Electronic component tray system and tray structure thereof
By designing a special configuration of the capturing and supporting parts in the pallet structure, damage to the substrate edges is avoided, solving the problem of substrate damage during transportation and achieving effective protection of the substrate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-03-13
AI Technical Summary
In existing pallet structures, the bottom outer edge of the substrate is easily damaged by contact with the capture and support parts during the transportation and protection of the substrate, resulting in problems such as chipping or scratches.
Design a tray structure whose receiving part includes a capturing part and a supporting part. The capturing part contacts the upper side of the substrate, and the supporting part contacts the bottom surface of the substrate but does not contact the outer edge, avoiding direct contact with the outer edge of the substrate. The supporting part is made of soft or hard material to protect the substrate.
It effectively protects the substrate from damage and prevents chips or scratches from contact with pallet structural components during transportation, thus improving the protection effect of the substrate.
Smart Images
Figure CN121650992A_ABST
Abstract
Description
Technical Field
[0001] This application relates to a tray structure, and more particularly to a tray structure for receiving a packaged assembly having a substrate or for receiving a substrate. Background Technology
[0002] Pallet structures are common in the semiconductor industry for transporting components such as electronic parts.
[0003] The substrate is the basic material for manufacturing printed circuit boards (e.g., PCBs). In the manufacture of single-sided and double-sided PCBs, selective processes such as hole machining, chemical copper plating, electroplating, and etching are performed on the substrate to obtain the desired circuit pattern. In the manufacture of multilayer PCBs, the substrate serves as the base, and conductive pattern layers and prepregs are alternately laminated together in a single process to form interconnections between multiple conductive pattern layers. The substrate has three functions: conductivity, insulation, and support. The performance, quality, processability, manufacturing cost, and manufacturing level of a PCB largely depend on the substrate. Summary of the Invention
[0004] The most common use of pallet structures is to transport and protect components during assembly, testing, and distribution stages. Each pallet structure includes one or more receiving sections, each designed to receive a component. Components include packaged assemblies with substrates, such as integrated circuit chips, or substrates.
[0005] The dimensions of the receiving section of the pallet structure must conform as closely as possible to the dimensions of the component it is designed to support. This reduces the free movement of the component in both the horizontal and vertical directions, thus preventing damage. However, to meet the manufacturing tolerances of both the component and the pallet structure, the receiving section is designed to be slightly larger than the component it is designed to support. A free clearance should be allowed between the component and the inner wall of the receiving section.
[0006] The inventors have discovered that a package assembly or substrate having a substrate can be received in a receiving portion of a tray structure via a loose fit. The receiving portion includes a capturing portion and a supporting portion. The capturing portion and the supporting portion form a receiving space to receive at least a portion of the package assembly or substrate having the substrate. The supporting portion is configured to contact the bottom surface of the substrate to support the substrate. The capturing portion is configured to contact the side surface of the substrate to restrict movement of the substrate along the surface of the supporting substrate of the supporting portion.
[0007] The inventors also discovered that the inner wall of the side of the capturing part that contacts the substrate intersects and connects with the support contact surface of the support part that contacts the bottom surface of the substrate, thereby surrounding at least a portion of the outer edge of the bottom of the substrate. When the substrate moves along the support contact surface of the support part in the receiving space, the outer edge of the bottom of the substrate will occasionally contact the lower edge of the inner wall and the outer edge of the support contact surface. However, the outer edge of the bottom of the substrate is very fragile, and therefore the movement of the substrate in the receiving space formed by the capturing part and the support part usually causes chips, scratches, etc. on the substrate.
[0008] To address the aforementioned problems, this application provides a tray structure comprising one or more receiving portions, each receiving portion forming a receiving space to receive at least a portion of a substrate. The receiving portions are configured such that when the substrate is received in the receiving space and moves along the surface of a supporting substrate within the receiving space, it does not contact the outer edge of the bottom of the substrate. The substrates of this application include general-purpose substrates and other different types of substrates, such as silicon substrates, organic substrates, or glass substrates.
[0009] Specifically, according to one aspect of this application, a tray structure is provided, comprising one or more receiving portions, each receiving portion configured to receive a package assembly having a substrate or a receiving substrate. Each receiving portion includes a plurality of capturing portions and a supporting portion. The plurality of capturing portions are configured to contact the side surfaces of the substrate. The supporting portion is configured to support the substrate. The capturing portions and the supporting portion form a receiving space to receive at least a portion of the substrate. The capturing portions are configured to contact a portion above the lower edge of the side surface of the substrate, and the supporting portion is configured to contact a portion of the bottom surface of the substrate and not contact the outer edge of the bottom surface of the substrate.
[0010] According to one aspect of this application, the capturing portion includes an inner wall configured to contact the side of a substrate. The lower edge of the inner wall is higher than the surface of the supporting substrate of the supporting portion.
[0011] According to one aspect of this application, the support includes a support contact surface configured as part of the bottom surface of the contact substrate. The outer edge of the support contact surface is closer to the center of the receiving space relative to the inner wall.
[0012] According to one aspect of this application, the capturing part and the supporting part are configured such that when the substrate moves along the surface of the supporting substrate of the supporting part in the receiving space such that one capturing part contacts the first side of the substrate and the other capturing part separates from the second side of the substrate opposite to the first side, the supporting part still does not contact the outer edge of the bottom surface of the substrate.
[0013] According to one aspect of this application, the side of the support is sloped.
[0014] According to one aspect of this application, the support is made of a soft or hard material.
[0015] According to one aspect of this application, the support portion is a support frame configured to contact the periphery of the bottom surface of the substrate to support the substrate. Alternatively, the support portion is a support base plate configured to contact substantially the entire bottom surface of the substrate to support the substrate.
[0016] According to one aspect of this application, the support frame includes a plurality of protrusions arranged circumferentially and spaced apart from a plurality of capture portions along the circumferential direction.
[0017] According to one aspect of this application, the pallet structure also includes a mounting frame. Multiple capture parts and support parts are mounted on the mounting frame.
[0018] According to another aspect of this application, this application provides a pallet system that includes one or more of the pallet structures described above.
[0019] According to another aspect of this application, the pallet structure is stacked in layers. Attached Figure Description
[0020] The accompanying drawings are not to scale. In the drawings, each identical or nearly identical component shown in different figures is indicated by the same reference numerals. For clarity, not every component may be labeled in every drawing. In the drawings: Figure 1A A perspective view of the tray structure of this application (on which a packaging assembly with a substrate is received) is shown. Figure 1B A perspective view showing a first embodiment of the tray structure of this application (on which no packaging components and substrate are received); Figure 1C A perspective view showing a second embodiment of the tray structure of this application; Figure 1D yes Figure 1C Top view; Figure 1E A perspective view showing a third embodiment of the tray structure of this application; Figure 1F A perspective view showing a fourth embodiment of the tray structure of this application; Figure 1G A perspective view showing a fifth embodiment of the tray structure of this application; Figure 1H yes Figure 1G Top view; Figure 1I A perspective view showing an embodiment of the pallet system with a pallet structure according to this application; Figure 2A yes Figure 1AA partially enlarged view of the tray structure (on which a package assembly with a substrate is received) from a first angle. Figure 2B yes Figure 1A A partially enlarged view of the tray structure (on which a package assembly with a substrate is received) from a second angle. Figure 2C yes Figure 1A A partially enlarged view from a third angle of the tray structure (on which a package assembly with a substrate is received). Figure 2D yes Figure 2C A partial enlarged view of the tray structure (on which a packaging assembly with a substrate is received); Figure 3A yes Figure 1C A partial enlarged view of the tray structure from a first angle is shown; Figure 3B yes Figure 1C A partial enlarged view of the tray structure from a second angle; Figure 4A yes Figure 1C The diagram shows a partially enlarged cross-sectional view of the tray structure along section line AA; Figure 4B yes Figure 1C The diagram shows a partially enlarged cross-sectional view of the tray structure along section line BB; Figure 5A A cross-sectional view of a second embodiment of the tray structure of this application after the packaging assembly with a substrate has been moved is shown. Figure 5B yes Figure 5A A first partial enlarged view of the tray structure shown; and Figure 5C yes Figure 5A A second enlarged view of the tray structure is shown. Detailed Implementation
[0021] Various specific embodiments of this application will now be described with reference to the accompanying drawings, which form part of this specification. It should be understood that although terms indicating direction, such as "front," "rear," "upper," "lower," "left," "right," "top," and "bottom," are used herein to describe various exemplary structural parts and elements, their use is merely for illustrative purposes and is based on the exemplary orientations shown in the accompanying drawings. Since the embodiments disclosed herein can be arranged in different orientations, these terms indicating direction are illustrative only and should not be considered limiting.
[0022] Ordinal numbers such as “first” and “second” used in this application are used only for distinction and identification and have no other meaning. Unless otherwise specified, they do not indicate a specific order or a specific relationship.
[0023] Figure 1A A perspective view of the tray structure 100 of this application (on which a packaging assembly 1043 having a substrate 104 is received) is shown to illustrate the mating relationship between the tray structure 100 and its components and the packaging assembly 1043 and the substrate 104. Figure 1B A perspective view of a first embodiment of the tray structure of this application (on which packaging components and a substrate are not received) is shown. Figure 1C A perspective view of a second embodiment of the tray structure of this application is shown. Figure 1D yes Figure 1C Top view, Figure 1E A perspective view of a third embodiment of the tray structure of this application is shown. Figure 1F A perspective view of a fourth embodiment of the tray structure of this application is shown. Figure 1G A perspective view of a fifth embodiment of the tray structure of this application is shown. Figure 1H yes Figure 1G A top view, and Figure 1I This illustration shows a perspective view of an embodiment of the pallet system with a pallet structure according to this application, illustrating various implementations and structures of the pallet structure and pallet system of this application. For ease of illustration and explanation, the orientations "upper," "lower," "top," and "bottom" in the following description of this application refer to... Figure 1A The pallet structure 100 shown includes the "upper", "lower", "top" and "bottom".
[0024] like Figure 1A As shown, a package assembly 1043 having a substrate 104 is received in a tray structure 100. The tray structure 100 includes a receiving portion configured to receive the package assembly 1043 having the substrate 104. The package assembly 1043 includes multiple layers, including a bottom layer, namely the substrate 104. The receiving portion includes multiple capturing portions 101 and support portions 102. The multiple capturing portions 101 and support portions 102 form a receiving space 105 to receive at least a portion of the substrate 104. In another embodiment, the receiving portion of the tray structure 100 is configured to receive the substrate 104. Figure 1A The entire substrate is shown being received in receiving space 105. In other embodiments, the tray structure may receive a portion of the substrate.
[0025] The length and width of the receiving space 105 formed by the capturing portion 101 and the support portion 102 of the receiving portion of the tray structure 100 are slightly larger than the length and width of the encapsulation assembly 1043 having a substrate 104 at the bottom, so that the encapsulation assembly 1043 can be easily installed into and removed from the receiving space 105, and a certain deviation in the length and width of the receiving space 105 and the encapsulation assembly 1043 is allowed. Furthermore, the above arrangement of the tray structure 100 can also prevent damage to the bottom edge of the substrate 104 from contacting the capturing portion 101 and / or the support portion 102, or from moving along the capturing portion 101 and / or the support portion 102, during installation (e.g., when inserting the encapsulation assembly 1043 into the receiving space 105) and during disassembly, such as chipping, scratches, etc. The bottom edge of the substrate 104 includes the lower edge of the side surface of the substrate 104 and the outer edge of the bottom surface. When the package assembly 1043 is received in the receiving space 105, the bottom edge of the substrate 104 at the bottom of the package assembly 1043 may also be damaged due to the contact capture portion 101 and / or the support portion 102.
[0026] After the encapsulation assembly 1043 is received in the receiving space 105, during use (e.g., transportation) or other applications, the encapsulation assembly 1043 may move along the support contact surface 1021 of the support portion 102. This movement may cause the bottom edge of the substrate 104 to be damaged by contact with the capturing portion 101 and / or the support portion 102. Therefore, in order to solve the above-mentioned problem, in this application, the capturing portion 101 is configured not to contact the lower edge of the side surface of the substrate 104, and the support portion 102 is configured not to contact the outer edge of the bottom surface of the substrate 104, so as to avoid the bottom edge of the substrate 104 from contacting the capturing portion 101 and / or the support portion 102 and being damaged, such as by chipping, scratches, etc.
[0027] like Figure 1A As shown, a plurality of capturing portions 101 are configured to contact the side surfaces of the substrate 104. The side surfaces of the substrate 104 include... Figure 1A The sides 1041 and 1042 shown are shown in the diagram, as well as two sides (not shown) opposite to these two sides 1041 and 1042, respectively. More specifically, the capturing part 101 is configured to contact a portion of the sides 1041 and 1042 of the substrate 104, but not to contact the lower edges 2031 and 2041 of the sides of the substrate 104 (see Figure 1041). Figure 2AFor example, the capturing portion 101 is configured to contact the portion above the lower edge portions 2031, 2041 of the side surface of the substrate 104 to prevent the lower edge portions 2031, 2041 of the side surface of the substrate 104 from being damaged by contact with the capturing portion 101 during use (e.g., transportation) or other applications. In one embodiment, for a BGA type substrate package assembly, a plurality of solder balls are arranged on the bottom surface 205 of the substrate 104 (see...). Figures 5A-5C These solder balls are arranged, for example, in a matrix. In other embodiments, the bottom surface 205 of the substrate 104 is arranged with other suitable structures. For example, for an LGA type substrate package assembly, the bottom surface 205 of the substrate 104 is arranged with a plurality of contacts (not shown).
[0028] The support portion 102 is configured to support the substrate 104. The support portion 102 contacts a portion of the bottom surface 205 of the substrate 104 to support the substrate 104. The support portion 102 does not contact the outer edge 2051 of the bottom surface 205 of the substrate 104 (see...). Figure 2C-2D This is to prevent the outer edge 2051 of the bottom surface 205 of the substrate 104 from contacting the support 102 and being damaged during use (e.g., transportation) or other applications. The lower edges 2031 and 2041 of the side surfaces of the substrate 104 are close to the bottom surface 205 of the substrate 104 (see...). Figure 2A and Figure 2C The portion above the lower edges 2031 and 2041 on the side of the substrate 104 represents the portion of the side of the substrate 104 that is adjacent to the lower edges 2031 and 2041 and is far from the bottom surface 205 of the substrate 104.
[0029] like Figure 1A As shown, the receiving portion of the tray structure 100 includes eight capturing portions 101. These eight capturing portions 101 form four pairs of capturing portions 101, respectively arranged to contact or be adjacent to the four sides of the substrate 104. In other embodiments, the receiving portion of the tray structure 100 includes other suitable numbers and / or suitable positions of capturing portions 101 to contact or be adjacent to the four sides of the substrate 104. The tray structure 100 also includes a mounting frame 103. Both the capturing portions 101 and the support portions 102 are mounted to the mounting frame 103. The mounting frame 103 is recessed and includes a base plate 1031. The capturing portions 101 and the support portions 102 are mounted on the base plate 1031. The base plate 1031 includes through holes 1032 (see...). Figure 1B-1E and Figure 1G-1H The mounting frame 103 is configured to allow airflow through it to dissipate heat from the substrate 104 received by the capture section 101 and the support section 102. In other embodiments, the mounting frame 103 includes other suitable structures.
[0030] Figure 1B The first embodiment of the pallet structure of this application is shown, namely pallet structure 110. Figure 1B The tray structure 110 in the middle is Figure 1A One specific embodiment of the tray structure 100 in the above. (Refer to the above...) Figure 1A The description of pallet structure 100 also applies to Figure 1B The tray structure 110 is so complex that it will not be described in detail here.
[0031] like Figure 1B As shown, the support portion 102 of the receiving portion of the tray structure 110 can be referred to as the support portion 102A. The support portion 102A is a support frame, which is configured to contact the periphery of the bottom surface 205 of the substrate 104 to support the substrate 104, but does not contact the outer edge 2051 of the bottom surface 205 of the substrate 104 (see...). Figure 2C-2D The support frame and the base plate 1031 of the tray structure 110 form a space for receiving solder balls, contacts, and other structures arranged on the bottom surface 205 of the substrate 104. The base plate 1031 of the tray structure 110 does not contact the solder balls, contacts, and other structures arranged on the bottom surface 205 of the substrate 104 to avoid damage to these structures on the bottom surface 205 of the substrate 104 due to contact, such as the generation of chips, scratches, etc. The support frame structure of the support portion 102 allows the support portion 102 to be made of either a soft or a hard material. The support frame structure made of a hard material will not damage the outer edge 2051 of the bottom surface 205 of the substrate 104 because the support frame structure does not contact the outer edge 2051 of the bottom surface 205 of the substrate 104, and will not damage the structures on the bottom surface 205 of the substrate 104, such as solder balls and contacts, because the support frame structure does not contact these structures on the bottom surface 205 of the substrate 104. In one embodiment, rigid materials are less expensive than soft materials. Structures made of rigid materials are more resilient to stress and have a longer lifespan than structures made of soft materials.
[0032] like Figure 1BAs shown, the support frame 102A is a protrusion that extends circumferentially and is closed. The top surface 1021 of the protrusion extends circumferentially to contact the periphery of the bottom surface 205 of the substrate 104 to support the substrate 104. The top surface 1021 has substantially the same height circumferentially. In one embodiment, the top surface 1021 (i.e., the support surface) is part of a support plate. The outer side 1022 of the protrusion facing away from the receiving space 105 includes a sloping surface. The inner side 1023 of the protrusion facing the receiving space 105 is recessed toward the outer side 1022. In one embodiment, the inner side 1023 includes an arcuate surface. The inner side 1023 of the receiving portion and the bottom plate 1031 of the tray structure 110 form a space for receiving solder balls, contacts, and other structures arranged on the bottom surface 205 of the substrate 104. In other embodiments, the support frame 102A includes other suitable structures. The capturing portion 101 of the receiving portion of the tray structure 110 is inverted L-shaped. The capturing part 101 includes a protrusion 1011 disposed on the upper part of the capturing part 101 and facing the receiving space 105. The protrusion 1011 includes inner walls 201, 202 of the lower edge portion configured to contact a portion of the side surface of the substrate 104 without contacting the side surface of the substrate 104 (see Figures 2A-2D In other embodiments, the support portion 102 of the receiving section of the tray structure of this application includes other suitable structures. For example, in one embodiment, the support portion 102 consists of a plurality of spaced protrusions.
[0033] In one embodiment, the pallet structure is integrally formed. One method of integral forming is injection molding. In one embodiment, a male injection mold and a female injection mold are combined, and material is injected into the combined male and female injection molds. After the material is formed, the male and female injection molds are removed, thereby forming the pallet structure of this application. To facilitate the injection molding of the pallet structure, this application designs a second embodiment of the pallet structure, namely pallet structure 120. Figure 1C A perspective view of the tray structure 120 is shown. Figure 1D A top view of the tray structure 120 is shown.
[0034] Figure 1C-1D The tray structure 120 and Figure 1B The tray structure 110 in the middle has a basically the same structure. The difference is that... Figure 1C-1D The tray structure 120 in the middle is composed of Figure 1B It is obtained by removing a portion of the tray structure 110. Specifically, from Figure 1B The tray structure 110 removes portions of the receiving part support 102 and the base plate 1031 of the mounting frame 103 below the protrusion 1011 of the receiving part capture part 101 to obtain... Figure 1C-1DThe tray structure 120 is included. Furthermore, for reliable injection molding, the removed portion extends further into the receiving space 105 relative to the protrusion 1011. (As...) Figure 1C-1D As shown, the support portion 102 in the tray structure 120 is a support portion 102B. The aforementioned removal causes the support portion 102B to include a portion having a recess 1024. On the same side of the tray structure, in a direction perpendicular to the inner wall 201 of the capture portion 101, this recess 1024 faces the corresponding capture portion 101. The outer surface of this portion is the outer surface 1022' (see...). Figure 4B and Figures 5B-5C The outer surface 1022' is an inclined surface sloping towards the receiving space 105 in a top-to-bottom direction to facilitate the removal of the injection mold after the tray structure is injection molded. On the same side of the tray structure, in a direction perpendicular to the inner wall 201 of the capturing part 101, the capturing part 101 has a corresponding inner surface 1045 facing the outer surface 1022'. This inner surface 1045 is an inclined surface sloping away from the receiving space 105 in a top-to-bottom direction to facilitate the removal of the injection mold after the tray structure is injection molded.
[0035] As can be seen from the above, in the portion of the support 102B with the recess 1024 facing the capture portion 101, there is a small wall thickness H1 between the inner side surface 1023 and the outer side surface 1022' of the support frame (see...). Figures 4A-4B In other parts of the support 102B (without the recess 1024), there is a large wall thickness H2 between the inner side 1023 and the outer side 1022 of the support frame (see...). Figures 4A-4B ). Figure 1C-1D The arrangement of the tray structure 120 in this configuration helps to meet the requirements of existing two-platen mold technology for injection molds, reduce manufacturing and mold costs, and optimize possible processing cycles, etc. In other embodiments, Figure 1C-1D The pallet structure 120 in the design includes other suitable structures. Figure 1C-1D The pallet structure 120 and Figure 1B The same structure as pallet structure 110 will not be described again here.
[0036] Figure 1A-1D The tray structure shown includes a receiving section configured to receive a single package assembly 1043 having a substrate 104 or to receive a single substrate 104. In other embodiments, the tray structure includes more than one receiving section (e.g., such as...). Figure 1E As shown), each receiving unit is configured to receive a packaging assembly 1043 having a substrate 104 or to receive a substrate 104. Figure 1E A third embodiment of the tray structure of this application is shown, namely tray structure 130. Tray structure 130 includes three receiving sections, for example, each receiving section is... Figure 1CThe tray structure 120 shown has a receiving section. Three tray structures 120 form three receiving spaces 105. Each receiving space 105 of each receiving section is configured to receive a package assembly having a substrate or at least a portion of a substrate. The tray structure 130 includes a mounting frame 111. The capturing section 101 and the support section 102B of each receiving section are mounted to the mounting frame 111. In other embodiments, the tray structure 130 includes other suitable numbers of receiving sections, such as those arranged in a matrix. In one embodiment, the tray structure is a matrix tray, such as the JEDEC transport and handling matrix tray, for receiving or storing multiple package assemblies or multiple substrates.
[0037] Figure 1F The fourth embodiment of the tray structure of this application is shown, namely tray structure 140. Figure 1F The tray structure 140 and Figure 1C The tray structure 120 in the middle has a basically the same structure. The difference is that... Figure 1C The support portion 102B of the receiving section of the tray structure 120 is a support frame, while Figure 1F The support portion 102C of the receiving portion of the tray structure 140 is a support base plate. This support base plate 102C is configured to contact approximately the entire bottom surface of the substrate 104 to support the substrate 104, without contacting the outer edge 2051 of the bottom surface 205 of the substrate 104. As previously described, the bottom surface 205 of the substrate 104 is provided with solder balls (see...). Figures 5A-5C Structures such as contacts, etc. Therefore, in a package assembly 1043 having a substrate 104 or a substrate 104 being received in... Figure 1F In the tray structure 140, the support base plate 102C of the tray structure 140 contacts solder balls, contacts, and other structures arranged on the bottom surface 205 of the substrate 104. In order to prevent the support base plate 102C from damaging these structures by contacting them on the bottom surface 205 of the substrate 104, such as causing chips, scratches, etc., the support base plate 102C (i.e., the support portion) is made of a soft material.
[0038] like Figure 1F As shown, the support base plate 102C is a boss. This boss has a top surface 1025, which is configured to contact substantially the entire bottom surface of the substrate 104 to support the substrate 104. In one embodiment, the top surface 1025 (i.e., the support surface) is a support plane. The side surface 1026 of the boss... Figure 1C The outer surfaces 1022 and 1022' of the support portion 102B have substantially the same shape. In other embodiments, the support base plate 102C includes other suitable structures. Figure 1F The pallet structure 140 and Figure 1C The same structure as the 120 pallet is used here and will not be described again.
[0039] Figure 1G-1H The fifth embodiment of the pallet structure of this application is shown, namely pallet structure 150. Figure 1G-1H The tray structure 150 and Figure 1C-1D The tray structure 120 in the middle has a basically the same structure. The difference is that... Figure 1C-1D The support portion 102B of the receiving section of the tray structure 120 is a circumferentially extending and closed protrusion, which has a corresponding recess 1024 facing the capturing portion 101. Figure 1G-1H The support portion 102D of the receiving portion of the tray structure 150 is composed of a plurality of separated protrusions or protrusions 1027, 1028. Figure 1G-1H These protrusions 1027 and 1028 can be accessed from... Figure 1C-1D The tray structure 120 is obtained by further removing the portion of the support portion 102B that the capture portion 101 faces on the same side of the receiving portion of the tray structure, in the direction perpendicular to the inner wall 201 of the capture portion 101. The top surfaces of the protrusions 1027 and 1028 of the support portion 102D are part of the top surface 1021 (i.e., the support contact surface) of the support portion 102B.
[0040] like Figure 1G-1H As shown, the receiving portion of the tray structure 150 includes a plurality of capturing portions 101 and a support portion 102D, forming a receiving space 105. Protrusions 1027 and 1028 of the support portion 102D extend circumferentially. These protrusions 1027 and 1028 and the plurality of capturing portions 101 are spaced apart circumferentially. In one embodiment, an opening 1029 is circumferentially spaced between adjacent protrusions 1027 and 1028. The capturing portions 101 are at least partially disposed at the opening 1029 circumferentially.
[0041] The protrusion 1027 extends substantially linearly on one side of the receiving portion of the tray structure 150. For example, the protrusion 1027 is located between two capturing portions 101 on one side of the receiving portion of the tray structure 150. The protrusion 1028 extends curvedly from one side of the receiving portion of the tray structure 150 to the other side. For example, the protrusion 1028 is located on both sides of the receiving portion of the tray structure 150 and between two adjacent capturing portions 101. To avoid damage to the bottom of the substrate 104 during the installation and removal of the packaging assembly 1043 or the substrate 104 having the substrate 104, the end of the protrusion 1027 of the support portion 102D includes a curved structure 1033, and the circumferential end of its protrusion 1028 includes a curved structure 1034. In one embodiment, the curved structures 1033, 1034 may be formed by rounding corners. In other embodiments, the circumferential ends of the protrusions 1027, 1028 include other suitable structures. The support portion 102D includes other suitable protrusion structures. Figure 1G-1HThe support portion 102D of the receiving section of the pallet structure 150 helps to comply with the DFM guidelines for injection molding materials to reduce process FMEA risks, as detailed below. Figure 1G-1H The pallet structure 150 and Figure 1C-1D The same structure as the 120 pallet is used here and will not be described again.
[0042] Figure 1I A perspective view of an embodiment of the pallet system 160 with a pallet structure according to this application is shown. Figure 1I As shown, the pallet system 160 includes three pallet structures stacked in layers. In one embodiment, the pallet system 160 includes... Figure 1E The three tray structures 130 are shown. In other embodiments, the tray system 160 includes other suitable tray structures, such as tray structures 110, 120, 140, 150, or other tray structures including other suitable numbers of receiving sections. In other embodiments, the tray system 160 includes other suitable numbers of tray structures stacked in layers.
[0043] Figure 2A yes Figure 1A A partially enlarged view from a first angle of the tray structure 100 (on which a packaging assembly 1043 having a substrate 104 is received). Figure 2B yes Figure 1A The diagram shows a partially enlarged view from a second angle of the tray structure 100 (on which a packaging assembly 1043 having a substrate 104 is received). Figure 2C yes Figure 1A The diagram shows a partially enlarged view from a third angle of the tray structure 100 (on which a packaging assembly 1043 having a substrate 104 is received). Figure 2D yes Figure 2C A partial enlarged view of the tray structure 100 (on which a packaging assembly 1043 having a substrate 104 is received) is shown to illustrate the engagement relationship between the capturing portion 101 and the supporting portion 102 of the tray structure 100 and the substrate 104.
[0044] As previously described, the receiving portion 101 and the support portion 102 of the receiving section of the tray structure 100 form a receiving space 105 to receive a packaging assembly 1043 having a substrate 104. Figures 2A-2D As shown, substrate 104 includes adjacent side surfaces 203 and 204. Side surface 203 of substrate 104 includes a lower edge portion 2031, and side surface 204 of substrate 104 includes a lower edge portion 2041. Substrate 104 also includes side surfaces (not shown) opposite to side surfaces 203 and 204, respectively. Substrate 104 also includes a bottom surface 205, which includes an outer edge portion 2051.
[0045] The receiving portion 101 of the tray structure 100 includes an inner wall 201 configured to contact a portion of the side surface 203 of the substrate 104 without contacting the lower edge 2031 of the side surface 203 of the substrate 104. For example, the inner wall 201 contacts the portion above the lower edge 2031 of the side surface 203 of the substrate 104. The inner wall 201 includes a lower edge 2011 that is higher than the support contact surface 1021 of the support portion 102 in a direction perpendicular to (e.g., vertical direction) of the support contact surface 1021 of the support portion 102 (see [link to relevant documentation]). Figures 3A-3B The lower edge 2011 is positioned so that it is higher than the lower edge 2031 of the side surface 203 of the substrate 104 supported on the surface 1021 of the support portion 102, so that the inner wall 201 will not contact the lower edge 2031 of the side surface 203 of the substrate 104.
[0046] Another capturing portion 101 of the receiving portion of the tray structure 100 includes an inner wall 202, which is configured to contact a portion of the side surface 204 of the substrate 104 without contacting the lower edge 2041 of the side surface 204 of the substrate 104. For example, the inner wall 202 contacts the portion above the lower edge 2041 of the side surface 204 of the substrate 104. The inner wall 202 includes a lower edge 2021 that is higher than the support contact surface 1021 of the support portion 102 in a direction perpendicular to (e.g., vertical direction) of the support contact surface 1021 of the support portion 102 (see [link to relevant documentation]). Figures 3A-3B The lower edge 2021 is arranged such that it is higher than the lower edge 2041 of the side surface 204 of the substrate 104 supported on the surface 1021 of the support portion 102, so that the inner wall 202 will not contact the lower edge 2041 of the side surface 204 of the substrate 104. With this arrangement, the inner walls 201 and 202 of the capturing portion 101 are formed as raised or suspended inner walls.
[0047] The support portion 102 of the receiving section of the tray structure 100 includes a support contact surface 1021 (see...). Figures 3A-3B This is configured as part of the bottom surface 205 of the contact substrate 104. For example... Figure 2C-2D As shown, the supporting contact surface 1021 includes an outer edge 2061 that is closer to the center of the receiving space 105 relative to the inner wall 201 in a direction perpendicular to the inner wall 202 (e.g., the horizontal direction), such that the outer edge 2061 is away from the outer edge portion 2051 of the bottom surface 205 of the substrate 104 toward the center of the receiving space 105, so that the supporting contact surface 1021 will not contact the outer edge portion 2051 of the bottom surface 205 of the substrate 104.
[0048] Figure 3A yes Figure 1C The diagram shows a partial enlarged view of the tray structure 120 from a first angle. Figure 3B yes Figure 1CA partially enlarged view of the tray structure 120 from a second angle is shown to illustrate the structure of the capture portion 101 and the support portion 102 (102B) of the tray structure 120.
[0049] like Figures 3A-3B As shown, the receiving portion 101 of the tray structure 120 includes a body portion 304 and a rib 303. The body portion 304 includes a protrusion 1011, which includes an inner wall 201 and a guide wall 302. The body portion 304 is inverted L-shaped. The body portion 304 may include other suitable structures. The inner wall 201 is disposed toward the receiving space 105 formed by the receiving portion 101 and the support portion 102 (102B) and is configured to contact a portion of the side surface of the substrate 104 received in the receiving space 105. In one embodiment, the inner wall 201 is a vertical surface. To avoid damage to the bottom of the substrate 104 during the installation and removal of the encapsulation assembly 1043 or the substrate 104 having the substrate 104, the end of the inner wall 201 of the receiving portion 101 includes a curved structure 305. The guide wall 302 is adjacent to the inner wall 201. The guide wall 302 is configured to guide the encapsulation assembly 1043 and the substrate 104 to be installed into the receiving space 105. The guide wall 302 is positioned toward the receiving space 105 and gradually tilts toward the receiving space 105 from top to bottom.
[0050] When the packaging assembly 1043 or substrate 104 with substrate 104 is inserted from above the tray structure 120 into the receiving space 105 of the receiving portion, the guide walls 302 of the plurality of capturing portions 101 form (enclose) a large opening to facilitate the installation of the packaging assembly 1043 and substrate 104 into the receiving space 105. After the packaging assembly 1043 and substrate 104 have formed a large opening through the guide walls 302, the packaging assembly 1043 and substrate 104 enter into a smaller opening formed (enclosed) by the inner walls 201 of the plurality of capturing portions 101 and contact the support portion 102 (102B) to be received in the receiving space 105.
[0051] like Figure 1C As shown, the support portion 102 (102B) of the receiving portion of the tray structure 120 is a circumferentially extending protrusion, and on the same side of the receiving portion of the tray structure, in a direction perpendicular to the inner wall 201 of the capturing portion 101, the protrusion has a corresponding recess 1024 facing the capturing portion 101. The support portion 102 (102B) includes a support contact surface 1021, outer surfaces 1022, 1022', and inner surface 1023. The support contact surface 1021 is configured to contact a portion of the bottom surface 205 of the substrate 104 received in the receiving space 105. Figures 3A-3BAs shown, the support contact surface 1021 is a horizontal surface. The outer surfaces 1022 and 1022' of the support portion 102 (102B) are adjacent to the support contact surface 1021. The outer surface 1022 includes an upper portion 301 that gradually slopes outward (away from the receiving space 105) in a top-to-bottom direction. A generally vertical surface 306 is formed at the bottom of the outer surface 1022. The outer surface 1022' slopes gradually towards the receiving space 105 in a top-to-bottom direction. In other embodiments, the support portion 102 (102B) includes other suitable structures, for example, other suitable outer surfaces.
[0052] Figure 4A yes Figure 1C The diagram shows a partially enlarged cross-sectional view of the tray structure 120 along section line AA. Figure 4B yes Figure 1C The diagram shows a partially enlarged cross-sectional view of the tray structure 120 along section line BB, illustrating the mating relationship between the receiving portion 101 and the support portion 102 (102B) of the tray structure 120. Section line AA does not pass through the portions of the receiving portion 101 and the support portion 102B that have recesses 1024 facing the receiving portion 101, while section line BB passes through the portions of the receiving portion 101 and the support portion 102 (102B) that have recesses 1024 facing the receiving portion 101.
[0053] like Figure 4A As shown, the portion of the support 102B that does not have the recess 1024 facing the capturing portion 101 includes a support contact surface 1021, an outer side surface 1022, and an inner side surface 1023. The wall thickness H2 of this portion of the support 102B (i.e., the thickness between the outer side surface 1022 and the inner side surface 1023) is relatively large because the outer side surface 1022 includes an upper portion 301 that gradually slopes away from the receiving space 105 in a downward direction (see...). Figure 3A ).like Figure 4B As shown, the portion of the support 102B having a recess 1024 facing the capture portion 101 includes a support contact surface 1021, an outer side surface 1022', and an inner side surface 1023. The wall thickness H1 of this portion of the support 102B (i.e., the thickness between the outer side surface 1022' and the inner side surface 1023) is relatively small. To comply with the injection molding material DFM guidelines and reduce process FMEA risk, this wall thickness H1 should not be less than a predetermined thickness threshold.
[0054] like Figures 4A-4BAs shown, in the direction perpendicular to the support contact surface 1021 of the support portion 102 (102B), the lower edge 2011 of the inner wall 201 of the capturing portion 101 is higher than the support contact surface 1021 of the support portion 102 (102B), so that when the packaging assembly 1043 having the substrate 104 or the substrate 104 is received in the receiving space formed by the capturing portion 101 and the support portion 102 (102B), for example on the support contact surface 1021, the inner wall 201 does not contact the lower edges 2031, 2041 of the side of the substrate 104 (see Figure 2A The lower edge 2011 of the inner wall 201 is higher than the support contact surface 1021 by a first distance D1. This first distance D1 is greater than the height of the lower edges 2031 and 2041 of the side surface of the substrate 104 (for example, in the direction perpendicular to the support contact surface 1021 of the support portion 102B), thereby ensuring that the inner wall 201 does not contact the lower edges 2031 and 2041 of the side surface of the substrate 104.
[0055] On the same side of the receiving portion of the tray structure, in a direction perpendicular to the inner wall 201 of the capturing portion 101, the outer edge 2061 of the support contact surface 1021 of the support portion 102 (102B) is spaced apart from the inner wall 201 by a second distance D2, and is closer to the center of the receiving space 105 relative to the inner wall 201. This second distance D2 is greater than the width of the outer edge 2051 of the bottom surface 205 of the substrate 104 (e.g., in a direction perpendicular to the inner wall 201 of the capturing portion 101), thereby ensuring that the support contact surface 1021 does not contact the outer edge 2051 of the bottom surface 205 of the substrate 104 (see...). Figure 2C-2D ).
[0056] like Figure 4B As shown, by arranging the lower edge 2011 of the inner wall 201 of the capturing part 101 to be higher than the support contact surface 1021 of the support part 102 (102B) by a first distance D1, and by setting the outer edge 2061 of the support contact surface 1021 of the support part 102 (102B) to be spaced apart from the inner wall 201 by a second distance D2 and closer to the center of the receiving space 105 relative to the inner wall 201, the inner wall 201 and the support contact surface 1021 do not form corner edges. Conversely, on the same side of the receiving space 105, corner edges are eliminated between the facing capturing part 101 and the support part 102 (102B), as indicated by the dashed circle, so that the capturing part 101 and the support part 102 (102B) do not contact the outer edge of the bottom of the substrate 104.
[0057] Figures 4A-4BThe support contact surface 1021 shown is a horizontal surface, and the inner wall 201 is a vertical surface. Therefore, the direction perpendicular to the support contact surface 1021 is the vertical direction, and the direction perpendicular to the inner wall 201 is the horizontal direction. In other embodiments, the support contact surface 1021 and the inner wall 201 may include surfaces with other suitable orientations.
[0058] Figure 5A This diagram shows a cross-sectional view of a second embodiment of the tray structure of this application (i.e., tray structure 120) after the packaging assembly 1043 with substrate 104 has been moved. Figure 5B yes Figure 5A A first enlarged view of the portion indicated by the circle on the right side of the tray structure 120 shown. Figure 5C yes Figure 5A A second enlarged view of the portion shown by the left circle of the tray structure 120. Figures 5A-5C The cutting line of the cross-sectional view passes through the portion of the capturing part 101 and the portion of the support part 102B that has a recess 1024 facing the capturing part 101.
[0059] As previously described, the receiving space 105 is configured to have a size slightly larger than that of the package assembly 1043 and the substrate 104 to receive the package assembly 1043 and the substrate 104. After the package assembly 1043 or the substrate 104 having the substrate 104 is received in the receiving space 105, the package assembly 1043 or the substrate 104 may move along the support contact surface 1021 of the support portion 102B during use (e.g., transportation) or other applications.
[0060] like Figure 5A As shown, when the packaging assembly 1043 with substrate 104 moves in the X direction along the support contact surface 1021, one capturing portion 101 (the capturing portion 101 on the right) contacts the first side surface 501 of substrate 104, while the other capturing portion 101 (the capturing portion 101 on the left) separates from the second side surface 502 of substrate 104 opposite to the first side surface 501. At this time, the support portion 102B still does not contact the outer edge portion 2051 of the bottom surface 205 of substrate 104. Solder balls 1044 are arranged on the bottom surface 205 of substrate 104. In other embodiments, the bottom surface 205 of substrate 104 is arranged with other suitable structures.
[0061] like Figure 5BAs shown, the inner wall 201 of a capturing portion 101 of the receiving portion of the tray structure 120 contacts a portion of the first side surface 501 of the substrate 104, but does not contact the lower edge portion 5011 of the first side surface 501 of the substrate 104. In a direction perpendicular to the support contact surface 1021 of the support portion 102B, for example, in the vertical direction, the inner wall 201 is higher than the support contact surface 1021 by a distance, so that the inner wall 201 does not contact the lower edge portion 5011 of the first side surface 501 of the substrate 104.
[0062] The support contact surface 1021 of the support portion 102B contacts a portion of the bottom surface 205 of the substrate 104, but does not contact the outer edge 2051 of the bottom surface 205 of the substrate 104. On the same side of the receiving portion of the tray structure, in a direction perpendicular to the inner wall 201, such as the horizontal direction, the outer edge 2061 of the support contact surface 1021 is separated from the inner wall 201 by a third distance and is closer to the center of the receiving space 105 relative to the inner wall 201, so that the support contact surface 1021 does not contact the outer edge 2051 of the bottom surface 205 of the substrate 104. This third distance is greater than the width of the outer edge 2051 of the bottom surface 205 of the substrate 104.
[0063] like Figure 5C As shown, another capturing portion 101 of the receiving portion of the tray structure 120 is separated from the second side surface 502 of the substrate 104 by a fourth distance. At this time, the support contact surface 1021 of the support portion 102B still does not contact the outer edge portion 2051 of the bottom surface 205 of the substrate 104. In a direction perpendicular to the inner wall 201, for example, in the horizontal direction, the outer edge 2061 of the support contact surface 1021 is separated from the inner wall 201 by a fifth distance and is closer to the center of the receiving space 105 relative to the inner wall 201. The outer edge 2061 of the support contact surface 1021 is separated from the inner wall 201 by a sufficient distance such that the outer edge 2061 contacts the interior of the bottom surface 205 of the substrate 104, but does not contact the outer edge portion 2051 of the bottom surface 205 of the substrate 104. This interior of the bottom surface 205 of the substrate 104 is closer to the center of the bottom surface 205 of the substrate 104 relative to the outer edge portion 2051. The fifth distance is greater than the sum of the fourth distance and the width of the outer edge 2051 of the bottom surface 205 of the substrate 104.
[0064] like Figures 5B-5C As shown, the inner side 1023 of the support portion 102B is close to but does not contact the solder balls 1044 arranged on the bottom surface 205 of the substrate 104. Figures 5A-5C The cross-sectional view of the tray structure 120 shown can also be a cross-sectional view of the tray structure 120 when the packaging assembly 1043 with substrate 104 is received in the receiving space 105.
[0065] As mentioned earlier, for BGA type substrate package assemblies, the bottom surface 205 of substrate 104 is provided with multiple solder balls (see...). Figures 5A-5C For LGA type substrate package assemblies, the bottom surface of substrate 104 has multiple contacts (not shown). For example... Figure 5B As shown, the solder balls, contacts, and other structures arranged on the bottom surface 205 of the substrate 104 are spaced apart by a predetermined distance S from the outer edge 2051 of the bottom surface 205. To prevent these structures on the bottom surface 205 of the substrate 104 from contacting and being damaged by the support frame structure of the support portion 102 (e.g., support frames 102A, 102B, and 102C), these structures on the bottom surface 205 of the substrate 104 need to be spaced apart from the inner surface 1023 of the support frame by a distance S1. Furthermore, to prevent the support frame from contacting the outer edge 2051 of the bottom surface 205 of the substrate 104, the outer edge 2061 of the support contact surface 1021 of the support frame needs to be spaced apart from the outer edge 2051 of the bottom surface 205 of the substrate 104 by a distance S2 (e.g., in a direction perpendicular to the inner wall 201 of the trapping portion 101).
[0066] like Figures 4A-4B As shown, when the predetermined distance S between the structure arranged on the bottom surface 205 of the substrate 104 and the outer edge 2051 of the bottom surface 205 is small, in order to meet the above requirements and considering the dimensional deviation between the receiving part of the tray structure and the substrate, the thickness H of the support contact surface 1021 of the support frame needs to be designed to be small. At this time, the wall thickness H2 of the portion of the support portion 102B that does not have the recess 1024 facing the capturing part 101 (i.e., the thickness between the outer side 1022 and the inner side 1023) is still large, which can reduce the risk of process FMEA by conforming to the DFM guidelines for injection molding materials. The wall thickness H1 of the portion of the support portion 102B that has the recess 1024 facing the capturing part 101 (i.e., the thickness between the outer side 1022' and the inner side 1023) is correspondingly smaller. When the aforementioned spacing S is small enough that the wall thickness H1 between the inner side 1023 and the outer side 1022' of the support frame is less than a predetermined thickness threshold (e.g., 0.50 mm), the pallet structure will not meet the injection molding material DFM guidelines, thus increasing the risk of process FMEA.
[0067] The fifth embodiment of the tray structure designed in this application, namely tray structure 150, solves the above-mentioned problems. As described above, the support portion 102D of the receiving portion of tray structure 150 includes a plurality of spaced protrusions 1027, 1028. The protrusions 1027, 1028 are arranged circumferentially and are spaced apart from a plurality of capturing portions 101 circumferentially. On the same side of the receiving portion of the tray structure, in a direction perpendicular to the inner wall 201 of the capturing portion 101, the protrusions 1027, 1028 do not face the capturing portion 101. When the predetermined distance S between the structure arranged on the bottom surface 205 of the substrate 104 and the outer edge portion 2051 of the bottom surface 205 is small, the thickness H of the support contact surface 1021 of the support frame needs to be designed to be small. However, the wall thickness of the protrusions 1027 and 1028 of the support portion 102D (which is basically the same as the wall thickness H2 of the support portion 102B) is still relatively large because the outer surface 1022 includes an upper portion 301 that gradually slopes away from the receiving space 105 in the direction from top to bottom (see...). Figure 3A Therefore, the protrusions 1027 and 1028 of the support portion 102D of the receiving portion enable the pallet structure to comply with the injection molding material DFM guidelines without increasing the risk of process FMEA.
[0068] Although this application has been described with reference to examples of the embodiments outlined above, various alternatives, modifications, variations, improvements, and / or substantially equivalents, whether known or currently or soon to be foreseen, will likely be apparent to those skilled in the art. Furthermore, the technical effects and / or technical problems described herein are exemplary and not limiting; therefore, the disclosures herein may be used to solve other technical problems and have other technical effects and / or can solve other technical problems. Thus, the examples of embodiments of this application as set forth above are intended to be illustrative and not limiting. Various changes can be made without departing from the spirit or scope of this application. Therefore, this application is intended to include all known or previously developed alternatives, modifications, variations, improvements, and / or substantially equivalents.
Claims
1. A pallet structure (100, 110, 120, 130, 140, 150), characterized in that... include: One or more receiving units, each receiving unit being configured to receive a package assembly (1043) having a substrate (104) or to receive the substrate (104), each receiving unit comprising: Multiple capturing parts (101) are configured to contact the sides (203, 204) of the substrate (104). Support portion (102) is configured to support the substrate (104). The capturing part (101) and the supporting part (102) form a receiving space (105) to receive at least a portion of the substrate (104). The capturing part (101) is configured to contact the portion above the lower edge portion (2031, 2041) of the side surface of the substrate (104), and the supporting part (102) is configured to contact a portion of the bottom surface of the substrate (104) and not contact the outer edge portion (2051) of the bottom surface of the substrate (104).
2. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 1, characterized in that, The capturing part (101) includes an inner wall (201, 202) configured to contact the side of the substrate (104), the lower edge (2011, 2021) of the inner wall (201, 202) being higher than the surface (1021, 1025) of the support part (102) supporting the substrate (104).
3. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 2, characterized in that, The support (102) includes a support contact surface (1021, 1025) configured to contact a portion of the bottom surface of the substrate (104), the outer edge (2061) of the support contact surface (1021, 1025) being closer to the center of the receiving space (105) relative to the inner wall (201, 202).
4. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 1, characterized in that, The capturing part (101) and the supporting part (102) are configured such that when the substrate (104) moves within the receiving space (105) along the surface of the supporting part (102) that supports the substrate (104), such that one of the capturing parts (101) contacts the first side (501) of the substrate (104) and the other capturing part (101) separates from the second side (502) of the substrate (104) opposite to the first side, the supporting part (102) still does not contact the outer edge (2051) of the bottom surface of the substrate (104).
5. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 1, characterized in that, The outer side (1022) of the support (102) facing away from the receiving space (105) is sloping.
6. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 1, characterized in that, The support (102) is made of soft or hard material.
7. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 1, characterized in that, The support part (102) is: Support frames (102A, 102B, 102D) are configured to contact the periphery (2052) of the bottom surface (205) of the substrate (104) to support the substrate (104); or A support base plate (102C) is configured to contact approximately the entire bottom surface (205) of the substrate (104) to support the substrate (104).
8. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 7, characterized in that, The support frame (102A, 102B, 102D) includes a plurality of protrusions (1027, 1028) arranged circumferentially and separated from the plurality of capture portions (101) along the circumferential direction.
9. The pallet structure (100, 110, 120, 130, 140, 150) according to claim 1, characterized in that, The tray structure (100, 110, 120) also includes: Mounting frame (103), on which the plurality of capture parts (101) and the support parts (102) are mounted.
10. A pallet system (160), characterized in that... include: One or more pallet structures (100, 110, 120, 130, 140, 150) according to any one of claims 1-9.
11. The pallet system (160) according to claim 10, characterized in that, The tray structure is stacked in layers.