Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The problem that in the prior art, the yield of display products is low is solved. The display panel comprises a substrate, an isolation structure, a light-emitting device and a protective layer, the isolation structure is located on one side of the substrate, and an isolation opening is defined by the isolation structure; the isolation structure comprises a first part and a second part; the first part is positioned on one side, close to the substrate, of the second part; at least part of the light-emitting device is located in the isolation opening, and the protection layer at least covers the side wall of the first part and is located between the first part and the light-emitting device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) and flat display devices based on light emitting diode (LED) technology have been widely applied to mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display devices.

[0003] However, the yield of the current display products is low. SUMMARY

[0004] Therefore, the embodiments of the present application provide a display panel, a preparation method thereof and a display device, which solve the problem of low yield of display products in the prior art.

[0005] The first aspect of the present application provides a display panel, comprising: a substrate, an isolation structure, a light emitting device and a protective layer, the isolation structure is located on one side of the substrate, and the isolation structure encloses an isolation opening; the isolation structure comprises a first part and a second part, the first part is located on the side of the second part close to the substrate; at least part of the light emitting device is located in the isolation opening, and the protective layer at least covers the sidewall of the first part and is located between the first part and the light emitting device.

[0006] In combination with the first aspect, in some possible implementation manners, the material of the protective layer is a conductive material; preferably, the oxidation resistance of the material of the protective layer is greater than that of the material of the first part; preferably, the material of the protective layer comprises at least one of molybdenum, titanium, alloy material and indium tin oxide.

[0007] In combination with the first aspect, in some possible implementation manners, the orthographic projection of the first part on the substrate is located in the orthographic projection of the second part on the substrate; preferably, the material of the first part comprises aluminum; preferably, the material of the second part comprises titanium or molybdenum.

[0008] In some possible implementation manners of the first aspect, the protective layer further covers the sidewall of the second portion; preferably, the protective layer further covers at least part of the surface of the second portion away from the substrate; preferably, the protective layer is located on the surface of the second portion facing the substrate; preferably, the orthogonal projection of the protective layer on the surface of the second portion facing the substrate on the substrate and the orthogonal projection of the surface of the first portion away from the substrate on the substrate do not overlap; preferably, the orthogonal projection of the protective layer on the surface of the second portion facing the substrate on the substrate and the orthogonal projection of the surface of the first portion away from the substrate on the substrate are connected.

[0009] In some possible implementation manners of the first aspect, the isolation structure further comprises a third portion located on the side of the first portion close to the substrate, and the orthogonal projection of the first portion on the substrate is located in the range of the orthogonal projection of the third portion on the substrate; preferably, the material of the third portion comprises molybdenum or titanium.

[0010] In some possible implementation manners of the first aspect, the protective layer further covers the sidewall of the third portion; preferably, the protective layer is located on the surface of the third portion away from the substrate; preferably, the orthogonal projection of the protective layer on the surface of the third portion away from the substrate on the substrate and the orthogonal projection of the surface of the first portion facing the substrate on the substrate do not overlap; preferably, the orthogonal projection of the protective layer on the surface of the third portion away from the substrate on the substrate and the orthogonal projection of the surface of the first portion facing the substrate on the substrate are connected.

[0011] In some possible implementation manners of the first aspect, the isolation structure further comprises a third portion located on the side of the first portion close to the substrate, and the orthogonal projection of the first portion on the substrate is located in the range of the orthogonal projection of the third portion on the substrate; preferably, the material of the third portion comprises molybdenum or titanium.

[0012] In some possible implementation manners of the first aspect, the protective layer further covers the sidewall of the third portion; preferably, the protective layer is located on the surface of the third portion away from the substrate; preferably, the orthogonal projection of the protective layer on the surface of the third portion away from the substrate on the substrate and the orthogonal projection of the surface of the first portion facing the substrate on the substrate do not overlap; preferably, the orthogonal projection of the protective layer on the surface of the third portion away from the substrate on the substrate and the orthogonal projection of the surface of the first portion facing the substrate on the substrate are connected.

[0013] In some possible implementation manners of the first aspect, the isolation structure further comprises a third portion located on the side of the first portion close to the substrate, and the orthogonal projection of the first portion on the substrate is located in the range of the orthogonal projection of the third portion on the substrate; preferably, the material of the third portion comprises molybdenum or titanium.

[0014] In some possible implementation modes of the first aspect, the light-emitting device comprises a first electrode and a second electrode arranged in a stack, the second electrode is located on a side of the first electrode away from the substrate; preferably, the second electrode is electrically connected to the first electrode; preferably, the second electrode and the protective layer are overlapped; preferably, a normal projection of the protective layer on the substrate surrounds a normal projection of the second electrode on the substrate; preferably, the protective layer comprises a plurality of protective portions, adjacent protective portions are disconnected on a side of the isolation structure away from the substrate.

[0015] In some possible implementation modes of the first aspect, the display panel further comprises an inorganic encapsulation portion located on a side of the second electrode away from the substrate and extending to a side of the isolation structure away from the substrate, a normal projection of the inorganic encapsulation portion on the substrate covers a normal projection of the second electrode on the substrate; preferably, a plurality of inorganic encapsulation portions are arranged at intervals; preferably, the plurality of inorganic encapsulation portions and the plurality of light-emitting devices are in one-to-one correspondence.

[0016] In some possible implementation modes of the first aspect, the display panel further comprises an organic encapsulation layer located on a side of the inorganic encapsulation portion away from the substrate, a normal projection of the organic encapsulation layer on the substrate covers a normal projection of the inorganic encapsulation portion on the substrate; preferably, the display panel further comprises an inorganic encapsulation layer located on a side of the organic encapsulation layer away from the substrate, a normal projection of the inorganic encapsulation layer on the substrate covers a normal projection of the organic encapsulation layer on the substrate.

[0017] The second aspect of the present application provides a display panel, the display panel comprising a substrate, an isolation structure, a light-emitting device and a protective layer, the isolation structure is located on a side of the substrate, the isolation structure encloses an isolation opening; at least part of the light-emitting device is located in the isolation opening; the protective layer is located at least on a side of the isolation structure away from the substrate, and the protective layer covers a surface of the isolation structure away from the substrate and a side wall of the isolation structure.

[0018] In some possible implementation modes of the second aspect, the display panel further comprises a pixel definition layer located on a side of the isolation structure close to the substrate; preferably, the protective layer is also located on part of the surface of the pixel definition layer away from the substrate.

[0019] The third aspect of the present application provides a display panel, comprising a substrate, an isolation structure and a light-emitting device, the isolation structure is located on a side of the substrate, the isolation structure encloses an isolation opening, the isolation structure comprises a first portion and a second portion, the first portion is located on a side of the second portion close to the substrate, a material of the first portion comprises at least one of molybdenum, titanium, an alloy material and indium tin oxide, and the light-emitting device is at least partially located in the isolation opening.

[0020] In conjunction with the third aspect, in some possible implementations, the isolation structure further includes a third part located on the side of the first part closer to the substrate, wherein the orthographic projection of the first part on the substrate is within the orthographic projection range of the third part on the substrate; preferably, the light-emitting device includes a first electrode and a second electrode stacked together, wherein the second electrode is located on the side of the first electrode away from the substrate; preferably, the second electrode and the first part overlap.

[0021] The fourth aspect of this application provides a method for fabricating a display panel, comprising: fabricating an isolation structure on one side of a substrate, the substrate including a first electrode, the isolation structure enclosing an isolation opening, the isolation structure including a first part and a second part, the first part being located on the side of the second part closer to the substrate; fabricating a protective material layer on the side of the isolation structure away from the substrate, and patterning the protective material layer to obtain a protective layer, the protective layer at least covering the sidewall of the first part; and sequentially fabricating a light-emitting layer, a second electrode, and an inorganic encapsulation portion within the isolation opening.

[0022] In conjunction with the fourth aspect, in some possible implementations, the sequential fabrication of the light-emitting layer, the second electrode, and the inorganic encapsulation portion within the isolation opening includes: sequentially fabricating a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer within the isolation opening, and patterning the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer to obtain the light-emitting layer, the second electrode, and the inorganic encapsulation portion.

[0023] In conjunction with the fourth aspect, in some possible embodiments, before fabricating the isolation structure on one side of the substrate, the method further includes: fabricating a pixel definition material layer on one side of the substrate; fabricating the isolation structure on one side of the substrate includes: fabricating the isolation structure on the side of the pixel definition material layer away from the substrate; fabricating a protective material layer on the side of the isolation structure away from the substrate, and patterning the protective material layer to obtain a protective layer includes: fabricating a protective material layer on the side of the isolation structure away from the substrate; simultaneously patterning the protective material layer and the pixel definition material layer to obtain a pixel definition layer and a protective layer, wherein the protective layer covers the surface of the isolation structure away from the substrate, the sidewalls of the isolation structure, and a portion of the surface of the pixel definition layer away from the substrate.

[0024] The fifth aspect of this application provides a display device, including the display panel described above, or the display panel obtained by the preparation method described above.

[0025] According to the display panel, its manufacturing method, and display device provided in the embodiments of this application, by providing a protective layer on the sidewall of the first part of the isolation structure, the material of the first part is prevented from being oxidized in subsequent processes, thereby improving the bonding effect between the first part and the cathode and increasing the yield of the display panel. Attached Figure Description

[0026] Figure 1 This is a partial cross-sectional structural diagram of the display panel provided in the first embodiment of this application.

[0027] Figure 2 This is a partial cross-sectional structural diagram of the display panel provided in the second embodiment of this application.

[0028] Figure 3a This is a partial cross-sectional structural diagram of the display panel provided in the third embodiment of this application.

[0029] Figure 3b This is a partial cross-sectional structural diagram of the display panel provided in the fourth embodiment of this application.

[0030] Figure 4 This is a partial cross-sectional structural diagram of the display panel provided in the fifth embodiment of this application.

[0031] Figure 5 This is a partial cross-sectional structural diagram of the display panel provided in the sixth embodiment of this application.

[0032] Figure 6 This is a flowchart of the method for manufacturing a display panel provided in the first embodiment of this application.

[0033] Figures 7a to 7c This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application.

[0034] Figure 8 This is a flowchart of the method for preparing a display panel according to the second embodiment of this application.

[0035] Figures 9a to 9e This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application.

[0036] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0037] In the process of developing this invention, the inventors discovered the following problems in the related technology: With the rapid development of display technology, panel size is no longer limited by fine metal masks. As an alternative technical means, an isolation structure is usually set in the display panel to isolate the film layers deposited on the isolation structure, such as the organic light-emitting functional layer and cathode layer of adjacent light-emitting devices, thereby eliminating the need for a fine metal mask in the display panel manufacturing process. However, the existing display panel isolation structure and cathode bonding resistance are too high or have poor uniformity, ultimately leading to poor display quality.

[0038] In view of this, embodiments of this application provide a display panel and a method for manufacturing the same and a display device. By providing a protective layer on the sidewall of the first part of the isolation structure, the material of the first part is prevented from being oxidized in subsequent processes, thereby improving the bonding effect between the first part and the cathode and improving the yield of the display panel.

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0041] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0042] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, Patent PCT / CN2024 / 098217, Patent

[0043] PCT / CN2024 / 099419 and patent PCT / CN2024 / 099072 describe relevant technical solutions for isolation structures, the contents of which are incorporated herein by reference.

[0044] Figure 1 This is a partial cross-sectional structural diagram of the display panel provided in the first embodiment of this application. (See diagram below.) Figure 1 As shown, the display panel includes a substrate 11, an isolation structure 12, a light-emitting device 13, and a protective layer 14. The isolation structure 12 encloses an isolation opening Q. The isolation structure 12 includes a first part 121 and a second part 122. The first part 121 is located on the side of the second part 122 closer to the substrate 11. At least a portion of the light-emitting device 13 is located within the isolation opening Q. The protective layer 14 at least covers the sidewall of the first part 121 and is located between the first part 121 and the light-emitting device 13.

[0045] The substrate 11 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0046] Furthermore, in one embodiment, the substrate 11 may have a driving circuit for driving multiple light-emitting devices 13 to emit light of corresponding colors. For example, the substrate 11 may include a substrate layer, a barrier layer, a buffer layer, a gate insulator (GI), a capacitance insulator (CI), a gate, a source and drain, an interlayer dielectric (ILD), etc.

[0047] The light-emitting device 13 can be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), or the like. The light-emitting device 13 can be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, etc.

[0048] In one embodiment, the light-emitting device 13 includes a first electrode 131 and a second electrode 132 stacked together, and at least one organic light-emitting functional layer 133 located between the first electrode 131 and the second electrode 132, wherein the second electrode 132 is located on the side of the first electrode 131 facing away from the substrate 11. The first electrode 131 may be an anode, and the second electrode 132 may be a cathode. The at least one organic light-emitting functional layer 133 includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0049] In one embodiment, at least one light-emitting device 13 includes a plurality of light-emitting devices, the plurality of light-emitting devices including at least two of a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B.

[0050] The isolation structure 12 can isolate the organic light-emitting functional layer 133 and the second electrode 132 of multiple light-emitting devices 13. In one embodiment, the orthographic projection of the first part 121 on the substrate 11 is within the orthographic projection range of the second part 122 on the substrate 11. Exemplarily, the first part 121 can be designed as an independent film layer, that is, there is no physical interface inside the first part 121, and each part is made of the same material, for example, the material of the first part 121 may include aluminum. Alternatively, the first part 121 can be designed to be formed by stacking at least two film layers. For example, the first part 121 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. Exemplarily, the first part 121 includes a conductive portion, or the first part 121 itself is a conductive structure. The first part 121 is electrically connected to the second electrode 132 of the light-emitting device 13, so that the second electrodes 132 of adjacent light-emitting devices 13 are electrically connected to each other, thereby realizing a full-surface cathode. Specifically, the second electrode 132 overlaps with the protective layer 14. The material of the second part 122 can be an organic material, an inorganic material, or a metallic material, such as molybdenum or titanium. When the second part 122 is a metallic material, the material of the second part 122 can be titanium.

[0051] In one embodiment, the protective layer 14 is made of a conductive material, thereby electrically connecting the second electrode 132 and the first part 121 through the protective layer 14.

[0052] In one embodiment, the material of the protective layer 14 has a greater oxidation resistance than the material of the first part 121, thereby protecting the first part 121 while preventing its own oxidation that could lead to poor bonding between the second electrode 132 and the first part 121. It should be understood that oxidation resistance refers to the ability to resist oxidation reactions under the influence of external environments such as high temperature, high pressure, and oxygen. The fact that the material of the protective layer 14 has a greater oxidation resistance than the material of the first part 121 means that under the same external environments of high temperature, high pressure, and oxygen, the material of the protective layer 14 is more resistant to oxidation reactions than the material of the first part 121. In other words, under the same conditions, the material of the first part 121 is more prone to oxidation than the material of the protective layer 14.

[0053] In one specific embodiment, the material of the protective layer 14 includes at least one of molybdenum, titanium, alloy materials, and indium tin oxide.

[0054] In one embodiment, the display panel further includes a pixel defining layer 15 located between the substrate 11 and the isolation structure 12. The pixel defining layer 15 encloses a pixel opening 151, the orthographic projection of which onto the substrate 11 falls within the orthographic projection range of which onto the isolation opening 12. The pixel opening 151 exposes at least a portion of the first electrode 131. Exemplarily, the pixel defining layer 15 is made of an inorganic material.

[0055] Optionally, the pixel definition layer 15 can be made of a light-transmitting material to allow the light from the light-emitting device 13 to pass through the pixel definition layer better. Optionally, the pixel definition layer 15 can be made of an opaque material, which can improve the light absorption of the pixel definition layer 15, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent light-emitting devices 13, and improve the display effect of the display panel.

[0056] In one embodiment, the display panel further includes an inorganic encapsulation portion 16, which is located on the side of the second electrode 132 opposite to the substrate 11 and extends to the side of the isolation structure 12 opposite to the substrate 11. The orthographic projection of the inorganic encapsulation portion 16 on the substrate 11 covers the orthographic projection of the second electrode 132 on the substrate 11. Exemplarily, the material of the inorganic encapsulation portion 16 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation portion 16 can be a single layer, multiple layers, composite layers, etc.

[0057] In one embodiment, there are multiple inorganic encapsulation portions 16, which are spaced apart.

[0058] In one embodiment, a plurality of inorganic encapsulation portions 16 and a plurality of light-emitting devices 13 correspond one-to-one.

[0059] This application provides a display panel that, by providing a protective layer on the sidewall of the first part of the isolation structure, prevents the material of the first part from being oxidized in subsequent processes, improves the bonding effect between the first part and the cathode, and improves the yield of the display panel.

[0060] Figure 2 This is a partial cross-sectional structural diagram of the display panel provided in the second embodiment of this application. For example... Figure 2 As shown, in one embodiment, the display panel further includes an organic encapsulation layer 17, which is located on the side of the inorganic encapsulation portion 16 facing away from the substrate 11. The orthographic projection of the organic encapsulation layer 17 onto the substrate 11 covers the orthographic projection of the inorganic encapsulation portion 16 onto the substrate 11. Exemplarily, the material of the organic encapsulation layer 17 is a fiber material, a resin material, or a multilayer board material, etc. The organic encapsulation layer 17 can be a single layer, a multilayer, a composite layer, etc.

[0061] In one embodiment, the display panel further includes an inorganic encapsulation layer 18, which is located on the side of the organic encapsulation layer 17 facing away from the substrate 11. The orthographic projection of the inorganic encapsulation layer 18 onto the substrate 11 covers the orthographic projection of the organic encapsulation layer 17 onto the substrate 11. Exemplarily, the material of the inorganic encapsulation layer 18 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer 18 can be a single layer, multiple layers, composite layers, etc.

[0062] Figure 3a This is a partial cross-sectional structural diagram of the display panel provided in the third embodiment of this application. Figure 3b This is a partial cross-sectional structural diagram of the display panel provided in the fourth embodiment of this application. For example... Figure 3a and Figure 3b As shown, in one embodiment, the protective layer 14 also covers the sidewall of the second part 122.

[0063] In one embodiment, the protective layer 14 also covers at least a portion of the surface of the second part 122 that is away from the substrate 11.

[0064] As a way, such as Figure 3a As shown, the protective layer 14 covers the entire surface of the second part 122 that is away from the substrate 11.

[0065] As a way, such as Figure 3b As shown, the orthographic projection of the protective layer 14 on the substrate 11 surrounds the orthographic projection of the second electrode 132 on the substrate 11. Specifically, the protective layer 14 has a plurality of protective portions 141, and adjacent protective portions 141 are disconnected on the side of the isolation structure 12 away from the substrate 11.

[0066] In one embodiment, the protective layer 14 is also located on the surface of the second part 122 facing the substrate 11.

[0067] In one specific embodiment, the orthographic projection of the protective layer 14 on the substrate 11 of the surface of the second part 122 facing the substrate 11 and the orthographic projection of the surface of the first part 121 facing away from the substrate 11 on the substrate 11 do not overlap.

[0068] Furthermore, the orthographic projection of the protective layer 14 on the surface of the second part 122 facing the substrate 11 onto the substrate 11 is connected to the orthographic projection of the surface of the first part 121 facing away from the substrate 11 onto the substrate 11.

[0069] In one embodiment, the protective layer 14 is also located on the surface of the pixel definition layer 15 facing away from the substrate 11.

[0070] In one specific embodiment, the orthographic projection of the protective layer 14 on the substrate 11 on the surface of the pixel definition layer 15 facing away from the substrate 11 and the orthographic projection of the surface of the first part 121 facing the substrate 11 on the substrate 11 do not overlap.

[0071] Furthermore, the orthographic projection of the protective layer 14 on the substrate 11 of the surface of the pixel definition layer 15 facing away from the substrate 11 and the orthographic projection of the surface of the first part 121 facing the substrate 11 on the substrate 11 are connected.

[0072] Figure 4 This is a partial cross-sectional structural diagram of the display panel provided in the fifth embodiment of this application. For example... Figure 4 As shown, in one embodiment, the isolation structure 12 further includes a third portion 123 located on the side of the first portion 121 near the substrate 11, with the orthographic projection of the first portion 121 onto the substrate 11 falling within the orthographic projection range of the third portion 123 onto the substrate 11. The material of the third portion 123 includes molybdenum or titanium. For example, the first portion 121 is a conductive film layer made of aluminum, and the third portion 123 is a conductive film layer made of molybdenum. In this case, the cross-section of the isolation structure 12 is I-shaped. Of course, in other embodiments, the third portion 123 is a conductive film layer made of titanium.

[0073] In one embodiment, the protective layer 14 also covers the sidewall of the third part 123.

[0074] In one embodiment, the protective layer 14 is also located on the surface of the third part 123 opposite to the substrate 11.

[0075] In one specific embodiment, the orthographic projection of the protective layer on the substrate 11 of the surface of the third part 123 facing away from the substrate 11 and the orthographic projection of the surface of the first part 121 facing the substrate 11 on the substrate 11 do not overlap.

[0076] Furthermore, the orthographic projection of the protective layer on the surface of the third part 123 facing away from the substrate 11 onto the substrate 11 is connected to the orthographic projection of the surface of the first part 121 facing the substrate 11 onto the substrate 11.

[0077] In one embodiment, the orthographic projection of the protective layer 14 on the substrate 11 on the surface of the pixel definition layer 15 facing away from the substrate 11 and the orthographic projection of the surface of the third part 123 facing the substrate 11 on the substrate 11 do not overlap.

[0078] Furthermore, the orthographic projection of the protective layer 14 on the substrate 11 of the surface of the pixel definition layer 15 facing away from the substrate 11 and the orthographic projection of the surface of the third part 123 facing the substrate 11 on the substrate 11 are connected.

[0079] This application embodiment also provides a display panel, which includes a substrate 11, an isolation structure 12, light-emitting devices 13, and a protective layer 14. The isolation structure 12 is located on one side of the substrate 11 and encloses an isolation opening Q. At least a portion of the light-emitting devices 13 are located within the isolation opening Q. The protective layer 14 is located at least on the side of the isolation structure 12 away from the substrate 11 and covers the surface of the isolation structure 12 away from the substrate 11 and the sidewall of the isolation structure 12.

[0080] In one embodiment, the display panel further includes a pixel definition layer 15 located on the side of the isolation structure 12 close to the substrate 11, and a protective layer 14 located on a portion of the surface of the pixel definition layer 15 facing away from the substrate 11.

[0081] In one embodiment, the display panel further includes at least one of a cover plate, a polarizer, an optical adhesive layer, and a touch layer.

[0082] The display panel provided according to the embodiments of this application belongs to the same inventive concept as the display panel provided in the foregoing embodiments of this application, and has corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of this display panel can be found in the embodiments section of the foregoing display panel, and will not be repeated here.

[0083] This application embodiment also provides a display panel. Figure 5 This is a partial cross-sectional structural diagram of the display panel provided in the sixth embodiment of this application. (See diagram below.) Figure 5As shown, the display panel includes a substrate 11, an isolation structure 12, and a light-emitting device 13. The isolation structure 12 is located on one side of the substrate 11 and encloses an isolation opening Q. The isolation structure 12 includes a first part 121 and a second part 122. The first part 121 is located on the side of the second part 122 closer to the substrate 11. The material of the first part 121 includes at least one of molybdenum, titanium, alloy materials, and indium tin oxide. The light-emitting device 13 is at least partially located within the isolation opening Q.

[0084] In one embodiment, the isolation structure 12 further includes a third part 123 located on the side of the first part 121 close to the substrate 11, and the orthographic projection of the first part 121 on the substrate 11 is within the orthographic projection range of the third part 123 on the substrate 11.

[0085] In one embodiment, the light-emitting device 13 includes a first electrode 131 and a second electrode 132 stacked together, and at least one organic light-emitting functional layer 133 located between the first electrode 131 and the second electrode 132, wherein the second electrode 132 is located on the side of the first electrode 131 facing away from the substrate 11. The first electrode 131 may be an anode, and the second electrode 132 may be a cathode.

[0086] In one embodiment, the second electrode 132 and the first part 121 are connected.

[0087] The display panel provided according to the embodiments of this application belongs to the same inventive concept as the display panel provided in the foregoing embodiments of this application, and has corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of this display panel can be found in the embodiments section of the foregoing display panel, and will not be repeated here.

[0088] This application also provides a method for manufacturing a display panel. Figure 6 This is a flowchart illustrating a method for fabricating a display panel according to the first embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 6 As shown, the preparation method includes:

[0089] Step S610: An isolation structure is prepared on one side of a substrate. The substrate includes a first electrode, and the isolation structure encloses an isolation opening. The isolation structure includes a first part and a second part.

[0090] In step S620, a protective material layer is prepared on the side of the isolation structure away from the substrate, and the protective material layer is patterned to obtain a protective layer that at least covers the sidewall of the first part.

[0091] In step S630, a light-emitting layer, a second electrode, and an inorganic encapsulation part are sequentially prepared within the isolation opening.

[0092] Figures 7a to 7cThis is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application. For example... Figures 7a to 7c As shown, the preparation method specifically includes:

[0093] Please refer to step S610. Figure 7a The substrate 11 includes a first electrode 131. An isolation structure 12 encloses an isolation opening Q. The isolation structure 12 includes a first part 121 and a second part 122. The first part 121 is located on the side of the second part 122 closer to the substrate 11.

[0094] An isolation structure material layer is prepared using a film-forming process, and then the isolation structure material layer is patterned to obtain the isolation structure 12. For example, a groove can be first formed on the isolation structure material layer using a dry etching process, and then the sidewalls of the groove can be further etched using a wet etching process to form an undercut structure.

[0095] Please refer to step S620. Figure 7b A protective material layer is prepared on the side of the isolation structure 12 away from the substrate 11, and the protective material layer is patterned to obtain a protective layer 14, which at least covers the sidewall of the first part 121.

[0096] Please refer to step S630. Figure 7c Within the isolation opening Q, a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer are sequentially prepared, and the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer are patterned to obtain a light-emitting layer 130, a second electrode 132, and an inorganic encapsulation part 16.

[0097] The light-emitting layer 130 includes at least one organic light-emitting functional layer 133, which can be at least one of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.

[0098] In one embodiment, the preparation method further includes the step of preparing an organic encapsulation layer and an inorganic encapsulation layer on the side of the inorganic encapsulation portion 16 away from the substrate 11.

[0099] Figure 8 This is a flowchart of the method for manufacturing a display panel according to the second embodiment of this application. Figure 8 As shown, the preparation method includes:

[0100] Step S601: Prepare a pixel definition material layer on one side of the substrate.

[0101] Step S611: Prepare an isolation structure on the side of the pixel definition material layer away from the substrate.

[0102] Step S621: Prepare a protective material layer on the side of the isolation structure away from the substrate.

[0103] Step S622: Simultaneously, the protective material layer and the pixel definition material layer are patterned to obtain the pixel definition layer and the protective layer. The orthographic projection of the protective layer on the substrate covers the surface of the isolation structure facing away from the substrate, the sidewall of the isolation structure, and a portion of the surface of the pixel definition layer facing away from the substrate.

[0104] In step S630, a light-emitting layer, a second electrode, and an inorganic encapsulation part are sequentially prepared within the isolation opening.

[0105] Figures 9a to 9e This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application. For example... Figures 9a to 9e As shown, the preparation method specifically includes:

[0106] Please refer to step S601. Figure 9a A pixel definition material layer 150 is prepared on the substrate 11.

[0107] Please refer to step S611. Figure 9b An isolation structure is fabricated on the side of the pixel definition material layer 150 facing away from the substrate 11.

[0108] Specifically, an isolation structure material layer is prepared using a film-forming process, and then the isolation structure material layer is patterned to obtain the isolation structure 12. For example, a groove can be formed on the isolation structure material layer using a dry etching process first, and then the sidewalls of the groove can be further etched using a wet etching process to form an undercut structure.

[0109] Please refer to step S621. Figure 9c A protective material layer 140 is prepared on the side of the isolation structure 12 away from the substrate 11.

[0110] Please refer to step S622. Figure 9d Simultaneously, the protective material layer 140 and the pixel definition material layer 150 are patterned to obtain the protective layer 14 and the pixel definition layer 15. The protective layer 14 covers the surface of the isolation structure 12 facing away from the substrate 11, the sidewall of the isolation structure 12, and a portion of the surface of the pixel definition layer 15 facing away from the substrate 11. This method simplifies the process by simultaneously patterning the protective material layer 140 and the pixel definition material layer 150 in a single etching operation.

[0111] Please refer to step S630. Figure 9e Within the isolation opening Q, a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer are sequentially prepared, and the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer are patterned to obtain a light-emitting layer 130, a second electrode 132, and an inorganic encapsulation part 16.

[0112] The light-emitting layer 130 includes at least one organic light-emitting functional layer 133, which can be at least one of a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer.

[0113] In one embodiment, the preparation method further includes the step of preparing an organic encapsulation layer and an inorganic encapsulation layer on the side of the inorganic encapsulation portion 16 away from the substrate 11.

[0114] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 10 As shown, the display device is a product with image display capabilities. For example, the display device can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0115] Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.

[0116] The display device includes the display panel 100 provided in any of the above embodiments or the display panel 100 obtained by the manufacturing method provided in any of the above embodiments. The display panel 100 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0117] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0118] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0119] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized by, The application relates to a light emitting device, comprising: a substrate; an isolation structure on one side of the substrate, the isolation structure enclosing an isolation opening; the isolation structure comprises a first part and a second part, the first part is on the side of the second part close to the substrate; a light emitting device at least partially in the isolation opening; and a protective layer covering at least the sidewall of the first part and between the first part and the light emitting device. The material of the protective layer is conductive material; 2. The display panel of claim 1, wherein, Preferably, the material of the protective layer has a greater oxidation resistance than the material of the first part; Preferably, the material of the protective layer comprises at least one of molybdenum, titanium, alloy material and indium tin oxide. The orthographic projection of the first part on the substrate is within the orthographic projection of the second part on the substrate; 3. The display panel of claim 1, wherein, Preferably, the material of the first part comprises aluminum; Preferably, the material of the second part comprises titanium or molybdenum. The protective layer also covers the sidewall of the second part; 4. The display panel of claim 3, wherein, Preferably, the protective layer also covers at least part of the surface on the side of the second part away from the substrate; Preferably, the protective layer is also on the surface on the side of the second part towards the substrate; Preferably, the orthographic projection of the protective layer on the surface on the side of the second part towards the substrate and the orthographic projection of the surface on the side of the first part away from the substrate on the substrate do not overlap; Preferably, the orthographic projection of the protective layer on the surface on the side of the second part towards the substrate and the orthographic projection of the surface on the side of the first part away from the substrate on the substrate are connected. The isolation structure further comprises a third part on the side of the first part close to the substrate, the orthographic projection of the first part on the substrate is within the orthographic projection of the third part on the substrate; 5. The display panel of claim 3, wherein, Preferably, the material of the third part comprises molybdenum or titanium. The protective layer also covers the sidewall of the third part; 6. The display panel of claim 5, wherein, Preferably, the protective layer is also on the surface on the side of the third part away from the substrate; Preferably, the orthographic projection of the protective layer on the surface on the side of the third part away from the substrate and the orthographic projection of the surface on the side of the first part towards the substrate on the substrate do not overlap; Preferably, the orthographic projection of the protective layer on the surface on the side of the third part away from the substrate and the orthographic projection of the surface on the side of the first part towards the substrate on the substrate are connected. Further comprising a pixel definition layer on the side of the isolation structure close to the substrate, the pixel definition layer enclosing a pixel opening, the orthographic projection of the isolation opening on the substrate covers the orthographic projection of the pixel opening on the substrate; 7. The display panel of claim 1, wherein, Preferably, the material of the pixel definition layer comprises inorganic material. The protective layer is also on the surface on the side of the pixel definition layer away from the substrate; 8. The display panel of claim 7, wherein, Preferably, the orthographic projection of the protective layer on the surface on the side of the pixel definition layer away from the substrate and the orthographic projection of the surface on the side of the first part towards the substrate on the substrate do not overlap; ​ Preferably, the orthogonal projection of the protective layer on the substrate, which is located on the surface of the pixel definition layer away from the substrate, and the orthogonal projection of the first portion on the substrate, which is located on the surface of the first portion away from the substrate, are connected.

9. The display panel of claim 8, wherein, The isolation structure further comprises a third portion, which is located on the side of the first portion close to the substrate; Preferably, the orthogonal projection of the protective layer on the substrate, which is located on the surface of the pixel definition layer away from the substrate, and the orthogonal projection of the third portion on the substrate, which is located on the surface of the third portion away from the substrate, do not overlap. Preferably, the orthogonal projection of the protective layer on the substrate, which is located on the surface of the pixel definition layer away from the substrate, and the orthogonal projection of the third portion on the substrate, which is located on the surface of the third portion away from the substrate, are connected.

10. The display panel of claim 1, wherein, The light-emitting device comprises a first electrode and a second electrode arranged in a stack, the second electrode being located on the side of the first electrode away from the substrate; Preferably, the second electrode and the first portion are electrically connected; Preferably, the second electrode and the protective layer are overlapped; Preferably, the orthogonal projection of the protective layer on the substrate surrounds the orthogonal projection of the second electrode on the substrate; Preferably, the protective layer comprises a plurality of protective portions, and adjacent protective portions are disconnected on the side of the isolation structure away from the substrate.

11. The display panel of claim 10, wherein, Further comprising an inorganic encapsulation portion, which is located on the side of the second electrode away from the substrate and extends to the side of the isolation structure away from the substrate, and the orthogonal projection of the inorganic encapsulation portion on the substrate covers the orthogonal projection of the second electrode on the substrate; Preferably, a plurality of inorganic encapsulation portions are arranged at intervals; Preferably, a plurality of inorganic encapsulation portions and a plurality of light-emitting devices correspond one-to-one.

12. The display panel of claim 11, wherein, Further comprising an organic encapsulation layer, which is located on the side of the inorganic encapsulation portion away from the substrate, and the orthogonal projection of the organic encapsulation layer on the substrate covers the orthogonal projection of the inorganic encapsulation portion on the substrate; Preferably, the display panel further comprises an inorganic encapsulation layer, which is located on the side of the organic encapsulation layer away from the substrate, and the orthogonal projection of the inorganic encapsulation layer on the substrate covers the orthogonal projection of the organic encapsulation layer on the substrate.

13. A display panel, characterized by Comprise: a substrate; an isolation structure, which is located on the side of the substrate, and which encloses an isolation opening; a light-emitting device, which is at least partially located in the isolation opening; a protective layer, which is at least located on the side of the isolation structure away from the substrate, and which covers the surface of the isolation structure away from the substrate and the sidewall of the isolation structure.

14. The display panel of claim 13, wherein, Further comprising a pixel definition layer, which is located on the side of the isolation structure close to the substrate; Preferably, the protective layer is also located on part of the surface of the pixel definition layer away from the substrate.

15. A display panel, characterized by Comprise: a substrate; an isolation structure, which is located on the side of the substrate, and which encloses an isolation opening; The isolation structure comprises a first portion and a second portion, the first portion is located on the side of the second portion close to the substrate; the material of the first portion comprises at least one of molybdenum, titanium, alloy material, and indium tin oxide; and a light-emitting device, which is at least partially located in the isolation opening.

16. The display panel of claim 15, wherein, The isolation structure further comprises a third part located on the side of the first part close to the substrate, and a normal projection of the first part on the substrate is located within a normal projection range of the third part on the substrate. Preferably, the light-emitting device comprises a first electrode and a second electrode arranged in a stack, and the second electrode is located on the side of the first electrode away from the substrate. Preferably, the second electrode and the first part are overlapped.

17. A method for manufacturing a display panel, characterized by, Comprise: An isolation structure is prepared on the side of a substrate, the substrate comprises a first electrode, the isolation structure encloses an isolation opening, and the isolation structure comprises a first part and a second part, the first part is located on the side of the second part close to the substrate; A protective material layer is prepared on the side of the isolation structure away from the substrate, and the protective material layer is patterned to obtain a protective layer, the protective layer covers at least the sidewall of the first part; A light-emitting layer, a second electrode and an inorganic encapsulating part are sequentially prepared in the isolation opening.

18. The method of claim 17, wherein, The sequentially preparing a light-emitting layer, a second electrode and an inorganic encapsulating part in the isolation opening comprises: A light-emitting material layer, a second electrode material layer and an inorganic encapsulating material layer are sequentially prepared in the isolation opening, and the inorganic encapsulating material layer, the second electrode material layer and the light-emitting material layer are patterned to obtain the light-emitting layer, the second electrode and the inorganic encapsulating part; Preferably, before the preparing an isolation structure on the side of the substrate, the method further comprises: A pixel definition material layer is prepared on the side of the substrate; The preparing an isolation structure on the side of the substrate comprises: An isolation structure is prepared on the side of the pixel definition material layer away from the substrate; The preparing a protective material layer on the side of the isolation structure away from the substrate, and patterning the protective material layer to obtain a protective layer comprises: A protective material layer is prepared on the side of the isolation structure away from the substrate; The protective material layer and the pixel definition material layer are patterned at the same time to obtain the pixel definition layer and the protective layer, the protective layer covers the surface of the isolation structure away from the substrate, the sidewall of the isolation structure, and part of the surface of the pixel definition layer away from the substrate.

19. A display device comprising: The display panel of any one of claims 1-16, or the display panel obtained by the preparation method of claim 17 or 18.

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