Display device and electronic device including the same

By employing a multi-layer encapsulation structure in display devices and adjusting the refractive index and thickness of the encapsulation layers, the problems of low reliability of the encapsulation layers and viewing angle-dependent color difference are solved, achieving higher display quality and reliability.

CN121646153APending Publication Date: 2026-03-10SAMSUNG DISPLAY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-29
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

The packaging layer of existing display devices has low reliability, and different viewing angles will identify images with different color coordinates, affecting display quality.

Method used

A multi-layer encapsulation structure is adopted, which includes a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer. The first and second inorganic encapsulation layers have different refractive indices. By adjusting the refractive index and thickness of each layer, the reflection and refraction of light are controlled to improve the light extraction efficiency and viewing angle characteristics.

Benefits of technology

It improves the reliability and display quality of display devices, reduces the penetration of external moisture and oxygen, and improves light extraction efficiency and viewing angle consistency.

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Abstract

The invention relates to a display device and an electronic device including the same. The display device includes a display element disposed throughout a substrate, and an encapsulation layer disposed on the display element and including a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer, wherein the first inorganic encapsulation layer comprises: a first-first inorganic encapsulation layer comprising silicon nitride, first-second inorganic encapsulation layer disposed throughout the first-first inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer, and first-second inorganic encapsulation layer disposed between the first-first inorganic encapsulation layer and the first-second inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer and being large and first to third inorganic encapsulation layers having a refractive index equal to the refractive index of the first to second inorganic encapsulation layers. The refractive indexes of the first to third inorganic encapsulation layers are greater than 1.75 and less than 1.80.
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Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0117884, filed on August 30, 2024, and all benefits derived therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The embodiments relate to display devices and electronic devices including display devices, and more specifically, to display devices and electronic devices including display devices that have improved reliability and improved display quality. Background Technology

[0004] Display devices include organic light-emitting diodes (OLEDs) as display elements. An OLED includes a pixel electrode, a counter electrode, and an emitting layer between the pixel electrode and the counter electrode. Because OLEDs are easily damaged by external moisture or oxygen, an encapsulation layer protects the OLED by covering it. Additionally, the encapsulation layer is disposed on the display element and serves as an optical layer for controlling the light extraction efficiency and viewing angle characteristics of the display element. Summary of the Invention

[0005] However, in display devices in related fields, the reliability of the encapsulation layer is relatively low and the image can be identified with different color coordinates depending on the viewing angle of the display device.

[0006] The embodiments include display devices with improved reliability and improved display quality, as well as electronic devices including the display devices. However, such technical features are merely examples, and this disclosure is not limited thereto.

[0007] Other features will be set forth in part in the description which follows and in part will be obvious from the description or may be learned by practice of the embodiments of this disclosure presented.

[0008] In embodiments of this disclosure, a display device includes a display element disposed throughout a substrate and an encapsulation layer disposed on the display element and including a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first and second inorganic encapsulation layers. The first inorganic encapsulation layer includes: a first-first inorganic encapsulation layer comprising silicon nitride; a first-second inorganic encapsulation layer disposed throughout the first-first inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer; and a first-third inorganic encapsulation layer disposed between the first-first inorganic encapsulation layer and the first-second inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer and greater than that of the first-second inorganic encapsulation layer, wherein the refractive index of the first-third inorganic encapsulation layer is greater than 1.75 and less than 1.80.

[0009] In an embodiment, the refractive index of the first-first inorganic encapsulation layer may be in the range of about 1.85 to about 2.00, and the refractive index of the first-second inorganic encapsulation layer may be in the range of about 1.52 to about 1.70.

[0010] In an embodiment, each of the first-second inorganic encapsulation layer and the first-third inorganic encapsulation layer may include silicon oxynitride, and the oxygen content of the first-third inorganic encapsulation layer may be less than the oxygen content of the first-second inorganic encapsulation layer.

[0011] In this embodiment, the nitrogen content of the first to third inorganic encapsulation layers may be greater than the nitrogen content of the first to second inorganic encapsulation layers.

[0012] In the implementation, the first and second inorganic encapsulation layers may have approximately to approximately The thickness, and the first-third inorganic encapsulation layers can have approximately to approximately The thickness.

[0013] In the implementation, the first-first inorganic encapsulation layer may have approximately to approximately The thickness.

[0014] In the implementation, the first-third inorganic encapsulation layer can directly contact the first-first inorganic encapsulation layer, and the first-second inorganic encapsulation layer can directly contact the first-third inorganic encapsulation layer.

[0015] In an embodiment, the display device may further include a capping layer disposed between the display element and the encapsulation layer, and a buffer layer disposed between the capping layer and the encapsulation layer.

[0016] In one embodiment, the capping layer may have a refractive index greater than that of the buffer layer, and the refractive index of the buffer layer may be less than that of the first inorganic encapsulation layer.

[0017] In an embodiment, the refractive index of the capping layer may be in the range of about 1.60 to about 2.30, and the refractive index of the buffer layer may be in the range of about 1.20 to about 1.62.

[0018] In embodiments of this disclosure, the electronic device includes: a display device comprising a display element disposed throughout a substrate and an encapsulation layer disposed on the display element and including a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first and second inorganic encapsulation layers; and a housing accommodating the display device and constituting the appearance of the electronic device; wherein the first inorganic encapsulation layer includes: a first-first inorganic encapsulation layer comprising silicon nitride, a first-second inorganic encapsulation layer disposed throughout the first-first inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer, and a first-third inorganic encapsulation layer disposed between the first-first inorganic encapsulation layer and the first-second inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer and greater than that of the first-second inorganic encapsulation layer, wherein the refractive index of the first-third inorganic encapsulation layer is greater than 1.75 and less than 1.80.

[0019] In an embodiment, the refractive index of the first-first inorganic encapsulation layer may be in the range of about 1.85 to about 2.00, and the refractive index of the first-second inorganic encapsulation layer may be in the range of about 1.52 to about 1.70.

[0020] In an embodiment, each of the first-second inorganic encapsulation layer and the first-third inorganic encapsulation layer may include silicon oxynitride, and the oxygen content of the first-third inorganic encapsulation layer may be less than the oxygen content of the first-second inorganic encapsulation layer.

[0021] In this embodiment, the nitrogen content of the first to third inorganic encapsulation layers may be greater than the nitrogen content of the first to second inorganic encapsulation layers.

[0022] In the implementation, the first and second inorganic encapsulation layers may have approximately to approximately The thickness, and the first-third inorganic encapsulation layers can have approximately to approximately The thickness.

[0023] In the implementation, the first-first inorganic encapsulation layer may have approximately to approximately The thickness.

[0024] In the implementation, the first-third inorganic encapsulation layer can directly contact the first-first inorganic encapsulation layer, and the first-second inorganic encapsulation layer can directly contact the first-third inorganic encapsulation layer.

[0025] In one embodiment, the electronic device may further include a capping layer disposed between the display element and the encapsulation layer, and a buffer layer disposed between the capping layer and the encapsulation layer.

[0026] In one embodiment, the capping layer may have a refractive index greater than that of the buffer layer, and the refractive index of the buffer layer may be less than that of the first inorganic encapsulation layer.

[0027] In an embodiment, the refractive index of the capping layer may be in the range of about 1.60 to about 2.30, and the refractive index of the buffer layer may be in the range of about 1.20 to about 1.62.

[0028] These and / or other features will become apparent and more readily understood from the following detailed description, the accompanying drawings, and the claims. Attached Figure Description

[0029] The above-described features and advantages of the illustrative embodiments of this disclosure, as well as other features and advantages, will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0030] Figure 1 A schematic perspective view of an embodiment of an electronic device;

[0031] Figure 2 A schematic plan view for implementing the display device;

[0032] Figure 3 for Figure 2 The equivalent circuit diagram of the pixel circuits included in the display device;

[0033] Figure 4 For along Figure 2 The line I-I' intercepted Figure 2 A schematic cross-sectional view of a display device;

[0034] Figures 5A to 5J A view illustrating the effect of the thickness of the sublayer of the first inorganic encapsulation layer on color coordinates according to the viewing angle;

[0035] Figure 6 This is a schematic cross-sectional view of another embodiment of the display device. Detailed Implementation

[0036] The embodiments illustrated herein will now be described in detail with reference to the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this regard, the illustrated embodiments may take different forms and should not be construed as limited to the description set forth herein. Accordingly, embodiments are described below solely with reference to the drawings to explain the described features. As used herein, the term “and / or” includes any and all combinations of one or more of the associated enumerated items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0037] Because this disclosure allows for various modifications and numerous embodiments, illustrative embodiments will be explained in the accompanying drawings and described in the text. The effects and features of this disclosure, as well as methods for implementing them, will be clarified with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below and can be embodied in various forms.

[0038] While terms like "first" and "second" can be used to describe various components, these components are not necessarily limited to the terms mentioned above. The terms above are used to distinguish one component from another.

[0039] As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0040] It will be understood that, as used herein, the terms “comprise,” “comprising,” “include,” and / or “including” indicate the presence of a feature or component of the description, but do not preclude the addition of one or more other features or components.

[0041] In the specification, "A and / or B" means A or B or A and B. In the specification, "at least one of A and B" means A or B or A and B.

[0042] In the instruction manual, when various components (such as layers, areas, and boards) are set "on" another component (such as layers, areas, and boards), not only can the components (such as layers, areas, and boards) be set "directly" on the other component (such as layers, areas, and boards), but the other component (such as layers, areas, and boards) can also be set between them.

[0043] It will be understood that when a layer, area, or component is referred to as being "connected" to another layer, area, or component, it may be "directly connected" to that other layer, area, or component, or it may be "indirectly connected" to that other layer, area, or component, with that other layer, area, or component inserted between them. For example, it will be understood that when a layer, area, or element is referred to as being "electrically connected" to another layer, area, or element, it may be "directly electrically connected" to that other layer, area, or element, or it may be "indirectly electrically connected" to that other layer, area, or element, with that other layer, area, or element inserted between them.

[0044] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0045] As used herein, “about” or “approximately” includes the stated value and means within an acceptable range of deviation for a particular value, determined by a person skilled in the art considering the measurement in question and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, the term “about” may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0046] The embodiments will now be described with reference to the accompanying drawings, wherein the same reference numerals refer to the same elements throughout and repeated descriptions thereof are omitted. For ease of explanation, the dimensions of elements in the drawings may be enlarged or reduced. In the embodiments, for ease of description, the dimensions (e.g., thickness) of each element shown in the drawings are arbitrarily represented, and therefore, this disclosure is not necessarily limited thereto.

[0047] Figure 1 This is a schematic perspective view of an embodiment of electronic device 2. Figure 2 This is a schematic plan view of an embodiment of display device 1.

[0048] like Figure 1 and Figure 2 As shown, display device 1 is a device for displaying moving or still images, and can display screens or input or output data in electronic device 2.

[0049] Despite Figure 1 The illustration shows a display device 1 used in a mobile phone in an embodiment, but this disclosure is not limited thereto. In embodiments, the display device 1 can be used as a display screen for various electronic devices, including televisions, laptop computers, monitors, billboards, Internet of Things (“IoT”) devices, and portable electronic devices, including mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (“PMP”), navigation devices, and ultra-mobile personal computers (“UMPC”).

[0050] Additionally, the display device 1 in the embodiments can be used in electronic devices (e.g., wearable devices, including smartwatches, smartwatch phones, glasses-type displays, and head-mounted displays (“HMDs”)). In the embodiments, the display device 1 is suitable for displays in various electronic devices (e.g., displays in the instrument panel of a car, displays in the center console of a car, or displays in the central information display (“CID”) arranged on the dashboard), interior mirror displays replacing the side mirrors of a car, and displays in entertainment systems for rear-seat passengers arranged on the back of the front seats in a car.

[0051] In this embodiment, the display device 1 may be housed within the housing 3 of the electronic device 2. The housing 3 serves as a protective cover for internal components (such as the display device 1) and forms the exterior of the electronic device 2. Furthermore, the display device 1 may be connected to and driven by the electronic module of the electronic device 2. The display device 1 will be described primarily below.

[0052] like Figure 2 As shown, the display device 1 may include a display area DA and a peripheral area PA, wherein a plurality of pixels PX are disposed in the display area DA, and the peripheral area PA is outside the display area DA. Specifically, the peripheral area PA may completely surround the display area DA.

[0053] Each pixel PX of the display device 1 may include an area capable of emitting light of a preset color. The display device 1 can display an image using light from the pixel PX. In an embodiment, each pixel PX may emit red, green, or blue light. Figure 2 As shown, the display area DA may have a polygonal shape (including a quadrilateral shape). In one embodiment, the display area DA may have a quadrilateral shape (e.g., a rectangular shape where the horizontal length is less than the vertical length, a rectangular shape where the horizontal length is greater than the vertical length, or a square shape). In alternative embodiments, the display area DA may have various other shapes (e.g., an elliptical shape or a circular shape).

[0054] The outer peripheral region PA can be a non-display area where no pixels PX are located. Drivers that provide electrical signals or power to the pixels PX can be located in the outer peripheral region PA. Multiple pads (not shown) can be located in the outer peripheral region PA, where electronic components or printed circuit boards can be electrically connected to the pads. The pads can be spaced apart from each other in the outer peripheral region PA and electrically connected to printed circuit boards or integrated circuit components.

[0055] Although an organic light-emitting display device is described in the embodiments of display device 1 below, display device 1 according to this disclosure is not limited thereto. In another embodiment, display device 1 may be an inorganic light-emitting display device or a quantum dot light-emitting display device. In an embodiment, the emitting layer of the display element of display device 1 may include organic or inorganic materials. In addition, display device 1 may include an emitting layer and a quantum dot layer disposed in the path of light emitted from the emitting layer.

[0056] Figure 3 for Figure 2 The equivalent circuit diagram of the pixel circuit PC included in the display device 1 is shown below. The pixel circuit PC can be electrically connected to the display element, and one display element can correspond to one pixel PX. That is, the display element can emit red light, green light, or blue light. Figure 3 An organic light-emitting element (e.g., an organic light-emitting diode) OLED is shown as a display element.

[0057] The pixel circuit PC may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. The second transistor T2 is a switching thin-film transistor, connectable to the scan line SL and the data line DL, and can be turned on according to a switch signal to transmit a data signal to the first transistor T1, receive a data signal from the data line DL, and receive a switch signal from the scan line SL. The storage capacitor Cst includes one end electrically connected to the second transistor T2 and the opposite end electrically connected to the drive voltage line PL. The storage capacitor Cst can store a voltage corresponding to the difference between the voltage transmitted from the second transistor T2 and the drive power supply voltage ELVDD supplied from the drive voltage line PL.

[0058] The first transistor T1 is a driving transistor, which can be connected to the driving voltage line PL and the storage capacitor Cst. The magnitude of the driving current can be controlled according to the voltage stored in the storage capacitor Cst. The driving current flows from the driving voltage line PL to the organic light-emitting element (OLED). The OLED emits light with a preset brightness corresponding to the driving current. The counter electrode of the OLED receives the electrode power supply voltage ELVSS.

[0059] Although reference Figure 3 The pixel circuit PC is described as including two transistors and one storage capacitor, but this disclosure is not limited thereto. In embodiments, the number of transistors and the number of storage capacitors can be varied depending on the design of the pixel circuit PC.

[0060] Figure 4 For along Figure 2 The line I-I' intercepted Figure 2 A schematic cross-sectional view of the display device 1. As those skilled in the art will recognize, in addition to Figure 4In addition to the elements shown, the display device 1 may further include other elements.

[0061] like Figure 4 As shown, the display device 1 may include a substrate 100, a pixel circuit layer 200, a display element layer 300, a capping layer CPL, a buffer layer BL, and an encapsulation layer 400. Since the display device 1 includes a substrate 100, it can be understood that the substrate 100 includes a display area DA and a peripheral area PA. For convenience, the following description is based on the assumption that the substrate 100 includes a display area DA and a peripheral area PA.

[0062] Substrate 100 may comprise glass, metal, or polymer resin. Substrate 100 needs to be flexible or bendable. In this case, substrate 100 may comprise a polymer resin (e.g., polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate). Substrate 100 may have a multilayer structure comprising two layers, each comprising a polymer resin, and an inorganic material (e.g., silicon oxide (SiO2)) between the two layers. x ), silicon nitride (SiN) x ) or silicon oxynitride (SiO) x N y An isolation layer (such as...). However, various modifications can be made.

[0063] Pixel circuit layer 200 may be disposed on substrate 100. Pixel circuit layer 200 may include a transistor TFT, an inorganic insulating layer IIL, and an organic insulating layer OIL. The transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The inorganic insulating layer IIL may include a gate insulating layer IIL1, a first interlayer insulating layer IIL2, and a second interlayer insulating layer IIL3. For ease of explanation, Figure 4 A transistor TFT is shown, and the transistor TFT may correspond to the first transistor T1 (reference). Figure 3 ).

[0064] A semiconductor layer Act may be disposed on the substrate 100. The semiconductor layer Act may include polycrystalline silicon. In alternative embodiments, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. In one embodiment, the semiconductor layer Act may include a channel region, a drain region, and a source region, with the drain region and source region located on opposite sides of the channel region.

[0065] The gate insulating layer IIL1 may be disposed on the semiconductor layer Act and the substrate 100. The gate insulating layer IIL1 may include an inorganic insulating material (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x) or silicon oxynitride (SiO) x N y In this embodiment, the gate insulating layer IIL1 may have a single-layer or multi-layer structure comprising the materials described above. The insulating layer comprising inorganic insulating materials may be formed by chemical vapor deposition. This also applies to the embodiments and modifications thereof described below.

[0066] although Figure 4 The diagram shows a gate insulating layer IIL1 having a shape corresponding to the entire surface of the substrate 100 and having a structure in which contact holes are formed in a predetermined portion, but this disclosure is not limited thereto. In embodiments, the gate insulating layer IIL1 may be patterned to have the same shape as the gate electrode GE.

[0067] The gate electrode GE can be disposed on the gate insulating layer IIL1. That is, because the gate insulating layer IIL1 is disposed between the semiconductor layer Act and the gate electrode GE, insulation between the semiconductor layer Act and the gate electrode GE can be ensured. The gate electrode GE can overlap with the channel region of the semiconductor layer Act. The gate electrode GE can include a low-resistance metallic material. In an embodiment, the gate electrode GE can include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and has a single-layer structure or a multilayer structure including the above-mentioned conductive material.

[0068] The first interlayer insulating layer IIL2 may be disposed on the gate electrode GE and the gate insulating layer IIL1. The first interlayer insulating layer IIL2 may include an inorganic insulating material (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x ) or silicon oxynitride (SiO) x N y In an embodiment, the first interlayer insulation layer IIL2 may have a single-layer structure or a multi-layer structure including the above-described materials.

[0069] The source electrode SE and drain electrode DE may be disposed on the first interlayer insulating layer IIL2. Each of the source electrode SE and drain electrode DE may be connected to the semiconductor layer Act through contact holes defined in the gate insulating layer IIL1 and the first interlayer insulating layer IIL2. At least one of the source electrode SE and drain electrode DE may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may include a single-layer structure or a multilayer structure comprising the aforementioned conductive material. In an embodiment, at least one of the source electrode SE and drain electrode DE may have a Ti / Al / Ti multilayer structure.

[0070] However, this disclosure is not limited thereto. In embodiments, the transistor TFT may have only one of the source electrode SE and the drain electrode DE, or may not have either of them. In embodiments, one transistor TFT does not have a drain electrode DE, another transistor TFT connected to one transistor TFT does not have a source electrode SE, and the semiconductor layers Act of the two transistors may be connected to each other. This connection structure achieves the same effect as when one transistor TFT has a source electrode SE and another transistor TFT has a drain electrode DE, and the source electrode SE of one transistor TFT is connected to the drain electrode DE of the remaining (other) transistor TFT.

[0071] The second interlayer insulating layer IIL3 can be disposed on the source electrode SE, the drain electrode DE, and the first interlayer insulating layer IIL2. The second interlayer insulating layer IIL3 may include an inorganic insulating material (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x ) or silicon oxynitride (SiO) x N y In an embodiment, the second interlayer insulation layer IIL3 may have a single-layer structure or a multi-layer structure including the above-described materials.

[0072] An organic insulating layer (OIL) may be disposed on the second interlayer insulating layer (IIL3). The organic insulating layer (OIL) typically planarizes the upper portion of the pixel circuit layer 200. The organic insulating layer (OIL) may comprise organic materials (e.g., acrylic resin, benzocyclobutene (“BCB”), or hexamethyldisiloxane (“HMDSO”)). Although Figure 4 The diagram shows an organic insulating layer (OIL) as a single layer, but an organic insulating layer (OIL) can be multilayered. However, various modifications are possible.

[0073] The display element layer 300 may be disposed on the pixel circuit layer 200. The display element layer 300 may include a display element 310 and a pixel defining layer 320. In other words, the display element 310 may be disposed throughout the substrate 100. The display element 310 may be electrically connected to a transistor TFT. The display element 310 may be an organic light-emitting element including, for example, a pixel electrode 311, a counter electrode 313, and an emitting layer 312, wherein the emitting layer 312 is disposed between the pixel electrode 311 and the counter electrode 313. When the display element 310 is electrically connected to the transistor TFT, it can be understood that the pixel electrode 311 of the organic light-emitting element is electrically connected to the transistor TFT.

[0074] Pixel electrode 311 can be electrically connected to the transistor TFT via a contact hole defined in the second interlayer insulating layer IIL3 and the organic insulating layer OIL, contacting one of the source electrode SE and the drain electrode DE. Pixel electrode 311 may include a conductive oxide (e.g., indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (“IGO”), or aluminum zinc oxide (“AZO”)). In another embodiment, pixel electrode 311 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or any combination thereof. In another embodiment, pixel electrode 311 may further include a layer above / below the reflective layer comprising ITO, IZO, ZnO, or In2O3.

[0075] The pixel defining layer 320 may cover the edge of the pixel electrode 311. The pixel defining layer 320 may define a pixel opening, and the pixel opening may overlap with the pixel electrode 311. In an embodiment, the pixel opening may expose the central portion of the pixel electrode 311, and at least a portion of the emitting layer 312 of the display element 310 may be disposed in the pixel opening. The emitting area for emitting light from the display element 310 may be defined by the pixel opening.

[0076] In addition, Figure 4 In the case shown, the pixel defining layer 320 can increase the distance between the edge of the pixel electrode 311 and the counter electrode 313 disposed above the pixel electrode 311. Accordingly, it can prevent the generation of electric arcs or the like at the edge of the pixel electrode 311. The pixel defining layer 320 may include an organic insulating material (e.g., polyimide or HMDSO). In an embodiment, the pixel defining layer 320 may include a light-blocking material.

[0077] Counter electrode 313 may be disposed throughout pixel electrode 311. Counter electrode 313 may be provided uniformly throughout the entire surface of display device 1, and correspondingly, counter electrode 313 may be provided commonly throughout multiple display elements 310. That is, counter electrode 313 may be provided uniformly throughout multiple display elements 310. Accordingly, counter electrode 313 may correspond to multiple pixel electrodes 311. Counter electrode 313 may include: a light-transmitting conductive layer including ITO, In2O3 or IZO, and a semi-transparent layer including a metal (e.g., magnesium (Mg), aluminum (Al) or silver (Ag)). In an embodiment, counter electrode 313 may be a semi-transparent layer including magnesium (Mg) and silver (Ag).

[0078] A light-emitting layer 312 is disposed between the pixel electrode 311 and the counter electrode 313. The light-emitting layer 312 can emit red, green, or blue light. The light-emitting layer 312 may comprise a polymeric organic material or a low-molecular-weight organic material capable of emitting light of a preset color (red, green, or blue). In embodiments, the light-emitting layer 312 may comprise a polymeric organic material (e.g., polyphenylene acetylene (“PPV”) or polyfluorene). The light-emitting layer 312 may be formed by screen printing, inkjet printing, or laser-induced thermal imaging (“LITI”). However, this disclosure is not limited thereto.

[0079] In one embodiment, a functional layer (not shown) may be disposed below and on the emitter layer 312. The functional layer may include a hole injection layer (“HIL”), a hole transport layer (“HTL”), an electron transport layer (“ETL”), and / or an electron injection layer (“EIL”). The functional layer may be provided throughout the plurality of pixel electrodes 311, or patterned to correspond to each of the plurality of pixel electrodes 311.

[0080] The capping layer CPL can be disposed on the counter electrode 313. In other words, the capping layer CPL can be disposed between the display element 310 and the encapsulation layer 400. The capping layer CPL can cover and protect the upper part of the counter electrode 313. In addition, the capping layer CPL can improve the light extraction efficiency of the display element 310 through constructive interference, etc. In other words, the light extraction efficiency of the display element 310 can be improved by the capping layer CPL.

[0081] The capping layer CPL may be a layer with a relatively high refractive index. The capping layer CPL may have a refractive index greater than that of the buffer layer BL described below. Specifically, the capping layer CPL may have a refractive index of about 1.60 to about 2.30. In an embodiment, the capping layer CPL may have a refractive index of about 2.05. The capping layer CPL may have a refractive index of about... to approximately The thickness. In an embodiment, the capping layer CPL may have approximately [a certain thickness]. The thickness of the capping layer (CPL) is considered. The capping layer can comprise inorganic or organic insulating materials. Although... Figure 4 The diagram shows a capping layer CPL comprising a single layer, but this disclosure is not limited thereto. In another embodiment, the capping layer CPL may have a structure in which multiple layers are stacked. That is, the capping layer CPL may have a multilayer structure comprising the aforementioned materials.

[0082] A buffer layer BL can be disposed on the capping layer CPL. In other words, the buffer layer BL can be disposed between the capping layer CPL and the encapsulation layer 400. That is, the buffer layer BL can block plasma and the like used in the process of forming the encapsulation layer 400, so that plasma particles and the like do not penetrate the display element 310 and do not damage the emitter layer 312 or the counter electrode 313.

[0083] The buffer layer BL may be a layer with a relatively low refractive index. The buffer layer BL may have a refractive index lower than that of the capping layer CPL. Additionally, the buffer layer BL may have a refractive index lower than that of the first-first inorganic encapsulation layer 411. Specifically, the buffer layer BL may have a refractive index of about 1.20 to about 1.62. In an embodiment, the buffer layer BL may have a refractive index of about 1.39. The buffer layer BL may have a refractive index of about... to approximately The thickness of the buffer layer BL. In an embodiment, the buffer layer BL may have approximately [a certain thickness]. The thickness of the buffer layer BL. The buffer layer BL may include inorganic materials (e.g., lithium fluoride (LiF), magnesium fluoride (MgF2), or calcium fluoride (CaF2)). In an embodiment, the buffer layer BL may include lithium fluoride (LiF).

[0084] Because the display element 310 is easily damaged by external moisture or oxygen, the encapsulation layer 400 protects the display element 310 by covering it. That is, the encapsulation layer 400 can be disposed on the display element 310. In an embodiment, the encapsulation layer 400 can be disposed on the buffer layer BL. For example... Figure 4 As shown, the encapsulation layer 400 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430. In an embodiment, the encapsulation layer 400 may be disposed on a buffer layer BL, wherein the encapsulation layer 400 includes a first inorganic encapsulation layer 410, a second inorganic encapsulation layer 430, and an organic encapsulation layer 420 between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430.

[0085] The first inorganic encapsulation layer 410 may cover the counter electrode 313 and includes silicon oxide (SiO2). x ), silicon nitride (SiN) x ) and silicon oxynitrides (SiO) x N y At least one of the following. Because the first inorganic encapsulation layer 410 is formed along the structure beneath it, therefore, as Figure 4 As shown, the upper surface of the first inorganic encapsulation layer 410 may not be flat. The first inorganic encapsulation layer 410 may include multiple sublayers, and the specific structure of the first inorganic encapsulation layer 410 is described in detail below.

[0086] The organic encapsulation layer 420 may cover the first inorganic encapsulation layer 410. The organic encapsulation layer 420 may be disposed on the first inorganic encapsulation layer 410. In other words, the organic encapsulation layer 420 may be disposed between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430. Unlike the first inorganic encapsulation layer 410, the upper surface of the organic encapsulation layer 420 may be approximately flat. The organic encapsulation layer 420 may include at least one material selected from the following: polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane.

[0087] The second inorganic encapsulation layer 430 may cover the organic encapsulation layer 420. The second inorganic encapsulation layer 430 may be disposed on the organic encapsulation layer 420 and in direct contact with the organic encapsulation layer 420. The second inorganic encapsulation layer 430 may include silicon nitride (SiN). x ) and silicon oxynitrides (SiO) x N y At least one of the following.

[0088] Because the encapsulation layer 400 includes a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, even if cracks occur inside the encapsulation layer 400, the multi-layer structure prevents these cracks from connecting with each other between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420, or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. This configuration prevents or reduces the formation of pathways through which external moisture or oxygen can penetrate into the interior of the display device 1.

[0089] As described above, the first inorganic encapsulation layer 410 may include multiple sublayers. That is, the first inorganic encapsulation layer 410 may have a structure in which multiple sublayers are stacked. The refractive indices of the multiple sublayers included in the first inorganic encapsulation layer 410 may be different from each other.

[0090] Typically, at least a portion of the light emitted from the display element 310 can be reflected and / or refracted at the interfaces between layers disposed on the display element 310. The reflection and / or refraction of light emitted from the display element 310 can be controlled by adjusting the refractive index and thickness of the layers disposed on the display element 310. That is, the light extraction efficiency and viewing angle characteristics of the display element 310 can be controlled by adjusting the refractive index and thickness of the layers disposed on the display element 310. Accordingly, the layers disposed on the display element 310 can serve as optical layers. However, the layers disposed on the display element 310 may be excessively thick (e.g., (or larger) or too thin (e.g., In cases where the thickness is small or smaller, this layer may not be suitable for use as an optical layer.

[0091] In the case where the first inorganic encapsulation layer 410 has a structure in which multiple sublayers with different refractive indices are stacked, at least a portion of the light emitted from the display element 310 can be reflected and / or refracted at the interfaces between the multiple sublayers of the first inorganic encapsulation layer 410. By adjusting the refractive index and thickness of the multiple sublayers of the first inorganic encapsulation layer 410, the reflection and / or refraction of light emitted from the display element 310 can be controlled. That is, by adjusting the refractive index and thickness of the multiple sublayers of the first inorganic encapsulation layer 410, the light extraction efficiency and viewing angle characteristics of the display element 310 can be controlled. Accordingly, the first inorganic encapsulation layer 410 can be used as an optical layer.

[0092] Specifically, the first inorganic encapsulation layer 410 may include a first-first inorganic encapsulation layer 411 and a first-second inorganic encapsulation layer 412 disposed on the first-first inorganic encapsulation layer 411. The first inorganic encapsulation layer 410 may further include a first-third inorganic encapsulation layer 413, and the first-third inorganic encapsulation layer 413 may be disposed between the first-first inorganic encapsulation layer 411 and the first-second inorganic encapsulation layer 412. That is, the first-third inorganic encapsulation layer 413 may be disposed on the first-first inorganic encapsulation layer 411, and the first-second inorganic encapsulation layer 412 may be disposed on the first-third inorganic encapsulation layer 413. The first-third inorganic encapsulation layer 413 may directly contact the first-first inorganic encapsulation layer 411, and the first-second inorganic encapsulation layer 412 may directly contact the first-third inorganic encapsulation layer 413. In other words, the first-third inorganic encapsulation layer 413 can be directly disposed on the first-first inorganic encapsulation layer 411, and the first-second inorganic encapsulation layer 412 can be directly disposed on the first-third inorganic encapsulation layer 413.

[0093] The multiple sublayers of the first inorganic encapsulation layer 410 may have different refractive indices. The first-first inorganic encapsulation layer 411 may be a high refractive index layer with a relatively high refractive index, and the first-second inorganic encapsulation layer 412 may be a low refractive index layer with a relatively low refractive index. That is, the refractive index of the first-second inorganic encapsulation layer 412 may be less than the refractive index of the first-first inorganic encapsulation layer 411. The refractive index of the first-third inorganic encapsulation layer 413 may be less than the refractive index of the first-first inorganic encapsulation layer 411 and greater than the refractive index of the first-second inorganic encapsulation layer 412. That is, the first-third inorganic encapsulation layer 413 may serve as a medium refractive index layer.

[0094] Specifically, the first-first inorganic encapsulation layer 411 may have a refractive index of about 1.85 to about 2.00, and the first-second inorganic encapsulation layer 412 may have a refractive index of about 1.52 to about 1.70. The first-third inorganic encapsulation layer 413 may have a refractive index greater than 1.75 and less than 1.80. In an embodiment, the refractive index of the first-first inorganic encapsulation layer 411 may be about 1.89, and the refractive index of the first-second inorganic encapsulation layer 412 may be about 1.62. The refractive index of the first-third inorganic encapsulation layer 413 may be about 1.77.

[0095] Each of the plurality of sub-layers included in the first inorganic encapsulation layer 410 may include: an inorganic insulating material comprising silicon (Si) (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) x ) or silicon oxynitride (SiO) x N y The refractive index of multiple sublayers can vary depending on the amount of nitrogen (N) and oxygen (O) contained in each of the multiple sublayers.

[0096] In this embodiment, the first-first inorganic encapsulation layer 411 may include silicon nitride (SiN). x Each of the first-second inorganic encapsulation layer 412 and the first-third inorganic encapsulation layer 413 may include silicon oxynitride (SiO2). x N y The nitrogen (N) content in the first-third inorganic encapsulation layer 413 may be greater than the nitrogen (N) content in the first-second inorganic encapsulation layer 412, and the oxygen (O) content in the first-third inorganic encapsulation layer 413 may be less than the oxygen (O) content in the first-second inorganic encapsulation layer 412.

[0097] In this embodiment, based on the total weight of the first-first inorganic encapsulation layer 411, the first-first inorganic encapsulation layer 411 may include approximately 58 wt% silicon (Si) and approximately 42 wt% nitrogen (N). That is, the first-first inorganic encapsulation layer 411 may not include oxygen (O). Based on the total weight of the first-second inorganic encapsulation layer 412, the first-second inorganic encapsulation layer 412 may include approximately 47 wt% silicon (Si), approximately 22 wt% nitrogen (N), and approximately 31 wt% oxygen (O). Based on the total weight of the first-third inorganic encapsulation layer 413, the first-third inorganic encapsulation layer 413 may include approximately 52 wt% silicon (Si), approximately 34 wt% nitrogen (N), and approximately 14 wt% oxygen (O). The silicon (Si) and nitrogen (N) content contained in the multiple sublayers can be determined using X-ray photoelectron spectroscopy (“XPS”). Because the use of XPS to determine the silicon (Si) and nitrogen (N) content is common in the manufacture of display devices, a detailed description thereof is omitted.

[0098] Generally, when one of the layers comprises an inorganic insulating material containing silicon (Si) or composed of silicon (Si), the refractive index of the layer increases with increasing nitrogen (N) content. Conversely, the reliability of the layer increases with decreasing oxygen (O) content.

[0099] When the first inorganic encapsulation layer 410 includes first-third inorganic encapsulation layers 413, the first-third inorganic encapsulation layers 413 directly contact the first-first inorganic encapsulation layer 411, which is a relatively high refractive index layer. Because the difference between the refractive index of the first-first inorganic encapsulation layer 411 and the refractive index of the first-third inorganic encapsulation layer 413 is small, the reflection and / or refraction of light at the interface formed by the first-first inorganic encapsulation layer 411 and the first-third inorganic encapsulation layer 413 is small. However, when the first inorganic encapsulation layer 410 includes first-third inorganic encapsulation layers 413, an interface is formed between the first-first inorganic encapsulation layer 411 and the first-third inorganic encapsulation layer 413, and an interface is formed between the first-third inorganic encapsulation layer 413 and the first-second inorganic encapsulation layer 412. Accordingly, the reflection and / or refraction of light emitted from the display element 310 occurs not only at the interface between the first-first inorganic encapsulation layer 411 and the first-third inorganic encapsulation layer 413, but also at the interface between the first-third inorganic encapsulation layer 413 and the first-second inorganic encapsulation layer 412.

[0100] In contrast, when the first-second inorganic encapsulation layer 412 directly contacts the first-first inorganic encapsulation layer 411, i.e., when the first inorganic encapsulation layer 410 does not include the first-third inorganic encapsulation layer 413, an interface is formed only between the first-first inorganic encapsulation layer 411 and the first-second inorganic encapsulation layer 412. Accordingly, reflection and / or refraction of light emitted from the display element 310 may occur only at the interface between the first-first inorganic encapsulation layer 411 and the first-second inorganic encapsulation layer 412. Accordingly, in the illustrated embodiment, because light reflection and / or refraction can occur at more interfaces, it is advantageous to control the light extraction efficiency and viewing angle characteristics of the display element 310.

[0101] Furthermore, compared to the case where the first inorganic encapsulation layer 410 does not include the first-third inorganic encapsulation layer 413, in the case where the first inorganic encapsulation layer 410 includes the first-first inorganic encapsulation layer 411, the first-second inorganic encapsulation layer 412 and the first-third inorganic encapsulation layer 413, the first-second inorganic encapsulation layer 412, which has a relatively small thickness relative to the first inorganic encapsulation layer 410 having a predetermined thickness, is included in the first inorganic encapsulation layer 410. For example, assuming the relative thickness of the first inorganic encapsulation layer 410 is 1, the relative thickness of the first-first inorganic encapsulation layer 411 can be about 0.1, the relative thickness of the first-second inorganic encapsulation layer 412 can be about 0.6, and the relative thickness of the first-third inorganic encapsulation layer 413 can be about 0.3. Alternatively, where the first inorganic encapsulation layer 410 does not include the first-third inorganic encapsulation layer 413, the relative thickness of the first-first inorganic encapsulation layer 411 can be about 0.1, and the relative thickness of the first-second inorganic encapsulation layer 412 can be about 0.9.

[0102] In contrast, when the first-second inorganic encapsulation layer 412 directly contacts the first-first inorganic encapsulation layer 411, the relative thickness of the first-first inorganic encapsulation layer 411 can be approximately 0.1 relative to the first inorganic encapsulation layer 410 having the same predetermined thickness, and the relative thickness of the first-second inorganic encapsulation layer 412 can be approximately 0.9. Accordingly, in the illustrated embodiment, since the thickness of the first-second inorganic encapsulation layer 412 having a relatively high oxygen (O) content can be small, the reliability of the first inorganic encapsulation layer 410 can be increased. That is, the reliability of the display device 1 can be increased.

[0103] In the implementation, the first-first inorganic encapsulation layer 411 may have approximately to approximately The thickness of the first-second inorganic encapsulation layer 412. to approximately The thickness, and the first-third inorganic encapsulation layer 413 may have approximately to approximately The thickness. In an embodiment, the first-first inorganic encapsulation layer 411 may have approximately [a certain thickness]. The thickness of the first-second inorganic encapsulation layer 412. The thickness, and the first-third inorganic encapsulation layer 413 may have approximately The thickness.

[0104] Figures 5A to 5J To explain the first inorganic encapsulation layer 410 ( Figure 4 The effect of the thickness of the sublayer on the color coordinates of the view based on the viewing angle. Figures 5A to 5J The relative color coordinates based on the viewing angle are shown. Specifically, Figures 5A to 5J The relative positions of color coordinates based on the viewing angle are shown in the CIE 1976 color coordinate system. In the implementation, in Figures 5A to 5J In the equation, the horizontal position can be related to △u', and the vertical position can be related to △v'.

[0105] because Figures 5A to 5J To explain the differences in color coordinates based on viewing angle, the predetermined values ​​of the color coordinates have been omitted, and... Figures 5A to 5J For ease of description, a representation of display device 1 is also shown. Figure 4 The desired optical properties are elliptical. That is, in Figures 5A to 5J In this case, the color coordinates should be set inside the ellipse to correspond to the case where the display device 1 meets the desired optical characteristics (SPEC IN).

[0106] exist Figures 5A to 5J In the diagram, the uncolored circles represent the color coordinates at a viewing angle of approximately 0°. Figures 5A to 5J In the diagram, uncolored quadrilaterals represent color coordinates at a viewing angle of approximately 15°, uncolored triangles represent color coordinates at a viewing angle of approximately 30°, colored circles represent color coordinates at a viewing angle of approximately 45°, and colored quadrilaterals represent color coordinates at a viewing angle of approximately 60°. Figures 5A to 5J In this context, the closer the color coordinates when the viewing angle is not approximately 0° are to the color coordinates when the viewing angle is approximately 0°, the smaller the change in color coordinates due to the change in viewing angle. That is, the closer the color coordinates when the viewing angle is not approximately 0° are to the color coordinates when the viewing angle is approximately 0°, the better the color coordinates will appear from the display device 1 (…). Figure 4 The smaller the color shift (e.g., white angle dependence (“WAD”) of the emitted light on the side.

[0107] Figure 5A The color coordinates based on the viewing angle are shown in Embodiment 2, and Embodiment 2 has: approximately The thickness of the first-first inorganic encapsulation layer 411 ( Figure 4 ), with approximately The thickness of the first-second inorganic encapsulation layer 412 ( Figure 4 ) and have about The thickness of the first-third inorganic encapsulation layer 413 ( Figure 4 ). Figure 5B The color coordinates based on the viewing angle in Embodiment 3 are shown, and Embodiment 3 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The first and second inorganic encapsulation layers 412 with a thickness of approximately The thickness of the first-third inorganic encapsulation layer 413. Figure 5C The color coordinates based on the viewing angle are shown in Comparative Example 3, and Comparative Example 3 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The first and second inorganic encapsulation layers 412 with a thickness of approximately The thickness of the first-third inorganic encapsulation layer 413. Figure 5D The color coordinates according to the viewing angle are shown in Comparative Example 4, and Comparative Example 4 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The first and second inorganic encapsulation layers 412 with a thickness of approximately The thickness of the first-third inorganic encapsulation layer 413.

[0108] Figure 5E The color coordinates based on the viewing angle in Embodiment 1 are shown, and Embodiment 1 has: approximately The thickness of the first-first inorganic encapsulation layer 411 ( Figure 4 ), with approximately The thickness of the first-second inorganic encapsulation layer 412 ( Figure 4 ) and have about The thickness of the first-third inorganic encapsulation layer 413 ( Figure 4 ). Figure 5F The color coordinates according to the viewing angle are shown in Comparative Example 5, and Comparative Example 5 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The first and second inorganic encapsulation layers 412 with a thickness of approximately The thickness of the first-third inorganic encapsulation layer 413. Figure 5G The color coordinates according to the viewing angle are shown in Comparative Example 6, and Comparative Example 6 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The thickness of the first-second inorganic encapsulation layer 412 and having approximately The thickness of the first-third inorganic encapsulation layer 413. Figure 5H The color coordinates based on the viewing angle are shown in Comparative Example 7, and Comparative Example 7 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The first and second inorganic encapsulation layers 412 with a thickness of approximately The thickness of the first-third inorganic encapsulation layer 413.

[0109] Figure 5IThe color coordinates according to the viewing angle are shown in Comparative Example 8, and Comparative Example 8 has: approximately The thickness of the first-first inorganic encapsulation layer 411 ( Figure 4 ), with approximately The thickness of the first-second inorganic encapsulation layer 412 ( Figure 4 ) and have about The thickness of the first-third inorganic encapsulation layer 413 ( Figure 4 ). Figure 5J The color coordinates according to the viewing angle are shown in Comparative Example 9, and Comparative Example 9 has: approximately The first inorganic encapsulation layer 411 of the thickness of the first inorganic encapsulation layer 411 has approximately The first and second inorganic encapsulation layers 412 with a thickness of approximately The thickness of the first-third inorganic encapsulation layer 413.

[0110] The difference between Embodiment 2, Embodiment 3, and Comparative Examples 3 to 9 and Embodiment 1 lies only in the first inorganic encapsulation layer 410 ( Figure 4 The thickness of the sublayer of the first-second inorganic encapsulation layer 412 is the same as that of the second-second inorganic encapsulation layer 412, and the remaining (other) components are the same or similar. Specifically, the difference between Comparative Examples 3 to 9 and Embodiment 1 is only in the thickness of the second-second inorganic encapsulation layer 412. Figure 4 The thickness of the first-third inorganic encapsulation layer 413 and the thickness of the first-third inorganic encapsulation layer 413 Figure 4 The thickness of ) . The difference between Embodiment 2, Embodiment 3 and Embodiment 1 lies only in the thickness of the first-first inorganic encapsulation layer 411 ( Figure 4 The thickness of ).

[0111] refer to Figures 5C to 5J In which the first-second inorganic encapsulation layer 412 ( Figure 4 The thickness is approximately to approximately And the first-third inorganic encapsulation layer 413 ( Figure 4 The thickness is approximately to approximately In this case, all color coordinates are set inside the ellipse. Specifically, in Comparative Examples 3 to 9 (where the thickness of the first-second inorganic encapsulation layer 412 deviates by approximately...), to approximately The range and the thickness deviation of the first-third inorganic encapsulation layer 413 is approximately to approximately In the case of (within the range), at least one color coordinate is set outside the ellipse. In Embodiment 1 (where the thickness of the first-second inorganic encapsulation layer 412 is approximately to approximately Within the range and the thickness of the first-third inorganic encapsulation layer 413 is approximately to approximately Within the range of ellipses, all color coordinates are set inside the ellipse.

[0112] Accordingly, in which the first-first inorganic encapsulation layer 411 ( Figure 4 The thickness is approximately First-second inorganic encapsulation layer 412 ( Figure 4 The thickness is approximately to approximately Within the range and the first-third inorganic encapsulation layer 413 ( Figure 4 The thickness is approximately to approximately Within the range, display device 1 ( Figure 4 The desired optical properties are achieved. Furthermore, the thickness of the first and second inorganic encapsulation layers 412 is approximately... to approximately Within the range and the thickness of the first-third inorganic encapsulation layer 413 is approximately to approximately Within the specified range, the color coordinates when the viewing angle is not approximately 0° are set to be close to the color coordinates when the viewing angle is approximately 0°. That is, compared to Comparative Examples 3 to 9, Embodiment 1 shows a small change in color coordinates depending on the change in viewing angle. In other words, the color shift (e.g., WAD) on the side of the light emitted from the display device 1 is small. Accordingly, the display quality of the display device 1 can be improved.

[0113] refer to Figure 5A , Figure 5B and Figure 5E In which the first inorganic encapsulation layer 411 ( Figure 4 The thickness is approximately to approximately In this case, the color coordinates when the viewing angle is not approximately 0° are set to color coordinates close to those when the viewing angle is approximately 0°. That is, compared to Embodiments 2 and 3, Embodiment 1 shows a small change in color coordinates depending on the change in viewing angle. In other words, from the display device 1 ( Figure 4 The emitted light has a small lateral color shift (e.g., WAD). Accordingly, the display quality of display device 1 can be improved.

[0114] Despite Figure 4 The diagram shows the first-second inorganic encapsulation layer 412 directly contacting the organic encapsulation layer 420, but this disclosure is not limited thereto. In embodiments, the first inorganic encapsulation layer 410 may further include an auxiliary layer AL disposed on the first-second inorganic encapsulation layer 412. Figure 6 ).

[0115] Figure 6 This is a schematic cross-sectional view of another embodiment of display device 1. Because Figure 6 The display device 1 in the embodiment shown above is the same as the one in the above reference. Figures 1 to 4 The description of display device 1 is similar, so the following will mainly focus on the description and reference. Figures 1 to 4 The differences described in display device 1. Figure 6 In, with Figures 1 to 4 The same reference numerals in the figures denote the same components, and therefore, repeated descriptions are omitted.

[0116] The above reference Figures 1 to 4 The described display device 1 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, and the first inorganic encapsulation layer 410 may include a first-first inorganic encapsulation layer 411, a first-second inorganic encapsulation layer 412, and a first-third inorganic encapsulation layer 413. For example... Figure 6 The display device 1 in the illustrated embodiment may also include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, and the first inorganic encapsulation layer 410 may include a first-first inorganic encapsulation layer 411, a first-second inorganic encapsulation layer 412, and a first-third inorganic encapsulation layer 413.

[0117] However, in Figure 6 In the display device 1 of the embodiments described herein, the first inorganic encapsulation layer 410 may further include an auxiliary layer AL. The auxiliary layer AL may have a refractive index different from that of the first-first inorganic encapsulation layer 411, the first-second inorganic encapsulation layer 412, and the first-third inorganic encapsulation layer 413. Specifically, the auxiliary layer AL may have a refractive index lower than that of the first-second inorganic encapsulation layer 412. In an embodiment, where the refractive index of the first-second inorganic encapsulation layer 412 is approximately 1.62, the refractive index of the auxiliary layer AL may be approximately 1.57. However, this disclosure is not limited thereto.

[0118] The auxiliary layer AL may include inorganic insulating materials (including silicon nitrides (SiN)). x ), silicon oxide (SiO) x ) or silicon oxynitride (SiO) x N y In an embodiment, the auxiliary layer AL may include silicon oxynitride (SiO2). x N y In this embodiment, based on the total weight of the auxiliary layer AL, the auxiliary layer AL may include approximately 46 wt% silicon (Si), approximately 19 wt% nitrogen (N), and approximately 35 wt% oxygen (O).

[0119] The auxiliary layer AL can have approximately to approximately The thickness. In an embodiment, the auxiliary layer AL may have approximately The thickness. However, this disclosure is not limited thereto. In the illustrated embodiment, the thickness of the first-second inorganic encapsulation layer 412 may be approximately to approximately Furthermore, the thickness of the first to third inorganic encapsulation layers 413 can be approximately [missing information]. to approximately In addition, the thickness of the first inorganic encapsulation layer 411 can be approximately to approximately Accordingly, in the illustrated embodiments, the reliability of the display device 1 can be increased and the display quality of the display device 1 can be improved.

[0120] In embodiments with the above configuration, a display device with improved reliability and improved display quality can be implemented, and an electronic device including the display device can be implemented. However, the scope of this disclosure is not limited to these effects.

[0121] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and are not intended for limiting purposes. The description of features or advantages in each embodiment should generally be regarded as other similar features or advantages that may be applicable to other embodiments. Although embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the claims.

Claims

1. A display apparatus comprising: a display element disposed throughout a substrate; and an encapsulation layer disposed on the display element and comprising: a first inorganic encapsulation layer comprising: a first-first inorganic encapsulation layer comprising silicon nitride; a first-second inorganic encapsulation layer disposed throughout the first-first inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer; and a first-third inorganic encapsulation layer disposed between the first-first inorganic encapsulation layer and the first-second inorganic encapsulation layer and having a refractive index less than that of the first-first inorganic encapsulation layer and greater than that of the first-second inorganic encapsulation layer; a second inorganic encapsulation layer; and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer, wherein the refractive index of the first-third inorganic encapsulation layer is greater than 1.75 and less than 1.

80. 2.The display apparatus of claim 1, wherein the first-first inorganic encapsulation layer has a refractive index in a range of 1.85 to 2.00, and the first-second inorganic encapsulation layer has a refractive index in a range of 1.52 to 1.

70. 3.The display apparatus of claim 1, wherein each of the first-second inorganic encapsulation layer and the first-third inorganic encapsulation layer comprises silicon oxynitride, and the first-third inorganic encapsulation layer has an oxygen content less than that of the first-second inorganic encapsulation layer. 4.The display apparatus of claim 3, wherein the first-third inorganic encapsulation layer has a nitrogen content greater than that of the first-second inorganic encapsulation layer. 5.The display apparatus of claim 1, wherein the first-second inorganic encapsulation layer has a thickness of 5,200 angstroms to 6,200 angstroms, and the first-third inorganic encapsulation layer has a thickness of 2,500 angstroms to 3,500 angstroms. 6.The display apparatus of claim 5, wherein the first-first inorganic encapsulation layer has a thickness of 1,150 angstroms to 1,550 angstroms. 7.The display apparatus of claim 1, wherein the first-third inorganic encapsulation layer directly contacts the first-first inorganic encapsulation layer, and the first-second inorganic encapsulation layer directly contacts the first-third inorganic encapsulation layer. 8.The display apparatus of claim 1, further comprising: a capping layer disposed between the display element and the encapsulation layer; and a buffer layer disposed between the capping layer and the encapsulation layer. 9.The display apparatus of claim 8, wherein the capping layer has a refractive index greater than that of the buffer layer, and the buffer layer has a refractive index less than that of the first-first inorganic encapsulation layer. 10.The display apparatus of claim 9, wherein the capping layer has a refractive index in a range of 1.60 to 2.30, and the buffer layer has a refractive index in a range of 1.20 to 1.

62. 11.An electronic apparatus comprising: the display apparatus of any one of claims 1 to 10, and A housing that accommodates the display device and constitutes an external appearance of the electronic device.

Citation Information

Patent Citations

  • Display apparatus

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