Building support state detection device and working method thereof

Abstract

A building support state monitoring device comprises a base material, a data acquisition module and an embedded data processing module, the data acquisition module is composed of a sensor module used for acquiring strain signals of a building support, and the sensor module comprises two groups of tension and pressure strain sensors which are installed on the building support according to a certain angle. The method comprises the steps of installation, dial-up number setting, data acquisition, processing, transmission, analysis and the like, the analyzed data is uploaded to the cloud server big data service platform, the functions of nondestructive detection and timely early warning of the in-service state of the building support are achieved, resource allocation is optimized, engineering time and cost are saved, operation is simple and easy to achieve, and the method is suitable for popularization and application. And the safety risk is reduced, and the safety of constructional engineering is ensured.

Description

(I) Technical Field:

[0001] This invention relates to the field of building safety monitoring, specifically to a building support status detection device and its working method. This invention can realize the in-service status detection and stability assessment of building supports, thereby ensuring the safety performance of building projects. (II) Background Technology:

[0002] With the continuous development of my country's economy, infrastructure construction has entered a peak period, and the scale and quantity of production continue to increase. In construction projects such as buildings, bridges, and photovoltaic power stations, the application of building supports is becoming increasingly widespread. Nowadays, complex and tall building projects require excellent load-bearing structures, and high-performance, tall load-bearing structures need to be supported and fixed using building supports. Therefore, ensuring the safety and performance of building supports is a crucial aspect of the entire structural construction and application. Comprehensive monitoring of the condition of building supports can reflect their operational status and ensure the safety of the construction project.

[0003] Since the late 20th century, my country has gradually emphasized building safety design and established regulations to ensure its effectiveness. Since 1989, the "Code for Seismic Design of Buildings" (GBJ 11-89) has been formulated and published. This code, for the first time, explicitly requires specific design standards for building supports, aiming to ensure the stability and safety of building supports during construction and use, providing fundamental guidance for the safety design of building projects. Entering the 21st century, the country further strengthened building safety design standards. The updated "Code for Design of Steel Structures" (GB 50017-2017), published in 2017, includes detailed provisions on the stress analysis of steel structure building supports. Furthermore, the code sets forth specific requirements for the structural requirements, material selection, and connection methods of supports to ensure their safety and reliability under various working conditions.

[0004] In construction engineering, although strict requirements and standards exist for the design and construction phases of building supports, research and practice on monitoring their in-service status are relatively limited. Building supports may be affected by various dynamic loads and environmental factors during construction and use, which can lead to performance degradation and safety hazards. Therefore, comprehensive monitoring of building supports is crucial to ensuring the overall safety of the construction project. Regular monitoring allows for real-time access to core data such as the load-bearing capacity, deformation degree, and stress distribution of the supports, facilitating the timely identification of any potential problems and prompt corrective action. Thus, the importance of monitoring the stress state of building supports for the safety performance of construction projects cannot be ignored.

[0005] In terms of monitoring technology, current monitoring of building scaffolding mostly employs sensor technology. Stress sensors are directly attached to key parts of the scaffolding structure to monitor stress and strain data during construction and use, providing fundamental data for monitoring the in-service status of the scaffolding. However, several problems have been identified during sensor installation, primarily: First, during construction, frequent activities such as machinery operation, personnel movement, and material handling easily damage the strain sensors pre-attached to the scaffolding. Damage not only affects the accuracy of monitoring data but also necessitates reinstallation and recalibration, increasing project time and cost. Second, while installing strain sensors after scaffolding installation reduces damage during construction, the complex and variable environment of construction sites makes accurate sensor installation difficult. Furthermore, building scaffolding is often installed at high positions, requiring workers to perform high-altitude work to attach strain sensors after installation, significantly increasing operational difficulty and safety risks. Therefore, how to reasonably solve the problem of sensor bonding in building support monitoring systems, ensure the timeliness and accuracy of building support monitoring, and save project time and costs are issues that must be addressed to improve the monitoring of the in-service status of building supports and ensure the safety of building projects.

[0006] To address the practical requirements of building support status monitoring, this invention designs an integrated building support status monitoring device. This device is based on the integration of mechanical engineering design, sensor technology, and wireless transmission technology, enabling real-time monitoring of the in-service status of building supports, assessment of the safety status of building projects, and timely early warning. Simultaneously, it utilizes a cloud server big data service platform for visualization design, ensuring the storage and traceability of collected historical data, enabling remote access and control, and completing remote early warning functions. (III) Summary of the Invention:

[0007] The purpose of this invention is to provide a building support status detection device and its working method for real-time monitoring of the stress state of building supports. It can overcome the shortcomings of the existing technology. This invention uses mechanical engineering design technology to design the building support status monitoring device. At the same time, based on sensor and wireless transmission technology, the stress state data of the building support is transmitted to the cloud server through a wireless network to obtain the data monitoring status map of the building support under the current state, observe whether there are any abnormalities, and provide a scientific basis for the decision-making of relevant operators.

[0008] The technical solution of the present invention is as follows: a building support status monitoring device, characterized in that it includes a base material, a data acquisition module, and an embedded data processing module; the data acquisition module and the embedded data processing module are installed on the base material; the data acquisition module is connected to the embedded data processing module, and the data acquisition module transmits the acquired data to the embedded data processing module; the embedded data processing module transmits the processed data to a server.

[0009] The embedded data processing module includes a power module, a bridge processing module, a temperature compensation module, a data processing module, a DIP switch module, and a WiFi wireless communication module. The power module provides power to all modules in the embedded data processing module and the data acquisition module. The input of the bridge processing module is connected to the output of the data acquisition module. The input of the temperature compensation module is connected to the output of the bridge processing module. The input of the data processing module receives the output signals from the bridge processing module and the temperature compensation module, and simultaneously receives and verifies the ID number data output by the DIP switch module. The output of the data processing module is bidirectionally connected to the cloud server big data service platform via the WiFi wireless communication module. When the stress state of the building support changes, the data acquisition module collects the strain of the building support. The data processing module analyzes, calculates, and processes the data obtained after bridge processing and temperature compensation, and then transmits it to the cloud server big data service platform via the WiFi wireless communication module, realizing the function of sensor parameter acquisition and uploading. Subsequently, the uploaded data is remotely monitored on the cloud server big data service platform to detect any sudden changes in the uploaded information and ensure the safety performance of the building support.

[0010] The data acquisition module consists of a sensor module for acquiring strain signals from the building support structure. It is powered by a power module in the embedded data processing module, and its output is connected to the input of the bridge processing module.

[0011] The sensor module includes two sets of tensile and compressive strain sensors. One set is used to measure the tensile and compressive strain of the building support along the support direction, and is referred to as the first set of strain sensors. The other set is used to measure the torsional strain of the building support under stress, and is referred to as the second set of strain sensors.

[0012] The first group of strain sensors includes two strain sensors. One strain sensor is installed in a direction parallel to the building support, with this direction set to 0° for temperature compensation. The other strain sensor is installed at an angle of 90°.

[0013] The second set of strain sensors includes two strain sensors. One strain sensor is installed at a 45° angle along the building support for temperature compensation, while the other strain sensor is installed at a 135° angle along the building support.

[0014] The bridge processing module is a Wheatstone bridge processing circuit structure; the temperature compensation module is a temperature self-compensation circuit structure.

[0015] The substrate is mounted on a building support frame.

[0016] The substrate is made of fiberglass board.

[0017] The fiberglass board is shaped like a rounded rectangle. Bolt mounting holes are pre-drilled on the left, middle, and right sides of the fiberglass board to allow the monitoring device to be fixed to the building support structure. An adhesive strain sensor is placed between the two pre-drilled bolt holes on the left and middle sides to measure the tensile, compressive, and torsional forces on the building support structure. Grooves are cut above and below the adhesive strain sensor area to accommodate the wires connecting the strain sensor and the embedded data processing module. Simultaneously, to prevent deformation of the building support status monitoring device during stress, which could affect the normal operation of the embedded data processing module, grooves are cut in the middle of the pre-drilled bolt positions on the middle and right sides of the monitoring device to accommodate the embedded data processing module.

[0018] A method for operating a building support structure condition monitoring device, characterized by comprising the following steps:

[0019] (1) Before installing the building support, install the building support status monitoring device in the corresponding position of the building support through the reserved bolt holes, and confirm the ID number of each building support through the DIP switch module, so that when the status of the corresponding number of building support changes suddenly during the inspection process, the staff can confirm and check and repair it in time.

[0020] (2) The strain sensors attached at 0° and 90° on the device are considered as a group for measuring the tensile and compressive values ​​of the building support under stress, and the strain sensors attached at 45° and 135° are considered as a group for measuring the torsional force of the building support under stress.

[0021] (3) The tensile and torsional force data measured by the strain sensor are processed by the Wheatstone bridge module and the temperature compensation module to convert the tensile and torsional force data generated by the building support under stress into voltage values.

[0022] (4) The measured voltage data is processed by the data processing module, which amplifies and filters the measured small pressure value, and transmits the digital signal data after analog-to-digital conversion using a high-precision ADC chip to the WiFi communication module. The data is transmitted to the cloud server in real time through the WiFi communication function, which makes it convenient for staff to monitor, download and view the data.

[0023] (5) At the terminal of the device, in order to avoid breakage during installation, the strain sensor and the corresponding wire should be connected and placed in the reserved slot for strain sensor wires in the device and then pasted with insulating tape.

[0024] (6) After each acquisition terminal is installed and the power supply module is used to power each terminal, the embedded main control chip is used to debug and initialize each terminal.

[0025] (7) After receiving the initialization command, the building support status monitoring device terminal drives two sets of strain sensors to monitor the stress state of the building support, and processes the collected data and transmits it to the cloud server using WiFi communication transmission function.

[0026] (8) For the collected tensile and torsional force data, data visualization design is carried out on the cloud server big data service platform. At the same time, a threshold is set. When the tensile or torsional force data of a certain building support changes abruptly and exceeds the set threshold, the cloud server big data service platform will promptly issue an early warning to the relevant staff to remind them to judge and confirm the service status of the corresponding building support based on the ID value, so as to ensure the safety of the building project.

[0027] The working principle of this invention is as follows: This device integrates wireless transmission technology, embedded systems, and artificial intelligence technology. Based on sensing, it integrates a building support status measurement terminal, an embedded data processing module, and a cloud server big data service platform. The building support status measurement terminal has strain sensors pre-attached to it and is installed at the corresponding positions on the building support using bolts. The embedded data processing module collects and processes the data transmitted from the sensors and interacts with the cloud server via WiFi. The cloud server big data service platform completes real-time monitoring and timely early warning of the stress state of the building support.

[0028] The building support condition measurement terminal is a building support condition monitoring device designed according to the mechanical structure. This device integrates a sensor component and an embedded data processing module. Using this device can solve the problem of attaching strain sensors to the building support. In practical applications, the integrated monitoring device with strain sensors is installed onto the building support before the entire system is installed, thus effectively solving the aforementioned problem.

[0029] The cloud server big data service platform connects to the cloud server via an embedded data processing module and WiFi wireless communication. It stores and processes data collected by the building support status measurement terminal on the cloud server, ensuring the storage and traceability of historical building support data. Simultaneously, data monitoring and early warning settings can be configured on the cloud server big data service platform, enabling remote monitoring and timely alerts via email alarms and other remote operations.

[0030] Design principles of the present invention: (1) Mechanical structure design of building support status monitoring device

[0031] The mechanical structure design of the building support status monitoring device is mainly described from the aspects of base material, structural design, and completed functions.

[0032] The monitoring device is made of substrates of different sizes and specifications. The substrate material is FR-4 fiberglass board with high mechanical strength, high temperature corrosion resistance and easy processing, which ensures that the device can be used for a long time and maintains stability while the substrate is installed on the building support.

[0033] The installation method of the strain sensor group first requires stress analysis of the support. For building supports such as internal building supports, seismic bracing, and solar photovoltaic supports, static and dynamic analyses must be performed after installation. According to the analysis results, it is necessary to consider the load-bearing capacity of the building's internal structure and the weight of the equipment, as well as the horizontal force caused by the earthquake. It is necessary to ensure that the building support has sufficient seismic resistance to protect the building structure and equipment.

[0034] The weight of the building's internal structure and equipment, as well as the horizontal forces caused by earthquakes, often generate tensile and compressive forces on the building's support structure. When the support structure is subjected to external moments or asymmetrical loads such as urban wind loads, seismic action, and uneven solar panel placement, torsional forces are generated. To measure the tensile, compressive, and torsional forces on the building's support structure, strain gauges are used. First, regarding the strain gauge orientation, to measure the tensile and compressive forces along the support direction, one strain gauge is positioned parallel to the support direction, set to 0°. For temperature compensation, the other strain gauge in this group is positioned at 90°. Simultaneously, to measure the torsional forces under stress, an additional strain gauge group is added, installed at a 45° angle along the support structure, with a 135° strain gauge also installed for temperature compensation. Figure 2The diagram shows the specific installation direction of the sensor group for measuring tensile, compressive, and torsional forces in the design of the building support condition measurement terminal. Secondly, regarding the placement of the strain sensor leads, because the strain sensor leads are relatively thin and the connection strength between the leads and the strain sensor resistance wire is very low, they are easily broken. Furthermore, the distance between the strain sensor and the embedded data processing module in this monitoring device is relatively large. Therefore, in this monitoring device, the strain sensor leads are led to the slots above and below the strain sensor bonding area and fixed with insulating tape to prevent breakage of the strain sensor and connecting wires during transportation and installation.

[0035] The embedded data processing module is installed by slotting the fiberboard at the midpoint of the pre-reserved bolt positions on the middle and right sides. This is done to prevent deformation of the building support monitoring device due to stress from affecting the embedded data processing module when measuring tensile, compressive, and torsional forces under load. The size of the slot for installing the embedded data processing module needs to take into account the actual size of the embedded data processing module.

[0036] The embedded data processing module processes data collected by four strain sensors attached to the building support condition monitoring device. The deformation of the sensors under stress reflects the stress condition of the building support. In practical applications, abrupt changes in the collected strain data can be observed. Any abrupt changes indicate a shift in the stress state of the building support, requiring inspection to ensure it remains in good working order.

[0037] (2) Embedded data processing module for building support status monitoring device

[0038] The embedded data processing module in the building support condition monitoring device is built based on embedded system technology and integrates power supply circuit, bridge processing circuit, temperature compensation circuit, data processing circuit, DIP switch circuit, and WiFi wireless communication circuit (such as...). Figure 3 (As shown). When the stress state of the building support changes, the strain of the support can be collected in a timely manner through the data acquisition module. After analysis, calculation, and processing, the obtained data is transmitted to a cloud server via WiFi wireless network. The cloud server's big data service platform is used for monitoring, realizing the function of collecting and uploading sensor parameters. On the cloud server's big data service platform, the uploaded data is remotely monitored to detect any sudden changes in the uploaded information, ensuring the safety performance of the building support. The embedded data processing module of the building support status monitoring device mainly includes: a power supply module, a bridge processing module, a temperature compensation module, a data processing module, a DIP switch module, and a WiFi wireless communication module. Figure 3The diagram shows the circuit structure of the embedded data processing module of the building support status monitoring device.

[0039] The power module supplies power to the data acquisition module and embedded data processing module on the building support measurement terminal.

[0040] The aforementioned bridge processing module measures the stress state of the building support structure. Based on the sensors pre-installed on the aforementioned building support structure status monitoring terminal device, the bridge processing circuit measures the magnitude of the deformation of the sensor group caused by the tensile, compressive, and torsional forces generated by the building support structure under stress. The bridge processing module then converts this deformation magnitude into a voltage value, which directly reflects the stress magnitude of the building support structure and monitors its in-service status.

[0041] The temperature compensation module employs a temperature self-compensation method to eliminate the influence of temperature on the resistive strain sensor. For the strain sensor group measuring tension and compression, the 0° and 90° strain sensors are connected to a Wheatstone bridge circuit using a half-bridge configuration. The 0° strain sensor is mounted in the same direction as the tension and compression direction of the building support, ensuring that the 90° strain sensor compensates for temperature-induced errors during measurement under the same environmental conditions. The same applies to the strain sensors at 45° and 135°. The data on strain sensor deformation caused by tension, compression, and torsion forces, after error elimination, is connected to a Wheatstone bridge to convert the deformation value into a voltage value. This voltage change data is then input to the data processing module for processing. The temperature compensation module circuit uses a strain sensor for temperature self-compensation, forming a half-bridge Wheatstone circuit with the original strain sensor.

[0042] The data processing module addresses the issue that the deformation values ​​of the building support structure collected by the strain sensor are relatively small, resulting in low voltage values ​​after Wheatstone bridge conversion, making them difficult to process and identify. Therefore, the voltage signal, after temperature compensation, needs to be amplified and filtered. The processed analog voltage signal is then converted into a digital signal using a high-precision ADC chip. Finally, a WiFi wireless communication module is used to upload the building support structure strain data to a cloud server big data service platform.

[0043] The DIP switch module, by installing DIP switches on the embedded data processing module, realizes ID recognition based on the different DIP switch data. Based on the different ID numbers, the building supports in the construction project are numbered. When the stress state of the building supports changes abruptly, the specific location of the faulty support can be accurately identified based on the ID number, so that relevant workers can react immediately and inspect and repair the faulty building supports.

[0044] When the WiFi wireless communication module receives data that has been amplified, filtered, and converted by an A / D converter, it uses the WiFi module's wireless communication function to upload the data to the cloud server in real time. The cloud server's big data service platform then performs real-time monitoring of the building support strain data. When observing sudden changes in the stress state of the building support, the system uses the ID number reflected by the DIP switch to determine if the corresponding number of the building support in the entire construction project has become loose. This alerts relevant workers to take timely action and ensure the safety of the construction project.

[0045] (3) Cloud server big data service platform for building support status monitoring device

[0046] In this device, a cloud server big data service platform is connected via WiFi wireless communication. The cloud server big data service platform acts as a server, providing an open IP address and port number for the connection and data transmission between the building support status monitoring device terminals. Furthermore, based on the DIP switch module of the embedded data processing module, it manages all building support status monitoring device terminals, receives stress status data of the building supports monitored by the terminals, and stores, processes, displays, and issues warnings for the data.

[0047] The cloud server big data service platform stores data by receiving and saving the stress status information of the building support structure collected by the building support structure status monitoring device via a WiFi wireless communication module. Data processing involves encapsulating the data into a suitable transmission format using the WiFi wireless communication module, sending the data to the cloud server, parsing the received data, and storing it in the cloud server database. Data visualization involves designing data visualizations on the platform after parsing and saving the data, displaying the data collected by the device. Early warning is provided by setting warning thresholds on the visualization platform. When a sudden change occurs in the collected data, causing the data result to exceed the threshold, remote warning measures such as email alerts are used to promptly notify relevant personnel, achieving the goal of remote, early, and timely warning.

[0048] Advantages of the present invention:

[0049] 1. This invention designs a building support structure condition monitoring device. Before collecting data on the building support structure's condition, this device needs to be pre-installed on the support structure. The device integrates strain sensors for collecting data on the stress state of the support structure. Compared to directly attaching strain sensors to the support structure, this device is more adaptable to various harsh conditions, ensuring reliable data in different environments. Using this device for data collection avoids strain sensor damage during the support structure installation process. The device is easy to install, avoiding the need for high-altitude operations due to complex site environments. The device also integrates an embedded data processing module, enabling monitoring and early warning functions, minimizing downtime caused by structural problems, and improving the building's operational efficiency and safety performance.

[0050] 2. This invention combines wireless transmission technology, embedded systems, and artificial intelligence technology, and designs a method and device for detecting the state of building supports based on sensor perception. Using a building support state monitoring device terminal, data on the stress state of building supports can be collected non-destructively, and the data is processed using an embedded data processing module integrated on the terminal. This enables rapid, comprehensive, real-time, and intelligent monitoring of the stress state of building supports with confirmed ID numbers, and timely issuance of warnings to relevant personnel upon detecting abnormalities.

[0051] 3. The embedded data processing module of the building support condition monitoring device terminal is equipped with a WiFi wireless communication module. Combined with distributed sensor data monitoring technology, it connects wirelessly to a cloud server to upload data collected by the terminal for storage, processing, display, and early warning. Using the cloud server big data service platform for monitoring enables timely data upload and real-time monitoring, remote access, and real-time remote early warning. It provides timely alerts when the stress data of the building support exceeds a threshold, ensuring the safety of the construction project. (iv) Description of the attached drawings:

[0052] Figure 1 This is a structural schematic diagram of a building support status detection device according to the present invention (wherein, ① represents the base material of the building support status monitoring device, ② represents the reserved bolt fixing position, ③ represents the strain sensor pasting position, ④ represents the reserved groove for the strain sensor wire, and ⑤ represents the installation position of the embedded data processing module of the building support status monitoring device).

[0053] Figure 2 This is a schematic diagram showing the installation position and direction of the strain sensor module in a building support status detection device according to the present invention.

[0054] Figure 3This is a schematic diagram of the circuit structure of the embedded data processing module in a building support status detection device according to the present invention.

[0055] Figure 4 This is a schematic diagram of the working method of a building support status detection device according to the present invention. (V) Specific Implementation Methods:

[0056] Example: A building support structure status monitoring device, characterized in that it includes a base material, a data acquisition module, and an embedded data processing module; the data acquisition module and the embedded data processing module are mounted on the base material; the data acquisition module is connected to the embedded data processing module, and the data acquisition module transmits the acquired data to the embedded data processing module; the embedded data processing module transmits the processed data to a server; the base material is made of fiberglass board and is mounted on the building support structure, such as... Figure 1 As shown.

[0057] The embedded data processing module includes a power module, a bridge processing module, a temperature compensation module, a data processing module, a DIP switch module, and a WiFi wireless communication module, such as... Figure 3 As shown; the power module provides power support for all modules in the embedded data processing module and the data acquisition module; the input terminal of the bridge processing module is connected to the output terminal of the data acquisition module; the input terminal of the temperature compensation module is connected to the output terminal of the bridge processing module; the input terminal of the data processing module receives the output signals from the bridge processing module and the temperature compensation module, and simultaneously receives and verifies the ID number data output by the DIP switch module; the output terminal of the data processing module is connected to the cloud server big data service platform via a WiFi wireless communication module for bidirectional data transmission; when the stress state of the building support changes, the strain of the building support is collected by the data acquisition module, and the data obtained after bridge processing and temperature compensation by the data processing module is analyzed, calculated, and processed, and then transmitted to the cloud server big data service platform via the WiFi wireless communication module to realize the function of sensor parameter acquisition and uploading; subsequently, the uploaded data is remotely monitored on the cloud server big data service platform to monitor for any sudden changes in the uploaded information and ensure the safety performance of the building support. The bridge processing module is a Wheatstone bridge processing circuit structure; the temperature compensation module is a temperature self-compensation circuit structure.

[0058] The data acquisition module consists of a sensor module for acquiring strain signals from the building support structure. It is powered by a power module in the embedded data processing module, and its output is connected to the input of the bridge processing module.

[0059] The sensor module includes two sets of tensile and compressive strain sensors, such as... Figure 2 , Figure 3 As shown, one set of strain sensors is used to measure the tensile and compressive strain of the building support along the support direction, and is referred to as the first set of strain sensors. The other set is used to measure the torsional strain of the building support under stress, and is referred to as the second set of strain sensors.

[0060] The first set of strain sensors includes two strain sensors. One strain sensor is installed parallel to the building support direction, with this direction set to 0° for temperature compensation. The other strain sensor is installed at a 90° angle. Figure 2 As shown.

[0061] The second set of strain sensors includes two strain sensors. One strain sensor is installed at a 45° angle along the building support for temperature compensation, while the other strain sensor is installed at a 135° angle along the building support. Figure 2 As shown.

[0062] The fiberglass board is designed as a rounded rectangle. Bolt mounting holes 2 are pre-drilled on the left, middle, and right sides of the fiberglass board to allow the monitoring device to be fixed to the building support structure. An adhesive strain sensor is placed between the two pre-drilled bolt holes on the left and middle sides, 3, to measure the tensile, compressive, and torsional forces on the building support structure. Grooves 4 are cut above and below the adhesive strain sensor area to accommodate the wires connecting the strain sensor and the embedded data processing module. Simultaneously, to prevent deformation of the building support structure monitoring device during stress, which could affect the normal operation of the embedded data processing module, grooves are cut in the middle of the pre-drilled bolt positions on the middle and right sides of the monitoring device to accommodate the embedded data processing module.

[0063] This invention relates to a method and apparatus for detecting the condition of building supports, such as... Figure 1 The diagram shows the mechanical structure of the device. In actual engineering applications, before installing the building support, the stress measurement integrated plate is first bolted onto the building support, and then the support is installed.

[0064] The device uses fiberglass as its base material and is designed in a planar, rounded rectangular shape. Its size must be matched to the actual building support structure. Bolt mounting holes must be pre-drilled on the left, middle, and right sides of the device to ensure it can be installed on the building support. The sensor group installation direction, with the strain sensor attachment points located between the pre-drilled mounting holes on the left and middle sides, is as follows: Figure 2As shown, four strain sensors used to measure the tensile, compressive, and torsional forces of the building support are attached at a specific angle, following strain sensor attachment rules, to their pre-defined attachment positions. Slots are cut above and below these attachment positions to embed the strain sensor wires, which are then secured with insulating tape to prevent breakage during transportation and installation. Slots are also cut in the middle of the pre-drilled bolt holes on the middle and right sides. These slots are used to house an embedded data processing module for data processing, preventing deformation of the stress-integrated sheet under external loads from affecting the operation of the embedded data processing module.

[0065] An embedded data processing module is integrated into the building support status monitoring device. The circuit structure block diagram of this module is shown below. Figure 3 As shown, its main modules include: power supply module, bridge processing module, temperature compensation module, data processing module, DIP switch module, and WiFi wireless communication module.

[0066] The power supply module functions to power each circuit module using a battery. The bridge processing module converts the minute deformations caused by stress in the data acquisition module into voltage values ​​via a bridge. The temperature compensation module performs temperature compensation for the strain sensor group to reduce the impact of temperature. It uses a half-bridge configuration to connect a Wheatstone bridge, enabling temperature self-compensation for the strain sensors. The measured minute deformations after temperature compensation are then converted into voltage values ​​via the bridge module. The data processing module, because the voltage output from the bridge is too small to be used directly, requires further processing. The voltage value is input to the data processing module, where the data is amplified and filtered. The processed data is then input to a high-precision ADC chip to convert the analog signal into a digital signal. The DIP switch module assigns a number to each building support status monitoring device based on the DIP switch, enabling ID identification of the building support. The WiFi wireless communication module inputs the output digital signal to a chip with WiFi functionality, uploading the data to a cloud server via WiFi. Visual design is then performed on the cloud server's big data service platform to measure and monitor the stress on the building support, and to issue timely warnings when stress changes abruptly.

[0067] The specific implementation method of the above-mentioned building support status monitoring device is as follows:

[0068] For building supports such as internal scaffolding, seismic bracing, and solar photovoltaic supports, monitoring their in-service status is necessary to reduce the impact of disasters such as earthquakes on buildings and ensure the safety of construction projects. To address the problems associated with directly mounting sensors on building supports, this invention designs a building support status monitoring device. This device integrates sensor modules and an embedded data processing module, and is bolted to the building supports before installation. This enables the monitoring of the building supports' in-service status and timely early warning of abnormal conditions. The installation and usage process of this invention is as follows: Figure 4 As shown.

[0069] (1) Before installing the building support, install the building support status monitoring device in the corresponding position of the building support through the reserved bolt holes, and confirm the ID number of each building support through the DIP switch module, so that when the status of the corresponding number of building support changes suddenly during the inspection process, the staff can confirm and check and repair it in time.

[0070] (2) The strain sensors attached at 0° and 90° on the device are considered as a group for measuring the tensile and compressive values ​​of the building support under stress, and the strain sensors attached at 45° and 135° are considered as a group for measuring the torsional force of the building support under stress.

[0071] (3) After the tensile and torsional force data measured by the strain sensor are processed by temperature self-compensation and Wheatstone bridge, the tensile and torsional force data generated by the building support under stress are converted into voltage values.

[0072] (4) The measured voltage data is processed by the data processing module, which amplifies and filters the measured small pressure value, and transmits the digital signal data after analog-to-digital conversion using a high-precision ADC chip to the WiFi communication module. The data is transmitted to the cloud server in real time through the WiFi communication function, which makes it convenient for staff to monitor, download and view the data.

[0073] (5) At the terminal of the device, in order to avoid breakage during installation, the strain sensor and the corresponding wire should be connected and placed in the reserved slot for strain sensor wires in the device and then pasted with insulating tape.

[0074] (6) After each acquisition terminal is installed and the power supply module is used to power each terminal, the embedded main control chip is used to debug and initialize each terminal.

[0075] (7) After receiving the initialization command, the building support status monitoring device terminal drives two sets of strain sensors to monitor the stress state of the building support, and processes the collected data and transmits it to the cloud server using WiFi communication transmission function.

[0076] (8) For the collected tensile and torsional force data, data visualization design is carried out on the cloud server big data service platform. At the same time, a threshold is set. When the tensile or torsional force data of a certain building support changes abruptly and exceeds the set threshold, the cloud server big data service platform will promptly issue an early warning to the relevant staff to remind them to judge and confirm the service status of the corresponding building support based on the ID value, so as to ensure the safety of the building project.

Claims

1. A building support structure condition monitoring device, characterized in that... It includes a substrate, a data acquisition module, and an embedded data processing module; the data acquisition module and the embedded data processing module are mounted on the substrate; the data acquisition module is connected to the embedded data processing module, and the data acquisition module transmits the acquired data to the embedded data processing module; The embedded data processing module transmits the processed data to the server.

2. The building support status monitoring device according to claim 1, characterized in that... The embedded data processing module includes a power module, a bridge processing module, a temperature compensation module, a data processing module, a DIP switch module, and a WiFi wireless communication module. The power module provides power to all modules in the embedded data processing module and the data acquisition module. The input of the bridge processing module is connected to the output of the data acquisition module. The input of the temperature compensation module is connected to the output of the bridge processing module. The input of the data processing module receives the output signals from the bridge processing module and the temperature compensation module, and simultaneously receives and verifies the ID number data output by the DIP switch module. The output of the data processing module is bidirectionally connected to the cloud server big data service platform via the WiFi wireless communication module. When the stress state of the building support changes, the data acquisition module collects the strain of the building support. The data processing module analyzes, calculates, and processes the data obtained after bridge processing and temperature compensation, and then transmits it to the cloud server big data service platform via the WiFi wireless communication module, realizing the function of sensor parameter acquisition and uploading. Subsequently, the uploaded data is remotely monitored on the cloud server big data service platform to detect any sudden changes in the uploaded information and ensure the safety performance of the building support.

3. The building support status monitoring device according to claim 2, characterized in that... The data acquisition module consists of a sensor module for acquiring strain signals from the building support structure. It is powered by a power module in the embedded data processing module, and its output is connected to the input of the bridge processing module.

4. A building support status monitoring device according to claim 3, characterized in that... The sensor module includes two sets of tensile and compressive strain sensors. One set is used to measure the tensile and compressive strain of the building support along the support direction, and is referred to as the first set of strain sensors. The other set is used to measure the torsional strain of the building support under stress, and is referred to as the second set of strain sensors.

5. A building support status monitoring device according to claim 4, characterized in that... The first group of strain sensors has two strain sensors. One strain sensor is installed parallel to the building support direction and is set to 0° for temperature compensation. The other strain sensor is installed at an angle of 90°. The second group of strain sensors has two strain sensors. One strain sensor is installed at a 45° angle along the building support for temperature compensation. The other strain sensor is installed at a 135° angle along the building support.

6. A building support status monitoring device according to claim 2, characterized in that... The bridge processing module is a Wheatstone bridge processing circuit structure; the temperature compensation module is a temperature self-compensation circuit structure.

7. A building support status monitoring device according to claim 1, characterized in that... The substrate is mounted on a building support frame.

8. A building support status monitoring device according to claim 7, characterized in that... The substrate is made of fiberglass board.

9. A building support status monitoring device according to claim 8, characterized in that... The fiberglass board is shaped like a rounded rectangle. Bolt mounting holes are pre-drilled on the left, middle, and right sides of the fiberglass board to allow the monitoring device to be fixed to the building support structure. An adhesive strain sensor is placed between the two pre-drilled bolt holes on the left and middle sides to measure the tensile, compressive, and torsional forces on the building support structure. Grooves are cut above and below the adhesive strain sensor area to accommodate the wires connecting the strain sensor and the embedded data processing module. Simultaneously, to prevent deformation of the building support status monitoring device during stress, which could affect the normal operation of the embedded data processing module, grooves are cut in the middle of the pre-drilled bolt positions on the middle and right sides of the monitoring device to accommodate the embedded data processing module.

10. A method for operating a building support structure condition monitoring device, characterized in that... It includes the following steps: (1) Before installing the building support, install the building support status monitoring device in the corresponding position of the building support through the reserved bolt holes, and confirm the ID number of each building support through the DIP switch module, so that when the status of the corresponding number of building support changes suddenly during the inspection process, the staff can confirm and check and repair it in time. (2) The strain sensors attached at 0° and 90° on the device are considered as a group for measuring the tensile and compressive values ​​of the building support under stress, and the strain sensors attached at 45° and 135° are considered as a group for measuring the torsional force of the building support under stress. (3) After the tensile and torsional force data measured by the strain sensor are processed by the Wheatstone bridge module and the temperature compensation module, the tensile and torsional force data generated by the building support under stress are converted into voltage values. (4) The measured voltage data is processed by the data processing module, which amplifies and filters the measured small pressure value, and transmits the digital signal data after analog-to-digital conversion using a high-precision ADC chip to the WiFi communication module. Through the WiFi communication function, the data is transmitted to the cloud server in real time, which is convenient for staff to monitor, download and view the data. (5) On the terminal of the device, in order to avoid breakage during installation, the strain sensor and the corresponding wire should be connected and placed in the reserved slot for strain sensor wires in the device and then pasted with insulating tape. (6) After each acquisition terminal is installed and the power supply module is used to power each terminal, the embedded main control chip is used to debug and initialize each terminal. (7) After receiving the initialization command, the building support status monitoring device terminal drives two sets of strain sensors to monitor the stress state of the building support, and processes the collected data and transmits it to the cloud server using WiFi communication transmission function. (8) For the collected tensile and torsional force data, data visualization design is carried out on the cloud server big data service platform. At the same time, a threshold is set. When the tensile or torsional force data of a certain building support changes abruptly and exceeds the set threshold, the cloud server big data service platform will promptly issue an early warning to the relevant staff to remind them to judge and confirm the service status of the corresponding building support based on the ID value, so as to ensure the safety of the building project.

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