Display device, method of manufacturing the same, and electronic device including the same

Abstract

Provided are a display device, a method of manufacturing the same, and an electronic device including the same, the display device including: a first substrate including a first support substrate including an emission area and a light emitting element disposed in the emission area; a second substrate facing the first substrate; and a sealing layer bonding the first substrate and the second substrate together. The second substrate includes: a second support substrate facing the first substrate; a color filter layer disposed on a surface of the second support substrate; a low refractive layer disposed on a portion of the color filter layer and in the emission region; and a first capping layer disposed on the color filter layer, including an inorganic insulating material, and covering the low refractive layer. The low refractive layer has a refractive index lower than a refractive index of the first capping layer.

Description

Technical Field

[0001] The disclosure relates to a display device, a method of manufacturing the display device, and an electronic device including the display device. Background Technology

[0002] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. For example, display devices are used in various electronic devices such as smartphones, digital cameras, laptops, navigation devices, and smart TVs.

[0003] The display device can be a flat panel display device such as a liquid crystal display device, a field emission display device, and a light-emitting display device. Here, the light-emitting display device can include an organic light-emitting display device that includes an organic light-emitting element, an inorganic light-emitting display device that includes an inorganic light-emitting element such as an inorganic semiconductor, or a micro-light-emitting display device or a nano-light-emitting display device that includes a micro-light-emitting element or a nano-light-emitting element.

[0004] Organic light-emitting display devices use light-emitting elements to display images, each of which includes a light-emitting layer of organic light-emitting material. Compared to other display devices, organic light-emitting display devices that use self-emissive elements to display images can have relatively superior performance in terms of power consumption, response speed, luminous efficiency, brightness, and wide viewing angle.

[0005] In a display device, the surface from which light is emitted may include a display area for displaying an image and a non-display area adjacent to the display area. Within the display area, an emitting area may be arranged that emits light with corresponding brightness and color. Summary of the Invention

[0006] The display device may include a first substrate that emits light with corresponding brightness from the emitting region and a second substrate that converts the light from the emitting region into corresponding colors.

[0007] Light emitted from the first substrate can be seen outside the display device through the second substrate. Therefore, the second substrate may include a low-refractive-index layer to improve luminous efficiency.

[0008] Low-refractive-index layers can include organic materials instead of inorganic materials to achieve a relatively low refractive index. Therefore, there is a problem that the organic materials in the low-refractive-index layer can create pathways for oxygen or moisture to permeate.

[0009] The disclosed aspect provides a display device and a method for manufacturing the display device, wherein the permeation of oxygen or moisture through a low-refractive layer can be reduced or delayed.

[0010] However, the disclosure is not limited to those described herein. The above and other aspects of the disclosure will become more apparent to a person skilled in the art upon which it pertains by referring to the detailed description of the disclosure given below.

[0011] According to the disclosed embodiments, the display device may include: a first substrate, including a first support substrate comprising an emitting region and a light-emitting element disposed in the emitting region; a second substrate facing the first substrate; and a sealing layer bonding the first substrate and the second substrate together. The second substrate may include: a second support substrate facing the first substrate; a color filter layer disposed on one surface of the second support substrate; a low-refractive-index layer disposed on a portion of the color filter layer and in the emitting region; and a first capping layer disposed on the color filter layer, comprising an inorganic insulating material, and covering the low-refractive-index layer. The low-refractive-index layer may have a lower refractive index than the first capping layer.

[0012] The low-refractive layer may include a transparent organic material and hollow silica particles dispersed in the transparent organic material, and the refractive index of the low-refractive layer may be in the range of about 1.0 to about 1.5.

[0013] Each of the first and second support substrates may include a display area in which an emission area is disposed and a non-display area disposed around the display area. The display area may include the non-emission area between the emission areas. The color filter layer may include a light-blocking portion disposed in the non-emission area and the non-display area and blocking light. The low-refractive-index layer may be disposed in the portion of the non-display area adjacent to the display area and in the display area.

[0014] The sealing layer can be placed in a non-display area, and the low-refractive layer can be spaced apart from the sealing layer.

[0015] The second substrate may also include a dam portion disposed on the color filter layer in the non-display area and surrounding the display area in the plan view, and a low-refractive layer may be disposed in the area surrounded by the dam portion in the plan view.

[0016] The emission region may include a first emission region that emits light of a first wavelength, a second emission region that emits light of a second wavelength lower than the first wavelength, and a third emission region that emits light of a third wavelength lower than the second wavelength. The color filter layer may also include a first color filter portion disposed in the first emission region and transmitting light of the first wavelength, a second color filter portion disposed in the second emission region and transmitting light of the second wavelength, and a third color filter portion disposed in the third emission region and transmitting light of the third wavelength. The light blocking portion may include a structure in which two or more of the first color filter portion, the second color filter portion, and the third color filter portion are stacked.

[0017] The light-emitting element can emit light of a fourth band equal to or lower than the third band, and the second substrate may further include a color conversion layer disposed on the first capping layer and a second capping layer disposed on the first capping layer, comprising an inorganic insulating material and covering the color conversion layer. The color conversion layer may include: a first color conversion portion disposed in the first emission region and converting the fourth band light into first band light; a second color conversion portion disposed in the second emission region and converting the fourth band light into second band light; a light-transmitting portion disposed in at least a portion of the third emission region and transmitting the fourth band light; and a partition wall disposed between the first color conversion portion, the second color conversion portion, and the light-transmitting portion.

[0018] The first substrate may include: a circuit layer disposed on the first support substrate and including light-emitting pixel drivers electrically connected to light-emitting elements respectively; an element layer disposed on the circuit layer and including light-emitting elements; and an encapsulation layer covering the element layer. The element layer may further include an anode disposed in the emitting region, a pixel defining layer disposed in the non-emitting region and covering the edge of the anode, a light-emitting layer disposed on the anode and the pixel defining layer, and a cathode disposed on the light-emitting layer, and each of the light-emitting elements may have a structure in which the light-emitting layer is disposed between the anode and the cathode facing each other.

[0019] According to the disclosed embodiments, a method for manufacturing a display device may include the following steps: preparing a first substrate including a light-emitting element disposed in an emitting region; preparing a second substrate; disposing a sealing layer on the first substrate or the second substrate; and bonding the first substrate and the second substrate together using the sealing layer. The step of preparing the second substrate may include: disposing a color filter layer on a second support substrate; disposing a low-refractive-index layer on a portion of the color filter layer and in the emitting region; and disposing a first capping layer covering the low-refractive-index layer by stacking an inorganic insulating material on the color filter layer.

[0020] In the step of setting the low-refractive layer, the low-refractive layer may have a lower refractive index than the first capping layer.

[0021] Each of the first substrate and the second substrate may include a display area in which an emission area is arranged and a non-display area disposed around the display area. The display area may include the non-emission area between the emission areas. In the step of setting a color filter layer, the color filter layer may include light-blocking portions disposed in the non-emission area and the non-display area and blocking light. In the step of setting a low-refractive layer, a low-refractive layer may be set in the portion of the non-display area adjacent to the display area and in the display area.

[0022] In the step of setting the sealing layer, the sealing layer can be set in a non-display area.

[0023] In the step of setting the low-refractive layer, the low-refractive layer may include a transparent organic material and hollow silica particles dispersed in the transparent organic material, and the refractive index of the low-refractive layer may be in the range of about 1.0 to about 1.5.

[0024] The steps of setting a low-refractive layer may include: setting a target material layer on a portion of the color filter layer by dripping the target material through a nozzle; and curing the target material layer.

[0025] The step of preparing the second substrate may further include: before setting the low-refractive layer, setting a dam portion on the color filter layer in the non-display area that is spaced apart from and surrounds the display area, and the step of setting the target material layer may include causing the target material dropped onto the color filter layer to diffuse in the area surrounded by the dam portion.

[0026] The steps of setting a low-refractive layer may include: setting a target material layer on a portion of a color filter layer by dripping target material through a nozzle; preparing a temporary material layer by curing the target material layer on the color filter layer; setting a mask material layer on the temporary material layer; preparing an etch mask by removing the mask material layer except for a portion that overlaps with the display area in the plan view; and partially removing the temporary material layer using the etch mask.

[0027] The steps of setting a low-refractive layer may include: setting a sacrificial layer by removing at least a portion of the sacrificial material layer that overlaps with the display area in a plan view on a color filter layer; setting a target material layer covering the sacrificial layer on the color filter layer; preparing a temporary material layer by curing the target material layer; and removing the portion of the temporary material layer set on the sacrificial layer together with the sacrificial layer.

[0028] According to the disclosed embodiments, a method for manufacturing a display device may include the following steps: preparing a first substrate including a light-emitting element disposed in an emitting region of a display region; preparing a second substrate; disposing a sealing layer on the first substrate or the second substrate; and bonding the first substrate and the second substrate together using the sealing layer. The step of preparing the second substrate may include: disposing a color filter layer on a second support substrate; disposing a sacrificial layer by removing at least a portion of a sacrificial material layer in a plan view that overlaps with the display region from the color filter layer; disposing a target material layer covering the sacrificial layer on the color filter layer; preparing a temporary material layer by curing the target material layer; and disposing a low-refractive layer on a portion of the color filter layer and in the emitting region by removing a portion of the temporary material layer disposed on the sacrificial layer together with the sacrificial layer.

[0029] The step of preparing the second substrate may further include setting a first capping layer covering the low-refractive layer by stacking an inorganic insulating material on the color filter layer, and in the step of setting the low-refractive layer, the low-refractive layer may have a refractive index lower than that of the first capping layer.

[0030] In the step of setting the low-refractive layer, the low-refractive layer may include a transparent organic material and hollow silica particles dispersed in the transparent organic material, and the refractive index of the low-refractive layer may be in the range of about 1.0 to about 1.5.

[0031] The second support substrate may include a display area in which the emission area is arranged and a non-display area disposed around the display area. The display area may include the non-emission area between the emission areas. In the step of setting the color filter layer, the color filter layer may include light blocking portions disposed in the non-emission area and the non-display area and blocking light. In the step of setting the low refractive layer, the low refractive layer may be set in the portion of the non-display area adjacent to the display area and in the display area. In the step of setting the sealing layer, the sealing layer may be set in the non-display area.

[0032] According to the disclosed embodiments, the electronic device may include a display device and a processor for transmitting image data signals to the display device. Attached Figure Description

[0033] These and / or other aspects will become apparent and more readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which: Figure 1 This is a plan view of the display device according to an embodiment; Figure 2 It is according to the embodiment along Figure 1 A schematic cross-sectional view taken by line A-A'; Figure 3 yes Figure 2 A magnified view of part C; Figure 4 yes Figure 1 The diagram shows the display area and circuit layer plan of part B. Figure 5 yes Figure 1 A schematic block diagram of the circuit layer of part B shown in the figure; Figure 6 yes Figure 5 A schematic diagram of the equivalent circuit of the light-emitting pixel driver; Figure 7 It is according to the embodiment along Figure 4 A schematic cross-sectional view taken by line D-D'; Figure 8 and Figure 9 It is according to the embodiment along Figure 1 A schematic cross-sectional view taken by line A-A'; Figure 10 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment; Figure 11 This illustrates an embodiment in Figure 10 A flowchart of the process for preparing the second substrate; Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 It is shown Figure 10 and Figure 11 Some operational diagrams; Figure 20 This illustrates an embodiment in Figure 11 The flowchart for setting up a low-refractive layer; Figure 21 , Figure 22 and Figure 23 It is shown Figure 20 A schematic diagram of the operation; Figure 24 This is a flowchart illustrating the operation of preparing the second substrate according to an embodiment; Figure 25 , Figure 26 and Figure 27 It is shown Figure 20 and Figure 24 A schematic diagram of the operation; Figure 28 This illustrates an embodiment in Figure 11 The flowchart for setting up a low-refractive layer; Figure 29 , Figure 30 , Figure 31 , Figure 32 and Figure 33 It is shown Figure 28 A schematic diagram of the operation; Figure 34 This illustrates an embodiment in Figure 11 The flowchart for setting up a low-refractive layer; and Figure 35 , Figure 36 , Figure 37 , Figure 38 and Figure 39 It is shown Figure 34 A diagram illustrating the operation. Detailed Implementation

[0034] Embodiments will be described more fully below with reference to the accompanying drawings. However, embodiments may be provided in different forms and should not be construed as limiting. Throughout this disclosure, the same reference numerals denote the same components. In the drawings, the thickness of layers and regions may be exaggerated for clarity.

[0035] In order to describe the disclosed embodiments, some parts that are not related to the description may be omitted.

[0036] When a component or layer is referred to as being "on," "connected to," or "bonded to" another component or layer, it can be directly on, directly connected to, or directly bonded to the other component or layer, or an intermediary component or layer may be present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another component or layer, an intermediary component or layer is not present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without an intermediary component. Furthermore, when a component is referred to as being "in contact" with another component or a variation thereof, the component can be in "electrical contact" or "physical contact" with the other component; or in "indirect contact" or "direct contact" with the other component.

[0037] Furthermore, the phrase "in a plan view" indicates the view of a portion of an object from above, while the phrase "in a schematic sectional view" indicates the view of a schematic section obtained by vertically cutting a portion of an object from the side. The terms "overlapping" or "coinciding" indicate that the first object may be above or below the second object, or to the side of the second object, or vice versa. Additionally, the term "overlapping" can include layering, stacking, facing or oriented, extending over, covering or partially covering, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art. The expression "not overlapping" can include meanings such as "separated from," "offset relative to," or "shifted relative to," and any other suitable equivalent as will be understood and appreciated by one of ordinary skill in the art. The terms "facing" and "oriented" can indicate that the first object may be directly or indirectly opposite the second object. In the case where a third object is placed between the first and second objects, the first and second objects, although still facing each other, can be understood as being indirectly opposite each other.

[0038] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” or “above” may be used herein to describe the relationship between one element or component and another, as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are also intended to cover different orientations of the device during use or operation. For example, in the case where the device shown in the drawings is flipped, a device placed “below” or “under” another device may be placed “above” said other device. Thus, the exemplary term “below” can include both “below” and “above” positions. The device may also be oriented in other directions, and thus, the spatial relative terms may be interpreted differently depending on the orientation.

[0039] When an element is referred to as being “connected” or “joined” to another element, the element may be “directly connected” or “directly joined” to the other element, or “indirectly connected” or “indirectly joined” to the other element with one or more intermediary elements placed therebetween. It will also be understood that when the terms “comprising,” “having,” “including,” and / or variations thereof are used, they may indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of other features, integrals, steps, operations, elements, components, and / or any combinations thereof.

[0040] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another, or for the convenience of their description and explanation. For example, when discussing a “first element” in the specification, it may be referred to as a “second element” or a “third element,” and “second element” and “third element” may be referred to in a similar manner.

[0041] As used herein, the terms “about” or “approximately” include the stated value and indicate an acceptable deviation from the particular value as determined by a person skilled in the art taking into account the measurement involved and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0042] In the specification and claims, for the purposes of their meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in the sense of conjunction or disjunction and can be understood to be equivalent to "and / or". In the specification and claims, for the purposes of their meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one of the group consisting of...". For example, "at least one of A and B" can be understood to mean "A, B, or A and B".

[0043] Unless otherwise defined or implied, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formalized sense unless expressly defined in the specification.

[0044] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0045] Figure 1 This is a plan view of the display device 10 according to an embodiment.

[0046] Reference Figure 1 The display device 10 according to the embodiment can be a device for displaying moving or still images. The display device 10 can be used as a display screen in portable electronic devices (such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs)) and various products (such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices).

[0047] The display device 10 may be an organic light-emitting display device using organic light-emitting diodes (OLEDs), a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, or a light-emitting display device using micro-LEDs or nano-LEDs. An embodiment of the display device 10 as an organic light-emitting display device will be described below. However, the disclosure is not limited thereto, and it can also be applied to display devices including organic insulating materials, organic light-emitting materials, and metallic materials.

[0048] The display device 10 may be formed as a flat surface, but the disclosure is not limited thereto. For example, the display device 10 may include curved portions formed at the left and right ends and having a constant or varying curvature. For example, the display device 10 may be formed as a flexible surface, such that it can be bent, folded, rolled, or rolled up.

[0049] According to an embodiment, the display device 10 may be an organic light-emitting display device.

[0050] like Figure 1 As shown, the display device 10 according to an embodiment may include a quadrilateral surface. However, this is merely an example, and the shape of the display device 10 is not limited to this. Figure 1The shape shown is indicated. In another embodiment, the display device 10 may include a polygonal surface or a circular surface other than a quadrilateral surface. In yet another embodiment, at least a portion of the display device 10 may be deformable from an unfolded shape into a curved, bent, folded, or rolled shape.

[0051] The surface of the display device 10 may include a display area DA from which light for displaying an image is emitted and a non-display area NDA surrounding the display area DA.

[0052] The display area DA can form most of the surface of the display device 10.

[0053] The non-display area NDA can be a frame-shaped area that does not emit light for displaying an image and surrounds the display area DA. For example, the non-display area NDA can be a specific color such as black.

[0054] The display device 10 may include an emissive pixel driver EPD (see [reference]) that transmits signals, voltages, or power to a light-emitting pixel in the display area DA. Figure 4 , Figure 5 and Figure 6 ) drives 11 and 12.

[0055] Of drivers 11 and 12, driver 11, which can be implemented as a relatively simple circuit, can be located in the non-display area NDA.

[0056] Another driver 12 of drivers 11 and 12 may be fabricated as an integrated circuit chip and mounted on a circuit board 13 electrically connected to a pad (“pad”, or “soldering pad”) of the non-display area NDA. In another embodiment, the other driver 12 may be mounted on the pad of the non-display area NDA.

[0057] Figure 2 It is along Figure 1 A schematic cross-sectional view taken by line A-A'. Figure 3 yes Figure 2 A magnified view of part C.

[0058] Reference Figure 2 The display device 10 according to the embodiment may include a first substrate 100, a second substrate 200 facing the first substrate 100, and a sealing layer 400 that bonds the first substrate 100 and the second substrate 200 together.

[0059] Each of the first substrate 100 and the second substrate 200 may include a display area DA from which light for displaying an image is emitted, and a non-display area NDA disposed around the display area DA and not from which light is emitted.

[0060] The sealing layer 400 can be disposed in the non-display area NDA between the first substrate 100 and the second substrate 200.

[0061] The display device 10 may further include a filling layer 300 disposed between the first substrate 100 and the second substrate 200. The filling layer 300 may be disposed at least in the display area DA and may fill the space between the first substrate 100 and the second substrate 200.

[0062] The first substrate 100 may include a first support substrate 110, a circuit layer 120 disposed on the first support substrate 110, a component layer 130 disposed on the circuit layer 120, and an encapsulation layer 140 disposed on the component layer 130.

[0063] The second substrate 200 may include a second support substrate 210 facing the first substrate 100, a color filter layer 220 disposed on the second support substrate 210, and an emission region EA disposed on a portion of the color filter layer 220 and on a third-direction DR3 adjacent to the display region DA (see Figure 4 The low-refractive-index layer 230 is stacked and a first capping layer 240, comprising inorganic insulating material and covering the low-refractive-index layer 230, is disposed on the color filter layer 220.

[0064] The second substrate 200 may further include a color conversion layer 250 disposed on the first cover layer 240 and a second cover layer 260 disposed on the first cover layer 240, comprising an inorganic insulating material and covering the color conversion layer 250.

[0065] Reference Figure 3 The low-refractive layer 230 may include a transparent organic material TOM and hollow silica particles HL dispersed in the transparent organic material TOM.

[0066] The transparent organic material TOM can have a lower refractive index than the inorganic insulating material of the first capping layer 240. For example, the refractive index of the transparent organic material TOM can be in the range of about 1.6 to about 1.7. In another embodiment, the refractive index of the transparent organic material TOM can be higher than about 1.7.

[0067] Hollow silica particles HL can be air-filled particles. Since the refractive index of air is about 1.0, the higher the content of hollow silica particles HL in the transparent organic material TOM, the lower the refractive index of the low refractive layer 230.

[0068] For example, the refractive index of the low-refractive layer 230 can be in the range of about 1.0 to about 1.5.

[0069] like Figure 2As shown in the embodiment, the low-refractive layer 230 can extend not only in the display area DA, but also to the portion of the non-display area NDA adjacent to the display area DA.

[0070] According to an embodiment, the low-refractive-index layer 230 may not be completely superimposed on the display area DA and non-display area NDA of the second support substrate 210 on the third-direction DR3. For example, the low-refractive-index layer 230 may be superimposed only on the display area DA and the portion of the non-display area NDA adjacent to the display area DA, and may not extend to the edge of the second support substrate 210.

[0071] Therefore, the side surface of the low-refractive layer 230 can be spaced apart from the edge of the second support substrate 210 and can be covered by the first capping layer 240 disposed on the low-refractive layer 230. Thus, the penetration of oxygen or moisture through the low-refractive layer 230, which comprises a transparent organic material TOM, can be reduced or delayed.

[0072] Figure 4 yes Figure 1 The diagram shows the display area DA of part B and the plan view of circuit layer 120.

[0073] Reference Figure 4 The display area DA may include the emission area EA from which light is emitted and the non-emission area NEA between the emission areas EA.

[0074] According to an embodiment, the emission region EA may include a first emission region EA1 that emits light in a first wavelength band, a second emission region EA2 that emits light in a second wavelength band lower than the first wavelength band, and a third emission region EA3 that emits light in a third wavelength band lower than the second wavelength band.

[0075] For example, the first band can be in the range of approximately 600 nm to approximately 750 nm, and the light in the first band can be red. The second band can be in the range of approximately 480 nm to approximately 560 nm, and the light in the second band can be green. The third band can be in the range of approximately 370 nm to approximately 460 nm, and the light in the third band can be blue.

[0076] Therefore, a unit pixel PX that displays white light can be formed by one or more first emission regions EA1, one or more second emission regions EA2, and one or more third emission regions EA3 that are adjacent to each other in the emission region EA.

[0077] According to an embodiment, the first launch area EA1, the second launch area EA2, and the third launch area EA3 can be arranged side by side in the second direction DR2.

[0078] The third transmission area EA3 can be set on the first direction DR1 between the first transmission area EA1 and the second transmission area EA2.

[0079] Each of the emission areas EA can have one of the following shapes: rectangular, triangular, rhomboid, square, trapezoidal, circular, and elliptical.

[0080] According to an embodiment, in the second direction DR2, the third transmission region EA3 may have a width smaller than that of the first transmission region EA1 and the second transmission region EA2. Therefore, in the second direction DR2, the gap between the third transmission regions EA3 may be larger than the gap between the first transmission regions EA1 and the gap between the second transmission regions EA2.

[0081] The circuit layer 120 of the first substrate 100 may include light-emitting pixel drivers EPDs arranged side by side.

[0082] The light-emitting pixel driver EPD can be electrically connected to the light-emitting elements LE disposed in the emission region EA of the element layer 130 (see [link]). Figure 6 ).

[0083] The light-emitting pixel driver EPD may include a first light-emitting pixel driver EPD1 electrically connected to a light-emitting element LE electrically connected to a first emission region EA1, a second light-emitting pixel driver EPD2 electrically connected to a light-emitting element LE electrically connected to a second emission region EA2, and a third light-emitting pixel driver EPD3 electrically connected to a light-emitting element LE electrically connected to a third emission region EA3.

[0084] Figure 5 yes Figure 1 The diagram shows a schematic block diagram of circuit layer 120 of part B.

[0085] like Figure 5 As shown, circuit layer 120 (see...) Figure 2 It may include a light-emitting pixel driver EPD and lines VDL, DL, VIL, GWL and GIL electrically connected to the light-emitting pixel driver EPD.

[0086] The lines VDL, DL, VIL, GWL, and GIL can transmit voltage or power and signals to each of the light-emitting pixel drivers in the EPD.

[0087] For example, circuit layer 120 may include transmitting a scan write signal GW to the light-emitting pixel driver EPD (see Figure 6 The scan write line GWL transmits the scan initialization signal GI to the light-emitting pixel driver EPD (see...). Figure 6 The scan initialization line GIL and the data signal Vdata transmitted to the light-emitting pixel driver EPD (see...) Figure 6The data line DL transmits the initialization voltage VINT to the light-emitting pixel driver EPD (see...). Figure 6 The initial voltage line VIL is used to transfer the first power ELVDD to the light-emitting pixel driver EPD (see [link]). Figure 6 The first electric field line VDL and the light-emitting element LE (see) Figure 6 Transmitting the second power ELVSS (see) Figure 6 The second power line VSL.

[0088] The circuit layer 120 may also include a first power supplement line VDAL for reducing the resistance of the first power line VDL and a second power supplement line VSAL for reducing the resistance of the second power line VSL.

[0089] The first power auxiliary line VDAL may extend in a direction intersecting with the first power line VDL and may be electrically connected to the first power line VDL.

[0090] The second power supplementary line VSAL may extend in a direction intersecting with the second power line VSL and may be electrically connected to the second power line VSL.

[0091] Data line DL may include transmitting data signal Vdata to the first luminous pixel driver EPD1 (see...) Figure 6 The first data line DL1 transmits the data signal Vdata to the second light-emitting pixel driver EPD2 (see...). Figure 6 The second data line DL2 and the data signal Vdata transmitted to the third luminous pixel driver EPD3 (see...) Figure 6 The third data line DL3.

[0092] Figure 6 yes Figure 5 A schematic diagram of the equivalent circuit of the light-emitting pixel driver EPD.

[0093] Reference Figure 6 The light-emitting pixel driver EPD can be electrically connected between the first power line VDL transmitting the first power ELVDD and the light-emitting element LE, and the light-emitting element LE can be electrically connected between the light-emitting pixel driver EPD and the second power line VSL transmitting the second power ELVSS.

[0094] The light-emitting element (LE) can be an organic light-emitting diode (OLED) including an organic light-emitting layer, a quantum dot light-emitting diode including a quantum dot light-emitting layer, a micro light-emitting diode, or an inorganic light-emitting diode including inorganic semiconductors.

[0095] The second power source ELVSS can have a lower voltage level than the first power source ELVDD.

[0096] For example, the anode of the light-emitting element LE can be electrically connected to the light-emitting pixel driver EPD, and the cathode of the light-emitting element LE can be electrically connected to the second power line VSL that transmits the second power ELVSS.

[0097] According to an embodiment, element layer 130 (see Figure 2 The light-emitting element (LE) can emit light in the fourth band, which is lower than the third band.

[0098] The light-emitting pixel driver EPD may include a first transistor ST1 for generating drive current for the light-emitting element LE, one or more transistors ST2 and ST3 electrically connected to the first transistor ST1, and one or more capacitors C1.

[0099] The first transistor ST1 can be electrically connected between the first power line VDL and the light-emitting element LE.

[0100] The first electrode of the first transistor ST1 can be electrically connected to the first power line VDL.

[0101] The second electrode of the first transistor ST1 can be electrically connected to the second node N2 and the anode of the light-emitting element LE.

[0102] The first gate electrode of the first transistor ST1 can be electrically connected to the first node N1 and the second transistor ST2.

[0103] The second gate electrode of the first transistor ST1 can be electrically connected to the second node N2.

[0104] The second transistor ST2 can be electrically connected between the data line DL and the first node N1.

[0105] The gate electrode of the second transistor ST2 can be electrically connected to the scan write line GWL. For example, the second transistor ST2 can be turned on by the scan write signal GW of the scan write line GWL.

[0106] With the second transistor ST2 turned on, the data signal Vdata of the data line DL can be transmitted to the first node N1.

[0107] Because of the data signal Vdata transmitted to the first node N1, the voltage difference between the first gate electrode and the first electrode of the first transistor ST1 (e.g., the gate-source voltage difference) can become the voltage difference between the first power ELVDD and the data signal Vdata, and therefore becomes greater than the threshold voltage of the first transistor ST1. Therefore, the first transistor ST1 can be turned on, and a source-drain current with a magnitude corresponding to the data signal Vdata can be generated between the first and second electrodes of the first transistor ST1. The source-drain current of the first transistor ST1 can be supplied as a drive current to the light-emitting element LE.

[0108] Therefore, since a driving current of the same magnitude as the data signal Vdata is supplied to the light-emitting element LE, the light-emitting element LE can emit light with a brightness corresponding to the data signal Vdata.

[0109] The first capacitor C1 can be electrically connected between the first node N1 and the second node N2.

[0110] The first capacitor C1 can be charged with a data signal Vdata that is transmitted to the first node N1 via the conducting second transistor ST2.

[0111] Therefore, the potential of the first node N1 can be maintained for a period of time due to the voltage applied to the first capacitor C1.

[0112] The third transistor ST3 can be electrically connected between the initialization voltage line VIL and the second node N2.

[0113] The gate electrode of the third transistor ST3 can be electrically connected to the scan initialization line GIL. For example, the third transistor ST3 can be turned on by the scan initialization signal GI of the scan initialization line GIL.

[0114] With the third transistor ST3 turned on, the potential of the second node N2 (e.g., the potential of the anode of the light-emitting element LE) can be initialized to the initial voltage VINT of the initial voltage line VIL.

[0115] like Figure 6 As shown, according to an embodiment, each of the first transistor ST1, the second transistor ST2, and the third transistor ST3 may be an N-type MOSFET. However, the disclosure is not limited thereto, and in another embodiment, at least one of the first transistor ST1, the second transistor ST2, and the third transistor ST3 may be a P-type MOSFET.

[0116] Figure 7 It is according to the embodiment along Figure 4 A schematic cross-sectional view taken by line D-D'.

[0117] Reference Figure 7 The display device 10 may include a first substrate 100 and a second substrate 200 facing each other, and a filling layer 300 that fills the space between the first substrate 100 and the second substrate 200.

[0118] The first substrate 100 may include a circuit layer 120 disposed on the first support substrate 110 and including a light-emitting pixel driver EPD, an element layer 130 disposed on the circuit layer 120 and including a light-emitting element LE disposed in an emission region EA, and an encapsulation layer 140 disposed on the element layer 130.

[0119] The encapsulation layer 140 may include two or more inorganic insulating layers and at least one organic insulating layer, wherein the two or more inorganic insulating layers comprise inorganic insulating materials, and the at least one organic insulating layer is disposed between the two or more inorganic insulating layers and comprises organic insulating materials.

[0120] The encapsulation layer 140 can prevent defects in the circuit layer 120 or component layer 130 caused by foreign matter, and prevent oxygen or moisture from penetrating into the circuit layer 120 or component layer 130.

[0121] The first support substrate 110 may include a display area DA (see...) Figure 1 ) and non-display area NDA (see Figure 1 ).

[0122] The display area DA may include side-by-side emission areas EA ( Figure 4 The non-emission area NEA between EA1, EA2 and EA3 in the emission area and the emission area EA.

[0123] For example, the width of the non-display area NDA of the second support substrate 210 may be equal to or less than the width of the non-display area NDA of the first support substrate 110.

[0124] The circuit layer 120 may include a buffer layer 121 disposed on the first support substrate 110, a first interlayer insulating layer 122 disposed on the buffer layer 121, a second interlayer insulating layer 123 disposed on the first interlayer insulating layer 122, and a planarization layer 124 disposed on the second interlayer insulating layer 123.

[0125] Each of the buffer layer 121, the first interlayer insulation layer 122, and the second interlayer insulation layer 123 may include an inorganic insulating material.

[0126] The planarization layer 124 may include an organic insulating material.

[0127] The circuit layer 120 may include a light-emitting pixel driver EPD that transmits drive current to the light-emitting element LE.

[0128] Each of the light-emitting pixel drivers (EPD) may include two or more transistors ST1, ST2, and ST3 (see...). Figure 6 ).

[0129] The first transistor ST1 of each of the light-emitting pixel drivers EPDs may include an active layer ACT disposed on a buffer layer 121, a gate electrode GE disposed on a gate insulating layer GAI on a channel portion CH1 covering the active layer ACT, and a first electrode E1 and a second electrode E2 disposed on a first interlayer insulating layer 122 covering the active layer ACT and the gate electrode GE.

[0130] At least the channel portion CH1 of the active layer ACT can be stacked on the third-direction DR3 with the light blocking layer BML on the first support substrate 110.

[0131] Buffer layer 121 can cover light blocking layer BML.

[0132] The active layer ACT may include a channel portion CH1, a first electrode portion ELC1 connected to one side of the channel portion CH1, and a second electrode portion ELC2 connected to the other side of the channel portion CH1.

[0133] The first electrode E1 can be electrically connected to the first electrode portion ELC1 of the active layer ACT through a hole penetrating the first interlayer insulating layer 122.

[0134] The second electrode E2 can be electrically connected to the second electrode portion ELC2 of the active layer ACT through a hole penetrating the first interlayer insulating layer 122.

[0135] The second electrode E2 can be electrically connected to the light-blocking layer BML through a hole penetrating the first interlayer insulating layer 122 and the buffer layer 121.

[0136] Since the photoblocking layer BML faces the rear surface of the active layer ACT, the portion of the active layer ACT adjacent to the photoblocking layer BML can be activated relatively weakly compared to the other portion of the active layer ACT adjacent to the gate electrode GE, based on the same potential of the photoblocking layer BML as the second electrode E2.

[0137] The second interlayer insulation layer 123 can cover the first interlayer insulation layer 122, the first electrode E1, and the second electrode E2.

[0138] Each of the buffer layer 121, the gate insulating layer GAI, the first interlayer insulating layer 122, and the second interlayer insulating layer 123 may include an inorganic insulating material.

[0139] The component layer 130 can be disposed on the planarization layer 124.

[0140] The element layer 130 may include a light-emitting element LE disposed in the emission region EA. The light-emitting element LE may emit light in the fourth band.

[0141] Each of the light-emitting elements LE may include a structure in which a light-emitting layer 133 is disposed between an anode 131 and a cathode 134 facing each other.

[0142] For example, the element layer 130 may include an anode 131 disposed in the emission region EA, a pixel defining layer 132 disposed in the non-emission region NEA and covering the edge of the anode 131, a light-emitting layer 133 disposed on the anode 131 and the pixel defining layer 132, and a cathode 134 disposed on the light-emitting layer 133.

[0143] In another embodiment, the light-emitting layer 133 may be disposed in the emission region EA.

[0144] Anode 131 can be electrically connected to the light-emitting pixel driver EPD through the anode connection hole ANCH.

[0145] For example, anode 131 can be electrically connected to the second electrode E2 of the first transistor ST1 of the light-emitting pixel driver EPD through the anode connection hole ANCH.

[0146] The anode connection hole ANCH can penetrate the planarization layer 124 and the second interlayer insulation layer 123.

[0147] The encapsulation layer 140 may include a first encapsulation layer 141 disposed on the component layer 130 and comprising an inorganic insulating material, a second encapsulation layer 142 disposed on the first encapsulation layer 141 and comprising an organic insulating material, and a third encapsulation layer 143 disposed on the second encapsulation layer 142 and comprising an inorganic insulating material.

[0148] The second substrate 200 may include a color filter layer 220 disposed on the second support substrate 210, a low refractive layer 230 disposed on a portion of the color filter layer 220, a first capping layer 240 covering the low refractive layer 230, a color conversion layer 250 disposed on the first capping layer 240, and a second capping layer 260 covering the color conversion layer 250.

[0149] The second support substrate 210 may include a display area DA (see...) Figure 1 ) and non-display area NDA (see Figure 1 ).

[0150] Along the direction of light emitted by the display device 10 (e.g., third direction DR3), a low-refractive-index layer 230 may be disposed on the color conversion layer 250, a color filter layer 220 may be disposed on the low-refractive-index layer 230, and a second support substrate 210 may be disposed on the color filter layer 220. Therefore, light emitted from the light-emitting element LE of the element layer 130 can pass through the color conversion layer 250, the low-refractive-index layer 230, the color filter layer 220, and the second support substrate 210 and be emitted to the outside.

[0151] Color conversion layer 250 can convert the wavelength of light emitted from light-emitting elements LE in some emission regions EA of element layer 130.

[0152] For example, the color conversion layer 250 can convert the light emitted from the light-emitting element LE in the first emission region EA1 from the fourth band to the first band, convert the light emitted from the light-emitting element LE in the second emission region EA2 from the fourth band to the second band, and can transmit and scatter the light emitted from the light-emitting element LE in the third emission region EA3.

[0153] The color filter layer 220 can transmit some wavelengths of light emitted from the color conversion layer 250 in the emission region EA.

[0154] For example, the color filter layer 220 can transmit light of the first wavelength in the first emission region EA1, light of the second wavelength in the second emission region EA2, and light of the third wavelength in the third emission region EA3.

[0155] For example, the color conversion layer 250 may include a first color conversion portion 251 disposed in a first emission region EA1, a second color conversion portion 252 disposed in a second emission region EA2, a light-transmitting portion 253 disposed in a third emission region EA3 (e.g., in at least a portion of the third emission region EA3), and a partition wall 254 disposed in a non-emission region NEA.

[0156] The first color conversion section 251 can convert the fourth-band light emitted from the light-emitting element LE in the first emission region EA1 into the first-band light.

[0157] The first color conversion section 251 may be a cured product of a first ink material comprising a matrix resin and first color conversion particles dispersed in the matrix resin. The first color conversion particles can convert light in the fourth band into light in the first band.

[0158] The second color conversion section 252 can convert the fourth-band light emitted from the light-emitting element LE in the second emission region EA2 into second-band light.

[0159] The second color conversion section 252 may be a cured product of a second ink material comprising a matrix resin and second color conversion particles dispersed in the matrix resin. The second color conversion particles can convert fourth-band light into second-band light.

[0160] The light-transmitting portion 253 can transmit and scatter the fourth-band light emitted from the light-emitting element LE in the third emission region EA3.

[0161] The light-transmitting portion 253 may include a matrix resin and scattering particles dispersed in the matrix resin.

[0162] The scattering particles can be metal oxide particles or organic particles.

[0163] The metal oxide particles can be at least one of titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), zinc oxide (ZnO), and tin oxide (SnO2).

[0164] The organic particles can be acrylic resin or urethane resin.

[0165] Each of the first color conversion section 251 and the second color conversion section 252 may further include scattering particles dispersed in the matrix resin.

[0166] Each of the first color conversion particle and the second color conversion particle can be at least one of quantum dots, quantum rods, and phosphors.

[0167] Quantum dots may include at least one of group IV element or compound nanocrystals, group II-VI compound nanocrystals, group III-V compound nanocrystals, group IV-VI compound nanocrystals, and combinations thereof.

[0168] The first color conversion portion 251, the second color conversion portion 252, and the light-transmitting portion 253 may include the same matrix resin, or they may include different matrix resins.

[0169] The partition wall 254 can be disposed between the first color conversion part 251, the second color conversion part 252 and the light-transmitting part 253.

[0170] The partition wall 254 may include organic materials.

[0171] The color conversion layer 250 can be disposed between the first cover layer 240 and the second cover layer 260 in the display area DA, and can therefore be sealed with a bonding structure of inorganic insulating material. Thus, the penetration of oxygen or moisture through the color conversion layer 250 can be reduced or delayed.

[0172] The low-refractive-index layer 230 can be superimposed on the emission region EA of the display region DA on the third-direction DR3.

[0173] The low-refractive layer 230 may include a dispersion of a transparent organic material TOM (see Figure 3 Hollow silica particles HL in ) (see Figure 3 ).

[0174] Therefore, the low-refractive-index layer 230 can have a refractive index in the range of about 1.0 to about 1.5. For example, the low-refractive-index layer 230 can have a refractive index in the range of about 1.1 to about 1.4.

[0175] Since the luminous efficiency of the second substrate 200 can be improved by using the low-refractive layer 230, the brightness and display quality of the display device 10 can be improved.

[0176] Color filter layer 220 may include a first color filter portion 221 disposed in the first emission region EA1 and transmitting light of the first wavelength band, a second color filter portion 222 disposed in the second emission region EA2 and transmitting light of the second wavelength band, a third color filter portion 223 disposed in the third emission region EA3 and transmitting light of the third wavelength band, and a third color filter portion 223 disposed in the non-emission region NEA and the non-display region NDA (see Figure 1 ) and the light blocking part 224 that blocks light.

[0177] Each of the first color filter section 221, the second color filter section 222, and the third color filter section 223 may include a coloring agent such as a dye or pigment. The coloring agent may be a material that absorbs light in bands other than a certain wavelength.

[0178] For example, the first color filter portion 221 can transmit light of the first band by including a colorant that absorbs light of bands other than the first band in the light transmitted through the color conversion layer 250.

[0179] The second color filter section 222 can transmit light of the second band by including a colorant that absorbs light of the band other than the second band in the light transmitted through the color conversion layer 250.

[0180] The third color filter section 223 can transmit light of the third band by including a colorant that absorbs light of the band other than the third band in the light transmitted through the color conversion layer 250.

[0181] The light-blocking portion 224 may include a structure in which two or more of the first color filter portion 221, the second color filter portion 222 and the third color filter portion 223 are stacked.

[0182] In another embodiment, the light-blocking portion 224 may include a light-absorbing material such as a black matrix material.

[0183] The filling layer 300 can fill the space between the first substrate 100 and the second substrate 200.

[0184] The filler layer 300 can be disposed between the encapsulation layer 140 of the first substrate 100 and the second capping layer 260 of the second substrate 200.

[0185] The filler layer 300 may include an organic material that is transparent and adhesive.

[0186] For example, the filler layer 300 may include Si-based organic materials or epoxy-based organic materials.

[0187] Figure 8 and Figure 9 It is according to the embodiment along Figure 1 A schematic cross-sectional view taken by line A-A'.

[0188] Except that the low-refractive-index layer 230 can be stacked on the third-direction DR3 without being overlaid with the non-display area NDA and only with the display area DA, Figure 8 The display device 10 of the embodiment shown can be used with Figures 1 to 7 The display device 10 shown in the embodiments is basically the same. Therefore, redundant descriptions will be omitted below.

[0189] according to Figure 8 In this embodiment, the luminous efficiency of the emitting region EA can be improved by using the low-refractive-index layer 230, and the distance from each side surface of the second support substrate 210 to the low-refractive-index layer 230 can be relatively long. Therefore, the penetration of oxygen or moisture through the low-refractive-index layer 230 can be further delayed or reduced.

[0190] Apart from Figure 9 The display device 10 may also include a frame-shaped dam portion DM disposed on the color filter layer 220 in the non-display area NDA and outside the display area DA in the plan view. Figure 9 The display device 10 of the embodiment shown can be used with Figures 1 to 8 The display device 10 shown in the embodiments is basically the same. Therefore, redundant descriptions will be omitted below.

[0191] according to Figure 9 In one embodiment, the low-refractive layer 230 may be disposed only in the area surrounded by the dam portion DM in the plan view.

[0192] Therefore, since the area of ​​the low-refractive layer 230 can be limited by the dam portion DM, the possibility that the low-refractive layer 230 would be positioned adjacent to the edge of the second support substrate 210 due to the diffusion of the material of the low-refractive layer 230 into the surrounding area can be eliminated. Thus, process defects in the process of setting the low-refractive layer 230 can be reduced, thereby improving the ease and simplicity of the process for setting the low-refractive layer 230.

[0193] As described above, according to the embodiment, the low-refractive-index layer 230 may be disposed only in the portion of the non-display area NDA adjacent to the display area DA and in the display area DA. Therefore, the low-refractive-index layer 230 may be completely covered by the first capping layer 240 disposed on the entire surface of the second support substrate 210. For example, the side surfaces of the low-refractive-index layer 230 may not be exposed to the outside.

[0194] Therefore, the permeation of oxygen or moisture through the low-refractive layer 230 of the transparent organic material TOM (see Figure 3 The penetration of ) can improve the lifespan and display quality of the display device 10.

[0195] Figure 10 This is a flowchart illustrating a method for manufacturing a display device 10 according to an embodiment. Figure 11 This illustrates an embodiment in Figure 10 The flowchart shows the process of preparing the second substrate 200. Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 It is shown Figure 10 and Figure 11 Some of the operation diagrams are shown.

[0196] Reference Figure 10 The method of manufacturing the display device 10 according to the embodiment may include the following steps: preparing a first substrate 100 (operation S10); preparing a second substrate 200 (operation S20); providing a sealing layer 400 on the first substrate 100 or the second substrate 200 (operation S30); and bonding the first substrate 100 and the second substrate 200 together using the sealing layer 400 (operation S40).

[0197] like Figure 19 As shown, the step of fabricating the first substrate 100 (operation S10) may include: forming a circuit layer 120 on the first support substrate 110; forming a component layer 130 on the circuit layer 120; and forming an encapsulation layer 140 on the component layer 130.

[0198] Reference Figure 11The steps of preparing the second substrate 200 according to the embodiment (operation S20) may include: providing a color filter layer 220 on the second support substrate 210 (operation S21); providing a low refractive layer 230 superimposed on the emission region EA on a portion of the color filter layer 220 (operation S22); and providing a first capping layer 240 covering the low refractive layer 230 by stacking inorganic insulating material on the color filter layer 220 (operation S23).

[0199] The step of preparing the second substrate 200 according to the embodiment (operation S20) may further include: setting a color conversion layer 250 on the first capping layer 240 (operation S24); and setting a second capping layer 260 covering the color conversion layer 250 by stacking inorganic insulating material on the first capping layer 240 (operation S25).

[0200] like Figure 12 , Figure 13 and Figure 14 As shown, the step of setting the color filter layer 220 (operation S21) may include: setting the second color filter portion 222 (see... Figure 12 ); Set the first color filter section 221 (see Figure 13 ); and setting the third color filter section 223 (see Figure 14 ).

[0201] like Figure 12 As shown, a second color filter portion 222 can be provided on the second support substrate 210 in the second emission region EA2.

[0202] In order to set up the light blocking part 224 (see Figure 7 ), and can also be used in the non-emission area NEA and the non-display area NDA (see Figure 1 Set the second color filter section 222 in ).

[0203] like Figure 13 As shown, a first color filter portion 221 can be disposed on a second support substrate 210 in the first emission region EA1.

[0204] In order to set up the light blocking part 224 (see Figure 7 ), and can also be used in the non-emission area NEA and the non-display area NDA (see Figure 1 The first color filter section 221 is provided on the second color filter section 222.

[0205] like Figure 14 As shown, a third color filter portion 223 can be provided on the second support substrate 210 in the third emission region EA3.

[0206] In order to set up the light blocking part 224 (see Figure 7), and can also be used in the non-emission area NEA and the non-display area NDA (see Figure 1 A third color filter section 223 is provided on the first color filter section 221.

[0207] As a result, in the non-emitting area (NEA) and the non-display area (NDA), the light blocking portion 224 can be configured such that the first color filter portion 221, the second color filter portion 222, and the third color filter portion 223 are stacked.

[0208] like Figure 15 As shown, in the step of setting the low-refractive layer 230 (operation S22), the low-refractive layer 230 can be superimposed on the third-direction DR3 with the display area DA, which includes the emitting areas EA (EA1, EA2, and EA3) and the non-emitting area NEA. The steps of setting the low-refractive layer 230 (operation S22) according to the embodiment will be described in detail below.

[0209] In the step of setting the first cover layer 240 (operation S23), the first cover layer 240 may include an inorganic insulating material covering the low refractive layer 230.

[0210] like Figure 16 and Figure 17 As shown, the step of setting the color conversion layer 250 (operation S24) may include: setting a partition wall 254 on the first cover layer 240 in the non-emitting region NEA; and setting a first color conversion portion 251 in the first emitting region EA1, setting a second color conversion portion 252 in the second emitting region EA2 and setting a light-transmitting portion 253 in the third emitting region EA3.

[0211] Reference Figure 16 In the step of setting the partition wall 254, the partition wall 254 can be set by partially removing the organic material on the first cover layer 240.

[0212] Reference Figure 17 The steps of setting the first color conversion portion 251, the second color conversion portion 252, and the light-transmitting portion 253 may include: a process of setting the first color conversion portion 251 by spraying a first ink material into a first emission region EA1 surrounded by a partition wall 254 and curing the first ink material; a process of setting the second color conversion portion 252 by spraying a second ink material into a second emission region EA2 surrounded by a partition wall 254 and curing the second ink material; and a process of setting the light-transmitting portion 253 by curing a light-transmitting material contained in a third emission region EA3 surrounded by a partition wall 254.

[0213] Reference Figure 18The step of setting a sealing layer 400 on the first substrate 100 or the second substrate 200 (operation S30) may include a process of setting a sealing material on the second cover layer 260 in the non-display area NDA of the second substrate 200.

[0214] The sealing layer 400 may be spaced apart from the display area DA and configured as a frame surrounding the display area DA.

[0215] Reference Figure 19 The method of manufacturing the display device 10 according to the embodiment may further include: bonding the first substrate 100 and the second substrate 200 ( Figure 10 Before operation S40, a filling layer 300 is provided on one of the first substrate 100 and the second substrate 200.

[0216] like Figure 2 As shown, in the step of joining the first substrate 100 and the second substrate 200 (operation S40), the space between the first substrate 100 and the second substrate 200 joined to each other by the sealing layer 400 can be filled with the filling layer 300.

[0217] The low-refractive layer 230 may include a dispersion of a transparent organic material TOM (see Figure 3 Hollow silica particles HL in ) (see Figure 3 Furthermore, the higher the content of hollow silica particles HL in the low-refractive layer 230, the lower the refractive index of the low-refractive layer 230.

[0218] For example, if the low-refractive layer 230 also contains photoinitiators for the exposure process, it may be detrimental to reducing the refractive index.

[0219] Therefore, it may be difficult to perform an exposure process on the low-refractive layer 230 to partially set the low-refractive layer 230.

[0220] Therefore, the following embodiments provide a method for manufacturing a display device 10 in which the low-refractive-index layer 230 can be partially disposed without performing an exposure process on the low-refractive-index layer 230.

[0221] Figure 20 This illustrates an embodiment in Figure 11 The flowchart for setting the low-refractive layer 230 (operation S22) is shown. Figure 21 , Figure 22 and Figure 23 It is shown Figure 20 A diagram illustrating the operation.

[0222] according to Figure 20 In an embodiment, the step of setting the low-refractive layer 230 (operation S22) may include the following steps: using a nozzle NZ (see...) Figure 21Set the target material layer OML (see) Figure 22 (Operation S211); and by curing the target material layer OML (see Figure 22 To set the low-refractive layer 230 (operation S212).

[0223] like Figure 21 and Figure 22 As shown, in the step of setting the target material layer OML (operation S211), the target material layer OML can be set on a portion of the color filter layer 220 by dripping the target material OM onto a portion of the color filter layer 220 via the nozzle NZ.

[0224] like Figure 23 As shown, in the step of setting the low refractive layer 230 (operation S212), the low refractive layer 230 can be prepared by performing a low-temperature heat treatment (HEAT) to cure the target material layer OML set on this portion of the color filter layer 220.

[0225] During the process of curing the target material layer OML, the heat treatment temperature can be a low temperature of less than or equal to about 130°C. For example, the heat treatment temperature can be about 110°C.

[0226] As mentioned above, Figure 20 , Figure 21 , Figure 22 and Figure 23 The embodiment shown has the advantage of being able to form the low-refractive-index layer 230 on a portion of the color filter layer 220 by using a nozzle NZ to apply the target material layer OML, without a separate masking process. On the other hand, since the target material layer OML is liquid-state in a portion for the use of the nozzle NZ, it may be difficult to set the low-refractive-index layer 230 in a specific area. For example, even if the target material layer OML drips into a specific area, the liquid target material layer OML may diffuse irregularly. Therefore, the edges of the low-refractive-index layer 230 may be partially deformed into a waveform different from the shape in which the target material layer OML drips.

[0227] Figure 24 This is a flowchart illustrating the operation (operation S20) of preparing the second substrate 200 according to an embodiment. Figure 25 , Figure 26 and Figure 27 It is shown Figure 20 and Figure 24 A diagram illustrating the operation.

[0228] In addition to the preparation of the second substrate 200 (operation S20), the operation may also include setting the dam portion DM before the step of setting the low-refractive layer 230 (operation S22) (see Figure 25 In addition to the steps in (operation S26), Figure 24 The embodiments can be related to Figure 11 The embodiments are basically the same. Therefore, redundant descriptions will be omitted below.

[0229] In addition to setting the low-refractive layer 230 (operation S22), the step can also include curing the target material layer OML ( Figure 20 Before operation S212, diffuse the target material OM (see...). Figure 26 In addition to, Figure 24 The embodiments can be related to Figure 20 The embodiments are basically the same. Therefore, redundant descriptions will be omitted below.

[0230] like Figure 25 As shown, in the step of setting the dam section DM (operation S26), the dam section DM can be set by partially removing the organic material on the color filter layer 220.

[0231] The dam section DM can be set on the color filter layer 220 in the non-display area NDA, can be spaced apart from the display area DA, and can be in the form of a frame surrounding the display area DA in the plan view.

[0232] like Figure 26 As shown, in setting the target material layer OML (see...) Figure 27 () Figure 20 In step S211, the target material OM can be dripped onto the area surrounded by the dam portion DM on the color filter layer 220 through the nozzle NZ.

[0233] like Figure 27 As shown, the target material OM, which is dropped onto the color filter layer 220, can diffuse uniformly over time in the area surrounded by the dam section DM. Therefore, a target material layer OML can be set.

[0234] The target material layer OML can be set only in the area surrounded by the dam section DM.

[0235] like Figure 9 and Figure 23 As shown, the low-refractive-index layer 230 can be prepared by curing a target material layer OML that is disposed on a portion of the color filter layer 220 and surrounded by the dam portion DM.

[0236] according to Figures 24 to 27 The disadvantage of this embodiment is that it adds a masking process for preparing the dam portion DM, and that the thinning and structural simplification are limited by setting the dam portion DM. On the other hand, since the target material layer OML can be prevented from diffusing to the outside of the dam portion DM, the setting defects of the low-refractive layer 230 can be reduced. As a result, the quality uniformity of the display device 10 can be improved.

[0237] Figure 28 This illustrates an embodiment in Figure 11 The flowchart for setting the low-refractive layer 230 (operation S22) is shown. Figure 29 , Figure 30 , Figure 31 , Figure 32 and Figure 33 It is shown Figure 28 A diagram illustrating the operation.

[0238] according to Figure 28 In an embodiment, the step of setting the low-refractive layer 230 (operation S22) may include the following steps: curing a target material layer OML (see [reference]) onto the color filter layer 220. Figure 29 To prepare a temporary material layer PML (see) Figure 30 (Operation S221); Set a mask material layer MSM on the temporary material layer PML (see...) Figure 31 (Operation S222); An etch mask ETM is prepared by removing the mask material layer MSM on the third-direction DR3, except for the portion that overlaps with the display area DA (see...). Figure 32 (Operation S223); and setting the low-refractive layer 230 by partially removing the temporary material layer PML according to the etch mask ETM (Operation S224).

[0239] like Figure 29 As shown, in the step of preparing the temporary material layer PML (operation S221), the target material layer OML can be set by applying the target material to the entire area of ​​the color filter layer 220. The target material layer OML can be set on the color filter layer 220 in the display area DA and the non-display area NDA of the second support substrate 210.

[0240] like Figure 30 As shown, in the step of preparing the temporary material layer PML (operation S221), the target material layer OML (see...) can be prepared by... Figure 29 Perform a low-temperature heat treatment (HEAT) to set a temporary material layer (PML).

[0241] The heat treatment temperature can be a low temperature of less than or equal to about 130°C. For example, the heat treatment temperature can be about 110°C.

[0242] like Figure 31 As shown, in the step of setting the mask material layer MSM (operation S222), the mask material layer MSM can be set by stacking mask material over the entire area of ​​the temporary material layer PML.

[0243] like Figure 32As shown, in the step of preparing the etched mask ETM (operation S223), the etched mask ETM can be set on a portion of the color filter layer 220 by partially exposing the mask material layer MSM by exposing the mask MSK and developing the mask material layer MSM.

[0244] For example, the exposure mask MSK may include at least a display area DA facing the second support substrate 210 and a blocking portion BK that blocks light, and an opening OP that transmits light as a portion other than the blocking portion BK.

[0245] The blocking portion BK can also face the portion of the non-display area NDA of the second support base 210 that is adjacent to the display area DA.

[0246] Therefore, the etched mask ETM can be superimposed on the third-direction DR3 at least with the display area DA of the second support substrate 210.

[0247] like Figure 33 As shown, in the step of setting the low refractive layer 230 (operation S224), the low refractive layer 230 can be prepared by removing the portion of the temporary material layer PML that is not covered by the etch mask ETM.

[0248] according to Figures 28 to 33 The embodiments, and Figure 20 Compared to the previous embodiment, it may have the disadvantage of requiring a masking process, and the portion of the color filter layer 220 not covered by the low-refractive layer 230 may be exposed to the etching process and thus damaged. On the other hand, since the low-refractive layer 230 can be configured to have a relatively uniform thickness, process defects in the step of setting the low-refractive layer 230 (operation S22) can be reduced.

[0249] Figure 34 This illustrates an embodiment in Figure 11 The flowchart for setting the low-refractive layer 230 (operation S22) is shown. Figure 35 , Figure 36 , Figure 37 , Figure 38 and Figure 39 It is shown Figure 34 A diagram illustrating the operation.

[0250] according to Figure 34 In an embodiment, the step of setting the low-refractive layer 230 (operation S22) may include the following steps: removing the sacrificial material layer SML on the color filter layer 220 (see Figure 35 The sacrificial layer SCL is set on the portion of the third-party DR3 that overlaps with the display area DA (see...). Figure 36 (Operation S231); Set a target material layer OML (see) on the color filter layer 220 to cover the sacrificial layer SCL. Figure 37 (Operation S232); A temporary material layer PML is prepared by curing the target material layer OML (see...). Figure 38 (Operation S233); and to set the low-refractive layer 230 by removing the portion of the temporary material layer PML that is set on the sacrificial layer SCL together with the sacrificial layer SCL (Operation S234).

[0251] like Figure 35 As shown, when setting the sacrificial layer SCL (see...) Figure 36 In step (operation S231), a sacrificial material layer SML can be set over the entire area of ​​the color filter layer 220.

[0252] like Figure 36 As shown, in the step of setting the sacrificial layer SCL (operation S231), the sacrificial material layer SML can be partially exposed by the exposure mask MSK and the sacrificial material layer SML can be developed to set the sacrificial layer SCL.

[0253] For example, the exposure mask MSK may include at least a display area DA facing the second support substrate 210 and an opening OP that transmits light, and a blocking portion BK that blocks light as a portion other than the opening OP.

[0254] The opening OP can also face the portion of the non-display area NDA of the second support substrate 210 that is adjacent to the display area DA.

[0255] Therefore, the sacrificial layer SCL can be disposed in another part of the non-display area NDA that contacts the edge of the second support substrate 210.

[0256] like Figure 37 As shown, in the step of setting the target material layer OML (operation S232), the target material layer OML can be prepared by applying the target material onto the color filter layer 220 and covering it with the sacrificial layer SCL.

[0257] like Figure 38 As shown, in the step of preparing the temporary material layer PML (operation S233), the target material layer OML (see...) can be prepared by... Figure 37 A temporary material layer, PML, was prepared by performing a low-temperature heat treatment (HEAT).

[0258] The heat treatment temperature can be a low temperature of less than or equal to about 130°C. For example, the heat treatment temperature can be about 110°C.

[0259] like Figure 39As shown, in the step of setting the low refractive layer 230 (operation S234), the low refractive layer 230 can be prepared by separating the portion of the temporary material layer PML set on the sacrificial layer SCL together with the sacrificial layer SCL from the color filter layer 220 by a peeling method.

[0260] according to Figures 34 to 39 In the embodiment shown, during the step of setting the low-refractive layer 230 (operation S234), the process of partially removing the temporary material layer PML can be performed without an etching process. Therefore, defects such as damage to portions of the color filter layer 220 not covered by the low-refractive layer 230 due to exposure to the etching process can be prevented. Furthermore, since the portion of the temporary material layer PML that overlaps with the sacrificial layer SCL on the third-direction DR3 is removed along with the sacrificial layer SCL, defects such as partially retaining a portion of the temporary material layer PML can be prevented.

[0261] Since the temporary material layer PML can be configured to have a relatively uniform thickness, and the sacrificial layer SCL can be configured to have a specific shape corresponding to the exposure mask MSK, the low-refractive layer 230 can be configured to have a relatively uniform thickness and shape. Therefore, process defects in the step of setting the low-refractive layer 230 (operation S22) can be further reduced.

[0262] In addition, according to Figures 34 to 39 In the embodiment shown, during the step of setting the low-refractive layer 230 (operation S234), the portion of the temporary material layer PML that is not peeled off along with the sacrificial layer SCL can be set as the low-refractive layer 230. Therefore, due to the peeling process, the edges of the low-refractive layer 230 can have a shape with irregular and small depressions and protrusions, partially torn or broken.

[0263] However, the effects of the disclosure are not limited to those described herein. The above and other effects of the disclosure will become more apparent to those skilled in the art by referring to the claims.

[0264] The display device according to an embodiment may include a first substrate and a second substrate facing each other. The second substrate may include a color filter layer on a second support substrate, a low-refractive-index layer disposed on a portion of the color filter layer, and a first capping layer disposed on the color filter layer, comprising an inorganic insulating material and covering the low-refractive-index layer. The electronic device according to an embodiment may include the display device described herein and a processor for transmitting image data signals to the display device.

[0265] The low-refractive layer may include a transparent organic material and hollow silica particles dispersed in the transparent organic material.

[0266] Since the first capping layer comprises an inorganic insulating material, the low-refractive-index layer can have a lower refractive index than the first capping layer.

[0267] As described above, according to the embodiment, since the low-refractive layer is only disposed on a portion of the color filter layer, the upper and side surfaces of the low-refractive layer can be completely covered by the inorganic insulating material of the first capping layer.

[0268] For example, since the transparent organic material of the low-refractive layer is encapsulated by the first capping layer, the permeation of oxygen or moisture through the low-refractive layer can be reduced or delayed.

[0269] Therefore, the lifespan and display quality of the display device can be improved.

[0270] The above description is an example of the disclosed technical features, and those skilled in the art will be able to make various modifications and variations. Therefore, the disclosed embodiments described above can be implemented individually or in combination with each other.

[0271] Therefore, the embodiments disclosed in this disclosure are not intended to limit the spirit of the disclosed technology, but rather to describe it, and the scope of the disclosed spirit of the technology is not limited by these embodiments. The scope of protection of the disclosure should be interpreted by the claims, and should be construed as including all equivalent spirit of the technology within the scope of the disclosure.

Claims

1. A display device comprising: a first substrate including a first support substrate including an emission region and a light-emitting element provided in the emission region; a second substrate facing the first substrate; and a sealing layer joining the first substrate and the second substrate together, wherein the second substrate includes: a second support substrate facing the first substrate; a color filter layer provided on one surface of the second support substrate; a low-refraction layer provided on a part of the color filter layer and in the emission region; and a first cover layer provided on the color filter layer, including an inorganic insulating material, and covering the low-refraction layer, and the low-refraction layer has a refractive index lower than that of the first cover layer.

2. The display device according to claim 1, wherein the low-refraction layer includes a transparent organic material and hollow silica particles dispersed in the transparent organic material, and the low-refraction layer has a refractive index in the range of 1.0 to 1.

5.

3. The display device according to claim 1, wherein each of the first support substrate and the second support substrate includes a display region in which the emission region is arranged and a non-display region provided around the display region, the display region includes a non-emission region between the emission regions, the color filter layer includes a light-blocking portion provided in the non-emission region and the non-display region and blocking light, and the low-refraction layer is provided in a part of the non-display region adjacent to the display region and in the display region.

4. The display device according to claim 3, wherein the sealing layer is provided in the non-display region, and the low-refraction layer is spaced apart from the sealing layer.

5. The display device according to claim 3, wherein the second substrate further includes a dam portion provided on the color filter layer in the non-display region and surrounding the display region in a plan view, and the low-refraction layer is provided in a region surrounded by the dam portion in a plan view.

6. The display device according to claim 3, wherein the emission region includes a first emission region emitting light of a first waveband, a second emission region emitting light of a second waveband lower than the first waveband, and a third emission region emitting light of a third waveband lower than the second waveband, the color filter layer further includes a first color filter portion provided in the first emission region and transmitting light of the first waveband, a second color filter portion provided in the second emission region and transmitting light of the second waveband, and a third color filter portion provided in the third emission region and transmitting light of the third waveband, and the light-blocking portion includes a structure in which two or more of the first color filter portion, the second color filter portion, and the third color filter portion are stacked.

7. The display device according to claim 6, wherein the light-emitting element emits light of a fourth waveband equal to or lower than the third waveband, ​ The second substrate further includes a color conversion layer provided on the first cover layer and a second cover layer including an inorganic insulating material and covering the color conversion layer provided on the first cover layer, and The color conversion layer includes: a first color conversion portion provided in the first emission region and converting light of the fourth waveband into light of the first waveband; a second color conversion portion provided in the second emission region and converting light of the fourth waveband into light of the second waveband; a light-transmitting portion provided in at least a part of the third emission region and transmitting light of the fourth waveband; and a partition wall provided between the first color conversion portion, the second color conversion portion, and the light-transmitting portion.

8. The display device according to claim 3, wherein The first substrate includes: a circuit layer provided on the first support substrate and including light-emitting pixel drivers electrically connected to the light-emitting elements, respectively; an element layer provided on the circuit layer and including the light-emitting elements; and an encapsulation layer covering the element layer, The element layer further includes an anode provided in the emission region, a pixel-defining layer provided in the non-emission region and covering an edge of the anode, a light-emitting layer provided on the anode and the pixel-defining layer, and a cathode provided on the light-emitting layer, and Each of the light-emitting elements has a structure in which the light-emitting layer is provided between the anode and the cathode facing each other.

9. A method of manufacturing a display device, the method including the steps of: preparing a first substrate including light-emitting elements provided in emission regions; preparing a second substrate; providing a sealing layer on the first substrate or the second substrate; and joining the first substrate and the second substrate together using the sealing layer, wherein The step of preparing the second substrate includes: providing a color filter layer on a second support substrate; providing a low-refraction layer on a part of the color filter layer and in the emission regions; and providing a first cover layer covering the low-refraction layer by stacking an inorganic insulating material on the color filter layer, and In the step of providing the low-refraction layer, the low-refraction layer has a lower refractive index than a refractive index of the first cover layer.

10. The method according to claim 9, wherein Each of the first substrate and the second substrate includes a display region in which the emission regions are arranged and a non-display region provided around the display region, The display region includes non-emission regions between the emission regions, In the step of providing the color filter layer, the color filter layer includes light-blocking portions provided in the non-emission regions and the non-display region and blocking light, and In the step of providing the low-refraction layer, the low-refraction layer is provided in a part of the non-display region adjacent to the display region and in the display region. In the step of providing the sealing layer, the sealing layer is provided in the non-display region.

11. The method of claim 10, wherein, In the step of providing the low-refraction layer, 12. The method of claim 10, wherein, ​ The low-refraction layer includes a transparent organic material and hollow silica particles dispersed in the transparent organic material, and The low-refraction layer has a refractive index in the range of 1.0 to 1.

5.

13. The method of claim 12, wherein, The step of providing the low-refraction layer includes: providing a target material layer on a portion of the color filter layer by dropping a target material through a nozzle; and curing the target material layer.

14. The method according to claim 13, wherein The step of preparing the second substrate further includes: providing a dam portion spaced apart from the display region and surrounding the display region on the color filter layer in the non-display region before the step of providing the low-refraction layer, and The step of providing the target material layer includes spreading the target material dropped on the color filter layer in a region surrounded by the dam portion.

15. The method of claim 12, wherein, The step of providing the low-refraction layer includes: providing a target material layer on a portion of the color filter layer by dropping a target material through a nozzle; and preparing a temporary material layer by curing the target material layer on the color filter layer; providing a mask material layer on the temporary material layer; preparing an etching mask by removing the mask material layer except for a portion at least overlapping the display region in a plan view; and partially removing the temporary material layer using the etching mask.

16. The method of claim 12, wherein, The step of providing the low-refraction layer includes: providing a sacrificial layer by removing a portion of a sacrificial material layer on the color filter layer at least overlapping the display region in a plan view; providing a target material layer covering the sacrificial layer on the color filter layer; preparing a temporary material layer by curing the target material layer; and removing a portion of the temporary material layer provided on the sacrificial layer together with the sacrificial layer.

17. A method of manufacturing a display device, the method including the steps of: preparing a first substrate including a light emitting element provided in an emission region of a display region; preparing a second substrate; providing a sealing layer on the first substrate or the second substrate; and joining the first substrate and the second substrate together using the sealing layer, wherein the step of preparing the second substrate includes: providing a color filter layer on a second support substrate; providing a sacrificial layer by removing a portion of a sacrificial material layer on the color filter layer at least overlapping the display region in a plan view; providing a target material layer covering the sacrificial layer on the color filter layer; preparing a temporary material layer by curing the target material layer; and providing a low-refraction layer on a portion of the color filter layer and in the emission region by removing a portion of the temporary material layer provided on the sacrificial layer together with the sacrificial layer.

18. The method according to claim 17, wherein The step of preparing the second substrate further includes: providing a first cap layer covering the low-refraction layer by stacking an inorganic insulating material on the color filter layer, and In the step of providing the low-refraction layer, the low-refraction layer has a lower refractive index than a refractive index of the first cap layer, The low-refraction layer includes a transparent organic material and hollow silica particles dispersed in the transparent organic material, and The low-refraction layer includes a transparent organic material and hollow silica particles dispersed in the transparent organic material, and The low-refraction layer has a refractive index in the range of 1.0 to 1.

5.

19. The method of claim 18, wherein, the second support substrate includes the display area in which the emission areas are disposed and a non-display area disposed around the display area, the display area includes a non-emission area between the emission areas, in the step of disposing the color filter layer, the color filter layer includes a light-blocking portion disposed in the non-emission area and the non-display area and blocking light, in the step of disposing the low-refraction layer, the low-refraction layer is disposed in a portion of the non-display area adjacent to the display area and in the display area, and in the step of disposing the sealing layer, the sealing layer is disposed in the non-display area.

20. An electronic device comprising: a display device; and a processor that transmits an image data signal to the display device, wherein the display device includes: a first substrate including a first support substrate including emission areas and light emitting elements disposed in the emission areas; a second substrate facing the first substrate; and a sealing layer that bonds the first substrate and the second substrate together, wherein the second substrate includes: a second support substrate facing the first substrate; a color filter layer disposed on one surface of the second support substrate; a low-refraction layer disposed on a portion of the color filter layer and in the emission areas; and a first cover layer disposed on the color filter layer, including an inorganic insulating material, and covering the low-refraction layer, and the low-refraction layer has a refractive index lower than a refractive index of the first cover layer.

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