Display device and electronic device including the same

Abstract

The invention relates to a display device and an electronic apparatus including the same. The display device includes: a display panel configured to be folded along a folding axis; and a protective member disposed on the display panel, in which the protective member includes: a protective substrate layer; a hard coating layer including a polymer derived from a coating composition, where the hard coating layer is disposed on the protective substrate layer; and an anti-reflection layer including a high refractive index layer and a low refractive index layer disposed on the high refractive index layer, in which the anti-reflection layer is disposed on the hard coating layer, in which the coating composition includes a silsesquioxane-based resin, an oxetane-based resin, a photopolymerization initiator, and silica nanoparticles, and in which the photopolymerization initiator is a photopolymerization initiator based on the total weight of the coating composition. The first weight of the silica nanoparticles is from about 3 wt% to about 5 wt%.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0117333, filed on August 30, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to display devices (e.g., foldable display devices) and electronic devices including display devices. Background Technology

[0004] Various electronic devices (such as televisions, mobile phones, tablet computers, and game consoles) are currently under development. Recently, flexible electronic devices, including flexible display panels capable of folding, rolling, or sliding, are being developed. Unlike rigid electronic devices, flexible electronic devices can be folded or rolled. Regardless of the size of existing screens, flexible electronic devices that can change shape in various ways can be carried, thereby increasing user convenience. Flexible electronic devices may include layers that maintain the reliability of flexible operation. Summary of the Invention

[0005] According to an embodiment of the present invention, a display device includes: a display panel configured to fold along a folding axis; and a protective member disposed on the display panel, wherein the protective member includes: a protective substrate layer; a hard coating layer comprising a polymer derived from a coating composition, wherein the hard coating layer is disposed on the protective substrate layer; and an anti-reflective layer comprising a high refractive index layer and a low refractive index layer disposed on the high refractive index layer, wherein the anti-reflective layer is disposed on the hard coating layer, wherein the coating composition includes a silsesquioxane resin, an oxetane resin, a photopolymerization initiator, and silica nanoparticles, and wherein, based on the total weight of the coating composition, the first weight of the silica nanoparticles is about 3 wt% to about 5 wt%.

[0006] In an embodiment of the invention, based on the total weight of the coating composition, the sum of the second weight of the silsesquioxane resin and the third weight of the oxetane resin is about 93 wt% to about 95 wt%.

[0007] In embodiments of the present invention, the silsesquioxane resin includes at least one of T-type silsesquioxane units, D-type silsesquioxane units, and M-type silsesquioxane units.

[0008] In embodiments of the present invention, the silsesquioxane resin comprises 7 or 8 siloxane units.

[0009] In embodiments of the present invention, the oxobutane resin includes a portion represented by the following formula 1.

[0010] [Formula 1]

[0011]

[0012] In Equation 1, n1 is an integer selected from 3 to 100.

[0013] In embodiments of the present invention, the photopolymerization initiator includes triarylsulfonium hexafluoroantimonate.

[0014] In embodiments of the present invention, the weight of the photopolymerization initiator is about 2 wt% or less, based on the total weight of the coating composition.

[0015] In embodiments of the present invention, the diameter of the silica nanoparticles is about 20 nm to about 60 nm.

[0016] In embodiments of the present invention, the silica nanoparticles include hydroxyl groups on their surface.

[0017] In embodiments of the present invention, the coating composition further includes a solvent, and the solvent includes at least one selected from 1-methoxy-2-methyl-2-propanol, 1-methoxy-2-propanol, and 2-butanone.

[0018] In an embodiment of the present invention, the high refractive index layer comprises niobium pentoxide (Nb2O5) and titanium dioxide (TiO2), and the ratio of the fourth weight to the fifth weight is about 7:3 to about 9:1 based on the sum of the fourth weight of niobium pentoxide and the fifth weight of titanium dioxide.

[0019] In embodiments of the present invention, the high refractive index layer and the low refractive index layer are provided as a plurality of high refractive index layers and a plurality of low refractive index layers, and the plurality of high refractive index layers and the plurality of low refractive index layers are alternately disposed on the hard coating layer.

[0020] In embodiments of the present invention, the thickness of the hard coating is from about 1 μm to about 8 μm.

[0021] In embodiments of the invention, the hard coating has a reflectivity including a specular component (SCI) of about 0.5% to about 1.5%.

[0022] In embodiments of the present invention, the hard coating has a hardness of about 0.22 GPa to about 0.32 GPa, and the elastic modulus of the hard coating is about 2.78 GPa to about 3.78 GPa.

[0023] In embodiments of the present invention, the protective substrate layer comprises at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene vinyl alcohol copolymer.

[0024] According to an embodiment of the present invention, an electronic device includes: a display device including a module region; and an electronic module configured to correspond to the module region, wherein the display device includes: a display panel configured to fold along a folding axis; and a protective member disposed on the display panel, wherein the protective member includes: a protective substrate layer; a hard coating layer including a polymer derived from a coating composition, wherein the hard coating layer is disposed on the protective substrate layer; and an anti-reflective layer including a high refractive index layer and a low refractive index layer disposed on the high refractive index layer, wherein the anti-reflective layer is disposed on the hard coating layer, wherein the coating composition includes a silsesquioxane resin, an oxetane resin, a photopolymerization initiator, and silica nanoparticles, and wherein, based on the total weight of the coating composition, the first weight of the silica nanoparticles is about 3 wt% to about 5 wt%.

[0025] In an embodiment of the invention, based on the total weight of the coating composition, the sum of the second weight of the silsesquioxane resin and the third weight of the oxetane resin is about 93 wt% to about 95 wt%.

[0026] In embodiments of the present invention, the photopolymerization initiator comprises triarylsulfonium hexafluoroantimonate, and the oxobutane resin comprises a portion represented by the following formula 1.

[0027] [Formula 1]

[0028]

[0029] In Equation 1, n1 is an integer selected from 3 to 100.

[0030] According to an embodiment of the present invention, an electronic device includes: a processor; a memory storing applications for execution by the processor; a display device including: a display panel configured to fold along a folding axis; and a protective member disposed on the display panel, wherein the protective member includes: a protective substrate layer; a hard coating comprising a polymer derived from a coating composition, wherein the hard coating is disposed on the protective substrate layer; and an anti-reflective layer comprising a high refractive index layer and a low refractive index layer disposed on the high refractive index layer, wherein the anti-reflective layer is disposed on the hard coating layer, wherein the high refractive index layer comprises niobium pentoxide and titanium dioxide, wherein the coating composition comprises silsesquioxane resin, oxetane resin, photopolymerization initiator, and silica nanoparticles, and wherein the first weight of the silica nanoparticles is about 3 wt% to about 5 wt% based on the total weight of the coating composition; and a user interface configured to sense user input via touch or cursor selection of icons presented on the display panel, wherein when user input is received, the processor executes one or more stored applications. Attached Figure Description

[0031] The above and other objects and features of the invention will become apparent from the detailed description of embodiments of the invention with reference to the accompanying drawings.

[0032] Figure 1 A perspective view of an electronic device for illustrating embodiments of the present invention;

[0033] Figure 2 A perspective view of an electronic device for illustrating embodiments of the present invention;

[0034] Figure 3 A plan view of an electronic device illustrating embodiments of the present invention;

[0035] Figure 4 A perspective view of an electronic device for illustrating embodiments of the present invention;

[0036] Figure 5 A perspective view of an electronic device for illustrating embodiments of the present invention;

[0037] Figure 6 A perspective view of an electronic device for illustrating embodiments of the present invention;

[0038] Figure 7 A perspective view of an electronic device for illustrating embodiments of the present invention;

[0039] Figure 8 An exploded perspective view of an electronic device for illustrating embodiments of the present invention;

[0040] Figure 9 To explain along Figure 8 A cross-sectional view of the portion intercepted by line I-I' in the diagram;

[0041] Figure 10 To explain Figure 9 An enlarged cross-sectional view of region XX' in the diagram;

[0042] Figure 11 A diagram illustrating silica nanoparticles according to an embodiment of the present invention;

[0043] Figure 12 To explain along Figure 8 A cross-sectional view of the portion intercepted by line II-II' in the diagram;

[0044] Figure 13 A block diagram illustrating an electronic device according to an embodiment of the present invention; and

[0045] Figure 14 Schematic diagrams illustrating electronic devices according to various implementation methods. Detailed Implementation

[0046] This invention can be modified in various ways and can be embodied in different forms, and exemplary embodiments will be explained in detail with reference to the accompanying drawings. However, this invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, all modifications, equivalents, and alternatives that fall within the spirit and scope of this invention should be included herein.

[0047] In the description, when an element (or area, layer, or component, etc.) is referred to as being "on" another element (or area, layer, or component, etc.), "connected" to another element (or area, layer, or component, etc.), or "combined" with another element (or area, layer, or component, etc.), it may be directly disposed on another element (or area, layer, or component, etc.), connected to another element (or area, layer, or component, etc.), or combined with another element (or area, layer, or component, etc.), or an intermediate third element (or area, layer, or component, etc.) may be disposed therein.

[0048] Throughout the specification and drawings, the same reference numerals refer to the same elements. Furthermore, various thicknesses, lengths, and angles are shown, and although the arrangements shown do represent embodiments of the invention, it should be understood that various modifications to the thicknesses, lengths, and angles are possible within the spirit and scope of this disclosure, and this disclosure is not necessarily limited to the specific thicknesses, lengths, and angles shown. The term "and / or" may include one or more combinations that may define the relevant elements.

[0049] It will be understood that although terms such as "first" or "second" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element without departing from the scope of the invention. Similarly, a second element may be referred to as a first element. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise.

[0050] Furthermore, terms such as “below,” “under,” “above,” and “above” are used to describe the relationships between the components illustrated in the accompanying drawings. These terms serve as spatial relative concepts and are described based on the directions indicated in the drawings. It will be understood that, in addition to the orientations depicted in the figures, the spatial relative terms are also intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features will then be oriented “above” other elements or features. Thus, the exemplary term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0051] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, it will be further understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an ideal or overly formal sense unless expressly so defined herein.

[0052] In this document, the term "substituted or unsubstituted" may indicate that the group is unsubstituted or substituted with at least one of the substituents selected from the group consisting of: deuterium, halogen, cyano, nitro, amino, amino, silyl, oxy, thio, sulfinyl, sulfonyl, carbonyl, boryl, alkyl, alkenyl, alkynyl, cycloalkyl, aryl, and heterocyclic groups. Additionally, each of the substituents presented above as examples may be substituted or unsubstituted. For example, biphenyl may be interpreted as aryl or as a phenyl group substituted with a phenyl group.

[0053] In the description, alkyl groups may be straight-chain, branched, or cyclic. The number of carbon atoms in the alkyl group may be 1 to 60, 1 to 50, 1 to 30, 1 to 20, 1 to 10, or 1 to 6. Examples of alkyl groups may include methyl, ethyl, n-propyl, isopropyl, cyclopropyl, n-butyl, sec-butyl, tert-butyl, isobutyl, 2-ethylbutyl, 3,3-dimethylbutyl, cyclobutyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, 1-methylpentyl, 3-methylpentyl, 2-ethylpentyl, 4-methyl-2-pentyl, cyclopentyl, n-hexyl, 1-methylhexyl, 2-ethylhexyl, 2-butylhexyl, cyclo Hexyl, 4-methylcyclohexyl, 4-butylcyclohexyl, n-heptyl, 1-methylheptyl, 2,2-dimethylheptyl, 2-ethylheptyl, 2-butylheptyl, cycloheptyl, dicycloheptyl, n-octyl, tert-octyl, 2-ethyloctyl, 2-butyloctyl, 2-hexyloctyl, 3,7-dimethyloctyl, cyclooctyl, n-nonyl, cyclononyl, n-decyl, cyclodecyl, norbornyl, 1-adamantyl, 2-adamantyl The following compounds are included: isobornyl, 2-ethyldecyl, 2-butyldecyl, 2-hexyldecyl, 2-octyldecyl, undecyl, dodecyl, 2-ethyldodecyl, 2-butyldodecyl, 2-hexyldodecyl, 2-octyldodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, 2-ethylhexadecyl, 2-butylhexadecyl, 2-hexylhexadecyl, heptadecanyl, octadecyl, nonadecanyl, eicosyl, 2-ethyleicosyl, 2-butyleicosyl, 2-hexyleicosyl, 2-octyleicosyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecanyl, nonadecanyl, nonadecanyl, and triadecyl, but the invention is not limited thereto.

[0054] In the description, alkenyl means a hydrocarbon group having at least one carbon-carbon double bond in the middle or at the end of an alkyl group having two or more carbon atoms. Alkenyl groups can be straight-chain or branched. The number of carbon atoms in the alkenyl group is not specifically limited, but can be 2 to 60, 2 to 30, 2 to 20, or 2 to 10. Examples of alkenyl groups may include, but are not limited to, vinyl, 1-butenyl, 1-pentenyl, 1,3-butadienyl, styryl, or styrylvinyl, etc.

[0055] In this description, aryl means any functional group or substituent derived from an aromatic hydrocarbon ring. Aryl can be monocyclic or polycyclic. The number of carbon atoms in the ring forming the aryl can be 6 to 60, 6 to 30, 6 to 20, or 6 to 15. Examples of aryl can include, but are not limited to, phenyl, naphthyl, fluorenyl, anthracene, phenanthryl, biphenyl, terphenyl, tetraphenyl, pentaphenyl, hexaphenyl, triphenylene, pyrene, benzofluoranthracene, or 1,2-benzophenanthryl.

[0056] In the description, alkoxy can mean the alkyl group defined above that is bonded to an oxygen atom. Alkoxy groups can be straight-chain, branched, or cyclic. The number of carbon atoms in an alkoxy group is not specifically limited, but can be, for example, 1 to 60, 1 to 30, 1 to 20, or 1 to 10. Examples of alkoxy groups include, but are not limited to, methoxy, ethoxy, n-propoxy, isopropoxy, butoxy, pentoxy, hexoxy, octoxy, nonoxy, or decoxy.

[0057] In the description, "*-" indicates the bonding location.

[0058] Embodiments of the present invention relate to display devices (e.g., foldable display devices) and electronic devices incorporated into foldable display devices. The display device includes a flexible display panel capable of folding along a folding axis and reinforced with a protective member. The protective member may include multiple layers: a protective base layer, a hard coating for durability, and an anti-reflective layer for improving visual clarity. The composition of the protective member ensures high reliability, allowing the display device to withstand repeated folding and unfolding without compromising functionality or appearance.

[0059] According to embodiments of the present invention, the hard coating may comprise a polymer derived from a coating composition comprising a silsesquioxane resin, an oxetane resin, a photopolymerization initiator, and silica nanoparticles. This composition provides a balance between hardness and flexibility, ensuring the display device can handle low-curvature folds (e.g., low-curvature folds with a radius of curvature as small as approximately 1.5 mm). Carefully sized and proportioned silica nanoparticles increase durability and abrasion resistance, ensuring the display device remains intact and scratch-resistant during use.

[0060] Additionally, the anti-reflective layer comprises alternating high-refractive-index and low-refractive-index materials, such as niobium pentoxide and titanium dioxide for the high-refractive-index layer and silicon dioxide for the low-refractive-index layer. These layers minimize glare and improve display quality by reducing SCI reflectivity. The display device according to embodiments of the present invention ensures flexibility and robustness, thereby maintaining performance during folding and unfolding cycles.

[0061] The following description will use reference to the accompanying drawings to illustrate a display device and an electronic device including the display device according to embodiments of the present invention. Figure 1 This is a perspective view of an electronic device EA in its unfolded state according to an embodiment of the present invention.

[0062] The electronic device EA according to embodiments of the present invention can be a device activated by an electrical signal. For example, the electronic device EA can be a smartphone, tablet computer, car navigation system, game console, or wearable device, but embodiments of the present invention are not limited thereto. Figure 1 In the example, the electronic device EA is explained as a smartphone.

[0063] An electronic device EA may include a first display surface FS, which is parallel to a plane defined by a first directional axis DR1 (or the first direction DR1) and a second directional axis DR2 (or the second direction DR2) intersecting the first directional axis DR1. The electronic device EA may provide an image IM to a user via the first display surface FS. The electronic device EA may display the image IM towards a third directional axis DR3 (or the third direction DR3) via the first display surface FS, which is parallel to each of the first and second directional axes DR1 and DR2. The image IM may include moving images and still images.

[0064] In the description, the first direction axis DR1 and the second direction axis DR2 may be orthogonal to each other, and the third direction axis DR3 may be the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the electronic device EA may be a direction parallel to the third direction axis DR3. The front surface (or, for example, the upper surface) and the rear surface (or, for example, the lower surface) of the electronic device EA are opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface (or, for example, the upper surface) and the rear surface (or, for example, the lower surface) may be parallel to the third direction axis DR3. The front surface (or, for example, the upper surface) of the electronic device EA may correspond to the first display surface FS, and the rear surface (or, for example, the lower surface) refers to the surface spaced apart from the first display surface FS along the third direction axis DR3. In addition, the rear surface (or, for example, the lower surface) of the electronic device EA may correspond to the second display surface RS, which will be described later. For example, the upper side refers to the direction close to the first display surface FS, and the lower side refers to the direction extending away from the first display surface FS.

[0065] A cross section refers to a surface parallel to the third direction DR3, and a plane refers to a surface perpendicular to the third direction DR3. A plane refers to a plane defined by the first direction axis DR1 and the second direction axis DR2.

[0066] The directions indicated by the first to third directional axes DR1, DR2, and DR3 as described in the specification are relative concepts and can be converted to other directions. Furthermore, the directions indicated by the first to third directional axes DR1, DR2, and DR3 can be described as first direction to third direction respectively, and the same reference numerals can be used.

[0067] An electronic device (EA) can detect external input applied from the outside. External input can include various types of input provided from outside the electronic device (EA). For example, external input can include contact via a part of the body (e.g., a user's hand), and external input applied near the electronic device (EA) or at a predetermined distance (e.g., hovering). As another example, external input can include contact via an object (e.g., a stylus). Furthermore, external input can take various forms (e.g., force (e.g., pressure), temperature, and light).

[0068] An electronic device EA may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active region F-AA, a first peripheral region F-NAA, and a sub-region MH. The second display surface RS may be defined as a surface opposite to at least a portion of the first display surface FS. For example, the second display surface RS may be defined as a portion of the rear surface of the electronic device EA.

[0069] The first active region F-AA can be a region activated based on an electrical signal. The first active region F-AA can be a region in which the image IM is displayed and various types of external inputs can be detected.

[0070] The first peripheral region F-NAA may be adjacent to the first active region F-AA. The light transmittance of the first peripheral region F-NAA may be lower than that of the first active region F-AA. The first peripheral region F-NAA may have a predetermined color. The first peripheral region F-NAA may at least partially surround the first active region F-AA. For example, the first peripheral region F-NAA may completely surround the first active region F-AA. Accordingly, the shape of the first active region F-AA may be substantially defined by the first peripheral region F-NAA. However, this is for illustrative purposes, and the first peripheral region F-NAA may be provided only on one side adjacent to the first active region F-AA, or the first peripheral region F-NAA may be omitted.

[0071] Sub-region MH can detect external objects received via display surfaces FS and RS, or provide sound signals (e.g., voice) to the outside via display surfaces FS and RS. Optical signals (e.g., visible light or infrared light) can be moved to sub-region MH.

[0072] Various electronic modules (ELM) can be configured. Figure 8 ), to correspond to the sub-region MH. For example, the electronic module ELM ( Figure 8 The electronic device EA may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The electronic device EA may include an electronic module ELM (…). Figure 8The Electronic Module (ELM) captures external images by using visible light passing through the sub-region MH and / or determines the presence and / or accessibility of external objects by using infrared light. For example, the ELM can utilize its visible light capability to capture a user's facial image for authentication purposes, ensuring secure access to the electronic device (EA). Simultaneously, the infrared light function can detect the proximity of a user's hand or face, ensuring features such as gesture-based interaction or automatic screen activation when the ELM senses the user's presence. Figure 8 It may include various configurations and is not limited to any one implementation.

[0073] The sub-region MH can be located within the first active region F-AA. However, this is for illustrative purposes only and is not limited to any particular implementation. For example, the sub-region MH can be surrounded by the first outer peripheral region F-NAA, or it can be surrounded by both the first active region F-AA and the first outer peripheral region F-NAA. Although Figure 1 It describes a subregion MH, but can provide multiple subregion MHs.

[0074] An electronic device EA according to an embodiment of the present invention may include at least one folded region FA and a plurality of non-folded regions NFA1 and NFA2 extending from the folded region FA. For example, a first non-folded region NFA1, a folded region FA, and a second non-folded region NFA2 may be defined along a second direction DR2. For example, the folded region FA may be disposed between the first non-folded region NFA1 and the second non-folded region NFA2. An electronic device EA according to an embodiment of the present invention may include a first non-folded region NFA1 and a second non-folded region NFA2 spaced apart from each other in the second direction DR2, with the folded region FA inserted between the first non-folded region NFA1 and the second non-folded region NFA2. For example, the first non-folded region NFA1 may be disposed on one side of the folded region FA along the second direction DR2, and the second non-folded region NFA2 may be disposed on the other side of the folded region FA along the second direction DR2.

[0075] although Figure 1 The present invention describes an electronic device EA including a folded region FA according to an embodiment of the present invention. However, the embodiments of the present invention are not limited thereto, and multiple folded regions may be included in the electronic device EA. For example, an electronic device according to an embodiment of the present invention may include two or more folded regions, and may also include three or more non-folded regions, wherein each of the folded regions is inserted between three or more non-folded regions.

[0076] Figure 2 A perspective view illustrating the folding operation of an electronic device EA according to an embodiment of the present invention. Figure 3A plan view illustrating the folded state of the electronic device EA according to an embodiment of the present invention. Figure 4 A perspective view illustrating the folding operation of an electronic device EA according to an embodiment of the present invention.

[0077] refer to Figure 2 According to an embodiment of the present invention, the electronic device EA can be folded based on a first folding axis FX1 extending in a first direction DR1. In the folded state of the electronic device EA, the folded region FA can have a predetermined curvature and radius of curvature. The electronic device EA can be folded based on the first folding axis FX1 such that the first non-folded region NFA1 and the second non-folded region NFA2 face each other, and can be converted to an inward folded state so that the first display surface FS is not exposed to the outside.

[0078] Figure 3 This can be a plan view illustrating the electronic device EA in its inward-folded state. (Reference) Figure 3 In the electronic device EA according to an embodiment of the present invention, the second display surface RS is visible to the user in its inwardly folded state. In this case, the second display surface RS may include a second active region R-AA for displaying images and a second peripheral region R-NAA. The second active region R-AA may be a region activated according to an electrical signal. The second active region R-AA may be a region in which images are displayed and various types of external inputs can be detected.

[0079] The second peripheral region R-NAA may be adjacent to the second active region R-AA. The light transmittance of the second peripheral region R-NAA may be lower than that of the second active region R-AA. The second peripheral region R-NAA may have a predetermined color. The second peripheral region R-NAA may at least partially surround the second active region R-AA. For example, the second peripheral region R-NAA may completely surround the second active region R-AA. The electronic device EA may further include a sub-region on the second display surface RS in which electronic modules including various configurations are disposed, and is not limited to any one embodiment.

[0080] refer to Figure 4 According to an embodiment of the present invention, the electronic device EA can be folded based on a second folding axis FX2 extending in a first direction DR1. The electronic device EA can be folded based on the second folding axis FX2 and converted to an outward folded state so that the first display surface FS is exposed to the outside. For example, the first non-folded region NFA1 and the second non-folded region NFA2 can face opposite directions to each other. In embodiments of the present invention, the electronic device EA can be configured such that an inward folding operation or an outward folding operation is repeated interactively with an unfolding operation, but embodiments of the present invention are not limited thereto.

[0081] exist Figures 1 to 4In this invention, folding is illustrated based on a folding axis FX1 or FX2, but the number of folding axes and the number of non-folded areas according to the folding axes in the electronic device EA according to embodiments of the invention are not limited thereto. For example, the electronic device EA may be folded based on multiple folding axes such that a portion of each of the first display surface FS and the second display surface RS faces each other. Furthermore, the first folding axis FX1 and the second folding axis FX2 are illustrated as being parallel to the long side of the electronic device EA, but embodiments of the invention are not limited thereto, and the first folding axis FX1 and the second folding axis FX2 may be parallel to the short side of the electronic device EA.

[0082] In an electronic device EA, each of the first non-folding region NFA1 and the second non-folding region NFA2 may be defined as having display surfaces FS and RS, as shown in the figure. Figure 3 The folded region FA is a portion of a plane defined by a first direction axis DR1 and a second direction axis DR2 in the folded state, and the folded region FA can be defined as the area between a first non-folded region NFA1 and a second non-folded region NFA2. The folded region FA may include a curved portion that is bent in the folded state to have a predetermined curvature and radius of curvature.

[0083] Figures 5 to 7 A perspective view illustrating an electronic device EA-a according to an embodiment of the present invention. Figure 5 A perspective view illustrating the unfolded state of the electronic device EA-a. Figure 6 and Figure 7 A perspective view illustrating the folding operation of the electronic device EA-a. Figure 6 To explain Figure 5 A perspective view illustrating the inward folding operation of the electronic device EA-a. Figure 7 To explain Figure 5 A perspective view illustrating the outward folding operation of the electronic device EA-a.

[0084] The electronic device EA-a can be folded based on a third folding axis FX3 parallel to the first direction axis DR1. (Reference) Figure 6 and Figure 7 The extension direction of the third folding axis FX3 can be parallel to the extension direction of the short side of the electronic device EA-a.

[0085] The electronic device EA-a can be divided into a folded region FA-a, a first non-folded region NFA1-a adjacent to one side of the folded region FA-a, and a second non-folded region NFA2-a adjacent to the other side of the folded region FA-a. The first non-folded region NFA1-a and the second non-folded region NFA2-a can be spaced apart from each other, with the folded region FA-a located between the first non-folded region NFA1-a and the second non-folded region NFA2-a.

[0086] The folded region FA-a can be the area where the electronic device EA-a is folded based on the third folding axis FX3. If the electronic device EA-a is folded, the folded region FA-a can have a predetermined curvature and radius of curvature. The first non-folded region NFA1-a and the second non-folded region NFA2-a face each other, and the electronic device EA-a can be folded inward so that the display surface FS-a is not exposed to the outside.

[0087] refer to Figure 5 In an embodiment of the present invention, in the unfolded state (i.e., in the folded state), the display surface FS-a of the electronic device EA-a is visible to the user. (See reference...) Figures 1 to 4 Similarly, the display surface FS-a of the electronic device EA-a may include an active region F-AAa, a peripheral region F-NAAa, and a sub-region MH-a. The active region F-AAa may be the area in which the image IM is displayed and various forms of external input can be detected.

[0088] refer to Figure 6 When the electronic device EA-a according to an embodiment of the present invention is in an inwardly folded state, the back RS-a is visible to the user. For example, the back RS-a can be used as a second display surface for displaying video or images. In addition, the back RS-a may also be provided with sub-regions in which electronic modules including various configurations are disposed.

[0089] refer to Figure 7 The electronic device EA-a can be folded based on the third folding axis FX3 and converted to an outward folded state, wherein one region of the back RS-a that overlaps with the first non-folded region NFA1-a and another region of the back RS-a that overlaps with the second non-folded region NFA2-a face each other. For example, when the electronic device EA-a is in the outward folded state, the first non-folded region NFA1-a and the second non-folded region NFA2-a may face opposite directions.

[0090] Figure 8 for Figure 1 The diagram below illustrates the exploded perspective of an electronic device EA. The description of the electronic device EA below can also be applied to... Figures 5 to 7 The electronic device EA-a is explained in the text.

[0091] Figure 8 An exploded perspective view illustrating an electronic device EA according to an embodiment of the present invention. (Reference) Figure 8The electronic device EA may include an electronic module ELM and a display device DD. Additionally, the electronic device EA may further include a housing HAU. In embodiments of the invention, the display device DD may include a display module DM and a protective member RM disposed on the display module DM. The display device DD may have a module region DM-MH provided therein, and the electronic module ELM may be configured to correspond to the module region DM-MH.

[0092] The protective component RM can be located at the top of the electronic device EA. For example, the protective component RM can be the front surface of the electronic device EA. The image IM generated from the display module DM... Figure 1 It can be provided to the user through the protective member RM. The protective member RM can be based on the folding axis FX1 ( Figure 2 ) and folding axis FX2 ( Figure 4 At least one fold in the structure. In embodiments of the invention, the protective member RM exhibits properties that prevent damage (e.g., cracking) during low-curvature folding and facilitate repeated folding and unfolding. Low-curvature folding can mean folding to a small radius of curvature of about 2.0 mm or less, or about 1.5 mm or less. Accordingly, a display device DD including a protective member RM and an electronic device EA including a display device DD according to embodiments of the invention exhibit increased reliability.

[0093] The display device DD may further include an upper adhesive layer AP-R. The upper adhesive layer AP-R may be disposed between the display module DM and the protective member RM. The protective member RM and the display module DM can be bonded to each other via the upper adhesive layer AP-R. The upper adhesive layer AP-R may include pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear adhesive resin (OCR). However, this is for illustrative purposes and embodiments of the invention are not limited thereto. Unlike the accompanying drawings, the upper adhesive layer AP-R may be omitted.

[0094] The display module DM can display images based on electrical signals and transmit / receive information about external inputs. The display area DM-DA and the non-display area DM-NDA are provided within the display module DM. Additionally, the module area DM-MH is provided within the display module DM.

[0095] The display area DM-DA can be defined as the area for transmitting images provided from the display module DM. The display area DM-DA of the display module DM can correspond to the first active area F-AA. Figure 1 At least a part of ).

[0096] The driving circuitry or driving wiring for driving the display area DM-DA may be disposed in the non-display area DM-NDA. The non-display area DM-NDA may be adjacent to the display area DM-DA. For example, the non-display area DM-NDA may at least partially surround the display area DM-DA. However, this is illustrative, and the non-display area DM-NDA may be defined in various shapes and is not limited to any one embodiment.

[0097] Module area DM-MH can correspond to Figure 1 The sub-region MH is illustrated in the diagram. Optical signals can be moved to the module region DM-MH. The module region DM-MH can be located in the display region DM-DA. However, this is for illustration only and is not limited to any particular implementation.

[0098] The Electronic Module (ELM) can be configured to correspond to the module area DM-MH. The ELM can be an electronic component that outputs and / or receives optical signals. The ELM may include a camera module and / or a proximity sensor. The camera module can capture external images via the module area DM-MH.

[0099] The display module DM may include a foldable display portion FP-D and non-foldable display portions NFP1-D and NFP2-D. The foldable display portion FP-D may correspond to the folding area FA of the electronic device EA. Figure 1 Furthermore, the non-folding display portions NFP1-D and NFP2-D can correspond to the non-folding area NFA1 of the electronic device EA. Figure 1 ) and NFA2 ( Figure 1 ).

[0100] The folding display section FP-D can be folded along the folding axis FX1 ( Figure 2 ) and folding axis FX2 ( Figure 4 The non-folding display portions NFP1-D and NFP2-D may include a first non-folding display portion NFP1-D and a second non-folding display portion NFP2-D. The first non-folding display portion NFP1-D and the second non-folding display portion NFP2-D may be spaced apart from each other in the second direction DR2, and the folding display portion FP-D is inserted between the first non-folding display portion NFP1-D and the second non-folding display portion NFP2-D. The first non-folding display portion NFP1-D may be corresponding to the first non-folding region NFA1 ( Figure 1 The second non-folding display portion NFP2-D can be the portion corresponding to the second non-folding area NFA2. Figure 1 (part of)

[0101] The housing HAU may comprise a material with relatively high rigidity. For example, the housing HAU may comprise multiple frames and / or panels made of glass, plastic, or metal. The housing HAU provides a predetermined receiving space. Through the housing HAU, the display module DM can be housed within the receiving space and protected from external impacts.

[0102] Figure 9 To explain along Figure 8 The cross-sectional view of the portion intercepted by line I-I' is shown in the figure. Figure 9 This can be a cross-sectional view illustrating the electronic device EA according to an embodiment of the present invention. Figure 9 For ease of explanation, the outer shell HAU has been omitted. Figure 8 ).

[0103] refer to Figure 9 The electronic device EA may further include a lower module LM, a lower adhesive layer AP-D, and a lower protective film DF. The lower module LM, lower adhesive layer AP-D, and lower protective film DF may be disposed on the display device DD and the housing HAU. Figure 8 )between.

[0104] The lower module LM can be located below the display module DM. The lower module LM may include a support plate MP and a lower support member (e.g., a layer) BSM. Figure 9 The lower module LM described herein is an example configuration, and the combination of configurations included in the lower module LM in the electronic device EA of the embodiments of the present invention may vary depending on the size, shape, or operating characteristics of the electronic device EA.

[0105] The support plate MP may be made of a metallic or polymeric material. For example, the support plate MP may be formed of stainless steel, aluminum, or an alloy thereof. Alternatively, the support plate MP may be formed of a polymeric material. Multiple openings OP may be defined in the support plate MP. The support plate MP may include an opening pattern OP-PT defining the multiple openings OP. The opening pattern OP-PT may be formed in the folded region FA.

[0106] The lower support member (BSM) may include a support member (SPM) and a filler portion (SAP). In plan view, the support member (SPM) may be configured to overlap a large portion of the display module (DM). The filler portion (SAP) may be configured to be located outside the support member (SPM) and overlap with the outer edge of the display module (DM). For example, from a plan view, the filler portion (SAP) may be positioned around the outer edge of the support member (SPM). For example, the filler portion (SAP) may overlap with the outer periphery of the display module (DM).

[0107] The support member SPM may include at least one of the support layer SP, the padding layer CP, the shielding layer EMP, and the interlayer adhesive layer ILP. Figure 9The configuration of the support member SPM described herein is illustrative, and embodiments of the present invention are not limited thereto. For example, some of the support layer SP, padding layer CP, shielding layer EMP, and interlayer adhesive layer ILP may be omitted, or the stacking order may be changed to match the configuration described herein. Figure 9 The order described may differ from the order described, or additional configurations beyond the described configuration may be included in the support member SPM. For example, another layer may be included in the support member SPM.

[0108] The support layer SP may comprise a metallic or polymeric material. The support layer SP may be disposed below the support plate MP. For example, the support layer SP may be a thin film comprising a metal substrate. The support layer SP may comprise a first sub-support layer SP1 and a second sub-support layer SP2 spaced apart from each other in the second direction DR2. The space between the first sub-support layer SP1 and the second sub-support layer SP2 may correspond to the folding axis FX1 (…). Figure 2 ) and folding axis FX2 ( Figure 4 In the region of FA, the support layer SP can be provided as a first sub-support layer SP1 and a second sub-support layer SP2 spaced apart from each other, thereby more effectively increasing the folding capability of the electronic device EA.

[0109] A cushioning layer CP may be disposed beneath the support layer SP. The cushioning layer CP prevents the support plate MP from being subjected to compression effects or plastic deformation due to external impacts and / or forces. For example, the cushioning layer CP can absorb forces from accidental drops or heavy objects pressing on the electronic device EA, preventing dents or permanent bending of the support plate MP. The cushioning layer CP can increase the impact resistance of the electronic device EA. For example, the cushioning layer CP may comprise an elastomer (e.g., sponge, foam, or urethane resin). Additionally, the cushioning layer CP may be formed from at least one of acrylic polymers, urethane polymers, silicone polymers, and imide polymers. However, this is illustrative, and embodiments of the invention are not limited thereto.

[0110] The padding layer CP may include a first sub-padding layer CP1 and a second sub-padding layer CP2 spaced apart from each other in the second direction DR2. The first sub-padding layer CP1 and the second sub-padding layer CP2 may be located corresponding to the folding axis FX1 ( Figure 2 ) and folding axis FX2 ( Figure 4 The pads are spaced apart from each other at certain points. For example, the space between the first sub-pad CP1 and the second sub-pad CP2 can be positioned to correspond to the folding axes FX1 and FX2. The pads CP can improve the folding characteristics of the electronic device EA by providing spaced first sub-pads CP1 and second sub-pads CP2 in the folding region FA.

[0111] The shielding layer (EMP) can be an electromagnetic shielding layer and / or a heat dissipation layer. For example, the shielding layer (EMP) can be a single-layer structure or a multi-layer structure. In addition, the shielding layer (EMP) can be used as an adhesive layer.

[0112] The interlayer adhesive layer (ILP) bonds the components of the support plate (MP) and the support member (SPM) to each other. The ILP can be provided in the form of an adhesive resin layer or tape. Figure 9 In this context, the interlayer adhesive layer ILP is explained as providing a layer corresponding to the folding axis FX1 ( Figure 2 ) and folding axis FX2 ( Figure 4 The two components are spaced apart in the region corresponding to the folding axis FX1, but embodiments of the invention are not limited thereto. Unlike the accompanying drawings, the interlayer adhesive layer ILP can be provided as a space between the two components in the region corresponding to the folding axis FX1. Figure 2 ) and folding axis FX2 ( Figure 4 A layer that is not separated from the other layer in the region.

[0113] The filler SAP can be installed outside the support layer SP and the padding layer CP. The filler SAP can also be installed on the support plate MP and the housing HAU. Figure 8 Between ) . The filling part SAP can fill the support plate MP and the housing HAU ( Figure 8 The space between the housing HAU and the support plate MP can be fixed. For example, the filler portion SAP can be set on the third-party DR3 between the housing HAU and the support plate MP.

[0114] The lower protective film DF can be disposed between the display module DM and the support plate MP. The lower protective film DF can be disposed below the display module DM to protect the back of the display module DM. However, the inventive concept is not limited thereto, and for example, the lower protective film DF can be disposed on the upper surface of the display module DM. The lower protective film DF can be disposed on the support plate MP. The lower protective film DF can include a polymer material. For example, the lower protective film DF can be a polyimide film or a polyethylene terephthalate film. However, this is for illustrative purposes, and the lower protective film DF is not limited thereto.

[0115] The lower adhesive layer AP-D may be disposed between the support plate MP and the lower protective film DF. The support plate MP and the lower protective film DF can be bonded to each other through the lower adhesive layer AP-D. The lower adhesive layer AP-D may include, for example, pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear adhesive resin (OCR). However, this is for illustration only, and embodiments of the invention are not limited thereto. Unlike the drawings, the lower adhesive layer AP-D may be omitted.

[0116] The display module DM may include a display panel DP and an input sensing portion TP disposed on the display panel DP. The display panel DP may be configured to generate an image. According to an embodiment of the present invention, the display panel DP may be based on a folding axis FX1 (… Figure 2 ) and folding axis FX2 ( Figure 4 )fold.

[0117] The input sensing unit (TP) detects external input, converts it into a predetermined input signal, and provides the input signal to the display panel (DP) via a processor. The processor interprets and processes the input signal, ensuring that it is correctly mapped to the desired response or action on the display panel (DP). For example, the input sensing unit (TP) can be a touch detection unit that detects touch. The input sensing unit (TP) can recognize direct touch from the user, indirect touch from the user, direct touch from an object, or indirect touch from an object.

[0118] The input sensing portion TP can detect at least one of the location and intensity (pressure) of a touch applied from the outside. In embodiments of the invention, the input sensing portion TP can have various structures and / or be composed of various materials, and is not limited to any one embodiment. For example, the input sensing portion TP can detect external input capacitively. The display panel DP can receive the input signal from the input sensing portion TP and generate an image corresponding to the input signal.

[0119] Figure 10 To explain Figure 9 An enlarged cross-sectional view of region XX' in the diagram. Figure 10 A cross-sectional view that can illustrate the configuration of the protective component RM.

[0120] refer to Figure 10 The protective component RM may include a protective base layer BL, a hard coating HAC disposed on the protective base layer BL, and an anti-reflective layer ARL disposed on the hard coating HAC. Additionally, the protective component RM may further include a functional layer FL disposed on the anti-reflective layer ARL.

[0121] The protective substrate layer BL can be a component providing a substrate surface, with a hard coating HAC and an anti-reflective layer ARL disposed on the substrate surface. For example, the protective substrate layer BL can be a flexible polymer film. The protective substrate layer BL may include at least one of, for example, polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene vinyl alcohol copolymers. The thickness of the protective substrate layer BL may be about 65 μm. However, this is for illustrative purposes, and the thickness of the protective substrate layer BL is not limited to this.

[0122] The functional layer FL may include a polymer film. The functional layer FL may include an anti-fingerprint coating or an antistatic agent, etc. Unlike the attached figure, the functional layer FL may be omitted.

[0123] The thickness TH of the hard-coated HAC can be from about 1 μm to about 8 μm. For example, the thickness TH of the hard-coated HAC can be from about 3 μm to about 5 μm. Hard-coated HACs with a thickness of less than about 1 μm are too thin and cannot exhibit sufficient hardness and durability. Hard-coated HACs with a thickness greater than about 8 μm increase the thickness of the display device due to their large thickness and may not be easy to repeatedly fold and unfold. Hard-coated HACs with a thickness TH of about 1 μm to about 8 μm can achieve the desired display device thickness without increasing the DD (Display Device Dimensions). Figure 9 It exhibits excellent hardness and durability even at a thickness of ), and also demonstrates properties that facilitate easy repeated folding and unfolding.

[0124] In embodiments of the present invention, the hard coating HAC may comprise a polymer derived from the coating composition. The hard coating HAC can be formed by curing the coating composition. The coating composition is cured by a cationic curing process, which exhibits excellent coating properties. The cationic curing process minimizes (or prevents) curing inhibition due to oxygen. Furthermore, the coating composition according to embodiments of the present invention can be cured by a cationic curing process, exhibiting low shrinkage during curing and excellent adhesion after curing.

[0125] For example, a protective substrate layer BL can be prepared, a coating composition can be provided on the protective substrate layer BL, and a hard coating HAC can be formed by emitting light onto the coating composition provided on the protective substrate layer BL. Subsequently, an anti-reflective layer ARL can be provided on the hard coating HAC. The component on which the coating composition is provided is not limited to the protective substrate layer BL, and the coating composition can be cured after being provided on a temporary substrate, etc. In this case, the hard coating HAC formed by curing the coating composition can be removed from the temporary substrate after curing, and the hard coating HAC is provided on the protective substrate layer BL. The temporary substrate is not limited to any one embodiment, as long as it is a substrate from which the hard coating HAC can be easily detached.

[0126] The coating composition forming a hard-coated HAC may include, for example, silsesquioxane resins, oxetane resins, photopolymerization initiators, and silica nanoparticles. In embodiments of the invention, the hard-coated HAC formed from a coating composition comprising silsesquioxane resins, oxetane resins, photopolymerization initiators, and silica nanoparticles exhibits high elongation and can be easily folded at low curvature as well as repeatedly folded and unfolded. In the description, silsesquioxane resins refer to resins containing silsesquioxane functional groups, and oxetane resins refer to resins containing oxetane functional groups.

[0127] Based on 100 wt% of the total weight of the coating composition, the first weight of the silica nanoparticles can be from about 3 wt% to about 5 wt%. Based on 100 wt% of the total weight of the coating composition, a hard coating formed from a coating composition containing less than about 3 wt% silica nanoparticles exhibits relatively low hardness, resulting in reduced durability. Based on 100 wt% of the total weight of the coating composition, a coating composition including more than about 5 wt% silica nanoparticles causes particle aggregation, etc., and it is impossible to form a hard coating with uniform hardness. Based on 100 wt% of the total weight of the coating composition, the hard coating HAC of the embodiments of the present invention formed from a coating composition including about 3 wt% to about 5 wt% silica nanoparticles exhibits excellent hardness.

[0128] The diameter of the silica nanoparticles can be from about 20 nm to about 60 nm. The hard coating HAC of embodiments of the present invention, formed from a coating composition comprising silica nanoparticles having a diameter of about 20 nm to about 60 nm and satisfying the above weight range (i.e., about 3 wt% to about 5 wt%), exhibits excellent hardness and excellent wear resistance.

[0129] Figure 11 A diagram illustrating a silica nanoparticle SNP as an example according to an embodiment of the present invention. (Refer to...) Figure 11 Silica nanoparticles (SNPs) can include silicon atoms, oxygen atoms, and hydroxyl groups (-OH). In silica nanoparticle SNPs, silicon atoms (Si) and oxygen atoms (O) can exist on the surface, and hydroxyl groups can be bonded to silicon atoms on the surface. Figure 11 In this document, the number / position of silicon atoms, the number / position of oxygen atoms, and the number / position of hydroxyl groups are used for illustrative purposes, and the embodiments of the present invention are not limited thereto.

[0130] In the coating composition according to an embodiment of the invention, the hydroxyl groups of the silica nanoparticles (SNPs) can be partially bonded to silsesquioxane resins or oxetane resins. Accordingly, if the coating composition cures, the adhesion strength to the silsesquioxane resins and oxetane resins can be increased, and the hard coating HAC formed by the coating composition according to an embodiment of the invention... Figure 10 It can exhibit high toughness properties.

[0131] Silsesquioxane resins may include partially cage-like structures, ladder-like structures, random structures, and / or cage-like structures. Silsesquioxane resins may include 7 or 8 siloxane units. For example, a silsesquioxane resin may include a partially cage-like structure and 7 siloxane units. Alternatively, a silsesquioxane resin may include a cage-like structure and 8 siloxane units. For example, a partially cage-like structure may be represented by the following formula P-1, and a siloxane unit may be represented by the following formula S-1.

[0132] [Formula P-1]

[0133]

[0134] In equation P-1, multiple R x Each of the following can be independently a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 60 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 60 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 60 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 60 cyclic carbon atoms.

[0135] [Formula S-1]

[0136] *—Si-OR a

[0137] In equation S-1, R a It may be a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 60 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 60 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 60 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 60 cyclic carbon atoms. "*-" indicates the bonding position. Hard coating HACs include polymers derived from coating compositions comprising sesquioxane resins having 7 or 8 siloxane units. Figure 10 It can demonstrate increased hardness and increased flexibility.

[0138] Silsesquioxane resins may include at least one of, for example, T-type silsesquioxane units, D-type silsesquioxane units, and M-type silsesquioxane units. A T-type silsesquioxane unit may be represented by formula A-1 or A-2 provided below. A D-type silsesquioxane unit may be represented by formula B-1 or B-2 below. An M-type silsesquioxane unit may be represented by any one of formulas C-1 to C-4 below. In formulas A-1, A-2, B-1, B-2, and C-1 to C-4, R1 to R... 20 Each of the following can be a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 60 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 60 carbon atoms, a substituted or unsubstituted alkoxy group having 1 to 60 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 60 cyclic carbon atoms. "*-" indicates the bonding position.

[0139] [Formula A-1]

[0140]

[0141] [Formula A-2]

[0142]

[0143] [Formula B-1]

[0144]

[0145] [Formula B-2]

[0146]

[0147] [Formula C-1]

[0148]

[0149] [Formula C-2]

[0150]

[0151] [Formula C-3]

[0152]

[0153] [Formula C-4]

[0154]

[0155] Oxycyclic butane resins may include a portion of 1,4-bis[(3-ethyl-3-oxetane-butylmethoxy)methyl]benzene. Oxycyclic butane resins may include a portion represented by the following Formula 1.

[0156] [Formula 1]

[0157]

[0158] In Formula 1 above, n1 can be an integer selected from 3 to 100. For example, n1 can be 3. A hard coating HAC (Hard Coating Acoustic Coating) is formed from a coating composition including the portion represented by Formula 1 where n1 is 1 or 2. Figure 10 It exhibits low flexibility and may crack during low-curvature folding. Additionally, it may not be easy to repeat folding and unfolding. A hard coating HAC formed from a coating composition comprising a portion represented by Formula 1, wherein n1 is 3 or greater, exhibits increased flexibility, prevents damage during low-curvature folding, and exhibits the property of easy repeat folding and unfolding.

[0159] For example, the portion represented by Formula 1 can be combined with a silsesquioxane resin having a partially cage-like structure and comprising 7 siloxane units. Alternatively, the portion represented by Formula 1 can be combined with a silsesquioxane resin having a cage-like structure and comprising 8 siloxane units, and each of the 8 siloxane units can constitute a T-type silsesquioxane unit. Accordingly, the hard coating HAC formed from the coating composition... Figure 10It exhibits increased flexibility to prevent cracks and other damage even during low-curvature folding, and can be easily folded and unfolded repeatedly.

[0160] Based on infrared spectroscopy, a hard coating HAC is formed by combining the portion represented by Formula 1 with a sesquioxane resin having a partially cage-like structure and 7 siloxane units. Figure 10 In the infrared spectrum (IR spectrum), it can be found at approximately 1066 cm⁻¹. -1 Approximately 2138cm -1 A peak is observed at the wavenumber. It is approximately 1066 cm⁻¹. -1 The wavenumber peak indicates the presence of the Si-O-Si region, and is located at approximately 2138 cm⁻¹. -1 The peaks at the wavenumbers indicate the presence of the Si-H portion. Furthermore, the hard-coated HAC according to an embodiment of the invention exhibits a Si(OSi≡)⁴ peak at approximately -107.6 ppm in the Si NMR spectrum and a Si-H peak at approximately 4.7 ppm in the H NMR spectrum.

[0161] Based on a 100wt% total weight of the coating composition, the sum of the second weight of the silsesquioxane resin and the third weight of the oxetane resin can be from about 93wt% to about 95wt%. The silsesquioxane resin exhibits high hardness while increasing flexibility. The oxetane resin increases flexibility. Accordingly, based on a 100wt% total weight of the coating composition, a hard coating HAC (Hyperhard Acrylic Acid) is formed from a coating composition in which the sum of the second weight of the silsesquioxane resin and the third weight of the oxetane resin satisfies the range mentioned above (i.e., from about 93wt% to about 95wt%). Figure 10 It can exhibit increased stiffness and increased flexibility. Accordingly, hard-coated HAC can exhibit properties such as no cracking during low-curvature folding and easy repeated folding and unfolding.

[0162] In the formation of hard coating HAC ( Figure 10 In the coating composition for forming a hard HAC, the weight of the photopolymerization initiator may be about 2 wt% or less based on 100 wt% of the total weight of the coating composition. In the coating composition for forming a hard HAC, the weight of the photopolymerization initiator may be greater than about 0 wt% to about 2 wt% based on 100 wt% of the total weight of the coating composition. In the coating composition for forming a hard HAC, the photopolymerization initiator may include triarylsulfonium hexafluoroantimonate. The hard HAC formed from the coating composition including triarylsulfonium hexafluoroantimonate may have increased oxidation resistance and prevent deformation even when exposed to oxygen.

[0163] Photopolymerization initiators may include, for example, a mixed triarylsulfonium hexafluoroantimonate (CAS: 109037-75-4), which is a mixed salt of triarylsulfonium ions and hexafluoroantimonate ions. The mixed triarylsulfonium hexafluoroantimonate (CAS: 109037-75-4) can be represented by formulas E-1-1 and E-1-2 provided below. In formulas E-1-1 and E-1-2, the S of triarylsulfonium... + Sb can react with hexafluoroantimonyic acid - They form ionic bonds.

[0164] [Equation E-1-1 and E-1-2]

[0165]

[0166] Used to form a hard coating HAC ( Figure 10 The coating composition may further include a solvent. In the coating composition, the solvent may include at least one of, for example, 1-methoxy-2-methyl-2-propanol, 1-methoxy-2-propanol and 2-butanone.

[0167] Additionally, HAC (hard coating) is used to form a hard coating. Figure 10 The coating composition may further include additives within a range that do not inhibit the physical properties of the hard coating HAC. Additives may include homogenizers or dispersants, etc., but these are for illustrative purposes only, and additives may include those known in the art without limitation. For example, based on 100 wt% of the total weight of the coating composition, the weight of the additives may be about 2 wt%.

[0168] Hard coating HAC formed from the coating composition according to embodiments of the present invention Figure 10 The hard-coated HAC with an SCI reflectance of about 0.5% to about 1.5% can increase the display device's DD (display reflectance) due to the low SCI reflectance. Figure 9 The display quality of ).

[0169] Hard coating HAC formed from the coating composition according to embodiments of the present invention Figure 10 It can have a hardness of about 0.22 GPa to about 0.32 GPa and an elastic modulus of about 2.78 GPa to about 3.78 GPa. The hardness and elastic modulus can be measured by providing a hard coating HAC with a thickness TH of about 5 μm on a protective substrate BL comprising polyethylene terephthalate, and by using a Bruker Co. nanoindenter at an indentation depth of about 200 nm. Hard coating HACs with hardness and elastic modulus meeting the ranges mentioned above demonstrate increased reliability.

[0170] Hard coating HAC (Hyperpolymer Acrylic Acid) formed from a coating composition comprising, for example, silsesquioxane resins, oxetane resins, photopolymerization initiators, and silica nanoparticles, each of which satisfies the above weight range) Figure 10 It can have a crack strain of about 8% or greater. Hard-coated HAC with a crack strain of about 8% or greater exhibits properties that prevent damage during low-curvature folding and facilitate repeated folding and unfolding due to its superior flexibility.

[0171] Additionally, a hard coating HAC (Hypercarbonyl Acrylic Acid) is formed from a coating composition comprising, for example, silsesquioxane resins, oxetane resins, photopolymerization initiators, and silica nanoparticles, each of which satisfies the aforementioned weight range. Figure 10 The eraser may have a water contact angle of approximately 100° or greater before the abrasion resistance evaluation and approximately 95° or less after the evaluation. In this case, the eraser abrasion resistance evaluation can be performed 5,000 times under a load of approximately 1 kgf using an eraser specifically designed for abrasion resistance testing. Hard-coated HACs that meet the aforementioned water contact angle range before and after the eraser abrasion resistance evaluation exhibit excellent abrasion resistance.

[0172] Refer again Figure 10 The anti-reflective layer ARL may include a high refractive index layer HL and a low refractive index layer WL disposed on the high refractive index layer HL. The anti-reflective layer ARL can be formed by a dry process. The high refractive index layer HL may include multiple high refractive index layers HR1, ..., HR n In other words, the high refractive index layer HL can be provided as multiple high refractive index layers HR1, ..., HR2. n The low-refractive-index layer WL may include multiple low-refractive-index layers WR1, ..., WR n In other words, the low-refractive-index layer WL can be provided as multiple low-refractive-index layers WR1, ..., WR n Here, n is an integer of 2 or greater. It includes multiple high-refractive-index layers HR1, ..., HR2. n and multiple low refractive index layers WR1, ..., WR n The protective component RM exhibits low SCI reflectivity, thereby increasing the reflectivity of the display device DD ( Figure 9 The display quality is improved. Multiple high refractive index layers HR1, ..., HR n and multiple low refractive index layers WR1, ..., WR n They can be alternately disposed on the protective substrate layer BL. The functional layer FL can be disposed on the nth low refractive index layer WR. n For example, each of the high refractive index layer HL and the low refractive index layer WL can be provided as five layers.

[0173] The refractive index of the low refractive index layer WL can be from about 1.3 to about 1.5. For example, the low refractive index layer WL may include silicon dioxide (SiO2). However, this is for illustrative purposes only, and the low refractive index layer WL may include materials with low refractive index characteristics known in the relevant art without limitation.

[0174] The refractive index of the high refractive index layer HL can be from about 1.6 to about 2.5. The high refractive index layer HL may include, for example, niobium pentoxide (Nb₂O₅) and titanium dioxide (TiO₂). In the high refractive index layer HL, the ratio of the fourth weight to the fifth weight, based on the sum of the fourth weight of niobium pentoxide and the fifth weight of titanium dioxide, can be from about 7:3 to about 9:1. Components including niobium pentoxide have increased flexibility, and components including titanium dioxide can exhibit high hardness. The high refractive index layer HL, which includes niobium pentoxide and titanium dioxide, and where the fourth weight of niobium pentoxide and the fifth weight of titanium dioxide satisfy about 7:3 to about 9:1, can exhibit increased flexibility and increased hardness. Accordingly, the high refractive index layer HL can exhibit low curvature folding and easy repeated folding and unfolding characteristics. A display device DD including a high refractive index layer HL ( Figure 9 ) and electronic equipment EA ( Figure 9 It can demonstrate increased reliability.

[0175] Table 1 below shows the configurations of the protective members used for the evaluation in Table 2. In Table 1, the protective member of Example 1 is a protective member according to an embodiment of the present invention. Table 2 below shows the results of evaluating the crack strain, abrasion resistance, and SCI reflectivity of the protective members of Comparative Examples 1 to 3 and Example 1.

[0176] Table 1

[0177]

[0178] In Table 1, the protective components of Comparative Examples 1 and 2 have a protective substrate layer with a thickness of about 50 μm, and the protective components of Comparative Examples 3 and Example 1 have a protective substrate layer with a thickness of about 65 μm. The protective components of Comparative Examples 1 to 3 and Example 1 have a protective substrate layer formed of polyethylene terephthalate (PET).

[0179] In the protective components of Comparative Examples 1 and 2, the hard coating was formed by composition 1, which was formed by an acrylic resin. The acrylic resin exhibited a relatively low elongation. The hard coating of Comparative Example 3 was formed by composition 2, which was formed by a silsesquioxane resin, an oxetane resin, and a photopolymerization initiator. Composition 2 did not include silica nanoparticles. The hard coating of Example 1 was formed by composition 3, which was formed by a silsesquioxane resin, an oxetane resin, a photopolymerization initiator, and silica nanoparticles. Based on 100 wt% of the total weight of composition 3, the weight of the silica nanoparticles was about 3 wt%. Composition 3 is a coating composition according to an embodiment of the present invention that satisfies the above-described weight range of silica nanoparticles (i.e., about 3 wt% to about 5 wt%). The silsesquioxane resin is represented by formula P-1. In formula P-1, R x It is 1,4-bis[(3-ethyl-3-oxetane-butylmethoxy)methyl]benzene. Oxetane resins are represented by Formula 1, where n1 in Formula 1 is 3. The photopolymerization initiator is a mixture of triarylsulfonium hexafluoroantimonate (CAS: 109037-75-4).

[0180] The protective components of Comparative Examples 1 to 3 and Example 1 are formed by alternating high-refractive-index layers and low-refractive-index layers. In the protective component of Comparative Example 1, the anti-reflective layer is formed by a wet process, and each of the high-refractive-index layer and the low-refractive-index layer is provided as two layers. In the protective component of Comparative Example 1, the high-refractive-index layer is formed of zirconium oxide (ZrO2), and the low-refractive-index layer is formed of silicon oxide (SiO2).

[0181] In the protective component of Comparative Example 2, the anti-reflective layer is formed by a dry process, and each of the high refractive index layer and the low refractive index layer is provided as seven layers. In the protective component of Comparative Example 2, the high refractive index layer is formed of niobium pentoxide (Nb₂O₅), and the low refractive index layer is formed of silicon dioxide (SiO₂).

[0182] In the protective component of Comparative Example 3, the anti-reflective layer was formed by a dry process, and each of the high-refractive-index layer and the low-refractive-index layer was provided in five layers. In the protective component of Comparative Example 3, the high-refractive-index layer was formed of niobium pentoxide (Nb₂O₅) and titanium dioxide (TiO₂), and the low-refractive-index layer was formed of silicon dioxide (SiO₂). In the high-refractive-index layer, based on the sum of the weights of niobium pentoxide and titanium dioxide, the weight ratio of niobium pentoxide to titanium dioxide was approximately 9:1.

[0183] In the protective component of Example 1, the anti-reflective layer is formed by a dry process, and each of the high-refractive-index layer and the low-refractive-index layer is provided in five layers. In the protective component of Example 1, the high-refractive-index layer comprises, for example, niobium pentoxide (Nb₂O₅) and titanium dioxide (TiO₂), and the low-refractive-index layer comprises silicon dioxide (SiO₂). In the high-refractive-index layer, the weight ratio of niobium pentoxide to titanium dioxide is approximately 9:1, based on the sum of the weights of niobium pentoxide and titanium dioxide. That is, in Example 1, the weight ratio of niobium pentoxide to titanium dioxide satisfies the aforementioned weight range (i.e., approximately 7:3 to approximately 9:1).

[0184] The thickness of the hard coating in Example 1 and Comparative Examples 1 to 3 was approximately 5 μm. The hardness of the hard coating in Example 1 was approximately 0.27 GPa. The hardness of the hard coating in Comparative Example 1 was approximately 0.35 GPa. The hardness of the hard coating in Comparative Example 2 was approximately 0.35 GPa. The hardness of the hard coating in Comparative Example 3 was approximately 0.25 GPa. The hardness was measured at an indentation depth of approximately 200 nm using a nanoindenter from Bruker. The elastic modulus of the hard coating in Example 1 was approximately 3.28 GPa. The elastic modulus of the hard coating in Comparative Example 1 was approximately 6.1 GPa. The elastic modulus of the hard coating in Comparative Example 2 was approximately 6.52 GPa. The elastic modulus of the hard coating in Comparative Example 3 was approximately 3.96 GPa. The elastic modulus was measured at an indentation depth of approximately 200 nm using a nanoindenter from Bruker.

[0185] In Table 2 below, crack strain, abrasion resistance, and SCI reflectivity were evaluated using the following methods. Crack strain was measured using Instron's Universal Testing Machine (UTM) by fixing a 10mm wide × 60mm long protective member, pulling the member at approximately 50mm / min, and then inspecting for cracks. Abrasion resistance was assessed by comparing the water contact angle before and after the abrasion resistance evaluation to determine compliance with specified standards. The specified standards were a water contact angle of approximately 100° or higher before the evaluation and approximately 95° or higher after the evaluation. Water was used for the water contact angle evaluation. An industrial eraser with approximately 5mm of raised bumps from Munbangsau was used, and an abrasion resistance tester from Daesung Precision was used to evaluate the eraser's abrasion resistance under conditions of approximately 1kgf load, approximately 50rpm speed, and approximately 15mm reciprocating distance. The contact angle was then measured using a Kruss contact angle measurement device (Drop Shape Analysis System).

[0186] In the abrasion resistance table 2, "NG" indicates that it does not meet the given standard, and "OK" indicates that it meets the given standard. Comparative Examples 1 and 2 were not evaluated because their flexibility was too low to be assessed for abrasion resistance.

[0187] SCI reflectance represents the SCI reflectance for light with a wavelength of approximately 550 nm. SCI reflectance was measured in reflectance mode using a spectrophotometer CM-3700A from Konica Minolta and evaluated by attaching black tape to one side of the PET of the protective member. The protective member of Comparative Example 3 showed an SCI reflectance of approximately 0.61% to approximately 0.7%, and the protective member of Example 1 showed an SCI reflectance of approximately 0.56% to approximately 0.69%.

[0188] Table 2

[0189] Comparative Example 1 Comparative Example 2 Comparative Example 3 Example 1 Crack strain (%) 4.5 2 16.0 12.5 abrasion resistance - - NG OK SCI reflectance (%, @550nm) 1.33 0.25 0.61 to 0.7 0.56 to 0.69

[0190] Referring to Table 2, it can be seen that, compared with Comparative Examples 1 and 2, Comparative Example 3 and Example 1 exhibit high crack strain, with a crack strain of about 8% or greater. It can be seen that Comparative Examples 1, 3, and 1 exhibit SCI reflectivity of about 0.5% to about 1.5%. It can be seen that Comparative Example 3 and Example 1 exhibit SCI reflectivity of about 1.0% or less. It can be seen that Example 1 meets the wear resistance criterion.

[0191] As described above, the protective member of Example 1 comprises a hard coating formed from a coating composition according to an embodiment of the present invention and a high refractive index layer comprising niobium pentoxide (Nb₂O₅) and titanium dioxide (TiO₂) in the weight ratios described above. It can be observed that the protective member of Example 1 comprises a protective substrate layer with a greater thickness compared to the protective members of Comparative Examples 1 and 2, but exhibits a high crack strain value due to the inclusion of the hard coating according to an embodiment of the present invention. A high crack strain value signifies increased flexibility, and because of this increased flexibility, it facilitates low-curvature folding and repeated folding and unfolding. Furthermore, it can be observed that the hard coating included in the protective member of Example 1 is formed from a coating composition comprising silica nanoparticles and exhibits increased abrasion resistance. Accordingly, it can be observed that the protective member according to an embodiment of the present invention, comprising a hard coating and a high refractive index layer, will exhibit increased flexibility, increased abrasion resistance, and increased SCI reflectivity.

[0192] As described above, in the protective members of Comparative Example 1 and Comparative Example 2, the hard coating is formed from composition 1 comprising an acrylic resin having a low elongation. Accordingly, the protective members of Comparative Example 1 and Comparative Example 2 exhibit low crack strain.

[0193] As described above, the hard coating included in the protective member of Comparative Example 3 is formed from composition 2, which does not contain silica nanoparticles. Accordingly, the protective member of Comparative Example 3 did not meet the predetermined standard in the wear resistance evaluation and showed poor wear resistance.

[0194] Figure 12 To explain along Figure 8 A cross-sectional view of the portion intercepted by line II-II' in the diagram. Figure 12 This can be used to illustrate the cross-sectional view of the display area DM-DA of the display module DM.

[0195] refer to Figure 12 The display panel DP may include a substrate BS, a circuit layer DP-CL disposed on the substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. Figure 12 The configuration of the display panel DP described herein is for illustrative purposes only, and the configuration of the display panel DP is not limited to this.

[0196] The substrate BS provides a substrate surface on which the circuit layer DP-CL is disposed. The substrate BS can be a flexible substrate capable of being bent, folded, or rolled. The substrate BS can be a glass substrate, a metal substrate, or a polymer substrate, etc. However, embodiments of the present invention are not limited thereto, and the substrate BS may include inorganic layers, organic layers, or composite material layers.

[0197] The substrate BS may comprise a single layer or multiple layers. For example, the substrate BS may comprise a first synthetic resin layer, a multilayer or single-layer inorganic layer disposed on the first synthetic resin layer, and a second synthetic resin layer disposed on the multilayer or single-layer inorganic layer. Each of the first and second synthetic resin layers may comprise a polyimide resin. Additionally, each of the first and second synthetic resin layers may comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In the description, "~~" type resin refers to a resin containing the "~~" functional group.

[0198] The display panel DP may include transistors (TR) and light-emitting elements (ED). The transistors (TR) and light-emitting elements (ED) may be disposed on a substrate BS. Figure 12 The image shows a transistor TR, but the display panel DP may include multiple transistors for driving the light-emitting element ED and at least one capacitor.

[0199] The circuit layer DP-CL may include insulating layers, semiconductor patterns, conductive patterns, and signal lines. For example, the circuit layer DP-CL may include switching transistors and driving transistors for driving the light-emitting elements ED of the display element layer DP-EL.

[0200] The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, and multiple insulating layers BFL and INS1 to INS6. The multiple insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first insulating layers INS1 to sixth insulating layers INS6. However, Figure 12 The stacked structure of the DP-CL circuit layer shown is for illustration, and the stacked structure of the DP-CL circuit layer can be changed depending on the configuration of the display panel DP and the process of the DP-CL circuit layer.

[0201] A shielding electrode BML can be disposed on the substrate BS. The shielding electrode BML can overlap with the transistor TR. The shielding electrode BML can block light incident on the transistor TR from the bottom of the display panel DP to protect the transistor TR. For example, the shielding electrode BML can be disposed below the transistor TR. The shielding electrode BML may include a conductive material. If a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, embodiments of the present invention are not limited thereto, and the shielding electrode BML can be a floating electrode. The shielding electrode BML may be omitted.

[0202] A buffer layer BFL can be disposed on the substrate BS to cover the shielding electrode BML. For example, the buffer layer BFL can be disposed between the shielding electrode BML and the transistor TR. The buffer layer BFL may include an inorganic layer. The buffer layer BFL can increase the adhesion strength between the semiconductor pattern or conductive pattern disposed on the buffer layer BFL and the substrate BS.

[0203] A transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, channel C1, and drain D1 of the transistor TR may be formed in a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide, and is not limited to any material having semiconductor properties.

[0204] A semiconductor pattern may include multiple regions distinguished by their conductivity levels. Regions in the semiconductor pattern that are doped with dopants or have reduced metal oxides may have high conductivity and can essentially serve as the source and drain electrodes of a transistor TR. Regions with high conductivity in the semiconductor pattern may correspond to the source S1 and drain D1 of the transistor TR. Regions in the semiconductor pattern that are undoped, lightly doped, or have unreduced metal oxides and therefore have low conductivity may correspond to the channel C1 (or active region) of the transistor TR.

[0205] A first insulating layer INS1 covers the semiconductor pattern of transistor TR and may be disposed on a buffer layer BFL. The gate G1 of transistor TR may be disposed on the first insulating layer INS1. In a planar plane, the gate G1 may overlap with the channel C1 of transistor TR. The gate G1 may be used as a mask in the process of doping the semiconductor pattern of transistor TR.

[0206] The second insulating layer INS2 covers the gate G1 and may be disposed on the first insulating layer INS1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0207] The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 for electrically connecting the transistor TR and the light-emitting element ED. However, the configuration of the connection electrode CNE for electrically connecting the transistor TR and the light-emitting element ED is not limited thereto, and one of the first connection electrode CNE1 and the second connection electrode CNE2 may be omitted, or additional connection electrodes may be included.

[0208] The first connecting electrode CNE1 may be disposed on the third insulating layer INS3. The first connecting electrode CNE1 may be connected to the drain electrode D1 through the first contact hole CH1 penetrating the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 may cover the first connecting electrode CNE1 and may be disposed on the third insulating layer INS3. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0209] The second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 through the second contact hole CH2 penetrating the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 may cover the second connecting electrode CNE2 and may be disposed on the fifth insulating layer INS5.

[0210] Each of the first insulating layer INS1 to the sixth insulating layer INS6 may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. For example, the organic layer may include at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0211] The display element layer DP-EL may include a pixel defining layer PDL and a light-emitting element ED. The light-emitting element ED may include a first electrode AE, a hole control layer HCL, an emission layer EML, an electron control layer TCL, and a second electrode CE.

[0212] Light-emitting elements (EDs) can emit light. For example, EDs may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, or quantum rods. For example, EDs may include micro-LEDs or nano-LEDs.

[0213] The first electrode AE ​​can be disposed on the sixth insulating layer INS6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the third contact hole CH3 penetrating the sixth insulating layer INS6. The first electrode AE ​​can be electrically connected to the drain D1 of the transistor TR through the first connecting electrode CNE1 and the second connecting electrode CNE2.

[0214] The first electrode AE ​​can be formed using metallic materials, metal alloys, or conductive compounds. The first electrode AE ​​can be an anode or a cathode. However, embodiments of the present invention are not limited thereto. Additionally, the first electrode AE ​​can be a pixel electrode. For example, the first electrode AE ​​can be a transmission electrode, a semi-transmission electrode, or a reflection electrode. For example, the first electrode AE ​​can include at least one of Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound selected from two or more of these, a mixture selected from two or more of these, or an oxide thereof.

[0215] For example, if the first electrode AE ​​is a transmission electrode, it may comprise a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). For example, if the first electrode AE ​​is a semi-transmission electrode or a reflection electrode, it may comprise Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or compounds thereof or mixtures thereof (e.g., a mixture of Ag and Mg), or materials with a multilayer structure, such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Furthermore, the first electrode AE ​​may have a multilayer structure, including a reflective or semi-transmission film formed using the above materials and a transparent conductive film formed using indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but embodiments of the present invention are not limited thereto. Additionally, the first electrode AE ​​may comprise the aforementioned metallic material, a combination of two or more metallic materials selected from the aforementioned metallic materials, or an oxide of the aforementioned metallic materials, but embodiments of the present invention are not limited thereto.

[0216] A pixel-defining layer (PDL) may be disposed on a sixth insulating layer (INS6). A light-emitting aperture (PX_OP) exposing a portion of the first electrode (AE) may be formed in the pixel-defining layer (PDL) to provide a light-emitting region (LA). The portion of the first electrode (AE) exposed by the light-emitting aperture (PX_OP) may correspond to the light-emitting region (LA).

[0217] The display area DM-DA of the display module DM may include a light-emitting area LA and a light-shielding area NLA. The area where the pixel limiting layer PDL is set may correspond to the light-shielding area NLA. In the display area DM-DA, the light-shielding area NLA may surround the light-emitting area LA.

[0218] A hole control layer (HCL) may be disposed on the first electrode (AE) and the pixel defining layer (PDL). The hole control layer (HCL) may be a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). The hole control layer (HCL) may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer (HCL) may include known hole injection materials and / or known hole transport materials.

[0219] The emission layer EML can be disposed on the hole control layer HCL. The emission layer EML can be disposed in the region corresponding to the light-emitting aperture PX_OP. Alternatively, the emission layer EML can be provided as a common layer. The emission layer EML may include organic light-emitting materials and / or inorganic light-emitting materials. The emission layer EML can emit any of red, green, or blue light. For example, the emission layer EML can emit blue light.

[0220] An electron control layer (TCL) may be disposed on the emitter layer (EML). The TCL may be a common layer overlapping the emitting region (LA) and the blocking region (NLA). The TCL may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The TCL may include known electron injection materials and / or known electron transport materials.

[0221] The second electrode CE can be disposed on the electronic control layer TCL. The second electrode CE can be provided as a common layer overlapping the light-emitting region LA and the light-shielding region NLA.

[0222] The second electrode CE can be a common electrode. The second electrode CE can be a cathode or an anode, but the embodiments of the present invention are not limited thereto. For example, if the first electrode AE ​​is an anode, then the second electrode CE can be a cathode, and if the first electrode AE ​​is a cathode, then the second electrode CE can be an anode.

[0223] The second electrode CE can be a transmission electrode, a semi-transmission electrode, or a reflection electrode. For example, if the second electrode CE is a transmission electrode, it can be formed using a transparent metal oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO)).

[0224] For example, if the second electrode CE is a semi-transparent or reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W, or compounds thereof or mixtures thereof (e.g., AgMg, AgYb, or MgYb), or materials with a multilayer structure, such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Additionally, the second electrode CE may have a multilayer structure, including a reflective or semi-transparent film formed using the above materials and a transparent conductive film formed using indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). For example, the second electrode CE may include the above-mentioned metallic materials, a combination of two or more metallic materials selected from the above-mentioned metallic materials, or oxides of the above-mentioned metallic materials.

[0225] The encapsulation layer TFE can be disposed on the display element layer DP-EL. The encapsulation layer TFE can be disposed on the second electrode CE to cover the light-emitting element ED. The encapsulation layer TFE can protect the display element layer DP-EL from foreign matter (such as moisture, oxygen and / or dust particles). The encapsulation layer TFE may comprise multiple thin films.

[0226] The encapsulation layer TFE may include at least one inorganic film and an organic film. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film protects the light-emitting element ED from moisture / oxygen, and the organic film protects the light-emitting element ED from other foreign matter (such as dust particles).

[0227] The input sensing component TP can be disposed on the display panel DP. Alternatively, the input sensing component TP can be disposed on the encapsulation layer TFE. For example, the input sensing component TP can be directly disposed on the encapsulation layer TFE of the display panel DP. Furthermore, an adhesive layer can be disposed between the input sensing component TP and the display panel DP.

[0228] In the description, if one element is directly set / provided on another element, it means that no third element is set / provided between the two elements. In other words, if one element is "directly set / provided" on another element, it means that the two elements are "in contact" with each other.

[0229] The input sensing section TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing section TP may include at least one conductive layer disposed on the sensing insulating layers. The input sensing section TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0230] A first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. For example, the first sensing insulating layer IL1 may contact the encapsulation layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, and in this case, the first conductive layer CDL1 may contact the encapsulation layer TFE.

[0231] A first conductive layer CDL1 may be disposed on a first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. A second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0232] A second conductive layer CDL2 may be disposed on a second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. Each of the plurality of second conductive patterns may be connected to a plurality of first conductive patterns through a contact hole formed in the second sensing insulating layer IL2.

[0233] Each of the plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 may be configured to correspond to the light-shielding region NLA. Each of the plurality of first conductive patterns in the first conductive layer CDL1 and the plurality of second conductive patterns in the second conductive layer CDL2 may have a grid pattern.

[0234] A third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and may cover the second conductive layer CDL2. Each of the second sensing insulating layer IL2 and the third sensing insulating layer IL3 may include an inorganic insulating layer or an organic insulating layer.

[0235] Each of the first conductive layer CDL1 and the second conductive layer CDL2 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3. Each of the conductive layers CDL1 and CDL2 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include, for example, molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include, for example, a transparent conductive oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO)). Alternatively, the transparent conductive layer may include a conductive polymer (e.g., poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene, etc.

[0236] Each of the conductive layers CDL1 and CDL2 having a multilayer structure may include a metal layer. The metal layer may have a three-layer structure, such as titanium (Ti) / aluminum (Al) / titanium (Ti). The conductive layers CDL1 and CDL2 having a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0237] Figure 13 A block diagram illustrating an electronic device (or, for example, an electronic device) according to an embodiment of the present invention. (See reference...) Figure 13 The electronic device 1000 according to an embodiment of the present invention can be adapted to... Figure 8 The display module 1140 of the display device DD shown in the figure outputs various information (e.g., images, text, music, etc.). When the processor 1110 executes an application stored in the memory 1120, the display module 1140 can provide application information to the user through the display panel 1141.

[0238] In some embodiments of the present invention, the electronic device 1000 may be configured as a smartphone, camera, smart TV, monitor, smartwatch, tablet computer, automotive display, or AR / VR head-mounted display. For example, the electronic device 1000 may be a smartphone, which includes a touch-sensitive display area for interaction (e.g., a first active area F-AA). Figure 1 ) and / or the second active region R-AA ( Figure 3 And a non-display area including sensors and circuitry for enhanced functionality (e.g., the first peripheral area F-NAA). Figure 1 ) and / or the second peripheral region R-NAA ( Figure 3 For example, electronic device 1000 may be a television or monitor, including a large display area for high-resolution video playback and a non-display area incorporating drive circuitry or a connection module for external input. For example, electronic device 1000 may be a smartwatch, including a display area optimized for compact and high-definition visual effects and a non-display area integrating biometric sensors for health monitoring. In some cases, electronic device 1000 may be an AR / VR head-mounted display.

[0239] In some embodiments of the invention, memory 1120 may store information such as software code for operating application 1123. Application 1123 may include software designed to perform specific tasks or provide functionality to a user. Application 1123 may operate under the control of processor 1110 and utilize data stored in memory 1120 to deliver a wide range of features, such as productivity tools, multimedia streaming and playback, file or email delivery, or communication services. Application 1123 interacts seamlessly with user interface 1161 or touchscreen 1142, allowing the user to launch, navigate, and use the program using user input (e.g., touch, click, gesture, or voice interaction).

[0240] When a user selects an application via touchscreen 1142 or user interface 1161, processor 1110 can execute application program 1123, retrieved from memory 1120, corresponding to the selected application, to perform the application's functions. For example, when a user selects a camera application by clicking an icon (or camera application icon) presented on display panel 1141, processor 1110 activates the camera module. Processor 1110 can then transfer image data corresponding to the captured image obtained by the camera module to display module 1140. Display module 1140 can then display the image corresponding to the captured image via display panel 1141.

[0241] As another example, when a user wishes to make a phone call, the user clicks the phone icon displayed on display module 1140, and processor 1110 can execute a phone application stored in memory 1120. A phone keypad can be displayed on display panel 1141 for the user to enter the phone number to call.

[0242] As another example, the display module 1140 can be integrated into the electronic device 1000 (e.g., a laptop computer, smart TV, or tablet computer). Users who wish to access multimedia streaming applications (e.g., watching music videos or movies) can do so by clicking the corresponding icon. This action activates the application, allowing the user to watch streaming content.

[0243] Processor 1110 may include a main processor 1111 and an auxiliary processor or coprocessor 1112. Main processor 1111 may include a central processing unit (CPU). Main processor 1111 may further include one or more of a graphics processing unit (GPU), a communication processor (CP), and an image signal processor (ISP).

[0244] The coprocessor 1112 may include a controller 1112-1. The controller 1112-1 may include interface conversion circuitry and timing control circuitry. The controller 1112-1 may receive image signals from the main processor 1111, convert the data format of the image signals to match the interface specifications of the display module 1140, and output the image data. The controller 1112-1 may output various control signals to drive the display module 1140. For example, the controller 1112-1 may drive the display module 1140 to display icons on the screen suitable for user selection, thereby enabling the execution of the application program 1123.

[0245] The memory 1120 may store one or more applications 1123 used by at least one component of the electronic device 1000 (e.g., processor 1110 or user interface 1161) and various data, as well as input or output data of commands associated therewith. For example, when a user selects a corresponding icon presented on a display screen (or display panel 1141) via touchscreen 1142 or user interface 1161, the processor 1110 may execute camera applications, GPS applications, augmented reality and virtual reality applications, and other applications. Additionally, various setting data corresponding to user settings may be stored in the memory 1120. The memory 1120 may include volatile memory 1121 and non-volatile memory 1122.

[0246] Display module 1140 can output visual information (images) to a user. Display module 1140 may include display panel 1141, gate driver, source driver, voltage generation circuitry, and touchscreen 1142. Display module 1140 may further include a window, chassis, and bracket to protect display panel 1141. Display module 1140 may include... Figure 8 At least a portion of the configuration of the display device DD shown in the figure.

[0247] User interface 1161 serves as an interaction medium between the user and electronic device 1000. User interface 1161 can detect input by using a part of the user's body (e.g., a finger) or by using a pen or mouse, and generate electrical signals or data values ​​corresponding to the input. User interface 1161 includes a fingerprint sensor 1162, an input sensor 1163, and a digitizer 1164.

[0248] The fingerprint sensor 1162 can sense fingerprints for user biometric identification and can also measure one or more biometric signals (such as blood pressure, water content, or weight).

[0249] Input sensor 1163 can sense user interactions, including touch, click, gesture, motion, voice commands, and eye movement. Input sensor 1163 includes optical sensors for image capture, eye tracking, or motion and gesture detection. The optical sensors may be infrared or semiconductor photodetectors. Input sensor 1163 includes audio and acoustic sensors, which may be MEMS microphones for speech recognition or sound-based interaction. The audio and acoustic sensors may be mounted as part of user interface 1161 or embedded in display panel 1141.

[0250] The digitizer 1164 generates data values ​​corresponding to coordinate information input via a pen or mouse to control the movement of the screen cursor. The digitizer 1164 generates data values ​​representing the change in electromagnetic flux caused by the input. The digitizer 1164 can detect input via a passive pen, or transmit and receive data using an active pen or remote control.

[0251] At least one of the fingerprint sensor 1162, the input sensor 1163, and the digitizer 1164 may be implemented as a sensor layer formed on the top layer of the display panel 1141 by a process that is continuous with the process of forming the elements (e.g., light-emitting elements and transistors) included in the display panel 1141.

[0252] Additionally, the user interface 1161 may further include, for example, a gesture sensor, a gyroscope sensor for sensing rotational motion, an accelerometer sensor for tracking translational motion, a grip sensor, a pressure sensor, a proximity sensor, a color sensor, an infrared (IR) emitter and camera sensor for tracking gaze direction and eye movement, a temperature sensor, or a light sensor. For example, the gyroscope sensor, accelerometer sensor, and infrared emitter and camera sensor may be particularly suitable for AR / VR head-mounted display functions.

[0253] Touchscreen 1142 includes a touch sensor embedded in a semiconductor layer of display panel 1141 to sense pressure applied to the top layer (screen) of display panel 1141. The touch sensor may be capacitive or resistive. Touchscreen 1142 can be used as a primary interface for user selection and navigation applications, control of electronic device 1000, and interaction with electronic device 1000.

[0254] The display panel 1141 (or display) may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and the type of display panel 1141 is not specifically limited. The display panel 1141 may be rigid or flexible, capable of being rolled up or folded. The display module 1140 may further include supports, brackets, and heat dissipation components for supporting the display panel 1141. The display panel 1141 may include... Figure 12 The display panel DP is shown in the image.

[0255] Power module 1150 supplies power to components of electronic device 1000. Power module 1150 may include a battery charged with a power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 1150 may include a power management integrated circuit (PMIC). The PMIC supplies optimized power to each of the aforementioned components, including display module 1140.

[0256] For example, regarding Figure 13 The disclosure of the electronic device 1000 can be combined with the disclosure of electronic device EA and electronic device EA-a.

[0257] Figure 14 Schematic diagrams illustrating electronic devices according to various embodiments. References Figure 14 According to the embodiment, it includes a display device DD ( Figure 8The electronic devices EA of the device may include not only electronic devices for displaying images (e.g., smartphones EA_1a, tablet computers (PCs) EA_1b, laptop computers EA_1c, TVs EA_1d, and monitors for desktop computers EA_1e), but also wearable electronic devices that include display devices (e.g., smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c) and vehicle electronic devices EA_3 that include display devices (e.g., vehicle instrument panels, center consoles, central information displays (CIDs) mounted on the instrument panel, and interior mirror displays).

[0258] In embodiments of the present invention, an electronic device may include a display device. The display device may include a foldable display panel and a protective member disposed on the display panel. The protective member may include a protective substrate layer, a hard coating layer, and an anti-reflective layer stacked sequentially. The hard coating layer comprises a polymer derived from a coating composition, and the coating composition may include silsesquioxane resins, oxetane resins, photopolymerization initiators, and silica nanoparticles. Based on 100 wt% of the total weight of the coating composition, the weight of the silica nanoparticles may be from about 3 wt% to about 5 wt%. The hard coating layer is formed by curing the coating composition and may exhibit low SCI reflectivity, increased abrasion resistance, increased flexibility, and increased hardness. Accordingly, the hard coating layer may exhibit low curvature folding and easy repeated folding and unfolding. Display devices and electronic devices including the hard coating layer may exhibit superior reliability and superior display quality.

[0259] The display device and electronic device including the display device according to embodiments of the present invention include a hard coating formed by a coating composition comprising specific materials, and may have increased reliability.

[0260] Although the invention has been described above with reference to embodiments thereof, it will be understood that those skilled in the art or those with ordinary knowledge in the art may modify and alter the invention in various ways without departing from the spirit and scope of the invention as described in the claims.

[0261] Although the invention has been specifically shown and described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes in form and detail may be made to the invention without departing from the spirit and scope thereof.

Claims

1.A display device, comprising: a display panel configured to be folded along a folding axis; and a protective member disposed on the display panel, wherein the protective member comprises: a protective base layer; a hard coat layer comprising a polymer derived from a coating composition, wherein the hard coat layer is disposed on the protective base layer; and an anti-reflection layer comprising a high refractive index layer and a low refractive index layer disposed on the high refractive index layer, wherein the anti-reflection layer is disposed on the hard coat layer, wherein the coating composition comprises a silsesquioxane-based resin, an oxetane-based resin, a photopolymerization initiator, and silica nanoparticles, and wherein a first weight of the silica nanoparticles is 3 to 5 wt% based on a total weight of the coating composition. 2.The display device of claim 1, wherein a sum of a second weight of the silsesquioxane-based resin and a third weight of the oxetane-based resin is 93 to 95 wt% based on the total weight of the coating composition. 3.The display device of claim 1, wherein the silsesquioxane-based resin comprises at least one of a T-type silsesquioxane unit, a D-type silsesquioxane unit, and an M-type silsesquioxane unit. 4.The display device of claim 1, wherein the silsesquioxane-based resin comprises 7 or 8 siloxane units. 5.The display device of claim 1, wherein the oxetane-based resin comprises a moiety represented by the following Formula 1: Formula 1 In Formula 1, n1 is an integer selected from 3 to 100. 6.The display device of claim 1, wherein the photopolymerization initiator comprises triarylsulfonium hexafluoroantimonate. 7.The display device of claim 1, wherein a weight of the photopolymerization initiator is 2 wt% or less based on the total weight of the coating composition. 8.The display device of claim 1, wherein a diameter of the silica nanoparticles is 20 to 60 nm. 9.The display device of claim 1, wherein the silica nanoparticles comprise hydroxyl groups on surfaces thereof. 10.The display device of claim 1, wherein the coating composition further comprises a solvent, and the solvent comprises at least one of 1-methoxy-2-methyl-2-propanol, 1-methoxy-2-propanol, and 2-butanone. 11.The display device of claim 1, wherein the high refractive index layer comprises niobium pentoxide and titanium dioxide, and a ratio of a fourth weight of the niobium pentoxide to a fifth weight of the titanium dioxide is 7:3 to 9:1 based on a sum of the fourth weight and the fifth weight. 12.The display device of claim 1, wherein the high refractive index layer and the low refractive index layer are respectively provided as a plurality of high refractive index layers and a plurality of low refractive index layers, and the plurality of high refractive index layers and the plurality of low refractive index layers are alternately disposed on the hard coat layer. 13.The display device of claim 1, wherein a thickness of the hard coat layer is 1 to 8 µm, ​ wherein the hard coat layer has a reflectance including a specular component of 0.5% to 1.5%, and wherein the hardness of the hard coat layer is 0.22 GPa to 0.32 GPa, and the elastic modulus of the hard coat layer is 2.78 GPa to 3.78 GPa. 14.The display device of claim 1, wherein the protective base layer comprises at least one of polyethylene terephthalate, polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, and ethylene vinyl alcohol copolymer. 15.An electronic device comprising: a processor; a memory storing an application program for execution by the processor; a display device according to any one of claims 1 to 14; and a user interface configured to sense a user input via a touch or cursor selection of an icon presented on the display panel, wherein the processor is caused to execute one or more stored application programs when the user input is received. ​

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