Assembled magnet, semiconductor equipment and semiconductor material preparation method

Abstract

The invention belongs to the technical field of magnetic control, and provides an assembled magnet, semiconductor equipment and a semiconductor material preparation method, the assembled magnet comprises a plurality of splicing bodies and a plurality of magnetic columns, the splicing bodies are provided with mounting holes, and the magnetic columns are mounted in the mounting holes. The size and the shape of the stud curve can be adjusted, and universality is achieved.

Description

Technical Field

[0001] This invention belongs to the field of magnetic control technology and relates to the assembly of magnets, semiconductor equipment, and methods for preparing semiconductor materials. Background Technology

[0002] Magnets in the prior art, such as Figure 1 and Figure 2 As shown, the design employs a perforated mainplate with small magnetic pillars: both the mainplate and the front and back panels have through holes, and the magnetic pillars have stepped ends. The small magnetic pillars are secured by end plates. Threaded holes are drilled in the empty spaces between the front and back panels and the mainplate, and screws are used to fix the front and back panels in place. The mainplate and the rotating plate are then further secured together with screws.

[0003] The magnetic column curve of a magnet affects the process and material properties; therefore, optimizing magnet performance is particularly important for semiconductor devices.

[0004] In existing technologies, when using magnets to prepare semiconductor materials through semiconductor equipment, the position of the magnetic pillar is first determined through simulation calculations, and then the semiconductor material is prepared according to the determined position of the magnetic pillar (e.g., magnetron deposition, magnetron nanolayer film technology).

[0005] The above-mentioned preparation method involves designing the magnet before magnetron sputtering begins. However, in practical applications, due to the discrepancy between theory and reality, the electrical and optical properties of semiconductor materials may change significantly under the influence of a magnetic field. Therefore, it is necessary to adjust the size and shape of the stud curve. However, existing magnets cannot be adjusted in this way and need to be reprocessed and purchased, which increases the R&D cycle and cost. For example, when removing a single magnetic column, the entire front backplate needs to be disassembled and reassembled each time, increasing the workload. Also, when there are differences between the inside and outside of the deposited film, and it is necessary to expand or shrink the position of a group of small magnetic columns as a whole, since the position is fixed and cannot be changed, it is necessary to reprocess and purchase them, which increases the R&D cycle and cost.

[0006] In addition, different semiconductor devices have different process chamber sizes and require different magnet sizes, all of which need to be customized as a whole and cannot be used interchangeably.

[0007] Therefore, the need for a universal magnet that can adjust the size and shape of the stud curve is an important issue that the industry urgently needs to address. Summary of the Invention

[0008] In view of the above problems, one embodiment of the present invention aims to provide an assembled magnet in which the position of the magnetic column can be adjusted and the size and shape of the magnet curve can be adjusted.

[0009] Another objective of one embodiment of the present invention is to provide a semiconductor device and a method for preparing semiconductor materials that are compatible with process chambers of different sizes.

[0010] According to a first aspect of the present invention, an assembly magnet is provided, comprising a plurality of splicing bodies and a plurality of magnetic pillars, wherein the splicing bodies are provided with mounting holes and the magnetic pillars are mounted in the mounting holes.

[0011] In one possible implementation, the plurality of splicing bodies includes a first splicing body and a second splicing body, the second splicing body being spliced ​​with the first splicing body, and the plurality of magnetic pillars being installed in the mounting holes of the first splicing body and / or the second splicing body.

[0012] In one possible implementation, the first splice body and the second splice body are clipped and spliced ​​together.

[0013] In one possible implementation, the first or second splicing body includes a body and a first step, the size of the first step being smaller than the size of the body, and the first step being disposed on the top surface and / or bottom surface of the body. The second or first splicing body includes a body and a second step, the size of the second step being larger than the size of the body, and the second step being disposed on the top surface and / or bottom surface of the body.

[0014] In one possible implementation, the mounting hole is a threaded hole.

[0015] In one possible implementation, the shape of the splice body includes one or more of the following: circle, semicircle, ellipse, polygon, cross, star, heart, and irregular shape.

[0016] In one possible implementation, the assembled magnet further includes a first adapter that surrounds the assembled shape of the plurality of splicing bodies, and the inner surface shape of the first adapter is adapted to the splicing shape.

[0017] In one possible implementation, the first adapter is a splicing adapter.

[0018] In one possible implementation, the assembled magnet further includes a second adapter that is adapted to the outer surface of the first adapter.

[0019] In one possible implementation, the assembled magnet further includes fasteners configured to secure the first adapter and / or the second adapter.

[0020] In one possible implementation, the assembled magnet further includes a rotating plate, the assembled body is detachably connected to the rotating plate, and the rotating plate drives the assembled body to rotate.

[0021] According to a second aspect of the present invention, a semiconductor device is provided, including a process chamber and the aforementioned assembled magnet disposed within the process chamber.

[0022] According to a third aspect of the present invention, a method for preparing a semiconductor material is provided, comprising: The magnetic field is altered by changing the splicing shape of multiple splicing elements and / or the position of the magnetic pillars in the above-mentioned assembled magnet.

[0023] The assembled magnet of the present invention has mounting holes for magnetic pillars on the assembled body, and multiple assembled bodies can be assembled into any shape without further processing, thereby realizing the adjustment of the layout size and shape of the magnetic pillars.

[0024] The semiconductor equipment described in this invention can adjust the shape and size of the assembled magnets according to the shape and size of the process cavity, adjust the magnetic field strength, be compatible with deposition equipment of different sizes, require no customization, and have high versatility.

[0025] The semiconductor material preparation method of the present invention changes the magnetic field by splicing multiple spliced ​​bodies and / or changing the position of magnetic pillars, thus adapting to the preparation of semiconductor materials of different sizes and having high versatility. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a magnet in the prior art; Figure 2 yes Figure 1 A schematic diagram of the magnetic pillar arrangement in a magnet; Figure 3 This is a schematic diagram of one embodiment of the assembled magnet described in this invention; Figure 4 (a)-4(c) are schematic diagrams of one embodiment of the splicing body described in this invention; Figure 5 (a)-5(c) are schematic diagrams of another embodiment of the splicing body described in this invention; Figure 6 (a)-6(c) are schematic diagrams of the third embodiment of the splicing body described in this invention; Figure 7 This is a schematic diagram of an embodiment of the first adapter of the present invention; Figure 8 This is a schematic diagram of an embodiment of the second adapter of the present invention; Among them: 1. Assembled magnet; 10. First splice body; 11. First step; 20. Second splice body; 21. Second step; 30. Mounting hole; 40. First adapter; 50. Second adapter; 60. Fastener. Detailed Implementation

[0027] Numerous specific details are set forth in the following description to provide a full understanding of the invention. However, the invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0028] The terminology used in one or more embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The singular forms “a” and “the” as used in one or more embodiments of the invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of the invention refers to and includes any or all possible combinations of one or more associated listed items.

[0029] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of the present invention, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of the present invention, and similarly, second may also be referred to as first.

[0030] Hereinafter, one or more embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can clearly and completely understand the present invention. When the description of well-known structures or features would unnecessarily obscure the main points of the present invention, the description of such well-known structures or features will be omitted.

[0031] The positions of the magnetic pillars on the existing magnet board are fixed and difficult to adjust. When the magnetic pillar position layout needs to be adjusted, the entire board needs to be replaced, which increases costs and development cycle. During process debugging, each time a single magnetic pillar is removed, the entire front and back panels need to be dismantled, which is time-consuming and labor-intensive. It is also not compatible with semiconductor devices of different sizes.

[0032] To address the aforementioned technical problems of magnets in the prior art, the present invention provides an assembled magnet, such as... Figure 3 As shown, the assembled magnet 1 includes a first splicing body 10, a second splicing body 20, and a plurality of magnetic pillars (not shown). The first splicing body 10 and the second splicing body 20 are spliced ​​together and both are provided with mounting holes 30. The plurality of magnetic pillars are installed on one or more mounting holes 30 of the first splicing body 10 or / and the second splicing body 20.

[0033] The assembled magnet 1 of the present invention can change the shape and size of the magnet by changing the splicing shape of the first splicing body 10 and the second splicing body 20.

[0034] The assembled magnet 1 described in this invention can also change the shape and size of the magnetic field by changing the installation position of the magnetic column.

[0035] Therefore, the assembled magnet 1 of the present invention does not require further processing, realizes the change of magnetic field shape and size, and can be assembled to be compatible with semiconductor devices of different sizes.

[0036] In one feasible embodiment, the assembled magnet 1 further includes a first adapter 40: The first adapter 40 surrounds the splicing shape of the first splicing body 10 and the second splicing body 20 after splicing, and the inner surface shape of the first adapter 40 is adapted to the splicing shape.

[0037] In one feasible embodiment, the assembled magnet 1 further includes a second adapter 50: The second adapter 50 is adapted to the outer surface of the first adapter 40.

[0038] In one feasible embodiment, the assembled magnet 1 further includes a fastener 60: The fastener 60 is configured to fasten the first adapter 40 and / or the second adapter 50.

[0039] The following details the components of assembling magnet 1: Figure 4 (a)- Figure 4 (c) A schematic diagram of one embodiment of the first splice body 10 and the second splice body 20 is shown, as follows: Figure 4 (a)- Figure 4 As shown in (c), the first splicing body 10 and the second splicing body 20 can be splicing blocks of any shape that can be spliced, and are not limited to the shapes of polygons such as triangles, squares, rectangles, parallelograms, pentagons, and hexagons.

[0040] The aforementioned assembled magnet 1 can be assembled into different shapes using a single splicing body.

[0041] Figure 5 (a)- Figure 5 (c) A schematic diagram of one embodiment of the first splice body 10 is shown, as follows: Figure 5 (a)- Figure 5 As shown in (c), the first splice body 10 includes a body and a first step 11. The size of the first step 11 is smaller than the size of the body. The first step 11 is disposed on the top surface and / or bottom surface of the body.

[0042] Figure 6 (a)- Figure 6 (c) A schematic diagram of one embodiment of the second splice 20 is shown, as follows: Figure 6 (a)- Figure 6As shown in (c), the second splice body 20 includes a body and a second step 21. The size of the second step 21 is larger than the size of the body. The second step 21 is disposed on the top surface and / or bottom surface of the body.

[0043] In the above-mentioned assembled magnet 1, the first splicing body 10 and the second splicing body 20 are spliced ​​together by the first step 11 of the first splicing body 10 and the second step 21 of the second splicing body 20.

[0044] Figure 4 (a)- Figure 6 (c) shows an embodiment of splicing by one splicing body and splicing by two splicing bodies, but the present invention is not limited thereto. The present invention can achieve splicing by three, four or more splicing bodies.

[0045] Figure 5 (a)- Figure 6 (c) illustrates one splicing method using clips and joints, but the invention is not limited thereto. Other splicing methods include groove splicing, mortise and tenon splicing, overlapping splicing, trapezoidal mortise and tenon splicing, and one or more other splicing methods. Figure 5 (a)- Figure 6 (c) The card and splicing method is more robust than other splicing methods that rely solely on frictional force from mutual compression. It is suitable for applications involving rotating magnets and is simple to manufacture and low in cost.

[0046] like Figure 1 as well as Figure 5 (a)- Figure 6 As shown in (c), the first splicing body 10 is in the shape of a downward step, with a magnetic post mounting hole 30 in the middle; the second splicing body 20 is in the shape of an upward step, with a magnetic post mounting hole 30 in the middle. The first splicing body 10 and the second splicing body 20 are spliced ​​together from the side, so that the top and bottom surfaces are fixed to each other, and adjacent splicing blocks are interlocked and spliced ​​together in the vertical direction.

[0047] In a preferred embodiment of the present invention, such as Figures 3-6 As shown in (c), the assembled magnet 1 includes a first splicing body 10, a second splicing body 20, a first adapter 40, a second adapter 50, a fastener 60, and a plurality of magnetic pillars. The first splicing body and the second splicing body are provided with mounting holes 30 for mounting magnetic pillars. The first splicing body and the second splicing body are spliced ​​to form a splicing shape adapted to the preparation of semiconductor materials. The inner surface of the first adapter 40 is adapted to the splicing shape, and the outer surface is adapted to the second adapter 50. The fastener 60 passes through the hole of the second adapter to fasten the first adapter 40 and the second adapter 50.

[0048] The assembled magnet 1 described in this invention requires no further processing, and the size and shape of the magnetic column layout can be adjusted, making it compatible with semiconductor devices of different sizes.

[0049] The assembled magnet 1 of the present invention omits the front backup plate, thereby shortening the space and reducing the overall weight of the magnet, thereby reducing the overall center of gravity height of the equipment and reducing the risk of tipping over.

[0050] In one feasible embodiment, the assembled magnet 1 further includes a rotating plate, and the first splicing body and the second splicing body are detachably connected to the rotating plate, and the rotating plate drives the first splicing body and the second splicing body to rotate.

[0051] Preferably, the mounting hole 30 of the magnetic column can be a stepped threaded hole. One end of the magnetic column is flat, and the other end is threaded. The threaded end is connected and fixed to the first splice body 10 and / or the second splice body 20, eliminating the need for a front backup plate, thereby shortening the space and reducing weight. At the same time, in applications where the magnet rotates, the stepped threaded hole can serve as a fixing hole between the splice body and the rotating plate.

[0052] This invention uses a magnetic post passing through the mounting hole 30 to fix the splicing block, magnetic post, and rotating plate, eliminating the need for a front backup plate and allowing the splicing body to be fixed on both the top and bottom surfaces.

[0053] The present invention assembles the magnet 1 without adding any parts inside and without affecting the magnetic field lines; the splicing method enables the adjustment of the magnetic column within a certain range and the interchangeability of magnets of different sizes.

[0054] Figure 7 A schematic diagram of one embodiment of the first adapter of the present invention is shown, as follows: Figure 7 As shown, the first adapter 40 is an adapter in the form of splicing.

[0055] The first adapter 40 can be made of two pieces or multiple pieces of other types. The shape of each first adapter 40 can be the same or different.

[0056] Figure 8 A schematic diagram of one embodiment of the second adapter of the present invention is shown, as follows: Figure 8 As shown, the shape of the second adapter 50 is adapted to the outer surface shape of the first adapter 40. The first adapter 40 can be fastened by a gap fit between the second adapter 50 and the first adapter 40, or by using multiple assembled second adapters 50.

[0057] In a preferred embodiment, the second adapter 50 and the first adapter 40 may be provided with holes, and the second adapter 50 and the first adapter 40 are fastened by fasteners 60 passing through the holes. The holes may be smooth holes and / or threaded holes.

[0058] The splicing magnet may include multiple second adapters 50 and multiple fasteners 60, which fasten the first adapter 40 and the second adapter 50 at multiple splicing positions of the first adapter 40.

[0059] The present invention also provides a semiconductor device, the semiconductor device including a process chamber and an assembly magnet 1 disposed in the process chamber.

[0060] Semiconductor equipment can be magnetron deposition equipment. PVD utilizes plasma to bombard the target material at the top of the process chamber, causing target atoms to deposit downwards. During plasma generation and collision, the assembled magnet 1 above generates a magnetic field, affecting the collision speed and direction. By changing the position and layout of the magnetic pillars, the assembled magnet 1 alters the shape of the generated magnetic field, thereby affecting the desired orientation consistency, density, resistivity, and other important properties of the deposited thin film, thus optimizing the film preparation.

[0061] The assembly magnet 1 of the semiconductor device of the present invention achieves universality for multi-size process chambers by only changing the external first adapter 40 and the internal assembly body through splicing.

[0062] In one feasible embodiment, the semiconductor device further includes a platform and a magnetic chuck. The platform includes a movable platform and / or a rotating platform. The magnetic chuck is disposed on the platform and is used to attract magnetic columns. By changing the position of the magnetic columns through the platform and the magnetic chuck, the position of the magnetic columns can be automatically changed, which is suitable for sealed process chambers such as vacuum chambers.

[0063] In one feasible embodiment, the semiconductor device further includes a magnetic shielding sheet and an electromagnetic drive device, which allows the magnetic shielding sheet to cover or not cover the magnetic column, thereby adjusting the size and shape of the magnetic field.

[0064] This invention also provides a method for preparing semiconductor materials, the method comprising: The magnetic field is changed by altering the splicing shape of multiple splicing bodies in the assembled magnet 1 and / or the position of the magnetic column.

[0065] Each assembly has mounting holes 30 for magnetic pillars, allowing the magnetic pillars to move within a certain range. During process testing, the magnetic pillar layout can be changed to adjust the deposition effect. For example, if the semiconductor equipment is 8 inches and the wafer size is less than 12 inches, the required magnetic field size is small. Moving the magnetic pillars towards the center reduces the magnetic field size.

[0066] The novel assembly method of this invention is applicable not only to 12-inch PVD process chambers, but also to other semiconductor equipment process chambers that use magnetic induction.

[0067] When the results of important properties such as the consistency of the required orientation, density, and resistance of the thin film do not meet the standards during process testing and the magnetic field needs to be adjusted, the magnetic column can be flexibly moved and connected to the splice at different positions.

[0068] In one feasible embodiment of the present invention, the method for preparing the semiconductor material includes one or more of the following steps: The density and / or resistance of the prepared semiconductor material can be changed by altering the number of magnetic pillars. For example, increasing the number of magnetic pillars on the splice body enhances the magnetic field and increases the density of the semiconductor material. Adjusting the splicing shape of the magnetic pillars and / or the splicing shape of the splice body can regulate the density and / or resistance of the prepared semiconductor material. For example, adjusting the splicing shape of the magnetic pillars can change the magnetic flux path, allowing some magnetic flux to bypass the target material, thereby adjusting the effective magnetic field strength and changing the magnetic field gradient, which in turn changes the density and / or resistance of the semiconductor material. For example, the magnetic field gradient can be changed by changing the width of the magnetic pillar arrangement curve. Alternatively, optimizing the magnetic pillar splicing shape (such as curve design, unbalanced magnetic field) can increase the magnetic field gradient, thereby improving plasma confinement and splicing uniformity.

[0069] In one feasible embodiment of the present invention, the method for preparing the semiconductor material includes one or more of the following steps: Increasing the number of magnetic pillars on the splice body improves the consistency of semiconductor material preparation. Increasing the number of magnetic pillars can optimize plasma confinement, make the magnetic field distribution more uniform, and reduce sputtering rate differences. The consistency of semiconductor material preparation can be improved by adjusting the arrangement curve of the magnetic pillars (such as height, width, or angle). Adjusting the arrangement curve of the magnetic pillars can change the magnetic field gradient, improve plasma distribution, and enhance consistency. By adjusting the position of the magnetic pillars on the assembly, an unbalanced magnetic field layout can be achieved, thereby improving the consistency of semiconductor material preparation.

[0070] This invention solves the problem of the inability to adjust the column curve by installing magnetic columns on the splicing body and by the splicing method of the splicing body, and achieves the effect of real-time adjustment of magnetic columns and magnetic induction lines within a certain range.

[0071] This invention uses a combination of assembly and different adapters to solve the problem of magnets in different process chambers having different required sizes and being unable to be used interchangeably, thus achieving a certain degree of universal interchangeability.

[0072] The foregoing has described specific embodiments of the invention. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0073] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the embodiments of the present invention.

[0074] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0075] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the embodiments of the present invention. These embodiments are selected and specifically described to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention.

Claims

1. An assembled magnet, characterized in that, It includes multiple splicing bodies and multiple magnetic pillars, with mounting holes provided on the splicing bodies, and the magnetic pillars are installed in the mounting holes.

2. The assembled magnet according to claim 1, characterized in that, The plurality of splicing bodies includes a first splicing body and a second splicing body, the second splicing body being spliced ​​with the first splicing body, and the plurality of magnetic pillars being installed in the mounting holes of the first splicing body or / and the second splicing body.

3. The assembled magnet according to claim 2, characterized in that, The first and second splicing bodies are clipped and spliced ​​together.

4. The assembled magnet according to claim 3, characterized in that, The first or second splicing body includes a body and a first step, the size of the first step being smaller than the size of the body, and the first step being disposed on the top surface and / or bottom surface of the body; The second or first splicing body includes a body and a second step, the size of the second step being larger than the size of the body, and the second step being disposed on the top surface and / or bottom surface of the body.

5. The assembled magnet according to claim 1, characterized in that, The mounting hole is a threaded hole.

6. The assembled magnet according to claim 1, characterized in that, The shape of the spliced ​​body includes one or more of the following: circle, semicircle, ellipse, polygon, cross, star, heart, and irregular shape.

7. The assembled magnet according to claim 1, characterized in that, It also includes a first adapter, which surrounds the splicing shape of the plurality of splicing bodies, and the inner surface shape of the first adapter is adapted to the splicing shape.

8. The assembled magnet according to claim 7, characterized in that, The first adapter is a splicing type adapter.

9. The assembled magnet according to claim 7, characterized in that, It also includes a second adapter that is adapted to the outer surface of the first adapter.

10. The assembled magnet according to any one of claims 7-9, characterized in that, It also includes fasteners configured to fasten the first adapter and / or the second adapter.

11. The assembled magnet according to claim 1, characterized in that, It also includes a rotating plate, the splicing body is detachably connected to the rotating plate, and the rotating plate drives the splicing body to rotate.

12. A semiconductor device, characterized in that, It includes a process chamber and an assembled magnet as described in any one of claims 1-11 disposed within the process chamber.

13. A method for preparing a semiconductor material, characterized in that, include: The magnetic field is changed by altering the splicing shape of the plurality of splicing bodies and / or the position of the magnetic column in the assembled magnet according to any one of claims 1-11.

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