Display panel, display device and preparation method of display panel

Abstract

The invention relates to a display panel, a display device and a preparation method of the display panel. The display panel is provided with a display area and a wiring area, and the wiring area and the display area are arranged adjacently; the display panel includes: a substrate; the conductive wire is arranged on one side of the substrate and is positioned in the wiring area; wherein the conductive wire comprises a first conductive part and a second conductive part, the first conductive part is located on the side, away from the substrate, of the second conductive part, the orthographic projection of the first conductive part on the substrate is located in the orthographic projection of the second conductive part on the substrate, and the first conductive part and the second conductive part are made of different materials. Therefore, according to the display panel, the display device and the preparation method of the display panel, the electrical reliability of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising next-generation flat panel display technology. Compared to liquid crystal displays, OLED technology offers advantages such as lower energy consumption, lower cost, self-emissiveness, wide viewing angle, and faster response time. However, the electrical reliability of display panels made using this technology still needs improvement. Summary of the Invention

[0003] Therefore, it is necessary to provide a display panel, a display device, and a method for manufacturing the display panel that can improve the electrical reliability of the display panel.

[0004] In a first aspect, embodiments of this application provide a display panel having a display area and a wiring area, the wiring area and the display area being disposed adjacent to each other; the display panel includes: a substrate; conductive wiring disposed on one side of the substrate and located in the wiring area; wherein, the conductive wiring includes a first conductive portion and a second conductive portion, the first conductive portion being located on the side of the second conductive portion away from the substrate, the orthographic projection of the first conductive portion on the substrate being located within the orthographic projection of the second conductive portion on the substrate, and the first conductive portion and the second conductive portion being made of different materials.

[0005] The display panel provided in this application embodiment includes conductive traces comprising a first conductive portion and a second conductive portion. The first conductive portion is located on the side of the second conductive portion facing away from the substrate, and the orthographic projection of the first conductive portion on the substrate lies within the orthographic projection of the second conductive portion on the substrate. The first and second conductive portions are made of different materials. This avoids the first conductive portion protruding from the side of the second conductive portion, thereby improving the thickness and continuity of the film layer subsequently formed on the side of the first and second conductive portions. This also makes it less likely for moisture to penetrate the first and second conductive portions through the film layer, thus improving the electrical reliability of the conductive traces and mitigating phenomena such as black spots and bright lines.

[0006] In one embodiment, the conductive trace includes a third conductive portion located on the side of the second conductive portion facing the substrate, the orthographic projection of the second conductive portion on the substrate is located within the orthographic projection of the third conductive portion on the substrate, and the second conductive portion and the third conductive portion are made of different materials.

[0007] Preferably, at least one of the first conductive portion and the third conductive portion is made of titanium;

[0008] Preferably, the material of the second conductive part includes aluminum;

[0009] Preferably, the conductive traces are configured as power lines;

[0010] Preferably, the power line includes a first power line and a second power line, the voltage transmitted by the first power line and the voltage transmitted by the second power line are different, one of the first power line and the second power line is electrically connected to the anode of the light-emitting unit, and the other is electrically connected to the cathode of the light-emitting unit.

[0011] Preferably, the conductive traces extend along the direction from the display area to the trace area.

[0012] In one embodiment, the display panel further includes a light-emitting unit, the anode of which is located on the side of the conductive trace away from the substrate.

[0013] In one embodiment, the display panel further includes a first encapsulation layer, a second encapsulation layer, and a barrier. The second encapsulation layer covers the light-emitting unit and is made of an organic material. The first encapsulation layer is disposed on the side of the second encapsulation layer away from the light-emitting unit. The barrier is disposed on one side of the substrate and is used to block the second encapsulation layer. The wiring area is located on the side of the barrier away from the display area.

[0014] In one embodiment, the conductive trace includes two first surfaces disposed opposite each other along a direction perpendicular to the display area to the trace area; the display panel further includes a pixel defining layer, in the trace area, the pixel defining layer is located on the side of the conductive trace away from the substrate, the pixel defining layer has a first opening, the first opening exposes at least one first surface;

[0015] Preferably, in the display area, the display panel includes a plurality of light-emitting units, and a pixel defining layer surrounds and forms a plurality of pixel openings. The plurality of pixel openings and the plurality of light-emitting units are correspondingly disposed, and at least a portion of the light-emitting units is disposed in the corresponding pixel openings.

[0016] Preferably, in the display area, the display panel further includes an isolation structure located on the side of the pixel limiting layer away from the substrate. The isolation structure encloses and forms multiple isolation openings, which are correspondingly arranged with multiple pixel openings. The isolation openings and the corresponding pixel openings are interconnected, and the light-emitting unit extends into the corresponding isolation opening.

[0017] In one embodiment, the display panel further includes an insulating layer located on the side of the conductive trace facing the substrate, and a groove on the side of the insulating layer away from the substrate. The groove opening is located on the surface of the insulating layer away from the substrate, and the groove is connected to the first opening.

[0018] Preferably, the display panel further includes a first encapsulation layer located on the side of the pixel defining layer away from the substrate, the first encapsulation layer covering the first surface and extending into the groove.

[0019] Secondly, embodiments of this application provide a display panel having a display area and a wiring area, the wiring area and the display area being disposed adjacent to each other; the display panel includes: a substrate; conductive wiring disposed on one side of the substrate and located in the wiring area; the conductive wiring includes two first surfaces disposed opposite to each other along a direction perpendicular to the display area to the wiring area, the conductive wiring includes a second surface and a third surface disposed opposite to each other along the thickness direction of the substrate, the second surface being located on the side of the third surface facing the substrate, the second surface and the third surface being connected through the first surface; wherein, the orthographic projection of the third surface on the substrate is located within the orthographic projection of the second surface on the substrate; a light-emitting unit, the anode of the light-emitting unit being disposed on the side of the conductive wiring away from the substrate.

[0020] In the display panel provided in this application embodiment, the orthographic projection of the third surface on the substrate is located within the orthographic projection of the second surface on the substrate. This avoids the first conductive part from protruding from the side of the second conductive part, thereby improving the thickness and continuity of the film layer subsequently formed on the side of the first and second conductive parts. This makes it difficult for moisture to invade the first and second conductive parts through the film layer, thereby improving the electrical reliability of the conductive traces and alleviating phenomena such as black spots and bright lines.

[0021] In one embodiment, along the direction close to the substrate, the conductive trace includes a first conductive portion, a second conductive portion, and a third conductive portion stacked together; the third surface is the surface of the first conductive portion facing away from the substrate, and the second surface is the surface of the third conductive portion facing the substrate.

[0022] In one embodiment, the display panel further includes a second encapsulation layer and a barrier. The second encapsulation layer covers the light-emitting unit and is made of an organic material. The barrier is disposed on one side of the substrate and is used to block the second encapsulation layer. The wiring area is located on the side of the barrier away from the display area.

[0023] Thirdly, embodiments of this application provide a display device, including the display panel described in the first and second aspects above.

[0024] The display device provided in this application includes a display panel, which can prevent the first conductive part from protruding from the side of the second conductive part. This helps to improve the thickness and continuity of the film layer subsequently formed on the side of the first and second conductive parts, making it difficult for water vapor to invade the first and second conductive parts through the film layer. This can improve the electrical reliability of the conductive traces and alleviate phenomena such as black spots and bright lines.

[0025] Fourthly, embodiments of this application provide a method for manufacturing a display panel. The display panel has a display area and a wiring area, which are arranged adjacent to each other. The method for manufacturing the display panel includes: providing a substrate; forming conductive wiring on one side of the substrate; the conductive wiring being located in the wiring area; wherein the conductive wiring includes a first conductive portion and a second conductive portion, the first conductive portion being located on the side of the second conductive portion away from the substrate, the orthographic projection of the first conductive portion on the substrate being located within the orthographic projection of the second conductive portion on the substrate, and the first conductive portion and the second conductive portion being made of different materials.

[0026] The display panel fabrication method provided in this application includes conductive traces comprising a first conductive portion and a second conductive portion. The first conductive portion is located on the side of the second conductive portion facing away from the substrate, and the orthographic projection of the first conductive portion on the substrate lies within the orthographic projection of the second conductive portion on the substrate. The first and second conductive portions are made of different materials. This avoids the first conductive portion protruding from the side of the second conductive portion, thereby improving the thickness and continuity of the film layer subsequently formed on the side of the first and second conductive portions. This also makes it less likely for moisture to penetrate the first and second conductive portions through the film layer, thus improving the electrical reliability of the conductive traces and mitigating phenomena such as black spots and bright lines.

[0027] In one embodiment, a conductive trace is formed on one side of the substrate, including:

[0028] A first intermediate conductive portion and a second intermediate conductive portion are formed on one side of the substrate in the trace area; the first intermediate conductive portion is located on the side of the second intermediate conductive portion away from the substrate, and the first intermediate conductive portion includes a first protrusion that protrudes from the sidewall of the second intermediate conductive portion.

[0029] Preferably, the process of forming the first intermediate conductive portion and the second intermediate conductive portion on one side of the substrate in the wiring area further includes:

[0030] A third intermediate conductive portion is formed on one side of the substrate; the third intermediate conductive portion is located on the side of the second intermediate conductive portion away from the first intermediate conductive portion, and the third intermediate conductive portion includes a second protrusion that protrudes from the sidewall of the second intermediate conductive portion.

[0031] Preferably, the materials of the first intermediate conductive portion and the third intermediate conductive portion include titanium, and the material of the second intermediate conductive portion includes aluminum;

[0032] Preferably, the conductive traces extend along the direction from the display area to the trace area.

[0033] In one embodiment, after forming a first intermediate conductive portion and a second intermediate conductive portion on one side of the substrate in the wiring area, the process includes:

[0034] A pixel defining material layer is formed on the side of the first intermediate conductive portion away from the substrate;

[0035] A mask layer is formed on the side of the pixel-defining material layer away from the substrate; in the wiring area, the mask layer has a second opening, and the orthographic projection of the first protrusion on the substrate is located within the orthographic projection of the second opening on the substrate.

[0036] Based on the mask layer, the pixel-defining material layer is subjected to a first patterning process to form a first opening in the pixel-defining material layer of the wiring area. The first opening is connected to a second opening, and the first opening exposes a first protrusion.

[0037] Based on the mask layer, the first intermediate conductive portion and the second intermediate conductive portion are subjected to a second patterning process to remove the first protrusion, the retained first intermediate conductive portion forms the first conductive portion, and the retained second intermediate conductive portion forms the second conductive portion.

[0038] Preferably, the second patterning process includes dry etching; after the substrate is provided and before forming conductive traces on one side of the substrate, it includes:

[0039] An insulating layer is formed on one side of the substrate; the insulating layer is located between the conductive trace and the substrate, and a first opening exposes a portion of the insulating layer; during the second patterning process, the etching rate of the insulating layer is less than the etching rate of the first intermediate conductive portion and / or the second intermediate conductive portion.

[0040] Preferably, the etching gas used in the second patterning process includes chlorine gas;

[0041] Preferably, the first opening also exposes the second protrusion; during the second patterning process of the first intermediate conductive portion and the second intermediate conductive portion, the method further includes: removing the second protrusion, and the remaining third intermediate conductive portion forming the third conductive portion.

[0042] In one embodiment, the display area includes a first pixel opening area, and a mask layer is formed on the side of the pixel defining material layer facing away from the substrate, including:

[0043] A photoresist material layer is formed on the side of the pixel-defining material layer away from the substrate, and a mask is disposed on the side of the photoresist material layer away from the substrate; the mask has a first light-transmitting hole and a second light-transmitting hole; the first light-transmitting hole is disposed opposite to the first pixel opening area, the second light-transmitting hole is disposed opposite to the second opening, and the light transmittance of the first light-transmitting hole and the second light-transmitting hole is different.

[0044] Based on the photomask, the photoresist material layer is exposed.

[0045] A third patterning process is performed on the photoresist material layer to form a second opening in the photoresist material layer of the wiring area, and the photoresist material layer of the first pixel opening area is thinned. The remaining photoresist material layer forms a mask layer, and the thickness of the mask layer in the first pixel opening area is less than the thickness of the mask layer in the rest of the area.

[0046] After performing a second patterning process on the first intermediate conductive portion and the second intermediate conductive portion, the process includes: performing an ashing process on the mask layer, removing at least a portion of the mask layer of the first pixel opening region to form a third opening, the third opening exposing the pixel defining material layer.

[0047] Based on the mask layer after ashing, the pixel-defining material layer is subjected to a fourth patterning process to remove the pixel-defining material layer exposed by the third opening and form the first pixel opening. The remaining pixel-defining material layer forms the pixel-defining layer.

[0048] Remove the mask layer.

[0049] In one embodiment, after forming a pixel defining material layer on the side of the first intermediate conductive portion away from the substrate, and before forming a mask layer on the side of the pixel defining material layer away from the substrate, the process includes:

[0050] An isolation material layer is formed on the side of the pixel-defining material layer away from the substrate, and at least a portion of the isolation material layer is located in the display area;

[0051] The isolation material layer is subjected to a fifth patterning process to form a first isolation opening in the isolation material layer of the display area, and the remaining isolation material layer forms an isolation structure; a photoresist material layer covers the isolation structure; the orthographic projection of the third opening on the substrate at least partially overlaps with the orthographic projection of the first isolation opening on the substrate;

[0052] Preferably, after removing the mask layer, the process includes: forming a first light-emitting device material layer on the side of the substrate facing the conductive traces, the first light-emitting device material layer being located in the display area and the trace area; in the display area, the first light-emitting device material layer is located within a first isolation opening and on the side of the isolation material layer facing away from the substrate;

[0053] The first light-emitting device material layer is subjected to a sixth patterning process, removing the first light-emitting device material layer located in the wiring area and at least a portion of the first light-emitting device material layer located on the side of the isolation material layer away from the substrate, retaining the first light-emitting device material layer located in the first isolation opening, and forming at least one of the light-emitting functional component, the second electrode, and the packaging portion of the first light-emitting unit.

[0054] In one embodiment, prior to the fifth patterning process of the insulating material layer, the process includes:

[0055] A seventh patterning process is performed on the isolation material layer to form a second isolation opening in the isolation material layer of the display area;

[0056] The pixel-defining material layer is subjected to an eighth patterning process to form a second pixel opening in the pixel-defining material layer of the display area;

[0057] Preferably, after performing the eighth patterning process on the pixel defining material layer, before forming a mask layer on the side of the pixel defining material layer away from the substrate, the method includes: forming a second light-emitting device material layer on the side of the substrate facing the conductive trace, the second light-emitting device material layer being located in the display area and the trace area; in the display area, the second light-emitting device material layer is located within the second isolation opening and on the side of the isolation material layer away from the substrate.

[0058] The second light-emitting device material layer is subjected to a ninth patterning process, which removes the second light-emitting device material layer located in the wiring area and at least a portion of the second light-emitting device material layer located on the side of the isolation material layer away from the substrate, retains the second light-emitting device material layer located in the second isolation opening, and forms at least one of the light-emitting functional component, the second electrode, and the packaging portion of the second light-emitting unit.

[0059] In one embodiment, the seventh patterning process of the isolation material layer further includes forming a third isolation opening in the isolation material layer of the display area;

[0060] Alternatively, before performing the seventh patterning process on the isolation material layer, the process may include performing a tenth patterning process on the isolation material layer to form a third isolation opening in the isolation material layer of the display area;

[0061] Preferably, a portion of the isolation material layer is located in the wiring area. During the process of forming the third isolation opening in the isolation material layer in the display area, the process also includes removing the isolation material layer located in the wiring area.

[0062] In one embodiment, the process of performing the eighth patterning process on the pixel-defining material layer further includes forming a third pixel opening in the pixel-defining material layer of the display area;

[0063] Alternatively, before performing the eighth patterning process on the pixel-defined material layer, the process includes performing an eleventh patterning process on the pixel-defined material layer to form a third pixel opening in the pixel-defined material layer of the display area.

[0064] In one embodiment, after forming a third pixel opening in the pixel defining material layer of the display area and before forming a mask layer on the side of the pixel defining material layer away from the substrate, the method includes: forming a third light-emitting device material layer on the side of the substrate facing the conductive trace, the third light-emitting device material layer being located in the display area and the trace area; in the display area, the third light-emitting device material layer being located within a third isolation opening and on the side of the isolation material layer away from the substrate.

[0065] The third light-emitting device material layer is subjected to a twelfth patterning process, removing the third light-emitting device material layer located in the wiring area and at least a portion of the third light-emitting device material layer located on the side of the isolation material layer away from the substrate, retaining the third light-emitting device material layer located in the third isolation opening, and forming at least one of the light-emitting functional component, the second electrode, and the packaging portion of the third light-emitting unit.

[0066] Preferably, after performing a sixth patterning process on the first light-emitting device material layer, the process includes: forming a second encapsulation layer on the side of the first light-emitting device material away from the substrate, wherein the material of the second encapsulation layer includes an organic material;

[0067] A first encapsulation layer is formed on the side of the second encapsulation layer away from the substrate, and the first encapsulation layer covers the conductive traces.

[0068] In one embodiment, after the substrate is provided and before forming conductive traces on one side of the substrate, the following steps are included:

[0069] An insulating layer is formed on one side of the substrate; the insulating layer is located between the conductive trace and the substrate, and a first opening exposes a portion of the insulating layer;

[0070] Preferably, the process of performing the fourth patterning process on the pixel-defining material layer further includes: thinning the insulating layer exposed by the first opening to form a groove on the side of the insulating layer away from the substrate; the groove is connected to the first opening. Attached Figure Description

[0071] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0072] Figure 1 This is a top view of the display panel provided in an embodiment of this application.

[0073] Figure 2 This is a partial cross-sectional view of the display panel of the wiring area provided in an embodiment of this application.

[0074] Figure 3 This is a cross-sectional view of the conductive traces provided in an embodiment of this application.

[0075] Figure 4 This is a cross-sectional view of the display panel of the display area provided in an embodiment of this application.

[0076] Figure 5 This is a partial cross-sectional view of the display area after a mask layer has been formed, as provided in the embodiments of this application.

[0077] Figure 6 This is a partial cross-sectional view of the wiring area after a mask layer has been formed, as provided in the embodiments of this application.

[0078] Figure 7 This is a cross-sectional view of the intermediate conductive trace provided in an embodiment of this application.

[0079] Figure 8 A partial cross-sectional view of the wiring area after the first opening is formed, as provided in the embodiments of this application.

[0080] Figure 9 This is a partial cross-sectional view of the wiring area provided in the embodiments of this application after removing the first and second protrusions.

[0081] Figure 10 This is a partial cross-sectional view of the display area mask layer after ashing treatment, as provided in an embodiment of this application.

[0082] Figure 11 This is a partial cross-sectional view of the trace area mask layer after ashing treatment, provided in an embodiment of this application.

[0083] Figure 12 This is a partial cross-sectional view of the display area after the first pixel opening is formed, as provided in the embodiments of this application.

[0084] Figure 13 This is a cross-sectional view of the display area provided in the embodiment of this application after the third light-emitting unit has been formed.

[0085] Figure 14 A cross-sectional view of the display area provided in the embodiments of this application after the formation of the second and third light-emitting units.

[0086] Figure 15 This is a schematic flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application.

[0087] Explanation of reference numerals in the attached figures:

[0088] 100. Display panel; 100a. Display area; 100b. Wiring area; 100b1. First sub-area; 100b2. Second sub-area; 100c. Bending area; 100d. Non-display area; 101. Substrate; 110. Conductive trace; 110a. Intermediate conductive trace; 111. First conductive portion; 111a. First intermediate conductive portion; 112. Second conductive portion; 112a. Second intermediate conductive portion; 113. Third conductive portion; 113a. Third intermediate conductive portion; 1141. First protrusion; 1142. Second protrusion; 1151. First surface; 11511. First sub-surface; 11512. Second sub-surface; 11513. Third sub-surface; 1152. Second surface; 1153. Third surface; 130. Light-emitting unit; 131. First electrode; 132. Second electrode; 133. Light-emitting functional component ; 134, Encapsulation section; 130a, First light-emitting unit; 130b, Second light-emitting unit; 130c, Third light-emitting unit; 140, Isolation structure; 140a, Isolation material layer; 141, First isolation section; 142, Second isolation section; 143, Blocking section; 144, Isolation opening; 1441, First isolation opening; 1442, Second isolation opening; 1443, Third isolation opening; 150, Mask layer; 152, Second opening; 153, Third opening; 160, Insulating layer; 161, Groove; 170, Pixel defining layer; 170a, Pixel defining material layer; 171, First opening; 172, Pixel opening; 1721, First pixel opening; 1721a, First pixel opening area; 1722, Second pixel opening; 1723, Third pixel opening; 180, Planarization layer; 190, Barrier. Detailed Implementation

[0089] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0090] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0091] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0092] Organic Light Emitting Diode (OLED) display technology is considered the most promising next-generation flat panel display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0093] In the process of developing this application, the inventors discovered the following problem in the related technology: A display panel has a display area and a wiring area. The display panel may include a substrate and power wiring disposed on the substrate. The power wiring is located in the wiring area and includes a first titanium layer, an aluminum layer, and a second titanium layer arranged sequentially in a direction away from the substrate. After the power wiring is fabricated, a planarization material layer can be formed on the side of the power wiring away from the substrate. Then, the planarization material layer is wet-etched to remove at least a portion of the planarization material layer located in the wiring area.

[0094] However, during the wet etching process of the planarization material layer, the aluminum layer of the power trace is etched laterally, causing the side of the aluminum layer to be recessed relative to the sides of the first and second titanium layers, resulting in a thinner pixel-defining layer formed on the sidewall of the power trace. The pixel-defining layer on the sidewall of the power trace is easily damaged in subsequent etching processes, leading to further etching of the aluminum layer to deepen the recess. This results in larger voids and gaps in the encapsulation layer formed on the sidewall of the power trace, allowing moisture to easily penetrate the encapsulation layer and corrode the power trace. This adversely affects the electrical reliability of the power trace and the display panel, causing problems such as black spots and bright lines on the display panel.

[0095] In view of at least one of the above problems, embodiments of this application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve the electrical reliability of the display panel.

[0096] The following will combine Figures 1-15 The display device provided in the embodiments of this application will be described.

[0097] This application provides a display device, which may include a display panel 100. The display device may be an electronic paper device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, smart bracelet, smartwatch, supercomputer, navigator, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, clock, calculator, television monitor, computer monitor, automotive display (e.g., odometer display), cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic billboard or sign, projector, and other mobile or fixed terminals.

[0098] For example, the display panel 100 can be an organic light-emitting diode (OLED) display panel, a micro organic light-emitting diode (Micro OLED) display panel, a light-emitting diode (LED) display panel, a quantum dot light-emitting diode (QLED) display panel, a mini light-emitting diode (MiniLED) display panel, a micro light-emitting diode (Micro LED) display panel, or a liquid crystal display (LCD) display panel, etc. This application uses an OLED display panel as an example for illustration.

[0099] The display panel 100 provided in the embodiments of this application will be described below.

[0100] See Figure 1 and Figure 2The display panel 100 may have a first direction A, a second direction B, and a third direction C, all of which are different. The first direction A and the second direction B can be any two different directions parallel to the display panel 100, and the third direction C can be any direction intersecting a plane parallel to the display panel 100. For example, the first direction A, the second direction B, and the third direction C can be mutually perpendicular. Exemplarily, the first direction A can be the width direction of the display panel 100, the second direction B can be the length direction of the display panel 100, and the third direction C can be the thickness direction of the display panel 100. The length, width, and thickness in the embodiments of this application are merely for descriptive convenience and do not imply any limitation on the dimensions. For example, the width can be greater than, equal to, or less than the length. The orientation of the display panel 100 can be consistent with the orientation of the film layers such as the substrate 101.

[0101] In some embodiments, see Figure 1 The display panel 100 has a display area 100a and a non-display area 100d. The display area 100a can be used to display images, and the non-display area 100d can be arranged adjacent to the display area 100a. The non-display area 100d can be located on at least one side of the display area 100a. For example, the non-display area 100d can surround the outer perimeter of the display area 100a, and the non-display area 100d can form a "black border" around the outer perimeter of the display area 100a.

[0102] For example, see Figure 1 The non-display area 100d may include a wiring area 100b, which may be located on one side of the display area 100a along the first direction A, and may be adjacent to the display area 100a.

[0103] For example, see Figure 1 The trace area 100b may include a first sub-area 100b1 and a second sub-area 100b2. The first sub-area 100b1 and the second sub-area 100b2 are spaced apart along the second direction B. Both the first sub-area 100b1 and the second sub-area 100b2 may be provided with conductive traces 110. Figure 3 ).

[0104] For example, see Figure 1 The non-display area 100d may include a bending area 100c, which is located on the side of the wiring area 100b away from the display area 100a.

[0105] In some embodiments, see Figure 3 The display panel 100 may include a substrate 101. The substrate 101 may provide support for the remaining film layers that are subsequently applied.

[0106] The conductive trace 110 provided in the embodiments of this application will be described below.

[0107] In some embodiments, see Figure 1 and Figure 2 The display panel 100 may include conductive traces 110, which are disposed on one side of the substrate 101 and located in a trace area 100b. For example, the conductive traces 110 may be located in a first sub-region 100b1 and a second sub-region 100b2. The conductive traces 110 extend along the direction from the display area 100a to the trace area 100b (i.e., the first direction A).

[0108] For example, conductive trace 110 is configured as a power line. The power line includes a first power line or a second power line. Alternatively, there may be multiple power lines, which may include a first power line and a second power line. The first power line transmits a different voltage than the second power line. One of the first power line and the second power line transmits a higher voltage, and the other transmits a lower voltage.

[0109] For example, the first power line is located in the first sub-region 100b1, and the second power line is located in the second sub-region 100b2.

[0110] For example, see Figure 2 and Figure 3 The conductive trace 110 includes a first conductive portion 111 and a second conductive portion 112. The first conductive portion 111 is located on the side of the second conductive portion 112 facing away from the substrate 101. The orthographic projection of the first conductive portion 111 on the substrate 101 lies within the orthographic projection of the second conductive portion 112 on the substrate 101. The first conductive portion 111 and the second conductive portion 112 are made of different materials. This avoids the first conductive portion 111 protruding from the side of the second conductive portion 112, thereby improving the thickness and continuity of the film layer subsequently formed on the side of the first conductive portion 111 and the second conductive portion 112. This makes it difficult for moisture to penetrate the first conductive portion 111 and the second conductive portion 112 through the film layer, thereby improving the electrical reliability of the conductive trace 110 and mitigating phenomena such as black spots and bright lines.

[0111] For example, see Figure 2 and Figure 3The conductive trace 110 includes a third conductive portion 113, which is located on the side of the second conductive portion 112 facing the substrate 101. The orthographic projection of the second conductive portion 112 on the substrate 101 lies within the orthographic projection of the third conductive portion 113 on the substrate 101. The second conductive portion 112 and the third conductive portion 113 are made of different materials. This avoids the second conductive portion 112 protruding from the side of the third conductive portion 113, thereby improving the thickness and continuity of the film layer subsequently formed on the sides of the second conductive portion 112 and the third conductive portion 113. This makes it difficult for moisture to penetrate the second conductive portion 112 and the third conductive portion 113 through the film layer, thereby improving the electrical reliability of the conductive trace 110 and mitigating phenomena such as black spots and bright lines.

[0112] The conductive structure provided in this application embodiment (e.g., at least one of the first conductive part 111, the second conductive part 112, the third conductive part 113, the first isolation part 141, the second isolation part 142, and the blocking part 143) may be made of metals such as titanium, silver, copper, aluminum, and molybdenum, or alloys, or conductive oxides such as any one or more of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), zinc gallium oxide, titanium tantalum oxide, tin oxide, cadmium oxide, and indium oxide.

[0113] For example, at least one of the first conductive portion 111 and the third conductive portion 113 may be made of titanium.

[0114] For example, the material of the second conductive part 112 includes aluminum.

[0115] In some embodiments, see Figure 2 and Figure 3 The conductive trace 110 includes two first surfaces 1151 disposed opposite each other in a direction perpendicular to the display area 100a to the trace area 100b (i.e., the second direction B). The first surfaces 1151 may be formed by at least a portion of the side surfaces of the conductive trace 110.

[0116] For example, see Figure 2 and Figure 3The first surface 1151 includes a first sub-surface 11511 and a second sub-surface 11512 connected to the first sub-surface 11511. The first sub-surface 11511 is disposed on the first conductive portion 111, and the second sub-surface 11512 is disposed on the second conductive portion 112. The connection between the first sub-surface 11511 and the second sub-surface 11512 is smoothly transitioned, which is beneficial to improving the thickness and continuity of the film layer subsequently formed on the first sub-surface 11511 and the second sub-surface 11512, thereby improving the electrical reliability of the conductive trace 110 and alleviating phenomena such as black spots and bright lines.

[0117] For example, see Figure 2 and Figure 3 The first surface 1151 includes a third sub-surface 11513 connected to the second sub-surface 11512. The third sub-surface 11513 is disposed on the third conductive portion 113. The connection between the second sub-surface 11512 and the third sub-surface 11513 is smoothly transitioned, which is beneficial to improve the thickness and continuity of the film layer subsequently formed on the second sub-surface 11512 and the third sub-surface 11513. This can improve the electrical reliability of the conductive trace 110 and alleviate phenomena such as black spots and bright lines.

[0118] In embodiments where there is a smooth transition between the first sub-surface 11511 and the second sub-surface 11512, and a smooth transition between the second sub-surface 11512 and the third sub-surface 11513, the first surface 1151 can be a smooth surface, which means a surface without obvious undulations. In this case, the first surface 1151 can be without depressions. The conductive trace 110 includes a second surface 1152 and a third surface 1153 disposed opposite to each other along the thickness direction (i.e., the third direction C) of the substrate 101. The second surface 1152 is located on the side of the third surface 1153 facing the substrate 101, and the second surface 1152 and the third surface 1153 are connected through the first surface 1151. The orthographic projection of the third surface 1153 on the substrate 101 lies within the orthographic projection of the second surface 1152 on the substrate 101, thereby improving the thickness and continuity of the film layer subsequently formed on the first surface 1151, improving the electrical reliability of the conductive trace 110, and mitigating phenomena such as black spots and bright lines.

[0119] The third surface 1153 is the surface of the first conductive part 111 that is away from the substrate 101, and the second surface 1152 is the surface of the third conductive part 113 that faces the substrate 101.

[0120] In some embodiments, see Figure 2 and Figure 3The distance between the two first surfaces 1151 gradually decreases along the direction from the substrate 101 to the conductive trace 110, which can reduce the difficulty of subsequent film formation on the first surface 1151 and also help improve the uniformity, thickness and continuity of the subsequent film formed on the first surface 1151, thereby improving the electrical reliability of the conductive trace 110 and alleviating phenomena such as black spots and bright lines.

[0121] For example, see Figure 2 and Figure 3 The first surface 1151 is an inclined surface, which includes a first end close to the substrate 101 and a second end away from the substrate 101. The first end is inclined relative to the second end in a direction away from the center of the conductive trace 110. Thus, the first surface 1151 is an inclined surface, and the structure of the first surface 1151 is relatively simple, which can reduce the difficulty of fabricating the first surface 1151.

[0122] Alternatively, the first surface 1151 can be curved, protruding outwards from the center of the conductive trace 110. This curved surface increases the area of ​​the first surface 1151, which in turn improves the stability of the connection between the film layer subsequently formed on the first surface 1151 and the first surface 1151.

[0123] For example, the included angle β between the first surface 1151 and the second surface 1152 is less than or equal to 60°, which helps to improve the uniformity, thickness and continuity of the film layer subsequently formed on the first surface 1151, thereby improving the electrical reliability of the conductive trace 110 and mitigating phenomena such as black spots and bright lines. For example, the included angle β can be any value of 30°, 40°, 45°, 50°, 60° or less than 60°.

[0124] When the first surface 1151 is an arc surface, the first surface 1151 has a virtual tangent surface, which is tangent to the first surface 1151. The angle between the first surface 1151 and the second surface 1152 can be the angle between the virtual tangent surface and the second surface 1152.

[0125] In other embodiments, the distance between the two first surfaces 1151 is the same everywhere along the direction from the substrate 101 to the conductive trace 110.

[0126] The pixel limiting layer 170 provided in the embodiments of this application will be described below.

[0127] In some embodiments, see Figure 2 and Figure 4 The display panel 100 also includes a pixel limiting layer 170, which is located in the display area 100a and the wiring area 100b.

[0128] For example, see Figure 2 In the trace area 100b, the pixel defining layer 170 is located on the side of the conductive trace 110 away from the substrate 101, and the pixel defining layer 170 has a first opening 171 that exposes at least one first surface 1151.

[0129] For example, see Figure 4 In the display area 100a, the display panel 100 includes a plurality of light-emitting units 130, and a pixel limiting layer 170 surrounds and forms a plurality of pixel openings 172. The plurality of pixel openings 172 and the plurality of light-emitting units 130 are correspondingly disposed, and at least a portion of the light-emitting units 130 is disposed in the corresponding pixel openings 172. In this way, by providing the pixel limiting layer 170, it is convenient to set the light-emitting units 130 on the substrate 101.

[0130] For example, the conductive trace 110 may also be located in the display area 100a. In the display area 100a, the first electrode 131 of the light-emitting unit 130 is disposed on the side of the conductive trace 110 away from the substrate 101.

[0131] In this embodiment, the correspondence between A and B can refer to one A corresponding to at least one B, or one B corresponding to at least one A. This embodiment uses the example of one A corresponding to one B. For instance, the correspondence between the light-emitting unit 130 and the pixel opening 172 can refer to one light-emitting unit 130 corresponding to at least one pixel opening 172, or one pixel opening 172 corresponding to at least one light-emitting unit 130.

[0132] For example, the plurality of light-emitting units 130 include a first light-emitting unit 130a, a second light-emitting unit 130b and a third light-emitting unit 130c with different light-emitting colors. The pixel opening 172 of the first light-emitting unit 130a is a first pixel opening 1721, the pixel opening 172 of the second light-emitting unit 130b is a second pixel opening 1722, and the pixel opening 172 of the third light-emitting unit 130c is a third pixel opening 1723.

[0133] For example, participate Figure 12 The display area 100a includes a first pixel opening area 1721a, and the first pixel opening 1721 is located in the first pixel opening area 1721a.

[0134] The following describes the insulating layer 160, the first encapsulation layer, and the second encapsulation layer provided in the embodiments of this application.

[0135] In some embodiments, see Figure 2The display panel 100 also includes an insulating layer 160, which may be located in the wiring area 100b, on the side of the conductive trace 110 facing the substrate 101. Alternatively, the insulating layer 160 may also be located in the display area 100a. In the wiring area 100b, the insulating layer 160 has a groove 161 on the side facing away from the substrate 101. The opening of the groove 161 is located on the surface of the insulating layer 160 facing away from the substrate 101, and the groove 161 communicates with the first opening 171.

[0136] In some embodiments, the display panel 100 further includes a first encapsulation layer located in the display area 100a and the wiring area 100b. In the display area 100a, the first encapsulation layer is located on the side of the light-emitting unit 130 facing away from the substrate 101. In the wiring area 100b, the first encapsulation layer is located on the side of the pixel defining layer 170 facing away from the substrate 101. The first encapsulation layer covers the first surface 1151 and extends into the groove 161. Thus, by providing the groove 161, the connection stability between the first encapsulation layer and the insulating layer 160 is improved, thereby improving the encapsulation effect of the first encapsulation layer.

[0137] For example, the material of the first encapsulation layer includes inorganic materials. The first encapsulation layer formed by inorganic materials has a better encapsulation effect and is also conducive to reducing the manufacturing cost of the first encapsulation layer.

[0138] For example, the opening cross-sectional area of ​​the groove 161 gradually increases along the direction from the substrate 101 to the conductive trace 110, which helps to improve the continuity, thickness and uniformity of the first encapsulation layer on the groove sidewall of the groove 161, and helps to improve the encapsulation effect of the first encapsulation layer.

[0139] Alternatively, the cross-sectional area of ​​the opening of the groove 161 is the same everywhere along the direction from the substrate 101 to the conductive trace 110.

[0140] For example, the distance between the orthographic projection of the groove 161 on the substrate 101 and the orthographic projection of the conductive trace 110 on the substrate 101 is greater than or equal to 0, thereby avoiding the groove 161 extending between the insulating layer 160 and the conductive trace 110 and causing adverse effects on the continuity and thickness of the first encapsulation layer on the groove sidewall of the groove 161.

[0141] In some embodiments, the display panel 100 further includes a second encapsulation layer located between the light-emitting unit 130 and the first encapsulation layer.

[0142] For example, the material of the second encapsulation layer includes an organic material that can alleviate stress on the display panel.

[0143] In some embodiments, participants Figure 1The display panel 100 may further include a barrier 190, which is disposed on the side of the substrate 101 facing the conductive trace 110. The barrier 190 is used to prevent the second encapsulation layer from spreading from the display area 100a to the non-display area 100d, effectively reducing the difference in thickness between the edge region and the center region of the second encapsulation layer in the display area 100a, thereby improving the display effect. The trace area 100b is located on the side of the barrier 190 away from the display area 100a. It should be noted that the barrier 190 and the display area 100a are spaced apart, meaning that a non-display area can exist between the barrier 190 and the non-display area 100a.

[0144] The isolation structure 140 provided in the embodiments of this application will be described below.

[0145] In some embodiments, see Figure 4 In the display area 100a, the display panel 100 further includes an isolation structure 140. The isolation structure 140 can be disposed on one side of the substrate 101. The isolation structure 140 is located on the side of the pixel limiting layer 170 opposite to the substrate 101. The isolation structure 140 encloses and forms a plurality of isolation openings 144, which can be spaced apart. The plurality of isolation openings 144 are correspondingly disposed with a plurality of pixel openings 172, and the isolation openings 144 and the corresponding pixel openings 172 are interconnected. The light-emitting unit 130 can extend into the corresponding isolation opening 144.

[0146] For example, the orthographic projection of the pixel opening 172 on the substrate 101 may be located within the orthographic projection of the isolation opening 144 on the substrate 101.

[0147] For example, the isolation opening 144 of the first light-emitting unit 130a is the first isolation opening 1441, the isolation opening 144 of the second light-emitting unit 130b is the second isolation opening 1442, and the isolation opening 144 of the third light-emitting unit 130c is the third isolation opening 1443.

[0148] For example, the isolation structure 140 can refer to an undercut structure that is larger at the top and smaller at the bottom, capable of separating adjacent light-emitting functional elements 133. The isolation structure 140 can be a structure formed by a single film layer or a structure formed by stacking multiple film layers.

[0149] For example, the cross-sectional shape of the isolation structure 140 can be an inverted trapezoid with a larger top and a smaller bottom, a "T" shape, or an "I" shape, etc.

[0150] In some embodiments, see Figure 4The isolation structure 140 may include a first isolation portion 141 and a blocking portion 143. The first isolation portion 141 is located on the side of the blocking portion 143 facing the substrate 101. The orthographic projection of the first isolation portion 141 on the substrate 101 is located within the orthographic projection of the blocking portion 143 on the substrate 101, thereby making the isolation structure 140 form an undercut structure that is "larger at the top and smaller at the bottom", that is, the isolation structure 140 has an "eaves". In this way, during the formation of the light-emitting functional element 133, the isolation structure 140 can separate two adjacent light-emitting functional elements 133.

[0151] In some embodiments, see Figure 4 The isolation structure 140 may include a second isolation portion 142, which may be located on the side of the first isolation portion 141 opposite to the blocking portion 143. The orthographic projection of the first isolation portion 141 on the substrate 101 may be located within the orthographic projection of the second isolation portion 142 on the substrate 101. Thus, in embodiments where the material of the isolation structure 140 is a conductive material, by providing the stacked first isolation portion 141, second isolation portion 142, and blocking portion 143, the resistance of the isolation structure 140 can be reduced, thereby reducing the power consumption of the display panel 100.

[0152] For example, at least one of the first isolation portion 141, the second isolation portion 142, and the blocking portion 143 may be made of a conductive material, as described in the above embodiments, and will not be repeated here. In other examples, at least one of the first isolation portion 141, the second isolation portion 142, and the blocking portion 143 may be made of an insulating material, and this application embodiment does not limit this.

[0153] For example, the material of the blocking portion 143 may include at least one of titanium and molybdenum.

[0154] For example, the material of the first isolation section 141 may include at least one of aluminum, copper, and silver.

[0155] For example, the material of the second isolation section 142 may include at least one of titanium and molybdenum.

[0156] In embodiments where at least one of the first isolation portion 141, the second isolation portion 142, and the blocking portion 143 is made of a conductive material, the second electrode 132 can be electrically connected to the isolation structure 140. This allows the second electrodes 132 located within each isolation opening 144 to be connected as a whole via the isolation structure 140, facilitating the electrical connection of the second electrode 132 to the second power line via the isolation structure 140 for applying a power supply voltage to the second electrode 132, thereby optimizing the wiring layout of the display panel 100.

[0157] In embodiments where the material of the first isolation portion 141 is a conductive material, the second electrode 132 can be electrically connected to the first isolation portion 141.

[0158] In embodiments where the material of the second isolation portion 142 is a conductive material, the second electrode 132 can be electrically connected to the second isolation portion 142.

[0159] In embodiments where both the first isolation portion 141 and the second isolation portion 142 are made of conductive materials, the second electrode 132 can be electrically connected to at least one of the first isolation portion 141 and the second isolation portion 142. For example, the second electrode 132 can be connected to both the first isolation portion 141 and the second isolation portion 142, thereby improving the connection stability between the second electrode 132 and the isolation structure 140.

[0160] The composition and preparation of the isolation structure 140 mentioned in the embodiments of this application are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A, and are provided for reference.

[0161] The following describes the light-emitting unit 130 provided in the embodiments of this application.

[0162] In some embodiments, see Figure 4 The display panel 100 includes light-emitting units 130, which are located on the side of the substrate 101 facing the isolation structure 140 and in the display area 100a. Multiple light-emitting units 130 can be arranged at intervals, for example, in an array. The light-emitting units 130 and the isolation openings 144 can be correspondingly arranged, with at least a portion of the light-emitting units 130 located within the corresponding isolation openings 144.

[0163] For example, the light-emitting unit 130 includes a first electrode 131, a light-emitting functional element 133, a second electrode 132, and an encapsulation portion 134 arranged sequentially in a direction away from the substrate 101.

[0164] For example, the pixel defining layer 170 is located on the side of the first electrode 131 facing away from the substrate 101, and the pixel opening 172 exposes the corresponding first electrode 131. That is, part of the first electrode 131 can be covered by the pixel defining layer 170, and another part of the first electrode 131 can be exposed by the corresponding pixel opening 172.

[0165] For example, a portion of the light-emitting functional element 133 is disposed in the corresponding pixel opening 172 and extends from the corresponding pixel opening 172 to the corresponding isolation opening 144.

[0166] For example, the second electrode 132 and the package portion 134 may be located at least partially in the corresponding isolation opening 144.

[0167] For example, the encapsulation part 134 is disposed on the side of the corresponding second electrode 132 away from the substrate 101, the encapsulation part 134 is also located on the sidewall of the corresponding isolation opening 144, and the encapsulation part 134 extends to the side of the isolation structure 140 away from the substrate 101, so as to achieve a better encapsulation effect on the light-emitting unit 130.

[0168] For example, one of the first electrode 131 and the second electrode 132 can be an anode, and the other of the first electrode 131 and the second electrode 132 can be a cathode. This application embodiment is illustrated using the example of the first electrode 131 being the anode and the second electrode 132 being the cathode.

[0169] For example, the first electrode 131 can be electrically connected to a pixel driving circuit, which can be electrically connected to a first power line. The second electrode 132 can be electrically connected to a second power line. For instance, the first power line is used to transmit high voltage, and the second power line is used to transmit low voltage.

[0170] For example, the light-emitting functional component 133 may include an emission layer (EML). Additionally, the light-emitting functional component 133 may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL).

[0171] For example, the plurality of light-emitting units 130 includes, but is not limited to, a first light-emitting unit 130a, a second light-emitting unit 130b, and a third light-emitting unit 130c that emit different colors. For instance, the first light-emitting unit 130a, the second light-emitting unit 130b, and the third light-emitting unit 130c may be a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit, respectively. In other examples, the plurality of light-emitting units 130 may also include a white light-emitting unit.

[0172] The planarization layer 180 provided in the embodiments of this application will be described below.

[0173] In some embodiments, the display panel 100 includes a planarization layer 180 formed after the conductive traces 110 and before the first electrode 131. In the display area 100a, the planarization layer 180 may be located between the first electrode 131 and the insulating layer 160. The planarization layer 180 may extend into the non-display area 100d. In the non-display area 100d, the planarization layer 180 exposes at least a portion of the conductive traces 110.

[0174] In some embodiments, a polarizer may also be disposed on the side of the first encapsulation layer opposite to the substrate 101. A touch layer may also be disposed between the polarizer and the first encapsulation layer, and a connecting layer may be disposed between the touch layer and the polarizer. For example, the connecting layer may be formed of optically transparent adhesive.

[0175] For example, a polarizer may contain potassium ions (K ions). + ) or iodide ions (I - In the display panel 100, if a depression forms on the side of the conductive trace 110, resulting in voids and gaps in the touch insulating layer of the first encapsulation layer and touch layer located on the side of the conductive trace 110, then during reliability testing or application, potassium ions (K ions) in the polarizer... + ) or iodide ions (I - It can easily erode the touch insulation layer in the first encapsulation layer and touch layer, thereby further eroding the conductive trace 110 and adversely affecting the electrical reliability of the conductive trace 110.

[0176] The following describes the manufacturing method of the display panel 100 provided in the embodiments of this application.

[0177] The method for preparing the display panel 100 provided in this application embodiment can be used to prepare the display panel 100 in the above embodiments. See also... Figure 1 The display panel 100 includes a display area 100a and a wiring area 100b. See also... Figure 15 The preparation method may include the following steps:

[0178] S100: Provides substrate 101.

[0179] First, substrate 101 is provided ( Figure 4 The substrate 101 can provide support for the remaining film layers that are subsequently applied.

[0180] For example, after providing the substrate 101, it may include: forming an insulating layer 160 on one side of the substrate 101. Figure 6 ).

[0181] S200: A conductive trace is formed on one side of the substrate; the conductive trace is located in the trace area; wherein the conductive trace includes a first conductive part and a second conductive part, the first conductive part is located on the side of the second conductive part away from the substrate, the orthographic projection of the first conductive part on the substrate is located within the orthographic projection of the second conductive part on the substrate, and the materials of the first conductive part and the second conductive part are different.

[0182] In some embodiments, see Figure 2 After forming the insulating layer 160, the process may include forming a conductive trace 110 on the side of the insulating layer 160 facing away from the substrate 101, i.e., the insulating layer 160 is located between the conductive trace 110 and the substrate 101. The conductive trace 110 is located in the trace area 100b and extends along the direction from the display area 100a to the trace area 100b; wherein the conductive trace 110 includes a first conductive portion 111 and a second conductive portion 112, the first conductive portion 111 is located on the side of the second conductive portion 112 facing away from the substrate 101, the orthographic projection of the first conductive portion 111 on the substrate 101 is located within the orthographic projection of the second conductive portion 112 on the substrate 101, and the first conductive portion 111 and the second conductive portion 112 are made of different materials. This design prevents the first conductive portion 111 from protruding from the side of the second conductive portion 112, thereby improving the thickness and continuity of the film layer subsequently formed on the sides of the first conductive portion 111 and the second conductive portion 112. This makes it difficult for moisture to penetrate the first conductive portion 111 and the second conductive portion 112 through the film layer, thus improving the electrical reliability of the conductive trace 110 and mitigating phenomena such as black spots and bright lines. The aforementioned insulating layer 160 may include non-metallic inorganic materials, such as silicon nitride and silicon oxide.

[0183] In some embodiments, see Figure 6 and Figure 7 A conductive trace 110 is formed on one side of the substrate 101, which may include forming a first intermediate conductive portion 111a and a second intermediate conductive portion 112a on one side of the substrate 101 in the trace area 100b. The first intermediate conductive portion 111a is located on the side of the second intermediate conductive portion 112a opposite to the substrate 101, and the first intermediate conductive portion 111a includes a first protrusion 1141 that protrudes from the side of the second intermediate conductive portion 112a. The first intermediate conductive portion 111a and the second intermediate conductive portion 112a together form the intermediate conductive trace 110a.

[0184] For example, see Figure 6 and Figure 7During the process of forming a first intermediate conductive portion 111a and a second intermediate conductive portion 112a on one side of the substrate 101 in the trace area 100b, the method further includes forming a third intermediate conductive portion 113a on one side of the substrate 101. The third intermediate conductive portion 113a is located on the side of the second intermediate conductive portion 112a opposite to the first intermediate conductive portion 111a, and the third intermediate conductive portion 113a includes a second protrusion 1142 that protrudes from the side of the second intermediate conductive portion 112a. The first intermediate conductive portion 111a, the second intermediate conductive portion 112a, and the third intermediate conductive portion 113a together form the intermediate conductive trace 110a. Because the first protrusion 1141 and the second protrusion 1142 protrude from the side of the second intermediate conductive part 112a, the sidewall of the intermediate conductive trace 110a is recessed. The intermediate conductive trace 110a is exposed to subsequent etching processes, which will further increase the degree of the recess. As a result, the first encapsulation layer and other film layers subsequently formed on the sidewall of the conductive trace 110 are prone to large voids and gaps. Moisture can easily invade the first encapsulation layer and corrode the trace, which will have an adverse effect on the electrical reliability of the conductive trace 100 and the display panel 100, resulting in problems such as black spots and bright lines.

[0185] For example, the material of the first intermediate conductive portion 111a is the same as the material of the first conductive portion 111, the material of the second intermediate conductive portion 112a is the same as the material of the second conductive portion 112, and the material of the third intermediate conductive portion 113a is the same as the material of the third conductive portion 113. For example, the materials of the first intermediate conductive portion 111a and the third intermediate conductive portion 113a include titanium, and the material of the second intermediate conductive portion 112a includes aluminum.

[0186] For example, after forming a first intermediate conductive portion 111a and a second intermediate conductive portion 112a on one side of the substrate 101 in the wiring area 100b, the process may include: forming a planarization material layer on the side of the first intermediate conductive portion 111a facing away from the substrate 101; patterning the planarization material layer to remove at least a portion of the planarization material layer located in the wiring area 100b and exposing at least a portion of the first intermediate conductive portion 111a and the second intermediate conductive portion 112a; and retaining the planarization material layer as a planarization layer 180. Figure 5 During the patterning process of the planarization material layer, the second intermediate conductive portion 112a is etched laterally in the trace area 100b, which causes the second intermediate conductive portion 112a to be recessed relative to the first intermediate conductive portion 111a and the third intermediate conductive portion 113a. This results in the first protrusion 1141 and the second protrusion 1142 protruding from the side of the second intermediate conductive portion 112a. In other words, the patterning process of the planarization material layer can be one of the reasons for the sidewall recess of the intermediate conductive trace 110a.

[0187] For example, the patterning process provided in the embodiments of this application can be completed by dry etching and / or wet etching.

[0188] For example, see Figure 5 After the planarization layer 180 is formed, a plurality of first electrodes 131 may be formed on the side of the planarization layer 180 away from the substrate 101.

[0189] In some embodiments, see Figure 6 After forming a first intermediate conductive portion 111a and a second intermediate conductive portion 112a on one side of the substrate 101 in the wiring area 100b, the process may include: forming a pixel defining material layer 170a on the side of the first intermediate conductive portion 111a facing away from the substrate 101, the pixel defining material layer 170a being located in both the display area 100a and the wiring area 100b. In the display area 100a, the pixel defining material layer 170a is located on the side of the first electrode 131 facing away from the substrate 101. Then, a mask layer 150 is formed on the side of the pixel defining material layer 170a facing away from the substrate 101; for example, the material of the mask layer 150 may be photoresist. In the wiring area 100b, the mask layer 150 has a second opening 152, and the orthographic projection of the first protrusion 1141 on the substrate 101 lies within the orthographic projection of the second opening 152 on the substrate 101, so as to facilitate subsequent removal of the first protrusion 1141 based on the mask layer 150. Then, see... Figure 8 Based on the mask layer 150, a first patterning process is performed on the pixel defining material layer 170a to form a first opening 171 in the pixel defining material layer 170a of the wiring area 100b. The first opening 171 communicates with a second opening 152 and exposes a first protrusion 1141 and a second protrusion 1142 to facilitate subsequent removal of the first protrusion 1141 and the second protrusion 1142. Additionally, the first opening 171 may also expose a portion of the insulating layer 160. Then, see... Figure 9 Continuing based on the mask layer 150, the first intermediate conductive portion 111a and the second intermediate conductive portion 112a are subjected to a second patterning process to remove the first protrusion 1141, thereby eliminating the depression on the side of the intermediate conductive trace 110a. The retained first intermediate conductive portion 111a forms the first conductive portion 111, and the retained second intermediate conductive portion 112a forms the second conductive portion 112. This avoids the first conductive portion 111 protruding from the side of the second conductive portion 112, which is beneficial to improving the thickness and continuity of the film layer subsequently formed on the side of the first conductive portion 111 and the second conductive portion 112. This makes it difficult for water vapor to invade the first conductive portion 111 and the second conductive portion 112 through the film layer, thereby improving the electrical reliability of the conductive trace 110 and alleviating phenomena such as black spots and bright lines.

[0190] For example, the pixel-defined material layer 170a can be etched using etching gases SF6 and O2.

[0191] For example, the second patterning process includes dry etching, and the intermediate conductive trace 110a can be etched using etching gas Cl2. The etching gas used in the second patterning process includes chlorine gas.

[0192] For example, during the second patterning process of the first intermediate conductive portion 111a and the second intermediate conductive portion 112a, the process further includes: removing the second protrusion 1142, and forming the third conductive portion 113a with the remaining third intermediate conductive portion 113a. This facilitates a smooth transition between the second sub-surface 11512 and the third sub-surface 11513, which can improve the electrical reliability of the conductive trace 110 and alleviate phenomena such as black spots and bright lines. The principle has been explained and will not be repeated here.

[0193] For example, during the second patterning process, the etching rate of the insulating layer 160 is less than the etching rate of the first intermediate conductive portion 111a and / or the second intermediate conductive portion 112a, so as to reduce the damage of the second patterning process to the portion of the insulating layer 160 exposed by the first opening 171.

[0194] In some embodiments, the display area 100a includes a first pixel aperture area 1721a ( Figure 10 Forming a mask layer 150 on the side of the pixel-defining material layer 170a facing away from the substrate 101 may include: forming a photoresist material layer on the side of the pixel-defining material layer 170a facing away from the substrate 101, and disposing a mask on the side of the photoresist material layer facing away from the substrate 101. The mask has a first light-transmitting hole and a second light-transmitting hole, the first light-transmitting hole being disposed opposite to the first pixel opening region 1721a. The second light-transmitting hole is disposed opposite to the second opening 152, and the first light-transmitting hole and the second light-transmitting hole have different transmittances. Then, based on the mask, the photoresist material layer is exposed. Then, a third patterning process (e.g., the third patterning process may include development) is performed on the photoresist material layer to form a second opening 152 in the photoresist material layer of the wiring area 100b, and the photoresist material layer of the first pixel opening area 1721a is thinned, with the remaining photoresist material layer forming a mask layer 150, the thickness of the mask layer 150 of the first pixel opening area 1721a being less than the thickness of the mask layer 150 of the remaining portion.

[0195] For example, the photoresist material layer is a positive photoresist, and the transmittance of the first light-transmitting hole is less than that of the second light-transmitting hole. Alternatively, the photoresist material layer is a negative photoresist, and the transmittance of the first light-transmitting hole is greater than that of the second light-transmitting hole.

[0196] Taking a positive photoresist layer as an example, where the transmittance of the first aperture is less than that of the second aperture, the second aperture has a higher transmittance, resulting in a higher degree of exposure of the photoresist material corresponding to it. This leads to a faster etching rate for the photoresist material layer corresponding to the second aperture. Conversely, the first aperture has a lower transmittance, resulting in a lower degree of exposure of the photoresist material corresponding to it. This leads to a slower etching rate for the photoresist material layer corresponding to the first aperture. Therefore, when forming the second opening 152, a portion of the photoresist material layer in the first pixel opening region 1721a can be removed, while another portion of the photoresist material layer in the first pixel opening region 1721a can be retained. This ensures that the thickness of the mask layer 150 in the first pixel opening region 1721a is less than the thickness of the remaining portion of the mask layer 150. Consequently, the thinning of the photoresist material layer in the first pixel opening region 1721a and the formation of the second opening 152 are completed simultaneously, simplifying the fabrication process and reducing fabrication costs. In addition, during the first patterning process, the mask layer 150 protects the pixel defining material layer 170a, the first electrode 131 and other film layers of the display area 100a, and can prevent damage to the pixel defining material layer 170a and the first electrode 131.

[0197] For example, see Figure 10 and Figure 11 After performing a second patterning process on the first intermediate conductive portion 111a and the second intermediate conductive portion 112a, the process includes: performing an ashing process on the mask layer 150, which can thin the mask layer 150 as a whole. Since the thickness of the mask layer 150 in the first pixel opening region 1721a is less than the thickness of the remaining portions of the mask layer 150, the ashing time can be controlled to remove at least a portion of the mask layer 150 in the first pixel opening region 1721a and form a third opening 153. The third opening 153 exposes the pixel defining material layer 170a, while simultaneously thinning the mask layer 150 outside the first pixel opening region 1721a. Thus, selective etching of the mask layer 150 to form the third opening 153 in the mask layer 150 can be achieved without reformulating other masks, simplifying the fabrication process of the third opening 153 and reducing fabrication costs.

[0198] For example, see Figure 12 After the mask layer 150 is altended, the process may include: based on the altended mask layer 150, performing a fourth patterning process on the pixel defining material layer 170a to remove the pixel defining material layer 170a exposed by the third opening 153 and form a first pixel opening 1721. The remaining pixel defining material layer 170a forms the pixel defining layer 170, i.e., the first pixel opening 1721. Then, the mask layer 150 is removed.

[0199] For example, see Figure 2 and Figure 12 During the fourth patterning process of the pixel defining material layer 170a, the process may further include: thinning the insulating layer 160 exposed by the first opening 171 to form a groove 161 on the side of the insulating layer 160 facing away from the substrate 101; the groove 161 is correspondingly connected to the first opening 171. Since the third opening 153 exposes the pixel defining material layer 170a of the first pixel opening region 1721a, and the first opening 171 exposes the insulating layer 160, during the fourth patterning process, the etching reagent can contact the insulating layer 160, thereby facilitating the etching of the insulating layer 160.

[0200] In some embodiments, see Figure 5 and Figure 6 After forming the pixel defining material layer 170a on the side of the first intermediate conductive portion 111a facing away from the substrate 101, and before forming the mask layer 150 on the side of the pixel defining material layer 170a facing away from the substrate 101, the process includes:

[0201] An isolation material layer 140a is formed on the side of the pixel-defining material layer 170a facing away from the substrate 101. Figure 13 At least a portion of the isolation material layer 140a is located in the display area 100a. Then, the isolation material layer 140a undergoes a fifth patterning process to form a first isolation opening 1441 in the isolation material layer 140a of the display area 100a. The remaining isolation material layer 140a forms a partition structure 140, and the first isolation opening 1441 can communicate with the subsequently formed first pixel opening 1721. A photoresist material layer covers the isolation structure 140, and the orthographic projection of the third opening 153 on the substrate 101 at least partially coincides with the orthographic projection of the first isolation opening 1441 on the substrate.

[0202] For example, after removing the mask layer 150, the process may include: forming a first light-emitting device material layer on the side of the substrate 101 facing the conductive trace 110, the first light-emitting device material layer being located in the display area 100a and the trace area 100b; in the display area 100a, the first light-emitting device material layer is located within the first isolation opening 1441 and on the side of the isolation material layer 140a facing away from the substrate 101. Then, a sixth patterning process is performed on the first light-emitting device material layer, removing the first light-emitting device material layer located in the trace area 100b and at least a portion of the first light-emitting device material layer located on the side of the isolation material layer 140a facing away from the substrate 101, retaining the first light-emitting device material layer located in the first isolation opening 1441, the retained first light-emitting device material layer being able to form at least one of the light-emitting functional element 133, the second electrode 132, and the encapsulation portion 134 of the first light-emitting unit 130a.

[0203] In some embodiments, see Figure 14Before performing a fifth patterning process on the isolation material layer 140a, the process may include: performing a seventh patterning process on the isolation material layer 140a to form a second isolation opening 1442 in the isolation material layer 140a of the display area 100a. Then, performing an eighth patterning process on the pixel defining material layer 170a to form a second pixel opening 1722 in the pixel defining material layer 170a of the display area 100a. The seventh and eighth patterning processes may deepen the recessed sidewall of the intermediate conductive trace 110a by side-marking the second intermediate conductive portion 112a. By performing both the seventh and eighth patterning processes before the second patterning process, the side-marking of the intermediate conductive trace 110a caused by the seventh and eighth patterning processes can be eliminated when the second patterning process removes the first protrusion 1141 and the second protrusion 1142.

[0204] For example, after performing an eighth patterning process on the pixel defining material layer 170a, before forming a mask layer 150 on the side of the pixel defining material layer 170a facing away from the substrate 101, the process may include: forming a second light-emitting device material layer on the side of the substrate 101 facing the conductive trace 110, the second light-emitting device material layer being located in the display area 100a and the trace area 100b; in the display area 100a, the second light-emitting device material layer being located within the second isolation opening 1442 and on the side of the isolation material layer 140a facing away from the substrate 101. Then, a ninth patterning process is performed on the second light-emitting device material layer, removing the second light-emitting device material layer located in the trace area 100b and at least a portion of the second light-emitting device material layer located on the side of the isolation material layer 140a facing away from the substrate 101, retaining the second light-emitting device material layer located in the second isolation opening 1442, the retained second light-emitting device material layer forming at least one of the light-emitting functional element 133, the second electrode 132, and the encapsulation portion 134 of the second light-emitting unit 130b.

[0205] In this process, the sidewall of the intermediate conductive trace 110a is recessed, resulting in discontinuity in the coverage of the second light-emitting device material layer over the sidewall of the intermediate conductive trace 110a. During the ninth patterning process, the etching reagent can easily erode the second intermediate conductive portion 112a through this discontinuity, thereby increasing the degree of recess in the sidewall of the intermediate conductive trace 110a. By performing the ninth patterning process before the second patterning process, the sidewall of the intermediate conductive trace 110a caused by the ninth patterning process can be eliminated when the first protrusion 1141 and the second protrusion 1142 are removed during the second patterning process.

[0206] In some embodiments, see Figure 14During the seventh patterning process of the isolation material layer 140a, a third isolation opening 1443 may also be formed in the isolation material layer 140a of the display area 100a. Thus, by simultaneously forming the second isolation opening 1442 and the third isolation opening 1443 through the seventh patterning process, the fabrication process of the second isolation opening 1442 and the third isolation opening 1443 can be simplified, and the fabrication cost reduced.

[0207] Or see Figure 13 Before performing the seventh patterning process on the isolation material layer 140a, the process may further include performing a tenth patterning process on the isolation material layer 140a to form a third isolation opening 1443 in the isolation material layer 140a of the display area 100a. That is, the second isolation opening 1442 and the third isolation opening 1443 can be prepared stepwise. Furthermore, by placing the tenth patterning process before the second patterning process, the side markings on the intermediate conductive trace 110a caused by the tenth patterning process can be eliminated when the first protrusion 1141 and the second protrusion 1142 are removed during the second patterning process. The principle has already been explained and will not be repeated here.

[0208] For example, a portion of the isolation material layer is located in the wiring area 100b. During the process of forming the third isolation opening 1443 in the isolation material layer 140a of the display area 100a, the process may also include removing the isolation material layer 140a located in the wiring area 100b. During the fabrication of the display panel 100, a lighting test may be performed on each color-emitting unit 130 after it has been formed. When the sidewall of the intermediate conductive trace 110a is recessed, the pixel-defining material layer 170a does not adequately cover the sidewall of the intermediate conductive trace 110a, potentially resulting in holes or gaps in the pixel-defining material layer 170a. Subsequently, when the conductive isolation material layer 140a is formed, it may fill the holes or gaps, potentially causing a short circuit between the isolation material layer 140a and the intermediate conductive trace 110a. Therefore, by removing the isolation material layer 140a of the wiring area 100b while forming the third isolation opening 1443, the isolation material layer 140a of the wiring area 100b can be removed earlier, and then the complete light-emitting unit 130 can be formed and the lighting test can be performed. This can avoid the adverse effects on the lighting test of the light-emitting unit 130 caused by the short circuit between the isolation material layer 140a of the wiring area 100b and the conductive wiring 110 due to the failure to remove the isolation material layer 140a.

[0209] In some embodiments, see Figure 14The eighth patterning process for the pixel-defining material layer 170a also includes forming a third pixel opening 1723 in the pixel-defining material layer 170a of the display area 100a. Thus, by simultaneously forming the second pixel opening 1722 and the third pixel opening 1723 through the eighth patterning process, the fabrication process of the second pixel opening 1722 and the third pixel opening 1723 can be simplified, reducing fabrication costs.

[0210] Or see Figure 13 Before performing the eighth patterning process on the pixel-defining material layer 170a, the method further includes performing an eleventh patterning process on the pixel-defining material layer 170a to form a third pixel opening 1723 in the pixel-defining material layer 170a of the display area 100a. That is, the second pixel opening 1722 and the third pixel opening 1723 can be prepared stepwise. Furthermore, by placing the eleventh patterning process before the second patterning process, the side marking of the intermediate conductive trace 110a caused by the eleventh patterning process can be eliminated when the first protrusion 1141 and the second protrusion 1142 are removed in the second patterning process. The principle has already been explained and will not be repeated here.

[0211] In some embodiments, after forming the third pixel opening 1723 in the pixel defining material layer 170a of the display area 100a and before forming the mask layer 150 on the side of the pixel defining material layer 170a facing away from the substrate 101, the process may include forming a third light-emitting device material layer on the side of the substrate 101 facing the conductive trace 110, the third light-emitting device material layer being located in the display area 100a and the trace area 100b. In the display area 100a, the third light-emitting device material layer is located within the third isolation opening 1443 and on the side of the isolation material layer 140a facing away from the substrate 101. Then, a twelfth patterning process is performed on the third light-emitting device material layer, removing at least a portion of the third light-emitting device material layer located in the trace area 100b and on the side of the isolation material layer 140a facing away from the substrate 101, while retaining the third light-emitting device material layer located within the third isolation opening 1443. The retained third light-emitting device material layer forms at least one of the light-emitting functional element 133, the second electrode 132, and the encapsulation portion 134 of the third light-emitting unit 130c. Thus, by setting the twelfth patterning process before the second patterning process, the side marking of the intermediate conductive trace 110a caused by the twelfth patterning process can be eliminated when the first protrusion 1141 and the second protrusion 1142 are removed in the second patterning process. The principle has been explained and will not be repeated here.

[0212] In some embodiments, after performing a sixth patterning process on the first light-emitting device material layer, the process may include: sequentially forming a second encapsulation layer and a first encapsulation layer on the side of the first light-emitting device material layer facing away from the substrate 101. The material of the second encapsulation layer may be an organic material, and the material of the first encapsulation layer may be an inorganic material. The second encapsulation layer may be located in the display area 100a, and the second encapsulation layer may expose the conductive traces 110. The first encapsulation layer may be located in both the display area 100a and the trace area 100b. In the trace area 100b, the first encapsulation layer covers the conductive traces 110.

[0213] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0214] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0215] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized by, A display panel has a display area and a trace area, the trace area and the display area are adjacent to each other; the display panel comprises: a substrate; a conductive trace disposed on one side of the substrate and located in the trace area; wherein the conductive trace comprises a first conductive part and a second conductive part, the first conductive part is located on a side of the second conductive part away from the substrate, the orthographic projection of the first conductive part on the substrate is located within the orthographic projection of the second conductive part on the substrate, and the materials of the first conductive part and the second conductive part are different.

2. The display panel of claim 1, wherein, The conductive trace comprises a third conductive part, the third conductive part is located on a side of the second conductive part towards the substrate, the orthographic projection of the second conductive part on the substrate is located within the orthographic projection of the third conductive part on the substrate, and the materials of the second conductive part and the third conductive part are different. Preferably, the material of at least one of the first conductive part and the third conductive part comprises titanium. Preferably, the material of the second conductive part comprises aluminum. Preferably, the conductive trace is configured as a power line. Preferably, the power line comprises a first power line and a second power line, the voltage transmitted by the first power line and the voltage transmitted by the second power line are different, one of the first power line and the second power line is electrically connected to the anode of the light emitting unit, and the other is electrically connected to the cathode of the light emitting unit. Preferably, the conductive trace extends in the direction from the display area to the trace area.

3. The display panel of claim 1 or 2, wherein, The display panel further comprises a light emitting unit, and an anode of the light emitting unit is disposed on a side of the conductive trace away from the substrate.

4. The display panel of claim 3, wherein, The display panel further comprises a first encapsulation layer, a second encapsulation layer, and a barrier wall, the second encapsulation layer covers the light emitting unit, the material of the second encapsulation layer comprises an organic material, the first encapsulation layer is disposed on a side of the second encapsulation layer away from the light emitting unit; the barrier wall is disposed on a side of the substrate and is used to block the second encapsulation layer; and the trace area is located on a side of the barrier wall away from the display area.

5. The display panel of claim 1, wherein, The conductive trace comprises two first surfaces oppositely disposed in a direction perpendicular to the direction from the display area to the trace area; the display panel further comprises a pixel definition layer, in the trace area, the pixel definition layer is located on a side of the conductive trace away from the substrate, and the pixel definition layer has a first opening that exposes at least one of the first surfaces; Preferably, in the display area, the display panel comprises a plurality of light emitting units, the pixel definition layer encloses a plurality of pixel openings, the plurality of pixel openings and the plurality of light emitting units are correspondingly arranged, and at least part of the light emitting units are disposed in the corresponding pixel openings; Preferably, in the display area, the display panel further comprises an isolation structure, the isolation structure is located on a side of the pixel definition layer away from the substrate, the isolation structure encloses a plurality of isolation openings, the plurality of isolation openings and the plurality of pixel openings are correspondingly arranged, the isolation openings and the corresponding pixel openings are in communication with each other, and the light emitting units extend into the corresponding isolation openings.

6. The display panel of claim 5, wherein, The display panel further comprises an insulating layer, the insulating layer is located on the side of the conductive trace facing the substrate, the side of the insulating layer away from the substrate has a groove, the groove opening is located on the side of the insulating layer away from the substrate, and the groove is in communication with the first opening; Preferably, the display panel further comprises a first encapsulation layer, the first encapsulation layer is located on the side of the pixel definition layer away from the substrate, and the first encapsulation layer covers the first surface and extends into the groove.

7. A display panel, characterized by comprising: The display panel has a display area and a trace area, the trace area and the display area are arranged adjacent to each other, and the display panel comprises: a substrate; a conductive trace arranged on one side of the substrate and located in the trace area, the conductive trace comprises two first surfaces arranged opposite to each other in a direction perpendicular to the display area to the trace area, the conductive trace comprises a second surface and a third surface arranged opposite to each other in the thickness direction of the substrate, the second surface is located on the side of the third surface facing the substrate, and the second surface and the third surface are connected through the first surface; wherein the orthographic projection of the third surface on the substrate is located in the orthographic projection of the second surface on the substrate; an anode of a light emitting unit is arranged on the side of the conductive trace away from the substrate.

8. The display panel of claim 7, wherein, In the direction close to the substrate, the conductive trace comprises a first conductive part, a second conductive part and a third conductive part arranged in layers, the third surface is the surface of the first conductive part away from the substrate, and the second surface is the surface of the third conductive part facing the substrate.

9. The display panel of claim 7, wherein, The display panel further comprises a second encapsulation layer and a barrier wall, the second encapsulation layer covers the light emitting unit, the material of the second encapsulation layer comprises an organic material, the barrier wall is arranged on one side of the substrate and used for blocking the second encapsulation layer, and the trace area is located on the side of the barrier wall away from the display area.

10. A display device, characterized by comprising: The display panel comprises any one of the display panels in claims 1-9.

11. A method for manufacturing a display panel, characterized by, The display panel has a display area and a trace area, the trace area and the display area are arranged adjacent to each other, and the preparation method of the display panel comprises: providing a substrate; forming a conductive trace on one side of the substrate, the conductive trace is located in the trace area; wherein the conductive trace comprises a first conductive part and a second conductive part, the first conductive part is located on the side of the second conductive part away from the substrate, the orthographic projection of the first conductive part on the substrate is located in the orthographic projection of the second conductive part on the substrate, and the materials of the first conductive part and the second conductive part are different.

12. The method of manufacturing a display panel according to claim 11, wherein, The process of forming the conductive trace on one side of the substrate comprises: forming a first intermediate conductive part and a second intermediate conductive part on one side of the substrate in the trace area, the first intermediate conductive part is located on the side of the second intermediate conductive part away from the substrate, and the first intermediate conductive part comprises a first protruding part protruding from the side wall of the second intermediate conductive part; Preferably, in the process of forming the first intermediate conductive part and the second intermediate conductive part on one side of the substrate in the trace area, the process further comprises: forming a third intermediate conductive part on one side of the substrate; the third intermediate conductive part is located on the side of the second intermediate conductive part away from the first intermediate conductive part, and the third intermediate conductive part comprises a second protruding part protruding from the side wall of the second intermediate conductive part; Preferably, the material of the first intermediate conductive part and the third intermediate conductive part comprises titanium, and the material of the second intermediate conductive part comprises aluminum; Preferably, the conductive trace extends in the direction from the display area to the trace area.

13. The method of manufacturing a display panel according to claim 12, wherein After forming the first intermediate conductive part and the second intermediate conductive part on one side of the substrate in the trace area, the method comprises: forming a pixel defining material layer on the side of the first intermediate conductive part away from the substrate; forming a mask layer on the side of the pixel defining material layer away from the substrate; in the trace area, the mask layer has a second opening, and the orthographic projection of the first protruding part on the substrate is located within the orthographic projection of the second opening on the substrate; based on the mask layer, performing a first patterning process on the pixel defining material layer to form a first opening in the pixel defining material layer in the trace area, the first opening being in communication with the second opening, and the first opening exposing the first protruding part; based on the mask layer, performing a second patterning process on the first intermediate conductive part and the second intermediate conductive part to remove the first protruding part, the remaining first intermediate conductive part forming a first conductive part, and the remaining second intermediate conductive part forming a second conductive part; Preferably, the second patterning process comprises dry etching; after the substrate is provided, before the conductive trace is formed on one side of the substrate, the method comprises: forming an insulating layer on one side of the substrate; the insulating layer is located between the conductive trace and the substrate, and the first opening exposes part of the insulating layer; during the second patterning process, the etching rate of the insulating layer is less than the etching rate of the first intermediate conductive part and / or the second intermediate conductive part; Preferably, the etching gas used in the second patterning process comprises chlorine; Preferably, the first opening also exposes the second protruding part; during the second patterning process on the first intermediate conductive part and the second intermediate conductive part, the method further comprises: removing the second protruding part, and the remaining third intermediate conductive part forming a third conductive part.

14. The method of manufacturing a display panel according to claim 13, wherein, The display area comprises a first pixel opening area; forming the mask layer on the side of the pixel defining material layer away from the substrate comprises: forming a photoresist material layer on the side of the pixel defining material layer away from the substrate, and disposing a mask plate on the side of the photoresist material layer away from the substrate; the mask plate has a first light transmission hole and a second light transmission hole; the first light transmission hole is disposed opposite to the first pixel opening area, and the second light transmission hole is disposed opposite to the second opening; the light transmission rates of the first light transmission hole and the second light transmission hole are different; based on the mask plate, performing an exposure process on the photoresist material layer; performing a third patterning process on the photoresist material layer to form the second opening in the photoresist material layer of the wire region and to thin the photoresist material layer of the first pixel opening region, the remaining photoresist material layer forming the mask layer, the mask layer of the first pixel opening region having a thickness less than a thickness of the mask layer of the remaining portion; after the second patterning process on the first intermediate conductive part and the second intermediate conductive part, performing an ashing process on the mask layer to remove at least part of the mask layer of the first pixel opening region to form a third opening, the third opening exposing the pixel defining material layer; performing a fourth patterning process on the pixel defining material layer based on the mask layer after the ashing process to remove the pixel defining material layer exposed by the third opening and to form a first pixel opening, the remaining pixel defining material layer forming a pixel defining layer; removing the mask layer.

15. The method of manufacturing a display panel according to claim 14, wherein, after forming the pixel defining material layer on a side of the first intermediate conductive part facing away from the substrate, before forming the mask layer on a side of the pixel defining material layer facing away from the substrate, the method comprises: forming an isolation material layer on a side of the pixel defining material layer facing away from the substrate, at least part of the isolation material layer being located in the display region; performing a fifth patterning process on the isolation material layer to form a first isolation opening in the isolation material layer of the display region, the remaining isolation material layer forming an isolation structure; the photoresist material layer covering the isolation structure; a normal projection of the third opening on the substrate at least partially coinciding with a normal projection of the first isolation opening on the substrate; preferably, after removing the mask layer, the method comprises: forming a first light emitting device material layer on a side of the substrate facing the conductive wire, the first light emitting device material layer being located in the display region and the wire region; in the display region, the first light emitting device material layer being located in the first isolation opening and on a side of the isolation material layer facing away from the substrate; performing a sixth patterning process on the first light emitting device material layer to remove the first light emitting device material layer located in the wire region and at least part of the first light emitting device material layer located on a side of the isolation material layer facing away from the substrate, the remaining first light emitting device material layer located in the first isolation opening forming at least one of a light emitting functional part, a second electrode and an encapsulation part of a first light emitting unit.

16. The method of producing a display panel according to claim 15, wherein before performing the fifth patterning process on the isolation material layer, the method comprises: performing a seventh patterning process on the isolation material layer to form a second isolation opening in the isolation material layer of the display region; performing an eighth patterning process on the pixel defining material layer to form a second pixel opening in the pixel defining material layer of the display region; Preferably, after the eighth patterning process on the pixel defining material layer, before forming the mask layer on the side of the pixel defining material layer away from the substrate, the method further comprises: forming a second light emitting device material layer on the side of the substrate facing the conductive trace, the second light emitting device material layer being located in the display region and the trace region; in the display region, the second light emitting device material layer is located in the second isolation opening and on the side of the isolation material layer away from the substrate. A ninth patterning process is performed on the second light emitting device material layer to remove the second light emitting device material layer in the trace region and at least part of the second light emitting device material layer on the side of the isolation material layer away from the substrate, and to retain the second light emitting device material layer in the second isolation opening, and to form at least one of a light emitting functional element, a second electrode and an encapsulation part of a second light emitting unit.

17. The method of producing a display panel according to claim 16, wherein In the seventh patterning process on the isolation material layer, a third isolation opening is formed in the isolation material layer in the display region. Alternatively, before the seventh patterning process on the isolation material layer, a tenth patterning process is performed on the isolation material layer to form a third isolation opening in the isolation material layer in the display region. Preferably, part of the isolation material layer is located in the trace region, and in the process of forming the third isolation opening in the isolation material layer in the display region, the isolation material layer in the trace region is removed.

18. The method of producing a display panel according to claim 16 or 17, wherein In the eighth patterning process on the pixel defining material layer, a third pixel opening is formed in the pixel defining material layer in the display region. Alternatively, before the eighth patterning process on the pixel defining material layer, an eleventh patterning process is performed on the pixel defining material layer to form a third pixel opening in the pixel defining material layer in the display region.

19. The method of producing a display panel according to claim 18, wherein After forming the third pixel opening in the pixel defining material layer in the display region, before forming the mask layer on the side of the pixel defining material layer away from the substrate, the method further comprises: forming a third light emitting device material layer on the side of the substrate facing the conductive trace, the third light emitting device material layer being located in the display region and the trace region; in the display region, the third light emitting device material layer is located in the third isolation opening and on the side of the isolation material layer away from the substrate. A twelfth patterning process is performed on the third light emitting device material layer to remove the third light emitting device material layer in the trace region and at least part of the third light emitting device material layer on the side of the isolation material layer away from the substrate, and to retain the third light emitting device material layer in the third isolation opening, and to form at least one of a light emitting functional element, a second electrode and an encapsulation part of a third light emitting unit. Preferably, after the sixth patterning process on the first light emitting device material layer, a second encapsulation layer is formed on the side of the first light emitting device material away from the substrate, and the material of the second encapsulation layer comprises an organic material. A first encapsulation layer is formed on the side of the second encapsulation layer away from the substrate, and the first encapsulation layer covers the conductive traces.

20. The method of manufacturing a display panel according to claim 14, wherein, After the substrate is provided, before the conductive traces are formed on the side of the substrate, the process comprises: An insulating layer is formed on the side of the substrate; the insulating layer is between the conductive traces and the substrate, and the first opening exposes part of the insulating layer; Preferably, during the fourth patterning process on the pixel defining material layer, the process further comprises: thinning the insulating layer exposed by the first opening to form a groove on the side of the insulating layer away from the substrate; and the groove is in communication with the first opening.

Images