etc., but the embodiments of this specification are not limited thereto.

[0196] The second optical layer 117b may be formed of an organic insulating material; however, the embodiments described herein are not limited thereto. The second optical layer 117b may be formed of the same material as the first optical layer 117a; however, the embodiments described herein are not limited thereto. For example, the first optical layer 117a may contain fine particles, and the second optical layer 117b may not contain fine particles. For example, the second optical layer 117b may be formed of a siloxane; however, the embodiments described herein are not limited thereto.

[0197] For example, the thickness of the first optical layer 117a may be less than the thickness of the second optical layer 117b, but the embodiments of this specification are not limited thereto. Therefore, in a plan view, the area in which the first optical layer 117a is disposed may include a recess that is recessed inward relative to the upper surface of the second optical layer 117b.

[0198] According to this specification, the second electrode CE2 may be disposed on the first optical layer 117a and the second optical layer 117b. For example, the second electrode CE2 may be electrically connected to a plurality of contact electrodes CCE through contact holes in the second optical layer 117b. For example, the second electrode CE2 may be disposed on a plurality of light-emitting elements ED. For example, the second electrode CE2 may comprise a transparent conductive oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO); however, the embodiments of this specification are not limited thereto. For example, the second electrode CE2 may be configured to contact the cathode electrode 135. For example, the second electrode CE2 may overlap the first optical layer 117a. For example, the second electrode CE2 may cover the outer flat surface of the first optical layer 117a.

[0199] The second electrode CE2 can extend continuously in the first direction (X-axis direction) of the substrate 110. Therefore, the second electrode CE2 can be connected to a plurality of pixels PX arranged along the first direction (X-axis direction) of the substrate 110. For example, the second electrode CE2 can be connected to a plurality of pixels PX.

[0200] According to this specification, the second electrode CE2 can extend continuously over the first optical layer 117a, the second optical layer 117b, and the light-emitting element ED. The region where the first optical layer 117a is disposed may include a recess that is recessed inward relative to the upper surface of the second optical layer 117b. Therefore, a first portion of the second electrode CE2 disposed on the first optical layer 117a can be disposed along this recess, and thus can be positioned below a second portion of the second electrode CE2 disposed on the second optical layer 117b.

[0201] A third optical layer 117c may be disposed on the second electrode CE2. The third optical layer 117c may be configured to overlap with the plurality of light-emitting elements ED and the first optical layer 117a. Since the third optical layer 117c is disposed on the second electrode CE2 and the plurality of light-emitting elements ED, it can prevent the appearance of patterns in some of the plurality of light-emitting elements ED. For example, when the plurality of light-emitting elements ED are transferred onto the substrate 110 of the display device 1000, process variations or other factors may cause uneven spacing between the plurality of light-emitting elements ED. If the spacing between the plurality of light-emitting elements ED is uneven, the individual light output areas of the plurality of light-emitting elements ED will be unevenly arranged, making patterns visible to the user. Considering the above problem, the third optical layer 117c may be configured to uniformly diffuse light on the plurality of light-emitting elements ED, thereby reducing the perception of patterns caused by light emission from some of the light-emitting elements ED. Therefore, the third optical layer 117c enables the light emitted from the plurality of light-emitting elements ED to be uniformly diffused and extracted to the outside of the display device 1000, thereby improving the brightness uniformity of the display device 1000.

[0202] The third optical layer 117c can be formed from an organic insulating material in which fine particles are dispersed. However, the embodiments described herein are not limited to this. For example, the third optical layer 117c can be formed from a siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed; however, the embodiments described herein are not limited to this. For example, the third optical layer 117c can be formed from the same material as the first optical layer 117a, but the embodiments described herein are not limited to this. For example, the third optical layer 117c can be a diffuse layer or an upper surface diffuse layer; however, the embodiments described herein are not limited to this.

[0203] According to this specification, light emitted from multiple light-emitting elements (EDs) can be scattered by fine particles dispersed in the third optical layer 117c and emitted to the outside of the display device 1000. The third optical layer 117c can uniformly mix the light emitted from the multiple light-emitting elements (EDs), thereby further improving the brightness uniformity of the display device 1000. In addition, using multiple fine particles to scatter light can improve the light extraction efficiency of the display device 1000, thereby enabling the display device 1000 to operate with lower power consumption.

[0204] In the display area AA, a black matrix BM can be disposed on the second electrode CE2, the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c. For example, the black matrix BM can fill the contact holes of the second optical layer 117b. Since the black matrix BM is configured to cover the display area AA, it can reduce color mixing of light from multiple sub-pixels and reflection of external light. For example, the black matrix BM can also be disposed in the contact holes through which the second electrode CE2 and the contact electrode CCE are connected, thereby preventing light leakage between adjacent sub-pixels.

[0205] For example, the black matrix BM can be formed from an opaque material. However, the embodiments described herein are not limited to this. For example, the black matrix BM can be an organic insulating material containing black pigment or black dye, but the embodiments described herein are not limited to this.

[0206] In the display area AA, a cover layer 118 may be disposed on the black matrix BM. The cover layer 118 can protect components disposed beneath it. For example, the cover layer 118 may be formed of an organic insulating material; however, the embodiments described herein are not limited thereto. For example, the cover layer 118 may be formed of photoresist, polyimide (PI), photosensitive acrylic-based materials, etc., but the embodiments described herein are not limited thereto. For example, the cover layer 118 may be a cladding layer, an insulating layer, etc.; however, the embodiments described herein are not limited thereto.

[0207] The polarizing layer 293 may be disposed on the cover layer 118 via the first adhesive layer 291. The cover member 120 may be disposed on the polarizing layer 293 via the cover adhesive layer 295. For example, the first adhesive layer 291 and the cover adhesive layer 295 may each comprise an optically transparent adhesive (OCA), an optically transparent resin (OCR), a pressure-sensitive adhesive (PSA), etc. However, the embodiments described in this specification are not limited thereto.

[0208] According to this specification, in the second non-display area NA2, a plurality of pad electrodes PE can be arranged on the third insulating layer 115c. For example, at least a portion of each of the plurality of pad electrodes PE can be exposed from the passivation layer 116. For example, the plurality of pad electrodes PE can be electrically connected to a fourth second connection line 122d through contact holes in the third insulating layer 115c.

[0209] A conductive adhesive layer (ACF) can be disposed on multiple pad electrodes (PE). The conductive adhesive layer (ACF) can be an adhesive layer in which conductive spheres are dispersed in an insulating material, but embodiments of this specification are not limited thereto. When heat or pressure is applied to the conductive adhesive layer (ACF), the conductive spheres in the areas where heat or pressure is applied can become electrically connected, thereby exhibiting conductive properties. A flexible circuit board (or flexible film) (CB) can be attached or bonded to multiple pad electrodes (PE) by disposing the conductive adhesive layer (ACF) between the multiple pad electrodes (PE) and the flexible circuit board (or flexible film) (CB). For example, the conductive adhesive layer (ACF) can be an anisotropic conductive film (ACF), but embodiments of this specification are not limited thereto.

[0210] A flexible circuit board (or flexible film) CB can be disposed on a conductive adhesive layer ACF. The flexible circuit board (or flexible film) CB can be electrically connected to multiple pad electrodes PE through the conductive adhesive layer ACF. Therefore, signals output from the flexible circuit board (or flexible film) CB and the printed circuit board can be transmitted to the pixel driving circuit PD in the display area AA through multiple pad electrodes PE, a fourth second connection line 122d, a third second connection line 122c, a second second connection line 122b, and a first second connection line 122a.

[0211] Figure 12 This is a cross-sectional view showing the display panel of the display device according to the comparative example. For example, Figure 12 It is based on the cross-sectional view of the comparative example, which corresponds to along Figure 2 The cross-sectional view taken from line II-II′. Figure 13 This is a cross-sectional view showing the display panel of a display device according to another embodiment of this specification. For example, Figure 13 It shows along Figure 2 A cross-sectional view of another embodiment of the display panel, taken by line II-II′. Here, Figure 13 The display panel shown can be the display panel 100a according to the second embodiment, and can be used in the display device 1000 instead of the one according to the second embodiment. Figure 8 The display panel 100 of the first embodiment shown. Figure 14 This is a plan view illustrating a pattern disposed in a display panel according to another embodiment of this specification. For example, Figure 14 This is a plan view showing a pattern arranged in a display panel according to a second embodiment of this specification.

[0212] When comparing the display device 1000 including the display panel 100 according to the first embodiment with the display device 1000 including the display panel 100CE according to the comparative example, refer to Figure 8 and Figure 12The display device 1000 including the display panel 100 according to the first embodiment may further include a first adhesive layer 291 and a polarizing layer 293. For example, the display device including the display panel 100CE according to the comparative example may differ from the display device 1000 including the display panel 100 according to the first embodiment in that the cover member 120 is attached via a cover adhesive layer 295 without the first adhesive layer 291 and the polarizing layer 293.

[0213] When comparing the display device 1000 including the display panel 100 according to the first embodiment with the display device 1000 including the display panel 100a according to the second embodiment, refer to Figure 8 and Figure 13 The display device 1000 according to the first embodiment, including the display panel 100, differs from the display device 1000 according to the second embodiment, including the display panel 100a, in that the display device 1000 according to the first embodiment further includes a first adhesive layer 291 and a polarizing layer 293, and does not include the pattern 119. However, in some cases, the display device 1000 according to the second embodiment, including the display panel 100a, may further include a first adhesive layer 291 and a polarizing layer 293 disposed between the pattern 119 and the cover adhesive layer 295. Here, the cover adhesive layer 295 of the display panel 100a according to the second embodiment may correspond to the cover adhesive layer 295 of the display panel 100 according to the first embodiment.

[0214] When comparing the display device according to the comparative example, which includes a display panel 100CE, with the display device 1000 according to the second embodiment, which includes a display panel 100a, the display panel 100a according to the second embodiment may further include a pattern 119. Therefore, compared to the display panel 100CE according to the comparative example, the display panel 100a according to the second embodiment can achieve higher efficiency in terms of light scattering efficiency (%), thereby preventing or minimizing speckles at tilted viewing angles. Here, light scattering efficiency (%) can be expressed as a percentage obtained by dividing the brightness measured at a tilted viewing angle by the brightness measured at a normal viewing angle. Brightness at a normal viewing angle can refer to the brightness of the display panel measured at the front of the display panel (i.e., at an angle of 90 degrees relative to the plane of the cover 120). Brightness at a tilted viewing angle can refer to the brightness of the display panel measured at an angle of 75 degrees relative to the plane of the cover 120.

[0215] In reference Figure 8 and Figure 13In the following description of the display panel 100a according to the second embodiment, substantially the same components of the display panel 100 according to the first embodiment and the display panel 100a according to the second embodiment can be indicated by the same reference numerals, therefore, detailed descriptions thereof will be omitted.

[0216] Reference Figure 8 and Figure 13 According to the second embodiment, the display panel 100a may include a first buffer layer 111a disposed on a substrate 110, an alignment key MK disposed on the first buffer layer 111a, a second buffer layer 111b disposed on the first buffer layer 111a to cover the alignment key MK, a circuit adhesive layer 112 disposed on the second buffer layer 111b, a pixel driving circuit PD disposed on the circuit adhesive layer 112, a first protective layer 113a and a second protective layer 113b disposed on the circuit adhesive layer 112 and configured to surround the side surfaces of the pixel driving circuit PD, a first connecting line 121, a third protective layer 114 disposed on the second protective layer 113b, a first insulating layer 115a, a second insulating layer 115b and a third insulating layer 115c, a plurality of contact electrodes CCE, and a dam B. The system comprises: NK, passivation layer 116, and multiple signal lines TL disposed on a third insulating layer 115c within an insulating layer; a first electrode CE1 disposed on a dam portion BNK; a solder pattern SDP disposed on the first electrode CE1; multiple light-emitting elements ED disposed on the solder pattern SDP; a first optical layer 117a, a second optical layer 117b, and a third optical layer 117c surrounding the multiple light-emitting elements ED; a second electrode CE2 disposed on the light-emitting elements ED; a black matrix BM disposed on the first optical layer 117a, the second optical layer 117b, and the third optical layer 117c; a cover layer 118; at least one pattern 119 disposed on the cover layer 118; a cover adhesive layer 295 covering at least one pattern 119; and a cover member 120 disposed on the cover adhesive layer 295. The cover member 120 may include a flat region FA and a curved region CA formed around the flat region FA. The curved region CA may include a curved surface. For example, the curved region CA of the cover member 120 may overlap with a portion of the display region AA and a first non-display region NA1.

[0217] Furthermore, the display panel 100a according to the second embodiment may include a plurality of second connecting lines 122 disposed on a second protective layer 113b in a non-display area NA, a plurality of pad electrodes PE disposed on the plurality of second connecting lines 122, and a conductive adhesive layer ACF disposed on the plurality of pad electrodes PE.

[0218] At least one or more patterns 119 may be disposed on the light emission path of the light-emitting element ED. Furthermore, scattered light emitted from the light-emitting element ED may be refracted by at least one or more patterns 119. Therefore, as the scattered light is refracted by at least one or more patterns 119, the light collection efficiency can be improved.

[0219] At least one or more patterns 119 may be disposed on the cover layer 118. For example, at least one or more patterns 119 may be formed to protrude from the cover layer 118. Furthermore, at least one or more patterns 119 may be integrally formed with the cover layer 118. However, the embodiments described herein are not limited thereto.

[0220] Reference Figure 13 Multiple patterns 119 can be arranged in the display area AA and the first non-display area NA1. In this case, at least one pattern 119 disposed in the first non-display area NA1 can collect scattered light toward the front surface of the cover 120. For example, since scattered light emitted toward the side of the display panel 100a is refracted by the pattern 119, the scattered light efficiency (or light collection efficiency) can be improved by the pattern 119. Therefore, the display device 1000 can prevent or minimize the formation of streaks in the curved area CA of the cover 120 by means of the pattern 119. For example, Figure 13 The dashed arrows shown can represent the light path of scattered light emitted from the light-emitting element ED. Referring to the light path of the scattered light, the scattered light emitted toward the side of the display panel 100a can be collected toward the front surface of the cover 120 through the pattern 119. For example, the front surface of the cover 120 refers to a surface of the cover 120, which can be a surface opposite to the rear surface of the cover 120 facing the light-emitting element ED or a surface on which an image of the display device 1000 is displayed.

[0221] Pattern 119 can be configured to have a width W and a height H. For example, pattern 119 can be formed into a cone shape, a triangular pyramid shape, a square pyramid shape, a pentagonal pyramid shape, a hexagonal pyramid shape, etc. However, the embodiments in this specification are not limited to this.

[0222] like Figure 14 As shown, pattern 119 can be formed in a cone shape. The cone-shaped pattern 119 can be arranged in the display area AA and the first non-display area NA1. However, embodiments of this specification are not limited thereto. The width W of the cone-shaped pattern 119 can be greater than its height H. For example, the width W of the cone-shaped pattern 119 can be twice its height H, but embodiments of this specification are not limited thereto.

[0223] Considering the scattering range of light emitted from the light-emitting element ED, the width W of pattern 119 can be adjusted in various ways.

[0224] The width W of pattern 119 may be greater than the width WED of light-emitting element ED. For example, cover layer 118 may be formed of a material different from that of optical layer (i.e., third optical layer 117c), and the refractive index of cover layer 118 may be different from that of third optical layer 117c. Therefore, since cover layer 118 is a different medium than third optical layer 117c, a portion of the light emitted from light-emitting element ED can be scattered. Considering the scattering range of the scattered light, the width W of pattern 119 may be greater than the width WED of light-emitting element ED. When the height H of pattern 119 is less than the first thickness T1 of cover layer 118 and the second thickness T2 of cover adhesive layer 295, the width W of pattern 119 may be formed to be equal to or similar to the width WOP of the opening formed between black matrices BM. However, the embodiments of this specification are not limited thereto. For example, the opening formed between black matrices BM may overlap with light-emitting element ED.

[0225] In order for the light reflected by the pattern 119 toward the third optical layer 117c to be reflected toward the front side of the cover 120, the refractive index of the third optical layer 117c may be greater than the refractive index of the cover layer 118. In this case, the refractive index of the cover adhesive layer 295 may be greater than the refractive index of the third optical layer 117c. Therefore, the refractive index of the third optical layer 117c may be greater than the refractive index of the cover layer 118 and less than the refractive index of the cover adhesive layer 295.

[0226] The height H of pattern 119 can adjust the position where scattered light is refracted. For example, since scattered light can be refracted at the surface (or upper surface) of pattern 119 that is in contact with the adhesive layer 295, the position where scattered light is refracted can be adjusted by the height H of pattern 119. For example, as the height H of pattern 119 increases, the distance from the surface (or upper surface) of pattern 119 to the upper surface 295a of adhesive layer 295 can be reduced. Therefore, since the light path in pattern 119 becomes longer, the light scattering efficiency of the display panel caused by pattern 119 can be improved, but the embodiments of this specification are not limited thereto. For example, the light scattering efficiency of the display panel can be improved only when the width W and height H of pattern 119 are formed to be at least a predetermined size relative to the second thickness T2 of adhesive layer 295. Since the height H of pattern 119 corresponds to the width W of pattern 119, the height H of pattern 119 can increase as the width W increases.

[0227] Figure 15 This is a graph showing the light scattering efficiency of a display panel according to a comparative example, based on the flat and curved areas of the cover, the light scattering efficiency of a display panel according to another embodiment, and the height of the pattern. For example, Figure 15The light scattering efficiency of a display panel according to a comparative example, based on the flat and curved areas of the cover, and the light scattering efficiency and pattern height of a display panel according to a second embodiment are shown. Here, Figure 15 The left vertical axis represents the light scattering efficiency, and the right vertical axis represents the height of the pattern 119. The second thickness T2 of the adhesive layer 295 can be 10 μm. Therefore, the width W and height H of the pattern 119 can be less than the second thickness T2 of the adhesive layer 295. Furthermore, the light scattering efficiency (%) can be expressed as a percentage obtained by dividing the brightness measured at an oblique viewing angle by the brightness measured at a normal viewing angle. The brightness at a normal viewing angle can refer to the brightness of the display panel measured at the front of the display panel (i.e., at an angle of 90 degrees relative to the plane of the cover 120). The brightness at an oblique viewing angle can refer to the brightness of the display panel measured at an angle of 75 degrees relative to the plane of the cover 120.

[0228] Reference Figure 13 and Figure 15 According to the second embodiment, the pattern 119 of the display panel 100a can be formed to have a width W and a height H. For example, the width W and height H of the pattern 119 can be formed to be less than the second thickness T2 of the adhesive layer 295. For example, the second thickness T2 of the adhesive layer 295 can be 10 μm, the width W of the pattern 119 can be 6.4 μm, and the height H of the pattern 119 can be 3.2 μm.

[0229] Even if the display panel 100a according to the second embodiment includes a pattern 119, if the width W and height H of the pattern 119 do not reach the predetermined dimensions, it may be difficult to ensure the light scattering efficiency (%) achieved by the pattern 119. As a result, patterns may form in the curved region CA of the cover 120 provided in the display panel 100a according to the second embodiment. For example, as Figure 15 As shown, since the display panel 100a according to the second embodiment exhibits a lower light scattering efficiency than the display panel 100CE according to the comparative example, considering that patterns may appear in the display panel 100CE according to the comparative example, patterns may also appear in the curved region CA of the cover 120 provided in the display panel 100a according to the second embodiment.

[0230] Therefore, although the display panel 100a according to the second embodiment may be insufficient to prevent blemishes, it is understood that the efficiency of scattered light can be adjusted by the pattern 119 of the display panel 100a according to the second embodiment.

[0231] Therefore, the display device 1000 according to embodiments of this specification can prevent streaks from appearing at an oblique viewing angle through various embodiments of patterns having different sizes, shapes, and arrangement positions than the pattern 119 of the display panel 100a according to the second embodiment. For example, the display device 1000 according to embodiments of this specification can prevent or minimize streaks from appearing at an oblique viewing angle by providing various embodiments of patterns formed by adjusting the size, shape, and arrangement position of the pattern 119.

[0232] In the following sections, various embodiments of patterns that can prevent or minimize the appearance of speckles at oblique viewing angles will be described.

[0233] Figure 16 It is along Figure 2 A cross-sectional view of the display panel of a display device according to another embodiment of this specification, taken by line II-II′. For example, Figure 16 It shows along Figure 2 A cross-sectional view of another embodiment of the display panel, taken by line II-II′. For example, Figure 16 The display panel shown may be the display panel 100b according to the third embodiment, and may be used in the display device 1000 to replace the display panel 100a according to the second embodiment. Figure 16 The dashed arrow shown can represent the optical path of the scattered light emitted from the light-emitting element ED. Figure 17 This is a plan view illustrating a pattern arranged in a display panel according to another embodiment of this specification. For example, Figure 17 This is a plan view showing the pattern arranged in the display panel according to the third embodiment of this specification.

[0234] In reference Figure 13 and Figure 16 When comparing the display device 1000 including the display panel 100a according to the second embodiment with the display device 1000 including the display panel 100b according to the third embodiment, the following differences exist: In the display device 1000 including the display panel 100b according to the third embodiment, the size of the pattern 119 disposed around the center C of the display panel 100b is different from the size of the pattern 119 disposed in the periphery of the display panel 100b. For example, the display panel 100b according to the third embodiment may include patterns 119 that increase in size from the center C of the display panel 100b toward the first non-display area NA1. Furthermore, the display panel 100b according to the third embodiment may include multiple pattern groups, which include multiple patterns 119 of different sizes. For example, among the multiple pattern groups, the pattern group including the larger pattern 119 may be disposed on the outermost side of the display panel 100b.

[0235] In reference Figure 8 , Figure 13 and Figure 16 In the following description of the display panel 100b according to the third embodiment, substantially the same components of the display panel 100 according to the first embodiment, the display panel 100a according to the second embodiment, and the display panel 100b according to the third embodiment can be indicated by the same reference numerals, therefore, detailed descriptions thereof will be omitted.

[0236] Reference Figure 8 and Figure 16 According to the third embodiment, the display panel 100b may include a first buffer layer 111a, an alignment key MK, a second buffer layer 111b, a circuit adhesive layer 112, a pixel driving circuit PD, a first protective layer 113a, a second protective layer 113b, a first connecting line 121, a third protective layer 114, a first insulating layer 115a, a second insulating layer 115b and a third insulating layer 115c, a plurality of contact electrodes CCE, a dam BNK, a passivation layer 116, a plurality of signal lines TL, a first electrode CE1, a solder pattern SDP, a light-emitting element ED, a first optical layer 117a, a second optical layer 117b and a third optical layer 117c, a second electrode CE2, a black matrix BM, a cover layer 118, at least one pattern 119, a cover adhesive layer 295, and a cover member 120. Here, the cover member 120 may include a flat region FA and a curved region CA formed around the flat region FA, and the curved region CA may include a curved surface. For example, the curved area CA of the cover 120 may overlap with a portion of the display area AA and the first non-display area NA1.

[0237] Furthermore, the display panel 100b according to the third embodiment may include multiple second connection lines 122, multiple pad electrodes PE, and a conductive adhesive layer ACF.

[0238] According to the third embodiment, a plurality of patterns 119 of the display panel 100b can be arranged along the light emission path of the light-emitting element ED. Furthermore, scattered light emitted from the light-emitting element ED can be refracted by the patterns 119. Therefore, as the scattered light is refracted by the patterns 119, light collection efficiency can be improved.

[0239] Multiple patterns 119 may be arranged on the cover layer 118. For example, the patterns 119 may be formed to protrude from the cover layer 118. Furthermore, the patterns 119 may be integrally formed with the cover layer 118; however, the embodiments described herein are not limited thereto.

[0240] Multiple patterns 119 may be arranged in the display area AA and the first non-display area NA1. For example, multiple patterns 119 may overlap with the curved area CA and the flat area FA of the cover 120.

[0241] The size of the multiple patterns 119 can increase from the display area AA toward the non-display area NA. For example, the size of the multiple patterns 119 can increase from the center C of the display area AA toward the first non-display area NA1.

[0242] Considering the difficulty in ensuring a satisfactory light scattering efficiency (%) of pattern 119 when the width W and height H of pattern 119 do not reach the predetermined dimensions, and the possibility that scattered light emitted from the light-emitting element ED located on the outermost side of the display area AA may form speckles in the curved area CA of cover 120, pattern 119 overlapping with the light-emitting element ED located on the outermost side of the display area AA or overlapping with the first non-display area NA1 may be formed with a predetermined height H. In other words, considering the light scattering efficiency (%), pattern 119 overlapping with the curved area CA of cover 120 may be formed with a predetermined height H. For example, if the second thickness T2 of the cover adhesive layer 295 is defined as 1, the height H of pattern 119 overlapping with the curved area CA of cover 120 may be 0.5 to 1.0 times the second thickness T2 of the cover adhesive layer 295. When each pattern 119 is formed in a conical shape (such as a square pyramid shape), the width W of pattern 119 may increase with the increase of the height H of pattern 119.

[0243] Reference Figure 16 The plurality of patterns 119 may include a first pattern 119-1 overlapping the curved region CA of the cover 120, a second pattern 119-2 disposed at or adjacent to the center C of the display panel 100b, and a third pattern 119-3 disposed between the first pattern 119-1 and the second pattern 119-2. The second pattern 119-2 and the third pattern 119-3 may overlap with the flat region FA of the cover 120. Furthermore, the number of the first pattern 119-1, the second pattern 119-2, and the third pattern 119-3 may be adjustable.

[0244] The first height H1 of the first pattern 119-1 can be greater than the second height H2 of the second pattern 119-2. Furthermore, the third height H3 of the third pattern 119-3 can be greater than the second height H2 of the second pattern 119-2. Therefore, the first height H1 of the first pattern 119-1 overlapping with the curved region CA can be greater than the height H2 of the second pattern 119-2 and the height H3 of the third pattern 119-3 overlapping with the flat region FA.

[0245] The first height H1 of the first pattern 119-1 can be formed to be equal to or greater than a preset height. For example, the first height H1 of the first pattern 119-1 can be 0.5 to 1.0 times the second thickness T2 of the adhesive layer 295. For example, considering the non-contact between the first pattern 119-1 and the cover 120, the first height H1 of the first pattern 119-1 can be 0.5 to 0.95 times the second thickness T2 of the adhesive layer 295, but is not limited to this. Here, the first light-emitting element 130, which is arranged on the outermost side of the display panel 100b relative to the center C of the display panel 100b, can be configured to overlap with the first pattern 119-1 in order to prevent or minimize the formation of streaks on the cover 120.

[0246] Furthermore, the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150, which are arranged on the outermost side of the display area AA and form a single pixel PX, can overlap with the first pattern 119-1 (which overlaps with the curved area CA of the cover 120) to prevent or minimize the formation of patterns on the cover 120. Here, since the first light-emitting element 130 is disposed in the first sub-pixel SP1, the second light-emitting element 140 is disposed in the second sub-pixel SP2, and the third light-emitting element 150 is disposed in the third sub-pixel SP3 to form a single pixel PX, the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150, which are arranged on the outermost side of the display area AA and form a pixel PX, can overlap with the first pattern 119-1. Therefore, the formation of patterns on the cover 120 can be prevented or minimized. In other words, since the light-emitting element ED, which is disposed on the outermost side of the display area AA to form a single pixel PX, overlaps with the first pattern 119-1, the formation of patterns on the cover 120 can be prevented or minimized. For example, since the pixel PX, which is set on the outermost side of the display area AA, overlaps with the first pattern 119-1, it is possible to prevent or minimize the formation of patterns on the cover 120.

[0247] Therefore, in the display panel 100b according to the third embodiment, since the first height H1 of the first pattern 119-1 overlapping with the curved region CA is formed in the range of 0.5 to 1.0 times the second thickness T2 of the covering adhesive layer 295, the formation of streaks on the cover 120 can be prevented, reduced or minimized.

[0248] Figure 18 This is a graph showing the light scattering efficiency of a display panel according to a comparative example, based on the flat and curved areas of the cover, the light scattering efficiency of a display panel according to another embodiment, and the height of the pattern. For example, Figure 18The light scattering efficiency of a display panel according to a comparative example, based on the flat and curved areas of the cover, and the light scattering efficiency and pattern height of a display panel according to a third embodiment are shown. Here, Figure 18 The left vertical axis represents the light scattering efficiency, and the right vertical axis represents the height of pattern 119. The second thickness T2 of the adhesive layer 295 can be 10 μm. The height H of pattern 119 can be less than or equal to the second thickness T2 of the adhesive layer 295.

[0249] Reference Figure 18 According to the third embodiment, the size of the pattern 119 of the display panel 100b can increase from the center C of the display panel 100b toward the first non-display area NA1. For example, the height H of the pattern 119 can increase toward the first non-display area NA1. The height H of the pattern 119 disposed on the outermost side of the display panel 100b can be equal to the second thickness T2 of the adhesive layer 295. For example, the second thickness T2 of the adhesive layer 295 can be 10 μm. In addition, the height H of the pattern 119 overlapping the curved area CA of the cover member 120 can be formed in the range of 0.5 to 1.0 times the second thickness T2 of the adhesive layer 295. Furthermore, the height H of the pattern 119 disposed on the outermost side of the display panel 100b can be formed in the range of 0.5 to 1.0 times the second thickness T2 of the adhesive layer 295.

[0250] Reference Figures 16 to 18 On the outermost side of the display panel, the light scattering efficiency of the display panel 100b according to the third embodiment is less than that of the display panel 100CE according to the comparative example. Therefore, the display panel 100b according to the third embodiment can prevent streaks from appearing at oblique viewing angles by utilizing the first pattern 119-1 disposed on the outermost side of the display panel 100b.

[0251] Figure 19 This is a cross-sectional view of the display panel of a display device according to another embodiment of this specification. For example, Figure 19 It shows along Figure 2 A cross-sectional view of another embodiment of the display panel, taken by line II-II′. For example, Figure 19 The display panel shown may be the display panel 100c according to the fourth embodiment, and may be used in the display device 1000 to replace the display panel 100a according to the second embodiment. Figure 19 The dashed arrow shown can represent the optical path of the scattered light emitted from the light-emitting element ED. Figure 20 This is a plan view illustrating a pattern arranged in a display panel according to another embodiment of this specification. For example, Figure 20 This is a plan view showing the pattern arranged in the display panel according to the fourth embodiment of this specification.

[0252] In reference Figure 16 and Figure 19 When comparing the display device 1000 including the display panel 100b according to the third embodiment with the display device 1000 including the display panel 100c according to the fourth embodiment, the difference lies in the fact that in the display device 1000 including the display panel 100c according to the fourth embodiment, the pattern 119 is only arranged in the periphery of the display panel 100c. For example, the display panel 100c according to the fourth embodiment may include a plurality of first patterns 119-1 overlapping the curved region CA of the cover 120.

[0253] In reference Figure 8 , Figure 13 , Figure 16 and Figure 19 In the following description of the display panel 100c according to the fourth embodiment, substantially the same components of the display panel 100 according to the first embodiment, the display panel 100a according to the second embodiment, the display panel 100b according to the third embodiment, and the display panel 100c according to the fourth embodiment can be indicated by the same reference numerals, therefore, detailed descriptions thereof will be omitted.

[0254] Reference Figure 8 and Figure 19 According to the fourth embodiment, the display panel 100c may include a first buffer layer 111a, an alignment key MK, a second buffer layer 111b, a circuit adhesive layer 112, a pixel driving circuit PD, a first protective layer 113a, a second protective layer 113b, a first connecting line 121, a third protective layer 114, a first insulating layer 115a, a second insulating layer 115b and a third insulating layer 115c, a plurality of contact electrodes CCE, a dam BNK, a passivation layer 116, a plurality of signal lines TL, a first electrode CE1, a solder pattern SDP, a light-emitting element ED, a first optical layer 117a, a second optical layer 117b and a third optical layer 117c, a second electrode CE2, a black matrix BM, a cover layer 118, a plurality of patterns 119 overlapping with the curved region CA, a cover adhesive layer 295, and a cover member 120. Here, the cover member 120 may include a flat region FA and a curved region CA formed around the flat region FA, and the curved region CA may include a curved surface. For example, the curved area CA of the cover 120 may overlap with a portion of the display area AA and the first non-display area NA1.

[0255] Furthermore, the display panel 100c according to the fourth embodiment may include multiple second connection lines 122, multiple pad electrodes PE, and a conductive adhesive layer ACF.

[0256] According to the fourth embodiment, a plurality of patterns 119 of the display panel 100c can be arranged along the light emission path of the light-emitting element ED disposed in the periphery of the display panel 100c. Furthermore, scattered light emitted from the light-emitting element ED can be refracted by the patterns 119. Therefore, as the scattered light is refracted by the patterns 119, light collection efficiency can be improved.

[0257] Multiple patterns 119 may be arranged on the cover layer 118. For example, the patterns 119 may be formed to protrude from the cover layer 118. Furthermore, the patterns 119 may be integrally formed with the cover layer 118. However, the embodiments described in this specification are not limited thereto.

[0258] Reference Figure 19 Multiple patterns 119 can be arranged to overlap with the curved region CA of the cover 120. Therefore, multiple patterns 119 can be disposed in a portion of the periphery of the display area AA and in the first non-display area NA1. Here, the multiple patterns 119 overlapping the curved region CA of the cover 120 can correspond to the first pattern 119-1. Therefore, the height H of the pattern 119 overlapping the curved region CA of the cover 120 can be formed in the range of 0.5 to 1.0 times the second thickness T2 of the adhesive layer 295, but is not necessarily limited to this. For example, the height H of the pattern 119 overlapping the curved region CA of the cover 120 can be equal to or slightly less than the second thickness T2 of the adhesive layer 295. In this case, based on the Z-axis direction, the height H of the pattern 119 can be greater than the first thickness T1 of the cover layer 118. Additionally, the height H of the pattern 119 can be less than the width W of the pattern 119.

[0259] Figure 21 This is a graph showing the light scattering efficiency of a display panel according to a comparative example, based on the flat and curved areas of the cover, the light scattering efficiency of a display panel according to another embodiment, and the height of the pattern. For example, Figure 21 The light scattering efficiency of a display panel according to a comparative example, based on the flat and curved areas of the cover, and the light scattering efficiency and pattern height of a display panel according to a fourth embodiment are shown. Here, Figure 21 The left vertical axis represents the light scattering efficiency, and the right vertical axis represents the height of pattern 119. The second thickness T2 of the adhesive layer 295 can be 10 μm. The height H of pattern 119 can be less than or equal to the second thickness T2 of the adhesive layer 295.

[0260] Reference Figure 19According to the fourth embodiment, the pattern 119 of the display panel 100c can overlap with the curved region CA of the cover 120. Therefore, the pattern 119 of the display panel 100c may not overlap with the flat region FA of the cover 120. The height H of the pattern 119 overlapping with the curved region CA of the cover 120 may be equal to the second thickness T2 of the adhesive layer 295, but is not limited thereto. For example, the second thickness T2 of the adhesive layer 295 may be 10 μm. Furthermore, the height H of the pattern 119 overlapping with the curved region CA of the cover 120 may be formed in the range of 0.5 to 1.0 times the second thickness T2 of the adhesive layer 295.

[0261] Reference Figures 19 to 21 Since the light scattering efficiency of the display panel 100c according to the fourth embodiment is less than that of the display panel 100CE according to the comparative example, the display panel 100c according to the fourth embodiment can prevent spots from appearing at the tilted viewing angle by utilizing the pattern 119 that overlaps with the curved area CA of the cover 120.

[0262] Figure 22 This is a cross-sectional view of the display panel of a display device according to another embodiment of this specification. For example, Figure 22 It shows along Figure 2 A cross-sectional view of another embodiment of the display panel, taken by line II-II′. For example, Figure 22 The display panel shown may be the display panel 100d according to the fifth embodiment, and may be used in the display device 1000 to replace the display panel 100a according to the second embodiment. Figure 22 The dashed arrow shown can represent the optical path of the scattered light emitted from the light-emitting element ED.

[0263] In reference Figure 16 and Figure 22 When comparing the display device 1000 including display panel 100b according to the third embodiment with the display device 1000 including display panel 100d according to the fifth embodiment, the shapes of the patterns in the display device 1000 including display panel 100d according to the fifth embodiment differ. For example, each pattern 119 of the display panel 100b according to the third embodiment may have a cone shape, and each pattern 119a of the display panel 100d according to the fifth embodiment may have a microlens shape.

[0264] In reference Figure 8 , Figure 13 , Figure 16 and Figure 22In the following description of the display panel 100d according to the fifth embodiment, substantially the same components of the display panel 100 according to the first embodiment, the display panel 100a according to the second embodiment, the display panel 100b according to the third embodiment, and the display panel 100d according to the fifth embodiment can be indicated by the same reference numerals, therefore, detailed descriptions thereof will be omitted.

[0265] Reference Figure 8 and Figure 22 According to the fifth embodiment, the display panel 100d may include a first buffer layer 111a, an alignment key MK, a second buffer layer 111b, a circuit adhesive layer 112, a pixel driving circuit PD, a first protective layer 113a, a second protective layer 113b, a first connecting line 121, a third protective layer 114, a first insulating layer 115a, a second insulating layer 115b and a third insulating layer 115c, a plurality of contact electrodes CCE, a dam BNK, a passivation layer 116, a plurality of signal lines TL, a first electrode CE1, a solder pattern SDP, a light-emitting element ED, a first optical layer 117a, a second optical layer 117b and a third optical layer 117c, a second electrode CE2, a black matrix BM, a cover layer 118, a plurality of patterns 119a, a cover adhesive layer 295, and a cover member 120. Here, the cover member 120 may include a flat region FA and a curved region CA formed around the flat region FA, and the curved region CA may include a curved surface. For example, the curved region CA of the cover 120 may overlap with a portion of the display region AA and the first non-display region NA1. Additionally, each of the multiple patterns 119a may have a microlens shape.

[0266] Furthermore, the display panel 100d according to the fifth embodiment may include multiple second connection lines 122, multiple pad electrodes PE, and a conductive adhesive layer ACF.

[0267] According to the fifth embodiment, the plurality of patterns 119a arranged in the display panel 100d can be positioned along the light emission path of the light-emitting element ED. Furthermore, scattered light emitted from the light-emitting element ED can be refracted by the patterns 119a. Therefore, as the scattered light is refracted by the patterns 119a, light collection efficiency can be improved.

[0268] Multiple patterns 119a may be arranged on the cover layer 118. For example, the patterns 119a may be formed to protrude from the cover layer 118. Furthermore, the patterns 119a may be integrally formed with the cover layer 118. However, the embodiments described in this specification are not limited thereto.

[0269] Reference Figure 22 Multiple patterns 119a can be arranged in the display area AA and the first non-display area NA1. For example, multiple patterns 119a can overlap with the curved area CA and the flat area FA of the cover 120.

[0270] The size of the multiple patterns 119a can increase from the display area AA toward the non-display area NA. For example, the size of the multiple patterns 119a can increase from the center C of the display area AA toward the first non-display area NA1.

[0271] Reference Figure 22 The plurality of patterns 119a may include a first pattern 119a-1 that overlaps with the curved region CA of the cover 120, a second pattern 119a-2 disposed at or adjacent to the center C of the display panel 100d, and a third pattern 119a-3 disposed between the first pattern 119a-1 and the second pattern 119a-2. Here, the second pattern 119a-2 and the third pattern 119a-3 may overlap with the flat region FA of the cover 120.

[0272] The first height H1 of the first pattern 119a-1 may be greater than the second height H2 of the second pattern 119a-2. Furthermore, the third height H3 of the third pattern 119a-3 may be greater than the second height H2 of the second pattern 119a-2. Therefore, the first height H1 of the first pattern 119a-1 overlapping the curved region CA may be greater than the height H2 of the second pattern 119a-2 and the height H3 of the third pattern 119a-3 overlapping the flat region FA. For example, the first height H1 of the first pattern 119a-1 may be 0.5 to 0.95 times the second thickness T2 of the covering adhesive layer 295, but is not limited thereto.

[0273] Figure 23 This is a cross-sectional view of the display panel of a display device according to another embodiment of this specification. For example, Figure 23 It shows along Figure 2 A cross-sectional view of another embodiment of the display panel with line II-II′. For example, Figure 23 The display panel shown may be the display panel 100e according to the sixth embodiment, and may be used in the display device 1000 to replace the display panel 100a according to the second embodiment. Figure 23 The dashed arrow shown can represent the optical path of the scattered light emitted from the light-emitting element ED.

[0274] In reference Figure 19 and Figure 23When comparing the display device 1000 including the display panel 100c according to the fourth embodiment with the display device 100e according to the sixth embodiment, the shapes of the patterns in the display device 1000 including the display panel 100e according to the sixth embodiment differ. For example, each pattern 119 of the display panel 100c according to the fourth embodiment may have a cone shape, and each pattern 119a of the display panel 100e according to the sixth embodiment may have a microlens shape.

[0275] In reference Figure 8 , Figure 13 , Figure 16 , Figure 19 and Figure 23 In the following description of the display panel 100e according to the sixth embodiment, substantially the same components of the display panel 100 according to the first embodiment, the display panel 100a according to the second embodiment, the display panel 100b according to the third embodiment, the display panel 100c according to the fourth embodiment, and the display panel 100e according to the sixth embodiment can be indicated by the same reference numerals, therefore, detailed descriptions thereof will be omitted.

[0276] Reference Figure 8 and Figure 23 According to the sixth embodiment, the display panel 100e may include a first buffer layer 111a, an alignment key MK, a second buffer layer 111b, a circuit adhesive layer 112, a pixel driving circuit PD, a first protective layer 113a, a second protective layer 113b, a first connecting line 121, a third protective layer 114, a first insulating layer 115a, a second insulating layer 115b and a third insulating layer 115c, a plurality of contact electrodes CCE, a dam BNK, a passivation layer 116, a plurality of signal lines TL, a first electrode CE1, a solder pattern SDP, a light-emitting element ED, a first optical layer 117a, a second optical layer 117b and a third optical layer 117c, a second electrode CE2, a black matrix BM, a cover layer 118, a plurality of patterns 119a overlapping the curved region CA, a cover adhesive layer 295, and a cover layer 120. Here, the cover 120 may include a flat region FA and a curved region CA formed around the flat region FA, and the curved region CA may include a curved surface. The curved region CA of the cover 120 may overlap with a portion of the display region AA and the first non-display region NA1. Additionally, each of the multiple patterns 119a may have a microlens shape.

[0277] According to the sixth embodiment, the display panel 100e may include multiple second connection lines 122, multiple pad electrodes PE, and a conductive adhesive layer ACF.

[0278] According to the sixth embodiment, a plurality of patterns 119a arranged in the display panel 100e can be positioned along the light emission path of the light-emitting element ED disposed in the periphery of the display panel 100c. Furthermore, scattered light emitted from the light-emitting element ED can be refracted by the patterns 119a. Therefore, as the scattered light is refracted by the patterns 119a, light collection efficiency can be improved.

[0279] Multiple patterns 119a may be arranged on the cover layer 118. For example, the patterns 119a may be formed to protrude from the cover layer 118. Furthermore, the patterns 119a may be integrally formed with the cover layer 118. However, the embodiments described in this specification are not limited thereto.

[0280] Reference Figure 23 Multiple patterns 119a can be arranged to overlap with the curved region CA of the cover 120. Therefore, multiple patterns 119a can be arranged in a portion of the periphery of the display area AA and in the first non-display area NA1. Here, the multiple patterns 119a overlapping the curved region CA of the cover 120 can correspond to the first pattern 119a-1. Therefore, the height H of the pattern 119a overlapping the curved region CA of the cover 120 can be formed in the range of 0.5 to 1.0 times the second thickness T2 of the adhesive layer 295, but is not necessarily limited to this. For example, the height H of the pattern 119a overlapping the curved region CA of the cover 120 can be equal to or slightly less than the second thickness T2 of the adhesive layer 295. For example, based on the Z-axis direction, the height H of the pattern 119a can be greater than the first thickness T1 of the cover layer 118. Furthermore, the height H of the pattern 119a can be less than the width W of the pattern 119a.

[0281] Figures 24 to 27 This is a schematic diagram illustrating a device to which a display apparatus according to an embodiment of this specification is applied.

[0282] Reference Figures 24 to 27 The display device 1000 according to embodiments of this specification can be included in various devices or electronic devices. For example, such as Figures 24 to 27 As shown, various electronic devices may include wearable devices 1100, mobile devices 1200, laptop computers 1300, and monitors or TVs 1400, but the embodiments described herein are not limited thereto.

[0283] Each of the wearable device 1100, mobile device 1200, laptop computer 1300, and monitor or TV 1400 may respectively include a housing 1005, 1010, 1015, or 1020, and the display device 100 includes as referenced. Figures 1 to 23 The display panel 100 described according to an embodiment of this specification.

[0284] For example, the display device according to embodiments of the present invention can be applied to mobile devices, video phones, smartwatches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbooks, workstations, navigation devices, in-vehicle display devices, theater display devices, televisions, wallpaper devices, signage devices, gaming devices, laptop computers, monitors, cameras, camcorders, home appliances, etc.

[0285] A display device according to one or more embodiments of the present invention can be described as follows.

[0286] A display device according to one or more embodiments of this specification may include a display panel, the display panel comprising: a substrate; an insulating layer disposed on the substrate; a plurality of first electrodes disposed on the insulating layer; a plurality of light-emitting elements disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of light-emitting elements; an optical layer surrounding the plurality of light-emitting elements; a cover layer disposed on the optical layer; at least one pattern disposed on the cover layer; a cover adhesive layer covering the at least one pattern; and a cover member disposed on the cover adhesive layer. The cover member may include a flat region and a curved region formed around the flat region.

[0287] According to one or more embodiments of this specification, the curved area of ​​the cover may overlap with at least one pattern.

[0288] According to one or more embodiments of this specification, at least one pattern overlapping the curved region may overlap with a plurality of light-emitting elements.

[0289] According to one or more embodiments of this specification, the width of each of the plurality of light-emitting elements is smaller than the width of each of at least one pattern.

[0290] According to one or more embodiments of this specification, the substrate may include a display area in which a plurality of light-emitting elements are arranged and a non-display area formed around the display area. The light-emitting elements disposed in the outermost portion of the display area may overlap with a curved area and at least one pattern.

[0291] According to one or more embodiments of this specification, the substrate may include a display area in which a plurality of light-emitting elements are arranged and a non-display area formed around the display area. At least one pattern may include multiple patterns. Multiple patterns may be disposed in the display area and the non-display area.

[0292] According to one or more embodiments of this specification, the height of multiple patterns can be increased from the display area toward the non-display area.

[0293] According to one or more embodiments of this specification, the height of the pattern that overlaps with the curved region among the plurality of patterns may be greater than the height of the pattern that overlaps with the flat region among the plurality of patterns.

[0294] According to one or more embodiments of this specification, the substrate may include a display area in which a plurality of light-emitting elements are arranged and a non-display area formed around the display area. At least one pattern may include multiple patterns. The multiple patterns may be disposed around the display area and in the non-display area. The pattern disposed in the display area among the multiple patterns may overlap with the curved area.

[0295] According to one or more embodiments of this specification, the refractive index of the optical layer may be greater than that of the cover layer and less than that of the cover adhesive layer.

[0296] According to one or more embodiments of this specification, each of at least one pattern may have a cone shape or a microlens shape.

[0297] According to one or more embodiments of this specification, the height of each of at least one pattern may be greater than the thickness of the overlay.

[0298] According to one or more embodiments of this specification, each of at least one pattern may have a width and a height that may be less than the width.

[0299] According to one or more embodiments of this specification, the display device may further include a plurality of embankments disposed on an insulating layer. A plurality of first electrodes may be disposed on the plurality of embankments respectively.

[0300] According to one or more embodiments of this specification, the optical layer may include a first optical layer disposed around a plurality of light-emitting elements, a second optical layer disposed on a side surface of the first optical layer, and a third optical layer disposed on the plurality of light-emitting elements.

[0301] According to one or more embodiments of this specification, each of the plurality of light-emitting elements may be a micro light-emitting diode (micro LED) made of inorganic material.

[0302] According to one or more embodiments of this specification, each of the plurality of light-emitting elements may have a vertical structure.

[0303] According to one or more embodiments of this specification, the display device may further include: a passivation layer disposed on an insulating layer and including a plurality of holes; and a plurality of patterned layers respectively connected to a plurality of first electrodes and disposed in the plurality of holes. The plurality of first electrodes and the plurality of light-emitting elements may be electrically connected via eutectic bonding using the plurality of patterned layers respectively.

[0304] According to one or more embodiments of this specification, the display device may further include: a pixel driving circuit disposed on a substrate; and a plurality of connecting lines disposed on the substrate and electrically connecting a plurality of first electrodes and the pixel driving circuit.

[0305] The objectives to be achieved by this disclosure, the apparatus for achieving these objectives, and the effects described above do not specify the essential features of the claims. Therefore, the scope of the claims is not limited to the content of this disclosure.

[0306] Although embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the embodiments disclosed herein are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are illustrative in all respects and do not limit the present disclosure.

Claims

1. A display device comprising a display panel, the display panel comprising: a substrate; an insulating layer on the substrate; a plurality of first electrodes on the insulating layer; a plurality of light emitting elements on the plurality of first electrodes; a plurality of second electrodes on the plurality of light emitting elements; an optical layer surrounding the plurality of light emitting elements; a cover layer on the optical layer; at least one pattern on the cover layer; a cover adhesive layer covering the at least one pattern; and a cover on the cover adhesive layer, wherein the cover comprises a flat area and a curved area surrounding the flat area. the curved area of the cover overlaps the at least one pattern. the at least one pattern overlaps the curved area and the plurality of light emitting elements. a width of each of the plurality of light emitting elements is smaller than a width of each of the at least one pattern. the substrate comprises a display area in which the plurality of light emitting elements are disposed and a non-display area surrounding the display area, and wherein a light emitting element of the plurality of light emitting elements located in an outermost portion of the display area overlaps the curved area and the at least one pattern. the substrate comprises a display area in which the plurality of light emitting elements are disposed and a non-display area surrounding the display area, wherein the at least one pattern comprises a plurality of patterns, and the plurality of patterns are located in the display area and the non-display area. a height of the plurality of patterns increases from the display area toward the non-display area. a height of a pattern of the plurality of patterns overlapping the curved area is greater than a height of a pattern of the plurality of patterns overlapping the flat area. the substrate comprises a display area in which the plurality of light emitting elements are disposed and a non-display area surrounding the display area, wherein the at least one pattern comprises a plurality of patterns disposed in a periphery of the display area and in the non-display area, wherein a pattern of the plurality of patterns disposed in the display area overlaps the curved area. a refractive index of the optical layer is greater than a refractive index of the cover layer and less than a refractive index of the cover adhesive layer. each of the at least one pattern has a conical shape or a microlens shape. a height of each of the at least one pattern is greater than a thickness of the cover layer. each of the at least one pattern has a width and a height less than the width. the display device further comprises: a plurality of banks on the insulating layer, wherein the plurality of first electrodes are respectively on the plurality of banks. the optical layer comprises: a first optical layer surrounding the plurality of light emitting elements, a second optical layer on a side surface of the first optical layer, and a third optical layer on the plurality of light emitting elements. each of the plurality of light emitting elements is a micro light emitting diode made of an inorganic material. each of the plurality of light emitting elements has a vertical structure. the display device further comprises: a passivation layer on the insulating layer, the passivation layer comprising a plurality of holes; and ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 2. The display device according to claim 1, wherein ​ 3. The display device according to claim 2, wherein ​ 4. The display device according to claim 3, wherein ​ 5. The display device according to claim 1, wherein ​ ​ 6. The display device according to claim 1, wherein ​ ​ 7. The display device of claim 6, wherein, ​ 8. The display device of claim 6, wherein, ​ 9. The display device according to claim 1, wherein ​ ​ ​ 10. The display device of claim 1, wherein, ​ 11. The display device according to claim 1, wherein ​ 12. The display device of claim 1, wherein, ​ 13. The display device of claim 1, wherein, ​ 14. The display device of claim 1, wherein, ​ ​ ​ 15. The display device of claim 14, wherein, ​ ​ ​ ​ 16. The display device of claim 14, wherein, ​ 17. The display device of claim 1, wherein, ​ 18. The display device of claim 1, wherein, ​ ​ a plurality of pattern layers connected to the plurality of first electrodes, the plurality of pattern layers respectively disposed in the plurality of holes; wherein the plurality of first electrodes and the plurality of light emitting elements are respectively electrically connected by eutaxy bonding using the plurality of pattern layers.

19. The display device of claim 1, wherein, The display device further includes: a pixel driving circuit on the substrate; and a plurality of connection lines on the substrate and electrically connecting the plurality of first electrodes and the pixel driving circuit.

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