Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel includes: a substrate; the isolation structure is arranged on one side of the substrate, and a plurality of isolation openings are defined by the isolation structure; a plurality of light-emitting devices, wherein at least part of the light-emitting devices are arranged in the corresponding isolation openings; and the shading layer is arranged on one side, deviating from the substrate, of the isolation structure. The light shielding layer is arranged to absorb the reflected light of the residual metal material on the isolation structure, so that the defect performance of the display panel is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] An organic light-emitting diode (OLED) is a kind of organic thin film electroluminescent device, which has attracted great attention and been widely used in electronic display products due to its advantages of low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, the inventors found that the current display panel still has a defect performance to be improved. SUMMARY

[0004] The purpose of the present application is to provide a display panel, a preparation method thereof and a display device to solve the defect performance of the existing display panel.

[0005] To achieve the above-mentioned purpose, the present application provides a display panel, comprising: a substrate; an isolation structure arranged on one side of the substrate, the isolation structure enclosing a plurality of isolated openings; a plurality of light emitting devices, at least part of the light emitting devices being arranged in the corresponding isolated openings; and a light shielding layer arranged on the side of the isolation structure away from the substrate.

[0006] Further, the display panel further comprises: a first encapsulation layer comprising a plurality of first encapsulation portions, the first encapsulation portion being located on the side of the light emitting device away from the substrate and extending from the side wall of the isolation structure to the side of the isolation structure away from the substrate; wherein, on the side of the isolation structure away from the substrate, the light shielding layer extends from the side of the isolation structure away from the substrate to the side of the first encapsulation portion away from the substrate; preferably, on the side of the isolation structure away from the substrate, the maximum film thickness of the first encapsulation portion is less than the maximum film thickness of the light shielding layer.

[0007] Preferably, the display panel further comprises: a pixel defining layer arranged on one side of the substrate, comprising a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion, the pixel opening and the corresponding isolated opening being in communication; wherein, the part of the first encapsulation portion on the orthographic projection of the pixel defining portion is located outside the orthographic projection of the light shielding layer on the pixel defining portion.

[0008] Further, the first encapsulation portion and the side of the isolation structure away from the substrate have a first gap, and the orthographic projection of the light shielding layer on the substrate covers the orthographic projection of the periphery of the first gap on the substrate.

[0009] Further, the display panel further comprises a pixel defining layer disposed on one side of the substrate, comprising a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion, the pixel opening and the corresponding isolation opening are in communication; wherein the light shielding layer on the substrate is located outside the pixel opening on the substrate.

[0010] Further, the isolation structure comprises a support portion disposed on one side of the substrate, and a blocking portion disposed on one side of the support portion away from the substrate, the blocking portion protrudes from the support portion towards the isolation opening; preferably, the material of the support portion and the blocking portion comprises conductive material; preferably, the material of the support portion comprises aluminum, and the material of the blocking portion comprises titanium.

[0011] Further, the light shielding layer on the substrate covers the blocking portion on the substrate; preferably, the light shielding layer comprises a first light shielding portion, the first light shielding portion forms a plurality of first light shielding openings, the first light shielding opening and the corresponding isolation opening are in communication; preferably, the light shielding layer on the substrate covers the isolation structure on the substrate; preferably, the blocking portion on the substrate covers the support portion on the substrate.

[0012] Further, the light emitting device comprises a first electrode disposed on one side of the substrate, part of the first electrode is located between the pixel defining portion and the substrate, and the other part is exposed from the corresponding pixel opening; wherein the projection of the isolation structure on the substrate and the projection of the first electrode on the substrate have an overlapping part; preferably, the edge of the first electrode on the substrate is located within the projection of the isolation structure on the substrate.

[0013] Further, the light-emitting device comprises: a light-emitting layer and a second electrode which are sequentially stacked in a direction away from the substrate, the second electrode being overlapped with the isolation structure; preferably, the first gap comprises a filling portion, a material of the filling portion being the same as a material of the second electrode; preferably, a volume of the filling portion is less than a volume of the first gap; preferably, the isolation structure comprises a support portion and a barrier portion which are sequentially stacked in a direction away from the substrate, the barrier portion being protruded from the support portion towards the isolation opening, wherein a second gap is between a normal projection of the light-emitting layer on the substrate and a normal projection of the support portion on the substrate; preferably, the second gap is filled by the second electrode; preferably, the isolation structure further comprises a conductive portion which is disposed on a side of the support portion away from the substrate, the conductive portion being protruded from the support portion towards the isolation opening, wherein the second electrode is overlapped with the support portion and / or the second electrode is overlapped with the conductive portion; preferably, the second gap comprises a sub-gap, a normal projection of the sub-gap on the substrate being between the normal projection of the light-emitting layer on the substrate and a normal projection of the conductive portion on the substrate.

[0014] Further, a reflectivity of the light-shielding layer is less than a reflectivity of the second electrode.

[0015] Further, a material of the light-shielding layer comprises a black light-absorbing material.

[0016] Further, on a side of the isolation structure away from the substrate, the first encapsulation portion comprises a first side surface towards the isolation opening, the light-shielding layer comprises a second side surface towards the isolation opening, the first side surface and the second side surface are not coplanar.

[0017] Further, the display panel further comprises: a second encapsulation layer which is disposed on a side of the first encapsulation layer and the light-shielding layer away from the substrate; wherein a distance between a surface of the second encapsulation layer away from the substrate and the substrate is not less than a distance between a surface of the light-shielding layer away from the substrate and the substrate.

[0018] Further, the display panel further comprises: a third encapsulation layer which is disposed on a side of the second encapsulation layer away from the substrate; preferably, a material of the first encapsulation layer and the third encapsulation layer comprises an inorganic material, and a material of the second encapsulation layer comprises an organic material.

[0019] Further, the light-shielding layer comprises: a plurality of second light-shielding portions, the second light-shielding portions enclosing a second light-shielding opening, the second light-shielding opening being in communication with the corresponding isolation opening; preferably, a part of a normal projection of the isolation structure on the substrate is located outside of normal projections of the plurality of second light-shielding portions on the substrate.

[0020] The present invention also provides a method for manufacturing a display panel, which includes the following steps: providing a substrate; forming an isolation structure on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; forming a plurality of light-emitting devices located within the plurality of isolation openings; and forming a light-shielding layer on the side of the isolation structure opposite to the substrate.

[0021] Furthermore, after the step of forming multiple light-emitting devices located within the multiple isolation openings, the method further includes: forming a first encapsulation layer located on the side of the multiple light-emitting devices facing away from the substrate, wherein the first encapsulation layer includes multiple first encapsulation portions located on the side of the corresponding light-emitting device facing away from the substrate, and extending from the sidewall of the isolation structure to the side of the isolation structure facing away from the substrate.

[0022] Furthermore, the step of forming the light-shielding layer on the side of the isolation structure away from the substrate includes: coating a layer of black light-absorbing material on the surface of the first encapsulation layer and the isolation structure away from the substrate; and exposing and developing the black light-absorbing material to form the light-shielding layer.

[0023] Furthermore, after the step of forming a light-shielding layer on the side of the isolation structure away from the substrate, the method further includes: forming a second encapsulation layer located on the side of the first encapsulation layer and the light-shielding layer away from the substrate, wherein the distance between the surface of the second encapsulation layer away from the substrate and the substrate is not less than the distance between the surface of the light-shielding layer away from the substrate and the substrate.

[0024] Further, the step of forming an isolation structure on one side of the substrate includes: forming a support material layer and a blocking material layer on one side of the substrate; sequentially patterning the blocking material layer and the support material layer to form a blocking portion and a support portion, wherein the blocking portion protrudes from the support portion toward the isolation opening.

[0025] The present invention also provides a display device, the display device comprising the display panel as described above.

[0026] The advantage of this invention is that it improves the display performance of the display panel by absorbing the reflected light from residual metal materials through a light-shielding layer on the isolation structure. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the layered structure of the display panel in an embodiment of the present invention;

[0029] Figure 2 for Figure 1 An enlarged schematic diagram of part of the structure of the central display panel;

[0030] Figure 3 This is a layered schematic diagram of the display panel in another embodiment of the present invention;

[0031] Figure 4 for Figure 3 An enlarged schematic diagram of part of the structure of the central display panel;

[0032] Figure 5 This is a schematic diagram showing the distribution between the light-emitting devices and the light-shielding layer of the display panel in an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram showing the distribution between the light-emitting devices and the light-shielding layer of the display panel in another embodiment of the present invention;

[0034] Figure 7 This is a schematic flowchart of the display panel manufacturing method in an embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram of the photomask of the display panel in step S50 of this embodiment of the invention.

[0036] Figure 9 for Figure 2 A schematic diagram showing the residual condition of the filler area within the dashed box after the wet etching process;

[0037] Figure 10 for Figure 2 A schematic diagram showing the residual condition of the filling area within the dashed box after the dry etching process.

[0038] The components in the diagram are shown below:

[0039] Display panel 1; Substrate 10;

[0040] Pixel limiting layer 11; Pixel opening 12;

[0041] Light-emitting devices: 20, 20R, 20G, 20B;

[0042] First electrode 21; Light-emitting layer 22;

[0043] Second electrode 23; Isolation structure 30;

[0044] Support 31; Barrier layer 32;

[0045] Conductive part 33; Isolation opening 34;

[0046] First encapsulation layer 40; First encapsulation part 41;

[0047] First gap 42; Second gap 43;

[0048] Sub-gap 431; Third gap 44;

[0049] First side surface 45; Filling part 231;

[0050] Light-shielding layer 50; First light-shielding part 51;

[0051] First light-shielding opening 52; Second light-shielding part 53;

[0052] Second light-shielding opening 54; Second side 55;

[0053] Second encapsulation layer 60; Third encapsulation layer 70;

[0054] Mask template 2. Detailed Implementation

[0055] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0056] In related display technologies, to achieve high resolution and color in OLED (Organic Light-Emitting Diode) and to better address issues such as low resolution of the OLED cathode film and low device yield, a cathode isolation structure has been introduced. This involves creating an isolation structure on the substrate before depositing the organic thin film and metal cathode, instead of using a metal mask during device fabrication. This isolation structure separates different pixels, forming a pixel array. However, the inventors discovered in actual production that residual metal material remains on the isolation structure, especially under the encapsulation layer. This residual metal cannot be completely removed, leading to varying intensities of reflected light on the isolation structure and consequently causing abnormal background color in the display panel.

[0057] Based on the technical problems discovered in the aforementioned related display technologies, this embodiment of the invention provides a display panel 1, such as...Figure 1 As shown, the display panel 1 includes a substrate 10, an isolation structure 30, multiple light-emitting devices 20, and a light-shielding layer 50. The substrate 10 drives the light-emitting devices 20. The isolation structure 30 is disposed on one side of the substrate 10 and encloses multiple isolation openings 34, which block vapor-deposited materials and disconnect the vapor-deposited materials in adjacent isolation openings 34, thereby isolating the multiple light-emitting devices 20. At least a portion of each light-emitting device 20 is disposed within a corresponding isolation opening 34, and each light-emitting device 20, as an independent light-emitting unit, can be turned on or off according to a corresponding display signal under the drive of the substrate 10. The light-shielding layer 50 is disposed on the side of the isolation structure 30 facing away from the substrate 10 and is used to absorb light reflected by residual metal materials on the isolation structure 30. (The composition and preparation of the isolation structure 30 mentioned below are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 for reference.)

[0058] The substrate 10 is an array substrate, comprising multiple thin-film transistors arranged in an array, with each light-emitting device 20 electrically connected to at least one thin-film transistor. The substrate 10 also includes signal traces, one end of which is electrically connected to a driver chip, and the other end to a thin-film transistor. The driver chip transmits display signals to the corresponding thin-film transistors via the signal traces. The thin-film transistors then activate the corresponding light-emitting devices 20 according to the display signals, thereby illuminating the light-emitting devices 20 at the corresponding positions and forming an image. Simultaneously, the driver chip can also change the displayed image by sending different display signals.

[0059] The display panel 1 also includes a pixel defining layer 11 disposed on one side of the substrate 10. The pixel defining layer 11 includes a pixel defining portion and a plurality of pixel openings 12 formed by the pixel defining portion. At least a portion of the light-emitting device 20 is disposed in the pixel opening 12. An isolation structure 30 is disposed on the side of the pixel defining layer 11 facing away from the substrate 10, and the isolation opening 34 formed therein communicates with the corresponding pixel opening 12, enabling the material in the light-emitting device 20 to be deposited in the pixel opening 12.

[0060] The light-emitting device 20 includes a first electrode 21, a light-emitting layer 22, and a second electrode 23. The first electrode 21 is disposed on one side of the substrate 10, with a portion of the first electrode 21 located between the pixel defining portion and the substrate 10, and the other portion exposed in the corresponding pixel opening 12. The light-emitting layer 22 is disposed in the corresponding pixel opening 12, covering the exposed surface of the first electrode 21 in the corresponding pixel opening 12, and extending from the surface of the first electrode 21 to the side of the pixel defining portion facing away from the substrate 10. The second electrode 23 is stacked on the side of the light-emitting layer 22 facing away from the substrate 10, and extends from the surface of the light-emitting layer 22 facing away from the substrate 10 to the surface of the isolation structure 30 facing the isolation opening 34, thereby allowing the second electrode 23 to overlap with the isolation structure 30. The orthographic projection of the isolation structure 30 on the substrate 10 overlaps with the orthographic projection of the first electrode 21 on the substrate 10. That is, the edge of the orthographic projection of the first electrode 21 on the substrate 10 is located within the orthographic projection of the isolation structure 30 on the substrate 10. This prevents poor packaging reliability due to uneven top surface of the blocking part, and at the same time shortens the spacing between two adjacent light-emitting devices 20, thereby increasing the density of light-emitting devices 20 in the display panel 1 and improving the resolution of the display panel 1.

[0061] Specifically, the isolation structure 30 includes a support portion 31 and a blocking portion, which surround the pixel opening 12. The support portion 31 is disposed on the side of the pixel defining layer 11 facing away from the substrate 10, and the blocking portion is stacked and disposed on the side of the support portion 31 facing away from the substrate 10. The materials of the support portion 31 and the blocking portion include conductive materials; preferably, the material of the support portion 31 can be aluminum, and the material of the blocking portion can be titanium. Figure 2 As shown, a second gap 43 exists between the orthographic projection of the light-emitting layer 22 onto the substrate 10 and the orthographic projection of the support portion 31 onto the substrate 10. The second electrode 23 fills this second gap 43 and extends from the second gap 43 to the sidewall of the support portion 31, thereby enabling the second electrode 23 to be electrically connected to the support portion 31. The second electrode 23 can obtain a power signal through the support portion 31. The support portion 31 located between two adjacent pixel openings 12 has a trapezoidal cross-sectional profile, and the width of the support portion 31 near the blocking portion is smaller than its width near the substrate 10, to facilitate the climbing of the second electrode 23 and reduce the difficulty of overlapping between the second electrode 23 and the support portion 31.

[0062] The blocking portion protrudes from the support portion 31 at one end facing the isolation opening 34. That is, the orthogonal projection of the blocking portion on the substrate 10 covers the orthogonal projection of the support portion 31 on the substrate 10, and the orthogonal projection area of ​​the blocking portion on the substrate 10 is larger than the orthogonal projection area of ​​the support portion 31 on the substrate 10. This allows the blocking portion to completely block the support portion 31, thereby preventing the material of the light-emitting layer 22 from being deposited onto the support portion 31 when the light-emitting layer 22 is prepared. When the second electrode 23 is prepared, the deposition angle of the material of the second electrode 23 can be adjusted to make the coverage area of ​​the second electrode 23 larger than the coverage area of ​​the light-emitting layer 22, so as to form a light-emitting layer 22 and a second electrode 23 with different coverage areas, thereby improving the bonding yield between the second electrode 23 and the support portion 31.

[0063] Furthermore, in another embodiment of the invention, such as Figure 3 and Figure 4 As shown, the isolation structure 30 may further include a conductive portion 33 disposed on the side of the support portion 31 facing the substrate 10. The conductive portion 33 protrudes from the support portion 31 toward the isolation opening 34. The second electrode 23 can be electrically connected to the support portion 31 by overlapping with the conductive portion 33. The second gap 43 includes a sub-gap 431. The orthographic projection of the sub-gap 431 on the substrate 10 is located between the orthographic projection of the light-emitting layer 22 on the substrate 10 and the orthographic projection of the conductive portion 33 on the substrate 10. The second electrode 23 fills the sub-gap 431 and extends from the sub-gap 431 to the surface of the conductive portion 33, thereby facilitating the electrical connection between the second electrode 23 and the conductive portion 33.

[0064] like Figure 1As shown, the display panel 1 also includes a first encapsulation layer 40, a second encapsulation layer 60, and a third encapsulation layer 70. The first encapsulation layer 40 includes a plurality of first encapsulation portions 41, each located on the side of the corresponding light-emitting device 20 facing away from the substrate 10, and extending from the sidewall of the isolation structure 30 to the side of the isolation structure 30 facing away from the substrate 10. The second encapsulation layer 60 is located on the side of the first encapsulation layer 40 and the light-shielding layer 50 facing away from the substrate 10. The third encapsulation layer 70 is located on the side of the second encapsulation layer 60 facing away from the substrate 10. The portion of the first encapsulation portion 41 projected onto the pixel defining portion is outside the projection of the light-shielding layer 50 onto the pixel defining portion. The distance between the surface of the second encapsulation layer 60 facing away from the substrate 10 and the substrate 10 is not less than the distance between the surface of the light-shielding layer 50 and the substrate 10, thereby ensuring that at least one of the second encapsulation layer 60 and the third encapsulation layer 70 can cover the light-shielding layer 50, thus preventing water and oxygen from intruding into the panel interior through the light-shielding layer 50. The first encapsulation layer 40 and the third encapsulation layer 70 are made of inorganic materials, while the second encapsulation layer 60 is made of organic materials. The first encapsulation layer 40, the second encapsulation layer 60, and the third encapsulation layer 70 are combined to form a thin film encapsulation (TFE) structure, which is used to encapsulate and protect the light-emitting device 20 and other electronic devices in the display panel 1.

[0065] On the side of the isolation structure 30 facing away from the substrate 10, the light-shielding layer 50 extends from the side of the isolation structure 30 facing away from the substrate 10 to the side of the first packaging portion 41 facing away from the substrate 10. For example... Figure 2 , Figure 9 and Figure 10As shown, a first gap 42 exists between the first encapsulation portion 41 and the side of the isolation structure 30 facing away from the substrate 10. A filling portion 231 is provided within the first gap 42. The volume of the filling portion 231 is smaller than the volume of the first gap 42. This filling portion 231 is the material remaining on the isolation structure 30 during the fabrication of the second electrode 23; therefore, the material of the filling portion 231 is the same as the material of the second electrode 23. The second electrode 23 is typically fabricated using a metal material. Therefore, light reflection occurs on the filling portion 231 remaining on the blocking portion. The reflected light exits from the light-emitting surface of the display panel 1, thus affecting the image quality of the display panel 1. To address this, this embodiment of the invention provides a light-shielding layer 50 on the side of the first encapsulation portion 41 facing away from the substrate 10. The light-shielding layer 50 blocks the filling portion 231, preventing reflected light from affecting the saturation of the normal display light, thereby solving the problem of abnormal background color in the display panel 1. The reflectivity of the light-shielding layer 50 is lower than that of the second electrode 23, ensuring that the light-shielding layer 50 can effectively reduce light reflection at the isolation structure 30. Preferably, the material of the light-shielding layer 50 includes a black light-absorbing material, which can be an organic material, inorganic material, etc. doped with black pigment. The light-shielding layer 50 prepared by this material is also black and can absorb all colors of light.

[0066] like Figure 1 and Figure 2 As shown, the orthographic projection of the light-shielding layer 50 on the substrate 10 covers the orthographic projection of the periphery of the first gap 42 on the substrate 10, thereby enabling the light-shielding layer 50 to block the first gap 42 and prevent reflected light from leaking out. Furthermore, the orthographic projection of the light-shielding layer 50 on the substrate 10 covers the orthographic projection of the blocking portion on the substrate 10, thereby ensuring that the light-shielding layer 50 can completely block the first gap 42, further improving the light-shielding and anti-reflection effect of the light-shielding layer 50, and thus further enhancing the display effect of the display panel 1.

[0067] The first encapsulation layer 40 has a plurality of third gaps 44, and there is a third gap 44 between two adjacent first encapsulation portions 41. The third gaps 44 separate the plurality of first encapsulation portions 41 in the first encapsulation layer 40. The maximum film thickness of the first encapsulation portion 41 is less than the maximum film thickness of the light-shielding layer 50, so that the light-shielding layer 50 can completely fill the third gaps 44 and cover the portion of the first encapsulation portion 41 located on the side of the isolation structure 30 away from the substrate 10.

[0068] The orthographic projection of the light-shielding layer 50 on the substrate 10 is outside the orthographic projection of the pixel opening 12 on the substrate 10, thereby preventing the light-shielding layer 50 from blocking the normal light emission of the light-emitting device 20 and reducing the impact of the light-shielding layer 50 on normal display light. Figure 5As shown, the light-emitting device 20 includes a first light-emitting device 20R for emitting red light, a second light-emitting device 20G for emitting green light, and a third light-emitting device 20B for emitting blue light. The light-emitting devices 20 of different colors are separated by an isolation structure 30. A light-shielding layer 50 disposed on the isolation structure 30 also forms an enclosure surrounding the light-emitting device 20. Specifically, the light-shielding layer 50 includes a first light-shielding portion 51, which encloses a plurality of first light-shielding openings 52. Adjacent first light-shielding openings 52 are connected by the first light-shielding portion 51, causing the orthographic projection of the light-shielding layer 50 on the substrate 10 to cover the orthographic projection of the isolation structure 30 on the substrate 10. The first light-shielding openings 52 communicate with corresponding isolation openings 34, and a light-emitting device 20 is correspondingly disposed in each of the connected first light-shielding openings 52 and isolation openings 34.

[0069] In another embodiment of the invention, such as Figure 6 As described above, the light-emitting device 20 may further include a plurality of second light-shielding portions 53, each of which encloses a second light-shielding opening 54. The second light-shielding opening 54 communicates with the corresponding isolation opening 34, and there is a fourth gap between adjacent second light-shielding openings 54, that is, adjacent second light-shielding portions 53 are not connected. In this case, the portion of the orthographic projection of the isolation structure 30 on the substrate 10 is located outside the orthographic projection of the plurality of second light-shielding portions 53 on the substrate 10. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0070] like Figure 2 As shown, on the side of the isolation structure 30 away from the substrate 10, the first packaging part 41 includes a first side 45 facing the isolation opening 34, and the light-shielding layer 50 includes a second side 55 facing the isolation opening 34. The first side 45 and the second side 55 are not coplanar, which can reduce the patterning difficulty and accuracy when preparing the light-shielding layer 50 and improve production efficiency.

[0071] This invention also provides a method for manufacturing a display panel 1, used to manufacture the display panel 1 as described above. The process of this method for manufacturing the display panel 1 is as follows: Figure 7 As shown, it includes steps S10-S70.

[0072] Step S10) Provide substrate 10:

[0073] A substrate 10 containing multiple thin-film transistors is formed using an array process; at least one layer of conductive material is deposited on one side of the substrate 10, and the formed conductive material layer is patterned to form multiple first electrodes 21 on the surface of the substrate 10; an insulating material covering the first electrodes 21 is deposited on the substrate 10 to form a pixel defining layer 11.

[0074] Step S20) An isolation structure 30 is formed on one side of the substrate 10, and the isolation structure 30 encloses a plurality of isolation openings 34:

[0075] At least two conductive materials are sequentially deposited on the side of the pixel limiting layer 11 away from the substrate 10. For example, a layer of aluminum is deposited first, and a layer of titanium is deposited on the aluminum layer away from the pixel limiting layer 11 to form a support material layer and a blocking material layer. The blocking material layer and the support material layer 31 are sequentially patterned, and a portion of the conductive material above the first electrode 21 is removed to form an isolation opening 34 that penetrates the support material layer 31 and the blocking material layer. The remaining support material layer 31 and the blocking material layer form the blocking part and the support part 31. The blocking part protrudes from the support part 31 toward the isolation opening 34.

[0076] Step S30) Forming multiple light-emitting devices 20 located within multiple isolation openings 34:

[0077] The pixel defining layer 11 is patterned, and part of the pixel defining layer 11 overlapping with the first electrode 21 is removed, thereby forming a pixel opening 12 in the pixel defining layer 11 that exposes part of the first electrode 21, and the pixel opening 12 is connected to the isolation opening 34; an organic light-emitting material covering the exposed surface of the first electrode 21 is deposited in the pixel opening 12 to form a light-emitting layer 22; a metal material is deposited on the side of the light-emitting layer 22 away from the first electrode 21, and by adjusting the evaporation angle, the metal material is extended from the surface of the light-emitting layer 22 to the sidewall of the support portion 31 facing the isolation opening 34 to form a second electrode 23; wherein, the first electrode 21, the light-emitting layer 22 and the second electrode 23 are combined to form a light-emitting device 20.

[0078] Step S40) Forming a first encapsulation layer 40 on the side of the plurality of light-emitting devices 20 facing away from the substrate 10:

[0079] An inorganic material is deposited on the second electrode 23 away from the substrate 10 to form a first encapsulation layer 40; photoresist is coated on the side of the first encapsulation layer 40 away from the substrate 10 and patterned to form a photolithography layer; the first encapsulation layer 40 is patterned to form a first encapsulation portion 41 on the corresponding light-emitting device 20. The first encapsulation portion 41 is located on the side of the corresponding light-emitting device 20 away from the substrate 10 and extends from the sidewall of the isolation structure 30 to the side of the isolation structure 30 away from the substrate 10.

[0080] Step S50) A light-shielding layer 50 is formed on the side of the isolation structure 30 facing away from the substrate 10:

[0081] A layer of black light-absorbing material is coated on the surface of the first encapsulation layer 40 and the isolation structure 30 facing away from the substrate 10 to form a black light-absorbing layer 50'; Figure 8 As shown, the black light-absorbing material is exposed and developed through the mask 2, and the black light-absorbing layer 50' is patterned through the etching process to remove the black light-absorbing layer on the light-emitting device 20, forming the light-shielding layer 50.

[0082] Step S60) Forming a second encapsulation layer 60 on the side of the first encapsulation layer 40 and the light-shielding layer 50 facing away from the substrate 10:

[0083] An organic material is deposited on the side of the first encapsulation layer 40 and the light-shielding layer 50 away from the substrate 10 to form a second encapsulation layer 60; wherein the distance between the surface of the second encapsulation layer 60 away from the substrate 10 and the substrate 10 is not less than the distance between the surface of the light-shielding layer 50 away from the substrate 10 and the substrate 10.

[0084] Step S70) Forming a third encapsulation layer 70 on the side of the second encapsulation layer 60 facing away from the substrate 10:

[0085] An inorganic material is deposited on the side of the second encapsulation layer 60 away from the substrate 10 to form a third encapsulation layer 70.

[0086] This invention also provides a display device, which can be an OLED display device, including the display panel 1 as described above, the display panel 1 being used to display image information for the display device. The display device can be any display device with display functionality, such as a mobile phone, laptop computer, tablet computer, etc.

[0087] In this embodiment of the invention, a light-shielding layer is provided on the isolation structure to absorb the reflected light from the residual metal material, thereby solving the problem of abnormal background color of the display panel caused by the reflected light from the residual metal.

[0088] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A display panel, characterized by, Comprise: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a plurality of light emitting devices, at least part of the light emitting devices disposed in corresponding isolation openings; a light shielding layer disposed on a side of the isolation structure away from the substrate.

2. The display panel of claim 1, wherein, Further comprise: a first encapsulation layer comprising a plurality of first encapsulation portions, the first encapsulation portions located on a side of the light emitting devices away from the substrate and extending from a side wall of the isolation structure to a side of the isolation structure away from the substrate; wherein, on the side of the isolation structure away from the substrate, the light shielding layer extends from the side of the isolation structure away from the substrate to the side of the first encapsulation portions away from the substrate; Preferably, on the side of the isolation structure away from the substrate, the maximum film thickness of the first encapsulation portions is less than the maximum film thickness of the light shielding layer; Preferably, the display panel further comprises: a pixel defining layer disposed on one side of the substrate, comprising a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion, the pixel openings and corresponding isolation openings being in communication; wherein, the part of the first encapsulation portion on the orthographic projection of the pixel defining portion is located outside the orthographic projection of the light shielding layer on the pixel defining portion.

3. The display panel of claim 2, wherein, The first encapsulation portion and the side of the isolation structure away from the substrate have a first gap, and the orthographic projection of the light shielding layer on the substrate covers the orthographic projection of the periphery of the first gap on the substrate.

4. The display panel of claim 1, wherein, Further comprise: a pixel defining layer disposed on one side of the substrate, comprising a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion, the pixel openings and corresponding isolation openings being in communication; wherein, the orthographic projection of the light shielding layer on the substrate is located outside the orthographic projection of the pixel openings on the substrate.

5. The display panel of claim 1, wherein, The isolation structure comprises: a support portion disposed on one side of the substrate; a blocking portion disposed on a side of the support portion away from the substrate, the blocking portion protruding from the support portion towards the isolation openings; Preferably, the material of the support portion and the blocking portion comprises a conductive material; Preferably, the material of the support portion comprises aluminum, and the material of the blocking portion comprises titanium.

6. The display panel of claim 5, wherein, The orthographic projection of the light shielding layer on the substrate covers the orthographic projection of the blocking portion on the substrate; Preferably, the light shielding layer comprises a first light shielding portion, the first light shielding portion enclosing a plurality of first light shielding openings, the first light shielding openings being in communication with corresponding isolation openings; Preferably, the orthographic projection of the light shielding layer on the substrate covers the orthographic projection of the isolation structure on the substrate; Preferably, the orthographic projection of the blocking portion on the substrate covers the orthographic projection of the support portion on the substrate.

7. The display panel of claim 4, wherein, The light emitting device comprises: a first electrode disposed on one side of the substrate, part of the first electrode being located between the pixel defining portion and the substrate, and another part of the first electrode being exposed from the corresponding pixel opening; wherein, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate have an overlapping part; Preferably, an edge of a normal projection of the first electrode on the substrate is located within a normal projection of the isolation structure on the substrate.

8. The display panel of claim 3, wherein, The light emitting device comprises: a light emitting layer and a second electrode which are sequentially stacked in a direction away from the substrate, the second electrode being overlapped with the isolation structure; Preferably, the first gap comprises a filling portion, a material of the filling portion being the same as a material of the second electrode; Preferably, a volume of the filling portion is less than a volume of the first gap; Preferably, the isolation structure comprises a support portion and a barrier portion which are sequentially stacked in a direction away from the substrate, the barrier portion being protruded from the support portion towards the isolation opening, wherein a normal projection of the light emitting layer on the substrate and a normal projection of the support portion on the substrate have a second gap therebetween; Preferably, the second gap is filled by the second electrode; Preferably, the isolation structure further comprises a conductive portion which is disposed on a side of the support portion facing the substrate, the conductive portion being protruded from the support portion towards the isolation opening, wherein the second electrode is overlapped with the support portion and / or the second electrode is overlapped with the conductive portion; Preferably, the second gap comprises a sub-gap, a normal projection of the sub-gap on the substrate being located between a normal projection of the light emitting layer on the substrate and a normal projection of the conductive portion on the substrate.

9. The display panel of claim 8, wherein, The light shielding layer has a reflectivity less than a reflectivity of the second electrode.

10. The display panel of claim 1, wherein, The light shielding layer comprises a black light absorbing material.

11. The display panel of claim 2, wherein, On a side of the isolation structure away from the substrate, the first encapsulation portion comprises a first side surface facing the isolation opening, the light shielding layer comprises a second side surface facing the isolation opening, and the first side surface and the second side surface are not coplanar.

12. The display panel of claim 2, wherein, Further comprising: a second encapsulation layer located on a side of the first encapsulation layer and the light shielding layer away from the substrate; wherein a distance between a surface of the second encapsulation layer away from the substrate and the substrate is not less than a distance between a surface of the light shielding layer away from the substrate and the substrate.

13. The display panel of claim 12, wherein, Further comprising: a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; Preferably, a material of the first encapsulation layer and the third encapsulation layer comprises an inorganic material, and a material of the second encapsulation layer comprises an organic material.

14. The display panel of claim 12, wherein, The light shielding layer comprises: a plurality of second light shielding portions, the second light shielding portions enclosing a second light shielding opening, the second light shielding opening being in communication with a corresponding isolation opening; Preferably, a part of a normal projection of the isolation structure on the substrate is located outside normal projections of the plurality of second light shielding portions on the substrate.

15. A method for manufacturing a display panel, characterized by, Comprising: providing a substrate; forming an isolation structure on a side of the substrate, the isolation structure enclosing a plurality of isolation openings; forming a plurality of light emitting devices located in the plurality of isolation openings; forming a light shielding layer on a side of the isolation structure away from the substrate.

16. The method of producing a display panel according to claim 15, wherein After the step of forming a plurality of light emitting devices located in the plurality of isolation openings, further comprising: forming a first encapsulation layer on a side of the plurality of light emitting devices away from the substrate, wherein the first encapsulation layer comprises a plurality of first encapsulation portions, each of the first encapsulation portions is on a side of a corresponding one of the light emitting devices away from the substrate and extends from a side wall of the isolation structure to a side of the isolation structure away from the substrate.

17. The method of producing a display panel according to claim 16, wherein The step of forming the light-blocking layer on the side of the isolation structure away from the substrate comprises: coating a layer of black light-absorbing material on the surface of the first encapsulation layer and the surface of the isolation structure away from the substrate; exposing and developing the layer of black light-absorbing material to form the light-blocking layer.

18. The method of producing a display panel according to claim 16, wherein After the step of forming the light-blocking layer on the side of the isolation structure away from the substrate, the method further comprises: forming a second encapsulation layer on a side of the first encapsulation layer and the light-blocking layer away from the substrate, wherein a distance between a surface of the second encapsulation layer away from the substrate and the substrate is not less than a distance between a surface of the light-blocking layer away from the substrate and the substrate.

19. The method of producing a display panel according to claim 15, wherein The step of forming the isolation structure on the side of the substrate comprises: forming a layer of support portion material and a layer of barrier portion material on the side of the substrate; patterning the layer of barrier portion material and the layer of support portion material in sequence to form a barrier portion and a support portion, wherein the barrier portion protrudes from the support portion towards the isolation opening.

20. A display device comprising: A display panel comprising any one of claims 1 to 14.

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