Display device and electronic device

Abstract

The invention discloses an electronic device and a display device. The electronic device includes: a display module; and a window on the display module. The window includes: a window base on the display module, and the window base includes: a folded portion having a groove in one surface of the window base; and a first non-folded portion and a second non-folded portion spaced apart from each other with the folded portion between the first non-folded portion and the second non-folded portion; and a resin layer on one surface of the window base, and the resin layer includes: a first resin portion on the folded portion to fill the groove; and a second resin portion on the first non-folded portion and the second non-folded portion.

Description

Cross-reference to related applications

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0124067, filed on September 11, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] An aspect of the embodiments of this disclosure relates to an electronic device and a display device that may include a window. Background Technology

[0003] Electronic devices include display devices comprising a display area activated in response to electrical signals. The display device senses input applied to it from the outside through the display area and displays images thereto to provide information to the user. Recently, display devices with various shapes are being developed, and research on foldable display devices is actively underway.

[0004] The information disclosed in this background section is intended to enhance the understanding of the background of this disclosure and may therefore contain information that does not constitute prior art. Summary of the Invention

[0005] To improve the impact resistance of ultra-thin glass (UTG) with foldable properties, while preventing the display module and the ultra-thin glass from separating from each other during folding operations, the physical properties of the resin layer placed on one surface of the ultra-thin glass can be adjusted.

[0006] Embodiments of this disclosure may relate to electronic devices and display devices that include a window having foldable properties and improved reliability. For example, in some embodiments, the window may include a foldable window base and a resin layer disposed on one surface of the foldable window base.

[0007] According to one or more embodiments of this disclosure, an electronic device includes: a display module; and a window on the display module, the window including: a window substrate on the display module, and the window substrate including: a folded portion having a groove in one surface of the window substrate; and a first non-folded portion and a second non-folded portion spaced apart from each other with the folded portion between the first non-folded portion and the second non-folded portion; and a resin layer on one surface of the window substrate, and the resin layer including: a first resin portion on the folded portion to fill the groove; and a second resin portion on the first non-folded portion and the second non-folded portion. The resin layer has a Young's modulus equal to or greater than about 60 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, a Young's modulus equal to or greater than about 35 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and a Young's modulus equal to or greater than about 10 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius.

[0008] In one embodiment, the folded portion may include a first surface adjacent to the display module and a second surface opposite to the first surface. A groove may be formed in the first surface.

[0009] In the embodiments, the Young's modulus of the resin layer can be equal to or greater than about 70 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, equal to or greater than about 40 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and equal to or greater than about 20 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius.

[0010] In one embodiment, the folded portion may include a first surface adjacent to the display module and a second surface opposite to the first surface. A groove may be formed in the second surface.

[0011] In an embodiment, the first non-folded portion may include a first non-folded surface; the second non-folded portion may include a second non-folded surface; and the folded portion may include: a flat surface; a first inclined surface connecting the flat surface and the first non-folded surface to each other; and a second inclined surface connecting the flat surface and the second non-folded surface to each other.

[0012] In an embodiment, the first resin portion may contact each of the flat surface, the first inclined surface, and the second inclined surface.

[0013] In an embodiment, the groove may include a flat surface, a first inclined surface, and a second inclined surface.

[0014] In an embodiment, the resin layer may have a refractive index that is equal to or greater than about 1.45 and equal to or less than about 1.54 relative to visible light.

[0015] In an embodiment, the absolute value of the crack strain in the resin layer may be equal to or less than about 10%.

[0016] In an embodiment, the folded portion may have a thickness equal to or greater than about 30 micrometers and equal to or less than about 70 micrometers; the first non-folded portion may have a thickness equal to or greater than about 120 micrometers and equal to or less than about 180 micrometers; and the second non-folded portion may have a thickness equal to or greater than about 120 micrometers and equal to or less than about 180 micrometers.

[0017] In an embodiment, the resin layer may further include a third resin portion that contacts the side surface of the window substrate.

[0018] In this embodiment, the first resin portion, the second resin portion, and the third resin portion may be integral with each other.

[0019] In an embodiment, the first resin portion may have a thickness equal to or greater than about 50 micrometers and equal to or less than about 150 micrometers, and the second resin portion may have a thickness equal to or greater than about 5 micrometers and equal to or less than about 30 micrometers.

[0020] According to one or more embodiments of this disclosure, a display device includes: a lower protective film; a substrate layer on the lower protective film; a display element layer on the substrate layer; and a window, the window including: a window substrate on the display element layer, and the window substrate including: a folded portion having a groove in one surface of the window substrate; and a first non-folded portion and a second non-folded portion spaced apart from each other with the folded portion between the first non-folded portion and the second non-folded portion; and a resin layer on one surface of the window substrate. The resin layer has a Young's modulus equal to or greater than about 60 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, a Young's modulus equal to or greater than about 35 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and a Young's modulus equal to or greater than about 10 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius.

[0021] In an embodiment, the resin layer may include: a first resin portion directly in the groove; and a second resin portion directly on the first non-folded portion and the second non-folded portion.

[0022] In an embodiment, the display device may further include a barrier layer on the lower surface of the lower protective film.

[0023] In an embodiment, the barrier layer may have a thickness equal to or greater than about 20 micrometers and equal to or less than about 40 micrometers.

[0024] In an embodiment, the display device may further include a protective layer on the resin layer.

[0025] In an embodiment, the protective layer may have a thickness equal to or greater than about 30 micrometers and equal to or less than about 60 micrometers.

[0026] In an embodiment, the folded portion may include a first surface adjacent to the display element layer and a second surface opposite to the first surface; a groove may be formed in the first surface; and the Young's modulus of the resin layer may be equal to or greater than about 70 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, equal to or greater than about 40 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and equal to or greater than about 20 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius.

[0027] According to some embodiments of this disclosure, the electronic device and display device may include: a window comprising a window substrate having a groove in one of its surfaces; and a resin layer disposed on one surface of the window substrate. Therefore, impact resistance and buckling resistance during folding can be improved.

[0028] However, this disclosure is not limited to the foregoing aspects and features, and the foregoing and additional aspects and features will be set forth in part in the following detailed description with reference to the accompanying drawings, and in part will be apparent from the drawings or may be learned by practicing one or more of the embodiments given in this disclosure. Attached Figure Description

[0029] The above and other aspects and features of this disclosure will become more clearly understood from the following detailed description of illustrative, non-limiting embodiments with reference to the accompanying drawings, in which:

[0030] Figures 1A to 1C This is a perspective view of a display device according to an embodiment of the present disclosure;

[0031] Figure 2 This is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0032] Figure 3 This is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0033] Figure 4 It is along Figure 2 A cross-sectional view of the display module taken by line I-I';

[0034] Figure 5 It is along Figure 2 A cross-sectional view of the display device taken by line II-II';

[0035] Figure 6 yes Figure 5 Enlarged cross-sectional view of region AA';

[0036] Figure 7 It is according to the embodiments of this disclosure along Figure 2 A cross-sectional view of the display device taken by line II-II';

[0037] Figure 8 It is according to the embodiments of this disclosure along Figure 2 A cross-sectional view of the display device taken by line II-II'; and

[0038] Figure 9 It is according to the embodiments of this disclosure along Figure 3 The cross-sectional view of the display device taken by line III-III'. Detailed Implementation

[0039] In the following description, embodiments will be illustrated in more detail with reference to the accompanying drawings, in which the same reference numerals refer to the same elements throughout. However, this disclosure may be implemented in a variety of different forms and should not be construed as limited to the embodiments shown only herein. Rather, these embodiments are provided as examples so that this disclosure will be thorough and complete and will fully convey to those skilled in the art aspects and features of this disclosure. Therefore, processes, elements, and techniques not essential for a full understanding of the aspects and features of this disclosure by those skilled in the art may not be described. Unless otherwise stated, the same reference numerals refer to the same elements throughout the drawings and written description, and therefore redundant descriptions thereof may not be repeated.

[0040] When a particular embodiment can be implemented differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed simultaneously or substantially simultaneously, or they may be performed in the reverse order of the described sequence.

[0041] Furthermore, as will be understood by those skilled in the art, each suitable feature of the various embodiments of this disclosure may be combined in part or in whole, or combined with one another, and may be technically interlocked and operated in a variety of suitable ways, and each embodiment may be implemented independently or in combination with one another in any suitable manner, unless otherwise stated or implied.

[0042] In the accompanying drawings, for clarity, the relative dimensions, thicknesses, and ratios of elements, layers, and regions may be exaggerated and / or simplified. For ease of interpretation, spatial relative terms such as “below,” “under,” “below,” “below,” “above,” and “above” are used herein to describe the relationship of one element or feature to another element (or feature) or feature (or feature) as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the accompanying drawings, the spatial relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as “below” or “below” or “below” other elements or features will subsequently be oriented “above” said other elements or features. Thus, the example terms “below” and “below” can cover both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0043] Furthermore, it should be anticipated that the shapes shown in the accompanying drawings may vary in practice depending on, for example, tolerances and / or manufacturing techniques. Therefore, the embodiments of this disclosure should not be construed as limited to the specific shapes shown in the drawings, and should be interpreted to account for shape variations that may occur, for example, as a result of manufacturing. Thus, the shapes shown in the drawings may not depict the actual shape of an area of ​​the device, and this disclosure is not limited thereto.

[0044] In the accompanying drawings, the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular or substantially perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0045] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or segments, these elements, components, areas, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, area, layer, or segment from another element, component, area, layer, or segment. Therefore, without departing from the spirit and scope of this disclosure, the first element, first component, first area, first layer, or first segment described below may be referred to as a second element, second component, second area, second layer, or second segment.

[0046] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or one or more intermediary elements or layers may exist. Similarly, when a layer, region, or element is referred to as being "electrically connected" to another layer, region, or element, the layer, region, or element may be directly electrically connected to the other layer, region, or element, and / or may be indirectly electrically connected to one or more intermediary layers, regions, or elements between the layer, region, or element and the other layer, region, or element. Furthermore, it will be understood that when an element or layer is referred to as being "between" two elements or layers, the element or layer may be the only element or layer between the two elements or layers, or one or more intermediary elements or layers may exist.

[0047] The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are also intended to include the plural forms. It will also be understood that when the terms “comprises,” “includes,” and “has, have, having” are used in this specification, they indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. For example, the expression “A and / or B” means A, B, or A and B. Expressions such as “at least one of…” modify the entire list of elements when preceding / following the list of elements and do not modify individual elements in the list. For example, the expressions “at least one of a, b and c” and “at least one of the groups consisting of a, b and c” indicate only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or variations thereof.

[0048] As used herein, the terms “substantially,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree and are intended to describe inherent biases in measurements or calculations that will be recognized by those skilled in the art. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.” As used herein, the terms “use,” “using,” and “used” can be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.

[0049] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that, unless expressly defined herein, terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and / or in this specification, and shall not be interpreted in an idealized or overly formal sense.

[0050] Figures 1A to 1C This is a perspective view of a display device ED according to an embodiment of the present disclosure. Figure 1A The unfolded state of the display device ED is shown, and Figure 1B and Figure 1C Each device (ED) is shown in its folded state.

[0051] Figures 1A to 1C A foldable display device as a display device ED is shown; however, this disclosure is not limited thereto or thereby. The display device ED can be a flexible display device that is bendable or rollable.

[0052] The display device ED may include a display surface FS defined by a first direction DR1 and a second direction DR2 intersecting or crossing the first direction DR1. The display device ED can provide an image IM to a user through the display surface FS. The display device ED can display an image toward a third direction DR3 through the display surface FS, which is parallel or substantially parallel to each of the first direction DR1 and the second direction DR2.

[0053] The display surface FS of the display device ED may include an active region F-AA and a peripheral region F-NAA. The active region F-AA of the display device ED can be activated in response to an electrical signal. The display device ED can display an image IM through the active region F-AA. In addition, various suitable external inputs can be sensed through the active region F-AA. The peripheral region F-NAA may be defined to be adjacent to the active region F-AA. The peripheral region F-NAA may have a suitable color (e.g., a predetermined color). The peripheral region F-NAA may surround the active region F-AA (e.g., around the periphery of the active region F-AA). Therefore, the active region F-AA may have a shape defined or substantially defined by the peripheral region F-NAA; however, this disclosure is not limited thereto. The peripheral region F-NAA may be defined to be adjacent to one side (e.g., only one side) of the active region F-AA, or may be omitted as needed or desired. According to embodiments, the display device ED may include active regions having various suitable shapes, and there are no particular limitations.

[0054] The active area F-AA may include a sensing area EMA. Various suitable electronic modules (e.g., electronic devices or sensors) may be disposed in the sensing area EMA. As an example, the electronic module may include at least one of a camera module (e.g., a camera), a speaker, an optical sensor, and a thermal sensor. External objects can be sensed by the sensing area EMA of the display surface FS, and / or sound signals such as speech can be provided to the outside by the sensing area EMA of the display surface FS. The electronic module may include a number of suitable components, and there are no particular limitations.

[0055] The sensing area EMA may be surrounded by an active area F-AA and a peripheral area F-NAA (e.g., the periphery of the sensing area EMA is surrounded by an active area F-AA and a peripheral area F-NAA), however, it is not limited thereto or thereby restricted. The sensing area EMA may be defined within the active area F-AA, but is not particularly limited thereto. Figure 1A A sensing area EMA is shown as a representative example; however, the number of sensing areas EMA is not limited to this or thus restricted.

[0056] The sensing area EMA can be part of the active area F-AA. Therefore, the display device ED can also display images through the sensing area EMA. When the electronic module disposed in the sensing area EMA is not activated, the sensing area EMA can be used as part of the display surface to display the image IM.

[0057] The display device ED may include a rear surface RS opposite to the display surface FS. The rear surface RS may be an external surface of the display device ED and may display an image IM without passing through the rear surface RS; however, it is not limited to this or thereby restricted. According to embodiments, the rear surface RS may serve as a second display surface through which an image is displayed. Additionally, in some embodiments, the display device ED may also include a sensing area defined in the rear surface RS. A camera, speaker, and / or optical sensor may be disposed within the sensing area defined in the rear surface RS.

[0058] The display device ED may include a folded region FA and non-folded regions NFA1 and NFA2. The display device ED may include multiple non-folded regions NFA1 and NFA2. According to this embodiment, the display device ED may include a first non-folded region NFA1 and a second non-folded region NFA2 configured to be adjacent to each other, with the folded region FA located between the first non-folded region NFA1 and the second non-folded region NFA2. Although Figures 1A to 1C A display device ED including a folded region FA is shown, but this disclosure is not limited thereto. According to an embodiment, the display device ED may include a plurality of folded regions defined in the display device ED. According to an embodiment, the display device ED may be folded relative to a plurality of folding axes such that portions of the display surface FS face each other, and the number of folding axes and the number of non-folded regions are not particularly limited.

[0059] Reference Figure 1B and Figure 1C The display device ED can be folded relative to a folding axis FX1 that extends in one direction. Figure 1B and Figure 1C The folding axis FX1 shown may be an imaginary axis extending in the second direction DR2, parallel or substantially parallel to the direction in which the long side of the display device ED extends. However, the direction in which the folding axis FX1 extends is not limited to the second direction DR2.

[0060] The folding axis FX1 can extend on the display surface FS in the second direction DR2, or it can extend below the rear surface RS in the second direction DR2. (See reference...) Figure 1B The display device ED can be folded inward (e.g., inward folding) so that the first non-folded region NFA1 and the second non-folded region NFA2 face each other, and therefore, the display surface FS can be kept from being exposed to the outside. Additionally, refer to... Figure 1C The display device ED can be folded outward relative to the folding axis FX1 (e.g., outward folding), so that the portion of the rear surface RS that overlaps with the first non-folded region NFA1 faces the other portion of the rear surface RS that overlaps with the second non-folded region NFA2.

[0061] The display device ED can repeatedly perform unfolding and inward folding operations, or repeatedly perform unfolding and outward folding operations; however, this disclosure is not limited thereto or thereby restricted. According to an embodiment, the display device ED can selectively operate in any one of the unfolding, inward folding, and outward folding operations.

[0062] Figures 1A to 1C A display device ED is shown folded relative to a folding axis FX1 that is parallel or substantially parallel to the long side of the display device ED; however, this disclosure is not limited thereto or thereby restrictive. According to an embodiment, the display device ED can be folded relative to a folding axis that is parallel or substantially parallel to the short side of the display device ED.

[0063] Figure 2 This is an exploded perspective view of the display device ED-a according to an embodiment of the present disclosure. Figure 3 This is an exploded perspective view of the display device ED-b according to an embodiment of the present disclosure. Figure 2 and Figure 3 It can be Figure 1A An exploded perspective view of the display device ED shown.

[0064] Reference Figure 2 The display device ED-a may include a display module (e.g., a monitor or touch display) DM and a window WM-a. The display device ED-a may include the display module DM, an upper module (e.g., an upper layer or upper stack) UM-a disposed on the display module DM, and a lower module (e.g., a lower layer or lower stack) LM disposed below the display module DM. The upper module UM-a may be referred to as a protective member, and the lower module LM may be referred to as a supporting member.

[0065] The upper module UM-a, which is set on the display module DM, can be used as a protective component to protect the display module DM from external impacts, or it can be used as an optical component to prevent or substantially prevent the reflection of external light to improve light extraction efficiency.

[0066] The upper module UM-a may include a window WM-a disposed above the display module DM, a protective layer PL disposed above the window WM-a, and a protective adhesive layer AP-PL disposed between the window WM-a and the protective layer PL.

[0067] Window WM-a may cover the entire upper surface of display module DM. Window WM-a may have a suitable shape corresponding to the shape of display module DM. Window WM-a may include window substrate WMB-a and resin layer RSL-a. In display device ED-a, window substrate WMB-a may be disposed above display module DM. Window substrate WMB-a may include an optically transparent insulating material. Window substrate WMB-a may include a glass substrate or a polymer substrate. As an example, window substrate WMB-a may be a tempered glass substrate. According to some embodiments of this disclosure, window substrate WMB-a may have a shape corresponding to the folding region FA (e.g., see reference FA). Figure 1A The folded portion FP corresponds to the non-folded regions NFA1 and NFA2 (e.g., refer to...). Figure 1A The step difference formed between the non-folded portions NFP1 and NFP2 of the display device ED-a enhances its folding characteristics. (See below for further details.) Figure 5 A more detailed description of the shape of the window substrate WMB-a is provided.

[0068] The resin layer RSL-a can be disposed on one surface of the window substrate WMB-a. For example... Figure 2 As shown, the resin layer RSL-a can be disposed on the upper surface of the window substrate WMB-a. The resin layer RSL-a can be directly disposed on the upper surface of the window substrate WMB-a. However, this disclosure is not limited thereto, and as... Figure 3 As shown, resin layer RSL-b can be disposed below window substrate WMB-b. Resin layer RSL-a may include a first resin portion RSP1 corresponding to the folded portion FP and a second resin portion RSP2 corresponding to the non-folded portions NFP1 and NFP2. Resin layer RSL-a may include acrylic resin, epoxy resin, silicone resin, urethane resin, urethane acrylic resin, mixed sol-gel and / or siloxane resin. As an example, resin layer RSL-a may include acrylic resin. Resin layer RSL-a may include protruding portions corresponding to grooves etched in one surface of window substrate WMB-a. Because resin layer RSL-a according to some embodiments of the present disclosure, as described in more detail below, can have a Young's modulus within a suitable range, resin layer RSL-a disposed on one surface of window substrate WMB-a can prevent or substantially prevent buckling when display device ED-a is folded, and therefore, the durability of display device ED-a can be increased. Reference will be made below. Figure 5 A more detailed description of the shape of the resin layer RSL-a is provided.

[0069] The upper module UM-a may further include a window adhesive layer AP-W disposed below the window WM-a. The window adhesive layer AP-W may be disposed between the display module DM and the window WM-a. The window adhesive layer AP-W may be an optically clear adhesive (OCA) film or an optically clear resin (OCR) film. According to embodiments, the window adhesive layer AP-W may be omitted as needed or desired.

[0070] A protective layer PL can be placed above window WM-a and can protect window WM-a from the influence of the external environment. The protective layer PL can be transparent, and therefore, despite the protective layer PL being in place, image information provided from the display module DM can still be observed (e.g., reference). Figure 1A The protective layer PL may be the uppermost exposed surface of the display device ED-a, and depending on the use of the display device ED-a, the protective layer PL may be damaged. The protective layer PL may have a thickness d-PL equal to or greater than about 30 micrometers and equal to or less than about 60 micrometers (e.g., see image IM). Figure 5 As an example, the protective layer PL can have a thickness of approximately 35 micrometers, d-PL.

[0071] The protective layer PL can have optical properties including approximately 90% or higher transmittance in the visible light region and a haze value of less than approximately 1%. The protective layer PL can include a polymer film. Additionally, the protective layer PL can have a polymer film as its base layer and may also include functional layers (such as hard coatings, anti-fingerprint coatings, or antistatic coatings) on the base layer. The protective layer PL used in the display device ED-a can have suitable flexibility.

[0072] The protective layer PL can be a polymer film of at least one polymer resin selected from polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polycarbonate (PC), polymethyl methacrylate (PMMA), polystyrene (PS), polyvinyl chloride (PVC), polyethersulfone (PES), polypropylene (PP), polyamide (PA), modified polyphenylene ether (m-PPO), polyoxymethylene (POM), polysulfone (PSU), polyphenylene sulfide (PPS), polyimide (PI), polyethyleneimine (PEI), polyetheretherketone (PEEK), polyamide-imide (PAI), polyarylate (PAR), and thermoplastic polyurethane (TPU).

[0073] As an example, the protective layer PL can be a polyethylene terephthalate (PET) film or a thermoplastic polyurethane (TPU) film. Alternatively, the protective layer PL can be a PET film without phase retardation.

[0074] According to some embodiments of the display device ED-a, a protective adhesive layer AP-PL may be disposed between the window WM-a and the protective layer PL. The protective adhesive layer AP-PL may be an optically transparent adhesive layer. The protective adhesive layer AP-PL may be attached to the window WM-a to secure the protective layer PL to the window WM-a.

[0075] The display device ED-a according to an embodiment may further include a housing HAU that houses the display module DM and the lower module LM. The housing HAU may be coupled to the window WM-a. The housing HAU may also include a hinge structure for easier folding or bending. The hinge structure may be configured to correspond to the folding area FA.

[0076] The display device ED-a according to an embodiment may further include a housing adhesive layer AP-Ha. The housing adhesive layer AP-Ha can be used to secure the lower module LM to the housing HAU. The housing adhesive layer AP-Ha may include a folded adhesive portion H-LA corresponding to the folded region FA (e.g., see reference 1). Figure 5 ) and the non-folded adhesive portion H-HA corresponding to the non-folded regions NFA1 and NFA2 (e.g., refer to Figure 5 The housing adhesive layer AP-Ha can be an adhesive component to couple the lower module LM to the housing HAU, and can also be used as an electromagnetic shielding layer or a heat dissipation layer.

[0077] The display module (DM) may include a display panel (DP) and an input sensing layer (ISP) disposed on the display panel (DP). (See below for further details.) Figure 4 A more detailed description is provided of the display panel (DP) and the input sensing layer (ISP).

[0078] According to some embodiments of the display device ED-a, the display module DM may include a folded display portion FA-D and non-folded display portions NFA1-D and NFA2-D. The folded display portion FA-D may correspond to the folded area FA (e.g., see reference 1). Figure 1A Furthermore, the non-folding display portions NFA1-D and NFA2-D can correspond to the non-folding regions NFA1 and NFA2.

[0079] The folding display portion FA-D can be relative to the folding axis FX1 (e.g., refer to...). Figure 1B or Figure 1C The display module DM may include a first non-foldable display portion NFA1-D and a second non-foldable display portion NFA2-D, and the first non-foldable display portion NFA1-D and the second non-foldable display portion NFA2-D may be spaced apart from each other, and the foldable display portion FA-D is located between the first non-foldable display portion NFA1-D and the second non-foldable display portion NFA2-D.

[0080] The display device ED-a may also include a module adhesive layer AP-DM disposed between the display module DM and the lower module LM. The module adhesive layer AP-DM may be an optically clear adhesive (OCA) film or an optically clear resin (OCR) film.

[0081] According to some embodiments of the display device ED-a, the lower module LM may include a support plate MP and adhesive layers AP-U1, AP-U2 and AP-D disposed above and below the support plate MP (e.g., see reference). Figure 5 Additionally, the lower module LM may also include at least one of the following: support portions SP1 and SP2, filling portion SAP, lower protective film PF, and barrier layer BR. As an example, the lower module LM may include a support plate MP disposed below the display module DM, a lower protective film PF and a barrier layer BR disposed between the support plate MP and the display module DM, and support portions SP1 and SP2 and filling portion SAP disposed below the support plate MP.

[0082] A support plate MP can be disposed below the display module DM. The support plate MP may include a folding support portion FA-MP and non-folding support portions NFA1-MP and NFA2-MP. Hereinafter, the folding support portion FA-MP may be referred to as the folded portion, and the non-folding support portions NFA1-MP and NFA2-MP may be referred to as the non-folded portions. The first non-folded portion NFA1-MP and the second folded portion NFA2-MP of the support plate MP may be spaced apart from each other, with the folded portion FA-MP situated between the first non-folded portion NFA1-MP and the second folded portion NFA2-MP. The folded portion FA-MP may correspond to the folded region FA, and the non-folded portions NFA1-MP and NFA2-MP may correspond to the non-folded regions NFA1 and NFA2.

[0083] The support plate MP may comprise a metallic or polymeric material. As an example, the support plate MP may comprise stainless steel, aluminum, or a suitable alloy thereof. Additionally, according to embodiments, the support plate MP may comprise carbon fiber reinforced plastic (CFRP); however, this disclosure is not limited thereto. According to embodiments, the support plate MP may comprise a non-metallic material, such as at least one of plastic materials, glass fiber reinforced plastic, and glass materials.

[0084] The support plate MP may be provided with a plurality of openings OP' defined therethrough (e.g., see reference). Figure 5 The opening OP' can be defined as corresponding to the folded region FA.

[0085] The lower protective film PF can be disposed between the display module DM and the support plate MP. The lower protective film PF can be disposed below the display module DM and can protect the rear surface of the display module DM. The lower protective film PF can completely overlap with the display module DM. The lower protective film PF can include a polymer material. As an example, the lower protective film PF can be a polyimide film or a polyethylene terephthalate film; however, the material used for the lower protective film PF is not limited to or restricted by these. The lower protective film PF can have a thickness d1 equal to or greater than about 30 micrometers and equal to or less than about 70 micrometers (e.g., see reference). Figure 5 As an example, the thickness d1 of the lower protective film PF can be approximately 50 micrometers.

[0086] The lower module LM may include support portions SP1 and SP2 and a filling portion SAP. Support portions SP1 and SP2 may largely overlap with the display module DM. The filling portion SAP may be located outside the support portions SP1 and SP2 and may overlap with the outer portion of the display module DM.

[0087] Support portions SP1 and SP2 may include a first sub-support portion SP1 and a second sub-support portion SP2 spaced apart from the first sub-support portion SP1 in a first direction DR1. The first sub-support portion SP1 and the second sub-support portion SP2 may be positioned relative to the folding axis FX1 (e.g., see reference FX1). Figure 1B The support portions SP1 and SP2 are spaced apart from each other in the corresponding areas. Since the support portions SP1 and SP2 are provided as a first sub-support portion SP1 and a second sub-support portion SP2 spaced apart from each other in the folding area FA, the folding or bending characteristics of the display device ED-a can be improved. In some embodiments, the lower module LM may also include a pad layer disposed above or below the support portions SP1 and SP2. The pad layer may be included in the area corresponding to the folding axis FX1 (e.g., refer to...). Figure 1B or Figure 1C Sub-pads spaced apart from each other (e.g., separate) in the corresponding regions. A lower adhesive layer may also be provided between the support portions SP1 and SP2 and the pads, the adhesive layer having lower adhesion in the region corresponding to the folded region FA than in the region corresponding to the unfolded regions NFA1 and NFA2.

[0088] The padding layer prevents or substantially prevents the support plate MP from being pressed and deformed by external impacts and forces. The padding layer may include sponge, foam, or elastomer (such as urethane resin). Alternatively, the padding layer may include at least one of acrylic polymers, urethane polymers, silicone polymers, and imide polymers, but is not limited thereto. According to embodiments, the padding layer may be disposed below the support plate MP or below the lower support plate.

[0089] The filler SAP can be located outside the support portions SP1 and SP2. The filler SAP can be located between the support plate MP and the housing HAU. The filler SAP can fill the space between the support plate MP and the housing HAU and can also secure the support plate MP.

[0090] The display device ED-a may include a barrier layer BR included in the lower module LM. The barrier layer BR may serve as a thickness compensation layer to compensate for thickness differences in components disposed below the display module DM, or it may serve as a support layer to support the display module DM. The barrier layer BR may have a thickness d2 equal to or greater than about 20 micrometers and equal to or less than about 40 micrometers (e.g., see reference). Figure 5 As an example, the thickness d2 of the barrier layer BR can be approximately 25 micrometers. However, this disclosure is not limited thereto, and in embodiments, the barrier layer BR may be omitted as needed or desired.

[0091] The combination of components included in the lower module LM of the display device ED-a is not limited to or restricted by this, and can be modified in various ways depending on the size, shape, or operating characteristics of the display device ED-a. As an example, the lower module LM may also include other components such as additional support plates, padding members, and / or adhesive layers.

[0092] The lower module LM of the display device ED-a may include one or more upper adhesive layers AP-U1 and AP-U2 disposed above the support plate MP (e.g., see reference). Figure 5 ) and at least one lower adhesive layer AP-D disposed below the support plate MP (e.g., refer to Figure 5 ).

[0093] Figure 4 It is along Figure 2 The cross-sectional view of the display module DM is taken by line I-I'.

[0094] Reference Figure 4 The display panel (DP) can have a suitable configuration for essentially generating images. The display panel (DP) can be a light-emitting type of display panel. For example, the display panel (DP) can be an organic light-emitting display panel, an inorganic light-emitting display panel, a micro light-emitting diode (LED) display panel, a micro OLED display panel, or a nano LED display panel.

[0095] The display panel DP can include the display area DP-DA (e.g., refer to...) Figure 2 ) and non-display area DP-NDA. The display area DP-DA can be defined as the area in which the image provided from the display panel DP is displayed.

[0096] The non-display area DP-NDA can be defined as being adjacent to the display area DP-DA. As an example, the non-display area DP-NDA can surround the display area DP-DA (e.g., around the periphery of the display area DP-DA); however, this disclosure is not limited thereto. According to embodiments, the non-display area DP-NDA can have various suitable shapes and is not particularly limited. The display area DP-DA of the display panel DP can be adjacent to the active area F-AA (e.g., referencing...). Figure 1A At least a part of it corresponds to.

[0097] The display panel (DP) may include a substrate layer (BS), a circuit layer (DP-CL), a display element layer (DP-EL), and a packaging layer (TFE) stacked sequentially. Figure 4 In some embodiments with different structures shown, the functional layer may also be disposed between two adjacent layers among the substrate layer BS, circuit layer DP-CL, display element layer DP-EL, and encapsulation layer TFE.

[0098] The substrate layer BS can provide a substrate surface on which the circuit layer DP-CL is disposed. The substrate layer BS can be a flexible substrate that is bendable, foldable, or rollable. The substrate layer BS can be a glass substrate, a metal substrate, or a polymer substrate, however, it is not limited to or restricted by these. According to embodiments, the substrate layer BS can be an inorganic layer, an organic layer, or a composite material layer.

[0099] The matrix layer BS can have a single-layer or multi-layer structure. For example, the matrix layer BS may include a first synthetic resin layer, an inorganic layer having a single-layer or multi-layer structure, and a second synthetic resin layer disposed on the inorganic layer having a single-layer or multi-layer structure. Each of the first and second synthetic resin layers may include a polyimide resin. Additionally, each of the first and second synthetic resin layers may include at least one selected from acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. As used herein, the term "X-type resin" refers to a resin containing the functional group X.

[0100] The circuit layer DP-CL can be disposed on the substrate layer BS. The circuit layer DP-CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. The display element layer DP-EL can be disposed on the circuit layer DP-CL. The display element layer DP-EL may include light-emitting elements. As an example, the light-emitting elements may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0101] A TFE (Transmission Equipment) encapsulation layer can be disposed on the Display Element Layer (DP-EL). The TFE protects the DP-EL from moisture, oxygen, and foreign substances such as dust particles. The TFE may include at least one inorganic layer. As an example, the TFE may include sequentially stacked inorganic, organic, and inorganic layers.

[0102] The input sensing layer ISP can be disposed on the display panel DP. The input sensing layer ISP can be directly disposed on the encapsulation layer TFE; however, this disclosure is not limited thereto. According to an embodiment, an adhesive member can be disposed between the input sensing layer ISP and the display panel DP.

[0103] An input sensing layer (ISP) can sense external input, convert the sensed input into an input signal (e.g., a predetermined input signal), and provide the input signal to a display panel (DP). As an example, an input sensing layer (ISP) can be a touch sensing layer that senses touch events. An input sensing layer (ISP) can sense direct touches from a user, indirect touches from a user, direct touches from an object, or indirect touches from an object.

[0104] An input sensing layer (ISP) can sense at least one of the location and intensity (e.g., pressure) of an externally applied touch event. The ISP can have various suitable structures or may comprise various suitable materials, but is not particularly limited thereto. As an example, the ISP can sense external input capacitively. The display panel (DP) can receive input signals from the ISP and generate an image corresponding to the input signals.

[0105] Figure 5 It is along Figure 2 The cross-sectional view of display device ED-a taken from line II-II'. Figure 6 yes Figure 5 An enlarged cross-sectional view of region AA'. Figure 5 and Figure 6 In the figures, the same reference numerals indicate the same meanings as those above. Figures 1A to 4 The elements described are the same or substantially the same, and therefore, their redundant descriptions need not be repeated.

[0106] Reference Figure 5 and Figure 6 The window substrate WMB-a may include a first surface S1-a adjacent to the display module DM and a second surface S2-a opposite to the first surface S1-a. A recess HM may be etched into one surface of the window substrate WMB-a. For example, in some embodiments, the recess HM may be formed (e.g., etched) in the second surface S2-a of the window substrate WMB-a.

[0107] The window substrate WMB-a may include a first non-folded portion NFP1, a folded portion FP, and a second non-folded portion NFP2. The folded portion FP may have a thickness d3 equal to or greater than about 30 micrometers and equal to or less than about 70 micrometers. As an example, the thickness d3 of the folded portion FP may be about 50 micrometers. The first non-folded portion NFP1 may have a thickness d4 equal to or greater than about 120 micrometers and equal to or less than about 180 micrometers. The second non-folded portion NFP2 may have a thickness d4 equal to or greater than about 120 micrometers and equal to or less than about 180 micrometers. The thickness d4 of the first non-folded portion NFP1 and the second non-folded portion NFP2 may be the same as or substantially the same as each other. As an example, the thickness d4 of each of the first non-folded portion NFP1 and the second non-folded portion NFP2 may be about 150 micrometers. According to some embodiments of the present disclosure, the thickness of each of the folded portion FP and the non-folded portions NFP1 and NFP2 of the window substrate WMB-a can be greater than the thickness of each of the folded portion and non-folded portion of the comparative window substrate, and thus, the impact resistance can be improved.

[0108] The first non-folding portion NFP1 may include a first non-folding surface NFPS1, and the second non-folding portion NFP2 may include a second non-folding surface NFPS2. The folding portion FP may include a flat surface FL, a first inclined surface SL1, and a second inclined surface SL2. The first inclined surface SL1 may connect the first non-folding surface NFPS1 to the flat surface FL. The second inclined surface SL2 may connect the second non-folding surface NFPS2 and the flat surface FL to each other. The groove HM may include, or be defined by, the flat surface FL, the first inclined surface SL1, and the second inclined surface SL2. A first resin portion RSP1 disposed in the groove HM may contact each of the flat surface FL, the first inclined surface SL1, and the second inclined surface SL2.

[0109] The resin layer RSL-a may include a first resin portion RSP1 and a second resin portion RSP2. The first resin portion RSP1 may be disposed in the groove HM. The first resin portion RSP1 may be directly disposed on the folded portion FP. The first resin portion RSP1 may protrude in a direction opposite to the third direction DR3.

[0110] The first resin portion RSP1 may have a thickness d5 defined by the distance from the flat surface FL to the upper surface of the resin layer RSL-a. The thickness d5 of the first resin portion RSP1 may be equal to or greater than about 50 micrometers and equal to or less than about 150 micrometers. As an example, the thickness d5 of the first resin portion RSP1 may be about 120 micrometers. The second resin portion RSP2 may have a thickness d6 equal to or greater than about 5 micrometers and equal to or less than about 30 micrometers. As an example, the thickness d6 of the second resin portion RSP2 may be about 20 micrometers. The sum of the thickness d3 of the folded portion FP and the thickness d5 of the first resin portion RSP1 may be the same as or substantially the same as the sum of the thickness d4 of the unfolded portions NFP1 and NFP2 and the thickness d6 of the second resin portion RSP2.

[0111] The Young's modulus of the resin layer RSL-a can be equal to or greater than about 60 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, equal to or greater than about 35 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and equal to or greater than about 10 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius. As a comparative example, when the Young's modulus of the resin layer RSL-a is less than about 60 MPa at a temperature of about -20 degrees Celsius, the degree of folding of the resin layer RSL-a when the display device ED-a is folded may be greater than the degree of folding of the display module DM, and therefore, buckling may occur. When the Young's modulus of the resin layer RSL-a is greater than about 1000 MPa at a temperature of about -20 degrees Celsius, cracks may occur in the protective layer PL disposed on the resin layer RSL-a.

[0112] The absolute value of the crack strain of resin layer RSL-a can be about 10% or less. The crack strain of resin layer RSL-a can be defined as the value obtained by subtracting the original length of resin layer RSL-a before deformation from the length of resin layer RSL-a when cracking occurs due to the force applied to it, and dividing the subtracted value by the original length of resin layer RSL-a before deformation. Since compressive crack strain can be the crack strain when a compressive force is applied to resin layer RSL-a, the compressive crack strain can be zero (0) or negative, and since tensile crack strain can be the crack strain when a tensile force is applied to resin layer RSL-a, the tensile crack strain can be zero (0) or positive. The compressive crack strain of resin layer RSL-a can be equal to or greater than about -10%. The tensile crack strain of resin layer PSL-a can be equal to or less than about 10%.

[0113] The resin layer RSL-a may have a refractive index equal to or greater than about 1.45 and equal to or less than about 1.54 with respect to visible light. As an example, the refractive index of the resin layer RSL-a may be about 1.50 with respect to visible light. The refractive index of the window substrate WMB-a with respect to visible light may be equal to or greater than about 0.9 times and equal to or less than about 1.1 times the refractive index of the resin layer RSL-a with respect to visible light. The refractive index of the window substrate WMB-a with respect to visible light may be the same as or substantially the same as the refractive index of the resin layer RSL-a with respect to visible light. In the present disclosure, when two components are described as "the same or substantially the same", it means both cases where the two components are physically the same and where the two components are the same in design but have minor differences after processing.

[0114] According to some embodiments of the present disclosure, the display device ED-a may include a window WM-a including the window substrate WMB-a, the window substrate WMB-a being provided with a groove engraved in one surface of the window substrate WMB-a, and the resin layer RSL-a being provided on one surface of the window substrate WMB-a. Accordingly, the folding characteristics of the display device ED-a can be improved, and the buckling phenomenon and cracks generated when the display device ED-a is folded can be reduced.

[0115] Figure 7 is a cross-sectional view of the display device ED-a' taken along the Figure 2 line II-II' according to an embodiment of the present disclosure. Figure 8 is a cross-sectional view of the display device ED-a1 taken along the Figure 2 line II-II' according to an embodiment of the present disclosure. Different from the Figure 5 display device ED-a, Figure 7 the display device ED-a' shown in Figure 5 does not include some components. Different from the Figure 8 resin layer RSL-a of

[0116] Referring to Figure 7 and different from the Figure 5 display device ED-a shown in

[0117] Referring to Figure 8 The upper module (e.g., upper layer or upper stack) UM-a1 of the display device ED-a1 may include a window substrate WMB-a1 and a resin layer RSL-a1. With Figure 5 The window substrate WMB-a shown is different. Figure 8 The window substrate WMB-a1 shown may overlap with a portion of the display module DM (e.g., only a portion of the display module DM). When viewed in a plane (e.g., in a plan view), the dimensions of the first surface S1-a1 and the second surface S2-a1 may be smaller than the dimensions of the display module DM when viewed in a plane. In other words, when viewed in a plane (e.g., in a plan view), the dimensions of the window substrate WMB-a1 may be smaller than the dimensions of the display module DM when viewed in a plane.

[0118] The resin layer RSL-a1 may include a first resin portion RSP1, a second resin portion RSP2, and a third resin portion RSP3. The third resin portion RSP3 may contact the side surface of the window substrate WMB-a1. The first resin portion RSP1, the second resin portion RSP2, and the third resin portion RSP3 may be integrally provided with each other. Figure 5 As shown, resin layer RSL-a1 can have a larger contact area with window substrate WMB-a1 compared to the contact area between resin layer RSL-a and window substrate WMB-a1. Therefore, the adhesion between resin layer RSL-a1 and window substrate WMB-a1 can be increased, and the side surface of window substrate WMB-a1 can be protected from external impacts.

[0119] Figure 9 It is according to the embodiments of this disclosure along Figure 3 The cross-sectional view of display device ED-b taken from line III-III'.

[0120] Reference Figure 9 The upper module (e.g., upper layer or upper stack) UM-b of the display device ED-b may include a window substrate WMB-b and a resin layer RSL-b. Figure 5 The window substrate WMB-a shown is different. Figure 9The window substrate WMB-b shown may include a first surface S1-b adjacent to the display module DM and provided with a groove engraved therein. The groove may not be engraved in a second surface S2-b opposite to the first surface S1-b of the window substrate WMB-b. The resin layer RSL-b may have a Young's modulus equal to or greater than about 70 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, a Young's modulus equal to or greater than about 40 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and a Young's modulus equal to or greater than about 20 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius. As a comparative example, if the Young's modulus of the resin layer RSL-b is less than about 70 MPa at a temperature of about -20 degrees Celsius, when the display device ED-b is folded, the degree of folding of the resin layer RSL-b may be greater than the degree of folding of the display module DM, and therefore, buckling may occur. When the Young's modulus of the resin layer RSL-b is greater than about 1000 MPa at a temperature of about -20 degrees Celsius, cracks may occur in the protective layer PL set on the resin layer RSL-b.

[0121] The physical properties of the resin layer included in a display device according to some embodiments of the present disclosure will be described in more detail below. Furthermore, the embodiments described below are examples provided to aid in understanding some aspects and features of the present disclosure, and therefore, the present disclosure is not limited thereto or thereby.

[0122] Table 1 below shows: For Figure 2 The display device ED-a shown herein, when folded (e.g., inward folded) about a folding axis with a radius of curvature of about 2.1 mm at a temperature of about 25 degrees Celsius, is as follows: Figure 1B When the upper surfaces of the first non-folded region NFA1 and the second non-folded region NFA2 are shown facing each other, according to the resin layer (e.g., Figure 2 The upper surface of the resin layer (RSL-a) with Young's modulus, the lower surface of the resin layer and the window substrate (e.g., Figure 2 The strain (%) of each of the window substrates (WMB-a) and the repulsive force (N) between the resin layer and the window substrate are shown in Table 1. The lower surface of the resin layer indicates the surface in contact with the upper surface of the folded portion of the window substrate. In Table 1, BK indicates buckling, and CK indicates cracking in the protective layer disposed above the resin layer. In Table 1 and Tables 2 through 6 below, as the absolute values ​​of the strain of the upper surface of the resin layer, the strain of the lower surface of the resin layer, the strain of the window substrate, and the repulsive force increase, the likelihood of cracking in the protective layer may increase, which may degrade the folding characteristics. Table 1:

[0123] Referring to Table 1, when the Young's modulus of the resin layer is less than about 35 MPa at a temperature of about 25 degrees Celsius, buckling occurs, and the resin layer may separate from the window substrate due to its low Young's modulus. When the Young's modulus of the resin layer is greater than about 1000 MPa, cracks may occur in the protective layer, and the force transmitted to the protective layer may induce cracking because the force required to fold the resin layer may be excessive. As the Young's modulus of the resin layer increases, the strain on the upper surface of the resin layer increases, the strain on the lower surface of the resin layer remains the same or decreases, and the strain of the window substrate increases. In addition, the repulsive force increases proportionally to the Young's modulus of the resin layer. When the Young's modulus of the resin layer is equal to or greater than about 35 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, buckling or cracking may not occur, and the folding characteristics of the display device may not be degraded.

[0124] Table 2 below shows: For Figure 2 The display device ED-a shown herein, when folded (e.g., inward folded) about a folding axis with a radius of curvature of about 2.1 mm at a temperature of about 60 degrees Celsius, is as follows: Figure 1B When the upper surfaces of the first non-folded region NFA1 and the second non-folded region NFA2 are shown facing each other, according to the resin layer (e.g., Figure 2 The upper surface of the resin layer (RSL-a) with Young's modulus, the lower surface of the resin layer and the window substrate (e.g., Figure 2 The strain (%) of each of the window substrates (WMB-a) and the repulsive force (N) between the resin layer and the window substrate. Table 2:

[0125] Reference Figure 2 When the Young's modulus of the resin layer is less than about 10 MPa at a temperature of about 60 degrees Celsius, buckling may occur, and the resin layer may separate from the window substrate due to its low Young's modulus. When the Young's modulus of the resin layer is greater than about 1000 MPa, cracks may occur in the protective layer, and the force transmitted to the protective layer may induce cracking because the force required to fold the resin layer may be excessive. As the Young's modulus of the resin layer increases, the strain on the upper surface of the resin layer increases, the strain on the lower surface of the resin layer remains the same or decreases, and the strain of the window substrate increases. In addition, the repulsive force increases proportionally to the Young's modulus of the resin layer. When the Young's modulus of the resin layer is equal to or greater than about 10 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius, buckling or cracking may not occur, and the folding characteristics of the display device may not be degraded.

[0126] Table 3 below shows: For Figure 2 The display device ED-a shown herein, when folded (e.g., inward folded) about a folding axis with a radius of curvature of approximately 2.1 mm at a temperature of approximately -20 degrees Celsius, is as follows: Figure 1B When the upper surfaces of the first non-folded region NFA1 and the second non-folded region NFA2 are shown facing each other, according to the resin layer (e.g., Figure 2 The upper surface of the resin layer (RSL-a) with Young's modulus, the lower surface of the resin layer and the window substrate (e.g., Figure 2 The strain (%) of each of the window substrates (WMB-a) and the repulsive force (N) between the resin layer and the window substrate. Table 3:

[0127] Referring to Table 3, when the Young's modulus of the resin layer is less than about 60 MPa at a temperature of about -20 degrees Celsius, buckling may occur, and the resin layer may separate from the window substrate due to its low Young's modulus. When the Young's modulus of the resin layer is greater than about 1000 MPa, cracks may occur in the protective layer, and the force transmitted to the protective layer may induce cracking because the force required to fold the resin layer may be excessive. As the Young's modulus of the resin layer increases, the strain on the upper surface of the resin layer increases, the strain on the lower surface of the resin layer remains the same or decreases, and the strain of the window substrate increases. In addition, the repulsive force increases proportionally to the Young's modulus of the resin layer. When the Young's modulus of the resin layer is equal to or greater than about 60 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, buckling or cracking may not occur, and the folding characteristics of the display device may not be degraded.

[0128] Table 4 below shows: For Figure 3 The display device ED-b shown herein, when folded (e.g., outward folded) about a folding axis with a radius of curvature of about 2.1 mm at a temperature of about 25 degrees Celsius, is as follows: Figure 1C When the lower surfaces of the first non-folded region NFA1 and the second non-folded region NFA2 are shown facing each other, according to the resin layer (e.g., Figure 3 The resin layer RSL-b) has a Young's modulus and a window matrix (e.g., Figure 3 The strain (%) of each of the window substrates (WMB-b) and the repulsive force (N) between the resin layer and the window substrate. Table 4:

[0129] Referring to Table 4, when the Young's modulus of the resin layer is less than about 40 MPa at a temperature of about 25 degrees Celsius, buckling may occur, and the resin layer may separate from the window substrate due to its low Young's modulus. When the Young's modulus of the resin layer is greater than about 1000 MPa, cracks may occur in the protective layer, and the forces transmitted to the protective layer may induce cracking because the force required to fold the resin layer may be excessive. As the Young's modulus of the resin layer increases, the strain of the resin layer, the strain of the window substrate, and the repulsive force increase. When the Young's modulus of the resin layer is equal to or greater than about 40 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, buckling or cracking may not occur, and the folding characteristics of the display device may not be degraded.

[0130] Table 5 below shows: For Figure 3 The display device ED-b shown herein, when folded (e.g., outward folded) about a folding axis with a radius of curvature of about 2.1 mm at a temperature of about 60 degrees Celsius, is as follows: Figure 1C When the lower surfaces of the first non-folded region NFA1 and the second non-folded region NFA2 are shown facing each other, according to the resin layer (e.g., Figure 3 The resin layer RSL-b) has a Young's modulus and a window matrix (e.g., Figure 3 The strain (%) of each of the window substrates (WMB-b) and the repulsive force (N) between the resin layer and the window substrate. Table 5:

[0131] Referring to Table 5, when the Young's modulus of the resin layer is less than about 20 MPa at a temperature of about 60 degrees Celsius, buckling may occur, and the resin layer may separate from the window substrate due to its low Young's modulus. When the Young's modulus of the resin layer is greater than about 1000 MPa, cracks may occur in the protective layer, and the forces transmitted to the protective layer may induce cracking because the force required to fold the resin layer may be excessive. As the Young's modulus of the resin layer increases, the strain of the resin layer, the strain of the window substrate, and the repulsive force increase. When the Young's modulus of the resin layer is equal to or greater than about 20 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius, buckling or cracking may not occur, and the folding characteristics of the display device may not be degraded.

[0132] Table 6 below shows: For Figure 3 The display device ED-b shown herein, when folded (e.g., outward folded) about a folding axis with a radius of curvature of approximately 2.1 mm at a temperature of approximately -20 degrees Celsius, is as follows: Figure 1CWhen the lower surfaces of the first non-folded region NFA1 and the second non-folded region NFA2 are shown facing each other, according to the resin layer (e.g., Figure 3 The resin layer RSL-b) has a Young's modulus and a window matrix (e.g., Figure 3 The strain (%) of each of the window substrates (WMB-b) and the repulsive force (N) between the resin layer and the window substrate. Table 6:

[0133] Referring to Table 6, when the Young's modulus of the resin layer is less than about 70 MPa at a temperature of about -20 degrees Celsius, buckling may occur, and the resin layer may separate from the window substrate due to its low Young's modulus. When the Young's modulus of the resin layer is greater than about 1000 MPa, cracks may occur in the protective layer, and the forces transmitted to the protective layer may induce cracking because the force required to fold the resin layer may be excessive. As the Young's modulus of the resin layer increases, the strain of the resin layer, the strain of the window substrate, and the repulsive force increase. When the Young's modulus of the resin layer is equal to or greater than about 70 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, buckling or cracking may not occur, and the folding characteristics of the display device may not be degraded.

[0134] According to Tables 1 to 3, when Figure 2 The display device ED-a shown is folded inward, and the Young's modulus of the resin layer is equal to or greater than about 60 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, equal to or greater than about 35 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and equal to or greater than about 10 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius, which can improve buckling or cracking. Additionally, according to Tables 4 to 6, when... Figure 3 When the display device ED-b shown is folded outwards, and the Young's modulus of the resin layer is equal to or greater than about 70 MPa and equal to or less than about 1000 MPa at a temperature of about -20 degrees Celsius, equal to or greater than about 40 MPa and equal to or less than about 1000 MPa at a temperature of about 25 degrees Celsius, and equal to or greater than about 20 MPa and equal to or less than about 1000 MPa at a temperature of about 60 degrees Celsius, the occurrence of buckling or cracking can be reduced.

[0135] Table 7 below shows the force (hereinafter referred to as breaking force) exerted by the pen on the display device, including the display module and the window, when the window is broken by the pen during a pen drop test on the display device after the display device is placed on a panel with a thickness of about 10 cm. Table 7:

[0136] Reference Figure 7 The thickness of the window is proportional to the breaking force, and the breaking force when the window thickness is about 50 micrometers is about 53% higher than the breaking force when the window thickness is about 30 micrometers. Furthermore, the breaking force when the window thickness is about 150 micrometers is about 148% higher than the breaking force when the window thickness is about 70 micrometers. Because the window substrate of the display device according to some embodiments of the present disclosure has a greater thickness than the thickness of the comparative window substrate, the durability of the display device according to some embodiments of the present disclosure can be improved. As an example, in the window substrate of the display device according to some embodiments of the present disclosure, the thickness of the folded portion can be about 50 micrometers, and the thickness of the non-folded portion can be about 150 micrometers. According to the window substrate of the comparative display device, the thickness of the folded portion is about 30 micrometers, and the thickness of the non-folded portion is about 70 micrometers. When compared with the comparative display device, the durability of the display device according to some embodiments of the present disclosure can be significantly improved.

[0137] Table 8 below shows the total thickness (μm), strain (%) of the resin layer, strain (%) of the window substrate, and repulsive force (N) between the resin layer and the window substrate according to the stacked structure of the display device. In each of the display devices according to the comparative example and the example embodiment, the stacking order from bottom to top is as follows: barrier layer (BR), upper adhesive layer (AP-U2), lower protective film (PF), module adhesive layer (AP-DM), display panel (DP), window adhesive layer (AP-W), window substrate (WMB), resin layer (RSL), protective layer adhesive layer (AP-PL), protective layer (PL), and coating layer (HC). Table 8 shows the thickness (μm) of each of the above layers, and X indicates that the corresponding component is not included.

[0138] In the display device of Comparative Example 1, the groove is not formed in the window substrate, and the window substrate has a flat shape. In the display device of Comparative Example 2 and the display devices of Examples 1 to 7, the groove is formed in the folded portion of the window substrate. The thickness (μm) of the window substrate is given in the order of folded and non-folded portions. In the display device of Comparative Example 2 and the display devices of Examples 1 to 7, a resin layer is disposed in the groove and also on the non-folded portion. The thickness (μm) of the resin layer refers to the thickness of the portion of the resin layer disposed on the non-folded portion. The total thickness (μm) is the sum of the thicknesses of all layers, and the strain (%) of the resin layer, the strain (%) of the window substrate, and the repulsive force (N) are conceptually the same as the strain (%) of the upper surface of the resin layer, the strain (%) of the window substrate, and the repulsive force (N) between the resin layer and the window substrate as defined in Table 1. Table 8:

[0139] Reference Figure 8 As the total thickness decreases, the strain of the resin layer, the strain of the window substrate, and the repulsive force tend to decrease. Compared to the repulsive force of the display device of Comparative Example 1, the display devices of Examples 1 to 7 have high repulsive forces, but also exhibit excellent folding characteristics because the groove is formed in the folded portion of the window substrate. The thickness of the window substrate of the display devices of Examples 1 to 7 can be greater than the thickness of the window substrate of the display devices of Comparative Example 1 and Comparative Example 2, and therefore, the durability of the display devices of Examples 1 to 7 can be improved.

[0140] The foregoing is a description of some embodiments of this disclosure and should not be construed as limiting the disclosure. Although some embodiments have been described, it will be readily apparent to those skilled in the art that various modifications are possible in the embodiments without departing from the spirit and scope of this disclosure. It will be understood that, unless otherwise described, the description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Therefore, unless specifically indicated otherwise, features, characteristics, and / or elements described in connection with particular embodiments, as will be apparent to those skilled in the art, may be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments. Therefore, it should be understood that the foregoing is a description of various exemplary embodiments and should not be construed as limiting to the specific embodiments disclosed herein, and various modifications to the disclosed embodiments and other exemplary embodiments are intended to be included within the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, wherein, The electronic device includes: Display module; and A window, on the display module, includes: A window base, on the display module, and the window base includes: The folded portion has a groove in one surface of the window base; and A first non-folding portion and a second non-folding portion are spaced apart from each other, and the folding portion is located between the first non-folding portion and the second non-folding portion; and A resin layer on said one surface of the window substrate, and said resin layer comprising: A first resin portion, filling the groove on the folded portion; and The second resin portion, on both the first non-folded portion and the second non-folded portion. The resin layer has a Young's modulus of 60 MPa or greater and 1000 MPa or less at a temperature of -20 degrees Celsius, a Young's modulus of 35 MPa or greater and 1000 MPa or less at a temperature of 25 degrees Celsius, and a Young's modulus of 10 MPa or greater and 1000 MPa or less at a temperature of 60 degrees Celsius.

2. The electronic device according to claim 1, wherein, The folded portion includes a first surface adjacent to the display module and a second surface opposite to the first surface, and The groove is formed in the first surface.

3. The electronic device according to claim 2, wherein, The Young's modulus of the resin layer is equal to or greater than 70 MPa and equal to or less than 1000 MPa at a temperature of -20 degrees Celsius, equal to or greater than 40 MPa and equal to or less than 1000 MPa at a temperature of 25 degrees Celsius, and equal to or greater than 20 MPa and equal to or less than 1000 MPa at a temperature of 60 degrees Celsius.

4. The electronic device according to claim 1, wherein, The folded portion includes a first surface adjacent to the display module and a second surface opposite to the first surface, and The groove is formed in the second surface.

5. The electronic device according to claim 1, wherein: The first non-folded portion includes a first non-folded surface; The second non-folded portion includes a second non-folded surface; and The folded portion includes: a flat surface; a first inclined surface connecting the flat surface to the first non-folded surface; and a second inclined surface connecting the flat surface to the second non-folded surface.

6. The electronic device according to claim 5, wherein, The first resin portion contacts each of the flat surface, the first inclined surface, and the second inclined surface.

7. The electronic device according to claim 5, wherein, The groove includes the flat surface, the first inclined surface, and the second inclined surface.

8. The electronic device according to claim 1, wherein, The resin layer has a refractive index of 1.45 or greater and 1.54 or less relative to visible light.

9. The electronic device according to claim 1, wherein, The absolute value of the crack strain in the resin layer is equal to or less than 10%.

10. The electronic device according to claim 1, wherein: The folded portion has a thickness of 30 micrometers or greater and 70 micrometers or less; The first non-folded portion has a thickness equal to or greater than 120 micrometers and equal to or less than 180 micrometers; and The second non-folded portion has a thickness of 120 micrometers or greater and 180 micrometers or less.

11. The electronic device according to claim 1, wherein, The resin layer also includes a third resin portion that contacts the side surface of the window substrate.

12. The electronic device according to claim 11, wherein, The first resin portion, the second resin portion, and the third resin portion are integral with each other.

13. The electronic device according to claim 1, wherein, The first resin portion has a thickness of 50 micrometers or more and 150 micrometers or less, and the second resin portion has a thickness of 5 micrometers or more and 30 micrometers or less.

14. A display device, wherein, The display device includes: Lower protective film; The substrate layer is on the lower protective film; Display element layer, on the substrate layer; and Window, the window comprising: A window substrate, on the display element layer, and the window substrate includes: The folded portion has a groove in one surface of the window base; and A first non-folding portion and a second non-folding portion are spaced apart from each other, and the folding portion is located between the first non-folding portion and the second non-folding portion; and A resin layer on one surface of the window substrate. The resin layer has a Young's modulus of 60 MPa or greater and 1000 MPa or less at a temperature of -20 degrees Celsius, a Young's modulus of 35 MPa or greater and 1000 MPa or less at a temperature of 25 degrees Celsius, and a Young's modulus of 10 MPa or greater and 1000 MPa or less at a temperature of 60 degrees Celsius.

15. The display device according to claim 14, wherein, The resin layer comprises: The first resin portion is directly in the groove; and The second resin portion is applied directly to both the first non-folded portion and the second non-folded portion.

16. The display device according to claim 14, wherein, The display device further includes a barrier layer on the lower surface of the lower protective film.

17. The display device according to claim 16, wherein, The barrier layer has a thickness of 20 micrometers or greater and 40 micrometers or less.

18. The display device according to claim 14, wherein, The display device further includes a protective layer on the resin layer.

19. The display device according to claim 18, wherein, The protective layer has a thickness of 30 micrometers or greater and 60 micrometers or less.

20. The display device according to claim 14, wherein: The folded portion includes a first surface adjacent to the display element layer and a second surface opposite to the first surface; The groove is formed in the first surface; and The Young's modulus of the resin layer is equal to or greater than 70 MPa and equal to or less than 1000 MPa at a temperature of -20 degrees Celsius, equal to or greater than 40 MPa and equal to or less than 1000 MPa at a temperature of 25 degrees Celsius, and equal to or greater than 20 MPa and equal to or less than 1000 MPa at a temperature of 60 degrees Celsius.

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