Display device and manufacturing method thereof

Abstract

A display device and a method of manufacturing the same are disclosed. According to one aspect of the present disclosure, the display device includes: a cover window; a display panel located below the cover window, the display panel including a display area, a first non-display area surrounding the display area, a bending area to be bent extending from one side of the first non-display area, and a second non-display area extending from one side of the bending area; a frame under the display panel; a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame; and a molding member under the cover window to cover a side surface of the display panel, side surfaces of the plurality of adhesive layers, a side surface of the frame, and a part of a bottom surface of the frame, and side surfaces of some of the plurality of adhesive layers have an inwardly recessed shape in a portion of an interface with the molding member.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a display device, and more particularly, for example, but not limited to, a display device having improved bonding strength between components of the display device and a manufacturing method thereof. BACKGROUND

[0002] Currently, as the information age has come, the field of display devices that visually express electric information signals has rapidly developed, and research is continuing to improve the performance of various display devices, such as thin thickness, light weight, and low power consumption.

[0003] Among various display devices, an organic light emitting display device is a self-emissive display device, such that a separate light source is not required, unlike a liquid crystal display device. Accordingly, the organic light emitting display device can be manufactured to have a light weight and a small thickness. In addition, since the organic light emitting display device is driven at a low voltage, it is advantageous not only in terms of power consumption, but also in terms of color implementation, response speed, viewing angle, and contrast ratio (CR). Thus, it is expected to be utilized in various fields.

[0004] The description provided in the description of the background section should not be assumed to be prior art merely because of its inclusion in the background section or its association with the background section. The background section can include information that describes one or more aspects of the subject technology, and that is not limited to the present disclosure. The description in the background section is not an admission that the subject technology is not entitled to antecedent priority to prior art that is in the public domain. SUMMARY

[0005] The inventors have recognized that in the related art, there are limitations in terms of the size and lifespan of a display device. Accordingly, it is an object of the present disclosure to provide a display device that minimizes the size of a bezel area.

[0006] It is another object of the present disclosure to provide a display device that alleviates stress due to shrinkage and expansion of a display panel and a molded member.

[0007] The objects of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned above will be clearly understood by those skilled in the art from the following description.

[0008] According to an aspect of the disclosure, a display device includes a cover window, a display panel below the cover window, the display panel including a display area, a first non-display area surrounding the display area, a bending area to be bent extending from one side of the first non-display area, and a second non-display area extending from one side of the bending area, a frame below the display panel, a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame, a molding member below the cover window to cover side surfaces of the display panel, side surfaces of the plurality of adhesive layers, a side surface of the frame, and a portion of a bottom surface of the frame, and the side surfaces of some of the plurality of adhesive layers have an inwardly recessed shape in a portion of an interface with the molding member.

[0009] According to another aspect of the disclosure, a manufacturing method of a display device includes forming a display panel including a display area, a non-display area adjacent to the display area, and a bending area extending from one side of the non-display area, forming a cover window above the display panel, forming a frame below the display panel, forming a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame, and forming a molding member below the cover window to cover side surfaces of the display panel, side surfaces of the plurality of adhesive layers, a side surface of the frame, and a portion of a bottom surface of the frame, wherein the side surfaces of some of the plurality of adhesive layers have an inwardly recessed shape in a portion of an interface with the molding member.

[0010] According to another aspect of the disclosure, a manufacturing method of a display device includes forming a display panel including a display area, a non-display area adjacent to the display area, and a bending area extending from one side of the non-display area, forming a cover window above the display panel, forming a molding member below the cover window to cover side surfaces of the display panel, forming adhesive layers at a top and a bottom of the display panel such that side surfaces of the adhesive layers are covered by the molding member, wherein an interface of the adhesive layers and the molding member has a shape protruding toward the adhesive layers.

[0011] Further details of example embodiments are included in the detailed description and the accompanying drawings.

[0012] According to the disclosure, a space required to protect an outside of a display panel is minimized to achieve a narrow bezel.

[0013] According to the disclosure, stress generated between a display panel and a molding member is alleviated to improve durability of a display device.

[0014] According to the present invention, the stress on the display panel is reduced to improve the lifespan of the display device driven by low power.

[0015] The effects of this disclosure are not limited to those illustrated above, and include many more effects in this specification. Attached Figure Description

[0016] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0017] FIG. 1A This is a plan view of a display device according to an exemplary embodiment of the present disclosure before bending;

[0018] FIG. 1B This is a rear view of a display device according to an exemplary embodiment of the present disclosure after bending.

[0019] FIG. 2 It is along FIG. 1A A cross-sectional view taken from A-A';

[0020] FIG. 3 It is along FIG. 1B A cross-sectional view taken at B-B';

[0021] FIG. 4 It is along FIG. 1B A cross-sectional view taken at C-C';

[0022] FIG. 5A and FIG. 5B yes FIG. 4 Enlarged cross-sectional view of region D;

[0023] FIG. 6 This is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure;

[0024] FIG. 7A yes FIG. 6 Enlarged cross-sectional view of region E;

[0025] FIG. 7B yes FIG. 6 Enlarged cross-sectional view of region F;

[0026] FIG. 8 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present disclosure;

[0027] FIG. 9A yes FIG. 8 An enlarged cross-sectional view of region E; and

[0028] FIG. 9B yes FIG. 8 An enlarged cross-sectional view of region F.

[0029] Throughout the accompanying drawings and detailed description, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the relative sizes and descriptions of these elements may be exaggerated. Detailed Implementation

[0030] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. The described progression of processing steps and / or operations is illustrative; however, the order of steps and / or operations is not limited to that described herein and can be varied as is known in the art, except for steps and / or operations that must occur in a specific order. The names of the various elements used in the following explanation may have been chosen merely for convenience of writing the specification and may therefore differ from the names used in actual products.

[0031] This disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only, so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0032] The shapes, sizes, dimensions (e.g., length, width, height, thickness, radius, diameter, area, etc.), ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, similar reference numerals generally denote similar elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” “including,” “containing,” “constituting,” “made of,” “formed from,” “composed of”, and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0033] The dimensions of the various components shown in the accompanying drawings, including size and thickness, are shown for ease of description, and this disclosure is not limited to the size and thickness of the components shown. However, it should be noted that the relative dimensions of the components shown in the various accompanying drawings, including relative size, position, and thickness, are part of this disclosure.

[0034] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0035] When using terms such as “on top of,” “above,” “above,” “below,” “below,” “next to,” “under,” “near,” “close to,” “adjacent to,” “on the side of,” or “near” to describe the positional relationship between two parts, one or more parts may be located between the two parts unless used with the terms “exactly” or “directly.”

[0036] When a component or layer is placed "on top of" another component or layer, the other layer or component can be directly inserted on or between the other component.

[0037] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of this disclosure, the first component mentioned below can be the second component.

[0038] Throughout the specification, the same reference numerals generally denote the same elements.

[0039] For ease of illustration, the dimensions and thicknesses of the components shown in the figures are illustrated, and this disclosure is not limited to the dimensions and thicknesses of the components shown.

[0040] The term "at least one" should be understood to include all possible combinations that can be suggested from one or more related projects. For example, "at least one of the first, second, or third projects" can mean each of the first, second, or third projects, and can also mean all possible combinations that can be suggested from two or more of the first, second, and third projects.

[0041] As used herein, the term "device" can refer to a display device that includes a display panel and a driver for driving the display panel. Examples of display devices may include light-emitting elements, etc. Additionally, examples of devices may include laptops, televisions, computer monitors, automotive devices, wearable devices, and automotive equipment devices, as well as assemblies of electronic devices (or equipment) or assemblies (or devices) that include light-emitting elements, etc., as complete products or end products, such as mobile electronic devices like smartphones or tablets, but embodiments of this disclosure are not limited thereto.

[0042] Features of the various embodiments of this disclosure may be partially or completely attached or combined with each other, and may be interlocked and operated in various technical ways, and the embodiments may be performed independently or in relation to each other.

[0043] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It will be further understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with, for example, their meaning in the context of the relevant art, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0044] In embodiments of this disclosure, for ease of description, the source electrode and drain electrode are distinguished from each other. However, the source electrode and drain electrode are interchangeable. A source electrode can be a drain electrode, and a drain electrode can be a source electrode. Furthermore, a source electrode in any aspect of this disclosure can be a drain electrode in another aspect of this disclosure, and a drain electrode in any aspect of this disclosure can be a source electrode in another aspect of this disclosure.

[0045] The present disclosure will now be described in detail with reference to the accompanying drawings.

[0046] FIG. 1A This is a plan view of a display device according to an exemplary embodiment of the present disclosure before bending. FIG. 1B This is a rear view of a display device according to an exemplary embodiment of the present disclosure after bending. FIG. 2 It is along FIG. 1A The cross-sectional view taken from A-A'. FIG. 3 It is along FIG. 1B The cross-sectional view taken from B-B'. FIG. 4 It is along FIG. 1B The cross-sectional view taken from C-C'. FIG. 5A yes FIG. 4 A magnified view of region D. FIG. 5B yes FIG. 4 Enlarged cross-sectional view of region D. FIG. 2 It is a cross-sectional view of one sub-pixel among multiple sub-pixels of a display device. FIG. 1A to FIG. 5B For ease of explanation, only the display panel PN, cover window 120, back plate 130, metal plate 140, frame 150, and molded component 160 of the display device 100 are shown. FIG. 1A For ease of illustration, the shading line of the display panel PN has been omitted.

[0047] exist FIG. 1A to FIG. 4 The display device 100 according to this disclosure also includes a display panel PN, a cover window 120, a back plate 130, a metal plate 140, a frame 150, a molded component 160, and a plurality of adhesive layers AD1, AD2, AD3, AD4, AD5, AD6, AD7, and AD8.

[0048] A display panel (PN) is a panel used to display images to a user. The display panel (PN) includes display elements for displaying images, driving elements for driving the display elements, and wiring for sending various signals to the display elements and driving elements.

[0049] The display element can be defined in different ways depending on the type of the display panel PN. For example, when the display panel PN is an organic light-emitting display panel PN, the display element can be an organic light-emitting diode (OLED) comprising an anode, an organic light-emitting layer, and a cathode. For example, when the display panel PN is a liquid crystal display panel, the display element can be a liquid crystal display element. In the following text, even if the display panel PN is assumed to be an organic light-emitting display panel, the display panel PN is not limited to organic light-emitting display panels.

[0050] The display panel PN includes a display area AA and a non-display area NA. For example, the display panel PN may include a display area AA containing multiple pixels and a non-display area NA that completely or partially surrounds the display area AA. The planar shape of the display area AA may be rectangular. However, the exemplary embodiments of this disclosure are not limited thereto, and the planar shape of the display area AA may be square, circular, oval, or other polygonal. For example, the display area AA may have a rectangular shape with rounded corners, but is not limited thereto, and may also have a rectangular shape with angular corners.

[0051] The display area AA is the area in the display panel PN where the image is displayed. Within the display area AA, multiple sub-pixels SP that make up multiple pixels and driving circuits for driving the multiple sub-pixels SP can be set.

[0052] Multiple subpixels SP are the smallest units constituting the display area AA, and the multiple subpixels may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, one of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be a red subpixel, another may be a green subpixel, and another may be a blue subpixel. In some exemplary embodiments, the multiple subpixels may also include a fourth subpixel, which may be a white subpixel. The type of each subpixel in the multiple subpixels is an example, and the exemplary embodiments of this disclosure are not limited thereto.

[0053] For example, multiple subpixels of a pixel can be modified in various ways in terms of color and configuration as needed. For instance, multiple subpixels may include red, green, and blue subpixels, which can be arranged in a repeating manner. Alternatively, multiple subpixels may include red, green, blue, and white subpixels, which can be arranged in a repeating manner, or in a quadrilateral pattern. For example, red, blue, and green subpixels can be arranged sequentially along a row direction, or red, blue, green, and white subpixels can be arranged sequentially along a row direction. However, in embodiments of this disclosure, the color type, arrangement type, and arrangement order of the subpixels are not limited and can be configured in various forms according to light-emitting characteristics, device lifetime, and device specifications.

[0054] Furthermore, depending on their light-emitting characteristics, sub-pixels can have different light-emitting areas. For example, a sub-pixel that emits light of a different color than the blue sub-pixel can have a different light-emitting area than the blue sub-pixel. For example, red, blue, and green sub-pixels, or red, blue, white, and green sub-pixels, can each have different light-emitting areas.

[0055] Furthermore, the display element can be disposed in each of the multiple sub-pixels SP. For example, an organic light-emitting diode including an anode, an organic light-emitting layer, and a cathode can be disposed in each of the multiple sub-pixels SP, but is not limited thereto. Additionally, the driving circuit for driving the multiple sub-pixels SP can include driving elements and wiring. For example, the driving circuit can be composed of thin-film transistors, storage capacitors, gate lines, and data lines, but is not limited thereto.

[0056] The active layer of a thin-film transistor can be formed from semiconductor materials, such as oxide semiconductors, amorphous semiconductors, or polycrystalline semiconductors, but is not limited to these.

[0057] Oxide semiconductor materials offer excellent leakage current prevention and relatively low manufacturing costs. Oxide semiconductors can be made from metal oxides such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), and titanium (Ti), or combinations of metals and their oxides such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), or titanium (Ti). Specifically, oxide semiconductors can include, but are not limited to, zinc oxide (ZnO), zinc tin oxide (ZTO), zinc indium oxide (ZIO), indium oxide (InO), titanium oxide (TiO), indium gallium zinc oxide (IGZO), indium zinc tin oxide (IZTO), indium zinc oxide (IZO), indium gallium tin oxide (IGTO), and indium gallium oxide (IGO).

[0058] Polycrystalline semiconductor materials exhibit high mobility due to the fast movement speed of charge carriers such as electrons and holes, resulting in low energy consumption and excellent reliability. Polycrystalline semiconductors can be made of polycrystalline silicon (poly-Si), but are not limited to this.

[0059] Amorphous semiconductor materials can be made of amorphous silicon (a-Si), but are not limited to this.

[0060] The non-display area NA is the area where no image is displayed. The non-display area NA refers to the outer periphery of the display panel PN surrounding the display area AA. Various wiring and circuits for driving the organic light-emitting diodes (OLEDs) of the display area AA are provided in the non-display area NA. For example, the non-display area NA may contain links that send signals to driving circuits for multiple sub-pixels SP and the display area AA, or to driver ICs (D-ICs) such as gating driver ICs or data driver ICs, but is not limited to these.

[0061] The non-display area NA includes the first non-display area NA1, the curved area BA, and the second non-display area NA2.

[0062] The first non-display area NA1 is the area surrounding and extending from the display area AA. The curved area BA can extend from one side of the first non-display area NA1 and can be bent. The second non-display area NA2 extends from the curved area BA and is located below the display area AA.

[0063] In addition, refer to FIG. 1A , FIG. 1B and FIG. 3The first non-display area NA1 and the second non-display area NA2 are disposed on the same plane as the display area AA, or are disposed parallel to the display area AA and kept flat. For example, the first non-display area NA1 is disposed flat on the same plane as the display area AA, and the second non-display area NA2 is disposed below the display area AA so as to be parallel to the display area AA and flat. Therefore, the display area AA, the first non-display area NA1, and the second non-display area NA2 can be referred to as non-curved areas, but are not limited thereto.

[0064] Reference FIG. 1A and FIG. 1B The driver IC D-IC is located in the second non-display area NA2. The driver IC D-IC supplies data signals to multiple sub-pixels SP. For example, in response to a data timing control signal supplied from a timing controller, the driver IC D-IC samples and latches the data signal supplied from the timing controller to convert the data signal into a gamma reference voltage and outputs the converted gamma reference voltage. For example, based on timing control signals Vsync, Hsync, and DE received from the host system HS, the timing controller can generate a data timing control signal for controlling the operating timing of the data driver and a gating timing control signal for controlling the operating timing of the gating driver. Here, the horizontal synchronization signal Hsync is a signal representing the time taken to display a horizontal line on the screen, and the vertical synchronization signal Vsync is a signal representing the time taken to display one frame. The data enable signal DE can correspond to a signal indicating the time period for supplying data voltage to the pixel. The driver IC D-IC supplies data signals through multiple data lines. For example, in the second non-display area NA2 where the driver IC D-IC is located, there are pad units and a printed circuit board electrically connected to the pad units to supply signals to the driver IC D-IC, but not limited to this.

[0065] Furthermore, the driver IC D-IC is disposed on one side of the display panel PN in a chip-on-panel (COP) manner to connect to the display panel PN, or disposed in a separate flexible film in a chip-on-film (COF) manner to connect to the display panel PN. In the display device 100 according to an exemplary embodiment of the present disclosure, it is assumed that the driver IC D-IC is disposed in a COP manner, but it is not limited thereto.

[0066] Reference FIG. 1BWhen the display panel PN is bent, the driver IC D-IC, located in the second non-display area NA2, is positioned below the display area AA. For example, the driver IC D-IC and the printed circuit board of the pad units connected to the display panel PN move to the rear surface of the display panel PN and overlap with the display area AA. Therefore, circuit components such as the driver IC D-IC and the printed circuit board are not visible when viewed from the top of the display panel PN. Consequently, the size of the non-display area visible from the top of the display panel PN is reduced, achieving a narrow bezel.

[0067] Reference FIG. 2 The display device 100 according to an exemplary embodiment of the present disclosure includes a substrate 110, a lower buffer layer 111, a first transistor TR1, a storage capacitor Cst, a first gate insulating layer 112a, a first interlayer insulating layer 113a, an upper buffer layer 114, a second transistor TR2, a second gate insulating layer 112b, a second interlayer insulating layer 113b, a first connection electrode CE1, a first planarization layer 115a, a second connection electrode CE2, a second planarization layer 115b, a dam 116a, a spacer 116b, a light-emitting diode 125, and an encapsulation layer 117.

[0068] The substrate 110 is used to support and protect the components of the display device 100 disposed thereon.

[0069] The substrate 110 is a component used to support various components included in the display device 100, and may be formed of an insulating material. The substrate 110 includes a first substrate 110a, a second substrate 110b, and an inorganic insulating layer 110c. The inorganic insulating layer 110c may be disposed between the first substrate 110a and the second substrate 110b. As described above, the substrate 110 is composed of three layers—the first substrate 110a, the second substrate 110b, and the inorganic insulating layer 110c—to minimize moisture penetration from the outside. However, the substrate 110 may be a single layer, but is not limited to this.

[0070] The first substrate 110a has both rigidity and flexibility. The first substrate 110a can be a structure within the substrate 110 that substantially supports components of the display device 100. For example, the first substrate 110a may include a flexible polymer film. For example, the flexible polymer film may be made of any one of polyimide (PI), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), polyarylate (PAR), polysulfone (PSF), cyclic olefin copolymer (COC), triacetyl cellulose (TAC), polyvinyl alcohol (PVA), and polystyrene (PS), and this disclosure is not limited thereto. For example, the first substrate 110a may be a flexible substrate formed of polyimide (PI), but is not limited thereto.

[0071] An inorganic insulating layer 110c is disposed on the entire surface of the first substrate 110a. The inorganic insulating layer 110c is formed of an inorganic insulating material. For example, the inorganic insulating layer 110c may be formed from a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto. For example, the inorganic insulating layer 110c may be formed by a single layer or multiple layers of inorganic film. For example, the single layer of inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, while the multiple layers of inorganic film may be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film and one or more layers of amorphous silicon (a-Si), but the exemplary embodiments of this disclosure are not limited thereto.

[0072] The inorganic insulating layer 110c can be formed on the entire substrate 110, but is not limited thereto. For example, the inorganic insulating layer 110c may not be formed in the curved region BA, or may not be patterned in the curved region BA.

[0073] The second substrate 110b is disposed on the inorganic insulating layer 110c. The second substrate 110b has both rigidity and flexibility. In the structure of the substrate 110, the second substrate 110b can be a structure that substantially supports the components of the display device 100 together with the first substrate 110a. For example, the second substrate 110b may include a flexible polymer film. For example, the flexible polymer film may be made of any one of polyimide (PI), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), polyarylate (PAR), polysulfone (PSF), cyclic olefin copolymer (COC), triacetyl cellulose (TAC), polyvinyl alcohol (PVA), and polystyrene (PS), and this disclosure is not limited thereto. For example, the second substrate 110b may be a flexible substrate formed of polyimide (PI), but is not limited thereto.

[0074] A lower buffer layer 111 is disposed on the substrate 110. The lower buffer layer 111 is disposed below the first transistor TR1 to delay the diffusion of moisture or oxygen that has penetrated into the substrate 110 to the first transistor TR1.

[0075] The lower buffer layer 111 includes a first lower buffer layer 111a and a second lower buffer layer 111b. The lower buffer layer 111 is formed by multiple layers including the first lower buffer layer 111a and the second lower buffer layer 111b. Therefore, even though the lower buffer layer 111 is referred to as a multi-buffer layer, the lower buffer layer 111 can be formed by a single layer or by multiple layers other than two layers, but is not limited thereto.

[0076] For example, the first lower buffer layer 111a may be formed of a single layer or multiple layers of any one of amorphous silicon (a-Si), silicon nitride (SiNx) and silicon oxide (SiOx), but is not limited thereto.

[0077] For example, the second lower buffer layer 111b may be formed of a single layer or multiple layers of any one of amorphous silicon (a-Si), silicon nitride (SiNx) and silicon oxide (SiOx), but is not limited thereto.

[0078] For example, the first lower buffer layer 111a and the second lower buffer layer 111b can be formed by a single layer or multiple layers of inorganic films. For example, the single layer of inorganic film can be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, while the multiple layers of inorganic film can be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film and one or more layers of amorphous silicon (a-Si), but the exemplary embodiments of this disclosure are not limited thereto.

[0079] The first transistor TR1 is disposed on the lower buffer layer 111. The first transistor TR1 may include a first active layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1. However, depending on the design of the pixel circuit, the first source electrode S1 can be used as the first drain electrode D1, and the first drain electrode D1 can be used as the first source electrode S1.

[0080] The first active layer A1 is disposed on the lower buffer layer 111. The first active layer A1 may include low-temperature polycrystalline silicon (LTPS), such as amorphous silicon or polycrystalline silicon.

[0081] For example, the first active layer A1 may include low-temperature polycrystalline silicon (LTPS). For instance, due to the high mobility (100 cm⁻¹) of polycrystalline silicon materials... 2 With a voltage of / Vs or higher, polysilicon has low power consumption and high reliability, making it suitable for use as a gating driver for driving transistors for light-emitting diodes and / or multiplexers (MUX). Therefore, a first active layer A1 comprising low-temperature polysilicon (LTPS) can be used as an active layer for driving transistors, but is not limited to this.

[0082] For example, the first active layer A1 may include a channel region in which a channel is formed when the first transistor TR1 is driven, and source and drain regions located on either side of the channel region. The source region refers to the portion of the first active layer A1 connected to the first source electrode S1, and the drain region refers to the portion of the first active layer A1 connected to the first drain electrode D1. For example, the source and drain regions are configured by ion doping (impurity doping) of the first active layer A1. The source and drain regions can be generated by doping ions into a polysilicon material, and the channel region can refer to the portion in which ions are not doped but the polysilicon material remains.

[0083] A first gate insulating layer 112a is disposed on the first active layer A1. The first gate insulating layer 112a may be composed of a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx). A contact hole may be formed in the first gate insulating layer 112a, through which the first source electrode S1 and the first drain electrode D1 of the first transistor TR1 are respectively connected to the source region and the drain region of the first active layer A1 of the first transistor TR1.

[0084] The first gate electrode G1 of the first transistor TR1 can be disposed on the first gate insulating layer 112a.

[0085] For example, the first gate electrode G1 may be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd) or their alloys, but is not limited thereto. The first gate electrode G1 may be formed on the first gate insulating layer 112a to overlap with the channel region of the first active layer A1 of the first transistor TR1.

[0086] Furthermore, the first capacitor electrode C1 of the storage capacitor Cst can be disposed on the first gate insulating layer 112a. For example, the first capacitor electrode C1 can be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys, but is not limited thereto.

[0087] Based on the driving characteristics of the display device 100 and the structure and type of the transistor, the first capacitor electrode C1 can be omitted. The first gate electrode G1 and the first capacitor electrode C1 can be formed using the same process. Furthermore, the first gate electrode G1 and the first capacitor electrode C1 can be formed on the same layer from the same material.

[0088] The first interlayer insulating layer 113a may be disposed on the first gate insulating layer 112a and the first gate electrode G1. Contact holes for exposing the first source region and the first drain region of the first active layer A1 of the first transistor TR1 may be formed in the first interlayer insulating layer 113a. For example, the first interlayer insulating layer 113a may be composed of a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx).

[0089] The second capacitor electrode C2 of the storage capacitor Cst can be disposed on the first interlayer insulating layer 113a. The second capacitor electrode C2 can be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys.

[0090] The second capacitor electrode C2 can be formed on the first interlayer insulating layer 113a to overlap with the first capacitor electrode C1. Furthermore, the second capacitor electrode C2 can be formed of the same material as the first capacitor electrode C1. The second capacitor electrode C2 may be omitted based on the driving characteristics of the display device 100 and the structure and type of the transistor, but is not limited thereto.

[0091] An upper buffer layer 114 is disposed on the first interlayer insulating layer 113a. The upper buffer layer 114 includes a first upper buffer layer and a second upper buffer layer. The upper buffer layer 114 is formed as a multilayer comprising the first upper buffer layer and the second upper buffer layer. Therefore, although the upper buffer layer 114 is referred to as a multilayer buffer layer, the upper buffer layer 114 may also be formed as a single layer, or may be formed from multiple layers other than two layers, but is not limited thereto.

[0092] For example, the first upper buffer layer may be formed of a single layer or multiple layers of any one of amorphous silicon (a-Si), silicon nitride (SiNx) and silicon oxide (SiOx), but is not limited thereto.

[0093] For example, the second upper buffer layer may be formed of a single layer or multiple layers of any one of amorphous silicon (a-Si), silicon nitride (SiNx) and silicon oxide (SiOx), but is not limited thereto.

[0094] For example, the first upper buffer layer and the second upper buffer layer can be formed by a single layer or multiple layers of inorganic films. For example, the single layer of inorganic film can be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, while the multiple layers of inorganic film can be formed by alternately stacking one or more layers of silicon oxide (SiOx) film, one or more layers of silicon nitride (SiNx) film and one or more layers of amorphous silicon (a-Si), but the exemplary embodiments of this disclosure are not limited thereto.

[0095] The second transistor TR2 is disposed on the upper buffer layer 114. The second transistor TR2 may include a second active layer A2, a second gate electrode G2, a second source electrode S2, and a second drain electrode D2. However, depending on the design of the pixel circuit, the second source electrode S2 can be used as the drain electrode, and the second drain electrode D2 can be used as the second source electrode S2.

[0096] The second active layer A2 is disposed on the upper buffer layer 114. The second active layer A2 comprises an oxide semiconductor material formed of a metal oxide such as indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium tin oxide (IGTO), or indium gallium oxide (IGO).

[0097] For example, the second active layer A2 can be formed of oxide semiconductor. Oxide semiconductor materials have a larger band gap than silicon materials, preventing electrons from jumping across the band gap in the off state. Therefore, oxide semiconductor materials have low cutoff current. Thus, transistors including active layers formed of oxide semiconductors are suitable for, but not limited to, switching transistors that maintain short on-time and long off-time.

[0098] For example, the second active layer A2 may include a channel region in which a channel is formed when the second transistor TR2 is driven, and source and drain regions located on either side of the channel region. The source region refers to the portion of the second active layer A2 connected to the second source electrode S2, and the drain region refers to the portion of the second active layer A2 connected to the second drain electrode D2. For example, the source and drain regions are configured by ion doping (impurity doping) of the second active layer A2. The source and drain regions can be generated by doping ions into an oxide semiconductor material, and the channel region can refer to the portion in which no ions are doped but the oxide semiconductor material remains.

[0099] The second gate insulating layer 112b can be disposed on the second active layer A2. The second gate insulating layer 112b can be configured as a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx). Contact holes can be formed in the second gate insulating layer 112b, through which the second source electrode S2 and the second drain electrode D2 of the second transistor TR2 are respectively connected to the source region and drain region of the second active layer A2.

[0100] The second gate electrode G2 of the second transistor TR2 is disposed on the second gate insulating layer 112b.

[0101] For example, the second gate electrode G2 may be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd) or their alloys, but is not limited thereto. The second gate electrode G2 may be formed on the second gate insulating layer 112b to overlap with the channel region of the second active layer A2 of the second transistor TR2.

[0102] The second interlayer insulating layer 113b can be disposed on the second gate insulating layer 112b and the second gate electrode G2. The second interlayer insulating layer 113b can be configured as a single layer or multiple layers of silicon nitride (SiNx) or silicon oxide (SiOx).

[0103] The first source electrode S1 and the first drain electrode D1 of the first transistor TR1, the second source electrode S2 and the second drain electrode D2 of the second transistor TR2, and the first connection electrode CE1 are disposed on the second interlayer insulating layer 113b.

[0104] The first source electrode S1 and the first drain electrode D1 can be electrically connected to the first active layer A1 of the first transistor TR1 through contact holes of the first gate insulating layer 112a, the first interlayer insulating layer 113a, the upper buffer layer 114, the second gate insulating layer 112b, and the second interlayer insulating layer 113b.

[0105] The second source electrode S2 and the second drain electrode D2 can be electrically connected to the second active layer A2 of the second transistor TR2 through the contact holes of the second gate insulating layer 112b and the second interlayer insulating layer 113b.

[0106] The first source electrode S1, the first drain electrode D1, the second source electrode S2, and the second drain electrode D2 can be formed, for example, from any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd) or their alloys, in a single layer or multiple layers, but are not limited thereto.

[0107] The first connection electrode CE1 can be electrically connected to the second drain electrode D2 of the second transistor TR2. Furthermore, the first connection electrode CE1 can be electrically connected to the second capacitor electrode C2 of the storage capacitor Cst through a contact hole formed in the upper buffer layer 114 and the second interlayer insulating layer 113b. In other words, the first connection electrode CE1 can be used to electrically connect the second capacitor electrode C2 of the storage capacitor Cst to the second drain electrode D2 of the second transistor TR2.

[0108] Furthermore, the first connection electrode CE1 can be formed from the same material using the same process as the first source electrode S1 and first drain electrode D1 of the first transistor TR1 and the second source electrode S2 and second drain electrode D2 of the second transistor TR2. For example, the first connection electrode CE1 can be formed from a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys, but is not limited thereto.

[0109] Furthermore, the first connection electrode CE1 may be integrally formed to connect to the second drain electrode D2 of the second transistor TR2, but is not limited thereto.

[0110] In the first transistor TR1 and the second transistor TR2, a light-shielding layer LS is respectively disposed below the first active layer A1 and the second active layer A2. The light-shielding layer LS is configured to overlap with the first active layer A1 between the substrate 110 and the lower buffer layer 111, and is configured to overlap with the second active layer A2 between the first interlayer insulating layer 113a and the upper buffer layer 114. Therefore, the light-shielding layer LS can be insulated from the first active layer A1 and the second active layer A2.

[0111] The light-shielding layer LS can be formed of a metallic material with low light transmittance, and reflects light incident on the first active layer A1 and the second active layer A2 below the first active layer A1 and the second active layer A2. The light-shielding layer LS can shield the light incident on the first active layer A1 and the second active layer A2, and protect the first active layer A1 and the second active layer A2.

[0112] For example, the light-shielding layer LS is referred to as a bottom shielding metal (BSM), but is not limited thereto. Specifically, the light-shielding layer LS can be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys, but is not limited thereto.

[0113] The first planarization layer 115a may be disposed on the first connecting electrode CE1, the first source electrode S1 and the first drain electrode D1 of the first transistor TR1, the second source electrode S2 and the second drain electrode D2 of the second transistor TR2, and the second interlayer insulating layer 113b.

[0114] The first planarization layer 115a may be an organic layer that planarizes and protects the upper portion of the first transistor TR1 and the second transistor TR2. For example, the first planarization layer 115a may be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0115] The second connection electrode CE2 is disposed on the first planarization layer 115a. The second connection electrode CE2 can be connected to the second drain electrode D2 of the second transistor TR2 through the contact hole of the first planarization layer 115a. Therefore, the second connection electrode CE2 can be configured to electrically connect the second transistor TR2 and the light-emitting diode 125.

[0116] The second connecting electrode CE2 may be formed, for example, from a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys, but is not limited thereto.

[0117] A second planarization layer 115b is disposed on the first planarization layer 115a and the second connecting electrode CE2. The top surface of the second planarization layer 115b has a surface parallel to the substrate 110. Therefore, the second planarization layer 115b can planarize steps that may be caused by components disposed beneath it. For example, the second planarization layer 115b can be formed of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but is not limited thereto.

[0118] The light-emitting diode 125 is disposed on the second planarization layer 115b.

[0119] The light-emitting diode 125 includes an anode 121, a light-emitting layer 122, and a cathode 123.

[0120] The anode 121 is disposed on the second planarization layer 115b. The anode 121 can be connected to the second connection electrode CE2 through the contact holes of the second planarization layer 115b, and can also be electrically connected to the second transistor TR2. The anode 121 can be formed of a metallic material.

[0121] When the display device 100 is a top-emission type in which light emitted from a light-emitting diode 125 is emitted above a substrate 110 on which the light-emitting diode 125 is disposed, the anode 121 may include a reflective layer and a transparent conductive layer disposed on the reflective layer. The transparent conductive layer may be formed of a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the reflective layer may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof, but is not limited thereto.

[0122] Anode 121 is configured to correspond to each of the plurality of sub-pixels SP. Anode 121 is configured to cover the second planarization layer 115b. Anode 121 may be configured along the shape of the second planarization layer 115b. That is, anode 121 may be configured flatly on the top surface of the second planarization layer 115b.

[0123] A dam 116a is disposed on the anode 121. The dam 116a may be disposed while simultaneously covering the end of the anode 121. A portion of the dam 116a corresponding to the light-emitting area of ​​the sub-pixel SP may be open. A portion of the anode 121 may be exposed through the opening portion (hereinafter referred to as the opening area) of the dam 116a. In this case, the dam 116a may be formed of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx) or an organic insulating material such as benzocyclobutene resin, acrylic resin, or imide resin, but is not limited thereto. A spacer 116b may be further disposed on the dam 116a.

[0124] A light-emitting layer 122 is disposed on the anode 121 and the embankment 116a. The light-emitting layer 122 can be disposed in the opening region of the embankment 116a and near the opening region of the embankment 116a. Therefore, the light-emitting layer 122 can be disposed on the anode 121 exposed through the opening region of the embankment 116a.

[0125] The light-emitting layer 122 may include multiple organic material layers. For example, the light-emitting layer 122 may include organic material layers such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. Furthermore, when the light-emitting layer 122 emits white light, the light emitted from the light-emitting layer 122 can be converted into light of various colors by multiple color filters, but is not limited thereto. The light-emitting layer 122 may include multiple organic layers and light-emitting material layers separated by the embankment 116a.

[0126] A cathode 123 is disposed on the light-emitting layer 122. The cathode 123 supplies electrons to the light-emitting layer 122, allowing the cathode to be formed of a conductive material with a low work function. The cathode 123 can be formed as a single layer over multiple sub-pixels SP. That is, the cathodes 123 of multiple sub-pixels SP can be connected to form a single unit.

[0127] For example, the cathode 123 may be formed of a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO) or ytterbium (Yb) alloy, and may further include a metal doped layer, but is not limited thereto.

[0128] The encapsulation layer 117 is disposed on the light-emitting diode 125.

[0129] The encapsulation layer 117 may have a multilayer structure including a first encapsulation layer 117a, a second encapsulation layer 117b, and a third encapsulation layer 117c. However, the encapsulation layer may be formed as a single layer, but is not limited thereto.

[0130] The first encapsulation layer 117a and the third encapsulation layer 117c can be formed of inorganic materials, and the second encapsulation layer 117b can be formed of organic materials. The second encapsulation layer 117b can be the thickest among the first encapsulation layer 117a, the second encapsulation layer 117b, and the third encapsulation layer 117c. The second encapsulation layer 117b can planarize the upper part of the light-emitting diode 125.

[0131] The first encapsulation layer 117a may be disposed on the cathode 123 and may be positioned as the closest to the light-emitting diode. The first encapsulation layer 117a may be formed of an inorganic insulating material on which low-temperature deposition can be performed. For example, the first encapsulation layer 117a may be configured with silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3), but is not limited thereto.

[0132] The first encapsulation layer 117a is deposited in a low-temperature atmosphere, which allows for the suppression of damage to the light-emitting layer 122, which includes organic materials susceptible to high-temperature atmospheres, during the deposition process.

[0133] A second encapsulation layer 117b is disposed on the first encapsulation layer 117a. The second encapsulation layer 117b may be configured to have a smaller area than the first encapsulation layer 117a. In this case, the second encapsulation layer 117b may be formed to expose both ends of the first encapsulation layer 117a. The second encapsulation layer 117b may serve as a buffer layer to alleviate interlayer stress caused by bending of the display device 100 and to enhance planarization performance.

[0134] For example, the second encapsulation layer 117b can be formed of an organic insulating material, such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon-oxygen carbon (SiOC). For example, the second encapsulation layer 117b can be formed by an inkjet printing method, but is not limited thereto.

[0135] The third encapsulation layer 117c can be formed above the substrate 110 on which the second encapsulation layer 117b is formed, to cover the upper and side surfaces of the second encapsulation layer 117b and the first encapsulation layer 117a. In this case, the third encapsulation layer 117c can minimize or block the penetration of external moisture or oxygen into the first encapsulation layer 117a and the second encapsulation layer 117b. For example, the third encapsulation layer 117c can be made of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3), but is not limited thereto.

[0136] Alternatively, the encapsulation layer may include a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, a second organic encapsulation layer, and a third inorganic encapsulation layer stacked sequentially.

[0137] The first, second, and third inorganic encapsulation layers can be used to block the penetration of moisture or oxygen. The first, second, and third inorganic encapsulation layers can be made of inorganic materials, such as silicon nitride (SiNx), silicon oxide (SiOx), or aluminum oxide (AlOx). However, this disclosure is not limited thereto.

[0138] A first organic encapsulation layer is disposed between a first inorganic encapsulation layer and a second inorganic encapsulation layer, and a second organic encapsulation layer is disposed between the second and third inorganic encapsulation layers. The first and second organic encapsulation layers may each have a greater thickness than each of the first, second, and third inorganic encapsulation layers to adsorb or block particles that may be generated during the manufacturing process of the display device. The first and second organic encapsulation layers may fill cracks that may form in the first and second inorganic encapsulation layers. The first and second organic encapsulation layers can planarize the upper portions of the first and second inorganic encapsulation layers by respectively covering particles on the first and second inorganic encapsulation layers. For example, the first organic encapsulation layer can planarize the upper portion of the first inorganic encapsulation layer by covering particles on the first inorganic encapsulation layer. For example, the second organic encapsulation layer can planarize the upper portion of the second inorganic encapsulation layer by covering particles on the second inorganic encapsulation layer. The first and second organic encapsulation layers may be made of organic materials, and for example, epoxy polymers, acrylic polymers, etc., may be used. However, this disclosure is not limited thereto.

[0139] Furthermore, the encapsulation layer is not limited to three or five layers. For example, it can include n layers of alternating inorganic and organic encapsulation layers (where n is an integer greater than 3).

[0140] Even if not shown in the figure, the touch sensing layer can be disposed on the encapsulation layer 117.

[0141] The touch sensing layer may include a touch buffer layer, an interlayer insulating layer, and touch electrodes. The touch electrodes may include touch sensor metal and bridging metal located on different layers.

[0142] For example, a touch buffer layer is disposed on the third encapsulation layer 117c, and a bridging metal is disposed on the touch buffer layer. An interlayer insulating layer is disposed on the bridging metal, and a touch sensor metal is disposed on the interlayer insulating layer.

[0143] The touch buffer layer and the interlayer insulating layer can be formed of, for example, inorganic or organic insulating materials. Therefore, the touch buffer layer and the interlayer insulating layer can minimize the step at the location where the touch electrodes are placed, and can be configured to electrically insulate the touch sensor metal and the bridging metal from each other.

[0144] Reference FIG. 1B , FIG. 3 and FIG. 4 A cover window 120 is disposed on the front surface of the display panel PN. The cover window 120 may be a component exposed to the outer periphery of the display device 100 and protecting the display device 100 from external impacts or scratches. In addition, the cover window 120 can protect the display device 100 from the penetration of moisture and other external factors. The cover window 120 may be formed of flexible glass or plastic materials, but is not limited thereto.

[0145] A polarizer (POL) is disposed between the display panel PN and the cover window 120. The polarizer POL may be disposed on the front surface of the display panel PN. The polarizer POL selectively transmits light to reduce the reflection of external light incident on the display panel PN. Specifically, the display panel PN comprises various metallic materials used in semiconductor elements, wiring, and organic light-emitting diodes. Therefore, external light incident on the display panel PN may be reflected from the metallic materials, potentially reducing the visibility of the display device 100 due to the reflection of external light. Conversely, when a polarizer POL is provided, the polarizer POL suppresses the reflection of external light, thereby increasing the outdoor visibility of the display device 100. However, depending on the embodiment of the display device 100, the polarizer POL may be omitted, but is not limited thereto.

[0146] Multiple adhesive layers AD1, AD2, AD3, AD4, AD5, AD6, AD7 and AD8 can be used to join the various components of the display device 100 together, and can be disposed between the display panel PN and the cover window 120 and between the display panel PN and the frame 150.

[0147] A third adhesive layer AD3 is disposed between the polarizer POL and the cover window 120, and a first adhesive layer AD1 is disposed between the polarizer POL and the display panel PN. The third adhesive layer AD3 bonds the cover window 120 and the polarizer POL, and the first adhesive layer AD1 bonds the polarizer POL and the display panel PN. Thus, the first adhesive layer AD1 and the third adhesive layer AD3 bond the display panel PN and the cover window 120. The first adhesive layer AD1 and the third adhesive layer AD3 can be formed as transparent adhesive layers, making the image on the display panel PN visible. For example, the first adhesive layer AD1 and the third adhesive layer AD3 can be formed of optically transparent adhesive (OCA) or pressure-sensitive adhesive (PSA), but are not limited thereto.

[0148] A backplate 130 is disposed below the display panel PN. The backplate 130 can be configured to support the display panel PN. For example, when the substrate of the display panel PN is formed of a plastic material such as polyimide, due to its flexible properties, a separate component for supporting the substrate may be required. Therefore, a support substrate formed of glass is disposed below the substrate to perform the manufacturing process of the display device 100, and the support substrate can be separated and released after the manufacturing process is completed. However, even after the support substrate is released, a component for supporting the substrate is still required, so that the backplate 130 for supporting the substrate can be disposed below the display panel PN.

[0149] The backsheet 130 may include a plastic material. For example, the backsheet 130 may be formed of a plastic film made of polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), or a combination of polymers.

[0150] The second adhesive layer AD2 is disposed between the display panel PN and the back panel 130. The second adhesive layer AD2 can bond the display panel PN and the back panel 130. The second adhesive layer AD2 can be formed by optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA), but is not limited to these.

[0151] A metal plate 140 is disposed below the back panel 130. The metal plate 140 protects the components of the display device 100 from external impacts. Furthermore, the metal plate 140 serves as grounding to suppress static electricity from entering the display device 100 or to easily release residual charge accumulated in the display device 100 to the outside. Additionally, the metal plate 140 facilitates the dissipation of heat generated in the display device 100 to the outside. The metal plate 140 can be formed of a metallic material with excellent thermal conductivity, electrical conductivity, and mechanical rigidity. For example, the metal plate 140 can be made of copper (Cu) or stainless steel (SUS), but is not limited to these.

[0152] A fourth adhesive layer AD4 is disposed between the back panel 130 and the metal plate 140. The fourth adhesive layer AD4 can bond the back panel 130 and the metal plate 140 together. The fourth adhesive layer AD4 can be formed of optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA), but is not limited to these.

[0153] Reference FIG. 3 An additional backplate 130A and an additional metal plate 140A are disposed below the metal plate 140 corresponding to the bending region BA.

[0154] The additional backplate 130A and the additional metal plate 140A supplement the rigidity of the display panel PN disposed in the second non-display area NA2. Furthermore, the additional backplate 130A and the additional metal plate 104A can be configured not to overlap with the bending area BA. Therefore, the thickness of the structure disposed in the bending area BA is minimized, and the neutral plane of the bending area BA is easily controlled to ensure the flexibility of the bending area.

[0155] A sixth adhesive layer AD6 is disposed between the metal plate 140 and the additional metal plate 140A, and a seventh adhesive layer AD7 is disposed between the additional metal plate 140A and the additional back plate 130A. The sixth adhesive layer AD6 is bonded between the metal plate 140 and the additional metal plate 140A, and the seventh adhesive layer AD7 is bonded between the additional metal plate 140A and the additional back plate 130A. For example, the sixth adhesive layer AD6 and the seventh adhesive layer AD7 may be formed of pressure-sensitive adhesive (PSA), but are not limited thereto.

[0156] The second non-display area NA2 of the display panel PN is disposed below the additional backplate 130A. An eighth adhesive layer AD8 is disposed between the second non-display area NA2 of the display panel PN and the additional backplate 130A. The eighth adhesive layer AD8 is bonded between the second non-display area NA2 of the display panel PN and the additional backplate 130A. For example, the eighth adhesive layer AD8 may be formed of optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA), but is not limited thereto.

[0157] Reference FIG. 3The side surfaces of the plurality of adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 adjacent to the curved region BA in the first non-display area NA1 can be flat at the interface with the molding member 160. For example, the side surfaces of the plurality of adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 adjacent to the curved region BA can be flat at the interface with the molding member 160. Specifically, before joining the cover window 120, a process is performed to cut the outer periphery of the first non-display area NA1, the curved region BA, and the second non-display area NA2 excluding the curved region BA of the display panel PN, such as a trimming process, to form the outer periphery shape of the display panel PN. Therefore, the first non-display area NA1 adjacent to the curved region BA corresponds to the area that has not been trimmed, so that the side surfaces of the plurality of adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 will not be deformed due to the trimming process.

[0158] Reference FIG. 1B and FIG. 4 The frame 150 is disposed below the metal plate 140. The frame 150 can be disposed below the metal plate 140 along the outer periphery of the display device 100. Therefore, the frame 150 enhances the rigidity of the outer periphery of the display device 100 while covering it. Furthermore, as... FIG. 1B As shown, the frame 150 is partially exposed from the molded member 160 to serve as a fastening unit for components disposed below the frame 150.

[0159] For example, the frame 150 may be formed of a plastic formed from polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), or a combination of these polymers, or a metal such as copper (Cu) or stainless steel (SUS) to enhance the rigidity of the periphery of the display device 100. However, this disclosure is not limited thereto.

[0160] A fifth adhesive layer AD5 is disposed between the metal plate 140 and the frame 150. The fifth adhesive layer AD5 bonds the metal plate 140 and the frame 150. For example, the fifth adhesive layer AD5 may be formed of optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA), but is not limited thereto.

[0161] The molded component 160 seals the cover window 120, display panel PN, back plate 130, metal plate 140, and frame 150. Specifically, the molded component 160 may be configured to surround a portion of the bottom of the cover window 120, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, and the side and bottom surfaces of the frame 150. The molded component 160 may be configured to cover the side surface of the display panel PN located below the cover window 120. In this case, the molded component 160 may be configured to cover the side surfaces of multiple adhesive layers AD1, AD2, AD3, AD4, and AD5 disposed between the cover window 120 and the display panel PN, and between the display panel PN and the frame 150. The molded component 160 can prevent moisture or oxygen from penetrating into the display device 100. In addition, the molded component 160 can protect the components of the display device 100 and mitigate impacts applied to the display device 100.

[0162] For example, the molded component 160 can be formed by removing the mold after filling and curing the mold with the material used to form the molded component 160, wherein the mold is configured to surround a portion of the side surface of the cover window 120 and expose a portion of the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, the side surface of the frame 150, and the bottom surface of the frame 150. However, the method of forming the molded component 160 is not limited to this.

[0163] The molded component 160 may be formed from one or more materials selected from, but not limited to, acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenyl resin, polyphenylene sulfide resin and benzocyclobutene.

[0164] In this disclosure, the side surfaces of some of the adhesive layers AD1, AD2, AD3, AD4, and AD5 in the first non-display area NA1 that are not adjacent to the curved area BA may have an inwardly recessed shape in a portion of the interface with the molding member 160. Specifically, the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 are inwardly recessed at the interface with the molding member 160. That is, the interface between the first adhesive layer AD1 and the second adhesive layer AD2 disposed on the top and bottom of the display panel PN and the molding member 160 may protrude toward the first adhesive layer AD1 and the second adhesive layer AD2, but is not limited thereto.

[0165] Before joining the cover window 120, a process is performed to cut off the outer periphery of the first non-display area NA1 of the display panel PN, excluding the curved area BA, such as a trimming process. The trimming process is used to separate the display panel unit by unit along the shape of the display panel. At this time, during the trimming process, a laser is used so that the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 can be deformed by the laser. Therefore, the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 are deformed by the laser into an inward concavity, and the deformed side surface shape acts as a barrier.

[0166] After the finishing process, the bonding process of the cover window 120, metal plate 140, and frame 150 is carried out sequentially. Therefore, the side surfaces of the third adhesive layer AD3, fourth adhesive layer AD4, and fifth adhesive layer AD5 will not deform due to the finishing process. Therefore, the side surfaces of the third adhesive layer AD3, fourth adhesive layer AD4, and fifth adhesive layer AD5 are flat at the interface with the molded member 160.

[0167] The following is for reference FIG. 5A and FIG. 5B As an example, various shapes of the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 are described.

[0168] Reference FIG. 5A The side surface of the first adhesive layer AD1 is recessed inward at the interface with the molding member 160. The side surface of the first adhesive layer AD1 has an irregular shape AD_D1 with an inward recess. That is, the interface between the first adhesive layer AD1 and the molding member 160, and the interface between the molding member 160 and the second adhesive layer AD2, can protrude toward the adhesive layer with the irregular shape.

[0169] Reference FIG. 5B The side surface of the first adhesive layer AD1 is recessed inward at the interface with the molding member 160. The side surface of the first adhesive layer AD1 has an inwardly recessed embossed shape AD_D2. That is, the interface between the first adhesive layer AD1 and the molding member 160, and the interface between the molding member 160 and the second adhesive layer AD2, can protrude toward the adhesive layer with the embossed shape.

[0170] In addition, refer to FIG. 1A and FIG. 1B The adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 in the first non-display area NA1 adjacent to the curved area BA have a flat shape at their interface with the molding member 160. Additionally, the adhesive layers AD1, AD2, AD3, AD4, and AD5 in the first non-display area NA1 not adjacent to the curved area BA have an inwardly recessed shape at their interface with the molding member 160, within the first adhesive layer AD1 and the second adhesive layer AD2.

[0171] For example, refer to FIG. 1A and FIG. 1B If the portion containing the curved area BA among the four surfaces of the display device 100 is defined as the top, then the bottom, left, and right sides are defined relative to the top. In this case, the multiple adhesive layers AD1, AD2, AD3, AD4, and AD5 in the first non-display areas NA1 of the bottom, left, and right sides of the display device 100 have an inwardly recessed shape at the interface with the molding member 160, resembling the first adhesive layer AD1 and the second adhesive layer AD2. Furthermore, the multiple adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 in the first non-display area NA1 of the top have a flat shape at the interface with the molding member 160. Here, the first non-display area NA1 of the top corresponds to an area that is not trimmed, ensuring that the side surfaces of the multiple adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 are not deformed due to trimming. Therefore, the multiple adhesive layers AD1, AD2, AD3, AD4, AD6, AD7 and AD8 in the first non-display area NA1 on the top can be flat at the interface with the molded member 160.

[0172] More specifically, in the first non-display areas NA1 at the bottom, left, and right sides of the display device 100, the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 have an inwardly recessed shape at their interfaces with the molding member 160. Furthermore, the side surfaces of the third adhesive layer AD3, the fourth adhesive layer AD4, and the fifth adhesive layer AD5 have a flat shape at their interfaces with the molding member 160.

[0173] In the first non-display area NA1 at the bottom, left, and right sides, the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 are deformed by laser during the trimming process, resulting in an inwardly recessed shape at the interface with the molding member 160. Furthermore, after the trimming process, a bonding process is performed on the cover window 120, the metal plate 140, and the frame 150, ensuring that the side surfaces of the third adhesive layer AD3, the fourth adhesive layer AD4, and the fifth adhesive layer AD5 are unaffected by the trimming process, thus achieving a flat shape at the interface with the molding member 160.

[0174] The multiple adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 in the first non-display area NA1 on the top can be flat at their interface with the molding member 160. That is, in the non-display area NA on the top adjacent to the curved area BA, the interface between the molding member 160 and the multiple adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 has a flat shape. In other words, in the non-display area NA adjacent to the curved area BA, the interface between the first adhesive layer AD1 and the second adhesive layer AD2, provided on the top and bottom of the display panel PN, and the molding member 160 can have a flat shape. As described above, this is because the first non-display area NA1 on the top is an untrimmed area, so that the side surfaces of the multiple adhesive layers AD1, AD2, AD3, AD4, AD6, AD7, and AD8 are not deformed by trimming and have a flat shape at their interface with the molding member 160.

[0175] In display devices, a separate cover unit can be positioned below a cover window to protect components such as the display panel. However, when a separate cover unit is used, it is typically positioned at a predetermined distance from the display panel to minimize interference between the display panel and the cover unit. Therefore, in display devices where a separate cover unit is positioned below a cover window, achieving a narrow bezel is difficult due to the space between the display panel and the cover unit.

[0176] Therefore, in the display device 100, the molded member 160 of the components of the display device 100 is provided below the cover window 120 to minimize the size of the bezel area.

[0177] However, when the heating and cooling process is repeated on the display device, the components of the display panel PN of the display device 100 expand and contract, and the molding member 160 also expands and contracts. If this process is repeated, stress is generated on the display panel PN, causing the display panel PN to crack, which leads to a defect in the display device 100 caused by the crack.

[0178] Therefore, in the display device 100 according to an exemplary embodiment of the present disclosure, a portion of the side surface of some of the plurality of adhesive layers AD1, AD2, AD3, AD4, and AD5 at the interface with the molding member 160 has an inwardly recessed shape. This reduces or minimizes the stress on the display panel PN caused by the shrinkage and expansion of the molding member 160 under reliable conditions. Specifically, the side surfaces of some of the plurality of adhesive layers AD1, AD2, AD3, AD4, and AD5 disposed between the display panel PN and the cover window 120, and between the display panel PN and the frame 150, have an inwardly recessed shape at the interface with the molding member 160. That is, the interfaces between the first adhesive layer AD1 and the second adhesive layer AD2 disposed at the top and bottom of the display panel PN and the molding member 160 can be formed in a shape protruding toward the first adhesive layer AD1 and the second adhesive layer AD2 to reduce or minimize the stress on the display panel PN caused by the shrinkage and expansion of the molding member 160. By doing so, in the display device 100 according to an exemplary embodiment of the present disclosure, a portion of the interface between the side surfaces of the plurality of adhesive layers AD1, AD2, AD3, AD4, and AD5 and the molding member 160 has an inwardly recessed shape. For example... FIG. 4 As shown, in the region adjacent to the curved region in the first non-display area, the side surfaces of the plurality of adhesive layers AD3, AD4, and AD5 have a flat shape at the interface with the molding member, and in other regions of the first non-display area, the side surfaces of the plurality of adhesive layers AD1 and AD2 have an inwardly recessed shape at the interface with the molding member. Therefore, the stress generated by the contraction and expansion of the molding member 160 is relieved to suppress cracks generated in the display panel PN, thereby reducing or minimizing defects in the display device 100.

[0179] FIG. 6 This is a cross-sectional view of a display device according to another exemplary embodiment of the present disclosure. FIG. 7A yes FIG. 6 Enlarged cross-sectional view of region E. FIG. 7B yes FIG. 6 An enlarged cross-sectional view of region F. FIG. 6 For ease of description, only the display panel PN, cover window 120, polarizer POL, back plate 130, metal plate 140, frame 150 and molding component 160 of the display device 200 are shown. FIG. 6 The display device 200 also includes a barrier layer 270, but other components are similar to... FIG. 1A to FIG. 4 Since the display device 100 is the same, repeated descriptions will be omitted.

[0180] Reference FIG. 6The barrier layer 270 can be set in a first non-display area NA1 that is not adjacent to the curved area BA.

[0181] The barrier layer 270 serves as a barrier between the side surface of the polarizer POL, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, and the side surface of the frame 150, and the molding member 160. Therefore, the barrier layer 270 is disposed in the portion between the molding member 160 and the side surfaces of the polarizer POL, the display panel PN, the back plate 130, the metal plate 140, and the frame 150.

[0182] In other words, the barrier layer 270 can be disposed in the first non-display area NA1, which is not adjacent to the bending area BA, on the side surface of the molding member 160 and the polarizer POL, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, and the side surface of the frame 150.

[0183] Furthermore, the barrier layer 270 may be further disposed in a portion or all of the bottom surface of the frame 150. For example, the barrier layer 270 may be disposed on the side surface of the polarizer POL, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, and the side surface of the frame 150, and further extend to surround a portion of the bottom surface of the frame 150. As another example, the barrier layer 270 may extend to surround the entire bottom surface of the frame 150.

[0184] The barrier layer 270 may include, but is not limited to, multiple particles formed of epoxy resin or polyurethane. For example, after the cover window 120 and frame 150 are joined to the top and bottom of the display panel PN, and before the injection molding member 160 is formed, the barrier layer 270 may be filled after multiple particles are placed on the side surfaces of the polarizer POL, the display panel PN, the back plate 130, the metal plate 140, and the frame 150.

[0185] Reference FIG. 6 and FIG. 7A The barrier layer 270 is provided with an inwardly recessed shape along the interface between the first adhesive layer AD1 and the molded member 160 located above the display panel PN. Furthermore, as... FIG. 7A As shown, the barrier layer 270 is provided with an inwardly recessed shape along the interface between the second adhesive layer AD2 and the molding member 160 located below the display panel PN.

[0186] Reference FIG. 6 and FIG. 7BThe barrier layer 270 can be provided in a flat shape between the side surface of the display panel PN and the molding member 160. That is, the barrier layer 270 can be provided not only in a flat shape between the side surface of the polarizer POL, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, the side surface of the frame 150 and the molding member 160, but also in a flat shape between the side surface of the third adhesive layer AD3, the side surface of the fourth adhesive layer AD4 and the side surface of the fifth adhesive layer AD5 and the molding member 160, but is not limited to this.

[0187] Furthermore, when the interface between the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 disposed on the top and bottom of the display panel PN and the molding member 160 has a flat shape, the barrier layer 270 can also be disposed along the flat shape.

[0188] In another exemplary embodiment of the display device 200 according to this disclosure, a barrier layer 270 may be provided at the interface with the molding member 160, such that the stress on the display panel PN caused by the shrinkage and expansion of the molding member 160 can be reduced or minimized. Therefore, the reliability of the components provided on the display panel PN can be improved.

[0189] FIG. 8 This is a cross-sectional view of a display device according to yet another exemplary embodiment of the present disclosure. FIG. 9A yes FIG. 8 Enlarged cross-sectional view of region E. FIG. 9B yes FIG. 8 An enlarged cross-sectional view of region F. FIG. 8 For ease of explanation, only the display panel PN, cover window 120, polarizer POL, back plate 130, metal plate 140, frame 150 and molding component 160 of the display device 300 are shown. FIG. 8 The display device 300 also includes a barrier layer 370, while other components... FIG. 1A to FIG. 4 Since the display device 100 is the same, repeated descriptions will be omitted.

[0190] Reference FIG. 8 The barrier layer 370 can be set in a first non-display area NA1 that is not adjacent to the curved area BA.

[0191] The barrier layer 370 serves as a barrier between the side surfaces of the polarizer POL, the display panel PN, the backplate 130, the metal plate 140, and the frame 150, and the molding member 160. Therefore, the barrier layer 270 is disposed in the portion between the molding member 160 and the side surfaces of the polarizer POL, the display panel PN, the backplate 130, the metal plate 140, and the frame 150. The barrier layer 370 may be disposed between the molding member 160 and the side surfaces of the display panel PN and the side surfaces of the plurality of adhesive layers AD1, AD2, AD3, AD4, and AD5. In other words, the barrier layer 370 may be disposed on the side surfaces of the molding member 160 and the polarizer POL, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, the side surface of the frame 150, and the side surfaces of the multiple adhesive layers AD1, AD2, AD3, AD4 and AD5 in the first non-display area NA1 that is not adjacent to the bending area BA, but is not limited thereto.

[0192] Furthermore, the barrier layer 370 may be further disposed in a portion or all of the bottom surface of the frame 150. For example, the barrier layer 370 may be disposed on the side surface of the polarizer POL, the side surface of the display panel PN, the side surface of the back plate 130, the side surface of the metal plate 140, and the side surface of the frame 150, and further extend to surround a portion of the bottom surface of the frame 150. As another example, the barrier layer 370 may extend to surround the entire bottom surface of the frame 150, but is not limited thereto.

[0193] The barrier layer 370 may be formed as a single layer of epoxy resin or polyurethane, but is not limited thereto. For example, after the cover window 120 and the frame 150 are joined to the top and bottom of the display panel PN, and before the molding member 160 is injected, the molding member 160 is filled with and cured with a material for forming the liquid barrier layer 370 on the side surfaces of the polarizer POL, the side surfaces of the display panel PN, the side surfaces of the back plate 130, the side surfaces of the metal plate 140, and the side surfaces of the frame 150, to form the barrier layer 370 at the interface with the molding member 160.

[0194] Reference FIG. 8 and FIG. 9A The barrier layer 370 can be provided in an inwardly recessed shape along the interface between the first adhesive layer AD1 and the molded member 160 located above the display panel PN. Furthermore, as... FIG. 9A As shown, the barrier layer 370 can be configured in an inwardly recessed shape along the interface between the second adhesive layer AD2 located below the display panel PN and the molding member 160.

[0195] Reference FIG. 8 andFIG. 9B The barrier layer 370 can be provided in a flat shape between the side surface of the display panel PN and the molding member 160. That is, the barrier layer 370 can be provided not only in a flat shape between the side surfaces of the polarizer POL, the display panel PN, the backplate 130, the metal plate 140, and the frame 150 and the molding member 160, but also in a flat shape between the side surfaces of the third adhesive layer AD3, the fourth adhesive layer AD4, and the fifth adhesive layer AD5 and the molding member 160. FIG. 8 As shown, in the region adjacent to the curved region in the first non-display area, the side surfaces of the plurality of adhesive layers AD3, AD4, and AD5 have a flat shape at the interface with the molding member, and in other regions of the first non-display area, the side surfaces of the plurality of adhesive layers AD1 and AD2 have an inwardly recessed shape at the interface with the molding member. Therefore, the stress generated by the contraction and expansion of the molding member 160 is relieved to suppress cracks generated in the display panel PN, thereby reducing or minimizing defects in the display device 100.

[0196] Furthermore, even when the interface between the side surfaces of the first adhesive layer AD1 and the second adhesive layer AD2 disposed on the top and bottom of the display panel PN and the molding member 160 has a flat shape, the barrier layer 370 is disposed along the flat shape.

[0197] In another exemplary embodiment of the display device 300 according to this disclosure, a barrier layer 370 may be provided at the interface with the molding member 160, such that the stress on the display panel PN caused by the shrinkage and expansion of the molding member 160 can be reduced or minimized. As a result, cracks in the display panel PN can be suppressed, thereby reducing or minimizing defects in the display device 300.

[0198] Exemplary embodiments of this disclosure can also be described as follows:

[0199] According to one aspect of this disclosure, a display device includes: a cover window; a display panel located below the cover window and including a display area, a first non-display area surrounding the display area, a curved area extending from one side of the first non-display area, and a second non-display area extending from one side of the curved area; a frame located below the display panel; a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame; and a molding member located below the cover window to cover a side surface of the display panel, side surfaces of the plurality of adhesive layers, a side surface of the frame, and a portion of the bottom surface of the frame. Some of the adhesive layers have an inwardly recessed shape at a portion of their interface with the molding member.

[0200] Some of the adhesive layers may have irregular or embossed side surfaces.

[0201] The display device may further include: a polarizer between the cover window and the display panel; a back plate between the display panel and the frame; and a metal plate between the back plate and the frame. Molded components may be configured to surround the side surfaces of the polarizer, the back plate, and the metal plate.

[0202] Multiple adhesive layers may include a first adhesive layer between the polarizer and the display panel; and a second adhesive layer between the display panel and the backplate. The side surfaces of the first adhesive layer and the side surfaces of the second adhesive layer may have an inwardly recessed shape at the interface with the molded member.

[0203] The multiple adhesive layers may further include: a third adhesive layer between the cover window and the polarizer; a fourth adhesive layer between the back plate and the metal plate; and a fifth adhesive layer between the metal plate and the frame. The side surfaces of the third adhesive layer, the fourth adhesive layer, and the fifth adhesive layer may have a flat shape at their interfaces with the molded member.

[0204] In a first non-display area adjacent to the curved area, the side surfaces of the multiple adhesive layers may have a flat shape at the interface with the molded member, and in another first non-display area, the side surfaces of the multiple adhesive layers may have an inwardly recessed shape at a portion of the interface with the molded member.

[0205] The display device may further include a barrier layer disposed in the portion between the side surface of the molding member and the polarizer, the side surface of the display panel, the side surface of the back plate, the side surface of the metal plate, and the side surface of the frame.

[0206] The barrier layer can be set in a first non-display area that is not adjacent to the curved area.

[0207] The barrier layer may include epoxy resin or polyurethane.

[0208] The barrier layer can be formed as a single layer of epoxy resin or polyurethane.

[0209] The barrier layer may include multiple particles formed of epoxy resin or polyurethane.

[0210] The barrier layer can also be set in part or all of the bottom surface of the frame.

[0211] According to another aspect of this disclosure, a display device includes: a cover window; a display panel located below the cover window and including a display area, a first non-display area surrounding the display area, and a curved area extending from one side of the first non-display area; a molding member located below the cover window to cover a side surface of the display panel; and an adhesive layer on the top and bottom of the display panel such that a side surface of the adhesive layer is covered by the molding member. The interface between the molding member and the adhesive layer has a shape that protrudes toward the adhesive layer.

[0212] The interface between the molded part and the adhesive layer can have an irregular shape or an embossed shape.

[0213] The display device may further include: a polarizer between the cover window and the display panel; a back plate between the display panel and the frame; and a metal plate between the back plate and the frame, wherein the molding member is configured to surround the side surface of the polarizer, the side surface of the back plate, and the side surface of the metal plate.

[0214] The display device may also include other adhesive layers between the cover window and the polarizer, between the back panel and the metal plate, and between the metal plate and the frame.

[0215] The interface between the molded component and the adhesive layer in the non-display area adjacent to the curved area can have a flat shape.

[0216] The display device may also include a barrier layer between the molded member and the side surface of the display panel and the side surface of the adhesive layer.

[0217] The barrier layer may include epoxy resin or polyurethane.

[0218] The barrier layer can be formed as a single layer of epoxy resin or polyurethane.

[0219] The barrier layer may include multiple particles formed of epoxy resin or polyurethane.

[0220] The barrier layer can be set in a non-display area that is not adjacent to the curved area.

[0221] According to another aspect of this disclosure, a method for manufacturing a display device is provided, the method comprising: forming a display panel including a display area, a non-display area adjacent to the display area, and a curved area extending from one side of the non-display area; forming a cover window above the display panel; forming a frame below the display panel; forming a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame; and forming a molding member below the cover window to cover a side surface of the display panel, a side surface of the plurality of adhesive layers, a side surface of the frame, and a portion of the bottom surface of the frame, wherein the side surfaces of some of the plurality of adhesive layers have an inwardly recessed shape in a portion of their interface with the molding member.

[0222] According to another aspect of this disclosure, a method for manufacturing a display device is provided, the method comprising: forming a display panel including a display area, a non-display area adjacent to the display area, and a curved area extending from one side of the non-display area; forming a cover window above the display panel; forming a molding member below the cover window to cover a side surface of the display panel; and forming adhesive layers at the top and bottom of the display panel such that the side surfaces of the adhesive layer are covered by the molding member, wherein the interface between the adhesive layer and the molding member has a shape protruding toward the adhesive layer.

[0223] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope thereof should be interpreted as falling within the scope of the present disclosure.

[0224] Cross-references to related applications

[0225] This application claims priority and benefit to Korean Patent Application No. 10-2024-0120033, filed on September 4, 2024, with the Korean Intellectual Property Office, the entire contents of which are hereby expressly incorporated herein by reference for all purposes.

Claims

1. A display device, comprising: a cover window; a display panel below the cover window, and the display panel including a display area, a first non-display area surrounding the display area, a bending area to be bent extending from a side of the first non-display area, and a second non-display area extending from a side of the bending area; a frame below the display panel; a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame; and a molding member below the cover window to cover a side surface of the display panel, a side surface of the plurality of adhesive layers, a side surface of the frame, and a portion of a bottom surface of the frame; wherein a side surface of some of the plurality of adhesive layers has an inwardly concave shape in a portion of an interface with the molding member. The side surface of some of the plurality of adhesive layers has an irregular shape or an embossed shape.

2. The display device according to claim 1, wherein 3.The display device of claim 1, further comprising: a polarizer between the cover window and the display panel; a back plate between the display panel and the frame; and a metal plate between the back plate and the frame, wherein the molding member is disposed to surround a side surface of the polarizer, a side surface of the back plate, and a side surface of the metal plate. The plurality of adhesive layers includes: a first adhesive layer between the polarizer and the display panel; and 4. The display device according to claim 3, wherein a second adhesive layer between the display panel and the back plate, and wherein a side surface of the first adhesive layer and a side surface of the second adhesive layer have an inwardly concave shape at the interface with the molding member. The plurality of adhesive layers further includes: a third adhesive layer between the cover window and the polarizer; 5. The display device of claim 4, wherein, a fourth adhesive layer between the back plate and the metal plate; and a fifth adhesive layer between the metal plate and the frame, and wherein a side surface of the third adhesive layer, a side surface of the fourth adhesive layer, and a side surface of the fifth adhesive layer have a flat shape at the interface with the molding member. In a region of the first non-display area adjacent to the bending area, a side surface of the plurality of adhesive layers has a flat shape at the interface with the molding member, and in other regions of the first non-display area, a side surface of the plurality of adhesive layers has an inwardly concave shape at a portion of the interface with the molding member. 7.The display device of claim 3, further comprising:

6. The display device according to claim 3, wherein a barrier layer disposed in a portion between the molding member and a side surface of the polarizer, a side surface of the display panel, a side surface of the back plate, a side surface of the metal plate, and a side surface of the frame. ​ ​ 8. The display device of claim 7, wherein, The barrier layer is provided in a region of the first non-display region that is not adjacent to the bending region.

9. The display device according to claim 7, wherein The barrier layer includes an epoxy resin or a polyurethane.

10. The display device of claim 9, wherein, The barrier layer is formed as a single layer formed of an epoxy resin or a polyurethane.

11. The display device of claim 9, wherein, The barrier layer includes a plurality of particles formed of an epoxy resin or a polyurethane.

12. The display device of claim 7, wherein, The barrier layer is also provided in a part or all of the bottom surface of the frame.

13. A display device, comprising: a cover window; a display panel below the cover window, and including a display region, a first non-display region surrounding the display region, and a bending region to be bent extending from one side of the first non-display region; a molded member below the cover window to cover a side surface of the display panel; and an adhesive layer on top and bottom of the display panel such that a side surface of the adhesive layer is covered by the molded member, wherein an interface of the molded member and the adhesive layer has a shape protruding toward the adhesive layer. The interface of the molded member and the adhesive layer has an irregular shape or an embossed shape.

14. The display device of claim 13, wherein, 15. The display device according to claim 13, further comprising: a polarizer between the cover window and the display panel; a back plate between the display panel and a frame of the display device; and a metal plate between the back plate and the frame, wherein the molded member is provided to surround a side surface of the polarizer, a side surface of the back plate, and a side surface of the metal plate.

16. The display device according to claim 15, further comprising another adhesive layer between the cover window and the polarizer, between the back plate and the metal plate, and between the metal plate and the frame. In a region of the non-display region adjacent to the bending region, the interface of the molded member and the other adhesive layer has a flat shape.

18. The display device according to claim 13, further comprising:

17. The display device of claim 16, wherein, a barrier layer between the molded member and a side surface of the display panel and a side surface of the adhesive layer. The barrier layer includes an epoxy resin or a polyurethane. The barrier layer is formed as a single layer formed of an epoxy resin or a polyurethane.

19. The display device of claim 18, wherein, The barrier layer includes a plurality of particles formed of an epoxy resin or a polyurethane.

20. The display device of claim 19, wherein, The barrier layer is provided in a region of the non-display region that is not adjacent to the bending region.

21. The display device of claim 19, wherein, 23. A manufacturing method of a display device, comprising:

22. The display device of claim 18, wherein, forming a display panel including a display region, a non-display region adjacent to the display region, and a bending region extending from one side of the non-display region; forming a cover window above the display panel; forming a frame below the display panel; forming a plurality of adhesive layers between the display panel and the cover window and between the display panel and the frame; and ​ ​ ​ a molding member is formed below the cover window to cover a side surface of the display panel, side surfaces of the plurality of adhesive layers, a side surface of the frame, and a portion of a bottom surface of the frame, wherein a side surface of some of the plurality of adhesive layers has a shape that is recessed inward in a portion of an interface with the molding member.

24. A manufacturing method of a display device, the manufacturing method of a display device comprising: forming a display panel including a display area, a non-display area adjacent to the display area, and a bending area extending from one side of the non-display area; forming a cover window over the display panel; forming a molding member below the cover window to cover a side surface of the display panel; forming an adhesive layer at a top and a bottom of the display panel such that a side surface of the adhesive layer is covered by the molding member, wherein an interface of the adhesive layer and the molding member has a shape that protrudes toward the adhesive layer.

Images