Hard and brittle plate combined machining system and method

Abstract

The invention belongs to the technical field of numerical control cutting equipment, and particularly relates to a hard and brittle plate combined machining system and method.The hard and brittle plate combined machining system comprises a control module, a machining tool, a cutting unit and a jig platform, and the cutting unit and the jig platform are installed on the machining tool; the jig platform is used for positioning and fixing the hard and brittle plate; the jig platform is arranged on the lower side of the cutting unit; the cutting unit comprises a laser emitting assembly and a vibration cutter assembly which are installed on a machining tool. The processing machine tool is used for controlling the jig platform and the cutting unit to move relatively in an XYZ space; the control module is used for controlling the processing machine tool and the laser emitting assembly to punch pre-splitting holes in the upper surface of the hard and brittle plate at intervals along a designed path according to the input cutting path information; and then the processing machine tool and the vibration cutter assembly are controlled to crack the hard and brittle plate along the designed path. The thermal influence of laser can be reduced, the cutting resistance borne by the vibration cutter assembly in the splitting process is reduced, and the respective technical advantages of two different machining modes are reserved.

Description

Technical Field

[0001] This invention belongs to the field of CNC cutting equipment technology, and specifically relates to a composite processing system and method for hard and brittle plates. Background Technology

[0002] Currently, the cutting of hard and brittle plates (such as photovoltaic silicon wafers, mobile phone glass, IGBT ceramic substrates, etc.) can generally be classified into traditional cutting methods (mechanical cutting, hot knife cutting, chemical cutting, etc.) and laser cutting methods based on the cutting methods used. With the development of cutting technology for hard and brittle plates, traditional cutting methods (mechanical cutting, hot knife cutting, chemical cutting, etc.) can no longer meet the modern industrial demand for high precision, high efficiency, and non-destructive processing. Laser cutting technology, due to its non-contact, programmable, and highly flexible characteristics, has become an important development direction for cutting technology of hard and brittle plates.

[0003] During laser cutting, the high-energy laser beam causes localized melting or vaporization of the material. However, heat diffusion leads to structural changes in the surrounding area (such as grain coarsening and hardness alteration), forming a heat-affected zone (HAZ). An excessively large HAZ can cause material deformation and reduced strength. Hard and brittle materials are typically heat-sensitive, and during laser cutting, microcracks are easily generated due to an excessively large HAZ. To reduce the formation of microcracks, high-peak-power pulsed lasers (such as femtosecond lasers) are often used to reduce heat diffusion. However, using high-peak-power pulsed lasers also leads to reduced repetition frequency, increased cooling requirements, higher equipment costs, and more frequent maintenance. Simultaneously, as the laser beam penetrates hard and brittle materials, the energy distribution exhibits a gradient attenuation, resulting in a difference in the degree of melting between the upper end (laser entry side) and the lower end (laser exit side) of the cut, forming a tilted cut surface. This affects the processing accuracy of the cut surface. Consequently, existing laser cutting technologies for hard and brittle materials often suffer from a technical problem: the difficulty in balancing processing efficiency with the requirements of non-destructive processing due to laser thermal effects and tilted cut surfaces, resulting in limited processing accuracy. Summary of the Invention

[0004] This invention provides a composite processing system and method for hard and brittle plates, which solves the technical problem that existing laser cutting technologies for hard and brittle plates often suffer from difficulties in balancing processing efficiency and non-destructive processing requirements due to laser thermal effects and inclined cutting surfaces, as well as the limitation of processing accuracy.

[0005] The technical solution adopted in this invention is: a composite processing system for hard and brittle plates, including a control module, a processing machine tool, and a cutting unit and a fixture platform installed on the processing machine tool; The fixture platform is used to position and fix the hard and brittle plate; the fixture platform is located on the lower side of the cutting unit; The cutting unit includes a laser emitting assembly and a vibrating knife assembly mounted on the machine tool; The machine tool is used to control the relative movement of the fixture platform and the cutting unit in the XYZ space; The control module is used to control the machine tool and the laser emitting assembly to drill pre-crack holes at intervals along the designed path on the upper surface of the hard and brittle plate according to the input cutting path information; and then control the machine tool and the vibrating knife assembly to split the hard and brittle plate along the designed path.

[0006] The composite processing system for hard and brittle plates provided by this invention utilizes the combined effects of laser and mechanical energy. It employs pulsed laser to create pre-drilled holes along a designed path at intervals, with a depth-to-diameter ratio, followed by cleaving along the same path using a vibrating blade assembly. This reduces the thermal impact of the laser while leveraging the high precision and smooth edges of the vibrating blade, eliminating the need for secondary grinding. This ensures that individual products do not have tilted cut surfaces after processing. Furthermore, the pre-drilled holes effectively reduce the cutting resistance experienced by the vibrating blade assembly during cleaving, preventing tool breakage due to excessive cutting resistance and avoiding vibration marks, cracks, and chipping on the cut surfaces of hard and brittle plates. This system solves the problems inherent in both laser processing and vibrating blade processing methods while retaining their respective advantages. It addresses the technical problem of existing laser cutting technologies for hard and brittle plates, which often suffer from difficulties in balancing processing efficiency with non-destructive processing requirements and limited processing precision due to laser thermal effects and tilted cut surfaces.

[0007] The machine tool only needs to be able to control the relative movement of the fixture platform and the cutting unit in the XYZ space. Its specific structure can be arranged in various ways, all of which are conventional technologies in the field of machine tool technology (for example, refer to the structure of the machine tool in the high-energy laser cutting machine and the vibrating knife cutting machine). Therefore, the specific structure of the machine tool will not be described in detail in this invention.

[0008] Furthermore, the laser emitting assembly includes a laser emitter and a scanning galvanometer mounted on the machine tool; The laser emitter is used to project a laser beam into the scanning galvanometer, and the laser beam is reflected by the scanning galvanometer to the upper surface of the hard and brittle plate. The control module is used to control the machine tool to move the hard and brittle plate fixed on the fixture platform to the first positioning station below the laser emitting assembly according to the input cutting path information, and then control the deflection angle of the scanning galvanometer and the start and stop of the laser emitter so that the laser emitting assembly can drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

[0009] By configuring the scanning galvanometer, the control module, based on the input cutting path information, controls the machine tool and the laser emitting assembly to drill pre-cracked holes at intervals along the designed path on the upper surface of the hard and brittle plate. During this process, the control module only needs to move the hard and brittle plate, which is fixed on the fixture platform, to the first positioning station below the laser emitting assembly. There is no need to control the machine tool to move the laser's landing point on the upper surface of the hard and brittle plate. Compared to using a laser emitting assembly that emits a vertical laser downwards, requiring the control module to control the machine tool to move the laser's landing point on the upper surface of the hard and brittle plate to drill pre-cracked holes at intervals, the high-speed movement characteristics of the scanning galvanometer can further improve processing efficiency.

[0010] Furthermore, the fixture platform is a perforated vacuum suction cup.

[0011] By setting the fixture platform as a dense-hole vacuum suction cup, the hard and brittle plate can be fixed by negative pressure adsorption when positioning and fixing the hard and brittle plate. This can effectively reduce the warping of the hard and brittle plate and improve the control accuracy of the laser focus when the laser emitting component drills pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path. It can also solve the technical problem of the difficulty in fixing each individual fragment of the hard and brittle plate during the cleaving process (such as in the process of cross cleaving or grid cleaving).

[0012] Based on the composite processing system for hard and brittle plates provided by the present invention, the present invention also provides a method for composite processing of hard and brittle plates; The composite processing method for hard and brittle plates includes: positioning and fixing the hard and brittle plates on a fixture platform; Input the cutting path information into the control module; The control module controls the laser emitting assembly of the processing machine tool and the cutting unit installed on the processing machine tool to drill pre-cracked holes at intervals along the designed path on the upper surface of the hard and brittle plate according to the input cutting path information. The control module controls the machine tool and the vibrating knife assembly of the cutting unit mounted on the machine tool to split the hard and brittle plate along the designed path according to the input cutting path information.

[0013] Furthermore, based on the input cutting path information, the control module controls the machine tool to move the hard and brittle plate fixed on the fixture platform to the first positioning station below the laser emitting assembly, and then controls the deflection angle of the scanning galvanometer of the laser emitting assembly and the start and stop of the laser emitter of the laser emitting assembly, so that the laser emitting assembly can drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

[0014] Furthermore, based on the input cutting path information, the control module controls the machine tool to move the hard and brittle plate with pre-cracked holes to the second positioning station under the vibrating knife assembly, and then controls the machine tool and the vibrating knife assembly to crack the hard and brittle plate along the designed path.

[0015] For laser emitting components that emit vertical lasers downwards, requiring the control module to control the machine tool to move the laser's landing point on the upper surface of the hard and brittle plate to create pre-cracked holes at intervals, the composite processing method for hard and brittle plates provided by this invention also offers the following technical solution: Furthermore, based on the input cutting path information, the control module controls the machine tool to move the hard and brittle plate fixed on the fixture platform to the third positioning station below the laser emitting assembly, and then controls the machine tool and the laser emitting assembly to drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

[0016] Furthermore, the hole edge distance between two adjacent pre-cracked holes on the design path is equal to a preset distance value, the preset distance value being in the range of 5 micrometers to 10 micrometers.

[0017] Furthermore, the depth of the pre-cracked hole is equal to a preset depth value, which ranges from 15% to 30% of the thickness of the hard and brittle plate fixed on the fixture platform in the vertical direction.

[0018] By setting the range of the preset depth value to 15% to 30% of the thickness of the hard and brittle plate fixed on the fixture platform in the vertical direction, the thermal effect generated when drilling the pre-cracked hole can be further reduced. In addition, during the subsequent process of the control module controlling the machine tool and the vibrating knife assembly to crack the hard and brittle plate along the design path, the influence of the tapered inner hole of the pre-cracked hole on the flatness of the cut surface can be reduced.

[0019] Furthermore, the diameter of the pre-cracked hole ranges from 30 micrometers to 100 micrometers. Attached Figure Description

[0020] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the composite processing system for hard and brittle plates in Example 1; Among them, 1—machine tool, 2—fixture platform, 3—vibrating knife assembly, and 4—scanning galvanometer. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0023] Example 1: like Figure 1 As shown, this embodiment 1 provides a composite processing system for hard and brittle plates, including a control module, a processing machine tool 1, and a cutting unit and a fixture platform 2 installed on the processing machine tool 1; The fixture platform 2 is used to position and fix the hard and brittle plate parts; the fixture platform 2 is located on the lower side of the cutting unit; The cutting unit includes a laser emitting assembly and a vibrating knife assembly 3 mounted on the machine tool 1; Machine tool 1 is used to control the relative movement of fixture platform 2 and cutting unit in XYZ space; The control module is used to control the processing machine tool 1 and the laser emission assembly to drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path according to the input cutting path information; and then control the processing machine tool 1 and the vibrating knife assembly 3 to split the hard and brittle plate along the designed path.

[0024] The composite processing system for hard and brittle plates provided by this invention utilizes the combined effects of laser and mechanical energy. It employs pulsed laser to create pre-drilled holes along a designed path at intervals, with a depth-to-diameter ratio, followed by a vibrating blade assembly 3 to perform dicing along the designed path. This reduces the thermal impact of the laser while leveraging the high precision and smooth cutting edges of the vibrating blade, eliminating the need for secondary grinding. This ensures that individual products do not have tilted cut surfaces after processing. Furthermore, the pre-drilled holes effectively reduce the cutting resistance experienced by the vibrating blade assembly 3 during dicing, preventing tool breakage due to excessive cutting resistance and avoiding vibration marks, cracks, and chipping on the cut surfaces of hard and brittle plates. This system solves the problems inherent in both laser processing and vibrating blade processing methods while retaining their respective advantages. It addresses the technical problem of existing laser cutting technologies for hard and brittle plates, which often suffer from difficulties in balancing processing efficiency with non-destructive processing requirements and limited processing precision due to laser thermal effects and tilted cut surfaces.

[0025] The processing machine tool 1 only needs to satisfy the function of controlling the relative movement of the fixture platform 2 and the cutting unit in the XYZ space. Its specific structure can be arranged in various ways, all of which are conventional technologies in the field of processing machine tool 1 (for example, referring to the structure of processing machine tool 1 in high-energy laser cutting machine and vibrating knife cutting machine). Therefore, the specific structure of processing machine tool 1 will not be described in detail in this invention.

[0026] Among them, the acquisition of cutting path information is a conventional technology in this field. It can be obtained by referring to the marking path generation software of the laser marking machine in the prior art. By importing the drawing of the hard and brittle plate to be processed into the above software, the cutting path information on the upper surface of the hard and brittle plate can be generated.

[0027] Preferably, in this embodiment 1, as Figure 1 As shown, the laser emitting assembly includes a laser emitter and a scanning galvanometer 4 mounted on the machine tool 1; The laser emitter is used to inject laser light into the scanning galvanometer 4, and the laser light is reflected by the scanning galvanometer 4 to the upper surface of the hard and brittle plate. The control module is used to control the processing machine tool 1 to move the hard and brittle plate fixed on the fixture platform 2 to the first positioning station below the laser emitting component according to the input cutting path information. Then, it controls the deflection angle of the scanning galvanometer 4 and the start and stop of the laser emitter, so that the laser emitting component can make pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

[0028] By setting up the scanning galvanometer 4, the control module controls the machining tool 1 and the laser emitting assembly to drill pre-cracked holes at intervals on the upper surface of the hard and brittle plate according to the input cutting path information. During this process, the control module only needs to control the machining tool 1 to move the hard and brittle plate, which is fixed on the fixture platform 2, to the first positioning station below the laser emitting assembly. There is no need to control the machining tool 1 to move the laser landing point on the upper surface of the hard and brittle plate. Compared with the method of using a laser emitting assembly that simply emits a vertical laser downwards, which requires the control module to control the machining tool 1 to move the laser landing point on the upper surface of the hard and brittle plate to drill pre-cracked holes at intervals, the high-speed motion characteristics of the scanning galvanometer 4 can be used to further improve the processing efficiency.

[0029] Preferably, in this embodiment 1, as Figure 1 As shown, fixture platform 2 is a perforated vacuum suction cup.

[0030] By setting the fixture platform 2 as a dense-hole vacuum suction cup, the hard and brittle plate can be fixed by negative pressure adsorption when positioning and fixing the hard and brittle plate. This can effectively reduce the warping of the hard and brittle plate and improve the control accuracy of the laser focus when the laser emitting component drills pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path. It can also solve the technical problem of fixing each individual fragment of the hard and brittle plate during the cleaving process (such as during cross cleaving or grid cleaving).

[0031] Example 2: Based on the composite processing system for hard and brittle plates provided in Example 1, Example 2 provides a composite processing method for hard and brittle plates. The composite processing method for hard and brittle plates includes: positioning and fixing the hard and brittle plates on the fixture platform 2; Input the cutting path information into the control module; Based on the input cutting path information, the control module controls the laser emitting assembly of the processing machine tool 1 and the cutting unit mounted on the processing machine tool 1 to drill pre-cracked holes at intervals along the designed path on the upper surface of the hard and brittle plate. The control module controls the machine tool 1 and the vibrating knife assembly 3 of the cutting unit mounted on the machine tool 1 to split the hard and brittle plate along the designed path according to the input cutting path information.

[0032] Based on the two selections of the laser emitting component in Embodiment 1 (using a laser emitting component that simply emits vertical laser light downwards, and using a laser emitting component equipped with a scanning galvanometer 4), this Embodiment 2 also provides two corresponding control methods: In this embodiment 2, for a laser emitting assembly equipped with a scanning galvanometer 4, the method by which the control module controls the laser emitting assembly of the machining tool 1 and the cutting unit mounted on the machining tool 1 to drill pre-cracked holes at intervals along the designed path on the upper surface of the hard and brittle plate according to the input cutting path information includes: Based on the input cutting path information, the control module controls the machining tool 1 to move the hard and brittle plate fixed on the fixture platform 2 to the first positioning station below the laser emitting component. Then, it controls the deflection angle of the scanning galvanometer 4 of the laser emitting component and the start and stop of the laser emitter of the laser emitting component, so that the laser emitting component can drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

[0033] In this embodiment 2, using a laser emitting assembly that emits a vertical laser beam downwards, the method by which the control module controls the laser emitting assembly of the machining tool 1 and the cutting unit mounted on the machining tool 1 to drill pre-cracked holes at intervals along the designed path on the upper surface of the hard and brittle plate, based on the input cutting path information, includes: Based on the input cutting path information, the control module controls the machining tool 1 to move the hard and brittle plate fixed on the fixture platform 2 to the third positioning station below the laser emitting component. Then, the control module controls the machining tool 1 and the laser emitting component to drill pre-cracked holes at intervals on the upper surface of the hard and brittle plate along the designed path.

[0034] Specifically, in this embodiment 2, the method by which the control module controls the machine tool 1 and the vibrating knife assembly 3 of the cutting unit mounted on the machine tool 1 to chop the hard and brittle plate along the designed path according to the input cutting path information includes: Based on the input cutting path information, the control module controls the machining tool 1 to move the hard and brittle plate with pre-cracked holes to the second positioning station under the vibrating knife assembly 3, and then controls the machining tool 1 and the vibrating knife assembly 3 to crack the hard and brittle plate along the designed path.

[0035] Specifically, in this embodiment 2, the hole edge distance between two adjacent pre-cracked holes on the design path is equal to a preset distance value, and the preset distance value ranges from 5 micrometers to 10 micrometers.

[0036] Specifically, in this embodiment 2, the depth of the pre-cracked hole is equal to the preset depth value, and the preset depth value ranges from 15% to 30% of the thickness of the hard and brittle plate fixed on the fixture platform 2 in the vertical direction.

[0037] By setting the preset depth value to 15% to 30% of the thickness of the hard and brittle plate fixed on the fixture platform 2 in the vertical direction, the thermal effect generated when drilling the pre-crack hole can be further reduced. In addition, during the subsequent process of the control module controlling the machining tool 1 and the vibrating knife assembly 3 to crack the hard and brittle plate along the design path, the influence of the tapered inner hole of the pre-crack hole on the flatness of the cut surface can be reduced.

[0038] Specifically, in this embodiment 2, the diameter of the pre-cracked hole ranges from 30 micrometers to 100 micrometers.

[0039] The composite processing system and method for hard and brittle plates provided by this invention have at least the following technical effects or advantages: 1. The composite processing system for hard and brittle plates provided by this invention can utilize the combined effects of laser and mechanical energy. It uses pulsed laser to pre-drill holes with a depth-to-diameter ratio along a designed path, followed by a vibrating blade assembly 3 to perform flaking along the designed path. This reduces the thermal impact of the laser and leverages the high precision and smooth cutting edges of the vibrating blade, eliminating the need for secondary grinding. This ensures that individual products do not have tilted cut surfaces after processing. Furthermore, the pre-drilled holes effectively reduce the cutting resistance experienced by the vibrating blade assembly 3 during flaking, preventing tool breakage due to excessive cutting resistance and avoiding vibration marks, cracks, and chipping on the cut surfaces of hard and brittle plates. This system solves the problems inherent in both laser processing and vibrating blade processing methods while retaining their respective advantages. It addresses the technical problem that existing laser cutting technologies for hard and brittle plates often suffer from difficulties in balancing processing efficiency with non-destructive processing requirements due to laser thermal effects and tilted cut surfaces, resulting in limited processing precision.

[0040] 2. By setting up the scanning galvanometer 4, the control module controls the machining tool 1 and the laser emitting assembly to drill pre-cracked holes at intervals on the upper surface of the hard and brittle plate according to the input cutting path information. During this process, the control module only needs to control the machining tool 1 to move the hard and brittle plate, which is fixed on the fixture platform 2, to the first positioning station below the laser emitting assembly. There is no need to control the machining tool 1 to move the laser landing point on the upper surface of the hard and brittle plate. Compared with the method of using a laser emitting assembly that emits a vertical laser downwards, which requires the control module to control the machining tool 1 to move the laser landing point on the upper surface of the hard and brittle plate to drill pre-cracked holes at intervals, the high-speed movement characteristics of the scanning galvanometer 4 can be used to further improve the processing efficiency.

[0041] 3. By setting the fixture platform 2 as a dense-hole vacuum suction cup, the hard and brittle plate can be fixed by negative pressure adsorption when positioning and fixing the hard and brittle plate. This can effectively reduce the warping of the hard and brittle plate and improve the control accuracy of the laser focus when the laser emitting component drills pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path. It can also solve the technical problem of fixing each individual crack of the hard and brittle plate during the cracking process (such as during cross cracking or grid cracking).

[0042] 4. By setting the range of the preset depth value to 15% to 30% of the thickness of the hard and brittle plate fixed on the fixture platform 2 in the vertical direction, the heat effect generated when drilling the pre-crack hole can be further reduced. In addition, during the subsequent process of the control module controlling the processing machine tool 1 and the vibrating knife assembly 3 to crack the hard and brittle plate along the design path, the influence of the tapered inner hole of the pre-crack hole on the flatness of the cut surface can be reduced.

[0043] The above are merely specific application examples of the present invention and do not constitute any limitation on the scope of protection of the present invention. All technical solutions formed by equivalent transformation or equivalent substitution fall within the scope of protection of the present invention.

Claims

1. A composite processing system for hard and brittle sheet metal parts, characterized in that: It includes a control module, a machine tool, and a cutting unit and fixture platform mounted on the machine tool; The fixture platform is used to position and fix the hard and brittle plate; the fixture platform is located on the lower side of the cutting unit; The cutting unit includes a laser emitting assembly and a vibrating knife assembly mounted on the machine tool; The machine tool is used to control the relative movement of the fixture platform and the cutting unit in the XYZ space; The control module is used to control the machine tool and the laser emitting assembly to drill pre-crack holes at intervals along the designed path on the upper surface of the hard and brittle plate according to the input cutting path information; and then control the machine tool and the vibrating knife assembly to split the hard and brittle plate along the designed path.

2. The composite processing system for hard and brittle plates according to claim 1, characterized in that: The laser emitting assembly includes a laser emitter and a scanning galvanometer mounted on the machine tool; The laser emitter is used to project a laser beam into the scanning galvanometer, and the laser beam is reflected by the scanning galvanometer to the upper surface of the hard and brittle plate. The control module is used to control the machine tool to move the hard and brittle plate fixed on the fixture platform to the first positioning station below the laser emitting assembly according to the input cutting path information, and then control the deflection angle of the scanning galvanometer and the start and stop of the laser emitter so that the laser emitting assembly can drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

3. The composite processing system for hard and brittle plates according to claim 1, characterized in that: The fixture platform is a perforated vacuum suction cup.

4. A method for composite processing of hard and brittle plate parts, characterized in that: The composite processing system for hard and brittle plates is implemented based on any one of claims 1-3; The composite processing method for hard and brittle plates includes: positioning and fixing the hard and brittle plates on a fixture platform; Input the cutting path information into the control module; The control module controls the laser emitting assembly of the processing machine tool and the cutting unit installed on the processing machine tool to drill pre-cracked holes at intervals along the designed path on the upper surface of the hard and brittle plate according to the input cutting path information. The control module controls the machine tool and the vibrating knife assembly of the cutting unit mounted on the machine tool to split the hard and brittle plate along the designed path according to the input cutting path information.

5. The composite processing method for hard and brittle plates according to claim 4, characterized in that: The control module controls the machine tool to move the hard and brittle plate fixed on the fixture platform to the first positioning station below the laser emitting assembly based on the input cutting path information. Then, it controls the deflection angle of the scanning galvanometer of the laser emitting assembly and the start and stop of the laser emitter of the laser emitting assembly, so that the laser emitting assembly can drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the designed path.

6. The composite processing method for hard and brittle plates according to claim 4, characterized in that: The control module controls the machine tool to move the hard and brittle plate with pre-cracked holes to the second positioning station under the vibrating knife assembly based on the input cutting path information. Then, the control module controls the machine tool and the vibrating knife assembly to crack the hard and brittle plate along the designed path.

7. The composite processing method for hard and brittle plates according to claim 4, characterized in that: According to the input cutting path information, the control module controls the machine tool to move the hard and brittle plate fixed on the fixture platform to the third positioning station below the laser emitting component, and then controls the machine tool and the laser emitting component to drill pre-crack holes at intervals on the upper surface of the hard and brittle plate along the design path.

8. The composite processing method for hard and brittle plates according to claim 4, characterized in that: The hole edge distance between two adjacent pre-cracked holes on the design path is equal to a preset distance value, which ranges from 5 micrometers to 10 micrometers.

9. The composite processing method for hard and brittle plates according to claim 4, characterized in that: The depth of the pre-cracked hole is equal to a preset depth value, which ranges from 15% to 30% of the thickness of the hard and brittle plate fixed on the fixture platform in the vertical direction.

10. The composite processing method for hard and brittle plates according to claim 4, characterized in that: The diameter of the pre-cracked hole ranges from 30 micrometers to 100 micrometers.

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