Display device and electronic device including the same

Abstract

The invention relates to a display device and an electronic device including the same. The display device includes: a display panel including a substrate and a display unit; a circuit board connected to the substrate; a reinforcing member disposed on the substrate and extending from the circuit board toward the display unit; a protection member disposed on the substrate and extending from the display unit toward the circuit board to contact the reinforcement member; and a protective film provided to cover the reinforcing member, and in which a removed region exposing a portion of the reinforcing member is formed, in which the removed region is defined in the vicinity (aside) of a contact surface in which the reinforcing member and the protective member are in contact with each other.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0122558, filed on September 9, 2024, and Korean Patent Application No. 10-2025-0001918, filed on January 7, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices and electronic devices including display devices. Background Technology

[0004] Typically, electronic devices such as smartphones, tablet PCs (“PCs”), digital cameras, laptop computers, navigation devices, and smart TVs (“TVs”) include organic light-emitting display devices for displaying images.

[0005] Organic light-emitting diode (OLED) displays offer advantages such as good brightness, relatively low driving voltage, relatively fast response speed, and wide color reproduction range, and are therefore used in a variety of devices, including smartphones. An OLED display includes a display panel configured with multiple pixels and circuitry units that provide signals to the display panel.

[0006] The display panel is configured with signal lines that transmit signals for realizing images and a substrate on which switching elements for driving pixels are formed.

[0007] The circuit unit is configured with a system, a control board, and a driver board. The system provides signals and power for realizing the image. The control board includes a driver that converts the signals provided by the system into signals to be provided to the display panel. The driver board processes the converted signals from the control board and sends them to the display panel.

[0008] The drive circuit board can be electrically connected to the substrate of the display panel. Reinforcing members and protective members can be disposed on the substrate of the display panel, and a protective film for protecting the reinforcing members can be disposed on the reinforcing members. Summary of the Invention

[0009] The present disclosure provides a display device and an electronic device including the display device, wherein a protective film disposed on a reinforcing member can be easily separated from the reinforcing member.

[0010] However, the features of this disclosure are not limited to those set forth herein. These and other features of the disclosure will become more apparent to those skilled in the art upon reference to the detailed description of the disclosure given below.

[0011] In embodiments of this disclosure, the display device includes: a display panel including a substrate and display units; a circuit board connected to the substrate; a reinforcing member disposed on the substrate and extending from the circuit board toward the display units; a protective member disposed on the substrate and extending from the display units toward the circuit board to contact the reinforcing member; and a protective film disposed to cover the reinforcing member, and defining a removal area in the protective film for portions exposing the reinforcing member. The removal area is defined near (beside) the contact surfaces where the reinforcing member and the protective member contact each other.

[0012] In this embodiment, the removal area is located on the boundary line between the reinforcing member and the substrate.

[0013] In an implementation, the removal area is defined by: a first removal surface, configured to be parallel to the boundary line; a second removal surface, configured to intersect the boundary line; and a third removal surface, configured to be spaced apart from the first removal surface, such that the boundary line is located between the third removal surface and the first removal surface.

[0014] In one embodiment, the distance from the boundary line to the first removal surface is made shorter than the distance from the boundary line to the third removal surface.

[0015] In one embodiment, the distance between the contact surface and the second removal surface is made longer than the distance between the boundary line and the first removal surface.

[0016] In one embodiment, the protective film extends to the outside of the substrate, and the third removal surface is disposed on the outside of the substrate.

[0017] In one embodiment, the width of the reinforcing member in the first direction is formed to be smaller than the width of the substrate in the first direction, and one side and the other side of the reinforcing member in the first direction are disposed inside the substrate.

[0018] In one embodiment, the protective film extends from the periphery of one side of the reinforcing member in the first direction to the outer side of the substrate, and the removal area is defined on the boundary line between the other side of the reinforcing member and the substrate.

[0019] In one embodiment, one side of the protective film in the first direction is spaced apart from the boundary line between the side of the reinforcing member and the substrate.

[0020] In one embodiment, the protective film extends in a first direction such that one side and the other side of the protective film in the first direction are disposed on the outer side of the substrate, and a plurality of removal regions are provided, thereby providing a plurality of removal regions, the plurality of removal regions including a first removal region and a second removal region, the first removal region being defined on the boundary line between the other side of the reinforcing member and the substrate, and the second removal region being defined on the boundary line between one side of the reinforcing member and the substrate.

[0021] In an embodiment, the first removal region is defined by: a first-first removal surface configured to be parallel to the boundary line between the other side of the reinforcing member and the substrate; a first-second removal surface configured to intersect the boundary line between the other side of the reinforcing member and the substrate; and a first-third removal surface configured to be spaced apart from the first-first removal surface, such that the boundary line between the other side of the reinforcing member and the substrate is located between the first-third removal surface and the first-first removal surface.

[0022] In one embodiment, the distance between the boundary line between the other side of the reinforcing member and the substrate and the first-first removal surface is formed to be shorter than the distance between the boundary line between the other side of the reinforcing member and the substrate and the first-third removal surface.

[0023] In one embodiment, the distance between the contact surface and the first-second removal surface is formed to be longer than the distance between the boundary line between the other side of the reinforcing member and the substrate and the first-first removal surface.

[0024] In this embodiment, the first to third removal surfaces are disposed on the outer side of the substrate.

[0025] In an embodiment, the second removal region is defined by: a second-first removal surface configured to be parallel to the boundary line between one side of the reinforcing member and the substrate; a second-second removal surface configured to intersect the boundary line between one side of the reinforcing member and the substrate; and a second-third removal surface configured to be spaced apart from the second-first removal surface, such that the boundary line between one side of the reinforcing member and the substrate is located between the second-third removal surface and the second-first removal surface.

[0026] In one embodiment, the distance between the boundary line between one side of the reinforcing member and the substrate and the second-first removal surface is formed to be shorter than the distance between the boundary line between one side of the reinforcing member and the substrate and the second-third removal surface.

[0027] In one embodiment, the distance from the contact surface to the second-second removal surface is formed to be longer than the distance from the boundary line between one side of the reinforcing member and the substrate to the second-first removal surface.

[0028] In this embodiment, the second and third removal surfaces are disposed on the outer side of the substrate.

[0029] In embodiments of this disclosure, an electronic device includes: a display panel including a substrate and a display unit; a circuit board connected to the substrate; a reinforcing member disposed on the substrate and extending from the circuit board toward the display unit; a protective member disposed on the substrate and extending from the display unit toward the circuit board to contact the reinforcing member; and a protective film disposed to cover the reinforcing member, and having formed at least one removal area in the protective film for exposing portions of the reinforcing member, wherein the at least one removal area is defined at the periphery of a contact area where the reinforcing member and the protective member contact each other.

[0030] In one embodiment, at least one removal area is disposed on the boundary line between the reinforcing member and the substrate.

[0031] In embodiments of this disclosure, by forming a removal region in the protective film as disposed on the boundary line between the reinforcing member and the substrate, the protective film can be easily separated from the reinforcing member even when the protective member penetrates into the boundary line between the reinforcing member and the substrate.

[0032] The effects of the embodiments of this disclosure are not limited to those mentioned above, and many more effects are included in the following description of this disclosure. Attached Figure Description

[0033] The above and other advantages and features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which: Figure 1 This is a perspective view of an embodiment of the electronic device according to the present disclosure; Figure 2 This is a plan view of an embodiment of the display device according to the present disclosure; Figure 3 It is along Figure 2 A sectional view cut by line A-A'; Figure 4 It is shown schematically. Figure 3 A cross-sectional view of the display panel; Figure 5 It is shown in Figure 2 A plan view showing the state in which the protective film of the first embodiment is provided; Figure 6 yes Figure 5 A magnified view of part B; Figure 7 yes Figure 5 A magnified view of part C; Figure 8 It is shown in Figure 2 A plan view showing the state in which the protective film of the second embodiment is provided; Figure 9 yes Figure 8A magnified view of part D; and Figure 10 yes Figure 8 A magnified view of part E. Detailed Implementation

[0034] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become apparent from the following description of embodiments with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed herein, but can be implemented in various different ways. Embodiments are provided to make the disclosure thorough and to fully convey the scope of this disclosure to those skilled in the art. It should be noted that the scope of this disclosure is defined only by the claims.

[0035] As used herein, the phrase "element A on element B" means that element A can be directly disposed on element B, and / or element A can be indirectly disposed on element B via another element C. Throughout the description, the same reference numerals denote the same elements. The figures, dimensions, ratios, angles, and number of elements given in the figures are illustrative only and not limiting.

[0036] Terms such as "first" and "second" are used to arbitrarily distinguish between the elements described by these terms, and therefore these terms are not necessarily intended to indicate the temporal or other priorities of these elements. These terms are used only to distinguish one element from another. Therefore, within the scope of this disclosure, as used herein, a first element may be a second element.

[0037] Features of the various embodiments of this disclosure can be combined in part or in whole. As will be clearly understood by those skilled in the art, various technical interactions and operations are possible. The various embodiments can be implemented individually or in combination.

[0038] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0039] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0040] refer to Figure 1In embodiments of this disclosure, electronic device 1 may include various electronic devices that provide a display screen. In these embodiments, electronic device 1 may include, but is not limited to, mobile phones, smartphones, tablet personal computers (“PCs”), mobile communication terminals, electronic notebooks, e-books, personal digital assistants (“PDAs”), portable multimedia players (“PMPs”), navigation devices, ultra-mobile PCs (“UMPCs”), televisions, game consoles, wristwatches, head-mounted displays, personal computer monitors, laptops, vehicle dashboards, digital cameras, camcorders, outdoor billboards, electronic billboards, various medical devices, various examination devices, various household appliances including display areas such as refrigerators and washing machines, Internet of Things (“IoT”) devices, etc.

[0041] Electronic device 1 may include a display area DA and a non-display area NDA. When viewed from above, the shape of the display area DA may conform to the shape of electronic device 1. In an embodiment, for example, when electronic device 1 has a quadrilateral shape (e.g., a rectangular shape) when viewed from above, the display area DA may also have a quadrilateral shape (e.g., a rectangular shape).

[0042] The display area DA may include multiple pixels to display an image. The non-display area NDA may not display an image because it does not contain pixels. The non-display area NDA may be disposed around the display area DA. The non-display area NDA may surround the display area DA, but embodiments of this disclosure are not limited thereto. The display area DA may be partially surrounded by the non-display area NDA.

[0043] The electronic device 1 in the embodiments of this disclosure may include a display device 10.

[0044] Figure 2 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 3 It is along Figure 2 A sectional view cut by line A-A'.

[0045] In embodiments of this disclosure, the display device 10 is used to display moving or still images. The display device 10 can be used as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, e-notebooks, e-book readers, PMPs, navigation devices, and UMPCs, as well as a display screen for various products such as televisions, laptops, monitors, billboards, and IoT devices. In an alternative embodiment, the display device 10 can be used as a display screen for a central dashboard in a vehicle.

[0046] Display device 10 may be a light-emitting display device (such as an organic light-emitting display device using an organic light-emitting diode (“OLED”), a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, and a micro light-emitting display device using micro light-emitting diodes (“LED”)). In the following description, an organic light-emitting display device is described in an embodiment of display device 10. However, it should be understood that this disclosure is not limited thereto.

[0047] When viewed from above, the first direction D1 may be parallel to one side of the display device 10 (e.g., the horizontal direction of the display device 10). When viewed from above, the second direction D2 may be parallel to the other side that contacts one side of the display device 10 (e.g., the vertical direction of the display device 10). The third direction D3 may refer to the thickness direction of the display device 10.

[0048] When viewed from above, the display device 10 may have a square shape, such as a rectangle. In an embodiment, for example, when viewed from above, the display device 10 may have a rectangular shape having a long side in a first direction D1 and a short side in a second direction D2. The corner where the long side in the first direction D1 meets the short side in the second direction D2 may be rounded with a predetermined curvature or may be a right angle. When viewed from above, the shape of the display device 10 is not limited to a quadrilateral shape (e.g., a rectangular shape), but may be formed in another polygonal shape, a circular shape, or an elliptical shape.

[0049] refer to Figure 2 and Figure 3 The display device 10 in the embodiments of this disclosure may include a cover window 100, a display panel 200, a panel bottom component 300, a circuit board 500, a reinforcing component 600, a protective component 700, a driving circuit 800, and a cover component 900.

[0050] Cover window 100 may include a material with relatively high light transmittance. Cover window 100 may include a polymer resin such as polyimide or glass. Cover window 100 may be attached to the polarizing film PF of display panel 200 by an adhesive member such as an optically clear adhesive (“OCA”) film.

[0051] The display panel 200 can be disposed below the cover window 100. When viewed from above, the display panel 200 can have a quadrilateral shape (e.g., a rectangular shape having a long side in a first direction D1 and a short side in a second direction D2). In the display panel 200, the corner where the long side in the first direction D1 meets the short side in the second direction D2 can be a right angle or can be rounded with a predetermined curvature. When viewed from above, the display panel 200 can have a quadrilateral shape other than a rectangle, a polygonal shape other than a quadrilateral shape, a circular shape, an elliptical shape, or an irregular shape.

[0052] The display panel 200 may include a display area in which multiple emitting regions for emitting light are arranged, and a non-display area disposed around the display area. The non-display area may surround the display area. Multiple display pads may be disposed in the non-display area at one edge of the display panel 200.

[0053] The display panel 200 may include a substrate SUB, a display unit PAL, a sensor unit SENL, and a polarizing film PF.

[0054] The substrate SUB can include insulating materials such as glass, quartz, and polymer resin, or be composed of insulating materials such as glass, quartz, and polymer resin. The substrate SUB can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc. The substrate SUB can extend further in one direction than the display unit PAL, sensor unit SENL, and polarizing film PF disposed on the top portion.

[0055] The display unit (PAL) can be disposed on the substrate (SUB). The display unit (PAL) can be a layer comprising multiple emitting regions that emit light. The display unit (PAL) may include a buffer film, a thin-film transistor layer on which thin-film transistors are disposed, a light-emitting element layer, and an encapsulation layer for encapsulating the light-emitting element layer.

[0056] The sensor unit SENL can be mounted on the display unit PAL. The sensor unit SENL may include sensor electrodes and can sense whether a user is touching the screen.

[0057] A polarizing film PF can be disposed on the sensor unit SENL. The polarizing film PF can prevent the degradation of image visibility of the display panel 200 due to reflection of external light. The polarizing film PF may include a linear polarizer and a phase retardation film such as a quarter-wavelength plate. The phase retardation film can be disposed on the sensor unit SENL, and the linear polarizer can be disposed on the phase retardation film. A cover window 100 can be disposed on the polarizing film PF.

[0058] The bottom panel member 300 may be disposed below the substrate SUB. The bottom panel member 300 may be attached to the lower surface of the substrate SUB via an adhesive layer (not shown). The adhesive layer (not shown) may be a pressure-sensitive adhesive (“PSA”). The bottom panel member 300 may include at least one of a light-absorbing member for absorbing light incident from the outside, a buffer member for absorbing external impacts, and a heat-dissipating member for effectively dissipating heat from the display panel 200.

[0059] A light-absorbing component may be disposed beneath the substrate SUB. The light-absorbing component blocks light transmission to prevent components disposed beneath it (such as circuit board 500) from being seen from above the display panel 200. The light-absorbing component may comprise a light-absorbing material such as black pigment and black dye.

[0060] A buffer member can be disposed below the light-absorbing member. The buffer member absorbs external impacts to prevent damage to the display panel 200. The buffer member can be composed of a single layer or multiple layers. In embodiments, for example, the buffer member can include or be composed of polymer resins such as polyurethane, polycarbonate, polypropylene, and polyethylene, or can include or be composed of elastic materials (such as rubber and a sponge obtained by foaming a urethane-based material or an acrylic-based material).

[0061] The heat dissipation component can be disposed below the buffer component. The heat dissipation component may include a first heat dissipation layer and a second heat dissipation layer, wherein the first heat dissipation layer includes graphite or carbon nanotubes, and the second heat dissipation layer includes or is composed of a thin metal film such as copper, nickel, ferrite and silver, which can block electromagnetic waves and has relatively high thermal conductivity.

[0062] When the substrate SUB is bent, the circuit board 500 can overlap with the bottom panel member 300. The circuit board 500 is a flexible printed circuit board (“FPCB”), a rigid and inflexible rigid printed circuit board (“PCB”), or a hybrid printed circuit board including both rigid and flexible printed circuit boards.

[0063] The circuit board 500 can process the signal converted in the control circuit board (not shown) and send it to the display panel 200. The circuit board 500 can be electrically connected to the substrate SUB.

[0064] The reinforcing member 600 may be disposed on the substrate SUB and extend on the substrate SUB from the circuit board 500 toward the display unit PAL. In an embodiment, for example, the reinforcing member 600 may extend on the substrate SUB in a first direction D1 and a second direction D2. The reinforcing member 600 is located on one side in the second direction D2 (…). Figure 2 The lower side of the middle part can contact the circuit board 500, and the reinforcing member 600 on the other side of the second direction D2 ( Figure 2 The upper side of the display unit (PAL) can extend along the second direction D2 toward the display unit PAL.

[0065] The width of the reinforcing member 600 in the first direction D1 may be smaller than the width of the substrate SUB in the first direction D1. In some embodiments, since the reinforcing member 600 is formed to have a width in the first direction D1 smaller than the width of the substrate SUB in the first direction D1, the sides of the reinforcing members 600 that are opposite each other in the first direction D1 ( Figure 2 (left side) and the other side ( Figure 2 The reinforcing member 600 (on the right side of the substrate SUB) can be disposed inside the substrate SUB (e.g., the reinforcing member 600 extends in the first direction D1 without exceeding the substrate SUB). The boundary line between the reinforcing member 600 and the substrate SUB can be parallel in the second direction D2.

[0066] The reinforcing member 600 may overlap with the drive circuit 800 and may prevent stress caused by bending of the substrate SUB from being transmitted to the drive circuit 800. The reinforcing member 600 may include stainless steel.

[0067] The protective member 700 can be disposed on the substrate SUB and extends from the display unit PAL, sensor unit SENL, and polarizing film PF toward the circuit board 500, and contacts the reinforcing member 600. In an embodiment, for example, the protective member 700 can extend on the substrate SUB in a first direction D1 and a second direction D2. The protective member 700 is located on the other side of the second direction D2 ( Figure 2 The upper side of the protective member 700 can contact the display unit PAL, the sensor unit SENL, and the polarizing film PF, and the protective member 700 is located on one side in the second direction D2. Figure 2 The lower side of the circuit board 500 can extend along the second direction D2 toward the reinforcing member 600.

[0068] The width of the protective member 700 in the first direction D1 can be formed to correspond to the width of the substrate SUB in the first direction D1. The contact surface between the protective member 700 and the reinforcing member 600 can be parallel to the first direction D1. In some embodiments, the contact surface between the protective member 700 and the reinforcing member 600 can be formed to intersect with the second direction D2.

[0069] The protective member 700 can be a bending protective layer. When the substrate SUB bends, the protective member 700 can bend along with the substrate SUB. The protective member 700 can prevent the bent portion of the substrate SUB from being damaged by external impacts or prevent foreign objects from entering. The protective member 700 shown in the figure is only one embodiment, and the shape of the protective member 700 can be changed as needed.

[0070] Protective member 700 may include a plastic film as a base layer. Protective member 700 may include plastic films such as polyethersulfone (“PES”), polyacrylate (“PA”), polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyethylene terephthalate (“PET”), polyphenylene sulfide (“PPS”), polyallyl ester, polyimide (“PI”), polycarbonate (“PC”), polyaryl ether sulfone, and any of the combinations thereof. The materials constituting protective member 700 are not limited to plastic resins and may include organic / inorganic composite materials. Protective member 700 may include a porous organic layer and inorganic material filling the pores of the organic layer. Protective member 700 may include a single-layer structure or a multi-layer structure.

[0071] The driving circuit 800 can receive control signals and power supply voltages through the circuit board 500, and generate and output signals and voltages for driving the display panel 200. The driving circuit 800 can be formed as an integrated circuit (“IC”) and electrically connected to the substrate SUB and the circuit board 500. The driving circuit 800 can be disposed on the reinforcing member 600 and overlap with the reinforcing member 600.

[0072] The cover member 900 may be configured to cover portions of the drive circuit 800, the circuit board 500, and the reinforcing member 600. In one embodiment, for example, a portion of the cover member 900 may be disposed on the reinforcing member 600, and the remaining (other) portions of the cover member 900 may be disposed on the circuit board 500 and configured to cover the entire drive circuit 800 disposed on the reinforcing member 600. The cover member 900 may protect the drive circuit 800 from external impacts.

[0073] Figure 4 It is shown schematically. Figure 3 A cross-sectional view of the display panel.

[0074] refer to Figure 4 The display unit PAL may include a buffer film 202, a thin film transistor layer 203, a light-emitting element layer 204, and an encapsulation layer 205.

[0075] A buffer film 202 can be formed on a substrate SUB. The buffer film 202 can be formed on the substrate SUB to protect the thin-film transistor 235 and the light-emitting element from moisture penetration through the moisture-sensitive substrate SUB. The buffer film 202 may comprise or consist of a plurality of alternately stacked inorganic layers. In an embodiment, for example, the buffer film 202 may comprise a silicon oxide film (SiO2). x ), silicon nitride film (SiN) x Multiple films consisting of one or more inorganic films, such as silicon oxide films (SiON) and silicon oxynitride films (SiO2), stacked alternately, or consisting of silicon oxide films (SiO2) and silicon oxynitride films (SiON). x ), silicon nitride film (SiN) x It consists of multiple films, one or more of which are inorganic films, such as silicon oxynitride (SiON) films, stacked alternately. Buffer film 202 can be omitted.

[0076] The thin-film transistor layer 203 can be disposed on the buffer film 202. The thin-film transistor layer 203 includes a thin-film transistor 235, a gate insulating film 236, an interlayer insulating film 237, a protective film 238, and an organic film 239.

[0077] Each of the thin-film transistors 235 includes an active layer 231, a gate electrode 232, a source electrode 233, and a drain electrode 234. Figure 4 The example illustrates a thin-film transistor 235 formed with a top-gate configuration where the gate electrode 232 is disposed on top of the active layer 231. However, it should be noted that this disclosure is not limited thereto. That is, the thin-film transistor 235 may be formed with a bottom-gate configuration where the gate electrode 232 is disposed on the bottom of the active layer 231, or with a dual-gate configuration where the gate electrode 232 is disposed on both the top and bottom of the active layer 231.

[0078] An active layer 231 is formed on the buffer film 202. The active layer 231 may comprise a silicon-based semiconductor material or an oxide-based semiconductor material, or be composed of either a silicon-based semiconductor material or an oxide-based semiconductor material. In embodiments, for example, the active layer 231 may comprise polycrystalline silicon, amorphous silicon, or an oxide semiconductor, or be composed of either polycrystalline silicon, amorphous silicon, or an oxide semiconductor. A light-blocking layer for blocking external light from incident on the active layer 231 may be formed between the buffer film 202 and the active layer 231.

[0079] The gate insulating film 236 can be formed on the active layer 231. The gate insulating film 236 may include an inorganic film (e.g., a silicon oxide film (SiO2)). x ), silicon nitride film (SiN) x (or multiple films thereof) or inorganic films (e.g., silicon oxide films (SiO2) x ), silicon nitride film (SiN) xIt consists of (or multiple membranes).

[0080] The gate electrode 232 may be formed on the gate insulating film 236. The gate electrode 232 and the gate line may be formed as a single layer or multiple layers, which may include any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or any alloy thereof, or be composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or any alloy thereof.

[0081] An interlayer insulating film 237 can be formed on the gate electrode 232 and the gate line. The interlayer insulating film 237 may include an inorganic film (e.g., a silicon oxide film (SiO2)). x ), silicon nitride film (SiN) x (or multiple films thereof) or made of inorganic films (e.g., silicon oxide films (SiO2) x ), silicon nitride film (SiN) x It consists of (or multiple membranes).

[0082] Source electrode 233 and drain electrode 234 may be formed on interlayer insulating film 237. Each of source electrode 233 and drain electrode 234 may be connected to active layer 231 through contact holes passing through gate insulating film 236 and interlayer insulating film 237. Source electrode 233 and drain electrode 234 may be formed as a single layer or multiple layers, which may include any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or any alloy thereof, or be composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or any alloy thereof.

[0083] A protective film 238 for insulating the thin-film transistor 235 can be formed on the source electrode 233 and the drain electrode 234. The protective film 238 may include an inorganic film (e.g., a silicon oxide film (SiO2)). x ), silicon nitride film (SiN) x (or multiple films thereof) or made of inorganic films (e.g., silicon oxide films (SiO2) x ), silicon nitride film (SiN) x It consists of (or multiple membranes).

[0084] An organic film 239 for planarizing the steps caused by the thin-film transistor 235 can be formed on the protective film 238. The organic film 239 may include organic films such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc., or may be composed of organic films such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0085] The light-emitting element layer 204 is formed on the thin-film transistor layer 203. The light-emitting element layer 204 includes a light-emitting element and a diaphragm.

[0086] The light-emitting element and the embankment are formed on the organic film 239. An example of the light-emitting element is an organic light-emitting element including an anode electrode 241, a light-emitting layer 242, and a cathode electrode 243.

[0087] The anode electrode 241 can be formed on the organic film 239. The anode electrode 241 can be connected to the drain electrode 234 of the thin-film transistor 235 through contact holes passing through the protective film 238 and the organic film 239.

[0088] A dam can be formed to cover the edge of the anode electrode 241 on the organic film 239 to separate the emission region EA of the pixel. That is, the dam is used to define the emission region EA of the pixel. Each of the pixels in which the anode electrode 241, the light-emitting layer 242, and the cathode electrode 243 are stacked in sequence indicates the area in which holes from the anode electrode 241 and electrons from the cathode electrode 243 recombine with each other in the light-emitting layer 242 to emit light.

[0089] A light-emitting layer 242 is formed on the anode electrode 241 and the diaphragm. The light-emitting layer 242 can be an organic light-emitting layer. The light-emitting layer 242 can emit one of red, green, and blue light. In an alternative embodiment, the light-emitting layer 242 can be a white light-emitting layer that emits white light. In this case, the light-emitting layer 242 can have a structure in which red, green, and blue light-emitting layers are stacked, and can be a common layer formed for multiple pixels. In this case, the display panel 200 may also include separate color filters for displaying red, green, or blue colors.

[0090] The light-emitting layer 242 may include a hole transport layer, a light-emitting layer, and an electron transport layer. Furthermore, the light-emitting layer 242 may be formed in a series structure of two or more stacks, in which case a charge-generating layer may be formed between the stacks.

[0091] A cathode electrode 243 is formed on the light-emitting layer 242. The cathode electrode 243 may be formed to cover the light-emitting layer 242. The cathode electrode 243 may be a common layer formed for multiple pixels.

[0092] When the light-emitting element layer 204 is formed by a top-emission method that emits light upwards, the anode electrode 241 may include or be composed of a metallic material with relatively high reflectivity. For example, the anode electrode 241 may have a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). Furthermore, the cathode electrode 243 may comprise a transparent conductive material (“TCO”) that transmits light (such as indium tin oxide (“ITO” or indium zinc oxide (“IZO”)) or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag), or may be composed of a transparent conductive material (“TCO”) that transmits light (“ITO” or indium zinc oxide (“IZO”)) or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag)). When the cathode electrode 243 comprises or is composed of a semi-transmissive conductive material, the luminous efficiency can be improved due to the microcavity effect.

[0093] When the light-emitting element layer 204 is formed by a bottom emission method that emits light downwards, the anode electrode 241 may include a transparent conductive material (“TCO”) (such as ITO or IZO) or a semi-transparent conductive material (such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag), or be composed of a transparent conductive material (“TCO”) (such as ITO or IZO) or a semi-transparent conductive material (such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). The cathode electrode 243 may comprise a metallic material with relatively high reflectivity (such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of Al and ITO (ITO / Al / ITO), an APC alloy, a stacked structure of APC alloy and ITO (ITO / APC / ITO), etc.), or may be composed of a metallic material with relatively high reflectivity (such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of Al and ITO (ITO / Al / ITO), an APC alloy, a stacked structure of APC alloy and ITO (ITO / APC / ITO), etc.). When the anode electrode 241 comprises or is composed of a semi-transparent conductive material, the luminous efficiency can be improved due to the microcavity effect.

[0094] An encapsulation layer 205 is formed on the light-emitting element layer 204. The encapsulation layer 205 serves to prevent air or moisture from penetrating the light-emitting layer 242 and the cathode electrode 243. For this purpose, the encapsulation layer 205 may further include at least one inorganic film. The inorganic film may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide, or may be composed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. Furthermore, the encapsulation layer 205 may also include at least one organic film. The inorganic film may have sufficient thickness to prevent particles from penetrating the encapsulation layer 205 and entering the light-emitting layer 242 and the cathode electrode 243. The organic film may include any one of epoxy resin, acrylate, and polyurethane acrylate.

[0095] The sensor unit SENL can be formed on the encapsulation layer 205. When the sensor unit SENL is formed directly on the encapsulation layer 205, the thickness of the display device 10 can be reduced compared to a display device where a separate touch panel is attached to the encapsulation layer 205.

[0096] The sensor unit SENL may include sensor electrodes for capacitively sensing a user's touch and touch lines connecting pads and sensor electrodes. In some embodiments, the sensor unit SENL may sense the user's touch using self-capacitance sensing or mutual capacitance sensing. Figure 4 In the example shown, the sensor unit SENL consists of two layers for mutual capacitance sensing, including a driving electrode TE, a sensing electrode RE, and a bridge BE connected between the driving electrodes TE.

[0097] The bridge BE can be formed on the encapsulation layer 205. The bridge BE can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO), but is not limited thereto. In embodiments, for example, the bridge BE can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0098] The first sensing insulating film TINS1 is formed on the bridge BE. The first sensing insulating film TINS1 may include an inorganic film (e.g., a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer) or be composed of an inorganic film (e.g., a silicon nitride layer, a silicon nitride oxide layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0099] The driving electrode TE and the sensing electrode RE can be formed on the first sensing insulating film TINS1. The driving electrode TE and the sensing electrode RE can be formed as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO), but are not limited thereto. In embodiments, for example, the driving electrode TE and the sensing electrode RE can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0100] Contact holes can be formed in the first sensing insulating film TINS1 to expose the bridge BE. The drive electrode TE can be connected to the bridge BE through the contact holes.

[0101] A second sensing insulating film TINS2 is formed on the driving electrode TE and the sensing electrode RE. The second sensing insulating film TINS2 can provide a flat surface on the driving electrode TE, the sensing electrode RE, and the bridge BE, which have different heights. The second sensing insulating film TINS2 can comprise an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin, or be composed of an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0102] A bridge BE connecting adjacent (nearby) driving electrodes TE can be disposed on the encapsulation layer 205, and the driving electrode TE and the sensing electrode RE can be disposed on the first sensing insulating film TINS1. Therefore, while the sensing electrodes RE can be electrically connected to each other in one direction and the driving electrodes TE can be electrically connected to each other in another direction, the driving electrodes TE and the sensing electrodes RE can be electrically separated from each other at their intersection.

[0103] The polarizing film PF can be set on the second sensing insulating film TINS2 and can prevent the image visibility of the display panel 200 from being degraded due to the reflection of external light.

[0104] The display device 10 in the embodiments of this disclosure may further include a protective film 1000. The protective film 1000 may have multiple embodiments, and the multiple embodiments of the protective film 1000 may include a first embodiment and a second embodiment.

[0105] Figure 5 It is shown in Figure 2 A plan view showing the state in which the protective film of the first embodiment is provided. Figure 6 yes Figure 5 A magnified view of part B. Figure 7 yes Figure 5 A magnified view of part C.

[0106] refer to Figures 5 to 7 According to the first embodiment, the protective film 1000 can be configured to extend in the first direction D1 and cover the reinforcing member 600. In an embodiment, for example, the protective film 1000 can extend along the first direction D1 from one side of the reinforcing member 600 in the first direction D1 ( Figure 5 The protective film 1000 extends to the outside of the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1) on one side of the first direction D1. In some embodiments, the protective film 1000 extends to the outside of the substrate SUB in the first direction D1 (e.g., extending beyond the substrate SUB in the first direction D1). Figure 5 The left side of the protective film 1000 can be disposed on the circuit board 500 and the reinforcing member 600, and the protective film 1000 is disposed on the other side of the first direction D1. Figure 5 The right side of the substrate SUB can be located outside the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1).

[0107] The protective film 1000 is on one side of the first direction D1 ( Figure 5 The left side of the middle) can be connected to one side of the reinforcing member 600 in the first direction D1 ( Figure 5 The boundary line between the protective film 1000 (on the left side of the image) and the substrate SUB is spaced apart. In some embodiments, the protective film 1000 is on one side of the first direction D1 (…). Figure 5 The left side of the middle) can be connected to one side of the reinforcing member 600 in the first direction D1 ( Figure 5 The left side of the protective film 1000 is spaced apart by a distance SL-4. As described above, due to the protective film 1000 on one side of the first direction D1 ( Figure 5 The left side of the middle) and the side of the reinforcing member 600 in the first direction D1 ( Figure 5 The boundary line between the reinforcing member 600 (left side) and the substrate SUB is separated, so that even when the protective member 700 crosses the boundary line between the reinforcing member 600 and the substrate SUB, the reinforcing member 600 and the protective film 1000 will not come into contact with each other, and the protective film 1000 can be easily separated from the reinforcing member 600.

[0108] Furthermore, the protective film 1000 may be configured to extend in the second direction D2 and cover the reinforcing member 600. In an embodiment, for example, the protective film 1000 is located on one side in the second direction D2 ( Figure 5 The lower side of the protective film 1000 can be disposed on the circuit board 500, and the protective film 1000 is disposed on the other side of the second direction D2. Figure 5 The upper side of the protective film 1000 can be disposed on the reinforcing member 600. In some embodiments, the protective film 1000 can extend on the circuit board 500 and the reinforcing member 600 in the second direction D2. Near (beside) the contact surface between the reinforcing member 600 and the protective member 700, the protective film 1000 is disposed on the other side in the second direction D2. Figure 5The upper side may extend in the first direction D1 to be parallel to the contact surface between the reinforcing member 600 and the protective member 700.

[0109] The protective film 1000 can define a removal area RMA. The removal area RMA can be defined as the area where a portion of the protective film 1000 is removed. Since the removal area RMA is defined as the area where a portion of the protective film 1000 is removed, a portion of the reinforcing member 600 can be exposed to the outside of the protective film 1000 through the removal area RMA. Near (beside) the contact area where the reinforcing member 600 and the protective member 700 contact each other, the removal area RMA can be defined on the other side of the reinforcing member 600 in the first direction D1. Figure 5 On the right side of the image) and the boundary line between the substrate SUB.

[0110] The removal area RMA can be defined by the first removal surface RMAS-1, the second removal surface RMAS-2, and the third removal surface RMAS-3.

[0111] The first removal surface RMAS-1 can be on the other side of the reinforcing member 600 in the first direction D1 ( Figure 5 The boundary line between the right side of the substrate SUB and the first removal surface RMAS-1 may be parallel to the other side of the reinforcing member 600 in the first direction D1. Figure 5 The boundary line between the right side of the substrate (SUB) and the substrate SUB is spaced apart, while being parallel in the second direction D2. The first removal surface RMAS-1 can be provided on the reinforcing member 600.

[0112] The second removal surface RMAS-2 can be configured to be on the other side of the reinforcing member 600 in the first direction D1. Figure 5 The boundary line between the first removal surface RMAS-1 and the substrate SUB intersects on the right side of the reinforcement member 600. In some embodiments, the second removal surface RMAS-2 may extend from the first removal surface RMAS-1 in the first direction D1. The second removal surface RMAS-2 may extend beyond the substrate SUB on the reinforcement member 600 to the outside of the substrate SUB (e.g., the outside of the substrate SUB in the first direction D1). The second removal surface RMAS-2 may be parallel to the contact surface between the reinforcement member 600 and the protective member 700.

[0113] The third removal surface RMAS-3 can be spaced apart from the first removal surface RMAS-1, such that the reinforcing member 600 is on the other side in the first direction D1 ( Figure 5The boundary line between the right side of the substrate SUB and the third removal surface RMAS-3 and the first removal surface RMAS-1 is set in the gap between them. In some embodiments, the third removal surface RMAS-3 may be adjacent to the other side of the reinforcing member 600 in the first direction D1. Figure 5 The boundary line between the right side of the substrate SUB and the substrate SUB is spaced apart, while being parallel in the second direction D2. The third removal surface RMAS-3 can be disposed outside the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1).

[0114] From the first removal surface RMAS-1 to the other side of the reinforcing member 600 in the first direction D1 ( Figure 5 The spacing SL-1 between the boundary line between the right side of the substrate SUB and the third removal surface RMAS-3 and the reinforcing member 600 on the other side of the first direction D1 can be greater than that between the third removal surface RMAS-3 and the reinforcing member 600. Figure 5 The distance SL-2 between the boundary line between the right side of the reinforcing member 600 and the substrate SUB is shorter. Furthermore, the distance SL-3 from the contact surface between the reinforcing member 600 and the protective member 700 to the second removal surface RMAS-2 can be shorter than the distance SL-3 from the first removal surface RMAS-1 to the other side of the reinforcing member 600 in the first direction D1. Figure 5 The distance SL-1 between the boundary line between the reinforcing member 600 (on the right side of the image) and the substrate SUB is longer. The distance SL-3 between the contact surface between the reinforcing member 600 and the protective member 700 and the second removal surface RMAS-2 can be longer than the through length of the protective member 700 along the boundary line between the reinforcing member 600 and the substrate SUB.

[0115] As described above, near (beside) the contact surface between the reinforcing member 600 and the protective member 700, because the reinforcing member 600 is on the other side in the first direction D1 ( Figure 5 The boundary line between the protective member 700 (on the right side of the image) and the substrate SUB is separated from the protective film 1000 due to the removal area RMA. Therefore, even when the protective member 700 passes through the boundary line between the reinforcing member 600 and the substrate SUB, the protective member 700 and the protective film 1000 do not contact each other and the protective film 1000 can be easily separated from the reinforcing member 600.

[0116] Figure 8 It is shown in Figure 2 A plan view showing the state in which the protective film of the second embodiment is provided. Figure 9 yes Figure 8 A magnified view of part D. Figure 10 yes Figure 8 A magnified view of part E.

[0117] refer to Figures 8 to 10According to the second embodiment, the protective film 1000 can be configured to extend in the first direction D1 and cover the reinforcing member 600. In an embodiment, for example, the protective film 1000 can extend along the first direction D1 from one side of the substrate SUB in the first direction D1 ( Figure 8 (Left side) extends to the other side of the substrate SUB in the first direction D1 ( Figure 8 The outer side of the right side of the protective film 1000 in the first direction D1. In some embodiments, the protective film 1000 is located on one side of the right side of the protective film 1000 in the first direction D1. Figure 8 (left side of the middle) and the protective film 1000 on the other side of the first direction D1 ( Figure 8 The protective film 1000 (on the right side of the substrate SUB) can be disposed outside the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1). The protective film 1000 is located on one side of the substrate SUB in the first direction D1. Figure 8 (left side of the middle) and the protective film 1000 on the other side of the first direction D1 ( Figure 8 (The right side of the middle) can be parallel to each other in the second direction D2.

[0118] Furthermore, the protective film 1000 may be configured to extend in the second direction D2 and cover the reinforcing member 600. In an embodiment, for example, the protective film 1000 is located on one side in the second direction D2 ( Figure 8 The lower side of the protective film 1000 can be disposed on the circuit board 500, and the protective film 1000 is disposed on the other side of the second direction D2. Figure 8 The upper side of the protective film 1000 can be disposed on the reinforcing member 600. In some embodiments, the protective film 1000 can extend on the circuit board 500 and the reinforcing member 600 in the second direction D2. Near (beside) the contact surface between the reinforcing member 600 and the protective member 700, the protective film 1000 is disposed on the other side in the second direction D2. Figure 8 The upper side of the member can extend in the first direction D1 to be parallel to the contact surface between the reinforcing member 600 and the protective member 700.

[0119] The protective film 1000 may define a removal area RMA. The removal area RMA may be a region where a portion of the protective film 1000 is removed. Since the removal area RMA is a region where a portion of the protective film 1000 is removed, a portion of the reinforcing member 600 may be exposed to the outside of the protective film 1000 through the removal area RMA. Multiple removal areas RMA may be provided, and the multiple removal areas RMA may include a first removal area RMA-1 and a second removal area RMA-2.

[0120] Near (beside) the contact surfaces where the reinforcing member 600 and the protective member 700 come into contact with each other, the first removal area RMA-1 may be defined on the other side of the reinforcing member 600 in the first direction D1. Figure 8On the right side of the image) and the boundary line between the substrate SUB.

[0121] The first removal region RMA-1 may be defined by the first-first removal surface RMAS1-1, the first-second removal surface RMAS1-2, and the first-third removal surface RMAS1-3.

[0122] The first removal surface RMAS1-1 can be on the other side of the reinforcing member 600 in the first direction D1 ( Figure 8 The boundary line between the right side of the substrate SUB and the first removal surface RMAS1-1 may be parallel to the other side of the reinforcing member 600 in the first direction D1. Figure 8 The boundary line between the right side of the substrate SUB and the substrate SUB is spaced apart, while being parallel in the second direction D2. The first removal surface RMAS1-1 can be provided on the reinforcing member 600.

[0123] The first-second removal surface RMAS1-2 can be configured to be on the other side of the reinforcing member 600 in the first direction D1. Figure 8 The first-second removal surface RMAS1-2 intersects the boundary line between the reinforcing member 600 (right side) and the substrate SUB. In some embodiments, the first-second removal surface RMAS1-2 may extend from the first-first removal surface RMAS1-1 in the first direction D1. The first-second removal surface RMAS1-2 may extend beyond the substrate SUB on the reinforcing member 600 to the outside of the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1). The first-second removal surface RMAS1-2 may be parallel to the contact surface between the reinforcing member 600 and the protective member 700.

[0124] The first-third removal surface RMAS1-3 can be spaced apart from the first-first removal surface RMAS1-1, such that the reinforcing member 600 is on the other side in the first direction D1 ( Figure 8 The boundary line between the right side of the substrate SUB and the first-third removal surface RMAS1-3 and the first-first removal surface RMAS1-1 is set in the gap between them. In some embodiments, the first-third removal surface RMAS1-3 may be adjacent to the other side of the reinforcing member 600 in the first direction D1. Figure 8 The boundary line between the right side of the substrate SUB and the substrate SUB is spaced apart, while being parallel in the second direction D2. The first-third removal surfaces RMAS1-3 can be disposed outside the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1).

[0125] From the first-first removal surface RMAS1-1 to the reinforcing member 600 on the other side of the first direction D1 ( Figure 8The spacing SL-5 between the boundary line between the right side of the substrate SUB and the first-third removed surface RMAS1-3 to the other side of the reinforcing member 600 in the first direction D1 can be greater than that between the right side of the substrate SUB and the right side of the substrate SUB. Figure 8 The distance SL-6 between the boundary line between the right side of the reinforcing member 600 and the substrate SUB is shorter. Furthermore, the distance SL-7 from the contact surface between the reinforcing member 600 and the protective member 700 to the first-second removal surface RMAS1-2 can be shorter than the distance SL-7 from the first-first removal surface RMAS1-1 to the other side of the reinforcing member 600 in the first direction D1. Figure 8 The spacing distance SL-5 between the boundary line between the reinforcing member 600 (on the right side) and the substrate SUB is longer. The spacing distance SL-7 from the contact surface between the reinforcing member 600 and the protective member 700 to the first-second removal surface RMAS1-2 can be longer than the through length of the protective member 700 along the boundary line between the reinforcing member 600 and the substrate SUB.

[0126] As described above, near (beside) the contact surface between the reinforcing member 600 and the protective member 700, because the reinforcing member 600 is on the other side in the first direction D1 ( Figure 8 The boundary line between the protective member 700 (on the right side of the image) and the substrate SUB is separated from the protective film 1000 by the first removal region RMA-1, so even when the protective member 700 passes through the boundary line between the reinforcing member 600 and the substrate SUB, the protective member 700 and the protective film 1000 do not contact each other, and the protective film 1000 can be easily separated from the reinforcing member 600.

[0127] Near (beside) the contact surfaces where the reinforcing member 600 and the protective member 700 come into contact with each other, the second removal area RMA-2 may be defined on one side of the reinforcing member 600 in the first direction D1. Figure 8 On the boundary line between the left side of the image and the substrate SUB.

[0128] The second removal region RMA-2 can be defined by the second-first removal surface RMAS2-1, the second-second removal surface RMAS2-2, and the second-third removal surface RMAS2-3.

[0129] The second-first removal surface RMAS2-1 can be on one side of the reinforcing member 600 in the first direction D1 ( Figure 8 The boundary line between the left side of the substrate SUB and the second-first removal surface RMAS2-1 may be parallel to one side of the reinforcing member 600 in the first direction D1. Figure 8 The boundary line between the left side of the substrate (SUB) and the substrate SUB is spaced apart, while being parallel in the second direction D2. The second-first removal surface RMAS2-1 can be provided on the reinforcing member 600.

[0130] The second-second removal surface RMAS2-2 can be configured to be on one side of the reinforcing member 600 in the first direction D1. Figure 8 The second-second removal surface RMAS2-2 intersects the boundary line between the reinforcing member 600 (left side) and the substrate SUB. In some embodiments, the second-second removal surface RMAS2-2 may extend from the second-first removal surface RMAS2-1 in the first direction D1. The second-second removal surface RMAS2-2 may extend beyond the substrate SUB on the reinforcing member 600 to the outside of the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1). The second-second removal surface RMAS2-2 may be parallel to the contact surface between the reinforcing member 600 and the protective member 700.

[0131] The second-third removal surface RMAS2-3 can be spaced apart from the second-first removal surface RMAS2-1, such that the reinforcing member 600 is located on one side in the first direction D1 ( Figure 8 The boundary line between the left side of the substrate SUB and the second-third removal surface RMAS2-3 and the second-first removal surface RMAS2-1 is set in the gap between them. In some embodiments, the second-third removal surface RMAS2-3 may be adjacent to one side of the reinforcing member 600 in the first direction D1. Figure 8 The boundary line between the left side of the substrate SUB and the substrate SUB is spaced apart while being parallel in the second direction D2. The second-third removal surface RMAS2-3 can be disposed outside the substrate SUB (e.g., extending beyond the substrate SUB in the first direction D1).

[0132] From the second-first removal surface RMAS2-1 to the reinforcing member 600 on one side of the first direction D1 ( Figure 8 The spacing SL-8 between the boundary line between the left side of the middle section and the substrate SUB can be greater than that between the second and third removed surfaces RMAS2-3 and the reinforcing member 600 on one side of the first direction D1. Figure 8 The distance SL-9 between the boundary line between the left side of the substrate SUB and the reinforcing member 600 (in the left side of the image) and the substrate SUB is shorter. Furthermore, the distance SL-10 from the contact surface between the reinforcing member 600 and the protective member 700 to the second-second removal surface RMAS2-2 can be shorter than the distance SL-10 from the second-first removal surface RMAS2-1 to one side of the reinforcing member 600 in the first direction D1. Figure 8 The spacing distance SL-8 between the boundary line between the reinforcing member 600 (left side) and the substrate SUB is longer. The spacing distance SL-10 from the contact surface between the reinforcing member 600 and the protective member 700 to the second-second removal surface RMAS2-2 can be longer than the through length of the protective member 700 along the boundary line between the reinforcing member 600 and the substrate SUB.

[0133] As described above, near (beside) the contact surface between the reinforcing member 600 and the protective member 700, because the reinforcing member 600 is on one side in the first direction D1 ( Figure 8 The boundary line between the protective member 700 (on the left side of the image) and the substrate SUB is separated from the protective film 1000 by the second removal region RMA-2, so even when the protective member 700 passes through the boundary line between the reinforcing member 600 and the substrate SUB, the protective member 700 and the protective film 1000 do not contact each other, and the protective film 1000 can be easily separated from the reinforcing member 600.

[0134] However, it should be understood that the advantages and features of the embodiments of this disclosure are not limited to those described herein. The above and other features of this disclosure will become more apparent to those skilled in the art upon reference to the claims, and equivalents of the above and other features of this disclosure should be included in this disclosure.

Claims

1. A display device, comprising: a display panel including a substrate and a display unit; a circuit board connected to the substrate; a reinforcing member provided on the substrate and extending from the circuit board toward the display unit; a protective member provided on the substrate, extending from the display unit toward the circuit board, and contacting the reinforcing member; and a protective film covering the reinforcing member and having a removal region in which a portion of the reinforcing member is exposed, wherein the removal region is defined in a vicinity of a contact surface at which the reinforcing member and the protective member contact each other. 2.The display device according to claim 1, the removal region is provided on a boundary line between the reinforcing member and the substrate. wherein 3.The display device according to claim 2, the removal region is defined by: wherein a first removal surface parallel to the boundary line; a second removal surface intersecting the boundary line; and a third removal surface spaced apart from the first removal surface such that the boundary line is provided between the third removal surface and the first removal surface. 4.The display device according to claim 3, a separation distance from the boundary line to the first removal surface is shorter than a separation distance from the boundary line to the third removal surface. 5.The display device according to claim 3, wherein a separation distance from the contact surface to the second removal surface is longer than a separation distance from the boundary line to the first removal surface. 6.The display device according to claim 3, wherein the protective film extends to an outer side of the substrate, and the third removal surface is provided on the outer side of the substrate. wherein 7.The display device according to claim 1, a width of the reinforcing member in a first direction is smaller than a width of the substrate in the first direction, and one side and the other side of the reinforcing member in the first direction are provided on an inner side of the substrate. wherein 8.The display device according to claim 7, the protective film extends from a periphery of the one side of the reinforcing member in the first direction to an outer side of the substrate, and the removal region is provided on a boundary line between the other side of the reinforcing member and the substrate. wherein, 9.The display device according to claim 8, one side of the protective film in the first direction is spaced apart from the boundary line between the one side of the reinforcing member and the substrate. 10.The display device according to claim 7, wherein the protective film extends in the first direction such that one side and the other side of the protective film in the first direction are provided on an outer side of the substrate, the removal region is provided in a plurality, thereby providing a plurality of removal regions, wherein, the plurality of removal regions include a first removal region and a second removal region, the first removal region is defined on a boundary line between the other side of the reinforcing member and the substrate, and the second removal region is defined on a boundary line between the one side of the reinforcing member and the substrate. 11.The display device according to claim 10, the first removal region is defined by: a first removal surface parallel to the boundary line; wherein a second removal surface intersecting the boundary line; and a third removal surface spaced apart from the first removal surface such that the boundary line is provided between the third removal surface and the first removal surface. a first-first removal surface parallel to the boundary line between the other side of the reinforcing member and the substrate; a first-second removal surface intersecting the boundary line between the other side of the reinforcing member and the substrate; and a first-third removal surface disposed apart from the first-first removal surface such that the boundary line between the other side of the reinforcing member and the substrate is disposed between the first-third removal surface and the first-first removal surface.

12. The display device according to claim 11, a distance apart from the boundary line between the other side of the reinforcing member and the substrate to the first-first removal surface is shorter than a distance apart from the boundary line between the other side of the reinforcing member and the substrate to the first-third removal surface. wherein 13. The display device according to claim 11, a distance apart from the contact surface to the first-second removal surface is longer than a distance apart from the boundary line between the other side of the reinforcing member and the substrate to the first-first removal surface. wherein 14. The display device according to claim 11, the first-third removal surface is disposed outside the substrate. wherein 15. The display device according to claim 10, the second removal region is defined by: wherein a second-first removal surface parallel to the boundary line between the side of the reinforcing member and the substrate; a second-second removal surface intersecting the boundary line between the side of the reinforcing member and the substrate; and a second-third removal surface disposed apart from the second-first removal surface such that the boundary line between the side of the reinforcing member and the substrate is disposed between the second-third removal surface and the second-first removal surface.

16. The display device according to claim 15, a distance apart from the boundary line between the side of the reinforcing member and the substrate to the second-first removal surface is shorter than a distance apart from the boundary line between the side of the reinforcing member and the substrate to the second-third removal surface.

17. The display device according to claim 15, wherein, a distance apart from the contact surface to the second-second removal surface is longer than a distance apart from the boundary line between the side of the reinforcing member and the substrate to the second-first removal surface.

18. The display device according to claim 15, wherein, the second-third removal surface is disposed outside the substrate.

19. An electronic device comprising: wherein a display panel including a substrate and a display unit; a circuit board connected to the substrate; a reinforcing member disposed on the substrate and extending from the circuit board toward the display unit; a protection member disposed on the substrate, extending from the display unit toward the circuit board, and contacting the reinforcing member; and a protection film covering the reinforcing member, and in which at least one removal region exposing a portion of the reinforcing member is formed, ​ ​ ​ The at least one removed region is defined at a periphery of a contact region where the reinforcing member and the protective member contact each other.

20. The electronic device of claim 19, wherein The at least one removed region is disposed on a boundary line between the reinforcing member and the substrate.

Images