Forming device for rubber product preparation

Abstract

The invention relates to the technical field of rubber processing, and provides a forming device for rubber product preparation, which comprises a base and a telescopic rod, the telescopic rod is mounted at the top of the base, an upper mold is mounted at the telescopic end of the base, a lower mold is mounted at the bottom of the inner side of the base, and a temperature control cavity, a liquid return groove and a liquid inlet groove are formed in the lower mold; and the heat exchange box is installed at the bottom of the inner side of the base, and a sealing cylinder, a liquid return pipe and a communicating pipe are installed between the heat exchange box and the lower die in a communicating mode. According to the device, the liquid return pipe and the one-way valve in the sealing cylinder are used for blocking the flow direction of the heat conduction liquid, at the moment, the heat conduction liquid can uniformly heat the cavity of the mold through the temperature control cavity and the liquid return groove when wrapping the cavity in all directions, and when the heating device heats the heat conduction liquid, the temperature rise of the whole heat conduction liquid is synchronous and uniform; therefore, the problem that local heating is not uniform due to traditional resistance wire heating is solved.

Description

Technical Field

[0001] This application relates to the field of rubber processing technology, specifically to a molding apparatus for preparing rubber products. Background Technology

[0002] Rubber products are widely used in various industries. They possess unique properties such as high elasticity and reversible deformation. They are elastic at room temperature, capable of significant deformation under small external forces, and return to their original shape after the force is removed. Rubber molding equipment is used in rubber molding processes. This equipment consists of upper and lower molds. When the molds are closed, the gap between them forms the cavity for rubber molding. The raw material is placed in the lower mold and then pressed into shape. During the molding process, the mold is often heated to promote the flowability of the rubber, allowing it to completely fill the mold cavity. After the rubber product is molded, it needs to be cooled to prevent the rubber from continuing the vulcanization reaction due to residual heat, which would lead to a decline in product performance. However, the temperature control system of the molding device, which consists of heating and cooling, has obvious defects in the existing technology: uneven heating. When the heating wire is in direct contact with the mold, the overall heating of the mold has a process of heating from near to far. That is, the part closer to the heating point heats up faster, while the part farther away heats up slower. This causes uneven heating of the rubber product located in the cavity, which in turn generates internal stress and damages the product's performance. Therefore, it is urgent to solve this problem and redesign the temperature control system of the molding device. Summary of the Invention

[0003] To overcome the above-mentioned defects, embodiments of this application provide a molding apparatus for preparing rubber products, which solves the technical problem of uneven heating in related technologies.

[0004] This invention provides a molding apparatus for preparing rubber products, including a base, comprising; A telescopic rod is installed on the top of the base. An upper mold is installed on the telescopic end of the base, and a lower mold is installed on the inner bottom of the base. The lower mold has a temperature control chamber, a return liquid tank, and an inlet liquid tank inside. A heat exchange box is installed on the inner bottom of the base. A sealing cylinder, a return pipe, and a connecting pipe are installed between the heat exchange box and the lower mold. A pump is installed on the top of the heat exchange box. The inlet end of the pump enters the inner cavity of the heat exchange box and is connected to an upper sealing chamber. A lower sealing chamber is fixedly installed at the bottom of the inner cavity of the heat exchange box. Multiple heat exchange tanks are installed between the upper and lower sealing chambers. A semiconductor cooler is fixedly installed on one side of each heat exchange tank. A fan is installed on the outside of the heat exchange box. The outlet end of the pump is connected to the sealing cylinder. A heating device is fixedly installed on the inner wall of the liquid inlet tank. The liquid return pipe is connected to the liquid return tank and the connecting pipe. The sealing cylinder is connected to the liquid inlet tank. The inner cavities of the temperature control chamber, the liquid return tank, the liquid inlet tank, the upper sealing chamber, the lower sealing chamber, and the heat exchange tank are all filled with heat-conducting liquid.

[0005] Preferably, the return pipe and return tank are each set into four groups and are distributed equidistantly in a circle on the outer circumferential surface of the lower mold. The inlet tank is located at the bottom of the temperature control cavity, and the temperature control cavity, the return tank and the inlet tank are connected.

[0006] Preferably, a sealing plate and a spring are movably sleeved on the inner wall of the return pipe. The diameter of the sealing plate is greater than the inner diameter of the return tank and less than the inner diameter of the return pipe. The sealing plate is elastically abutted against the inner wall of the return pipe near the return tank by the spring.

[0007] Preferably, a sealing opening is provided in the middle of the sealing cylinder, and a second spring and a second sealing plate are movably sleeved inside the sealing cylinder. The diameter of the second sealing plate is greater than the inner diameter of the sealing opening and less than the inner diameter of the sealing cylinder. The second spring elastically abuts against the top of the sealing opening.

[0008] Preferably, an adapter cylinder is fixedly connected to the inner wall of the liquid inlet tank, and the adapter cylinder is made of rubber block.

[0009] Preferably, the heat exchange tanks are configured in at least eleven groups and are equidistantly distributed along a horizontal line. The multiple groups of heat exchange tanks are parallel to each other. The upper sealing chamber, the lower sealing chamber, and the heat exchange tanks are all made of brass. The upper sealing chamber, the lower sealing chamber, and the heat exchange tanks are fixed together by laser welding.

[0010] Preferably, the side of the semiconductor cooler that is in contact with and fixed to the heat exchange tank is the cold end, and a gap is left between the hot end of the semiconductor cooler and another set of adjacent heat exchange tanks.

[0011] Preferably, the fan is connected and installed at the rear of the heat exchange box, and the heat exchange box has an exhaust vent on the front.

[0012] Preferably, the heat-conducting liquid is made of mineral-based heat-conducting oil, and the heat-conducting liquid fills the temperature control chamber, return tank, inlet tank, return pipe, connecting pipe, upper sealing chamber, lower sealing chamber, semiconductor cooler, and sealing cylinder.

[0013] Beneficial effects 1. This device has been redesigned to ensure more uniform heating of the rubber products within the device, significantly improving their quality and performance. To achieve this, the temperature control system has been redesigned, comprising two modules for heating and cooling the lower mold. The heating module includes a heating device located in the liquid inlet tank, which provides the heat source during heating. Inside the lower mold, interconnected temperature control chambers, return tanks, and inlet tanks are sealed and filled with heat-conducting liquid. The flow of the heat-conducting liquid is blocked by a one-way valve design inside the return pipe and the sealing cylinder. At this time, the heat-conducting liquid can uniformly heat the mold cavity from all directions through the temperature control chamber and the return tank. When the heating device heats the heat-conducting liquid, the temperature rise of the entire heat-conducting liquid is synchronous and uniform, which solves the problem of uneven local heating caused by traditional resistance wire heating.

[0014] 2. Then, as a supplement to the heating module, the cooling module designed in this device mainly includes a heat exchange box, an upper sealed chamber, a lower sealed chamber, a heat exchange tank, a semiconductor cooler, a return pipe, a connecting pipe, a sealing cylinder, a pump, and a fan. The cooling module is connected to the heating module through the return pipe, the connecting pipe, and the sealing cylinder. The functions of sealing plate one, spring one, the sealing port, sealing plate two, and spring two are to prevent the heat-conducting liquids at both ends of sealing plate one and sealing plate two from being isolated from each other in the heating mode, thus preventing heat transfer. When the cooling mode is activated, the cold end of the semiconductor cooler first cools the heat exchange tank, allowing the heat exchange tank to exchange heat with the heat-conducting liquid flowing through it. Then, the fan and exhaust vents are used to create air-cooled convection between the heat exchange tanks. The heat generated by heat exchange between the heat exchange tank and the heat transfer liquid is carried away. Therefore, when the pump is turned on, the sealing plates 1 and 2 are pushed open by the pressure of the heat transfer liquid flow, thereby quickly replacing a portion of the heat transfer liquid originally used for heating in the temperature control chamber, return tank, and inlet tank. Another portion of the heat transfer liquid, cooled inside the heat exchange box, is flushed into the temperature control chamber, return tank, and inlet tank to uniformly and rapidly cool the rubber products in the lower mold and cavity. Meanwhile, a portion of the heat transfer liquid discharged into the heat exchange box along the return pipe and connecting pipe enters the next cycle after heat exchange and cooling. This design can significantly improve the cooling molding efficiency of the device, and the overall working efficiency is higher after the entire temperature control system is integrated. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a front sectional view of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged schematic diagram of the structure at point A; Figure 3 For the present invention Figure 1 Enlarged schematic diagram of the structure at point B; Figure 4 This is a frontal perspective view of the overall structure of the present invention; Figure 5 This is a side sectional view of the overall structure of the present invention; Figure 6 This is a cross-sectional view of the lower mold, heating device, heat exchange box, upper sealing chamber, lower sealing chamber and heat exchange tank of the present invention. Figure 7 For the present invention Figure 6 Enlarged schematic diagram of the structure at point C; Figure 8 This is a top sectional view of the heat exchange box, upper sealing chamber, lower sealing chamber, and heat exchange tank of the present invention. Figure 9 This is a schematic diagram showing the separation of the sealing cylinder, pump, heat exchange box, upper sealing chamber, lower sealing chamber, heat exchange tank, and semiconductor cooler of the present invention.

[0017] In the diagram: 1. Base; 2. Telescopic rod; 3. Upper mold; 4. Lower mold; 5. Heating device; 6. Return pipe; 7. Connecting pipe; 8. Sealing cylinder; 9. Pump; 10. Heat exchange box; 11. Upper sealing chamber; 12. Lower sealing chamber; 13. Heat exchange tank; 14. Semiconductor cooler; 15. Temperature control chamber; 16. Return tank; 17. Inlet tank; 18. Adapter cylinder; 19. Sealing plate one; 20. Spring one; 21. Sealing port; 22. Sealing plate two; 23. Spring two; 24. Fan; 25. Exhaust port. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0019] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0020] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in a sequence other than those illustrated or described herein.

[0022] To make the drawings concise and easy to understand, some drawings only show one of the components with the same structure or function, or only one of them is marked. In this article, "one" not only means "only one", but can also mean "more than one", and "several" includes "two" and "more than two".

[0023] Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus. It is understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. The embodiments of this application are described in detail below with reference to the accompanying drawings.

[0024] like Figures 1-9 As shown, it illustrates a molding apparatus for preparing rubber products according to the present invention, including a base 1, comprising; Telescopic rod 2 is installed on the top of base 1. The telescopic end of base 1 is equipped with upper mold 3. The bottom inner side of base 1 is equipped with lower mold 4. The interior of lower mold 4 is provided with temperature control cavity 15, return liquid tank 16 and liquid inlet tank 17. A heat exchange box 10 is installed on the inner bottom of the base 1. A sealing cylinder 8, a return pipe 6, and a connecting pipe 7 are installed between the heat exchange box 10 and the lower mold 4. A pump 9 is installed on the top of the heat exchange box 10. The inlet end of the pump 9 passes through the inner cavity of the heat exchange box 10 and is connected to the upper sealing chamber 11. A lower sealing chamber 12 is fixedly installed at the bottom of the inner cavity of the heat exchange box 10. Multiple sets of heat exchange tanks 13 are installed between the upper sealing chamber 11 and the lower sealing chamber 12. A semiconductor cooler 14 is fixedly installed on one side of the heat exchange tank 13. A fan 24 is installed on the outside of the heat exchange box 10. The outlet end of the pump 9 is connected to the sealing cylinder 8. A heating device 5 is fixedly installed on the inner wall of the liquid inlet tank 17. The return pipe 6 is connected to the return tank 16 and the connecting pipe 7. The sealing cylinder 8 is connected to the liquid inlet tank 17. The inner cavities of the temperature control chamber 15, the return tank 16, the liquid inlet tank 17, the upper sealing chamber 11, the lower sealing chamber 12 and the heat exchange tank 13 are all filled with heat-conducting liquid. This device has been redesigned to ensure more uniform heating of the rubber products within, significantly improving their quality and performance. To achieve this, the temperature control system has been redesigned, comprising two modules for heating and cooling the lower mold 4. The heating module includes a heating device 5 located in the liquid inlet tank 17, which provides the heat source during heating. Inside the lower mold 4, interconnected temperature control chamber 15, return tank 16, and inlet tank 17 are sealed and filled with heat-conducting liquid. The flow of the heat-conducting liquid is blocked by a one-way valve design inside the return pipe 6 and the sealing cylinder 8. At this time, the heat-conducting liquid can uniformly heat the mold cavity from all directions through the temperature control chamber 15 and the return tank 16. When the heating device 5 heats the heat-conducting liquid, the temperature rise of the entire heat-conducting liquid is synchronous and uniform, which solves the problem of uneven local heating caused by traditional resistance wire heating.

[0025] Then, as a supplement to the heating module, the cooling module designed in this device mainly includes a heat exchange box 10, an upper sealing chamber 11, a lower sealing chamber 12, a heat exchange tank 13, a semiconductor cooler 14, a return pipe 6, a connecting pipe 7, a sealing cylinder 8, a pump 9, and a fan 24. The cooling module is connected to the heating module through the return pipe 6, the connecting pipe 7, and the sealing cylinder 8. The function of the sealing plate 19, spring 20, sealing port 21, sealing plate 22, and spring 23 is to prevent the heat-conducting liquids at both ends of the sealing plate 19 and sealing plate 22 from being isolated from each other in the heating mode, thus preventing heat transfer. When the cooling mode is activated, the cold end of the semiconductor cooler 14 first cools the heat exchange tank 13, allowing the heat exchange tank 13 to exchange heat with the heat-conducting liquid flowing through it. Then, the fan 24 and the exhaust port 25 are used to cool the heat exchange tank 13. Airflow is used to cool the heat exchange tank 13 and the heat transfer liquid, carrying away the heat generated by the heat exchange. Therefore, when the pump 9 is turned on, the sealing plate 19 and the sealing plate 22 will be pushed open by the pressure of the heat transfer liquid flow, thereby quickly replacing part of the heat transfer liquid originally used for heating in the temperature control chamber 15, the return tank 16 and the inlet tank 17. Another part of the heat transfer liquid, which has been cooled inside the heat exchange box 10, is flushed into the temperature control chamber 15, the return tank 16 and the inlet tank 17 to uniformly and quickly cool the lower mold 4 and the rubber product in the cavity. The part of the heat transfer liquid discharged into the heat exchange box 10 along the return pipe 6 and the connecting pipe 7 will enter the next cycle after heat exchange and cooling. This design can significantly improve the cooling molding efficiency of the device, and the overall working efficiency is higher after the integration of the entire temperature control system.

[0026] As a specific embodiment, the return pipe 6 and the return tank 16 are both set into four groups and are distributed in a circular pattern at equal intervals on the outer circumference of the lower mold 4. The inlet tank 17 is located at the bottom of the temperature control cavity 15. The temperature control cavity 15, the return tank 16 and the inlet tank 17 are connected. like Figure 1 As shown, the return tank 16 and the lower sealing chamber 12 are connected by the return pipe 6 and the connecting pipe 7, and the inlet tank 17 and the upper sealing chamber 11 are connected by the sealing cylinder 8 and the pump 9. When the pump 9 starts, the heat transfer liquid starts from the pump 9 and goes upward through the sealing cylinder 8 to push open the sealing plate 22 and enter the inlet tank 17. Then it enters the temperature control chamber 15 and the return tank 16, and enters the return pipe 6. It pushes open the sealing plate 19 to the outside and enters the connecting pipe 7. Then it enters the lower sealing chamber 12 and goes upward through multiple sets of heat exchange tanks 13 before entering the upper sealing chamber 11, completing one cycle.

[0027] As a specific embodiment, a sealing plate 19 and a spring 20 are movably sleeved on the inner wall of the return pipe 6. The diameter of the sealing plate 19 is greater than the inner diameter of the return tank 16 and less than the inner diameter of the return pipe 6. The sealing plate 19 is elastically abutted against the side of the inner wall of the return pipe 6 near the return tank 16 by the spring 20. like Figure 1 , Figure 2 and Figure 3 As shown, sealing plate 19 and spring 20 are responsible for blocking the return pipe 6, so that the heat-conducting liquid at both ends of sealing plate 19 is isolated when pump 9 stops running. Similarly, sealing plate 22 and spring 23 are also responsible for isolating the heat-conducting liquid at both ends of sealing plate 22, so that the liquid at both ends is isolated during heating to avoid heat loss. During cooling, they are automatically pushed open under the drive of pump 9, thereby completing the circulation cooling function of heat-conducting liquid.

[0028] As a specific embodiment, a sealing opening 21 is provided in the middle of the sealing cylinder 8. A second spring 23 and a second sealing plate 22 are movably sleeved inside the sealing cylinder 8. The diameter of the second sealing plate 22 is greater than the inner diameter of the sealing opening 21 and less than the inner diameter of the sealing cylinder 8. The second spring 23 elastically abuts against the top of the sealing opening 21. like Figure 3 As shown, the sealing plate 22 is tightly pressed against the top of the sealing port 21 by the downward elastic force of the spring 23 to form a seal, thereby effectively isolating the heat-conducting liquid at both ends of the sealing plate 22.

[0029] As a specific embodiment, an adapter cylinder 18 is fixedly connected to the inner wall of the liquid inlet tank 17, and the adapter cylinder 18 is made of rubber block; like Figure 1 As shown, when the heat-conducting liquid in the temperature control chamber 15, the return liquid tank 16 and the inlet liquid tank 17 is heated and expands, its volume will inevitably expand. At this time, the adapter cylinder 18 is used to neutralize the volume expansion of the heat-conducting liquid by deformation, which can eliminate the risk of the sealing plate 19 and the sealing plate 22 being opened.

[0030] As a specific embodiment, the heat exchange tank 13 is set to at least eleven groups and is distributed at equal intervals along the horizontal line. The multiple groups of heat exchange tanks 13 are parallel to each other. The upper sealing chamber 11, the lower sealing chamber 12 and the heat exchange tank 13 are all made of brass. The upper sealing chamber 11, the lower sealing chamber 12 and the heat exchange tank 13 are fixed together by laser welding. like Figure 1 As shown, the heat exchange tank 13 is responsible for increasing the heat exchange area between the heat transfer liquid and the heat exchange medium. The upper sealing chamber 11, the lower sealing chamber 12 and the heat exchange tank 13 are fixed together by laser welding, which can directly attach metal to metal, thereby maximizing the heat dissipation efficiency.

[0031] As a specific embodiment, the side of the semiconductor cooler 14 that is in contact with and fixed to the heat exchange tank 13 is the cold end, and a gap is left between the hot end of the semiconductor cooler 14 and another set of heat exchange tanks 13 adjacent to it. like Figure 1As shown, the cold end of the semiconductor cooler 14 directly contacts and cools the heat exchange tank 13, thereby conducting heat conduction cooling on the heat-conducting liquid inside the heat exchange tank 13. Combined with the air cooling of the fan 24, the heat dissipation efficiency of the heat-conducting liquid is improved.

[0032] As a specific embodiment, the fan 24 is connected and installed on the rear side of the heat exchange box 10, and the front of the heat exchange box 10 is provided with an exhaust port 25; like Figure 8 As shown, the fan 24 and the exhaust port 25 create a convection airflow from back to front within the heat exchange box 10, thereby carrying away the heat dissipated between the multiple heat exchange tanks 13 and cooling the heat-conducting liquid.

[0033] As a specific embodiment, the heat transfer fluid is made of mineral-based heat transfer oil and fills the temperature control chamber 15, the return tank 16, the inlet tank 17, the return pipe 6, the connecting pipe 7, the upper sealing chamber 11, the lower sealing chamber 12, the semiconductor cooler 14, and the sealing cylinder 8. Mineral-based heat transfer oil: It is made from petroleum distillate as base oil through refining. It has low cost and wide application. It has good thermal conductivity, but it is easy to oxidize at high temperatures and needs to be used in closed systems. According to the national standard GB23971-2009, the maximum operating temperature of mineral-based heat transfer oil is generally no more than 320°C. For example, L-QC grade products can operate stably at 320°C.

[0034] Working principle: When this device is in operation: First, activate the telescopic rod 2 and move the upper mold 3 upward to a high position, place the rubber material on the top of the lower mold 4, activate the heating device 5, and heat the heat-conducting liquid in the temperature control chamber 15, the return liquid tank 16 and the inlet liquid tank 17, so that the heat is evenly distributed to all parts of the inner cavity of the lower mold 4. Then, activate the telescopic rod 2, which pulls the upper mold 3 downwards, causing the upper mold 3 and lower mold 4 to combine and close to form a cavity. This then compresses the rubber located in the cavity, softening the rubber and quickly and evenly filling the entire cavity. At this point, as... Figure 1 , Figure 2 and Figure 3 As shown, a portion of the heat-conducting liquid used to heat the cavity is confined in the temperature control cavity 15, the return liquid tank 16, and the inlet liquid tank 17 by the sealing plate 19 and the sealing plate 22, so that the other portion of the heat-conducting liquid located in the connecting pipe 7, the upper sealing chamber 11, the lower sealing chamber 12, and the heat exchange tank 13 is isolated from them and prevented from being heated as well. Finally, after the rubber product is formed in the cavity, the heating device 5 is turned off, and the heating of the heat-conducting liquid is stopped. Then, the pump 9 is started, and the heat-conducting liquid in the upper sealing chamber 11 flows upward toward the sealing cylinder 8, pushing open the sealing plate 22 and compressing the spring 23. The remaining unheated heat-conducting liquid enters the inlet tank 17, causing a portion of the heat-conducting liquid originally located in the temperature control chamber 15 to begin to be pressurized and flow toward one side of the sealing plate 19, pushing open the sealing plate 19 to the outside, while simultaneously compressing the spring 20. Figure 1 As shown, the heat-conducting liquid from the temperature control chamber 15 flows back to the lower sealing chamber 12 through the return pipe 6 and the connecting pipe 7, and then, under the action of the pump 9, flows upward through multiple sets of heat exchange tanks 13 and enters the upper sealing chamber 11. At this time, the semiconductor cooler 14 is turned on, so that the cold end of the semiconductor cooler 14 cools the heat exchange tanks 13, allowing the heat-conducting liquid to directly and efficiently conduct heat transfer when passing through the heat exchange tanks 13. At the same time, the fan 24 is started, and airflow is generated in the gaps between the sets of heat exchange tanks 13, which carries away the heat from the hot end of the semiconductor cooler 14 and the heat generated by the heat exchange tanks 13 and the heat-conducting liquid. Finally, the heat is discharged along the exhaust port 25. In this way, the heat of the heat-conducting liquid inside the heat exchange box 10 is dissipated, the temperature drops sharply, and then it is recirculated into the temperature control chamber 15, the return tank 16 and the inlet tank 17, thereby timely cooling the lower mold 4 and the rubber product located in the cavity.

[0035] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A molding apparatus for preparing rubber products, comprising a base (1), characterized in that, include; Telescopic rod (2) is installed on the top of base (1). The telescopic end of the base (1) is equipped with an upper mold (3). The bottom inner side of the base (1) is equipped with a lower mold (4). The lower mold (4) has a temperature control chamber (15), a return liquid tank (16) and an inlet liquid tank (17) inside. A heat exchange box (10) is installed on the inner bottom of the base (1). A sealing cylinder (8), a return pipe (6), and a connecting pipe (7) are installed between the heat exchange box (10) and the lower mold (4). A pump (9) is installed on the top of the heat exchange box (10). The inlet end of the pump (9) penetrates into the inner cavity of the heat exchange box (10) and is connected to an upper sealing chamber (11). A lower sealing chamber (12) is fixedly installed at the bottom of the inner cavity of the heat exchange box (10). Multiple sets of heat exchange tanks (13) are connected between the upper sealing chamber (11) and the lower sealing chamber (12). A semiconductor cooler (14) is fixedly installed on one side of the heat exchange tank (13). A fan (24) is installed on the outside of the heat exchange box (10). The outlet end of the pump (9) is connected to the sealing cylinder (8). A heating device (5) is fixedly installed on the inner wall of the liquid inlet tank (17). The liquid return pipe (6) is connected to the liquid return tank (16) and the connecting pipe (7). The sealing cylinder (8) is connected to the liquid inlet tank (17). The inner cavities of the temperature control chamber (15), the liquid return tank (16), the liquid inlet tank (17), the upper sealing chamber (11), the lower sealing chamber (12), and the heat exchange tank (13) are all filled with heat-conducting liquid.

2. The molding apparatus for preparing rubber products according to claim 1, characterized in that, The return pipe (6) and return tank (16) are each set into four groups and are distributed in a circular pattern at equal intervals on the outer circumference of the lower mold (4). The inlet tank (17) is located at the bottom of the temperature control cavity (15). The temperature control cavity (15), return tank (16) and inlet tank (17) are connected.

3. The molding apparatus for preparing rubber products according to claim 2, characterized in that, The inner wall of the return pipe (6) is movably fitted with a sealing plate (19) and a spring (20). The diameter of the sealing plate (19) is greater than the inner diameter of the return tank (16) and less than the inner diameter of the return pipe (6). The sealing plate (19) is elastically abutted against the inner wall of the return pipe (6) near the return tank (16) by the spring (20).

4. The molding apparatus for preparing rubber products according to claim 3, characterized in that, The sealing cylinder (8) has a sealing port (21) in the middle. The sealing cylinder (8) is movably fitted with a second spring (23) and a second sealing plate (22). The diameter of the second sealing plate (22) is greater than the inner diameter of the sealing port (21) and less than the inner diameter of the sealing cylinder (8). The second spring (23) elastically abuts against the top of the sealing port (21).

5. The molding apparatus for preparing rubber products according to claim 4, characterized in that, The inner wall of the liquid inlet tank (17) is fixedly connected to an adapter cylinder (18), which is made of rubber blocks.

6. The molding apparatus for preparing rubber products according to claim 5, characterized in that, The heat exchange tank (13) is set to at least eleven groups and is distributed at equal intervals along the horizontal line. The multiple groups of heat exchange tanks (13) are parallel to each other. The upper sealing chamber (11), the lower sealing chamber (12), and the heat exchange tank (13) are all made of brass. The upper sealing chamber (11), the lower sealing chamber (12), and the heat exchange tank (13) are fixed together by laser welding.

7. The molding apparatus for preparing rubber products according to claim 6, characterized in that, The side of the semiconductor cooler (14) that is in contact with and fixed to the heat exchange tank (13) is the cold end, and there is a gap between the hot end of the semiconductor cooler (14) and the adjacent heat exchange tank (13).

8. The molding apparatus for preparing rubber products according to claim 7, characterized in that, The fan (24) is connected to the rear side of the heat exchange box (10), and the heat exchange box (10) has an exhaust port (25) on the front.

9. A molding apparatus for preparing rubber products according to claim 8, characterized in that, The heat-conducting liquid is made of mineral-based heat-conducting oil and fills the temperature control chamber (15), return tank (16), inlet tank (17), return pipe (6), connecting pipe (7), upper sealing chamber (11), lower sealing chamber (12), semiconductor cooler (14) and sealing cylinder (8).

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