Electronic paper packaging method and electronic paper

Abstract

The invention discloses an electronic paper packaging method and electronic paper, the packaging method comprises the following steps: weighing 10-90 parts by weight of first resin, 1-20 parts by weight of second resin, 1-90 parts by weight of a solvent, 0.1-20 parts by weight of a photoinitiator, 1-10 parts by weight of a leveling agent, 1-10 parts by weight of a high dielectric additive and 0.1-5 parts by weight of a dispersant, mixing and stirring to obtain a packaging adhesive; providing an upper substrate and a lower substrate with a microcavity structure; coating the packaging adhesive on the upper substrate to form a packaging adhesive layer, and performing first curing treatment on the packaging adhesive layer; under the vacuum condition, the upper substrate and the lower substrate are aligned and pressed, so that the micro-cavity wall of the lower substrate is embedded into the packaging adhesive layer; and carrying out second curing treatment on the packaging adhesive layer to finish electronic paper packaging. According to the packaging method, by performing staged curing on the packaging adhesive layer, electronic paste crosstalk between adjacent microcavity structures can be blocked, and the display effect of the electronic paper is improved.

Description

Technical Field

[0001] This invention belongs to the field of electronic paper technology, specifically relating to an electronic paper packaging method and electronic paper. Background Technology

[0002] Electronic paper, as a new type of display technology, has the characteristics of low power consumption, high definition, and flexibility, and is widely used in fields such as e-books, electronic tags, and smart logistics. The packaging quality of electronic paper directly determines its display effect.

[0003] Currently, electronic paper encapsulation mainly employs a one-time curing process, such as one-time UV curing or heat curing. This process requires simultaneous application of encapsulant and curing, meaning that encapsulant is applied to the microcavity structure while it is being cured. This simultaneous process presents two significant problems: first, the encapsulant can easily seep into the electronic paste before curing, affecting the display effect; second, once the encapsulant is fully cured, its hardness increases and it loses its plasticity, making it difficult for the encapsulant layer to be fully embedded in the microcavity walls, resulting in poor encapsulation. Summary of the Invention

[0004] This invention provides a method for encapsulating electronic paper and the electronic paper itself. The encapsulation method avoids the risk of encapsulating adhesive seeping into the electronic paste by curing the encapsulating adhesive layer in stages, and ensures that the microcavity wall and the encapsulating adhesive layer are completely bonded. This can block crosstalk between adjacent microcavity structures and improve the display effect of the electronic paper.

[0005] To achieve the above-mentioned objectives, the technical solution of the present invention is as follows: The first aspect of this invention provides a method for packaging electronic paper, comprising the following steps: Weigh 10-90 parts by weight of the first resin, 1-20 parts by weight of the second resin, 1-90 parts by weight of the solvent, 0.1-20 parts by weight of the photoinitiator, 1-10 parts by weight of the leveling agent, 1-10 parts by weight of the high dielectric additive, and 0.1-5 parts by weight of the dispersant, and mix them to obtain the encapsulating adhesive. An upper substrate and a lower substrate with a microcavity structure are provided. The encapsulating adhesive is applied to the upper substrate to form an encapsulating adhesive layer. The encapsulating adhesive layer is subjected to a first curing treatment so that the Young's modulus of the encapsulating adhesive layer is 0.1MPa~500MPa. Under vacuum conditions, the upper substrate and the lower substrate are aligned and pressed together, so that the microcavity wall of the lower substrate is embedded in the encapsulation adhesive layer; The encapsulating adhesive layer is subjected to a second curing treatment to make the Young's modulus of the encapsulating adhesive layer greater than 1 GPa, thus completing the electronic paper encapsulation.

[0006] As can be seen from the above technical solution, the electronic paper encapsulation method provided by the first aspect of the present invention controls the Young's modulus of the encapsulation adhesive layer to 0.1MPa~500MPa through a first curing process, so that the encapsulation adhesive layer achieves preliminary film formation, loses liquid fluidity but retains plasticity, and then increases the Young's modulus of the encapsulation adhesive layer to greater than 1GPa through a second curing process, so that the microcavity wall is fully embedded in the encapsulation adhesive layer and achieves complete adhesion, thereby blocking electronic paste crosstalk between adjacent microcavity structures and improving the display effect of electronic paper.

[0007] A second aspect of the present invention provides an electronic paper packaged using the packaging method of the above embodiments.

[0008] As can be seen from the above technical solution, the electronic paper provided by the second aspect of the present invention is obtained by encapsulation using the above encapsulation method. Its microcavity wall and encapsulation adhesive layer are tightly bonded and the interface is seamless, which can block crosstalk of electronic paste between adjacent microcavity structures and improve the display effect of electronic paper. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a flowchart illustrating the electronic paper packaging method provided in an embodiment of the present invention. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0012] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0013] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0014] It should also be understood that the term “and / or” as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0015] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0016] In a first aspect, embodiments of the present invention provide a method for packaging electronic paper, such as... Figure 1 As shown, the electronic paper packaging method specifically includes steps S101 to S104.

[0017] Step S101: Weigh 10-90 parts by weight of the first resin, 1-20 parts by weight of the second resin, 1-90 parts by weight of the solvent, 0.1-20 parts by weight of the photoinitiator, 1-10 parts by weight of the leveling agent, 1-10 parts by weight of the high dielectric additive, and 0.1-5 parts by weight of the dispersant, and mix them to obtain the encapsulating adhesive.

[0018] The first resin provides the basic properties of the encapsulant, exhibiting good adhesion, weather resistance, and stability. The second resin compensates for some deficiencies of the first resin, such as flexibility and plasticity. The solvent adjusts the viscosity and evaporation rate of the system, facilitating control of the thickness and surface smoothness of the encapsulant layer during coating. The photoinitiator adjusts the curing rate and degree of curing. The leveling agent improves the wetting and leveling of the encapsulant, enhancing the smoothness of the encapsulant layer. The high-dielectric additive adjusts the dielectric constant of the encapsulant, improving its insulation strength. The dispersant reduces the viscosity of the system and acts as a dispersant and wetter, ensuring uniform dispersion of all components.

[0019] In encapsulating adhesives, the content of each component affects their performance. Specifically, if the content of the first resin is too high, the encapsulating adhesive system will be too rigid and lack flexibility; if the content is too low, it will not provide sufficient adhesion and stability, resulting in incomplete adhesion between the encapsulating adhesive layer and the microcavity wall. If the content of the second resin is too high, the overall strength of the encapsulating adhesive system will decrease, and the robustness of the encapsulation structure will be insufficient; if the content is too low, it will not effectively compensate for the deficiencies in flexibility and plasticity of the first resin. If the solvent content is too high, the evaporation time after coating will be too long, and residual solvent will affect the curing and crosslinking efficiency of the encapsulating adhesive; if the content is too low, the viscosity of the encapsulating adhesive system will be too high, making it difficult to form an encapsulating adhesive layer of uniform thickness. If the photoinitiator content is too high, it will accelerate the curing reaction rate, resulting in an overly vigorous reaction in the first curing stage, making it prone to uneven curing and stress concentration in the encapsulating adhesive layer; if the content is too low, the curing reaction rate will be too slow, the expected preliminary film formation effect in the first curing stage will not be achieved, and the target crosslinking density in the second curing stage will also be difficult to achieve, resulting in insufficient strength and stability of the encapsulating adhesive layer. If the leveling agent content is too high, it will lead to excessively low surface tension of the encapsulant, making it prone to defects such as edge shrinkage and fisheyes during coating. If the content is too low, it cannot effectively improve the wetting and leveling of the encapsulant, and defects such as brush marks and orange peel are likely to appear on the film surface. If the high-dielectric additive content is too high, it will make the dielectric constant of the encapsulant too large, which may interfere with the electric field distribution inside the electronic paper and affect display performance. If the content is too low, it cannot effectively improve the insulation strength of the encapsulant, making it difficult to block electric field interference between microcavities and posing a risk of crosstalk in the electronic paste. If the dispersant content is too high, it will remain in the system after the encapsulant cures, reducing the crosslinking density and mechanical strength of the encapsulant layer. If the content is too low, it cannot effectively reduce the viscosity of the system, and the functional components are prone to agglomeration, resulting in uneven encapsulant performance.

[0020] For example, in the encapsulating adhesive, the weight parts of the first resin can be any typical but non-limiting value or a range between any two values, such as 10, 12, 13, 20, 28, 30, 33, 40, 47, 50, 51, 60, 65, 76, 88, 90. The weight parts of the first resin can be any typical but non-limiting value or a range between any two values, such as 1, 2, 5, 8, 10, 11, 15, 17, 20. The weight parts of the solvent can be any typical but non-limiting value or a range between any two values, such as 1, 2, 3, 7, 10, 11, 15, 23, 26, 30, 35, 40, 45, 50, 58, 62, 66, 70, 85, 90. Photoinitiator... The weight parts of the agent can be any typical but non-limiting value such as 0.1, 0.5, 1, 3, 7, 10, 11, 14, 17, 20, or any range between any two values. The weight parts of the leveling agent can be any typical but non-limiting value such as 1, 2, 4, 5, 8, 9, 10, or any range between any two values. The weight parts of the high dielectric additive can be any typical but non-limiting value such as 1, 2, 4, 5, 8, 9, 10, or any range between any two values. The weight parts of the dispersant can be any typical but non-limiting value such as 0.1, 0.3, 0.5, 1, 1.2, 1.7, 2, 2.8, 3, 3.2, 3.8, 4, 4.5, 5, or any range between any two values.

[0021] In some embodiments, the first resin is selected from one or more of epoxy acrylate resin, polyurethane acrylate resin, and phenolic resin. Epoxy acrylate resin provides high crosslinking density and excellent adhesion, polyurethane acrylate resin provides good flexibility and toughness, and phenolic resin has high hardness, high thermal stability, and good dimensional stability.

[0022] In some embodiments, the second resin is selected from one or more of polyethylene glycol acrylate and polypropylene glycol acrylate. Both polyethylene glycol acrylate and polypropylene glycol acrylate contain flexible ether chains, which can provide good flexibility and plasticity.

[0023] In some embodiments, the mass ratio of the first resin to the second resin is (2~15):1, achieving a good balance between hardness and plasticity. If the mass ratio is greater than 15:1, the hardness of the cured encapsulating layer will be too high and the plasticity insufficient; if the mass ratio is less than 2:1, the crosslinking density of the encapsulating system will be insufficient, and although the plasticity is good, the final Young's modulus will be difficult to reach the requirement of greater than 1 GPa. For example, the mass ratio of the first resin to the second resin can be any typical but non-limiting value or a range between any two values, such as 2:1, 3.1:1, 4.2:1, 4.5:1, 4.7:1, 5.5:1, 6:1, 7.3:1, 8:1, 9.6:1, 10:1, 12:1, 15:1.

[0024] In some embodiments, the viscosity of the first resin at 25 °C is greater than 2000 cps to ensure that the encapsulating adhesive has suitable adhesion. If the viscosity at 25 °C is less than 2000 cps, the encapsulating adhesive may be too thin, and sagging or localized leakage may easily occur after application.

[0025] In some embodiments, the dielectric constant of the first resin is greater than 4 at 100 kHz to ensure that the cured encapsulating layer has sufficient energy storage capacity. If the dielectric constant is less than 4, the energy storage capacity of the encapsulating layer is insufficient, leading to increased energy consumption for electronic paper operation.

[0026] In some embodiments, a viscosity of the second resin greater than 1000 cps at 25 °C helps maintain the stability of the encapsulant system and prevents sedimentation or delamination of the components before storage and coating. If the viscosity at 25 °C is less than 1000 cps, it may lead to decreased system stability and affect the uniformity of the encapsulant layer.

[0027] In some embodiments, the functionality of the second resin is greater than 4, which helps to form a tighter cross-linked network and improves the curing strength of the encapsulating adhesive layer. If the functionality is less than 4, the reactivity is insufficient, resulting in a low cross-linking density and affecting the performance of the encapsulating adhesive layer after curing.

[0028] In some embodiments, the second resin has a dielectric constant greater than 4 at 100 kHz to ensure synergy with the first resin and other components, enabling the final cured encapsulating layer to meet the required dielectric properties. If the dielectric constant is less than 4, the dielectric properties of the encapsulating layer may fail to meet the requirements.

[0029] In some embodiments, the solvent is selected from one or more of propylene glycol methyl ether acetate and ethyl acetate. These solvents used in the embodiments of the present invention have good solubility and compatibility with the first resin, the second resin, and other components, ensuring uniform dispersion of each component and avoiding coating defects caused by component agglomeration.

[0030] In some embodiments, the photoinitiator is selected from one or more of trimethylbenzoyl-diphenylphosphine oxide and 2-hydroxy-2-methyl-1-phenyl-1-propanone. Trimethylbenzoyl-diphenylphosphine oxide is a cleavage-type free radical photoinitiator with a fast initiation rate, which can quickly generate free radicals even at low light intensities; 2-hydroxy-2-methyl-1-phenyl-1-propanone is a hydrogen abstraction-type free radical photoinitiator with a controllable initiation rate, which is beneficial for achieving uniform and deep thorough crosslinking in the second curing stage.

[0031] In some embodiments, the leveling agent is selected from one or more of BYK-370 and BYK-377. These leveling agents used in the embodiments of the present invention can reduce the surface tension of the encapsulant system, improve the wetting and leveling of the encapsulant, thereby promoting the formation of a high-quality encapsulant layer with uniform thickness, smooth surface, and no defects such as pinholes or orange peel during the coating process.

[0032] In some embodiments, the high-dielectric additive is selected from one or more of BYK-3570 and BYK-2205. These high-dielectric additives used in the embodiments of the present invention can increase the overall dielectric constant of the encapsulant after curing and enhance its insulating strength, thereby optimizing the encapsulant layer's ability to modulate the electric field.

[0033] In some embodiments, the dispersant is selected from one or more of nano-zirconia, ionic liquid, and nano-silica. Nano-zirconia and nano-silica can adsorb onto the surface of each solid component, significantly reducing particle agglomeration through electrostatic steric hindrance; ionic liquid can uniformly coat the surface of each solid component, reducing particle agglomeration through steric hindrance.

[0034] Step S102: Provide an upper substrate and a lower substrate with a microcavity structure, apply encapsulating adhesive to the upper substrate to form an encapsulating adhesive layer, and perform a first curing treatment on the encapsulating adhesive layer to make the Young's modulus of the encapsulating adhesive layer 0.1 MPa~500 MPa.

[0035] The upper substrate is a light-transmitting and conductive substrate, such as transparent ITO glass or ITO-coated CF glass; the lower substrate has a microcavity structure, such as a microcup array, which is filled with electronic paste.

[0036] Through the first curing process, the Young's modulus of the encapsulating adhesive layer is controlled within the range of 0.1 MPa to 500 MPa, allowing the encapsulating adhesive layer to achieve initial film formation, losing its liquid fluidity while maintaining its plasticity. If the Young's modulus is greater than 500 MPa, the encapsulating adhesive layer is too hard, making it difficult for the microcavity walls of the underlying substrate to embed within the encapsulating adhesive layer, leading to encapsulation defects. If the Young's modulus is less than 0.1 MPa, the encapsulating adhesive layer is too soft and still has fluidity, which increases the risk of the encapsulating adhesive entering the electronic paste. For example, the Young's modulus can be any typical but non-limiting value or a range between any two values, such as 0.1 MPa, 3 MPa, 8 MPa, 15 MPa, 20 MPa, 30 MPa, 50 MPa, 80 MPa, 110 MPa, 200 MPa, 350 MPa, 440 MPa, and 500 MPa.

[0037] In some embodiments, the coating thickness is 1 μm to 30 μm to ensure sufficient adhesive after lamination to fully embed the microcavity walls of the lower substrate and form a reliable package. If the coating thickness is greater than 30 μm, while a seal can be ensured, it will increase the thickness of the final product, increasing material costs. If the coating thickness is less than 1 μm, the adhesive layer may be too thin, making it difficult to completely encapsulate the microcavity walls after lamination and form a continuous, defect-free sealing interface, posing a risk of insufficient package strength. For example, the coating thickness can be any typical but non-limiting value, or a range between any two values, such as 1 μm, 3 μm, 5 μm, 10 μm, 13 μm, 14 μm, 17 μm, 20 μm, 21 μm, 25 μm, 28 μm, and 30 μm.

[0038] In some embodiments, the first curing process involves baking at 60°C to 80°C for 0.5 h to 3 h to control the Young's modulus of the encapsulating adhesive layer within the range of 0.1 MPa to 500 MPa through a mild curing reaction. Under these conditions, the encapsulating adhesive exhibits low volatility, with a weight loss of less than 3%. If the baking temperature exceeds 80°C or the baking time exceeds 3 h, the encapsulating adhesive layer may harden and lose its plasticity; if the baking time is less than 60°C or less than 0.5 h, the reaction is insufficient, and the encapsulating adhesive layer is difficult to set. For example, the baking temperature can be any typical but non-limiting value such as 60 ℃, 63 ℃, 66 ℃, 70 ℃, 75 ℃, 78 ℃, 80 ℃, or any range between any two values; the baking time can be any typical but non-limiting value such as 0.5 h, 0.7 h, 1 h, 1.4 h, 1.7 h, 2 h, 2.5 h, 2.9 h, 3 h, or any range between any two values.

[0039] Step S103: Under vacuum conditions, align and press the upper substrate and the lower substrate together so that the microcavity wall of the lower substrate is embedded in the encapsulation adhesive layer.

[0040] By utilizing the plasticity retained by the first cured encapsulating adhesive layer, the upper substrate and the lower substrate are aligned and pressed together under vacuum conditions, so that the microcavity wall of the lower substrate is embedded in the encapsulating adhesive layer, and the microcavity wall and the encapsulating adhesive layer are completely bonded.

[0041] In some embodiments, a vacuum level of 800 MPa to 1500 MPa can effectively eliminate air between the upper substrate encapsulation layer and the lower substrate microcavity structure interface, preventing poor adhesion due to residual gas. If the vacuum level is greater than 1500 MPa, the system requirements are high, energy consumption is high, and excessive pressure may cause unnecessary deformation of the substrate; if the vacuum level is less than 800 MPa, insufficient air removal can easily form bubbles or voids at the encapsulation interface, affecting the hermeticity and bonding strength of the encapsulation. For example, the vacuum level can be any typical but non-limiting value such as 800 MPa, 850 MPa, 900 MPa, 930 MPa, 1000 MPa, 1100 MPa, 1200 MPa, 1400 MPa, 1500 MPa, or any range between any two values.

[0042] In some embodiments, the bonding depth is 1 μm to 20 μm to ensure that the encapsulating adhesive can completely fill and seal the gaps between adjacent microcavity structures, thereby preventing crosstalk between the internal electronic pastes. If the bonding depth is greater than 20 μm, the adhesive layer may be over-compressed, resulting in uneven thickness or even local cracking, thus disrupting the continuity of the seal. If the bonding depth is less than 1 μm, the microcavity walls are embedded too shallowly, resulting in insufficient interfacial bonding between the microcavity walls and the encapsulating adhesive layer, affecting the reliability of the encapsulation. For example, the bonding depth can be any typical but non-limiting value such as 1 μm, 2 μm, 3 μm, 5 μm, 8 μm, 10 μm, 14 μm, 16 μm, 19 μm, 20 μm, or any range between any two values.

[0043] Step S104: Perform a second curing treatment on the encapsulating adhesive layer to make the Young's modulus of the encapsulating adhesive layer greater than 1 GPa, thus completing the electronic paper encapsulation.

[0044] The second curing process increases the Young's modulus of the encapsulating adhesive layer to greater than 1 GPa, ensuring a thorough and secure bond between the microcavity walls and the encapsulating adhesive layer. If the Young's modulus is less than 1 GPa, the cross-linking and curing are insufficient, resulting in a softer overall encapsulating adhesive layer that compromises the long-term reliability of the encapsulation structure. For example, the Young's modulus can be any typical but non-limiting value, such as 1 GPa, 1.3 GPa, 1.6 GPa, 2 GPa, 3 GPa, 6 GPa, or 10 GPa, or a range between any two values.

[0045] In some embodiments, the second curing process employs an LED curing lamp with a curing energy of 10 mJ / cm². 2 ~800 mJ / cm 2 This ensures a complete curing reaction, thereby increasing the Young's modulus of the encapsulating adhesive layer to greater than 1 GPa. If the curing energy is greater than 800 mJ / cm², this will be necessary. 2 This may lead to over-curing of the encapsulating adhesive layer, increasing its brittleness; if the curing energy is less than 10 mJ / cm 2 If the curing reaction is insufficient, the Young's modulus of the final encapsulated adhesive layer will not reach above 1 GPa. For example, the curing energy could be 10 mJ / cm². 2 50 mJ / cm 2 90 mJ / cm 2 110 mJ / cm 2 160 mJ / cm 2 200 mJ / cm 2 230 mJ / cm 2 300mJ / cm 2 350 mJ / cm 2 400 mJ / cm 2 500 mJ / cm 2 600 mJ / cm 2 650 mJ / cm 2 700 mJ / cm 2 800mJ / cm 2 Typical but not restrictive arbitrary values ​​or intervals between any two values.

[0046] In some embodiments, the ratio of the Young's modulus of the first curing treatment to that of the second curing treatment is (0.01~0.1):1, which gives the encapsulating adhesive layer suitable for embedding into the microcavity wall after the first curing treatment, and ensures a firm fit with the microcavity wall after the second curing treatment. If the mass ratio is greater than 0.1:1, the encapsulating adhesive layer lacks sufficient plasticity during pressing, making it difficult to embed into the microcavity wall, and the internal stress is relatively large, which can easily lead to poor adhesion; if the mass ratio is less than 0.01:1, the encapsulating adhesive layer is too soft, and when the microcavity wall is embedded into the encapsulating adhesive layer, it is easy to cause deformation or displacement of the encapsulating adhesive layer, making it difficult to form a structurally stable and tightly sealed encapsulation interface. For example, the ratio of the Young's modulus of the first curing treatment to the Young's modulus of the second curing treatment can be any typical but non-limiting value such as 0.01:1, 0.015:1, 0.02:1, 0.025:1, 0.03:1, 0.037:1, 0.04:1, 0.046:1, 0.05:1, 0.06:1, 0.072:1, 0.08:1, 0.09:1, 0.1:1, or any interval between any two values.

[0047] The encapsulation method of this invention, through a first curing process, controls the Young's modulus of the encapsulating adhesive layer to be between 0.1 MPa and 500 MPa, enabling the encapsulating adhesive layer to initially form a film, losing its liquid fluidity but retaining its plasticity. Subsequently, through a second curing process, the Young's modulus of the encapsulating adhesive layer is increased to greater than 1 GPa, allowing the microcavity walls to be fully embedded within the encapsulating adhesive layer, achieving complete adhesion. This effectively blocks crosstalk between adjacent microcavity structures and improves the display effect of electronic paper. Furthermore, this encapsulation method is simple in process, highly efficient in production, convenient in maintenance and updates, and low in cost, meeting the requirements of electronic paper encapsulation.

[0048] Secondly, embodiments of the present invention provide an electronic paper, which is an electronic paper packaged using the packaging method described in the above embodiments.

[0049] The microcavity walls of this electronic paper are tightly bonded to the encapsulation adhesive layer with a seamless interface, which can effectively block crosstalk of electronic paste between adjacent microcavity structures, thereby improving the display effect of the electronic paper.

[0050] To enable those skilled in the art to clearly understand the above-described implementation details and operations of the present invention, and to demonstrate the significant advancements in the electronic paper packaging method and performance of the electronic paper in the embodiments of the present invention, the above technical solutions are illustrated below through multiple embodiments.

[0051] Example 1 Please see Figure 1First, weigh 47 parts by weight of epoxy acrylate resin, 10 parts by weight of polyethylene glycol acrylate, 40 parts by weight of propylene glycol methyl ether acetate, 1 part by weight of trimethylbenzoyl-diphenylphosphine oxide, 1 part by weight of BYK-370, 1 part by weight of BYK-3570, and 1 part by weight of nano-zirconia and mix them to obtain the encapsulating adhesive. Secondly, an upper substrate and a lower substrate with a microcavity structure are provided. Encapsulating adhesive is applied to the upper substrate with a coating thickness of 20 μm to form an encapsulating adhesive layer. The encapsulating adhesive layer is subjected to a first curing treatment, namely baking at 80 ℃ for 0.5 h, so that the Young's modulus of the encapsulating adhesive layer reaches 50 MPa. Next, under a vacuum of 800 MPa, the upper substrate and the lower substrate are aligned and pressed together to a depth of 5 μm, so that the microcavity wall of the lower substrate is embedded in the encapsulation adhesive layer. Finally, the encapsulating adhesive layer undergoes a second curing process, which is performed using an LED curing lamp at a curing energy of 500 mJ / cm². 2 Irradiation under certain conditions can achieve a Young's modulus of 2 GPa for the encapsulation adhesive layer, thus completing the electronic paper encapsulation and blocking crosstalk of electronic paste between adjacent microcavity structures.

[0052] Example 2 Please see Figure 1 First, 90 parts by weight of polyurethane acrylate resin, 20 parts by weight of polypropylene glycol acrylate, 90 parts by weight of propylene glycol methyl ether acetate, 20 parts by weight of trimethylbenzoyl-diphenylphosphine oxide, 10 parts by weight of BYK-370, 10 parts by weight of BYK-3570, and 5 parts by weight of nano-zirconia are weighed and mixed to obtain an encapsulating adhesive. The viscosity of polyurethane acrylate resin at 25 ℃ is 3500 cps, and the viscosity of polypropylene glycol acrylate at 25 ℃ is 2000 cps. Secondly, an upper substrate and a lower substrate with a microcavity structure are provided. Encapsulating adhesive is applied to the upper substrate with a coating thickness of 30 μm to form an encapsulating adhesive layer. The encapsulating adhesive layer is subjected to a first curing treatment, namely baking at 80 ℃ for 2 h, so that the Young's modulus of the encapsulating adhesive layer reaches 110 MPa. Next, under a vacuum of 1000 MPa, the upper substrate and the lower substrate are aligned and pressed together to a depth of 10 μm, so that the microcavity wall of the lower substrate is embedded in the encapsulation adhesive layer. Finally, the encapsulating adhesive layer undergoes a second curing process, which is performed using an LED curing lamp at a curing energy of 800 mJ / cm². 2 Irradiation under certain conditions can achieve a Young's modulus of 3 GPa for the encapsulation adhesive layer, thus completing the electronic paper encapsulation and blocking crosstalk of electronic paste between adjacent microcavity structures.

[0053] Example 3 Please see Figure 1 First, weigh 10 parts by weight of phenolic resin, 1 part by weight of polyethylene glycol acrylate, 0.1 parts by weight of ethyl acetate, 1 part by weight of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1 part by weight of BYK-377, 1 part by weight of BYK-2205, and 0.1 parts by weight of ionic liquid, and mix and stir to obtain an encapsulating adhesive. The phenolic resin has a viscosity of 3500 cps at 25 ℃ and a dielectric constant of 5 at 100 kHz. The polyethylene glycol acrylate has a viscosity of 2000 cps at 25 ℃ and a dielectric constant of 5 at 100 kHz. Secondly, an upper substrate and a lower substrate with a microcavity structure are provided. Encapsulating adhesive is applied to the upper substrate with a coating thickness of 10 μm to form an encapsulating adhesive layer. The encapsulating adhesive layer is subjected to a first curing treatment, namely baking at 60 °C for 0.5 h, so that the Young's modulus of the encapsulating adhesive layer reaches 20 MPa. Next, under a vacuum of 800 MPa, the upper substrate and the lower substrate are aligned and pressed together to a depth of 2 μm, so that the microcavity wall of the lower substrate is embedded in the encapsulation adhesive layer. Finally, the encapsulating adhesive layer undergoes a second curing process, which is performed using an LED curing lamp at a curing energy of 300 mJ / cm². 2 Irradiation under certain conditions can achieve a Young's modulus of 1.3 GPa for the encapsulation adhesive layer, thus completing the electronic paper encapsulation and blocking crosstalk of electronic paste between adjacent microcavity structures.

[0054] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for packaging electronic paper, characterized in that, Includes the following steps: Weigh 10-90 parts by weight of the first resin, 1-20 parts by weight of the second resin, 1-90 parts by weight of the solvent, 0.1-20 parts by weight of the photoinitiator, 1-10 parts by weight of the leveling agent, 1-10 parts by weight of the high dielectric additive, and 0.1-5 parts by weight of the dispersant, and mix them to obtain the encapsulating adhesive. An upper substrate and a lower substrate with a microcavity structure are provided. The encapsulating adhesive is applied to the upper substrate to form an encapsulating adhesive layer. The encapsulating adhesive layer is subjected to a first curing treatment so that the Young's modulus of the encapsulating adhesive layer is 0.1 MPa to 500 MPa. Under vacuum conditions, the upper substrate and the lower substrate are aligned and pressed together, so that the microcavity wall of the lower substrate is embedded in the encapsulation adhesive layer; The encapsulating adhesive layer is subjected to a second curing treatment to make the Young's modulus of the encapsulating adhesive layer greater than 1 GPa, thus completing the electronic paper encapsulation.

2. The electronic paper packaging method according to claim 1, characterized in that, The mass ratio of the first resin to the second resin is (2~15):

1.

3. The electronic paper packaging method according to claim 1, characterized in that, The ratio of the Young's modulus of the first curing treatment to the Young's modulus of the second curing treatment is (0.01~0.1):

1.

4. The electronic paper packaging method according to claim 1, characterized in that, The viscosity of the first resin at 25 °C is greater than 2000 cps; And / or, the dielectric constant of the first resin is greater than 4 at 100 kHz.

5. The electronic paper packaging method according to claim 1, characterized in that, The viscosity of the second resin at 25 °C is greater than 1000 cps; And / or, the functionality of the second resin is greater than 4; And / or, the dielectric constant of the second resin is greater than 4 at 100 kHz.

6. The electronic paper packaging method according to claim 1, characterized in that, The first resin is selected from one or more of epoxy acrylate resin, polyurethane acrylate resin, and phenolic resin.

7. The electronic paper packaging method according to claim 1, characterized in that, The second resin is selected from one or more of polyethylene glycol acrylate and polypropylene glycol acrylate.

8. The electronic paper packaging method according to claim 1, characterized in that, The solvent is selected from one or more of propylene glycol methyl ether acetate and ethyl acetate; And / or, the photoinitiator is selected from one or more of trimethylbenzoyl-diphenylphosphine oxide and 2-hydroxy-2-methyl-1-phenyl-1-propanone; And / or, the leveling agent is selected from one or more of BYK-370 and BYK-377; And / or, the high dielectric additive is selected from one or more of BYK-3570 and BYK-2205; And / or, the dispersant is selected from one or more of nano-zirconia, ionic liquid, and nano-silica.

9. The electronic paper packaging method according to claim 1, characterized in that, The coating thickness is 1 μm to 30 μm; And / or, the first curing treatment is baking at 60 ℃ to 80 ℃ for 0.5 h to 3 h; And / or, the vacuum degree is 800 MPa~1500 MPa; And / or, the pressing depth is 1 μm to 20 μm; And / or, the second curing process uses an LED curing lamp with a curing energy of 10 mJ / cm². 2 ~800 mJ / cm 2 .

10. An electronic paper, characterized in that, Electronic paper packaged using the packaging method of electronic paper as described in any one of claims 1 to 9.

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