Substrate lower supporting device and substrate processing device

Abstract

The substrate lower supporting device is provided with a top plate and a base body. The top plate is provided with an upper surface that is in contact with the lower surface of the substrate, a plurality of substrate suction paths that open in the upper surface, and a negative pressure introduction path that introduces negative pressure into the plurality of substrate suction paths. The base body is provided with: a vacuum suction unit which is in contact with the lower surface of the top plate and vacuum-sucks the top plate; and a substrate suction negative pressure supply unit that supplies negative pressure to the negative pressure introduction path of the top plate that is vacuum-sucked by the vacuum suction unit.

Description

Technical Field

[0001] The present invention relates to a substrate support device for supporting a substrate in a substrate processing apparatus for performing a prescribed process on a substrate, and to a substrate processing apparatus having the substrate support device. Background Technology

[0002] Conventionally, as a substrate processing apparatus for performing prescribed treatments on substrates, screen printing is known for processing substrates by printing solder paste or other similar materials. In screen printing apparatuses, the substrate to be screen printed is supported from below by a lower support device. However, as such a substrate lower support device, there is, for example, the device disclosed in Patent Document 1. The substrate lower support device disclosed in Patent Document 1 is configured to have a top plate (substrate lower support member) with suction holes on its upper surface and a base body (lower support member mounting part) that holds the top plate. By placing the substrate on the upper surface of the top plate, air is drawn out through the suction holes, thereby vacuum-suctioning the substrate. The top plate varies in shape and size depending on the size of the substrate, so when changing the type of substrate being produced, the top plate is also replaced relative to the base body.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-144642 Summary of the Invention

[0006] However, in the aforementioned conventional lower support device, the top plate in the base body is held by the magnetic force between the magnet and the magnetic body, which presents the following difficulties: when the magnetic force is weak, the holding force of the top plate is insufficient and the posture of the base plate becomes unstable; when the magnetic force is too strong, it is difficult to replace the top plate.

[0007] Therefore, the object of the present invention is to provide a substrate support device and a substrate processing device that can not only reliably hold the substrate by means of vacuum suction through the top plate, but also easily replace the top plate relative to the base body.

[0008] The substrate support device of the present invention includes a top plate and a base body. The top plate has an upper surface that contacts the lower surface of the substrate, a plurality of substrate attraction paths that open on the upper surface, and a negative pressure guide path that introduces negative pressure into the plurality of substrate attraction paths. The base body includes: a vacuum adsorption section that contacts the lower surface of the top plate to perform vacuum adsorption on the top plate; and a substrate attraction negative pressure supply section that supplies negative pressure to the negative pressure guide path of the top plate vacuum adsorbed by the vacuum adsorption section.

[0009] The substrate processing apparatus of the present invention is a substrate processing apparatus that performs a prescribed process on the substrate supported by the substrate under support device of the present invention described above, wherein the top plate is replaceable relative to the base body, and the operation of replacing the top plate relative to the base body is performed by switching the vacuum adsorption of the top plate by the vacuum adsorption unit.

[0010] According to the present invention, not only can the substrate be reliably held by vacuum suction through the top plate, but the top plate can also be easily replaced relative to the base body. Attached Figure Description

[0011] Figure 1 This is a top view of a screen printing apparatus according to an embodiment of the present invention.

[0012] Figure 2 This is a side view of a screen printing apparatus according to an embodiment of the present invention.

[0013] Figure 3 These are (a) an exploded perspective view and (b) a perspective view of the lower support unit included in a screen printing apparatus according to an embodiment of the present invention.

[0014] Figure 4 This is a cross-sectional view of the lower support unit according to an embodiment of the present invention.

[0015] Figure 5 This is an exploded perspective view of the top plate included in the lower support unit according to an embodiment of the present invention.

[0016] Figure 6 The following are (a) an anatomical view and (b) a sectional view of the top plate of the lower support unit according to an embodiment of the present invention.

[0017] Figure 7 This is a block diagram illustrating the control system of a screen printing apparatus according to one embodiment of the present invention.

[0018] Figure 8 This is a side sectional view showing the airflow when the lower support unit adsorbs the substrate in one embodiment of the present invention.

[0019] Figure 9 (a), (b), and (c) are side views showing the process of bringing a substrate supported by the lower support unit of the screen printing apparatus according to an embodiment of the present invention into contact with a mask.

[0020] Figure 10 (a) and (b) are side views showing the state in which a squeegee of a screen printing apparatus according to an embodiment of the present invention applies paste to a substrate. Detailed Implementation

[0021] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 and Figure 2 This describes a screen printing apparatus 1 according to one embodiment of the present invention.

[0022] The screen printing apparatus 1 is an apparatus that receives a substrate KB supplied from the upstream process side and performs a screen printing operation to print solder paste Pst onto an electrode pattern DK provided on the substrate KB. In this embodiment, the flow direction of the substrate KB in the screen printing apparatus 1 (from...) Figure 1 The horizontal direction from left to right (observed from the operator's perspective) is set as the X direction, the direction in the horizontal plane orthogonal to the X direction (observed from the operator's perspective) is set as the Y direction, and the vertical direction is set as the Z direction.

[0023] exist Figure 1 and Figure 2 In the screen printing apparatus 1, a substrate holding and moving mechanism 12 is provided on a base 11. A mask 13 is provided above the substrate holding and moving mechanism 12, and a printing head 14 is arranged above the mask 13.

[0024] exist Figure 2 In this design, the substrate holding and moving mechanism 12 consists of a substrate holding unit 21 and a unit moving mechanism 22. The substrate holding unit 21 transports the substrate KB to a predetermined position and holds the transported substrate KB. The unit moving mechanism 22 moves the entire substrate holding unit 21 in the horizontal plane (XY plane) and the vertical direction (Z direction).

[0025] exist Figure 2 In this embodiment, the substrate holding unit 21 has a pair of upwardly extending conveyor support members 32 arranged opposite each other in the Y direction (front-to-back direction) on a lifting plate 31 that serves as a base. A pair of conveyors 33 are mounted on the inner surface of the pair of conveyor support members 32 (the surfaces on which the pair of conveyor support members 32 face each other). The conveyors 33 extend in the X direction and are arranged opposite each other and parallel in the Y direction. The pair of conveyors 33 transport the substrate KB along the X direction and position it at a predetermined location.

[0026] exist Figure 2 In the middle, a lower support unit 34, serving as a lower support device, is provided above the lifting plate 31. The lower support unit 34 is raised and lowered freely by a lifting actuator 35 provided on the lifting plate 31. A pair of clamping members 36 (see also) are provided at the upper end of a pair of conveyor support members 32, which are located above the conveyor 33 and open and close in the Y direction. Figure 1 ).

[0027] exist Figure 3 (a), (b) and Figure 4The lower support unit 34 includes: a base worktable 41 that is raised and lowered by a lifting actuator 35; a base body 42 and an auxiliary support portion 43 disposed on the upper surface of the base worktable 41; and a top plate 44 that is detachably held on the upper surface of the base body 42 and supported by the auxiliary support portion 43.

[0028] The top plate 44 is held in place by the base body 42 by being attracted to its lower surface on one end side in the X direction. The top plate 44 attracts and supports the lower surface of the substrate KB, which is positioned at a predetermined position by the conveyor 33. Multiple top plates 44 of different sizes corresponding to the size of the substrate KB are prepared, and a top plate 44 corresponding to the size of the substrate KB to be supported is selected and attracted and held in place by the base body 42.

[0029] The auxiliary support 43 supports the lower surface of the top plate 44 at the other end in the Y direction. The auxiliary support 43 is located along the guide rail 41G provided on the upper surface of the base worktable 41. Figure 3 (a) and (b) can move freely in the Y direction. The auxiliary support 43 moves in the Y direction according to the Y-direction dimension of the top plate 44, thereby stably supporting the other end of the top plate 44 regardless of the dimension of the top plate 44 (specifically the Y-direction dimension).

[0030] Thus, in this embodiment, the auxiliary support portion 43 changes its relative position to the base body 42 according to the size of the substrate KB to support a portion of the lower surface of the top plate 44.

[0031] The top plate 44 has an upper surface, which serves as the lower support surface of the lower support substrate KB. For example... Figure 4 As shown, the top plate 44 has multiple substrate attraction paths 51 with openings at multiple locations on its upper surface (lower support surface) and negative pressure introduction paths 52 for introducing negative pressure into these multiple substrate attraction paths 51. Figure 4 , Figure 5 as well as Figure 6 In (a) and (b), the top plate 44 has: an upper half 44a having the aforementioned plurality of substrate attraction paths 51; and a lower half 44b having a negative pressure guide path 52, which is engaged with the lower side of the upper half 44a.

[0032] In this embodiment, the upper surface of the upper half 44a of the top plate corresponds to the upper surface of the top plate 44, and the lower surface of the lower half 44b of the top plate corresponds to the lower surface of the top plate 44. For example... Figure 3 (a), (b) Figure 5 as well as Figure 6As shown in (a) and (b), on the upper surface of the top plate 44 (upper half of the top plate 44a), a plurality of interference avoidance parts 53 for avoiding interference with components such as BH mounted on the lower surface of the supported substrate KB are provided with an opening on the upper surface of the top plate 44.

[0033] The arrangement of the interference avoidance portion 53 in the top plate 44 varies depending on the arrangement of the component BH mounted on the back side of the substrate KB, which is the object of production (i.e., the support object of the top plate 44). Therefore, multiple top plates are prepared in advance that correspond not only to the size of the substrate KB, which is the object of production, but also to the arrangement of the component BH mounted on the back side of the substrate KB (and the arrangement of the interference avoidance portion 53 formed on the upper surface of the top plate 44).

[0034] exist Figure 5 and Figure 6 In (a), the lower half 44b of the top plate has a recessed groove 54 that opens on the upper surface side. When the lower half 44b of the top plate is engaged with the upper half 44a of the top plate, the recessed groove 54 is covered by the upper half 44a of the top plate. Figure 6 (a) → Figure 6 (b) thus forming a connecting path 55 between the lower half 44b of the top plate and the upper half 44a of the top plate (i.e., inside the top plate 44). Figure 6 (b)

[0035] exist Figure 4 and Figure 6 In (a) and (b), multiple substrate attraction paths 51 extend through the upper half 44a of the top plate in the thickness direction and are connected to the connecting path 55 of the top plate 44. That is, the multiple substrate attraction paths 51 provided on the top plate 44 are interconnected through the connecting path 55 provided in the top plate 44.

[0036] Thus, in this embodiment, the top plate 44 has: an upper half 44a having a plurality of substrate attraction paths 51; and a lower half 44b having a negative pressure guide path 52, which engages with the lower side of the upper half 44a. A connecting path 55 is formed by the engagement of the upper half 44a and the lower half 44b. Specifically, the connecting path 55 is formed by a concave groove 54 and the lower surface of the upper half 44a. The concave groove 54 is disposed in the lower half 44b and opens on its upper surface, which engages with the upper half 44a. The upper half 44a closes the concave groove 54 when the lower half 44b is engaged with the upper half 44a. The plurality of substrate attraction paths 51 are respectively disposed through the upper half 44a in the vertical direction.

[0037] exist Figure 4 , Figure 5 and Figure 6In (a) and (b), a first gasket 56 is provided between the upper half 44a and the lower half 44b of the top plate as a first sealing member to seal the mating surface of the upper half 44a and the lower half 44b of the top plate. The first gasket 56 prevents air (pressure) from leaking between the upper half 44a and the lower half 44b of the top plate.

[0038] exist Figure 4 and Figure 5 In this embodiment, the negative pressure induction path 52 is provided with an opening on the lower surface of the lower half 44b of the top plate and is connected to the connecting path 55. Therefore, when negative pressure is introduced from the negative pressure induction path 52, attractive forces are generated in the multiple substrate attraction paths 51 through the connecting path 55. When a substrate KB is placed on the upper surface of the top plate 44 (the upper surface of the upper half 44a of the top plate), the substrate KB is attracted to the upper surface of the top plate 44 by vacuum. It should be noted that, in this embodiment, as... Figure 5 As shown, multiple negative pressure inlet channels 52 are arranged in the Y direction and are connected to the concave groove 54 (i.e., the connecting channel 55), but at least one negative pressure inlet channel 52 is required.

[0039] The upper surface of the base 42 becomes the top plate contact surface that contacts the lower surface of the top plate 44. For example... Figure 3 As shown in (a) and (b), the base body 42 includes: a recess 57 which has an opening on its upper surface (top plate contact surface) and forms a sealed area between its upper surface and the contacting top plate 44 (top plate lower half 44b); and a substrate suction negative pressure supply part 58 which is connected to a negative pressure guide path 52 provided on the top plate 44.

[0040] like Figure 3 As shown in (a), the substrate suction negative pressure supply section 58 has a shape extending along the Y direction and is located below the negative pressure guide path 52 (a plurality of negative pressure guide paths 52 arranged along the Y direction) provided on the top plate 44 when the top plate 44 is held on the upper surface of the base body 42. The recess 57 has the same Y-direction dimension as the substrate suction negative pressure supply section 58 and has a larger X-direction dimension than the substrate suction negative pressure supply section 58.

[0041] exist Figure 3 In (a), a protrusion 59P protruding upward is provided on the upper surface of the base body 42. On the other hand, a concave protrusion receiving portion 59Q capable of engaging with the protrusion 59P is provided on the lower surface of the top plate 44 (specifically, the lower half of the top plate 44b). The protrusion 59P and the protrusion receiving portion 59Q are respectively provided at two locations along the X direction. By engaging the two protrusions 59P on the base body 42 side with the two protrusion receiving portions 59Q on the top plate 44 side, the top plate 44 can be positioned relative to the base body 42. Figure 4 ).

[0042] exist Figure 3 (a) and Figure 4 In this design, a second gasket 60 is provided between the base body 42 and the top plate 44 (specifically, on the upper surface of the base body 42) as a second sealing member to seal the mating surface of the base body 42 and the top plate 44. The second gasket 60 prevents air (pressure) from leaking between the base body 42 and the top plate 44.

[0043] like Figure 4 As shown, the aforementioned interference avoidance part 53 has: a low-height type interference avoidance part whose bottom of the hole does not reach the lower half 44b of the top plate (also referred to as interference avoidance part 53 by reference numeral "53A"); and a high-height interference avoidance part whose bottom of the hole reaches the lower half 44b of the top plate or extends vertically through the top plate 44 (also referred to as interference avoidance part 53 by reference numeral "53B"). The high-height type interference avoidance part 53 has a length that extends at least vertically through the upper half 44a of the top plate.

[0044] In the case where the top plate 44 has the aforementioned high-height interference avoidance portion 53, a through hole 53H constituting a part of the height direction of the interference avoidance portion 53 is provided in the first pad 56, and the lower end portion (through hole or bottom) 53T of the interference avoidance portion 53 is provided in the lower half of the top plate 44b. In this case, as Figure 5 As shown, the concave groove 54 is formed to avoid the lower end portion 53T of the interference avoidance part 53 provided on the lower half of the top plate 44b.

[0045] exist Figure 4 In the base body 42, a first negative pressure supply line 61 connected to a vacuum source VP disposed outside the lower support unit 34 is connected to a recess 57. In addition, a second negative pressure supply line 62 connected to the vacuum source VP is connected to a substrate suction negative pressure supply section 58 provided in the base body 42.

[0046] exist Figure 4In this design, a first control valve 63 is installed in the first negative pressure supply line 61, and a second control valve 64 is installed in the second negative pressure supply line 62. The first control valve 63 is used to open and close the first negative pressure supply line 61, and performs the following actions: it sends the negative pressure supplied by the vacuum source VP into the recess 57 through the first negative pressure supply line 61, closes the first negative pressure supply line 61, or releases the negative pressure in the recess 57 to the atmosphere through the first negative pressure supply line 61 (discharges negative pressure). The second control valve 64 is used to open and close the second negative pressure supply line 62, and performs the following actions: it sends the negative pressure supplied by the vacuum source VP into the substrate suction negative pressure supply section 58 through the second negative pressure supply line 62, closes the second negative pressure supply line 62, or releases the negative pressure in the substrate suction negative pressure supply section 58 to the atmosphere through the second negative pressure supply line 62 (discharges negative pressure).

[0047] With the top plate 44 resting on the upper surface of the base body 42, the recess 57 becomes a sealed area enclosed by the top plate 44. Therefore, when the first control valve 63 is activated to deliver negative pressure supplied by the vacuum source VP into the recess 57 while the top plate 44 is resting on the upper surface of the base body 42, an attractive force is generated in the sealed area within the recess 57, and the top plate 44 is vacuum-attracted (vacuum-adsorbed) to the base body 42.

[0048] Thus, in this embodiment, the recess 57 provided on the base body 42 and forming a sealed area between it and the top plate 44 in contact with the base body 42 becomes a vacuum adsorption part that vacuum adsorbs the top plate 44 by being supplied with negative pressure.

[0049] exist Figure 1 In this design, the mask 13 has a rectangular shape and is held by a rectangular mask frame 13W around its perimeter. The mask 13 is made of a metal plate, and a pattern opening 13K is provided in the center in a configuration corresponding to the electrode pattern DK formed on the surface of the substrate KB. Above the substrate holding unit 21, a pair of mask supports 13G extending in the Y direction and facing each other in the X direction are provided (see also...). Figure 2 The two opposite sides of the mask 13 in the X direction are supported by the mask support portion 13G and are located above the substrate holding unit 21.

[0050] exist Figure 1 and Figure 2 In the middle, the printing head 14 extends along the X direction, and two scrapers 14S are provided below it. The two scrapers 14S are each composed of a "scraper"-shaped component extending along the X direction, and are arranged opposite each other in the Y direction.

[0051] The two scrapers 14S can be raised and lowered independently relative to the print head 14. The print head 14 is moved by the print head moving mechanism 14M ( Figure 1 and Figure 2The printhead 14 moves in the Y direction. The printhead moving mechanism 14M consists of a ball screw 14a extending in the Y direction and a drive motor 14b that drives the ball screw 14a to rotate. When the ball screw 14a is rotated about an axis by the drive motor 14b, the printhead 14 moves in the Y direction.

[0052] Figure 7 This describes the control system of the screen printing apparatus 1. The control unit 70 of the screen printing apparatus 1 controls the transport of the substrate KB by the substrate holding unit 21, the lifting and lowering of the lower support unit 34, the clamping of the substrate KB, and the movement of the substrate holding unit 21 by the unit moving mechanism 22. Additionally, the control unit 70 controls the movement of the print head 14 based on the print head moving mechanism 14M and the lifting and lowering of the squeegee 14S of the print head 14. Furthermore, the control unit 70 controls the operation of the first control valve 63 and the second control valve 64.

[0053] Next, the execution steps of the screen printing operation of the screen printing apparatus 1 will be described. Before starting the screen printing operation, firstly, the top plate 44 is set on the base body 42. Regarding the top plate 44, from a plurality of top plates prepared in advance according to the size of the substrate KB to be produced and the configuration of the component BH mounted on the back side of the substrate KB, the top plate corresponding to the substrate KB to be screen printed thereafter is selected and set on the base body 42.

[0054] To mount the top plate 44 onto the base body 42, the top plate 44 is first placed on the upper surface of the base body 42. At this time, the two protrusion receiving portions 59Q on the top plate 44 are engaged with the two protrusions 59P on the base body 42, positioning the top plate 44 relative to the base body 42. Furthermore, the position of the auxiliary support portion 43 relative to the base worktable 41 in the X direction is adjusted according to the X-direction dimension of the top plate 44, thereby stably supporting the top plate 44 by the base body 42 and the auxiliary support portion 43.

[0055] As described above, with the top plate 44 placed on the base body 42, the recess 57 formed in the base body 42 is blocked by the lower surface of the top plate 44. In addition, the plurality of negative pressure guide passages 52 that open on the lower surface of the top plate 44 are respectively connected to the substrate suction negative pressure supply section 58 formed in the base body 42.

[0056] After the top plate 44 is placed on the base body 42, the first control valve 63 is activated from the control unit 70 to introduce negative pressure from the vacuum source VP into the first negative pressure supply line 61. When negative pressure is introduced into the first negative pressure supply line 61, negative pressure is introduced into the sealed area between the recess 57 formed in the base body 42 and the lower surface of the substrate KB, and the top plate 44 is attracted to the upper surface side of the base body 42 (see reference). Figure 8Arrow P1 indicates airflow. Thus, the top plate 44 is vacuum-adsorbed onto the base body 42, resulting in the top plate 44 being positioned on the base body 42. After the top plate 44 is positioned on the base body 42, the first control valve 63 is activated to close the first negative pressure supply line 61, maintaining the negative pressure state within the recess 57 (i.e., the vacuum adsorption state of the substrate KB).

[0057] After the top plate 44 is set on the base body 42, the screen printing operation begins. In the screen printing operation, firstly, the substrate KB, delivered from the upstream process side of the screen printing apparatus 1, is transported in by the conveyor 33 and positioned at a predetermined location. After the substrate KB is positioned at the predetermined location, the lifting actuator 35 operates to raise the base worktable 41. Figure 9 Arrow A1 shown in (a) indicates that the upper surface of the top plate 44 contacts the lower surface of the substrate KB on the conveyor 33. Figure 9 (a) Thus, the multiple substrate attraction paths 51 that open on the upper surface of the top plate 44 are respectively sealed by the top plate.

[0058] After the top plate 44 contacts the substrate KB, the control unit 70 activates the second control valve 64, supplying negative pressure from the vacuum source VP to the substrate suction negative pressure supply unit 58 of the base body 42 through the second negative pressure supply pipe 62. This introduces negative pressure from the substrate suction negative pressure supply unit 58 into the negative pressure inlet path 52 of the top plate 44, and then introduces negative pressure into the multiple substrate suction paths 51 through the connecting path 55. Consequently, an attraction force is generated in each substrate suction path 51, and the lower surface of the substrate KB is attracted to the upper surface side of the top plate 44 (see reference). Figure 8 (The arrow P2 in the middle indicates the flow of air). The substrate KB is adsorbed and held on the upper surface of the top plate 44, and is supported by the top plate 44 (and thus by the lower support unit 34).

[0059] After the substrate KB is held on the upper surface of the top plate 44 as described above, the lifting actuator 35 is activated to raise the base worktable 41. Figure 9 (See arrow A2 in (b)). As a result, the substrate KB is lifted and separated upwards from the conveyor 33. Furthermore, once the upper surface of the substrate KB reaches the same height as the upper surface of the clamping member 36, the lifting actuator 35 stops the upward movement of the base table 41. Figure 9 (b)). After the base worktable 41 stops rising, the clamping member 36 actuates, clamping the substrate KB from the Y direction. Figure 9 Arrow B shown in (b).

[0060] After the substrate KB is clamped by the clamping member 36, the unit moving mechanism 22 operates to move the substrate holding unit 21 horizontally so that the electrode pattern DK of the substrate KB and the pattern opening 13K formed on the mask 13 are aligned in the vertical direction. Then, the unit moving mechanism 22 raises the substrate holding unit 21. Figure 9 As shown by arrow A3 in (C), when the upper surface of the substrate KB contacts the lower surface of the mask 13, the rising of the substrate holding unit 21 stops. As a result, the electrode pattern DK of the substrate KB is aligned with the pattern opening 13K formed on the mask 13.

[0061] After the upper surface of the substrate KB contacts the lower surface of the mask 13, and paste Pst is supplied to the upper surface of the mask 13, one of the two scrapers 14S of the printing head 14 is lowered so that its lower end abuts against the upper surface of the mask 13. Figure 10 (a)). Then, after the lower end of the scraper 14S abuts against the upper surface of the mask 13, the printing head 14 is moved in the Y direction by the printing head moving mechanism 14M. Figure 10 (a) → Figure 10 (b) Thus, the paste Pst is scraped onto the mask 13 by the scraper 14S, and the paste Pst is applied to the electrode pattern DK through the pattern opening 13K of the mask 13.

[0062] After the paste Pst is applied to the substrate KB by the scraper 14S, the unit moving mechanism 22 lowers the substrate holding unit 21, pulling the substrate KB downwards from the mask 13 (removal). After the substrate KB is removed, a pair of clamping members 36 move in the separation direction to release the clamping of the substrate KB. After the clamping of the substrate KB is released, the base worktable 41 is lowered by the lifting actuator 35, unloading the substrate KB onto the conveyor 33.

[0063] After the substrate KB descends onto the conveyor 33, the second control valve 64 is activated, opening the substrate suction negative pressure supply section 58 to the atmosphere and releasing the negative pressure within the substrate suction path 51. This releases the suction state of the substrate KB, allowing it to move from the top plate 44. Once the substrate KB can move, it is moved outward via the conveyor 33. This completes the printing operation for each substrate KB.

[0064] Thus, the screen printing apparatus 1 in this embodiment functions as a substrate processing apparatus for screen printing (a prescribed process) on a substrate KB supported by the lower support unit 34. In this screen printing apparatus 1, the top plate 44 is replaceable relative to the base body 42, and the replacement operation of the top plate 44 is performed by switching the vacuum adsorption of the top plate 44 on and off by the vacuum adsorption part (recess 57).

[0065] In detail, when the top plate 44 is held in the base body 42, as described above, the first control valve 63 is activated to introduce negative pressure supplied from the vacuum source VP into the recess 57 of the base body 42. On the other hand, when the top plate 44 is removed from the base body 42 (released from holding), the first control valve 63 is activated to open the sealed area formed by the recess 57 and the top plate 44 to the atmosphere through the first negative pressure supply line 61, thereby discharging the negative pressure inside the recess 57 (i.e., inside the vacuum adsorption section).

[0066] Thus, the lower support unit 34 in this embodiment includes: a top plate 44 having a plurality of substrate suction paths 51 with an opening on an upper surface that contacts the lower surface of the substrate KB, and a negative pressure guiding path 52 for introducing negative pressure into the plurality of substrate suction paths 51; and a base body 42 having a vacuum suction section (recess 57) that contacts the lower surface of the top plate 44 to perform vacuum suction on the top plate 44, and a substrate suction negative pressure supply section 58 that supplies negative pressure to the negative pressure guiding path 52 of the top plate 44 vacuum-suctioned by the vacuum suction section. The substrate KB can be held relative to the top plate 44 and released from holding by controlling the supply and discharge of negative pressure relative to the vacuum suction section (recess 57). Therefore, according to the lower support device (lower support unit 34) in this embodiment, not only can the substrate KB be reliably held by vacuum suction using the top plate 44, but the top plate 44 can also be easily replaced relative to the base body 42.

[0067] It should be noted that the replacement operation of the top plate 44 relative to the base body 42 (the installation and removal of the top plate 44) can be performed manually by the operator (OP) or automatically by introducing a device for replacing the top plate 44 into the screen printing apparatus 1. In the case of automatic replacement of the top plate 44, for example, a carrier member (not shown) that holds the top plate 44 freely using a mask support 13G or the like is positioned above the base body 42, and the base body 42 is raised by the unit moving mechanism 22 and the lifting actuator 35, thereby transferring the top plate 44 between the carrier member and the base body 42.

[0068] As explained above, in the lower support unit 34 (a screen printing apparatus 1 of a substrate processing apparatus equipped with the lower support unit 34) of this embodiment, the base body 42 holding the top plate 44, which vacuum-suctions the lower surface of the substrate KB, includes: a vacuum adsorption section (recess 57) that vacuum-suctions the top plate 44; and a substrate suction negative pressure supply section 58 that supplies negative pressure to the top plate 44 vacuum-suctioned by the vacuum adsorption section for vacuum suction of the substrate KB. The substrate KB can be held relative to the top plate 44 and released from holding by controlling the supply and discharge of negative pressure in the vacuum adsorption section (recess 57). Therefore, the substrate lower support device (lower support unit 34) of this embodiment can reliably hold the substrate KB by vacuum suction, and the top plate 44 can be easily replaced relative to the base body 42.

[0069] The embodiments of the present invention have now been described, but the present invention is not limited to the above description and various modifications are possible. For example, in the above embodiment, the interference avoidance part 53, which prevents interference with the component BH mounted on the lower surface of the substrate KB, is provided with an opening on the upper surface of the top plate 44. However, if the substrate KB is supported on the lower surface without the component BH mounted thereon, the interference avoidance part 53 does not need to be provided on the top plate 44. Furthermore, in the above embodiment, the concave groove 54 constituting the connecting path 55 is provided on the lower half 44b of the top plate, but the concave groove 54 may also be provided on the upper half 44a of the top plate. In this case, by joining the lower half 44b and the upper half 44a of the top plate, the concave groove 54 is blocked by the upper surface of the lower half 44b of the top plate, thus forming the connecting path 55.

[0070] Furthermore, in the above embodiment, the top plate 44 is composed of an upper half 44a and a lower half 44b. However, the top plate 44 may not be composed of an upper half 44a and a lower half 44b; it may be composed of a single component. However, if the top plate 44 is composed of an upper half 44a and a lower half 44b, it has the advantage that it is easier to form multiple substrate attraction paths 51, communication paths 55, and negative pressure guide paths 52 on the top plate 44. Additionally, in the above embodiment, the auxiliary support portion 43, which supports a portion of the lower surface of the top plate 44 by changing its relative position to the base body 42, is configured as part of the lower support unit 34. However, the auxiliary support portion 43 does not necessarily need to be part of the lower support unit 34; a portion other than the lower support unit 34 of the screen printing apparatus 1 can also function as the auxiliary support portion 43.

[0071] In addition, in the above embodiment, the substrate processing apparatus that performs the prescribed processing on the substrate KB supported by the lower support device (lower support unit 34) is a screen printing apparatus for screen printing the substrate KB, but the substrate processing apparatus may also be other apparatuses different from the screen printing apparatus (e.g., a component mounting apparatus for mounting components on the substrate KB).

[0072] Industrial availability

[0073] The present invention provides a substrate support device and a substrate processing device that can not only reliably hold the substrate by means of vacuum suction through the top plate, but also easily replace the top plate relative to the base body.

[0074] Explanation of reference numerals in the attached figures

[0075] 1. Screen printing apparatus (substrate processing apparatus)

[0076] 34. Lower support unit (substrate lower support device)

[0077] 41 Abutment

[0078] 41G guide rail

[0079] 42 Base Body

[0080] 43 Auxiliary support section

[0081] 44 Top Plate

[0082] 44a Upper half of the top plate

[0083] 44b Lower half of the top plate

[0084] 51 Substrate attraction path

[0085] 52 Negative Pressure Inlet Path

[0086] 53 Interference Avoidance Department

[0087] 55 Connecting Paths

[0088] 54. Concave groove

[0089] 56 First gasket (first sealing member)

[0090] 57 Recessed part (vacuum adsorption part)

[0091] 58. Substrate suction negative pressure supply section

[0092] 60 Second gasket (second sealing member)

[0093] 61 First negative pressure supply pipeline

[0094] 62 Second negative pressure supply pipeline

[0095] 63 First control valve

[0096] 64 Second control valve

[0097] 70 Control Department

[0098] KB substrate.

Claims

1. A substrate under-supporting apparatus, wherein the substrate under-supporting apparatus has: a top plate having an upper surface which contacts a lower surface of a substrate, a plurality of substrate suction paths which are opened in the upper surface, and a negative pressure introduction path which introduces a negative pressure to the plurality of substrate suction paths; and a base body having a vacuum adsorption portion which vacuum-adsorbs the top plate by contacting a lower surface of the top plate, and a substrate suction negative pressure supply portion which supplies a negative pressure to the negative pressure introduction path of the top plate which is vacuum-adsorbed by the vacuum adsorption portion.

2. The substrate under-supporting apparatus according to claim 1, wherein the top plate further has a communication path which communicates the plurality of substrate suction paths with each other inside, the negative pressure introduction path introduces a negative pressure to the plurality of substrate suction paths through the communication path.

3. The substrate under-supporting apparatus according to claim 1, wherein the top plate further has an interference avoidance portion which avoids interference with a member mounted on the lower surface of the substrate, the interference avoidance portion is opened in the upper surface of the top plate.

4. The substrate under-supporting apparatus according to claim 3, wherein the top plate has a top plate upper half body which has the plurality of substrate suction paths, and a top plate lower half body which has the negative pressure introduction path and is joined to a lower side of the top plate upper half body, the communication path is formed by the top plate upper half body and the top plate lower half body being joined.

5. The substrate under-supporting apparatus according to claim 4, wherein the top plate lower half body further has a recessed groove which is opened in an upper surface of the top plate lower half body which is joined to the top plate upper half body, the communication path is formed by the recessed groove and a lower surface of the top plate upper half body which blocks the recessed groove in a state where the top plate lower half body and the top plate upper half body are joined, the plurality of substrate suction paths respectively pass through the top plate upper half body in an up-and-down direction.

6. The substrate under-supporting apparatus according to claim 5, wherein in a case where the interference avoidance portion has a length which passes through the top plate upper half body in the up-and-down direction, the recessed groove is formed so as to avoid the interference avoidance portion.

7. The substrate under-supporting apparatus according to claim 6, wherein the substrate under-supporting apparatus further has a first sealing member which seals a joining surface of the top plate upper half body and the top plate lower half body.

8. The substrate under-supporting apparatus according to claim 1, wherein the vacuum adsorption portion is constituted by a recessed portion which is opened in an upper surface of the base body and forms a sealed region between the top plate which contacts the base body and the base body.

9. The substrate under-supporting apparatus according to claim 8, wherein the substrate under-supporting apparatus further has a second sealing member which seals a joining surface of the base body and the top plate.

10. A substrate processing apparatus which performs a prescribed process on a substrate which is supported by the substrate under-supporting apparatus according to any one of claims 1 to 9, wherein the top plate is replaceable with respect to the base body, a work of replacing the top plate with respect to the base body is performed by turning on and off vacuum adsorption of the top plate by the vacuum adsorption portion. ​ 11. The substrate processing apparatus according to claim 10, wherein The substrate processing apparatus has an auxiliary support portion that supports a portion of the lower surface of the top plate at a different relative position from the base body.

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